WO2015172408A1 - 单板玻璃基板的切割方法 - Google Patents

单板玻璃基板的切割方法 Download PDF

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Publication number
WO2015172408A1
WO2015172408A1 PCT/CN2014/078675 CN2014078675W WO2015172408A1 WO 2015172408 A1 WO2015172408 A1 WO 2015172408A1 CN 2014078675 W CN2014078675 W CN 2014078675W WO 2015172408 A1 WO2015172408 A1 WO 2015172408A1
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WIPO (PCT)
Prior art keywords
cutting
glass substrate
plate glass
cutting platform
platform
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Ceased
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PCT/CN2014/078675
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English (en)
French (fr)
Inventor
姚江波
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/381,198 priority Critical patent/US9586851B2/en
Publication of WO2015172408A1 publication Critical patent/WO2015172408A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to the field of manufacturing liquid crystal display devices, and more particularly to a method for cutting a single-plate glass substrate. Background technique
  • Liquid Crystal Display has many advantages such as thin body, power saving, no radiation, etc., and has been widely used, such as: mobile electronic i-note personal digital assistant (PDA) digital camera, computer screen or laptop Screen, etc.
  • PDA personal digital assistant
  • a Thin Film Transistor Array Substrate is a color filter substrate (Color Filter, CF and a liquid crystal layer disposed between the two substrates, and the working principle is The rotation of the liquid crystal molecules of the liquid crystal layer is controlled by applying a driving voltage on the two glass substrates, and the light of the backlight module is refracted to generate a picture.
  • the TFT substrate includes a glass substrate and a thin film transistor array formed on the glass substrate.
  • the thin film transistor array drives the liquid crystal molecules in the liquid crystal layer to deflect to select the light transmitted through the liquid crystal panel. Therefore, the TFT substrate is an important component of the liquid crystal display device, which directly affects the display quality of the liquid crystal panel.
  • the cutting method of the single-plate glass substrate is generally: placing the single-plate glass substrate under the cutting blade, and cutting the cutting head directly on the single-plate glass substrate according to the setting cutting path.
  • the method has certain drawbacks, which are mainly manifested in the irregular splash of glass debris generated in the process of cutting the single-plate glass substrate by the cutting blade to the circuit pattern of the thin film transistor provided on the single-plate glass substrate, and The presence of static electricity adheres to the circuit pattern of the thin film transistor, and cannot be completely removed, resulting in poor product quality and affecting the display quality of the liquid crystal panel.
  • An object of the present invention is to provide a method for cutting a single-plate glass substrate, which can completely remove the glass debris generated during cutting, and effectively solve the problem of defective product caused by splashing of glass debris and adhesion to the thin film transistor circuit, thereby Improve the quality of LCD panels and liquid crystal display devices
  • the present invention provides a method for cutting a single-plate glass substrate, comprising the following steps:
  • Step 1 providing a single-plate glass substrate to be cut and a cutting platform
  • Step 2 fixing a single-plate glass substrate on the cutting platform
  • Step 3 Rotating the cutting platform to make the single-plate glass substrate under the cutting platform
  • Step 4 providing a cutting blade to cut the single-plate glass substrate under the cutting platform, and simultaneously providing a vacuum adsorption device and a P residual electrostatic device to remove the glass debris generated when the cutting blade cuts the single-plate glass substrate;
  • Step 5 After the cutting is completed, the cutting platform leaves the cutting head, the vacuum adsorption device and the static elimination device, and rotates the cutting platform so that the cut single-plate glass substrate is located above the cutting platform.
  • the single-plate glass substrate is fixed on the cutting platform by vacuum adsorption and the clamp.
  • the surface of the single-plate glass substrate contacting the cutting platform is vacuum-adsorbed, and the edge of the single-plate glass substrate is fixed by a jig. .
  • the step 3 rotates the cutting platform by a motor drive belt transmission mechanism.
  • a belt transmission mechanism is disposed on each side of the cutting platform, and each belt transmission mechanism includes a pulley mounted on the cutting platform, a driving wheel driven by the motor, and a transmission belt installed between the pulley and the driving wheel.
  • the cutting platform is rotated by 180 degrees.
  • the step 4 moves the cutting platform to contact the single-plate glass substrate against the cutting head, activates the vacuum adsorption device and the static elimination device, and simultaneously starts the cutting blade for cutting.
  • the cutting cutter head is provided with a pressure sensor.
  • the pressure sensor senses the pressure, triggers the vacuum suction device and the static elimination device to be activated, and simultaneously starts cutting.
  • the cutter head is cut.
  • the cutting blade, the vacuum adsorption device and the static elimination device are mounted in a mounting cover.
  • the static eliminating device uses x-ray to remove static electricity.
  • the invention also provides a method for cutting a single-plate glass substrate, comprising the following steps: Step 1: providing a single-plate glass substrate to be cut and a cutting platform;
  • Step 2 fixing a single-plate glass substrate on the cutting platform
  • Step 3 Rotating the cutting platform to make the single-plate glass substrate under the cutting platform
  • Step 4 providing a cutting cutter head to cut the single-plate glass substrate under the cutting platform, and simultaneously providing a vacuum adsorption device and a P residual electrostatic device to remove the glass debris generated when the cutting cutter head cuts the single-plate glass substrate;
  • Step 5 after the cutting is completed, the cutting platform leaves the cutting head, the vacuum adsorption device and the static elimination device, and rotates the cutting platform so that the cut single-plate glass substrate is located above the cutting platform;
  • the step 2 fixes the single-plate glass substrate on the cutting platform by vacuum adsorption and a clamp;
  • the surface of the single-plate glass substrate contacting the cutting platform is vacuum-adsorbed, and the edge of the single-plate glass substrate is fixed by a jig;
  • the cutting platform is rotated by the motor driving belt transmission mechanism; wherein a belt transmission mechanism is respectively disposed on both sides of the cutting platform, and each belt transmission mechanism includes a pulley mounted on the cutting platform, and the motor is driven by the motor a driving drive wheel and a transmission belt installed between the pulley and the driving wheel;
  • the step 4 moves the cutting platform to contact the single-plate glass substrate against the cutting cutter head, activates the vacuum adsorption device and the static elimination device, and simultaneously starts the cutting cutter head for cutting;
  • the cutting cutter head is provided with a pressure sensor, and when the step 4 moves the cutting platform to contact the single-plate glass substrate against the cutting cutter head, the pressure sensor senses the pressure, triggers the activation of the vacuum adsorption device and the static elimination device, and simultaneously Starting the cutting head for cutting;
  • the cutting head, the vacuum adsorption device and the static eliminating device are installed in a mounting cover; wherein the static eliminating device uses x-ray to remove static electricity.
  • the cutting method of the single-plate glass substrate of the present invention is to be cut when cutting
  • the cutter head is placed under the cutting platform and the single-plate glass substrate, and the vacuum adsorption device and the static elimination device are used to completely absorb and remove the generated glass debris, thereby effectively solving the problem of glass debris splashing and adhesion to the thin film transistor circuit. Problem, thereby improving the quality of the liquid crystal panel and the liquid crystal display device / "pick up"
  • FIG. 1 is a flow chart of a method for cutting a single-plate glass substrate of the present invention
  • FIG. 2 is a simplified schematic view of a step 2 of a method for cutting a single-plate glass substrate according to the present invention
  • FIG. 3 is a perspective view showing a step 2 of a method for cutting a single-plate glass substrate according to the present invention
  • FIG. 5 is a schematic perspective view of step 3 of the method for cutting a single-plate glass substrate according to the present invention
  • FIG. 6 is a simplified schematic view of step 4 of the method for cutting a single-plate glass substrate of the present invention
  • 3 is a schematic perspective view of the step 4 of the method for cutting a single-plate glass substrate
  • FIG. 8 is a cutting head, vacuum suction in the step 4 of the method for cutting a single-plate glass substrate of the present invention
  • the present invention provides a method for cutting a single-plate glass substrate, comprising the following steps:
  • Step 1 providing a single-plate glass substrate 10 to be cut and a cutting platform 20;
  • Step 2 Fixing the single-plate glass substrate 10 on the cutting platform 20;
  • Step 3 Rotate the cutting platform 20 to place the single-plate glass substrate 10 under the cutting platform 20;
  • Step 4 provide a cutting blade 30 to cut the single-plate glass substrate 10 under the cutting platform 20, and provide a vacuum adsorption device 40 and a P residual electrostatic device 50 removes glass debris generated when the cutting blade 30 cuts the single-plate glass substrate 10;
  • Step 5 After the cutting is completed, the cutting platform 20 leaves the cutting head 30, the vacuum adsorption device 40 and the static eliminating device 50, and rotates the cutting platform 20 so that the cut single-plate glass substrate 10 is placed on the cutting platform 20.
  • the cutting platform 20 in the step 2 is provided with a true inside.
  • the empty adsorption unit adsorbs the single-plate glass substrate 10, and a jig 21 is disposed on the cutting platform 20 to further fix the single-plate glass substrate 10 from the edge of the single-plate glass substrate 10 on the cutting platform 20.
  • the number of the jigs 21 is four.
  • the single-plate glass substrate 10 is placed on the cutting platform 20, and the surface of the single-plate glass substrate 10 that is in contact with the cutting platform 20 is vacuum-adsorbed, and the single-plate is positioned and pressed by the clamp 21
  • the edge of the glass substrate 10 is on the cutting platform 20, and the single-plate glass substrate 10 is fixed on the cutting platform 20, and the fixing effect is stable and reliable.
  • the step 3 rotates the cutting platform 20 by the motor drive belt transmission mechanism 60.
  • a belt drive mechanism 60 is disposed on each side of the cutting platform 20, and each belt drive mechanism 60 includes a pulley 62 mounted on the cutting platform 20, a drive wheel 64 driven by the motor, and mounted on the pulley A drive belt 66 between the 62 and the drive wheel 64.
  • the specific implementation of the step 3 is to open the motor, the motor drives the driving wheel 64 to rotate, the driving wheel 64 drives the pulley 62 to rotate through the transmission belt 66, and the cutting platform 20 is pulleyd on both sides thereof.
  • the cutting platform is rotated by 180 degrees, so that the single-plate glass substrate 10 fixed on the cutting platform 20 is located below the cutting platform 20.
  • the motor is turned off, and the cutting platform 20 and the single-plate glass substrate 10 are maintained at this position.
  • the cutting in the step 4 [the J head 30 , the vacuum adsorption device 40 and the static eliminating device 50 are mounted in a mounting cover 70 , the cutting head 30 handle portion
  • a pressure sensor 80 is disposed.
  • the pressure sensor 80 is electrically connected to a control circuit module.
  • the control circuit module is electrically connected to the cutting head 30, the vacuum adsorption device 40, and the static eliminating device 50.
  • the static eliminating device 50 adopts x. -ray removes static electricity.
  • the specific implementation of the step 4 is that the cutting platform 20 is moved to contact the single-plate glass substrate 10 against the cutting cutter head 30, and the pressure sensor 80 senses that the pressure is fed back to the control circuit module, and the control circuit module controls
  • the vacuum adsorption device 40 and the static elimination device 50 are activated, and the cutting blade 30 is activated to perform cutting.
  • the glass crumb generated during the cutting process is adsorbed into the mounting cover 70 by the vacuum adsorption device 40, and the x-my emitted from the static eliminating device 50 removes static electricity, and the glass debris is difficult to adhere to the single-plate glass.
  • the substrate 10 enables the vacuum adsorption device 40 to remove the glass debris more thoroughly, and can completely absorb the glass debris, thereby ensuring that the glass chip does not adhere to the circuit pattern of the thin film transistor, thereby improving product yield and improving product quality.
  • step 4 After the step 4 is performed on the cutting and removing the glass debris of the single-plate glass substrate 10, the operation of step 5 is performed, and the cutting platform 10 is separated from the cutting head 30, the vacuum adsorption device 40, and the static eliminating device 50.
  • the motor is turned on again, and the driving wheel 64 drives the pulley 62 to rotate through the belt 66.
  • the cutting platform 20 is rotated by 180 degrees under the action of the pulleys 62 on both sides thereof.
  • the cut single-plate glass substrate 10 is placed on the cutting platform 20 for facilitating the removal of the jig and removing the cut single-plate glass substrate 10.
  • the cutting method of the single-plate glass substrate of the present invention is to place the cutting head under the cutting platform and the single-plate glass substrate during cutting, and simultaneously use the vacuum adsorption device and the static eliminating device to completely adsorb and remove the broken glass. Chips, effectively solve the problem of product defects caused by splashing of glass chips and adhesion to the thin film transistor circuit, thereby improving the quality of the liquid crystal panel and the liquid crystal display device.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Forests & Forestry (AREA)
  • Mathematical Physics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

一种单板玻璃基板的切割方法，包括如下步骤：步骤1、提供待切割的单板玻璃基板（10）与一切割平台（20）；步骤2、固定单板玻璃基板（10）于该切割平台（20）上面；步骤3、转动切割平台（20）使单板玻璃基板（10）位于切割平台（20）下面；步骤4、提供一切割刀头（30）在切割平台（20）下方对单板玻璃基板（10）进行切割，同时提供一真空吸附装置（40）与一除静电装置（50）去除切割刀头（30）切割单板玻璃基板（10）时产生的玻璃碎屑；步骤5、切割完成后，切割平台（20）离开切割刀头（30）、真空吸附装置（40）及除静电装置（50），转动切割平台（20）使切割后的单板玻璃基板（10）位于切割平台（20）上面。

Description

单板玻璃基板的切割方法 技术领域
本发明涉及液晶显示设备制造领域，尤其涉及一种单板玻璃基板的切 割方法。 背景技术
液晶显示装置 ( Liquid Crystal Display , LCD )具有机身薄、 省电、 无 辐射等众多优点，得到了广泛的应用，如：移动电 i舌个人数字助理（ PDA ) 数字相机、 计算机屏幕或笔记本电脑屏幕等。
现有巿场上的液晶显示装置大部分为背光型液晶显示装置，其包括壳 体、 设于壳体内的液晶面板及设于壳体内的背光模组 ( Backlight module \ 现有的液晶面板的结构是由一薄膜晶体管阵列基板（ Thin Film Transistor Array Substrate , TFT Array Substrate —彩色滤光片基板 ( Color Filter , CF 以及一配置于两基板间的液晶层（ Liquid Crystal Layer )所构成，其 工作原理是通过在两片玻璃基板上施加驱动电压来控制液晶层的液晶分子 的旋转，将背光模组的光线折射出来产生画面。
TFT基板包括一玻璃基板、 及形成于玻璃基板上的薄膜晶体管阵列， 该薄膜晶体管阵列驱动液晶层中的液晶分子发生偏转，以对透过液晶面板 的光线进行选择，因而 TFT基板是液晶显示装置的重要组成部分，直接影 响到液晶面板的显示品质。
在液晶面板的制程中，一个单板玻璃基板上会设置数个 TFT基板，因 此，需要对单板玻璃基板进行切割，以形成独立的数个 TFT基板。 目前， 对单板玻璃基板的切割方法一般为：将单板玻璃基板置于切割刀头的下 方，切割刀头直接在单板玻璃基板上按照设定刀路进行切割。 该方法存在 一定的弊端，主要表现于切割刀头在切割单板玻璃基板的过程中所产生的 玻璃碎屑无规律飞溅至设于该单板玻璃基板上的薄膜晶体管的电路图形 上，并由于静电的存在附着于薄膜晶体管的电路图形，无法完全去除干净， 造成产品不良，影响液晶面板的显示品质。 发明内容
本发明的目的在于提供一种单板玻璃基板的切割方法，通过该方法能 够完全去除切割时产生的玻璃碎屑，有效解决玻璃碎屑飞溅、 附着在薄膜 晶体管电路上造成的产品不良问题，从而提高液晶面板及液晶显示装置的 品质 /提局 ""品良率 为实现上述目的，本发明提供一种单板玻璃基板的切割方法，包括如 下步骤：
步骤 1、 提供待切割的单板玻璃基板与一切割平台；
步骤 2、 固定单板玻璃基板于该切割平台上面；
步骤 3、 转动切割平台使单板玻璃基板位于切割平台下面；
步骤 4、 提供一切割刀头在切割平台下方对单板玻璃基板进行切割，同 时提供一真空吸附装置与一 P余静电装置去除切割刀头切割单板玻璃基板时 产生的玻璃碎屑；
步骤 5、 切割完成后，切割平台离开切割刀头、 真空吸附装置及除静电 装置，转动切割平台使切割后的单板玻璃基板位于切割平台上面。
所述步骤 2通过真空吸附与夹具将单板玻璃基板固定于切割平台上面 所述步骤 2中对单板玻璃基板与切割平台接触的表面进行真空吸附， 对单板玻璃基板的边缘用夹具进行固定。
所述步骤 3通过电机驱动带传动机构使切割平台进行转动。
所述切割平台两侧分别设置一个带传动机构，每一个带传动机构包括 安装于切割平台上的带轮、 由电机驱动的驱动轮、 及安装于带轮与驱动轮 之间的传动带。 所述步骤 3中切割平台转动 180度。
所述步骤 4移动切割平台使单板玻璃基板接触抵压切割刀头，启动真 空吸附装置及除静电装置，同时启动切割刀头进行切割。
所述切割刀头设有一压力传感器，所述步骤 4移动切割平台使单板玻 璃基板接触抵压切割刀头时，该压力传感器感应到压力，触发启动真空吸 附装置及除静电装置，同时启动切割刀头进行切割。
所述切割刀头、 真空吸附装置及除静电装置安装于一安装罩内。
所述除静电装置采用 x-ray去除静电。
本发明还提供一种单板玻璃基板的切割方法，包括如下步骤： 步骤 1、 提供待切割的单板玻璃基板与一切割平台；
步骤 2、 固定单板玻璃基板于该切割平台上面；
步骤 3、 转动切割平台使单板玻璃基板位于切割平台下面；
步骤 4、提供一切割刀头在切割平台下方对单板玻璃基板进行切割，同 时提供一真空吸附装置与一 P余静电装置去除切割刀头切割单板玻璃基板时 产生的玻璃碎屑；
步骤 5、切割完成后，切割平台离开切割刀头、 真空吸附装置及除静电 装置，转动切割平台使切割后的单板玻璃基板位于切割平台上面； 其中，所述步骤 2通过真空吸附与夹具将单板玻璃基板固定于切割平 台上面；
其中，所述步骤 2中对单板玻璃基板与切割平台接触的表面进行真空 吸附，对单板玻璃基板的边缘用夹具进行固定；
其中，所述步骤 3通过电机驱动带传动机构使切割平台进行转动； 其中，所述切割平台两侧分别设置一个带传动机构，每一个带传动机 构包括安装于切割平台上的带轮、 由电机驱动的驱动轮、 及安装于带轮与 驱动轮之间的传动带；
其中，所述步骤 3中切割平台转动 180度；
其中，所述步骤 4移动切割平台使单板玻璃基板接触抵压切割刀头， 启动真空吸附装置及除静电装置，同时启动切割刀头进行切割；
其中，所述切割刀头设有一压力传感器，所述步骤 4移动切割平台使 单板玻璃基板接触抵压切割刀头时，该压力传感器感应到压力，触发启动 真空吸附装置及除静电装置，同时启动切割刀头进行切割；
其中，所述切割刀头、 真空吸附装置及除静电装置安装于一安装罩内； 其中，所述除静电装置采用 x-ray去除静电。
本发明的有益效果：本发明的单板玻璃基板的切割方法，切割时将切 割刀头置于切割平台及单板玻璃基板下方，同时使用真空吸附装置及除静 电装置完全吸附、 去除产生的玻璃碎屑，有效解决玻璃碎屑飞溅、 附着在 薄膜晶体管电路上造成的产品不良问题，从而提高液晶面板及液晶显示装 置白勺品质 /提局 ""品良率 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为本发明单板玻璃基板的切割方法的流程图；
图 2为本发明单板玻璃基板的切割方法的步骤 2的简化示意图； 图 3为本发明单板玻璃基板的切割方法的步骤 2的立体示意图； 图 4为本发明单板玻璃基板的切割方法的步骤 3的简化示意图； 图 5为本发明单板玻璃基板的切割方法的步骤 3的立体示意图； 图 6为本发明单板玻璃基板的切割方法的步骤 4的简化示意图； 图 7为本发明单板玻璃基板的切割方法的步骤 4的立体示意图； 图 8为本发明单板玻璃基板的切割方法的步骤 4中切割刀头、 真空吸 附装置及除静电装置的的立体放大图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 1至图 8 ,本发明提供一种单板玻璃基板的切割方法，包括如 下步骤：
步骤 1、 提供待切割的单板玻璃基板 10与一切割平台 20；
步骤 2、 固定单板玻璃基板 10于该切割平台 20上面；
步骤 3、 转动切割平台 20使单板玻璃基板 10位于切割平台 20下面； 步骤 4、 提供一切割刀头 30在切割平台 20下方对单板玻璃基板 10进 行切割，同时提供一真空吸附装置 40与一 P余静电装置 50去除切割刀头 30 切割单板玻璃基板 10时产生的玻璃碎屑；
步骤 5、 切割完成后，切割平台 20离开切割刀头 30、 真空吸附装置 40 及除静电装置 50 ,转动切割平台 20使切割后的单板玻璃基板 10位于切割 平台 20上面。
具体的，请参阅图 2及图 3 ,所述步骤 2中的切割平台 20内部设有真 空吸附单元以对单板玻璃基板 10进行吸附，并在所述切割平台 20上设置 夹具 21以进一步从单板玻璃基板 10边缘来固定单板玻璃基板 10于切割平 台 20上，优选的，所述夹具 21的数量为 4个。 所述单板玻璃基板 10放置 于所述切割平台 20上，利用真空吸附所述单板玻璃基板 10与所述切割平 台 20接触的表面，同时利用所述夹具 21定位并压紧所述单板玻璃基板 10 的边缘至所述切割平台 20上，实现将所述单板玻璃基板 10固定于所述切 割平台 20上面，且固定效果稳定、 可靠。
请参阅图 4及图 5 ,所述步骤 3通过电机驱动带传动机构 60使切割平 台 20进行转动。 进一步的，所述切割平台 20两侧各设置一个带传动机构 60 ,每一带传动机构 60包括安装于切割平台 20上的带轮 62、 由电机驱动 的驱动轮 64、 及安装于所述带轮 62与驱动轮 64之间的传动带 66。 所述步 骤 3的具体实施方式为，开启电机，该电机驱动所述驱动轮 64旋转，所述 驱动轮 64通过传动带 66带动所述带轮 62旋转，所述切割平台 20在其两 侧带轮 62的作用下相应转动，优选的，所述切割平台转动 180度，使得固 定于所述切割平台 20上的单板玻璃基板 10位于所述切割平台 20下面。 所 述切割平台 20完成 180度转动后，关闭电机，使切割平台 20及单板玻璃 基板 10保持在此位置。 请参阅图 6、 图 7及图 8 ,所述步骤 4中的切害 [J刀头 30、 真空吸附装置 40及除静电装置 50安装于一安装罩 70内，所述切割刀头 30柄部设有一压 力传感器 80 ,所述压力传感器 80电性连接一控制电路模块，该控制电路模 块与切割刀头 30、 真空吸附装置 40及除静电装置 50电性连接，所述除静 电装置 50采用 x-ray去除静电。 所述步骤 4的具体实施方式为，移动所述 切割平台 20使单板玻璃基板 10接触抵压切割刀头 30 ,所述压力传感器 80 感应到压力即将信号反馈给控制电路模块，控制电路模块控制所述真空吸 附装置 40及除静电装置 50启动，同时启动所述切割刀头 30进行切割。 切 割过程中产生的玻璃碎屑被所述真空吸附装置 40 吸附于所述安装罩 70 内，同时所述除静电装置 50发出的 x-my去除静电，玻璃碎屑难以附着于 所述单板玻璃基板 10 ,使所述真空吸附装置 40对玻璃碎屑的去除更彻底， 能够完全吸附玻璃碎屑，保证薄膜晶体管的电路图形上不会附着玻璃碎 屑，从而提高产品良率，改善产品品质。
所述步骤 4对单板玻璃基板 10的切割及去除玻璃碎屑完成后，进行步 骤 5的操作，将所述切割平台 10离开所述切割刀头 30、 真空吸附装置 40 及除静电装置 50 ,再次开启电机，所述驱动轮 64通过传动带 66带动带轮 62旋转，所述切割平台 20在其两侧带轮 62的作用下相应转动 180度，返 回至步骤 2中所处的位置，即切割后的单板玻璃基板 10位于切割平台 20 上面，便于拆卸夹具，取下切割后的单板玻璃基板 10。
综上所述，本发明的单板玻璃基板的切割方法，切割时将切割刀头置 于切割平台及单板玻璃基板下方，同时使用真空吸附装置及除静电装置完 全吸附、 去除产生的玻璃碎屑，有效解决玻璃碎屑飞溅、 附着在薄膜晶体 管电路上造成的产品不良问题，从而提高液晶面板及液晶显示装置的品 质 /提局 ""品良率
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

杈 利 要 求
1、 一种单板玻璃基板的切割方法，包括如下步骤：
步骤 1、 提供待切割的单板玻璃基板与一切割平台；
步骤 2、 固定单板玻璃基板于该切割平台上面；
步骤 3、 转动切割平台使单板玻璃基板位于切割平台下面；
步骤 4、提供一切割刀头在切割平台下方对单板玻璃基板进行切割，同 时提供一真空吸附装置与一 P余静电装置去除切割刀头切割单板玻璃基板时 产生的玻璃碎屑；
步骤 5、切割完成后，切割平台离开切割刀头、 真空吸附装置及除静电 装置，转动切割平台使切割后的单板玻璃基板位于切割平台上面。
2、 如权利要求 1所述的单板玻璃基板的切割方法，其中，所述步骤 2 通过真空吸附与夹具将单板玻璃基板固定于切割平台上面。
3、 如权利要求 2所述的单板玻璃基板的切割方法，其中，所述步骤 2 中对单板玻璃基板与切割平台接触的表面进行真空吸附，对单板玻璃基板 的边缘用夹具进行固定。
4、 如权利要求 1所述的单板玻璃基板的切割方法，其中，所述步骤 3 通过电机驱动带传动机构使切割平台进行转动。
5、 如权利要求 4所述的单板玻璃基板的切割方法，其中，所述切割平 台两侧分别设置一个带传动机构，每一个带传动机构包括安装于切割平台 上的带轮、 由电机驱动的驱动轮、 及安装于带轮与驱动轮之间的传动带。
6、 如权利要求 4所述的单板玻璃基板的切割方法，其中，所述步骤 3 中切割平台转动 180度。
7、 如权利要求 1所述的单板玻璃基板的切割方法，其中，所述步骤 4 移动切割平台使单板玻璃基板接触抵压切割刀头，启动真空吸附装置及除 静电装置，同时启动切割刀头进行切割。
8、 如权利要求 7所述的单板玻璃基板的切割方法，其中，所述切割刀 头设有一压力传感器，所述步骤 4移动切割平台使单板玻璃基板接触抵压 切割刀头时，该压力传感器感应到压力，触发启动真空吸附装置及除静电 装置，同时启动切割刀头进行切割。
9、 如权利要求 7所述的单板玻璃基板的切割方法，其中，所述切割刀 头、 真空吸附装置及除静电装置安装于一安装罩内。
10、 如权利要求 7所述的单板玻璃基板的切割方法，其中，所述除静 电装置采用 x-ray去除静电。
11、 一种单板玻璃基板的切割方法，包括如下步骤： 步骤 1、 提供待切割的单板玻璃基板与一切割平台；
步骤 2、 固定单板玻璃基板于该切割平台上面；
步骤 3、 转动切割平台使单板玻璃基板位于切割平台下面；
步骤 4、提供一切割刀头在切割平台下方对单板玻璃基板进行切割，同 时提供一真空吸附装置与一 P余静电装置去除切割刀头切割单板玻璃基板时 产生的玻璃碎屑；
步骤 5、切割完成后，切割平台离开切割刀头、 真空吸附装置及除静电 装置，转动切割平台使切割后的单板玻璃基板位于切割平台上面；
其中，所述步骤 2通过真空吸附与夹具将单板玻璃基板固定于切割平 台上面；
其中，所述步骤 2中对单板玻璃基板与切割平台接触的表面进行真空 吸附，对单板玻璃基板的边缘用夹具进行固定；
其中，所述步骤 3通过电机驱动带传动机构使切割平台进行转动； 其中，所述切割平台两侧分别设置一个带传动机构，每一个带传动机 构包括安装于切割平台上的带轮、 由电机驱动的驱动轮、 及安装于带轮与 驱动轮之间的传动带；
其中，所述步骤 3中切割平台转动 180度； 其中，所述步骤 4移动切割平台使单板玻璃基板接触抵压切割刀头， 启动真空吸附装置及除静电装置，同时启动切割刀头进行切割；
其中，所述切割刀头设有一压力传感器，所述步骤 4移动切割平台使 单板玻璃基板接触抵压切割刀头时，该压力传感器感应到压力，触发启动 真空吸附装置及除静电装置，同时启动切割刀头进行切割；
其中，所述切割刀头、 真空吸附装置及除静电装置安装于一安装罩内； 其中，所述除静电装置采用 x-ray去除静电。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Families Citing this family (14)

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CN114770774B (zh) * 2022-04-29 2023-04-25 邢台浩达玻璃制品有限公司 一种智能化防静电稳定型钢化玻璃切割设备
CN116197419B (zh) * 2023-04-18 2023-12-29 霖鼎光学(江苏)有限公司 一种高精度隐形眼镜车削装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6289695B1 (en) * 1998-03-16 2001-09-18 The Regents Of The University Of California Vacuum fusion bonding of glass plates
CN1979278A (zh) * 2005-12-08 2007-06-13 Nec液晶技术株式会社 制造液晶显示器面板的方法和切割液晶显示器面板的装置
CN1991484A (zh) * 2005-12-29 2007-07-04 Lg.菲利浦Lcd株式会社 切割lcd装置的设备和方法及用其制造lcd装置的方法
CN101224946A (zh) * 2008-01-30 2008-07-23 河北东旭机械设备有限公司 Tft-lcd玻璃基板自动加工生产线
CN101234848A (zh) * 2008-02-27 2008-08-06 友达光电股份有限公司 基板切割裂片装置及方法
CN102050564A (zh) * 2009-10-30 2011-05-11 孙月卫 切割液晶显示器单元母板的方法及其自动化切割系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT399865B (de) * 1990-05-15 1995-08-25 Lisec Peter Verfahren und vorrichtung zum brechen von glasscheiben
AT401172B (de) * 1995-01-24 1996-07-25 Lisec Peter Verfahren zum teilen von glastafeln in zuschnitte
WO2002057192A1 (en) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separator and separating system
TWI226877B (en) * 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
KR100633488B1 (ko) * 2001-11-08 2006-10-13 샤프 가부시키가이샤 유리 기판의 분단 방법, 유리 기판의 분단 장치 및 액정 패널 제조 장치
KR100817129B1 (ko) * 2002-02-07 2008-03-27 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
KR100832292B1 (ko) * 2002-02-19 2008-05-26 엘지디스플레이 주식회사 액정 패널의 절단 장치
KR100724474B1 (ko) * 2002-10-22 2007-06-04 엘지.필립스 엘시디 주식회사 액정 표시패널의 절단 장치 및 이를 이용한 절단방법
CN101596723B (zh) * 2002-11-22 2012-05-30 三星钻石工业股份有限公司 基板分断方法
JPWO2004073946A1 (ja) * 2003-02-21 2006-06-01 三星ダイヤモンド工業株式会社 基板加工用テーブル及び基板の加工装置
JP2005067971A (ja) * 2003-08-26 2005-03-17 Fuji Photo Film Co Ltd 基板切断装置及び方法
JP2007088398A (ja) * 2004-12-14 2007-04-05 Realize Advanced Technology Ltd 洗浄装置、この洗浄装置を用いた洗浄システム、及び被洗浄基板の洗浄方法
TWI393682B (zh) * 2005-07-06 2013-04-21 Mitsuboshi Diamond Ind Co Ltd A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool
JPWO2007046151A1 (ja) * 2005-10-21 2009-04-23 近藤工業株式会社 半導体および液晶製造工程における半導体基板および液晶基板表面の静電除去装置
WO2010116421A1 (ja) * 2009-04-10 2010-10-14 坂東機工株式会社 ガラス板のスクライブ方法及びスクライブ装置
US9278878B2 (en) * 2011-02-23 2016-03-08 Corning Incorporated Methods and apparatus for scoring thin glass
CN102503106B (zh) * 2011-10-28 2013-11-27 深圳市华星光电技术有限公司 切割机构的碎屑收集装置及lcd面板切割碎屑吸除装置
WO2014073472A1 (ja) * 2012-11-09 2014-05-15 日本電気硝子株式会社 初期クラック形成装置、及び形成方法
CN203513502U (zh) * 2013-09-05 2014-04-02 樊晖 玻璃贴膜生产线

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6289695B1 (en) * 1998-03-16 2001-09-18 The Regents Of The University Of California Vacuum fusion bonding of glass plates
CN1979278A (zh) * 2005-12-08 2007-06-13 Nec液晶技术株式会社 制造液晶显示器面板的方法和切割液晶显示器面板的装置
CN1991484A (zh) * 2005-12-29 2007-07-04 Lg.菲利浦Lcd株式会社 切割lcd装置的设备和方法及用其制造lcd装置的方法
CN101224946A (zh) * 2008-01-30 2008-07-23 河北东旭机械设备有限公司 Tft-lcd玻璃基板自动加工生产线
CN101234848A (zh) * 2008-02-27 2008-08-06 友达光电股份有限公司 基板切割裂片装置及方法
CN102050564A (zh) * 2009-10-30 2011-05-11 孙月卫 切割液晶显示器单元母板的方法及其自动化切割系统

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107689403A (zh) * 2017-09-27 2018-02-13 无锡奥特维科技股份有限公司 片体集中处理设备
CN107689403B (zh) * 2017-09-27 2024-03-01 无锡奥特维科技股份有限公司 片体集中处理设备

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