WO2016101693A1 - 形成有天线槽的电子产品金属壳体及其制备方法 - Google Patents

形成有天线槽的电子产品金属壳体及其制备方法 Download PDF

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Publication number
WO2016101693A1
WO2016101693A1 PCT/CN2015/092723 CN2015092723W WO2016101693A1 WO 2016101693 A1 WO2016101693 A1 WO 2016101693A1 CN 2015092723 W CN2015092723 W CN 2015092723W WO 2016101693 A1 WO2016101693 A1 WO 2016101693A1
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WIPO (PCT)
Prior art keywords
layer
metal
electronic product
ink
aluminum alloy
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PCT/CN2015/092723
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English (en)
French (fr)
Inventor
蒋宝荣
廖重重
李爱华
陈梁
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比亚迪股份有限公司
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Application filed by 比亚迪股份有限公司 filed Critical 比亚迪股份有限公司
Priority to EP15871766.0A priority Critical patent/EP3240377B1/en
Priority to KR1020177015739A priority patent/KR102032344B1/ko
Priority to JP2017534547A priority patent/JP6438586B2/ja
Publication of WO2016101693A1 publication Critical patent/WO2016101693A1/zh
Priority to US15/631,915 priority patent/US10194547B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Definitions

  • the present disclosure relates to the field of electronic product preparation, and in particular to an electronic product metal casing formed with an antenna slot and a method of fabricating the same.
  • electronic products such as metal mobile phones use the method of opening the antenna slot and molding on the back cover of the mobile phone, such as the upper and lower antenna slots of the HTC ONE, the side antenna slots of the iphone 5/5s, and the like.
  • the above-mentioned method of opening an antenna slot on an electronic product metal casing (such as a metal mobile phone back cover) and injection molding has caused certain damage to the overall structure of the metal casing of the electronic product (such as a metal mobile phone body), which affects its appearance. Cleanliness and continuity.
  • the plastic visible in the metal casing of the electronic product (such as the back cover of the mobile phone) also destroys the overall metallic texture of the body.
  • the purpose of the present disclosure is to overcome the prior art method of opening an antenna slot on an electronic product metal casing and injecting the same, which affects the appearance and continuity of the appearance of the metal shell of the electronic product, and destroys the metal texture of the metal shell of the electronic product.
  • the defect provides a metal casing for forming an electronic product with an antenna slot and a preparation method thereof, and the antenna groove formed in the metal casing of the electronic product of the present disclosure is invisible, thereby ensuring the appearance of the metal casing of the electronic product and Continuity and the metal texture of the metal casing of the electronic product is not destroyed.
  • the present disclosure provides an electronic product metal casing formed with an antenna slot, the electronic product metal casing including a metal layer and a hard anodized layer, the hard anode An oxide layer is wrapped on a surface of the metal layer, and a first surface of the electronic product metal casing is formed with a step, and the step penetrates the first surface of the electronic product metal shell by a hard anodized layer in a thickness direction And a portion of the metal layer, the antenna groove is located in the step and penetrates the remaining metal layer in the thickness direction, and exposes the inner side of the second surface hard anodized layer, and the antenna groove is filled with a non-conductive material.
  • the present disclosure provides a method of fabricating an electronic product metal housing formed with an antenna slot, the method comprising the steps of:
  • step (2) first forming a step on the first side of the product obtained by the step (1), such that the step penetrates the first surface of the product into the hard anodized layer and a portion of the metal layer in the thickness direction, and then in the Forming an antenna slot in the step such that the antenna slot penetrates the remaining metal layer in the thickness direction and exposes the inner side of the second surface hard anodized layer;
  • the present disclosure provides an electronic product metal casing prepared by the above method.
  • the appearance of the antenna slot formed in the metal casing of the electronic product of the present disclosure is not visible, and the appearance surface layer of the metal shell of the electronic product has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the metal shell of the electronic product can be maintained. And the metal texture of the metal shell of the electronic product is not destroyed.
  • FIG. 1 is a schematic cross-sectional view showing an aluminum alloy casing after removing an ink layer corresponding to a step pattern portion and a hard anodized layer in Embodiment 1 of the present disclosure
  • FIG. 2 is a schematic cross-sectional view showing an aluminum alloy casing obtained by removing a part of an aluminum alloy layer in a thickness direction in a thickness direction according to Embodiment 1 of the present disclosure
  • FIG. 3 is a schematic cross-sectional structural view of an aluminum alloy casing in which a slit of a antenna is grooved in a step and an ink corresponding to an slit of the antenna slot is removed in the first embodiment of the present disclosure;
  • FIG. 4 is a schematic cross-sectional structural view of an aluminum alloy casing after removing an ink layer in Embodiment 1 of the present disclosure
  • Embodiment 5 is a picture of an aluminum alloy case after forming an ink layer in Embodiment 1 of the present disclosure
  • Embodiment 6 is a picture of an aluminum alloy case after a laser-engraved step pattern in Embodiment 1 of the present disclosure
  • Fig. 8 is a view showing an aluminum alloy casing after the slit of the radium antenna slot in the first embodiment of the present disclosure.
  • the present disclosure provides an electronic product metal casing formed with an antenna slot, the electronic product metal casing including a metal layer 3 and a hard anodized layer 1, and a hard anodized layer 1 wrapped in a metal layer Surface, electronic product
  • the first surface of the metal shell is formed with a step 4 which penetrates the first surface hard anodized layer and a part of the metal layer of the metal shell of the electronic product in the thickness direction
  • the antenna slot 5 is located in the step and penetrates in the thickness direction
  • the remaining metal layer is exposed and the inner side of the second surface hard anodized layer is exposed, and the antenna groove is filled with a non-conductive material.
  • the step 4 may be a groove having a width of 1.0 to 5.0 cm and a depth of 0.1 to 0.8 mm, for example, a groove having a depth of 0.3 to 0.5 mm.
  • the opening of the antenna slot 5 corresponding to the first surface of the metal shell of the electronic product is an upper opening
  • the cross-sectional structure of the antenna slot 5 is an upper opening and a small lower opening.
  • the trapezoidal structure has an upper opening having a width of 2 to 5 mm, for example, 2-3 mm; and a lower opening having a width of 0.8 to 1.4 mm, for example, 0.8 to 1.2 mm.
  • the metal layer 3 may have a thickness of 0.5-1.5 mm, for example, 0.5-0.6 mm; and the hard anodized layer 1 may have a thickness of 0.02-0.06 mm, for example 0.04-0.06mm.
  • the metal layer 3 may be an aluminum alloy layer.
  • the electronic product metal casing may be a metal shell of a mobile phone or a metal casing of a tablet computer.
  • the present disclosure provides a method of fabricating an electronic product metal housing formed with an antenna slot, the method comprising the steps of:
  • step (2) first forming a step on the first side of the product obtained by the step (1), such that the step penetrates the first surface of the product into the hard anodized layer and a portion of the metal layer in the thickness direction, and then forms an antenna in the step a groove such that the antenna groove penetrates the remaining metal layer in the thickness direction and exposes the inner side of the second surface hard anodized layer;
  • the method of the hard anodizing treatment is not particularly limited, and various hard anodizing treatment methods commonly used in the art may be employed.
  • the method of hard anodizing comprises sequentially performing an alkali etching treatment, a light-emitting treatment, an oxidation treatment, and a sealing treatment on the metal layer, and separately performing water washing after each treatment.
  • the method of washing with water is not particularly limited, and various washing methods commonly used in the art can be used, for example, it can be washed 2-3 times with deionized water.
  • the conditions of the alkali etching treatment are not particularly limited, and various alkali etching treatment conditions commonly used in the art may be employed.
  • the conditions of the alkali etching treatment include: a temperature of 50-70 ° C, a time of 1-2 min, an alkali etching solution concentration of 30-60 g / L, the alkali etching solution is a sodium hydroxide solution, a potassium hydroxide solution, and One or more of lithium hydroxide solutions.
  • the conditions for the light-emitting treatment are not particularly limited, and various conditions for the light-emitting treatment which are commonly used in the art may be employed.
  • the conditions of the light-emitting treatment include: the temperature is 20-30 ° C, the time is 1-3 min, the light-emitting liquid It is an aqueous solution of nitric acid, and the content of nitric acid is 130-270 g (i.e., the amount of concentrated nitric acid corresponding to 65-68 wt% is 200-400 mL) in terms of 1 L of the light-emitting liquid.
  • the conditions of the oxidation treatment are not particularly limited, and may be various oxidation treatment conditions commonly used in the art.
  • the conditions of the oxidation treatment include: a temperature of 5-12 ° C, a time of 30-50 min, a pulse wave type is a forward square wave pulse, a duty ratio of 50-90%, a frequency of 500-1000 Hz, a current
  • the density is 2-7 A/dm 2
  • the oxidizing solution is an aqueous solution containing sulfuric acid and oxalic acid/malic acid.
  • the content of sulfuric acid is 120-220 g
  • the content of oxalic acid or malic acid is 8-20 g, based on 1 L of the oxidizing solution.
  • the oxidizing solution is an aqueous solution containing sulfuric acid or oxalic acid/malic acid, which means that the oxidizing solution is an aqueous solution containing sulfuric acid and oxalic acid, or the oxidizing solution is an aqueous solution containing sulfuric acid and malic acid.
  • the conditions of the plugging treatment are not particularly limited, and may be various sealing treatment conditions commonly used in the art.
  • the conditions of the sealing treatment include: a temperature of 20-30 ° C, and a time of 2-3 min.
  • the sealing agent is one or more of a nickel-free sealing agent, a trace amount of nickel sealing agent, and a heavy metal-free sealing agent. It should be understood by those skilled in the art that after the sealing treatment, water washing is performed, and after washing with water, drying can be performed to form a hard anodized layer.
  • the manner of drying is not particularly limited and may be variously used in the art, for example, it may be blown off with an oil-free compressed gas at a temperature of 20 to 30 ° C for 5 to 10 minutes, which is a person skilled in the art. It is well known that it will not be described here.
  • the ink layer 2 is formed on both the second side and the first side of the product subjected to the hard anodizing treatment.
  • the manner of the ink spray treatment is not particularly limited, and various ink spray treatment methods commonly used in the art may be used.
  • the method of ink spraying treatment comprises: spraying the UV ink to form an ink layer having a thickness of 40-60 um, then baking at 110-120 ° C for 20-30 min, and exposing under ultraviolet light for 1-2 min.
  • the second side of the metal shell of the electronic product refers to one side of the metal shell of the electronic product exposed in the air when assembled into the finished electronic product, and the first side is The opposite side to the second side.
  • the step of forming the step comprises: forming a step pattern on the first side of the product obtained by the step (1) to remove the ink layer corresponding to the step pattern portion and hard An anodized layer is removed and a portion of the metal layer is removed in the thickness direction to obtain a step.
  • the second surface of the metal shell of the electronic product does not have a convex mark, thereby further improving the firmness and hardness, and optionally, after removing a part of the metal layer
  • the thickness of the remaining metal layer is 20-80% of the total thickness of the metal layer, for example, 20-40%.
  • the step formed is a groove having a width of 1.0 to 5.0 cm and a depth of 0.1 to 0.8 mm, for example, a groove having a depth of 0.3 to 0.5 mm.
  • a step is formed by laser engraving on the first side of the product obtained by the step (1) pattern.
  • the method for the laser-engraved step pattern is not particularly limited, and various laser engraving methods commonly used in the art can be used.
  • laser engraving can be performed by a laser engraving machine, which is well known to those skilled in the art and will not be described herein.
  • a part of the metal is optionally removed in the thickness direction by etching.
  • the conditions for etching are not particularly limited and may be various etching conditions commonly used in the art.
  • the etchant is an acidic etchant.
  • the acidic etching liquid is not particularly limited, and may be various acidic etching liquids commonly used in the art, and may be, for example, a ferric chloride-based acidic etching liquid, a copper chloride-based acidic etching liquid, or a hydrochloric acid-based acidic etching liquid.
  • the etching conditions include: the temperature is 20-30 ° C, the time is 30-40 min, the etching solution is an aqueous solution containing ferric chloride and hydrochloric acid, and the content of ferric chloride is 800-based on 1 L etching liquid. 1000 g, the content of hydrochloric acid is 35-75 g (that is, the amount of hydrochloric acid equivalent to 36-38 wt% is 100-200 mL).
  • the etching time should be related to the thickness of the removed metal layer. The larger the thickness of the removed metal layer, the longer the etching time should be. Otherwise, the thickness of the removed metal layer. The smaller the etch, the shorter the etching time should be.
  • the process of forming the antenna slot includes: spraying ink on the step portion, forming an antenna slot slit in the step to remove the ink corresponding to the slot of the antenna slot, and then removing The metal layer corresponding to the slot of the antenna slot is exposed until the inner side of the second surface hard anodized layer is exposed.
  • the manner of spraying the ink is not particularly limited, and various methods of spraying the ink which are commonly used in the art may be employed.
  • the method of spraying the ink comprises: spraying the UV ink to form an ink layer having a thickness of 30-60 um, then baking at 110-120 ° C for 20-30 min, and exposing 1-2 min under ultraviolet light. .
  • the width of the formed antenna slot slit is 0.02-0.1 mm.
  • step (2) the metal layer corresponding to the slot of the antenna slot is removed by etching, and the etching conditions include: the temperature is 20-30 ° C, the time is 30-40 min, and the etching liquid is contained.
  • An aqueous solution of ferric chloride and hydrochloric acid, in terms of 1 L of etching liquid, has a content of ferric chloride of 800-1000 g and a hydrochloric acid content of 35-75 g.
  • the metal layer may contain other metal impurities such as copper, manganese, and the like. Therefore, the method of the present disclosure may further include performing water washing after each etching, stripping the black film after water washing, removing the bare black impurity layer, and performing water washing again.
  • the method of washing with water is not particularly limited, and various washing methods commonly used in the art can be used, for example, it can be washed 2-3 times with deionized water.
  • the opening of the antenna slot corresponding to the first surface of the metal shell of the electronic product is an upper opening
  • the cross-sectional structure of the antenna slot is a trapezoidal structure having a small upper opening and a small lower opening.
  • the width of the upper opening of the antenna groove formed by etching is 2-3 mm, and the lower opening The width is 0.8-1.2mm.
  • the removed ink layer is all of the ink layers on the surface of the metal outer casing of the electronic product.
  • the manner of removing the ink layer is not particularly limited, and various stripping methods commonly used in the art may be used as long as the ink layer can be removed.
  • the ink layer is removed by removing the ink layer with a neutral paint stripper.
  • the neutral paint remover is not particularly limited, and may be various neutral paint removers commonly used in the art, for example, one of a common solvent type paint remover, a chlorinated hydrocarbon paint remover, and an aqueous paint remover. Kind or more.
  • the method of the present disclosure may further include water washing and drying after removing the ink layer, before filling the non-conductive material.
  • the drying method is not particularly limited and may be a drying method commonly used in the art.
  • the drying conditions include a temperature of 80-120 ° C and a time of 5-10 min.
  • the method of filling the non-conductive material and the non-conductive material are not particularly limited, and various non-conductive material filling methods and non-conductive materials which are commonly used in the art may be used.
  • the non-conductive material is one or more of a UV glue, a heat curing glue, and a room temperature hardening glue.
  • the stepped portion in order to beautify the appearance of the prepared metal shell of the electronic product, the stepped portion may be filled with a non-conductive material.
  • the metal layer is an aluminum alloy layer.
  • the metal shell of the electronic product is a metal shell of a mobile phone or a metal shell of a tablet.
  • the present disclosure provides an electronic product metal casing prepared by the above method.
  • a 0.5 mm thick 5 series aluminum material was purchased from Fujian Nanping Aluminum Co., Ltd.
  • Nickel-free sealing agent trace nickel sealing agent and heavy metal-free sealing agent were purchased from Shenzhen Oudemei Technology Co., Ltd.
  • the chlorinated hydrocarbon solvent stripper was purchased from Dongguan Sihui Surface Treatment Technology Co., Ltd.
  • the UV glue was purchased from Aesek Corporation (ASEC), model AS-210604C.
  • the laser engraving machine was purchased from Shenzhen Guangda Laser Technology Co., Ltd., model FM20D.
  • This embodiment is used to explain the aluminum alloy casing of the mobile phone formed with the antenna slot of the present disclosure and a preparation method thereof.
  • Alkali etching treatment 5 series aluminum material with aluminum alloy layer 3 thickness of 0.5 mm is cut into aluminum alloy sheets of 5 cm*3.5 cm, and aluminum alloy sheets are made of sodium hydroxide at a concentration of 40 g/L at 60 °C. Alkaline etching in solution for 1.5 min, then washing with deionized water for 2 times;
  • the aluminum alloy sheet obtained in the step (1) was light-exposed at 25 ° C in a light-emitting liquid (300 ml of 65% by weight of concentrated nitric acid), and then deionized water was used. Wash 2 times;
  • Oxidation treatment The aluminum alloy sheet obtained in the step (2) is placed in an oxidation tank, wherein, at 10 ° C, a forward square wave pulse is used, the duty ratio is 80%, the frequency is 800 Hz, and the current density is 5 A. /dm2, the aluminum alloy sheet in the oxidation tank is hard-oxidized for 40 min (in terms of 1 L of oxidizing solution, the amount of 98% by weight of sulfuric acid is 200 g, the amount of oxalic acid is 15 g, the balance is water), and then deionized water is used. Wash 2 times;
  • step (4) ink spraying treatment: the surface of the aluminum alloy sheet obtained in step (4) is sprayed with UV ink to form an ink layer 2 having a thickness of 50 ⁇ m, then baked at 115 ° C for 25 min, and exposed to ultraviolet light for 1.5 min;
  • the first surface of the aluminum alloy sheet obtained in the step (5) is laser-etched with a laser engraving step pattern to remove the ink layer and the hard anodized layer corresponding to the step pattern portion, and is etched at 25 ° C.
  • the liquid (the amount of ferric chloride hexahydrate was 900 g, the amount of 37 wt% hydrochloric acid was 150 ml, and the balance was water) was etched in the thickness direction for 45 minutes to remove the 0.3 mm aluminum alloy layer.
  • a step 4 having a width of 2.5 cm and a depth of 0.3 mm, and then washing twice with deionized water, and peeling off the exposed black impurity layer, and then washing it twice with deionized water;
  • the ink corresponding to the slot of the antenna slot is removed, and then the etching solution is used at 25 ° C (the amount of ferric chloride hexahydrate is 900 g, and the amount of 37 wt% hydrochloric acid is 150 ml, the balance is water).
  • the aluminum alloy layer corresponding to the portion of the slit is etched for 35 min.
  • the cross-sectional structure of the aluminum alloy casing after removing the ink layer corresponding to the step pattern portion and the hard anodized layer is as shown in FIG. 1 , and the aluminum alloy layer is removed in the thickness direction to obtain the aluminum alloy after the step.
  • the schematic diagram of the cross-sectional structure of the casing is shown in Fig. 2.
  • the schematic diagram of the cross-sectional structure of the aluminum alloy casing after the radium engraving antenna slot slit in the step and the ink corresponding to the slot of the antenna slot is removed is shown in Fig. 3, after the ink layer is removed.
  • the cross-sectional structure of the aluminum alloy casing is shown in Fig. 4.
  • the picture of the aluminum alloy casing after forming the ink layer is shown in Fig.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • This embodiment is used to explain the aluminum alloy casing of the mobile phone formed with the antenna slot of the present disclosure and a preparation method thereof.
  • Alkali etching treatment 5 series aluminum material with aluminum alloy layer 3 thickness of 0.5 mm is cut into aluminum alloy sheets of 5 cm*3.5 cm, and aluminum alloy sheets are made of potassium hydroxide at a concentration of 30 g/L at 50 °C. Alkaline etching in solution for 2min, then washing with deionized water for 2 times;
  • the aluminum alloy sheet obtained in the step (1) was light-exposed in a light-emitting liquid (400 ml of concentrated nitric acid in an amount of 400 ml) at 20 ° C for 1 min, and then deionized water was used. Wash 2 times;
  • Oxidation treatment The aluminum alloy piece obtained in the step (2) is placed in an oxidation tank, wherein a forward square wave pulse is used at 5 ° C, the duty ratio is 50%, the frequency is 500 Hz, and the current density is 2 A. /dm2, the aluminum alloy sheet in the oxidation tank is hard oxidized for 50 min (in terms of 1 L oxidizing solution, the amount of 98% by weight of sulfuric acid is 220 g, the amount of oxalic acid is 20 g, the balance is water), and then deionized water is used. Wash 2 times;
  • step (4) ink spraying treatment: the surface of the aluminum alloy sheet obtained in step (4) is sprayed with UV ink to form an ink layer 2 having a thickness of 40 ⁇ m, then baked at 110 ° C for 30 min, and exposed to ultraviolet light for 1 min;
  • the first surface of the aluminum alloy sheet obtained in the step (5) is laser-etched with a laser engraving step pattern to remove the ink layer and the hard anodized layer corresponding to the step pattern portion, and is etched at 20 ° C.
  • the liquid (the amount of ferric chloride hexahydrate was 800 g, the amount of 37 wt% hydrochloric acid was 100 ml, and the balance was water) was etched in the thickness direction for 50 min to remove the 0.4 mm aluminum alloy layer.
  • a step 4 having a width of 2.5 cm and a depth of 0.4 mm, and then washing twice with deionized water, and peeling off the exposed black impurity layer, and then washing it twice with deionized water;
  • the ink corresponding to the slot of the antenna slot is then etched at 20 ° C (the amount of ferric chloride hexahydrate is 800 g, the amount of hydrochloric acid of 37 wt % is 100 ml, and the balance is water).
  • the aluminum alloy layer of the corresponding portion of the slit was etched for 40 min.
  • a cross-sectional structural view of the aluminum alloy casing after removing the ink layer corresponding to the step pattern portion and the hard anodized layer, and a cross-sectional structure of the aluminum alloy casing obtained by removing a portion of the aluminum alloy layer in the thickness direction The schematic diagram, the schematic diagram of the cross-sectional structure of the aluminum alloy casing after the laser engraving antenna slot slit in the step, the ink corresponding to the slot of the antenna slot, the cross-sectional structure of the aluminum alloy casing after removing the ink layer, and the ink layer after forming the ink layer
  • a picture of the aluminum alloy case, a picture of the aluminum alloy case after the laser-engraved step pattern, a picture of the aluminum alloy case after etching the step, and a picture of the aluminum alloy case after the laser-cut antenna groove slit are all the same as in the first embodiment. Consistent.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • This embodiment is for explaining the aluminum alloy casing of the tablet computer formed with the antenna slot of the present disclosure and a preparation method thereof.
  • Alkali etching treatment 5 series aluminum material with aluminum alloy layer 3 thickness of 0.5 mm is cut into aluminum alloy sheets of 5 cm*3.5 cm, and aluminum alloy sheets are made of potassium hydroxide at a concentration of 60 g/L at 70 °C. Alkaline etching in solution for 1 min, then washing with deionized water for 2 times;
  • Oxidation treatment The aluminum alloy sheet obtained in the step (2) is placed in an oxidation tank, wherein a forward square wave pulse is used at 12 ° C, the duty ratio is 90%, the frequency is 1000 Hz, and the current density is 7 A. /dm 2 , the aluminum alloy sheet in the oxidation tank is hard oxidized for 30 min (in terms of 1 L oxidizing solution, the amount of 98% by weight of sulfuric acid is 120 g, the amount of oxalic acid is 8 g, the balance is water), and then deionized Water washing 2 times;
  • step (4) ink spraying treatment: the surface of the aluminum alloy sheet obtained in step (4) is sprayed with UV ink to form an ink layer 2 having a thickness of 60 ⁇ m, then baked at 120 ° C for 20 min, and exposed to ultraviolet light for 2 min;
  • the first surface of the aluminum alloy sheet obtained in the step (5) is laser-etched with a laser engraving step pattern to remove the ink layer and the hard anodized layer corresponding to the step pattern portion, and is etched at 30 ° C.
  • Liquid (based on 1L of etching solution, hexahydrate The amount of ferric chloride was 1000 g, the amount of 37% by weight of hydrochloric acid was 200 ml, and the balance was water) was etched in the thickness direction for 40 min to remove the 0.35 mm aluminum alloy layer to obtain a width of 2.5 cm and a depth of 0.35 mm. Step 4, then cleaned twice with deionized water, and stripped of the exposed black impurity layer, and then washed twice with deionized water;
  • the ink corresponding to the slot of the antenna slot is then etched at 30 ° C (the amount of ferric chloride hexahydrate is 1000 g, the amount of hydrochloric acid of 37 wt % is 200 ml, and the balance is water).
  • the aluminum alloy layer corresponding to the slit was etched for 30 min.
  • a cross-sectional structural view of the aluminum alloy casing after removing the ink layer corresponding to the step pattern portion and the hard anodized layer, and a cross-sectional structure of the aluminum alloy casing obtained by removing a portion of the aluminum alloy layer in the thickness direction The schematic diagram, the schematic diagram of the cross-sectional structure of the aluminum alloy casing after the laser engraving antenna slot slit in the step, the ink corresponding to the slot of the antenna slot, the cross-sectional structure of the aluminum alloy casing after removing the ink layer, and the ink layer after forming the ink layer
  • a picture of the aluminum alloy case, a picture of the aluminum alloy case after the laser-engraved step pattern, a picture of the aluminum alloy case after etching the step, and a picture of the aluminum alloy case after the laser-cut antenna groove slit are all the same as in the first embodiment. Consistent.
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • step (6) the amount of hydrochloric acid in an amount of 900 g and 37% by weight of ferric chloride hexahydrate was measured at 25 ° C using an etching solution (in terms of 1 L of etching liquid). 150 ml, the balance being water) was etched in the thickness direction for 20 min to remove the 0.1 mm aluminum alloy layer, and a step was obtained.
  • a cross-sectional structural view of the aluminum alloy casing after removing the ink layer corresponding to the step pattern portion and the hard anodized layer, and a cross-sectional structure of the aluminum alloy casing obtained by removing a portion of the aluminum alloy layer in the thickness direction The schematic diagram, the schematic diagram of the cross-sectional structure of the aluminum alloy casing after the laser engraving antenna slot slit in the step, the ink corresponding to the slot of the antenna slot, the cross-sectional structure of the aluminum alloy casing after removing the ink layer, and the ink layer after forming the ink layer Picture of aluminum alloy casing,
  • the picture of the aluminum alloy case after the laser-engraving step pattern, the picture of the aluminum alloy case after etching the step, and the picture of the aluminum alloy case after the laser-cut antenna groove slit are all in accordance with the first embodiment, wherein the formed
  • the width of the step was 2.5 cm and the depth was 0.1 mm; the width of the upper opening of the formed antenna groove was 5 mm, and the
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • step (6) the amount of hydrochloric acid in an amount of 900 g and 37% by weight of ferric chloride hexahydrate was measured at 25 ° C using an etching solution (in terms of 1 L of etching liquid). 150 ml, the balance being water) was etched in the thickness direction for 15 min to remove the 0.05 mm aluminum alloy layer, and a step was obtained.
  • a cross-sectional structural view of the aluminum alloy casing after removing the ink layer corresponding to the step pattern portion and the hard anodized layer, and a cross-sectional structure of the aluminum alloy casing obtained by removing a portion of the aluminum alloy layer in the thickness direction The schematic diagram, the schematic diagram of the cross-sectional structure of the aluminum alloy casing after the laser engraving antenna slot slit in the step, the ink corresponding to the slot of the antenna slot, the cross-sectional structure of the aluminum alloy casing after removing the ink layer, and the ink layer after forming the ink layer
  • a picture of the aluminum alloy case, a picture of the aluminum alloy case after the laser-engraved step pattern, a picture of the aluminum alloy case after etching the step, and a picture of the aluminum alloy case after the laser-cut antenna groove slit are all the same as in the first embodiment.
  • the formed step has a width of 2.5 cm and a depth of 0.05 mm; the width of the upper opening of the formed antenna groove is 6 mm
  • the method of the embodiment has an invisible appearance of the antenna groove formed in the aluminum alloy casing, the surface layer of the aluminum alloy casing has not been damaged, and the appearance surface is neat and smooth, and the appearance and continuity of the appearance of the body can be maintained, and The overall metal texture of the fuselage is not destroyed.
  • the width of the upper opening and the lower opening of the antenna slot the better the firmness and hardness of the aluminum alloy casing. Comparing Example 1 with Example 4-5, respectively, in step (6), after removing part of the aluminum alloy layer, the thickness of the remaining aluminum alloy layer can be significantly reduced when the thickness of the aluminum alloy layer is 20-40% of the total thickness of the aluminum alloy layer.
  • the width of the upper opening and the lower opening of the antenna groove formed by etching can significantly improve the firmness and hardness of the aluminum alloy casing.
  • the aluminum alloy shells prepared in Examples 1-5 were subjected to signal shielding test by: conducting a conductive position in each part of the laser separated by an antenna slot that is not visible in appearance, and measuring two conductive positions. Conductivity between. Implementation The measurement results corresponding to Examples 1-5 are all non-conductive. Therefore, it is understood that the method of the present disclosure maintains the appearance and continuity of the appearance of the metal casing of the electronic product, and the metal texture of the entire metal casing of the electronic product is not destroyed. It solves the signal shielding problem of the metal shell body of electronic products.

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Abstract

一种形成有天线槽（5）的电子产品金属壳体及其制备方法，所述电子产品金属壳体包括金属层（3）和硬质阳极氧化层（1），硬质阳极氧化层（1）包裹在金属层（3）的表面，电子产品金属壳体的第一面形成有台阶（4），在厚度方向上台阶（4）贯穿电子产品金属壳体的第一面硬质阳极氧化层（1）和部分金属层（3），天线槽（5）位于台阶（4）内并在厚度方向上贯穿剩余金属层（3），并使得第二面硬质阳极氧化层（1）的内侧暴露，且天线槽（5）中填充有非导电材料。

Description

形成有天线槽的电子产品金属壳体及其制备方法
相关申请的交叉引用
本申请主张在2014年12月26日在中国提交的中国专利申请号No.201410837112.2的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及电子产品制备领域，具体地，涉及一种形成有天线槽的电子产品金属壳体及其制备方法。
背景技术
目前，为解决机身信号屏蔽问题，电子产品如金属手机多采用在手机后盖上开天线槽并注塑的方法，如HTC ONE的上下两条天线槽，iphone5/5s的侧边天线槽等。但是，前述通过在电子产品金属壳体(如金属手机后盖)上开天线槽并注塑的方法对电子产品金属壳体(如金属手机机身)整体结构造成了一定破坏，影响了其外观的整洁性及连续性。同时，电子产品金属壳体(如手机后盖)可见的塑胶也破坏了机身整体的金属质感。
发明内容
本公开的目的是为了克服现有技术的在电子产品金属壳体上开天线槽并注塑的方法影响电子产品金属壳体外观的整洁性及连续性，并破坏电子产品金属壳体整体的金属质感的缺陷，提供一种形成有天线槽的电子产品金属壳体及其制备方法，本公开的电子产品金属壳体中形成的天线槽外观不可见，保证了电子产品金属壳体外观的整洁性及连续性，并使得电子产品金属壳体整体的金属质感不被破坏。
因此，为了实现上述目的，第一方面，本公开提供了一种形成有天线槽的电子产品金属壳体，所述电子产品金属壳体包括金属层和硬质阳极氧化层，所述硬质阳极氧化层包裹在所述金属层的表面，所述电子产品金属壳体的第一面形成有台阶，在厚度方向上所述台阶贯穿所述电子产品金属壳体的第一面硬质阳极氧化层和部分金属层，所述天线槽位于所述台阶内并在厚度方向上贯穿剩余金属层，并使得第二面硬质阳极氧化层的内侧暴露，且所述天线槽中填充有非导电材料。
第二方面，本公开提供了一种制备形成有天线槽的电子产品金属壳体的方法，所述方法包括以下步骤：
(1)将金属层依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成硬质阳极氧化层和油墨层；
(2)先在经步骤(1)处理所得产品的第一面形成台阶，使得在厚度方向上所述台阶贯穿所述产品的第一面硬质阳极氧化层和部分金属层，然后在所述台阶内形成天线槽，使得所述天线槽在厚度方向上贯穿剩余金属层，并使得第二面硬质阳极氧化层的内侧暴露；
(3)去除经步骤(2)处理所得产品表面上的油墨层，并在所述天线槽中填充非导电材料。
第三方面，本公开提供了上述方法制备得到的电子产品金属壳体。
本公开的电子产品金属壳体中形成的天线槽外观不可见，电子产品金属壳体的外观面表层未曾遭到破坏，外观面整洁光滑，能够保持电子产品金属壳体外观的整洁性及连续性，并使得电子产品金属壳体整体的金属质感不被破坏。
本公开的其它特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
图1是本公开实施例1中去除台阶图案部位对应的油墨层和硬质阳极氧化层后的铝合金壳体的剖面结构示意图；
图2是本公开实施例1中在厚度方向上去除部分铝合金层得到台阶后的铝合金壳体的剖面结构示意图；
图3是本公开实施例1中在台阶内镭雕天线槽狭缝、去除天线槽狭缝对应的油墨后的铝合金壳体的剖面结构示意图；
图4是本公开实施例1中去除油墨层后的铝合金壳体的剖面结构示意图；
图5是本公开实施例1中形成油墨层后的铝合金壳体的图片；
图6是本公开实施例1中镭雕台阶图案后的铝合金壳体的图片；
图7是本公开实施例1中蚀刻台阶后的铝合金壳体的图片；以及
图8是本公开实施例1中镭雕天线槽狭缝后的铝合金壳体的图片。
具体实施方式
以下对本公开的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本公开，并不用于限制本公开。
第一方面，本公开提供了一种形成有天线槽的电子产品金属壳体，所述电子产品金属壳体包括金属层3和硬质阳极氧化层1，硬质阳极氧化层1包裹在金属层的表面，电子产 品金属壳体的第一面形成有台阶4，在厚度方向上台阶贯穿电子产品金属壳体的第一面硬质阳极氧化层和部分金属层，天线槽5位于台阶内并在厚度方向上贯穿剩余金属层，并使得第二面硬质阳极氧化层的内侧暴露，且天线槽中填充有非导电材料。
本公开的电子产品金属壳体中，可选地，台阶4可以为宽度为1.0-5.0cm、深度可以为0.1-0.8mm的凹槽，例如凹槽的深度为0.3-0.5mm。
本公开的电子产品金属壳体中，可选地，以电子产品金属壳体的第一面所对应的天线槽5的开口为上部开口，天线槽5的剖面结构为上部开口大下部开口小的梯形结构，且上部开口的宽度为2-5mm，例如为2-3mm；下部开口的宽度为0.8-1.4mm，例如为0.8-1.2mm。
本公开的电子产品金属壳体中，可选地，金属层3的厚度可以为0.5-1.5mm，例如为0.5-0.6mm；硬质阳极氧化层1的厚度可以为0.02-0.06mm，例如为0.04-0.06mm。
本公开的电子产品金属壳体中，可选地，金属层3可以为铝合金层。
本公开的电子产品金属壳体中，可选地，电子产品金属壳体可以为手机金属外壳或平板电脑金属外壳。
第二方面，本公开提供了一种制备形成有天线槽的电子产品金属壳体的方法，所述方法包括以下步骤：
(1)将金属层依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成硬质阳极氧化层和油墨层；
(2)先在经步骤(1)处理所得产品的第一面形成台阶，使得在厚度方向上台阶贯穿所述产品的第一面硬质阳极氧化层和部分金属层，然后在台阶内形成天线槽，使得天线槽在厚度方向上贯穿剩余金属层，并使得第二面硬质阳极氧化层的内侧暴露；
(3)去除经步骤(2)处理所得产品表面上的油墨层，并在天线槽中填充非导电材料。
本公开的方法中，对于硬质阳极氧化处理的方法没有特别的限定，可以为本领域常用的各种硬质阳极氧化处理方法。可选地，步骤(1)中，硬质阳极氧化处理的方法包括依次对金属层进行碱蚀处理、出光处理、氧化处理和封孔处理，并在每种处理后分别进行水洗。对于水洗的方法没有特别的限定，可以为本领域常用的各种水洗方法，例如可以为用去离子水清洗2-3次。
本公开的方法中，对于碱蚀处理的条件没有特别的限定，可以为本领域常用的各种碱蚀处理条件。可选地，碱蚀处理的条件包括：温度为50-70℃，时间为1-2min，碱蚀液的浓度为30-60g/L，碱蚀液为氢氧化钠溶液、氢氧化钾溶液和氢氧化锂溶液中的一种或多种。
本公开的方法中，对于出光处理的条件没有特别的限定，可以为本领域常用的各种出光处理的条件。可选地，，出光处理的条件包括：温度为20-30℃，时间为1-3min，出光液 为硝酸水溶液，且以1L出光液计，硝酸的含量为130-270g(即相当于65-68重量％的浓硝酸的量为200-400mL)。
本公开的方法中，对于氧化处理的条件没有特别的限定，可以为本领域常用的各种氧化处理的条件。可选地，，氧化处理的条件包括：温度为5-12℃，时间为30-50min，脉冲波型为正向方波脉冲，占空比为50-90％，频率为500-1000Hz，电流密度为2-7A/dm2，氧化液为含有硫酸、草酸/苹果酸的水溶液，以1L氧化液计，硫酸的含量为120-220g，草酸或苹果酸的含量为8-20g。其中，氧化液为含有硫酸、草酸/苹果酸的水溶液是指氧化液为含有硫酸和草酸的水溶液或者氧化液为含有硫酸和苹果酸的水溶液。
本公开的方法中，对于封孔处理的条件没有特别的限定，可以为本领域常用的各种封孔处理的条件。可选地，封孔处理的条件包括：温度为20-30℃，时间为2-3min。可选地，封孔剂为无镍封孔剂、微量镍封孔剂和无重金属封孔剂中的一种或多种。本领域技术人员应该理解的是，封孔处理后进行水洗，在水洗后进行吹干即可形成硬质阳极氧化层。对于吹干的方式没有特别的限定，可以为本领域常用的各种方式，例如可以用无油压缩气体吹干，温度为20-30℃，时间为5-10min，此为本领域技术人员所公知，在此不再赘述。
本公开的方法中，可选地，在经过硬质阳极氧化处理后的产品的第二面和第一面均形成油墨层2。
本公开的方法中，对于油墨喷涂处理的方式没有特别的限定，可以为本领域常用的各种油墨喷涂处理方式。可选地，油墨喷涂处理的方式包括：喷涂UV油墨形成厚度为40-60um的油墨层，然后在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min。
本公开的方法中，本领域技术人员应该理解的是，电子产品金属壳体的第二面是指组装为成品电子产品时露在空气中的电子产品金属壳体的一面，第一面则是与第二面相对的一面。
本公开的方法中，可选地，步骤(2)中，形成台阶的过程包括：在经步骤(1)处理所得产品的第一面形成台阶图案，以去除台阶图案部位对应的油墨层和硬质阳极氧化层，并在厚度方向上去除部分金属层，得到台阶。
本公开的方法中，为了减少对电子产品金属壳体结构的破坏，保证电子产品金属壳体的第二面不会出现凸痕，进一步提高牢固度及硬度，可选地，去除部分金属层后，剩余的金属层的厚度为金属层总厚度的20-80％，例如为20-40％。
本公开的方法中，可选地，形成的台阶为宽度为1.0-5.0cm、深度为0.1-0.8mm的凹槽，例如凹槽的深度为0.3-0.5mm。
本公开的方法中，可选地，通过镭雕在经步骤(1)处理所得产品的第一面形成台阶 图案。对于镭雕台阶图案的方法没有特别的限定，可以为本领域常用的各种镭雕方法，例如可以用镭雕机进行镭雕，此为本领域技术人员所公知，在此不再赘述。
本公开的方法中，可选地，通过蚀刻在厚度方向上去除部分金属。对于蚀刻的条件没有特别的限定，可以为本领域常用的各种蚀刻条件。可选地，蚀刻液为酸性蚀刻液。对于酸性蚀刻液没有特别的限定，可以为本领域常用的各种酸性蚀刻液，例如可以为三氯化铁类酸性蚀刻液、氯化铜类酸性蚀刻液或盐酸类酸性蚀刻液等。可选地，蚀刻的条件包括：温度为20-30℃，时间为30-40min，蚀刻液为含有三氯化铁和盐酸的水溶液，以1L蚀刻液计，三氯化铁的含量为800-1000g，盐酸的含量为35-75g(即相当于36-38重量％的盐酸的量为100-200mL)。本领域技术人员应该理解的是，蚀刻的时间应与去除的部分金属层的厚度有关，去除的部分金属层的厚度越大，则蚀刻的时间应越长，反之，去除的部分金属层的厚度越小，则蚀刻的时间应越短。
本公开的方法中，可选地，步骤(2)中，形成天线槽的过程包括：在台阶部位喷涂油墨，并在台阶内形成天线槽狭缝以去除天线槽狭缝对应的油墨，然后去除天线槽狭缝对应的金属层，直至使第二面硬质阳极氧化层的内侧暴露。
本公开的方法中，步骤(2)中，对于喷涂油墨的方式没有特别的限定，可以为本领域常用的各种喷涂油墨的方式。可选地，步骤(2)中，喷涂油墨的方式包括：喷涂UV油墨形成厚度为30-60um的油墨层，然后在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min。
本公开的方法中，可选地，步骤(2)中，形成的天线槽狭缝的宽度为0.02-0.1mm。
本公开的方法中，可选地，步骤(2)中，通过蚀刻去除天线槽狭缝对应的金属层，蚀刻的条件包括：温度为20-30℃，时间为30-40min，蚀刻液为含有三氯化铁和盐酸的水溶液，以1L蚀刻液计，三氯化铁的含量为800-1000g，盐酸的含量为35-75g。
本公开的方法中，金属层中可能会含有其他的金属杂质，如铜、锰等。因此，本公开的方法还可以包括在每次蚀刻后进行水洗，在水洗后进行剥黑膜，去除裸露的黑色杂质层，并再次进行水洗。对于水洗的方法没有特别的限定，可以为本领域常用的各种水洗方法，例如可以为用去离子水清洗2-3次。
本公开的方法中，以电子产品金属壳体的第一面所对应的天线槽的开口为上部开口，天线槽的剖面结构为上部开口大下部开口小的梯形结构。其中，当去除部分金属层后，剩余的金属层的厚度为金属层总厚度的20-80％时，经蚀刻后形成的天线槽的上部开口的宽度为2-5mm，下部开口的宽度为0.8-1.4mm；当去除部分金属层后，剩余的金属层的厚度为金属层总厚度的20-40％时，经蚀刻后形成的天线槽的上部开口的宽度为2-3mm，下部开口 的宽度为0.8-1.2mm。
本公开的方法中，本领域技术人员应该理解的是，去除的油墨层为电子产品金属外壳表面上的所有油墨层。对于去除油墨层的方式没有特别的限定，可以为本领域常用的各种脱漆方式，只要能够去除油墨层即可。可选地，去除油墨层的方式为用中性脱漆剂去除油墨层。对于中性脱漆剂没有特别的限定，可以为本领域常用的各种中性脱漆剂，例如可以为普通溶剂型脱漆剂、氯化烃类脱漆剂和水性脱漆剂中的一种或多种。
本领域技术人员应该理解的是，本公开的方法还可以包括在去除油墨层之后、在填充非导电材料之前进行水洗并烘干。对于烘干的方法没有特别的限定，可以为本领域常用的烘干方法，例如，烘干的条件包括：温度为80-120℃，时间为5-10min。
可选地，对于填充非导电材料的方法和非导电材料没有特别的限定，可以分别为本领域常用的各种填充非导电材料方法和非导电材料。可选地，非导电材料为UV胶水、热固化胶水和常温硬化胶中的一种或多种。
本公开的方法中，为了美化制备得到的电子产品金属壳体的外观，也可以在台阶部位填充非导电材料。
本公开的方法中，可选地，金属层为铝合金层。
本公开的方法中，可选地，电子产品金属壳体为手机金属外壳或平板电脑金属外壳。
第三方面，本公开提供了上述方法制备得到的电子产品金属壳体。
实施例
以下的实施例将对本公开作进一步的说明，但并不因此限制本公开。
以下实施例中，0.5mm厚的5系铝材购自福建省南平铝业有限公司。
无镍封孔剂、微量镍封孔剂和无重金属封孔剂均购自深圳欧得美科技有限公司。
氯化烃溶剂脱漆剂购自东莞市四辉表面处理科技有限公司。
UV胶水购自日本爱赛克公司(ASEC)，型号为AS-210604C。
镭雕机购自深圳市光大激光技术有限公司，型号为FM20D。
实施例1
本实施例用于说明本公开的形成有天线槽的手机铝合金壳体及其制备方法。
(1)碱蚀处理：将铝合金层3厚度为0.5mm的5系铝材切割成5cm*3.5cm的铝合金片，60℃下，将铝合金片在浓度为40g/L的氢氧化钠溶液中碱蚀1.5min，然后去离子水清洗2次；
(2)出光处理：25℃下，将步骤(1)得到的铝合金片在出光液(以1L出光液计，65重量％的浓硝酸的量为300ml)中出光2min，然后用去离子水清洗2次；
(3)氧化处理：将步骤(2)得到的铝合金片放入氧化槽中，其中，10℃下，采用正向方波脉冲，占空比为80％，频率为800Hz，电流密度为5A/dm2，将氧化槽中的铝合金片通电硬质氧化40min(以1L氧化液计，98重量％的硫酸的量为200g，草酸的量为15g，余量为水)，然后用去离子水清洗2次；
(4)封孔处理：25℃下用无镍封孔剂将步骤(3)得到的铝合金片封孔2.5min，然后用去离子水清洗2次，25℃下用无油压缩气体吹干，形成厚度为35μm的硬质阳极氧化层1；
(5)油墨喷涂处理：在步骤(4)得到的铝合金片表面喷涂UV油墨形成厚度为50μm的油墨层2，然后在115℃下烘烤25min，并在紫外线下曝光1.5min；
(6)在步骤(5)得到的铝合金片的第一面用镭雕机镭雕台阶图案，以去除台阶图案部位对应的油墨层和硬质阳极氧化层，并在25℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为900g、37重量％的盐酸的量为150ml，余量为水)在厚度方向上蚀刻45min以去除0.3mm的铝合金层，得到宽度为2.5cm、深度为0.3mm的台阶4，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次；
(7)在台阶部位喷涂UV油墨形成厚度为40um的油墨层，然后在115℃下烘烤25min，并在紫外线下曝光1.5min，接着在台阶内镭雕宽度为0.06mm的天线槽狭缝以去除天线槽狭缝对应的油墨，然后在25℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为900g、37重量％的盐酸的量为150ml，余量为水)蚀刻狭缝对应部位的铝合金层35min，观察发现第二面的硬质阳极氧化层的内侧已全部露出，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次，得到剖面结构为上部开口大下部开口小的梯形结构的天线槽5，上部开口的宽度为3mm，下部开口的宽度为1.2mm；
(8)用氯化烃溶剂脱漆剂脱漆去除铝合金手机后盖表面上的油墨层，用去离子水清洗2次，100℃下烘烤7min；
(9)使用UV胶水对天线槽进行填胶处理将天线槽充实。
本实施例中，去除台阶图案部位对应的油墨层和硬质阳极氧化层后的铝合金壳体的剖面结构示意图如图1所示，在厚度方向上去除部分铝合金层得到台阶后的铝合金壳体的剖面结构示意图如图2所示，在台阶内镭雕天线槽狭缝、去除天线槽狭缝对应的油墨后的铝合金壳体的剖面结构示意图如图3所示，去除油墨层后的铝合金壳体的剖面结构示意图如图4所示，形成油墨层后的铝合金壳体的图片如图5所示，镭雕台阶图案后的铝合金壳体的图片如图6所示，蚀刻台阶后的铝合金壳体的图片如图7所示，镭雕天线槽狭缝后的铝 合金壳体的图片如图8所示。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例2
本实施例用于说明本公开的形成有天线槽的手机铝合金壳体及其制备方法。
(1)碱蚀处理：将铝合金层3厚度为0.5mm的5系铝材切割成5cm*3.5cm的铝合金片，50℃下，将铝合金片在浓度为30g/L的氢氧化钾溶液中碱蚀2min，然后去离子水清洗2次；
(2)出光处理：20℃下，将步骤(1)得到的铝合金片在出光液(以1L出光液计，65重量％的浓硝酸的量为400ml)中出光1min，然后用去离子水清洗2次；
(3)氧化处理：将步骤(2)得到的铝合金片放入氧化槽中，其中，5℃下，采用正向方波脉冲，占空比为50％，频率为500Hz，电流密度为2A/dm2，将氧化槽中的铝合金片通电硬质氧化50min(以1L氧化液计，98重量％的硫酸的量为220g，草酸的量为20g，余量为水)，然后用去离子水清洗2次；
(4)封孔处理：20℃下用微量镍封孔剂将步骤(3)得到的铝合金片封孔3min，然后用去离子水清洗2次，25℃下用无油压缩气体吹干，形成厚度为40μm的硬质阳极氧化层1；
(5)油墨喷涂处理：在步骤(4)得到的铝合金片表面喷涂UV油墨形成厚度为40μm的油墨层2，然后在110℃下烘烤30min，并在紫外线下曝光1min；
(6)在步骤(5)得到的铝合金片的第一面用镭雕机镭雕台阶图案，以去除台阶图案部位对应的油墨层和硬质阳极氧化层，并在20℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为800g、37重量％的盐酸的量为100ml，余量为水)在厚度方向上蚀刻50min以去除0.4mm的铝合金层，得到宽度为2.5cm、深度为0.4mm的台阶4，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次；
(7)在台阶部位喷涂UV油墨形成厚度为30μm的油墨层，然后在110℃下烘烤30min，并在紫外线下曝光1min，接着在台阶内镭雕宽度为0.02mm的天线槽狭缝以去除天线槽狭缝对应的油墨，然后在20℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为800g、37重量％的盐酸的量为100ml，余量为水)蚀刻狭缝对应部位的铝合金层40min，观察发现第二面的硬质阳极氧化层的内侧已全部露出，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次，得到剖面结构为上部开口大下部开口小的梯形结构 的天线槽5，上部开口的宽度为2mm，下部开口的宽度为0.8mm；
(8)用氯化烃溶剂脱漆剂脱漆去除铝合金手机后盖表面上的油墨层，用去离子水清洗2次，80℃下烘烤10min；
(9)使用UV胶水对天线槽进行填胶处理将天线槽充实。
本实施例中，去除台阶图案部位对应的油墨层和硬质阳极氧化层后的铝合金壳体的剖面结构示意图、在厚度方向上去除部分铝合金层得到台阶后的铝合金壳体的剖面结构示意图、在台阶内镭雕天线槽狭缝、去除天线槽狭缝对应的油墨后的铝合金壳体的剖面结构示意图、去除油墨层后的铝合金壳体的剖面结构示意图、形成油墨层后的铝合金壳体的图片、镭雕台阶图案后的铝合金壳体的图片、蚀刻台阶后的铝合金壳体的图片和镭雕天线槽狭缝后的铝合金壳体的图片均与实施例1相一致。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例3
本实施例用于说明本公开的形成有天线槽的平板电脑铝合金壳体及其制备方法。
(1)碱蚀处理：将铝合金层3厚度为0.5mm的5系铝材切割成5cm*3.5cm的铝合金片，70℃下，将铝合金片在浓度为60g/L的氢氧化钾溶液中碱蚀1min，然后去离子水清洗2次；
(2)出光处理：30℃下，将步骤(1)得到的铝合金片在出光液(以1L出光液计，65重量％的浓硝酸的量为200ml)中出光3min，然后用去离子水清洗2次；
(3)氧化处理：将步骤(2)得到的铝合金片放入氧化槽中，其中，12℃下，采用正向方波脉冲，占空比为90％，频率为1000Hz，电流密度为7A/dm2，将氧化槽中的铝合金片通电硬质氧化30min(以1L氧化液计，98重量％的硫酸的量为120g，草酸的量为8g，余量为水)，然后用去离子水清洗2次；
(4)封孔处理：30℃下用微量镍封孔剂将步骤(3)得到的铝合金片封孔2min，然后用去离子水清洗2次，25℃下用无油压缩气体吹干，形成厚度为50μm的硬质阳极氧化层1；
(5)油墨喷涂处理：在步骤(4)得到的铝合金片表面喷涂UV油墨形成厚度为60μm的油墨层2，然后在120℃下烘烤20min，并在紫外线下曝光2min；
(6)在步骤(5)得到的铝合金片的第一面用镭雕机镭雕台阶图案，以去除台阶图案部位对应的油墨层和硬质阳极氧化层，并在30℃下，用蚀刻液(以1L蚀刻液计，六水合 三氯化铁的量为1000g、37重量％的盐酸的量为200ml，余量为水)在厚度方向上蚀刻40min以去除0.35mm的铝合金层，得到宽度为2.5cm、深度为0.35mm的台阶4，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次；
(7)在台阶部位喷涂UV油墨形成厚度为60μm的油墨层，然后在120℃下烘烤20min，并在紫外线下曝光2min，接着在台阶内镭雕宽度为0.1mm的天线槽狭缝以去除天线槽狭缝对应的油墨，然后在30℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为1000g、37重量％的盐酸的量为200ml，余量为水)蚀刻狭缝对应部位的铝合金层30min，观察发现第二面的硬质阳极氧化层的内侧已全部露出，然后用去离子水清洗2次，并剥除裸露的黑色杂质层，再用去离子水清洗2次，得到剖面结构为上部开口大下部开口小的梯形结构的天线槽5，上部开口的宽度为2.5mm，下部开口的宽度为1.0mm；
(8)用氯化烃溶剂脱漆剂脱漆去除铝合金手机后盖表面上的油墨层，用去离子水清洗2次，120℃下烘烤5min；
(9)使用UV胶水对天线槽进行填胶处理将天线槽充实。
本实施例中，去除台阶图案部位对应的油墨层和硬质阳极氧化层后的铝合金壳体的剖面结构示意图、在厚度方向上去除部分铝合金层得到台阶后的铝合金壳体的剖面结构示意图、在台阶内镭雕天线槽狭缝、去除天线槽狭缝对应的油墨后的铝合金壳体的剖面结构示意图、去除油墨层后的铝合金壳体的剖面结构示意图、形成油墨层后的铝合金壳体的图片、镭雕台阶图案后的铝合金壳体的图片、蚀刻台阶后的铝合金壳体的图片和镭雕天线槽狭缝后的铝合金壳体的图片均与实施例1相一致。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例4
按照实施例1的方法，不同的是，步骤(6)中，在25℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为900g、37重量％的盐酸的量为150ml，余量为水)在厚度方向上蚀刻20min以去除0.1mm的铝合金层，得到台阶。
本实施例中，去除台阶图案部位对应的油墨层和硬质阳极氧化层后的铝合金壳体的剖面结构示意图、在厚度方向上去除部分铝合金层得到台阶后的铝合金壳体的剖面结构示意图、在台阶内镭雕天线槽狭缝、去除天线槽狭缝对应的油墨后的铝合金壳体的剖面结构示意图、去除油墨层后的铝合金壳体的剖面结构示意图、形成油墨层后的铝合金壳体的图片、 镭雕台阶图案后的铝合金壳体的图片、蚀刻台阶后的铝合金壳体的图片和镭雕天线槽狭缝后的铝合金壳体的图片均与实施例1相一致，其中，形成的台阶的宽度为2.5cm、深度为0.1mm；形成的天线槽的上部开口的宽度为5mm，下部开口的宽度为1.4mm。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
实施例5
按照实施例1的方法，不同的是，步骤(6)中，在25℃下，用蚀刻液(以1L蚀刻液计，六水合三氯化铁的量为900g、37重量％的盐酸的量为150ml，余量为水)在厚度方向上蚀刻15min以去除0.05mm的铝合金层，得到台阶。
本实施例中，去除台阶图案部位对应的油墨层和硬质阳极氧化层后的铝合金壳体的剖面结构示意图、在厚度方向上去除部分铝合金层得到台阶后的铝合金壳体的剖面结构示意图、在台阶内镭雕天线槽狭缝、去除天线槽狭缝对应的油墨后的铝合金壳体的剖面结构示意图、去除油墨层后的铝合金壳体的剖面结构示意图、形成油墨层后的铝合金壳体的图片、镭雕台阶图案后的铝合金壳体的图片、蚀刻台阶后的铝合金壳体的图片和镭雕天线槽狭缝后的铝合金壳体的图片均与实施例1相一致，其中，形成的台阶的宽度为2.5cm、深度为0.05mm；形成的天线槽的上部开口的宽度为6mm，下部开口的宽度为1.6mm。
本实施例的方法在铝合金壳体中形成的天线槽外观不可见，铝合金壳体外观面表层未曾遭到破坏，外观面整洁光滑，能够保持机身外观的整洁性及连续性，并使得机身整体的金属质感不被破坏。
本领域技术人员应公知的是，天线槽的上部开口和下部开口的宽度越小，铝合金壳体的牢固度及硬度越好。将实施例1分别与实施例4-5比较可知，步骤(6)中，去除部分铝合金层后，剩余的铝合金层的厚度为铝合金层总厚度的20-40％时，能够明显降低经蚀刻后形成的天线槽的上部开口和下部开口的宽度，从而能够明显提高铝合金壳体的牢固度及硬度。
试验例
将实施例1-5制备得到的铝合金壳体进行信号屏蔽测试，测试方法为：在被外观不可见的天线槽完全隔开的两部分各镭雕出一个导电位，测定两个导电位之间的导电性。实施 例1-5对应的测定结果均为不导电，因此可知，本公开的方法在保持电子产品金属壳体外观的整洁性及连续性，使电子产品金属壳体整体的金属质感不被破坏的同时，很好地解决了电子产品金属壳体机身的信号屏蔽问题。
以上详细描述了本公开的优选实施方式，但是，本公开并不限于上述实施方式中的具体细节，在本公开的技术构思范围内，可以对本公开的技术方案进行多种简单变型，这些简单变型均属于本公开的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本公开对各种可能的组合方式不再另行说明。
此外，本公开的各种不同的实施方式之间也可以进行任意组合，只要其不违背本公开的思想，其同样应当视为本公开所公开的内容。

Claims (21)

  1. 一种形成有天线槽的电子产品金属壳体，其中所述电子产品金属壳体包括金属层和硬质阳极氧化层，所述硬质阳极氧化层包裹在所述金属层的表面，所述电子产品金属壳体的第一面形成有台阶，在厚度方向上所述台阶贯穿所述电子产品金属壳体的第一面硬质阳极氧化层和部分金属层，所述天线槽位于所述台阶内并在厚度方向上贯穿剩余金属层，并使得第二面硬质阳极氧化层的内侧暴露，且所述天线槽中填充有非导电材料。
  2. 根据权利要求1所述的电子产品金属壳体，其中所述台阶为宽度为1.0-5.0cm、深度为0.1-0.8mm的凹槽，优选地，凹槽的深度为0.3-0.5mm。
  3. 根据权利要求1或2所述的电子产品金属壳体，其中以所述电子产品金属壳体的第一面所对应的天线槽的开口为上部开口，所述天线槽的剖面结构为上部开口大下部开口小的梯形结构，且上部开口的宽度为2-5mm，优选为2-3mm；下部开口的宽度为0.8-1.4mm，优选为0.8-1.2mm。
  4. 根据权利要求1-3任一项所述的电子产品金属壳体，其中所述金属层的厚度为0.5-1.5mm，所述硬质阳极氧化层的厚度为0.02-0.06mm。
  5. 根据权利要求1-4任一项所述的电子产品金属壳体，其中所述金属层为铝合金层。
  6. 根据权利要求1-5任一项所述的电子产品金属壳体，其中所述电子产品金属壳体为手机金属外壳或平板电脑金属外壳。
  7. 一种形成有天线槽的电子产品金属壳体的制备方法，包括以下步骤：
    (1)将金属层依次进行硬质阳极氧化处理和油墨喷涂处理，以分别形成硬质阳极氧化层和油墨层；
    (2)先在经步骤(1)处理所得产品的第一面形成台阶，使得在厚度方向上所述台阶贯穿所述产品的第一面硬质阳极氧化层和部分金属层，然后在所述台阶内形成天线槽，使得所述天线槽在厚度方向上贯穿剩余金属层，并使得第二面硬质阳极氧化层的内侧暴露； 以及
    (3)去除经步骤(2)处理所得产品表面上的油墨层，并在所述天线槽中填充非导电材料。
  8. 根据权利要求7所述的方法，其中步骤(2)中，形成台阶的过程包括：在经步骤(1)处理所得产品的第一面形成台阶图案，以去除台阶图案部位对应的油墨层和硬质阳极氧化层，并在厚度方向上去除部分金属层，得到台阶。
  9. 根据权利要求8所述的方法，其中去除部分金属层后，剩余的金属层的厚度为金属层总厚度的20-80％，优选为20-40％。
  10. 根据权利要求8所述的方法，其中通过蚀刻在厚度方向上去除部分金属层，所述蚀刻的条件包括：温度为20-30℃，时间为40-50min，蚀刻液为含有三氯化铁和盐酸的水溶液，以1L蚀刻液计，三氯化铁的含量为800-1000g，盐酸的含量为35-75g。
  11. 根据权利要求7-10任一项所述的方法，其中步骤(2)中，形成天线槽的过程包括：在台阶部位喷涂油墨，并在台阶内形成天线槽狭缝以去除天线槽狭缝对应的油墨，然后去除天线槽狭缝对应的金属层，直至使第二面硬质阳极氧化层的内侧暴露。
  12. 根据权利要求11所述的方法，其中所述喷涂油墨的方式包括：喷涂UV油墨形成厚度为30-60μm的油墨层，然后在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min。
  13. 根据权利要求11所述的方法，其中所述形成的天线槽狭缝的宽度为0.02-0.1mm。
  14. 根据权利要求11所述的方法，其中通过蚀刻去除天线槽狭缝对应的金属层，所述蚀刻的条件包括：温度为20-30℃，时间为30-40min，蚀刻液为含有三氯化铁和盐酸的水溶液，以1L蚀刻液计，三氯化铁的含量为800-1000g，盐酸的含量为35-75g。
  15. 根据权利要求7-14中任意一项所述的方法，其中步骤(1)中，所述硬质阳极氧化处理的方法包括依次对电子产品金属壳体进行碱蚀处理、出光处理、氧化处理和封孔处理，并在每种处理后分别进行水洗；优选地，所述氧化处理的条件包括：温度为5-12℃， 时间为30-50min，脉冲波型为正向方波脉冲，占空比为50-90％，频率为500-1000Hz，电流密度为2-7A/dm2，氧化液为含有硫酸、草酸/苹果酸的水溶液，以1L氧化液计，硫酸的含量为120-220g，草酸或苹果酸的含量为8-20g。
  16. 根据权利要求7-15中任意一项所述的方法，其中步骤(1)中，所述油墨喷涂处理的方式包括：喷涂UV油墨形成厚度为40-60um的油墨层，然后在110-120℃下烘烤20-30min，并在紫外线下曝光1-2min。
  17. 根据权利要求7-16中任意一项所述的方法，其中步骤(3)中，去除油墨层的方式为用中性脱漆剂去除油墨层。
  18. 根据权利要求7-17中任意一项所述的方法，其中步骤(3)中，所述非导电材料为UV胶水、热固化胶水和常温硬化胶中的一种或多种。
  19. 根据权利要求7-18中任意一项所述的方法，其中所述金属层为铝合金层。
  20. 根据权利要求7-19中任意一项所述的方法，其中电子产品金属壳体为手机金属外壳或平板电脑金属外壳。
  21. 权利要求7-20中任意一项所述方法制备得到的电子产品金属壳体。
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EP3240377A1 (en) 2017-11-01

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