JP5449176B2 - 封止剤および封止部材、ならびに有機elデバイス - Google Patents
封止剤および封止部材、ならびに有機elデバイス Download PDFInfo
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- JP5449176B2 JP5449176B2 JP2010530747A JP2010530747A JP5449176B2 JP 5449176 B2 JP5449176 B2 JP 5449176B2 JP 2010530747 A JP2010530747 A JP 2010530747A JP 2010530747 A JP2010530747 A JP 2010530747A JP 5449176 B2 JP5449176 B2 JP 5449176B2
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- silane coupling
- coupling agent
- sealing
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- 238000007789 sealing Methods 0.000 title claims description 86
- 239000000565 sealant Substances 0.000 title claims description 52
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 50
- 239000003795 chemical substances by application Substances 0.000 claims description 40
- 150000003138 primary alcohols Chemical class 0.000 claims description 37
- -1 isocyanate compound Chemical class 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
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- 239000003822 epoxy resin Substances 0.000 claims description 17
- 125000003545 alkoxy group Chemical group 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 239000012948 isocyanate Substances 0.000 claims description 15
- 125000000962 organic group Chemical group 0.000 claims description 15
- 150000008065 acid anhydrides Chemical class 0.000 claims description 10
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- 150000002430 hydrocarbons Chemical group 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 9
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- 125000000524 functional group Chemical group 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009835 boiling Methods 0.000 claims description 7
- 125000003277 amino group Chemical group 0.000 claims description 5
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- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
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- 230000008878 coupling Effects 0.000 claims description 2
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
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- 229910052782 aluminium Inorganic materials 0.000 description 6
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- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 150000003509 tertiary alcohols Chemical class 0.000 description 3
- JRGQKLFZSNYTDX-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)propyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCOCC1CO1 JRGQKLFZSNYTDX-UHFFFAOYSA-N 0.000 description 2
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
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- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- 238000004817 gas chromatography Methods 0.000 description 2
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- 238000003786 synthesis reaction Methods 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical group C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
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- TZJDSQVHVIJEFA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl-tri(propan-2-yloxy)silane Chemical compound C1C(CC[Si](OC(C)C)(OC(C)C)OC(C)C)CCC2OC21 TZJDSQVHVIJEFA-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
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- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
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- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
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- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
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- MVLLZVWCFBDVHW-UHFFFAOYSA-N 3-tri(butan-2-yloxy)silylpropyl 2-methylprop-2-enoate Chemical compound CCC(C)O[Si](OC(C)CC)(OC(C)CC)CCCOC(=O)C(C)=C MVLLZVWCFBDVHW-UHFFFAOYSA-N 0.000 description 1
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- PRJLKHBZRBYOSG-UHFFFAOYSA-N N-[3-tri(butan-2-yloxy)silylpropyl]aniline Chemical compound C1(=CC=CC=C1)NCCC[Si](OC(C)CC)(OC(C)CC)OC(C)CC PRJLKHBZRBYOSG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- UHVCSNKHFBQKBO-UHFFFAOYSA-N benzyl-ethenyl-[2-(3-trimethoxysilylpropylamino)ethyl]azanium;chloride Chemical compound Cl.CO[Si](OC)(OC)CCCNCCN(C=C)CC1=CC=CC=C1 UHVCSNKHFBQKBO-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- CUGMPPOIEQHHSP-UHFFFAOYSA-N di(butan-2-yloxy)-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCC(C)O[Si](C)(OC(C)CC)CCCOCC1CO1 CUGMPPOIEQHHSP-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- BQRPSOKLSZSNAR-UHFFFAOYSA-N ethenyl-tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C=C BQRPSOKLSZSNAR-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- VPVUJLOXHZTLKK-UHFFFAOYSA-N n'-[3-[methyl-di(propan-2-yloxy)silyl]propyl]ethane-1,2-diamine Chemical compound CC(C)O[Si](C)(OC(C)C)CCCNCCN VPVUJLOXHZTLKK-UHFFFAOYSA-N 0.000 description 1
- IFZUFHWISBKFJP-UHFFFAOYSA-N n'-[4-[dimethoxy(methyl)silyl]oxybutyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)OCCCCNCCN IFZUFHWISBKFJP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- BJBOYMSSGHXAFF-UHFFFAOYSA-N n-[3-tri(propan-2-yloxy)silylpropyl]aniline Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCNC1=CC=CC=C1 BJBOYMSSGHXAFF-UHFFFAOYSA-N 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- HCOKJWUULRTBRS-UHFFFAOYSA-N propan-2-yloxysilane Chemical compound CC(C)O[SiH3] HCOKJWUULRTBRS-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- AKLJIUURIIIOLU-UHFFFAOYSA-N silane 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound [SiH4].CO[Si](OC)(OC)CCCOC(=O)C(C)=C AKLJIUURIIIOLU-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- VVEMUMZHQQNXEV-UHFFFAOYSA-N tri(butan-2-yloxy)-[2-(7-oxabicyclo[4.1.0]heptan-3-yl)ethyl]silane Chemical compound C1(CC2C(CC1)O2)CC[Si](OC(C)CC)(OC(C)CC)OC(C)CC VVEMUMZHQQNXEV-UHFFFAOYSA-N 0.000 description 1
- BCRRSELDRACECI-UHFFFAOYSA-N tri(butan-2-yloxy)-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCC(C)O[Si](OC(C)CC)(OC(C)CC)CCCOCC1CO1 BCRRSELDRACECI-UHFFFAOYSA-N 0.000 description 1
- MHQDJCZAQGWXBC-UHFFFAOYSA-N tri(butan-2-yloxy)-ethenylsilane Chemical compound CCC(C)O[Si](OC(C)CC)(OC(C)CC)C=C MHQDJCZAQGWXBC-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- GDNZEYFPHPHLOA-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)CCC2OC21 GDNZEYFPHPHLOA-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/872—Containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
Description
[1] 封止剤の1gを100℃で60分間加熱することにより発生する1級アルコール量が10μg以下である、封止剤。
[2] シランカップリング剤または/およびシランカップリング剤の反応物を含む、[1]に記載の封止剤。
[3] 前記1級アルコールは1気圧における沸点が120℃以下である、[1]に記載の封止剤。
[5]エポキシ樹脂をさらに含み、R4、R4’またはR4”が、それぞれ独立にエポキシ基、アミノ基、アクリル基、イソシアネート基のいずれかの有機基を有する、[4]に記載の封止剤。
前記シランカップリング剤が、下記一般式(3)、(3’)または(3”)で示される、[2]に記載の封止剤。
[7] 前記アルコールを吸着もしくはアルコールと反応する化合物は、イソシアネート化合物である、[6]に記載の封止剤。
[9] 前記硬化性樹脂または/および熱可塑性樹脂100質量部に対して、0.1〜10質量部のシランカップリング剤および/またはシランカップリング剤の反応物を含む、[8]に記載の封止剤。
[10] 前記硬化性樹脂が熱硬化性樹脂である、[9]に記載の封止剤。
[11] 前記熱硬化性樹脂がエポキシ樹脂である、[10]に記載の封止剤。
[12] 酸無水物および硬化促進剤をさらに含む、[11]に記載の封止剤。
[13] 前記エポキシ樹脂100質量部に対して、0.1〜10質量部のシランカップリング剤および/またはシランカップリング剤の反応物を含み、
前記酸無水物および前記硬化促進剤は、それぞれ酸無水基/エポキシ基の当量比が0.8〜1.2であり、硬化促進剤の活性官能基/エポキシ基の当量比が0.008〜0.152である、[12]に記載の封止剤。
[14] シランカップリング剤および/またはシランカップリング剤の反応物を含む封止剤の重合物または硬化物を含む封止部材であって、前記封止剤の1gを100℃で60分間加熱することにより発生する1級アルコール量が10μg以下である、封止部材。
[15] 前記1級アルコールは、1気圧における沸点が120℃以下である、[14]に記載の封止部材。
[16] 基板上に有機EL素子を形成する第1の工程と;前記有機EL素子に[1]に記載の封止剤を密着させる第2の工程と;前記封止剤を硬化させて封止部材を形成する第3の工程と、を含む、有機ELデバイスの製造方法。
[17] 前記第2の工程が、熱ラミネート法で行われる、[16]に記載の有機ELデバイスの製造方法。
[18] 有機EL素子と、前記有機EL素子と接する[1]に記載の封止剤の硬化物と、を含む有機ELデバイス。
[19] [14]に記載の封止部材を含む有機ELデバイス。
[20] [18]または[19]に記載の有機ELデバイスを具備する有機ELディスプレイパネル。
本発明の封止剤は、加熱によって発生する1級アルコール量が低減されていることを特徴とする。具体的には、本発明の封止剤1gを、100℃で60分間加熱することにより発生する1級アルコール量が10μg以下であることが好ましく、5μg以下であることがより好ましい。加熱によって発生する1級アルコール量は、ヘッドスペースGC−MS法によって測定されうる。
(1)ヘッドスペースサンプラー測定条件(機種;HP7694)
バイアル容量:10ml ループ容量:1ml Oven Temp:100℃
Loop Temp:150℃ TR LINE Temp:150℃ Gc Cycle Time:50分
VIALEQ Time:30分 Pressuriz Time:0.13分 Loop Fill Time:0.15分
Loop EQ Time:0.15分 Inject Time:10.3分
バイアル加圧:69Kpa(AUX5)
(2)GC測定条件(機種:HP6890(FID))
カラム:DB−WAX 122-7063
内径:0.25mm 長さ:60m 膜厚:0.5μm
温度:カラム40℃ 1分保持→230℃(10℃/分)15分保持
注入口250℃ 検出器250℃
キヤリアーガス:ヘリウム 初期流量1.81m1/分 設定圧力202kPa
平均線速度30cm/秒 スプリット比10:1
検出器:水素40ml/分 空気450m1/min
メークアップ+カラム合計50ml/分
(3)GC−MS測定条件(機種:HP6890-HP5973(MSD))
カラム、温度条件:前項のGC法とほぼ同条件
トータルイオンクロマトグラム(TIC):m/z=10〜550
ライブラリー検索データ:NBS75000件
硬化性樹脂とは、架橋反応によってポリマー鎖同士が結合して3次元の架橋構造を形成する樹脂をいう。硬化性樹脂の例には、フェノール樹脂,エポキシ樹脂,ユリア樹脂,メラミン樹脂,不飽和ポリエステル樹脂,ポリウレタンなどが含まれる。本発明の封止剤に含まれる硬化性樹脂は、エポキシ樹脂であることが好ましい。
本発明の封止剤に含まれる樹脂は、熱可塑性樹脂であってもよい。封止剤に含まれる熱可塑性樹脂は、例えばポリエチレンテレフタレートや、ポリクロロトリフルオロエチレンなどである。熱可塑性樹脂を含む封止剤は、ガラス膜やガラスシートと組み合わせて用いられてもよい。例えば、特開2002−299041号公報に記載されるように、ガラス膜の両面に、本発明の封止剤用樹脂組成物からなる層を形成したフィルムを、封止部材として用いてもよい。
本発明の有機ELデバイスは、本発明の封止剤を用いて封止されていることを特徴とする。有機ELデバイスとは、一般的には、一対の電極層(アノード電極層とカソード電極層)と、一対の電極層との間に配置される有機発光層と、を少なくとも有する積層型の発光デバイスである。
トリクロロシラン(4.67g,31mmol)を、トルエン80mLに溶解し、氷冷下にイソプロピルアルコール(10.4g,170mmol)をゆっくりと滴下した。滴下終了後、室温で19時間撹拌した。炭酸ナトリウム2gをジイソプロピルエーテル50mLに懸濁させ、その中に反応液をゆっくり滴下した。3時間室温で撹拌後、固体をろ別、トルエン10mLで洗浄してトリイソプロポキシシラン溶液を得た。この溶液は精製することなく次の反応に用いた。
収率13%
1H−NMR(CDCl3);δ(ppm)4.20(Hep.、3H、J=6Hz)、3.69(dd、1H、J=3Hz、11Hz)、3.5〜3.3(m、3H)、3.15〜3.1(m、1H)、2.79(dd、1H、J=4Hz、5Hz)、2.61(dd、1H、J=3Hz、5Hz)、1.75〜1.65(m、2H)、1.18(d、18H、J=6Hz)、0.6〜0.55(m、2H)
純度94.8%(GC測定による)
表1の配合物Aおよび配合物Bのそれぞれを、1.0g精秤して、バイアル瓶に封入した。封入した配合物を100℃にて60分間加熱した。バイアル瓶内のガスをGC−MSに導入して、ガス成分を検出した。検出されたガスを表2に示す。
厚み5mmのガラス板を2枚用意した。2枚のガラス板の間に、表1に示された配合物A、配合物Bまたは配合物Cを封入した。2枚のガラス板同士の隙間は12μmであった。得られた積層ガラス板を100℃30分間加熱し、封入した配合物を硬化した。得られた接着ガラス板を、60℃、90%RHで所定時間保存した。その後、引っ張り速度2mm/minでガラス板を引き剥がすときの破断強度を測定した。測定された破断強度を、接着面積で除することで、接着強度とした。
ITO膜が成膜されたガラス基板(東京三容真空株式会社、ITO付ソーダガラス、1500Å、SLR品)を用意して、ITO膜を電極形状にパターニングした。超純水、中性洗剤、アセトン、およびIPAで超音波洗浄し、さらに煮沸IPA中から引き上げて乾燥した。さらに、表面をUV/O3洗浄した後、真空蒸着装置の基板ホルダーに固定した。槽内の圧力を1×10−8Pa以下にまで減圧した。減圧を維持したまま、下記の膜を形成した。
前述の劣化試験と同様に、有機電界発光素子を作製し、アルミニウム製の容器2(図2参照)の内部に配置して、容器を密閉した。容器のセプタムから、マイクロシリンジ3で各種アルコール(30μl)を注入した。アルコールを注入直後、容器内に配置された有機電界発光素子を、48時間、定電流駆動(125mA/cm2)させて、輝度検出手段4で発光部の発光状態を観察した。ダークスポットの発生が確認された場合を×;ダークスポットの発生が確認されなかった場合を○と評価した。
2 アルミニウム製の容器
3 マイクロシリンジ
4 輝度検出手段
Claims (17)
- 下記一般式(1)、(1’)または(1”)で示されるシランカップリング剤または/および前記シランカップリング剤の反応物を含み、
封止剤の1gを100℃で60分間加熱することにより発生する揮発成分中の1級アルコール量が、10μg以下である、封止剤。
R 1 〜R 3 は、それぞれ独立して下記一般式(2)で示される基を示し、
R 4 、R 4 ’およびR 4 ”は、それぞれオキシ基以外の一価の有機基を示し、
nは1以上の整数を示し、nが2以上の場合に、2以上存在するR 2 、R 4 およびR 4 ’は、互いに同一であっても異なっていてもよい)
R 5 は、水素原子または炭化水素基を示し、
R 6 およびR 7 は、それぞれ独立して炭化水素基を示す) - 前記1級アルコールは1気圧における沸点が120℃以下である、請求項1に記載の封止剤。
- イソシアネート化合物をさらに含む、請求項1または2に記載の封止剤。
- エポキシ樹脂をさらに含み、R4、R4’またはR4”が、それぞれ独立にエポキシ基、アミノ基、アクリル基、イソシアネート基のいずれかの有機基を有する、請求項1〜3のいずれか一項に記載の封止剤。
- 硬化性樹脂または/および熱可塑性樹脂をさらに含む、請求項1〜4のいずれか一項に記載の封止剤。
- 前記硬化性樹脂または/および熱可塑性樹脂100質量部に対して、0.1〜10質量部の前記シランカップリング剤または/およびシランカップリング剤の反応物を含む、請求項5に記載の封止剤。
- 前記硬化性樹脂が熱硬化性樹脂である、請求項5または6に記載の封止剤。
- 前記熱硬化性樹脂がエポキシ樹脂である、請求項7に記載の封止剤。
- 酸無水物および硬化促進剤をさらに含む、請求項1〜8のいずれか一項に記載の封止剤。
- 前記エポキシ樹脂100質量部に対して、0.1〜10質量部の前記シランカップリング剤または/およびシランカップリング剤の反応物を含み、
前記酸無水物および前記硬化促進剤は、それぞれ酸無水基/エポキシ基の当量比が0.8〜1.2であり、硬化促進剤の活性官能基/エポキシ基の当量比が0.008〜0.152である、請求項9に記載の封止剤。 - 請求項1〜10のいずれか一項に記載の封止剤の重合物または硬化物を含む、封止部材。
- 基板上に有機EL素子を形成する第1の工程と、
前記有機EL素子に請求項1〜10のいずれか一項に記載の封止剤を密着させる第2の工程と、
前記封止剤を硬化させて封止部材を形成する第3の工程と、
を含む、有機ELデバイスの製造方法。 - 前記第2の工程が、熱ラミネート法で行われる、請求項12に記載の有機ELデバイスの製造方法。
- 有機EL素子と、前記有機EL素子と接する請求項1〜10のいずれか一項に記載の封止剤の硬化物と、を含む有機ELデバイス。
- 請求項11に記載の封止部材を含む有機ELデバイス。
- 請求項14または15に記載の有機ELデバイスを具備する有機ELディスプレイパネル。
- シランカップリング剤または/および前記シランカップリング剤の反応物を含み、
封止剤の1gを100℃で60分間加熱することにより発生する揮発成分中の1級アルコール量が、10μg以下であり、
前記シランカップリング剤は、1級アルコキシ基を含まないアルコキシシランである、封止剤。
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