Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/06—Non-macromolecular additives organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
  • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
  • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

• the present invention relates to a radical polymerization type adhesive composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, and a cationic polymerizable compound.
• an electrical connection body After superposing an electrical component such as a liquid crystal panel or an organic EL panel and another electrical component such as an IC chip or a flexible substrate via an uncured adhesive layer formed from a curable adhesive composition, It is widely performed to manufacture an electrical connection body by curing an uncured adhesive layer to form a cured adhesive layer. In this case, if excessive heating is performed to cure the uncured adhesive layer, the electrical connection body may be warped or the electrical component may be damaged. For this reason, as a curable adhesive composition, a cationic photopolymerizable adhesive composition in which a photoacid generator is mixed as a cationic photopolymerization initiator with a cationically polymerizable compound such as an epoxy compound is used. Yes.
• the photocation polymerization type adhesive composition is blended with a thermal radical polymerizable compound such as an acrylate monomer or oligomer and a thermal radical polymerization initiator such as an organic peroxide to impart thermosetting properties.
• a thermal radical polymerizable compound such as an acrylate monomer or oligomer
• a thermal radical polymerization initiator such as an organic peroxide
• the heating temperature at the time of thermocompression bonding when conducting conductive connection using a curable adhesive composition as disclosed in Patent Document 1 is an electrical connection created using the curable adhesive composition.
• the temperature is generally 130 to 180 ° C.
• thermocompression treatment when thermocompression treatment is performed at such a temperature, there is a problem that warpage that cannot be ignored in practice occurs in the electrical connection body. For this reason, it is conceivable to lower the heating temperature to about 100 ° C. However, since the thermosetting reaction becomes insufficient, the light-shielding portion is not sufficiently cured, resulting in an increase in conduction resistance value or die shear strength. There is concern that it will cause a decline.
• An object of the present invention is to solve the above-described problems of the conventional technology, and an electrical component such as a liquid crystal panel or an organic EL panel and another electrical component such as an IC chip or a flexible substrate are bonded to each other.
• the electrical connection body is manufactured by superposing the uncured adhesive layer formed from the adhesive composition and then curing the uncured adhesive layer to form a cured adhesive layer. Even if there is a light-shielding part such as a metal wiring in an electrical component, it will not cause a warp that is not negligible in practical use in the electrical connection body, and it will be possible to realize sufficient die shear strength and low conduction resistance value. is there.
• a polymerizable composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a cationic polymerizable compound, and a photoacid generator to the production of an electrical connector, the warp cannot be ignored in practice.
• a photoacid generator having a function of promoting a radical polymerization reaction is used, and a photoacid generator is used. The inventors have found that this can be achieved by limiting the blending amount of the cationic polymerizable compound to a specific range, and have completed the present invention.
• the present invention is a radical polymerization type adhesive composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a cationic polymerizable compound, and a photoacid generator,
• the photoacid generator has the property of accelerating the thermal radical polymerization reaction of the radical polymerization type adhesive composition
• a radical polymerization type adhesive composition in which the content of the cationic polymerizable compound in the radical polymerization type adhesive composition is 0.25 to 3.75 parts by mass with respect to 1 part by mass of the photoacid generator.
• the present invention also includes a step of disposing an adhesive layer on the terminal of one of the two electrical components to be opposed to each other, Placing the terminals of the other electrical component on the adhesive layer; While pressing one of the two electrical components facing each other toward the other, heating and irradiating the adhesive layer, the adhesive layer is cured and the two electrical components disposed facing each other
• the adhesive layer is formed from the above-mentioned radical polymerization type adhesive composition, Provided a manufacturing method for curing an adhesive layer by generating an acid from a photoacid generator by light irradiation when curing the adhesive layer, thereby promoting a thermal radical polymerization reaction of the radical polymerization type adhesive composition To do.
• the present invention includes a step of disposing an adhesive layer on a terminal of one of the two electrical components to be opposed to each other, Placing the terminals of the other electrical component on the adhesive layer; While pressing one of the two electrical components facing each other toward the other, heating and irradiating the adhesive layer, the adhesive layer is cured and the two electrical components disposed facing each other
• the adhesive layer is formed from the above-mentioned radical polymerization type adhesive composition, A manufacturing method in which heating to the adhesive layer is performed at a temperature lower than the thermal radical polymerization reaction temperature of the radical polymerization control composition corresponding to the radical polymerization adhesive composition from which the photoacid generator has been removed. provide.
• the radical polymerization type adhesive composition of the present invention includes a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator having a property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition, a cation
• the compounding amount of the cationic polymerizable compound with respect to the photoacid generator is limited to a specific range. Therefore, although the cationic polymerization of the cationic polymerizable compound proceeds, the acid generated by the photoacid generator by light irradiation is not consumed for the cationic polymerization of the cationic polymerizable compound, and as a result, radical polymerization type It becomes possible to accelerate the thermal radical polymerization reaction of the adhesive composition.
• the electric connection body does not generate a warp that cannot be ignored in practice, and a sufficient die shear strength and a low conduction resistance value are realized. be able to.
• the radical polymerization type adhesive composition of the present invention contains a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, and a cationic polymerizable compound.
• a radical polymerizable compound a thermal radical polymerization initiator
• a photoacid generator one having a property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition is used.
• the content of the cationic polymerizable compound in the radical polymerization adhesive composition is 0.25 to 3.75 parts by mass with respect to 1 part by mass of the photoacid generator.
• the radical polymerizable compound constituting the radical polymerization type adhesive composition of the present invention is a compound capable of undergoing radical polymerization reaction with active radicals generated by thermal decomposition of a thermal radical polymerization initiator, preferably one or more in the molecule. It has a carbon unsaturated bond, and includes so-called monofunctional radical polymerizable compounds and polyfunctional radical polymerizable compounds.
• the radical polymerizable compound contains a polyfunctional radical polymerizable compound, the die shear strength of the cured product of the radical polymerization adhesive composition can be further improved. Therefore, the radically polymerizable compound preferably contains a polyfunctional radically polymerizable compound in an amount of 30% by mass or more, more preferably 50% by mass or more.
• Examples of the monofunctional radical polymerizable compound include monofunctional vinyl compounds such as styrene and methylstyrene, and monofunctional (meth) acrylate compounds such as butyl acrylate and butyl methacrylate.
• monofunctional vinyl compounds such as styrene and methylstyrene
• monofunctional (meth) acrylate compounds such as butyl acrylate and butyl methacrylate.
• (meth) acrylate” is a term including acrylate and methacrylate.
• Polyfunctional radical polymerizable compounds include polyfunctional vinyl compounds such as divinylbenzene, 1,6-hexanediol diacrylate, trimethylolpropane trimethacrylate, bisphenol A glycidyl methacrylate (EA-1020, Shin-Nakamura Chemical Co., Ltd.) And polyfunctional (meth) acrylate compounds such as isocyanuric acid EO-modified diacrylate (M-215, Toagosei Co., Ltd.). These may be monomers or oligomers. Of these, polyfunctional (meth) acrylate compounds, particularly bisphenol A-type glycidyl methacrylate and isocyanuric acid EO-modified diacrylate are preferable from the viewpoint of heat resistance.
• the polyfunctional radically polymerizable compound may be composed of a polyfunctional vinyl compound and a polyfunctional (meth) acrylate compound.
• the thermal radical polymerization initiator constituting the radical polymerization type adhesive composition of the present invention generates an active radical for radical polymerization of a radical polymerizable compound by thermal decomposition, and is a known thermal radical polymerization initiator.
• an organic peroxide or an azo compound can be preferably used.
• an organic peroxide can be preferably used from the viewpoint that excellent storage stability and low-temperature rapid curability can be realized.
• an organic peroxide known as a thermal radical polymerization initiator for example, from the viewpoint of chemical structural classification, diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide.
• examples thereof include oxides, hydroperoxides, and silyl peroxides.
• peroxyesters and diacyl peroxides can be preferably used from the viewpoint that less organic acid is generated after thermal decomposition. From the viewpoint of half-life temperature for 1 minute, a temperature of 80 to 170 ° C. is preferable from the viewpoint of reactivity, and from the viewpoint of molecular weight, a temperature of 180 to 1000 is preferable.
• azo compound a known azo compound can be used as a thermal radical polymerization initiator.
• the amount of the thermal radical polymerization initiator in the radical polymerization adhesive composition is such that the radical polymerization compound 100 is sufficiently cured to prevent the radical polymerization adhesive composition from curing and cause foaming.
• the amount is preferably 0.5 to 30 parts by mass, more preferably 1.0 to 20 parts by mass with respect to parts by mass.
• the photoacid generator that constitutes the radical polymerization type adhesive composition of the present invention generates an acid when irradiated with light such as ultraviolet rays and initiates cationic polymerization of the cationically polymerizable compound. It promotes the decomposition of the radical polymerization initiator.
• the photoacid generator has the property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition. More specifically, the thermal radical polymerization reaction of the radical polymerization adhesive composition is carried out using a radical polymerization control composition corresponding to the radical polymerization adhesive composition in which the photoacid generator is further removed from the radical polymerization adhesive composition. It is possible to promote the thermal radical polymerization reaction.
• thermal radical polymerization reaction temperature T 0 of containing no photoacid generator radical polymerization type control composition thermal radical polymerization reaction temperature T 1 of the radical polymerization type adhesive composition containing a photoacid generator, It will be low.
• the thermal radical polymerization reaction temperature is a reaction temperature necessary for realizing the desired characteristics of the polymer, and is set according to the type of the polymerization system components, the blending ratio thereof, the desired characteristics, etc. Polymerization reaction temperature.
• the thermal radical polymerization reaction temperature T 0 of the radical polymerization control composition containing no photoacid generator is preferably in the range of 100 to 130 ° C.
• the thermal radical polymerization reaction temperature T 1 of the radical polymerization type adhesive composition containing the photoacid generator is preferably 10 ° C. or more lower than T 0 .
• Such a photoacid generator can be appropriately selected from photoacid generators used as a photocationic polymerization initiator, and is an onium salt such as an aromatic diazonium salt; an aromatic sulfonium salt, an aliphatic sulfonium.
• Sulfonium salts such as salts; pyridinium salts; selenonium salts; iodonium salts such as aromatic iodonium salts; complex compounds including metal arene complexes such as iron arene complexes; tosylate compounds such as benzoin tosylate and o-nitrobenzyl tosylate Etc.
• sulfonium salts iodonium salts, and iron arene complexes can be preferably mentioned because they can improve the generation efficiency of cationic species.
• an aromatic sulfonium salt that reacts with high sensitivity to I-line (365 nm) from an LED light source as light specifically, a triarylsulfonium salt can be preferably exemplified.
• the photoacid generator is a salt
• hexafluoroborate, hexafluorophosphate, tetrafluoroborate, tetrakis (pentafluorophenyl) borate are used as counter anions constituting the salt from the viewpoint of improving reactivity.
• Etc. can be preferably employed.
• tetrakis (pentafluorophenyl) borate can be preferably employed.
• the blending amount of the photoacid generator in the radical polymerization type adhesive composition is preferably 1.0 to 30 parts by mass, more preferably 2 to 20 parts by mass with respect to 100 parts by mass of the thermal radical polymerization initiator. If it is this range, the effect of promoting decomposition
• a cyclic ether compound can be preferably mentioned from the viewpoint of low temperature fast curability. Among these, those which are liquid at room temperature are preferable from the viewpoint of compatibility with other components and fluidity. Examples of such cyclic ether compounds include epoxy compounds and oxetane compounds. An epoxy compound can be preferably used from the viewpoints of cost, availability, and the like.
• Preferred examples of the epoxy compound include polyfunctional glycidyl ether type epoxy compounds and alicyclic epoxy compound compounds. In these, a polyfunctional glycidyl ether type epoxy compound can be used preferably.
• Polyfunctional glycidyl ether type epoxy compounds include bisphenol A type diglycidyl ether and its prepolymer (condensate), bisphenol F type diglycidyl ether and its prepolymer (condensate), phenol novolac type diglycidyl ether, di ( ⁇ -alkyl glycidyl) resorcinol ether, bisphenol A type di ( ⁇ -alkyl glycidyl) ether, bisphenol F type di ( ⁇ -alkyl glycidyl) ether, and the like.
• the epoxy equivalent of such an epoxy compound is preferably 100 to 500, more preferably 140 to 300.
• the blending amount of the cationic polymerizable compound such as an epoxy compound in the radical polymerization type adhesive composition is 1 to 15 parts by mass, preferably 1 to 3 parts by mass with respect to 1 part by mass of the photoacid generator. If it is this range, the effect with which a photo-acid generator accelerates
• the radical polymerization type adhesive composition of the present invention can further contain a thermoplastic resin such as a phenoxy resin as a film-forming resin.
• the blending amount of such a thermoplastic resin is preferably 10 to 70 parts by mass, more preferably 20 to 60 parts by mass with respect to 100 parts by mass of the radical polymerizable compound.
• the radical polymerization type adhesive composition of the present invention can contain a known silane coupling agent.
• the blending amount of the silane coupling agent is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the radical polymerizable compound. If it is this range, the effect that the adhesiveness with respect to an inorganic and metal type material will improve is acquired.
• the radical polymerization type adhesive composition of the present invention can contain a known radical photopolymerization initiator, an inorganic filler, an organic filler, a conductive filler, an insulating filler, etc., if necessary.
• the radical polymerization type adhesive composition of the present invention includes a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, a cationic polymerizable compound, and a thermoplastic resin blended as necessary. Can be prepared by uniformly mixing them with a known mixing means.
• Part 1 The method for manufacturing an electrical connection body according to the present invention (part 1) includes the following steps (a) to (c). Below, it demonstrates for every process.
• An adhesive layer is disposed on a terminal of one of the two electrical components to be disposed to face each other according to a known technique.
• a rigid circuit board, a flexible wiring board, etc. are mentioned as one of the two electric components which should be arrange
• these terminals include pad electrodes, line electrodes, and bump electrodes formed from electrode materials such as copper, aluminum, silver, gold, and ITO.
• the adhesive layer is formed from the radical polymerization type adhesive composition of the present invention described above. Such an adhesive layer can be formed by using a known method, for example, various coating methods, printing methods, and photolithographic techniques.
• the terminal of the other electrical component is placed on the adhesive layer formed in the step (A) according to a known method.
• the other electrical component include an IC chip, a liquid crystal panel, an organic EL panel, an IC module, and a solar cell module.
• these terminals include pad electrodes, line electrodes, and bump electrodes formed from electrode materials such as copper, aluminum, silver, gold, and ITO.
• the adhesive layer is heated while pressing one of the two electric components opposed to each other with a known heating and pressing tool. Simultaneously with this heating or waiting for softening or melting of the composition, after the heating is started, the heating is continued, preferably after 2 or 3 seconds, light such as ultraviolet rays, preferably the I-line of the LED light source, is applied to the adhesive layer. It is irradiated with light to cure the adhesive layer.
• light irradiation to the adhesive layer is performed from the other side of the transparent substrate of the electrical component. Is preferred.
• An electrical connector is obtained by curing in this way.
• an acid is generated from the photoacid generator by light irradiation, thereby cationically polymerizing the cation polymerizable compound, and thermal radical polymerization of the radical polymerization adhesive composition is performed from the radical polymerization adhesive composition.
• the adhesive layer is cured by accelerating the thermal radical polymerization of the radical polymerization control composition corresponding to the photoacid generator removed.
• the manufacturing method (part 2) of the electrical connection body of the present invention has the same steps as steps (a) to (c) of the manufacturing method (part 1).
• the adhesive layer is heated. Clarify the specific heating conditions to be performed at a temperature lower than the thermal radical polymerization reaction temperature of the radical polymerization control composition corresponding to the radical polymerization adhesive composition from which the photoacid generator is further removed. It differs in that it is. Since heat curing is performed at a temperature lower than the thermal radical polymerization reaction temperature T 0, it is possible to suppress the warpage of the electric bonded body, and the heat radical of the radical polymerization type adhesive composition is generated by the acid generated by the photoacid generator.
• the polymerization reaction temperature T 1 is lower than T 0, it can be sufficiently cured, and the two electric components arranged opposite to each other can be connected with a low conductive resistance value. In addition, good die shear strength can be achieved, and warpage of the electrical connection body can be suppressed.
• Examples 1 to 5 and Comparative Examples 1 to 4 A mixture (adhesive composition) obtained by mixing the components of the composition shown in Table 1 by a conventional method was applied to a release polyester film and dried at 70 ° C. to obtain an adhesive sheet having a thickness of 20 ⁇ m.
• the obtained adhesive sheet is provided with an IC (outside dimension: 1.8 mm ⁇ 20 mm, bump height 15 ⁇ m) as an evaluation base, and a 200 ⁇ m wide 500 nm-thick aluminum line electrode (light-shielding portion) on the back surface at a pitch of 200 ⁇ m.
• UV irradiation was performed for 3 seconds from the back side of the glass substrate (aluminum line electrode forming surface) under the UV irradiation conditions shown in Table 1 (UV light source: UV irradiator ZUV-C30H (OMRON Corporation)). Then, an electrical connection for test evaluation was prepared.
• the die shear strength of the created electrical connector was measured using a die shear tester (universal bond tester series 4000, manufactured by Daisy Japan Co., Ltd.) under the condition of a tool speed of 100 ⁇ m / second. The obtained results are shown in Table 1. Practically, it is desired to be 130 kgf or more.
• Comparative Example 4 which contained 8 parts by mass of an organic peroxide which is a radical polymerization initiator without containing a photoacid generator, 4 parts by mass of an organic peroxide, and 4 photoacid generators From the comparison with Comparative Example 1 that contained part by mass, it can be seen that the curing reaction was promoted by replacing half of the organic peroxide, which is a radical polymerization initiator, with a photoacid generator. Therefore, it can be seen that the photoacid generator used in Examples 1 to 5 has the property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition.
• the radical polymerization type adhesive composition of the present invention includes a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator having a property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition, a cation
• the compounding amount of the cationic polymerizable compound with respect to the photoacid generator is limited to a specific range. For this reason, even if there is a light-shielding part such as metal wiring in the electrical parts to be joined, the electrical connection body does not cause warp that is not negligible in practice, and sufficient die shear strength and low conduction resistance value are realized. can do.
• the radical polymerization type adhesive composition of the present invention has a low conductive resistance value, a good die shear strength, and an electrical connection body produced by connecting electrical components having a light-shielding portion at the joint portion, This is useful for realizing a small amount of warpage.

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Adhesive Tapes (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=55580915

Family Applications (1)

Country Status (5)

Cited By (2)

Families Citing this family (2)

Citations (4)

Family Cites Families (13)

• 2014
  • 2014-09-25 JP JP2014195538A patent/JP6384234B2/ja active Active
• 2015
  • 2015-08-31 KR KR1020167035777A patent/KR102343433B1/ko active IP Right Grant
  • 2015-08-31 CN CN201580048969.9A patent/CN106715622B/zh active Active
  • 2015-08-31 WO PCT/JP2015/074714 patent/WO2016047387A1/ja active Application Filing
  • 2015-09-25 TW TW104131752A patent/TWI720950B/zh active

Patent Citations (4)

Also Published As

Similar Documents

Legal Events