WO2016152390A1 - Feuille de cuivre ultra-mince comportant un support, son procédé de fabrication, stratifié à revêtement de cuivre, et carte de circuit imprimé - Google Patents

Feuille de cuivre ultra-mince comportant un support, son procédé de fabrication, stratifié à revêtement de cuivre, et carte de circuit imprimé Download PDF

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Publication number
WO2016152390A1
WO2016152390A1 PCT/JP2016/056014 JP2016056014W WO2016152390A1 WO 2016152390 A1 WO2016152390 A1 WO 2016152390A1 JP 2016056014 W JP2016056014 W JP 2016056014W WO 2016152390 A1 WO2016152390 A1 WO 2016152390A1
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Prior art keywords
copper foil
carrier
ultrathin copper
foil
ultra
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PCT/JP2016/056014
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English (en)
Japanese (ja)
Inventor
中島　大輔
花田　徹
吉川　和広
良憲 清水
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三井金属鉱業株式会社
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Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to KR1020177014980A priority Critical patent/KR102531073B1/ko
Priority to CN201680017908.0A priority patent/CN107428129B/zh
Priority to MYPI2017703386A priority patent/MY183238A/en
Priority to JP2017507639A priority patent/JP6650923B2/ja
Publication of WO2016152390A1 publication Critical patent/WO2016152390A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present invention relates to an ultrathin copper foil with a carrier, a manufacturing method thereof, a copper clad laminate, and a printed wiring board.
  • the subtractive method has been widely adopted as a method for manufacturing a printed wiring board.
  • the subtractive method is a technique capable of forming a fine circuit using a copper foil.
  • the roughened surface of the copper foil 10 is bonded to the insulating resin substrate 12 having the lower layer circuit 12b on the base substrate 12a through the prepreg 14 (step (a)).
  • step (b) the roughened surface of the copper foil 10 is bonded to the insulating resin substrate 12 having the lower layer circuit 12b on the base substrate 12a through the prepreg 14
  • via holes 16 are formed by laser drilling (step (c)).
  • step (d) chemical copper plating 18 (step (d)) and electrolytic copper plating 20 (step (e)) are performed, masking with a predetermined pattern by exposure and development using the dry film 22 (step (f)), and etching. Then, unnecessary copper foil or the like immediately below the opening of the dry film 22 is dissolved and removed (step (g)), and then the dry film 22 is peeled off (step (h)) to form the wiring 24 formed in a predetermined pattern. obtain.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-326467 discloses a method for manufacturing a printed wiring board including forming a recess such as a via hole in a copper-clad laminate, and the outer layer of the copper-clad laminate is disclosed. It is disclosed that by adopting a corrugated copper foil as the copper foil, direct laser drilling that simultaneously removes the copper foil and the base resin using a carbon dioxide gas laser is made possible.
  • Patent Document 2 Japanese Patent Laid-Open No.
  • the surface of the ultrathin copper foil is subjected to blackening treatment, and then the blackened surface is irradiated with a carbon dioxide laser to produce ultrathin copper.
  • a method for perforating a foil and an insulating layer immediately below the foil is disclosed.
  • Patent Document 1 Although the technique using the corrugated copper foil as disclosed in Patent Document 1 has high laser drilling workability, the fine circuit formability may be inferior, ensuring high laser drilling workability. However, it is desired to further improve the fine circuit formability.
  • the blackening treatment disclosed in Patent Document 2 requires time and cost, and the yield can be reduced. Therefore, direct laser drilling is desirably performed on the surface of the ultrathin copper foil without performing the blackening treatment. It is convenient if you can.
  • the present inventors now have an average distance (Peak Spacing) between the surface peaks of the surface on the peeling layer side of the ultrathin copper foil of 2.5 to 20.0 ⁇ m, and Surface profile where the core level difference Rk is 1.5 to 3.0 ⁇ m, and the maximum height difference Wmax of the waviness on the side opposite to the peel-off layer of the ultrathin copper foil is 4.0 ⁇ m or less.
  • Peak Spacing an average distance between the surface peaks of the surface on the peeling layer side of the ultrathin copper foil of 2.5 to 20.0 ⁇ m, and Surface profile where the core level difference Rk is 1.5 to 3.0 ⁇ m, and the maximum height difference Wmax of the waviness on the side opposite to the peel-off layer of the ultrathin copper foil is 4.0 ⁇ m or less.
  • an object of the present invention is to provide an ultrathin copper foil with a carrier capable of achieving both laser drilling workability and fine circuit formability in processing of a copper-clad laminate or manufacturing of a printed wiring board. .
  • an ultrathin copper foil with a carrier comprising a carrier foil, a release layer and an ultrathin copper foil in this order
  • the surface on the peeling layer side of the ultrathin copper foil has an average distance (Peak Spacing) between surface peaks of 2.5 to 20.0 ⁇ m and a core portion depth difference Rk of 1. 5 to 3.0 ⁇ m
  • the surface of the ultrathin copper foil opposite to the release layer is provided with an ultrathin copper foil with a carrier having a maximum waviness difference Wmax of 4.0 ⁇ m or less.
  • a method for producing an ultrathin copper foil with a carrier according to the above aspect, Prepare a carrier foil having a surface with an average valley spacing (Valley Spacing) of 2.5 to 20.0 ⁇ m and a core level difference (core roundness depth) Rk of 2.0 to 3.8 ⁇ m.
  • Process Forming a release layer on the surface of the carrier foil; Forming an ultrathin copper foil on the release layer; A method is provided comprising.
  • a copper clad laminate comprising the ultrathin copper foil with a carrier according to the above aspect.
  • a method for manufacturing a printed wiring board wherein the printed wiring board is manufactured using the ultrathin copper foil with a carrier according to the above aspect.
  • average peak-to-surface peak is the waveform data related to the peak after removing the waviness component from the information on the unevenness of the sample surface obtained using a three-dimensional surface structure analysis microscope. The average distance between peaks in the data extracted by filtering.
  • the “valley spacing” is obtained by filtering the waveform data related to the valley after removing the undulation component from the information on the unevenness of the sample surface obtained using a three-dimensional surface structure analysis microscope. This is the average distance between valleys in the extracted data.
  • the “core level difference Rk” is a parameter that can be determined in accordance with JIS B 0671-2: 2002, and as shown in FIG.
  • the difference between the upper level 32a and the lower level 32b of the core portion (roughness core profile) 32 of this is the "core portion of the roughness curve” 30.
  • the high protruding peak portion 34 and the deep protruding valley portion 36 are roughened.
  • the “maximum waviness difference Wmax” is a waveform obtained by extracting waveform data relating to waviness using a filter from information relating to the unevenness of the sample surface obtained using a three-dimensional surface structure analysis microscope.
  • the maximum value of the data height difference (the sum of the maximum peak height and the maximum valley depth of the waveform).
  • ten-point average roughness Rzjis is a parameter that can be determined in accordance with JIS B 0601: 2001.
  • the roughness curve of the reference length up to the fifth highest from the highest peak. This is the sum of the average of the mountain height and the average of the depth of the valleys from the deepest valley bottom to the fifth deepest.
  • the average distance between surface peaks (Peak spacing), the average distance between valleys (Valley spacing), the core level difference (core roughness depth) Rk, the maximum height difference Wmax of waviness, and the ten-point average roughness Rzjis, Using a commercially available three-dimensional surface structure analysis microscope (for example, zygo New View 5032 (manufactured by Zygo)) and commercially available analysis software (for example, Metro Pro Ver. 8.0.2), the low frequency filter is set to a condition of 11 ⁇ m. Can be measured.
  • the non-measurement surface of the foil was fixed in close contact with the sample stage, and measurement was performed by selecting 6 points of view of 108 ⁇ m ⁇ 144 ⁇ m within the 1 cm square range of the sample piece, and obtained from the 6 measurement points.
  • the average value of the measured values obtained is preferably adopted as the representative value.
  • the “electrode surface” of the carrier foil refers to the surface on the side in contact with the cathode when the carrier foil was produced.
  • the “deposition surface” of the carrier foil refers to the surface on the side where electrolytic copper is deposited when the carrier foil is produced, that is, the surface not in contact with the cathode.
  • the ultrathin copper foil with carrier of the present invention comprises a carrier foil, a release layer and an ultrathin copper foil in this order.
  • the surface on the peeling layer side of the ultrathin copper foil has an average distance between peak peaks (Peak Spacing) of 2.5 to 20.0 ⁇ m, and a core portion level difference (core roundness depth) Rk of 1 .5 to 3.0 ⁇ m.
  • the surface of the ultrathin copper foil opposite to the release layer has a maximum waviness difference Wmax of 4.0 ⁇ m or less.
  • ultrathin copper foil is difficult to achieve both laser drilling workability and fine circuit formability unless blackening treatment is performed. However, according to the present invention, both can be achieved unexpectedly.
  • an ultrathin copper foil having a smooth surface opposite to the peeling layer is required.
  • an ultrathin copper foil having a smooth surface on the peeling layer side is required.
  • the smoother the surface the more easily the laser is reflected. This is because it becomes difficult to be absorbed by the thin copper foil and the laser drilling processability is lowered.
  • the technique using the corrugated copper foil as disclosed in Patent Document 1 has high laser drilling workability, but may be inferior in microcircuit formability.
  • the ultrathin copper foil with a carrier of the present invention it is possible to improve the fine circuit formability while ensuring high laser drilling workability.
  • Such compatibility between laser drilling workability and fine circuit formability is considered to be realized as follows.
  • the level difference Rk of the core portion on the surface of the peeling layer side of the ultrathin copper foil is 1.5 ⁇ m or more, and the average distance (Peak Spacing) between surface peaks on the surface of the peeling layer side of the ultrathin copper foil By setting the thickness to 2.5 to 20.0 ⁇ m, it is considered that high direct laser drilling workability is realized.
  • the level difference Rk of the core portion 32 is different from the ten-point average roughness Rzjis and is a curve obtained by removing the high protruding peak portion 34 and the deep protruding valley portion 36 from the roughness curve 30.
  • the direct laser drilling processability is improved as a synergistic effect of the Rk control and the Peak Spacing control.
  • the level difference Rk of the core portion on the surface of the peeling layer side of the ultrathin copper foil is set to 3.0 ⁇ m or less, and the maximum height difference Wmax of the undulation on the surface on the side opposite to the peeling layer of the ultrathin copper foil is set.
  • the thickness is set to 4.0 ⁇ m or less, it is considered that an improvement in microcircuit formability is realized without impairing such high laser drilling workability.
  • the present inventors have ascertained that the main factor that decreases the fine circuit formability is the undulation of the surface opposite to the peeling layer of the ultrathin copper foil, and the maximum difference in undulation (Wmax) is determined. It has been found that controlling to 4.0 ⁇ m or less contributes to improvement of microcircuit formation. In particular, 4.0 ⁇ m, which is the upper limit value of the maximum waviness difference Wmax, is not an extremely low value, and therefore, extreme smoothness is not required on the surface of the copper foil opposite to the release layer (typical) It can be said that the surface profile is particularly suitable for the subtractive method. However, the present invention may be applied to methods other than the subtractive method (for example, the MSAP (Modified Semi-Additive Process) method).
  • MSAP Modem Semi-Additive Process
  • the ultra-thin copper foil has an average distance between peak peaks (Peak Spacing) of 2.5 to 20.0 ⁇ m, and a core level difference (core roundness depth) Rk of 1.5 to 3
  • a surface having a thickness of 0.0 ⁇ m is provided on the surface on the side of the release layer, and a surface having a maximum waviness difference Wmax of 4.0 ⁇ m or less is provided on the surface on the side opposite to the release layer.
  • the average distance (Peak spacing) between surface peaks on the surface on the peeling layer side of the ultrathin copper foil is 2.5 to 20.0 ⁇ m, preferably 6.5 to 15.0 ⁇ m.
  • the core level difference Rk on the surface of the ultrathin copper foil on the release layer side is 1.5 to 3.0 ⁇ m, preferably 2.0 to 3.0 ⁇ m.
  • the maximum height difference Wmax of the undulation on the surface opposite to the peeling layer of the ultrathin copper foil is 4.0 ⁇ m or less, preferably 3.0 ⁇ m or less, more preferably 2.5 ⁇ m or less.
  • Wmax on the surface of the ultrathin copper foil is 3.0 ⁇ m or less. Since Wmax is preferably as low as possible, the lower limit is not particularly limited, but Wmax is typically 0.1 ⁇ m or more, and more typically 0.2 ⁇ m or more.
  • the surface on the peeling layer side of the ultrathin copper foil has a ten-point average roughness Rzjis of preferably 2.0 to 4.0 ⁇ m, more preferably 2.5 to 4.0 ⁇ m. Within such a range, it contributes to improving the balance between laser drilling workability and fine circuit formability.
  • the surface of the ultrathin copper foil opposite to the release layer has a ten-point average roughness Rzjis of preferably 4.0 ⁇ m or less, more preferably 3.0 ⁇ m or less, and even more preferably 2.5 ⁇ m or less. Within this range, it contributes to the improvement of fine circuit formability.
  • the ten-point average roughness Rzjis is typically 0.5 ⁇ m or more and more typically 1.0 ⁇ m or more from the viewpoint of adhesion to the resin layer.
  • the surface of the ultrathin copper foil opposite to the release layer is preferably a roughened surface. That is, it is preferable that one surface of the ultrathin copper foil is roughened.
  • This roughening treatment passes through at least two types of plating processes including a baking plating process for depositing fine copper particles on an ultrathin copper foil and a covering plating process for preventing the fine copper grains from falling off. It is preferable to carry out according to a known plating technique.
  • the surface of the ultrathin copper foil opposite to the release layer is a roughened surface, and more preferably satisfies the above-mentioned ten-point average roughness Rzjis.
  • the ultra-thin copper foil may be a known configuration employed for the ultra-thin copper foil with a carrier, except that it has the above-mentioned specific surface profile, and is not particularly limited.
  • the ultrathin copper foil may be formed by a wet film formation method such as an electroless copper plating method and an electrolytic copper plating method, a dry film formation method such as sputtering and chemical vapor deposition, or a combination thereof.
  • the preferred thickness of the ultrathin copper foil is 0.5 to 5.0 ⁇ m.
  • the thickness of the ultrathin copper foil is particularly preferably 3.0 ⁇ m or less.
  • the release layer is a layer having a function of weakening the peeling strength of the carrier foil, ensuring the stability of the strength, and further suppressing interdiffusion that may occur between the carrier foil and the copper foil during press molding at a high temperature. It is.
  • the release layer is generally formed on one side of the carrier foil, but may be formed on both sides.
  • the release layer may be either an organic release layer or an inorganic release layer. Examples of organic components used in the organic release layer include nitrogen-containing organic compounds, sulfur-containing organic compounds, carboxylic acids and the like. Examples of nitrogen-containing organic compounds include triazole compounds, imidazole compounds, and the like. Among these, triazole compounds are preferred in terms of easy release stability.
  • triazole compounds examples include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H-1,2,4-triazole and 3-amino- And 1H-1,2,4-triazole.
  • sulfur-containing organic compound examples include mercaptobenzothiazole, thiocyanuric acid, 2-benzimidazolethiol and the like.
  • carboxylic acid examples include monocarboxylic acid and dicarboxylic acid.
  • examples of inorganic components used in the inorganic release layer include Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and a chromate-treated film.
  • the release layer may be formed by bringing a release layer component-containing solution into contact with at least one surface of the carrier foil and fixing the release layer component to the surface of the carrier foil.
  • this contact may be performed by immersion in the release layer component-containing solution, spraying of the release layer component-containing solution, flowing down of the release layer component-containing solution, or the like.
  • the release layer component may be fixed to the surface of the carrier foil by adsorption or drying of the release layer component-containing solution, electrodeposition of the release layer component in the release layer component-containing solution, or the like.
  • the thickness of the release layer is typically 1 nm to 1 ⁇ m, preferably 5 nm to 500 nm.
  • the carrier foil is a foil for supporting an ultrathin copper foil and improving its handleability.
  • the carrier foil include an aluminum foil, a copper foil, a stainless steel (SUS) foil, a resin film whose surface is metal-coated, and preferably a copper foil.
  • the copper foil may be a rolled copper foil or an electrolytic copper foil.
  • the thickness of the carrier foil is typically 250 ⁇ m or less, preferably 12 ⁇ m to 200 ⁇ m.
  • the surface of the carrier foil on the release layer side has an average distance between valleys (Valley spacing) of 2.5 to 20.0 ⁇ m, and a core level difference (core roughness depth) Rk of 2.0 to 3.8 ⁇ m. Is preferred.
  • valleys Peak spacing
  • core roughness depth core roughness depth
  • the ultra-thin copper foil with a carrier of the present invention has an average distance between valleys of 2.5 to 20.0 ⁇ m and a core level difference Rk of 2.0 to 2.0. It can be manufactured by preparing a carrier foil having a surface of 3.8 ⁇ m, forming a release layer on the surface of the carrier foil, and forming an ultrathin copper foil on the release layer.
  • the surface on the release layer side of the carrier foil preferably has a ten-point average roughness Rzjis of 2.0 to 5.0 ⁇ m.
  • the average distance (Valley spacing) between the valleys on the surface of the carrier foil on the release layer side is preferably 4.5 to 10.0 ⁇ m.
  • Realization of Valley spacing, Rk, and Rzjis within the above range on the surface of the carrier foil is performed by treating the electrolytic solution (for example, sulfuric acid copper sulfate solution) with activated carbon to remove the residual additive in the electrolytic solution, and then after the activated carbon treatment.
  • An additive such as glue or gelatin is newly added to the electrolytic solution and electrolysis is performed under known conditions to produce an electrolytic copper foil having a thickness of about 15 to 35 ⁇ m (for example, patent document). 3 (refer to the production method described in JP-A-9-241882).
  • another functional layer may be provided between the release layer and the carrier foil and / or ultrathin copper foil.
  • An example of such another functional layer is an auxiliary metal layer.
  • the auxiliary metal layer is preferably made of nickel and / or cobalt. By forming such an auxiliary metal layer on the surface side of the carrier foil and / or on the surface side of the ultrathin copper foil, it may occur between the carrier foil and the ultrathin copper foil during hot press molding at a high temperature or for a long time. Interdiffusion can be suppressed and the stability of the peeling strength of the carrier foil can be ensured.
  • the thickness of the auxiliary metal layer is preferably 0.001 to 3 ⁇ m.
  • rust prevention treatment may be applied to the ultrathin copper foil.
  • the rust prevention treatment preferably includes a plating treatment using zinc.
  • the plating treatment using zinc may be either a zinc plating treatment or a zinc alloy plating treatment, and the zinc alloy plating treatment is particularly preferably a zinc-nickel alloy treatment.
  • the zinc-nickel alloy treatment may be a plating treatment containing at least Ni and Zn, and may further contain other elements such as Sn, Cr, and Co.
  • the Ni / Zn adhesion ratio in the zinc-nickel alloy plating is preferably 1.2 to 10, more preferably 2 to 7, and still more preferably 2.7 to 4 in terms of mass ratio.
  • the rust prevention treatment preferably further includes a chromate treatment, and this chromate treatment is more preferably performed on the surface of the plating containing zinc after the plating treatment using zinc.
  • rust prevention property can further be improved.
  • a particularly preferable antirust treatment is a combination of a zinc-nickel alloy plating treatment and a subsequent chromate treatment.
  • the surface of the ultrathin copper foil may be treated with a silane coupling agent to form a silane coupling agent layer.
  • a silane coupling agent layer can be formed by appropriately diluting and applying a silane coupling agent and drying.
  • silane coupling agents include epoxy-functional silane coupling agents such as 4-glycidylbutyltrimethoxysilane and ⁇ -glycidoxypropyltrimethoxysilane, or ⁇ -aminopropyltrimethoxysilane, N- ⁇ (amino Amino functions such as ethyl) ⁇ -aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) butoxy) propyl-3-aminopropyltrimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane Silane coupling agent, or mercapto functional silane coupling agent such as ⁇ -mercaptopropyltrimethoxysilane, or olefin functional silane coupling agent such as vinyltrimethoxysilane, vinylphenyltrimethoxysilane, or ⁇ -methacryloxypropyl Trimetoki Acrylic-functional silane coupling
  • the ultrathin copper foil with a carrier of the present invention is preferably used for the production of a copper-clad laminate for printed wiring boards. That is, according to the preferable aspect of this invention, the copper clad laminated board obtained using the ultra-thin copper foil with a carrier is provided.
  • This copper clad laminate comprises the ultrathin copper foil with a carrier of the present invention and a resin layer provided in close contact with the surface treatment layer.
  • the ultra-thin copper foil with a carrier may be provided on one side of the resin layer or may be provided on both sides.
  • the resin layer comprises a resin, preferably an insulating resin.
  • the resin layer is preferably a prepreg and / or a resin sheet.
  • the prepreg is a general term for composite materials in which a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin.
  • Preferable examples of the insulating resin include an epoxy resin, a cyanate resin, a bismaleimide triazine resin (BT resin), a polyphenylene ether resin, and a phenol resin.
  • the insulating resin that constitutes the resin sheet include insulating resins such as epoxy resins, polyimide resins, and polyester resins.
  • the filler particle etc. which consist of various inorganic particles, such as a silica and an alumina, may contain in the resin layer from a viewpoint of improving insulation.
  • the thickness of the resin layer is not particularly limited, but is preferably 1 to 1000 ⁇ m, more preferably 2 to 400 ⁇ m, and still more preferably 3 to 200 ⁇ m.
  • the resin layer may be composed of a plurality of layers.
  • a resin layer such as a prepreg and / or a resin sheet may be provided on the ultrathin copper foil with a carrier via a primer resin layer previously applied to the surface of the copper foil.
  • the ultrathin copper foil with a carrier of the present invention is preferably used for production of a printed wiring board. That is, according to the preferable aspect of this invention, the printed wiring board obtained using the ultra-thin copper foil with a carrier is provided.
  • the printed wiring board according to this aspect includes a layer configuration in which a resin layer and a copper layer are laminated in this order.
  • a copper layer is a layer originating in the ultra-thin copper foil of the ultra-thin copper foil with a carrier of this invention.
  • the resin layer is as described above for the copper-clad laminate.
  • the printed wiring board can employ a known layer configuration except that the ultrathin copper foil with a carrier of the present invention is used.
  • Specific examples of the printed wiring board include a single-sided or double-sided printed wiring board formed with a circuit on the laminated body obtained by bonding the ultrathin copper foil of the present invention to one side or both sides of the prepreg, and a multilayer in which these are multilayered.
  • a printed wiring board etc. are mentioned.
  • Other specific examples include a flexible printed wiring board, a COF, a TAB tape, and the like that form a circuit by forming the ultrathin copper foil of the present invention on a resin film.
  • examples thereof include an electronic material for glass, and an electromagnetic wave shielding film obtained by applying a conductive adhesive to the ultrathin copper foil of the present invention.
  • the ultrathin copper foil with a carrier of the present invention is suitable for the subtractive method.
  • a configuration as shown in FIGS. 1 and 2 can be employed.
  • Example 1 After the release layer and the ultrathin copper foil layer were formed in this order on the deposition surface side of the carrier foil, an ultrathin copper foil with a carrier was prepared by performing a rust prevention treatment and a silane coupling agent treatment. And various evaluation was performed about the obtained ultra-thin copper foil with a carrier.
  • the specific procedure is as follows.
  • auxiliary metal layer Formation of auxiliary metal layer
  • the carrier foil on which the organic peeling layer is formed is immersed in a solution containing nickel concentration of 20 g / L prepared using nickel sulfate, and the liquid temperature is 45 ° C., the pH is 3, and the current density is 5 A.
  • nickel having a thickness equivalent to 0.001 ⁇ m was deposited on the organic release layer.
  • a nickel layer was formed as an auxiliary metal layer on the organic release layer.
  • Roughening treatment The surface of the ultrathin copper foil thus formed was subjected to a roughening treatment.
  • This roughening treatment includes a baking plating process in which fine copper grains are deposited on an ultrathin copper foil, and a covering plating process for preventing the fine copper grains from falling off.
  • a roughening treatment was performed at an acid density of 25 A / dm 2 using an acidic copper sulfate solution containing a copper concentration of 10 g / L and a sulfuric acid concentration of 120 g / L.
  • electrodeposition was performed using an acidic copper sulfate solution containing a copper concentration of 70 g / L and a sulfuric acid concentration of 120 g / L under smooth plating conditions of a liquid temperature of 40 ° C. and a current density of 15 A / dm 2 .
  • the surface of the roughening treatment layer of the obtained ultrathin copper foil with carrier was subjected to a rust prevention treatment comprising zinc-nickel alloy plating treatment and chromate treatment.
  • the surface of the carrier foil was subjected to zinc-nickel alloy plating.
  • a chromate treatment was performed on the surface that had been subjected to the zinc-nickel alloy plating treatment using an aqueous chromic acid concentration of 3 g / L under conditions of pH 10 and a current density of 5 A / dm 2 .
  • Silane coupling agent treatment An aqueous solution with a concentration of 2 g / L of ⁇ -glycidoxypropyltrimethoxysilane is adsorbed on the surface of the ultrathin copper foil with a carrier and evaporated with an electric heater. Then, the silane coupling agent treatment was performed. At this time, the silane coupling agent treatment was not performed on the carrier foil side.
  • ⁇ Surface property parameters> Zygo New View 5032 (manufactured by Zygo) was used as the measuring instrument, and Metro Pro Ver. 8.0.2, using a low frequency filter under the condition of 11 ⁇ m, the carrier foil and the ultrathin copper foil, the average distance between the surface peaks (Peak spacing), the average distance between the valleys (Valley spacing), The ten-point average roughness Rzjis, the core level difference Rk, and / or the maximum waviness difference Wmax were measured.
  • an ultra-thin copper foil or carrier foil is fixed in close contact with the sample stage, and 6 fields of 108 ⁇ m ⁇ 144 ⁇ m are selected and measured within the 1 cm square range of the sample piece. The average value of the measured values obtained was adopted as a representative value.
  • the surface at the side of the peeling layer of ultra-thin copper foil it measured after producing the copper-clad laminated board for laser drilling workability evaluation mentioned later.
  • a copper-clad laminate was prepared using an ultrathin copper foil with a carrier, and laser drilling workability was evaluated.
  • an ultrathin copper foil of a carrier-attached ultrathin copper foil is laminated on the surface of the inner layer substrate via a prepreg (manufactured by Mitsubishi Gas Chemical Co., Inc., 830NX-A, thickness 0.2 mm).
  • the carrier foil was peeled off to produce a copper clad laminate.
  • a carbon dioxide laser was used for the copper clad laminate, and a pulse width of 12 ⁇ sec.
  • Laser drilling was performed under the conditions of a pulse energy of 8 mJ and a laser beam diameter of 97 ⁇ m.
  • the diameters in the x direction and the y direction were measured for 10 holes formed by laser drilling, and the average value thereof was calculated as the hole diameter after processing.
  • the hole diameter after processing became 70 ⁇ m or more, it was determined as A, 65 ⁇ m or more and less than 70 ⁇ m was determined as B, and less than 65 ⁇ m was determined as C.
  • Example 2 Production and evaluation of an ultrathin copper foil with a carrier were carried out in the same manner as in Example 1 except that the ultrathin copper foil was formed by the following procedure.
  • the carrier foil on which the auxiliary metal layer is formed is immersed in a bright plating solution having the following composition, electrolyzed at a solution temperature of 45 to 50 ° C. and a current density of 33 A / dm 2 , and an ultrathin copper foil having a thickness of 3 ⁇ m. Was formed on the auxiliary metal layer.
  • Example 3 An ultrathin copper foil with a carrier was produced and evaluated in the same manner as in Example 2 except that a carrier foil having a thickness of 35 ⁇ m was produced.
  • Example 4 (Comparison) An ultrathin copper foil with a carrier was produced and evaluated in the same manner as in Example 1 except that the carrier foil was produced according to the following procedure.
  • a sulfuric acid copper sulfate solution having the following composition is used as the copper electrolyte, a titanium rotating electrode having a surface roughness Ra of 0.20 ⁇ m is used as the cathode, and a DSA (dimensionally stable anode) is used as the anode. Electrolysis was performed at a solution temperature of 50 ° C. and a current density of 60 A / dm 2 to obtain an electrolytic copper foil having a thickness of 35 ⁇ m as a carrier foil.
  • Example 5 (Comparison) An ultrathin copper foil with a carrier was prepared and evaluated in the same manner as in Example 1 except that a carrier foil having a thickness of 35 ⁇ m was prepared.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne une feuille de cuivre ultra-mince ayant un support au moyen de laquelle il est possible d'obtenir à la fois une capacité d'usinage par faisceau laser et une capacité de mise en forme de circuit fine, en termes d'emploi d'un stratifié à revêtement de cuivre ou de fabrication d'une carte de circuit imprimé. Une feuille de cuivre ultra-mince ayant un support selon la présente invention comprend une feuille de support, une couche de séparation, et une feuille de cuivre ultra-mince dans cet ordre. La surface de la feuille de cuivre ultra-mince sur le côté le plus proche de la couche de séparation a une distance moyenne entre des pics de surface avant (espacement de pic) dans la plage de 2,5 à 20,0 µm, et une différence de niveau dans une partie de cœur (profondeur de rugosité de cœur) Rk dans la plage de 1,5 à 3,0 μm. Les ondulations sur la surface de la feuille de cuivre ultra-mince sur le côté opposé à la couche de séparation ont une différence de niveau d'élévation maximale Wmax de 4,0 µm ou moins.
PCT/JP2016/056014 2015-03-24 2016-02-29 Feuille de cuivre ultra-mince comportant un support, son procédé de fabrication, stratifié à revêtement de cuivre, et carte de circuit imprimé WO2016152390A1 (fr)

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KR1020177014980A KR102531073B1 (ko) 2015-03-24 2016-02-29 캐리어 부착 극박 동박, 그 제조 방법, 동장 적층판 및 프린트 배선판
CN201680017908.0A CN107428129B (zh) 2015-03-24 2016-02-29 带载体的极薄铜箔、其制造方法、覆铜层叠板和印刷电路板
MYPI2017703386A MY183238A (en) 2015-03-24 2016-02-29 Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board
JP2017507639A JP6650923B2 (ja) 2015-03-24 2016-02-29 キャリア付極薄銅箔、その製造方法、銅張積層板及びプリント配線板

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WO2023189565A1 (fr) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 Feuille métallique fixée à un élément porteur, stratifié revêtu de métal, et carte de circuit imprimé

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WO2023189565A1 (fr) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 Feuille métallique fixée à un élément porteur, stratifié revêtu de métal, et carte de circuit imprimé

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CN107428129A (zh) 2017-12-01
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CN107428129B (zh) 2019-06-18
TWI617436B (zh) 2018-03-11
KR20170131832A (ko) 2017-11-30
MY183238A (en) 2021-02-18
KR102531073B1 (ko) 2023-05-09
JPWO2016152390A1 (ja) 2018-01-11

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