WO2015133446A1 - 圧着ヘッド、それを用いた実装装置および実装方法 - Google Patents

圧着ヘッド、それを用いた実装装置および実装方法 Download PDF

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Publication number
WO2015133446A1
WO2015133446A1 PCT/JP2015/056138 JP2015056138W WO2015133446A1 WO 2015133446 A1 WO2015133446 A1 WO 2015133446A1 JP 2015056138 W JP2015056138 W JP 2015056138W WO 2015133446 A1 WO2015133446 A1 WO 2015133446A1
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Prior art keywords
head
substrate
pressing
mounting
crimping
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PCT/JP2015/056138
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English (en)
French (fr)
Japanese (ja)
Inventor
昇 朝日
芳範 宮本
敏史 竹上
将次 仁村
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東レ株式会社
東レエンジニアリング株式会社
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Priority to KR1020167027065A priority Critical patent/KR20160127807A/ko
Publication of WO2015133446A1 publication Critical patent/WO2015133446A1/ja

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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Definitions

  • the present invention adheres to a circuit board such as a flexible substrate, a glass epoxy substrate, a glass substrate, a ceramic substrate, a silicon interposer, or a silicon substrate, and directly bonds or laminates a semiconductor device such as an IC or LSI or other electronic components.
  • the present invention relates to a crimping head for mounting in a state, a mounting apparatus using the same, and a mounting method.
  • flip-chip mounting is a method for mounting electronic components on circuit boards, and three-dimensional stacking is performed three-dimensionally with through electrodes that penetrate the electronic components. Stacked packaging is spreading rapidly. Therefore, it is important to ensure the reliability of bonding in mounting.
  • liquid sealing is performed in the gap between the semiconductor chip and the circuit board. It is a common method to inject and cure the adhesive.
  • a method has been proposed in which a semiconductor chip or a substrate with a bump on which an adhesive has been formed in advance is flip-chip connected to perform electrical bonding and resin sealing at the same time.
  • a substrate on which a semiconductor device is temporarily mounted via an insulating adhesive is placed on a substrate holding plate that is spring-biased upward from the lower die and separated from the lower die, and the upper die with a built-in heater is used as the substrate. Proximity to face. In this state, the substrate is preheated by radiant heat from the upper die, and then the upper die is lowered to fix the semiconductor device to the substrate while pressing and heating (see Patent Document 1).
  • the semiconductor chip height is absorbed to uniformly apply pressure to all the semiconductor chips.
  • a cavity for storing a plurality of heating and pressing tools that simultaneously press a plurality of semiconductor chips is formed in the heating and pressing head, and an elastic body is inserted into the proximal end side of the cavity to heat the cavity.
  • the pressure tool is elastically supported in the pressure heating head (see Patent Document 2).
  • the elastic body interposed between the heating and pressing head and the heating and pressing tool has a thickness that takes into account the elastic deformation to absorb the variation in the height of the semiconductor chip, and heat transfer to the semiconductor chip is hindered. Yes. As a result, there is a disadvantage that heat transfer is delayed and heat loss is caused. Such an inconvenience is not limited to the semiconductor chip, but can also occur when mounting other electronic components. In this case, when the temperature of the heater is increased or the solder bump is used, there is a problem that the adhesive is cured before the solder is melted, resulting in poor connection.
  • the present invention has been made in view of such circumstances, and applies an appropriate pressure to the electronic component to absorb the height variation of the electronic component to prevent breakage and to accelerate heat transfer to the electronic component.
  • the main object of the present invention is to provide a crimping head capable of reliably connecting a bump of an electronic component and a substrate electrode and conducting heat conduction in a short time, and a mounting apparatus and mounting method using the same.
  • This invention has the following configuration in order to achieve such an object.
  • a crimping head for mounting electronic components on a substrate, The head body, A pressing member attached to a lower portion of the head body and pressing an electronic component; An elastic member interposed between the head main body and the pressing member and having a plurality of surfaces divided at a predetermined interval and abutting against at least one surface of the head main body and the pressing member.
  • the elastic member interposed between the crimping head and the pressing member is in contact with at least one of the pressing member and the crimping head through a small-area divided portion. For this reason, when the pressing at the time of crimping acts on the pressing member, each of the divided portions elastically deforms in a substantially radial manner while expanding the area toward the space formed between the adjacent divided portions. That is, the elastic member abutted with a smaller area than the pressing member can be elastically deformed while efficiently expanding the area in a direction orthogonal to the pressing force. Therefore, even if the thickness of the elastic member is reduced, the cushioning property due to elastic deformation can be improved.
  • the crimping head includes, for example, a plurality of pressing members that simultaneously press a plurality of electronic components, An elastic member having a plurality of surfaces may be interposed for each pressing member.
  • the elastic member may be formed of an elastic sheet having a convex surface divided into a plurality of sides on one side of one elastic sheet.
  • the elastic member may be configured by arranging a plurality of elastic members between the head main body and the pressing member at predetermined intervals.
  • the structure provided with the heater embedded at the head main body may be sufficient.
  • all of the plurality of electronic components can be thermocompression bonded simultaneously and evenly on the substrate.
  • the present invention has the following configuration in order to achieve such an object.
  • a mounting device for mounting electronic components on a substrate Any one of the above-described crimping heads; An elevating mechanism for elevating the crimping head; A holding stage for placing and holding the substrate; It is characterized by having prepared.
  • the electronic component may be a semiconductor device having bumps, and may be mounted on a substrate via a thermosetting resin.
  • the bumps of the semiconductor device and the electrodes of the substrate can be connected, and the thermosetting resin interposed between the semiconductor device and the substrate can be thermoset in a short time.
  • the present invention has the following configuration in order to achieve such an object.
  • a mounting method for mounting electronic components In the process of mounting the electronic component on the substrate while applying pressure and heating to the substrate by the crimping head, there is an elastic member in which at least one of the head main body and the pressing member is divided at a predetermined interval between the head main body and the pressing member constituting the crimping head, and the elastic member is arranged in the thickness direction. The elastic member is displaced toward the gap between adjacent elastic members while being deformed.
  • a plurality of elastic members are elastically deformed radially while expanding the area toward a space formed between adjacent divided portions. That is, the elastic member abutted with a smaller area than the pressing member can be efficiently elastically deformed in the direction orthogonal to the pressing force. Therefore, even if the thickness of the elastic member is reduced, the cushioning property due to elastic deformation can be enhanced.
  • the mounting apparatus using the same, and the mounting method the height variation is absorbed without damaging the electronic component, and the heat transfer to the electronic component is accelerated, and the bumps and substrate electrodes of the electronic component
  • the main pressure bonding in which the thermosetting resin interposed between the electronic component and the substrate is thermally cured in a short time.
  • compression-bonding apparatus which comprises a mounting apparatus. It is a top view of a conveyance mechanism. It is a front view of a conveyance mechanism. It is a longitudinal cross-sectional view of a crimping head. It is a perspective view of a pressure bonding head. It is a perspective view of a pressing member and an elastic member. It is a flowchart which shows operation
  • thermosetting resin is preferably NCF (non-conductive adhesive film).
  • the “semiconductor device” in the present invention includes bumps such as an IC chip, a semiconductor chip, an optical element, a surface mount component, a chip, a wafer, TCP (Tape Carrier Package), FPC (Flexible Printed Circuit), etc. is there.
  • These semiconductor devices show all forms on the side to be bonded to the substrate regardless of the type and size, for example, bonding of COG (Chip On Glass), TCP, and FPC which is chip bonding to a flat display panel. OLB (Outer
  • substrate for example, a flexible substrate, a glass epoxy substrate, a glass substrate, a ceramic substrate, a silicon interposer, a silicon substrate, or the like is used.
  • FIG. 1 is a perspective view showing a schematic configuration of a main crimping apparatus constituting a mounting apparatus according to the present invention
  • FIG. 2 is a plan view showing a main configuration of a transport mechanism.
  • the mounting apparatus includes a transport mechanism 1 and a main crimping apparatus 2.
  • a transport mechanism 1 As shown in FIGS. 1 and 2, the mounting apparatus according to the present invention includes a transport mechanism 1 and a main crimping apparatus 2.
  • a main crimping apparatus 2 As shown in FIGS. 1 and 2, the mounting apparatus according to the present invention includes a transport mechanism 1 and a main crimping apparatus 2.
  • the transport mechanism 1 includes a movable table 3 and a transport arm 4.
  • the movable table 3 is configured to move in the horizontal axis direction along the guide rail 5.
  • the transfer arm 4 is connected at its base end side to the lifting / lowering drive mechanism of the movable table 3 and is configured to be movable in the vertical (Z) direction and the Z axis ( ⁇ ) direction.
  • the transfer arm 4 includes a holding frame 6 at the tip. As shown in FIGS. 2 and 3, the holding frame 6 has a horseshoe shape, and includes a plurality of locking claws 7 for locking the plate for heat conduction delay and the substrate W at the corners.
  • the main crimping device 2 includes a movable table 8 and a pressing mechanism 9.
  • the movable table 8 includes a holding stage 10 that holds the substrate W by suction.
  • the holding stage 10 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and around the Z axis ( ⁇ ).
  • the outer shape of the holding stage 10 is set to a size that fits inside the holding frame 6.
  • the holding stage 10 has a heater 11 embedded therein.
  • the pressing mechanism 9 includes a cylinder 13 and a pressure bonding head 14. That is, the cylinder 13 is connected to the upper side of the crimping head 14 so that the crimping head 14 moves up and down.
  • the crimping head 14 includes a head main body 16 in which the heater 15 is embedded, and a support holder 18 in which a plurality of pressing members 17 are housed in the lower portion of the head main body 16.
  • the heater 15 corresponds to the heater of the present invention.
  • the pressing member 17 has a downward convex shape.
  • the tip has an abutment surface that is substantially the same size as the semiconductor device C, and is aligned so as to press a plurality of semiconductor devices C arranged on the substrate W individually.
  • the pressing member 17 is configured such that the base end side is supported by the support holder 18 by passing the tip through a through hole slightly larger than the convex portion formed in the support holder 18. By tightening the support holder 18, the proximal end side of the pressing member 17 is gripped by the support holder 18 and the head body 16.
  • the pressure-bonding head 14 includes an elastic member 19 between the head main body 16 and the pressing member 17.
  • the elastic member 19 is configured by forming a lattice-like groove 20 on one sheet having a size equal to or less than the area of the proximal end of the pressing member 17.
  • the grooves 20 form a plurality of convex divided portions 21 on the sheet surface.
  • the elastic member general rubber can be used, but it is preferable to use heat-resistant fluoro rubber from the viewpoint of heating in particular.
  • the elastic modulus of the elastic member is preferably 70 to 90. If the elastic modulus is small, the lateral rigidity becomes small, and positional deviation is likely to occur. Moreover, since an elastic effect will become small if an elasticity modulus is too large, a film thickness cannot be made thin.
  • the controller 23 controls the temperature of the heater 15 of the pressure bonding head 14 and the temperature of the heater 11 of the holding stage 10 to be equal to or higher than the temperature at which the thermosetting resin G is cured.
  • thermosetting resin is completely cured with respect to the one in which a plurality of semiconductor devices C are transported in a pre-press-bonded state to the substrate W by NCF in the temporary press-bonding step of the previous step.
  • the case of crimping will be described as an example.
  • the temperature of both heaters 11 and 15 provided in the holding stage 10 and the pressure bonding head 14 is set by operating the operation unit 24.
  • the temperatures of both heaters 11 and 15 are set such that the temperature at the interface between the plate P and the substrate W for delaying heat conduction and the interface between the pressure bonding head 14 and the semiconductor device C are higher than the curing temperature of the thermosetting resin G.
  • the curing temperature is set (step S1).
  • the plate P is set so that, for example, the relationship between the heat transfer coefficient (W / m ⁇ K) L and the plate thickness (mm) T, that is, L / T is 1 or more and 20 or less.
  • the plate P is not limited to stainless steel, and may be any material that is not deformed by the pressing of the pressure-bonding head 14, and may be a metal, ceramic, carbon, a porous material, or the like.
  • step S2 When the initial setting is completed, the device is operated (step S2). On the main crimping apparatus side, the controller 23 starts temperature control so as to turn on the heaters 11 and 15 and keep the initial temperature constant.
  • a plate P is placed on the holding frame 6 of the transport mechanism 1 and a substrate W is placed on the plate P after that by a transport robot (not shown) arranged on the temporary press-bonding process side. (Step S3).
  • the plate P and the substrate W are conveyed to the main crimping apparatus 2.
  • the substrate W is transferred to the holding stage 10 as shown by the two-dot chain line in FIG.
  • a plurality of through holes are formed in the plate P and are sucked and held by the holding stage 10 through the through holes (step S4).
  • the holding stage 10 is moved to a predetermined mounting position below the pressure-bonding head 14 which is the front (Y direction in FIG. 1) by a driving mechanism (not shown).
  • the heating is started by the heater 11 from the time when the plate P and the substrate W are attracted and held on the holding stage 10 (step S5).
  • the crimping head 14 When the holding stage 10 reaches the mounting position, as shown in FIG. 9, the crimping head 14 is lowered by the operation of the cylinder 13, and a plurality of semiconductor devices C are sandwiched simultaneously. At this time, the semiconductor device C is pressed while being heated by the heated crimping head 14 (step S6).
  • thermosetting resin G when the pressure bonding head 14 is lowered to a predetermined height, the thermosetting resin G is in an uncured state, so that the bump B of the semiconductor device C is heated by the pressure of the pressure bonding head 14 as shown in FIG. It is pushed into the curable resin G. That is, after the bump B of the semiconductor device C reaches the electrode of the substrate W, the thermosetting resin is cured.
  • the heater temperature is controlled to melt the solder before the adhesive is completely cured.
  • each divided portion 21 expands the area toward the groove 20.
  • step S7 When the semiconductor device C is pressurized and heated until a predetermined time for the thermosetting resin G to cure (step S7), the pressure bonding head 14 is returned to the upper standby position to release the pressure, and the transport mechanism 1 causes the plate P to be released. And the substrate W are unloaded (step S8).
  • the plate P and the substrate W are transported to a predetermined position, they are transferred to another transport robot or stored in a stocker.
  • each divided portion 21 of the elastic member 19 provided between the head main body 16 and the pressing member 17 is elastically deformed while radially expanding in the groove direction along with the compression. Even if the thickness is the same as that of one flat sheet, the amount of displacement when compressed can be made larger than that of a conventional sheet. Therefore, even if the thickness of the entire sheet is reduced, a displacement amount equal to or greater than that of the conventional sheet can be earned. As a result, since the thickness of the elastic member 19 is reduced, the heat of the heater 11 embedded in the head body 16 can be efficiently transmitted to the pressing member 17, so that the thermosetting resin G can be reliably heated in a short time. It can be cured.
  • the present invention is not limited to the embodiment described above, and can be modified as follows.
  • the elastic member 19 is not limited to the above embodiment, and may be configured as follows, for example.
  • the elastic members 19 having an area smaller than the base end face of the pressing member 17 may be arranged and arranged in a two-dimensional array at a predetermined interval.
  • the shape of the divided portion 21 is not limited to a rectangle, and may be any shape that can be displaced radially, for example, a circle or a hexagon.
  • the pressure-bonding head 14 of the above-described embodiment apparatus can be used for a single type for main-bonding one semiconductor device C or a multi-type having a plurality of the single types as shown in FIG. it can.
  • the heater 15 of the crimping head 14 is embedded in the head main body 16, but may be configured to be heated from the outside of the head main body 16. In the above embodiment, the heater is heated to a high temperature. However, a pulse heater that changes the temperature during the process can be used, and mounting can be performed without using a plate for delaying heat conduction.
  • thermosetting resin any implementation that requires absorption can be effectively applied.
  • it may be used for flip chip mounting without interposing a thermosetting resin, die bonding for mounting a non-electrode surface of a semiconductor chip on a substrate via a thermosetting resin, or the like.
  • the present invention may be used when mounting electronic components (resistors, capacitors, piezoelectric elements, etc.) other than semiconductor devices on a substrate.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2015/056138 2014-03-05 2015-03-03 圧着ヘッド、それを用いた実装装置および実装方法 WO2015133446A1 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200235070A1 (en) * 2017-01-30 2020-07-23 Shinkawa Ltd. Mounting apparatus and mounting system

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6663805B2 (ja) 2016-06-28 2020-03-13 東レエンジニアリング株式会社 実装装置および実装方法
JP2019050341A (ja) * 2017-09-12 2019-03-28 東レエンジニアリング株式会社 圧着ヘッドおよび実装装置
JP7181013B2 (ja) * 2018-06-20 2022-11-30 Juki株式会社 電子部品実装装置及び電子部品実装方法
JP2020080383A (ja) * 2018-11-13 2020-05-28 株式会社ブイ・テクノロジー 表示装置の製造方法及び製造装置
US11482505B2 (en) 2019-03-29 2022-10-25 Samsung Electronics Co., Ltd. Chip bonding apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294607A (ja) * 2006-04-24 2007-11-08 Sony Chemical & Information Device Corp 押圧ヘッド及び押圧装置
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
JP2011009357A (ja) * 2009-06-24 2011-01-13 Fujitsu Ltd 実装装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786336A (ja) * 1993-09-10 1995-03-31 Fujitsu Ltd ボンディング装置
JP5401709B2 (ja) 2010-02-02 2014-01-29 アピックヤマダ株式会社 半導体装置の接合装置及び接合方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294607A (ja) * 2006-04-24 2007-11-08 Sony Chemical & Information Device Corp 押圧ヘッド及び押圧装置
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
JP2011009357A (ja) * 2009-06-24 2011-01-13 Fujitsu Ltd 実装装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200235070A1 (en) * 2017-01-30 2020-07-23 Shinkawa Ltd. Mounting apparatus and mounting system
US11545462B2 (en) * 2017-01-30 2023-01-03 Shinkawa Ltd. Mounting apparatus and mounting system

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JP6234277B2 (ja) 2017-11-22
TW201536132A (zh) 2015-09-16
JP2015170646A (ja) 2015-09-28
TWI654912B (zh) 2019-03-21

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