WO2016098199A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2016098199A1
WO2016098199A1 PCT/JP2014/083418 JP2014083418W WO2016098199A1 WO 2016098199 A1 WO2016098199 A1 WO 2016098199A1 JP 2014083418 W JP2014083418 W JP 2014083418W WO 2016098199 A1 WO2016098199 A1 WO 2016098199A1
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Prior art keywords
type
layer
drift layer
region
fwd
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PCT/JP2014/083418
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English (en)
French (fr)
Inventor
秀樹 春口
佳史 友松
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三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2014/083418 priority Critical patent/WO2016098199A1/ja
Priority to US15/325,465 priority patent/US9972618B2/en
Priority to JP2016564507A priority patent/JP6269860B2/ja
Priority to CN201480084166.4A priority patent/CN107112324A/zh
Priority to DE112014007266.4T priority patent/DE112014007266T5/de
Publication of WO2016098199A1 publication Critical patent/WO2016098199A1/ja

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Definitions

  • the present invention relates to a reverse conducting IGBT (RC (Reverse Conducting) -IGBT) in which an FWD (Free Wheeling Diode) is incorporated in an IGBT (Insulated Gate Bipolar Transistor).
  • RC Reverse Conducting
  • FWD Free Wheeling Diode
  • RC-IGBT can be realized by the combination of IGBT and FWD made of Si, which has been developed so far. And, if the structures of the IGBT region and the FWD region can be optimized, it can be manufactured with a stable yield using the current manufacturing apparatus. However, it is very difficult to simultaneously optimize the structures of the IGBT region and the FWD region and make the respective losses equal to the losses of the separately manufactured IGBT and FWD.
  • a small signal pad for connecting a gate and a built-in temperature sensing diode to an external electrode, and a gate wiring for electrically connecting the gate pad and the gate of each cell are formed.
  • an FLR (Field Limiting Ring) for holding a withstand voltage is formed in a termination region on the outer periphery of the substrate. In these regions, a p-type well having a high impurity concentration and a deep depth is formed with respect to the p-type base layer of the IGBT and the p-type anode layer of the FWD so as to maintain the withstand voltage.
  • the p-type well is electrically connected to the p-type base layer of the IGBT and the p-type anode layer of the FWD.
  • the FWD is forward biased, holes are injected from the p-type well, and the conventional RC-IGBT does not have a sufficient interference preventing effect at the time of recovery.
  • the present invention has been made to solve the problems as described above, and an object thereof is to obtain a semiconductor device capable of reducing the recovery loss of FWD without deteriorating the loss of the IGBT.
  • a semiconductor device comprises an n-type drift layer, a p-type base layer and an n-type emitter layer formed on the surface of the n-type drift layer, and a p-type collector formed on the back surface of the n-type drift layer.
  • n-type drift layer having a layer, an n-type drift layer, a p-type anode layer formed on the surface of the n-type drift layer, and an n-type formed on the back surface of the n-type drift layer
  • An FWD Free Wheeling Diode having a cathode layer, a p-type well formed on the surface of the n-type drift layer in a wiring region and a termination region, and a wiring formed on the p-type well in the wiring region
  • the p-type well is higher in impurity concentration and deeper than the p-type anode layer, and the p-type well is not formed directly on the n-type cathode layer, and the n-type well is Ka Characterized in that apart from directly above the region of over de layer.
  • the p-type well is not formed immediately above the n-type cathode layer, and is separated from the region immediately above the n-type cathode layer. This makes it possible to reduce the amount of holes in the n ⁇ -type drift layer in the formation region of the FWD when the FWD is forward biased and current is applied. As a result, the recovery loss of the FWD can be reduced without deteriorating the loss of the IGBT.
  • FIG. 1 is a plan view showing a semiconductor device according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line I-II of FIG. It is a sectional view showing a semiconductor device concerning a comparative example. It is a top view which shows the semiconductor device concerning Embodiment 2 of this invention.
  • FIG. 5 is a cross-sectional view taken along line I-II of FIG. 4; It is a top view which shows the semiconductor device concerning Embodiment 3 of this invention. It is sectional drawing which shows the semiconductor device concerning Embodiment 4 of this invention. It is sectional drawing which shows the semiconductor device concerning Embodiment 5 of this invention.
  • FIG. 1 is a plan view showing a semiconductor device according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view taken along line I-II of FIG.
  • This semiconductor device is an RC-IGBT in which an IGBT (Insulated Gate Bipolar Transistor) 1 and an FWD (Free Wheeling Diode) 2 are formed on one semiconductor substrate. Further, in the RC-IGBT, the wiring area 3 exists in areas other than the areas operating as the IGBT 1 and the FWD 2, and the termination area 4 exists in the outer periphery thereof.
  • IGBT Insulated Gate Bipolar Transistor
  • FWD Free Wheeling Diode
  • IGBT1 is, n - -type drift layer 5, n - and p-type base layer 6 and the n + -type emitter layer 7 formed on the surface of the type drift layer 5, n - formed on the back surface of the type drift layer 5 p And a type collector layer 8.
  • a collector electrode 9 is connected to the p-type collector layer 8.
  • electrons are supplied to the n ⁇ -type drift layer 5 through the channel by applying a voltage to the gate.
  • FWD2 is, n - and an n-type cathode layer 11 formed on the rear surface of the type drift layer 5 - -type drift layer 5, n - and p-type anode layer 10 formed on the surface of the type drift layer 5, n .
  • a p-type well 12 is formed on the surface of the n ⁇ -type drift layer 5 in the wiring region 3 and the termination region 4 so as to maintain the breakdown voltage.
  • a gate wiring 13 and a gate pad 14 are formed as a wiring on the p-type well 12 in the wiring region.
  • the gate wiring 13 electrically connects the gate pad 14 and the gate of each cell.
  • a small signal pad (not shown) for connecting a temperature sense diode built in the IGBT 1 to an external electrode is also provided.
  • an FLR Field Limiting Ring
  • These lines do not produce an inversion layer in the p-type well 12 unlike the gate electrode which produces an inversion region.
  • the p-type well 12 is higher in impurity concentration and deeper than the p-type anode layer 10.
  • the p-type well 12 is not formed immediately above the n-type cathode layer 11 and is separated from the region directly above the n-type cathode layer 11.
  • FIG. 3 is a cross-sectional view showing a semiconductor device according to a comparative example.
  • a part of the p-type well 12 is formed directly on the n-type cathode layer 11. Therefore, when the FWD 2 is forward biased, holes are injected from the p-type well 12 into the formation region of the FWD 2, and the interference preventing effect at the time of recovery is not sufficient.
  • the p-type well 12 is not formed immediately above the n-type cathode layer 11 and is separated from the region immediately above the n-type cathode layer 11. This makes it possible to reduce the amount of holes in the n ⁇ -type drift layer 5 in the formation region of the FWD 2 when the FWD 2 is forward biased and energized. As a result, the recovery loss of the FWD can be reduced without deteriorating the loss of the IGBT.
  • the p-type well is used to reduce the recovery loss of the FWD 2 It is preferable that the distance 12 be at least the thickness t or more of the n ⁇ -type drift layer 5 from the region immediately above the n-type cathode layer 11 (w ⁇ t in FIG. 2).
  • the n + -type emitter layer 7 is not formed in the region of FWD 2 , and the p-type base layer 6 and the p-type anode layer 10 preferably have the same depth and concentration.
  • the IGBT 1 and the FWD 2 can be formed separately only by forming the n + -type emitter layer 7 or not. Further, when forming the surface structure of the RC-IGBT, the number of processes can be reduced by sharing the wafer processes of the IGBT 1 and the FWD 2, and the RC-IGBT with good performance can be manufactured at low cost.
  • FIG. 4 is a plan view showing a semiconductor device according to the second embodiment of the present invention.
  • FIG. 5 is a cross-sectional view taken along line I-II of FIG. A plurality of trench gates 15 are formed.
  • the IGBT 1 is formed in the region between the wiring region 3 and the termination region 4 and the FWD 2. By forming the IGBT 1 in the vicinity of the wiring region 3 and the termination region 4, the recovery loss of the FWD 2 can be reduced without reducing the effective area of the element (the total area of the IGBTs 1 and FWD 2 which can be energized).
  • FIG. 6 is a plan view showing a semiconductor device according to the third embodiment of the present invention.
  • the IGBTs 1 and the FWDs 2 are repeatedly formed at fixed intervals in a region surrounded by the gate wiring 13 in plan view.
  • the IGBTs 1 and FWDs 2 in the RC-IGBT generate heat when current flows.
  • the maximum rated temperature of the element is generally 150 to 175 ° C. In order to lower the temperature of the element that has generated heat, it is necessary to cool the radiation fin in contact with the back side of the RC-IGBT by air cooling or water cooling.
  • the period in which the current flows in the IGBT 1 and the period in which the current flows in the FWD 2 alternate, and there is a gap between the timings at which the temperatures of the IGBT 1 and the FWD 2 peak. Therefore, by repeatedly forming the IGBT 1 and the FWD 2 at a constant interval, it is possible to dissipate the heat when one of the IGBT 1 and the FWD 2 is energized to the radiation fin of the other region, and to lower the device temperature efficiently. Can. Further, the chip can be reduced by that amount, and the cooling mechanism can be simplified, so that the cost of the element or the inverter incorporating the element can be reduced.
  • FIG. 7 is a cross-sectional view showing a semiconductor device according to the fourth embodiment of the present invention.
  • the p-type well 12 is deeper than the p-type anode layer 10 and has a lower impurity concentration.
  • the amount of holes injected from p-type well 12 can be reduced when FWD 2 is energized, and the recovery loss of FWD 2 can be reduced.
  • FIG. 8 is a cross-sectional view showing a semiconductor device according to the fifth embodiment of the present invention.
  • the p-type well 12 has the same impurity concentration and depth as the p-type anode layer 10. Thus, even if FWD 2 is formed in the vicinity of p-type well 12, the amount of holes injected from p-type well 12 can be reduced when FWD 2 is energized, and the recovery loss of FWD 2 can be reduced.
  • the p-type well 12 and the p-type anode layer 10 are formed by simultaneously injecting and diffusing a p-type impurity. As a result, the number of wafer process steps can be reduced, and a low-cost, high-performance RC-IGBT can be manufactured.
  • the semiconductor substrate is not limited to one formed of silicon, and may be formed of a wide band gap semiconductor having a larger band gap than silicon.
  • the wide band gap semiconductor is, for example, silicon carbide, gallium nitride based material, or diamond.
  • a semiconductor device formed of such a wide band gap semiconductor can be miniaturized because of high voltage resistance and allowable current density. By using this miniaturized device, it is possible to miniaturize a semiconductor module incorporating this device. Further, since the heat resistance of the element is high, the heat dissipating fins of the heat sink can be miniaturized, and the water cooling portion can be air cooled, so that the semiconductor module can be further miniaturized. In addition, since the power loss of the element is low and the efficiency is high, the semiconductor module can be highly efficient.

Abstract

　ＩＧＢＴ１は、ｎ型ドリフト層５と、ｎ型ドリフト層５の表面に形成されたｐ型ベース層６及びｎ型エミッタ層７と、ｎ型ドリフト層５の裏面に形成されたｐ型コレクタ層８とを有する。ＦＷＤ２は、ｎ型ドリフト層５と、ｎ型ドリフト層５の表面に形成されたｐ型アノード層１０と、ｎ－型ドリフト層５の裏面に形成されたｎ型カソード層１１とを有する。配線領域３と終端領域４においてｎ－型ドリフト層５の表面にｐ型ウエル１２が形成されている。配線領域３においてｐ型ウエル１２上に配線１３が形成されている。ｐ型ウエル１２はｐ型アノード層１０に対して不純物濃度が高くかつ深さが深い。ｐ型ウエル１２は、ｎ型カソード層１１の直上には形成されておらず、ｎ型カソード層１１の直上領域から離れている。

Description

半導体装置
　本発明は、ＦＷＤ（Free Wheeling Diode）をＩＧＢＴ（Insulated Gate Bipolar Transistor）に内蔵した逆導通ＩＧＢＴ（RC(Reverse Conducting)-IGBT）に関する。
　インバーターやコンバーターに実装されるＩＧＢＴやＦＷＤの損失は年々低減されてきた。それに伴い、チップの電流密度が向上し、チップサイズが縮小されてきた。しかし、近年、ＩＧＢＴやＦＷＤの損失は限界値に近づきつつあり、チップサイズの大幅な縮小のために、ＳｉＣを材料としたパワーデバイスの開発や、ＩＧＢＴとＦＷＤの性能を併せ持つＲＣ－ＩＧＢＴなどの開発も進められている。
　ＳｉＣを材料としたパワーデバイスは高温での使用が可能であり、損失も大幅に低減できることが期待されている。しかし、ＳｉＣウエハ材が高価であることや、ＳｉＣ中の欠陥を要因とする不良の発生など課題を抱えており、市場に広く普及するまでには暫くの時間を要する。
　これに対し、ＲＣ－ＩＧＢＴは、これまで開発が進んでいるＳｉを材料としたＩＧＢＴとＦＷＤの組み合わせにより実現可能である。そして、ＩＧＢＴ領域とＦＷＤ領域の構造が最適化できれば、現行の製造装置を使って、安定した歩留まりで製造可能である。しかし、ＩＧＢＴ領域とＦＷＤ領域の構造を同時に最適化し、それぞれの損失を個別に製造したＩＧＢＴとＦＷＤの損失と同等にすることは非常に難しい。
　通常のＦＷＤでは、リカバリー損失を低減するために、Ｓｉ中のライフタイムをＰｔ拡散や電子線照射によって短くする手法が採用されている。しかし、ＲＣ－ＩＧＢＴでは、Ｓｉ中のライフタイムを短くするとＩＧＢＴのトータル損失（オン時の損失とスイッチング損失の合計）が悪化するという問題があった。
　Ｓｉ中のライフタイムを短くせずにリカバリー損失を低減するためには、ＦＷＤに順バイアスをかけて通電させる際にアノード領域からのホールの注入を抑制することが効果的である。そのためにアノード領域の濃度が下げられている。しかし、アノード領域以外のチップ表面のＰ型拡散層からもホールが注入されるため、アノード領域以外のＰ型拡散層の設計にも注意を払う必要がある。
　例えばＲＣ－ＩＧＢＴにおけるリカバリー損失を低減させるために、ＩＧＢＴのＰ型ベース層の直下に、ダイオードのカソード層となる裏面ｎ＋領域を形成しない技術が提案されている（例えば、特許文献１参照）。
日本特開平５－１５２５７４号公報
　基板の配線領域には、ゲートや内蔵された温度センスダイオードを外部電極とワイヤ接続するための小信号パッドや、ゲートパッドと各セルのゲートを電気的に接続するためのゲート配線が形成されている。また、基板の外周の終端領域には耐圧を保持するためのＦＬＲ（Field Limiting Ring）が形成されている。これらの領域には、耐圧を保持できるように、ＩＧＢＴのｐ型ベース層やＦＷＤのｐ型アノード層に対して不純物濃度が高くかつ深さが深いｐ型ウエルが形成される。このｐ型ウエルはＩＧＢＴのＰ型ベース層やＦＷＤのｐ型アノード層と電気的に接続されている。ＦＷＤが順バイアスされる際には、ｐ型ウエルからホールが注入されてしまい、従来のＲＣ－ＩＧＢＴではリカバリー時の干渉防止効果が十分ではなかった。
　本発明は、上述のような課題を解決するためになされたもので、その目的はＩＧＢＴの損失を悪化させることなく、ＦＷＤのリカバリー損失を低減させることができる半導体装置を得るものである。
　本発明に係る半導体装置は、ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型ベース層及びｎ型エミッタ層と、前記ｎ型ドリフト層の裏面に形成されたｐ型コレクタ層とを有するＩＧＢＴ（Insulated Gate Bipolar Transistor）と、前記ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型アノード層と、前記ｎ型ドリフト層の裏面に形成されたｎ型カソード層とを有するＦＷＤ（Free Wheeling Diode）と、配線領域と終端領域において前記ｎ型ドリフト層の表面に形成されたｐ型ウエルと、前記配線領域において前記ｐ型ウエル上に形成された配線とを備え、前記ｐ型ウエルは前記ｐ型アノード層に対して不純物濃度が高くかつ深さが深く、前記ｐ型ウエルは、前記ｎ型カソード層の直上には形成されておらず、前記ｎ型カソード層の直上領域から離れていることを特徴とする。
　本発明では、ｐ型ウエルは、ｎ型カソード層の直上には形成されておらず、ｎ型カソード層の直上領域から離れている。これにより、ＦＷＤに順バイアスをかけて通電している際にＦＷＤの形成領域のｎ－型ドリフト層のホールの量を低減することができる。この結果、ＩＧＢＴの損失を悪化させることなく、ＦＷＤのリカバリー損失を低減させることができる。
本発明の実施の形態１に係る半導体装置を示す平面図である。 図１のＩ－ＩＩに沿った断面図である。 比較例に係る半導体装置を示す断面図である。 本発明の実施の形態２に係る半導体装置を示す平面図である。 図４のＩ－ＩＩに沿った断面図である。 本発明の実施の形態３に係る半導体装置を示す平面図である。 本発明の実施の形態４に係る半導体装置を示す断面図である。 本発明の実施の形態５に係る半導体装置を示す断面図である。
　本発明の実施の形態に係る半導体装置について図面を参照して説明する。同じ又は対応する構成要素には同じ符号を付し、説明の繰り返しを省略する場合がある。
実施の形態１．
　図１は、本発明の実施の形態１に係る半導体装置を示す平面図である。図２は図１のＩ－ＩＩに沿った断面図である。この半導体装置は１つの半導体基板にＩＧＢＴ（Insulated Gate Bipolar Transistor）１とＦＷＤ（Free Wheeling Diode）２が形成されたＲＣ－ＩＧＢＴである。また、ＲＣ－ＩＧＢＴにはＩＧＢＴ１やＦＷＤ２として動作する領域以外に配線領域３が存在し、それらの外周に終端領域４が存在する。
　ＩＧＢＴ１は、ｎ－型ドリフト層５と、ｎ－型ドリフト層５の表面に形成されたｐ型ベース層６及びｎ＋型エミッタ層７と、ｎ－型ドリフト層５の裏面に形成されたｐ型コレクタ層８とを有する。ｐ型コレクタ層８にはコレクタ電極９が接続されている。ＩＧＢＴ１の表面側のＭＯＳ構造ではゲートに電圧を印加することでチャネルを通じて電子がｎ－型ドリフト層５に供給される。
　ＦＷＤ２は、ｎ－型ドリフト層５と、ｎ－型ドリフト層５の表面に形成されたｐ型アノード層１０と、ｎ－型ドリフト層５の裏面に形成されたｎ型カソード層１１とを有する。
　配線領域３と終端領域４において、耐圧を保持できるように、ｎ－型ドリフト層５の表面にｐ型ウエル１２が形成されている。配線領域においてｐ型ウエル１２上に配線としてゲート配線１３及びゲートパッド１４が形成されている。ゲート配線１３はゲートパッド１４と各セルのゲートを電気的に接続する。また、配線領域には、ＩＧＢＴ１に内蔵された温度センスダイオードを外部電極とワイヤ接続するための小信号パッド（不図示）も設けられている。また、終端領域には耐圧を保持するためのＦＬＲ（Field Limiting Ring）が形成されている。これらの配線は、反転領域を生じさせるゲート電極とは異なり、ｐ型ウエル１２に反転層を生じさせない。
　ｐ型ウエル１２はｐ型アノード層１０に対して不純物濃度が高くかつ深さが深い。ｐ型ウエル１２は、ｎ型カソード層１１の直上には形成されておらず、ｎ型カソード層１１の直上領域から離れている。
　続いて、本実施の形態の効果を比較例と比較して説明する。図３は比較例に係る半導体装置を示す断面図である。比較例では、ｐ型ウエル１２の一部がｎ型カソード層１１の直上に形成されている。このため、ＦＷＤ２が順バイアスされる際には、ｐ型ウエル１２からＦＷＤ２の形成領域にホールが注入されてしまい、リカバリー時の干渉防止効果が十分ではない。
　一方、本実施の形態では、ｐ型ウエル１２は、ｎ型カソード層１１の直上には形成されておらず、ｎ型カソード層１１の直上領域から離れている。これにより、ＦＷＤ２に順バイアスをかけて通電している際にＦＷＤ２の形成領域のｎ－型ドリフト層５のホールの量を低減することができる。この結果、ＩＧＢＴの損失を悪化させることなく、ＦＷＤのリカバリー損失を低減させることができる。
　また、表面のｐ型ウエル１２から注入されたホールが裏面のｎ型カソード層１１に向かって下方斜め４５度で拡散していくと考えると、ＦＷＤ２のリカバリー損失を低減するためにはｐ型ウエル１２がｎ型カソード層１１の直上領域から少なくともｎ－型ドリフト層５の厚みｔ以上離れている（図２中のｗ≧ｔ）ことが好ましい。
　また、ＦＷＤ２の領域にはｎ＋型エミッタ層７は形成されておらず、ｐ型ベース層６とｐ型アノード層１０は深さと濃度が同じであることが好ましい。ｎ＋型エミッタ層７を形成するかしないかだけでＩＧＢＴ１とＦＷＤ２を分けて形成することができる。また、ＲＣ－ＩＧＢＴの表面構造を形成する際にＩＧＢＴ１とＦＷＤ２のウエハプロセスを共通化することで工程数を低減することができ、低コストで性能の良いＲＣ－ＩＧＢＴの製造が可能となる。
実施の形態２．
　図４は、本発明の実施の形態２に係る半導体装置を示す平面図である。図５は図４のＩ－ＩＩに沿った断面図である。複数のトレンチゲート１５が形成されている。配線領域３及び終端領域４とＦＷＤ２との間の領域にＩＧＢＴ１が形成されている。配線領域３及び終端領域４の近傍にＩＧＢＴ１を形成することによって、素子の有効面積（通電可能なＩＧＢＴ１とＦＷＤ２の合計面積）を小さくすることなく、ＦＷＤ２のリカバリー損失を低減することができる。
実施の形態３．
　図６は、本発明の実施の形態３に係る半導体装置を示す平面図である。平面視においてゲート配線１３で囲まれた領域内でＩＧＢＴ１とＦＷＤ２が一定の間隔で繰り返し形成されている。ＲＣ－ＩＧＢＴ内のＩＧＢＴ１とＦＷＤ２は電流を通電することで発熱する。素子の最大定格温度は一般的に１５０～１７５℃であり、発熱した素子の温度を下げるために、ＲＣ－ＩＧＢＴ裏面側に接触した放熱フィンを空冷もしくは水冷方式で冷却する必要がある。通常の使用方法において、ＩＧＢＴ１に電流が流れる期間とＦＷＤ２に電流が流れる期間は交互であり、ＩＧＢＴ１とＦＷＤ２の温度がピークになるタイミングにはずれがある。そこで、ＩＧＢＴ１とＦＷＤ２を一定の間隔で繰り返し形成することで、ＩＧＢＴ１とＦＷＤ２の一方の通電時の熱を他方の領域の放熱フィンにも逃がすことが可能となり、効率的に素子の温度を下げることができる。また、その分だけチップを縮小でき、冷却機構も簡素化できるので、素子や素子を内蔵するインバーターのコストを低減することができる。
実施の形態４．
　図７は、本発明の実施の形態４に係る半導体装置を示す断面図である。本実施の形態ではｐ型ウエル１２はｐ型アノード層１０に対して深さが深く不純物濃度が低い。これにより、ＦＷＤ２をｐ型ウエル１２の近傍に形成してもＦＷＤ２の通電時にｐ型ウエル１２から注入されるホールの量を低減することができ、ＦＷＤ２のリカバリー損失を低減することができる。
実施の形態５．
　図８は、本発明の実施の形態５に係る半導体装置を示す断面図である。本実施の形態ではｐ型ウエル１２はｐ型アノード層１０に対して不純物濃度と深さが同じである。これにより、ＦＷＤ２をｐ型ウエル１２の近傍に形成してもＦＷＤ２の通電時にｐ型ウエル１２から注入されるホールの量を低減することができ、ＦＷＤ２のリカバリー損失を低減することができる。
　また、ｐ型ウエル１２とｐ型アノード層１０はＰ型不純物を同時に注入及び拡散することで形成される。これにより、ウエハプロセス工程数を低減することができ、低コストで性能の良いＲＣ－ＩＧＢＴを製造することができる。
　なお、半導体基板は、珪素によって形成されたものに限らず、珪素に比べてバンドギャップが大きいワイドバンドギャップ半導体によって形成されたものでもよい。ワイドバンドギャップ半導体は、例えば、炭化珪素、窒化ガリウム系材料、又はダイヤモンドである。このようなワイドバンドギャップ半導体によって形成された半導体装置は、耐電圧性や許容電流密度が高いため、小型化できる。この小型化された装置を用いることで、この装置を組み込んだ半導体モジュールも小型化できる。また、素子の耐熱性が高いため、ヒートシンクの放熱フィンを小型化でき、水冷部を空冷化できるので、半導体モジュールを更に小型化できる。また、素子の電力損失が低く高効率であるため、半導体モジュールを高効率化できる。
１　ＩＧＢＴ、２　ＦＷＤ、３　配線領域、４　終端領域、５　ｎ－型ドリフト層、６　ｐ型ベース層、７　ｎ＋型エミッタ層、８　ｐ型コレクタ層、１０　ｐ型アノード層、１１　ｎ型カソード層、１２　ｐ型ウエル、１３　ゲート配線

Claims (8)

  1. 　ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型ベース層及びｎ型エミッタ層と、前記ｎ型ドリフト層の裏面に形成されたｐ型コレクタ層とを有するＩＧＢＴ（Insulated Gate Bipolar Transistor）と、
    　前記ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型アノード層と、前記ｎ型ドリフト層の裏面に形成されたｎ型カソード層とを有するＦＷＤ（Free Wheeling Diode）と、
    　配線領域と終端領域において前記ｎ型ドリフト層の表面に形成されたｐ型ウエルと、
    　前記配線領域において前記ｐ型ウエル上に形成された配線とを備え、
    　前記ｐ型ウエルは前記ｐ型アノード層に対して不純物濃度が高くかつ深さが深く、
    　前記ｐ型ウエルは、前記ｎ型カソード層の直上には形成されておらず、前記ｎ型カソード層の直上領域から離れていることを特徴とする半導体装置。
  2. 　前記ｐ型ウエルは前記ｎ型カソード層の直上領域から少なくとも前記ｎ型ドリフト層の厚み以上離れていることを特徴とする請求項１に記載の半導体装置。
  3. 　前記ＦＷＤの形成領域には前記ｎ型エミッタ層は形成されておらず、
    　前記ｐ型ベース層と前記ｐ型アノード層は深さと濃度が同じであることを特徴とする請求項１又は２に記載の半導体装置。
  4. 　前記配線領域及び前記終端領域と前記ＦＷＤの形成領域との間の領域に前記ＩＧＢＴが形成されていることを特徴とする請求項１～３の何れか１項に記載の半導体装置。
  5. 　平面視において前記ＩＧＢＴと前記ＦＷＤが一定の間隔で繰り返し形成されていることを特徴とする請求項１～４の何れか１項に記載の半導体装置。
  6. 　ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型ベース層及びｎ型エミッタ層と、前記ｎ型ドリフト層の裏面に形成されたｐ型コレクタ層とを有するＩＧＢＴと、
    　前記ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型アノード層と、前記ｎ型ドリフト層の裏面に形成されたｎ型カソード層とを有するＦＷＤと、
    　配線領域と終端領域において前記ｎ型ドリフト層の表面に形成されたｐ型ウエルと、
    　前記配線領域において前記ｐ型ウエル上に形成された配線とを備え、
    　前記ｐ型ウエルは前記ｐ型アノード層に対して深さが深くかつ不純物濃度が低いことを特徴とする半導体装置。
  7. 　ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型ベース層及びｎ型エミッタ層と、前記ｎ型ドリフト層の裏面に形成されたｐ型コレクタ層とを有するＩＧＢＴと、
    　前記ｎ型ドリフト層と、前記ｎ型ドリフト層の表面に形成されたｐ型アノード層と、前記ｎ型ドリフト層の裏面に形成されたｎ型カソード層とを有するＦＷＤと、
    　配線領域と終端領域において前記ｎ型ドリフト層の表面に形成されたｐ型ウエルと、
    　前記配線領域において前記ｐ型ウエル上に形成された配線とを備え、
    　前記ｐ型ウエルは前記ｐ型アノード層に対して不純物濃度と深さが同じであることを特徴とする半導体装置。
  8. 　前記ｐ型ウエルと前記ｐ型アノード層はＰ型不純物を同時に注入及び拡散することで形成されることを特徴とする請求項７に記載の半導体装置。
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JP2016564507A JP6269860B2 (ja) 2014-12-17 2014-12-17 半導体装置
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