WO2015151292A1 - Unité de carte de circuits imprimés - Google Patents

Unité de carte de circuits imprimés Download PDF

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Publication number
WO2015151292A1
WO2015151292A1 PCT/JP2014/060033 JP2014060033W WO2015151292A1 WO 2015151292 A1 WO2015151292 A1 WO 2015151292A1 JP 2014060033 W JP2014060033 W JP 2014060033W WO 2015151292 A1 WO2015151292 A1 WO 2015151292A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed wiring
wiring board
board unit
electrode
unit according
Prior art date
Application number
PCT/JP2014/060033
Other languages
English (en)
Japanese (ja)
Inventor
亮平 川端
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2016511303A priority Critical patent/JP6177427B2/ja
Priority to PCT/JP2014/060033 priority patent/WO2015151292A1/fr
Publication of WO2015151292A1 publication Critical patent/WO2015151292A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Definitions

  • the present invention relates to a printed wiring board unit in which a plurality of printed wiring boards are integrated.
  • Patent Document 1 a male connector is mounted on each printed wiring board, and a female connector connected to both ends of a lead wire is attached to the male connector, whereby electrical connection between the printed wiring boards is achieved. Has been done.
  • Patent Document 2 discloses that the other printed wiring board on which a special lead pin is mounted is inserted into the electrode portion provided at the end of one printed wiring board and is electrically bonded by soldering. ing.
  • Patent Document 3 an electrode is installed at the end of one printed wiring board, a slit and an electrode are installed in the other printed wiring board, and the other printed wiring board is inserted into the slit of one printed wiring board.
  • the electrodes installed on each printed wiring board are electrically joined by directly soldering them.
  • Patent Documents 1 and 2 a member such as a connector or a special lead pin is required for connection between the printed wiring boards, which increases the cost. Further, in Patent Documents 1 to 3, since it is necessary to consolidate electrodes connected to the outside of connectors and the like at predetermined portions of the printed wiring board, it is necessary to consolidate the conductor patterns forming the circuit at the connection locations. The degree of freedom is low and the substrate cannot be miniaturized.
  • the present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a printed wiring board unit that can be reduced in size while improving connection reliability at a low cost.
  • the printed wiring board unit of the present invention is a printed wiring board unit including a first printed wiring board and a second printed wiring board bonded onto the first printed wiring board, and the first printed wiring board is It has a surface electrode to which the second printed wiring board is bonded to the surface, and the second printed wiring board is integrally bonded and electrically connected to the surface electrode of the first printed wiring board by soldering. A junction electrode is provided.
  • the surface electrode of the first printed wiring board and the joining electrode of the second printed wiring board are soldered so that the first printed wiring board and the second printed wiring board are integrated. And are electrically connected to each other. This eliminates the need for a member for electrical connection, and eliminates the need to draw a useless pattern because it is not necessary to consolidate electrodes to be connected to the outside, while increasing connection reliability at a low cost. Miniaturization can be realized.
  • FIG. 1 It is a perspective view which shows the printed wiring board unit which concerns on Embodiment 1 of this invention. It is a disassembled perspective view of the printed wiring board unit of FIG. It is a perspective view which shows an example of the 1st printed wiring board in the printed wiring board unit of FIG. It is a perspective view of the surface side of the 2nd printed wiring board in the printed wiring board unit of FIG. It is a perspective view of the back surface side of the 2nd printed wiring board in the printed wiring board unit of FIG. It is sectional drawing which shows an example of the 2nd printed wiring board in the printed wiring board unit of FIG. It is a schematic diagram which shows Embodiment 2 of the 2nd printed wiring board in the printed wiring board unit of this invention.
  • FIG. 1 is a perspective view showing a printed wiring board unit according to Embodiment 1 of the present invention
  • FIG. 2 is an exploded perspective view of the printed wiring board unit of FIG.
  • a second printed wiring board 20 is integrally joined and electrically connected to a first printed wiring board 10.
  • the first printed wiring board 10 and the second printed wiring board 20 are made of a known material such as glass or epoxy.
  • FIG. 3 is a perspective view showing an example of the first printed wiring board in the printed wiring board unit of FIG. 1, and the first printed wiring board 10 will be described with reference to FIGS.
  • the first printed wiring board 10 is formed in, for example, a rectangular shape, and has a surface electrode 11 to which the second printed wiring board 20 is bonded to the surface 10A.
  • a plurality of surface electrodes 11 are provided in a predetermined region of the first printed wiring board 10 and have a predetermined conductor pattern in which, for example, a plurality of lands are formed.
  • a predetermined conductor pattern (not shown) for mounting other electronic components EP is formed on the surface 10A of the first printed wiring board 10, and the conductor pattern is formed on the conductor pattern.
  • the electronic component EP can be connected.
  • FIG. 4 is a perspective view of the front surface side of the second printed wiring board in the printed wiring board unit of FIG. 1
  • FIG. 5 is a perspective view of the back surface side of the second printed wiring board 20 in the printed wiring board unit 1.
  • the second printed wiring board 20 will be described with reference to FIG.
  • the second printed wiring board 20 is a so-called double-sided printed wiring board, for example, and is formed in a rectangular shape.
  • the second printed wiring board 20 has a smaller size than the first printed wiring board 10.
  • An electronic component EP such as an IC chip and a capacitor is mounted on the surface 20A side of the second printed wiring board 20.
  • FIG. 6 is a cross-sectional view showing an example of a second printed wiring board in the printed wiring board unit of FIG.
  • a bonding electrode 21 having a predetermined conductor pattern is formed on the back surface 20B side, and a mounting electrode 22 having a predetermined conductor pattern is formed on the front surface 20A side.
  • the bonding electrode 21 has, for example, the same conductor pattern as the surface electrode 11, and the bonding electrode 21 is installed at the same position of the surface electrode 11.
  • the surface electrode 11 and the joining electrode 21 should just be joined, and may have a different conductor pattern.
  • the electronic component EP is joined to the mounting electrode 22 by soldering S. Further, the second printed wiring board 20 is formed with an interlayer connection portion 23 formed of a through hole that electrically connects the bonding electrode 21 and the mounting electrode 22.
  • the junction electrode 21, the mounting electrode 22, and the interlayer connection portion 23 constitute a predetermined electric circuit. Note that the bonding electrode 21 and the mounting electrode 22 have a structure formed on the interlayer connection portion 23, for example.
  • the bonding electrode 21 is bonded to the surface electrode 11 of the first printed wiring board 10 so that the first printed wiring board 10 and the second printed wiring board 20 are integrally bonded and electrically connected.
  • paste solder is supplied to the surface electrode 11 of the first printed wiring board 10, and soldering is performed after the second printed wiring board 20 is mounted, whereby the first printed wiring board 10 and the second printed wiring board 20.
  • the printed wiring board unit 1 can be obtained.
  • the connection between the first printed wiring board 10 and the second printed wiring board 20 is performed at the surface electrode 11 and the bonding electrode 21, it is not necessary to use a member such as a connector for connecting the substrates,
  • the first printed wiring board 10 and the second printed wiring board 20 can be electrically connected while increasing connection reliability at a low cost. That is, when a member such as a connector or a lead pin is used for connection between printed wiring boards as in the prior art, the cost increases.
  • the degree of freedom in design is low and the substrate cannot be downsized.
  • the solder joint portion becomes thinner than the conductor width due to surface tension, and therefore it is necessary to widen the conductor width in order to ensure joining reliability. Moreover, since it is necessary to widen the pitch between the electrodes in order to suppress the bridging failure that occurs during soldering, it is difficult to perform multipoint connection. Furthermore, when installing and soldering an electrode that divides the through hole in half on the side of the substrate, the problem is that the through hole is easy to peel off from the base material by splitting it in half, so the strength is weak and the long-term connection reliability is poor. is there. On the other hand, in the printed wiring board unit 1 of FIG.
  • the surface electrode 11 is formed on the front surface 10 ⁇ / b> A of the first printed wiring board 10, and the bonding electrode 21 is formed on the back surface 20 ⁇ / b> B of the second printed wiring board 20. Therefore, the number of electrodes that can be installed is large and multipoint connection is possible, and the possibility that the conductor is peeled off from the base material is low.
  • FIG. FIG. 7 is a schematic diagram showing the second embodiment of the second printed wiring board in the printed wiring board unit of the present invention.
  • the second printed wiring board 120 will be described with reference to FIG.
  • the second printed wiring board 120 of FIG. 7 is different from the second printed wiring board 20 of Embodiment 1 in that it is composed of a multilayer printed wiring board.
  • the second printed wiring board 120 is formed of a multilayer printed wiring board such as a build-up multilayer printed wiring board, and the bonding electrode 21 and the mounting electrode 22 are electrically connected by an interlayer connection portion 123 formed of a via. ing. Even when a multilayer printed wiring board is used as the second printed wiring board 120, the connection between the first printed wiring board 10 and the second printed wiring board 120 is the surface as in the first embodiment. Since it is performed in the electrode 11 and the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates, and the first printed wiring board 10 and the second printed wiring board 120 are electrically connected at low cost. Can be connected to.
  • FIG. FIG. 8 is a schematic diagram showing Embodiment 3 of the second printed wiring board in the printed wiring board unit of the present invention.
  • the second printed wiring board 220 will be described with reference to FIG.
  • part which has the same structure as the 2nd printed wiring board 20 of Embodiment 1 is attached
  • the second printed wiring board 220 in FIG. 8 is different from the second printed wiring board 20 in the first embodiment in that the formation positions of the interlayer connection part (through hole) 23 and the bonding electrode 221 are shifted.
  • the bonding electrode 221 is provided at a position shifted from the formation position of the interlayer connection portion 23, and the bonding electrode 221 and the interlayer connection portion 23 are electrically connected by the connection wiring pattern 222.
  • the connection wiring pattern 222 is formed in the inner layer of the second printed wiring board 220, and the bonding electrode 221 is connected to a via (not shown) connected to the connection wiring pattern 222.
  • the interlayer connection 23 and the bonding electrode 221 are connected to each other within the second printed wiring board 220.
  • connection wiring pattern 222 is formed on the inner layer.
  • the connection wiring pattern 222 is formed on the back surface 10B side using a double-sided printed wiring board. You may make it do.
  • the bonding electrode 221 can be formed on the back surface 20B regardless of the position of the interlayer connection portion 23 penetrating the front surface 10A and the back surface 10B, the degree of freedom in design can be improved. Further, even when such a second printed wiring board 220 is used, the connection between the substrate of the first printed wiring board 10 and the second printed wiring board 220 is similar to that of the first embodiment. Since it is performed at the bonding electrode 221, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates to each other, and the first printed wiring board 10 and the second printed wiring board 220 can be reduced while improving connection reliability at low cost. Can be electrically connected.
  • FIG. 9 is a schematic view showing a printed wiring board unit according to a fourth embodiment of the present invention.
  • the printed wiring board unit 300 will be described with reference to FIG.
  • symbol is attached
  • the printed wiring board unit 300 of FIG. 7 is different from the printed wiring board unit 1 of the first embodiment in that a notch 301 is provided.
  • the notch 301 is formed at one corner of the four corners, and the second printed wiring board 320 has a laterally asymmetric or vertically asymmetric outer shape.
  • the second printed wiring board 320 has a laterally asymmetric or vertically asymmetric outer shape.
  • it is not limited to the shape of the notch part 301, A various shape is employable.
  • the second printed wiring board 320 is attached to the first printed wiring board 10 by making the outer shape of the second printed wiring board 320 left-right asymmetric or up-down asymmetrical, it is possible to distinguish the attachment direction from the appearance. Can do.
  • a protruding member 311 is provided at a portion corresponding to the position of the notch 301 when the second printed wiring board 20 is joined to the first printed wiring board 10.
  • the protruding member 311 is made of an electronic component EP, for example.
  • the protruding member 311 may be made of a jumper component or the like.
  • the connection between the substrate of the first printed wiring board 10 and the second printed wiring board 320 is similar to that of the first embodiment. Since it is performed at the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates, and the first printed wiring board 10 and the second printed wiring board 320 can be reduced while improving connection reliability at a low cost. Can be electrically connected.
  • FIG. FIG. 10 is a schematic view showing an embodiment of the printed wiring board unit of the present invention.
  • the printed wiring board unit 400 will be described with reference to FIG. In the printed wiring board unit 400 of FIG. 10, parts having the same configurations as those of the printed wiring board unit 1 of FIG.
  • the printed wiring board unit 400 of FIG. 10 is different from the printed wiring board unit 1 of the first embodiment in that a protruding member 411 is provided on the first printed wiring board 410.
  • the first printed wiring board 410 is provided with a plurality of protruding members 411 protruding from the surface 10A.
  • the plurality of protruding members 411 are made of jumper parts, for example, and are provided at positions that match the outer shape of the second printed wiring board 20.
  • the protruding member 411 may be formed by protruding from the surface 10A, and may be formed of the electronic component EP or the like as in the fourth embodiment.
  • the 2nd printed wiring board 20 may have the notch part 301 like Embodiment 4. FIG.
  • the second printed wiring board 20 can be easily positioned by providing the protruding member 411 on the first printed wiring board 410 side. Further, even when such a first printed wiring board 410 is used, the connection between the first printed wiring board 410 and the second printed wiring board 20 between the substrates is the same as in the first embodiment. Since it is performed in the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates, and the first printed wiring board 410 and the second printed wiring board 20 can be connected at low cost while increasing connection reliability. Can be electrically connected.
  • FIG. FIG. 11 is a schematic diagram showing a printed wiring board unit according to a sixth embodiment of the present invention.
  • the printed wiring board unit 500 will be described with reference to FIG.
  • parts having the same configuration as the printed wiring board unit 1 of the first embodiment are denoted by the same reference numerals and description thereof is omitted.
  • the printed wiring board unit 500 of FIG. 11 is different from the printed wiring board unit 1 of the first embodiment in that a protruding member 511 is provided on the first printed wiring board 510 side and a recess 521 is provided on the second printed wiring board 520 side. Is formed.
  • the first printed wiring board 510 is provided with a projecting member 511 made of, for example, a jumper component or an electronic component EP and projecting from the surface 10A.
  • the second printed wiring board 520 is formed with a recess 521 made of, for example, a slit, and the recess 521 has a size that can accommodate the protruding member 511. Then, when the second printed wiring board 520 is mounted on the first printed wiring board 510, the protruding member 511 is fitted into the recess 521, whereby the second printed wiring board 520 is positioned on the first printed wiring board 510. .
  • both positioning and mounting direction mistakes can be prevented at the same time.
  • FIG. 11 although the case where the protrusion member 511 and the recessed part 521 are provided one each is illustrated, the number of installation is not restricted to this, and positioning accuracy is further improved by installing multiple. Can do.
  • first printed wiring board 510 even when such a first printed wiring board 510 is used, the connection between the first printed wiring board 510 and the second printed wiring board 520 between the substrates is the same as in the first embodiment. Since it is performed at the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates to each other, and the first printed wiring board 510 and the second printed wiring board 520 can be reduced while improving connection reliability at low cost. Can be electrically connected.
  • the embodiment of the present invention is not limited to the above embodiment.
  • the case where one first printed wiring board 10 and one second printed wiring board 20 are integrated is illustrated, but three or more second printed wiring boards are illustrated.
  • the plate 20 may be integrated.
  • a plurality of second printed wiring boards 20 may be bonded to one surface of the first printed wiring board 10, or the second printed wiring boards 20 may be bonded to both surfaces of the first printed wiring board 10. .
  • the printed wiring board is further joined to the 2nd printed wiring board 20.
  • a surface electrode is formed on the surface side of the second printed wiring board 20 in the same manner as the first printed wiring board 10.
  • the case where the protruding member is provided on the first printed wiring board side is illustrated, but a recess is formed on the first printed wiring board side, and the back surface 20B of the second printed wiring board is formed.
  • a convex portion that fits into the concave portion may be formed.
  • Printed wiring board unit 10 410, 510 First printed wiring board, 10A Front surface of first printed wiring board, 10B Back surface of first printed wiring board, 11 Front electrode, 20, 120, 220 320, 520, second printed wiring board, 20A, surface of second printed wiring board, 20B, back surface of second printed wiring board, 21, 221 bonding electrode, 22 mounting electrode, 23 interlayer connection, 222 connection wiring pattern, 301 notch , 311, 411, 511, protruding member, 521, recess, EP electronic component.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une unité de carte de circuits imprimés qui est pourvu d'une première carte de circuits imprimés et d'une seconde carte de circuits imprimés qui est collé sur la première carte de circuits imprimés. La première carte de circuits imprimés porte, sur sa surface supérieure, des électrodes de surface supérieure auxquelles la seconde carte de circuits imprimés est collée. La seconde carte de circuits imprimés est pourvue : d'électrodes de montage disposées sur sa surface supérieure côté composants sur laquelle sont montés des composants électroniques ; d'électrodes de connexion inter-couche qui connectent électriquement des électrodes de collage à des électrodes de montage ; et d'électrodes de collage qui sont disposées sur la surface arrière à l'opposé de la surface supérieure et qui sont collées d'un seul tenant et connectées électriquement, par brasage, aux électrodes de surface supérieure de la première carte de circuits imprimés.
PCT/JP2014/060033 2014-04-04 2014-04-04 Unité de carte de circuits imprimés WO2015151292A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016511303A JP6177427B2 (ja) 2014-04-04 2014-04-04 プリント配線板ユニット
PCT/JP2014/060033 WO2015151292A1 (fr) 2014-04-04 2014-04-04 Unité de carte de circuits imprimés

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/060033 WO2015151292A1 (fr) 2014-04-04 2014-04-04 Unité de carte de circuits imprimés

Publications (1)

Publication Number Publication Date
WO2015151292A1 true WO2015151292A1 (fr) 2015-10-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/060033 WO2015151292A1 (fr) 2014-04-04 2014-04-04 Unité de carte de circuits imprimés

Country Status (2)

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JP (1) JP6177427B2 (fr)
WO (1) WO2015151292A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04340291A (ja) * 1991-05-16 1992-11-26 Minolta Camera Co Ltd 電装基板の接続構造
JPH07202355A (ja) * 1993-12-29 1995-08-04 Matsushita Electric Ind Co Ltd 配線基板とその実装方法
JPH1187873A (ja) * 1997-09-08 1999-03-30 Sony Corp 配線板及びその製造方法並びに半導体装置
JP2004335844A (ja) * 2003-05-09 2004-11-25 Nec Corp 回路基板装置およびその製造方法
JP2007150210A (ja) * 2005-11-30 2007-06-14 Hitachi Cable Ltd アセンブル品及びそのアセンブル方法
JP2007201008A (ja) * 2006-01-24 2007-08-09 Funai Electric Co Ltd フレキシブルフラットケーブルの位置決め構造
JP2008159637A (ja) * 2006-12-20 2008-07-10 Toyota Industries Corp 基板実装方法
JP2010263019A (ja) * 2009-04-30 2010-11-18 Hitachi Cable Ltd はんだ付け位置合せ方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994493A (ja) * 1982-11-20 1984-05-31 三菱電機株式会社 電子部品を有する回路基板装置
JPS6110299A (ja) * 1984-06-26 1986-01-17 三菱電機株式会社 集積回路実装構造
JPH0351988Y2 (fr) * 1984-09-21 1991-11-08
JPS6457789A (en) * 1987-08-28 1989-03-06 Mitsubishi Electric Corp Electronic component mounting structure
JPH01122582A (ja) * 1987-11-06 1989-05-15 Nippon Telegr & Teleph Corp <Ntt> 電気接続器
JP2913891B2 (ja) * 1990-12-04 1999-06-28 三菱電機株式会社 多層配線基板
JPH0523568U (ja) * 1991-09-09 1993-03-26 三菱電機株式会社 小型モジユール実装装置
US5657208A (en) * 1995-07-28 1997-08-12 Hewlett-Packard Company Surface mount attachments of daughterboards to motherboards
FR2742293B1 (fr) * 1995-12-07 2000-03-24 Sagem Assemblage de cartes electroniques, et procede de fabrication d'un tel assemblage
JP2730572B2 (ja) * 1996-03-21 1998-03-25 日本電気株式会社 液晶表示装置及びその製造方法
JPH1167947A (ja) * 1997-08-20 1999-03-09 Sony Corp ハイブリッド集積回路装置の表面実装方法及びハイブリッド集積回路装置及びハイブリッド集積回路装置の実装体
US6137693A (en) * 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
US6285558B1 (en) * 1998-09-25 2001-09-04 Intelect Communications, Inc. Microprocessor subsystem module for PCB bottom-side BGA installation
FR2789541B1 (fr) * 1999-02-05 2001-03-16 Novatec Sa Soc Procede de realisation de modules electroniques a connecteur a billes ou a preformes integre brasables sur circuit imprime et dispositif de mise en oeuvre
EP1168445A1 (fr) * 1999-12-27 2002-01-02 Mitsubishi Denki Kabushiki Kaisha Circuit integre
JP2001257445A (ja) * 2000-03-10 2001-09-21 Mitsubishi Electric Corp プリント配線板
US6529027B1 (en) * 2000-03-23 2003-03-04 Micron Technology, Inc. Interposer and methods for fabricating same
JP2002076561A (ja) * 2000-08-24 2002-03-15 Sony Corp 立体的回路基板装置及び立体的回路基板装置の製造方法
WO2002057921A1 (fr) * 2001-01-19 2002-07-25 Hitachi,Ltd Dispositif a circuit electronique
US8837161B2 (en) * 2002-07-16 2014-09-16 Nvidia Corporation Multi-configuration processor-memory substrate device
US6806580B2 (en) * 2002-12-26 2004-10-19 Fairchild Semiconductor Corporation Multichip module including substrate with an array of interconnect structures
US20060245308A1 (en) * 2005-02-15 2006-11-02 William Macropoulos Three dimensional packaging optimized for high frequency circuitry
US7205652B2 (en) * 2005-03-23 2007-04-17 Delphi Technologies, Inc Electronic assembly including multiple substrates
JP2006332083A (ja) * 2005-05-23 2006-12-07 Konica Minolta Photo Imaging Inc 回路基板構造
US20070091659A1 (en) * 2005-10-25 2007-04-26 Lin Richard S Power converter comprising a controller and a power component mounted on separate circuit boards
US7477197B2 (en) * 2006-12-29 2009-01-13 Intel Corporation Package level integration of antenna and RF front-end module
JP5207659B2 (ja) * 2007-05-22 2013-06-12 キヤノン株式会社 半導体装置
WO2012137457A1 (fr) * 2011-04-04 2012-10-11 パナソニック株式会社 Structure de montage et son procédé de fabrication
JP5896752B2 (ja) * 2012-01-16 2016-03-30 株式会社ミツトヨ 半導体パッケージ及びその製造方法
FR2988976A1 (fr) * 2012-03-28 2013-10-04 Johnson Contr Automotive Elect Ensemble de cartes a circuits imprimes

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04340291A (ja) * 1991-05-16 1992-11-26 Minolta Camera Co Ltd 電装基板の接続構造
JPH07202355A (ja) * 1993-12-29 1995-08-04 Matsushita Electric Ind Co Ltd 配線基板とその実装方法
JPH1187873A (ja) * 1997-09-08 1999-03-30 Sony Corp 配線板及びその製造方法並びに半導体装置
JP2004335844A (ja) * 2003-05-09 2004-11-25 Nec Corp 回路基板装置およびその製造方法
JP2007150210A (ja) * 2005-11-30 2007-06-14 Hitachi Cable Ltd アセンブル品及びそのアセンブル方法
JP2007201008A (ja) * 2006-01-24 2007-08-09 Funai Electric Co Ltd フレキシブルフラットケーブルの位置決め構造
JP2008159637A (ja) * 2006-12-20 2008-07-10 Toyota Industries Corp 基板実装方法
JP2010263019A (ja) * 2009-04-30 2010-11-18 Hitachi Cable Ltd はんだ付け位置合せ方法

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