WO2016101496A1 - 盖板与触控感应薄膜贴合的方法和触摸屏 - Google Patents

盖板与触控感应薄膜贴合的方法和触摸屏 Download PDF

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Publication number
WO2016101496A1
WO2016101496A1 PCT/CN2015/078764 CN2015078764W WO2016101496A1 WO 2016101496 A1 WO2016101496 A1 WO 2016101496A1 CN 2015078764 W CN2015078764 W CN 2015078764W WO 2016101496 A1 WO2016101496 A1 WO 2016101496A1
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Prior art keywords
touch
defoaming
touch module
adhesive
cover
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PCT/CN2015/078764
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English (en)
French (fr)
Inventor
罗鸿强
胡明
谢涛峰
许邹明
范文金
许军
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京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Priority to US14/891,933 priority Critical patent/US20160355003A1/en
Publication of WO2016101496A1 publication Critical patent/WO2016101496A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • Embodiments of the present invention relate to the field of touch screen technologies, and in particular, to a method of bonding a cover plate to a touch sensitive film and a touch screen manufactured by the method.
  • capacitive touch screens have been widely used in electronic devices such as mobile phones, multimedia, public information inquiry systems.
  • Traditionally used capacitive touch screens generally have a GG (glass cover + glass cover) structure in which a cover glass and a touch glass are bonded by an Optical Clear Adhesive (OCA).
  • OCA Optical Clear Adhesive
  • GF Glass Cover + Touch Sensing Film
  • GFF Glass Cover + Double Touch Sensing Film
  • OGS Integrated Touch Screen
  • a cover glass and one or two layers of the touch sensing film are bonded by optical adhesive (OCA) or optical clear epoxy (OCR).
  • OCA optical adhesive
  • OCR optical clear epoxy
  • the embodiment of the invention provides a method for bonding a cover plate and a touch sensing film and a touch screen manufactured by the method, which can avoid the formation of water ripple and improve the product excellent rate.
  • a method for bonding a cover to a touch sensitive film includes the following steps:
  • the touch module that has been defoamed is pressed.
  • the touch group is subjected to a defoaming process in a closed defoaming device.
  • the defoaming touch module is subjected to a pressing process by using two flat plates.
  • the step of pressing the defoaming touch module by using two flat plates comprises: utilizing at least one of the two flat plates while pressing together The touch module is heated.
  • the step of heating the touch module by using at least one of the two flat plates during the pressing comprises:
  • the touch panel is pressed with a predetermined pressing pressure using two plates to maintain a certain pressing duration.
  • heating resistor wires are respectively disposed in two of the plates.
  • the predetermined pressing pressure is maintained in the range of 1000 KG-1200 KG, and the predetermined pressing temperature of the flat plate contacting the cover plate is maintained in the range of 70 ° C - 80 ° C, and the touch
  • the predetermined pressing temperature of the plate in contact with the inductive film is maintained in the range of 70 ° C to 80 ° C, and the certain pressing duration is maintained in the range of 10 s to 80 s.
  • the predetermined pressing temperature of the flat plate in contact with the cover plate is higher than the predetermined pressing temperature of the flat plate in contact with the touch sensitive film.
  • the predetermined pressing pressure is maintained in the range of 1000 KG to 1200 KG, and the predetermined pressing temperature of the flat plate in contact with the cover plate is maintained in the range of 75 ° C to 85 ° C, and the touch
  • the predetermined pressing temperature of the plate in contact with the inductive film is maintained in the range of 70 ° C to 80 ° C, and the certain pressing duration is maintained in the range of 10 s to 80 s.
  • the step of performing a defoaming process on the touch module in the closed defoaming device includes:
  • the gas pressure in the defoaming device is maintained at a predetermined defoaming pressure to apply pressure to the touch assembly and maintain a certain heating and pressurization duration.
  • the touch module is defoamed in a closed defoaming device
  • the step of treating further includes maintaining the temperature within the defoaming device at a predetermined defoaming temperature.
  • the predetermined defoaming pressure is set such that the touch module is subjected to a pressure of 5KG-6KG; the predetermined defoaming temperature is in a range of 40° C. to 60° C.; The heating and pressurization duration is in the range of 15 minutes to 45 minutes.
  • the step of bonding the cover plate and the at least one touch sensing film together by an adhesive to form the touch module comprises:
  • At least one layer of the touch sensitive film adhered to the cover plate is attached.
  • the step of bonding the cover plate and the at least one touch sensing film together by an adhesive to form the touch module comprises:
  • the touch sensitive film is attached to the cover.
  • the step of bonding the cover plate and the at least one touch sensing film together by an adhesive to form the touch module comprises:
  • Two or more of the touch sensing films that have been attached are attached to the cover.
  • the touch module after performing the step of pressing the defoaming touch module, the touch module is irradiated with ultraviolet light to cure the adhesive.
  • the adhesive is a transparent adhesive.
  • the transparent adhesive comprises a water gel and/or an optical glue.
  • the transparent adhesive comprises any one of a silicone rubber, an acrylic resin, an unsaturated polyester, a polyurethane, an epoxy resin, or any combination thereof.
  • a touch screen fabricated using the method of any of the above embodiments is provided.
  • the method for bonding a cover plate and a touch sensing film according to the above embodiment of the present invention and the touch screen manufactured by the method can be removed by performing a defoaming process on the touch module and pressing the touch module.
  • Touch module The water ripple inside, thereby improving the product's excellent rate.
  • FIG. 1 is an operational flowchart of a method of bonding a cover plate to a touch sensitive film according to a first exemplary embodiment of the present invention
  • Figures 2a-2f are schematic views showing the operation of the method of Figure 1 in which the upper portion of each of Figures 2a-2c and 2e-2f is a side view and the lower portion is a top view;
  • FIG. 3 is a flow chart showing the operation of a method of bonding a cover to a touch sensitive film according to a second exemplary embodiment of the present invention
  • FIGS. 4a-4f are schematic views showing the operation of the method of Fig. 3, wherein the upper portions of the respective drawings in Figs. 4a-4c and 4e-4f are side views and the lower portion is a plan view.
  • a method for bonding a cover to a touch sensitive film includes the steps of: bonding a cover and at least one touch sensitive film together by an adhesive to form a touch a module; performing a defoaming process on the touch module; and pressing the defoaming touch module. After performing the defoaming process on the touch module, by pressing the touch module, the water ripple in the touch module can be removed, thereby improving the product excellent rate.
  • FIG. 1 is a flow chart showing the operation of a method of bonding a cover sheet to a touch sensitive film according to a first exemplary embodiment of the present invention
  • FIGS. 2a-2f are schematic views showing an operation process of performing the method shown in FIG. 1.
  • 1 and 2 illustrate a touch screen including a cover and a touch sensitive film, wherein the upper portions of the respective figures of Figures 2a-2c and 2e-2f are side views and the lower portion is a top view.
  • a method of laminating according to an exemplary embodiment of the present invention includes the steps of: transparently adhering a cover 1 made of, for example, glass or a transparent resin material to at least one touch sensitive film 2 provided with a touch sensing circuit
  • the mixture 3 is bonded together to form a touch module, as shown in FIG. 2c; the touch module is defoamed in a closed defoaming device (not shown); and two flat plates are utilized.
  • the defoaming touch module is pressed to remove water ripples in the touch module, as shown in Figure 2d.
  • the arrows in the figure indicate the direction in which the pressure is applied through the flat plate 4.
  • the water ripple in the touch module can be removed, thereby improving the product excellent rate.
  • individual bubbles which have not been removed in the defoaming step can also be eliminated by this method, thereby achieving further defoaming.
  • the step of bonding the cover 1 and the at least one touch sensing film 2 through the adhesive 3 to form the touch module comprises: plasma cleaning the cover 1 to cover the cover The oil, dust, water and the like on the bonding surface of 1 are removed, as shown in FIG. 2a; the adhesive 1 is covered on the cover 1, for example, covering the inner side of the frame 11 of the cover 1 and all the display areas, So that the adhesive covers the entire bonding surface of the cover 1 as shown in FIG. 2b; and the touch sensitive film 2 is attached to the cover 1, as shown in FIG. 2c.
  • the touch module is irradiated with the ultraviolet light 10 to cure the adhesive 3, thereby obtaining The touch screen shown in Figure 2f.
  • a method of laminating according to a first exemplary embodiment of the present invention includes the following steps: plasma cleaning the cover 1 as shown in FIG. 2a; Overlying the adhesive 3, as shown in FIG. 2b; attaching the touch sensitive film 2 to the cover 1 as shown in FIG. 2c; and touching the touch in a closed defoaming device (not shown)
  • the module performs defoaming treatment; and the two panels 4 are used to press the defoaming touch module to remove the water ripple in the touch module, as shown in FIG. 2d; and the ultraviolet light 10 is used to illuminate the touch mode.
  • the touch sensing film 2 may include a touch sensing film, or may include two or more touch sensing films that are pre-bonded together.
  • the step of pressing the defoaming touch module with two flat plates 4 to remove water ripples in the touch module includes: utilizing while pressing At least one of the two flat plates 4 having a flat surface and parallel to each other heats the touch module.
  • a large force can be applied to effectively remove the water ripples in the touch module, and by this method, individual bubbles that cannot be removed in the defoaming step can be eliminated, thereby achieving further defoaming.
  • the step of pressing the defoaming touch module with two flat plates 4 to remove the water ripple in the touch module comprises: at least one of the two flat plates 4 Heating to a predetermined pressing temperature
  • the touch module is placed between the two flat plates 4; and the touch panels are pressed with a predetermined pressing pressure by the two flat plates 4 to maintain a certain pressing duration.
  • the pressure, temperature and time of the pressing the water ripple can be effectively removed while maintaining the functions of the cover 1 and the touch sensitive film 2.
  • heating resistor wires are respectively provided in the two flat plates 4, and the heating time can be simply controlled by controlling the voltage applied to the electric resistance wires.
  • the predetermined press pressure is maintained in the range of 1000 kilograms (KG) to 1200 kilograms, and the predetermined pressing temperature of the flat plate 4 in contact with the cover plate 1 (eg, the lower plate in FIG. 2d) is maintained at 70.
  • the predetermined pressing temperature of the flat plate 4 contacting the touch sensing film 2 is maintained in the range of 70 ° C - 80 ° C, and the certain pressing duration is maintained. In the range of 10 seconds (s) - 80 seconds.
  • the predetermined bonding temperature of the flat plate 4 (eg, the lower plate in FIG. 2d) in contact with the cover 1 is higher than the flat plate 4 in contact with the touch sensitive film 2 (eg, in FIG. 2d)
  • the predetermined pressing temperature of the lower plate For example, the predetermined pressing pressure is maintained in the range of 1000 kg to 1200 kg, and the predetermined pressing temperature of the flat plate in contact with the cover plate is maintained in the range of 75 ° C to 85 ° C, and the predetermined pressing of the flat plate in contact with the touch sensing film.
  • the temperature is maintained in the range of 70 °C to 80 °C, and the certain pressurization duration is maintained in the range of 10 seconds to 80 seconds.
  • the touch sensitive film 2 has a small thickness and a thermal expansion rate, and is internally provided with a touch sensing circuit, and the flat plate 4 that contacts the touch sensitive film 2 (for example, the lower plate in FIG. 2d )
  • the lower temperature setting is beneficial to keep the temperature of the adhesive 3 uniform and to maintain the performance of the touch sensing circuit. It is to be understood that the above is only an example, and the present invention is not limited to the specific numerical ranges described above.
  • the step of defoaming the touch module in a closed defoaming device includes: placing the touch module in a defoaming device; and defoaming The gas pressure within the device is maintained at a predetermined defoaming pressure to apply pressure to the touch assembly and maintain a certain duration of heating and pressurization.
  • defoaming process bubbles generated in the touch module due to uneven force and/or uneven heating during the process of attaching the touch sensitive film 2 to the cover 1 can be removed to improve the product. rate.
  • the step of defoaming the touch module in the enclosed defoaming device further comprises maintaining the temperature within the defoaming device at a predetermined defoaming temperature.
  • the predetermined defoaming pressure is set such that the touch module is subjected to a pressure of 5-6 kg; the predetermined defoaming temperature is in the range of 40 ° C to 60 ° C; and the heating and pressurizing duration is 15 minutes. -45 minutes range.
  • the efficiency of removing bubbles can be improved by pressurization and heating.
  • FIG. 3 is an operational flowchart of a method of bonding a cover plate to a touch sensitive film according to a second exemplary embodiment of the present invention
  • FIGS. 4a-4f are schematic views showing an operation process of performing the method shown in FIG.
  • the upper part of each of Figures 4a-4c and 4e-4f is a side view and the lower part is a top view.
  • the step of bonding the cover 1 and the at least one touch sensing film together by an adhesive to form the touch module comprises: performing plasma cleaning on the touch sensing film 2 To remove the oil, dust, water and the like on the bonding surface of the touch sensitive film 2, as shown in FIG. 4a; cover the adhesive 3 on the touch sensitive film 2, as shown in FIG. 4b; The touch sensitive film 2 is attached to the cover 1 as shown in FIG. 4c.
  • the method for bonding according to the second exemplary embodiment of the present invention includes the following steps: performing plasma cleaning on a touch sensing film 2, as shown in FIG. 4a;
  • the touch sensitive film 2 is covered with an adhesive 3 as shown in FIG. 4b; and the touch sensitive film 2 is attached to the cover 1 as shown in FIG. 4c; in the closed defoaming device (not shown) Defoaming the touch module; and pressing the defoaming touch module with two flat plates 4 to remove water ripple in the touch module, as shown in FIG. 4d
  • the arrows in the figure show the direction in which the pressure is applied; the touch module is illuminated by the ultraviolet light 10 to cure the adhesive 3, as shown in Figure 4e; finally, the GF touch screen as shown in Figure 4f is obtained.
  • the present invention is not limited thereto.
  • the step of bonding the cover plate and the at least one touch sensing film through the transparent adhesive to form the touch module comprises: two or more Touch-sensitive film for plasma cleaning; covering the adhesive on two or more of the touch-sensitive films, and bonding two or more of the touch-sensitive films together; Two or more of the touch sensing films that are attached are attached to the cover. In this way, a GFF touch screen or a GFS touch screen can be fabricated.
  • the transparent adhesive comprises an Optical Clear (OCR) and/or an Optical Clear Adhesive (OCA).
  • OCR Optical Clear
  • OCA Optical Clear Adhesive
  • the adhesive further includes any one of silicone rubber, acrylic resin, unsaturated polyester, polyurethane, epoxy resin, and the like, or any combination thereof.
  • touch screen described in the embodiments of the present invention is a capacitive touch screen, but the present invention is not limited thereto.
  • the method of the present invention is also applicable if other types of touch screens (e.g., resistive, inductive) require connection of a cover and a touch module.
  • a touch screen made by the method of the above embodiment is provided.
  • a touch screen may be a touch screen based on a capacitive sensing principle or a touch screen based on a resistance sensing principle.
  • Such a touch screen can be applied to a display device.
  • the display device can be any product with display function such as mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, electronic paper, etc. Or parts.
  • a method for bonding a cover plate to a touch sensing film and a touch screen manufactured by the method after performing a defoaming process on the touch module, pressing the touch module by using two flat plates
  • the water ripple in the touch module can be removed, and at the same time, the individual bubbles that cannot be removed in the defoaming step are eliminated by this method, thereby improving the product excellent rate.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Fluid Mechanics (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种盖板与触控感应薄膜贴合的方法和利用该方法制作的触摸屏，该方法包括如下步骤：将盖板（1）与至少一个触控感应薄膜（2）通过粘合剂（3）贴合在一起以形成触控模组；在封闭的脱泡装置内对所述触控模组进行脱泡处理；以及利用两个平板（4）对经脱泡处理的触控模组进行压合。上述方法可以去除触控模组内的水波纹，从而提高触摸屏产品优良率。

Description

盖板与触控感应薄膜贴合的方法和触摸屏
本申请要求于2014年12月22日递交的、申请号为201410810272.8、发明名称为“盖板与触控感应薄膜贴合的方法和触摸屏”的中国专利申请的优先权，其全部内容通过引用并入本申请中。
技术领域
本发明的实施例涉及一种触摸屏技术领域，尤其涉及一种将盖板与触控感应薄膜贴合的方法和利用该方法制作的触摸屏。
背景技术
目前，电容式触摸屏已经广泛应用于在诸如手机、多媒体、公共信息查询系统等电子设备中。传统使用的电容触摸屏，一般都是将一层盖板玻璃与一层触控玻璃通过光学胶(Optical Clear Adhesive，OCA)贴合的GG(玻璃盖板+玻璃盖板)结构。但随着对触控屏轻薄化、低成本化的要求，已研发了GF(玻璃盖板+触控感应薄膜)、GFF(玻璃盖板+双层触控感应薄膜)、OGS(一体式触摸屏，one glass solution)等触控结构。
在GF或者GFF结构中，一层盖板玻璃与一层或者两层的触控感测薄膜通过光学胶(OCA)或水胶(Optical Clear resin，OCR)贴合。这两种结构在轻薄化、低成本化方面均具有一定的优势，并得到广泛应用。但是，由于在进行玻璃盖板与触控薄膜进行光学胶(OCA)或水胶(OCR)贴合时属于软贴硬或硬贴软很容易造成贴合水波纹，影响产品优良率，提高了触控屏成本。
发明内容
本发明的实施例提供一种盖板与触控感应薄膜贴合的方法和利用该方法制作的触摸屏，可以避免形成水波纹现象，提高产品优良率。
根据本发明一个发明的实施例，提供一种盖板与触控感应薄膜贴合的方法，包括如下步骤：
将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组；
对所述触控模组进行脱泡处理；以及
对经脱泡处理的触控模组进行压合。
根据本发明的一种实施例的方法，在封闭的脱泡装置内对所述触摸组进行脱泡处理。
根据本发明的一种实施例的方法，利用两个平板对经脱泡处理的触控模组进行压合处理。
根据本发明的一种实施例的方法，利用两个平板对经脱泡处理的触控模组进行压合的步骤包括：在压合的同时利用两个所述平板之中的至少一个对所述触控模组加热。
根据本发明的一种实施例的方法，在压合的同时利用两个所述平板之中的至少一个对所述触控模组加热的步骤具体包括：
将两个平板中的至少一个加热到预定压合温度；
将所述触控模组放置在两个平板之间；以及
利用两个平板对所述触控组件以预定压合压力进行压合并保持一定的压合持续时间。
根据本发明的一种实施例的方法，在两个所述平板内分别设有加热电阻丝。
根据本发明的一种实施例的方法，所述预定压合压力保持在1000KG-1200KG的范围内，与盖板接触的平板的预定压合温度保持在70℃-80℃范围内，与触控感应薄膜接触的平板的预定压合温度保持在70℃-80℃范围内，所述一定的压合持续时间保持在10s-80s范围内。
根据本发明的一种实施例的方法，与盖板接触的平板的预定压合温度高于与触控感应薄膜接触的平板的预定压合温度。
根据本发明的一种实施例的方法，所述预定压合压力保持在1000KG-1200KG的范围内，与盖板接触的平板的预定压合温度保持在75℃-85℃范围内，与触控感应薄膜接触的平板的预定压合温度保持在70℃-80℃范围内，所述一定的压合持续时间保持在10s-80s范围内。
根据本发明的一种实施例的方法，在封闭的脱泡装置内对所述触控模组进行脱泡处理的步骤包括：
将所述触控模组放置在所述脱泡装置内；以及
将所述脱泡装置内的气体压力保持在预定脱泡压力，以对所述触控组件施加压力并保持一定的加热加压持续时间。
根据本发明的一种实施例的方法，在封闭的脱泡装置内对所述触控模组进行脱泡 处理的步骤还包括：将脱泡装置内的温度保持在预定脱泡温度。
根据本发明的一种实施例的方法，所述预定脱泡压力设定成使得所述触控模组承受5KG-6KG的压力；所述预定脱泡温度在40℃-60℃范围内；所述加热加压持续时间在15分钟-45分钟的范围内。
根据本发明的一种实施例的方法，将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：
对所述盖板进行等离子清洁；
在所述盖板上覆盖所述粘合剂；以及
将已贴合的至少一层所述触控感应薄膜贴附在所述盖板上。
根据本发明的一种实施例的方法，将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：
对所述触控感应薄膜进行等离子清洁；
在所述触控感应薄膜上覆盖所述粘合剂；以及
将所述触控感应薄膜贴附在所述盖板上。
根据本发明的一种实施例的方法，将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：
对两个或者更多个所述触控感应薄膜进行等离子清洁；
在两个或者更多个所述触控感应薄膜上覆盖粘合剂，并将两个或者多个所述触控感应薄膜贴合在一起；以及
将已贴合的两个或者更多个所述触控感应薄膜贴附在所述盖板上。
根据本发明的一种实施例的方法，在执行对经脱泡处理的触控模组压合的步骤之后，利用紫外光照射所述触控模组，以使所述粘合剂固化。
根据本发明的一种实施例的方法，所述粘合剂为透明粘合剂。
根据本发明的一种实施例的方法，所述透明粘合剂包括水胶和/或者光学胶。
根据本发明的一种实施例的方法，所述透明粘合剂包括有机硅橡胶、丙烯酸型树脂、不饱和聚酯、聚氨酯、环氧树脂中的任一种或它们的任意组合。
根据本发明另一方面的实施例，提供一种利用上述任一实施例所述的方法制成的触摸屏。
根据本发明上述实施例的将盖板与触控感应薄膜贴合的方法和利用该方法制作的触摸屏，在对触控模组执行脱泡处理之后，通过对触控模组压合，可以去除触控模组 内的水波纹，从而提高产品优良率。
附图说明
为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明作进一步的详细说明，其中：
图1是根据本发明的第一种示例性实施例的将盖板与触控感应薄膜贴合的方法的操作流程图；
图2a-2f表示执行图1所示方法的操作过程的示意图，其中图2a-2c和2e-2f中的各个附图的上部为侧视图，下部为俯视图；
图3是根据本发明的第二种示例性实施例的将盖板与触控感应薄膜贴合的方法的操作流程图；以及
图4a-4f表示执行图3所示方法的操作过程的示意图，其中图4a-4c和4e-4f中的各个附图的上部为侧视图，下部为俯视图。
具体实施方式
下面通过实施例，并结合附图，对本发明的技术方案作进一步具体的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构思进行解释，而不应当理解为对本发明的一种限制。
根据本发明总体上的发明构思，提供一种盖板与触控感应薄膜贴合的方法，包括如下步骤：将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组；对所述触控模组进行脱泡处理；以及对经脱泡处理的触控模组压合。在对触控模组执行脱泡处理之后，通过对触控模组压合，可以去除触控模组内的水波纹，从而提高产品优良率。
在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。
图1是根据本发明的第一种示例性实施例的将盖板与触控感应薄膜贴合的方法的操作流程图，图2a-2f表示执行图1所示方法的操作过程的示意图。图1和2示出了一种包括盖板和一层触控感应薄膜的触摸屏，其中图2a-2c和2e-2f中各个附图的上部为侧视图，下部为俯视图。
根据本发明的一种示例性实施例贴合的方法包括如下步骤：将例如由玻璃或者透明树脂材料制成的盖板1与至少一个设有触控感应电路的触控感应薄膜2通过透明粘合剂3贴合在一起以形成触控模组，如图2c所示；在封闭的脱泡装置(未示出)内对所述触控模组进行脱泡处理；以及利用两个平板4对经脱泡处理的触控模组压合以去除触控模组内的水波纹，如图2d所示。在图2d中，图中的箭头表示通过平板4施加压力的方向。在对触控模组执行脱泡处理之后，通过利用两个平板对触控模组压合，可以去除触控模组内的水波纹，从而提高产品优良率。另外，通过此方法还可以消除在脱泡步骤中未能除去的个别气泡，从而实现进一步的脱泡。
在一种实施例中，将盖板1与至少一个触控感应薄膜2通过粘合剂3贴合在一起以形成触控模组的步骤包括：对盖板1进行等离子清洁，以将盖板1的贴合面上的油、灰尘、水等杂物清除，如图2a所示；在盖板1上覆盖粘合剂3，例如，覆盖盖板1的边框11的内侧以及全部显示区域，以使粘合剂覆盖盖板1的全部贴合面，如图2b所示；以及将触控感应薄膜2贴附在盖板1上，如图2c所示。
如图2e所示，在执行利用两个平板4对经脱泡处理的触控模组压合的步骤之后，利用紫外光10照射触控模组，以使粘合剂3固化，从而得到如图2f所示的触摸屏。
详细而言，参见图1和图2a-2f，根据本发明的第一种示例性实施例贴合的方法包括如下步骤：对盖板1进行等离子清洁，如图2a所示；在盖板1上覆盖粘合剂3，如图2b所示；将触控感应薄膜2贴附在盖板1上，如图2c所示；在封闭的脱泡装置(未示出)内对所述触控模组进行脱泡处理；以及利用两个平板4对经脱泡处理的触控模组压合以去除触控模组内的水波纹，如图2d所示；利用紫外光10照射触控模组，以使粘合剂3固化，如图2e所示；最后，得到如图2f所示的触摸屏。
在上面的实施例中，触控感应薄膜2可以包括一层触控感应薄膜，也可以包括预先贴合在一起的两层或者更多层触控感应薄膜。
在一种实施例中，如图2d所示，利用两个平板4对经脱泡处理的触控模组压合以去除触控模组内的水波纹的步骤包括：在压合的同时利用表面平坦且相互平行的两个平板4之中的至少一个对触控模组加热。利用两个平板4可以施加较大的力，以有效地将触控模组内的水波纹去除，通过此方法还可以消除在脱泡步骤中未能除去的个别气泡，从而实现进一步的脱泡。
在一种示例性实施例中，利用两个平板4对经脱泡处理的触控模组压合以去除触控模组内的水波纹的步骤具体包括：将两个平板4中的至少一个加热到预定压合温 度；将所述触控模组放置在两个平板4之间；以及利用两个平板4对触控组件以预定压合压力进行压合并保持一定的压合持续时间。这样，通过控制压合的压力、温度和时间，可以在保持盖板1和触控感应薄膜2的功能的情况下，有效地将水波纹去除。例如，在两个平板4内分别设有加热电阻丝(未示出)，通过控制施加在电阻丝上的电压可以简单地控制加热时间。
在一种实施例中，预定压合压力保持在1000千克(KG)-1200千克的范围内，与盖板1接触的平板4(例如图2d中的下平板)的预定压合温度保持在70℃-80℃范围内，与触控感应薄膜接触2的平板4(例如图2d中的上平板)的预定压合温度保持在70℃-80℃范围内，所述一定的压合持续时间保持在10秒(s)-80秒范围内。这样，通过设定合适的压合条件，在保持盖板1和触控感应薄膜2的功能的情况下，有效地将水波纹去除，并进一步消除在脱泡步骤中未能除去的个别气泡。可以理解，以上仅是一个示例，本发明不限于上述具体的数值范围。
在一种可替换的实施例中，与盖板1接触的平板4(例如图2d中的下平板)的预定压合温度高于与触控感应薄膜接触2的平板4(例如图2d中的下平板)的预定压合温度。例如，预定压合压力保持在1000千克-1200千克的范围内，与盖板接触的平板的预定压合温度保持在75℃-85℃范围内，与触控感应薄膜接触的平板的预定压合温度保持在70℃-80℃范围内，所述一定的压合持续时间保持在10秒-80秒范围内。相对于盖板1，触控感应薄膜2具有较小的厚度和受热膨胀率，而且内部设有触控感应电路，将与触控感应薄膜接触2的平板4(例如图2d中的下平板)的温度设定的较低，有利于保持粘合剂3的温度均匀，并保持触控感应电路的性能稳定。可以理解，以上仅是一个示例，本发明不限于上述具体的数值范围。
在一种实施例中，在封闭的脱泡装置(未示出)内对触控模组进行脱泡处理的步骤包括：将所述触控模组放置在脱泡装置内；以及将脱泡装置内的气体压力保持在预定脱泡压力，以对触控组件施加压力并保持一定的加热加压持续时间。通过脱泡处理，可以除去在将触控感应薄膜2贴合到盖板1的过程中，由于受力不均和/或受热不均而在触控模组中产生的气泡，以提高产品优良率。
在进一步的实施例中，在封闭的脱泡装置内对触控模组进行脱泡处理的步骤还包括：将脱泡装置内的温度保持在预定脱泡温度。例如，预定脱泡压力设定成使得所述触控模组承受5-6千克的压力；所述预定脱泡温度在40℃-60℃的范围内；所述加热加压持续时间在15分钟-45分钟的范围内。这样，通过加压和加热，可以提高去除气泡的效率。
图3是根据本发明的第二种示例性实施例的将盖板与触控感应薄膜贴合的方法的操作流程图；图4a-4f表示执行图3所示方法的操作过程的示意图，其中图4a-4c和4e-4f中各个附图的上部为侧视图，下部为俯视图。在第二实施例贴合的方法中，将盖板1与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：对一个触控感应薄膜2进行等离子清洁，以将触控感应薄膜2的贴合面上的油、灰尘、水等杂物清除，如图4a所示；在触控感应薄膜2上覆盖粘合剂3，如图4b所示；以及将所述触控感应薄膜2贴附在盖板1上，如图4c所示。
详细而言，参见图3和图4a-4f，根据本发明的第二种示例性实施例贴合的方法包括如下步骤：对一个触控感应薄膜2进行等离子清洁，如图4a所示；在触控感应薄膜2上覆盖粘合剂3，如图4b所示；以及将所述触控感应薄膜2贴附在盖板1上，如图4c所示；在封闭的脱泡装置(未示出)内对所述触控模组进行脱泡处理；以及利用两个平板4对经脱泡处理的触控模组压合以去除触控模组内的水波纹，如图4d所示(图中的箭头显示施加压力的方向)；利用紫外光10照射触控模组，以使粘合剂3固化，如图4e所示；最后，得到如图4f所示的GF触摸屏。
虽然在上面的第二实施例中，描述了将一层触控感应薄膜贴合在盖板1上与形成GF触摸屏的实施例，但本发明并不局限于此。在第二实施例的变形实施例中，将盖板与至少一个触控感应薄膜通过透明的粘合剂贴合在一起以形成触控模组的步骤包括：对两个或者更多个所述触控感应薄膜进行等离子清洁；在两个或者更多个所述触控感应薄膜上覆盖所述粘合剂，并将两个或者多个所述触控感应薄膜贴合在一起；以及将已贴合的两个或者更多个所述触控感应薄膜贴附在所述盖板上。这样，可以制作GFF触摸屏、或者GFS触摸屏。
在一种实施例中，透明的粘合剂包括水胶(Optical Clear resin，OCR)和/或者光学胶(Optical Clear Adhesive，OCA)。粘合剂还包括有机硅橡胶、丙烯酸型树脂、不饱和聚酯、聚氨酯、环氧树脂等胶粘剂中的任一种或它们的任意组合。
在此需要说明的是，在本发明的各实施例中所述的触摸屏为电容式触摸屏，但是本发明不限于此。如果其他类型的触摸屏(例如电阻式、电感式)需要连接盖板和触控模组，那么本发明所述的方法也是适用的。
根据本发明更进一步发明的实施例，提供一种由上述实施例贴合的方法制成的触摸屏。这种触摸屏可以是基于电容感测原理的触摸屏，也可以是基于电阻感测原理的触摸屏。这种触摸屏可以应用于显示装置中。显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、电子纸等任何具有显示功能的产品 或部件。
根据本发明上述实施例的将盖板与触控感应薄膜贴合的方法和利用该方法制作的触摸屏，在对触控模组执行脱泡处理之后，通过利用两个平板对触控模组压合，可以去除触控模组内的水波纹，同时通过此方法消除在脱泡步骤中未能除去的个别气泡，从而提高产品优良率。
以上所述的具体实施例，对本发明的目的、技术方案和有益效果进行了进一步详细说明，应理解的是，以上所述仅为本发明的具体实施例而已，并不用于限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (20)

  1. 一种盖板与触控感应薄膜贴合的方法，包括如下步骤：
    将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组；
    对所述触控模组进行脱泡处理；以及
    对经脱泡处理的触控模组进行压合处理。
  2. 如权利要求1所述的方法，其中，在封闭的脱泡装置内对所述触摸组进行脱泡处理。
  3. 如权利要求1或2所述的方法，其中，利用两个平板对经脱泡处理的触控模组进行压合处理。
  4. 如权利要求3所述的方法，其中，利用两个平板对经脱泡处理的触控模组进行压合的步骤包括：在压合的同时利用两个所述平板之中的至少一个对所述触控模组加热。
  5. 如权利要求4所述的方法，其中，在压合的同时利用两个所述平板之中的至少一个对所述触控模组加热的步骤具体包括：
    将两个平板中的至少一个加热到预定压合温度；
    将所述触控模组放置在两个平板之间；以及
    利用两个平板对所述触控组件以预定压合压力进行压合并保持一定的压合持续时间。
  6. 如权利要求5所述的方法，其中，在两个所述平板内分别设有加热电阻丝以执行所述加热。
  7. 如权利要求5所述的方法，其中，所述预定压合压力保持在1000KG-1200KG的范围内，与盖板接触的平板的预定压合温度保持在70℃-80℃范围内，与触控感应薄膜接触的平板的预定压合温度保持在70℃-80℃范围内，所述一定的压合持续时间保持在10s-80s范围内。
  8. 如权利要求5所述的方法，其中，与盖板接触的平板的预定压合温度高于与触控感应薄膜接触的平板的预定压合温度。
  9. 如权利要求8所述的方法，其中，所述预定压合压力保持在1000KG-1200KG的范围内，与盖板接触的平板的预定压合温度保持在75℃-85℃范围内，与 触控感应薄膜接触的平板的预定压合温度保持在70℃-80℃范围内，所述一定的压合持续时间保持在10s-80s范围内。
  10. 如权利要求2-9中的任一项所述的方法，其中，在封闭的脱泡装置内对所述触控模组进行脱泡处理的步骤包括：
    将所述触控模组放置在所述脱泡装置内；以及
    将所述脱泡装置内的气体压力保持在预定脱泡压力，以对所述触控组件施加压力并保持一定的加热加压持续时间。
  11. 如权利要求10所述的方法，其中，在封闭的脱泡装置内对所述触控模组进行脱泡处理的步骤还包括：将脱泡装置内的温度保持在预定脱泡温度。
  12. 如权利要求11所述的方法，其中，所述预定脱泡压力设定成使得所述触控模组承受5KG-6KG的压力；所述预定脱泡温度在40℃-60℃范围内；所述加热加压持续时间在15分钟-45分钟的范围内。
  13. 如权利要求1-12中的任一项所述的方法，其中，将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：
    对所述盖板进行等离子清洁；
    在所述盖板上覆盖所述粘合剂；以及
    将已贴合的至少一层所述触控感应薄膜贴附在所述盖板上。
  14. 如权利要求1-12中的任一项所述的方法，其中，将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：
    对所述触控感应薄膜进行等离子清洁；
    在所述触控感应薄膜上覆盖所述粘合剂；以及
    将所述触控感应薄膜贴附在所述盖板上。
  15. 如权利要求1-12中的任一项所述的方法，其中，将盖板与至少一个触控感应薄膜通过粘合剂贴合在一起以形成触控模组的步骤包括：
    对两个或者更多个所述触控感应薄膜进行等离子清洁；
    在两个或者更多个所述触控感应薄膜上覆盖粘合剂，并将两个或者多个所述触控感应薄膜贴合在一起；以及
    将已贴合的两个或者更多个所述触控感应薄膜贴附在所述盖板上。
  16. 如权利要求1-15中的任一项所述的方法，其中，在执行对经脱泡处理的触控模组压合的步骤之后，利用紫外光照射所述触控模组，以使所述粘合剂固化。
  17. 如权利要求1-16中任一项所述的方法，其中所述粘合剂为透明粘合剂。
  18. 如权利要求17所述的方法，其中，所述透明粘合剂包括水胶和/或者光学胶。
  19. 如权利要求18所述的方法，其中，所述透明粘合剂包括有机硅橡胶、丙烯酸型树脂、不饱和聚酯、聚氨酯、环氧树脂中的任一种或它们的任意组合。
  20. 一种触摸屏，所述触摸屏利用如权利要求1-19中的任一项所述的方法制成。
PCT/CN2015/078764 2014-12-22 2015-05-12 盖板与触控感应薄膜贴合的方法和触摸屏 WO2016101496A1 (zh)

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