WO2015166657A1 - シール材及びその硬化物 - Google Patents
シール材及びその硬化物 Download PDFInfo
- Publication number
- WO2015166657A1 WO2015166657A1 PCT/JP2015/002259 JP2015002259W WO2015166657A1 WO 2015166657 A1 WO2015166657 A1 WO 2015166657A1 JP 2015002259 W JP2015002259 W JP 2015002259W WO 2015166657 A1 WO2015166657 A1 WO 2015166657A1
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- WIPO (PCT)
- Prior art keywords
- sealing material
- group
- radical polymerization
- functional group
- sealing
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- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 239000003925 fat Substances 0.000 description 1
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- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
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- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
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- 239000002346 layers by function Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
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- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
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- YIMHRDBSVCPJOV-UHFFFAOYSA-N n'-(2-ethoxyphenyl)-n-(2-ethylphenyl)oxamide Chemical compound CCOC1=CC=CC=C1NC(=O)C(=O)NC1=CC=CC=C1CC YIMHRDBSVCPJOV-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- BXSZBTFVSMMJQG-UHFFFAOYSA-N naphtho[2,3-e][2]benzofuran-1,3-dione Chemical compound C1=CC2=CC3=CC=CC=C3C=C2C2=C1C(=O)OC2=O BXSZBTFVSMMJQG-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
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- 229920003986 novolac Polymers 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical class OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
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- 239000011574 phosphorus Substances 0.000 description 1
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- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
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- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1087—Materials or components characterised by specific uses
Definitions
- the present invention relates to a sealing material and a cured product thereof.
- Organic EL (Electro-Luminescence) elements are being used in displays and lighting devices because of their low power consumption.
- An organic EL element is easily deteriorated by moisture and oxygen in the atmosphere, and is used by being sealed with various sealing members.
- the organic EL device can be a structure including, for example, a substrate, an organic EL element disposed on the substrate, and a sealing substrate paired with the substrate.
- a sealing material is applied between the sealing substrate and the substrate and between the organic EL element and the sealing substrate, and is cured. The method (surface sealing method) is mentioned.
- organometallic compounds are known as moisture scavengers, and transparent films containing the same have also been proposed (Patent Documents 5 to 7). Further, it has also been proposed to add an organometallic compound and a powdered inorganic oxide as a moisture scavenger to a hot melt type member or the like (Patent Document 8).
- Non-patent Document 1 a compound containing a functional group capable of radical polymerization and an acid anhydride group in the molecule is known. It has also been conventionally known that a compound having an acid anhydride group and an acid group in one molecule is added to a composition for producing a curable resin (Patent Document 9).
- the present invention has been made in view of the above circumstances. That is, the present invention provides a sealing material that has a low moisture permeability, can be applied to the formation of a thin sealing layer, and can form a sealing layer having a moderately low elastic modulus.
- the first of the present invention relates to the following sealing material and a sheet-like sealing material obtained therefrom.
- the polymerizable functional group-containing olefin polymer (A) having at least one functional group capable of radical polymerization per molecule and having a number average molecular weight of 5,000 to 70,000 is further included.
- Sealing material [3] The sealing material according to [1] or [2], wherein a viscosity measured by an E-type viscometer at 25 ° C. and 1.0 rpm is 5 mPa ⁇ s or more and 20000 mPa ⁇ s or less.
- the radical polymerizable functional groups of the polymerizable monomer (B) and the acid anhydride derivative (C) each independently comprise a (meth) acryl group, a vinyl group, an allyl group, or a vinyl ether group.
- the radically polymerizable functional group of the polymerizable functional group-containing olefin polymer (A) is at least one selected from the group consisting of a (meth) acryl group, a vinyl group, an allyl group, and a vinyl ether group.
- 2nd of this invention is related with the hardened
- [8] A cured product of the sealing material according to any one of [1] to [6] above.
- the cured product of the sealing material according to [8], wherein the parallel light transmittance at a wavelength of 400 nm is 90% or more.
- a sealing material comprising: a hexahydrophthalic anhydride derivative (C ′) having at least one per molecule; and a radical polymerization initiator (D) containing at least one of a thermal radical polymerization initiator and a photo radical polymerization initiator.
- a cured product having low moisture permeability and moderately low elastic modulus can be obtained. Further, since the viscosity of the sealing material can be lowered, the cured material (sealing layer) of the sealing material can be thinned.
- FIG. 1A to FIG. 1C are schematic views showing a procedure for producing a sample for measuring moisture permeability of a cured product by the Ca method.
- FIG. 2A is a schematic cross-sectional view showing one aspect of the organic EL device
- FIG. 2B is a schematic cross-sectional view showing another aspect of the organic EL device.
- 3A to 3C are schematic views showing an example of a manufacturing process of the organic EL device of FIG. 2A.
- FIG. 4A is a schematic cross-sectional view showing another embodiment of the organic EL device
- FIG. 4B is a top view when the sealing substrate of the organic EL device of FIG. 4A is removed.
- the sealing material of this invention is a composition used for sealing layer formation of various devices, such as an organic EL device.
- the composition of the sealing material is appropriately selected according to the purpose.
- a sealing material containing a polymerizable monomer (B), an acid anhydride derivative (C), and a radical polymerization initiator (D) is used.
- the sealing material may contain a polymerizable functional group-containing olefin polymer (A) as necessary.
- the acid anhydride group of the acid anhydride derivative (C) having a polymerizable functional group is trapped by the acid anhydride group of the acid anhydride derivative (C) having a polymerizable functional group.
- the acid anhydride derivative (C) having a polymerizable functional group even if it is common acid anhydrides, such as hexahydro phthalic anhydride, the water which penetrate
- a general acid anhydride does not undergo a polymerization reaction with other components in the sealing material. Therefore, it is easy to bleed out after hardening of a sealing material, and it is hard to fully exhibit a moisture capture
- the acid anhydride derivative (C) contained in the sealing material of the present invention has a functional group capable of radical polymerization reaction, such as a polymerizable functional group-containing olefin polymer (A) and a polymerizable monomer (B). And polymerization reaction. Therefore, the structure (acid anhydride group) derived from the acid anhydride derivative (C) exists uniformly in the cured product. In other words, in the cured product of the sealing material of the present invention, the component that captures moisture (acid anhydride derivative (C)) does not bleed out and can capture moisture efficiently.
- the polymerizable functional group-containing olefin polymer (A) is polymerized with the acid anhydride derivative (C), so that the crosslink density of the cured product is hardly increased excessively.
- the sealing material does not easily shrink during curing, and warpage or the like hardly occurs in the substrate or the like laminated with the cured material of the sealing material.
- the elastic modulus of the cured product is moderately low and can absorb external loads and the like, the object to be sealed can be sufficiently protected from external stress strain and the like.
- the sealing material of the present invention does not contain the polymerizable functional group-containing polymer (A) or the content thereof is sufficiently small, the viscosity of the sealing material becomes low. As a result, the sealing material can be applied by an ink jet method or the like, and the thickness of the obtained cured product (sealing layer) can be reduced.
- the polymerizable functional group-containing olefin polymer (A), the polymerizable monomer (B), the acid anhydride derivative (C), the radical polymerization initiator (D), and the other which can be included in the sealing material of the present invention.
- the components will be described.
- Polymerizable functional group-containing olefin polymer (A) is an olefin polymer having at least one functional group capable of radical polymerization per molecule and having a number average molecular weight of 5,000 to 70,000.
- the number average molecular weight of the polymerizable functional group-containing olefin polymer (A) is from 5,000 to 70,000, preferably from 10,000 to 40,000.
- the number average molecular weight of the polymerizable functional group-containing olefin polymer (A) is 70000 or less, the fluidity of the sealing material is sufficiently increased, and various members can be easily sealed with the sealing material.
- the number average molecular weight of the polymerizable functional group-containing olefin polymer (A) is 5000 or more, the elastic modulus of the cured product of the sealing material tends to be low.
- the number of functional groups capable of radical polymerization contained per molecule of the polymerizable functional group-containing olefin polymer (A) may be one or more, and is based on the elastic modulus of the cured product of a desired sealing material. Is set as appropriate. If the number of radically polymerizable functional groups contained in the polymerizable functional group-containing olefin polymer (A) increases, the elastic modulus of the cured product of the sealing material tends to increase.
- the functional group capable of radical polymerization contained in the polymerizable functional group-containing olefin polymer (A) may be a functional group having an ethylenically unsaturated bond. Specifically, it is a (meth) acryl group, a vinyl group, an allyl group, a vinyl ether group or the like, and a (meth) acryl group or the like is preferable from the viewpoint of reactivity or the like.
- a plurality of functional groups capable of radical polymerization are contained in the polymerizable functional group-containing olefin polymer (A), these may be the same type of functional group or different types of functional groups.
- the polymerizable functional group-containing olefin polymer (A) is a copolymer of “polyolefin polymer” and “compound having a radical polymerizable functional group”, or “polyolefin polymer” can be “radically polymerized”. It may be a compound modified with “a compound having a functional group”.
- the functional group capable of radical polymerization may be directly bonded to the polyolefin polymer, or may be bonded to the polyolefin polymer via a divalent linking group.
- the type of the linking group for linking the functional group capable of radical polymerization is not particularly limited, but may have a substituent, a linear or branched alkylene group having 4 to 12 carbon atoms; A cycloalkylene group having 4 to 12 carbon atoms which may be present;
- the linking group may partially include —COO—, —O— and the like.
- Examples of the substituent contained in the linking group include an alkyl group, a hydroxy group, an alkoxy group, a carboxy group, an alkoxyalkoxy group, an aralkyloxy group, an aryl group, an aryloxy group, an aryloxyalkyloxy group, an alkylthio group, and an alkylthio group.
- Examples thereof include an alkylthio group, an aralkylthio group, an arylthio group, an arylthioalkylthio group, and a halogen atom.
- Examples of the “functional group capable of radical polymerization bonded to the olefin polymer via a linking group” include, for example, a group represented by the following general formula (Y2).
- R 13 represents a hydrogen atom or a methyl group.
- R 14 represents an alkylene group having 2 to 12 carbon atoms, preferably 2 to 6 carbon atoms.
- An alkylene group represents either a linear alkylene group, a branched alkylene group, or a cycloalkylene group.
- q represents the number of 1 or more and 23 or less. In one molecule of the polymerizable functional group-containing olefin polymer (A), only one kind of group represented by the general formula (Y2) may be contained, or two or more kinds may be contained.
- the polyolefin polymer that is the main skeleton of the polymerizable functional group-containing olefin polymer (A) may be a polymer of at least one olefin selected from olefins having 2 to 20 carbon atoms.
- the polyolefin polymer may be a homopolymer of one kind of olefin, or may be a random copolymer or a block copolymer of two or more kinds of olefins.
- Examples of olefins having 2 to 20 carbon atoms for obtaining polyolefin polymers include ethylene, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1 Straight chain having 2 to 20 carbon atoms such as pentene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene Or a branched ⁇ -olefin; cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, 2-methyl 1,4,5,8-dimethano-1,2,3,4,4a, Cyclic olefins having 3 to 20 carbon atoms such as 5,8,8a-octahydronaphthalene are included.
- the olefin having 2 to 20 carbon atoms for obtaining the polyolefin polymer includes vinylcyclohexane, diene, polyene and the like.
- the diene or polyene include cyclic or chain compounds having 4 to 20 carbon atoms and having two or more double bonds.
- polystyrene resin examples include polyethylene such as high density polyethylene and medium density polyethylene; polypropylene; poly-1-butene; polymethylbutene; ethylene / ⁇ -olefin copolymer; ethylene elastomer, propylene elastomer, Olefin elastomer such as isoprene rubber; and the like.
- the polyolefin polymer is preferably an olefin elastomer, particularly preferably isoprene rubber.
- examples of the “compound having a radically polymerizable functional group” to be reacted with the polyolefin-based polymer include a polymerizable monomer (B) described later and derivatives thereof.
- a polymerizable functional group-containing olefin polymer (A) is obtained by reacting the “compound having a functional group capable of radical polymerization” with a polyolefin polymer by a known method.
- Polymerizable monomer (B) The polymerizable monomer (B) is a compound having at least one functional group capable of radical polymerization per molecule, a molecular weight of 50 or more and 1000 or less, and liquid at 23 ° C. When the polymerizable monomer (B) is contained in the sealing material, the viscosity of the sealing material tends to be low, and the crosslinking density of the cured material of the sealing material is further increased.
- the polymerizable monomer (B) does not include those corresponding to the acid anhydride derivative (C) described later.
- the number of radically polymerizable functional groups contained in one molecule of the polymerizable monomer (B) may be one or more, preferably 1 to 16, more preferably 1 to 4, and still more preferably 1 to 3. .
- the radically polymerizable functional group contained in the polymerizable monomer (B) can be a vinyl group, a (meth) acryl group, an allyl group, a vinyl ether group, or the like, preferably a (meth) acryl group.
- the functional groups may be the same type or different types.
- the molecular weight of the polymerizable monomer (B) is 50 to 1000, preferably 50 to 500.
- the viscosity of the sealing material is easily adjusted.
- Examples of the polymerizable monomer (B) include a mono (meth) acryl monomer having one (meth) acryl group in one molecule and a di (meth) acryl having two (meth) acryl groups in one molecule. Monomers are included.
- R 7 in the general formula (1B) represents a hydrogen atom or a methyl group.
- R 8 represents a hydrogen atom or a hydrocarbon group having 4 to 18 carbon atoms.
- the hydrocarbon group having 4 to 18 carbon atoms represents a linear alkyl group, a branched alkyl group, or an alicyclic hydrocarbon.
- the mono (meth) acrylic monomer represented by the general formula (1B) include (meth) acrylic acid, n-butyl (meth) acrylate, i-butyl (meth) acrylate, 2-ethylhexyl (meth) Acrylate, lauryl (meth) acrylate, i-stearyl (meth) acrylate, isoamyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, isomyristyl (meth) acrylate, tridecyl (meth) acrylate, cyclohexyl (meta) ) Acrylate, dicyclopentenyloxyethyl acrylate and the like.
- the sealing material of the present invention may contain only one kind or two or more kinds.
- the di (meth) acryl monomer having two (meth) acryl groups in one molecule can be a monomer represented by the following general formula (2B).
- R 9 and R 10 in the general formula (2B) each independently represent a hydrogen atom or a methyl group.
- R 11 represents a hydrocarbon group having 4 to 12 carbon atoms.
- the hydrocarbon group having 4 to 12 carbon atoms represents a linear alkylene group, a branched alkylene group, or a cycloalkylene group.
- di (meth) acrylic monomer represented by the general formula (2B) examples include 1,3-butylene glycol di (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6- Hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate and the like are included.
- the sealing material may contain only one kind or two or more kinds.
- the sealing material contains a mono (meth) acrylic monomer and a di (meth) acrylic monomer
- these content ratios are arbitrary, but when the content ratio of the di (meth) acrylic monomer increases, a high temperature and high humidity environment Underlying contact reliability increases.
- Examples of the polymerizable monomer (B) include a monomer having one or more vinyl groups in one molecule, a monomer having one or more allyl groups in one molecule, and one or more vinyl ether groups in one molecule. Monomers and vinyl ether compounds having a (meth) acryloyl group in one molecule are also included.
- Examples of monomers having one or more vinyl groups in one molecule include styrene, p-hydroxystyrene, p-chlorostyrene, p-bromostyrene, p-methylstyrene, p-methoxystyrene, pt-butoxystyrene.
- Group vinyl compounds vinyl acetate, vinyl monochloroacetate, vinyl benzoate, vinyl pivalate, vinyl butyrate, vinyl laurate, vinyl adipate, vinyl methacrylate, vinyl crotonate, vinyl 2-ethylhexanoate, etc. Ester compounds; nitrogen-containing vinyl compounds such as N-vinylcarbazole and N-vinylpyrrolidone;
- Examples of monomers having one or more allyl groups in one molecule include diallyl phthalate, diallyl isophthalate, diallyl terephthalate, trimethylolpropane diallyl ether, triallyl isocyanurate, trimethallyl isocyanurate, triallyl cyanurate, etc. included.
- Examples of monomers having one or more vinyl ether groups in one molecule include ethyl vinyl ether, isobutyl vinyl ether, butanediol divinyl ether, cyclohexyl vinyl ether, hydroxybutyl vinyl ether, hydroxyethyl vinyl ether, cyclohexane dimethanol divinyl ether, cyclohexane dimethanol monovinyl ether. , Diethylene glycol divinyl ether, triethylene glycol divinyl ether, triethylene glycol monovinyl ether, and the like.
- vinyl ether compounds having a (meth) acryloyl group in one molecule include 2- (2-vinyloxyethoxy) ethyl acrylate and 2- (2-vinyloxyethoxy) ethyl methacrylate.
- Acid anhydride derivative (C) is a compound having at least one functional group capable of radical polymerization per molecule and an acid anhydride group constituting a 5-membered ring or a 6-membered ring.
- various acid anhydrides And a compound having a radical polymerizable functional group bonded thereto.
- the number of radically polymerizable functional groups contained in one molecule of the acid anhydride derivative (C) may be one or more, but preferably one.
- the functional group capable of radical polymerization is contained in the acid anhydride derivative (C)
- the polymerizable monomer (B), the polymerizable functional group-containing olefin polymer (A) and the acid anhydride are cured when the sealing material is cured.
- the derivative (C) is polymerized to suppress bleeding out of the acid anhydride derivative (C).
- the functional group capable of radical polymerization contained in the acid anhydride derivative (C) may be a functional group having an ethylenically unsaturated bond. Specifically, it is a (meth) acryl group, a vinyl group, an allyl group, a vinyl ether group or the like, and a (meth) acryl group or the like is preferable from the viewpoint of reactivity or the like.
- the functional group capable of radical polymerization may be directly bonded to the main skeleton containing an acid anhydride group or may be bonded via a linking group.
- the linking group may be the same as the linking group for linking the radically polymerizable functional group of the polymerizable functional group-containing olefin polymer (A) and the polyolefin polymer.
- the functional groups may be the same type or different types.
- the acid anhydride derivative (C) can be, for example, a compound represented by the following general formula (1C).
- X represents an organic group having 2 to 14 carbon atoms (provided that the number of carbons contained between the acid anhydride groups is 2 or 3), and R 1 is A functional group capable of radical polymerization is represented, and Y represents a single bond or a linking group.
- N represents a number from 1 to 12.
- X in the general formula (1C) is, for example, an aliphatic group; a monocyclic aliphatic group; a condensed polycyclic aliphatic group; a monocyclic aromatic group; a condensed polycyclic aromatic group; A non-condensed polycyclic aliphatic group in which groups are connected to each other directly or by a bridging member; a non-fused polycyclic aromatic group in which aromatic groups are connected to each other directly or by a bridging member.
- the above X is a structure derived from various acid anhydrides, and may be, for example, a group derived from an aromatic dicarboxylic acid anhydride or an alicyclic dicarboxylic acid anhydride.
- aromatic dicarboxylic acid anhydride examples include phthalic anhydride, naphthalene dicarboxylic acid anhydride, anthracene dicarboxylic acid anhydride and the like.
- examples of the alicyclic dicarboxylic anhydride include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, (1 ⁇ , 4 ⁇ ) -norbornane-2 ⁇ , 3 ⁇ -dicarboxylic anhydride and the like.
- X may have a substituent.
- the substituent may be an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group, a halogen, or the like.
- R 1 in the general formula (1C) may specifically be a (meth) acryl group, a vinyl group, an allyl group, or a vinyl ether group.
- Y in the general formula (1C) is a linking group
- Y represents an alkylene group having 1 to 10 carbon atoms, an alkenylene group having 1 to 3 unsaturated groups and 2 to 10 carbon atoms, or a phenylene group. It may be a divalent linking group selected from: A part of hydrogen of the linking group may be substituted with halogen.
- the acid anhydride derivative represented by the general formula (1C) is preferably a hexahydrophthalic anhydride derivative (C ′) or a phthalic anhydride derivative (C ′′), particularly preferably a hexahydrophthalic anhydride derivative ( C ′).
- hexahydrophthalic anhydride derivative examples include compounds represented by the following general formula (2C).
- the molecular weight of the compound is preferably 296 to 5000.
- n represents a number of 1 or more and 4 or less.
- R 11 represents a group containing at least one functional group capable of radical polymerization.
- R 11 is preferably a group represented by the following general formula (X1), a group containing a vinyl group, a group containing an allyl group, or a group containing a vinyl ether group.
- R 3 represents a hydrogen atom or a methyl group.
- R 4 represents a linear alkylene group, branched alkylene group, or cycloalkylene group having 2 to 12 carbon atoms, preferably 2 to 6 carbon atoms.
- p represents a number of 1 or more and 23 or less.
- Examples of the “group containing a vinyl group” corresponding to R 11 in the general formula (2C) include a 3-buten-1-yl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group 5-hexyl-1-yl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group, 7-octen-1-yl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group Is included.
- examples of the “group containing an allyl group” corresponding to R 11 include allyl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group, 2- (allyloxy) ) Ethyl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group is included.
- examples of the “group containing a vinyl ether group” corresponding to R 11 include a 2- (vinyloxy) ethyl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group, 2 -(2- (vinyloxy) ethoxy) ethyl-1,3-dioxooctahydroisobenzofuran-5-carboxylate group, 4- (vinyloxy) butyl-1,3-dioxooctahydroisobenzofuran-5-carboxylate A group is included.
- the compound represented by the general formula (2C) may have a substituent.
- the substituent is not particularly limited as long as the effect of the present invention is not impaired, and may be, for example, a linear or branched alkyl group having 1 to 5 carbon atoms.
- a particularly preferred example of the acid anhydride derivative (C) is a compound represented by the following general formula (3C).
- R 5 represents a hydrogen atom or a methyl group.
- Radical polymerization initiator (D) The radical polymerization initiator (D) is a compound for radical polymerization of the polymerizable functional group-containing olefin polymer (A), acid anhydride derivative (C), or polymerizable monomer (B) by heating or light irradiation. It is.
- the radical polymerization initiator (D) may be a photo radical polymerization initiator or a thermal radical polymerization initiator.
- the type of radical polymerization initiator (D) contained in the sealing material is appropriately selected according to the curing method of the sealing material, and the sealing material may contain either one or both. .
- the radical photopolymerization initiator is not particularly limited, and may be a known radical photopolymerization initiator.
- radical photopolymerization initiators include alkylphenone compounds, acyl phosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin compounds, acetophenone compounds, benzophenone compounds, thioxanthone compounds, ⁇ -acyro Examples include oxime ester compounds, phenylglyoxylate compounds, benzyl compounds, azo compounds, diphenyl sulfide compounds, organic dye compounds, iron-phthalocyanine compounds, benzoin ether compounds, anthraquinone compounds, and the like.
- the sealing material may contain only one kind, or two or more kinds.
- the photo radical polymerization initiator is particularly preferably an alkylphenone compound or an acyl phosphine oxide compound from the viewpoint of reactivity or the like.
- the thermal radical polymerization initiator is not particularly limited, and may be a known thermal radical polymerization initiator.
- the thermal radical polymerization initiator can be, for example, a known organic peroxide.
- thermal radical polymerization initiators include 2,4-dichlorobenzoyl peroxide, t-butyl peroxypivalate, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl Peroxide, succinic acid peroxide, acetyl peroxide, t-butylperoxy (2-ethylhexanoate), t-amylperoxy (2-ethylhexanoate), m-toluoyl peroxide, benzoylperoxide Oxide, t-butylperoxymaleic acid, t-butylperoxylaurate, t-butylperoxy-3,5,5-trimethyl
- the sealing material may contain a radical chain transfer agent in addition to the radical polymerization initiator.
- a radical chain transfer agent in addition to the radical polymerization initiator.
- the curability of the sealing material is further increased.
- the radical chain transfer agent include alpha methyl styrene dimers, mercapto group-containing thiols, disulfides such as diphenyl disulfide, terminal unsaturated methacrylic acid ester n-mers, porphyrin cobalt complexes, and the like. Only one type of radical chain transfer agent may be included in the sealing material, or two or more types of radical chain transfer agents may be included.
- the content of the radical chain transfer agent is preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the total amount of the compounds having radical polymerizable functional groups. is there.
- the sealing material may contain other resins as long as the effects of the present invention are not significantly impaired.
- the other resin can be, for example, a thermosetting resin.
- the thermosetting resin include epoxy resin, phenol resin, diallyl phthalate resin, urea resin, polyester resin and the like. Only one type of thermosetting resin may be included in the sealing material, or two or more types may be included.
- ⁇ ⁇ ⁇ Filler may be included in the sealing material.
- the filler contained in the sealing material include glass beads, styrene polymer particles, methacrylate polymer particles, ethylene polymer particles, and propylene polymer particles. Only one type of filler may be included in the sealing material, or two or more types of fillers may be included.
- the sealing material may contain a modifier and a stabilizer.
- the modifier include an anti-aging agent, a leveling agent, a wettability improver, a surfactant, a plasticizer, and the like. These modifiers can be used singly or in combination of two or more.
- specific examples of the stabilizer include ultraviolet absorbers, preservatives, antibacterial agents and the like. One of these modifiers and stabilizers may be included in the sealing material, or two or more thereof may be included.
- ⁇ An antioxidant may be included in the sealing material.
- Antioxidants refer to those that deactivate radicals generated by plasma irradiation or sunlight irradiation (Hindered Amine Light Stabilizer, HALS), and those that decompose peroxides.
- the antioxidant has a function of preventing discoloration of the cured material of the sealing material.
- Antioxidants can be hindered amines, phenolic antioxidants, phosphorus antioxidants, and the like.
- hindered amines include bis (2,2,6,6-tetramethylpiperidin-4-yl) sebacate, 2,4-dichloro-6-tert-octylamino-s-triazine and 4,4′-hexamethylene Bis (amino-2,2,6,6-tetramethylpihelidine) polycondensation product, bis [1- (2-hydroxy-2-methylpropoxy) -2,2,6,6-tetramethylpiperidine -4-yl] sebacate.
- phenolic antioxidants examples include monophenols such as 2,6-di-t-butyl-p-cresol, and bisphenols such as 2,2′-methylenebis (4-methyl-6-t-butylphenol). And high-molecular phenols such as 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane.
- an antioxidant selected from phosphites and a colorant selected from oxaphosphaphenanthrene oxides are preferably used.
- Tinuvin 123 bis (1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl) sebacic acid
- Tinuvin 765 bis (1,2,2, 6,6-pentamethyl-4-piperidyl) sebacic acid and methyl 1,2,2,6,6-pentamethyl-4-piperidyl sebacic acid
- Hostavin PR25 dimethyl 4-methoxybenzyl idenemalonate
- Tinuvin 312 or Hostavin vsu ethanediamide N- (2-ethoxyphenyl) -N '-(2-ethylphenyl)
- CHIMASSORB 119 FL N, N'-bis (3-aminopropyl) ethylenediamine-2,4-bis [N- Butyl-N (1,2,2,6,6-pentamethyl-4-piperidyl) amino] -6-chloro-1,3,5-triazine condensates
- the solvent of the present invention may contain a solvent as necessary.
- the solvent has a function of uniformly dispersing or dissolving each component.
- solvents include aromatic solvents such as toluene and xylene; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; ethers such as ether, dibutyl ether, tetrahydrofuran, dioxane, and ethylene glycol monoalkyl ether; N-methyl
- Examples include aprotic polar solvents such as pyrrolidone; esters such as ethyl acetate and butyl acetate.
- composition of the sealing material of the present invention is appropriately selected according to the composition of the sealing material.
- the sealing material when the sealing material is discharged from an ink jet and used, it is preferable that the sealing material has a low viscosity. Accordingly, it is preferable that the composition contains at least the polymerizable monomer (B), the acid anhydride derivative (C), and the radical polymerization initiator (D).
- the polymerizable monomer (B) is preferably contained in an amount of 60 to 96% by mass, more preferably 70 to 89% by mass, based on the total amount of the sealing material.
- cured material of a sealing material has sufficient intensity
- the acid anhydride derivative (C) is relatively sufficiently contained, and the moisture permeability of the cured product of the sealing material is lowered.
- the acid anhydride derivative (C) is preferably contained in an amount of 3 to 39% by mass, more preferably 10 to 29% by mass, based on the total amount of the sealing material.
- the amount of the acid anhydride derivative is 3% by mass or more, the moisture permeability of the cured product of the sealing material is sufficiently low.
- the radical polymerization initiator (D) is preferably contained in an amount of 1 to 25 parts by mass, more preferably 1 to 20 parts per 100 parts by mass of the total mass of the polymerizable monomer (B) and the acid anhydride derivative (C). Part by mass.
- the amount of the radical polymerization initiator (D) is in the above range, the polymerizable monomer (D) and the acid anhydride derivative (C) are sufficiently cured, and the elastic modulus of the cured product of the sealing material is in a desired range. Easy to fit.
- the sealing material may contain 1 to 10% by mass of the polymerizable functional group-containing polymer (A) based on the total amount of the sealing material, if necessary.
- a polymerizable monomer (B) may be included as necessary.
- the polymerizable functional group-containing olefin-based polymer (A) is preferably contained in an amount of 30 to 90% by mass, more preferably 30 to 60% by mass, based on the total amount (mass) of the sealing material.
- the amount of the polymerizable functional group-containing olefin polymer (A) is 30% by mass or more, the elastic modulus of the cured product of the sealing material is likely to fall within a desired range.
- the amount of the polymerizable functional group-containing olefin polymer (A) is 90% by mass or less, the acid anhydride derivative (C) is relatively sufficiently contained, and the moisture permeability of the cured product of the sealing material. Becomes lower.
- the amount of the polymerizable monomer (B) is 65% by mass or less based on the total mass of the polymerizable functional group-containing olefin polymer (A), the acid anhydride derivative (C), and the polymerizable monomer (B). It is preferable that the content is 5 to 50% by mass. When the amount of the polymerizable monomer (B) is within the above range, the elastic modulus of the sealing material can be made relatively low.
- the acid anhydride derivative (C) is contained in an amount of 3 to 40% by mass with respect to the total amount (mass) of the sealing material.
- the amount of the acid anhydride derivative (C) is 3% by mass or more, the moisture permeability of the cured product of the sealing material is sufficiently low.
- the amount of the acid anhydride derivative (C) in the sealing material is 40% by mass or less, the polymerizable functional group-containing olefin polymer (A) is relatively sufficiently contained, and the elasticity of the sealing material. The rate is lowered.
- the radical polymerization initiator (D) is a total amount of the compound having a radical polymerizable functional group, that is, a polymerizable functional group-containing olefin polymer (A), an acid anhydride derivative (C), and a polymerizable monomer (B ) Is preferably 2 to 15 parts by mass, more preferably 5 to 10 parts by mass.
- the viscosity of the sealing material of the present invention measured by an E-type viscometer at 25 ° C. and 1.0 rpm is preferably 5 to 20000 mPa ⁇ s.
- the coating property of the sealing material for example, screen printing property or ink jet printing property
- the viscosity of the sealing material is measured by, for example, RC-500 E-type viscometer manufactured by Toki Sangyo.
- the viscosity of the sealing material of the present invention measured by an E-type viscometer at 25 ° C. and 1.0 rpm is preferably 10 to 20000 mPa ⁇ s, More preferably, it is 10 to 5000 mPa ⁇ s.
- the viscosity of the sealing material of the present invention measured by an E-type viscometer at 25 ° C. and 1.0 rpm is preferably 5 to 1000 mPa ⁇ s. More preferably, it is ⁇ 100 mPa ⁇ s.
- the moisture content of the sealing material is preferably 0.5% by mass or less, more preferably 0.1% by mass or less, and further preferably 0.06% by mass or less. Since the electric circuit in which the organic EL element is arranged is easily deteriorated by moisture, it is preferable to reduce the moisture content of the sealing material as much as possible.
- the moisture content of the sealing material can be obtained by weighing about 0.1 g of a sample sample, heating to 150 ° C. using a Karl Fischer moisture meter, and measuring the amount of water generated at that time (solid vaporization method). ).
- the sealing material of the present invention is preferably used as a sealing material for forming a sealing layer for an optical semiconductor.
- An optical semiconductor is an element that emits light by converting electricity into light, for example.
- the optical semiconductor includes an inorganic LED (Light Emitting Diode) element, an organic EL element, and the like, and preferably an organic EL element. Since an optical semiconductor is easily deteriorated by moisture or the like, the surface needs to be sealed.
- the sealing material of the present invention it is possible to protect components that are easily deteriorated by moisture or the like (for example, pigments).
- the cured product of the sealing material of the present invention has low moisture permeability. Therefore, if a component that easily deteriorates due to moisture or the like is added to the sealing material, the component is difficult to come into contact with moisture, and the deterioration can be suppressed.
- the sealing material of the present invention may be coated in a liquid state with an object to be sealed and cured to form a sealing layer.
- an optical semiconductor such as an organic EL element by screen printing, dispenser application, ink jet application, etc.
- the applied layer is cured to light the organic EL element or the like.
- What is necessary is just to surface-seal a semiconductor.
- molding the sealing material of this invention in a film form you may seal a to-be-sealed object with the said film.
- a film-like sealing material is laminated on an optical semiconductor such as an organic EL element, and then cured to light the organic EL element or the like. The semiconductor is sealed.
- the curing method of the sealing material is appropriately selected depending on the type of radical polymerization initiator.
- the sealing material is cured by heating.
- the heating temperature only needs to be higher than 23 ° C., and is appropriately set in consideration of the heat resistant temperature and efficiency of the object to be sealed.
- the sealing material is cured by light irradiation.
- the wavelength of the light to be irradiated is appropriately selected depending on the kind of the radical photopolymerization initiator, and can be, for example, ultraviolet light or visible light.
- the integrated light quantity of the irradiated light is generally about 100 to 10,000 mJ / cm 2 . You may heat further after light irradiation.
- the sealing material of this invention is manufactured by arbitrary methods, unless the effect of this invention is impaired. For example, 1) a step of preparing a polymerizable functional group-containing olefin polymer (A), a polymerizable monomer (B), an acid anhydride derivative (C), a polymerization initiator (D), etc. 2) an inert gas It is manufactured through a process of mixing each component at 30 ° C. or less under the environment. Mixing includes a method in which these components are dispersed with a ball mill, a method in which the components are charged in a flask and agitation, and a method in which the components are kneaded with three rolls.
- a liquid sealing material may be applied to a release substrate, the coating film may be dried, and then peeled off.
- the sealing material may be applied using a method such as screen printing or dispenser application.
- cured material of the sealing material of this invention is as low as possible. That is, the Ca reaction start time measured at 60 ° C. and 90% RH measured by the following method is preferably 24 hours or more. The longer the Ca reaction start time, the lower the moisture permeability of the cured product.
- FIG. 1 is a schematic diagram showing a procedure for producing a sample for measuring moisture permeability of a cured product by the Ca method.
- a glass substrate 2 size: 25 ⁇ 25 mm, thickness: 0.7 mm
- a deposited film 4 of metallic calcium having a thickness of 170 nm is formed under the following conditions.
- the length L from the end of the metal calcium vapor deposition film 4 to the end of the glass substrate 2 is adjusted to 4 mm.
- Degree of vacuum during deposition 3.0 ⁇ 10 ⁇ 5 Pa
- Film-forming speed 1.2kg / sec
- Metal calcium raw material High-purity chemical, grain
- the obtained glass substrate with a deposited metal calcium film is moved to a glove box in an N 2 atmosphere without being exposed to air.
- the sealing material of the present invention was dropped onto a separately prepared acetone-cleaned glass substrate 6 (25 ⁇ 55 mm, thickness: 2 mm) so that the thickness after curing was 100 ⁇ m.
- the coating film 8 is formed by drying.
- a glass substrate with a coating film of a sealing material and a glass substrate with a vapor deposition film are bonded together to form a laminate and fixed with a clip.
- the thickness of the obtained laminate can be adjusted by sandwiching a Teflon (registered trademark) sheet having a thickness of 100 ⁇ m as a spacer between a glass substrate with a sealant coating film and a glass substrate with a metal calcium vapor deposition film. it can.
- the length L ′ from the end of the metal calcium vapor deposition film 4 to the end of the coating film 8 is also 4 mm.
- thermosetting type sealing material the laminate is heated in an oven at 100 ° C. for 30 minutes to cure the sealing material to obtain a sample.
- photo-curing type sealing material the laminate is irradiated with 3000 mJ with a mercury lamp, and then heated at 80 ° C. for 30 minutes to cure the sealing material to obtain a sample.
- the moisture permeability of the sealing layer in the organic EL device can be measured with high accuracy because the Ca method can be measured with an evaluation cell closer to the actual device configuration than the cup method.
- the moisture permeability measured by a general cup method is mainly to evaluate the moisture permeability in the direction invading from the main surface of the organic EL device (the direction from the sealing substrate 26 to the substrate 22 in FIG. 2A described later).
- the moisture permeability measured by the Ca method is mainly in the direction entering from the side surface of the organic EL device (the direction from the gap between the sealing substrate 26 and the substrate 22 in FIG.
- the Ca method can evaluate the moisture permeability of the sealing layer of the organic EL device because it can evaluate the moisture permeability of the organic EL device, which is the direction in which moisture and oxygen in the atmosphere penetrate. Can evaluate well.
- the elastic modulus of the cured product of the sealing material of the present invention is appropriately selected according to the application and composition of the sealing material.
- the pressure is preferably 0.1 MPa or more and 100 MPa or less, more preferably 0.1 to 20 MPa.
- the elastic modulus of the cured material of the sealing material is 100 MPa or less, the object to be sealed is protected from external stress strain and the like by the layer made of the cured material of the sealing material.
- the elastic modulus of the cured material of the sealing material is obtained as follows.
- a sample is attached to a tensile tester at a distance between chucks of 30 mm, and strain is measured at a starting load of 10 N and a tensile speed of 30 mm / min. Then, the elastic modulus is calculated from the slope of the straight line portion of the stress-strain curve in which the vertical axis represents stress and the horizontal axis represents strain.
- the elastic modulus can be 10 MPa to 10 GPa.
- the transmittance of parallel light having a wavelength of 400 nm of the cured material of the sealing material of the present invention is preferably 90% or more, more preferably 95% or more. If the parallel light transmittance of the cured product is 90% or more, the sealing material can be applied to a member for sealing various optical semiconductors.
- the transmittance of parallel light is the transmittance of parallel light of a cured product of 100 ⁇ m sealing material, and is measured with an ultraviolet-visible spectrophotometer or the like.
- Organic EL device Generally, an organic EL device is disposed between an organic EL element disposed on a substrate, a sealing substrate paired with the substrate, the substrate and the sealing substrate, and covers the organic EL element. And a sealing layer (surface sealing). Part or all of the sealing layer may be a cured product of the above-described sealing material. Moreover, since the cured product of the sealing material of the present invention has low moisture permeability as described above, the organic EL element is not completely covered, or between the cured product of the sealing material of the present invention and the organic EL element. Even when other members are present, the organic EL element can be protected from moisture.
- the cured product of the sealing material of the present invention can be used as a sealing material for protecting the organic EL element from moisture.
- the structure of an organic EL device is not limited.
- the organic EL device can be an organic EL display panel, organic EL lighting, or the like.
- FIG. 2A is a schematic cross-sectional view showing one embodiment of an organic EL device.
- This embodiment is an example in which the entire surface sealing layer is a cured product of the above-described sealing material.
- a substrate 22, an organic EL element 24, and a sealing substrate 26 are stacked in this order.
- a surface sealing layer 28 is disposed between the substrate 22 and the sealing substrate 26, and the surface sealing layer 28 covers the periphery of the organic EL element 24. In this manner, the surface sealing layer 28 seals the organic EL element 24.
- the substrate 22 and the sealing substrate 26 are usually glass substrates or resin films, and at least one of the substrate 22 and the sealing substrate 26 is a transparent glass substrate or a transparent resin film.
- transparent resin films include aromatic polyester resins such as polyethylene terephthalate.
- the organic EL element 24 When the organic EL element 24 is a top emission type, the organic EL element 24 includes a reflective pixel electrode layer 30 (made of aluminum or silver), an organic EL layer 32, and a transparent counter electrode layer 34 (ITO) from the substrate 22 side. (Including Indium Tin Oxide: indium tin oxide) and IZO (indium zinc oxide)).
- the reflective pixel electrode layer 30, the organic EL layer 32, and the transparent counter electrode layer 34 may be formed by vacuum deposition, sputtering, or the like.
- the surface sealing layer 28 can be made of a cured product of the sealing material of the present invention.
- the parallel light transmittance of the surface sealing layer 28 made of the cured product of the sealing material of the present invention is preferably 90% or more. This is because if the parallel light transmittance is too low, the light extraction efficiency from the device and the light absorption efficiency to the device are likely to decrease.
- the upper limit of the light transmittance of the surface sealing layer 28 can be about 99%, for example.
- the sealing material of the present invention is adjusted to have a relatively low viscosity, the coating property is good and the surface sealing layer 28 having a uniform film thickness can be formed. Further, the cured product of the sealing material of the present invention has a sufficiently reduced moisture permeability particularly by the Ca method. Therefore, the surface sealing layer 28 made of the cured material of the sealing material according to the present invention particularly has a gap between the substrate 22 and the sealing substrate 26; that is, moisture and oxygen in the atmosphere entering from the side surface direction of the organic EL element. It is possible to suppress trapping and contact with the organic EL element 24.
- invades from the main surface side of the organic EL device 20 to an internal direction is a material with low moisture permeability to the board
- an organic EL element disposed on the substrate 2) a cured resin layer that is in contact with the organic EL element and covers (surface seals) the organic EL element; 3)
- the aspect which includes the passivation layer which contacts the said resin cured material layer and covers the said resin cured material layer, and 4) the sealing substrate which covers a passivation layer is mention
- the cured resin layer can be a cured product of the above-described sealing material.
- FIG. 2B is a schematic cross-sectional view showing another aspect of the organic EL device.
- the surface sealing layer 28 covers the cured resin layer 28-1 made of the cured product of the sealing material of the present invention and the cured resin layer 28-1.
- the structure is substantially the same as that shown in FIG. 2A except that it includes a passivation layer 28-2 and a second cured resin layer 28-3 covering the passivation layer 28-2.
- Other components of the organic EL device 20 ′ shown in FIG. 2B are the same as the constituent members of the organic EL device 20 shown in FIG. 2A.
- the cured resin layer 28-1 included in the surface sealing layer 28 is preferably in contact with the organic EL element.
- the thickness of the cured resin layer 28-1 is preferably 0.1 to 20 ⁇ m.
- the passivation layer 28-2 included in the surface sealing layer 28 is preferably an inorganic compound layer formed in a plasma environment.
- Forming a film in a plasma environment means, for example, forming a film by a plasma CVD method, but is not particularly limited, and may be formed by a sputtering method or an evaporation method.
- the material of the passivation layer 28-2 is preferably a transparent inorganic compound, and examples thereof include silicon nitride, silicon oxide, SiONF, and SiON, but are not particularly limited.
- the thickness of the passivation layer 28-2 is preferably 0.1 to 5 ⁇ m.
- the passivation layer 28-2 may be formed in contact with the cured resin layer 28-1. This is because the cured resin layer 28-1 made of the cured material of the sealing material of the present invention can maintain its transparency even when exposed to a plasma environment.
- the passivation layer 28-2 is formed not in direct contact with the organic EL element 24 but in direct contact with the cured resin layer 28-1. If an attempt is made to form a film by bringing the passivation layer 28-2 into direct contact with the organic EL element 24, the edge of the organic EL element 24 has an acute angle, which may reduce the coverage by the passivation layer 28-2.
- the organic EL element 24 is sealed with a cured resin layer 28-1 that is a cured product of the sealing material of the present invention, and then the passivation layer 28- is formed on the cured resin layer 28-1.
- the film formation surface of the passivation layer 28-2 can be smoothed, and the coverage is improved.
- the second cured resin layer 28-3 included in the surface sealing layer 28 is made of the same material as that of the cured resin layer 28-1 (a layer made of the cured material of the sealing material of the present invention) but is different. It may be.
- the moisture content of the second cured resin layer 28-3 may be higher than the moisture content of the cured resin layer 28-1. This is because the second cured resin layer 28-3 is not in direct contact with the organic EL element.
- the second cured resin layer 28-3 is not in direct contact with the organic EL element.
- the second cured resin layer 28-3 In the case of a top emission type organic EL device (an organic EL device that takes out light emitted from the organic EL element through the second cured resin layer 28-3), the second cured resin layer 28-3 The light transmittance needs to be high as in the case of the cured resin layer 28-1.
- the organic EL device can be manufactured by any method, but 1) a step of preparing a substrate on which the organic EL element is arranged, and 2) covering the organic EL element with a sealing material, curing the sealing material, and sealing the surface. It can be manufactured through a process of forming a stop layer and 3) a process of sealing with a sealing substrate.
- FIG. 3 is a schematic diagram showing an example of a manufacturing process of the organic EL device of FIG. 2A.
- stacked is prepared (refer FIG. 3A).
- the organic EL element 24 includes a reflective pixel electrode layer 30, an organic EL layer 32, and a transparent counter electrode layer 34, but may further include other functional layers.
- the liquid sealing material 28-1 'of the present invention is applied on the organic EL element 24, or the sheet-like sealing material 28-1' is laminated on the organic EL element 24 (see FIG. 3B).
- the sealing substrate 26 is overlaid, and in this state, the sealing material is cured to form the cured resin layer 28-1, and the sealing substrate 26 is bonded (see FIG. 3C). In this way, the organic EL device 20 is obtained.
- the organic EL device may be manufactured through a process in which the surface sealing layer is exposed to plasma as necessary.
- Examples of the step of exposing the surface sealing layer to plasma include a step of forming a passivation film on the surface sealing layer by a plasma CVD method, and a step of changing the surface characteristics by irradiating the surface sealing layer with plasma. Etc. are included. By changing the surface characteristics (for example, increasing wettability), the adhesion with other members can be improved.
- the sealing member of the organic EL device may be a cured product of the above-described sealing material.
- 1) the organic EL element disposed on the substrate, and 2) the organic EL element is in contact with and covers at least a part of the side surface of the organic EL element (sealing) 1) a first cured resin layer, 3) a second cured resin layer in contact with the organic EL element, and covering (sealing) at least a part of the upper surface of the organic EL element, and 4)
- cured material layer is mention
- the first cured resin layer can be a cured product of the above-described sealing material.
- FIG. 4A is a schematic cross-sectional view showing another embodiment of the organic EL device
- FIG. 4B is a top view when the sealing substrate 26 of the organic EL device 20 ′′ in FIG. 4A is removed.
- the organic EL device 20 ′′ includes a surface sealing layer 28 and a dam material 36 that covers the outer periphery thereof; the surface sealing layer 28 further includes a side surface of the organic EL element 24.
- the configuration is substantially the same as that shown in FIG. 2A, except that the first sealing layer 28 ⁇ / b> A is covered and the second sealing layer 28 ⁇ / b> B covering the upper surface of the organic EL element 24 is formed.
- Other constituent members of the organic EL device 20 ′′ shown in FIGS. 4A and 4B are the same as the constituent members of the organic EL device 20 shown in FIG. 2A.
- the dam material 36 is not particularly limited, but may be composed of an epoxy resin or the like. Such a dam material 36 can be formed by applying or dripping by a dispenser method.
- the second sealing layer 28B does not contain a water-absorbing filler or a filler. This is because, as will be described later, since the upper surface of the organic EL element does not come into contact with the water-absorbing filler or filler, damage (scratch) of the organic EL element can be suppressed. Moreover, it is because the 2nd sealing layer 28B which does not contain a water absorbing filler, a filler, etc. is easy to make a total light transmittance high, and is excellent in transparency.
- the parallel light transmittance at a wavelength of 400 nm of the second sealing layer 28B is preferably 90% or more. This is because if the parallel light transmittance is too low, the light extraction efficiency from the device and the light absorption efficiency to the device are likely to decrease.
- the upper limit of the light transmittance of the cured product layer 28 can be, for example, about 99%.
- One of the means for increasing the parallel light transmittance is to contain no filler or 10% by mass or less.
- Such a surface sealing layer 28 is, for example, 1) after the step of applying and curing the aforementioned sealing material so as to cover the side surface of the organic EL element to form the first sealing layer 28A; 2) Organic It may be formed through a process of forming the second sealing layer 28B by applying and curing another sealing material so as to cover the upper surface of the EL element.
- the sealing material constituting the first sealing layer 28A can be applied by, for example, a dispenser method or an ink jet method; the sealing material constituting the second sealing layer 28B can be applied by a screen printing method or an ink jet method. Can be done.
- the organic EL device configured as described above, since the side surface of the organic EL element is covered with the cured material of the sealing material described above, the permeation of moisture and oxygen in the atmosphere can be highly suppressed. Moreover, since the upper surface of the organic EL element is covered with a cured product of another sealing material that does not contain a water-absorbing filler or filler, the organic EL element is damaged (scratched) by the water-absorbing filler or filler. It can be suppressed and transparency can be secured. That is, it is possible to achieve both low moisture permeability and transparency or scratch resistance.
- Example 1 A sealing material was prepared in the same manner as in Example 1 except that the hexahydrophthalic anhydride derivative (C ′) was not included and the composition ratio shown in Table 1 was used.
- Viscosity The viscosity of the sealing material at 25 ° C. and 1.0 rpm was measured with an E-type viscometer (digital rheometer model DII-III ULTRA manufactured by BROOKFIEL).
- permeability of the alkali free glass plate which is background data was subtracted, and the parallel light transmittance of the hardened
- the evaluation was performed with a parallel light transmittance at a wavelength of 400 nm.
- the obtained glass substrate with a metal calcium vapor deposition film was moved to a glove box in an N 2 atmosphere without being exposed to air. Subsequently, the sealing materials prepared in Examples and Comparative Examples were dropped on a separately prepared acetone-washed glass substrate (25 ⁇ 55 mm, thickness: 2 mm) so as to have a cured thickness of 100 ⁇ m, and then dried. A coating film was formed (see FIG. 1B).
- a glass substrate with a coating film of a sealing material and a glass substrate with a metal calcium vapor deposition film were bonded together to form a laminate, and fixed with clips.
- the thickness of the obtained laminate was adjusted by sandwiching a Teflon (registered trademark) sheet having a thickness of 100 ⁇ m as a spacer between a glass substrate with a coating film of a sealing material and a glass substrate with a vapor deposition film of metallic calcium.
- the length L ′ from the end of the metal calcium vapor deposition film to the end of the coating film of the sealing material was also 4 mm (see FIG. 1C).
- the laminate was heated in an oven at 100 ° C. for 30 minutes to cure the sealing material to obtain a sample.
- the cured sealing material was in the form of a film.
- Ca reaction start time The obtained sample was stored at 60 ° C. and 90% RH in a constant temperature and humidity chamber. And the time (Ca reaction start time, unit: time) until the edge part of the vapor deposition film
- the sealing material was heated and cured at 100 ° C. for 30 minutes to obtain a cured product having a thickness of 100 ⁇ m.
- the cured product of the obtained sheet material was cut out to 10 mm ⁇ 30 mm and used as a sample.
- the sample was attached to an universal testing machine manufactured by Intesco with a distance between chucks of 30 mm, and the test was performed at a starting load of 10 N and a tensile speed of 30 mm / min.
- the elastic modulus was calculated from the slope of the straight line portion of the stress-strain curve with the vertical axis representing stress and the horizontal axis representing strain.
- the structure (acid anhydride group) derived from the hexahydrophthalic anhydride derivative (C ′) was uniformly contained in the cured product of the sealing material, so that moisture entering from the cured product side surface of the sealing material was effectively captured. It is guessed.
- the sealing material of Example 1 had a sufficiently low elastic modulus of 17 MPa.
- the hexahydrophthalic anhydride derivative (C ′) has a functional group capable of radical polymerization, and is polymerized with a polymerizable monomer (B), a polymerizable functional group-containing olefin polymer (A), etc. when the sealing material is cured. For this reason, it is surmised that the crosslink density of the cured product of the sealing material did not increase excessively, and the elastic modulus decreased appropriately.
- the sealing material of Comparative Example 2 had a short Ca reaction start time despite containing 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride. It is surmised that 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride bleeded out from the cured material of the sealing material, so that water could not be captured sufficiently.
- the elastic modulus of the cured material of the sealing materials of Comparative Example 1 and Comparative Example 2 was 38 MPa or more. It is assumed that the crosslink density of the polymerizable functional group-containing olefin polymer (A) and the polymerizable monomer (B) was high.
- B2 a compound represented by the following formula (B2) as the polymerizable monomer (B)
- C ′ hexahydrophthalic anhydride derivative
- C1 t-amylperoxy-2-e
- Example 3 Sealing was performed in the same manner as in Example 2 except that 2,2′-azobis-2-methylbutyronitrile represented by the following formula (D2) was used instead of t-amylperoxy-2-ethylhexanoate. A material was prepared.
- Example 4 Example 2 except that 2-hydroxy-2-methyl-1-phenyl-propan-1-one represented by the following formula (D3) was used instead of t-amylperoxy-2-ethylhexanoate Similarly, a sealing material was prepared.
- the Ca reaction start time was very long. Since the hexahydrophthalic anhydride derivative (C ′) has a radical polymerizable functional group, it is polymerized with the polymerizable monomer (B) when the sealing material is cured, and the hexahydrophthalic anhydride derivative (C ′) is added to the cured material of the sealing material. ) Derived structure (acid anhydride group) is uniformly contained, and it is assumed that moisture entering from the side of the cured product of the sealing material was effectively captured. The Ca reaction start time did not change even when heat treatment was performed. Since the hexahydrophthalic anhydride derivative (C ′) is polymerized with the polymerizable monomer (B), it is presumed that bleeding did not occur.
- the sealing materials of Comparative Examples 3 to 5 had a short Ca reaction start time despite containing 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride. It is surmised that 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride bleeded out from the cured material of the sealing material, so that water could not be captured sufficiently.
- the sealing material containing the epoxy resin of Comparative Example 6 had a long Ca reaction start time, that is, the moisture permeability was very low, but the viscosity was very high and the parallel line transmittance was low.
- the sealing materials of Examples 2 to 4 had a low viscosity and could be applied by, for example, an ink jet method.
- the parallel light transmittance was as high as 98%.
- the cured product of the sealing material of the present invention has a low moisture permeability and a moderately low elastic modulus. Therefore, it can be applied to sealing layers of various optical devices.
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Abstract
Description
[1]ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、分子量が50以上1000以下であり、23℃で液状である重合性モノマー(B)と、5員環または6員環を構成する酸無水物基及びラジカル重合可能な官能基を1分子当たりに少なくとも1つ含む酸無水物誘導体(C)と、熱ラジカル重合開始剤及び光ラジカル重合開始剤の少なくとも一方を含むラジカル重合開始剤(D)と、を含む、シール材。
[3]E型粘度計により25℃、1.0rpmで測定される粘度が5mPa・s以上20000mPa・s以下である、[1]または[2]に記載のシール材。
[5]前記重合性官能基含有オレフィン系ポリマー(A)が有する前記ラジカル重合可能な官能基が、(メタ)アクリル基、ビニル基、アリル基、ビニルエーテル基からなる群から選ばれる1種類以上の官能基である、[2]~[4]のいずれかに記載のシール材。
[6]前記酸無水物誘導体(C)が、ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有するヘキサヒドロ無水フタル酸誘導体(C’)である、[1]~[5]のいずれかに記載のシール材。
[7]上記[1]~[6]のいずれかに記載のシール材から得られるシート状シール材。
[8]上記[1]~[6]のいずれかに記載のシール材の硬化物。
[9]弾性率が0.1MPa以上100MPa以下である、[2]~[6]のいずれかに記載のシール材の硬化物。
[10]波長400nmにおける平行光線透過率が90%以上である、[8]に記載のシール材の硬化物。
[11]波長400nmにおける平行光線透過率が90%以上である、[9]に記載のシール材の硬化物。
[12]ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、数平均分子量5000以上70000以下である重合性官能基含有オレフィン系ポリマー(A)と、ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有するヘキサヒドロ無水フタル酸誘導体(C’)と、熱ラジカル重合開始剤及び光ラジカル重合開始剤の少なくとも一方を含むラジカル重合開始剤(D)と、を含む、シール材。
本発明のシール材は、有機ELデバイス等、各種デバイスの封止層形成に用いられる組成物である。シール材の組成は、その目的に応じて適宜選択される。例えば、厚みの薄い封止層を形成する場合等には、重合性モノマー(B)、酸無水物誘導体(C)、及びラジカル重合開始剤(D)を含むシール材とする。このとき、シール材には、必要に応じて重合性官能基含有オレフィン系ポリマー(A)を含んでもよい。一方、弾性率の低い封止層を形成する場合等には、重合性官能基含有オレフィン系ポリマー(A)、酸無水物誘導体(C)、及びラジカル重合開始剤(D)を含むシール材とする。このとき、必要に応じて、重合性モノマー(B)を含んでもよい。
重合性官能基含有オレフィン系ポリマー(A)は、ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、かつ数平均分子量が5000以上70000以下であるオレフィン系のポリマーである。
重合性モノマー(B)は、ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、分子量が50以上1000以下であり、23℃で液状である化合物である。シール材に重合性モノマー(B)が含まれると、シール材の粘度が低くなりやすく、さらにシール材の硬化物の架橋密度が高まる。なお、重合性モノマー(B)には、後述の酸無水物誘導体(C)に相当するものは含まないものとする。
酸無水物誘導体(C)は、ラジカル重合可能な官能基を1分子当たり少なくとも1つと、5員環または6員環を構成する酸無水物基と、を有する化合物であり、例えば各種酸無水物に、ラジカル重合可能な官能基が結合した化合物でありうる。酸無水物誘導体(C)の1分子当たりに含まれるラジカル重合可能な官能基の数は1以上であればよいが、好ましくは1である。酸無水物誘導体(C)にラジカル重合可能な官能基が含まれると、シール材の硬化時に、前述の重合性モノマー(B)や、重合性官能基含有オレフィン系ポリマー(A)と酸無水物誘導体(C)とが重合し、酸無水物誘導体(C)のブリードアウトが抑制される。
ラジカル重合開始剤(D)は、加熱もしくは光照射によって、上記重合性官能基含有オレフィン系ポリマー(A)、酸無水物誘導体(C)、または重合性モノマー(B)をラジカル重合させるための化合物である。ラジカル重合開始剤(D)は、光ラジカル重合開始剤であってもよく、熱ラジカル重合開始剤であってもよい。シール材に含まれるラジカル重合開始剤(D)の種類は、シール材の硬化方法に応じて適宜選択され、シール材にはいずれか一方のみが含まれてもよく、両方が含まれてもよい。
シール材には、本発明の効果を大きくは損なわない範囲において、その他の樹脂が含まれてもよい。その他の樹脂は、例えば熱硬化性樹脂等でありうる。熱硬化性樹脂の例には、エポキシ樹脂、フェノール樹脂、ジアリルフタレート樹脂、ユリア樹脂、ポリエステル樹脂等が含まれる。熱硬化性樹脂は、シール材に1種のみ含まれてもよく、2種以上含まれてもよい。
前述のように、本発明のシール材の組成は、シール材の組成に応じて適宜選択される。例えば、シール材をインクジェットから吐出して使用する場合には、シール材の粘度が低いことが好ましい。したがって、前述の重合性モノマー(B)、酸無水物誘導体(C)、及びラジカル重合開始剤(D)を少なくとも含む組成とすることが好ましい。
なお、当該シール材には、必要に応じて重合性官能基含有ポリマー(A)をシール材の総量に対して1~10質量%含んでもよい。
本発明のシール材の、E型粘度計により25℃、1.0rpmで測定される粘度は、5~20000mPa・sであることが好ましい。シール材の粘度が上記範囲であると、シール材の塗工性(例えばスクリーン印刷性やインクジェット印刷性)が高まり、塗布が容易になる。シール材の粘度は、例えば東機産業製 RC-500のE型粘度計等で測定される。
本発明のシール材は、本発明の効果を損なわない限り、任意の方法で製造される。例えば、1)重合性官能基含有オレフィン系ポリマー(A)、重合性モノマー(B)、酸無水物誘導体(C)、及び重合開始剤(D)等を準備する工程と、2)不活性ガス環境下で、各成分を30℃以下で混合する工程等を経て製造される。混合は、これらの成分をボールミルで分散する方法、フラスコに装入して攪拌する方法や、三本ロールで混練する方法が含まれる。
本発明のシール材の硬化物の透湿度は、できるだけ低いことが好ましい。即ち、以下の方法で測定される、60℃90%RH下でのCa反応開始時間は、好ましくは24時間以上である。Ca反応開始時間が長いほど、硬化物の透湿度が低いことを意味する。
1)サンプルの作製
図1Aに示されるように、アセトンに浸漬して、超音波洗浄を10分間行ったガラス基板2(大きさ:25×25mm、厚さ:0.7mm)を準備する。このガラス基板2上に、蒸着機(エイ・エル・エステクノロジー社製)を用いて、下記条件で、厚さ170nmの金属カルシウムの蒸着膜4を形成する。蒸着用マスクを使用し、金属カルシウムの蒸着膜4の端部からガラス基板2の端部までの長さLが4mmとなるように調整する。
(蒸着条件)
蒸着時の真空度:3.0×10-5Pa
製膜速度:1.2Å/秒
金属カルシウム原料:高純度化学製、グレイン
得られたサンプルを、恒温恒湿槽にて60℃90%RH下で保存する。そして、金属カルシウムの蒸着膜の端部が、金属光沢から透明に変化するまでの時間(Ca反応開始時間)を測定する。即ち、金属カルシウム(金属光沢)と水が反応すると、透明な水酸化カルシウムCa(OH)2に変化する。Ca反応開始時間が長いほど、金属カルシウムと水の反応が起こりにくく、透湿度が低いことを意味する。
一般的に、有機ELデバイスは、基板上に配置された有機EL素子と、基板と対になる封止基板と、基板と封止基板との間に配置され、有機EL素子を覆う(面封止)する封止層とを含む。封止層の一部または全部を、前述のシール材の硬化物としうる。また、本発明のシール材の硬化物は、前述の通り透湿度が低いため、有機EL素子を完全に覆っていない場合や、本発明のシール材の硬化物と、有機EL素子との間に他の部材が介在している場合でも、有機EL素子を水分から保護しうる。さらに、封止基板を設けない構造の有機ELデバイスでも、本発明のシール材の硬化物は有機EL素子を水分から保護する封止材として使用できる。本発明のシール材の硬化物を、有機EL素子を水分から保護する封止材として用いる際、有機ELデバイスの構造は限定されない。有機ELデバイスは、有機ELディスプレイパネルや有機EL照明などでありうる。
重合性官能基含有ポリオレフィン系ポリマー(A)として下記式(A1)で表される化合物(クラプレン(登録商標)UC-102、クラレ社製、数平均分子量17000、1分子中のラジカル重合可能な平均官能基数=2)を54質量部;重合性モノマー(B)として下記式(B1)で表されるジシクロペンテニルオキシエチルアクリレート(FA-512AS、日立化成工業社製)を46質量部;酸無水物誘導体(C)として下記式(C1)で表されるヘキサヒドロ無水フタル酸誘導体(C’)(4-META-H、日本化成社製)を10質量部;ラジカル重合開始剤として、下記式(D1)で表されるt-アミルパーオキシ-2-エチルヘキサノエート(ルペロックス575、アルケマ吉富社製)を5質量部;混合してシール材を調製した。
ヘキサヒドロ無水フタル酸誘導体(C’)を含まず、表1に示される組成比とした以外は、実施例1と同様にシール材を調製した。
ヘキサヒドロ無水フタル酸誘導体(C’)の代わりに、新日本理化製、リカシッドMH700(4-メチルヘキサヒドロ無水フタル酸/ヘキサヒドロ無水フタル酸(質量比=70/30)の混合物)を使用し、かつ表1に示される組成比とした以外は、実施例1と同様にシール材を調製した。
各実施例及び比較例で調製したシール材の粘度を測定した。さらに、以下の方法で、シール材の硬化物の光線透過率、透湿度、弾性率を測定した。結果を表1に示す。
E型粘度計(BROOKFIEL社製のデジタルレオメータ型式DII-III ULTRA)にて、25℃、1.0rpmにおけるシール材の粘度を測定した。
バックグラウンドデータとして、無アルカリガラス板の190nm~800nmの波長領域(可視・紫外光)の平行光線透過率を、紫外可視光分光光度計(島津製作所 UV-2550)を用いて測定した。
上記と同一の無アルカリガラス板2枚でシール材を挟み、無アルカリガラス板の端部にテフロンシート(厚み100μm)を挟み込むことで、無アルカリガラス板2枚に挟まれたシール材の厚みを100μmとした。これを100℃で30分加熱して硬化させ、厚さ100μmのシール材の硬化物を得た。
紫外可視光分光光度計(島津製作所 UV-2550)にて、2枚の無アルカリガラス板で挟まれたシール材の硬化物の190nm~800nmの波長領域の平行光線透過率を測定した。なお、テフロンシートはガラス板の端部に配置したため、測定結果には影響を及ぼさない。
そして、シール材の硬化物の光線透過率測定結果から、バックグラウンドデータである無アルカリガラス板の透過率を減算し、シール材の硬化物の平行光線透過率を算出した。
評価は波長400nmの平行光線透過率で行った。
1)サンプルの作製
アセトンに浸漬して、超音波洗浄を10分間行ったガラス基板(大きさ:25×25mm、厚さ:0.7mm)を準備した。このガラス基板上に、蒸着機(エイ・エル・エステクノロジー社製)を用いて、下記条件で、厚さ170nmの金属カルシウムの蒸着膜を形成した(図1A参照)。蒸着時にはマスクを使用し、金属カルシウムの蒸着膜の端部からガラス基板の端部までの長さLは4mmとした。
蒸着時の真空度:3.0×10-5Pa
製膜速度:1.2Å/秒
金属カルシウム原料:高純度化学製、グレイン
得られたサンプルを、恒温恒湿槽にて、60℃90%RH下で保存した。そして、金属カルシウムの蒸着膜の端部が、金属光沢から透明に変化するまでの時間(Ca反応開始時間、単位:時間)を測定した。Ca法では、フィルム状のシール材の硬化物の側面方向からの透湿度を評価する。そして、Ca反応開始時間が24時間以上である場合は○、24時間未満である場合は×とした。
シール材を100℃で30分加熱して硬化させて、厚み100μmの硬化物を得た。得られたシート材の硬化物を、10mm×30mmに切り出し、試料とした。インテスコ社製万能引張試験機に、試料をチャック間距離30mmで取り付け、開始荷重10N、引張速度30mm/分にて試験を行った。縦軸に応力、横軸にひずみをとった応力ひずみ曲線の直線部の傾きより、弾性率を算出した。
重合性モノマー(B)として下記式(B2)で表される化合物(FA-124AS、日立化成社製、数平均分子量198、1分子中のラジカル重合可能な平均官能基数=2)を80質量部;酸無水物誘導体(C)として前述の式(C1)で表されるヘキサヒドロ無水フタル酸誘導体(C’)(4-META-H、日本化成社製)を20質量部;ラジカル重合開始剤として、前述の式(D1)で表されるt-アミルパーオキシ-2-エチルヘキサノエート(ルペロックス575、アルケマ吉富社製)を5質量部;混合してシール材を調製した。
t-アミルパーオキシ-2-エチルヘキサノエートの代わりに下記式(D2)で表される2,2’-アゾビス-2-メチルブチロニトリルを使用した以外は、実施例2と同様にシール材を調製した。
t-アミルパーオキシ-2-エチルヘキサノエートの代わりに下記式(D3)で表される2-ヒドロキシ-2-メチル-1フェニル-プロパン-1-オンを使用した以外は、実施例2と同様にシール材を調製した。
ヘキサヒドロ無水フタル酸誘導体(C’)の代わりに、新日本理化製、リカシッドMH700(4-メチルヘキサヒドロ無水フタル酸/ヘキサヒドロ無水フタル酸(質量比=70/30)の混合物)を使用した以外は、実施例2と同様にシール材を調製した。
t-アミルパーオキシ-2-エチルヘキサノエートの代わりに式(D2)で表される2,2’-アゾビス-2-メチルブチロニトリルを使用した以外は、比較例3と同様にシール材を調製した。
t-アミルパーオキシ-2-エチルヘキサノエートの代わりに式(D3)で表される2-ヒドロキシ-2-メチル-1フェニル-プロパン-1-オンを使用した以外は、比較例3と同様にシール材を調製した。
エポキシ樹脂(クレゾールノボラック型EPICLON(登録商標)N-680、エポキシ当量200-220(g/eq)、DIC社製)50質量部、高純度液状エポキシ樹脂(ビスFタイプ、YL983U0、エポキシ当量165-175(g/eq)、三菱化学社製)50質量部:シリカフィラー(アドマファイン SO-C6、アドマテックス社製)100質量部:光カチオン開始剤R2074(ローヌ・プーラン社製)3質量部;混合してシール材を調製した。
・平行光線透過率
無アルカリガラス板2枚で挟んだシール材を、熱硬化の場合は80℃で30分加熱して硬化させ、UV硬化の場合は波長365nmの光を3000mJ/cm2照射して硬化させて、厚さ100μmのシール材の硬化物を得た以外は、前述(実施例1等)の平行光線透過率の測定方法と同様に測定した。
前述(実施例1等)の方法と同様に透湿度(Ca)を測定した。さらに測定サンプルを、100℃で30分間加熱処理し、上記と同様に透湿度を評価した。
本出願は、2014年5月2日出願の特願2014-094957号に基づく優先権を主張する。当該出願明細書および図面に記載された内容は、すべて本願明細書に援用される。
22 基板
24 有機EL素子
26 封止基板
28 面封止層
28-1 硬化物層
28-2 パッシベーション層
28-3 第2の樹脂硬化物層
28A 第一の封止層
28B 第二の封止層
Claims (12)
- ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、分子量が50以上1000以下であり、23℃で液状である重合性モノマー(B)と、
5員環または6員環を構成する酸無水物基、及びラジカル重合可能な官能基を1分子当たりに少なくとも1つ含む酸無水物誘導体(C)と、
熱ラジカル重合開始剤及び光ラジカル重合開始剤の少なくとも一方を含むラジカル重合開始剤(D)と、を含む、シール材。 - ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、数平均分子量が5000以上70000以下である重合性官能基含有オレフィン系ポリマー(A)をさらに含む、請求項1に記載のシール材。
- E型粘度計により25℃、1.0rpmで測定される粘度が5mPa・s以上20000mPa・s以下である、請求項1に記載のシール材。
- 前記重合性モノマー(B)及び前記酸無水物誘導体(C)が有する前記ラジカル重合可能な官能基が、それぞれ独立に、(メタ)アクリル基、ビニル基、アリル基、ビニルエーテル基からなる群から選ばれる1種類以上の官能基である、請求項1に記載のシール材。
- 前記重合性官能基含有オレフィン系ポリマー(A)が有する前記ラジカル重合可能な官能基が、(メタ)アクリル基、ビニル基、アリル基、ビニルエーテル基からなる群から選ばれる1種類以上の官能基である、請求項2に記載のシール材。
- 前記酸無水物誘導体(C)が、ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有するヘキサヒドロ無水フタル酸誘導体(C’)である、請求項2に記載のシール材。
- 請求項1に記載のシール材から得られるシート状シール材。
- 請求項1に記載のシール材の硬化物。
- 弾性率が0.1MPa以上100MPa以下である、請求項2に記載のシール材の硬化物。
- 波長400nmにおける平行光線透過率が90%以上である、請求項8に記載のシール材の硬化物。
- 波長400nmにおける平行光線透過率が90%以上である、請求項9に記載のシール材の硬化物。
- ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有し、数平均分子量5000以上70000以下である重合性官能基含有オレフィン系ポリマー(A)と、
ラジカル重合可能な官能基を1分子当たりに少なくとも1つ有するヘキサヒドロ無水フタル酸誘導体(C’)と、
熱ラジカル重合開始剤及び光ラジカル重合開始剤の少なくとも一方を含むラジカル重合開始剤(D)と、を含む、シール材。
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