WO2010035502A1 - 封止剤および封止部材、ならびに有機elデバイス - Google Patents
封止剤および封止部材、ならびに有機elデバイス Download PDFInfo
- Publication number
- WO2010035502A1 WO2010035502A1 PCT/JP2009/004943 JP2009004943W WO2010035502A1 WO 2010035502 A1 WO2010035502 A1 WO 2010035502A1 JP 2009004943 W JP2009004943 W JP 2009004943W WO 2010035502 A1 WO2010035502 A1 WO 2010035502A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic
- group
- silane coupling
- coupling agent
- sealing
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 89
- 239000000565 sealant Substances 0.000 title claims abstract description 59
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 53
- 150000003138 primary alcohols Chemical class 0.000 claims abstract description 40
- -1 siloxane compound Chemical class 0.000 claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 27
- 125000003700 epoxy group Chemical group 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 125000000962 organic group Chemical group 0.000 claims description 16
- 239000012948 isocyanate Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000007795 chemical reaction product Substances 0.000 claims description 11
- 150000002430 hydrocarbons Chemical group 0.000 claims description 11
- 150000008065 acid anhydrides Chemical class 0.000 claims description 10
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 8
- 125000000524 functional group Chemical group 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000047 product Substances 0.000 claims description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 125000004018 acid anhydride group Chemical group 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract description 8
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 abstract description 7
- 239000011342 resin composition Substances 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 description 22
- 238000009472 formulation Methods 0.000 description 19
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 125000003545 alkoxy group Chemical group 0.000 description 15
- 239000007789 gas Substances 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005401 electroluminescence Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 150000003509 tertiary alcohols Chemical class 0.000 description 3
- JRGQKLFZSNYTDX-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)propyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCOCC1CO1 JRGQKLFZSNYTDX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000003333 secondary alcohols Chemical class 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical group C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- TZJDSQVHVIJEFA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl-tri(propan-2-yloxy)silane Chemical compound C1C(CC[Si](OC(C)C)(OC(C)C)OC(C)C)CCC2OC21 TZJDSQVHVIJEFA-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- YSHRTXBTHVBWTL-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)butoxy]ethanol Chemical compound OCCOCC(CC)OCC1CO1 YSHRTXBTHVBWTL-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- LUSCNZBJFBNVDT-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxy)cyclohexyl]oxymethyl]oxirane Chemical compound C1OC1COC1(OCC2OC2)CCCCC1 LUSCNZBJFBNVDT-UHFFFAOYSA-N 0.000 description 1
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
- PLDLPVSQYMQDBL-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethoxy)-2,2-bis(oxiran-2-ylmethoxymethyl)propoxy]methyl]oxirane Chemical compound C1OC1COCC(COCC1OC1)(COCC1OC1)COCC1CO1 PLDLPVSQYMQDBL-UHFFFAOYSA-N 0.000 description 1
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 1
- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- XYXBMCIMPXOBLB-UHFFFAOYSA-N 3,4,5-tris(dimethylamino)-2-methylphenol Chemical compound CN(C)C1=CC(O)=C(C)C(N(C)C)=C1N(C)C XYXBMCIMPXOBLB-UHFFFAOYSA-N 0.000 description 1
- XKQXZSHRPUFBSW-UHFFFAOYSA-N 3-[tris[(2-methylpropan-2-yl)oxy]silyl]propan-1-amine Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)CCCN XKQXZSHRPUFBSW-UHFFFAOYSA-N 0.000 description 1
- WALYBSCHCQWCPC-UHFFFAOYSA-N 3-[tris[(2-methylpropan-2-yl)oxy]silyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C WALYBSCHCQWCPC-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- CYYLVEIVOYAWNN-UHFFFAOYSA-N 3-tri(butan-2-yloxy)silylpropan-1-amine Chemical compound NCCC[Si](OC(C)CC)(OC(C)CC)OC(C)CC CYYLVEIVOYAWNN-UHFFFAOYSA-N 0.000 description 1
- WCZOJLBQHTXIPU-UHFFFAOYSA-N 3-tri(butan-2-yloxy)silylpropane-1-thiol Chemical compound CCC(C)O[Si](CCCS)(OC(C)CC)OC(C)CC WCZOJLBQHTXIPU-UHFFFAOYSA-N 0.000 description 1
- MVLLZVWCFBDVHW-UHFFFAOYSA-N 3-tri(butan-2-yloxy)silylpropyl 2-methylprop-2-enoate Chemical compound CCC(C)O[Si](OC(C)CC)(OC(C)CC)CCCOC(=O)C(C)=C MVLLZVWCFBDVHW-UHFFFAOYSA-N 0.000 description 1
- OXKAXHPVFLEQHV-UHFFFAOYSA-N 3-tri(propan-2-yloxy)silylpropan-1-amine Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCN OXKAXHPVFLEQHV-UHFFFAOYSA-N 0.000 description 1
- CJUFQURUUZMUOG-UHFFFAOYSA-N 3-tri(propan-2-yloxy)silylpropane-1-thiol Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCS CJUFQURUUZMUOG-UHFFFAOYSA-N 0.000 description 1
- ICHAUYNXFWOLPC-UHFFFAOYSA-N 3-tributoxysilylpropane-1-thiol Chemical compound CCCCO[Si](CCCS)(OCCCC)OCCCC ICHAUYNXFWOLPC-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- UQSWIDYXDCJEJD-UHFFFAOYSA-N C(C1CO1)OCCC[Si](OC(C)(C)C)(OC(C)(C)C)C Chemical compound C(C1CO1)OCCC[Si](OC(C)(C)C)(OC(C)(C)C)C UQSWIDYXDCJEJD-UHFFFAOYSA-N 0.000 description 1
- ISCZYXBKPZXTOP-UHFFFAOYSA-N C(C1CO1)OCCC[Si](OC(C)C)(OC(C)C)C.C(C1CO1)OCCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C Chemical compound C(C1CO1)OCCC[Si](OC(C)C)(OC(C)C)C.C(C1CO1)OCCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C ISCZYXBKPZXTOP-UHFFFAOYSA-N 0.000 description 1
- OHMYOXJUBIQYLW-UHFFFAOYSA-N Cl[SiH](Cl)Cl.C(C1CO1)OCCC[Si](OC(C)C)(OC(C)C)OC(C)C Chemical compound Cl[SiH](Cl)Cl.C(C1CO1)OCCC[Si](OC(C)C)(OC(C)C)OC(C)C OHMYOXJUBIQYLW-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WKZKYXNMTSBAOY-UHFFFAOYSA-N N'-[3-[di(butan-2-yloxy)-methylsilyl]propyl]ethane-1,2-diamine Chemical compound NCCNCCC[Si](OC(C)CC)(OC(C)CC)C WKZKYXNMTSBAOY-UHFFFAOYSA-N 0.000 description 1
- JYHJIEJIKIFYCX-UHFFFAOYSA-N N'-[3-[methyl-bis[(2-methylpropan-2-yl)oxy]silyl]propyl]ethane-1,2-diamine Chemical compound NCCNCCC[Si](OC(C)(C)C)(OC(C)(C)C)C JYHJIEJIKIFYCX-UHFFFAOYSA-N 0.000 description 1
- HYASYXVSXKWGJE-UHFFFAOYSA-N N'-[4-methyl-4-[methyl-di(propan-2-yloxy)silyl]oxypentyl]ethane-1,2-diamine Chemical compound NCCNCCCC(C)(C)O[Si](OC(C)C)(OC(C)C)C HYASYXVSXKWGJE-UHFFFAOYSA-N 0.000 description 1
- BPJRVOHRQYCNSK-UHFFFAOYSA-N N'-[5-[di(butan-2-yloxy)-methylsilyl]oxyheptyl]ethane-1,2-diamine Chemical compound NCCNCCCCC(CC)O[Si](OC(C)CC)(OC(C)CC)C BPJRVOHRQYCNSK-UHFFFAOYSA-N 0.000 description 1
- WRZRZPJGICSKJT-UHFFFAOYSA-N N'-[5-methyl-5-[methyl-bis[(2-methylpropan-2-yl)oxy]silyl]oxyhexyl]ethane-1,2-diamine Chemical compound NCCNCCCCC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C WRZRZPJGICSKJT-UHFFFAOYSA-N 0.000 description 1
- DDOGIJDTOCFCRS-UHFFFAOYSA-N N'-benzyl-N'-ethenyl-N-[3-[tris[(2-methylpropan-2-yl)oxy]silyl]propyl]ethane-1,2-diamine hydrochloride Chemical compound Cl.C(=C)N(CCNCCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)CC1=CC=CC=C1 DDOGIJDTOCFCRS-UHFFFAOYSA-N 0.000 description 1
- MGUJJAYNCSCCDR-UHFFFAOYSA-N N'-benzyl-N'-ethenyl-N-[3-tri(butan-2-yloxy)silylpropyl]ethane-1,2-diamine hydrochloride Chemical compound Cl.C(=C)N(CCNCCC[Si](OC(C)CC)(OC(C)CC)OC(C)CC)CC1=CC=CC=C1 MGUJJAYNCSCCDR-UHFFFAOYSA-N 0.000 description 1
- ISHYPVOQXRYFRK-UHFFFAOYSA-N N'-benzyl-N'-ethenyl-N-[3-tri(propan-2-yloxy)silylpropyl]ethane-1,2-diamine hydrochloride Chemical compound Cl.C(=C)N(CCNCCC[Si](OC(C)C)(OC(C)C)OC(C)C)CC1=CC=CC=C1 ISHYPVOQXRYFRK-UHFFFAOYSA-N 0.000 description 1
- PRJLKHBZRBYOSG-UHFFFAOYSA-N N-[3-tri(butan-2-yloxy)silylpropyl]aniline Chemical compound C1(=CC=CC=C1)NCCC[Si](OC(C)CC)(OC(C)CC)OC(C)CC PRJLKHBZRBYOSG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- UHVCSNKHFBQKBO-UHFFFAOYSA-N benzyl-ethenyl-[2-(3-trimethoxysilylpropylamino)ethyl]azanium;chloride Chemical compound Cl.CO[Si](OC)(OC)CCCNCCN(C=C)CC1=CC=CC=C1 UHVCSNKHFBQKBO-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- CUGMPPOIEQHHSP-UHFFFAOYSA-N di(butan-2-yloxy)-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCC(C)O[Si](C)(OC(C)CC)CCCOCC1CO1 CUGMPPOIEQHHSP-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- BQRPSOKLSZSNAR-UHFFFAOYSA-N ethenyl-tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C=C BQRPSOKLSZSNAR-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- VPVUJLOXHZTLKK-UHFFFAOYSA-N n'-[3-[methyl-di(propan-2-yloxy)silyl]propyl]ethane-1,2-diamine Chemical compound CC(C)O[Si](C)(OC(C)C)CCCNCCN VPVUJLOXHZTLKK-UHFFFAOYSA-N 0.000 description 1
- IFZUFHWISBKFJP-UHFFFAOYSA-N n'-[4-[dimethoxy(methyl)silyl]oxybutyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)OCCCCNCCN IFZUFHWISBKFJP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- BJBOYMSSGHXAFF-UHFFFAOYSA-N n-[3-tri(propan-2-yloxy)silylpropyl]aniline Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCNC1=CC=CC=C1 BJBOYMSSGHXAFF-UHFFFAOYSA-N 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- AKLJIUURIIIOLU-UHFFFAOYSA-N silane 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound [SiH4].CO[Si](OC)(OC)CCCOC(=O)C(C)=C AKLJIUURIIIOLU-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- VVEMUMZHQQNXEV-UHFFFAOYSA-N tri(butan-2-yloxy)-[2-(7-oxabicyclo[4.1.0]heptan-3-yl)ethyl]silane Chemical compound C1(CC2C(CC1)O2)CC[Si](OC(C)CC)(OC(C)CC)OC(C)CC VVEMUMZHQQNXEV-UHFFFAOYSA-N 0.000 description 1
- BCRRSELDRACECI-UHFFFAOYSA-N tri(butan-2-yloxy)-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCC(C)O[Si](OC(C)CC)(OC(C)CC)CCCOCC1CO1 BCRRSELDRACECI-UHFFFAOYSA-N 0.000 description 1
- MHQDJCZAQGWXBC-UHFFFAOYSA-N tri(butan-2-yloxy)-ethenylsilane Chemical compound CCC(C)O[Si](OC(C)CC)(OC(C)CC)C=C MHQDJCZAQGWXBC-UHFFFAOYSA-N 0.000 description 1
- MQVCTPXBBSKLFS-UHFFFAOYSA-N tri(propan-2-yloxy)-propylsilane Chemical compound CCC[Si](OC(C)C)(OC(C)C)OC(C)C MQVCTPXBBSKLFS-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- GDNZEYFPHPHLOA-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)CCC2OC21 GDNZEYFPHPHLOA-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/872—Containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a sealant and a sealing member, and an organic EL device sealed with them.
- the sealing member is required to have higher heat resistance, lower shrinkage during curing, transparency, and moisture permeability.
- sealants to which fillers and silane coupling agents are added have been developed.
- JP-A-5-36475 JP-A-5-89959 JP 7-169567 A Japanese Patent Laid-Open No. 11-74074
- An object of the present invention is to suppress deterioration with time of an organic electroluminescent element and maintain initial performance.
- the present inventor has found that one of the main causes of deterioration with time of an organic electroluminescent device is a primary alcohol among gases generated inside the device. And it discovered that the main generation source of primary alcohol was the sealing member of an organic electroluminescent element. In particular, it has been found that there is a cause in the silane coupling agent contained in the sealant.
- the present invention provides a sealing member having an extremely low primary alcohol concentration in the sealing member of an organic EL device despite containing an organic siloxane compound. Accordingly, it is an object to suppress the deterioration of the organic electroluminescent element having the sealing member and achieve a long life. Further, the present invention provides a sealing agent for providing such a sealing member, that is, a sealing agent that suppresses the generation of primary alcohol, absorbs the generated primary alcohol, or reacts with the primary alcohol to be primary. A sealant that can be changed into a substance other than alcohol is provided.
- the first of the present invention relates to a sealant.
- the sealing agent according to [1] including a silane coupling agent or / and a reaction product of a silane coupling agent.
- R 14 , R 14 ′ and R 14 ′′ each represents a monovalent organic group other than an oxy group; n represents an integer of 1 or more, and n is 2 or more In some cases, two or more of R 12 , R 14 and R 14 ′ may be the same or different from each other) (In the general formula (4), R 15 represents a hydrogen atom or a hydrocarbon group) [7]
- the sealant according to [6], wherein the compound that adsorbs or reacts with the alcohol is an isocyanate compound.
- Sealant. [10] The sealant according to [9], wherein the curable resin is a thermosetting resin.
- the sealant according to [10], wherein the thermosetting resin is an epoxy resin.
- the second of the present invention relates to a sealing member.
- produced by doing is 10 micrograms or less.
- the third of the present invention relates to an organic EL device, a manufacturing method thereof, and the like.
- An organic EL device comprising: an organic EL element; and a cured product of the sealant according to [1] that is in contact with the organic EL element.
- An organic EL device comprising the sealing member according to [14].
- An organic EL display panel comprising the organic EL device according to [18] or [19].
- the sealing agent of the present invention provides an organic EL device with high sealing performance and long life.
- Sealant of the present invention is characterized in that the amount of primary alcohol generated by heating is reduced. Specifically, the amount of primary alcohol generated by heating 1 g of the sealing agent of the present invention at 100 ° C. for 60 minutes is preferably 10 ⁇ g or less, and more preferably 5 ⁇ g or less. The amount of primary alcohol generated by heating can be measured by the headspace GC-MS method.
- a sample bottle containing a sample is heated at a constant temperature to generate a volatile component from the sample and bring it into an equilibrium state; then, the volatile component is removed from the gas chromatograph-mass spectrometer (GC-). MS) to analyze the target component.
- GC- gas chromatograph-mass spectrometer
- the sample to be measured is heated with a headspace sampler at 100 ° C for 60 minutes, and the generated outgas component is qualitatively determined by the GC / MS method.
- the amount of outgas generated can be quantified in terms of toluene using the GC method.
- Headspace sampler measurement conditions (model: HP7694) Vial volume: 10 ml Loop volume: 1 ml Oven Temp: 100 ° C Loop Temp: 150 ° C TR LINE Temp: 150 ° C Gc Cycle Time: 50 minutes VIALEQ Time: 30 minutes Pressuriz Time: 0.13 minutes Loop Fill Time: 0.15 minutes Loop EQ Time: 0.15 minutes Inject Time: 10.
- the concentration of the primary alcohol in the sealing agent of the present invention is preferably 50 ppm by mass or less, and more preferably 10 ppm by mass or less.
- the concentration of the primary alcohol in the sealant may be measured by 13 C-NMR.
- the sealing agent of the present invention is characterized in that the amount of primary alcohol generated by heating and the concentration of primary alcohol are reduced.
- the primary alcohol has a boiling point at 1 atm ( bp) can be an alcohol of 120 ° C. or lower.
- the alcohol at 120 ° C. or lower includes methanol (65 ° C.), ethanol (78 ° C.), 1-propanol (97 ° C.), 1-butanol (117 ° C.) and the like.
- the sealing agent of the present invention contains one or both of a silane coupling agent and a reaction product of the silane coupling agent.
- the silane coupling agent is preferably an alkoxysilane.
- the reaction product of the silane coupling agent refers to a hydrolyzate or dehydration condensate of alkoxysilane.
- the silane coupling agent and the reaction product of the silane coupling agent are collectively referred to as a silane coupling agent.
- the silane coupling agent can enhance the adhesion between the base material to be sealed and the sealing agent.
- the content of the silane coupling agent contained in the sealant is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the resin constituting the sealant.
- an organic group other than one, two, or three oxy groups is bonded to the Si element of the alkoxysilane constituting the silane coupling agent.
- the organic group other than the oxy group preferably contains an epoxy group, an amino group, an acrylic group, or an isocyanate group. These can react with other components (resin components) contained in the sealant.
- the alkoxy group of the alkoxysilane that is the silane coupling agent contained in the sealing agent of the present invention may be a primary alkoxy group, a secondary alkoxy group, or a tertiary alkoxy group.
- a silane coupling agent having a primary alkoxy group can be a source of primary alcohol.
- the first embodiment of the silane coupling agent contained in the sealant of the present invention is an alkoxysilane having no secondary alkoxy group or tertiary alkoxy group without having a primary alkoxy group.
- the second aspect of the silane coupling agent contained in the sealant of the present invention is an alkoxysilane having a primary alkoxy group; in that case, the sealant of the present invention contains alcohol. It is also preferable to include components that absorb or react with alcohol to form other substances.
- the 1st aspect of the silane coupling agent contained in the sealing agent of this invention is an alkoxysilane which does not have a primary alkoxy group, for example, the following general formula (1), (1 ' ) Or (1 ′′).
- R 1 to R 3 each independently represent a group represented by the following general formula (2).
- R 5 in the general formula (2) is
- R 6 and R 7 each represents a hydrocarbon group, and the hydrocarbon group represented by R 5 to R 7 is an alkyl group having 1 to 4 carbon atoms. Preferably there is.
- the silane coupling agent represented by the general formula (1), (1 ′) or (1 ′′) generates R 1 OH, R 2 OH, or R 3 OH by hydrolysis. Or a tertiary alcohol, not a primary alcohol.
- R 4 , R 4 ′ and R 4 ′′ each represent a monovalent organic group, but are not oxy groups and do not generate alcohol upon hydrolysis. Furthermore, R 4 , R 4 ′ and R 4 ′′ Each may have an organic functional group.
- the organic functional group is preferably a functional group capable of reacting with the resin component contained in the sealant. This is because when the silane coupling agent and the resin component contained in the sealing material are bonded by reaction, the adhesion between the base material and the sealing material can be further increased. Moreover, it can also prevent that a silane coupling agent precipitates from a sealing agent by the said coupling
- R 4 , R 4 ′ or R 4 ′′ may have an epoxy group, an amino group, an acrylic group, an isocyanate group, a hydroxyl group, or the like.
- R 4 , R 4 ′ or R 4 ′′ has a vinyl group.
- n represents an integer of 1 or more, but is usually preferably 1 to 5.
- R 2 , R 4 and R 4 ′ present in two or more may be the same as or different from each other.
- alkoxysilanes having no primary alkoxy groups include 3-glycidoxypropyltriisopropoxysilane, 3-glycidoxypropyltri-2-butoxysilane, 3-glycidoxypropyltri-t-butoxysilane 3-glycidoxypropylmethyldiisopropoxysilane, 3-glycidoxypropylmethyldi-2-butoxysilane, 3-glycidoxypropylmethyldi-t-butoxysilane, 2- (3,4-epoxycyclohexyl) ethyl Triisopropoxysilane, 2- (3,4-epoxycyclohexyl) ethyltri-2-butoxysilane, 2- (3,4-epoxycyclohexyl) ethyltri-t-butoxysilane, N-phenyl- ⁇ -aminopropyltriisopropoxysilane, N-phenyl- ⁇ -aminopropyltri-2-butoxy
- the second aspect of the silane coupling agent contained in the sealant of the present invention is an alkoxysilane having a primary alkoxy group.
- alkoxysilane having a primary alkoxy group For example, the following general formula (3), (3 ′) or (3 ′′) Indicated by
- R 11 to R 13 each represent a monovalent organic group, one or more of which are groups represented by the general formula (4)
- R 15 is preferably a hydrogen atom or a hydrocarbon group
- the hydrocarbon group represented by R 15 is preferably an alkyl group having 1 to 4 carbon atoms.
- the organic group represented by R 11 to R 13 and not the group represented by the general formula (4) is preferably a hydrocarbon group having 1 to 4 carbon atoms.
- the silane coupling agent represented by the general formula (3), (3 ′) or (3 ′′) generates R 11 OH, R 12 OH, or R 13 OH by hydrolysis, and at least one of them is generated. Therefore, in order to reduce the amount of primary alcohol generated in the sealant, the concentration of the primary alcohol, etc., the sealant is combined with a component that absorbs or reacts with alcohol to form another substance. It is preferable to contain.
- R 14 , R 14 ′ and R 14 ′′ are the same as R 4 in the general formula (1) and represent a monovalent organic group, but are not an oxy group but a group which does not generate an alcohol by hydrolysis. Furthermore, R 14 , R 14 ′ and R 14 ′′ may have an organic functional group as in R 4 .
- n represents an integer of 1 or more, but is usually preferably 1 to 5.
- R 12 , R 14 and R 14 ′ present in two or more may be the same as or different from each other.
- alkoxysilanes having primary alkoxy groups include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N- Phenyl- ⁇ -aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyltrimethoxysilane, 3-aminopropyltri Alkoxy such as ethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) -3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltri
- the sealant of the present invention may contain a component that absorbs or reacts with alcohol, particularly primary alcohol.
- the sealant contains an alkoxysilane having a primary alkoxy group, the component is also preferably contained.
- components that absorb alcohol include isocyanate compounds.
- Isocyanate compounds readily react with alcohols, particularly primary alcohols, to form urethanes.
- the isocyanate compound may be alkyl isocyanate, aryl isocyanate, or polyisocyanate.
- the isocyanate compound contained in the encapsulant resin composition is preferably highly reactive with alcohol, so that it is an aromatic isocyanate compound (for example, 2,6-tolylene diisocyanate (TDI) rather than an aliphatic isocyanate compound.
- aromatic isocyanate compound for example, 2,6-tolylene diisocyanate (TDI) rather than an aliphatic isocyanate compound.
- TDI 2,6-tolylene diisocyanate
- MDI diisocyanate
- it is preferable not to volatilize an isocyanate compound it may be preferable to use a high molecular weight isocyanate compound.
- the content of the isocyanate compound contained in the resin composition for sealant if the amount (mole) of the primary alcohol contained in the sealing material is known, 1 to 2 equivalents of the isocyanate is added. In addition, when primary alcohol is generated from the silane coupling agent, it is preferable to add 1 to 2 times the maximum amount of isocyanate that may be generated.
- the sealant of the present invention preferably contains a resin component.
- the resin may be a curable resin, a thermoplastic resin, or both.
- Curable resin refers to a resin in which polymer chains are bonded to each other by a crosslinking reaction to form a three-dimensional crosslinked structure.
- examples of the curable resin include phenol resin, epoxy resin, urea resin, melamine resin, unsaturated polyester resin, polyurethane and the like.
- the curable resin contained in the sealant of the present invention is preferably an epoxy resin.
- the epoxy resin contains a compound having one or more epoxy groups in the molecule.
- the compound having an epoxy group may be a monofunctional epoxy compound, a bifunctional epoxy compound, or a three or more polyfunctional epoxy compound.
- Examples of monofunctional epoxy compounds include phenyl glycidyl ether, 2-ethylhexyl glycidyl ether, ethyl diethylene glycol glycidyl ether, dicyclopentadiene glycidyl ether, 2-hydroxyethyl glycidyl ether, and the like.
- bifunctional epoxy compounds include hydroquinone diglycidyl ether, resorcin diglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl Ether, cyclohexanediol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, dicyclopentadienediol diglycidyl ether, 1,6-naphthalenediol diglycidyl ether, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, hydrogenated bisphenol A di Examples include glycidyl ether and hydrogenated bisphenol F diglycidyl ether.
- Examples of the three or more polyfunctional epoxy compounds include trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, phenol novolac type epoxy, cresol novolac type epoxy and the like.
- the epoxy resin may contain a polymer or oligomer having an epoxy group.
- the polymer or oligomer having an epoxy group is not particularly limited, but can be obtained by polymerizing a vinyl monomer having an epoxy group.
- vinyl monomers having an epoxy group are preferably (meth) acrylate monomers such as glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, and methylglycidyl (meth) acrylate.
- the epoxy resin may be a copolymer or oligomer of a vinyl monomer having an epoxy group and another vinyl monomer.
- examples of other vinyl monomers include (meth) acrylates.
- the ester groups of (meth) acrylates are methyl, ethyl, isopropyl, normal butyl, isobutyl, tertiary butyl, 2-ethylhexyl, cyclohexyl, benzyl, isobornyl, lauryl, myristyl.
- a non-functional alkyl ester is preferable regardless of a linear structure or a branched structure.
- the epoxy resin may be a copolymer of a vinyl monomer having an epoxy group and styrene, ⁇ -methylstyrene, vinyl acetate or the like.
- Thermoplastic resin contained in the sealant of the present invention may be a thermoplastic resin.
- the thermoplastic resin contained in the sealant is, for example, polyethylene terephthalate or polychlorotrifluoroethylene.
- the sealing agent containing a thermoplastic resin may be used in combination with a glass film or a glass sheet.
- a film in which a layer made of the resin composition for a sealant of the present invention is formed on both surfaces of a glass film may be used as a sealing member.
- the sealant of the present invention may contain an acid anhydride.
- a highly transparent encapsulant may be obtained from an encapsulant resin composition containing an epoxy resin that is a curable resin and an acid anhydride. Since many aromatic acid anhydrides are colored, aliphatic (aromatic hydrogenated) acid anhydrides are preferred. Examples of acid anhydrides contained in the sealant include phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, hexachloroendomethylenetetrahydrophthalic anhydride, benzophenone tetracarboxylic anhydride, etc. It is.
- An aliphatic acid anhydride having high transparency is hexahydrophthalic anhydride or methylhexahydrophthalic anhydride.
- the sealant containing the curable resin may contain a curing accelerator.
- the kind of hardening accelerator is not specifically limited, What is necessary is just to select suitably according to the kind of curable resin.
- the curing accelerator may be an imidazole compound or an amine compound. Examples of the imidazole compound include 2-ethyl-4-methylimidazole. Examples of the amine compound include trisdimethylaminomethylphenol.
- An example of a preferable composition of the sealing agent of the present invention includes 100 parts by mass of an epoxy resin and 0.1 to 10 parts by mass of a silane coupling agent, and further comprises an acid anhydride and an acid anhydride group / epoxy group.
- the equivalent ratio is 0.8 to 1.2, and the curing accelerator is included so that the equivalent ratio of active functional group / epoxy group is 0.008 to 0.152.
- the active functional group of the curing accelerator means an amino group or an imidazolyl group.
- the sealant of the present invention may contain an arbitrary filler.
- optional fillers include glass beads, styrenic polymer particles, methacrylate polymer particles, ethylene polymer particles, propylene polymer particles, and the like.
- the sealant of the present invention may be in the form of a film. When used as a sealant for an organic EL device, it is generally a film-form sealant having a thickness of several microns to several tens of microns.
- the sealant of the present invention may be formed on a support surface such as another film, a glass plate, or a metal foil in addition to the film itself molded into a film.
- the organic EL device of the present invention is characterized by being sealed using the sealant of the present invention.
- the organic EL device is generally a laminated light emitting device having at least a pair of electrode layers (an anode electrode layer and a cathode electrode layer) and an organic light emitting layer disposed between the pair of electrode layers. It is.
- the sealing method of the organic EL device is not particularly limited.
- Examples of organic EL device sealing methods include a method called “frame sealing” and a method called “surface sealing”.
- Frame sealing is a method in which an organic EL element disposed on a substrate is covered with a sealing cap, and the peripheral portion of the sealing cap is sealed (adhered) with a sealing member. You may produce this sealing member with the sealing agent of this invention.
- a sealing plate is disposed on an organic EL element disposed on a substrate, and sealing is performed between the sealing plate and the substrate and between the organic EL element and the sealing plate. In this method, the stop member is filled. You may produce this sealing member with the sealing agent of this invention.
- the sealing member of the present invention may be sealed with the sealing member of the present invention; both the light emitting surface side and the non-light emitting surface side are sealed with the sealing member of the present invention. It may be sealed with.
- a sealing member may be prepared by applying a sealing agent to a desired site and curing or polymerizing the sealing agent;
- the sealing member may be prepared by placing the sealing agent at a desired site and bringing it into close contact, and curing or polymerizing it. In order to dispose the film in close contact, it may be heat-laminated or affixed with an adhesive.
- an organic EL device is easily deteriorated by moisture or the like, but is also known to be easily deteriorated by an organic gas.
- the present inventor has found that the primary alcohol gas tends to deteriorate the organic EL device, for example, a dark spot may be generated or light emission may not be generated in the first place.
- the primary alcohol may be an alcohol having a boiling point (bp) at 1 atm of 120 ° C. or less.
- the alcohol at 120 ° C. or lower includes methanol (65 ° C.), ethanol (78 ° C.), 1-propanol (97 ° C.), 1-butanol (117 ° C.) and the like.
- a sealing member obtained by polymerizing or curing the sealing agent of the present invention includes a cured product or polymer of a resin and an organosiloxane compound, and the primary alcohol concentration is extremely reduced.
- An organosiloxane compound refers to a siloxane compound in which Si atoms contained therein are bonded to an organic group other than an oxy group. The carbon atom of the organic group other than the oxy group is preferably bonded to the Si atom.
- the primary alcohol concentration is extremely reduced, and specifically, the concentration measured by the headspace GC-MS method is preferably 10 ppm or less.
- the head space GC-MS method is as described above.
- IPA isopropyl alcohol
- MIBK methyl isobutyl ketone
- silane coupling agent is considered as a generation source.
- the graph of FIG. 1 shows the relationship between the adhesive strength and the storage time for the cases where the compounds A to C were used.
- the initial (storage time 0 hour) adhesive strength was low, and the adhesive strength decreased with the passage of storage time. did.
- Formulation A and Formulation B to which a silane coupling agent was added were used, the initial adhesive strength was high, and it did not decrease even when the storage time passed.
- Formulation A and Formulation B had equivalent adhesion performance.
- a glass substrate on which an ITO film was formed (Tokyo Sanyo Vacuum Co., Ltd., soda glass with ITO, 1500 mm, SLR product) was prepared, and the ITO film was patterned into an electrode shape. Ultrasonically washed with ultrapure water, neutral detergent, acetone, and IPA, and further pulled up from the boiling IPA and dried. Further, the surface was washed with UV / O 3 and then fixed to a substrate holder of a vacuum deposition apparatus. The pressure in the tank was reduced to 1 ⁇ 10 ⁇ 8 Pa or less. While maintaining the reduced pressure, the following film was formed.
- a deposited film (thickness: 100 mm) of copper phthalocyanine (CuPC) was formed on the ITO electrode surface to form a hole injection layer.
- a vapor-deposited film (thickness: 500 mm) of 4,4′-bis (N- (1-naphthyl) -N-phenylamino) biphenyl (NPD) was formed on the hole injection layer to form a hole transport layer.
- a vapor-deposited film (thickness: 650 mm) of tris (8-quinolinolato) aluminum (Alq 3 ) was formed on the hole transport layer to form an electron injection transport / light emitting layer.
- a lithium fluoride (LiF) film (5 ⁇ ) was formed on the electron injection transport / light-emitting layer to form an electron injection electrode.
- An aluminum (Al) vapor deposition film (800 mm) was formed on the surface of the electron injection electrode to form a protective electrode.
- the produced organic electroluminescence device was transferred from the vapor deposition apparatus into a glove box under a nitrogen atmosphere without being exposed to the air.
- the organic electroluminescent element 1 was placed inside an aluminum container 2 and the container was sealed.
- Each contact terminal of the organic electroluminescent element 1 disposed in the aluminum container 2 is electrically connected, and the energized state can be externally controlled.
- the sealed aluminum container 2 was taken out of the glove box.
- FIG. 3A shows the light emission state of the organic electroluminescence device when the formulation A is injected
- FIG. 3B shows the light emission state of the organic electroluminescence device when the formulation B is injected.
- an organic electroluminescent element was prepared and placed inside an aluminum container 2 (see FIG. 2), and the container was sealed.
- Various alcohols (30 ⁇ l) were injected from the septum of the container with the microsyringe 3.
- the organic electroluminescence device arranged in the container was driven at a constant current (125 mA / cm 2 ) for 48 hours, and the light emission state of the light emitting part was observed by the luminance detecting means 4.
- the case where the occurrence of dark spots was confirmed was evaluated as x; the case where the generation of dark spots was not confirmed was evaluated as ⁇ .
- the organic EL device having the sealing member in which the generation of the primary alcohol gas is suppressed has a long life.
- a long-life organic EL device is provided by the sealing member of the present invention.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
Abstract
Description
[1] 封止剤の1gを100℃で60分間加熱することにより発生する1級アルコール量が10μg以下である、封止剤。
[2] シランカップリング剤または/およびシランカップリング剤の反応物を含む、[1]に記載の封止剤。
[3] 前記1級アルコールは1気圧における沸点が120℃以下である、[1]に記載の封止剤。
[5]エポキシ樹脂をさらに含み、R4、R4’またはR4”が、それぞれ独立にエポキシ基、アミノ基、アクリル基、イソシアネート基のいずれかの有機基を有する、[4]に記載の封止剤。
前記シランカップリング剤が、下記一般式(3)、(3’)または(3”)で示される、[2]に記載の封止剤。
[7] 前記アルコールを吸着もしくはアルコールと反応する化合物は、イソシアネート化合物である、[6]に記載の封止剤。
[9] 前記硬化性樹脂または/および熱可塑性樹脂100質量部に対して、0.1~10質量部のシランカップリング剤および/またはシランカップリング剤の反応物を含む、[8]に記載の封止剤。
[10] 前記硬化性樹脂が熱硬化性樹脂である、[9]に記載の封止剤。
[11] 前記熱硬化性樹脂がエポキシ樹脂である、[10]に記載の封止剤。
[12] 酸無水物および硬化促進剤をさらに含む、[11]に記載の封止剤。
[13] 前記エポキシ樹脂100質量部に対して、0.1~10質量部のシランカップリング剤および/またはシランカップリング剤の反応物を含み、
前記酸無水物および前記硬化促進剤は、それぞれ酸無水基/エポキシ基の当量比が0.8~1.2であり、硬化促進剤の活性官能基/エポキシ基の当量比が0.008~0.152である、[12]に記載の封止剤。
[14] シランカップリング剤および/またはシランカップリング剤の反応物を含む封止剤の重合物または硬化物を含む封止部材であって、前記封止剤の1gを100℃で60分間加熱することにより発生する1級アルコール量が10μg以下である、封止部材。
[15] 前記1級アルコールは、1気圧における沸点が120℃以下である、[14]に記載の封止部材。
[16] 基板上に有機EL素子を形成する第1の工程と;前記有機EL素子に[1]に記載の封止剤を密着させる第2の工程と;前記封止剤を硬化させて封止部材を形成する第3の工程と、を含む、有機ELデバイスの製造方法。
[17] 前記第2の工程が、熱ラミネート法で行われる、[16]に記載の有機ELデバイスの製造方法。
[18] 有機EL素子と、前記有機EL素子と接する[1]に記載の封止剤の硬化物と、を含む有機ELデバイス。
[19] [14]に記載の封止部材を含む有機ELデバイス。
[20] [18]または[19]に記載の有機ELデバイスを具備する有機ELディスプレイパネル。
本発明の封止剤は、加熱によって発生する1級アルコール量が低減されていることを特徴とする。具体的には、本発明の封止剤1gを、100℃で60分間加熱することにより発生する1級アルコール量が10μg以下であることが好ましく、5μg以下であることがより好ましい。加熱によって発生する1級アルコール量は、ヘッドスペースGC-MS法によって測定されうる。
(1)ヘッドスペースサンプラー測定条件(機種;HP7694)
バイアル容量:10ml ループ容量:1ml Oven Temp:100℃
Loop Temp:150℃ TR LINE Temp:150℃ Gc Cycle Time:50分
VIALEQ Time:30分 Pressuriz Time:0.13分 Loop Fill Time:0.15分
Loop EQ Time:0.15分 Inject Time:10.3分
バイアル加圧:69Kpa(AUX5)
(2)GC測定条件(機種:HP6890(FID))
カラム:DB-WAX 122-7063
内径:0.25mm 長さ:60m 膜厚:0.5μm
温度:カラム40℃ 1分保持→230℃(10℃/分)15分保持
注入口250℃ 検出器250℃
キヤリアーガス:ヘリウム 初期流量1.81m1/分 設定圧力202kPa
平均線速度30cm/秒 スプリット比10:1
検出器:水素40ml/分 空気450m1/min
メークアップ+カラム合計50ml/分
(3)GC-MS測定条件(機種:HP6890-HP5973(MSD))
カラム、温度条件:前項のGC法とほぼ同条件
トータルイオンクロマトグラム(TIC):m/z=10~550
ライブラリー検索データ:NBS75000件
硬化性樹脂とは、架橋反応によってポリマー鎖同士が結合して3次元の架橋構造を形成する樹脂をいう。硬化性樹脂の例には、フェノール樹脂,エポキシ樹脂,ユリア樹脂,メラミン樹脂,不飽和ポリエステル樹脂,ポリウレタンなどが含まれる。本発明の封止剤に含まれる硬化性樹脂は、エポキシ樹脂であることが好ましい。
本発明の封止剤に含まれる樹脂は、熱可塑性樹脂であってもよい。封止剤に含まれる熱可塑性樹脂は、例えばポリエチレンテレフタレートや、ポリクロロトリフルオロエチレンなどである。熱可塑性樹脂を含む封止剤は、ガラス膜やガラスシートと組み合わせて用いられてもよい。例えば、特開2002-299041号公報に記載されるように、ガラス膜の両面に、本発明の封止剤用樹脂組成物からなる層を形成したフィルムを、封止部材として用いてもよい。
本発明の有機ELデバイスは、本発明の封止剤を用いて封止されていることを特徴とする。有機ELデバイスとは、一般的には、一対の電極層(アノード電極層とカソード電極層)と、一対の電極層との間に配置される有機発光層と、を少なくとも有する積層型の発光デバイスである。
トリクロロシラン(4.67g,31mmol)を、トルエン80mLに溶解し、氷冷下にイソプロピルアルコール(10.4g,170mmol)をゆっくりと滴下した。滴下終了後、室温で19時間撹拌した。炭酸ナトリウム2gをジイソプロピルエーテル50mLに懸濁させ、その中に反応液をゆっくり滴下した。3時間室温で撹拌後、固体をろ別、トルエン10mLで洗浄してトリイソプロポキシシラン溶液を得た。この溶液は精製することなく次の反応に用いた。
収率13%
1H-NMR(CDCl3);δ(ppm)4.20(Hep.、3H、J=6Hz)、3.69(dd、1H、J=3Hz、11Hz)、3.5~3.3(m、3H)、3.15~3.1(m、1H)、2.79(dd、1H、J=4Hz、5Hz)、2.61(dd、1H、J=3Hz、5Hz)、1.75~1.65(m、2H)、1.18(d、18H、J=6Hz)、0.6~0.55(m、2H)
純度94.8%(GC測定による)
表1の配合物Aおよび配合物Bのそれぞれを、1.0g精秤して、バイアル瓶に封入した。封入した配合物を100℃にて60分間加熱した。バイアル瓶内のガスをGC-MSに導入して、ガス成分を検出した。検出されたガスを表2に示す。
厚み5mmのガラス板を2枚用意した。2枚のガラス板の間に、表1に示された配合物A、配合物Bまたは配合物Cを封入した。2枚のガラス板同士の隙間は12μmであった。得られた積層ガラス板を100℃30分間加熱し、封入した配合物を硬化した。得られた接着ガラス板を、60℃、90%RHで所定時間保存した。その後、引っ張り速度2mm/minでガラス板を引き剥がすときの破断強度を測定した。測定された破断強度を、接着面積で除することで、接着強度とした。
ITO膜が成膜されたガラス基板(東京三容真空株式会社、ITO付ソーダガラス、1500Å、SLR品)を用意して、ITO膜を電極形状にパターニングした。超純水、中性洗剤、アセトン、およびIPAで超音波洗浄し、さらに煮沸IPA中から引き上げて乾燥した。さらに、表面をUV/O3洗浄した後、真空蒸着装置の基板ホルダーに固定した。槽内の圧力を1×10-8Pa以下にまで減圧した。減圧を維持したまま、下記の膜を形成した。
前述の劣化試験と同様に、有機電界発光素子を作製し、アルミニウム製の容器2(図2参照)の内部に配置して、容器を密閉した。容器のセプタムから、マイクロシリンジ3で各種アルコール(30μl)を注入した。アルコールを注入直後、容器内に配置された有機電界発光素子を、48時間、定電流駆動(125mA/cm2)させて、輝度検出手段4で発光部の発光状態を観察した。ダークスポットの発生が確認された場合を×;ダークスポットの発生が確認されなかった場合を○と評価した。
2 アルミニウム製の容器
3 マイクロシリンジ
4 輝度検出手段
Claims (20)
- 封止剤の1gを100℃で60分間加熱することにより発生する1級アルコール量が、10μg以下である、封止剤。
- シランカップリング剤または/およびシランカップリング剤の反応物を含む、請求項1に記載の封止剤。
- 前記1級アルコールは1気圧における沸点が120℃以下である、請求項1に記載の封止剤。
- エポキシ樹脂をさらに含み、R4、R4’またはR4”が、それぞれ独立にエポキシ基、アミノ基、アクリル基、イソシアネート基のいずれかの有機基を有する、請求項4に記載の封止剤。
- アルコールを吸着もしくはアルコールと反応する化合物をさらに含み、
前記シランカップリング剤が、下記一般式(3)、(3’)または(3”)で示される、請求項2に記載の封止剤。
R11~R13は、それぞれ独立して一価の有機基であるが、R11~R13のうち一つ以上は一般式(4)で示される基であり、
R14、R14’およびR14”は、それぞれオキシ基以外の一価の有機基を示し、
nは1以上の整数を示し、nが2以上の場合に、2以上存在するR12、R14およびR14’は、互いに同一であっても異なっていてもよい)
- 前記アルコールを吸着もしくはアルコールと反応する化合物は、イソシアネート化合物である、請求項6に記載の封止剤。
- 硬化性樹脂または/および熱可塑性樹脂をさらに含む、請求項1に記載の封止剤。
- 前記硬化性樹脂または/および熱可塑性樹脂100質量部に対して、0.1~10質量部の前記シランカップリング剤または/およびシランカップリング剤の反応物を含む、請求項8に記載の封止剤。
- 前記硬化性樹脂が熱硬化性樹脂である、請求項9に記載の封止剤。
- 前記熱硬化性樹脂がエポキシ樹脂である、請求項10に記載の封止剤。
- 酸無水物および硬化促進剤をさらに含む、請求項11に記載の封止剤。
- 前記エポキシ樹脂100質量部に対して、0.1~10質量部の前記シランカップリング剤または/およびシランカップリング剤の反応物を含み、
前記酸無水物および前記硬化促進剤は、それぞれ酸無水基/エポキシ基の当量比が0.8~1.2であり、硬化促進剤の活性官能基/エポキシ基の当量比が0.008~0.152である、請求項12に記載の封止剤。 - シランカップリング剤および/またはシランカップリング剤の反応物を含む封止剤の重合物または硬化物を含む封止部材であって、前記封止剤の1gを100℃で60分間加熱することにより発生する1級アルコール量が10μg以下である、封止部材。
- 前記1級アルコールは、1気圧における沸点が120℃以下である、請求項14に記載の封止部材。
- 基板上に有機EL素子を形成する第1の工程と、
前記有機EL素子に請求項1に記載の封止剤を密着させる第2の工程と、
前記封止剤を硬化させて封止部材を形成する第3の工程と、を含む、有機ELデバイスの製造方法。 - 前記第2の工程が、熱ラミネート法で行われる、請求項16に記載の有機ELデバイスの製造方法。
- 有機EL素子と、前記有機EL素子と接する請求項1に記載の封止剤の硬化物と、を含む有機ELデバイス。
- 請求項14に記載の封止部材を含む有機ELデバイス。
- 請求項18または19に記載の有機ELデバイスを具備する有機ELディスプレイパネル。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010530747A JP5449176B2 (ja) | 2008-09-29 | 2009-09-28 | 封止剤および封止部材、ならびに有機elデバイス |
KR1020117000290A KR101245079B1 (ko) | 2008-09-29 | 2009-09-28 | 봉지제 및 봉지 부재, 및 유기 el 디바이스 |
CN200980138215.7A CN102165017B (zh) | 2008-09-29 | 2009-09-28 | 密封剂、密封部件及有机el器件 |
HK11112605.9A HK1158238A1 (en) | 2008-09-29 | 2011-11-21 | Sealant, sealing member and organic el device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008250598 | 2008-09-29 | ||
JP2008-250598 | 2008-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010035502A1 true WO2010035502A1 (ja) | 2010-04-01 |
Family
ID=42059513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/004943 WO2010035502A1 (ja) | 2008-09-29 | 2009-09-28 | 封止剤および封止部材、ならびに有機elデバイス |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5449176B2 (ja) |
KR (1) | KR101245079B1 (ja) |
CN (1) | CN102165017B (ja) |
HK (1) | HK1158238A1 (ja) |
TW (1) | TWI449746B (ja) |
WO (1) | WO2010035502A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9013049B2 (en) | 2011-06-23 | 2015-04-21 | Mitsui Chemicals, Inc. | Surface sealant for optical semiconductor, method for manufacturing organic EL device, organic EL device and organic EL display panel using the same |
WO2019181592A1 (ja) * | 2018-03-19 | 2019-09-26 | 三井化学株式会社 | 表示素子用封止材およびその硬化物、有機el素子用枠封止材、ならびに有機el素子用面封止材 |
JP2021002533A (ja) * | 2013-06-28 | 2021-01-07 | 株式会社半導体エネルギー研究所 | 発光素子の作製方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130236681A1 (en) | 2012-03-06 | 2013-09-12 | Chang Min Lee | Photocurable composition, barrier layer including the same, and encapsulated apparatus including the same |
KR101864976B1 (ko) * | 2014-05-02 | 2018-06-05 | 미쯔이가가꾸가부시끼가이샤 | 시일재 및 그의 경화물 |
CN111892621A (zh) * | 2019-05-05 | 2020-11-06 | 石家庄圣泰化工有限公司 | [(2-乙氧基)丙基]环氧乙基-三甲氧基硅烷的合成方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01167359A (ja) * | 1987-12-24 | 1989-07-03 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH0589959A (ja) * | 1991-09-30 | 1993-04-09 | Idemitsu Kosan Co Ltd | 有機el素子の封止方法 |
JP2006070221A (ja) * | 2004-09-06 | 2006-03-16 | Three Bond Co Ltd | 有機el素子封止材 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR930002763A (ko) * | 1991-07-03 | 1993-02-23 | 이헌조 | 냉동사이클의 냉매순환제어장치 |
JP2004143383A (ja) * | 2002-10-28 | 2004-05-20 | Nikko Materials Co Ltd | 固形シランカップリング剤組成物、その製造方法およびそれを含有する樹脂組成物 |
JP4736652B2 (ja) * | 2005-09-09 | 2011-07-27 | セイコーエプソン株式会社 | 発光装置の製造方法 |
CN101278028A (zh) * | 2005-10-03 | 2008-10-01 | 三井化学株式会社 | 平板显示器用密封材料 |
WO2007145285A1 (ja) * | 2006-06-16 | 2007-12-21 | Nippon Shokubai Co., Ltd. | ポリマー被覆金属酸化物微粒子およびその応用 |
-
2009
- 2009-09-28 WO PCT/JP2009/004943 patent/WO2010035502A1/ja active Application Filing
- 2009-09-28 KR KR1020117000290A patent/KR101245079B1/ko active IP Right Grant
- 2009-09-28 CN CN200980138215.7A patent/CN102165017B/zh active Active
- 2009-09-28 JP JP2010530747A patent/JP5449176B2/ja active Active
- 2009-09-29 TW TW098133018A patent/TWI449746B/zh active
-
2011
- 2011-11-21 HK HK11112605.9A patent/HK1158238A1/xx unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01167359A (ja) * | 1987-12-24 | 1989-07-03 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH0589959A (ja) * | 1991-09-30 | 1993-04-09 | Idemitsu Kosan Co Ltd | 有機el素子の封止方法 |
JP2006070221A (ja) * | 2004-09-06 | 2006-03-16 | Three Bond Co Ltd | 有機el素子封止材 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9013049B2 (en) | 2011-06-23 | 2015-04-21 | Mitsui Chemicals, Inc. | Surface sealant for optical semiconductor, method for manufacturing organic EL device, organic EL device and organic EL display panel using the same |
JP2021002533A (ja) * | 2013-06-28 | 2021-01-07 | 株式会社半導体エネルギー研究所 | 発光素子の作製方法 |
JP7154265B2 (ja) | 2013-06-28 | 2022-10-17 | 株式会社半導体エネルギー研究所 | 発光素子の作製方法 |
WO2019181592A1 (ja) * | 2018-03-19 | 2019-09-26 | 三井化学株式会社 | 表示素子用封止材およびその硬化物、有機el素子用枠封止材、ならびに有機el素子用面封止材 |
CN111886315A (zh) * | 2018-03-19 | 2020-11-03 | 三井化学株式会社 | 显示元件用密封材及其固化物、有机el元件用框密封材以及有机el元件用面密封材 |
CN111886315B (zh) * | 2018-03-19 | 2023-06-30 | 三井化学株式会社 | 显示元件用密封材及其固化物、有机el元件用框密封材以及有机el元件用面密封材 |
Also Published As
Publication number | Publication date |
---|---|
KR20110028342A (ko) | 2011-03-17 |
TW201022358A (en) | 2010-06-16 |
JPWO2010035502A1 (ja) | 2012-02-23 |
HK1158238A1 (en) | 2012-07-13 |
KR101245079B1 (ko) | 2013-03-18 |
JP5449176B2 (ja) | 2014-03-19 |
TWI449746B (zh) | 2014-08-21 |
CN102165017A (zh) | 2011-08-24 |
CN102165017B (zh) | 2014-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11980084B2 (en) | Organic light emitting diode display | |
US10128462B2 (en) | Organic light emitting diode display and manufacturing method thereof | |
JP5449176B2 (ja) | 封止剤および封止部材、ならびに有機elデバイス | |
KR101999614B1 (ko) | 수지 조성물 및 그 경화물(1) | |
US20060100299A1 (en) | Transformable pressure sensitive adhesive tape and use thereof in display screens | |
US10233350B2 (en) | Photocurable composition and enveloped device including same | |
CN102210192B (zh) | 有机el元件的面密封剂、显示装置的制造方法和显示装置 | |
US8829772B2 (en) | Organic light emitting diode display with heat dissipating adhesive | |
TWI677530B (zh) | 有機電激發光顯示元件用密封劑 | |
CN104508065B (zh) | 粘合膜和使用该粘合膜的用于封装有机电子装置的产品 | |
KR20150090059A (ko) | 수지 조성물 및 그 경화물(2) | |
TWI641650B (zh) | Organic electroluminescent display element sealant | |
US10392459B2 (en) | Photocurable composition and device including barrier layer formed from composition | |
KR20190049451A (ko) | 디스플레이용 봉지제 및 그것을 이용한 액정 표시 셀 | |
KR20170120555A (ko) | 유기 일렉트로루미네선스 표시 소자용 봉지제 | |
KR102338360B1 (ko) | 유기 발광 표시 장치 | |
KR101374369B1 (ko) | 유기 el 디스플레이 장치 및 이에 포함되는 유기 el 소자 봉지용 접착제 조성물 | |
KR20190044497A (ko) | 디스플레이용 봉지제 및 그것을 이용한 액정 시일제, 그리고 액정 표시 셀 | |
JP2013214369A (ja) | 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた接着フィルム、ガスバリアフィルム、有機エレクトロルミネッセンス素子および有機エレクトロルミネッセンスパネル |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980138215.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09815921 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010530747 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20117000290 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09815921 Country of ref document: EP Kind code of ref document: A1 |