WO2016072011A1 - Procédé de formation de câblage - Google Patents

Procédé de formation de câblage Download PDF

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Publication number
WO2016072011A1
WO2016072011A1 PCT/JP2014/079540 JP2014079540W WO2016072011A1 WO 2016072011 A1 WO2016072011 A1 WO 2016072011A1 JP 2014079540 W JP2014079540 W JP 2014079540W WO 2016072011 A1 WO2016072011 A1 WO 2016072011A1
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WO
WIPO (PCT)
Prior art keywords
metal
wiring
hole
resin layer
metal column
Prior art date
Application number
PCT/JP2014/079540
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English (en)
Japanese (ja)
Inventor
良崇 橋本
政利 藤田
謙磁 塚田
明宏 川尻
雅登 鈴木
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2014/079540 priority Critical patent/WO2016072011A1/fr
Priority to JP2016557420A priority patent/JP6441954B2/ja
Publication of WO2016072011A1 publication Critical patent/WO2016072011A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a wiring forming method for forming a wiring on a circuit board by firing a metal-containing liquid that is a liquid containing metal fine particles.
  • a technique for forming wiring on a circuit board by firing a metal-containing liquid that is a liquid containing metal fine particles has been developed. Specifically, for example, a metal-containing liquid is applied between a plurality of conductive portions disposed on a circuit board, and the metal-containing liquid is irradiated with a laser. Thereby, a wiring is formed by baking a metal containing liquid.
  • the technique described in the above patent document it is possible to appropriately form wiring on the circuit board to some extent.
  • the conductive portion not only the conductive portion but also resin or the like is disposed on the circuit board, and there is a possibility that the wiring cannot be formed properly when the wiring is formed across the conductive portion and the resin. .
  • the thermal conductivity of the conductive part is high, when the laser is irradiated on the metal-containing liquid on the conductive part, the heat from the laser is easily transmitted through the conductive part. For this reason, the laser irradiation amount per unit area necessary for firing the metal-containing liquid on the conductive portion (hereinafter, sometimes referred to as “conductive portion irradiation amount”) is relatively large.
  • the thermal conductivity of the resin is low, when the laser is irradiated on the metal-containing liquid on the resin, the heat from the laser is not easily escaped through the resin. For this reason, the laser irradiation amount per unit area necessary for firing the metal-containing liquid on the resin (hereinafter sometimes referred to as resin irradiation amount) is relatively small.
  • the metal-containing liquid on the conductive part is appropriately baked.
  • the wiring is formed.
  • the metal-containing liquid on the resin is fired, but the wiring formed by firing may be damaged by excessive heat.
  • the metal-containing liquid on the resin is appropriately baked to form a wiring. The On the other hand, there is a possibility that the metal-containing liquid on the conductive part is not baked and wiring is not formed.
  • the metal-containing liquid on the resin is irradiated with a laser corresponding to the dose for the resin
  • the metal-containing liquid on the conductive portion is irradiated with a laser corresponding to the dose for the conductive portion. That is, it is conceivable to change the laser irradiation amount according to the base material to which the metal-containing liquid is applied.
  • the metal-containing liquid is applied on a portion other than the electrode of the electronic component. Therefore, it is difficult to control the change of the laser irradiation amount.
  • the conductive part is an electrode of an electronic component or the like
  • the metal-containing liquid is applied on an extremely small space other than the electrode of the electronic component, so that it may be very difficult to control the change of the laser irradiation amount. is there.
  • the present invention has been made in view of such a situation, and an object thereof is to provide a technique for easily forming a wiring on a circuit board.
  • a wiring forming method is a wiring formation for forming a wiring for electrically connecting a first conductive portion and a second conductive portion disposed on a circuit board.
  • a method for forming a resin layer wherein the wiring forming method forms a resin layer having a first hole reaching the first conductive portion and a second hole reaching the second conductive portion on the circuit board. The inside of the first hole and the second hole by repeating the discharge of the metal-containing liquid containing metal fine particles into the first hole and the second hole and the laser irradiation of the metal-containing liquid.
  • a resin layer having a first hole reaching the first conductive portion and a second hole reaching the second conductive portion is formed on the circuit board. Then, by laser irradiation to the metal-containing liquid applied between the first metal column disposed in the first hole and the second metal column disposed in the second hole, Wiring for electrically connecting the first conductive portion and the second conductive portion is formed. That is, in the wiring forming method of the present invention, for example, even when the conductive portion is an electrode of an electronic component, the metal-containing liquid is discharged onto two types of base materials, that is, a resin layer and a metal column. .
  • the laser irradiation amount can be changed between the metal-containing liquid on the resin layer and the metal-containing liquid on the metal column, and the laser irradiation amount can be changed relatively easily.
  • the resin layer and the metal column are larger than the portion other than the electrode of the electronic component, the laser irradiation amount can be changed relatively easily.
  • the laser irradiation amount can be changed relatively easily, and wiring can be easily formed on the circuit board.
  • FIG. 1 shows a substrate working apparatus 10 according to an embodiment of the present invention.
  • the substrate working apparatus 10 includes a transfer device 20, a head moving device 22, an ultraviolet irradiation device 24, a laser irradiation device 26, and two inkjet heads 27 and 28.
  • the conveyance device 20 includes a pair of conveyor belts 30 extending in the X-axis direction and an electromagnetic motor (not shown) that rotates the conveyor belt 30.
  • the pair of conveyor belts 30 supports the circuit board 34, and the circuit board 34 is conveyed in the X-axis direction by driving an electromagnetic motor.
  • the transport device 20 has a holding device (not shown). The holding device fixedly holds the circuit board 34 supported by the conveyor belt 30 at a predetermined position (a position where the circuit board 34 in FIG. 1 is illustrated).
  • the head moving device 22 includes an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52.
  • the X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction.
  • the X-axis slider 56 moves to an arbitrary position in the X-axis direction by driving an electromagnetic motor (not shown).
  • the Y-axis direction slide mechanism 52 has a Y-axis slider 58 provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction.
  • the Y-axis slider 58 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (not shown).
  • Two Y-axis sliders 27 and 28 are attached to the Y-axis slider 58 side by side. With such a structure, the ink jet heads 27 and 28 are moved to arbitrary positions on the base 54 by the head moving device 22.
  • the ultraviolet irradiation device 24 is a device that irradiates ultraviolet rays, and is fixed to the lower surface of the Y-axis slider 58 while facing downward. As a result, the Y-axis slider 58 is moved by the head moving device 22, so that an arbitrary position on the circuit board 34 can be irradiated with ultraviolet rays.
  • the laser irradiation device 26 is a device that irradiates a laser, and is fixed to the lower surface of the Y-axis slider 58 while facing downward. As a result, the Y-axis slider 58 is moved by the head moving device 22, so that an arbitrary position on the circuit board 34 can be irradiated with the laser.
  • the laser irradiation device 26 can arbitrarily change the laser irradiation amount per unit area of the laser to be irradiated.
  • the inkjet head 27 has a discharge port (not shown) formed on the lower surface side, and discharges ultraviolet curable resin onto the circuit board 34 from the discharge port.
  • the ultraviolet curable resin is a resin that is cured by the ultraviolet irradiation of the ultraviolet irradiation device 24.
  • the inkjet head 28 has an ejection port (not shown) formed on the lower surface side, and ejects metal ink onto the circuit board 34 from the ejection port.
  • the metal ink is obtained by dispersing fine metal particles in a solvent, and becomes a wiring by being baked by laser irradiation of the laser irradiation device 26.
  • wiring is formed on the circuit board 34 with the above-described configuration, and conductive portions such as a plurality of electrodes disposed on the circuit board 34 are electrically connected by the wiring.
  • the wiring is formed by a conventional method, the base material disposed under the wiring is different, and thus there is a possibility that the wiring cannot be formed appropriately.
  • An inclined portion 70 is formed between the electronic component 64 and the conductors 60 and 62.
  • the inclined portion 70 has an inclined surface that smoothly continues to the surface of the electronic component 64 and the surfaces of the conductors 60 and 62, and discharge of the ultraviolet curable resin from the inkjet head 27 and the discharged ultraviolet curable resin. It is formed by repeating the irradiation of the ultraviolet rays by the ultraviolet irradiation device 24.
  • the inkjet head 27 discharges the ultraviolet curable resin in a thin film shape between the electronic component 64 and the conductors 60 and 62, and the ultraviolet irradiation device 24 irradiates the thin film ultraviolet curable resin with ultraviolet rays.
  • a thin resin layer is formed.
  • the inclination part 70 is formed by repeating discharge of the ultraviolet curable resin on the thin film-like resin layer, and irradiation of an ultraviolet-ray.
  • the conductor 60 and the electrode 66 of the electronic component 64, and the conductor 62 and the electronic component 64 Metal ink 72 is discharged from the inkjet head 28 across the conductors 60 and 62, the electronic component 64, and the inclined portion 70 so as to connect the electrode 68.
  • the ejected metal ink 72 is irradiated with a laser from the laser irradiation device 26, whereby the metal ink 72 is baked, and the conductors 60 and 62 and the electrodes 66 and 62 of the electronic component 64 are baked by baking the metal ink 72.
  • a wiring for electrically connecting to 68 is formed.
  • the firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there.
  • the metal ink 72 is baked, a metal wiring is formed.
  • the metal ink 72 irradiated with the laser is ejected across the conductors 60 and 62, the electronic component 64, and the inclined portion 70, there is a possibility that the wiring is not properly formed.
  • a laser is applied to the metal ink 72 ejected on a substrate having a high thermal conductivity, a substrate having a large heat capacity, or a substrate having a large volume
  • the heat generated by the laser is the substrate. Easy to escape.
  • the laser is applied to the metal ink 72 discharged onto a substrate having a low thermal conductivity, a substrate having a small heat capacity, or a substrate having a small volume, the heat from the laser is applied to the substrate. It's hard to escape.
  • the metal ink 72 discharged onto the substrate having a high thermal conductivity is appropriately baked and the wiring is formed. It is formed.
  • the metal ink 72 discharged onto a substrate having a low thermal conductivity is baked, but the wiring formed by baking may be damaged by excessive heat.
  • the metal ink 72 discharged onto a substrate having a low thermal conductivity is appropriately baked to form a wiring. Is done.
  • the metal ink 72 discharged on a substrate having high thermal conductivity or the like may not be baked and a wiring may not be formed.
  • the metal ink 72 is ejected across a plurality of substrates having different thermal conductivities and the like, there is a possibility that the wiring by firing the metal ink 72 cannot be appropriately formed.
  • the metal ink 72 ejected on the conductors 60 and 62 is irradiated with a laser corresponding to the laser irradiation amount per unit area according to the conductors 60 and 62, and the inclined portion 70.
  • the metal ink 72 discharged above is irradiated with a laser corresponding to the laser irradiation amount per unit area corresponding to the inclined portion 70, and the metal ink 72 discharged on the electronic component 64 is electronically Laser corresponding to the laser irradiation amount per unit area corresponding to the component 64 is irradiated. Since the electronic component 64 is composed of the electrodes 66 and 68 and the main body 76, the metal ink 72 ejected on the electrodes 66 and 68 has a unit area corresponding to the electrodes 66 and 68.
  • the laser corresponding to the amount of laser irradiation is irradiated, and the metal ink 72 ejected on the main body portion 76 is irradiated with the laser corresponding to the laser irradiation amount per unit area corresponding to the main body portion 76.
  • the laser irradiation amount per unit area according to the material of the base material from which the metal ink 72 is discharged, it is possible to appropriately form wiring by firing the metal ink 72. .
  • the laser irradiation range to the metal ink 72 on the main body 76 of the electronic component 64 becomes extremely small, and it is very difficult to change the laser irradiation amount.
  • the substrate working apparatus 10 employs a technique of appropriately forming wiring by reducing the types of base materials onto which the metal ink 72 is discharged as much as possible.
  • a part of the conductors 60 and 62 and the electrodes 66 and 62 of the electronic component 64 are provided on the circuit board 34 on which the conductors 60 and 62 and the electronic component 64 are disposed.
  • the resin layer 78 is formed so that 68 is exposed. That is, the resin layer 78 is formed so as to cover the circuit board 34 except for portions of the conductors 60 and 62 and the electrodes 66 and 68.
  • conductor holes 80 and 82 reaching the conductors 60 and 62 and electrode holes 84 and 86 reaching the electrodes 66 and 68 are formed in the resin layer 78.
  • the resin layer 78 is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 27 and the irradiation of the ultraviolet rays by the ultraviolet irradiation device 24 to the discharged ultraviolet curable resin, similarly to the inclined portion 70.
  • a columnar metal lump obtained by sintering the metal ink 72 may be described inside the conductor holes 80 and 82 and the electrode holes 84 and 86. ) (See FIG. 8) 88 is formed.
  • the metal ink 72 is discharged into the conductor hole 82 by the inkjet head 28 as shown in FIG. 6. Then, the metal ink 72 is irradiated with laser by the laser irradiation device 26 as shown in FIG. As a result, the metal ink 72 is baked, and a film-like metal lump 90 is formed on the conductor 62.
  • the discharge of the metal ink 72 onto the film-like metal lump 90 and the laser irradiation are repeated, so that the metal pillar 88 is formed inside the conductor hole 82 as shown in FIG. Is done.
  • the metal column 88 is exposed on the surface of the resin layer 78.
  • the metal pillar 88 is also formed inside the conductor hole 80 and the electrode holes 84 and 86.
  • the method of forming the metal pillar 88 inside the conductor hole 80 and the electrode holes 84 and 86 is conductive. Since it is the same as the method of forming the metal pillar 88 inside the body hole 82, the description thereof is omitted.
  • the metal pillar 88 When the metal pillar 88 is formed inside the conductor holes 80 and 82 and the electrode holes 84 and 86, as shown in FIG. 9, the metal pillar 88 of the conductor hole 80, the metal pillar 88 of the electrode hole 84, and The metal ink 72 is ejected from the inkjet head 28 so as to connect the metal column 88 of the conductor hole 82 and the metal column 88 of the electrode hole 86. Then, the laser beam is applied to the ejected metal ink 72 by the laser irradiation device 26. Since the metal ink 72 is ejected across the metal column 88 and the resin layer 78, the metal ink 72 is disposed above the metal column 88. The laser irradiation amount per unit area is changed between when the metal ink 72 is irradiated with laser and when the metal ink 72 on the resin layer 78 is irradiated with laser.
  • the thermal conductivity of the metal column 88 is high, the heat from the laser applied to the metal ink 72 on the metal column 88 is easily transmitted through the metal column 88. For this reason, the metal ink 72 on the metal column 88 is irradiated with a laser corresponding to a relatively large value of the laser irradiation amount per unit area (hereinafter sometimes referred to as “metal irradiation amount”).
  • metal irradiation amount the heat conductivity of the resin layer 78 is low, the heat from the laser applied to the metal ink 72 on the resin layer 78 is difficult to escape through the resin layer 78.
  • the metal ink 72 on the resin layer 78 is irradiated with a laser corresponding to a laser irradiation amount per unit area having a relatively small value (hereinafter sometimes referred to as “resin irradiation amount”).
  • the boundary between the metal ink 72 ejected on the metal column 88 and the metal ink 72 ejected on the resin layer 78 corresponds to the metal irradiation amount when the irradiation amount is changed. Both the laser and the laser corresponding to the dose for resin are irradiated. For this reason, the end on the metal column 88 side of the metal ink 72 discharged onto the resin layer 78 (hereinafter, may be referred to as “end-of-metal ink on resin”) corresponds to the irradiation dose for metal. There is a possibility that the end of the metal ink on the resin is damaged by the laser irradiation.
  • the metal ink 72 discharged on the resin layer 78 is irradiated with a laser corresponding to the resin dose. Thereby, the metal ink 72 discharged onto the resin layer 78 is appropriately baked.
  • the wavelength of the laser irradiated to the metal ink 72 is set to 500 to 1500 nm. Since this wavelength is a wavelength that is easily absorbed by the metal fine particles contained in the metal ink 72, the metal ink 72 is appropriately baked.
  • the laser irradiation amount is changed from the resin irradiation amount to the metal irradiation amount.
  • the laser corresponding to the irradiation amount for metal is irradiated on the boundary between the metal ink 72 discharged onto the resin layer 78 and the metal ink 72 discharged onto the metal column 88. Since the metal ink 72 discharged on the layer 78 is baked, damage to the end portion of the metal ink on the resin is prevented.
  • the wavelength of the laser irradiated to the metal ink 72 is 500 to 1500 nm as described above, and this wavelength is a wavelength that is easily absorbed by the metal fine particles.
  • the end portion of the metal ink on the resin becomes a lump of metal, that is, a wiring due to the firing of the metal fine particles, and the laser absorbability is low. For this reason, even if the laser corresponding to the irradiation amount for metal is irradiated, damage to the end of the metal ink on the resin is prevented.
  • the metal ink 72 discharged onto the metal column 88 is irradiated with a laser, whereby the metal ink 72 discharged onto the metal column 88 is irradiated. Is appropriately fired.
  • the metal ink 72 discharged onto the resin layer 78 and the metal column 88 is appropriately fired, and as shown in FIG. Wirings 96 and 98 for electrically connecting the metal pillar 88 of the body hole 80 and the metal pillar 88 of the electrode hole 84 and the metal pillar 88 of the conductor hole 82 and the metal pillar 88 of the electrode hole 86 are formed.
  • the conductor 60 and the electrode 66 of the electronic component 64 are electrically connected via the metal column 88 of the conductor hole 80, the metal column 88 of the electrode hole 84, and the wiring 96.
  • the electrode 68 of the electronic component 64 is electrically connected through the metal column 88 of the conductor hole 82, the metal column 88 of the electrode hole 86, and the wiring 98.
  • the resin layer 78 and the metal pillar 88 there are two types of base materials on which the metal ink 72 is discharged, that is, the resin layer 78 and the metal pillar 88, and the laser irradiation amount can be easily changed. Further, unlike the conventional wiring formation, there is no laser irradiation to the metal ink 72 on the main body portion 76 of the extremely small electronic component 64, so that the change control of the laser irradiation amount becomes very easy.
  • the conductors 60 and 62 are an example of the first conductive part.
  • the electrodes 66 and 68 are an example of a second conductive part and electrodes.
  • the resin layer 78 is an example of a resin layer.
  • the conductor holes 80 and 82 are an example of a first hole.
  • the electrode holes 84 and 86 are an example of a second hole.
  • the metal column 88 is an example of a metal column.
  • the step of forming the resin layer 78 on the circuit board 34 is an example of a resin layer forming step.
  • the process of forming the metal pillar 88 inside the conductor holes 80 and 82 and the electrode holes 84 and 86 is an example of a metal pillar forming process.
  • the ink jet head 28 discharges the metal ink 72 so as to connect the metal pillar 88 of the conductor hole 80 and the metal pillar 88 of the electrode hole 84 and the metal pillar 88 of the conductor hole 82 and the metal pillar 88 of the electrode hole 86.
  • the step of performing is an example of a coating step.
  • the process of forming the wirings 96 and 98 by irradiating the ejected metal ink 72 with laser by the laser irradiation device 26 is an example of the wiring forming process.
  • the wiring can be formed by a different formation method from the above-described wiring formation method. Specifically, first, as in the above embodiment, a resin layer 78 is formed on the circuit board 34 as shown in FIG. When the resin layer 78 is formed, as shown in FIG. 11, an ink jet is formed so as to connect the edge of the conductor hole 80 and the edge of the electrode hole 84, and the edge of the conductor hole 82 and the edge of the electrode hole 86. Metal ink 72 is ejected from the head 28. The ejected metal ink 72 is irradiated with a laser corresponding to the resin dose by the laser irradiation device 26. Accordingly, as shown in FIG. 12, wiring is performed between the edge of the conductor hole 80 on the resin layer 78 and the edge of the electrode hole 84 and between the edge of the conductor hole 82 and the edge of the electrode hole 86. 100 is formed.
  • the discharge of the metal ink 72 into the conductor holes 80 and 82 and the electrode holes 84 and 86 and the laser irradiation of the discharged metal ink 72 are repeated.
  • metal pillars 88 are formed in the conductor holes 80 and 82 and the electrode holes 84 and 86, as shown in FIG.
  • the metal ink 72 is discharged onto the conductor holes 80 and 82 and the metal columns 88 of the electrode holes 84 and 86.
  • the metal ink 72 is discharged onto the metal column 88 so as to connect the metal column 88 and the wiring 100.
  • the metal ink 72 discharged on the metal pillar 88 is irradiated with a laser corresponding to the metal irradiation amount.
  • the wiring 102 connecting the metal column 88 and the wiring 100 is formed on the metal column 88.
  • the conductor 60 and the electrode 66 of the electronic component 64 are electrically connected via the metal column 88 of the conductor hole 80, the metal column 88 of the electrode hole 84, and the wirings 100 and 102.
  • 62 and the electrode 68 of the electronic component 64 are electrically connected via the metal column 88 of the conductor hole 82, the metal column 88 of the electrode hole 86, and the wirings 100 and 102.
  • the wiring 100 on the resin layer 78 and the wiring 102 on the metal pillar 88 are formed in separate steps. Thereby, when the wiring 100 on the resin layer 78 is formed, it is possible to prevent heat from escaping toward the metal column, to easily change the laser irradiation amount, and to easily control the laser irradiation device 26 and the like. .
  • the step of forming the resin layer 78 on the circuit board 34 is an example of a resin layer forming step.
  • the step of discharging the metal ink 72 onto the resin layer 78 is an example of a first application step.
  • the process of irradiating the metal ink 72 on the resin layer 78 with laser to form the wiring 100 is an example of a first wiring forming process.
  • the process of forming the metal pillar 88 inside the conductor holes 80 and 82 and the electrode holes 84 and 86 is an example of a metal pillar forming process.
  • the step of discharging the metal ink 72 onto the metal column 88 is an example of a second application step.
  • the process of irradiating the metal ink 72 on the metal pillar 88 with laser to form the wiring 102 is an example of a second wiring forming process.
  • this invention is not limited to the said Example and modification, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
  • the resin layer 78 and the metal ink 72 discharged onto the metal column 88 are irradiated with laser, and the metal ink 72 is baked.
  • the metallic ink 72 can be baked by irradiating the metallic ink 72 discharged on the base material of various materials other than 78 and the metallic pillar 88 with a laser.
  • Electrode hole (second hole) 60: Conductor (first conductive part) 62: Conductor (first conductive part) 66: Electrode (second conductive part) 68: Electrode (second conductive part) 78: Resin layer 80: Conductor hole (first Hall) 82: Conductor hole (first hole) 84: Electrode hole (second hole) 86: Electrode hole (second hole) 88: Metal pillar

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Selon l'invention, une couche de résine (78) qui possède un orifice d'électrode (86) menant à une électrode (68) et un orifice de conducteur (82) menant à un conducteur (62), est formée sur une carte de circuit imprimé (34). Puis, un câblage destiné à connecter électriquement l'électrode et le conducteur, est formé par irradiation au laser d'une encre métallique (72) appliquée entre une colonne métallique (88) placée dans la partie interne de l'orifice d'électrode et une colonne métallique (88) placée dans la partie interne de l'orifice de conducteur. Ainsi, une variation de quantité d'irradiation laser peut être effectuée entre l'encre métallique se trouvant sur la couche de résine et l'encre métallique se trouvant sur les colonnes métalliques, et il est possible d'effectuer une variation de quantité d'irradiation laser de manière relativement aisée. Enfin, la couche de résine et les colonnes métalliques, étant assez importantes en taille, il est possible d'effectuer une variation de quantité d'irradiation laser de manière relativement aisée.
PCT/JP2014/079540 2014-11-07 2014-11-07 Procédé de formation de câblage WO2016072011A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2014/079540 WO2016072011A1 (fr) 2014-11-07 2014-11-07 Procédé de formation de câblage
JP2016557420A JP6441954B2 (ja) 2014-11-07 2014-11-07 配線形成方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017212311A (ja) * 2016-05-25 2017-11-30 株式会社フジクラ 配線基板の製造方法
WO2019016920A1 (fr) * 2017-07-20 2019-01-24 株式会社Ｆｕｊｉ Procédé et dispositif de formation de câblage

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JP2006032535A (ja) * 2004-07-14 2006-02-02 Seiko Epson Corp 層形成方法、配線基板、電気光学装置、および電子機器
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JP2017212311A (ja) * 2016-05-25 2017-11-30 株式会社フジクラ 配線基板の製造方法
WO2019016920A1 (fr) * 2017-07-20 2019-01-24 株式会社Ｆｕｊｉ Procédé et dispositif de formation de câblage
JPWO2019016920A1 (ja) * 2017-07-20 2019-12-12 株式会社Ｆｕｊｉ 配線形成方法、および配線形成装置

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