JP6811770B2 - 回路形成方法 - Google Patents
回路形成方法 Download PDFInfo
- Publication number
- JP6811770B2 JP6811770B2 JP2018522220A JP2018522220A JP6811770B2 JP 6811770 B2 JP6811770 B2 JP 6811770B2 JP 2018522220 A JP2018522220 A JP 2018522220A JP 2018522220 A JP2018522220 A JP 2018522220A JP 6811770 B2 JP6811770 B2 JP 6811770B2
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- Prior art keywords
- ultraviolet curable
- curable resin
- resin
- resin layer
- ultraviolet
- Prior art date
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- 230000001678 irradiating effect Effects 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 8
- 239000010419 fine particle Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 description 36
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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Description
回路形成装置の構成
図1に回路形成装置10を示す。回路形成装置10は、搬送装置20と、第1造形ユニット22と、第2造形ユニット24と、装着ユニット26と、制御装置(図2参照)27を備える。それら搬送装置20と第1造形ユニット22と第2造形ユニット24と装着ユニット26とは、回路形成装置10のベース28の上に配置されている。ベース28は、概して長方形状をなしており、以下の説明では、ベース28の長手方向をX軸方向、ベース28の短手方向をY軸方向、X軸方向及びY軸方向の両方に直交する方向をZ軸方向と称して説明する。
回路形成装置10では、上述した構成によって、基板70上に電子部品96が装着されることで、回路が形成される。具体的には、ステージ52の基台60に基板70がセットされ、そのステージ52が、第2造形ユニット24の下方に移動される。そして、第2造形ユニット24において、図3に示すように、基板70の上に樹脂積層体130が形成される。樹脂積層体130は、電子部品96を装着するためのキャビティ132を有しており、インクジェットヘッド88からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置92による紫外線の照射とが繰り返されることにより形成される。
第1実施例の回路形成装置10では、キャビティ132の底面に、装着予定の電子部品96のサイズ及び重量に応じた量の紫外線硬化樹脂が吐出され、その紫外線硬化樹脂によって電子部品96が固定されているが、第2実施例の回路形成装置10では、キャビティ132の底面の全体に渡って紫外線硬化樹脂が吐出され、その紫外線硬化樹脂によって電子部品96が固定される。
Claims (5)
- 吐出装置によって吐出された紫外線硬化樹脂を硬化させた樹脂層を用いて、基板に形成されたキャビティの内部に部品が装着された回路を形成する回路形成方法であって、
前記部品の装着予定位置に、前記部品のサイズと重量との少なくとも一方に応じた量の紫外線硬化樹脂を前記吐出装置によって吐出する吐出工程と、
前記吐出工程において吐出された紫外線硬化樹脂の上に前記部品を載置する載置工程と、
前記吐出工程において吐出された紫外線硬化樹脂に紫外線を照射することで、前記載置工程において載置された前記部品を固定する固定工程と、
前記キャビティの前記部品が固定されている個所以外に、前記樹脂層を前記キャビティの上端に連続する面と同じ高さとなるまで積層させる樹脂層積層工程と、
前記樹脂層積層工程において積層された樹脂層の上面と、前記キャビティの上端に連続する面とに渡って前記樹脂層を形成する樹脂層形成工程と、
前記樹脂層形成工程において形成された樹脂層の上面に、金属微粒子を含有する金属含有液を線状に吐出し、その金属含有液を焼成することで配線を形成する配線形成工程と
を含む回路形成方法。 - 吐出装置によって吐出された紫外線硬化樹脂を硬化させた樹脂層を用いて、基板に形成されたキャビティの内部に部品が装着された回路を形成する回路形成方法であって、
前記キャビティの底面の全体に、紫外線硬化樹脂を前記吐出装置によって吐出する吐出工程と、
前記吐出工程において吐出された紫外線硬化樹脂の上の所定の位置に前記部品を載置する載置工程と、
前記吐出工程において吐出された紫外線硬化樹脂に紫外線を照射することで、前記載置工程において載置された前記部品を固定する固定工程と、
前記キャビティの前記部品が固定されている個所以外に、前記樹脂層を前記キャビティの上端に連続する面と同じ高さとなるまで積層させる樹脂層積層工程と、
前記樹脂層積層工程において積層された樹脂層の上面と、前記キャビティの上端に連続する面とに渡って前記樹脂層を形成する樹脂層形成工程と、
前記樹脂層形成工程において形成された樹脂層の上面に、金属微粒子を含有する金属含有液を線状に吐出し、その金属含有液を焼成することで配線を形成する配線形成工程と
を含む回路形成方法。 - 吐出装置によって吐出された紫外線硬化樹脂を硬化させた樹脂層を用いて、基板に部品が装着された回路を形成する回路形成方法であって、
前記部品の装着予定位置に、前記部品のサイズと重量との少なくとも一方に応じた量の紫外線硬化樹脂を前記吐出装置によって吐出する吐出工程と、
前記吐出工程において吐出された紫外線硬化樹脂に、前記部品が載置される前に、紫外線を照射することで紫外線硬化樹脂の粘度を上昇させる紫外線照射工程と、
前記紫外線照射工程における紫外線の照射により粘度の上昇した紫外線硬化樹脂の上に、前記部品を載置する載置工程と、
前記吐出工程において吐出された紫外線硬化樹脂に紫外線を照射することで、前記載置工程において載置された前記部品を固定する固定工程と
を含む回路形成方法。 - 前記部品の装着予定位置が、前記基板に形成されたキャビティの内部である請求項3に記載の回路形成方法。
- 吐出装置によって吐出された紫外線硬化樹脂を硬化させた樹脂層を用いて、基板に形成されたキャビティの内部に部品が装着された回路を形成する回路形成方法であって、
前記キャビティの底面の全体に、紫外線硬化樹脂を前記吐出装置によって吐出する吐出工程と、
前記吐出工程において吐出された紫外線硬化樹脂に、前記部品が載置される前に、紫外線を照射することで紫外線硬化樹脂の粘度を上昇させる紫外線照射工程と、
前記紫外線照射工程における紫外線の照射により粘度の上昇した紫外線硬化樹脂の上に、前記部品を載置する載置工程と、
前記吐出工程において吐出された紫外線硬化樹脂に紫外線を照射することで、前記載置工程において載置された前記部品を固定する固定工程と
を含む回路形成方法。
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