WO2015111756A1 - 粗化処理銅箔、銅張積層板及びプリント配線板 - Google Patents

粗化処理銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
WO2015111756A1
WO2015111756A1 PCT/JP2015/052201 JP2015052201W WO2015111756A1 WO 2015111756 A1 WO2015111756 A1 WO 2015111756A1 JP 2015052201 W JP2015052201 W JP 2015052201W WO 2015111756 A1 WO2015111756 A1 WO 2015111756A1
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Prior art keywords
copper foil
copper
roughened
laser
laser drilling
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PCT/JP2015/052201
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English (en)
French (fr)
Japanese (ja)
Inventor
裕昭 津吉
眞 細川
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三井金属鉱業株式会社
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Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to CN201580005574.0A priority Critical patent/CN105934307B/zh
Priority to JP2015515313A priority patent/JP5901848B2/ja
Priority to KR1020167017277A priority patent/KR101734795B1/ko
Publication of WO2015111756A1 publication Critical patent/WO2015111756A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, e.g. roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the present application relates to a roughened copper foil, a copper-clad laminate, and a printed wiring board, and in particular, relates to a roughened copper foil, a copper-clad laminate, and a printed wiring board having a roughened surface to be a laser absorption surface.
  • Patent Document 1 discloses that a process for forming a blackened film by applying a blackening process to a metal foil, and a method of manufacturing the printed wiring board with high via hole conduction reliability and its manufacturing method are disclosed. Attaching a metal foil to the bottom of the via hole forming portion of the substrate with the blackened film facing the substrate, irradiating the insulating substrate with a laser to form a via hole having the metal foil as the bottom; A process of applying desmear treatment to the metal foil exposed at the bottom, a process of performing soft etching on the metal foil exposed at the bottom of the via hole, and a process of confirming that there is no blackening film on the metal foil surface at the bottom of the via hole by soft etching; , A method of forming a metal plating film inside a via hole and a step of etching a metal foil to form a conductor pattern. .
  • Patent Document 2 discloses a copper-clad laminate suitable for forming a through hole or a through hole for forming a via hole or a recess used for securing interlayer conduction from an outer layer copper foil to a copper foil circuit layer by a laser method.
  • the reflectance of the laser beam is 86% or less
  • lightness L value by forming fine copper oxide or fine copper particles on the surface of the outer layer copper foil of the copper clad laminate, etc.
  • Patent Document 1 discloses a metal foil used when forming a via hole by a so-called conformal mask method. That is, when the metal foil described in Patent Document 1 is used, when forming the via hole, it is necessary to form an opening hole in the via hole forming portion of the metal foil by etching, and the via hole is formed by a so-called direct laser method. I could't.
  • the laser processing of the copper foil and the insulating layer can be performed simultaneously without etching the via hole forming portion, but the laser drilling performance varies.
  • blackening treatment is performed on the copper foil surface, needle-like crystals are formed on the copper foil surface, and the surface becomes a black matte surface, so that the absorbance of laser light is improved.
  • the needle-like crystal is thin from the surface of the copper foil and is long because it protrudes long and is brittle.
  • a roughening process that has high scratch resistance and is easy to handle, and that has a high laser absorbance and is suitable for laser drilling, and an excellent adhesion between the insulating layer constituent materials.
  • a copper foil for laser drilling with a surface, a copper-clad laminate and a printed wiring board using the roughened copper foil have been desired.
  • the roughened copper foil for laser drilling is formed on both surfaces of the copper foil by needle-like or plate-like convex portions having a maximum length of 500 nm or less made of a copper composite compound containing copper oxide.
  • a roughened surface having a fine concavo-convex structure wherein one surface of the copper foil is a laser irradiation surface irradiated with laser light during laser processing, and the other surface is bonded to the insulating layer constituent material It is a surface.
  • the copper-clad laminate according to the present application is characterized in that the roughened copper foil for laser drilling according to the present application is laminated on at least one surface of the insulating layer constituting material.
  • the printed wiring board concerning this application is provided with the copper layer formed using the roughening processing copper foil for laser drilling concerning this application.
  • the roughened copper foil for laser drilling has excellent scratch resistance on each of the laser irradiation surface irradiated with laser light during laser processing and the adhesive surface with the insulating layer constituent material. And a roughened surface having a fine concavo-convex structure formed by needle-like or plate-like convex portions having a maximum length of 500 nm or less made of a copper composite compound containing copper oxide.
  • a copper-clad laminate using a roughened copper foil for laser drilling copper oxide with excellent laser adhesion and excellent scratch resistance as well as excellent adhesion to the insulating layer components.
  • a rough surface with a fine concavo-convex structure made of a copper composite compound is present on the outer surface, so that it exhibits excellent laser drilling performance and is meticulous when an operator handles the copper-clad laminate. This eliminates the need to pay attention to and improves work efficiency. As a result, variation in laser drilling performance for the copper-clad laminate is reduced, and stable drilling is possible.
  • this roughened copper foil for laser drilling is suitable for forming a build-up layer of a printed wiring board, and it is possible to provide a multilayer printed wiring board with good quality.
  • Copper-clad laminate configuration 1. Copper-clad laminate
  • the copper-clad laminate according to the present application is characterized in that the roughened copper foil for laser drilling according to the present application is laminated on at least one surface of the insulating layer constituent material. It is used as a manufacturing material for printed wiring boards manufactured through processing steps.
  • the copper clad laminate according to the present application only needs to be obtained by laminating the roughened copper foil for laser drilling according to the present application on at least one surface of the insulating layer constituent material.
  • stacked the roughening copper foil for laser drilling which concerns on this invention on both surfaces of this material, respectively may be sufficient. Below, the roughening copper foil for laser drilling which concerns on this application is demonstrated first.
  • the roughened copper foil for laser drilling according to the present application is a copper composite that contains copper oxide (and cuprous oxide if necessary) on both sides of the copper foil.
  • a roughened surface having a fine concavo-convex structure formed by needle-like or plate-like convex portions having a maximum length of 500 nm or less made of a compound is provided.
  • the “roughened surface having a fine concavo-convex structure formed by needle-like or plate-like convex portions having a maximum length of 500 nm or less made of a copper composite compound containing copper oxide” is simply referred to as a roughened surface. .
  • the roughened copper foil for laser drilling according to the present application having the roughened surface on both sides may be hereinafter referred to as “double-sided roughened copper foil”. If a copper-clad laminate is manufactured using the double-sided roughened copper foil, the roughened surface on one side is used as a laser-irradiated surface of the copper-clad laminate, and the roughened surface on the other side is an insulating layer. By using the adhesive surface with the constituent material, it is possible to produce a copper-clad laminate having good laser drilling performance and good adhesion between the copper layer and the insulating layer constituent material.
  • the copper foil layer formed with the said double-sided roughening process copper foil etc. is called a copper layer.
  • the copper foil may be a rolled copper foil or an electrolytic copper foil, and the type of the copper foil is not particularly limited.
  • the thickness of the copper foil is not particularly limited, but considering the laser drilling performance when forming a via hole by laser drilling for the copper-clad laminate, The thickness is preferably 12 ⁇ m or less, and more preferably 7 ⁇ m to 12 ⁇ m in view of ease of handling.
  • the “copper foil” referred to in the present application refers to a copper foil before the fine uneven structure is formed.
  • the copper foil in the plane of the laser beam irradiation side, the surface area (three-dimensional area: A ⁇ m 2) when measuring the two-dimensional area of the "57570Myuemu 2 laser method and the ratio of the two-dimensional region area [(A) /
  • the value of “surface area ratio (B)” calculated by (57570)] is preferably 1.1 or more, and more preferably 1.5 or more.
  • the surface area ratio (B) is 1.1 or more, the laser drilling performance is good, and when it is 1.5 or more, it is even better.
  • the value of the specific surface area ratio (B) exceeds 3, the thickness of the copper foil itself varies, and as a result, the laser hole diameter tends to vary.
  • the value of the surface area ratio (B) of the surface on the laser light irradiation side in the copper foil is 3 or less.
  • the surface roughness (Rzjis) of the surface of the copper foil on the laser light irradiation side is preferably 2.0 ⁇ m or more.
  • the fine concavo-convex structure on a copper foil having a surface having a surface roughness (Rzjis) of 2.0 ⁇ m or more, the laser drilling performance is improved, and the surface roughness (Rzjis) is 3. When it becomes 0 ⁇ m or more, it becomes even better. The rougher the surface roughness, the lower the reflectivity of the laser beam in the copper layer, and the better the laser drilling performance.
  • the surface roughness (Rzjis) is 6.0 ⁇ m or more, the thickness of the copper foil itself also varies.
  • the laser hole diameter is likely to vary, and the thickness of the copper foil itself varies. If becomes too large, the roundness of the via hole also decreases. For this reason, it is preferable that the surface roughness (Rzjis) of the surface by the side of the laser beam irradiation in the said copper foil is 6.0 micrometers or less.
  • the surface characteristics of the bonding surface of the copper foil with the insulating resin base material are not particularly limited.
  • a fine film having a good etching factor is used.
  • the surface roughness (Rzjis) is preferably 2.0 ⁇ m or less, more preferably 1.5 ⁇ m or less, and even more preferably 1.0 ⁇ m or less.
  • the glossiness (Gs60 °) of the surface is preferably 100 or more, more preferably 300 or more.
  • the fine concavo-convex structure is formed on the adhesive surface of the copper foil having the above surface characteristics with the insulating layer constituent material, it is possible to obtain a good adhesion with the insulating layer constituent material and to form a circuit with excellent high frequency characteristics. it can. That is, in a high frequency circuit, in order to suppress transmission loss due to the skin effect, it is required to form a circuit with a conductor having a smooth surface.
  • the fine concavo-convex structure referred to in the present application is provided on the adhesive surface, there is a concern about transmission loss of a high-frequency signal due to the fine concavo-convex structure provided on the adhesive surface.
  • the fine concavo-convex structure is formed by a convex portion made of a copper composite compound containing copper oxide (and cuprous oxide if necessary). Not flowing.
  • the said roughening copper foil shows the high frequency characteristic equivalent to the case where a copper layer is formed with the non-roughening copper foil which is not provided with the roughening process surface.
  • the roughened surface has good adhesion to a low dielectric constant insulating layer constituent material used for a high-frequency substrate. Therefore, the double-sided roughened copper foil provided with the fine concavo-convex structure on both sides of the copper foil is also suitable as a high-frequency circuit forming material and a circuit forming material for a multilayer printed wiring board.
  • Fine concavo-convex structure The fine concavo-convex structure referred to in the present application is formed by “a needle-like or plate-like convex portion having a maximum length of 500 nm or less made of a copper composite compound containing copper oxide”.
  • the fine concavo-convex structure can be obtained, for example, by subjecting the surface of the copper foil to oxidation treatment by a method described later, and then performing reduction treatment as necessary.
  • This double-sided roughened copper foil and laminating it on an insulating layer constituent material to produce a copper-clad laminate the fine uneven structure is provided on the surface, and the insulating layer constituent material and the copper layer are in close contact with each other.
  • a copper-clad laminate with good properties can be easily obtained.
  • FIG. 1 a roughened surface (a roughened surface on the electrode surface side 3, a roughened surface 4 on the deposition surface side) when a general electrolytic copper foil is used as a double-sided roughened copper foil ( The scanning electron microscope observation images of FIGS. 3 to 6)) are shown.
  • fine convex portions protruding in a needle shape or a plate shape are gathered while being adjacent to each other, thereby forming a surface on the electrolytic copper foil.
  • An extremely fine concavo-convex structure is formed, and it is observed that these convex portions are provided so as to cover the surface of the electrolytic copper foil along the surface shape of the electrolytic copper foil.
  • the macroscopic surface shape of each surface is different.
  • the difference in the macroscopic surface shape is considered to be caused by the difference in the macroscopic surface shape between the electrode surface and the deposition surface of the electrolytic copper foil itself before forming the fine concavo-convex structure. From this, it is considered that when the fine concavo-convex structure referred to in the present application is provided on the surface of the copper foil, the macroscopic surface shape of the copper foil before the fine concavo-convex structure is formed can be maintained.
  • the electrolytic copper foil is generally obtained by electrodepositing copper on the surface of a rotary electrolytic drum and winding it.
  • the surface of the electrolytic copper foil that is in contact with the surface of the electrolytic drum (hereinafter referred to as “electrode surface”) is generally smooth and glossy because the surface shape of the electrolytic drum is transferred.
  • the other surface (hereinafter referred to as “deposition surface”) has an uneven shape formed by electrodeposition of copper. Referring to FIG. 1, the roughened surface maintains the macroscopic surface shape of each surface of the electrolytic copper foil before the roughening treatment, and the electrode surface has a relatively smooth macroscopic surface shape. It can be seen that the surface has a macroscopic surface shape with irregularities.
  • the fine concavo-convex structure referred to in the present application is closely packed on the surface of the copper foil so that the needle-like or plate-like convex portion having a maximum length of 500 nm or less covers the surface of the copper foil along the surface shape. Therefore, it is considered that the macroscopic surface shape of each surface of the electrolytic copper foil can be maintained even after the fine concavo-convex structure is formed.
  • the fine concavo-convex structure is formed by convex portions having a maximum length of 500 nm or less, and referring to FIG. 1, the arrangement pitch at which the convex portions are arranged on the surface of the electrolytic copper foil is each convex portion. Shorter than the length of.
  • a carbon dioxide laser having a dominant wavelength of 9.4 ⁇ m and 10.6 ⁇ m is used.
  • the arrangement pitch of the convex portions is shorter than the emission wavelength of the carbon dioxide laser, and the roughened surface suppresses the reflection of the laser light by the carbon dioxide laser and absorbs the laser light with a high absorbance.
  • the maximum length of the convex part which forms the fine concavo-convex structure provided on the roughened surface is as short as 500 nm or less, and unlike the conventional blackening process, the convex part is long and protrudes long from the surface of the copper foil. Even if other parts do not exist and another object comes into contact with the surface of the roughened surface, damage such as breakage of the convex part can be suppressed.
  • FIG. 2 is a scanning electron microscope observation image showing a cross section of the roughened copper foil for laser drilling according to the present application.
  • a portion observed in a thin line shape is a convex portion.
  • the surface of the copper foil is covered with countless convex portions densely packed with each other, and each convex portion is provided so as to protrude from the surface of the copper foil along the surface shape of the copper foil. Is done.
  • the “maximum length of the convex portion” means the length from the base end to the tip end of each convex portion that is observed in the shape of the line (line segment) in the cross section of the roughened copper foil. The maximum value when measured. Considering only the laser drilling performance on the laser irradiated surface, the longer the maximum length of the convex portion, the higher the laser light absorbance, and the laser drilling performance is improved. However, if the maximum length of the convex portion is shorter, it can be made difficult to be damaged when another object comes into contact with the roughened surface, so that handling becomes easier.
  • the one where the maximum length of a convex-shaped part is shorter can maintain the surface shape of the copper foil before a roughening process, and can suppress the change of the surface roughness before and behind a roughening process. For this reason, when the maximum length of the convex portion is shorter, good adhesion to the insulating layer constituent material can be obtained due to the fine nanoanchor effect, and when so-called non-roughened copper foil is used It becomes possible to form a fine pitch circuit having a good etching factor equivalent to.
  • the maximum length of the convex portion is preferably 400 nm or less, and more preferably 300 nm or less.
  • the maximum length of the convex portion is less than 100 nm, the laser drilling performance is degraded.
  • the maximum length of the convex portion is too short, a sufficient nanoanchor effect may not be obtained. For this reason, it is preferable that the maximum length of the convex portion is 100 nm or more.
  • the fine concavo-convex structure is visually recognized in a layer form on the surface layer portion of the copper foil.
  • a region where the fine uneven structure occupies the surface layer portion of the copper foil in a layered form is referred to as a fine uneven structure layer.
  • This fine concavo-convex structure layer corresponds to the length (height) in the thickness direction in which the convex portion protrudes from the surface of the copper foil.
  • the length and the protruding direction of each convex portion forming the fine concavo-convex structure are not constant, and the protruding direction of each convex portion is not parallel to the thickness direction of the copper foil.
  • the length of the tip portion that can be separated and observed is 250 nm or less.
  • “the length of the tip portion that can be separately observed from other convex portions refers to the length shown below.
  • the convex portion protrudes in a needle shape or a plate shape on the roughened surface as described above with reference to FIG.
  • the convex portions are densely provided on the surface of the copper foil, the base end portion of the convex portion from the surface of the copper foil, that is, the interface between the convex portion made of a copper composite compound and the copper foil. I can't observe. Therefore, when the roughened surface of the copper foil is observed in a planar manner as described above, one convex portion is separated from other convex portions among adjacent convex portions while being densely packed together.
  • the portion that can be observed as being independently present is referred to as the “tip portion that can be observed separately from other convex portions”, and the length of the tip portion is the tip of the convex portion (that is, the tip) The length from the tip of the portion) to the position on the most proximal side that can be separated and observed from other convex portions.
  • the maximum length of the convex portion is approximately 500 nm or less.
  • the maximum length of the convex portion is long, and it is preferable that the length of the tip portion of the convex portion is also long.
  • the one where the maximum length of a convex-shaped part is shorter can maintain the surface shape of the copper foil before a roughening process, and can suppress the change of the surface roughness before and behind a roughening process.
  • the length of the tip portion of the convex portion is preferably 200 nm or less, and more preferably 100 nm or less.
  • the length of the tip portion of the convex portion is less than 30 nm, the laser drilling performance is degraded. For this reason, it is preferable that the length of the front-end
  • the length of the tip portion of the convex portion is 1 ⁇ 2 or less with respect to the maximum length of the convex portion.
  • the tip of the convex portion protrudes from the surface of the copper foil while being separated from other convex portions, so that the copper foil surface is densely covered with this fine uneven structure. can do.
  • the specific surface area (hereinafter simply referred to as “Kr adsorption specific surface area”) measured by adsorbing krypton on the surface of the fine concavo-convex structure is 0.035 m 2 / g or more. It is preferable to satisfy.
  • the Kr adsorption specific surface area is 0.035 m 2 / g or more
  • the average height of the convex portion on the roughened surface is on the order of 200 nm, and good laser drilling performance, scratch resistance, and insulating layer configuration This is because good adhesion to the material can be stably secured.
  • the upper limit of the Kr adsorption specific surface area is not defined, the upper limit is about 0.3 m 2 / g, more preferably 0.2 m 2 / g.
  • the Kr adsorption specific surface area at this time is a pretreatment by heating the sample at 300 ° C. for 2 hours using a specific surface area / pore distribution measuring device 3Flex manufactured by Micromeritics. Measured using krypton (Kr) as the adsorbed gas.
  • the convex portion is made of a copper composite compound containing copper oxide.
  • the copper composite compound constituting the fine concavo-convex structure on the laser irradiation surface side is most preferably made of copper oxide, with copper oxide as the main component. You may contain cuprous oxide. In any case, a small amount of metallic copper may be contained.
  • the peak area of Cu (I) obtained by analyzing the constituent elements of the fine concavo-convex structure using X-ray photoelectron spectroscopy (X-ray Photoelectron Spectroscopy: hereinafter simply referred to as “XPS”)
  • XPS X-ray Photoelectron Spectroscopy
  • the ratio of the peak area of Cu (I) to the total area with the peak area of Cu (II) (hereinafter referred to as the occupied area ratio) is 50% when the roughened surface is a laser-irradiated surface. It is preferable that it is less than.
  • each peak of Cu (I) and Cu (II) can be separated and detected.
  • the Cu (0) peak may be observed overlapping the shoulder portion of the large Cu (I) peak.
  • the peak of Cu (0) is observed overlappingly, it shall be considered as a Cu (I) peak including this shoulder part.
  • the constituent element of the copper composite compound which forms a fine concavo-convex structure using XPS is analyzed, Cu (I) appearing at 932.4 eV corresponding to the binding energy of Cu 2p 3/2, and 934.
  • Cu (I) appearing at 932.4 eV corresponding to the binding energy of Cu 2p 3/2
  • 934 Each peak obtained by detecting the photoelectrons of Cu (II) appearing at 3 eV is separated into waveforms, and the occupation area ratio of the Cu (I) peak is specified from the peak areas of the respective components.
  • Quantum 2000 (beam condition: 40 W, 200 um diameter) manufactured by ULVAC-PHI Co., Ltd. is used as an XPS analyzer
  • “MultiPack ver. 6.1A” is used as analysis software to perform state / semi-quantitative narrow measurement. be able to.
  • the Cu (I) peak obtained as described above is considered to be derived from monovalent copper constituting cuprous oxide (cuprous oxide: Cu 2 O). And it is thought that a Cu (II) peak originates in the bivalent copper which comprises copper oxide (cupric oxide: CuO). Furthermore, it is considered that the Cu (0) peak is derived from zero-valent copper constituting metallic copper. Therefore, when the occupation area ratio of the Cu (I) peak is less than 50%, the proportion of cuprous oxide in the copper composite compound constituting the roughened layer is smaller than the proportion of copper oxide. In consideration of the laser drilling performance, the smaller the occupation ratio of the Cu (I) peak, the better.
  • the occupancy rate is less than 40%, less than 30%, less than 20%, etc., the smaller the value, the better the laser drilling performance, and the occupancy rate is 0%, that is, a fine concavo-convex structure is formed. It is most preferable that the convex portion to be made of only copper oxide.
  • the copper composite compound preferably contains copper oxide and cuprous oxide, and more preferably contains cuprous oxide as a main component on the adhesive surface with the insulating layer constituting material.
  • the occupancy ratio of the Cu (I) peak is preferably 50% or more, more preferably 70% or more, and 80% or more on the adhesive surface with the insulating layer constituting material. More preferably. Copper oxide has higher solubility in acids such as an etchant than cuprous oxide.
  • the occupied area ratio of the Cu (I) peak is less than 50%, after performing laser drilling on the copper layer and further forming a circuit by an etching method, The constituent components of the fine concavo-convex structure may be easily dissolved, and the adhesiveness between the copper layer and the insulating layer constituent material may be lowered afterwards, which is not preferable.
  • the upper limit value of the occupied area ratio of the Cu (I) peak is not particularly limited, but is 99% or less. As the occupied area ratio of the Cu (I) peak decreases, the adhesion between the insulating layer constituting material and the bonding surface tends to improve.
  • the exclusive area ratio of the Cu (I) peak is preferably 98% or less, and more preferably 95% or less.
  • the occupied area ratio of the Cu (I) peak is calculated by a calculation formula of Cu (I) / ⁇ Cu (I) + Cu (II) ⁇ ⁇ 100 (%).
  • the fine concavo-convex structure described above can be formed, for example, by subjecting the surface of the copper foil to a wet roughening treatment as follows. First, a copper composite compound containing copper oxide (cupric oxide) as a main component is formed on the surface of the copper foil by performing an oxidation treatment on the surface of the copper foil by a wet method. Thereby, “a fine concavo-convex structure formed from needle-like or plate-like convex portions” made of a copper composite compound containing copper oxide as a main component can be formed on the surface of the copper foil.
  • the copper compound is subjected to a reduction treatment to convert a part of the copper oxide into cuprous oxide (cuprous oxide), thereby obtaining a copper composite compound containing copper oxide and cuprous oxide.
  • the “fine concavo-convex structure formed from needle-like or plate-like convex portions” can be formed on the surface of the copper foil.
  • the “fine concavo-convex structure” itself referred to in the present application is formed of a copper compound containing copper oxide at the stage of oxidizing the surface of the copper foil.
  • the roughening treatment is completed without performing the reduction treatment.
  • the reduction treatment may be performed. Even when the reduction treatment is performed, a part of the copper oxide can be converted into cuprous oxide while maintaining the shape of the fine concavo-convex structure formed by the copper compound containing copper oxide as a main component. As a result, a “fine concavo-convex structure” made of a copper composite compound containing copper oxide and cuprous oxide can be formed.
  • the above-mentioned "fine concavo-convex structure" can be formed by performing a reduction process to the extent necessary.
  • a small amount of metallic copper may be contained in a copper composite compound containing copper oxide as a main component or a copper composite compound containing copper oxide and cuprous oxide.
  • an alkaline solution such as a sodium hydroxide solution when the wet roughening treatment is performed.
  • an alkaline solution such as a sodium hydroxide solution
  • a convex portion made of a copper composite compound mainly composed of needle-like or plate-like copper oxide can be formed on the surface of the copper foil.
  • the convex portion grows long, and the maximum length may exceed 500 nm, forming the fine concavo-convex structure referred to in the present application. It becomes difficult to do. Therefore, in order to form the fine concavo-convex structure, it is preferable to use an alkaline solution containing an oxidation inhibitor capable of suppressing oxidation on the copper foil surface.
  • Examples of such an oxidation inhibitor include an amino silane coupling agent. If the copper foil surface is oxidized using an alkaline solution containing an amino silane coupling agent, the amino silane coupling agent in the alkaline solution is adsorbed on the surface of the copper foil, and the copper foil surface by the alkaline solution Can be suppressed. As a result, the growth of needle-like crystals of copper oxide can be suppressed, and an extremely fine uneven structure can be formed on the surface of the copper layer.
  • amino-based silane coupling agent examples include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3- Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, etc. may be used. It can. All of these are dissolved in an alkaline solution, stably held in the alkaline solution, and exhibit the effect of suppressing oxidation of the copper foil surface described above.
  • the fine concavo-convex structure formed by subjecting the surface of the copper foil to an oxidation treatment with an alkaline solution containing an amino-based silane coupling agent is substantially maintained even after the reduction treatment.
  • a roughened surface having a fine concavo-convex structure formed by needle-like or plate-like convex portions including copper oxide and cuprous oxide and having a maximum length of 500 nm or less made of these copper composite compounds is formed. be able to.
  • Cu (I) obtained when qualitative analysis using XPS is performed on the constituent elements of the copper composite compound that forms the fine relief structure by adjusting the reducing agent concentration, solution pH, solution temperature, and the like.
  • the area occupied by the peak of Cu (I) can be appropriately adjusted with respect to the total area of the peak area of and the peak area of Cu (II). Also, for example, by immersing the copper foil in an alkaline solution, a fine uneven structure mainly composed of copper oxide is formed on both surfaces of the copper foil, and then the reduction treatment is performed only on the adhesive surface with the insulating layer constituent material. For example, a double-side roughened copper foil having a Cu (I) peak occupancy of 0% or less than 2% for the laser-irradiated surface and a Cu (I) peak occupancy of 50% or more for the adhesive surface. be able to. Moreover, the occupancy ratio of the Cu (I) peaks on both sides can be appropriately set to an appropriate value. When the constituent elements of the fine concavo-convex structure formed by the above method are analyzed by XPS, the presence of “—COOH” is detected.
  • the above-described fine relief structure can be simplified on both sides of the copper foil by a method such as immersing the copper foil in the treatment solution. Can be formed. Therefore, using this wet method, when forming a fine relief structure on both sides of the copper foil, the laser drilling process on the laser irradiation surface side is improved and the nano-anchor effect by the fine relief structure makes the insulating layer structure The adhesion between the material and the copper foil can be improved.
  • the fine concavo-convex structure has high scratch resistance, it is easy to handle even if the fine concavo-convex structure is formed on both sides of the copper foil, and the fine concavo-convex on the surface on the laser irradiation surface side.
  • the structure can be maintained, and powder falling off can be prevented.
  • Silane coupling agent treatment The double-side roughened copper foil adhesive layer with the insulating layer constituent material is provided with a silane coupling agent layer in order to improve moisture absorption resistance when processed into a printed wiring board. Also good.
  • the silane coupling agent treatment layer provided on the roughened surface is composed of olefin functional silane, epoxy functional silane, vinyl functional silane, acrylic functional silane, amino functional silane and mercapto functional silane as a silane coupling agent. Either can be used to form.
  • silane coupling agents are represented by the general formula R—Si (OR ′) n (where R: an organic functional group represented by an amino group, a vinyl group, etc., OR ′: a methoxy group, an ethoxy group, etc. And n: 2 or 3).
  • silane coupling agent vinyltrimethoxysilane, vinylphenyltrimethoxylane, ⁇ -methacryloxypropyltrimethoxysilane, mainly the same coupling agent used for prepreg glass cloth for printed wiring boards, ⁇ -glycidoxypropyltrimethoxysilane, 4-glycidylbutyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltrimethoxysilane, N-3- (4- (3 -Aminopropoxy) ptoxy) propyl-3-aminopropyltrimethoxysilane, imidazole silane, triazine silane, 3-acryloxypropylmethoxysilane, ⁇ -mercaptopropyltrimethoxysilane and the like can be used.
  • silane coupling agents listed here do not adversely affect the characteristics after becoming a printed wiring board. Which type is used in the silane coupling agent can be appropriately selected according to the use of the copper clad laminate.
  • the above-mentioned silane coupling agent contains water as a main solvent and contains the silane coupling agent component in a concentration range of 0.5 g / L to 10 g / L, and is treated at a room temperature level. It is preferable to use a liquid.
  • concentration of the silane coupling agent in the silane coupling agent treatment liquid is less than 0.5 g / L, the adsorption rate of the silane coupling agent is slow, which is not suitable for general commercial profit, and the adsorption is not uniform. It becomes.
  • the concentration of the silane cup agent exceeds 10 g / L, the adsorption rate is not particularly high, and the performance quality such as moisture absorption resistance is not particularly improved. .
  • the adsorption method of the silane coupling agent to the roughened surface using this silane coupling agent treatment liquid can employ an immersion method, a showering method, a spray method, etc., and is not particularly limited. That is, any method can be used as long as the roughened surface can be brought into contact with and adsorbed to the silane coupling agent treatment liquid most uniformly in accordance with the process design.
  • the silane coupling agent treatment described above is a treatment performed on the adhesive surface with the insulating layer constituting material and does not need to be performed on the laser irradiation surface.
  • the needle-shaped or plate-shaped convex portions having a maximum length of 500 nm or less constituting the fine concavo-convex structure are arranged at a pitch shorter than the wavelength of the carbon dioxide laser and shorter than the wavelength range of visible light. ing.
  • the light incident on the roughened surface is attenuated as a result of repeated irregular reflection within the fine concavo-convex structure. That is, the roughened surface functions as a light-absorbing surface, and the roughened surface is darkened to black, brown, or the like as compared to before the roughening treatment.
  • the copper clad laminate according to the present application is also characterized by the color tone of the roughened surface on the surface, and the value of the lightness L * of the L * a * b * color system is 30 or less.
  • the maximum length of the convex portions constituting the fine concavo-convex structure may exceed 500 nm, which is not preferable.
  • the value of L * exceeds 30 even if the maximum length of the convex portion is 500 nm or less, the convex portion may not be provided sufficiently densely on the surface of the copper foil. .
  • the value of the lightness L * exceeds 30, it is conceivable that the roughening process is insufficient or the state of the roughening process is uneven. In this case, there is a possibility that sufficient roughening treatment may not be performed in order to obtain good laser drilling performance, scratch resistance, good adhesion with the insulating layer constituting material, etc., which is not preferable.
  • the value of the lightness L * is more preferably 25 or less. When the value of the lightness L * is 25 or less, a more preferable roughened surface suitable for laser drilling is obtained.
  • the lightness L * was measured using a spectral color difference meter SE2000 manufactured by Nippon Denshoku Industries Co., Ltd., and the whiteness attached to the measuring device was used for the lightness calibration in accordance with JIS Z8722: 2000. And the measurement of 3 times is performed regarding the same site
  • the copper clad laminate has a basic layer structure as shown in FIGS. 3 and 4, for example.
  • FIG. 3 shows an example of the layer structure when the roughened surface 4 on the deposition surface side of the electrolytic copper foil 2 becomes the outer surface and is used as a laser irradiation surface.
  • FIG. 4 shows the roughening of the electrode surface side of the electrolytic copper foil 2.
  • An example of a layer structure when the treatment surface 3 is an outer surface of a copper clad laminate and is used as a laser irradiation surface is shown.
  • the roughened surface on the other surface side is an adhesive surface with the insulating layer constituting material.
  • the roughening copper foil for laser drilling said to this application also to the surface (other surface) on the opposite side to the laser beam irradiation side of the said copper clad laminated board May be laminated.
  • the double-side roughened copper foil is laminated on at least one surface of the insulating layer constituent material.
  • the laser-irradiated surface of the copper-clad laminate 1 can be used as the present case. It can be set as the roughened surface as referred to in the application.
  • the fine concavo-convex structure is provided on the laser irradiation surface, the roughened surface functions as a laser light absorption surface, so that laser drilling can be easily performed.
  • the copper layer of the other surface side can employ
  • good adhesion with the insulating layer constituent material can be obtained.
  • the insulating layer 5 exists between the copper layer 2 which has a laser irradiation surface, and the copper layer 2 of the other surface side.
  • the insulating layer 5 is a layer formed of an insulating layer constituent material such as a resin, and the insulating layer constituent material is not particularly limited.
  • the copper layer 2 on the side opposite to the laser light irradiation side is the surface of the copper layer 2 on the laser light irradiation side, that is, the surface in contact with the insulating layer 5.
  • Laser drilling when forming a through-via hole by using the roughened surface 3 having a fine concavo-convex structure formed by needle-like or plate-like convex portions having a maximum length of 500 nm or less made of a copper composite compound Processing performance can be improved.
  • the outer surface of the copper layer is the roughened surface and the outer surface of the copper layer is provided with a fine concavo-convex structure.
  • the roughened surface becomes a black or brown matte surface and reflects laser light. Therefore, the thermal energy of the laser beam can be efficiently applied to the laser beam irradiation site.
  • the laser-irradiated surface of the copper clad laminate is the copper layer itself, the laser light is reflected from the surface of the copper layer unless the surface of the copper layer is roughened or blackened. Therefore, the thermal energy of the laser beam cannot be efficiently applied to the laser beam irradiation site.
  • the boiling point of copper is 2562 ° C, whereas the boiling points of copper oxide and cuprous oxide are 2000 ° C and 1800 ° C, respectively. Compared with copper, the boiling points of copper oxide and cuprous oxide are low. For this reason, when the laser beam is irradiated on the roughened surface, the laser irradiation site on the roughened surface reaches the boiling point earlier than in the case where the copper layer itself is the outer surface.
  • the thermal conductivity of copper is 354 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 at 700 ° C., whereas the thermal conductivity of copper oxide and cuprous oxide are both 20 W ⁇ m ⁇ 1 at 700 ° C. -K- 1 or less.
  • the thermal conductivity of copper oxide and cuprous oxide is 1 or less, which is several tenths of the thermal conductivity of copper.
  • the melting points of copper oxide and cuprous oxide are 1201 ° C. and 1235 ° C., respectively, whereas the melting point of copper is 1083 ° C., which is low.
  • FIG. 5 illustrates the case where laser drilling is performed using the copper-clad laminate 1 having the layer configuration shown in FIG. 3 (1-C), but any of the layers shown in FIGS.
  • the copper layer on the laser irradiation surface side of the copper-clad laminate such as the copper-clad laminate 1 having a configuration, is formed using the double-side roughened copper foil referred to in the present application, it has other layer configurations. Even a copper-clad laminate can be laser drilled by the same procedure as above.
  • the printed wiring board according to the present application includes a copper layer formed using a roughened copper foil for laser drilling, and is manufactured using, for example, a copper-clad laminate according to the present application It may be a printed wiring board. Moreover, the printed wiring board which concerns on this application should just be equipped with the copper layer formed using the said double-sided roughening copper foil, for example, the multilayer manufactured by the process as shown in FIG.6 and FIG.7. Although it can be a printed wiring board, it is not limited to the multilayer printed wiring board demonstrated below, The specific layer structure, a manufacturing method, etc. are not specifically limited.
  • the double-sided roughened copper foil according to the present application is provided on both sides of an inner layer substrate 9 having an inner layer circuit 8 via an insulating layer constituting material 7 such as a prepreg or a resin film. Are laminated.
  • the inner layer substrate 9 is provided with the inner layer circuits 8 on both surfaces and filled vias (via holes) 10 for interlayer connection.
  • the inner layer substrate 9 is not limited to the form shown in FIG. 6A, and any layer configuration may be used.
  • the first buildup layer 30 is formed on both surfaces of the inner layer substrate 9. It becomes the laminated body 40 with a buildup layer (refer FIG.6 (B)). Then, the roughening surface 4 of each first buildup layer 30 is irradiated with laser light, for example, and laser drilling is performed in the same manner as described above. Thereafter, a desmear process for removing the resin residue generated by the laser drilling process, an interlayer conductive plating process is performed on the inner wall portion in the via hole to form a plating layer 24, and the via hole is plated and filled to form a filled via. . Then, the first build-up wiring layer 31 is formed by etching to form the first build-up wiring layer-attached laminate 41 including the filled via 10 for connecting to the inner layer circuit of the inner layer substrate 9 (FIG. 7). (See (C)). *
  • the double-sided roughened copper foil 2 is laminated on both surfaces of the laminate 41 with the first buildup wiring layer shown in FIG. 7C via the insulating layer constituting material 7 such as a prepreg or a resin film, It becomes the laminated body 42 with a 2nd buildup layer provided with the 2nd buildup layer 32 shown to 7 (D). From this stage, the same processes as in FIGS. 6B and 7C are performed, and the double-sided roughened copper foil 2 is laminated again via the insulating layer constituting material 7 such as a prepreg or a resin film. By repeating the operation as necessary, a build-up substrate including the nth circuit pattern layer (n ⁇ 3: integer) can be obtained.
  • the build-up laminate after the final build-up lamination is subjected to laser drilling as necessary, and a desmear process, an interlayer conduction plating process is performed in the via hole to form a plating layer, and the inside of the via hole is also formed.
  • the filled via 10 is formed by filling with plating.
  • the outer layer copper layer is etched to form an outer layer circuit to form a multilayer printed wiring board.
  • the printed wiring board uses the double-side roughened copper foil according to the present application, the laser drilling performance is good, and the printed wiring board has a good via hole. Moreover, it becomes possible to obtain good adhesion to the insulating layer constituent material of the inner layer circuit by the fine uneven structure on the bonding surface side.
  • the surface roughness (Rzjis) of the deposition surface is 3.2 ⁇ m
  • the surface area ratio (B) is 1.2
  • the glossiness [Gs (60 °)] is 2
  • the surface roughness (Rzjis) of the electrode surface Is 1.2 ⁇ m
  • surface area ratio (B) is 1.05
  • gloss [Gs (60 °)] is 110 ⁇ m in thickness of 12 ⁇ m electrolytic copper foil.
  • Surface treatment was applied according to the procedure. The surface roughness, surface area ratio, and glossiness are measured as follows.
  • the surface area ratio (B) was determined according to the above formula based on the surface area A when a two-dimensional area of 57570 ⁇ m 2 was measured by the laser method.
  • Glossiness was measured using a gloss meter PG-1M manufactured by Nippon Denshoku Industries Co., Ltd. according to JIS Z 8741-1997, which is a glossiness measurement method.
  • This electrolytic copper foil was pretreated and then roughened. Hereinafter, it demonstrates in order.
  • Pretreatment The electrolytic copper foil was immersed in an aqueous sodium hydroxide solution, subjected to alkali degreasing treatment, and washed with water. And after immersing the electrolytic copper foil which this alkali degreasing process complete
  • Roughening treatment An oxidation treatment was performed on the electrolytic copper foil that had been subjected to the preliminary treatment.
  • a sodium hydroxide solution containing a liquid temperature of 70 ° C., a pH of 12, a chlorous acid concentration of 150 g / L, and an N-2- (aminoethyl) -3-aminopropyltrimethoxysilane concentration of 10 g / L
  • the electrolytic copper foil is immersed in a predetermined oxidation treatment time (1 minute, 2 minutes, 4 minutes, 10 minutes), and a fine concavo-convex structure made of a copper composite compound mainly composed of copper oxide is formed on both surfaces of the electrolytic copper foil.
  • Four types of samples provided were obtained.
  • aqueous solution room temperature
  • part of the copper oxide on both sides of the electrolytic copper foil was reduced to cuprous oxide, and a roughened surface having a fine concavo-convex structure made of a copper composite compound containing copper oxide and cuprous oxide was obtained.
  • four types of double-sided roughened copper foils for laser drilling were provided, which were provided with both sides of the fine relief structure according to the present application.
  • each sample was subjected to FR-4 prepreg (R1551 manufactured by Panasonic Corporation), which is an insulating layer constituent material, using a vacuum press machine, with a press pressure of 2.9 MPa, a temperature of 190 ° C., and a press time of 90 minutes.
  • FR-4 prepreg R1551 manufactured by Panasonic Corporation
  • a copper clad laminate was produced by laminating under conditions.
  • a test substrate having a 3.0 mm width peel strength measuring linear circuit was produced by an etching method. And according to JIS C6481 (1996), the peeling strength was measured about each sample.
  • Example 2 with respect to the same electrolytic copper foil as in Example 1, according to the following procedure, a rough surface having a fine concavo-convex structure formed on one side by a convex portion made of a copper composite compound containing copper oxide as a main component.
  • a double-sided roughened copper foil with a roughened surface having a fine relief structure formed by a convex part made of a copper composite compound containing a copper oxide and cuprous oxide on the other surface is prepared.
  • stacked the other surface side of this double-sided roughening copper foil on the insulating layer structural material was produced. Since the preliminary treatment and the oxidation treatment (roughening treatment) for the electrolytic copper foil were performed in the same manner as in Example 1, the description is omitted here, and the steps after the reduction treatment after the oxidation treatment will be described.
  • Roughening treatment As described above, the electrolytic copper foil subjected to the pretreatment and the oxidation treatment (oxidation treatment time 2 minutes) in the same manner as in Example 1 was subjected to the reduction treatment as follows. It was. In Example 2, the surface to be the laser irradiation surface was not subjected to the reduction treatment, and the same reduction treatment solution as in Example 1 was sprayed only on the surface to be the adhesive surface with the insulating layer constituent material.
  • Silane coupling agent treatment The surface subjected to the reduction treatment, that is, the adhesion surface with the insulating layer constituting material was subjected to the silane coupling agent treatment. Specifically, after the reduction treatment, it is washed with water, and a silane coupling agent treatment solution (an aqueous solution containing 5 g / L of ⁇ -glycidoxypropyltrimethoxysilane using ion-exchanged water as a solvent) is obtained by the showering method. It sprayed on the surface which gave the reduction process, and adsorption
  • a silane coupling agent treatment solution an aqueous solution containing 5 g / L of ⁇ -gly
  • Example 1 Using the double-sided roughened copper foil obtained in the above steps, a copper clad laminate was produced in the same manner as in Example 1. A test substrate was prepared in the same manner as in Example 1, and the peel strength was measured.
  • Comparative Example 1 In Comparative Example 1, a conventional blackening treatment was performed on both surfaces of an electrolytic copper foil similar to the electrolytic copper foil used in Example 1, and a fine copper oxide was formed and adhered to a black brown state. As the blackening treatment conditions at this time, sodium chlorite 25 g / L, sodium hydride 20 g / L, alkyl acid ester 6 g / L, liquid temperature 67 ° C., and treatment time 4 minutes were employed. A copper-clad laminate is obtained by laminating electrolytic copper foil (hereinafter, “double-sided blackened copper foil”) subjected to blackening treatment on both sides of the above FR-4 prepreg under the same conditions as in Example 1. Got.
  • double-sided blackened copper foil double-sided blackened copper foil
  • Example 2 In the comparative example, the conventional reduction blackening treatment and reduction treatment (reduction blackening treatment) were performed on both surfaces of the same electrolytic copper foil as that used in Example 1.
  • the blackening treatment conditions at this time are 10% by volume of “PRO BOND 80A OXIDE SOLUTION” which is an oxidation treatment solution manufactured by Rohm and Haas Electronic Materials Co., Ltd., and an aqueous solution containing 20% by volume of “PRO BOND 80B OXIDE SOLUTION”, A liquid temperature of 85 ° C. and a treatment time of 5 minutes were employed.
  • the blackened electrolytic copper foil was subjected to a reduction treatment under the following reduction treatment conditions.
  • the reduction treatment conditions were 6.7 vol% of “CIRCUPOSIT PB OXIDE CONVERTER 60C”, which is a reduction treatment solution manufactured by Rohm and Haas Electronic Materials Co., Ltd., an aqueous solution containing 1.5 vol% of “CUPOSITZ”, and a liquid temperature of 35 ° C. A treatment time of 5 minutes was employed.
  • An electrolytic copper foil subjected to reduction blackening treatment on both sides (hereinafter referred to as “double-sided reduction blackening copper foil”) is laminated on both sides of the above-mentioned FR-4 prepreg under the same conditions as in Example 1, and copper-clad A laminate was obtained.
  • Table 1 below shows the specific surface area, lightness L * , and peel strength of the four types of double-sided roughened copper foils for laser drilling provided on both sides with the fine irregularities obtained in Example 1 and Example 2. Each measurement result is shown. Furthermore, the occupation area ratio (%) of the Cu (I) peak when the constituent elements of the copper composite compound are qualitatively analyzed using XPS is shown. Table 1 shows the measurement results of specific surface area, brightness L * , and peel strength of the double-sided blackened copper foil and double-sided blackened reduced copper foil obtained in Comparative Example 1 and Comparative Example 2.
  • the maximum length of the fine irregularities formed on both the deposition surface and the electrode surface is 500 nm or less.
  • the value of the lightness L * of the roughened surface is 18 to 26, which is a value with little variation.
  • the value of the Kr adsorption specific surface area increases in proportion to the increase in the oxidation treatment time. The peeling strength of these four types of double-side roughened copper foil for laser drilling is sufficient for practical use even in the shortest oxidation treatment time. A peel strength proportional to the value of the adsorption specific surface area is obtained. From this, it can be understood that the oxidation treatment time employed in the examples is appropriate.
  • Example 1 and Example 2 using the double-side roughened copper foil for laser drilling according to the present application, the maximum length made of a copper composite compound is a needle-like or plate-like convex part having a maximum length of 500 nm or less.
  • the copper clad laminated board provided with the roughening process surface which has the formed fine uneven structure is used.
  • Comparative Example 1 is obtained by laminating a conventional blackened electrolytic copper foil on an insulating layer constituent material
  • Comparative Example 2 is a conventional reduced blackened electrolytic copper foil. It is laminated on an insulating layer constituent material.
  • the laser irradiation surface of the copper clad laminated board which concerns on an Example and the copper clad laminated board which concerns on a comparative example was lightly rubbed manually using the filter paper (No. 5B).
  • the roughened surface of the copper clad laminates according to Example 1 and Example 2 was not changed as long as it was visually observed.
  • the blackening treatment surface or the reduction blackening treatment surface of the copper clad laminates according to Comparative Example 1 and Comparative Example 2 was glossy. Using the surface after rubbing with the filter paper as a laser irradiation surface, drilling was performed.
  • the carbon dioxide laser irradiation conditions at this time were a mask diameter of 2.3 mm and a pulse width of 14 ⁇ sec. , With a pulse energy of 15.0 mJ, an offset of 0.8, a laser beam diameter of 124 ⁇ m, and a hole with a processing diameter of 80 ⁇ m will be formed in a copper-clad laminate using a double-side roughened copper foil for laser drilling. Then, a via hole formation test of 100 shots of each sample was performed. Therefore, the inventors of the present invention have determined that the processing is performed well in the range where the hole diameter after processing is 80 ⁇ m or more as a criterion. The results are shown in Table 2 below.
  • the aperture ratio referred to in Table 2 is a ratio of the number of shots that can be drilled in a 100-shot via hole formation test.
  • the opening diameter distribution is a distribution width when the opening diameter of a via hole obtained in a 100-shot via hole formation test is measured.
  • a roughened copper foil for laser drilling processing By using a roughened copper foil for laser drilling processing according to the present application, a copper-clad laminate and a printed wiring board are manufactured, and the laser absorptivity is high and the copper composite compound is excellent in scratch resistance.
  • the roughened surface having a fine concavo-convex structure can be used as the outer surface of the copper layer. Therefore, it is necessary to exhibit laser drilling performance equal to or higher than that of conventional blackening treatment on the surface of the copper layer, and the operator must pay close attention when handling the copper clad laminate. Eliminates work efficiency. As a result, variation in laser drilling performance for the copper-clad laminate is reduced, and stable drilling is possible.
  • the roughened copper foil for laser drilling is preferably applied to the build-up method of the printed wiring board, and by forming a buildup layer using the roughened copper foil, It is possible to provide a multilayer printed wiring board with good quality.

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PCT/JP2015/052201 2014-01-27 2015-01-27 粗化処理銅箔、銅張積層板及びプリント配線板 WO2015111756A1 (ja)

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CN110996557A (zh) * 2020-01-15 2020-04-10 深圳市聚永能科技有限公司 激光粗化印刷电路板铜箔表面的方法和设备

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