WO2016117587A1 - Film de cuivre ultra-mince à support et son procédé de fabrication - Google Patents

Film de cuivre ultra-mince à support et son procédé de fabrication Download PDF

Info

Publication number
WO2016117587A1
WO2016117587A1 PCT/JP2016/051526 JP2016051526W WO2016117587A1 WO 2016117587 A1 WO2016117587 A1 WO 2016117587A1 JP 2016051526 W JP2016051526 W JP 2016051526W WO 2016117587 A1 WO2016117587 A1 WO 2016117587A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
ultrathin copper
carrier
foil
less
Prior art date
Application number
PCT/JP2016/051526
Other languages
English (en)
Japanese (ja)
Inventor
花田　徹
哲聡 ▲高▼梨
哲広 松永
歩 立岡
Original Assignee
三井金属鉱業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to CN201680003775.1A priority Critical patent/CN107002265B/zh
Priority to KR1020177009811A priority patent/KR101929844B1/ko
Priority to JP2016570671A priority patent/JP6352449B2/ja
Priority to KR1020187035876A priority patent/KR102031065B1/ko
Priority to CN201910236053.6A priority patent/CN110072334B/zh
Publication of WO2016117587A1 publication Critical patent/WO2016117587A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present invention relates to an ultrathin copper foil with a carrier and a method for producing the same.
  • the MSAP method is a method suitable for forming an extremely fine circuit, and is performed using an ultrathin copper foil with a carrier foil in order to take advantage of the feature.
  • an ultrathin copper foil 10 is applied to a primer layer on an insulating resin substrate 11 having a prepreg 11b on a base substrate 11a (lower layer circuit 11c may be included if necessary).
  • 12 is pressed and adhered (step (a)), the carrier foil (not shown) is peeled off, and then via holes 13 are formed by laser drilling as necessary (step (b)).
  • step (c) After applying chemical copper plating 14 (step (c)), masking with a predetermined pattern by exposure and development using a dry film 15 (step (d)), and applying electrolytic copper plating 16 (step (e) )). After the dry film 15 is removed to form the wiring portion 16a (step (f)), unnecessary ultrathin copper foil or the like between the adjacent wiring portions 16a and 16a is removed by etching over the entire thickness (step). (G)) A wiring 17 formed in a predetermined pattern is obtained.
  • Patent Document 1 International Publication No. 2012/046804 describes a release layer, a copper foil on a carrier foil having an average interval Sm of irregularities of a surface base mountain as defined in JIS-B-06012-1994 of 25 ⁇ m or more.
  • a copper foil is disclosed in which the copper foil is peeled off from the carrier foil.
  • via-hole processing of a copper-clad laminate is often used by direct laser drilling in which a laser beam is directly irradiated onto an ultrathin copper foil to form a via hole (for example, Patent Document 2 (Japanese Patent Laid-Open No. 11-110)). 346060))).
  • Patent Document 2 Japanese Patent Laid-Open No. 11-110)
  • 346060 Japanese Patent Laid-Open No. 11-110)
  • a carbon dioxide laser is irradiated on the blackened surface to form holes in the ultra-thin copper foil and the insulating layer immediately below it. Opening is performed.
  • the present inventors recently have an average distance (Peak spacing) between surface peaks of the surface on the peeling layer side of the ultrathin copper foil of 20 ⁇ m or less, and By providing a surface profile with a maximum height difference (Wmax) of undulation on the surface opposite to the release layer of 1.0 ⁇ m or less, in processing of copper-clad laminates or manufacturing of printed wiring boards, The knowledge that it was compatible with laser workability was acquired.
  • an object of the present invention is to provide an ultrathin copper foil with a carrier that can achieve both fine circuit formability and laser workability in the processing of a copper clad laminate or the production of a printed wiring board.
  • an ultrathin copper foil with a carrier comprising a carrier foil, a release layer and an ultrathin copper foil in this order
  • the surface on the peeling layer side of the ultra-thin copper foil has an average distance between peak peaks (Peak spacing) of 20 ⁇ m or less, and the surface on the opposite side to the peeling layer of the ultra-thin copper foil has a maximum undulation.
  • An ultrathin copper foil with a carrier having a difference (Wmax) of 1.0 ⁇ m or less is provided.
  • a method for producing an ultrathin copper foil with a carrier Providing a carrier foil having a surface with an average valley spacing (Valley spacing) of 15 ⁇ m or less and a maximum waviness difference (Wmax) of 0.8 ⁇ m or less; Forming a release layer on the surface of the carrier foil; Forming an ultrathin copper foil on the release layer; A method is provided comprising.
  • a copper clad laminate obtained using the ultrathin copper foil with a carrier according to the above aspect.
  • a printed wiring board obtained using the ultrathin copper foil with a carrier according to the above aspect.
  • the “average distance between surface peaks (Peak spacing)” refers to a peak after removing a high-frequency swell component from information on unevenness of a sample surface obtained using a three-dimensional surface structure analysis microscope. The average distance between peaks in data extracted by filtering waveform data.
  • valley spacing is the waveform data related to the valley after removing the high-frequency swell component from the information on the unevenness of the sample surface obtained using a three-dimensional surface structure analysis microscope. The average distance between valleys in the data extracted by filtering.
  • maximum waviness difference means that waveform data relating to waviness is extracted from information relating to unevenness of the sample surface obtained using a three-dimensional surface structure analysis microscope using a filter.
  • the maximum value of the height difference of the waveform data (the sum of the maximum peak height of the waveform and the maximum valley depth).
  • the average distance between surface peaks (Peak spacing), the average distance between valleys (Valley spacing), and the maximum difference in waviness (Wmax) are all commercially available three-dimensional surface structure analysis microscopes (for example, zygo New View 5032 ( Zygo)) and commercially available analysis software (for example, Metro Pro Ver. 8.0.2), the low frequency filter can be set to 11 ⁇ m and measured.
  • the surface to be measured of the foil is fixed in close contact with the sample stage, and 6 fields of 108 ⁇ m ⁇ 144 ⁇ m are selected and measured within the 1 cm square range of the sample piece, and obtained from the 6 measurement points.
  • the average value of the measured values obtained is preferably adopted as the representative value.
  • the “electrode surface” of the carrier foil refers to the surface on the side in contact with the rotating cathode when the carrier foil was produced.
  • the “deposition surface” of the carrier foil refers to the surface on the side where electrolytic copper is deposited when the carrier foil is produced, that is, the surface not in contact with the rotating cathode.
  • the ultrathin copper foil with carrier of the present invention comprises a carrier foil, a release layer and an ultrathin copper foil in this order.
  • the surface on the peeling layer side of the ultrathin copper foil has an average distance (Peak spacing) between surface peaks of 20 ⁇ m or less, and the surface on the side opposite to the peeling layer of the ultrathin copper foil has a maximum undulation.
  • the difference (Wmax) is 1.0 ⁇ m or less.
  • the cause of reducing the direct laser drilling workability is the case where the average distance (Peak spacing) between the surface peaks of the surface on the peeling layer side of the ultrathin copper foil exceeds 20 ⁇ m.
  • Wmax and Peak spacing in an ultrathin copper foil particularly MSAP ultrathin copper foil
  • line / space 15 ⁇ / 15 ⁇ m or less.
  • Direct laser drilling can be desirably performed while realizing fine circuit formation excellent enough to form a circuit.
  • the ultrathin copper foil has a surface having an average distance between surface peaks (Peak spacing) of 20 ⁇ m or less on the surface on the peeling layer side, and a maximum waviness difference (Wmax) of 1.0 ⁇ m. It has the following surface on the surface opposite to the release layer.
  • the average distance (Peak spacing) between the surface peaks on the surface on the peeling layer side of the ultrathin copper foil is 20 ⁇ m or less, preferably 1 to 15 ⁇ m, more preferably 5 to 15 ⁇ m, and still more preferably 10 to 15 ⁇ m.
  • the maximum height difference (Wmax) of the waviness on the surface opposite to the peeling layer of the ultrathin copper foil is 1.0 ⁇ m or less, preferably 0.9 ⁇ m or less, more preferably 0.8 ⁇ m or less.
  • Wmax on the surface of the ultrathin copper foil is 0.8 ⁇ m or less. Since Wmax is preferably as low as possible, the lower limit is not particularly limited, but Wmax is typically 0.1 ⁇ m or more, and more typically 0.2 ⁇ m or more.
  • the surface on the peeling layer side of the ultrathin copper foil also preferably has a maximum waviness difference (Wmax) of 1.0 ⁇ m or less, more preferably 0.8 ⁇ m, and even more preferably 0.6 ⁇ m or less.
  • Wmax is thus low, the Wmax on the surface opposite to the peeling layer of the ultrathin copper foil can be kept low, and the fine circuit formability is excellent.
  • Wmax is preferably 0.6 ⁇ m or less. Since Wmax is better if it is lower, the lower limit is not particularly limited.
  • Wmax when the thickness of the ultrathin copper foil is reduced (for example, when the thickness is 2.0 ⁇ m or less), it is preferable that Wmax is small.
  • Wmax is typically 0.1 ⁇ m or more, and more typically 0.2 ⁇ m or more.
  • the surface of the ultrathin copper foil opposite to the release layer is preferably a roughened surface. That is, it is preferable that one surface of the ultrathin copper foil is roughened.
  • This roughening treatment can be performed by forming roughened particles with copper or a copper alloy on an ultrathin copper foil.
  • a well-known plating technique that undergoes at least two types of plating processes including a baking plating process for depositing and adhering fine copper particles on an ultrathin copper foil and a covering plating process for preventing the fine copper grains from falling off. Is preferably carried out according to
  • the roughened surface comprises a plurality of roughened particles.
  • the plurality of roughened particles have an average roughened particle height of 1.0 to 1.4 ⁇ m from the basal plane, and the roughened particles on the cut surface according to the height from the basal plane.
  • the 1/10 value width of the distribution curve of the number of cuts is 1.3 ⁇ m or less.
  • the “number of cut edges of the roughened particles on the cut surface according to the height from the basal plane” is parallel to the cross-sectional contour curve of the roughened particles and the predetermined height from the basal plane. This is the number of surface areas to be cut by the various cut surfaces. That is, the cut surfaces are sequentially set from the basal plane to the maximum roughened particle height while being divided at regular intervals (for example, 0.02 ⁇ m) in the height direction, and the number of roughened particle cuts on each cut surface Count.
  • “Roughened particle height” means the height of the roughened particles from the basal plane
  • “average roughened particle height” means the height from the basal plane as illustrated in FIG.
  • the “1/10 value width” means the number of cut edges of the roughened particles in the distribution curve of the number of cut edges of the roughened particles on the cut surface according to the height from the basal plane. It means the distribution width (roughened particle height distribution width) at a value of 1/10 of the maximum value.
  • Etching variation in the surface direction is reduced, and undesirable skirting during circuit formation can be effectively prevented. As a result, circuit formability is improved. Furthermore, if the roughness is within the above range, the variation of the roughened particles is reduced, so that when the roughened surface is attached to a resin layer such as a prepreg, the variation due to the position of the peel strength from the resin layer is reduced.
  • the average roughened particle height is 1.0 to 1.4 ⁇ m, preferably 1.0 to 1.3 ⁇ m.
  • the 1/10 value width is 1.3 ⁇ m or less, preferably 1.0 ⁇ m or less. The 1/10 value width is preferably as small as possible, but is typically 0.1 ⁇ m or more.
  • the ultra-thin copper foil may be a known configuration employed for the ultra-thin copper foil with a carrier, except that it has the above-mentioned specific surface profile, and is not particularly limited.
  • the ultrathin copper foil may be formed by a wet film formation method such as an electroless copper plating method and an electrolytic copper plating method, a dry film formation method such as sputtering and chemical vapor deposition, or a combination thereof.
  • the thickness of the ultrathin copper foil is preferably 0.1 to 5.0 ⁇ m, more preferably 0.5 to 3.0 ⁇ m, and still more preferably 1.0 to 2.0 ⁇ m.
  • the thickness of the ultrathin copper foil is particularly preferably 2.0 ⁇ m or less.
  • the release layer is a layer having a function of weakening the peeling strength of the carrier foil, ensuring the stability of the strength, and further suppressing interdiffusion that may occur between the carrier foil and the copper foil during press molding at a high temperature. It is.
  • the release layer is generally formed on one side of the carrier foil, but may be formed on both sides.
  • the release layer may be either an organic release layer or an inorganic release layer. Examples of organic components used in the organic release layer include nitrogen-containing organic compounds, sulfur-containing organic compounds, carboxylic acids and the like. Examples of nitrogen-containing organic compounds include triazole compounds, imidazole compounds, and the like. Among these, triazole compounds are preferred in terms of easy release stability.
  • triazole compounds examples include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H-1,2,4-triazole and 3-amino- And 1H-1,2,4-triazole.
  • sulfur-containing organic compound examples include mercaptobenzothiazole, thiocyanuric acid, 2-benzimidazolethiol and the like.
  • carboxylic acid examples include monocarboxylic acid and dicarboxylic acid.
  • examples of inorganic components used in the inorganic release layer include Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and a chromate-treated film.
  • the release layer may be formed by bringing a release layer component-containing solution into contact with at least one surface of the carrier foil and fixing the release layer component to the surface of the carrier foil.
  • this contact may be performed by immersion in the release layer component-containing solution, spraying of the release layer component-containing solution, flowing down of the release layer component-containing solution, or the like.
  • the release layer component may be fixed to the surface of the carrier foil by adsorption or drying of the release layer component-containing solution, electrodeposition of the release layer component in the release layer component-containing solution, or the like.
  • the thickness of the release layer is typically 1 nm to 1 ⁇ m, preferably 5 nm to 500 nm.
  • the carrier foil is a foil for supporting an ultrathin copper foil and improving its handleability.
  • the carrier foil include an aluminum foil, a copper foil, a stainless steel (SUS) foil, a resin film whose surface is metal-coated, and preferably a copper foil.
  • the copper foil may be a rolled copper foil or an electrolytic copper foil.
  • the thickness of the carrier foil is typically 250 ⁇ m or less, preferably 12 ⁇ m to 200 ⁇ m.
  • the surface on the release layer side of the carrier foil preferably has an average valley spacing (Valley spacing) of 15 ⁇ m or less and a maximum waviness difference (Wmax) of 0.8 ⁇ m or less.
  • Vley spacing average valley spacing
  • Wmax maximum waviness difference
  • the ultrathin copper foil with a carrier of the present invention is a carrier foil having a surface with an average distance between valleys (Valley spacing) of 15 ⁇ m or less and a maximum waviness difference (Wmax) of 0.8 ⁇ m or less. It can be manufactured by preparing, forming a release layer on the surface of the carrier foil, and forming an ultrathin copper foil on the release layer.
  • the average distance (valley spacing) between the valleys on the surface of the carrier foil on the release layer side is preferably 15 ⁇ m or less, more preferably 1 to 10 ⁇ m or less, and further preferably 3 to 8 ⁇ m or less.
  • the maximum height difference (Wmax) of the waviness on the surface of the carrier foil on the release layer side is 0.8 ⁇ m or less, more preferably 0.7 ⁇ m or less, and still more preferably 0.6 ⁇ m or less. Since Wmax is preferably as low as possible, the lower limit is not particularly limited, but Wmax is typically 0.1 ⁇ m or more, and more typically 0.2 ⁇ m or more. Low Valley spacing and Wmax within the above range on the surface of the carrier foil is achieved by adjusting the surface roughness by polishing the surface of the rotating cathode used when electrolytically forming the carrier foil with a predetermined count buff. It can be carried out.
  • the surface profile of the rotating cathode thus adjusted is transferred to the electrode surface of the carrier foil, and an ultrathin copper foil is formed through the release layer on the electrode surface of the carrier foil thus provided with the desired surface profile.
  • the surface profile described above can be imparted to the surface on the peeling layer side of the ultrathin copper foil.
  • a preferred buff count is greater than # 1000 and less than # 3000, more preferably # 1500 to # 2500.
  • another functional layer may be provided between the release layer and the carrier foil and / or ultrathin copper foil.
  • An example of such another functional layer is an auxiliary metal layer.
  • the auxiliary metal layer is preferably made of nickel and / or cobalt. By forming such an auxiliary metal layer on the surface side of the carrier foil and / or on the surface side of the ultrathin copper foil, it may occur between the carrier foil and the ultrathin copper foil during hot press molding at a high temperature or for a long time. Interdiffusion can be suppressed and the stability of the peeling strength of the carrier foil can be ensured.
  • the thickness of the auxiliary metal layer is preferably 0.001 to 3 ⁇ m.
  • rust prevention treatment may be applied to the ultrathin copper foil.
  • the rust prevention treatment preferably includes a plating treatment using zinc.
  • the plating treatment using zinc may be either a zinc plating treatment or a zinc alloy plating treatment, and the zinc alloy plating treatment is particularly preferably a zinc-nickel alloy treatment.
  • the zinc-nickel alloy treatment may be a plating treatment containing at least Ni and Zn, and may further contain other elements such as Sn, Cr, and Co.
  • the Ni / Zn adhesion ratio in the zinc-nickel alloy plating is preferably 1.2 to 10, more preferably 2 to 7, and still more preferably 2.7 to 4 in terms of mass ratio.
  • the rust prevention treatment preferably further includes a chromate treatment, and this chromate treatment is more preferably performed on the surface of the plating containing zinc after the plating treatment using zinc.
  • rust prevention property can further be improved.
  • a particularly preferable antirust treatment is a combination of a zinc-nickel alloy plating treatment and a subsequent chromate treatment.
  • the surface of the ultrathin copper foil may be treated with a silane coupling agent to form a silane coupling agent layer.
  • a silane coupling agent layer can be formed by appropriately diluting and applying a silane coupling agent and drying.
  • silane coupling agents include epoxy-functional silane coupling agents such as 4-glycidylbutyltrimethoxysilane and ⁇ -glycidoxypropyltrimethoxysilane, or ⁇ -aminopropyltrimethoxysilane, N- ⁇ (amino Amino functions such as ethyl) ⁇ -aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) butoxy) propyl-3-aminopropyltrimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane Silane coupling agent, or mercapto functional silane coupling agent such as ⁇ -mercaptopropyltrimethoxysilane, or olefin functional silane coupling agent such as vinyltrimethoxysilane, vinylphenyltrimethoxysilane, or ⁇ -methacryloxypropyl Trimetoki Acrylic-functional silane coupling
  • the ultrathin copper foil with a carrier of the present invention is preferably used for the production of a copper-clad laminate for printed wiring boards. That is, according to the preferable aspect of this invention, the copper clad laminated board obtained using the ultra-thin copper foil with a carrier is provided.
  • This copper clad laminate comprises the ultrathin copper foil with a carrier of the present invention and a resin layer provided in close contact with the surface treatment layer.
  • the ultra-thin copper foil with a carrier may be provided on one side of the resin layer or may be provided on both sides.
  • the resin layer comprises a resin, preferably an insulating resin.
  • the resin layer is preferably a prepreg and / or a resin sheet.
  • the prepreg is a general term for composite materials in which a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin.
  • Preferable examples of the insulating resin include an epoxy resin, a cyanate resin, a bismaleimide triazine resin (BT resin), a polyphenylene ether resin, and a phenol resin.
  • the insulating resin that constitutes the resin sheet include insulating resins such as epoxy resins, polyimide resins, and polyester resins.
  • the filler particle etc. which consist of various inorganic particles, such as a silica and an alumina, may contain in the resin layer from a viewpoint of improving insulation.
  • the thickness of the resin layer is not particularly limited, but is preferably 1 to 1000 ⁇ m, more preferably 2 to 400 ⁇ m, and still more preferably 3 to 200 ⁇ m.
  • the resin layer may be composed of a plurality of layers.
  • a resin layer such as a prepreg and / or a resin sheet may be provided on the ultrathin copper foil with a carrier via a primer resin layer previously applied to the surface of the copper foil.
  • the ultrathin copper foil with a carrier of the present invention is preferably used for production of a printed wiring board. That is, according to the preferable aspect of this invention, the printed wiring board obtained using the ultra-thin copper foil with a carrier is provided.
  • the printed wiring board according to this aspect includes a layer configuration in which a resin layer and a copper layer are laminated in this order.
  • a copper layer is a layer originating in the ultra-thin copper foil of the ultra-thin copper foil with a carrier of this invention.
  • the resin layer is as described above for the copper-clad laminate.
  • the printed wiring board can employ a known layer configuration except that the ultrathin copper foil with a carrier of the present invention is used.
  • Specific examples of the printed wiring board include a single-sided or double-sided printed wiring board formed with a circuit on the laminated body obtained by bonding the ultrathin copper foil of the present invention to one side or both sides of the prepreg, and a multilayer in which these are multilayered.
  • a printed wiring board etc. are mentioned.
  • Other specific examples include a flexible printed wiring board, a COF, a TAB tape, and the like that form a circuit by forming the ultrathin copper foil of the present invention on a resin film.
  • the ultrathin copper foil with a carrier of the present invention is suitable for the MSAP method.
  • a configuration as shown in FIGS. 1 and 2 can be adopted.
  • Examples 1-5 After forming a peeling layer and an ultrathin copper foil layer in order on the electrode surface side of the carrier foil, an ultrathin copper foil with a carrier was produced by performing a rust prevention treatment and a silane coupling agent treatment. And various evaluation was performed about the obtained ultra-thin copper foil with a carrier.
  • the specific procedure is as follows.
  • auxiliary metal layer Formation of auxiliary metal layer
  • the carrier foil on which the organic peeling layer is formed is immersed in a solution containing nickel concentration of 20 g / L prepared using nickel sulfate, and the liquid temperature is 45 ° C., the pH is 3, and the current density is 5 A.
  • nickel having a thickness equivalent to 0.001 ⁇ m was deposited on the organic release layer.
  • a nickel layer was formed as an auxiliary metal layer on the organic release layer.
  • Roughening treatment The surface of the ultrathin copper foil thus formed was subjected to a roughening treatment.
  • This roughening treatment includes a baking plating process in which fine copper grains are deposited on an ultrathin copper foil, and a covering plating process for preventing the fine copper grains from falling off.
  • a roughening treatment was performed at an acid density of 25 A / dm 2 using an acidic copper sulfate solution containing a copper concentration of 10 g / L and a sulfuric acid concentration of 120 g / L.
  • electrodeposition was performed using an acidic copper sulfate solution containing a copper concentration of 70 g / L and a sulfuric acid concentration of 120 g / L under smooth plating conditions of a liquid temperature of 40 ° C. and a current density of 15 A / dm 2 .
  • the surface of the roughening treatment layer of the obtained ultrathin copper foil with carrier was subjected to a rust prevention treatment comprising zinc-nickel alloy plating treatment and chromate treatment.
  • the surface of the carrier foil was subjected to zinc-nickel alloy plating.
  • a chromate treatment was performed on the surface on which the zinc-nickel alloy plating treatment was performed using a 3 g / L aqueous solution of chromic acid under the conditions of pH 10 and a current density of 5 A / dm 2 .
  • Silane coupling agent treatment An aqueous solution containing 2 g / L of ⁇ -glycidoxypropyltrimethoxysilane is adsorbed on the surface of the ultrathin copper foil with a carrier and evaporated by an electric heater. The silane coupling agent treatment was performed. At this time, the silane coupling agent treatment was not performed on the carrier foil side.
  • Example 2 a surface profile of a 10800 ⁇ m 2 region (120 ⁇ m ⁇ 90 ⁇ m) on the surface (roughened surface side) of an ultrathin copper foil was used using a three-dimensional roughness analyzer (ERA-8900, manufactured by Elionix Corporation).
  • the average roughened particle height and the 1/10 value width were determined by analyzing under the conditions of measurement magnification: 1000 times, acceleration voltage: 10 kV, and Z-axis interval: 0.02 ⁇ m.
  • This surface analysis is performed by dividing the cut surface while dividing it at a constant interval (0.02 ⁇ m) in the height direction from the lowest position (corresponding to the basal plane) of the valley bottom between the roughened particles to the maximum roughened particle height.
  • the graph was plotted with the vertical axis as the number of cuts in the cut surface and the horizontal axis as the height from the basal plane. Based on this distribution curve and the above-mentioned definition, the average coarse particle height and 1/10 value width were determined.
  • a copper-clad laminate was prepared using an ultrathin copper foil with a carrier, and laser processability was evaluated.
  • an ultrathin copper foil with an ultrathin copper foil with a carrier was laminated on the surface of the inner layer substrate via a prepreg (manufactured by Mitsubishi Gas Chemical Co., Inc., 830NX-A, thickness 0.1 mm), and a pressure of 0.4 MPa, After thermocompression bonding at a temperature of 220 ° C. for 90 minutes, the carrier foil was peeled off to produce a copper clad laminate. Then, using a carbon dioxide laser, a pulse width of 14 ⁇ sec.
  • the copper-clad laminate was laser processed under the conditions of pulse energy of 6.4 mJ and laser beam diameter of 108 ⁇ m. At that time, when the hole diameter after processing was 60 ⁇ m or more, it was determined as A, and less than 60 ⁇ m was determined as B.
  • an etchant Mitsubishi Gas Chemical Co., Ltd., CPE800
  • Example 6 (Comparison) After the release layer and the ultrathin copper foil layer were formed in this order on the deposition surface side of the carrier foil, an ultrathin copper foil with a carrier was prepared by performing a rust prevention treatment and a silane coupling agent treatment. And various evaluation was performed about the obtained ultra-thin copper foil with a carrier.
  • the specific procedure is as follows.
  • the pickled carrier foil is immersed in a CBTA aqueous solution with CBTA (carboxybenzotriazole) 1 g / L, sulfuric acid concentration 150 g / L and copper concentration 10 g / L at a liquid temperature of 30 ° C. for 30 seconds. Then, the CBTA component was adsorbed on the deposition surface of the carrier foil. Thus, a CBTA layer was formed as an organic release layer on the deposition surface of the carrier foil.
  • CBTA carboxybenzotriazole
  • the auxiliary metal layer is formed on the organic release layer formed on the deposition surface side of the carrier foil. Formation, formation of ultrathin copper foil, roughening treatment, rust prevention treatment, silane coupling treatment, and various evaluations were performed.
  • Example 7 The baking plating process in the roughening treatment is performed using an acidic copper sulfate solution containing a copper concentration of 10 g / L, a sulfuric acid concentration of 120 g / L and carboxybenzotriazole of 2 mg / L at a liquid temperature of 25 ° C. and a current density of 15 A / dm 2 .
  • Preparation and evaluation of an ultrathin copper foil with a carrier were carried out in the same manner as in Example 2 except that the treatment was performed.
  • the distribution curve of the number of cut edges of the roughened particles on the cut surface according to the height from the basal plane was as shown in FIG.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un film de cuivre ultra-mince à support permettant d'obtenir à la fois une aptitude au formage de microcircuit et une aptitude au traitement laser, par l'usinage d'un stratifié cuivré dans la fabrication d'une carte de circuit imprimé. Le film de cuivre ultra-mince à support est pourvu d'un film support, d'une couche de libération et d'un film de cuivre ultra-mince, dans cet ordre. La surface du film de cuivre ultra-mince sur le côté couche de libération présente une distance moyenne (espacement de pics) entre les pics de surface de 20 μm ou moins, et la surface du film de cuivre ultra-mince sur le côté opposé de la couche de libération présente une différence maximum de hauteur d'ondulation (Wmax) de 1,0 µm ou moins.
PCT/JP2016/051526 2015-01-22 2016-01-20 Film de cuivre ultra-mince à support et son procédé de fabrication WO2016117587A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201680003775.1A CN107002265B (zh) 2015-01-22 2016-01-20 带载体的极薄铜箔及其制造方法
KR1020177009811A KR101929844B1 (ko) 2015-01-22 2016-01-20 캐리어 부착 극박 동박 및 그 제조 방법
JP2016570671A JP6352449B2 (ja) 2015-01-22 2016-01-20 キャリア付極薄銅箔及びその製造方法
KR1020187035876A KR102031065B1 (ko) 2015-01-22 2016-01-20 캐리어 부착 극박 동박 및 그 제조 방법, 동장 적층판, 및 프린트 배선판의 제조 방법
CN201910236053.6A CN110072334B (zh) 2015-01-22 2016-01-20 带载体的极薄铜箔及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-010431 2015-01-22
JP2015010431 2015-01-22

Publications (1)

Publication Number Publication Date
WO2016117587A1 true WO2016117587A1 (fr) 2016-07-28

Family

ID=56417128

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/051526 WO2016117587A1 (fr) 2015-01-22 2016-01-20 Film de cuivre ultra-mince à support et son procédé de fabrication

Country Status (6)

Country Link
JP (2) JP6352449B2 (fr)
KR (2) KR102031065B1 (fr)
CN (2) CN107002265B (fr)
MY (1) MY174931A (fr)
TW (1) TWI572747B (fr)
WO (1) WO2016117587A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181726A1 (fr) * 2017-03-30 2018-10-04 古河電気工業株式会社 Feuille de cuivre traitée en surface et stratifié recouvert de cuivre et carte de circuit imprimé utilisant ceux-ci
WO2020031721A1 (fr) * 2018-08-10 2020-02-13 三井金属鉱業株式会社 Feuille de cuivre rugosifiée, feuille de cuivre pourvue d'un support, stratifié plaqué de cuivre et carte de circuit imprimé
WO2021157363A1 (fr) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé
WO2021157362A1 (fr) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé
WO2022209989A1 (fr) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 Feuille de cuivre rendue rugueuse, carte stratifiée plaquée de cuivre et carte de circuit imprimé
WO2022209990A1 (fr) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 Feuille de cuivre rugosifiée, stratifié cuivré et carte de circuit imprimé
KR20240009404A (ko) 2021-05-20 2024-01-22 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR20240009403A (ko) 2021-05-20 2024-01-22 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR20240009937A (ko) 2021-05-20 2024-01-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107454762A (zh) * 2017-09-14 2017-12-08 桐城市闲产网络服务有限公司 一种计算机电路板的制作方法
CN108323025B (zh) * 2018-02-01 2020-01-14 北京启创驿讯科技有限公司 一种印刷电路板的制备方法及加工用铜箔
CN109518131A (zh) * 2018-12-25 2019-03-26 胡旭日 一种带载体的极薄铜箔、极薄铜箔生产方法及装置
CN112795964B (zh) * 2020-12-07 2021-11-19 安徽铜冠铜箔集团股份有限公司 一种极薄可剥离的复合铜箔及其制备方法
CN115233262B (zh) * 2022-08-01 2023-12-12 九江德福科技股份有限公司 一种附载体极薄铜箔的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176768A (ja) * 2008-01-21 2009-08-06 Ube Ind Ltd セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
WO2012046804A1 (fr) * 2010-10-06 2012-04-12 古河電気工業株式会社 Feuille de cuivre et son procédé de fabrication, feuille de cuivre avec support et son procédé de fabrication, carte de circuit imprimé et carte de circuit imprimé multicouche
JP2013019056A (ja) * 2006-03-10 2013-01-31 Mitsui Mining & Smelting Co Ltd 表面処理電解銅箔及びその表面処理銅箔を用いて得られる銅張積層板
WO2014133164A1 (fr) * 2013-02-28 2014-09-04 三井金属鉱業株式会社 Feuille de cuivre dont la surface a été traitée et noircie, procédé permettant de fabriquer une feuille de cuivre dont la surface a été traitée et noircie, stratifié recouvert de cuivre et carte de circuit imprimé flexible

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY138743A (en) * 1996-05-13 2009-07-31 Mitsui Mining & Smelting Co High tensile strength electrodeposited copper foil and the production process of the same
JP3142270B2 (ja) 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
JP4298943B2 (ja) * 2001-10-18 2009-07-22 日鉱金属株式会社 銅箔表面処理剤
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
EP1531656A3 (fr) * 2003-11-11 2007-10-03 Furukawa Circuit Foil Co., Ltd. Feuille de cuivre ultra-mince avec support et panneau à circuit imprimé utilisant une feuille de cuivre ultra-mince avec support
JP6403969B2 (ja) * 2013-03-29 2018-10-10 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013019056A (ja) * 2006-03-10 2013-01-31 Mitsui Mining & Smelting Co Ltd 表面処理電解銅箔及びその表面処理銅箔を用いて得られる銅張積層板
JP2009176768A (ja) * 2008-01-21 2009-08-06 Ube Ind Ltd セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
WO2012046804A1 (fr) * 2010-10-06 2012-04-12 古河電気工業株式会社 Feuille de cuivre et son procédé de fabrication, feuille de cuivre avec support et son procédé de fabrication, carte de circuit imprimé et carte de circuit imprimé multicouche
WO2014133164A1 (fr) * 2013-02-28 2014-09-04 三井金属鉱業株式会社 Feuille de cuivre dont la surface a été traitée et noircie, procédé permettant de fabriquer une feuille de cuivre dont la surface a été traitée et noircie, stratifié recouvert de cuivre et carte de circuit imprimé flexible

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181726A1 (fr) * 2017-03-30 2018-10-04 古河電気工業株式会社 Feuille de cuivre traitée en surface et stratifié recouvert de cuivre et carte de circuit imprimé utilisant ceux-ci
JPWO2018181726A1 (ja) * 2017-03-30 2019-06-27 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
CN110832120A (zh) * 2017-03-30 2020-02-21 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
US10701811B2 (en) 2017-03-30 2020-06-30 Furukawa Electric Co., Ltd. Surface-treated copper foil, and copper-clad laminate and printed wiring board using same
TWI782969B (zh) * 2017-03-30 2022-11-11 日商古河電氣工業股份有限公司 表面處理銅箔、以及使用其之覆銅積層板及印刷電路板
CN110832120B (zh) * 2017-03-30 2022-01-11 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
WO2020031721A1 (fr) * 2018-08-10 2020-02-13 三井金属鉱業株式会社 Feuille de cuivre rugosifiée, feuille de cuivre pourvue d'un support, stratifié plaqué de cuivre et carte de circuit imprimé
KR20210019518A (ko) 2018-08-10 2021-02-22 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
JPWO2020031721A1 (ja) * 2018-08-10 2021-04-30 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JPWO2021157362A1 (fr) * 2020-02-04 2021-08-12
JP7259093B2 (ja) 2020-02-04 2023-04-17 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JPWO2021157363A1 (fr) * 2020-02-04 2021-08-12
KR20220106199A (ko) 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
KR20220106200A (ko) 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
CN115038818A (zh) * 2020-02-04 2022-09-09 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
WO2021157362A1 (fr) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé
JP7177956B2 (ja) 2020-02-04 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2021157363A1 (fr) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé
WO2022209990A1 (fr) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 Feuille de cuivre rugosifiée, stratifié cuivré et carte de circuit imprimé
WO2022209989A1 (fr) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 Feuille de cuivre rendue rugueuse, carte stratifiée plaquée de cuivre et carte de circuit imprimé
KR20240009404A (ko) 2021-05-20 2024-01-22 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR20240009403A (ko) 2021-05-20 2024-01-22 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR20240009937A (ko) 2021-05-20 2024-01-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Also Published As

Publication number Publication date
TW201636457A (zh) 2016-10-16
MY174931A (en) 2020-05-24
CN107002265B (zh) 2019-04-26
CN110072334B (zh) 2022-04-01
JP6529640B2 (ja) 2019-06-12
CN110072334A (zh) 2019-07-30
KR20180135105A (ko) 2018-12-19
JPWO2016117587A1 (ja) 2017-07-06
JP2018138702A (ja) 2018-09-06
JP6352449B2 (ja) 2018-07-04
TWI572747B (zh) 2017-03-01
KR101929844B1 (ko) 2018-12-17
KR102031065B1 (ko) 2019-10-11
KR20170057327A (ko) 2017-05-24
CN107002265A (zh) 2017-08-01

Similar Documents

Publication Publication Date Title
JP6352449B2 (ja) キャリア付極薄銅箔及びその製造方法
JP6193534B2 (ja) 粗化処理銅箔、銅張積層板及びプリント配線板
JP6905157B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP6293365B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP6430092B1 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP7166335B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2019188837A1 (fr) Feuille de cuivre traitée en surface, stratifié revêtu de cuivre et procédé de fabrication d'une carte à circuits imprimés
TWI756039B (zh) 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板
WO2016152390A1 (fr) Feuille de cuivre ultra-mince comportant un support, son procédé de fabrication, stratifié à revêtement de cuivre, et carte de circuit imprimé
WO2022202539A1 (fr) Feuille de cuivre avec support, stratifié cuivré, et carte de circuit imprimé
WO2022244827A1 (fr) Feuille de cuivre rendue rugueuse, feuille de cuivre pourvue d'un support, stratifié plaqué de cuivre et carte de circuit imprimé
WO2022244826A1 (fr) Feuille de cuivre rugosifiée, feuille de cuivre comprenant un support, carte stratifiée plaquée de cuivre et carte de circuit imprimé
KR20240009937A (ko) 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16740194

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016570671

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20177009811

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16740194

Country of ref document: EP

Kind code of ref document: A1