WO2016101878A1 - 形成有天线槽的电子产品金属壳体及其制备方法 - Google Patents

形成有天线槽的电子产品金属壳体及其制备方法 Download PDF

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Publication number
WO2016101878A1
WO2016101878A1 PCT/CN2015/098304 CN2015098304W WO2016101878A1 WO 2016101878 A1 WO2016101878 A1 WO 2016101878A1 CN 2015098304 W CN2015098304 W CN 2015098304W WO 2016101878 A1 WO2016101878 A1 WO 2016101878A1
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WIPO (PCT)
Prior art keywords
layer
metal
electronic product
ink
metal layer
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PCT/CN2015/098304
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English (en)
French (fr)
Inventor
蒋宝荣
廖重重
李爱华
陈梁
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比亚迪股份有限公司
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Application filed by 比亚迪股份有限公司 filed Critical 比亚迪股份有限公司
Priority to EP15871946.8A priority Critical patent/EP3240378A4/en
Priority to KR1020177015796A priority patent/KR101909889B1/ko
Priority to JP2017534539A priority patent/JP6375065B2/ja
Publication of WO2016101878A1 publication Critical patent/WO2016101878A1/zh
Priority to US15/632,013 priority patent/US10506085B2/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02—Waveguide horns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Definitions

  • the present invention relates to the field of electronic product preparation, and in particular to an electronic product metal casing formed with an antenna slot and a method of fabricating the same.
  • electronic products such as metal mobile phones use the method of opening the antenna slot and molding on the back cover of the mobile phone, such as the upper and lower antenna slots of the HTC ONE, the side antenna slots of the iphone 5/5s, and the like.
  • the above-mentioned method of opening an antenna slot on an electronic product metal casing (such as a metal mobile phone back cover) and injection molding has caused certain damage to the overall structure of the metal casing of the electronic product (such as a metal mobile phone body), which affects its appearance. Cleanliness and continuity.
  • the plastic visible in the metal casing of the electronic product (such as the back cover of the mobile phone) also destroys the overall metallic texture of the body.
  • the object of the present invention is to overcome the prior art method of opening an antenna slot on an electronic product metal casing and injecting the same, which affects the appearance and continuity of the appearance of the metal shell of the electronic product, and destroys the metal texture of the metal shell of the electronic product.
  • the invention provides a metal casing for forming an electronic product with an antenna slot and a preparation method thereof, and the antenna groove formed in the metal casing of the electronic product of the invention is invisible, thereby ensuring the appearance of the metal casing of the electronic product and Continuity and the metal texture of the metal casing of the electronic product is not destroyed.
  • the present invention provides an electronic product metal casing formed with an antenna slot, the electronic product metal casing comprising: a metal layer; and a first hard formed on an upper surface of the metal layer
  • the anodized layer forms a second hard anodized layer on the lower surface of the metal layer, an antenna groove penetrating the metal layer and the first hard anodized layer, and a non-conductive material filled in the antenna groove.
  • the present invention provides a method of fabricating an electronic product metal casing formed with an antenna slot, the method comprising the steps of:
  • the present invention provides an electronic product metal casing prepared by the above method.
  • the appearance of the antenna groove formed in the metal casing of the electronic product of the invention is not visible, and the surface layer of the appearance of the metal shell of the electronic product has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the metal shell of the electronic product can be maintained. And the metal texture of the metal shell of the electronic product is not destroyed.
  • FIG. 1 is a cross-sectional structural view showing an aluminum alloy casing after a laser engraving (depth laser engraving) in a first embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing the aluminum alloy casing after etching in the first embodiment of the present invention.
  • Fig. 3 is a cross-sectional structural view showing the aluminum alloy casing after removing the ink layer in the first embodiment of the present invention.
  • Fig. 4 is a picture of the aluminum alloy sheet in the first embodiment of the present invention after hard anodizing (left) and after ink spraying (right).
  • Fig. 5 is a picture of the aluminum alloy casing in the first embodiment of the present invention after laser engraving.
  • Fig. 6 is a front elevational view showing the aluminum alloy casing in the first embodiment of the present invention after being filled.
  • Fig. 7 is a structural schematic view showing the aluminum alloy casing after the laser engraving (normal laser engraving) in the fifth embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a metal case of an electronic product according to an embodiment of the present invention.
  • FIG. 9 is a flow chart showing a method of preparing a metal casing of an electronic product according to an embodiment of the present invention.
  • the present invention provides an electronic product metal case formed with an antenna slot.
  • the electronic product metal case includes: a metal layer 1; and a first hard anode formed on an upper surface of the metal layer The oxide layer 21, the second hard anodized layer 22 formed on the lower surface of the metal layer, the antenna groove 5 penetrating the metal layer 1 and the first hard anodized layer 21, and the non-conductive material filled in the antenna groove (Fig. Not shown).
  • the electronic product metal casing includes: a metal layer 1 and a hard anodized layer (21, 22), and a hard anodized layer (21, 22) is wrapped around the surface of the metal layer 1,
  • the antenna groove 5 penetrates the back surface hard anodized layer 21 and the metal layer 1 of the metal shell of the electronic product in the thickness direction, and exposes the inner side of the front hard anodized layer 22, and the antenna groove 5 is filled with a non-conductive material.
  • the upper opening width L1 of the antenna groove 5 is larger than the lower opening width L2.
  • the upper opening width L1 is 3-15 mm, and in a preferred embodiment of the invention, the upper opening width L1 is 3-6 mm.
  • the lower opening width L2 is 1-3 mm, and in some embodiments of the invention, the lower opening width L2 is 1-1.6 mm.
  • the opening of the antenna slot corresponding to the back surface of the metal shell of the electronic product is an upper opening
  • the cross-sectional structure of the antenna slot is a trapezoidal structure having a small opening at the upper opening and a small opening at the lower portion.
  • the width L1 of the upper opening is 3-15 mm, in some embodiments of the invention, the width L1 of the upper opening is 3-6 mm; the width L2 of the lower opening is 1-3 mm, in some embodiments of the invention, the lower part The width L2 of the opening is 1-1.6 mm.
  • the metal layer 1 has a thickness of 0.5 to 1.5 mm; the first hard anodized layer 21 and the second hard anodized layer 22 each have a thickness of 0.02 to 0.06 mm.
  • the thickness of the metal layer 1 is 0.5-1.5 mm, and in other embodiments of the present invention, the thickness of the metal layer 1 is 0.5-0.8 mm;
  • the thickness of the anodized layer (21, 22) is 0.02-0.06 mm, and in other embodiments of the invention, the thickness of the hard anodized layer (21, 22) is 0.04-0.06 mm.
  • the metal layer is an aluminum alloy layer.
  • the metal housing of the electronic product is a metal casing of a mobile phone or a metal casing of a tablet.
  • the present invention provides a method of fabricating an electronic product metal casing formed with an antenna slot. Referring to FIG. 9, the method includes the following steps:
  • the metal layer 1 is sequentially subjected to hard anodization treatment and ink spray treatment to form the first hard anodized layer 21, the second hard anodized layer 22, the first ink layer 31, and the second ink layer, respectively.
  • a first hard anodized layer 21 is formed on an upper surface of the metal layer 1
  • a second hard anodized layer 22 is formed on a lower surface of the metal layer 1
  • a first ink layer 31 is formed on the first hard anode
  • the upper surface of the oxide layer 21, the second ink layer 32 is formed on the lower surface of the second hard anodized layer 22;
  • the method of preparing the electronic product metal casing formed with the antenna slot may include the following steps:
  • the metal layer is sequentially subjected to hard anodizing treatment and ink spraying treatment to form hard anodic oxygen Layer (21, 22) and ink layer (31, 32);
  • the method of the hard anodizing treatment is not particularly limited, and various hard anodizing treatment methods commonly used in the art can be used.
  • the method of hard anodizing comprises sequentially performing an alkali etching treatment, a light-emitting treatment, an oxidation treatment, and a sealing treatment on the metal layer, and After the treatment, water washing was performed separately.
  • the method of washing with water is not particularly limited, and various washing methods commonly used in the art can be used, for example, it can be washed 2-3 times with deionized water.
  • the conditions of the alkali etching treatment are not particularly limited, and various alkali etching treatment conditions commonly used in the art may be employed.
  • the conditions of the alkali etching treatment include: a temperature of 50-70 ° C, a time of 1-2 min, an alkali etching solution concentration of 30-60 g / L, the alkali etching solution is a sodium hydroxide solution, One or more of a potassium hydroxide solution and a lithium hydroxide solution.
  • the conditions of the light-emitting treatment are not particularly limited, and various light-emitting treatment conditions commonly used in the art may be employed.
  • the conditions of the light-emitting treatment include: the temperature is 20-30 ° C, the time is 1-3 min, the light-emitting liquid is an aqueous solution of nitric acid, and the content of nitric acid is 130-270 g in terms of 1 L of the light-emitting liquid (ie, The amount of concentrated nitric acid equivalent to 65-68% by weight is 200-400 mL), that is, the content of nitric acid is 130-270 g per 1 L of the light-emitting liquid.
  • the conditions of the oxidation treatment are not particularly limited, and may be various oxidation treatment conditions commonly used in the art.
  • the conditions of the oxidation treatment include: a temperature of 5-12 ° C, a time of 30-50 min, a pulse wave pattern of a positive square wave pulse, a duty cycle of 50-90%, and a frequency of 500.
  • oxidizing solution is an aqueous solution containing sulfuric acid, oxalic acid / malic acid, based on 1L oxidizing solution, sulfuric acid content is 120-220g, oxalic acid or malic acid content is 8-20g That is, the oxidizing solution is an aqueous solution containing sulfuric acid and one selected from the group consisting of oxalic acid and malic acid, and the content of sulfuric acid is 120-220 g per 1 L of the oxidizing solution, and the content of oxalic acid or malic acid is 8-20 g.
  • the oxidizing solution is an aqueous solution containing sulfuric acid or oxalic acid/malic acid, which means that the oxidizing solution is an aqueous solution containing sulfuric acid and oxalic acid, or the oxidizing solution is an aqueous solution containing sulfuric acid and malic acid.
  • the conditions of the plugging treatment are not particularly limited, and may be various sealing treatment conditions commonly used in the art.
  • the conditions for the plugging treatment include a temperature of 20-30 ° C and a time of 2-3 min.
  • the sealer is one or more of a nickel-free sealer, a trace nickel sealer, and a heavy metal-free sealer. It should be understood by those skilled in the art that the water is washed after the sealing treatment, and washed in water. Thereafter, the hard anodized layer is formed by blow drying, that is, the first hard anodized layer 21 and the second hard anodized layer 22 are formed by drying after washing with water.
  • the manner of drying is not particularly limited and may be variously used in the art, for example, it may be blown off with an oil-free compressed gas at a temperature of 20 to 30 ° C for 5 to 10 minutes, which is a person skilled in the art. It is well known that it will not be described here.
  • the conditions of the ink coating treatment are not particularly limited, and may be conditions for various ink spray treatments commonly used in the art.
  • the ink spraying process further comprises: spraying a UV ink layer on the surfaces of the first hard anodized layer 21 and the second hard anodized layer 22, respectively, and then The product obtained by spraying the UV ink is baked at 110-120 ° C for 20-30 min and exposed to ultraviolet light for 1-2 min, wherein the thickness of the first ink layer 31 or the second ink layer 32 formed is 40-60 ⁇ m.
  • the ink spraying treatment comprises: spraying the UV ink to form an ink layer (31, 32) having a thickness of 40-60 um, then baking at 110-120 ° C for 20-30 min, and ultraviolet ray. The next exposure is 1-2 min.
  • the front side (ie, the lower surface) of the metal shell of the electronic product refers to the side of the metal shell of the electronic product exposed in the air when assembled into the finished electronic product, the back side. (ie the upper surface) is the opposite side to the front.
  • step (2) forming the antenna slot further comprises: (2-1) forming an antenna slot slit 4 extending from the first ink layer 31 toward the metal layer 1 And at least penetrating the first ink layer 31 and the first hard anodized layer 21; (2-2) removing a portion of the metal layer 1 in the direction in which the slit 4 extends to form the antenna groove 5 penetrating the metal layer 1 .
  • the process of forming the antenna groove 5 includes: forming the antenna groove slit 4 on the back surface of the product obtained by the step (A), so that at least the back ink layer 31 and the back hard anodized layer are removed. 21, then the metal layer 1 at the corresponding portion of the slit 4 is removed to expose the inner side of the front hard anodized layer 22.
  • the antenna slot slits 4 extend through the first ink layer 31 and the first hard anodized layer 21 and into the metal layer 1. In other embodiments of the present invention, the thickness of the antenna slot slit 4 entering the metal layer 1 does not exceed 40% of the total thickness of the metal layer 1. In some embodiments of the present invention, the antenna slot slit 4 enters the metal layer. The thickness of 1 accounts for 20-30% of the total thickness of the metal layer 1. In the step (2-1), the antenna slot slit 4 is formed by laser engraving.
  • the antenna groove slit 4 is formed by laser engraving on the back surface of the product obtained by the step (A), so that the back ink layer 31, the back hard anodized layer 21 and a part of the metal layer 1 are removed.
  • the thickness of the removed portion of the metal layer 1 is 0-40% of the total thickness of the metal layer 1, and further preferably 20-30%.
  • the thickness of the removed part of the metal layer 1 is 0-10% of the total thickness of the metal layer 1, it is a normal laser engraving; when the removed part of the metal When the thickness of the layer 1 is 10-40% of the total thickness of the metal layer 1, it is a deep laser engraving (in the present invention, it should be noted that when the thickness of the removed part of the metal layer is 10% of the total thickness of the metal layer, Normal laser engraving).
  • the method for laser engraving is not particularly limited, and various laser engraving methods commonly used in the art may be used, for example, laser engraving may be performed by a laser engraving machine.
  • the formed antenna slot slit 4 has a width L3 of 0.05-0.1 mm.
  • a portion of the metal layer 1 is removed by etching. That is, in the step (B), the metal layer 1 at the portion corresponding to the slit 4 is removed by etching.
  • the conditions for etching are not particularly limited and may be various etching conditions commonly used in the art.
  • the etchant is an acidic etchant.
  • the acidic etching liquid is not particularly limited, and may be various acidic etching liquids commonly used in the art, and may be, for example, a ferric chloride-based acidic etching liquid, a copper chloride-based acidic etching liquid, or a hydrochloric acid-based acidic etching liquid.
  • the etching uses an aqueous solution containing ferric chloride and hydrochloric acid as an etching solution, and the content of ferric chloride in each of the etching liquids is 800- 1000 g, the content of hydrochloric acid is 35-75 g, and the etching is carried out at 20-30 ° C for 30-40 min.
  • the etching conditions include: the temperature is 20-30 ° C, the time is 30-40 min, the etching solution is an aqueous solution containing ferric chloride and hydrochloric acid, and the trichlorination is measured by 1 L of etching liquid.
  • the content of iron is 800-1000 g, and the content of hydrochloric acid is 35-75 g.
  • the etching time should be related to the thickness of a part of the metal layer removed during laser engraving. The greater the thickness of part of the metal layer removed during laser engraving, the shorter the etching time should be. The smaller the thickness of part of the metal layer removed during the engraving, the longer the etching time should be.
  • the opening of the antenna slot corresponding to the back surface of the metal shell of the electronic product is an upper opening
  • the cross-sectional structure of the antenna slot is a trapezoidal structure having a small upper opening and a small lower opening.
  • the metal layer 1 may contain other metal impurities such as copper, manganese, and the like. Therefore, the method of the present invention may further comprise, in the step (2-2) or the step (B), performing water washing after etching, stripping the black film after washing with water, removing the bare black impurity layer, and performing water washing again.
  • the method of washing with water is not particularly limited, and various washing methods commonly used in the art can be used, for example, it can be washed 2-3 times with deionized water.
  • the manner of removing the ink layer (31, 32) is not particularly limited, and various stripping methods commonly used in the art may be employed as long as the ink layer (31, 32) can be removed.
  • the ink layer (31, 32) is removed by removing the ink layer with a neutral paint stripper.
  • the neutral paint remover is not particularly limited, and may be various neutral paint removers commonly used in the art, for example, one of a common solvent type paint remover, a chlorinated hydrocarbon paint remover, and an aqueous paint remover. Kind or more.
  • the method of the present invention also includes water washing and drying after removing the ink layer (31, 32), before performing the filling process.
  • the drying method is not particularly limited and may be a drying method commonly used in the art.
  • the drying conditions include a temperature of 80-120 ° C and a time of 5-10 min.
  • the method of filling the non-conductive material and the non-conductive material are not particularly limited, and various non-conductive material filling methods and non-conductive materials which are commonly used in the art may be used.
  • the non-conductive material is one or more of a UV glue, a heat curing glue, and a room temperature hardening glue.
  • the metal layer 1 is an aluminum alloy layer.
  • the metal housing of the electronic product is a metal casing of a mobile phone or a metal casing of a tablet.
  • the present invention provides an electronic product metal casing prepared by the above method.
  • the features and advantages of the metal housing of the electronic product are consistent with the metal housing and method of the electronic product described above, and will not be further described herein.
  • a 0.5 mm thick 5 series aluminum material was purchased from Fujian Nanping Aluminum Co., Ltd.
  • Nickel-free sealing agent trace nickel sealing agent and heavy metal-free sealing agent were purchased from Shenzhen Oudemei Technology Co., Ltd.
  • the chlorinated hydrocarbon solvent stripper was purchased from Dongguan Sihui Surface Treatment Technology Co., Ltd.
  • the UV glue was purchased from Aesek Corporation (ASEC), model AS-210604C.
  • the laser engraving machine was purchased from Shenzhen Guangda Laser Technology Co., Ltd., model FM20D.
  • This embodiment is for explaining the aluminum alloy casing of the mobile phone formed with the antenna slot of the present invention and a preparation method thereof.
  • Alkali etching treatment 5 series aluminum material with aluminum alloy layer 1 thickness of 0.5 mm is cut into aluminum alloy sheets of 5 cm*3.5 cm, and aluminum alloy sheets are made of sodium hydroxide at a concentration of 40 g/L at 60 °C. Alkaline etching in solution for 1.5 min, then washing twice with deionized water;
  • the aluminum alloy sheet obtained in the step (1) was light-exposed at 25 ° C in a light-emitting liquid (300 ml of 65% by weight of concentrated nitric acid), and then deionized water was used. Wash 2 times;
  • Oxidation treatment The aluminum alloy sheet obtained in the step (2) is placed in an oxidation tank, wherein, at 10 ° C, a forward square wave pulse is used, the duty ratio is 80%, the frequency is 800 Hz, and the current density is 5 A. /dm 2 , the aluminum alloy sheet in the oxidation tank is hard oxidized for 40 min (in terms of 1 L oxidizing solution, the amount of 98% by weight of sulfuric acid is 200 g, the amount of oxalic acid is 15 g, the balance is water), and then deionized Water washing 2 times;
  • step (4) ink spraying treatment: the surface of the aluminum alloy sheet obtained in step (4) is sprayed with UV ink to form an ink layer 3 having a thickness of 50 ⁇ m, then baked at 115 ° C for 25 min, and exposed to ultraviolet light for 1.5 min;
  • the antenna groove slit 4 of the depth laser having a width of 0.07 mm is engraved by a laser engraving machine to remove the ink layer on the back surface, the hard anodized layer and the anode layer.
  • FIG. 1 a schematic cross-sectional structure of the aluminum alloy casing after laser engraving is shown in FIG. 1
  • a schematic cross-sectional structure of the aluminum alloy casing after etching is shown in FIG. 2
  • a schematic cross-sectional structure of the aluminum alloy casing after removing the ink layer is shown in FIG. 2 .
  • FIG. 3 the picture of the aluminum alloy sheet after hard anodizing (left) and after the ink spraying treatment (right) is shown in Fig. 4.
  • the picture of the aluminum alloy shell after laser engraving is shown in Fig. 5.
  • the front view of the aluminum alloy casing after filling is shown in Fig. 6.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • This embodiment is for explaining the aluminum alloy casing of the mobile phone formed with the antenna slot of the present invention and a preparation method thereof.
  • Alkali etching treatment 5 series aluminum material with aluminum alloy layer 1 thickness of 0.5 mm is cut into aluminum alloy sheets of 5 cm*3.5 cm, and aluminum alloy sheets are made of potassium hydroxide at a concentration of 30 g/L at 50 °C. Alkaline etching in solution for 2min, then washed twice with deionized water;
  • the aluminum alloy sheet obtained in the step (1) was light-exposed in a light-emitting liquid (400 ml of concentrated nitric acid in an amount of 400 ml) at 20 ° C for 1 min, and then deionized water was used. Wash 2 times;
  • Oxidation treatment The aluminum alloy piece obtained in the step (2) is placed in an oxidation tank, wherein a forward square wave pulse is used at 5 ° C, the duty ratio is 50%, the frequency is 500 Hz, and the current density is 2 A. /dm 2 , the aluminum alloy sheet in the oxidation tank is hard oxidized for 50 min (in terms of 1 L oxidizing solution, the amount of 98% by weight of sulfuric acid is 220 g, the amount of oxalic acid is 20 g, the balance is water), and then deionized Water washing 2 times;
  • step (4) ink spraying treatment: the surface of the aluminum alloy sheet obtained in step (4) is sprayed with UV ink to form an ink layer 3 having a thickness of 40 ⁇ m, then baked at 110 ° C for 30 min, and exposed to ultraviolet light for 1 min;
  • the antenna groove slit 4 of the depth laser having a width of 0.05 mm is engraved by a laser engraving machine to remove the ink layer on the back surface, the hard anodized layer and the An aluminum alloy layer having a total thickness of the aluminum alloy layer of 20%;
  • the etching solution (the amount of ferric chloride hexahydrate is 1000 g, the amount of 37% by weight of hydrochloric acid is 200 ml, and the balance is water) is used to etch the aluminum of the corresponding portion of the slit.
  • the alloy layer was observed for 30 min. It was observed that the hard anodized layer on the front side was completely exposed, and then washed twice with deionized water, and the bare black impurity layer was peeled off, and then washed twice with deionized water to obtain a cross-sectional structure of the upper opening.
  • An antenna slot 5 having a small lower opening and a small trapezoidal structure, the upper opening has a width of 5 mm, and the lower opening has a width of 1.3 mm;
  • a schematic cross-sectional structure of the aluminum alloy shell after laser engraving a schematic cross-sectional structure of the aluminum alloy shell after etching, a schematic cross-sectional structure of the aluminum alloy shell after removing the ink layer, and a hard anodizing treatment of the aluminum alloy sheet
  • the rear (left) and the pictures after the ink spraying process (right), the laser-engraved picture of the aluminum alloy case, and the front view of the aluminum alloy case after filling are all consistent with Example 1.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • This embodiment is for explaining the aluminum alloy casing of the tablet computer formed with the antenna groove of the present invention and a preparation method thereof.
  • Alkali etching treatment 5 series aluminum material with aluminum alloy layer 1 thickness of 0.5 mm is cut into aluminum alloy of 5 cm*3.5 cm The sheet was alkali-etched in a potassium hydroxide solution having a concentration of 60 g/L at 70 ° C for 1 min, and then washed twice with deionized water;
  • Oxidation treatment The aluminum alloy sheet obtained in the step (2) is placed in an oxidation tank, wherein a forward square wave pulse is used at 12 ° C, the duty ratio is 90%, the frequency is 1000 Hz, and the current density is 7 A. /dm 2 , the aluminum alloy sheet in the oxidation tank is hard oxidized for 30 min (in terms of 1 L oxidizing solution, the amount of 98% by weight of sulfuric acid is 120 g, the amount of oxalic acid is 8 g, the balance is water), and then deionized Water washing 2 times;
  • step (4) ink spraying treatment: the surface of the aluminum alloy sheet obtained in step (4) is sprayed with UV ink to form an ink layer 3 having a thickness of 60 ⁇ m, then baked at 120 ° C for 20 min, and exposed to ultraviolet light for 2 min;
  • the antenna groove slit 4 of the depth laser having a width of 0.1 mm is engraved by a laser engraving machine to remove the ink layer on the back surface, the hard anodized layer and the anode layer.
  • the etching solution (the amount of ferric chloride hexahydrate is 800 g, the amount of 37% by weight of hydrochloric acid is 100 ml, and the balance is water) is used to etch the aluminum of the corresponding portion of the slit.
  • the alloy layer was observed for 40 min. It was observed that the hard anodized layer on the front side was completely exposed, and then washed twice with deionized water, and the bare black oxide film was peeled off, and then washed twice with deionized water to obtain a cross-sectional structure of the upper opening.
  • An antenna slot 5 having a small trapezoidal structure with a small lower opening, a width of the upper opening of 4 mm, and a width of the lower opening of 1.2 mm;
  • a schematic cross-sectional structure of the aluminum alloy shell after laser engraving a schematic cross-sectional structure of the aluminum alloy shell after etching, a schematic cross-sectional structure of the aluminum alloy shell after removing the ink layer, and a hard anodizing treatment of the aluminum alloy sheet
  • the rear (left) and the pictures after the ink spraying process (right), the laser-engraved picture of the aluminum alloy case, and the front view of the aluminum alloy case after filling are all consistent with Example 1.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • the ink layer on the back side, the hard anodized layer, and the aluminum alloy layer which accounts for 15% of the total thickness of the aluminum alloy layer are removed.
  • a schematic cross-sectional structure of the aluminum alloy shell after laser engraving a schematic cross-sectional structure of the aluminum alloy shell after etching, a schematic cross-sectional structure of the aluminum alloy shell after removing the ink layer, and a hard anodizing treatment of the aluminum alloy sheet
  • the picture after the (left) and after the ink spraying process (right), the picture of the aluminum alloy case after laser engraving, and the front view of the aluminum alloy case are all consistent with the embodiment 1, wherein the formed
  • the upper opening of the antenna slot has a width of 6 mm and the lower opening has a width of 1.5 mm.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • the ink layer on the back side, the hard anodized layer, and the aluminum alloy layer which accounts for 5% of the total thickness of the aluminum alloy layer are removed.
  • FIG. 7 a schematic cross-sectional structure of the aluminum alloy shell after laser engraving is shown in FIG. 7 , and a schematic cross-sectional structure of the aluminum alloy shell after etching, a cross-sectional structure diagram of the aluminum alloy shell after removing the ink layer, and an aluminum alloy sheet.
  • the picture after hard anodizing (left) and after ink spraying (right), the picture of the aluminum alloy case after laser engraving, and the front view of the aluminum alloy case are all in the same way as in the first embodiment.
  • the antenna groove slit is engraved, and the ink layer on the back side, the hard anodized layer and the aluminum alloy layer occupying 5% of the total thickness of the aluminum alloy layer are formed normally.
  • the antenna slot slit 6 of the laser engraving is formed such that the upper opening of the antenna slot has a width of 12 mm and the lower opening has a width of 2.5 mm.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • Example 1 it can be seen that when the thickness of the removed portion of the aluminum alloy layer is 20-30% of the total thickness of the aluminum alloy layer, the upper opening of the antenna groove formed by etching can be significantly reduced. And the width of the lower opening, thereby significantly improving the firmness and hardness of the aluminum alloy casing.
  • the aluminum alloy shells prepared in Examples 1-5 were subjected to signal shielding test by: conducting a conductive position in each part of the laser separated by an antenna slot that is not visible in appearance, and measuring two conductive positions. Conductivity between.
  • the measurement results corresponding to Examples 1-5 are all non-conductive. Therefore, it is understood that the method of the present invention maintains the appearance and continuity of the appearance of the metal casing of the electronic product, so that the metal texture of the entire metal casing of the electronic product is not damaged. At the same time, the signal shielding problem of the metal shell body of the electronic product is well solved.

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Abstract

提供了形成有天线槽的电子产品金属壳体及其制备方法，所述电子产品金属壳体包括金属层；形成在金属层上表面的第一硬质阳极氧化层，形成在金属层下表面的第二硬质阳极氧化层，贯穿金属层和第一硬质阳极氧化层的天线槽，以及填充在天线槽中的非导电材料。

Description

形成有天线槽的电子产品金属壳体及其制备方法 技术领域
本发明涉及电子产品制备领域，具体地，涉及形成有天线槽的电子产品金属壳体及其制备方法。
背景技术
目前，为解决机身信号屏蔽问题，电子产品如金属手机多采用在手机后盖上开天线槽并注塑的方法，如HTC ONE的上下两条天线槽，iphone5/5s的侧边天线槽等。但是，前述通过在电子产品金属壳体(如金属手机后盖)上开天线槽并注塑的方法对电子产品金属壳体(如金属手机机身)整体结构造成了一定破坏，影响了其外观的整洁性及连续性。同时，电子产品金属壳体(如手机后盖)可见的塑胶也破坏了机身整体的金属质感。
发明内容
本发明的目的是为了克服现有技术的在电子产品金属壳体上开天线槽并注塑的方法影响电子产品金属壳体外观的整洁性及连续性，并破坏电子产品金属壳体整体的金属质感的缺陷，提供一种形成有天线槽的电子产品金属壳体及其制备方法，本发明的电子产品金属壳体中形成的天线槽外观不可见，保证了电子产品金属壳体外观的整洁性及连续性，并使得电子产品金属壳体整体的金属质感不被破坏。
因此，为了实现上述目的，第一方面，本发明提供了一种形成有天线槽的电子产品金属壳体，所述电子产品金属壳体包括：金属层；形成在金属层上表面的第一硬质阳极氧化层，形成在金属层下表面的第二硬质阳极氧化层，贯穿金属层和第一硬质阳极氧化层的天线槽，以及填充在天线槽中的非导电材料。
第二方面，本发明提供了一种形成有天线槽的电子产品金属壳体的制备方法，所述方法包括以下步骤：
(1)将金属层依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成第一硬质阳极氧化层、第二硬质阳极氧化层、第一油墨层和第二油墨层，其中，第一硬质阳极氧化层形成在金属层的上表面，第二硬质阳极氧化层形成在金属层的下表面，第一油墨层形成在第一硬质阳极氧化层的上表面，第二油墨层形成在第二硬质阳极氧化层的下表面；
(2)在经步骤(1)处理所得产品的上表面形成天线槽，使得在厚度方向上天线槽贯穿第一油墨层、第一硬质阳极氧化层和金属层；
(3)去除第一油墨层和第二油墨层，并在天线槽中填充所述非导电材料。
第三方面，本发明提供了上述方法制备得到的电子产品金属壳体。
本发明的电子产品金属壳体中形成的天线槽外观不可见，电子产品金属壳体的外观面表层未曾遭到破坏，外观面整洁光滑，能够保持电子产品金属壳体外观的整洁性及连续性，并使得电子产品金属壳体整体的金属质感不被破坏。
本发明的其它特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
图1是本发明实施例1中镭雕(深度镭雕)后铝合金壳体的剖面结构示意图。
图2是本发明实施例1中蚀刻后铝合金壳体的剖面结构示意图。
图3是本发明实施例1中去除油墨层后铝合金壳体的剖面结构示意图。
图4是本发明实施例1中铝合金片硬质阳极氧化处理后(左图)以及油墨喷涂处理后(右图)的图片。
图5是本发明实施例1中铝合金壳体镭雕后的图片。
图6是本发明实施例1中铝合金壳体填胶后的正面图。
图7是本发明实施例5中镭雕(正常镭雕)后铝合金壳体的结构示意图。
图8是根据本发明实施例的电子产品金属壳体的结构示意图。
图9是根据本发明实施例的制备电子产品金属壳体的方法的流程示意图。
附图标记说明
1金属层 2硬质阳极氧化层 21第一硬质阳极氧化层 22第二硬质阳极氧化层 3油墨层 31第一油墨层 32第二油墨层 4深度镭雕的天线槽狭缝 5天线槽 6正常镭雕的天线槽狭缝
具体实施方式
以下对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
第一方面，本发明提供了一种形成有天线槽的电子产品金属壳体，参照图8，所述电子产品金属壳体包括：金属层1；形成在金属层上表面的第一硬质阳极氧化层21，形成在金属层下表面的第二硬质阳极氧化层22，贯穿金属层1和第一硬质阳极氧化层21的天线槽5，以及填充在天线槽中的非导电材料(图中未示出)。
换句话说，根据本发明实施例的电子产品金属壳体包括：金属层1和硬质阳极氧化层(21，22)，硬质阳极氧化层(21，22)包裹在金属层1的表面，在厚度方向上天线槽5贯穿电子产品金属壳体的背面硬质阳极氧化层21和金属层1，并使得正面硬质阳极氧化层22的内侧暴露，且天线槽5中填充有非导电材料。
根据本发明的实施例，天线槽5的上部开口宽度L1大于下部开口宽度L2。在本发明的一些实施例中，上部开口宽度L1为3-15mm，在本发明的优选实施例中，上部开口宽度L1为3-6mm。在本发明的一些实施例中，下部开口宽度L2为1-3mm，在本发明的一些实施例中，下部开口宽度L2为1-1.6mm。或者说，本发明的电子产品金属壳体中，以所述电子产品金属壳体的背面所对应的天线槽的开口为上部开口，天线槽的剖面结构为上部开口大下部开口小的梯形结构，且上部开口的宽度L1为3-15mm，在本发明的一些实施例中，上部开口的宽度L1为3-6mm；下部开口的宽度L2为1-3mm，在本发明的一些实施例中，下部开口的宽度L2为1-1.6mm。
根据本发明的实施例，金属层1的厚度为0.5-1.5mm；第一硬质阳极氧化层21和第二硬质阳极氧化层22的厚度均为0.02-0.06mm。或者换句话说，本发明的电子产品金属壳体中，金属层1的厚度为0.5-1.5mm，在本发明的另一些实施例中，金属层1的厚度为0.5-0.8mm；所述硬质阳极氧化层(21，22)的厚度为0.02-0.06mm，在本发明的另一些实施例中，硬质阳极氧化层(21，22)的厚度为0.04-0.06mm。
根据本发明的实施例，金属层为铝合金层。
根据本发明的实施例，电子产品金属壳体为手机金属外壳或平板电脑金属外壳。
第二方面，本发明提供了一种形成有天线槽的电子产品金属壳体的制备方法，参照图9，所述方法包括以下步骤：
(1)将金属层1依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成第一硬质阳极氧化层21、第二硬质阳极氧化层22、第一油墨层31和第二油墨层32，其中，第一硬质阳极氧化层21形成在金属层1的上表面，第二硬质阳极氧化层22形成在金属层1的下表面，第一油墨层31形成在第一硬质阳极氧化层21的上表面，第二油墨层32形成在第二硬质阳极氧化层22的下表面；
(2)在经步骤(1)处理所得产品的上表面形成天线槽5，使得在厚度方向上天线槽5贯穿第一油墨层31、第一硬质阳极氧化层21和金属层1；
(3)去除第一油墨层31和第二油墨层32，并在天线槽5中填充非导电材料。
换句话说，形成有天线槽的电子产品金属壳体的制备方法可以包括以下步骤：
(A)将金属层依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成硬质阳极氧 化层(21，22)和油墨层(31，32)；
(B)在经步骤(1)处理所得产品的背面形成天线槽5，使得在厚度方向上所述天线槽贯5穿所述产品的背面油墨层231、背面硬质阳极氧化层21和金属层1，并使得正面硬质阳极氧化层22的内侧暴露；
(C)去除油墨层(31，32)，并在天线槽5中填充非导电材料。
本发明的方法中，对于硬质阳极氧化处理的方法没有特别的限定，可以为本领域常用的各种硬质阳极氧化处理方法。在本发明的一些实施例中，步骤(1)或步骤(A)中，硬质阳极氧化处理的方法包括依次对金属层进行碱蚀处理、出光处理、氧化处理和封孔处理，并在每种处理后分别进行水洗。对于水洗的方法没有特别的限定，可以为本领域常用的各种水洗方法，例如可以为用去离子水清洗2-3次。
根据本发明的实施例，对于碱蚀处理的条件没有特别的限定，可以为本领域常用的各种碱蚀处理条件。在本发明的一些实施例中，碱蚀处理的条件包括：温度为50-70℃，时间为1-2min，碱蚀液的浓度为30-60g/L，碱蚀液为氢氧化钠溶液、氢氧化钾溶液和氢氧化锂溶液中的一种或多种。
根据本发明的实施例，对于出光处理的条件没有特别的限定，可以为本领域常用的各种出光处理的条件。在本发明的一些实施例中，出光处理的条件包括：温度为20-30℃，时间为1-3min，出光液为硝酸水溶液，且以1L出光液计，硝酸的含量为130-270g(即相当于65-68重量％的浓硝酸的量为200-400mL)，即每1L出光液中，硝酸的含量为130-270g。
根据本发明的实施例，对于氧化处理的条件没有特别的限定，可以为本领域常用的各种氧化处理的条件。在本发明的一些实施例中，氧化处理的条件包括：温度为5-12℃，时间为30-50min，脉冲波型为正向方波脉冲，占空比为50-90％，频率为500-1000Hz，电流密度为2-7A/dm2，氧化液为含有硫酸、草酸/苹果酸的水溶液，以1L氧化液计，硫酸的含量为120-220g，草酸或苹果酸的含量为8-20g，即，氧化液为含有硫酸和选自草酸和苹果酸之一的水溶液，且每1L氧化液中，硫酸的含量为120-220g，草酸或苹果酸的含量为8-20g。其中，氧化液为含有硫酸、草酸/苹果酸的水溶液是指氧化液为含有硫酸和草酸的水溶液或者氧化液为含有硫酸和苹果酸的水溶液。
根据本发明的实施例，对于封孔处理的条件没有特别的限定，可以为本领域常用的各种封孔处理的条件。在本发明的一些实施例中，封孔处理的条件包括：温度为20-30℃，时间为2-3min。在本发明的一些实施例中，封孔剂为无镍封孔剂、微量镍封孔剂和无重金属封孔剂中的一种或多种。本领域技术人员应该理解的是，封孔处理后进行水洗，在水洗 后进行吹干即可形成硬质阳极氧化层，即在水洗后进行吹干即可形成第一硬质阳极氧化层21和第二硬质阳极氧化层22。对于吹干的方式没有特别的限定，可以为本领域常用的各种方式，例如可以用无油压缩气体吹干，温度为20-30℃，时间为5-10min，此为本领域技术人员所公知，在此不再赘述。
根据本发明的实施例，对于油墨喷涂处理的条件没有特别的限定，可以为本领域常用的各种油墨喷涂处理的条件。在本发明的一些实施例中，步骤(1)中，油墨喷涂处理进一步包括：分别在第一硬质阳极氧化层21和第二硬质阳极氧化层22的表面喷涂UV油墨层，然后将经喷涂UV油墨所得产品在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min，其中，形成的第一油墨层31或第二油墨层32的厚度为40-60μm。或者说，步骤(A)中，油墨喷涂处理的方式包括：喷涂UV油墨形成厚度为40-60um的油墨层(31，32)，然后在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min。
根据本发明的实施例，本领域技术人员应该理解的是，电子产品金属壳体的正面(即下表面)是指组装为成品电子产品时露在空气中的电子产品金属壳体的一面，背面(即上表面)则是与正面相对的一面。
在本发明的一些实施例中，步骤(2)中，形成天线槽进一步包括：(2-1)形成天线槽狭缝4，该天线槽狭缝4自第一油墨层31向金属层1延伸，并且至少贯穿第一油墨层31和第一硬质阳极氧化层21；(2-2)沿着狭缝4延伸的方向，去除金属层1的一部分，以便形成贯穿金属层1的天线槽5。换句话说，步骤(B)中，形成天线槽5的过程包括：在经步骤(A)处理所得产品的背面形成天线槽狭缝4，使得至少去除背面油墨层31和背面硬质阳极氧化层21，然后去除狭缝4对应部位的金属层1至露出正面硬质阳极氧化层22的内侧。
在本发明的一些实施例中，天线槽狭缝4贯穿第一油墨层31和第一硬质阳极氧化层21并且进入所述金属层1。在本发明的另一些实施例中，天线槽狭缝4进入金属层1的厚度占金属层1总厚度的不超过40％，在本发明的一些实施例中，天线槽狭缝4进入金属层1的厚度占金属层1总厚度的20-30％。且步骤(2-1)中，天线槽狭缝4是通过镭雕形成的。
换句话说，根据本发明的实施例，为了减少对电子产品金属壳体结构的破坏，保证电子产品金属壳体的正面不会出现凸痕，进一步提高牢固度及硬度，在本发明的一些实施例中，步骤(B)中，在经步骤(A)处理所得产品的背面通过镭雕形成天线槽狭缝4，使得去除背面油墨层31、背面硬质阳极氧化层21和部分金属层1，去除的部分金属层1的厚度为金属层1总厚度的0-40％，进一步优选为20-30％。本领域技术人员应该理解的是，当去除的部分金属层1的厚度为金属层1总厚度的0-10％时，为正常镭雕；当去除的部分金属 层1的厚度为金属层1总厚度的10-40％时，为深度镭雕(本发明中，需要说明的是，当去除的部分金属层的厚度为金属层总厚度的10％时，为正常镭雕)。
根据本发明的实施例，对于镭雕的方法没有特别的限定，可以为本领域常用的各种镭雕方法，例如可以用镭雕机进行镭雕。在本发明的一些实施例中，形成的天线槽狭缝4的宽度L3为0.05-0.1mm。
在本发明的一些实施例中，步骤(2-2)中，通过蚀刻去除所述金属层1的一部分。即步骤(B)中，通过蚀刻去除狭缝4对应部位的金属层1。对于蚀刻的条件没有特别的限定，可以为本领域常用的各种蚀刻条件。在本发明的一些实施例中，蚀刻液为酸性蚀刻液。对于酸性蚀刻液没有特别的限定，可以为本领域常用的各种酸性蚀刻液，例如可以为三氯化铁类酸性蚀刻液、氯化铜类酸性蚀刻液或盐酸类酸性蚀刻液等。在本发明的一些实施例中，步骤(2-2)中，蚀刻采用含有三氯化铁和盐酸的水溶液作为蚀刻液，且每1L所述蚀刻液中，三氯化铁的含量为800-1000g，盐酸的含量为35-75g，且蚀刻是在20-30℃的条件下进行30-40min。也就是说，步骤(B)中，蚀刻的条件包括：温度为20-30℃，时间为30-40min，蚀刻液为含有三氯化铁和盐酸的水溶液，以1L蚀刻液计，三氯化铁的含量为800-1000g，盐酸的含量为35-75g。本领域技术人员应该理解的是，蚀刻的时间应与镭雕时去除的部分金属层的厚度有关，镭雕时去除的部分金属层的厚度越大，则蚀刻的时间应越短，反之，镭雕时去除的部分金属层的厚度越小，则蚀刻的时间应越长。
根据本发明的实施例，以电子产品金属壳体的背面所对应的天线槽的开口为上部开口，天线槽的剖面结构为上部开口大下部开口小的梯形结构。其中，当镭雕天线槽狭缝4为深度镭雕时，经蚀刻后形成的天线槽5的上部开口L1的宽度为3-6mm，下部开口的宽度L2为1-1.6mm；当镭雕天线槽狭缝4为正常镭雕时，经蚀刻后形成的天线槽5的上部开口的宽度L1为10-15mm，下部开口的宽度L2为2-3mm。
根据本发明的实施例，金属层1中可能会含有其他的金属杂质，如铜、锰等。因此，本发明的方法还可以包括，步骤(2-2)或步骤(B)中，在蚀刻后进行水洗，在水洗后进行剥黑膜，去除裸露的黑色杂质层，并再次进行水洗。对于水洗的方法没有特别的限定，可以为本领域常用的各种水洗方法，例如可以为用去离子水清洗2-3次。
根据本发明的实施例，对于去除油墨层(31，32)的方式没有特别的限定，可以为本领域常用的各种脱漆方式，只要能够去除油墨层(31，32)即可。在本发明的一些实施例中，步骤(3)或步骤(C)中，去除油墨层(31，32)的方式为用中性脱漆剂去除油墨层。对于中性脱漆剂没有特别的限定，可以为本领域常用的各种中性脱漆剂，例如可以为普通溶剂型脱漆剂、氯化烃类脱漆剂和水性脱漆剂中的一种或多种。
本领域技术人员应该理解的是，本发明的方法还包括在去除油墨层(31，32)之后、进行填胶处理之前进行水洗并烘干。对于烘干的方法没有特别的限定，可以为本领域常用的烘干方法，在本发明的一些实施例中，烘干的条件包括：温度为80-120℃，时间为5-10min。
根据本发明的实施例，对于填充非导电材料的方法和非导电材料没有特别的限定，可以分别为本领域常用的各种填充非导电材料方法和非导电材料。在本发明的一些实施例中，非导电材料为UV胶水、热固化胶水和常温硬化胶中的一种或多种。
在本发明的一些实施例中，金属层1为铝合金层。
在本发明的一些实施例中，电子产品金属壳体为手机金属外壳或平板电脑金属外壳。
第三方面，本发明提供了上述方法制备得到的电子产品金属壳体。该电子产品金属壳体的特征和优点与前面所述的电子产品金属壳体和方法一致，在此不再一一赘述。
实施例
以下的实施例将对本发明作进一步的说明，但并不因此限制本发明。
以下实施例中，0.5mm厚的5系铝材购自福建省南平铝业有限公司。
无镍封孔剂、微量镍封孔剂和无重金属封孔剂均购自深圳欧得美科技有限公司。
氯化烃溶剂脱漆剂购自东莞市四辉表面处理科技有限公司。
UV胶水购自日本爱赛克公司(ASEC)，型号为AS-210604C。
镭雕机购自深圳市光大激光技术有限公司，型号为FM20D。
实施例1
本实施例用于说明本发明的形成有天线槽的手机铝合金壳体及其制备方法。
(1)碱蚀处理：将铝合金层1厚度为0.5mm的5系铝材切割成5cm*3.5cm的铝合金片，60℃下，将铝合金片在浓度为40g/L的氢氧化钠溶液中碱蚀1.5min，然后用去离子水清洗2次；
(2)出光处理：25℃下，将步骤(1)得到的铝合金片在出光液(以1L出光液计，65重量％的浓硝酸的量为300ml)中出光2min，然后用去离子水清洗2次；
(3)氧化处理：将步骤(2)得到的铝合金片放入氧化槽中，其中，10℃下，采用正向方波脉冲，占空比为80％，频率为800Hz，电流密度为5A/dm2，将氧化槽中的铝合金片通电硬质氧化40min(以1L氧化液计，98重量％的硫酸的量为200g，草酸的量为15g，余量为水)，然后用去离子水清洗2次；
(4)封孔处理：25℃下用无镍封孔剂将步骤(3)得到的铝合金片封孔2.5min，然后用去离子水清洗2次，25℃下用无油压缩气体吹干，形成厚度为35μm的硬质阳极氧化层2；
(5)油墨喷涂处理：在步骤(4)得到的铝合金片表面喷涂UV油墨形成厚度为50μm的油墨层3，然后在115℃下烘烤25min，并在紫外线下曝光1.5min；
(6)在步骤(5)得到的铝合金片的背面用镭雕机镭雕出宽度为0.07mm的深度镭雕的天线槽狭缝4，去除背面的油墨层、硬质阳极氧化层和占铝合金层总厚度25％的铝合金层；
(7)25℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为900g、37重量％的盐酸的量为150ml，余量为水)蚀刻狭缝对应部位的铝合金层35min，观察发现正面的硬质阳极氧化层已全部露出，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次，得到剖面结构为上部开口大下部开口小的梯形结构的天线槽5，上部开口的宽度为4.5mm，下部开口的宽度为1.25mm；
(8)用氯化烃溶剂脱漆剂脱漆去除油墨层，用去离子水清洗2次，100℃下烘烤7min；
(9)使用UV胶水对天线槽进行填胶处理将狭缝充实。
本实施例中，镭雕后铝合金壳体的剖面结构示意图如图1所示，蚀刻后铝合金壳体的剖面结构示意图如图2所示，去除油墨层后铝合金壳体的剖面结构示意图如图3所示，铝合金片经硬质阳极氧化处理后(左图)以及在油墨喷涂处理后(右图)的图片如图4所示，铝合金壳体镭雕后的图片如图5所示，铝合金壳体填胶后的正面图如图6所示。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例2
本实施例用于说明本发明的形成有天线槽的手机铝合金壳体及其制备方法。
(1)碱蚀处理：将铝合金层1厚度为0.5mm的5系铝材切割成5cm*3.5cm的铝合金片，50℃下，将铝合金片在浓度为30g/L的氢氧化钾溶液中碱蚀2min，然后用去离子水清洗2次；
(2)出光处理：20℃下，将步骤(1)得到的铝合金片在出光液(以1L出光液计，65重量％的浓硝酸的量为400ml)中出光1min，然后用去离子水清洗2次；
(3)氧化处理：将步骤(2)得到的铝合金片放入氧化槽中，其中，5℃下，采用正向方波脉冲，占空比为50％，频率为500Hz，电流密度为2A/dm2，将氧化槽中的铝合金片通电硬质氧化50min(以1L氧化液计，98重量％的硫酸的量为220g，草酸的量为20g，余量为水)，然后用去离子水清洗2次；
(4)封孔处理：20℃下用微量镍封孔剂将步骤(3)得到的铝合金片封孔3min，然后用去离子水清洗2次，25℃下用无油压缩气体吹干，形成厚度为40μm的硬质阳极氧化层2；
(5)油墨喷涂处理：在步骤(4)得到的铝合金片表面喷涂UV油墨形成厚度为40μm的油墨层3，然后在110℃下烘烤30min，并在紫外线下曝光1min；
(6)在步骤(5)得到的铝合金片的背面用镭雕机镭雕出宽度为0.05mm的深度镭雕的天线槽狭缝4，去除背面的油墨层、硬质阳极氧化层和占铝合金层总厚度20％的铝合金层；
(7)20℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为1000g、37重量％的盐酸的量为200ml，余量为水)蚀刻狭缝对应部位的铝合金层30min，观察发现正面的硬质阳极氧化层已全部露出，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次，得到剖面结构为上部开口大下部开口小的梯形结构的天线槽5，上部开口的宽度为5mm，下部开口的宽度为1.3mm；
(8)用氯化烃溶剂脱漆剂脱漆去除油墨层，用去离子水清洗2次，80℃下烘烤10min；
(9)使用UV胶水对天线槽进行填胶处理将狭缝充实。
本实施例中，镭雕后铝合金壳体的剖面结构示意图、蚀刻后铝合金壳体的剖面结构示意图、去除油墨层后铝合金壳体的剖面结构示意图、铝合金片经硬质阳极氧化处理后(左图)以及在油墨喷涂处理后(右图)的图片、铝合金壳体镭雕后的图片以及铝合金壳体填胶后的正面图均与实施例1相一致。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例3
本实施例用于说明本发明的形成有天线槽的平板电脑铝合金壳体及其制备方法。
(1)碱蚀处理：将铝合金层1厚度为0.5mm的5系铝材切割成5cm*3.5cm的铝合金 片，70℃下，将铝合金片在浓度为60g/L的氢氧化钾溶液中碱蚀1min，然后用去离子水清洗2次；
(2)出光处理：30℃下，将步骤(1)得到的铝合金片在出光液(以1L出光液计，65重量％的浓硝酸的量为200ml)中出光3min，然后用去离子水清洗2次；
(3)氧化处理：将步骤(2)得到的铝合金片放入氧化槽中，其中，12℃下，采用正向方波脉冲，占空比为90％，频率为1000Hz，电流密度为7A/dm2，将氧化槽中的铝合金片通电硬质氧化30min(以1L氧化液计，98重量％的硫酸的量为120g，草酸的量为8g，余量为水)，然后用去离子水清洗2次；
(4)封孔处理：30℃下用无重金属封孔剂将步骤(3)得到的铝合金片封孔2min，然后用去离子水清洗2次，25℃下用无油压缩气体吹干，形成厚度为50um的硬质阳极氧化层2；
(5)油墨喷涂处理：在步骤(4)得到的铝合金片表面喷涂UV油墨形成厚度为60μm的油墨层3，然后在120℃下烘烤20min，并在紫外线下曝光2min；
(6)在步骤(5)得到的铝合金片的背面用镭雕机镭雕出宽度为0.1mm的深度镭雕的天线槽狭缝4，去除背面的油墨层、硬质阳极氧化层和占铝合金层总厚度30％的铝合金层；
(7)30℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为800g、37重量％的盐酸的量为100ml，余量为水)蚀刻狭缝对应部位的铝合金层40min，观察发现正面的硬质阳极氧化层已全部露出，然后用去离子水清洗2次，并剥除裸露的黑色氧化膜，再用去离子水清洗2次，得到剖面结构为上部开口大下部开口小的梯形结构的天线槽5，上部开口的宽度为4mm，下部开口的宽度为1.2mm；
(8)用氯化烃溶剂脱漆剂脱漆去除油墨层，用去离子水清洗2次，120℃下烘烤5min；
(9)使用UV胶水对天线槽进行填胶处理将狭缝充实。
本实施例中，镭雕后铝合金壳体的剖面结构示意图、蚀刻后铝合金壳体的剖面结构示意图、去除油墨层后铝合金壳体的剖面结构示意图、铝合金片经硬质阳极氧化处理后(左图)以及在油墨喷涂处理后(右图)的图片、铝合金壳体镭雕后的图片以及铝合金壳体填胶后的正面图均与实施例1相一致。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例4
按照实施例1的方法，不同的是，步骤(6)中，去除背面的油墨层、硬质阳极氧化层和占铝合金层总厚度15％的铝合金层。
本实施例中，镭雕后铝合金壳体的剖面结构示意图、蚀刻后铝合金壳体的剖面结构示意图、去除油墨层后铝合金壳体的剖面结构示意图、铝合金片经硬质阳极氧化处理后(左图)以及在油墨喷涂处理后(右图)的图片、铝合金壳体镭雕后的图片以及铝合金壳体填胶后的正面图均与实施例1相一致，其中，形成的天线槽的上部开口的宽度为6mm，下部开口的宽度为1.5mm。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例5
按照实施例1的方法，不同的是，步骤(6)中，去除背面的油墨层、硬质阳极氧化层和占铝合金层总厚度5％的铝合金层。
本实施例中，镭雕后铝合金壳体的剖面结构示意图如图7所示，而蚀刻后铝合金壳体的剖面结构示意图、去除油墨层后铝合金壳体的剖面结构示意图、铝合金片经硬质阳极氧化处理后(左图)以及在油墨喷涂处理后(右图)的图片、铝合金壳体镭雕后的图片以及铝合金壳体填胶后的正面图均与实施例1相一致，其中，在步骤(5)得到的铝合金片的背面镭雕出天线槽狭缝，去除背面的油墨层、硬质阳极氧化层和占铝合金层总厚度5％的铝合金层形成正常镭雕的天线槽狭缝6，且形成的天线槽的上部开口的宽度为12mm，下部开口的宽度为2.5mm。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
本领域技术人员应公知的是，天线槽的上部开口和下部开口的宽度越小，铝合金壳体的牢固度及硬度越好。因此，将实施例1分别与实施例4-5比较可知，去除的部分铝合金层的厚度为铝合金层总厚度的20-30％时，能够明显降低经蚀刻后形成的天线槽的上部开口和下部开口的宽度，从而能够明显提高铝合金壳体的牢固度及硬度。
试验例
将实施例1-5制备得到的铝合金壳体进行信号屏蔽测试，测试方法为：在被外观不可见的天线槽完全隔开的两部分各镭雕出一个导电位，测定两个导电位之间的导电性。实施例1-5对应的测定结果均为不导电，因此可知，本发明的方法在保持电子产品金属壳体外观的整洁性及连续性，使电子产品金属壳体整体的金属质感不被破坏的同时，很好地解决了电子产品金属壳体机身的信号屏蔽问题。
以上详细描述了本发明的优选实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本发明对各种可能的组合方式不再另行说明。
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。

Claims (31)

  1. 一种电子产品金属壳体，其特征在于，包括：
    金属层；
    第一硬质阳极氧化层，所述第一硬质阳极氧化层形成在所述金属层的上表面；
    第二硬质阳极氧化层，所述第二硬质阳极氧化层形成在所述金属层的下表面；
    天线槽，所述天线槽贯穿所述金属层和所述第一硬质阳极氧化层；以及
    非导电材料，所述非导电材料填充在所述天线槽中。
  2. 根据权利要求1所述的电子产品金属壳体，其特征在于，所述天线槽的上部开口宽度大于下部开口宽度。
  3. 根据权利要求2所述的电子产品金属壳体，其特征在于，所述上部开口宽度为3-15mm。
  4. 根据权利要求3所述的电子产品金属壳体，其特征在于，所述上部开口宽度为3-6mm。
  5. 根据权利要求2所述的电子产品金属壳体，其特征在于，所述下部开口宽度为1-3mm。
  6. 根据权利要求5所述的电子产品金属壳体，其特征在于，所述下部开口宽度为1-1.6mm。
  7. 根据权利要求1-6中任一项所述的电子产品金属壳体，其特征在于，所述金属层的厚度为0.5-1.5mm；所述第一硬质阳极氧化层和所述第二硬质阳极氧化层的厚度均为0.02-0.06mm。
  8. 根据权利要求1-7中任一项所述的电子产品金属壳体，其特征在于，所述金属层为铝合金层。
  9. 根据权利要求1-8中任一项所述的电子产品金属壳体，其特征在于，所述电子产品 金属壳体为手机金属外壳或平板电脑金属外壳。
  10. 一种制备电子产品金属壳体的方法，其特征在于，所述方法包括：
    (1)将金属层依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成第一硬质阳极氧化层、第二硬质阳极氧化层、第一油墨层和第二油墨层，其中，所述第一硬质阳极氧化层形成在所述金属层的上表面，所述第二硬质阳极氧化层形成在所述金属层的下表面，所述第一油墨层形成在所述第一硬质阳极氧化层的上表面，所述油墨层形成在所述第二硬质阳极氧化层的下表面；
    (2)在经步骤(1)处理所得产品的上表面形成天线槽，使得在厚度方向上所述天线槽贯穿所述第一油墨层、所述第一硬质阳极氧化层和所述金属层；
    (3)去除所述第一油墨层和所述第二油墨层，并在所述天线槽中填充所述非导电材料。
  11. 根据权利要求10所述的方法，其特征在于，步骤(2)中，所述形成天线槽进一步包括：
    (2-1)形成天线槽狭缝，所述天线槽狭缝自所述第一油墨层向所述金属层延伸，并且至少贯穿所述第一油墨层和所述第一硬质阳极氧化层；
    (2-2)沿着所述狭缝延伸的方向，去除所述金属层的一部分，以便形成贯穿所述金属层的所述天线槽。
  12. 根据权利要求11所述的方法，其特征在于，所述天线槽狭缝贯穿所述第一油墨层和所述第一硬质阳极氧化层并且进入所述金属层。
  13. 根据权利要求12所述的方法，其特征在于，所述天线槽狭缝进入所述金属层的厚度占所述金属层总厚度的不超过40％。
  14. 根据权利要求13所述的方法，其特征在于，步骤(2-1)中，所述天线槽狭缝进入所述金属层的厚度占所述金属层总厚度的20-30％。
  15. 根据权利要求11-14中任一项所述的方法，其特征在于，步骤(2-1)中，所述天线槽狭缝是通过镭雕形成的。
  16. 根据权利要求11-15中任一项所述的方法，其特征在于，步骤(2-1)中，所述天线槽狭缝的宽度为0.05-0.1mm。
  17. 根据权利要求11-16中任一项所述的方法，其特征在于，步骤(2-2)中，通过蚀刻去除所述金属层的一部分。
  18. 根据权利要求17所述的方法，其特征在于，所述蚀刻采用含有三氯化铁和盐酸的水溶液作为蚀刻液，且每1L所述蚀刻液中，三氯化铁的含量为800-1000g，盐酸的含量为35-75g。
  19. 根据权利要求17或18所述的方法，其特征在于，所述蚀刻是在20-30℃的条件下进行30-40min。
  20. 根据权利要求10-19中任意一项所述的方法，其特征在于，步骤(1)中，所述硬质阳极氧化处理包括依次对所述金属层进行碱蚀处理、出光处理、氧化处理和封孔处理，并在所述碱蚀处理、出光处理、氧化处理和封孔处理后分别进行水洗。
  21. 根据权利要求20所述的方法，其特征在于，所述碱蚀处理的条件包括：
    温度为50-70℃，
    时间为1-2min，
    碱蚀液的浓度为30-60g/L，
    碱蚀液为选自氢氧化钠溶液、氢氧化钾溶液和氢氧化锂溶液中的一种或多种。
  22. 根据权利要求20或21所述的方法，其特征在于，所述出光处理的条件包括：
    温度为20-30℃，
    时间为1-3min，
    出光液为硝酸水溶液，
    且每1L所述出光液中硝酸的含量为130-270g。
  23. 根据权利要求20-22中任一项所述的方法，其特征在于，所述氧化处理的条件包 括：
    温度为5-12℃，
    时间为30-50min，
    脉冲波型为正向方波脉冲，
    占空比为50-90％，
    频率为500-1000Hz，
    电流密度为2-7A/dm2，
    氧化液为含有硫酸和选自草酸和苹果酸之一的水溶液，且每1L所述氧化液中，硫酸的含量为120-220g，草酸或苹果酸的含量为8-20g。
  24. 根据权利要求20-23中任一项所述的方法，其特征在于，所述封孔处理的条件包括：
    温度为20-30℃，
    时间为2-3min；
    封孔剂为选自无镍封孔剂、微量镍封孔剂和无重金属封孔剂中的一种或多种。
  25. 根据权利要求10-24中任意一项所述的方法，其特征在于，步骤(1)中，所述油墨喷涂处理进一步包括：
    分别在所述第一硬质阳极氧化层和所述第二硬质阳极氧化层的表面喷涂UV油墨，然后将经喷涂UV油墨所得产品在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min。
  26. 根据权利要求10-25中任意一项所述的方法，其特征在于，所述第一油墨层和所述第二油墨层的厚度为40-60μm。
  27. 根据权利要求10-26中任意一项所述的方法，其特征在于，步骤(3)中，利用中性脱漆剂去除所述第一油墨层和所述第二油墨层。
  28. 根据权利要求10-27中任意一项所述的方法，其特征在于，步骤(3)中，所述非导电材料为选自UV胶水、热固化胶水和常温硬化胶中的一种或多种。
  29. 根据权利要求10-28中任意一项所述的方法，其特征在于，所述金属层为铝合金 层。
  30. 根据权利要求10-29中任意一项所述的方法，其特征在于，所述电子产品金属壳体为手机金属外壳或平板电脑金属外壳。
  31. 一种电子产品金属壳体，其特征在于，是通过权利要求10-30中任意一项所述的方法制备的。
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US20170295267A1 (en) 2017-10-12
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