WO2015152364A1 - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
- Publication number
- WO2015152364A1 WO2015152364A1 PCT/JP2015/060444 JP2015060444W WO2015152364A1 WO 2015152364 A1 WO2015152364 A1 WO 2015152364A1 JP 2015060444 W JP2015060444 W JP 2015060444W WO 2015152364 A1 WO2015152364 A1 WO 2015152364A1
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- WIPO (PCT)
- Prior art keywords
- resin layer
- metal conductor
- manufacturing
- electronic component
- adhesive resin
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a method for manufacturing an electronic component in which a metal conductor is inserted into a synthetic resin base constituting a housing or the like.
- a base made of a synthetic resin in which a metal conductor is embedded is often used as a housing or a case, and this type of base is manufactured by a so-called insert molding method.
- a storage chamber is formed by a cover body in which metal terminals are embedded by insert molding and a housing.
- the resin is injection molded in the mold while the terminal is pressed by the pressing pin in the mold, and the position of the terminal is shifted in the mold by the resin pressure. It is prevented.
- pin holes corresponding to the shape of the pressing pins are formed in the molded lid.
- the terminals formed from the metal plate are generally plated on the surface and subjected to antiseptic treatment on the surface. Therefore, in the insert molding, the adhesion between the surface of the metal terminal and the resin constituting the lid is not so good, and there is a limit to maintaining the airtightness of the storage chamber formed by the lid and the housing.
- the lid manufactured by insert molding a part of the metal terminal is exposed inside the pin hole. For this reason, if moisture enters the pin holes, there is a risk that the moisture will come into contact with the terminals and cause electric leakage, and if moisture enters the plurality of pin holes at the same time, the metal terminals may be short-circuited.
- Patent Document 2 describes an invention in which a mold case containing a connector terminal is molded by an insert method.
- a gap is formed between the connector terminal and the mold case due to a so-called sink when the molten resin forming the mold case is cooled and solidified, so that the sealing performance of the mold case is likely to deteriorate.
- Technical challenges have been raised.
- the invention described in Patent Document 2 is to coat the middle part of the connector terminal with an acrylic adhesive, and insert the part coated with the adhesive into the mold to form a mold case.
- the adhesion between the resin constituting the mold case and the connector terminal is enhanced.
- the present invention solves the above-described conventional problems, and an object thereof is to provide a method of manufacturing an electronic component capable of enhancing the adhesion between a metal conductor and a synthetic resin constituting a substrate in a so-called insert molding process. Yes.
- the present invention relates to a method for manufacturing an electronic component in which a metal conductor is inserted and a synthetic resin base is formed.
- (1) a step of partially activating the surface of the metal plate material; (2) forming an adhesive resin layer in the area subjected to the activation treatment; (3) After the steps (1) and (2), a step of cutting and bending the metal conductor having the adhesive resin layer at least partially from the metal plate material; (4) installing the metal conductor in a mold and injecting a synthetic resin into the mold to mold the substrate; It is characterized by having.
- the surface of the metal plate material is partially activated to form an adhesive resin layer, and then the metal plate material is cut and bent to form a metal conductor. Therefore, an adhesive resin layer can also be formed on a bent portion of the metal conductor, the adhesion between the metal conductor and the synthetic resin substrate can be improved, and a highly sealed housing can be formed.
- step (1) between the step (1) and the step (2), (1a) a step of forming an insulating resin layer in the activated region; (1b) applying a second activation treatment to at least a part of the surface of the insulating resin layer; Contains In the step (2), the adhesive resin layer is formed on the insulating resin layer subjected to the second activation treatment.
- the insulating resin layer is formed on the surface of the metal conductor, even if there is a portion where the metal conductor is exposed except for the terminal portion, the insulating resin layer Insulation can be ensured.
- the processes (1) and (2) are performed using the same mask superimposed on the metal plate material.
- the processes (1), (1a), (1b) and (2) are performed using the same mask superimposed on the metal plate.
- the surface of the metal plate material is activated and the adhesive resin layer is formed, and further, the activation treatment and the insulating resin layer and the adhesive resin layer are formed, thereby forming a minute metal conductor.
- the adhesive resin layer and the insulating resin layer can be reliably attached to the necessary portions.
- step (4) a portion of the metal conductor installed in the mold where the insulating resin layer is formed is supported by a support protrusion, Molding is performed.
- the insulating resin layer and the adhesive resin layer on the surface are formed on the portion where the support protrusion is in contact, the portion where the support protrusion is in contact with the heat in the mold Even if the adhesive resin layer is removed, the insulating resin layer remains, so that electrical insulation of the exposed portion of the metal conductor after molding can be maintained.
- the adhesive resin layer formed in (2) and the synthetic resin used in the injection molding (4) have compatibility.
- the adhesive resin layer formed in (2) is in a temporarily cured state having a lower degree of crosslinking than the insulating resin layer formed in (1a). 3) It can comprise as what transfers to the process of (4).
- the activation process is a polarization process that irradiates vacuum ultraviolet light.
- the adhesive resin layer is formed on both surfaces of the portion of the metal conductor embedded in the base in the step (2).
- a part of the metal conductor protrudes from the base to form a terminal portion, and the terminal portion is configured not to be subjected to the activation process (1).
- the insulating resin layer and the adhesive resin layer remains even if the support protrusion for positioning the metal conductor in the mold hits the metal conductor and the adhesive resin layer is removed. Therefore, even if a part of the metal conductor is exposed to the molded substrate, electrical insulation can be ensured.
- FIG. 2 is an enlarged sectional view showing a part of FIG.
- FIG. 3 is a partially enlarged cross-sectional view of a part IV in FIG.
- the partial expanded sectional view of the V section of FIG. FIG. 3 is a partially enlarged cross-sectional view of the VI part of FIG.
- Diagram showing the properties of the adhesive resin layer during heat treatment A cross-sectional photograph showing the joint between the metal conductor and the substrate, The top view which shows the relationship between the process area
- the housing 2 includes a base 3 and a lid 4.
- the lid 4 is made of a synthetic resin material that can be bent and deformed.
- the base 3 is formed of a synthetic resin and has a bottom wall 3a and four side walls 3b.
- the base 3 has an opening surrounded by the upper end of the side wall 3 b, and this opening is closed by a lid 4, and a housing space 5 that is a sealed space is formed inside the housing 2.
- the housing 2 has a minute structure, and is formed so that the maximum value of one side of the cube is 5 mm or less, and further 2 mm or less.
- the detection element 6 is accommodated in the storage space 5 of the housing 2.
- the detection element 6 is a MEMS (Micro Electro Mechanical Systems) element and is mainly composed of a silicon substrate.
- the detecting element 6 is a force sensor, and the deforming portion is bent by an external pressure, and the bending amount is detected by a change in electric charge. Since the lid body 4 is formed of a flexible resin material, the lid body 4 is deformed according to the external pressure, and the change in the internal pressure of the storage space 5 at that time is detected by the detection element 6. Therefore, the storage space 5 needs to be an airtight space cut off from outside air.
- four metal conductors 10 are embedded and fixed in a bottom wall portion 3 a of the base 3 by a so-called insert molding method.
- each metal conductor 10 has a first plate portion 11 and a second plate portion 12.
- the first plate portion 11 extends in parallel with the bottom surface 3c of the bottom wall portion 3a, and the second plate portion 12 is bent at a substantially right angle from the first plate portion 11 and vertically upwards with respect to the bottom surface 3c. It extends.
- the boundary between the first plate portion 11 and the second plate portion 12 is a bent portion 15.
- the metal conductor 10 is integrally formed with an external terminal portion 14 that is continuous with the first plate portion 11 and an internal terminal portion 13 that is continuous with the second plate portion 12.
- the internal terminal portion 13 is bent at a substantially right angle from the second plate portion 12 and extends substantially parallel to the bottom surface 3c.
- the first plate portion 11 and the second plate portion 12 are embedded in the bottom wall portion 3 a of the base 3.
- the external terminal portion 14 protrudes to the side of the base 3.
- the other portion of the internal terminal portion 13 is embedded in the bottom wall portion 3 a with the upper surface 13 b exposed in the storage space 5.
- the detection element 6 has electrodes formed at four locations, and the electrodes and the internal terminal portions 13 are connected by solder fillets 7 in a one-to-one relationship.
- a first opening 3d is opened from the bottom surface 3c to the lower surface 11a of the first plate portion 11, and from the bottom surface 3c to the inside.
- a second opening 3 e is opened to the lower surface 13 a of the terminal portion 13.
- the metal conductor 10 is installed inside the mold 20 partly shown in FIGS. At this time, as shown in FIG. 5, the first plate portion 11 is supported by a support protrusion 21 provided in the mold 20, and as shown in FIG. 6, the internal terminal portion 13 is a support protrusion 22. The molten resin is injected into the mold 20 while being supported. Since the metal conductor 10 is supported by the support protrusions 21 and 22, the metal conductor 10 can be accurately positioned in the cavity of the mold 20, and the base 3 can be injection-molded.
- the support protrusions 21 and 22 are retracted in the mold 20 and extracted from the bottom wall portion 3a, and the mold 20 is separated and molded.
- the subsequent substrate 3 is taken out.
- a first opening 3 d is formed where the support protrusion 21 is extracted
- a second opening 3 e is formed where the support protrusion 22 is extracted.
- the metal conductor 10 has different surface treatment conditions depending on the location.
- the metal conductor 10 can be divided into sections (i), (ii), (iii), and (iv) according to the difference in the conditions.
- FIG. 5, and FIG. 6 show the IV, V, and VI parts of FIG. 3 in an enlarged manner.
- the lower surface 11a of the first plate portion 11 and the left surface 12a of the second plate portion 12 and the lower surface 13a of the internal terminal portion 13 The insulating resin layer 31 is formed, and the adhesive resin layer 32 is formed on the insulating resin layer 31.
- the adhesive resin layer 32 is formed on the upper surface 11 b of the first plate portion 11 and the right surface 12 b of the second plate portion 12.
- the metal conductor 10 in the embodiment is silver-plated on both surfaces of the phosphor bronze plate, and various protective agents such as a fluorine-based sulfidation inhibitor and a rust preventive agent are applied to the surface of the silver plating. Yes.
- the surface of the metal plate forming the metal conductor 10 is irradiated with vacuum ultraviolet light.
- vacuum ultraviolet light As a light source for vacuum ultraviolet light, an excimer UV lamp (wavelength: 172 nm) in which xenon gas is sealed is preferably used. Since the vacuum ultraviolet light is greatly attenuated in the atmosphere, the distance between the metal conductor 10 and the lamp is set close to several mm to several tens mm.
- the organic substance on the surface of the metal conductor 10 is cut by the low wavelength ultraviolet light, and oxygen in the air between the lamp and the metal conductor 10 is decomposed to form ozone.
- the protective agent on the surface is removed.
- the polarization of the surface of the metal conductor 10 is promoted, the surface free energy is increased, and the wettability is improved.
- the insulating resin layer 31 and the adhesive resin layer 32 resin materials having an affinity for each other are selected and used. Further, after the insulating resin layer 31 is formed, the surface is irradiated with vacuum ultraviolet light to increase the surface free energy of the insulating resin layer 31, and then the adhesive resin layer 32 is formed thereon, whereby the insulating resin layer 31 is formed. The adhesion between the layer 31 and the adhesive resin layer 32 can be enhanced.
- the adhesive resin layer 32 is compatible with the synthetic resin constituting the substrate 3, and the synthetic resin constituting the adhesive resin layer 32 and the substrate 3 is selected and used.
- the synthetic resin constituting the substrate 3 is a polyamide, and nylon 9T, which is a kind of so-called engineer plastic, is used.
- the adhesive resin layer 32 is formed using a two-liquid mixed type adhesive resin.
- a nylon base and an isocyanate curing agent are mixed to form a polyamide, and a crosslinking reaction is caused by heat treatment.
- FIG. 7 shows the relationship between temperature rise and state change of the nylon adhesive resin.
- the horizontal axis represents the heating temperature
- the vertical axis represents the heat change
- the positive side of the vertical axis represents the exothermic reaction
- the negative side represents the endothermic reaction.
- the range of (a) shown in FIG. 7 is a process of drying the adhesive resin, and the adhesive resin is in a so-called hot melt state.
- the solvent evaporates by being heated to around 109 ° C., it enters the range (b) and becomes a dry state, and the crosslinking reaction is started as the temperature rises.
- the temperature further exceeds 150 ° C. or 160 ° C. and falls within the range of (c), the three-dimensional crosslinking is promoted to become water insoluble.
- the adhesive resin layer 32 is used in a state where an adhesive resin is applied to the surface of the metal plate material constituting the metal conductor 10 and heated under the temperature condition in the range shown in FIG.
- the adhesive resin is dried under heating conditions of 110 ° C. to 150 ° C. or 110 to 160 ° C., and is used in a temporarily cured state, that is, a partially crosslinked state that is not in a completely crosslinked state.
- the adhesive resin layer 32 is heated and melted by coming into contact with the molten resin injected into the mold, and the adhesive resin layer 32 and the synthetic resin forming the substrate 3 are in a compatible state. Therefore, the molded base 3 is fixed to the metal conductor 10.
- the insulating resin layer 31 and the adhesive resin layer 32 are formed of a resin material having affinity and good adhesion to each other.
- the insulating resin layer 31 is formed of a urethane resin, and isocyanate is used as a curing agent.
- the nylon resin and urethane resin forming the adhesive resin layer 32 are well known to have similar chemical structures, and the insulating resin layer 31 and the adhesive resin layer 32 use the same isocyanate curing agent. is doing. By selecting the resin as the insulating resin layer 31 and the adhesive resin layer 32, the adhesion between the resin layers is improved.
- the insulating resin layer 31 is not in a temporarily cured state as in the adhesive resin layer 32, but is formed in a state in which the three-dimensional crosslinking is promoted and becomes almost insoluble. That is, the adhesive resin layer 32 is formed in a pre-cured state with a low degree of cross-linking, but the insulating resin layer 31 is one in which three-dimensional cross-linking is promoted more than the adhesive resin layer 32. Therefore, the insulating resin layer 31 is used after being heated at a temperature higher than that of the adhesive resin layer 32.
- the heat treatment temperature of the insulating resin layer 31 is preferably 180 ° C. or higher.
- the adhesive resin layer 32 is compatible with the synthetic resin constituting the base 3 as described above, but the insulating resin layer 31 is completely compatible with the synthetic resin constituting the base 3.
- the insulating resin layer 31 remains on the surface of the metal conductor 10.
- FIG. 8 is an electron micrograph of a partial cross-section of the base 3 into which the metal conductor 10 is inserted.
- the metal conductor 10 is obtained by forming the insulating resin layer 31 after the surface is activated by irradiation with vacuum ultraviolet light, and further forming the adhesive resin layer 32 by activating the surface of the insulating resin layer 31 by irradiation with vacuum ultraviolet light. It is. This photo is 50,000x.
- 10 is a metal conductor and 10a is a plating layer. A structure in which the insulating resin layer 31 is in close contact with the surface of the plating layer 10 a and the adhesive resin layer 32 is in a compatible state with the synthetic resin of the substrate 3 appears.
- the adhesive resin layer 32 formed on the two surfaces 11 a and 11 b of the first plate portion 11 of the metal conductor 10 is in a compatible state with the synthetic resin constituting the base body 3.
- the adhesive resin layer 31 formed on the two surfaces 12 a and 12 b of the second plate portion 12 is compatible with the synthetic resin constituting the base 3. Therefore, it is difficult to form a gap in the close contact portion between the metal conductor 10 and the bottom wall portion 3a of the base body 3, and the airtightness of the storage space 5 inside the housing 2 shown in FIG. 2 can be improved.
- the adhesive resin layer 32 is also formed on both surfaces of the bent portion 15 at the boundary between the first plate portion 11 and the second plate portion 12.
- the synthetic resin constituting the substrate 3 can be firmly fixed.
- the flow of the molten resin is deteriorated around the bent portion 15, so that when the resin is cooled and solidified, the sink around the bent portion 15 is called sink. Deformation is likely to occur. If the bottom wall portion 3a is thin, the resin strength tends to decrease at the portion where the bent portion 15 is embedded.
- the adhesive resin layer 32 is provided on both surfaces of the first plate portion 11 and the second plate portion 12 located on both sides of the bent portion 15, and the adhesive resin layer 32 is also provided on the surface of the bent portion 15. Therefore, the metal conductor 10 and the base 3 are firmly fixed in the region including the bent portion 15, and the problem of sink marks and the problem of strength reduction are less likely to occur.
- the adhesive resin layer 32 formed on the two surfaces 11 a and 11 b of the first plate portion 11 is formed of the resin constituting the substrate 3 at the portion where the external terminal portion 14 protrudes from the substrate 3.
- the first plate portion 11 and the base 3 are firmly fixed. Therefore, no gap is formed between the metal conductor 10 and the base body 3 at the protruding base portion of the external terminal portion 14, and the airtightness of the storage space 5 can be kept high. Furthermore, the strength of the base 3 around the protruding base portion of the external terminal portion 14 can be increased.
- the lower surface 13 a of the internal terminal portion 13 is fixed to the synthetic resin constituting the substrate 3 by the adhesive resin layer 32.
- the upper surface 13b of the internal terminal portion 13 is exposed from the bottom wall portion 3a.
- the upper surface 13b is not formed with the insulating resin layer 31 or the adhesive resin layer 32, and is not subjected to the activation treatment using vacuum ultraviolet light. It remains covered with the agent.
- the external terminal portion 14 protrudes to the side of the base 3, but the insulating resin layer 31 and the adhesive resin layer 32 are also formed on the upper surface 14 a and the lower surface 14 b of the external terminal portion 14. Further, the activation treatment using vacuum ultraviolet light is not performed. Therefore, the surfaces 14a and 14b remain silver-plated with a protective agent such as an antisulfurizing agent.
- the upper surface 13b of the internal terminal portion 13, the lower surface 14a and the upper surface 14b of the external terminal portion 14 can be kept in a state in which silver plating is hardly corroded.
- the lower surface 11 a of the first plate portion 11 is supported in contact with the support protrusion 21 in the mold, and the internal terminal portion
- the molds and the support protrusions 21 and 22 are heated in a state where the lower surface 13a of 13 is also in contact with and supported by the support protrusion 22.
- the temporarily cured adhesive resin layer 32 is melted at the portion where the support protrusions 21 and 22 are in contact, and the adhesive resin layer 32 is removed at the portion where the support protrusions 21 and 22 are in contact.
- the adhesive resin layer 32 is heat-processed in the range of (b) shown in FIG. 7, and adhesiveness has fallen compared with the hot-melt state of the range of (a). Therefore, the molten adhesive resin layer 32 is unlikely to adhere to the tip surfaces of the support protrusions 21 and 22.
- the insulating resin layer 31 is formed in a three-dimensional cross-linked state, it does not melt due to the mold temperature, and the surface of the metal conductor 10 is the insulating resin layer even at the part where the support protrusions 21 and 22 abut. The state covered with 31 is maintained.
- openings 3 d and 3 e that communicate with the metal conductor 10 from the bottom surface 3 c are formed in a plurality of locations on the bottom wall portion 3 a of the base body 3.
- the adhesive resin layer 32 and the resin constituting the substrate 3 are cured after being in a compatible state, the periphery of the openings 3d and 3e is around the openings 3d and 3e.
- the metal conductor 10 and the base body 3 are in close contact with each other and firmly fixed. Therefore, no gap is formed in the peripheral portion, and the airtightness in the storage space 5 can be further enhanced.
- the metal conductor 10 is exposed inside the openings 3d and 3e that open to the bottom surface 3c of the bottom wall 3a. However, as shown in FIGS. 5 and 6, the metal conductor 10 is formed inside the openings 3d and 3e. Since the surface is covered with the insulating resin layer 31, the insulation of the metal conductor 10 is maintained.
- the housing 2 is a small cube having a side of 5 mm or less and further 2 mm or less, if moisture adheres to the bottom surface 3 c of the base 3, the moisture easily enters the openings 3 d and 3 e at a plurality of locations at the same time. .
- the surface of the metal conductor 10 appearing at the bottoms of the openings 3d and 3e is covered and insulated by the insulating resin layer 31, it is possible to prevent the metal conductors 10 from being short-circuited by moisture.
- the synthetic resin constituting the substrate 3 is described as nylon 9T, the adhesive resin constituting the adhesive resin layer 32 as nylon resin, and the resin forming the insulating resin layer 31 as urethane resin.
- the resins are not limited to the above combinations as long as they have compatibility and affinity with each other.
- urethane-urethane acrylic-acrylic, olefin-olefin, epoxy-epoxy, isocyanate-isocyanate, and other materials
- epoxy-urethane, urethane- Combinations of isocyanate, epoxy-isocyanate, etc. are possible.
- the activation treatment for promoting the polarization is not limited to the irradiation with vacuum ultraviolet light, but includes plasma treatment, UV ozone treatment, corona treatment, chemical conversion treatment, flame treatment, heat treatment, anodizing treatment, etc. Also good.
- FIG. 12 shows a manufacturing method in order of steps until the base body 3 in which the metal conductor 10 is embedded is formed.
- a mask is manufactured in the process of P1 (process 1) shown in FIG.
- Two types of masks are manufactured: a first mask sheet 40A shown in FIG. 9 and a second mask sheet 40B shown in FIG.
- the first mask sheet 40A is for forming the insulating resin layer 31 and the adhesive resin layer 32 on the lower surfaces 11a, 13a and the left surface 12a of the metal conductor 10
- the second mask sheet 40B is a metal This is for forming the adhesive resin layer 32 on the upper surface 11 b and the right surface 12 b of the conductor 10.
- the metal plate material 50 and the mask sheets 40A and 40B to be the hoop base material are bonded together.
- FIG. 9 is a plan view showing a state in which the first mask sheet 40A is superimposed on the lower surface 50a of the metal plate 50.
- FIG. 11A is a sectional view showing a state in which the first mask sheet 40A is bonded to the lower surface 50a of the metal plate 50.
- the first mask sheet 40A and the metal plate 50 are bonded together by an adhesive so as not to be displaced from each other.
- a planned cutting line 52 for cutting the metal plate 50 by press working and cutting out the four metal conductors 10 is indicated by a broken line.
- the metal plate 50 is obtained by applying silver plating to both surfaces of a phosphor bronze plate and applying a protective agent for preventing sulfidation to the surface of the silver plating.
- the metal plate 50 is formed with transfer holes 51 at regular intervals for feeding into the insert-molding mold 20.
- the mask is manufactured from a resin film such as a PET (polyethylene terephthalate) film.
- the first mask sheet 40A has four mask openings 41 corresponding to the section (i) of the metal conductor 10 shown in FIG. Each mask 1 is superimposed on a part of the metal conductor 10.
- FIG. 10 shows a state in which the second mask sheet 40B is superimposed on the upper surface 50b of the metal plate 50.
- a mask opening 42 is formed in the second mask sheet 40B.
- the mask openings 42 correspond to the section (ii) of the metal conductor 10 shown in FIG. 3, and when the second mask sheet 40B is bonded to the upper surface 50b, each mask opening 42 becomes a metal. It overlaps with the part which becomes the conductor 10.
- activation processing for partially promoting the polarization is performed on the lower surface 50a and the upper surface 50b of the metal plate 50.
- the activation process is performed by irradiating the lower surface 50a of the metal plate 50 exposed in the mask opening 41 of the first mask sheet 40A shown in FIG. 9 with vacuum ultraviolet light. Similarly, the upper surface 50b exposed in the mask opening 42 of the second mask sheet 40B shown in FIG. 10 is irradiated with vacuum ultraviolet light to be activated.
- excimer light having a wavelength of 172 nm is used, and a light source of 10 to 15 mW is irradiated on the surfaces 50a and 50b of the metal plate 50 close to a distance of 5 mm or less, preferably about 3 mm, for about 10 seconds.
- the polarity is promoted by, for example, decomposing oxygen on the metal surface.
- the surface free energy of the metal surface after the activation treatment is preferably 35 mJ / m 2 or more.
- the upper limit is not particularly limited, but is about 50 mJ / m 2 to 300 mJ / m 2 .
- the insulating resin layer 31 is formed on the lower surface 50a of the metal plate 50 exposed from the mask opening 41 of the first mask sheet 40A shown in FIG.
- the resin material constituting the insulating resin layer 31 is a mixture of urethane resin and isocyanate curing agent.
- the resin material is temporarily dried under low-temperature heating conditions, and in the subsequent process of P6, for example, it is heated at a temperature of 180 ° C. or more, and is three-dimensionally cross-linked and cured, thereby forming the insulating resin layer 31. Complete.
- the surface of the cured insulating resin layer 31 is irradiated with vacuum ultraviolet light to promote the polarization of the surface of the insulating resin layer 31.
- the adhesive resin layer 32 is formed on the surface of the insulating resin layer 31.
- the adhesive resin for forming the adhesive resin layer 32 a two-component mixed type of a nylon main agent and an isocyanate curing agent is used.
- the bonding resin is temporarily dried in the process of P9 in FIG. 12, and is heat-treated in the process of P10.
- the adhesive resin is heat-treated in the range of 110 to 150 ° C. or 110 to 160 ° C. after printing, and the adhesive resin layer is in a pre-cured state in which three-dimensional crosslinking has not completely progressed. 32 is formed.
- the adhesive resin layer 32 is also formed on the upper surface 50b of the metal plate 50 shown in FIG. 10 in the process P8, the process P9, and the process P10.
- the insulating resin layer 31 is not formed on the upper surface 50b, and the insulating resin layer 31 is formed after the vacuum ultraviolet light treatment is performed in the step P3.
- the first mask sheet 40A and the second mask sheet 40B are peeled from the metal plate material 50.
- FIG. 11A shows a state in which the insulating resin layer 31 and the adhesive resin layer 32 are overlapped with the metal plate material 50 and the first mask sheet 40A being bonded together.
- FIG. 11B when the first mask sheet 40A is peeled from the metal plate 50, the resin layers 31 and 32 are formed in the region where the mask opening 42 is formed.
- the length of the metal conductor 10 is less than 1 mm and the area of the region where the resin layers 31 and 32 are formed is very small, the lower surface 50a of the metal plate 50 is formed by vacuum ultraviolet light inside the mask opening 42. Since the activation process is performed to improve the wettability, the resin layers 31 and 32 in the mask opening 41 are not peeled together when the first mask sheet 40A is peeled off.
- the second mask sheet 40B shown in FIG. 10 is peeled off from the upper surface 50b of the metal plate 50, and the adhesive resin layer 32 is formed in the portion where the mask opening 42 of the second mask sheet 40B is formed.
- the process proceeds to the pressing process.
- the metal plate material 50 is cut along the planned cutting line 52 shown in FIGS. 9 and 10.
- the left and right metal conductors 10 are integrally connected to the inside of the transport hoops 53, 53 on both the left and right sides. Furthermore, the respective metal conductors 10 are bent into a three-dimensional shape shown in FIGS. 2 and 3 by bending.
- the metal conductor 10 integral with the transport hoop parts 53, 53 is supplied into the mold 20 which is only partially shown in FIGS.
- the first plate portion 11 of the conductor 10 is supported by the support protrusion 21, and the internal terminal portion 13 is supported by the support protrusion 22.
- molten resin is inject
- the side surface of the plate portion 11 is a portion where the cut surface of the metal conductor 10 is exposed in the pressing process, and the adhesive resin layer 32 does not exist, but the adhesive resin layer 32 is softened and melted by heat at the time of molten resin injection. Since the resin pressure wraps around the side surface of the plate portion 11 and is fixed and sealed, no gap is formed in this portion, and the airtightness in the storage space 5 is not impaired.
- the metal conductor 10 is cut and separated from the transport hoop parts 53, 53, and the electronic component shown in FIGS. 1 and 2 is completed.
- the vacuum ultraviolet light treatment and the molding process of the resin layer 31.32 are performed in a state where the lower surface 50a and the upper surface 50b of the metal plate 50 are flat. Thereafter, cutting and bending are performed to form the three-dimensional metal conductor 10. Therefore, the resin layers can be formed on both surfaces of the first plate portion 11 and the second plate portion 12 after bending and the bent portion 15, and the fixing strength between these portions and the substrate 3 can be increased. In particular, the insulating resin layer 31 and the adhesive resin layer 32 can be formed on the bent portion and the three-dimensional shape portion even if the metal conductor 10 has a total length of less than 1 mm, for example.
- the same mask is used in the processes from P3 to P10.
- Different masks may be used in the molding of the insulating resin layer 31 in the process of P4 and the molding of the adhesive resin layer 32 in the process of P8, Different masks may be used.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
(1)金属板材の表面に、部分的に、活性化処理を施す工程と、
(2)前記活性化処理を施した領域に接着樹脂層を形成する工程と、
(3)前記(1)(2)の工程の後に、前記金属板材から、少なくとも一部に前記接着樹脂層を有する前記金属導体の切出しと曲げ加工を行う工程と、
(4)前記金属導体を金型内に設置し合成樹脂を前記金型内に射出して前記基体を成形する工程と、
を有することを特徴とするものである。
(1b)前記絶縁樹脂層の表面の少なくとも一部に、第2の活性化処理を施す工程と、
が含まれ、
前記(2)の工程では、前記第2の活性化処理を施した前記絶縁樹脂層の上に前記接着樹脂層を形成するものである。
図12には、金属導体10が埋設された基体3が成形されるまでの製造方法が工程順に示されている。
2 ハウジング
3 基体
3a 底壁部
3d,3e 開口部
5 収納空間
6 検知素子
10 金属導体
11 第1の板部
11a 下側表面
11b 上側表面
12 第2の板部
12a 左側表面
12b 右側表面
13 内部端子部
13a 下側表面
13b 上側表面
14 外部端子部
15 屈曲部
20 金型
21,22 支持突体
31 絶縁樹脂層
32 接着樹脂層
40A 第1のマスクシート
40B 第2のマスクシート
41,42 開口部
50 金属板材
50a 下側表面
50b 上側表面
52 切断予定線
53 搬送フープ部
Claims (10)
- 金属導体をインサートして合成樹脂製の基体を成形する電子部品の製造方法において、(1)金属板材の表面に、部分的に、活性化処理を施す工程と、
(2)前記活性化処理を施した領域に接着樹脂層を形成する工程と、
(3)前記(1)(2)の工程の後に、前記金属板材から、少なくとも一部に前記接着樹脂層を有する前記金属導体の切出しと曲げ加工を行う工程と、
(4)前記金属導体を金型内に設置し合成樹脂を前記金型内に射出して前記基体を成形する工程と、
を有することを特徴とする電子部品の製造方法。 - 前記(1)の工程と(2)の工程との間に、
(1a)前記活性化処理を施した領域に絶縁樹脂層を形成する工程と、
(1b)前記絶縁樹脂層の表面の少なくとも一部に、第2の活性化処理を施す工程と、
が含まれ、
前記(2)の工程では、前記第2の活性化処理を施した前記絶縁樹脂層の上に前記接着樹脂層を形成する、請求項1記載の電子部品の製造方法。 - 前記金属板材に重ねられた同じマスクを使用して、前記(1)と(2)の処理が行われる請求項1記載の電子部品の製造方法。
- 前記金属板材に重ねられた同じマスクを使用して、前記(1)と(1a)(1b)ならびに(2)の処理が行われる請求項2記載の電子部品の製造方法。
- 前記(4)の工程では、前記金型内に設置された前記金属導体の前記絶縁樹脂層が形成されている部分を支持突体で支持して、基体の成形を行う請求項2または4記載の電子部品の製造方法。
- 前記(2)で形成される前記接着樹脂層と、前記(4)の射出成形で使用される合成樹脂とが、相溶性を有する請求項1ないし5のいずれかに記載の電子部品の製造方法。
- 前記(2)で形成される前記接着樹脂層は、前記(1a)で形成される絶縁樹脂層よりも架橋の程度が低い仮硬化の状態で、前記(3)(4)の工程に移行する請求項2,4,5のいずれかに記載の電子部品の製造方法。
- 前記活性化処理は、真空紫外光を照射する極性化処理である請求項1ないし7のいずれかに記載の電子部品の製造方法。
- 前記(2)の工程では、金属導体における基体に埋設される部分の両表面に前記接着樹脂層を形成する請求項1ないし8のいずれかに記載の電子部品の製造方法。
- 前記金属導体は、その一部が前記基体から突出して端子部となっており、前記端子部には、前記(1)の活性化処理を施さない請求項1ないし9のいずれかに記載の電子部品の製造方法。
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CN107230641A (zh) * | 2016-03-24 | 2017-10-03 | 英飞凌科技股份有限公司 | 具有嵌入导电层和增强密封的模制腔封装体 |
WO2018143274A1 (ja) * | 2017-02-03 | 2018-08-09 | ポリプラスチックス株式会社 | 樹脂成型品の接合方法 |
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