JPWO2021157362A1 - - Google Patents

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Publication number
JPWO2021157362A1
JPWO2021157362A1 JP2021575705A JP2021575705A JPWO2021157362A1 JP WO2021157362 A1 JPWO2021157362 A1 JP WO2021157362A1 JP 2021575705 A JP2021575705 A JP 2021575705A JP 2021575705 A JP2021575705 A JP 2021575705A JP WO2021157362 A1 JPWO2021157362 A1 JP WO2021157362A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575705A
Other languages
Japanese (ja)
Other versions
JP7259093B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157362A1 publication Critical patent/JPWO2021157362A1/ja
Application granted granted Critical
Publication of JP7259093B2 publication Critical patent/JP7259093B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021575705A 2020-02-04 2021-01-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 Active JP7259093B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020016980 2020-02-04
JP2020016980 2020-02-04
PCT/JP2021/001902 WO2021157362A1 (fr) 2020-02-04 2021-01-20 Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé

Publications (2)

Publication Number Publication Date
JPWO2021157362A1 true JPWO2021157362A1 (fr) 2021-08-12
JP7259093B2 JP7259093B2 (ja) 2023-04-17

Family

ID=77199339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575705A Active JP7259093B2 (ja) 2020-02-04 2021-01-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP7259093B2 (fr)
KR (1) KR20220106200A (fr)
CN (1) CN115038819A (fr)
TW (1) TWI756039B (fr)
WO (1) WO2021157362A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022153580A1 (fr) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281759A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317574A (ja) * 1998-01-19 1999-11-16 Mitsui Mining & Smelting Co Ltd 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JP2001089892A (ja) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
JP2014506202A (ja) * 2010-12-14 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー 像及びそれを作製する方法
WO2016117587A1 (fr) * 2015-01-22 2016-07-28 三井金属鉱業株式会社 Film de cuivre ultra-mince à support et son procédé de fabrication

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6682516B2 (ja) * 2015-04-28 2020-04-15 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
MY177676A (en) * 2015-07-03 2020-09-23 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper-clad laminate and printed wiring board
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2017179416A1 (fr) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 Feuille de cuivre traitée en surface, feuille de cuivre avec support et procédés de fabrication de stratifié revêtu de cuivre et carte de circuit imprimé l'utilisant
WO2018110579A1 (fr) 2016-12-14 2018-06-21 古河電気工業株式会社 Feuille de cuivre traitée en surface et stratifié cuivré
JP6632739B2 (ja) * 2017-04-25 2020-01-22 古河電気工業株式会社 表面処理銅箔
KR102647658B1 (ko) * 2018-03-27 2024-03-15 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
JP6905157B2 (ja) * 2018-08-10 2021-07-21 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317574A (ja) * 1998-01-19 1999-11-16 Mitsui Mining & Smelting Co Ltd 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JP2001089892A (ja) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
JP2014506202A (ja) * 2010-12-14 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー 像及びそれを作製する方法
WO2016117587A1 (fr) * 2015-01-22 2016-07-28 三井金属鉱業株式会社 Film de cuivre ultra-mince à support et son procédé de fabrication

Also Published As

Publication number Publication date
WO2021157362A1 (fr) 2021-08-12
KR20220106200A (ko) 2022-07-28
CN115038819A (zh) 2022-09-09
TW202146711A (zh) 2021-12-16
JP7259093B2 (ja) 2023-04-17
TWI756039B (zh) 2022-02-21

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