WO2016031723A1 - 還元型無電解金めっき液及び当該めっき液を用いた無電解金めっき方法 - Google Patents

還元型無電解金めっき液及び当該めっき液を用いた無電解金めっき方法 Download PDF

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Publication number
WO2016031723A1
WO2016031723A1 PCT/JP2015/073551 JP2015073551W WO2016031723A1 WO 2016031723 A1 WO2016031723 A1 WO 2016031723A1 JP 2015073551 W JP2015073551 W JP 2015073551W WO 2016031723 A1 WO2016031723 A1 WO 2016031723A1
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WO
WIPO (PCT)
Prior art keywords
gold plating
plating film
electroless
electroless gold
plating solution
Prior art date
Application number
PCT/JP2015/073551
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
友人 加藤
秀人 渡邊
Original Assignee
小島化学薬品株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 小島化学薬品株式会社 filed Critical 小島化学薬品株式会社
Priority to KR1020167008689A priority Critical patent/KR101733119B1/ko
Priority to JP2016509202A priority patent/JP6017726B2/ja
Priority to CN201580001912.3A priority patent/CN105745355B/zh
Priority to US15/025,321 priority patent/US20160230287A1/en
Publication of WO2016031723A1 publication Critical patent/WO2016031723A1/ja
Priority to PH12016500567A priority patent/PH12016500567A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate

Definitions

  • the reduced deposition type electroless gold plating solution for palladium film described in Patent Document 3 is an electroless gold plating solution that can form a gold plating film directly on the palladium film, and includes a water-soluble gold compound and a reducing agent. And at least one compound selected from the group consisting of formaldehyde bisulfite, longalite and hydrazine as a reducing agent.
  • the reduced electroless gold plating solution according to the present invention preferably has a pH of 7.0 to pH 9.0.
  • the surface of the object to be plated is preferably provided with an electroless palladium plating film formed on the surface of the electroless nickel plating film.
  • Comparative Example 1 In Comparative Example 1, a substitutional electroless gold plating solution was used, as in Example 1, using a copper plate as a substrate, and an electroless nickel plating film / electroless palladium plating film / electroless gold plating film on the substrate. The plating film which consists of was produced.
  • FIG. 5 shows an electron micrograph ( ⁇ 30000) of the surface of the gold plating film of Example 2-2 in which a reduced electroless gold plating film of Example 2 was formed to a thickness of 0.13 ⁇ m.
  • FIG. 5 shows an electron micrograph ( ⁇ 30000) of the surface of the gold plating film of Comparative Example 2 in which a reduced electroless gold plating film is formed with a film thickness of 0.13 ⁇ m.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
PCT/JP2015/073551 2014-08-25 2015-08-21 還元型無電解金めっき液及び当該めっき液を用いた無電解金めっき方法 WO2016031723A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020167008689A KR101733119B1 (ko) 2014-08-25 2015-08-21 환원형 무전해 금도금액 및 그 도금액을 이용한 무전해 금도금 방법
JP2016509202A JP6017726B2 (ja) 2014-08-25 2015-08-21 還元型無電解金めっき液及び当該めっき液を用いた無電解金めっき方法
CN201580001912.3A CN105745355B (zh) 2014-08-25 2015-08-21 还原型化学镀金液及使用该镀金液的化学镀金方法
US15/025,321 US20160230287A1 (en) 2014-08-25 2015-08-21 Reductive electroless gold plating solution, and electroless gold plating method using the plating solution
PH12016500567A PH12016500567A1 (en) 2014-08-25 2016-03-28 Reductive electroless gold plating solution, and electroless gold plating method using said plating solution

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014170558 2014-08-25
JP2014-170558 2014-08-25

Publications (1)

Publication Number Publication Date
WO2016031723A1 true WO2016031723A1 (ja) 2016-03-03

Family

ID=55399615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/073551 WO2016031723A1 (ja) 2014-08-25 2015-08-21 還元型無電解金めっき液及び当該めっき液を用いた無電解金めっき方法

Country Status (7)

Country Link
US (1) US20160230287A1 (zh)
JP (1) JP6017726B2 (zh)
KR (1) KR101733119B1 (zh)
CN (1) CN105745355B (zh)
PH (1) PH12016500567A1 (zh)
TW (1) TWI567234B (zh)
WO (1) WO2016031723A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200232099A1 (en) * 2015-09-21 2020-07-23 Atotech Deutschland Gmbh Plating bath composition for electroless plating of gold and a method for depositing a gold layer

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2773771T3 (es) 2017-05-23 2020-07-14 Saxonia Edelmetalle Gmbh Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado
CN107190251B (zh) * 2017-06-19 2018-11-16 广东东硕科技有限公司 一种镀金液及其制备方法
JP6466521B2 (ja) * 2017-06-28 2019-02-06 小島化学薬品株式会社 無電解めっきプロセス
JP6474860B2 (ja) * 2017-06-28 2019-02-27 小島化学薬品株式会社 無電解ニッケルストライクめっき液及びニッケルめっき皮膜の成膜方法
EP3763851A4 (en) * 2018-03-07 2021-12-15 Sumitomo Electric Industries, Ltd. CLADDING LAYER AND CLADDED ELEMENT
CN117987815B (zh) * 2024-01-31 2024-07-09 珠海斯美特电子材料有限公司 一种高稳定性的还原型化学镀金溶液及其应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524914A (en) * 1978-08-05 1980-02-22 Ngk Spark Plug Co Ltd Nonelectrolytic gold plating liquor
US5035744A (en) * 1989-07-12 1991-07-30 Kojima Chemicals Co., Ltd. Electroless gold plating solution
JPH05295558A (ja) * 1992-04-17 1993-11-09 Okuno Chem Ind Co Ltd 高速置換型無電解金めっき液
JPH06280039A (ja) * 1993-03-26 1994-10-04 C Uyemura & Co Ltd 無電解金めっき浴
JP2003518552A (ja) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー 無電解金めっき組成物及びその使用方法
JP2012025974A (ja) * 2010-07-20 2012-02-09 Electroplating Eng Of Japan Co 無電解金めっき液及び無電解金めっき方法

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JPH05222541A (ja) 1992-02-07 1993-08-31 Hitachi Ltd 金めっき方法
DE69406701T2 (de) * 1993-03-26 1998-04-02 Uyemura & Co C Chemisches Vergoldungsbad
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
KR0183645B1 (ko) * 1996-03-26 1999-03-20 이대원 다층 구조의 도금층을 구비한 반도체 리드 프레임
JP3565302B2 (ja) * 1996-11-18 2004-09-15 日立化成工業株式会社 無電解金めっき方法
JP3566498B2 (ja) * 1997-05-14 2004-09-15 株式会社大和化成研究所 置換金めっき浴
DE19745602C1 (de) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Verfahren und Lösung zur Herstellung von Goldschichten
JP3466521B2 (ja) * 1999-10-04 2003-11-10 新光電気工業株式会社 置換型無電解金めっき液及び無電解金めっき方法
AU2001278794A1 (en) * 2000-08-21 2002-03-04 Learonal Japan Inc. Electroless displacement gold plating solution and additive for preparing said plating solution
WO2002022909A1 (fr) * 2000-09-18 2002-03-21 Hitachi Chemical Co., Ltd. Solution pour dorure autocatalytique et procede correspondant
US6445069B1 (en) * 2001-01-22 2002-09-03 Flip Chip Technologies, L.L.C. Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor
JP5526440B2 (ja) 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
JP5013077B2 (ja) 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
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Publication number Priority date Publication date Assignee Title
JPS5524914A (en) * 1978-08-05 1980-02-22 Ngk Spark Plug Co Ltd Nonelectrolytic gold plating liquor
US5035744A (en) * 1989-07-12 1991-07-30 Kojima Chemicals Co., Ltd. Electroless gold plating solution
JPH05295558A (ja) * 1992-04-17 1993-11-09 Okuno Chem Ind Co Ltd 高速置換型無電解金めっき液
JPH06280039A (ja) * 1993-03-26 1994-10-04 C Uyemura & Co Ltd 無電解金めっき浴
JP2003518552A (ja) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー 無電解金めっき組成物及びその使用方法
JP2012025974A (ja) * 2010-07-20 2012-02-09 Electroplating Eng Of Japan Co 無電解金めっき液及び無電解金めっき方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200232099A1 (en) * 2015-09-21 2020-07-23 Atotech Deutschland Gmbh Plating bath composition for electroless plating of gold and a method for depositing a gold layer

Also Published As

Publication number Publication date
US20160230287A1 (en) 2016-08-11
PH12016500567B1 (en) 2016-05-30
CN105745355A (zh) 2016-07-06
KR20160145533A (ko) 2016-12-20
JPWO2016031723A1 (ja) 2017-04-27
TWI567234B (zh) 2017-01-21
PH12016500567A1 (en) 2016-05-30
JP6017726B2 (ja) 2016-11-02
KR101733119B1 (ko) 2017-05-08
TW201623687A (zh) 2016-07-01
CN105745355B (zh) 2018-03-30

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