WO2016199242A1 - Dispositif de formation de motif de circuit - Google Patents

Dispositif de formation de motif de circuit Download PDF

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Publication number
WO2016199242A1
WO2016199242A1 PCT/JP2015/066734 JP2015066734W WO2016199242A1 WO 2016199242 A1 WO2016199242 A1 WO 2016199242A1 JP 2015066734 W JP2015066734 W JP 2015066734W WO 2016199242 A1 WO2016199242 A1 WO 2016199242A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
metal ink
irradiation
light
irradiation device
Prior art date
Application number
PCT/JP2015/066734
Other languages
English (en)
Japanese (ja)
Inventor
謙磁 塚田
政利 藤田
良崇 橋本
明宏 川尻
雅登 鈴木
克明 牧原
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2015/066734 priority Critical patent/WO2016199242A1/fr
Priority to JP2017523023A priority patent/JP6572308B2/ja
Publication of WO2016199242A1 publication Critical patent/WO2016199242A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a circuit pattern forming apparatus for forming a circuit pattern by forming a wiring with a metal-containing liquid containing metal fine particles.
  • the metal-containing liquid may be discharged onto the metal-containing liquid.
  • the metal-containing liquid that has been discharged first and the metal-containing liquid are discharged onto the metal-containing liquid.
  • the resulting metal-containing liquid may be integrated and basilized.
  • the metal-containing liquid is converted into basil, a part of the metal-containing liquid discharged in a linear shape is swelled, which may cause an abnormal wiring shape, disconnection of the wiring, or the like.
  • the circuit board is heated by a heating device such as a heater, and the metal-containing liquid is discharged onto the heated circuit board.
  • a heating device such as a heater
  • the metal-containing liquid is discharged onto the heated circuit board, the solvent contained in the metal-containing liquid is dried, and basilization of the metal-containing liquid can be prevented.
  • the provision of the heater causes problems such as an increase in size and cost of the circuit pattern forming apparatus.
  • This invention is made
  • a circuit pattern forming apparatus of the present invention includes a first discharge device that discharges a curable resin that is cured by light irradiation, and light is applied to the curable resin that is discharged by the first discharge device.
  • a circuit pattern forming apparatus for forming a circuit pattern comprising: a first discharge device, a first irradiation device, a second discharge device, and a control device that controls the operation of each of the second irradiation devices.
  • a resin layer forming part that forms a resin layer by irradiating light to the curable resin discharged by the first discharge device by the first irradiation device, and a metal containing material discharged by the second discharge device Liquid
  • a wiring forming portion that forms wiring by irradiating laser light from the second irradiation device, and the wiring forming portion applies the first irradiation device to the metal-containing liquid discharged by the second discharging device. It has the 1st irradiation part which irradiates light by, It is characterized by the above-mentioned.
  • the resin layer is formed by irradiating the curable resin discharged by the first discharge device with light by the first irradiation device. Further, the metal-containing liquid discharged by the second discharge device is irradiated with laser light by the second irradiation device, thereby forming a wiring. However, at the time of wiring formation, the first irradiation device irradiates light to the metal-containing liquid discharged by the second discharge device. By irradiating the metal-containing liquid with light from the first irradiation device, the solvent contained in the metal-containing liquid is dried, and basilization of the metal-containing liquid is prevented.
  • the solvent of the metal-containing liquid is dried by the first irradiation device used at the time of forming the resin layer without newly providing a heating device such as a heater. This makes it possible to prevent the metal-containing liquid from being basilized without intentionally arranging a heater or the like.
  • FIG. 1 shows a circuit pattern forming apparatus 10.
  • the circuit pattern forming apparatus (hereinafter may be abbreviated as “forming apparatus”) 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 6) 26.
  • the conveying device 20, the first modeling unit 22, and the second modeling unit 24 are disposed on the base 28 of the forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 6) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 6) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a circuit board or the like is placed on the upper surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edge portions in the X-axis direction of the circuit board or the like placed on the base 60 are sandwiched by the holding device 62, whereby the circuit board or the like is fixedly held.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the first modeling unit 22 is, for example, a unit that models the wiring (see FIG. 3) 80 on the circuit board (see FIG. 3) 70 placed on the base 60 of the stage 52, and the first printing unit 72. And a firing part 74.
  • the first printing unit 72 includes an inkjet head 76, and discharges the metal ink 77 in a linear manner onto the circuit board 70 placed on the base 60.
  • the metal ink 77 is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 ejects the metal ink 77 from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device 78, as shown in FIG.
  • the laser irradiation device 78 is a device that irradiates the metal ink 77 discharged onto the circuit board 70 with a laser, and the metal ink 77 irradiated with the laser is baked to form the wiring 80.
  • the firing of the metal ink 77 is a phenomenon in which, by applying energy, the solvent is vaporized, the metal fine particle protective film is decomposed, and the like, and the metal fine particles are contacted or fused to increase the conductivity. It is.
  • the metal wiring 77 is formed by baking the metal ink 77.
  • the 2nd modeling unit 24 is a unit which models the resin layer (refer FIG. 5) 82 on the circuit board (refer FIG. 5) 70 mounted in the base 60 of the stage 52, for example, FIG.
  • the second printing unit 84 and the curing unit 86 are provided.
  • the second printing unit 84 has an inkjet head 88 and discharges the ultraviolet curable resin 90 onto the circuit board 70 placed on the base 60.
  • the ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
  • the curing unit 86 includes a flattening device 96 and an irradiation device 98.
  • the flattening device 96 flattens the upper surface of the ultraviolet curable resin 90 discharged onto the circuit board 70 by the ink jet head 88.
  • the flattening device 96 removes excess resin while leveling the surface of the ultraviolet curable resin 90.
  • the thickness of the ultraviolet curable resin 90 is made uniform by scraping with a roller or a blade.
  • the irradiation device 98 includes a mercury lamp as a light source, and irradiates the ultraviolet curable resin 90 discharged on the circuit board 70 with ultraviolet rays. Thereby, the ultraviolet curable resin 90 discharged on the circuit board 70 is cured, and the resin layer 82 is formed.
  • the control device 26 includes a controller 102 and a plurality of drive circuits 104 as shown in FIG.
  • the plurality of drive circuits 104 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 96, and the irradiation device 98.
  • the controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operation of the transport device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 102.
  • a circuit pattern is formed by forming wiring and a resin layer on the circuit board 70 with the above-described configuration.
  • the circuit board 70 is set on the base 60 of the stage 52.
  • the stage 52 is moved below the first modeling unit 22, and the first printing unit 72 uses the ink jet head 76 as shown in FIG.
  • Metal ink 77 is ejected onto 70.
  • the metal ink 77 is intermittently discharged.
  • the metallic ink 77 is further ejected by the inkjet head 76 onto the intermittently ejected metallic ink 77.
  • the metal ink 77 discharged on the circuit board 70 is connected linearly.
  • the laser is irradiated by the laser irradiation device 78 on the metal ink 77 discharged onto the circuit board 70.
  • the metal ink 77 is baked, and wiring 80 is formed on the circuit board 70 as shown in FIG.
  • the stage 52 is moved below the second modeling unit 24, and in the second printing unit 84, as shown in FIG.
  • An ultraviolet curable resin 90 is discharged on the circuit board 70 in a thin film shape.
  • the curing unit 86 the discharged ultraviolet curable resin 90 is flattened by the flattening device 96 so that the film thickness becomes uniform.
  • the irradiation device 98 irradiates the flattened ultraviolet curable resin 90 with ultraviolet rays.
  • a thin resin layer 82 is formed on the circuit board 70.
  • the metal ink 77 is obtained by dispersing metal fine particles in a solvent, and many of the solvents used for the metal ink 77 have high boiling points and are difficult to dry. For this reason, when the metal ink is further discharged onto the metal ink 77 at the time of wiring formation, the metal ink 77 previously discharged and the metal ink 77 discharged onto the metal ink 77 are formed. Unify and bulge.
  • the metal ink 77 When the metal ink 77 is bulged, a part of the metal ink 77 ejected in a linear shape is swelled, which may cause an abnormal wiring shape, disconnection of the wiring, or the like. Further, when the metal ink 77 is baked, the metal ink 77 is irradiated with laser light. However, if the amount of the solvent contained in the metal ink 77 is large, the amount of laser irradiation increases, resulting in a decrease in throughput, damage to the circuit board, and the like. May occur.
  • the stage 52 is provided with a heater, and the circuit board 70 is heated by the heater. Then, the metal ink 77 is ejected onto the heated circuit board 70, and the metal ink 77 is baked to form wiring. In this way, by heating the circuit board 70 and drying the solvent contained in the metal ink 77, it is possible to suppress bulging of the metal ink 77. Further, by drying the solvent, it is possible to reduce the laser irradiation amount, and it is possible to prevent a decrease in throughput, damage to the circuit board, and the like.
  • the arrangement of the heater on the stage 52 causes problems such as an increase in the size of the apparatus and an increase in cost.
  • the nozzle surface of the inkjet head 76 may be dried by the heat of the heater, and the nozzle may be clogged.
  • the circuit board 70 is damaged by heating the circuit board 70 as a whole by the heater.
  • the metal ink 77 is dried by the irradiation device 98 used at the time of forming the resin layer at the time of wiring formation.
  • the stage 52 is moved below the second modeling unit 24.
  • the circuit board 70 is irradiated with ultraviolet rays by the irradiation device 98.
  • the irradiation device 98 includes a mercury lamp as a light source, and the mercury lamp irradiates light of a relatively wide wavelength (about 200 to 2000 nm) including not only ultraviolet rays but also visible light and infrared rays. . For this reason, the upper surface of the circuit board 70 is heated by the light irradiation of the irradiation device 98.
  • the stage 52 is moved below the first modeling unit 22, and the metal ink 77 is ejected onto the circuit board 70 by the inkjet head 76 in the first printing unit 72 as shown in FIG. 7. .
  • the solvent of the metal ink 77 discharged onto the circuit board 70 is dried and vaporized.
  • the metal ink 77 ejected by the inkjet head 76 contains not only metal fine particles but also inorganic or organic fine powder.
  • titanium dioxide zinc oxide
  • black pigment carbon black, iron black (magnetite), copper / chromium black, cobalt black
  • red pigment lead red, iron oxide red (hematite) as inorganic fine powder
  • Yellow pigment yellow lead, zinc yellow (zinc yellow 1 type, zinc yellow 2 type), yellow iron oxide
  • blue pigment ultramarine blue, prussian blue (potassium ferrocyanide), cobalt blue, cerulean blue
  • Manganese blue, tungsten blue, Egypt blue green pigments (chromium oxide, viridian, cobalt green, cobalt chrome green, Victoria green, Egypt green, manganese green).
  • organic fine powders yellow pigments (isoindolinone, isoindoline, azomethine, anthraquinone, anthrone, xanthene), orange pigments (diketopyrrolopyrrole, perylene, anthraquinone (anthrone), perinone, quinacridone, indigoid), Red pigment (quinacridone, diketopyrrolopyrrole, anthraquinone, perylene, perinone, indigoid), purple pigment (dioxazine, quinacridone, perylene, indigoid, anthraquinone (anthrone), xanthene), blue pigment (phthalocyanine, anthraquinone, indigoid), green pigment (Phthalocyanine, azomethine, perylene) and the like.
  • the size of the fine powder is preferably about 100 to 300 nm in consideration of the nozzle diameter of the ink
  • the stage 52 is moved below the second modeling unit 24. Then, as shown in FIG. 12, in the curing unit 86, the irradiation device 98 irradiates the metal ink 77 discharged on the circuit board 70 with light. Thereby, the metal ink 77 discharged on the circuit board 70 is heated, and the solvent of the metal ink 77 is further dried and vaporized.
  • the metal ink 77 contains not only metal fine particles but also fine powder. Since the fine powder is an oxidized metal fine powder or a colored fine powder, it absorbs light efficiently. Therefore, the metal ink 77 is efficiently heated by light irradiation, and the solvent of the metal ink 77 is efficiently dried and vaporized.
  • the stage 52 When light is irradiated onto the metal ink 77 by the irradiation device 98, the stage 52 is moved below the first modeling unit 22, and the first printing unit 72 uses the ink jet head 76 as shown in FIG.
  • the metal ink 77 is ejected onto the metal ink 77 that is ejected at the same time.
  • the metal ink 77 since the metal ink 77 previously ejected onto the circuit board 70 is vaporized by the irradiation of light from the irradiation device 98, the metal ink 77 ejected earlier and the metal ink 77 Bulging with the metal ink 77 ejected upward is prevented.
  • the metal ink 77 is connected linearly in a state where no swelling, disconnection or the like occurs.
  • the stage 52 When the metal ink 77 is ejected linearly onto the circuit board 70, the stage 52 is moved below the second modeling unit 24, and as shown in FIG. Light is irradiated to the metal ink 77 discharged on the circuit board 70. Thereby, the solvent of the newly ejected metal ink 77 is dried and vaporized on the metal ink 77. Then, the stage 52 is moved below the first modeling unit 22, and the laser 80 is irradiated to the metal ink 77 discharged to the circuit board 70 by the laser irradiation device 78 in the baking unit 74, thereby forming the wiring 80. .
  • the metal ink 77 is baked with a small laser irradiation amount. Thereby, it is possible to prevent a decrease in throughput, damage to the circuit board, and the like.
  • the metal ink 77 that has been ejected is dried by irradiation with light from the irradiation device 98, so that the metal ink is discharged. 77 can be prevented from becoming basil, and abnormal wiring shape, disconnection of wiring, and the like can be prevented. Further, before the metal ink 77 is baked by the laser light, the metal ink 77 is dried by light irradiation of the irradiation device 98 to prevent the metal ink 77 from scattering due to bumping, and the laser irradiation amount is reduced. It is possible to prevent a decrease in throughput and damage to the circuit board.
  • the metal ink 77 is dried by the irradiation device 98 used for forming the resin layer without newly arranging a heating device such as a heater.
  • a heating device such as a heater
  • the metal ink 77 discharged onto the circuit board 70 is heated by the light irradiation of the irradiation device 98. For this reason, it is possible to reduce damage to the circuit board 70 rather than heating the entire circuit board 70 with a heater or the like. Further, it is possible to prevent the inkjet head 76 from being dried due to the heating of the circuit board 70, and it is possible to prevent nozzle clogging and the like.
  • the controller 102 of the control device 26 includes a resin layer forming part 110 and a wiring forming part 112 as shown in FIG.
  • the resin layer forming unit 110 is a functional unit for forming a resin layer in the second modeling unit 24.
  • the wiring forming unit 112 is a functional unit for forming a wiring in the first modeling unit 22.
  • the wiring forming unit 112 includes a first irradiation unit 116 and a second irradiation unit 118.
  • the first irradiation unit 116 is a functional unit for irradiating the metal ink 77 with light by the irradiation device 98.
  • the second irradiation unit 118 is a functional unit for irradiating the metal ink 77 with laser light by the laser irradiation device 78.
  • the forming apparatus 10 is an example of a circuit pattern forming apparatus.
  • the control device 26 is an example of a control device.
  • the inkjet head 76 is an example of a second ejection device.
  • the laser irradiation device 78 is an example of a second irradiation device.
  • the inkjet head 88 is an example of a first discharge device.
  • the irradiation device 98 is an example of a first irradiation device.
  • the resin layer forming unit 110 is an example of a resin layer forming unit.
  • the wiring forming unit 112 is an example of a wiring forming unit.
  • the first irradiation unit 116 is an example of a first irradiation unit.
  • the second irradiation unit 118 is an example of a second irradiation unit.
  • this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
  • a mercury lamp is used as the light source of the irradiation device 98, but various light sources such as LEDs can be used as long as they can irradiate ultraviolet rays.
  • a light source capable of emitting light including a long wavelength in consideration of drying of the metal ink 77, it is preferable to employ a light source capable of emitting light including a long wavelength.
  • forming device circuit pattern forming device
  • control device 76 inkjet head (second ejection device)
  • 88 inkjet head (first ejection device)
  • 98 irradiation device ( (First irradiation device) 110: resin layer forming unit 112: wiring forming unit 116: first irradiation unit 118: second irradiation unit

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un dispositif de formation de motif de circuit dans lequel une résine durcissable aux ultraviolets déchargée à partir d'une tête à jet d'encre est exposée à la lumière à l'aide d'un dispositif d'irradiation afin de former une couche de résine. De plus, l'encre métallique déchargée de la tête à jet d'encre est exposée à la lumière laser à l'aide d'un dispositif d'irradiation laser afin de former un câblage. Au moment de former le câblage, l'encre métallique (77) déchargée de la tête à jet d'encre est exposée à la lumière à l'aide du dispositif d'irradiation (98). Au fur et à mesure que l'encre métallique est exposée à la lumière à l'aide du dispositif d'irradiation, le solvant contenu dans l'encre métallique est séché, ce qui évite le gonflement de l'encre métallique. De cette manière, selon la présente invention, dans le dispositif de formation de motif de circuit, le solvant de l'encre métallique est séché au moyen du dispositif d'irradiation utilisé lors de la formation d'une couche de résine, sans utiliser de nouveau un dispositif de réchauffement, tel qu'un chauffage. En conséquence, le gonflement de l'encre métallique peut être évité, sans qu'il soit nécessaire d'installer un chauffage ou similaire.
PCT/JP2015/066734 2015-06-10 2015-06-10 Dispositif de formation de motif de circuit WO2016199242A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/066734 WO2016199242A1 (fr) 2015-06-10 2015-06-10 Dispositif de formation de motif de circuit
JP2017523023A JP6572308B2 (ja) 2015-06-10 2015-06-10 回路パターン形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/066734 WO2016199242A1 (fr) 2015-06-10 2015-06-10 Dispositif de formation de motif de circuit

Publications (1)

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WO2016199242A1 true WO2016199242A1 (fr) 2016-12-15

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WO (1) WO2016199242A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
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JP2018157014A (ja) * 2017-03-16 2018-10-04 株式会社Ｆｕｊｉ 回路形成装置
WO2019016920A1 (fr) * 2017-07-20 2019-01-24 株式会社Ｆｕｊｉ Procédé et dispositif de formation de câblage

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JP2009004669A (ja) * 2007-06-25 2009-01-08 Panasonic Corp 金属配線基板の製造方法およびそれを用いて形成した金属配線基板
WO2015041189A1 (fr) * 2013-09-17 2015-03-26 東レエンジニアリング株式会社 Procédé de fabrication d'un substrat multicouche de câblage, et dispositif de modélisation tridimensionnelle utilisé pour celui-ci

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JP4244382B2 (ja) * 2003-02-26 2009-03-25 セイコーエプソン株式会社 機能性材料定着方法及びデバイス製造方法
JP3937169B2 (ja) * 2003-09-26 2007-06-27 セイコーエプソン株式会社 バンプ構造体の製造方法およびバンプ構造体の製造装置
JP2006310346A (ja) * 2005-04-26 2006-11-09 Seiko Epson Corp 機能性膜パターン形成装置、機能性膜パターンの形成方法及び電子機器
WO2013046441A1 (fr) * 2011-09-30 2013-04-04 株式会社メイコー Procédé de fabrication de substrat
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JP2009004669A (ja) * 2007-06-25 2009-01-08 Panasonic Corp 金属配線基板の製造方法およびそれを用いて形成した金属配線基板
WO2015041189A1 (fr) * 2013-09-17 2015-03-26 東レエンジニアリング株式会社 Procédé de fabrication d'un substrat multicouche de câblage, et dispositif de modélisation tridimensionnelle utilisé pour celui-ci

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018157014A (ja) * 2017-03-16 2018-10-04 株式会社Ｆｕｊｉ 回路形成装置
WO2019016920A1 (fr) * 2017-07-20 2019-01-24 株式会社Ｆｕｊｉ Procédé et dispositif de formation de câblage
JPWO2019016920A1 (ja) * 2017-07-20 2019-12-12 株式会社Ｆｕｊｉ 配線形成方法、および配線形成装置

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