TWI756039B - 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板 - Google Patents

粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板 Download PDF

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Publication number
TWI756039B
TWI756039B TW110103172A TW110103172A TWI756039B TW I756039 B TWI756039 B TW I756039B TW 110103172 A TW110103172 A TW 110103172A TW 110103172 A TW110103172 A TW 110103172A TW I756039 B TWI756039 B TW I756039B
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TW
Taiwan
Prior art keywords
copper foil
roughened
less
filter
carrier
Prior art date
Application number
TW110103172A
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English (en)
Chinese (zh)
Other versions
TW202146711A (zh
Inventor
細川眞
髙梨哲聡
溝口美智
Original Assignee
日商三井金屬鑛業股份有限公司
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Publication of TW202146711A publication Critical patent/TW202146711A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW110103172A 2020-02-04 2021-01-28 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板 TWI756039B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-016980 2020-02-04
JP2020016980 2020-02-04

Publications (2)

Publication Number Publication Date
TW202146711A TW202146711A (zh) 2021-12-16
TWI756039B true TWI756039B (zh) 2022-02-21

Family

ID=77199339

Family Applications (1)

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TW110103172A TWI756039B (zh) 2020-02-04 2021-01-28 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板

Country Status (5)

Country Link
JP (1) JP7259093B2 (fr)
KR (1) KR20220106200A (fr)
CN (1) CN115038819A (fr)
TW (1) TWI756039B (fr)
WO (1) WO2021157362A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022153580A1 (fr) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281759A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322259A (zh) * 1999-09-21 2001-11-14 三井金属鉱业株式会社 带载体箔的电解铜箔及其制造方法和使用该带载体箔的电解铜箔的敷铜层压板
TW201718948A (zh) * 2015-07-03 2017-06-01 Mitsui Mining & Smelting Co 粗糙化處理銅箔、貼銅層積板及印刷電路板
CN107002265A (zh) * 2015-01-22 2017-08-01 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
CN109072472A (zh) * 2016-04-14 2018-12-21 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392066B2 (ja) * 1998-01-19 2003-03-31 三井金属鉱業株式会社 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JP2005048277A (ja) 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
BR112013013241A2 (pt) * 2010-12-14 2016-09-06 3M Innovative Properties Co artigo e método para a produção do artigo
JP6682516B2 (ja) * 2015-04-28 2020-04-15 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2018110579A1 (fr) 2016-12-14 2018-06-21 古河電気工業株式会社 Feuille de cuivre traitée en surface et stratifié cuivré
KR102647658B1 (ko) * 2018-03-27 2024-03-15 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
JP6905157B2 (ja) * 2018-08-10 2021-07-21 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322259A (zh) * 1999-09-21 2001-11-14 三井金属鉱业株式会社 带载体箔的电解铜箔及其制造方法和使用该带载体箔的电解铜箔的敷铜层压板
CN107002265A (zh) * 2015-01-22 2017-08-01 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
TW201718948A (zh) * 2015-07-03 2017-06-01 Mitsui Mining & Smelting Co 粗糙化處理銅箔、貼銅層積板及印刷電路板
CN109072472A (zh) * 2016-04-14 2018-12-21 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔

Also Published As

Publication number Publication date
WO2021157362A1 (fr) 2021-08-12
KR20220106200A (ko) 2022-07-28
CN115038819A (zh) 2022-09-09
TW202146711A (zh) 2021-12-16
JPWO2021157362A1 (fr) 2021-08-12
JP7259093B2 (ja) 2023-04-17

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