WO2016042959A1 - Système de traitement et procédé de traitement - Google Patents

Système de traitement et procédé de traitement Download PDF

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Publication number
WO2016042959A1
WO2016042959A1 PCT/JP2015/073095 JP2015073095W WO2016042959A1 WO 2016042959 A1 WO2016042959 A1 WO 2016042959A1 JP 2015073095 W JP2015073095 W JP 2015073095W WO 2016042959 A1 WO2016042959 A1 WO 2016042959A1
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WIPO (PCT)
Prior art keywords
liquid
processing
filter
processed
cleaning
Prior art date
Application number
PCT/JP2015/073095
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English (en)
Japanese (ja)
Inventor
祥子 宮崎
深谷　太郎
敏弘 今田
靖崇 菊池
伊知郎 山梨
泰造 内村
夕佳 田中
Original Assignee
株式会社東芝
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Publication of WO2016042959A1 publication Critical patent/WO2016042959A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/02—Inorganic material
    • B01D71/05—Cermet materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D24/00—Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof
    • B01D24/48—Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof integrally combined with devices for controlling the filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/60—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor integrally combined with devices for controlling the filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/62—Regenerating the filter material in the filter
    • B01D29/66—Regenerating the filter material in the filter by flushing, e.g. counter-current air-bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D39/00—Filtering material for liquid or gaseous fluids
    • B01D39/14—Other self-supporting filtering material ; Other filtering material
    • B01D39/20—Other self-supporting filtering material ; Other filtering material of inorganic material, e.g. asbestos paper, metallic filtering material of non-woven wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/02—Inorganic material
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis

Definitions

  • Embodiments described herein relate generally to a processing system and a processing method.
  • a method for separating and removing water-insoluble matter and impurity particles contained in water include a membrane separation method, a centrifugal separation method, an activated carbon adsorption method, an ozone treatment method, and a method for removing suspended solids by adding a flocculant.
  • SS particles suspended substances
  • a filter having various forms of membranes and filter media. Pass through to separate SS particles from water.
  • typical filtration mechanisms there are mechanisms called surface filtration, depth filtration (depth filtration), and cake filtration.
  • Surface filtration is a mechanism for receiving SS particles contained in water at the surface of the filter when water passes through the filter.
  • Surface filtration mainly captures SS particles that are larger than the pores of the filter.
  • a surface filtration mechanism is mainly used.
  • Deep-layer filtration is a mechanism that utilizes the fact that SS particles contained in water adhere not only to the surface of the filter but also to the inner surface of the pores when the water passes through the filter.
  • depth filtration particles that are mainly smaller than the pores of the filter are trapped.
  • a mechanism of depth filtration is used.
  • Cake filtration is a mechanism in which when water passes through a filter, SS particles contained in the water are captured by the filter to form a cake, and this cake functions as a filter. Cake filtration captures SS particles that are even smaller than depth filtration.
  • the problem to be solved by the present invention is that a processing system using a filter that can capture SS particles in a liquid to be treated by using a mechanism of depth filtration and a mechanism of cake filtration, and can easily remove SS particles by washing, and It is to provide a processing method.
  • the processing system of the embodiment includes a processing liquid tank, a processing tank, a processing liquid supply pipe, and a cleaning processing liquid supply mechanism.
  • the liquid tank to be processed stores the liquid to be processed.
  • the treatment tank is partitioned by a filter into a treatment liquid region and a treatment liquid region.
  • the liquid supply pipe to be processed connects the liquid tank to be processed and the liquid area to be processed.
  • the cleaning liquid supply mechanism is connected to the processing tank.
  • a first filter having a plurality of needle-like structures having a height of 0.2 to 2.5 ⁇ m and a through hole having an average pore diameter of 0.5 to 10.0 ⁇ m, the filter being disposed close to the surface Or a plurality of polyhedral structures having an average value of the maximum outer dimensions of 0.5 to 10 ⁇ m arranged close to the surface and through-holes having an average diameter of the inscribed circle of 1.0 to 20 ⁇ m. It is the 2nd filter which has.
  • FIG. 1 is a schematic diagram illustrating a processing system according to the first embodiment.
  • a processing system 100 shown in FIG. 1 includes a processing liquid tank 101, a processing tank 102, a processing liquid tank 103, a processing liquid supply pipe 104, and a cleaning processing liquid supply pipe 105 (cleaning processing liquid supply mechanism).
  • the liquid tank 101 to be processed stores the liquid to be processed.
  • Examples of the liquid to be treated include water containing SS particles.
  • the liquid tank 101 to be processed is provided with a stirrer for stirring the liquid tank 101 to be processed.
  • the shape, capacity, material, and the like of the liquid tank 101 to be processed can be appropriately determined according to the use of the processing system 100, and are not particularly limited.
  • the processing tank 102 removes SS particles from the liquid to be processed to generate a processing liquid.
  • the outer shape of the processing tank 102 is not particularly limited, and for example, a flat shape having a large area in a plan view and a small area in a side view is used.
  • the processing tank 102 is partitioned into a processing liquid region 102a and a processing liquid region 102b by a filter 1 described later.
  • the filter 1 installed in the processing tank 102 is installed substantially horizontally in the vertical center of the processing tank 102. Therefore, the inside of the processing tank 102 is divided up and down by the filter 1.
  • the upper side of the filter 1 is a processing liquid region 102 a and the lower side of the filter 1 is a processing liquid region 102 b.
  • a pressure gauge 121 for measuring the pressure of the liquid to be processed in the liquid area 102 a to be processed is installed in the liquid area 102 a of the processing tank 102.
  • a pressure gauge that continuously measures the pressure of the liquid to be treated may be used, or a pressure gauge that measures the pressure every predetermined time may be used.
  • the measurement result of the pressure of the liquid to be processed measured by the pressure gauge 121 is sent to the control device 120.
  • the to-be-processed liquid supply piping 104 is connected between the to-be-processed liquid tank 101 and the to-be-processed liquid area
  • the to-be-treated liquid supply pipe 104 and the to-be-treated liquid tank 101 are connected at the lower part of the to-be-treated liquid tank 101. Further, the liquid supply pipe 104 to be processed and the processing tank 102 are connected to each other at a substantially central portion on the upper surface of the processing tank 102 in plan view.
  • a first pump 104a and a first valve 111 are installed in the liquid supply pipe 104 to be processed.
  • the first pump 104a pumps the liquid to be processed from the liquid tank 101 to be processed to the liquid region 102a to be processed.
  • the first valve 111 is an on-off valve.
  • the liquid to be processed supply pipe 104 the liquid to be processed is supplied from the liquid tank 101 to be processed to the liquid region 102 a of the processing tank 102 by opening the first valve 111. Further, by closing the first valve 111, supply of the liquid to be processed from the liquid tank 101 to be processed to the liquid region 102a of the processing tank 102 is shut off.
  • opening and closing of the first valve 111 is controlled by the control device 120.
  • the processing liquid tank 103 stores the processing liquid.
  • the processing liquid is generated when the liquid to be processed passes through the filter 1 in the processing tank 102.
  • the shape, capacity, material, and the like of the processing liquid tank 103 can be appropriately determined according to the use of the processing system 100, and are not particularly limited.
  • the processing liquid discharge pipe 108 is connected between the processing liquid region 102 b of the processing tank 102 and the processing liquid tank 103.
  • the treatment liquid discharge pipe 108 and the treatment tank 102 are connected to each other at a substantially central portion of the lower surface of the treatment tank 102 in a plan view.
  • the processing liquid discharge pipe 108 and the processing liquid tank 103 are connected on the upper surface of the processing liquid tank 103.
  • the processing liquid discharge pipe 108 is connected to an initial passage liquid discharge pipe 109 communicated with the liquid tank 101 to be processed.
  • the treatment liquid discharge pipe 108 is provided with an on-off valve 308 and a fourth valve 114.
  • the fourth valve 114 is a three-way valve.
  • the processing liquid discharge pipe 108 the processing liquid discharge pipe 108 and the initial passing liquid discharge pipe 109 are communicated with each other by switching the fourth valve 114.
  • the processing liquid region 102 b of the processing tank 102 and the processing liquid tank 103 are communicated by switching the fourth valve 114.
  • the cleaning processing liquid supply pipe 105 is connected between the processing tank 102 and the processing liquid tank 103.
  • the cleaning processing liquid supply pipe 105 includes a main pipe 105c connected to the processing liquid tank 103, and a first branch pipe 105a and a second branch pipe 105b branched from the main pipe 105c.
  • the first branch pipe 105 a is connected to the processing target liquid region 102 a of the processing tank 102.
  • region 102a are connected by the wall surface (side surface) upper part of the processing tank 102.
  • the second branch pipe 105 b is connected to the processing liquid region 102 b of the processing tank 102.
  • the second branch pipe 105b and the treatment liquid region 102b are connected at the lower part of the wall surface of the treatment tank 102.
  • the connection position between the first branch pipe 105a and the treatment tank 102 substantially overlaps with the connection position between the second branch pipe 105b and the treatment liquid region 102b in plan view.
  • the main pipe 105 c and the processing liquid tank 103 are connected at the lower part of the wall surface of the processing liquid tank 103.
  • the cleaning treatment liquid supply pipe 105 is provided with a ninth valve 301, a tenth valve 302, an eleventh valve 303, and a second pump 105d (“9th valve 301” and “9th” in this embodiment).
  • the “10th valve 302” and the “11th valve 303” correspond to the second valve in the claims).
  • the second pump 105d pumps the processing liquid from the processing liquid tank 103 to the processing liquid area 102a or the processing liquid area 102b.
  • the eleventh valve 303 is opened, so that the cleaning process liquid supply pipe 105 on the process liquid tank 103 side and the process liquid tank 103 communicate with each other than the third valve 113.
  • one of the following states occurs. That is, the state in which the processing liquid is supplied from the processing liquid tank 103 to the processing liquid area 102a, the state in which the processing liquid is supplied from the processing liquid tank 103 to the processing liquid area 102b, the processing liquid area 102a from the processing liquid tank 103, and A state occurs in which the supply of the processing liquid to the processing liquid region 102b is interrupted.
  • opening / closing of the ninth valve 301, the tenth valve 302, and the eleventh valve 303 is controlled by the control device 120.
  • a discharge pipe 115 connected to the outside of the processing system 100 is connected to the cleaning processing liquid supply pipe 105.
  • a third valve 113 is installed in the cleaning processing liquid supply pipe 105.
  • the third valve 113 is a three-way valve. In the cleaning processing liquid supply pipe 105, by switching the third valve 113, the cleaning processing liquid supply pipe 105 and the discharge pipe 115 closer to the processing liquid tank 103 than the third valve 113 communicate with each other. Further, by switching the third valve 113, the connection between the cleaning processing liquid supply pipe 105 and the discharge pipe 115 is cut off, and the cleaning processing liquid supply pipe 105 on the processing liquid tank 103 side from the third valve 113.
  • the cleaning processing liquid supply pipe 105 closer to the processing tank 102 than the third valve 113 communicates with each other.
  • a part of the main pipe 105 c in the cleaning treatment liquid supply pipe 105 functions as the discharge pipe 115.
  • the concentrated sludge tank 106 stores a concentrated liquid containing a lot of SS particles removed from the liquid to be treated.
  • the concentrated liquid is a processing liquid after being used for cleaning the filter 1.
  • the shape, capacity, material, and the like of the concentrated sludge tank 106 can be appropriately determined according to the use of the processing system 100, and are not particularly limited.
  • the cleaning liquid discharge pipe 107 is connected between the processing liquid region 102 a of the processing tank 102 and the concentrated sludge tank 106.
  • the cleaning liquid discharge pipe 107 and the processing tank 102 are connected at the upper part of the wall surface of the processing tank 102.
  • the connection position between the cleaning liquid discharge pipe 107 and the processing tank 102 is substantially opposite to the connection position between the first branch pipe 105a and the processing tank 102 with the central portion of the processing tank 102 in plan view.
  • the straight line connecting the connection position between the cleaning liquid discharge pipe 107 and the processing tank 102 and the connection position between the first branch pipe 105a and the processing tank 102 passes through the central portion in the plan view of the processing tank 102. Since it becomes long, it is preferable.
  • the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 are connected on the upper surface of the concentrated sludge tank 106.
  • a fifth valve 122 is installed in the cleaning liquid discharge pipe 107.
  • the fifth valve 122 is an on-off valve. In the cleaning liquid discharge pipe 107, by switching the fifth valve 122, the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 communicate with each other, or the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 are blocked.
  • flow meters (not shown) for measuring the flow rate of the liquid to be processed or the processing liquid moving in the processing system 100 are arranged at a plurality of locations.
  • the measurement result of the flow rate measured by the flow meter is preferably sent to the control device 120.
  • the control device 120 determines whether or not the pressure of the liquid to be processed in the liquid area 102a to be processed measured by the pressure gauge 121 is equal to or less than a predetermined threshold value. Furthermore, the control device 120 determines the first valve 111 installed in the liquid supply pipe 104 to be processed and the cleaning liquid supply pipe 105 for cleaning based on the determination result of whether or not the pressure is equal to or less than the threshold value.
  • the ninth valve 301, the tenth valve 302, and the eleventh valve 303 are controlled.
  • the control device 120 controls the first valve 111 to supply the liquid to be processed to the liquid region 102a to be processed, and the ninth valve 301 and the tenth valve.
  • the supply of the processing liquid to the processing liquid region 102a or the processing liquid region 102b is shut off by controlling the valve 302.
  • the control device 120 controls the first valve 111 to shut off the supply of the liquid to be processed to the liquid region 102a to be processed, and the ninth valve 301 and the tenth valve.
  • the processing liquid is supplied to the processing liquid region 102a or the processing liquid region 102b by controlling the valve 302 and the eleventh valve 303.
  • the threshold value of the pressure of the liquid to be processed in the liquid area 102a to be processed is a predetermined value determined in advance, and is not particularly limited, but may be 0.2 MPa, for example.
  • the control device 120 in the present embodiment preferably determines whether or not the cleaning process has been completed. Further, the control device 120, based on the determination result of whether or not the cleaning process is completed, the first valve 111 installed in the liquid to be processed supply pipe 104 and the first valve installed in the processing liquid supply pipe 105 for cleaning. It is preferable to control the 9th valve 301, the 10th valve 302, and the 11th valve 303. Specifically, when the control device 120 determines that the cleaning process has not been completed, the control device 120 controls the ninth valve 301, the tenth valve 302, and the eleventh valve 303 to perform the treatment liquid region 102a or the treatment liquid.
  • the processing liquid is supplied to the region 102b and the first valve 111 is controlled to cut off the supply of the processing liquid to the processing liquid region 102a.
  • the control device 120 determines that the cleaning process has been completed, controls the ninth valve 301, the tenth valve 302, and the eleventh valve 303 to perform processing on the liquid region 102a or the liquid region 102b.
  • the supply of the liquid is shut off, and the first valve 111 is controlled to supply the liquid to be processed to the liquid area 102a to be processed.
  • Whether or not the cleaning process is completed is determined by switching the ninth valve 301, the tenth valve 302, and the eleventh valve 303, for example, and starting the supply of the processing liquid to the processing liquid region 102a or the processing liquid region 102b. It is preferable that the determination is made after a predetermined time has elapsed since the cleaning process was started. Although the time which performs a washing
  • whether or not the cleaning process is completed is determined when a predetermined time has elapsed and / or when the cleaning process is a process of supplying a processing liquid to a processing liquid region 102b described later. You may judge by the pressure of the to-be-processed liquid in the liquid area
  • the first valve 111, the ninth valve 301, the tenth valve 302, and the eleventh valve 303 are controlled based on the determination function as to whether or not the pressure is equal to or less than the threshold value.
  • a function for determining whether or not the cleaning process is completed, and a function for controlling the first valve 111, the ninth valve 301, the tenth valve 302, and the eleventh valve 303 based on the determination result are, for example, This is realized by functions provided in the central processing unit of the computer.
  • the filter 1 is a first filter having a plurality of needle-like structures having a height of 0.2 to 2.5 ⁇ m and a through hole having an average pore diameter of 0.5 to 10.0 ⁇ m, which are arranged close to the surface.
  • a plurality of polyhedron structures having an average value of the maximum outer dimensions of 0.5 to 10 ⁇ m arranged close to the surface, and through holes having an average diameter of the inscribed circle of 1.0 to 20 ⁇ m;
  • a second filter having
  • the filter 1 shown in FIG. 2 is used as the first filter.
  • FIG. 2 is a schematic plan view showing an example of the first filter.
  • FIG. 3 is a schematic cross-sectional view showing an enlarged part of the filter shown in FIG.
  • the filter 1 shown in FIGS. 2 and 3 is a filter after a liquid to be treated containing SS particles is passed through to capture a certain amount of SS particles.
  • the filter base 6 has a filter base 6 and a plating layer 3 formed on the surface of the filter base 6 by electroplating or the like, as shown in FIG.
  • the filter base 6 is formed of a wire mesh formed of the wire 2 and a base layer 4 formed on the surface of the wire 2.
  • the plating layer 3 is formed of a plurality of needle-like structures 5 arranged close to each other.
  • the wire 2 is woven into a mesh shape.
  • a plurality of through holes 8 are regularly formed in the filter 1.
  • a cake 7 shown in FIG. 3 is formed in the vicinity of the through hole 8 of the filter 1 shown in FIGS. 2 and 3 so as to close the through hole 8.
  • the cake 7 is formed by SS particles captured by the filter 1.
  • the cake 7 functions as a filter that captures the SS particles in the liquid to be processed and separates the SS particles from the liquid to be processed.
  • the average hole diameter of the through holes 8 is in the range of 0.5 ⁇ m to 10.0 ⁇ m. When the hole diameter of the through hole 8 is 0.5 ⁇ m or more, the filtration flow rate of the filter 1 is easily secured, and excellent cleaning properties are obtained.
  • the average hole diameter of the through holes 8 is more preferably 1.0 ⁇ m or more. When the hole diameter of the through hole 8 is 10.0 ⁇ m or less, the cake 7 is easily formed in the vicinity of the through hole 8 so as to close the through hole 8.
  • the average hole diameter of the through holes 8 is more preferably 7.0 ⁇ m or less.
  • the average pore diameter of the through holes 8 of the filter 1 is measured by the following method. First, the through hole 8 of the filter 1 is photographed from directly above with a scanning electron microscope (SEM). At this time, the through-hole 8 extends substantially parallel to the vertical direction and the two filter base materials 6 on which the plating layer 3 is formed, and the surface extends substantially parallel to the horizontal direction. It has a substantially rectangular inner surface shape surrounded by two filter base materials 6 on which the plating layer 3 is formed. In addition, the vertical direction and the horizontal direction are substantially orthogonal. The shortest distance in the vertical direction and the shortest distance in the horizontal direction on the inner surface of the substantially rectangular through hole 8 are measured, and the dimension of the shorter distance is defined as the hole diameter of the through hole 8.
  • SEM scanning electron microscope
  • This distance is the distance between the tips of the needle-like structures 5.
  • one of the dimensions is the hole diameter of the through hole 8.
  • the hole diameter of the through hole 8 is measured at four or more locations, and the average value is defined as the hole diameter of the through hole 8 of the filter 1.
  • the opening ratio of the filter 1 is preferably in the range of 0.01 to 5%.
  • the aperture ratio is 0.01% or more, it is easy to secure the filtration flow rate of the filter 1 and more excellent cleaning properties are obtained.
  • the open area ratio is 5% or less, the SS particles are easily captured.
  • the open area ratio is more preferably 0.1% or more, and more preferably 4% or less.
  • the aperture ratio of the filter 1 is calculated by the following method.
  • the average value of the shortest distance between the adjacent through holes 8 is the average wire diameter of the wire 2 covered with the plating layer 3.
  • the aperture ratio is calculated using the average wire diameter of the wire 2 covered with the plating layer 3 as the average value of the shortest distance between the adjacent through holes 8.
  • an enlarged photograph of the filter 1 is taken using a scanning electron microscope (SEM), and image processing is performed.
  • the wire diameter of the wire 2 covered with the plating layer 3 is measured by selecting 10 representative locations for one photograph, and the average value is the wire covered with the plating layer 3. It is defined as an average wire diameter of 2.
  • the average wire diameter of the wire 2 covered with the plating layer 3 is A and the average value of the hole diameters of the through holes 8 is B
  • the value calculated by B 2 / (A + B) 2 (%) is the opening ratio.
  • the material of the wire 2 a material that can be used in a liquid to be treated that is filtered using the filter 1 is used.
  • the material of the wire 2 is preferably a metal so that the plating layer 3 or the plating layer 3 and the base layer 4 can be easily formed using a plating process.
  • the metal used for the wire 2 for example, iron, nickel, copper, and alloys thereof are preferably used.
  • the wire 2 it is preferable to use a stainless steel wire that is excellent in corrosion resistance, low in cost, and easy to process.
  • the underlayer 4 is provided as necessary in order to improve the adhesion of the plating layer 3 to the wire 2.
  • a material used for the underlayer 4 for example, when the plating layer 3 made of a nickel alloy is formed on the surface of the wire 2, it is preferable to use nickel or a nickel alloy.
  • the nickel alloy include an alloy containing one or more elements selected from boron, phosphorus, and zinc.
  • the thickness of the foundation layer 4 is set to be equal to or greater than the thickness that can improve the adhesion of the plating layer 3 to the wire 2.
  • the thickness of the base layer 4 is set such that the average pore diameter of the through-holes 8 is a size suitable for passing the liquid to be treated containing SS particles through the filter 1.
  • the thickness of the underlayer 4 is preferably 0.5 ⁇ m to 10.0 ⁇ m.
  • the plating layer 3 in the present embodiment is a composite body in which a plurality of needle-like structures 5 arranged close together gather on the surface of the base layer 4.
  • a base portion 5 a that is a region closer to the wire 2 than the base end 53 a of each needle-like structure 5 is integrated with a base portion 5 a of another adjacent needle-like structure 5.
  • the base 5 a of the needle-like structure 5 is continuously formed on the surface of the foundation layer 4.
  • Each needle-like structure 5 has, for example, a polygonal pyramid shape or a conical shape.
  • Each needle-like structure 5 having such a conical shape has a tapered shape from the proximal end 53a toward the distal end 52, as shown in FIG.
  • a valley 53 is formed between adjacent needle-like structures 5, whose width becomes narrower as it approaches the base end 53 a in a cross-sectional view.
  • the valley 53 is formed so as to surround each needle-like structure 5 in plan view.
  • the valleys 53 that surround each needle-like structure 5 are formed so as to be connected to the valleys 53 that surround another adjacent needle-like structure 5 in plan view.
  • the number of needle-like structures 5 per unit area (1 ⁇ m 2 ) of the filter substrate 6 is preferably 1.2 to 10.0 / ⁇ m 2 .
  • the number of needle-like structures 5 per unit area is 1.2 pieces / ⁇ m 2 or more, the surface area of the filter 1 is sufficiently large, and SS particles are easily caught between adjacent needle-like structures 5. .
  • the number of needle-like structures 5 per unit area is preferably 3.0 / ⁇ m 2 or more in order to obtain a filter 1 having a higher SS particle removal function.
  • the gap between the adjacent needle-like structures 5 is prevented from becoming too narrow. For this reason, as shown in FIG. 3, a sufficiently wide space surrounded by the valleys 53 formed between the adjacent needle-like structures 5 and the cake 7 formed on the plating layer 3. 31 is formed.
  • the space 31 functions as a flow path through which the cake-filtered processing liquid flows when the cake 7 is formed.
  • the filter that does not have the needle-like structure 5 only the treatment liquid that has passed through the cake 7 on the through hole 8 passes through the through hole 8, whereas in the filter 1, the cake 7 other than the cake 7 on the through hole 8.
  • the processing liquid that has passed through passes through the through-hole 8 through the space 31.
  • the filter 1 in which the number of needle-like structures 5 per unit area is 10.0 / ⁇ m 2 or less, SS particles are easily removed, and the filtration flow rate is large.
  • the space 31 also functions as a flow path through which the cleaning liquid flows when the filter 1 is cleaned. Therefore, the filter 1 in which the number of needle-like structures 5 per unit area is 10.0 pieces / ⁇ m 2 or less has more excellent detergency.
  • the number of needle-like structures 5 per unit area is preferably 7.0 pieces / ⁇ m 2 or less in order to obtain a filter 1 having a larger filtration flow rate and excellent detergency.
  • the number of needle-like structures 5 per unit area (1 ⁇ m 2 ) of the filter substrate 6 is measured by the following method.
  • the filter is observed with an electron microscope, and the number of apexes of the needle-like structure existing in a square having a length of 2 ⁇ m, a width of 2 ⁇ m, and an area of 4 ⁇ m 2 is measured at four points. Then, the number of apexes of the needle-like structures measured at four locations is averaged, and the number of needle-like structures per unit area (1 ⁇ m 2 ) is calculated.
  • the number of needle-like structures 5 per unit length (1 ⁇ m) in the cross section of the filter substrate 6 is preferably 1.0 to 4.0 pieces / ⁇ m.
  • the number of needle-like structures 5 per unit area is 1.2 / ⁇ m 2 or more.
  • an excellent removal function capable of capturing SS particles can be obtained by using a mechanism of depth filtration and a mechanism of cake filtration.
  • the number of needle-like structures 5 per unit length is preferably 1.5 / ⁇ m or more in order to obtain a filter 1 having a higher SS particle removing function.
  • the number of needle-like structures 5 per unit length is 4.0 / ⁇ m or less
  • the number of needle-like structures 5 per unit area is 10.0 / ⁇ m 2 or less.
  • the gap between the adjacent needle-like structures 5 is prevented from becoming too narrow. Therefore, the space 31 surrounded by the valleys 53 formed between the adjacent needle-like structures 5 and the cake 7 formed on the plating layer 3 has a sufficient width, and the filtration flow rate is high.
  • a filter 1 having a large and excellent cleaning property can be obtained.
  • the number of needle-like structures 5 per unit length is preferably 3.0 pieces / ⁇ m or less in order to obtain a filter 1 having a higher filtration flow rate and excellent cleaning properties.
  • the number of needle-like structures 5 per unit length (1 ⁇ m) in the cross section of the filter substrate 6 is measured by the following method.
  • the filter 1 is fixed with an embedding resin, cut perpendicularly to the surface of the filter substrate, the cut surface is smoothed by ion milling, and photographed using a scanning electron microscope (SEM). Thereafter, the number of needle-like structures per 10 ⁇ m is measured along the substantially extending direction of the surface of the filter base material in the photograph of the photographed cross section of the filter base material. Then, the number of needle-like structures per unit length (1 ⁇ m) is calculated from the measured number of needle-like structures.
  • the average height H of the needle-like structure 5 and the average width D of the base end portion in the cross section of the filter base 6 are obtained by measuring the dimensions of the following parts by the measurement method shown below. is there.
  • valleys 53 are formed between adjacent needle-like structures 5 in the cross section of the filter base 6.
  • the base ends 53 a and 53 a that are the valley bottoms facing each other with the needle-like structure 5 interposed therebetween are connected by a straight line 51, and the length of the straight line 51 is the base end of the needle-like structure 5.
  • the shortest distance between the tip 52 of the needle-like structure 5 and the straight line 51 is defined as the heights H1 and H2 of the needle-like structure 5.
  • the dimensions of the following parts are indicated by needle-like structures.
  • the heights H3 and H4 of the structures 57 and 58 and the widths D3 and D4 of the base ends of the needle-like structures 57 and 58 were used.
  • a straight line 54 connects the base ends 53a and 53a, which are valley bottoms facing each other across the needle-like structure 59 in which the needle-like structures 57 and 58 are integrated.
  • a perpendicular line 56 is drawn from the bottom of the valley 55 between the two needle-like structures 57 and 58 toward the straight line 54.
  • the distances from the intersection of the perpendicular 56 and the straight line 54 to the base ends 53a and 53a are defined as the widths D3 and D4 of the base ends of the needle-like structures 57 and 58, respectively.
  • the shortest distances between the tips 52a and 52b of the needle-like structures 57 and 58 and the straight line 54 are defined as heights H3 and H4 of the needle-like structures 57 and 58, respectively.
  • the length of the perpendicular 56 is less than 3/4 of the heights H3 and H4 of the needle-like structures 57 and 58, it is regarded as two independent needle-like structures.
  • the reference that the two needle-like structures 57 and 58 are integrated is a case other than the case where the two needle-like structures are regarded as independent.
  • the filter 1 In order to measure the height of the needle-like structure 5 and the width of the base end portion of the needle-like structure 5, the filter 1 is fixed by embedding resin and cut, and the cut surface is polished by ion milling and scanned. Photograph using a scanning electron microscope (SEM). Thereafter, a range of 10 ⁇ m in length along the substantially extending direction of the surface of the filter substrate in the enlarged photograph of the cross-section of the photographed filter substrate 6 is defined as one measurement region, and all the above-described ones existing in four measurement regions. The height of the needle-like structure 5 and the width of the base end are measured. Then, the average value of the measured heights of the four needle-like structures 5 is defined as an average height H of the needle-like structures 5. Further, the average value of the widths of the base end portions of the four needle-like structures 5 measured is defined as the average width D of the base end portions of the needle-like structures 5.
  • the variation coefficient of the height of the needle-like structure 5 in the cross section of the filter base 6 is preferably 0.15 to 0.50.
  • the variation coefficient is obtained by dividing the standard deviation of the height distribution of the needle-like structure 5 in the cross section of the filter base 6 described above by the arithmetic average value of the height of the needle-like structure 5.
  • the coefficient of variation is in the range of 0.15 to 0.50, it is possible to obtain a filter 1 that is further excellent in SS particle removal function and detergency.
  • the variation coefficient is 0.15 or more, the variation in height of the needle-like structure 5 is sufficiently large.
  • the flow of the liquid to be treated containing SS particles on the surface of the filter 1 becomes complicated, and the needle-like structure 5 having a high height is formed.
  • SS particles are easily caught.
  • the SS particles are easily captured by the mechanism of the deep layer filtration, and the cake 7 is easily formed on the surface of the plating layer 3 starting from the SS particles caught by the needle-like structure 5 having a high height.
  • the coefficient of variation is preferably 0.18 or more in order to obtain a filter 1 in which SS particles are more easily captured.
  • the filter 1 has a high filtration flow rate and excellent cleaning properties as compared with a filter without a needle-like structure.
  • the coefficient of variation is preferably 0.36 or less in order to make the filter 1 having a higher filtration flow rate and excellent cleaning properties.
  • the aspect ratio H / D between the average width D and the average height H of the base end portion of the needle-like structure 5 in the cross section of the filter base 6 is preferably 0.5 to 4.0.
  • the aspect ratio H / D is 0.5 or more, the height is sufficiently high surrounded by the valleys 53 formed between the adjacent needle-like structures 5 and the cake 7 formed on the plating layer 3. A space 31 is formed. For this reason, after the cake 7 is formed by filtration, the cake-filtered treatment liquid easily flows in the space 31, and the filtration flow rate is large and the cleaning property is excellent.
  • the aspect ratio H / D is preferably 1.0 or more in order to obtain a filter 1 having a higher filtration flow rate and excellent cleaning properties.
  • the aspect ratio H / D is 4.0 or less, since the needle-like structure 5 having excellent strength is obtained, the filter 1 having excellent durability can be obtained.
  • the aspect ratio H / D is preferably 3.0 or less in order to make the filter 1 more excellent in durability.
  • the average height H of the needle-like structures 5 in the cross section of the filter base 6 is 0.2 to 2.5 ⁇ m.
  • the average height H of the needle-like structures 5 is 0.2 ⁇ m or more, the valleys 53 formed between the adjacent needle-like structures 5 and the cake 7 formed on the plating layer 3 A sufficiently high space 31 surrounded is formed. For this reason, after the cake is formed at the time of filtration, the treatment liquid subjected to the cake filtration easily flows in the space 31, the filtration flow rate is easily secured, and excellent cleaning properties are obtained.
  • the average height H of the needle-like structure 5 is preferably 0.4 ⁇ m or more in order to obtain a filter 1 having a further excellent filtration flow rate and cleanability.
  • the average height H of the needle-like structures 5 is 2.5 ⁇ m or less, the gap between the adjacent needle-like structures 5 is prevented from becoming too narrow. For this reason, the space 31 is sufficiently ensured, and the filter 1 having excellent filtration flow rate and cleanability can be obtained.
  • the average height H of the needle-like structure 5 is preferably 1.9 ⁇ m or less in order to obtain a filter 1 having a further excellent filtration flow rate and cleanability.
  • the relationship between the average width D of the base end portion of the needle-like structure 5 in the cross section of the filter base 6 and the average particle diameter b (SS particle average particle diameter D 50 ) of the substance to be removed is b / D ⁇ 0. .33 is preferably satisfied.
  • the b / D is 0.33 or more, it becomes difficult for the SS particles to enter the vicinity of the valley bottom of the valley 53 formed between the adjacent needle-like structures 5. Therefore, a wide space 31 surrounded by the valleys 53 and the cake 7 formed on the plating layer 3 is easily formed. Accordingly, the cake-filtered processing liquid easily flows in the space 31, and the filter 1 is excellent in the filtration flow rate and the cleanability.
  • the b / D is preferably 0.50 or more in order to obtain a filter 1 having a higher filtration flow rate and excellent cleaning properties.
  • the b / D is preferably 3.00 or less.
  • the SS particles are more easily caught between the adjacent needle-like structures 5. For this reason, it is possible to obtain the filter 1 in which the SS particles are more easily captured by the deep filtration mechanism and the cake 7 is easily formed by the captured SS particles.
  • the b / D is more preferably 2.00 or less in order to obtain the filter 1 in which SS particles are more easily captured.
  • the average particle diameter b is measured by a laser diffraction method. Specifically, it can be measured by a SALD-DS21 type measuring device (trade name) manufactured by Shimadzu Corporation.
  • a metal capable of depositing the plurality of needle-like structures 5 on the surface of the filter base 6 by a process such as electroplating is used.
  • a metal capable of depositing the plurality of needle-like structures 5 on the surface of the filter base 6 by a process such as electroplating.
  • a metal include iron, nickel, copper, and alloys thereof.
  • nickel or a nickel alloy is particularly preferably used as the metal used for the plating layer 3 because it is easy to control the shape of the needle-like structure 5 and has excellent corrosion resistance.
  • the nickel alloy include an alloy containing one or more elements selected from boron, phosphorus, and zinc.
  • a method for manufacturing the filter 1 shown in FIGS. 2 and 3 will be described.
  • a wire 2 that is twilled to form a mesh is prepared.
  • the base layer 4 is formed on the entire surface of the wire 2 using a plating process.
  • a plating process for forming the underlayer 4 a conventionally known method can be used.
  • the nickel is plated by electrolytic nickel plating or electroless nickel plating.
  • a plurality of needle-like structures 5 are deposited on the base layer 4 provided on the entire surface of the wire 2 by electroplating.
  • the wire 2 is covered with the plating layer 3 via the base layer 4.
  • the electroplating process for forming the plating layer 3 a conventionally known method can be used.
  • an additive is added to the plating bath after the formation of the underlayer 4 to continuously perform electrolytic nickel plating treatment or electroless nickel plating. It is preferable to form the plating layer 3 by performing the treatment.
  • the shape and size of the needle-like structures 5 can be changed by changing the type, concentration, and plating time of the additive added to the plating bath.
  • the additive include ethylenediamine dihydrochloride and ethylenediamine (EDA).
  • heat treatment may be performed as necessary to promote crystallization of the plating layer 3.
  • another metal or organic substance is used on the surface of the plating layer 3 to improve the durability of the filter, if necessary.
  • a coating layer may be formed.
  • the filtration performance of the filter 1 shown in FIGS. 2 and 3 will be described.
  • SS particles are first captured by the mechanism of surface filtration and depth filtration. Since the filter 1 has a plurality of needle-like structures 5 having a predetermined height that are arranged close to the surface, the contact area between the filter 1 and the liquid to be treated containing SS particles is large. For this reason, in this embodiment, agglomeration of SS particles quickly occurs at a plurality of locations on the surface of the plating layer 3 starting from the SS particles attached to the surface of the needle-like structure 5 by the surface filtration and depth filtration mechanisms. It is formed.
  • the formed aggregate grows and peels by continuing the passage of the liquid to be treated containing SS particles to the filter 1 and moves toward the through hole 8 together with the liquid to be treated containing SS particles.
  • the through holes 8 have an average hole diameter of 0.5 to 10.0 ⁇ m. For this reason, the one or more aggregates that have moved to the through-hole 8 become the cake 7 that easily closes the through-hole 8.
  • the filter 1 of this embodiment not only the surface filtration mechanism but also the depth filtration mechanism and the cake filtration mechanism can be used to remove small SS particles in the liquid to be treated. Therefore, excellent filtration performance can be obtained.
  • the filter 1 has the trough 53 between the adjacent acicular structures 5, as shown in FIG.
  • the width becomes narrower as it approaches the base end 53a that is the bottom of the valley in a cross-sectional view.
  • the SS particles captured by the filter 1 are unlikely to enter the vicinity of the base end 53 a of the valley 53. Therefore, in the filter 1 in which the cake 7 is formed on the surface of the plating layer 3, a sufficiently large space 31 surrounded by the valley 53 and the cake 7 is formed as shown in FIG. After the space 31 is formed, the upper portion of the space 31 is covered with the lid formed by the cake 7 even if the liquid to be processed containing SS particles is further passed through the filter 1. , SS particles hardly enter the space 31. Therefore, even if the liquid to be treated containing SS particles continues to pass through the filter 1 and further SS particles are deposited on the cake 7, a filtration flow rate is secured.
  • first method a method of supplying a cleaning liquid to the surface of the filter 1 on the side of the processing liquid region 102a
  • second method a method of supplying a cleaning liquid (back washing) in a direction opposite to the direction in which the liquid to be treated containing SS particles of the filter 1 is passed.
  • the cleaning liquid flows into the space 31 from multiple directions through the valleys 53 formed so as to surround each needle-like structure 5.
  • SS particles or agglomerates of SS particles adhering to the filter 1 are pushed up to the cleaning liquid, and separation of the SS particles or agglomerates of SS particles is promoted.
  • the needle-like structure 5 of the filter 1 has a tapered shape from the proximal end 53 a toward the distal end 52. For this reason, SS particles or aggregates of SS particles pushed up by the cleaning liquid are easily peeled off from the filter 1.
  • the needle-like structure 5 has a tapered shape, SS particles adhering to the needle-like structure 5 at the time of cleaning are not easily caught in the valleys 53 and are easily separated from the needle-like structure 5. . Therefore, by washing the filter 1 using the first method, SS particles or aggregates of SS particles adhering to the filter 1 are quickly removed.
  • the filter 1 When the filter 1 is washed using the first method, the cake 7 formed in the through hole 8 is difficult to remove. Therefore, when the liquid to be treated containing SS particles is again passed through the filter 1 cleaned using the first method, a predetermined filtration performance can be obtained immediately after the passage of the liquid to be treated is started. Therefore, the time from the start of passing the liquid to be treated to the time when the cake 7 is formed on the filter 1 and a predetermined filtration performance is obtained (initial leak) is short, and in this respect, the first method is preferable. .
  • the filter 1 when the filter 1 is cleaned using the second method, the cake 7 formed in the through hole 8 is pushed away by the cleaning liquid and removed. At this time, the cleaning liquid flows into the space 31 existing in the through hole 8 and on the side of the liquid region 102 a to be processed from multiple directions through the valleys 53 formed so as to surround each needle-like structure 5. Accordingly, the cake 7 formed so as to cover at least a part of the upper portion of the valley 53 is pushed up by the cleaning liquid, and the peeling of the cake 7 is promoted.
  • the needle-like structure 5 of the filter 1 has a tapered shape from the proximal end 53 a toward the distal end 52.
  • the cake 7 pushed up by the cleaning liquid is easily peeled off from the filter 1 by the flow of the cleaning liquid trying to pass through the through hole 8.
  • the needle-like structure 5 has a tapered shape, SS particles adhering to the needle-like structure 5 are not easily caught in the valleys 53 during backwashing, and are easily separated from the needle-like structure 5. The Therefore, by washing the filter 1 using the second method, the cake 7 formed on the filter 1 and the SS particles adhering to the filter 1 are quickly removed.
  • the filter 1 When the filter 1 is washed using the second method, not only the SS particles or the aggregates of the SS particles adhering to the filter 1 but also the cake 7 formed in the through holes 8 can be effectively removed. . Therefore, the filter 1 after cleaning is regenerated to a state close to an unused filter.
  • the filter 1 according to the embodiment includes a plurality of needle-like structures having a height of 0.2 to 2.5 ⁇ m and a through hole having an average pore diameter of 0.5 to 10.0 ⁇ m, which are arranged close to the surface. .
  • the filter 1 of the embodiment can capture SS particles by using a mechanism of depth filtration and a mechanism of cake filtration, and has an excellent removal function.
  • the cake 7 is formed by allowing the liquid to be treated containing SS particles to pass therethrough, and then surrounded by the valley 53 and the cake 7 formed between the needle-like structures 5. A sufficiently large space 31 is formed. Therefore, the filter 1 of the embodiment is excellent in the filtration flow rate and the cleanability.
  • the filter 1 of the embodiment has a plurality of needle-like structures 5 formed on the surface of the filter base 6, there is no space between the filter base 6 and the needle-like structures 5. For this reason, compared with the case where space exists between the filter base material 6 and the needle-like structure 5, for example, the needle-like structure 5 is less likely to drop off, and the filter 1 having excellent durability is obtained. be able to. In addition, since there is no space between the filter base 6 and the needle-like structure 5, the SS particles in the liquid to be treated are not clogged in the space between the filter base 6 and the needle-like structure 5. . Therefore, the filter 1 is easy to clean.
  • the filter 1 having a wire mesh formed of the wire 2 is used as the filter base 6, the SS particles can be easily removed by washing compared to the case where the filter base is a nonwoven fabric, and the washing is performed in a short time. be able to.
  • FIG. 4 is a flowchart for explaining an example of a processing method using the processing system of the first embodiment.
  • the filter an unused filter or a filter from which cake has been removed by washing is used.
  • the on-off valve 308 and the fourth valve 114 are switched so that the processing liquid discharge pipe 108 and the initial passing liquid discharge pipe 109 are communicated with each other.
  • the fifth valve 122 is switched to shut off the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106.
  • the eleventh valve 303 is closed, and the connection between the cleaning processing liquid supply pipe 105 and the discharge pipe 115 is cut off.
  • the ninth valve 301 and the tenth valve 302 are closed to cut off the supply of the processing liquid from the processing liquid tank 103 to the processing liquid area 102a or the processing liquid area 102b.
  • the liquid to be processed is transferred from the liquid tank 101 to be processed to the liquid region 102a of the processing tank 102 via the liquid supply pipe 104 to be processed.
  • the processing liquid is generated by passing the processing liquid from the processing liquid region 102a side of the filter 1 to the processing liquid region 102b side.
  • the processing step is performed while measuring the pressure of the liquid to be processed in the liquid area 102a to be processed by the pressure gauge 121, and whether or not the pressure of the liquid to be processed measured by the pressure gauge 121 by the control device 120 is below a threshold value. Is determined (S2 in FIG. 4).
  • Measurement of the pressure of the liquid to be processed in the liquid area 102a to be processed by the pressure gauge 121 may be performed continuously during the processing step, or may be performed at predetermined time intervals.
  • the measurement result of the pressure of the liquid to be processed measured by the pressure gauge 121 is sent to the control device 120. Further, the determination as to whether or not the pressure of the liquid to be processed is equal to or lower than the threshold value by the control device 120 may be performed continuously during the processing step, or at predetermined intervals. Also good.
  • the processing liquid pumped by the first pump 104a is supplied to the processing liquid region 102a of the processing tank 102 from a substantially central portion of the upper surface of the processing tank 102 in plan view.
  • the processing liquid supplied to the processing liquid region 102a spreads on the filter 1 installed substantially horizontally in the processing tank 102 and passes through the filter 1 substantially vertically.
  • the treatment liquid that has passed through the filter 1 is connected to the treatment liquid region 102b from the start of the treatment process until a cake is formed on the filter 1 until a predetermined filtration performance is obtained (initial leak). Then, the liquid is discharged from the processing liquid region 102 b through the processing liquid discharge pipe 108 and returned to the liquid tank 101 to be processed through the initial passing liquid discharge pipe 109. Then, at the stage when the initial leak is completed, the fourth valve 114 is switched, and the processing liquid region 102 b of the processing tank 102 and the processing liquid tank 103 are communicated with each other by the processing liquid discharge pipe 108. That is, in the processing method of the present embodiment, the processing liquid discharge pipe 108 and the initial passing liquid discharge pipe 109 are communicated only during the initial leak.
  • Whether or not a cake has been formed in the filter 1 is, for example, that the turbidity of the processing liquid discharged from the processing liquid region 102b of the processing tank 102 is a predetermined value or less. It is judged by whether or not.
  • the control device 120 determines whether or not the pressure of the liquid to be processed in the liquid area 102a to be processed measured by the pressure gauge 121 is equal to or less than a threshold value. As a result, when the pressure of the liquid to be processed is equal to or lower than the threshold value, the processing process is continued.
  • the control device 120 stops the pump 104a and switches the first valve 111, and the liquid to be processed is supplied from the liquid tank 101 to be processed.
  • the supply of the liquid to be processed to the region 102a is shut off, and the processing step is stopped (processing stop step) (S3 in FIG. 4).
  • the fifth valve 122 is switched to allow the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 to communicate with each other.
  • the control device 120 switches the ninth valve 301, the tenth valve 302, the eleventh valve 303, and the third valve 113 to supply the processing liquid to the processing liquid area 102 a or the processing liquid area 102 b, and filter 1
  • the cleaning process for cleaning the is started (S4 in FIG. 4).
  • the cleaning process only one or both of the process of supplying the process liquid to the process liquid area 102a and the process of supplying the process liquid to the process liquid area 102b may be performed.
  • a processing liquid that has passed through the filter 1 is used as a cleaning liquid used for cleaning the filter 1.
  • the ninth valve 301 when the ninth valve 301 is opened and the processing liquid is supplied to the processing liquid region 102a via the first branch pipe 105a, the supplied processing liquid is applied to the filter 1 on the processing liquid region 102a side. Is moved toward the connection position between the liquid region 102a to be treated and the cleaning liquid discharge pipe 107.
  • the connection position between the first branch pipe 105a and the processing tank 102 and the connection position between the processing tank 102 and the cleaning liquid discharge pipe 107 are substantially opposed to each other with the central portion of the processing tank 102 in plan view. Therefore, a sufficient distance can be secured for the processing liquid supplied to the processing liquid region 102a to flow through the processing liquid region 102a, and the processing liquid and the filter 1 on the processing liquid region 102a side are in sufficient contact.
  • the processing liquid that has passed through the processing target liquid region 102 a is discharged from the processing target liquid region 102 a through the cleaning liquid discharge pipe 107 as a concentrated liquid containing a large amount of SS particles, and is stored in the concentrated sludge tank 106.
  • the SS particles deposited on the surface of the filter 1 on the treatment liquid region 102a side are mainly removed.
  • the connection position between the second branch pipe 105b and the treatment tank 102 and the connection position between the treatment tank 102 and the cleaning liquid discharge pipe 107 are disposed at substantially opposite positions with the central portion of the treatment tank 102 in plan view. .
  • the processing liquid that has passed through the filter 1 while moving in the processing liquid area 102b and the processing liquid area 102a is discharged from the processing liquid area 102a through the cleaning liquid discharge pipe 107 as a concentrated liquid containing a large amount of SS particles. Then, it is stored in the concentrated sludge tank 106.
  • the control device 120 determines whether or not the cleaning process is completed by the control device 120 (S5 in FIG. 4). It is preferable to determine whether or not the cleaning process has ended, for example, based on the elapse of a predetermined time after starting the cleaning process. Whether or not the cleaning process is completed depends on whether a predetermined time has elapsed and / or the pressure of the liquid to be processed in the liquid area to be processed 102a is equal to or higher than a predetermined threshold value. May be determined. If the controller 120 determines that the cleaning process is not completed, the cleaning process is continued.
  • control device 120 controls the ninth valve 301, the tenth valve 302, and the eleventh valve 303, and the liquid region 102a to be processed or The supply of the processing liquid to the processing liquid region 102b is shut off.
  • the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 are shut off by switching the fifth valve 122.
  • the 1st valve 111 is controlled by the control apparatus 120, a to-be-processed liquid is supplied to the to-be-processed liquid area
  • the cleaning process is a process of supplying the processing liquid to the processing target liquid region 102a from the first time to the end. It may be a step of supplying the treatment liquid to the treatment liquid region 102b, or a part of the washing steps from the first time to the last may be different.
  • the process liquid is supplied to the process liquid area 102b every time the process liquid is supplied to the process liquid area 102a 1 to 5 times. It is preferable to perform the process to perform once.
  • both the step of supplying the processing liquid to the processing liquid region 102a and the step of supplying the processing liquid to the processing liquid region 102b may be performed.
  • the cleaning process liquid supply pipe 105 and the discharge pipe 115 are appropriately switched by switching the third valve 113 according to the amount of the processing liquid in the processing liquid tank 103. Communicated. As a result, the processing liquid in the processing liquid tank 103 is discharged to the outside of the processing system 100.
  • the filter 1 As the filter 1, a plurality of needle-like structures 5 with a height of 0.2 to 2.5 ⁇ m disposed close to the surface and an average pore diameter of 0.5 to 10.0 ⁇ m. A first filter having a through-hole 8 is used. For this reason, the SS particles in the liquid to be treated can be captured using the mechanism of the depth filtration and the mechanism of the cake filtration. Moreover, SS particles are easily removed from the filter 1 by washing, and the first filter is preferable in this respect.
  • the processing system 100 of the present embodiment includes a pressure gauge 121 that measures the pressure of the liquid to be processed in the liquid area 102a to be processed, a first valve 111 installed in the liquid supply pipe 104 to be processed, and a supply of cleaning liquid.
  • a ninth valve 301 and a tenth valve 302 are provided in the pipe 105. Furthermore, the processing system 100 of this embodiment determines whether or not the pressure of the liquid to be processed measured by the pressure gauge 121 is equal to or lower than a threshold value. To control the ninth valve 301 and the tenth valve 302 to supply the processing liquid to the processing liquid area 102a or the processing liquid area 102b. 120.
  • the processing step is performed while measuring the pressure of the processing liquid in the processing liquid region 102a, and the pressure of the processing liquid exceeds the threshold value. Based on the above, it is possible to finish the processing step and start the cleaning step. Therefore, the filter 1 can be washed at an appropriate timing according to the decrease in the filtration performance of the processing system 100, and the liquid to be processed can be processed efficiently.
  • the processing liquid discharge pipe 108 may be connected to the treatment tank 102 separately.
  • the case where the discharge pipe 115 is connected to the cleaning processing liquid supply pipe 105 via the third valve 113 has been described as an example.
  • the processing liquid supply pipe 105 may be connected to the processing liquid tank 103 separately.
  • the cleaning processing liquid supply pipe 105 is connected to the processing liquid tank 103, the first branch pipe 105a branched from the main pipe 105c and connected to the processing target liquid region 102a, and the processing liquid region 102b.
  • the cleaning process liquid supply pipe 105 is not provided with the main pipe 105c, and the first branch pipe 105a connected to the process liquid area 102a and the process liquid tank 103, the process liquid area 102b, the process liquid tank 103, and the like.
  • a second branch pipe 105b connected to the second branch pipe 105b.
  • the filter in which the base layer 4 is provided between the wire 2 and the plating layer 3 has been described as an example, but the base layer may not be provided.
  • the case where the wire 2 is twilled and has a mesh shape has been described as an example.
  • the shape of the wire 2 is not particularly limited, and is, for example, a plain weave or a tatami weave. Also good.
  • FIG. 5 is a schematic diagram illustrating a processing system 130 according to the second embodiment.
  • the processing system 130 of the second embodiment is different from the processing system 100 of the first embodiment shown in FIG. 1 in that the liquid supply pipe 104 to be processed, the processing liquid supply pipe 105 for cleaning, the cleaning liquid discharge pipe 107 and the processing. This is a connection position between the liquid discharge pipe 108 and the treatment tank 102.
  • the treatment system 130 of the second embodiment is provided with a treated water circulation pipe 305 that returns from the cleaning liquid discharge pipe 107 to the treated liquid tank 101 via the three-way valve 304. Different from the system 100. Therefore, common members are denoted by the same reference numerals and description thereof is omitted.
  • region 102a of the processing tank 102 are connected by the wall surface (side surface) upper part of the processing tank 102.
  • the processing liquid discharge pipe 108 and the processing liquid region 102 b of the processing tank 102 are connected at the lower part of the wall surface of the processing tank 102.
  • the connection position between the processing liquid discharge pipe 108 and the processing tank 102 is substantially opposite to the connection position between the processing liquid supply pipe 104 and the processing tank 102 with the central portion of the processing tank 102 in plan view.
  • the first branch pipe 105 a of the cleaning processing liquid supply pipe 105 and the liquid region 102 a to be processed of the processing tank 102 are connected to each other at the upper part of the wall surface of the processing tank 102.
  • a connection portion between the first branch pipe 105 a and the processing tank 102 is disposed in the vicinity of a connection portion between the liquid supply pipe 104 to be processed and the processing tank 102.
  • the second branch pipe 105 b and the processing liquid region 102 b of the processing tank 102 are connected at the lower part of the wall surface of the processing tank 102.
  • the connection position between the first branch pipe 105a and the treatment tank 102 substantially overlaps with the connection position between the second branch pipe 105b and the treatment liquid region 102b of the treatment tank 102 in plan view.
  • the cleaning liquid discharge pipe 107 and the processing target liquid region 102 a of the processing tank 102 are connected to each other at the upper part of the wall surface of the processing tank 102.
  • the connection position between the cleaning liquid discharge pipe 107 and the processing tank 102 is substantially opposite to the connection position between the first branch pipe 105a and the processing tank 102 with the central portion of the processing tank 102 in plan view.
  • a three-way valve 304 connected to the liquid circulation pipe 305 to be treated is installed in the middle of the cleaning liquid discharge pipe 107.
  • the liquid to be processed circulation pipe 305 is communicated with the liquid tank 101 to be processed through a back pressure valve 306.
  • the processing method using the processing system 130 of the second embodiment and the processing method using the processing system 100 of the first embodiment shown in FIG. 1 are the processing target supplied to the processing target liquid region 102a in the processing step. It differs in the way the liquid flows. Others are the same as those of the processing system 100 of the first embodiment shown in FIG.
  • the liquid to be processed that is pumped by the first pump 104a in the processing step is within the liquid region 102a to be processed from the upper part of the wall surface of the processing tank 102. Is supplied approximately horizontally.
  • the liquid to be processed supplied to the liquid area 102a to be processed moves on the filter 1 installed almost horizontally in the processing tank 102 toward the connection position between the processing liquid discharge pipe 108 and the processing tank 102, It passes through the filter 1 from the treated liquid region 102a side to the treated liquid region 102b side.
  • connection position between the liquid supply pipe 104 to be processed and the processing tank 102 and the connection position between the processing liquid discharge pipe 108 and the processing tank 102 are substantially opposed to each other with the central portion of the processing tank 102 in plan view. Therefore, a sufficient distance can be secured for the liquid to be processed supplied to the liquid region 102a to flow through the liquid region 102a to be processed, and the liquid to be processed and the filter 1 are sufficiently in contact with each other.
  • the liquid region 102a to be processed is connected to the liquid tank 101 to be processed through the three-way valve 304 and the liquid circulation pipe 305 to be processed.
  • the internal pressure of the processing tank 102 is maintained by a back pressure valve 306.
  • the to-be-processed liquid which could not be filtered in the processing tank 102 is returned to the to-be-processed liquid tank 101 via the to-be-processed liquid circulation piping 305.
  • the liquid region 102a to be treated is connected to the concentrated sludge tank 106 via the three-way valve 304 and the cleaning liquid discharge pipe 107 in the cleaning process.
  • the processing system 130 of the present embodiment also has a plurality of needle-like structures 5 having a height of 0.2 to 2.5 ⁇ m and an average pore diameter of 0.5 to 10.0 ⁇ m, which are arranged close to the surface as the filter 1.
  • a first filter having a through-hole 8 is used. For this reason, the SS particles in the liquid to be treated can be captured using the mechanism of the depth filtration and the mechanism of the cake filtration. Moreover, SS particles are easily removed from the filter 1 by washing, and the first filter is preferable in this respect.
  • the filter 1 can be cleaned at an appropriate timing according to the decrease in the filtration performance of the processing system 130, and the processing liquid can be efficiently obtained. It can be processed.
  • FIG. 6 is a schematic diagram illustrating a processing system 150 according to the third embodiment.
  • the processing system 150 according to the third embodiment is different from the processing system 100 according to the first embodiment shown in FIG.
  • the processing system 150 of the third embodiment and the processing system 100 of the first embodiment shown in FIG. 1 are a liquid supply pipe 104 to be processed, a processing liquid supply pipe 105 for cleaning, a cleaning liquid discharge pipe 107, a processing liquid. It differs in the point of the connection position of each piping of the liquid discharge piping 108 and the initial passage liquid discharge piping 109, and the processing tank 160.
  • the processing tank 160 in the processing system 150 removes SS particles from the processing liquid and generates a processing liquid.
  • the processing tank 160 includes a main body 162 and two cylindrical filters 161a and 161b.
  • the filters 161a and 161b are obtained by forming the filter 1 shown in FIGS. 2 and 3 into a cylindrical shape.
  • cylindrical filters 161 a and 161 b divide the outside of the filters 161 a and 161 b in the main body 162 into a processing liquid region and the inside of the filters 161 a and 161 b into a processing liquid region.
  • the shape and arrangement of the filters 161a and 161b in the treatment tank 160 are not particularly limited, but for example, a cylindrical shape extending in the vertical direction is preferable. In such filters 161a and 161b, the direction of the liquid to be treated flowing from the outside toward the inside tends to be substantially horizontal. For this reason, the liquid to be processed is likely to flow uniformly from the entire outer surface of the filters 161a and 161b, and a cylindrical shape is preferable in this respect.
  • the installation positions of the filters 161a and 161b in the processing tank 160 are not particularly limited, but it is preferable that the filters 161a and 161b are installed so that the entire outer surfaces of the filters 161a and 161b are in sufficient contact with the liquid to be processed.
  • the shape of the main body 162 of the treatment tank 160 is a substantially trapezoidal shape in a side view, and the cross-sectional shape gradually decreases from the upper surface toward the lower surface. For this reason, the concentration of the SS particles settled in the liquid to be treated accommodated in the main body 162 is promoted.
  • the liquid supply pipe 104 to be processed and the processing tank 160 are connected on the side surface of the processing tank 160.
  • the cleaning liquid discharge pipe 107 and the processing tank 160 are connected at the lower surface of the processing tank 160.
  • a pump 107 a is installed in the cleaning liquid discharge pipe 107.
  • the pump 107 a takes out the concentrated liquid containing a lot of SS particles from the processing tank 160 and pumps it to the concentrated sludge tank 106.
  • the processing system 150 is provided with a pipe 153.
  • the pipe 153 is connected with flow paths 151a and 151b, a cleaning nozzle 152, an initial passage liquid discharge pipe 109, a cleaning processing liquid supply pipe 105, and a processing liquid discharge pipe 108, and a sixth valve 156 and a seventh valve 155.
  • the eighth valve 154 is installed (the “sixth valve 156”, “seventh valve 155”, and “eighth valve 154” in this embodiment correspond to the second valve in the claims).
  • the sixth valve 156, the seventh valve 155, and the eighth valve 154 are three-way valves.
  • the pipe 153 connects the sixth valve 156 and the eighth valve 154.
  • the pipe 153 is used for the movement of the processing liquid generated when the liquid to be processed passes through the filters 161a and 161b from the outside to the inside, and the movement of the processing liquid that passes the filters 161a and 161b from the inside to the outside. It is done.
  • the sixth valve 156 By switching the sixth valve 156, the flow paths 151a, 151b and the pipe 153 are communicated, or the cleaning nozzle 152 and the pipe 153 are communicated.
  • the seventh valve 155 By switching the seventh valve 155, the initial passage liquid discharge pipe 109 and the pipe 153 closer to the flow paths 151a and 151b than the seventh valve 155 communicate with each other, or the initial passage liquid discharge pipe 109 and the pipe 153 are blocked.
  • the eighth valve 154 the processing liquid discharge pipe 108 and the pipe 153 communicate with each other, or the cleaning processing liquid supply pipe 105 and the pipe 153 communicate with each other. Switching of the sixth valve 156, the seventh valve 155, and the eighth valve 154 is controlled by the control device 120.
  • the cleaning process liquid supply pipe 105 and the pipe 153 are communicated with each other by switching the eighth valve 154. Further, by switching the sixth valve 156, the flow paths 151a and 151b or the cleaning nozzle 152 and the pipe 153 are communicated. Accordingly, the pipe 153, the flow paths 151a and 151b, and the cleaning nozzle 152 function as a part of the cleaning processing liquid supply mechanism.
  • the flow paths 151 a and 151 b are pipes connected to the openings in the spaces inside the filters 161 a and 161 b and the pipe 153.
  • the flow paths 151a and 151b are pipes that take out the processing liquid generated when the liquid to be processed passes through the filters 161a and 161b from the outside toward the inside.
  • the flow paths 151a and 151b are pipes that supply a processing liquid that passes the filters 161a and 161b from the inside toward the outside.
  • the cleaning nozzle 152 ejects the processing liquid toward the filters 161a and 161b.
  • the cleaning nozzle 152 is cylindrical and has a plurality of jet nozzles arranged along the length direction.
  • the cleaning nozzle 152 is disposed adjacent to the filters 161a and 161b and substantially parallel to the filters 161a and 161b.
  • the control device 120 uses a predetermined threshold value to determine the pressure of the liquid to be processed in the liquid area to be processed (area outside the filters 161 a and 161 b in the main body 162) measured by the pressure gauge 121. It is determined whether or not: Based on the determination result, the control device 120 includes a first valve 111 installed in the liquid supply pipe 104 to be processed and a cleaning liquid supply mechanism (cleaning liquid supply pipe 105, pipe 153, flow path 151a, 151b and the second valve (sixth valve 156, seventh valve 155, and eighth valve 154) installed in the cleaning nozzle 152).
  • a cleaning liquid supply mechanism cleaning liquid supply pipe 105, pipe 153, flow path 151a, 151b and the second valve (sixth valve 156, seventh valve 155, and eighth valve 154) installed in the cleaning nozzle 152).
  • the control device 120 controls the first valve 111 to supply the liquid to be processed to the liquid area to be processed, and the sixth valve 156 and the seventh valve 155, the eighth valve 154 is controlled to cut off the supply of the processing liquid to the processing liquid area or the processing liquid area (inside the filters 161a and 161b).
  • the control device 120 controls the first valve 111 to shut off the supply of the liquid to be processed to the liquid area to be processed, and the sixth valve 156 and the seventh valve 155, the eighth valve 154 is controlled to supply the processing liquid to the processing liquid area or the processing liquid area.
  • unused filters or filters from which cake has been removed by washing are used as the filters 161a and 161b.
  • the seventh valve 155 is switched to communicate the initial passage liquid discharge pipe 109 with the pipe 153 on the flow paths 151a and 151b side of the seventh valve 155.
  • the connection between the pipe 153 closer to the flow paths 151 a and 151 b than the seventh valve 155 and the pipe 153 closer to the eighth valve 154 than the seventh valve 155 is blocked.
  • the fifth valve 122 is switched to shut off the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106.
  • the third valve 113 is switched to cut off the connection between the cleaning processing liquid supply pipe 105 and the discharge pipe 115.
  • the liquid to be processed is supplied from the liquid tank 101 to be processed to the liquid area of the processing tank 160 through the liquid supply pipe 104 to be processed.
  • Supply and start processing steps In the processing step, the processing liquid is generated by passing the processing liquid from the processing liquid region side (outside) to the processing liquid region side (inside) of the filters 161a and 161b.
  • the processing step is performed while measuring the pressure of the liquid to be processed in the liquid area to be processed by the pressure gauge 121, and whether or not the pressure of the liquid to be processed measured by the pressure gauge 121 by the control device 120 is equal to or less than a threshold value. Judging.
  • the processing liquid pumped by the first pump 104 a is supplied to the processing liquid region of the processing tank 160.
  • the treatment liquid supplied to the treatment tank 160 passes substantially horizontally from the outside to the inside of the filters 161a and 161b.
  • the processing liquid that has passed through the filters 161a and 161b is processed from the start of the processing process until a predetermined filtration performance is obtained by forming a cake on the filters 161a and 161b (initial leakage).
  • a predetermined filtration performance is obtained by forming a cake on the filters 161a and 161b (initial leakage).
  • the seventh valve 155 is switched to shut off the initial passing liquid discharge pipe 109 and the pipe 153.
  • the pipes 153 closer to the flow paths 151a and 151b than the seventh valve 155 and the pipe 153 closer to the eighth valve 154 than the seventh valve 155 are connected.
  • the eighth valve 154 is switched so that the processing liquid discharge pipe 108 and the pipe 153 communicate with each other, and the processing liquid region of the processing tank 160 and the processing liquid tank 103 communicate with each other. That is, in the processing method of the present embodiment, the pipe 153 and the initial passage liquid discharge pipe 109 are communicated only during the initial leak.
  • the processing liquid that has passed through the filters 161a and 161b is connected to the space inside the filters 161a and 161b, and the flow paths 151a and 151b are connected to the piping. 153, stored in the processing liquid tank 103 via the processing liquid discharge pipe.
  • the control device 120 determines whether or not the pressure of the liquid to be processed in the liquid area to be processed measured by the pressure gauge 121 is equal to or less than a threshold value. As a result, when the pressure of the liquid to be processed is equal to or lower than the threshold value, the processing process is continued.
  • the control device 120 switches the first valve 111 and stops the pump 104a, so that the liquid tank 101 is processed.
  • the supply of the liquid to be processed to the liquid region is shut off, and the processing step is stopped (processing stop step).
  • the fifth valve 122 is switched to allow the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 to communicate with each other.
  • control device 120 switches the sixth valve 156 and the eighth valve 154 to supply the processing liquid to the processing liquid area or the processing liquid area, and starts the cleaning process of cleaning the filters 161a and 161b.
  • the cleaning process of the present embodiment only one of the process of supplying the process liquid to the process liquid area shown below and the process of supplying the process liquid to the process liquid area may be performed. You may go.
  • the sixth valve 156 and the eighth valve 154 are switched, and the processing liquid is sprayed from the cleaning nozzle 152 to the outside of the filters 161a and 161b via the pipe 153 and the cleaning processing liquid supply pipe 105. .
  • the sprayed processing liquid flows into the processing tank 160 as a concentrated liquid containing a lot of SS particles together with SS particles or aggregates of SS particles adhering to the outside of the filters 161a and 161b. And it is discharged
  • FIG. When the processing liquid is ejected from the cleaning nozzle 152 toward the outside of the filters 161a and 161b, SS particles deposited on the outside of the filters 161a and 161b are mainly removed.
  • the sixth valve 156 and the eighth valve 154 are switched, and the processing liquid is supplied from the flow paths 151a and 151b to the space inside the filters 161a and 161b via the pipe 153 and the cleaning processing liquid supply pipe 105. .
  • the supplied processing liquid passes through the filters 161a and 161b from the inside to the outside, and flows down from the filters 161a and 161b into the processing tank 160 as a concentrated liquid containing a large amount of SS particles. And it is discharged
  • control device 120 determines whether or not the cleaning process is completed by the control device 120. If the controller 120 determines that the cleaning process is not completed, the cleaning process is continued. On the other hand, when it is determined by the control device 120 that the cleaning process is completed, the control device 120 controls the sixth valve 156 and the eighth valve 154 so that the processing liquid is supplied to the processing liquid region or the processing liquid region. Shut off the supply.
  • the cleaning liquid discharge pipe 107 and the concentrated sludge tank 106 are shut off by switching the fifth valve 122.
  • the 1st valve 111 is controlled by the control apparatus 120, a to-be-processed liquid is supplied to a to-be-processed liquid area
  • the filters 161a and 161b a plurality of needle-like structures 5 with a height of 0.2 to 2.5 ⁇ m arranged close to the surface and an average pore diameter of 0.5 to 10 are used.
  • the 1st filter which has the through-hole 8 which is 0.0 micrometer is used. For this reason, the SS particles in the liquid to be treated can be captured using the mechanism of the depth filtration and the mechanism of the cake filtration. Moreover, SS particles are easily removed from the filters 161a and 161b by washing, and the first filter is preferable in this respect.
  • the processing system 150 of the present embodiment includes a pressure gauge 121 that measures the pressure of the liquid to be processed in the liquid area to be processed, a first valve 111 installed in the liquid supply pipe 104 to be processed, and a processing liquid supply mechanism for purification. And a second valve (sixth valve 156, seventh valve 155, and eighth valve 154) installed in the cleaning treatment liquid supply pipe 105, the pipe 153, the flow paths 151a and 151b, and the cleaning nozzle 152. . Furthermore, the processing system 150 of this embodiment determines whether or not the pressure of the liquid to be processed measured by the pressure gauge 121 is equal to or lower than a threshold value.
  • the control device 120 is provided. Therefore, when processing the liquid to be processed using the processing system 150, the processing step is performed while measuring the pressure of the liquid to be processed in the liquid area to be processed, and the pressure of the liquid to be processed exceeds the threshold value. Based on this, the processing step can be completed and the cleaning step can be started. Therefore, the filters 161a and 161b can be cleaned at an appropriate timing according to the decrease in the filtration performance of the processing system 150, and the liquid to be processed can be processed efficiently.
  • the number of filters 161a and 161b is not limited to a cylindrical shape, and any shape can be used as long as it is hollow and allows the processing liquid to pass from the inside to the outside and from the outside to the inside. It may be a shape. Specifically, for example, those having an outer shape such as a spherical shape, a polygonal column shape, and a pleated shape can be mentioned.
  • the case where the first filter is used as the filter has been described as an example.
  • a plurality of average values of the maximum external dimensions that are arranged close to the surface are 0.5 to 10 ⁇ m.
  • a second filter having a polyhedral structure and through-holes having an average inscribed circle diameter of 1.0 to 20 ⁇ m may be used.
  • FIG. 7 is a schematic perspective view illustrating an example of the second filter.
  • the filter 201 shown in FIG. 7 has a mesh-like filter base material having a plurality of through holes 205 and a plating layer 203 that covers the surface of the filter base material.
  • the filter base material is a plate-like body formed by a wire 202, a base layer 204 formed on the surface of the wire 202, and a through hole 205 formed between the wires 202. .
  • plain-woven wires 202 are arranged in a mesh shape. Therefore, the plurality of through holes 205 are arranged in a matrix at substantially equal intervals.
  • the material of the wire 202 the same material as the wire 2 of the filter 1 shown in FIGS. 2 and 3 can be used.
  • the underlayer 204 is provided as necessary in order to improve the adhesion of the plating layer 203 to the wire 202.
  • the thing similar to the base layer 4 of the filter 1 shown in FIG. 2 and FIG. 3 can be used.
  • the thickness of the underlayer 204 may be any thickness that can improve the adhesion of the plating layer 203 to the wire 202.
  • the size of the through hole 205 may be adjusted by controlling the thickness of the base layer 4. In this case, the thickness of the foundation layer 204 is appropriately determined according to the required size of the through hole 205.
  • the plating layer 203 shown in FIG. 7 is formed as an aggregate in which a plurality of polyhedral precipitates (polyhedral structures) arranged in close proximity are aggregated on the surface of the base layer 204.
  • the plating layer 203 shown in FIG. In the aggregate shown in FIG. 7, a plurality of polyhedrons are bonded to each other and share a part of the volume.
  • Each of the plurality of polyhedral precipitates has a plurality of vertices where three or more planes intersect.
  • Each deposit has a different shape and a different size, and is formed densely on the surface of the underlayer 204. As a result, the portion corresponding to the side of the polyhedron shape faces an irregular direction.
  • the average value of the maximum outer dimensions of the polyhedral precipitate is 0.5 to 10 ⁇ m.
  • the average maximum outer dimension of the precipitate is within the above range, the SS particles in the liquid to be treated are easily caught.
  • the average particle diameter of the SS particles in the liquid to be treated is 0.1 to 10 ⁇ m, the SS particles are easily caught on the plating layer 203. Therefore, when the average particle diameter of the SS particles in the liquid to be treated is within the above range, the SS particles can be efficiently captured by the mechanism of the depth filtration.
  • the average maximum outer dimension of the precipitate is less than 0.5 ⁇ m, the unevenness on the surface of the plating layer 203 is reduced, and the amount of liquid to be processed passing through the gaps between the polyhedral precipitates is reduced. SS particles are less likely to adhere to 203.
  • the average maximum outer dimension of the precipitate is more preferably 2 ⁇ m or more. If the average maximum outer dimension of the precipitate exceeds 10 ⁇ m, the contact area between the plating layer 203 and the liquid to be treated containing SS particles decreases, and adhesion of SS particles to the plating layer 203 is difficult to occur.
  • the average maximum external dimension of the precipitate is more preferably 8 ⁇ m or less.
  • the average maximum outer dimension of the polyhedral precipitate is measured by the following measurement method. That is, a photograph of the enlarged filter 201 is taken using a scanning electron microscope (SEM), and image processing is performed. Specifically, the outer dimensions of the largest portion of the polyhedral precipitate are measured by selecting ten representative locations for one photograph, and the average value is taken as the average maximum outer dimension. Define.
  • the same metal as the plating layer 3 of the filter 1 shown in FIGS. 2 and 3 can be used.
  • the average value of the diameters of the inscribed circles 51 in contact with the inner walls of the through holes 205 covered with the plating layer 203 is 1.0 to 20 ⁇ m.
  • the average value of the diameter of the inscribed circle 251 determines the size of the through hole 205 and the aperture ratio of the filter 201.
  • the average value of the diameter of the inscribed circle 251 is the distance between the wires 202 before the formation of the foundation layer 204 and the plating layer 203, the thickness of the foundation layer 204, and the thickness of the plating layer 203. Can be adjusted by changing one or more of them.
  • the average value of the diameter of the inscribed circle 251 in contact with the inner wall of the through-hole 205 covered with the plating layer 203 is 1.0 to 20 ⁇ m in plan view, in particular, the average particle of the SS particles in the liquid to be treated When the diameter is 0.1 to 10 ⁇ m, the size of the through hole 205 is appropriate. Therefore, a cake that closes the through-hole 205 is easily formed by the SS particles captured by the filter 201, and the SS particles can be easily captured using a cake filtration mechanism.
  • the average value of the diameter of the inscribed circle 251 in contact with the inner wall of the through-hole 205 covered with the plating layer 203 is less than 1.0 ⁇ m in plan view, the amount of liquid to be processed that can pass through the filter 201 becomes insufficient. .
  • the average value of the diameter of the inscribed circle 251 is more preferably 2.0 ⁇ m or more.
  • the average value of the diameter of the inscribed circle 251 exceeds 20 ⁇ m, the size of the SS particles mainly captured by the surface filtration mechanism becomes large. For this reason, when the average particle diameter of SS particles is, for example, 1.0 to 10 ⁇ m, relatively large SS particles are hardly captured.
  • the average value of the diameter of the inscribed circle 251 is preferably 12 ⁇ m or less, and more preferably 7.0 ⁇ m or less.
  • the average diameter of the inscribed circle 251 is 12 ⁇ m or less, SS particles having an average particle diameter of 1 to 10 ⁇ m can be efficiently captured using a surface filtration mechanism.
  • the through hole 205 is used.
  • a cake is easily formed. This is presumed to be because SS particles having a small particle size captured on the surface of the plating layer 203 aggregate on the surface of the plating layer 203 to form an aggregate, which moves to the through hole 205 to form a cake. Is done.
  • Aggregates of SS particles on the surface of the plating layer 203 are more easily formed when the average particle diameter is 0.1 ⁇ m than when the average particle diameter of SS particles is 1.0 ⁇ m, for example. The This is presumably because the smaller the SS particle size, the smaller the resistance to the liquid to be treated. It is estimated that the SS particles having a low resistance to the liquid to be treated are likely to grow as aggregates because the time for staying on the surface of the plating layer 203 becomes long.
  • the average value of the diameter of the inscribed circle 251 in contact with the inner wall of the through-hole 205 covered with the plating layer 203 is measured by the following measuring method in plan view. That is, a photograph of the enlarged filter 201 is taken using a scanning electron microscope (SEM), and image processing is performed. Specifically, in plan view, the diameter of the inscribed circle 251 in contact with the inner wall of the through-hole 205 covered with the plating layer 203 is measured by selecting ten representative positions for one photograph, The average value is defined as the average value of the diameter of the inscribed circle 251.
  • the average maximum outer dimension of the precipitate of the plating layer 203 and the average value of the diameter of the inscribed circle 251 in contact with the inner wall of the through-hole 205 covered with the plating layer 203 in plan view are as follows. It is preferable to satisfy the relationship. That is, when the average maximum outer dimension of the precipitate is A and the average value of the diameter of the inscribed circle 251 is B, it is preferable that A ⁇ 3B is satisfied. When A ⁇ 3B in the above formula is satisfied, clogging is unlikely to occur, and a filter 201 that can efficiently capture SS particles using a mechanism of depth filtration and surface filtration is obtained.
  • the average value of the diameter of the inscribed circle 251 is extremely small with respect to the average maximum outer dimension of the precipitate, the particle diameter of the SS particles captured on the surface of the plating layer 203 by the depth filtration mechanism, and the surface filtration The size of the SS particles trapped in the through hole 205 is reversed by the mechanism, and clogging may occur easily.
  • the surface of the plating layer 203 of the filter 201 is formed with a region having a different affinity with the liquid to be processed.
  • a plurality of island-shaped first regions 206 and a second region 207 having a different affinity from the first region 206 are formed on the surface of the plating layer 203.
  • the first region 206 is preferably distributed substantially uniformly in the second region 207.
  • the shape of each first region 206 is not particularly limited, and may be any shape such as a circle, an ellipse, or a polygon in plan view.
  • the shapes and areas of the plurality of first regions 206 may be different from each other, or part or all of them may be the same.
  • the area ratio of the through hole 205 covered with the plating layer 203 relative to the area of the filter base material (area of the filter 1) in a plan view is 0.04% to 5%. preferable.
  • the aperture ratio of the filter 201 is 0.04% to 5%, the amount of the liquid to be processed passing through the gaps between the polyhedral precipitates forming the plating layer 203 and toward the through hole 205 is Sufficiently, the SS particles easily adhere to the surface of the plating layer 203. For this reason, it becomes easy to capture SS particles by the mechanism of the depth filtration.
  • the opening ratio is 0.04 to 5%
  • the SS particles captured by the plating layer 203 are aggregated, and a cake that blocks the through hole 205 of the filter 201 is easily formed.
  • a filter 201 that can efficiently capture SS particles having a size smaller than that of the through hole 205 can be obtained using a cake filtration mechanism.
  • the aperture ratio of the filter 201 is preferably 0.15% or more. Moreover, when the aperture ratio of the filter 201 exceeds 5%, the amount of the liquid to be processed that passes through the gaps between the polyhedral precipitates forming the plating layer 203 and goes to the through-hole 5 is insufficient. The adhesion of SS particles to the surface of the plating layer 203 is suppressed. Further, when the aperture ratio of the filter 201 exceeds 5%, aggregation of SS particles attached to the surface of the plating layer 203 cannot be sufficiently promoted on the surface of the plating layer 203. For this reason, it is difficult to form a cake that blocks the through hole 205.
  • the aperture ratio of the filter 201 is preferably 2.5% or less, and more preferably 1.5% or less.
  • the aperture ratio of the filter 201 is calculated by the following method using the average value of the shortest distance between adjacent through-holes 205 and the average value of the diameter of the inscribed circle 251 measured using the method described above. To do.
  • the wire 202 covered with the plating layer 203 is the same as the average value of the shortest distance between the adjacent through holes 8 of the filter 1 shown in FIGS. 2 and 3.
  • the average wire diameter of the wire 202 covered with the plating layer 203 is A
  • the average value of the diameter of the inscribed circle is B
  • the value calculated by B 2 / (A + B) 2 (%) is the opening ratio Define.
  • a method for manufacturing the filter 201 shown in FIG. 7 will be described.
  • a wire 202 arranged in a plain weave mesh is prepared.
  • the base layer 204 is formed on the entire surface of the wire 202 using a plating process.
  • a plating process for forming the foundation layer 204 the same method as that for the foundation layer 4 of the filter 1 shown in FIGS. 2 and 3 can be used.
  • the wire 202 is covered with the plating layer 203.
  • a plating process for forming the plating layer 203 a conventionally known method can be used.
  • the foundation layer 204 and the plating layer 203 are made of nickel or a nickel alloy, an additive is added to the plating bath after the foundation layer 204 is formed, and then electrolytic nickel plating or electroless nickel plating is performed.
  • the plating layer 203 is preferably formed.
  • the type and concentration of the additive added to the plating bath by changing the type and concentration of the additive added to the plating bath, the shape of the polyhedral precipitates and The size can be changed (for example, see Non-Patent Document 2).
  • the additive include 2-butyne-1,4-diol.
  • heat treatment may be performed as necessary to promote crystallization (polyhedralization) of the plating layer 203.
  • another plating layer formed of gold or the like is formed on the surface of the plating layer 203 in order to improve the durability of the filter as necessary. It may be formed.
  • a plurality of island-shaped first regions 206 and second regions 207 having different affinities between the first region 206 and the liquid to be processed are formed on the surface of the plating layer 203.
  • the first region 206 can be formed by modifying part of the surface of the plating layer 203.
  • the modification process is a process that changes the physical interaction with the liquid to be processed by changing the physical properties of the surface of the plating layer 203. Therefore, in the surface of the plating layer 203, the modified region is the first region 206, and the unmodified region is the second region in which the affinity between the first region 206 and the liquid to be treated is different. 207.
  • the modification treatment is performed only on a part of the plating layer 203 forming the surface of the filter 201.
  • the second region 207 which is difficult to flow (or easy to flow) is formed.
  • the flow of the liquid to be processed on the surface of the plating layer 203 becomes complicated, and the probability that the SS particles contained in the liquid to be processed and the surface of the plating layer 203 come into contact with each other increases. Therefore, the filter 201 having a high function of removing SS particles can be obtained.
  • the entire surface of the plating layer 203 remains in a uniform state. That is, the change in physical interaction with the liquid to be treated on the surface of the plating layer 203 after the modification treatment is uniform over the entire surface of the plating layer 203. Therefore, even if the reforming process is performed, an area where the liquid to be processed easily flows and an area where the liquid to be processed is difficult to flow are not formed.
  • the modification treatment of the plating layer 203 includes a hydrophilic treatment and a hydrophobic treatment.
  • a hydrophilization treatment for example, a treatment for imparting a hydroxyl group to the surface of the plating layer 203 by radiating plasma or the like to the plating layer 203, a treatment for applying a hydrophilic material (such as titanium dioxide) to the surface of the plating layer 203, Examples include a treatment of reacting the surface of the plating layer 203 with a silane coupling agent having a hydrophilic functional group.
  • the hydrophobic treatment include a treatment of applying a hydrophobic material to the surface of the plating layer 203, and a treatment of reacting the surface of the plating layer 203 with a silane coupling agent having a hydrophobic functional group.
  • the filter 201 shown in FIG. 7 When the liquid to be treated containing SS particles is passed through the filter 201, SS particles are first captured by the surface filtration and depth filtration mechanisms. Since the filter 201 has a plurality of polyhedral structures having a predetermined maximum outer shape arranged close to the surface, SS particles are easily caught on the surface, and the contact area between the filter 201 and the liquid to be treated containing SS particles is small. large. For this reason, in the filter 201 of the embodiment, there are many SS particles adhering to the surface of the plating layer 203, and the SS particles can be efficiently captured by the surface filtration and depth filtration mechanisms.
  • the filter 201 has a through hole whose average diameter of the inscribed circle is 1.0 to 20 ⁇ m. Therefore, a cake is quickly formed so as to close the through-hole 205 by the SS particles captured by the surface filtration and depth filtration mechanisms.
  • the filter 201 can utilize a cake filtration mechanism in addition to a surface filtration mechanism and a depth filtration mechanism. Therefore, the filter 201 of the embodiment can provide excellent filtration performance.
  • the cleaning liquid flows into the gap between the polyhedral structures from multiple directions.
  • SS particles or aggregates of SS particles adhering to the filter 201 are pushed away into the cleaning liquid, and separation of the SS particles or aggregates of SS particles is promoted. Therefore, by washing the filter 201 using the first method, SS particles or aggregates of SS particles adhering to the filter 201 are quickly removed.
  • the filter 201 when the filter 201 is cleaned using the second method, the cake that has blocked the through hole is pushed up by the cleaning liquid and peeled off. Furthermore, since the cleaning liquid flows into the gaps between the polyhedral structures from multiple directions, the separation of SS particles or aggregates of SS particles is promoted. Therefore, by washing the filter 201 using the second method, the cake formed on the filter 201 and the SS particles adhering to the filter 201 are quickly removed.
  • the filter 201 according to the embodiment has a plurality of polyhedral structures that have an average value of maximum outer dimensions of 0.5 to 10 ⁇ m arranged close to the surface, and an average value of an inscribed circle diameter of 1.0 to 20 ⁇ m. Having a through hole. For this reason, the filter 201 of the embodiment has an excellent removal function capable of trapping SS particles using a depth filtration mechanism and a cake filtration mechanism. In the filter 201 of the embodiment, the cleaning liquid flows from multiple directions into the gaps between the polyhedral structures at the time of cleaning, so that excellent cleaning properties can be obtained.
  • the filter for filtration in which the base layer 204 is provided between the wire 202 and the plating layer 203 is described as an example, but the base layer may not be provided.
  • the case where the shape of the wire 202 arranged in a mesh shape is a plain weave has been described as an example, but the shape of the wire 202 arranged in a mesh shape is not particularly limited, For example, twill weave and tatami weave may be used.
  • the filter base material is a woven fabric
  • the wire 202 intersects and overlaps to form irregularities on the surface of the filter 201. For this reason, SS particles are easily caught on the surface of the filter 201, and the filtration performance is further improved.
  • the filter base material may be a base material (punching mesh) in which a plurality of openings are provided at predetermined intervals as through holes in a plate material formed of metal or the like, or the surface thereof.
  • the base material in which the base layer was formed may be sufficient.
  • the width of the through hole is the distance between the wires.
  • the case where the surface of the plating layer 203 has a plurality of island-shaped first regions 206 and a second region 207 having an affinity for the liquid to be treated different from that of the first region 206 is taken as an example. As described above, the first region 206 and the second region 207 do not have to be formed.
  • the processing system having the pressure measuring device and the control device has been described as an example, but the pressure measuring device and the control device may not be provided.
  • the cleaning process is completed based on the time since the processing process was started, the amount of liquid to be processed processed in the processing process, etc. The process may be started.
  • the processing liquid passing through the filter is used as the cleaning liquid used for cleaning the filter is described as an example using the pipe connected to the processing tank and the processing liquid tank as the processing liquid supply pipe for cleaning.
  • the present invention is not limited to this example.
  • the processing system may be provided with a cleaning liquid tank containing a cleaning liquid such as water separately from the processing liquid tank, and a processing liquid supply pipe connected to the processing tank and the cleaning liquid tank may be provided. Good.
  • the cleaning liquid stored in the cleaning liquid tank is used as the cleaning liquid used for cleaning the filter.
  • the case where the process from the start of the processing process to the restart of the cleaning process is repeatedly performed a plurality of times has been described as an example, but it may be performed only once.
  • whether or not the cleaning process has ended may be determined by the fact that a predetermined time has elapsed since the start of the cleaning process. You may judge using other items, such as turbidity.
  • the processing system includes a processing liquid tank for storing the processing liquid, a processing tank partitioned into a processing liquid area and a processing liquid area by a filter, and the processing target.
  • a treatment liquid supply pipe for connecting the liquid tank and the treatment liquid region; a cleaning treatment liquid supply mechanism connected to the treatment tank; and a height at which the filter is disposed close to the surface.
  • a mechanism for depth filtration by being a second filter having a plurality of polyhedral structures having an average value of 0.5 to 10 ⁇ m and through-holes having an average diameter of inscribed circles of 1.0 to 20 ⁇ m
  • the cake filtration mechanism Can catch SS particles in the liquid to be treated, it is possible to provide a more easily SS particles are removed from the filter by cleaning system and processing method.
  • Example 1 A filter was produced by the following method. First, a plain woven wire mesh made of stainless steel (aperture 45 ⁇ m, wire diameter 32 ⁇ m) was prepared. This was immersed in a plating bath containing phosphorus, zinc, and nickel, and nickel plating was performed. Thus, a wire mesh formed of a stainless steel wire was covered with a base layer made of a nickel zinc alloy.
  • nickel plating treatment was performed by adding boric acid and ethylenediamine (EDA) as an additive to the plating bath in which the base layer was formed.
  • EDA ethylenediamine
  • the surface of the filter of Example 1 was observed with an electron microscope, and it was confirmed that a plurality of needle-like structures arranged close to the surface were formed. Moreover, about the filter of Example 1, the average height of the acicular structure, the average hole diameter of the through-hole, and the open area ratio were examined by the methods described above.
  • a filtration device simulating the treatment tank of the treatment system shown in FIG. 1 was created, and the following treatment steps and washing steps were repeated 10 times, and the items shown below Was evaluated.
  • the liquid to be treated was passed through the filter at a pressure of 0.1 MPa for 10 minutes.
  • a slurry (turbidity 266 NTU) formed of water containing 100 mg / L of alumina particles (Bycalox CR0.1) having an average particle diameter of 0.1 ⁇ m as SS particles was used.
  • Washing process The filter after the treatment step was taken out and washed by passing ion-exchanged water for 3 minutes at a water pressure of 0.1 MPa in the direction opposite to the direction in which the liquid to be treated was passed (backwashing).
  • the turbidity of the treated water generated by the first treatment step and the turbidity of the treated water produced by the tenth treatment step were measured. The case where the turbidity was less than 5 FTU was evaluated as ⁇ , the case where it was 5 FTU or more and less than 10 FTU was evaluated as ⁇ , and the case where it was 10 FTU or more was evaluated as ⁇ .
  • FIG. 8 is a photomicrograph obtained by photographing the surface of the filter of Example 1 after the 10th cleaning step.
  • FIG. 9 is an enlarged photograph of a part of the micrograph shown in FIG.
  • Frtration flow rate The first filtration flow rate and the tenth filtration flow rate were determined, and the reduction rate was calculated. When the reduction rate of the filtration flow rate was less than 20.0%, ⁇ , when it was 20.0% or more and less than 30.0%, ⁇ , when it was 30.0% or more, was evaluated as ⁇ .
  • Example 2 Example 1 was used except that a filter having an average needle-like structure height of 0.3 ⁇ m, a through-hole diameter of 3.5 ⁇ m, and an aperture ratio of 0.31% was used. And evaluated.
  • Example 3 Example 1 was used except that a filter having an average needle-like structure height of 1.9 ⁇ m, a through-hole diameter of 4.1 ⁇ m, and an open area ratio of 0.44% was used. And evaluated.
  • Example 4 Evaluation was conducted in the same manner as in Example 1 except that a filter having a through-hole diameter of 0.5 ⁇ m and an open area ratio of 0.13% was used. (Example 5) Evaluation was performed in the same manner as in Example 1 except that a filter having a through-hole diameter of 10.0 ⁇ m and an open area ratio of 3.92% was used.
  • Example 6 Evaluation was conducted in the same manner as in Example 1 except that the surface of the filter on the side of the liquid to be treated was washed by pouring ion exchange water at a water pressure of 0.1 MPa for 3 minutes.
  • Example 7 Of the 10 washing steps, the 1st to 4th and 6th to 9th washing steps were carried out in the same manner as in Example 6, and the 5th and 10th washing steps were carried out in the same manner as in Example 1. Were evaluated in the same manner as in Example 1.
  • Example 8 A plain-woven wire mesh made of stainless steel similar to that in Example 1 was prepared, and the base layer was coated in the same manner as in Example 1. Thereafter, 2-butyne-1,4-diol was added as an additive to the plating bath on which the underlayer was formed, and electroless nickel plating was performed. As a result, a plating layer covering the wire covered with the underlayer was formed, and the filter of Example 8 was obtained.
  • FIG. 10 is a photomicrograph of the filter of Example 8.
  • the filter of Example 8 was formed with a plurality of polyhedral structures that were arranged close to the surface. Further, the average maximum outer dimension, the hole diameter of the through hole (average value of the diameter of the inscribed circle of the through hole), and the hole area ratio of the polyhedral structure of the filter of Example 8 were examined by the methods described above. Evaluation was conducted in the same manner as in Example 1 using the filter of Example 8.
  • FIG. 11 is a photomicrograph of the surface of the filter of Comparative Example 1 after the 10th cleaning step.
  • FIG. 12 is an enlarged photograph of a part of the micrograph shown in FIG.
  • Table 1 shows the average height of the needle-like structures, the average hole diameter of the through holes, and the open area ratio in the cross sections of Examples 1 to 7 and Comparative Example 1.
  • Table 1 shows the average maximum outer dimensions, the hole diameters of the through holes, and the hole area ratio of the polyhedral structure of Example 8.
  • Table 1 shows the evaluation results of Examples 1 to 8 and Comparative Example.
  • Examples 1 to 8 were superior in cleaning properties compared to Comparative Example 1. In Examples 1 to 8, there was no significant decrease in the filtration flow rate. Further, it was found that Examples 1 to 8 were excellent in filtration performance, and that filtration performance could be maintained by performing a washing step. Further, as shown in Table 1, in Examples 1 and 3 in which the average height of the needle-like structures and the average hole diameter of the through holes are in a preferable range, the evaluation of the filtration flow rate was ⁇ .
  • Example 1 and Example 6 when backwashing is performed as a cleaning process, cleaning is further performed as compared with a case where ion-exchanged water is poured over the surface of the liquid to be treated as a cleaning process. It turns out that the effect is excellent. Furthermore, from the results of Example 1, Example 6, and Example 7, the case where ion-exchanged water is poured over the surface of the treated liquid region of the filter as a cleaning process and the case where backwashing is performed as a cleaning process. It has been found that the cleaning effect is improved by combining the ion exchange water over the surface of the filter through which the liquid to be treated is passed.
  • Example 2 From Table 2, by using the filter of Example 1 in which a plurality of needle-like structures arranged close to the surface are formed, the treatment liquid is compared with Comparative Example 1 in which no needle-like structures are formed. The amount was found to increase significantly.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Hydrology & Water Resources (AREA)
  • Geology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Organic Chemistry (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Filtering Materials (AREA)
  • Filtration Of Liquid (AREA)

Abstract

L'invention concerne un système de traitement comportant : une cuve contenant un liquide à traiter ; une cuve de traitement ; une tuyauterie d'alimentation de liquide à traiter ; et du matériel d'alimentation d'une solution de traitement pour nettoyage. La cuve de traitement est divisée par un filtre en une région de liquide devant être traité et une région de liquide traité. Le filtre est : un premier filtre ayant une pluralité de structures aciculaires, qui sont disposées de manière adjacente à la surface de celui-ci et ont une hauteur de 0,2 à 2,5 µm, et des trous traversants ayant un diamètre de trou moyen de 0,5 à 10,0 µm ; ou un second filtre ayant une pluralité de structures polyédriques, qui sont disposées de manière adjacente à la surface de celui-ci et ont une valeur moyenne de dimensions extérieures maximales de 0,5 à 10 µm, et des trous traversants ayant une valeur moyenne des diamètres de cercle inscrit de 1,0 à 20 µm.
PCT/JP2015/073095 2014-09-19 2015-08-18 Système de traitement et procédé de traitement WO2016042959A1 (fr)

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Cited By (1)

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JPH01159014A (ja) * 1987-08-06 1989-06-22 Thyssen Edelstahlwerke Ag 濾過体および該濾渦体の材料の製造法
JPH02280843A (ja) * 1989-03-16 1990-11-16 Schwaebische Huettenwerke Gmbh フィルター用または触媒用の担体の製造法
JP2002166112A (ja) * 2000-11-29 2002-06-11 Toshiba Plant Kensetsu Co Ltd 濾過方法および濾過装置
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