CN106715622B - 自由基聚合型粘接剂组合物以及电连接体的制造方法 - Google Patents

自由基聚合型粘接剂组合物以及电连接体的制造方法 Download PDF

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Publication number
CN106715622B
CN106715622B CN201580048969.9A CN201580048969A CN106715622B CN 106715622 B CN106715622 B CN 106715622B CN 201580048969 A CN201580048969 A CN 201580048969A CN 106715622 B CN106715622 B CN 106715622B
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China
Prior art keywords
radical polymerization
adhesive composition
adhesive layer
photoacid generator
thermal
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CN201580048969.9A
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English (en)
Chinese (zh)
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CN106715622A (zh
Inventor
林慎一
田中佑治
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Dexerials Corp
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Dexerials Corp
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Publication of CN106715622A publication Critical patent/CN106715622A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN201580048969.9A 2014-09-25 2015-08-31 自由基聚合型粘接剂组合物以及电连接体的制造方法 Active CN106715622B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-195538 2014-09-25
JP2014195538A JP6384234B2 (ja) 2014-09-25 2014-09-25 ラジカル重合型接着剤組成物、及び電気接続体の製造方法
PCT/JP2015/074714 WO2016047387A1 (ja) 2014-09-25 2015-08-31 ラジカル重合型接着剤組成物、及び電気接続体の製造方法

Publications (2)

Publication Number Publication Date
CN106715622A CN106715622A (zh) 2017-05-24
CN106715622B true CN106715622B (zh) 2020-09-04

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ID=55580915

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CN201580048969.9A Active CN106715622B (zh) 2014-09-25 2015-08-31 自由基聚合型粘接剂组合物以及电连接体的制造方法

Country Status (5)

Country Link
JP (1) JP6384234B2 (ko)
KR (1) KR102343433B1 (ko)
CN (1) CN106715622B (ko)
TW (1) TWI720950B (ko)
WO (1) WO2016047387A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018216868A1 (de) 2018-10-01 2020-04-02 Tesa Se Latent reaktiver Klebefilm
EP3719089A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
EP3719088A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Curable precursor of a structural adhesive composition
DE102020203952A1 (de) 2020-03-26 2021-09-30 Tesa Se Latent reaktiver Klebefilm

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0736555A2 (en) * 1995-04-05 1996-10-09 U C B, S.A. Radiation-curable epoxy resin composition
CN1157310A (zh) * 1995-11-22 1997-08-20 琳得科株式会社 粘合剂组合物和粘合片
CN1303423A (zh) * 1998-06-01 2001-07-11 Dsm有限公司 用于粘合光盘的可辐照固化的粘合剂
JP2002235065A (ja) * 2001-02-07 2002-08-23 Showa Denko Kk 導電性接着剤組成物
JP2007308694A (ja) * 2006-04-18 2007-11-29 Hitachi Chem Co Ltd 半導体用接着部材、半導体装置及び半導体装置の製造方法
CN101235257A (zh) * 2007-02-02 2008-08-06 Jsr株式会社 放射线固化性粘合剂用组合物、复合体及复合体的制法
CN102408839A (zh) * 2010-09-20 2012-04-11 Lg化学株式会社 用于偏振板的粘合剂以及包含该粘合剂的偏振板
CN102459354A (zh) * 2009-06-08 2012-05-16 三洋化成工业株式会社 感光性组合物
CN103087640A (zh) * 2011-11-08 2013-05-08 汉高股份有限公司 双固化粘合剂组合物及其用途以及粘合基底的方法
CN103415540A (zh) * 2011-03-07 2013-11-27 三洋化成工业株式会社 感光性组合物、固化物以及活性光线固化物的制造方法
WO2014103996A1 (ja) * 2012-12-27 2014-07-03 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000169553A (ja) * 1998-12-09 2000-06-20 Kyoeisha Chem Co Ltd 高耐熱性樹脂組成物
AU2327400A (en) * 1999-02-08 2000-08-25 Hitachi Chemical Co. Ltd. Adhesive, electrode-connecting structure, and method of connecting electrodes
JP4534716B2 (ja) * 2004-10-26 2010-09-01 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造体及び接続方法
JP2008013721A (ja) * 2006-07-10 2008-01-24 Kyocera Chemical Corp 硬化性樹脂組成物、表示素子用接着剤及び接着方法
JP5830883B2 (ja) * 2011-03-08 2015-12-09 日立化成株式会社 半導体用接着剤組成物、半導体装置及び半導体装置の製造方法
JP6232855B2 (ja) * 2013-08-30 2017-11-22 デクセリアルズ株式会社 ラジカル重合型接着剤組成物、及び電気接続体の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0736555A2 (en) * 1995-04-05 1996-10-09 U C B, S.A. Radiation-curable epoxy resin composition
CN1157310A (zh) * 1995-11-22 1997-08-20 琳得科株式会社 粘合剂组合物和粘合片
CN1303423A (zh) * 1998-06-01 2001-07-11 Dsm有限公司 用于粘合光盘的可辐照固化的粘合剂
JP2002235065A (ja) * 2001-02-07 2002-08-23 Showa Denko Kk 導電性接着剤組成物
JP2007308694A (ja) * 2006-04-18 2007-11-29 Hitachi Chem Co Ltd 半導体用接着部材、半導体装置及び半導体装置の製造方法
CN101235257A (zh) * 2007-02-02 2008-08-06 Jsr株式会社 放射线固化性粘合剂用组合物、复合体及复合体的制法
CN102459354A (zh) * 2009-06-08 2012-05-16 三洋化成工业株式会社 感光性组合物
CN102408839A (zh) * 2010-09-20 2012-04-11 Lg化学株式会社 用于偏振板的粘合剂以及包含该粘合剂的偏振板
CN103415540A (zh) * 2011-03-07 2013-11-27 三洋化成工业株式会社 感光性组合物、固化物以及活性光线固化物的制造方法
CN103087640A (zh) * 2011-11-08 2013-05-08 汉高股份有限公司 双固化粘合剂组合物及其用途以及粘合基底的方法
WO2014103996A1 (ja) * 2012-12-27 2014-07-03 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法

Also Published As

Publication number Publication date
WO2016047387A1 (ja) 2016-03-31
TW201627450A (zh) 2016-08-01
TWI720950B (zh) 2021-03-11
CN106715622A (zh) 2017-05-24
JP2016065172A (ja) 2016-04-28
KR20170059922A (ko) 2017-05-31
KR102343433B1 (ko) 2021-12-24
JP6384234B2 (ja) 2018-09-05

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