JP7055897B2 - 回路形成方法 - Google Patents
回路形成方法 Download PDFInfo
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- JP7055897B2 JP7055897B2 JP2020556369A JP2020556369A JP7055897B2 JP 7055897 B2 JP7055897 B2 JP 7055897B2 JP 2020556369 A JP2020556369 A JP 2020556369A JP 2020556369 A JP2020556369 A JP 2020556369A JP 7055897 B2 JP7055897 B2 JP 7055897B2
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- 238000000034 method Methods 0.000 title claims description 21
- 230000015572 biosynthetic process Effects 0.000 title description 5
- 239000002184 metal Substances 0.000 claims description 233
- 229910052751 metal Inorganic materials 0.000 claims description 233
- 239000011347 resin Substances 0.000 claims description 102
- 229920005989 resin Polymers 0.000 claims description 102
- 238000010438 heat treatment Methods 0.000 claims description 51
- 239000007788 liquid Substances 0.000 claims description 19
- 239000010419 fine particle Substances 0.000 claims description 15
- 239000002923 metal particle Substances 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 1
- 239000000976 ink Substances 0.000 description 87
- 239000000758 substrate Substances 0.000 description 13
- 238000007639 printing Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
図1に回路形成装置10を示す。回路形成装置10は、搬送装置20と、第1造形ユニット22と、第2造形ユニット24と、装着ユニット26と、制御装置(図2参照)28とを備える。それら搬送装置20と第1造形ユニット22と第2造形ユニット24と装着ユニット26とは、回路形成装置10のベース29の上に配置されている。ベース29は、概して長方形状をなしており、以下の説明では、ベース29の長手方向をX軸方向、ベース29の短手方向をY軸方向、X軸方向及びY軸方向の両方に直交する方向をZ軸方向と称して説明する。
上記第1実施例では、電子部品138が金属ペースト137を介して配線136に電気的に接続されているが、第2実施例では、異なる樹脂積層体の上に形成された2本の配線が金属ペーストにより電気的に接続される。詳しくは、第1造形ユニット22において、図10に示すように、樹脂積層体130の上に金属インク134がインクジェットヘッド76により線状に吐出され、その金属インク134がヒータ78により、120℃で1時間、加熱される。これにより、樹脂積層体130の上に配線136が形成される。
Claims (4)
- 金属微粒子を含有する金属含有液を線状に塗布し、加熱することで配線を形成する配線形成工程と、
前記配線の一部を露出させるキャビティを有するベースを、前記配線の上に形成するベース形成工程と、
前記金属含有液を前記ベース上に前記キャビティの内部に至るように線状に塗布するとともに、前記金属微粒子より大きな金属粒子と樹脂バインダーとを含有する金属ペーストを当該金属含有液に重なるように前記キャビティの内部に塗布する塗布工程と、
前記塗布工程において塗布された前記金属含有液と前記金属ペーストとを加熱することで導電化させる加熱工程と
を含む回路形成方法。 - 硬化性樹脂を薄膜状に塗布することで樹脂層を形成し、前記樹脂層を積層させることで、前記ベースを形成する前記ベース形成工程を、更に含む請求項1に記載の回路形成方法。
- 前記加熱工程は、
前記金属含有液を導電化させるために設定された加熱温度及び加熱時間と、前記金属ペーストを導電化させるために設定された加熱温度及び加熱時間とのうちの、高い加熱温度及び長い加熱時間により加熱することで、前記金属含有液と前記金属ペーストとを導電化させる請求項1または請求項2に記載の回路形成方法。 - 前記金属含有液は、ナノメートルサイズの金属微粒子を含有するものであり、
前記金属ペーストは、マイクロメートルサイズの金属粒子を含有するものである請求項1ないし請求項3のいずれか1つに記載の回路形成方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/040950 WO2020095340A1 (ja) | 2018-11-05 | 2018-11-05 | 回路形成方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2020095340A1 JPWO2020095340A1 (ja) | 2021-09-02 |
JP7055897B2 true JP7055897B2 (ja) | 2022-04-18 |
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Family Applications (1)
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JP2020556369A Active JP7055897B2 (ja) | 2018-11-05 | 2018-11-05 | 回路形成方法 |
Country Status (3)
Country | Link |
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US (1) | US11570900B2 (ja) |
JP (1) | JP7055897B2 (ja) |
WO (1) | WO2020095340A1 (ja) |
Families Citing this family (1)
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US20240023249A1 (en) * | 2020-11-10 | 2024-01-18 | Fuji Corporation | Circuit forming method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3167890B2 (ja) | 1995-08-11 | 2001-05-21 | 本田技研工業株式会社 | ハイブリッド車両の車載発電装置の制御装置 |
JP2001143529A (ja) | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | クリームハンダ配合による導電性接合剤およびそれを使用した接合方法 |
JP2004241514A (ja) | 2003-02-05 | 2004-08-26 | Mitsui Chemicals Inc | 多層回路基板およびその製造方法 |
JP2014017364A (ja) | 2012-07-09 | 2014-01-30 | Panasonic Corp | 部品実装基板の製造システム、および製造方法 |
JP2017516295A (ja) | 2014-03-25 | 2017-06-15 | ストラタシス リミテッド | 層交差パターンを製作する方法及びシステム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61166094A (ja) * | 1985-01-18 | 1986-07-26 | 日本電気株式会社 | 電子回路パツケ−ジの製造方法 |
JPH03167890A (ja) * | 1989-11-28 | 1991-07-19 | Fujitsu Ltd | プリント配線板ユニットの形成方法 |
JP2002057423A (ja) * | 2000-08-07 | 2002-02-22 | Matsushita Electric Ind Co Ltd | 導電性ペーストを用いた回路基板とその製造方法 |
JP4192554B2 (ja) | 2002-10-25 | 2008-12-10 | 株式会社デンソー | 多層回路基板の製造方法 |
JP2011243870A (ja) | 2010-05-20 | 2011-12-01 | Denso Corp | コイル実装基板 |
US20110284158A1 (en) | 2010-05-20 | 2011-11-24 | Fujifilm Corporation | Method and apparatus of manufacturing functionally gradient material |
JP2013165265A (ja) * | 2012-01-13 | 2013-08-22 | Zycube:Kk | 貫通/埋込電極構造及びその製造方法 |
JP5918641B2 (ja) * | 2012-06-26 | 2016-05-18 | 日本バイリーン株式会社 | プリーツ型エアフィルタ用濾材及びプリーツ型エアフィルタユニット |
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2018
- 2018-11-05 JP JP2020556369A patent/JP7055897B2/ja active Active
- 2018-11-05 US US17/285,162 patent/US11570900B2/en active Active
- 2018-11-05 WO PCT/JP2018/040950 patent/WO2020095340A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3167890B2 (ja) | 1995-08-11 | 2001-05-21 | 本田技研工業株式会社 | ハイブリッド車両の車載発電装置の制御装置 |
JP2001143529A (ja) | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | クリームハンダ配合による導電性接合剤およびそれを使用した接合方法 |
JP2004241514A (ja) | 2003-02-05 | 2004-08-26 | Mitsui Chemicals Inc | 多層回路基板およびその製造方法 |
JP2014017364A (ja) | 2012-07-09 | 2014-01-30 | Panasonic Corp | 部品実装基板の製造システム、および製造方法 |
JP2017516295A (ja) | 2014-03-25 | 2017-06-15 | ストラタシス リミテッド | 層交差パターンを製作する方法及びシステム |
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US11570900B2 (en) | 2023-01-31 |
US20210298180A1 (en) | 2021-09-23 |
JPWO2020095340A1 (ja) | 2021-09-02 |
WO2020095340A1 (ja) | 2020-05-14 |
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