WO2015060240A1 - ネガ型感光性樹脂組成物 - Google Patents
ネガ型感光性樹脂組成物 Download PDFInfo
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- WO2015060240A1 WO2015060240A1 PCT/JP2014/077819 JP2014077819W WO2015060240A1 WO 2015060240 A1 WO2015060240 A1 WO 2015060240A1 JP 2014077819 W JP2014077819 W JP 2014077819W WO 2015060240 A1 WO2015060240 A1 WO 2015060240A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
- G02F2202/022—Materials and properties organic material polymeric
- G02F2202/023—Materials and properties organic material polymeric curable
Definitions
- the present invention relates to a negative photosensitive resin composition and a cured film obtained therefrom. More specifically, the present invention relates to a photosensitive resin composition suitable for use in display materials, a cured film thereof, and various materials using the cured film.
- An epoxy cation polymerization UV curable resin composition containing an epoxy compound and a photoacid generator proposed as a negative type photosensitive resin composition is known to be highly transparent and thick.
- Patent Document 1 An epoxy cation polymerization UV curable resin composition containing an epoxy compound and a photoacid generator proposed as a negative type photosensitive resin composition is known to be highly transparent and thick.
- Patent Document 2 As a negative type material capable of alkali development, a radical polymerization type negative type material containing a polymer having an acryloyl group, a polyfunctional acrylic monomer and a photo radical initiator is known (for example, Patent Document 2).
- Patent Document 3 it is known that a positive type material has high resolution but is difficult to increase in thickness and has low transparency
- the photosensitive resin composition disclosed in the above-mentioned Patent Document 1 has a poor handling property because it is easy to tack on the coating film after application and before exposure. Further, since development with an aqueous alkali solution is not possible, development with an organic solvent is essential. Alkali development is considered feasible by introducing a carboxyl group into the polymer, but in the copolymerization of a monomer having an epoxy group and a monomer having a carboxyl group, a reaction between the epoxy group and the carboxyl group occurs during the polymerization. Easy to control synthesis of polymer. Even if the reaction can be controlled to synthesize a polymer, the storage stability is low.
- the negative type material described in Patent Document 2 that can be developed with an alkali has low curability for a thick film of 15 ⁇ m or more, and is sufficiently cured to reach the surface of the coating film in the process of exposing from the back surface of the substrate.
- by adding an excessive amount of a photoradical initiator having a high extinction coefficient it is possible to cure to the surface even when exposed from the back surface of the substrate, but in that case the transmittance of the cured film decreases, and the optical It was difficult to use as an element.
- the present invention has been made in view of the above circumstances, and has a curability that can be cured with a small amount of exposure from the back surface of the substrate, even after a film thickness of 15 ⁇ m or more, and after curing. It is an object of the present invention to provide a negative photosensitive resin composition having a high transparency and capable of forming a fine transparent structure.
- the present inventor has successfully cured even at a low exposure amount by using two kinds of photoinitiators having different extinction coefficients as a photoinitiator.
- the present invention has been completed by finding that a photosensitive resin composition having good properties and capable of forming a pattern and having excellent transparency can be realized. That is, as a first aspect, the present invention relates to a photosensitive resin composition containing the following component (A), component (B), component (C-1), component (C-2) and component (D).
- component alkali-soluble copolymer
- component a compound having two or more at least one polymerizable group selected from the group consisting of acrylate group, methacrylate group, vinyl group and allyl group
- component (C-1) a photoinitiator having an oxime ester group and having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more
- component (C-2) a photoinitiator having an extinction coefficient of 100 ml / g ⁇ cm or less in methanol or acetonitrile at 365 nm
- component Solvent.
- the component (A) relates to the photosensitive resin composition according to the first aspect or the second aspect, which is an alkali-soluble copolymer having a number average molecular weight of 2,000 to 50,000 in terms of polystyrene.
- the alkali-soluble copolymer of component (A) is a copolymer produced by copolymerization of a monomer mixture containing at least one selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride and maleimide.
- the photosensitive resin composition as described in any one of a 1st viewpoint thru
- the content of the component (C-1) is 0.3 to 5 parts by mass with respect to 100 parts by mass of the component (A), according to any one of the first to fourth aspects. It relates to the described photosensitive resin composition.
- the content of the component (C-2) is 0.5 to 10 parts by mass with respect to 100 parts by mass of the component (A), according to any one of the first to fifth aspects. It relates to the described photosensitive resin composition.
- the photosensitive property according to any one of the first to sixth aspects wherein the content of the component (B) is 10 parts by mass to 150 parts by mass with respect to 100 parts by mass of the component (A).
- the present invention relates to a resin composition.
- the present invention relates to the photosensitive resin composition according to any one of the first aspect to the seventh aspect, wherein the component (C-1) is a photoinitiator having a carbazole structure.
- the present invention relates to the photosensitive resin composition according to any one of the first to eighth aspects, wherein the component (C-2) is a photoinitiator having a hydroxy group.
- a 10th viewpoint it is related with the photosensitive resin composition as described in any one of a 1st viewpoint thru
- an 11th viewpoint it is related with the cured film obtained using the photosensitive resin composition as described in any one among a 1st viewpoint thru
- a coating film on a light-transmitting substrate comprising the photosensitive resin composition according to any one of the first to tenth aspects is opposite to the coating film surface of the substrate. It is related with the cured film obtained by exposing from the surface.
- the present invention relates to an interlayer insulating film for a liquid crystal display comprising the cured film described in the eleventh aspect or the twelfth aspect.
- the optical filter which consists of a cured film as described in an 11th viewpoint or a 12th viewpoint.
- an oxime ester photoinitiator having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more and 365 nm By using a mixture of photoinitiators having an extinction coefficient in methanol or acetonitrile of 100 ml / g ⁇ cm or less, the curing rate by exposure is increased, and even when the film thickness is 15 ⁇ m or more, The coating surface can be sufficiently cured by exposure, and a fine transparent structure can be formed.
- the photosensitive resin composition of the present invention is a photosensitive resin composition containing the following component (A), component (B), component (C-1), component (C-2) and component (D).
- component alkali-soluble copolymer
- component component: a compound having two or more at least one polymerizable group selected from the group consisting of acrylate group, methacrylate group, vinyl group and allyl group
- Component (C-1) a photoinitiator having an oxime ester group and having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more
- Component (C-2) a photoinitiator having an extinction coefficient of 100 ml / g ⁇ cm or less in methanol or acetonitrile at 365 nm
- Component Component: Solvent.
- the component (A) is an alkali-soluble polymer, and is a copolymer (hereinafter also simply referred to as a copolymer of the component (A)) produced by copolymerization of a monomer mixture containing a monomer having an alkali-soluble group and other monomers. is there.
- the copolymer of component (A) may be a copolymer having such a structure, and is not particularly limited with respect to the main chain skeleton and side chain type of the polymer constituting the copolymer.
- the number average molecular weight of the copolymer of component (A) exceeds 50,000, the developability of the unexposed area decreases, while the number average molecular weight is less than 2,000 and is too low. If it is, the components may be eluted during development because the exposed area is not sufficiently cured. Therefore, it is preferable to select a copolymer having a number average molecular weight in the range of 2,000 to 50,000 as the copolymer of component (A).
- both the number average molecular weight and the weight average molecular weight described below are measured in terms of polyester by gel permeation chromatography (GPC).
- Examples of the monomer having an alkali-soluble group include monomers having a carboxyl group, a phenolic hydroxy group, an acid anhydride group, and a maleimide group.
- Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, crotonic acid, mono- (2- (acryloyloxy) ethyl) phthalate, mono- (2- (methacryloyloxy) ethyl) phthalate, and N- (carboxyphenyl).
- Examples of the monomer having a phenolic hydroxy group include hydroxystyrene, N- (hydroxyphenyl) acrylamide, N- (hydroxyphenyl) methacrylamide, N- (hydroxyphenyl) maleimide and the like.
- Examples of the monomer having an acid anhydride group include maleic anhydride and itaconic anhydride.
- Examples of the monomer having a maleimide group include maleimide, the aforementioned N- (carboxyphenyl) maleimide, N- (hydroxyphenyl) maleimide and the like.
- a copolymer obtained by copolymerizing a monomer mixture containing at least one selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride and maleimide is preferable.
- the other monomer which can be copolymerized with the monomer which has the said alkali-soluble group is used together.
- specific examples of such other monomers include acrylic acid ester compounds, methacrylic acid ester compounds, N-substituted maleimide compounds, acrylonitrile compounds, acrylamide compounds, methacrylamide compounds, styrene compounds and vinyl compounds.
- specific examples of the above-mentioned other monomers will be given, but the invention is not limited to these.
- acrylic ester compound examples include methyl acrylate, ethyl acrylate, isopropyl acrylate, benzyl acrylate, naphthyl acrylate, anthryl acrylate, anthryl methyl acrylate, phenyl acrylate, phenoxyethyl acrylate, 2,2,2-trifluoroethyl.
- methacrylic acid ester compound examples include methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, benzyl methacrylate, naphthyl methacrylate, anthryl methacrylate, anthryl methyl methacrylate, phenyl methacrylate, phenoxyethyl methacrylate, 2,2,2-trifluoroethyl.
- vinyl compound examples include methyl vinyl ether, benzyl vinyl ether, vinyl naphthalene, vinyl anthracene, vinyl biphenyl, vinyl carbazole, 2-hydroxyethyl vinyl ether, phenyl vinyl ether, and propyl vinyl ether.
- styrene compound examples include styrene, methyl styrene, chlorostyrene, and bromostyrene.
- N-substituted maleimide compound examples include N-methylmaleimide, N-phenylmaleimide, N-cyclohexylmaleimide, and the like.
- acrylonitrile compound examples include acrylonitrile.
- the method for obtaining the copolymer of the component (A) used in the present invention is not particularly limited.
- the solvent used will not be specifically limited if it dissolves the monomer which has an alkali-soluble group, another monomer, and the copolymer of (A) component.
- the solvent described in the solvent of the (D) component mentioned later is mentioned.
- the alkali-soluble copolymer thus obtained is usually in a solution state dissolved in a solvent.
- the copolymer solution of component (A) obtained as described above is re-precipitated by stirring with stirring such as diethyl ether or water, and the produced precipitate is filtered and washed.
- the copolymer powder can be obtained by drying at room temperature or under heat under reduced pressure or reduced pressure. By such an operation, the polymerization initiator and unreacted monomer coexisting with the copolymer can be removed, and as a result, a purified copolymer powder can be obtained. If sufficient purification cannot be achieved by one operation, the obtained powder may be redissolved in a solvent and the above operation may be repeated.
- the polymerization solution of the alkali-soluble copolymer (A) may be used as it is, or the powder is re-dissolved, for example, in the solvent of the component (D) described later and used as a solution state. Also good.
- the copolymerization ratio of the alkali-soluble monomer is too small, the unexposed portion is not dissolved in the developer and tends to cause a residual film or residue.
- the sclerosis hardenability of an exposure part may be insufficient and a pattern cannot be formed.
- the component (B) is a compound having two or more polymerizable groups.
- the compound having two or more polymerizable groups as used herein means a compound having two or more polymerizable groups in one molecule and having these polymerizable groups at the molecular terminals.
- the polymerizable group means an acrylate group, a methacrylate group, a vinyl group, or an allyl group, and the component (B) targets a compound having two or more of at least one group among them.
- the compound having two or more polymerizable groups as the component (B) has good compatibility with each component in the solution of the negative photosensitive resin composition of the present invention and does not affect the developability. From the viewpoint, a compound having a weight average molecular weight of 1,000 or less is preferable.
- such compounds include dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, pentaerythritol triacrylate, penta Erythritol trimethacrylate, pentaerythritol diacrylate, pentaerythritol dimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, tetramethylolmethane tetraacrylate, tetramethylolmethane tetramethacrylate, trimethylolpropane triacrylate, trimethyl Propanetrimethacryl
- the above-mentioned polyfunctional acrylate compound can be easily obtained as a commercial product.
- Specific examples thereof include, for example, KAYARAD (registered trademark) T-1420, DPHA, DPHA-2C, D-310, D -330, DPCA-20, DPCA-30, DPCA-60, DPCA-120, DN-0075, DN-2475, R-526, NPGDA, PEG400DA, MANDA, R- 167, HX-220, HX620, R-551, R-712, R-604, R-684, GPO-303, TMPTA, THE-330, TPA-320, TPA -330, same PET-30, same RP-1040 (Nippon Kayaku Co., Ltd.); Aronix (registered trademark) M-210, same M-208, same M -211B, M-215, M-220, M-225, M-270, M-240, M-6100, M-6250, M-6500, M-6500, M-6200, M
- the content of the component (B) in the negative photosensitive resin composition of the present invention is preferably 10 to 150 parts by weight, more preferably 20 to 120 parts by weight, based on 100 parts by weight of the component (A). Particularly preferred is 30 to 110 parts by mass.
- the content ratio of the component (B) is too small, the exposed area becomes insufficiently cured, and pattern formation cannot be performed, or even if it can be performed, a film with low reliability may be formed.
- this ratio is excessive, tack may generate
- Component (C) is a photoinitiator, and in the present invention, the following (C-1) and (C-2) photoinitiators having two different (gram) extinction coefficients are used.
- Component (C-1) is a photoinitiator having an oxime ester group and an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more.
- a compound having an oxime ester group and a light absorption site and having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more is a photoinitiator having an oxime ester group and an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more.
- R 1 represents a phenyl group, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or a benzyl group
- R 2 represents a hydrogen atom, a linear, branched or cyclic carbon atom having 1 to 10 represents an alkyl group or a phenyl group, and a broken line represents a bond.
- linear, branched or cyclic alkyl group having 1 to 10 carbon atoms examples include methyl group, ethyl group, n-propyl group, isopropyl group, cyclopropyl group, n-butyl group, isobutyl group and sec-butyl group.
- Examples of the light absorption site include a group selected from a phenyl group, a phenylthiophenyl group, an N-alkylcarbazole group, a naphthyl group, a coumarin group, an alkoxyphenyl group, a phenylalkoxyphenyl group, and a phenoxyalkoxyphenyl group, a benzoyl group, Those substituted with a group having a benzoyl structure such as a naphthylcarbonyl group are preferred. Further, the structure may be substituted with a phenyl group, a phenylthio group, a diphenylamino group, or the like.
- Examples of the component (C-1) include an oxime ester group represented by the above formula (1) via a single bond or a carbonyl group, a phenyl group at a light absorption site, a phenylthiophenyl group, an N-alkylcarbazole.
- a compound bonded to a group selected from a group, a naphthyl group, a coumarin group, an alkoxyphenyl group, a phenylalkoxyphenyl group, and a phenoxyalkoxyphenyl group is preferable.
- component (C-1) examples include, for example, 1- (4-phenylthiophenyl) -1,2-octanedione-2- (O-benzoyloxime), ethanone, 1- [9-ethyl-6 -(2-Methylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime), (E) -4- (4 (4- (diphenylamino) benzoyl) benzyloxy) benzaldehyde-O- Acetyloxime, (E) -4- (4,8-Dimethoxy-1-naphthoyl) benzaldehyde-O-acetyloxime, 1- (9-propyl-9H-carbazol-3-yl) butane-1,3-dione- 1- (O-acetyloxime), 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] butan
- the photoinitiator of the component (C-1) can be easily obtained as a commercial product (photopolymerization initiator). Specific examples thereof include IRGACURE (registered trademark) OXE01 and IRGACURE (registered trademark) OXE02. (Above, manufactured by BASF), Adekaoptomer N-1919, Adeka Arcles NCI-831, Adeka Arcles NCI-930 (above, manufactured by ADEKA Corporation), and the like. These (C-1) component photoinitiators may be used alone or in combination of two or more.
- the content of the component (C-1) in the negative photosensitive resin composition of the present invention is preferably 0.3 to 5 parts by mass, more preferably 0 to 100 parts by mass of the component (A). .5 to 4 parts by mass.
- the proportion of the component (C-1) is less than 0.3 parts by mass, as described later, when the coating film coated with the resin composition on the substrate is exposed from the back surface of the substrate, In some cases, the curability up to the surface of the coating film may decrease. If this ratio is more than 5 parts by mass, the transmittance of the cured film will decrease or the surface will be exposed when exposed from the back surface of the substrate. The curability of the resin may decrease.
- Component (C-2) is a photoinitiator having an extinction coefficient in methanol or acetonitrile at 365 nm of 100 ml / g ⁇ cm or less.
- component (C-2) for example, those having a hydroxy group are preferred.
- component (C-2) examples include, for example, 1-hydroxy-cyclohexyl-phenyl-ketone, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1- Propan-1-one, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, phenylglyoxylic acid methyl ester, 2-oxy-2-phenylacetic acid 2- [2-hydroxy-ethoxy] ethyl Examples include esters.
- the photoinitiator of the component (C-2) can be easily obtained as a commercial product (photopolymerization initiator). Specific examples thereof include IRGACURE (registered trademark) 2959 and IRGACURE (registered trademark) 754. IRGACURE (registered trademark) 184, DAROCURE MBF, DAROCURE 1173 (above, manufactured by BASF) and the like. These (C-2) component photoinitiators can be used alone or in combination of two or more.
- the content of the component (C-2) in the negative photosensitive resin composition of the present invention is preferably 0.5 to 10 parts by mass, more preferably 1 part per 100 parts by mass of the component (A). Parts by mass to 7 parts by mass.
- the proportion of the component (C-2) is less than 0.5 parts by mass, the curability of the surface may be lowered.
- the proportion is more than 10 parts by mass, the transmittance of the cured film is low. It may decrease or a residue may be generated in the unexposed area.
- the (D) component solvent used in the present invention dissolves the (A) component, the (B) component, and the (C) component, and includes the following (E) component, (F) component, and the like that are optionally added.
- the type and structure of the solvent are not particularly limited as long as they are soluble and have such a dissolving ability.
- Such a component (D) solvent examples include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol, propylene glycol monomethyl ether, Propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, 2-butanone, 3-methyl-2-pentanone, 2-pentanone, 2-heptanone, ⁇ -butyrolactone, 2- Ethyl hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl Ethyl hydroxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, methyl 3-
- solvents can be used alone or in combination of two or more.
- solvents of component (D) propylene glycol monomethyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, ethyl lactate, butyl lactate and the like are preferable from the viewpoint of good coating properties and high safety. These solvents are generally used as solvents for photoresist materials.
- a component is a thiol compound.
- the negative photosensitive resin composition of the present invention can further contain a thiol compound for the purpose of improving the curing rate as long as the effects of the present invention are not impaired.
- the thiol compound as the component (E) is not particularly limited, and examples thereof include 1-hexanethiol, 1-heptanethiol, 1-octanethiol, 1-nonanethiol, 1-decanethiol, 1-undecanethiol, 1-dodecane.
- thiol compounds as component (E), pentaerythritol tetrakis (3-mercaptobutanoate), 1,4-bis (3-mercaptobutyryloxy) butane, 1,3,5-tris [2- (3 From the viewpoint that -sulfanylbutanoyloxy) ethyl] -1,3,5-triazinan-2,4,6-trione is high in storage stability of the negative photosensitive resin solution and sufficient curability is obtained. preferable.
- a thiol compound When a thiol compound is used, its content is 0.01 to 10 parts by mass, preferably 0.03 to 5 parts by mass, based on 100 parts by mass of component (A). Even if the amount of the thiol compound used as the component (E) is set to an excessive amount, the pattern resolution may be lowered. If it is too small, the effect of improving curability may not be exhibited.
- Component (F) is a surfactant.
- the negative photosensitive resin composition of the present invention can further contain a surfactant for the purpose of improving the coating properties as long as the effects of the present invention are not impaired.
- the surfactant as the component (F) is not particularly limited, and examples thereof include a fluorine-based surfactant, a silicone-based surfactant, and a nonionic surfactant.
- a fluorine-based surfactant for example, commercially available products such as those manufactured by Sumitomo 3M Co., Ltd., DIC Corp., or AGC Seimi Chemical Co., Ltd. can be used. These commercial products are convenient because they can be easily obtained.
- Specific examples thereof include Polyfox PF-136A, 151, 156A, 154N, 159, 636, 6320, 656, 6520 (manufactured by Omniva), MegaFac (registered trademark) R30, R08, R40, R41, R43.
- a surfactant When a surfactant is used, its content is 0.01 to 1 part by mass, preferably 0.02 to 0.8 part by mass, based on 100 parts by mass of component (A). Even if the amount of the surfactant used as the component (F) is set to an amount exceeding 1 part by mass, the effect of improving the coating property becomes dull and not economical. When the amount is 0.01 parts by mass or less, the effect of improving applicability may not be exhibited.
- the negative photosensitive resin composition of the present invention is a sensitizer, a chain transfer agent, a cross-linking agent, a rheology modifier, a pigment, a dye, a storage stability, as long as the effects of the present invention are not impaired.
- Agents, antifoaming agents, or dissolution accelerators such as polyhydric phenols and polycarboxylic acids.
- the negative photosensitive resin composition of the present invention has (A) an alkali-soluble polymer, (B) a compound having two or more polymerizable groups, and (C-1) an oxime ester group.
- the photoinitiator having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more, and the extinction coefficient in methanol or acetonitrile at 365 nm of component (C-2) is 100 ml / g ⁇ cm
- the following photoinitiator is dissolved in the solvent of component (D), and if desired, one or more of thiol compound of component (E), surfactant of component (F), and other additives It is a composition which can contain further.
- the preferable example of the negative photosensitive resin composition of this invention is as follows. [1]: Based on 100 parts by mass of component (A), 10 to 150 parts by mass of component (B), 0.3 to 5 parts by mass of component (C-1), 0.5 to 10 parts by mass A negative photosensitive resin composition containing parts by weight of component (C-2) and these components dissolved in the solvent of component (D). [2] A negative photosensitive resin composition further comprising 0.01 to 10 parts by mass of the component (E) based on 100 parts by mass of the component (A) in the composition of the above [1]. [3]: A negative photosensitive resin composition containing 0.01 to 1 part by mass of the component (F) based on 100 parts by mass of the component (A) in the composition of [1] or [2]. .
- the ratio of the solid content in the negative photosensitive resin composition of the present invention is not particularly limited as long as each component is uniformly dissolved in the solvent, but is, for example, 1 to 80% by mass, 5 to 70% by mass, or 10 to 60% by mass.
- solid content means what remove
- the method for preparing the negative photosensitive resin composition of the present invention is not particularly limited.
- the copolymer of the component (A) is dissolved in the solvent of the component (D) and the solution is added to this solution.
- a compound having two or more polymerizable groups, (C-1) component photoinitiator, and (C-2) component photoinitiator are mixed in a predetermined ratio to obtain a uniform solution.
- the thiol compound of (E) component, the surfactant of (F) component, and other additives are further added and mixed as needed.
- the polymerization solution of the copolymer of the component (A) obtained by the polymerization reaction in the solvent of the component (D) can be used as it is without purification.
- the (B) component, the (C-1) component, the (C-2) component, etc. are added to the polymerization solution of the (A) component in the same manner as described above, the purpose is to adjust the concentration.
- a solvent of component (D) may be additionally added.
- the solvent of the component (D) used in the process of forming the copolymer of the component (A) and the solvent of the component (D) used for adjusting the concentration when preparing the negative photosensitive resin composition It may be the same or different.
- the prepared negative photosensitive resin composition solution is preferably used after being filtered using a filter having a pore size of about 0.2 ⁇ m.
- the negative photosensitive resin composition of the present invention can be applied to a semiconductor substrate (for example, a silicon / silicon dioxide-coated substrate, a silicon nitride substrate, a substrate coated with a metal such as aluminum, molybdenum, or chromium, a glass substrate, or a quartz substrate.
- a semiconductor substrate for example, a silicon / silicon dioxide-coated substrate, a silicon nitride substrate, a substrate coated with a metal such as aluminum, molybdenum, or chromium, a glass substrate, or a quartz substrate.
- film substrates eg, triacetyl cellulose (TAC) film, cycloolefin polymer (COP) film, cycloolefin copolymer (COC) film, polyethylene terephthalate (PET) film, acrylic film, polyimide film, etc.
- TAC triacetyl cellulose
- COC cycloolefin polymer
- COC cycloolefin copolymer
- PET polyethylene terephthalate
- acrylic film polyimide film
- Etc. by spin coating, flow coating, roll coating, slit coating, spin coating following slit, ink jet coating, etc., and then pre-dried in a hot plate or oven to form a coating film Do Door can be. Then, a negative photosensitive resin film is formed by heat-treating this coating film.
- a heating temperature and a heating time appropriately selected from the range of a temperature of 70 ° C. to 150 ° C. and a time of 0.3 to 60 minutes are adopted.
- the heating temperature and heating time are preferably 80 to 120 ° C. and 0.5 to 10 minutes.
- the film thickness of the negative photosensitive resin film formed from the negative photosensitive resin composition is, for example, 0.1 to 50 ⁇ m, for example, 0.5 to 40 ⁇ m, and further, for example, 1 to 30 ⁇ m.
- the negative photosensitive resin film formed from the negative photosensitive resin composition of the present invention is exposed to light such as ultraviolet rays, ArF, KrF, and F 2 laser light using a mask having a predetermined pattern
- the exposed portion of the film is insoluble in an alkaline developer due to the action of radicals generated from the photopolymerization initiators of the components (C-1) and (C-2) contained in the negative photosensitive resin film It becomes.
- the negative photosensitive resin film of the present invention is formed on a light-transmitting substrate, not only the exposure from the upper part of the surface of the substrate on which the resin film (coating film) is formed, but also the resin film (coating). Even if exposure is performed through a mask or the like from the surface opposite to the surface on which the film is formed (coating surface), the exposed portion becomes a cured product that is sufficiently insoluble in the alkaline developer.
- alkaline developer examples include aqueous solutions of alkali metal hydroxides such as sodium carbonate, potassium carbonate, potassium hydroxide, and sodium hydroxide, and hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, and choline.
- alkali metal hydroxides such as sodium carbonate, potassium carbonate, potassium hydroxide, and sodium hydroxide
- hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, and choline.
- a surfactant or the like can be added to these developers.
- photoresist developers 0.5 to 3% by weight aqueous solution of sodium carbonate, 0.01 to 0.5% by weight aqueous solution of potassium hydroxide and 0.1 to 2.38% by weight aqueous solution of tetraethylammonium hydroxide are used as photoresist developers.
- the photosensitive resin composition of the present invention can also be developed satisfactorily without causing problems such as swelling using the alkaline developer.
- any of a liquid piling method, a dipping method, a rocking dipping method and the like can be used as a developing method.
- the development time at that time is usually 15 to 180 seconds.
- the negative photosensitive resin film is washed with running water, for example, for 20 to 90 seconds, and then air-dried with compressed air or compressed nitrogen or by spinning to remove moisture on the substrate, and A patterned film is obtained.
- the pattern forming film is heated by using a hot plate, an oven, or the like by performing post-baking for heat curing or post-exposure for photocuring.
- a film having a good relief pattern (cured film) with improved heat resistance, transparency, planarization, low water absorption, chemical resistance, and the like can be obtained.
- the post-bake is generally processed at a heating temperature selected from the range of 120 ° C. to 250 ° C. for 1 to 30 minutes when on a hot plate and 1 to 90 minutes when in an oven. The method is taken.
- a desired cured film having a good pattern shape can be obtained by such post-baking.
- the negative photosensitive resin composition of the present invention there is no tack before exposure, alkali development is possible, sufficiently high sensitivity is achieved even at a film thickness of about 15 ⁇ m, and the film of the exposed portion during development. Reduction is very small, and a coating film having a fine pattern can be formed. Furthermore, this cured film is excellent in transparency, heat resistance and solvent resistance. Therefore, it can be suitably used for various films in liquid crystal displays, organic EL displays, touch panel elements, etc., for example, interlayer insulating films, protective films, insulating films, optical films and the like.
- Examples 1 to 5 and Comparative Examples 1 to 7 In accordance with the composition shown in Table 1 below, the component (A) solution contains the components (B), (C-1), (C-2), the solvent (D), and the component (E).
- the negative photosensitive resin composition of each Example and each Comparative Example was prepared by mixing at a ratio of 5% and stirring at room temperature for 3 hours to obtain a uniform solution.
- the negative photosensitive resin composition was applied onto a quartz substrate using a spin coater, and then pre-baked on a hot plate at a temperature of 110 ° C. for 120 seconds to form a coating film (film thickness 20 ⁇ m).
- the coating film was irradiated with 100 mJ / cm 2 of ultraviolet light having a light intensity of 7.1 mW / cm 2 at 365 nm using an ultraviolet irradiation device PLA-600FA manufactured by Canon Inc.
- the cured film was measured for transmittance at a wavelength of 400 nm using an ultraviolet-visible spectrophotometer (SIMADZU UV-2550 model number, manufactured by Shimadzu Corporation).
- a negative photosensitive resin composition was applied on a non-alkali glass (substrate) with a black line and space of 10 ⁇ m with a film thickness of 200 nm using a spin coater, and then on a hot plate at a temperature of 110 ° C. for 120 seconds. Pre-baking was performed to form a coating film (film thickness 20 ⁇ m).
- a UV irradiation device PLA-600FA manufactured by Canon Inc. the UV light having a light intensity at 365 nm of 7.1 mW / cm 2 is applied from the surface (back surface) opposite to the surface on which the coating film is formed on the substrate. 100 mJ / cm 2 was irradiated.
- each of the negative photosensitive resin compositions of Examples 1 to 5 has a high residual film ratio even at a low exposure amount, and a photoinitiator (C-2) having a small absorption coefficient at 365 nm. ) was confirmed to have improved curability. Furthermore, the transmittance after exposure was as high as 90% or more, and high transparency was maintained even with a thick film (film thickness 20 ⁇ m). Furthermore, a pattern having a rectangular shape could be formed.
- Comparative Examples 1 to 4 using only a photoinitiator having a large absorption coefficient at 365 nm and Comparative Example 6 using both of them with a photoinitiator having a relatively large absorption coefficient are the same exposure as the above examples.
- Comparative Examples 1 to 3 the transmittance after exposure was as low as 90% or less. Further, Comparative Example 5 using only a photoinitiator having a small extinction coefficient at 365 nm and Comparative Example 7 using an initiator having a large extinction coefficient not containing an oxime ester group and a photoinitiator having a small extinction coefficient are used. As a result, although the transmittance was high, it was dissolved in an alkaline developer after the exposure and the residual film rate was 0, so that the curability was low and a pattern could not be formed.
- the negative photosensitive resin composition according to the present invention is a material for forming a cured film such as a protective film, a planarizing film, and an insulating film in various displays such as a thin film transistor (TFT) type liquid crystal display element, an organic EL element, and a touch panel element.
- TFT thin film transistor
- interlayer insulating films for TFT liquid crystal elements, protective films for color filters, array flattening films, interlayer insulating films for capacitive touch panels, insulating films for organic EL elements, and optical property adjustment layers on display surfaces It is also suitable as a material for forming a structure sheet or the like.
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Abstract
Description
またアルカリ現像が可能なネガ型材料として、アクリロイル基を有するポリマー、多官能アクリルモノマーおよび光ラジカル開始剤を含有するラジカル重合系のネガ型材料が知られている(例えば、特許文献2)。
一方、ポジ型材料は、解像度は高いが、厚膜化が難しく透明性も低いことが知られている(例えば、特許文献3)。
すなわち、第1観点として、下記(A)成分、(B)成分、(C-1)成分、(C-2)成分及び(D)成分を含有する感光性樹脂組成物に関する。
(A)成分:アルカリ可溶性共重合体、
(B)成分:アクリレート基、メタクリレート基、ビニル基及びアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物、
(C-1)成分:オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、
(C-2)成分:365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤、
(D)成分:溶剤。
第2観点として、(E)成分として、チオール化合物をさらに含有する、第1観点に記載の感光性樹脂組成物に関する。
第3観点として、(A)成分は数平均分子量がポリスチレン換算で2,000乃至50,000のアルカリ可溶性共重合体である、第1観点または第2観点に記載の感光性樹脂組成物に関する。
第4観点として、(A)成分のアルカリ可溶性共重合体がアクリル酸、メタクリル酸、無水マレイン酸及びマレイミドからなる群より選ばれる少なくとも1種を含むモノマー混合物の共重合により生ずる共重合体である、第1観点乃至第3観点のいずれか一項に記載の感光性樹脂組成物に関する。
第5観点として、(C-1)成分の含有量が(A)成分100質量部に対し、0.3質量部乃至5質量部である、第1観点乃至第4観点のいずれか一項に記載の感光性樹脂組成物に関する。
第6観点として、(C-2)成分の含有量が(A)成分100質量部に対し、0.5質量部乃至10質量部である、第1観点乃至第5観点のいずれか一項に記載の感光性樹脂組成物に関する。
第7観点として、(B)成分の含有量が(A)成分100質量部に対し、10質量部乃至150質量部である、第1観点乃至第6観点のいずれか一項に記載の感光性樹脂組成物に関する。
第8観点として、(C-1)成分がカルバゾール構造を有する光開始剤である、第1観点乃至第7観点のいずれか一項に記載の感光性樹脂組成物に関する。
第9観点として、(C-2)成分がヒドロキシ基を有する光開始剤である、第1観点乃至第8観点のいずれか一項に記載の感光性樹脂組成物に関する。
第10観点として、(F)成分として、界面活性剤をさらに含有する、第1観点乃至第9観点のいずれか一項に記載の感光性樹脂組成物に関する。
第11観点として、第1観点乃至第10観点のうちいずれか一項に記載の感光性樹脂組成物を用いて得られる硬化膜に関する。
第12観点として、第1観点乃至第10観点のうちいずれか一項に記載の感光性樹脂組成物からなる光透過性基材上の塗膜を、該基材の塗膜面とは反対側の面から露光して得られる硬化膜に関する。
第13観点として、第11観点または第12観点に記載の硬化膜からなる液晶ディスプレイ用層間絶縁膜に関する。
第14観点として、第11観点または第12観点に記載の硬化膜からなる光学フィルタに関する。
(A)成分:アルカリ可溶性共重合体、
(B)成分:アクリレート基、メタクリレート基、ビニル基及びアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物、
(C-1)成分:オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、
(C-2)成分:365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤、
(D)成分:溶剤。
(A)成分はアルカリ可溶性重合体であって、アルカリ可溶性基を有するモノマー及びその他モノマーを含むモノマー混合物の共重合により生ずる共重合体(以下、単に(A)成分の共重合体とも称する)である。
カルボキシル基を有するモノマーとしては、例えば、アクリル酸、メタクリル酸、クロトン酸、モノ-(2-(アクリロイルオキシ)エチル)フタレート、モノ-(2-(メタクリロイルオキシ)エチル)フタレート、N-(カルボキシフェニル)マレイミド、N-(カルボキシフェニル)メタクリルアミド、N-(カルボキシフェニル)アクリルアミド、4-ビニル安息香酸等が挙げられる。
フェノール性ヒドロキシ基を有するモノマーとしては、例えば、ヒドロキシスチレン、N-(ヒドロキシフェニル)アクリルアミド、N-(ヒドロキシフェニル)メタクリルアミド、N-(ヒドロキシフェニル)マレイミド等が挙げられる。
酸無水物基を有するモノマーとしては、例えば、無水マレイン酸、無水イタコン酸等が挙げられる。
マレイミド基を有するモノマーとしては、例えば、マレイミドや、前述のN-(カルボキシフェニル)マレイミド、N-(ヒドロキシフェニル)マレイミド等が挙げられる。
これらアルカリ可溶性基を有するモノマーの中でも、アクリル酸、メタクリル酸、無水マレイン酸及びマレイミドからなる群より選ばれる少なくとも1種を含むモノマー混合物を共重合して得られる共重合体であることが好ましい。
そのようなその他モノマーの具体例としては、アクリル酸エステル化合物、メタクリル酸エステル化合物、N-置換マレイミド化合物、アクリロニトリル化合物、アクリルアミド化合物、メタクリルアミド化合物、スチレン化合物及びビニル化合物等が挙げられる。
以下、上記その他モノマーの具体例を挙げるが、これらに限定されるものではない。
(B)成分は重合性基を2個以上有する化合物である。ここで言うところの重合性基を2個以上有する化合物とは、一分子中に重合性基を2個以上有し、且つそれらの重合性基が分子末端にある化合物を意味する。前記重合性基とは、アクリレート基、メタクリレート基、ビニル基又はアリル基を意味し、(B)成分はこれらのうち少なくとも一種の基を2個以上有する化合物を対象とする。
この(B)成分である重合性基を2個以上有する化合物は、本発明のネガ型感光性樹脂組成物の溶液において、各成分との相溶性が良好で、且つ現像性に影響を与えないという観点から、重量平均分子量が1,000以下の化合物が好ましい。
これらの重合性基を2個以上有する化合物は1種または2種以上を組み合わせて用いることができる。
(C)成分は光開始剤であって、本発明では下記(C-1)及び(C-2)の2種の異なる(グラム)吸光係数を有する光開始剤を用いる。
(C-1)成分は、オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤である。具体的には、オキシムエステル基と光吸収部位とを有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である化合物が挙げられる。
上記(C-1)成分の光開始剤は、市販品(光重合開始剤)として容易に入手が可能であり、その具体例としては、例えばIRGACURE(登録商標)OXE01、IRGACURE(登録商標)OXE02(以上、BASF社製)、アデカオプトマーN-1919、アデカアークルズNCI-831、アデカアークルズNCI-930(以上、(株)ADEKA製)等が挙げられる。
これら(C-1)成分の光開始剤は、単独で使用しても、二種類以上を併用することも可能である。
(C-2)成分は、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤である。(C-2)成分としては、例えば、ヒドロキシ基を有するものが好ましい。
上記(C-2)成分の光開始剤は、市販品(光重合開始剤)として容易に入手が可能であり、その具体例としては、例えばIRGACURE(登録商標)2959、IRGACURE(登録商標)754、IRGACURE(登録商標)184、DAROCURE MBF、DAROCURE 1173(以上、BASF社製)等が挙げられる。
これら(C-2)成分の光開始剤は単独で使用しても、二種類以上を併用することも可能である。
本発明に用いる(D)成分の溶剤は、(A)成分、(B)成分、および(C)成分を溶解し、且つ所望により添加される後述の(E)成分、(F)成分などを溶解するものであり、斯様な溶解能を有する溶剤であれば、その種類及び構造などは特に限定されるものでない。
(E)成分は、チオール化合物である。本発明のネガ型感光性樹脂組成物にあっては、その硬化速度を向上させるという目的で、本発明の効果を損なわない限りにおいて、更にチオール化合物を含有することができる。
これらの(E)成分であるチオール化合物は、一種単独で、または二種以上の組合せで使用することができる。
(F)成分は、界面活性剤である。本発明のネガ型感光性樹脂組成物にあっては、その塗布性を向上させるという目的で、本発明の効果を損なわない限りにおいて、更に界面活性剤を含有することができる。
(F)成分の界面活性剤は、一種単独で、または二種以上の組合せで使用することができる。
更に、本発明のネガ型感光性樹脂組成物は、本発明の効果を損なわない限りにおいて、必要に応じて、増感剤、連鎖移動剤、架橋剤、レオロジー調整剤、顔料、染料、保存安定剤、消泡剤、または多価フェノール、多価カルボン酸等の溶解促進剤等を含有することができる。
本発明のネガ型感光性樹脂組成物は、(A)成分のアルカリ可溶性重合体、(B)成分の重合性基を2個以上有する化合物、(C-1)成分のオキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、及び(C-2)成分の365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤を(D)成分の溶剤に溶解したものであり、且つ、それぞれ所望により(E)成分のチオール化合物、(F)成分の界面活性剤、及びその他添加剤のうち一種以上を更に含有することができる組成物である。
[1]:(A)成分100質量部に基づいて、10乃至150質量部の(B)成分、0.3質量部乃至5質量部の(C-1)成分、0.5質量部乃至10質量部の(C-2)成分を含有し、これら成分が(D)成分の溶剤に溶解されたネガ型感光性樹脂組成物。
[2]:上記[1]の組成物において、更に(E)成分を(A)成分100質量部に基づいて、0.01乃至10質量部含有するネガ型感光性樹脂組成物。
[3]:上記[1]または[2]の組成物において、更に(F)成分を(A)成分100質量部に基づいて、0.01乃至1質量部含有するネガ型感光性樹脂組成物。
本発明のネガ型感光性樹脂組成物は、これを半導体基板(例えば、シリコン/二酸化シリコン被覆基板、シリコンナイトライド基板、金属例えばアルミニウム、モリブデン、クロムなどが被覆された基板、ガラス基板、石英基板、ITO基板等)やフィルム基板(例えば、トリアセチルセルロース(TAC)フィルム、シクロオレフィンポリマー(COP)フィルム、シクロオレフィンコポリマー(COC)フィルム、ポリエチレンテレフタレート(PET)フィルム、アクリルフィルム、ポリイミド等の樹脂フィルム)等の上に、回転塗布、流し塗布、ロール塗布、スリット塗布、スリットに続いた回転塗布、インクジェット塗布などによって塗布し、その後、ホットプレートまたはオーブン等で予備乾燥することにより、塗膜を形成することができる。その後、この塗膜を加熱処理することにより、ネガ型感光性樹脂膜が形成される。
また、本発明のネガ型感光性樹脂膜は、光透過性基板上に形成した場合、該樹脂膜(塗膜)を形成した基板の面の上部からの露光だけでなく、該樹脂膜(塗膜)を形成した面(塗膜面)とは反対側の面からマスク等を介して露光しても、露光部がアルカリ性現像液に十分に不溶な硬化物となる。
以下の実施例で用いる略記号の意味は、次のとおりである。
MAA:メタクリル酸
MMA:メチルメタクリレート
AIBN:アゾビスイソブチロニトリル
PRG1:エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-1-(O-アセチルオキシム)(365nm吸光係数:7,749ml/g・cm in CH3CN)
PRG2:1-ヒドロキシ-シクロヘキシル-フェニル-ケトン(365nm吸光係数:88.64ml/g・cm in MeOH)
PRG3:1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン(365nm吸光係数:48.93ml/g・cm in MeOH)
PRG4:2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン(365nm吸光係数:73.88ml/g・cm in MeOH)
PRG5:フェニルグリオキシリックアシッドメチルエステル(365nm吸光係数:38ml/g・cm in CH3CN)
PRG6:2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-ブタノン-1(365nm吸光係数:7,858ml/g・cm in MeOH)
PRG7:ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド(365nm吸光係数:2,309ml/g・cm in MeOH)
PRG8:2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(365nm吸光係数:446.5ml/g・cm in CH3CN)
DPHA:ジペンタエリスリトールペンタ及びヘキサアクリレート
CTA:昭和電工(株)製 カレンズ-MT(登録商標)PE1(製品名)(化合物名:ペンタエリスリトールテトラキス(3-メルカプトブチレート))
PGME:プロピレングリコールモノメチルエーテル
以下の合成例に従い得られた(A)成分の共重合体の数平均分子量及び重量平均分子量は、島津サイエンス(株)製GPC装置(カラムKF803LおよびKF804L)を用い、溶出溶媒テトラヒドロフランを流量1mL/分でカラム中に(カラム温度40℃)流して溶離させるという条件で測定した。なお、下記の数平均分子量(以下、Mnと称す。)及び重量平均分子量(以下、Mwと称す。)は、ポリスチレン換算値にて表される。
共重合体を構成するモノマー成分として、MAA(30.0g)、MMA(120.0g)を使用し、ラジカル重合開始剤としてAIBN(6.4g)を使用し、これらを溶剤PGME(290g)中において重合反応させることにより、Mn9,700、Mw21,500である(A)成分の共重合体溶液(共重合体濃度:35質量%)を得た(P1)。なお、重合温度は、温度60℃乃至90℃に調整した。
次の表1に示す組成に従い、(A)成分の溶液に、(B)成分、(C-1)成分、(C-2)成分、(D)成分の溶剤、及び(E)成分を所定の割合で混合し、室温で3時間撹拌して均一な溶液とすることにより、各実施例及び各比較例のネガ型感光性樹脂組成物を調製した。
ネガ型感光性樹脂組成物を無アルカリガラス(基板)上にスピンコーターを用いて塗布した後、温度110℃で120秒間ホットプレート上においてプリベークを行い、塗膜を形成した(膜厚20μm)。キヤノン(株)製紫外線照射装置PLA-600FAを用いて365nmにおける光強度が7.1mW/cm2の紫外線を、該基板の塗膜を形成した面とは反対側の面(裏面)から塗膜に対して25mJ/cm2照射した。その後2.0質量%の炭酸水素ナトリウム水溶液で90秒間スプレー現像を行った後、超純水で20秒間流水洗浄を行うことで硬化膜を得た。
作製した硬化膜を140℃のホットプレートにて3分焼成(ポストベーク)したものについて膜厚をVecco製 Dektak3を用いて測定した。残膜率(%)は(ポストベーク後膜厚/プリベーク後膜厚)×100として計算した。
ネガ型感光性樹脂組成物を石英基板上にスピンコーターを用いて塗布した後、温度110℃で120秒間ホットプレート上においてプリベークを行い、塗膜を形成した(膜厚20μm)。この塗膜に対して、キヤノン(株)製紫外線照射装置PLA-600FAを用いて、365nmにおける光強度が7.1mW/cm2の紫外線を100mJ/cm2照射した。この硬化膜について、紫外線可視分光光度計((株)島津製作所製SIMADZU UV-2550型番)を用いて400nmの波長の透過率を測定した。
ネガ型感光性樹脂組成物を、黒色10μmのライン&スペースが形成された無アルカリガラス(基板)上にスピンコーターを用いて膜厚200nmで塗布した後、温度110℃で120秒間ホットプレート上においてプリベークを行い、塗膜を形成した(膜厚20μm)。キヤノン(株)製紫外線照射装置PLA-600FAを用いて365nmにおける光強度が7.1mW/cm2の紫外線を、該基板の塗膜を形成した面とは反対側の面(裏面)から塗膜に対して100mJ/cm2照射した。その後2.0質量%の炭酸ナトリウム水溶液で90秒間スプレー現像を行った後、超純水で20秒間流水洗浄を行うことでパターンを形成した。作製したパターンを140℃のホットプレートで3分間焼成したものについて、走査型顕微鏡(SEM)観察し、パターン形状を確認した。20μm周期の矩形形状が作製できたものについては○、矩形形状は作製できるが膜厚が足りないもの(膜厚14μm以下)については△、矩形形状が作製できなかったものは×とした。
以上の評価を行った結果を、次の表2に示す。
一方、365nmの吸光係数が大きい光開始剤のみを使用した比較例1乃至4並びにこれらと比較的吸光係数が大きい光開始剤とを併用した比較例6については、上記実施例と同程度の露光量では残膜率が低く、パターン(矩形)は作製できるものの膜厚が失われるという結果となった。また、比較例1乃至3については、露光後の透過率も90%以下と低かった。さらに、365nmにおける吸光係数の小さい光開始剤のみを使用した比較例5、並びに、オキシムエステル基を含有しない吸光係数の大きい開始剤と吸光係数の小さい光開始剤とを併用した比較例7にあっては、透過率は高いものの、露光後にアルカリ性現像液に溶解してしまい残膜率が0になるなど硬化性が低く、パターンを形成することもできないとする結果となった。
Claims (14)
- 下記(A)成分、(B)成分、(C-1)成分、(C-2)成分及び(D)成分を含有する感光性樹脂組成物。
(A)成分:アルカリ可溶性共重合体、
(B)成分:アクリレート基、メタクリレート基、ビニル基及びアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物、
(C-1)成分:オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、
(C-2)成分:365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤、
(D)成分:溶剤。 - (E)成分として、チオール化合物をさらに含有する、請求項1に記載の感光性樹脂組成物。
- (A)成分は数平均分子量がポリスチレン換算で2,000乃至50,000のアルカリ可溶性共重合体である、請求項1または2に記載の感光性樹脂組成物。
- (A)成分のアルカリ可溶性共重合体がアクリル酸、メタクリル酸、無水マレイン酸及びマレイミドからなる群より選ばれる少なくとも1種を含むモノマー混合物の共重合により生ずる共重合体である、請求項1乃至3のいずれか一項に記載の感光性樹脂組成物。
- (C-1)成分の含有量が(A)成分100質量部に対し、0.3質量部乃至5質量部である、請求項1乃至4のいずれか一項に記載の感光性樹脂組成物。
- (C-2)成分の含有量が(A)成分100質量部に対し、0.5質量部乃至10質量部である、請求項1乃至4のいずれか一項に記載の感光性樹脂組成物。
- (B)成分の含有量が(A)成分100質量部に対し、10質量部乃至150質量部である、請求項1乃至6のいずれか一項に記載の感光性樹脂組成物。
- (C-1)成分がカルバゾール構造を有する光開始剤である、請求項1乃至7のいずれか一項に記載の感光性樹脂組成物。
- (C-2)成分がヒドロキシ基を有する光開始剤である、請求項1乃至8のいずれか一項に記載の感光性樹脂組成物。
- (F)成分として、界面活性剤をさらに含有する、請求項1乃至9のいずれか一項に記載の感光性樹脂組成物。
- 請求項1乃至10のうちいずれか一項に記載の感光性樹脂組成物を用いて得られる硬化膜。
- 請求項1乃至10のうちいずれか一項に記載の感光性樹脂組成物からなる光透過性基材上の塗膜を、該基材の塗膜面とは反対側の面から露光して得られる硬化膜。
- 請求項11または12に記載の硬化膜からなる液晶ディスプレイ用層間絶縁膜。
- 請求項11または12に記載の硬化膜からなる光学フィルタ。
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CN107710061B (zh) * | 2016-01-26 | 2022-01-28 | 积水化学工业株式会社 | 液晶显示元件用遮光密封剂、上下导通材料和液晶显示元件 |
US20200292939A1 (en) * | 2019-03-13 | 2020-09-17 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article |
KR20220044982A (ko) | 2019-08-07 | 2022-04-12 | 닛산 가가쿠 가부시키가이샤 | 수지 조성물 |
EP3974904A1 (en) | 2020-09-24 | 2022-03-30 | Shin-Etsu Chemical Co., Ltd. | Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component |
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TWI655505B (zh) | 2019-04-01 |
CN105765458B (zh) | 2020-12-29 |
CN105765458A (zh) | 2016-07-13 |
JP6624379B2 (ja) | 2019-12-25 |
JPWO2015060240A1 (ja) | 2017-03-09 |
KR20160075566A (ko) | 2016-06-29 |
KR20210106011A (ko) | 2021-08-27 |
TW201527888A (zh) | 2015-07-16 |
KR102468581B1 (ko) | 2022-11-18 |
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