WO2021024928A1 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
- Publication number
- WO2021024928A1 WO2021024928A1 PCT/JP2020/029377 JP2020029377W WO2021024928A1 WO 2021024928 A1 WO2021024928 A1 WO 2021024928A1 JP 2020029377 W JP2020029377 W JP 2020029377W WO 2021024928 A1 WO2021024928 A1 WO 2021024928A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- component
- resin composition
- mass
- parts
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 61
- 239000002904 solvent Substances 0.000 claims abstract description 52
- 229920001577 copolymer Polymers 0.000 claims abstract description 36
- 239000000049 pigment Substances 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 239000005871 repellent Substances 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims abstract description 11
- 230000002940 repellent Effects 0.000 claims abstract description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 7
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims description 79
- -1 thiol compound Chemical class 0.000 claims description 79
- 239000010408 film Substances 0.000 claims description 60
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 33
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 27
- 238000002834 transmittance Methods 0.000 claims description 21
- 239000006185 dispersion Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 7
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 4
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 claims description 3
- 238000005401 electroluminescence Methods 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 38
- 230000008569 process Effects 0.000 abstract description 7
- 230000000903 blocking effect Effects 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 description 31
- 125000004432 carbon atom Chemical group C* 0.000 description 20
- 125000003709 fluoroalkyl group Chemical group 0.000 description 17
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 16
- 125000003277 amino group Chemical group 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 13
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 238000006116 polymerization reaction Methods 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 125000003368 amide group Chemical group 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- 239000004094 surface-active agent Substances 0.000 description 9
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 9
- 230000008033 biological extinction Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 8
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 7
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 7
- 229910052731 fluorine Inorganic materials 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000002318 adhesion promoter Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 229920005575 poly(amic acid) Polymers 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 230000000379 polymerizing effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 229920002396 Polyurea Polymers 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 125000004428 fluoroalkoxy group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 239000012986 chain transfer agent Substances 0.000 description 3
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical group Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 3
- 239000013065 commercial product Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LAXOSKGHJOPZMF-UHFFFAOYSA-N (2-propyl-2-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC1C(CCC)(OC(=O)C(C)=C)C2C3 LAXOSKGHJOPZMF-UHFFFAOYSA-N 0.000 description 2
- AURQHUVLTRSLGM-UHFFFAOYSA-N (2-propyl-2-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1C(CCC)(OC(=O)C=C)C2C3 AURQHUVLTRSLGM-UHFFFAOYSA-N 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 2
- CNDOSNMFHUSKGN-UHFFFAOYSA-N 1-(2-hydroxyphenyl)pyrrole-2,5-dione Chemical compound OC1=CC=CC=C1N1C(=O)C=CC1=O CNDOSNMFHUSKGN-UHFFFAOYSA-N 0.000 description 2
- PMBXCGGQNSVESQ-UHFFFAOYSA-N 1-Hexanethiol Chemical compound CCCCCCS PMBXCGGQNSVESQ-UHFFFAOYSA-N 0.000 description 2
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 2
- XIRPMPKSZHNMST-UHFFFAOYSA-N 1-ethenyl-2-phenylbenzene Chemical group C=CC1=CC=CC=C1C1=CC=CC=C1 XIRPMPKSZHNMST-UHFFFAOYSA-N 0.000 description 2
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 2
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 2
- VBHXIMACZBQHPX-UHFFFAOYSA-N 2,2,2-trifluoroethyl prop-2-enoate Chemical compound FC(F)(F)COC(=O)C=C VBHXIMACZBQHPX-UHFFFAOYSA-N 0.000 description 2
- QRIMLDXJAPZHJE-UHFFFAOYSA-N 2,3-dihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CO QRIMLDXJAPZHJE-UHFFFAOYSA-N 0.000 description 2
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 description 2
- OLQFXOWPTQTLDP-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCO OLQFXOWPTQTLDP-UHFFFAOYSA-N 0.000 description 2
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- GHGCHYOFZGPCNY-UHFFFAOYSA-N 2-(2-methylprop-2-enoylamino)benzoic acid Chemical compound CC(=C)C(=O)NC1=CC=CC=C1C(O)=O GHGCHYOFZGPCNY-UHFFFAOYSA-N 0.000 description 2
- IHYBDNMNEPKOEB-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethyl 6-hydroxyhexanoate Chemical compound CC(=C)C(=O)OCCOC(=O)CCCCCO IHYBDNMNEPKOEB-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- RKYJPYDJNQXILT-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCCOC(=O)C=C RKYJPYDJNQXILT-UHFFFAOYSA-N 0.000 description 2
- KJOLAZDWVDOTSF-UHFFFAOYSA-N 2-(prop-2-enoylamino)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1NC(=O)C=C KJOLAZDWVDOTSF-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- COORVRSSRBIIFJ-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCOCCO COORVRSSRBIIFJ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- FIQBJLHOPOSODG-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxycarbonyl]benzoic acid Chemical compound CC(=C)C(=O)OCCOC(=O)C1=CC=CC=C1C(O)=O FIQBJLHOPOSODG-UHFFFAOYSA-N 0.000 description 2
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 2
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- IFDUTQGPGFEDHJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;oxolan-2-one Chemical compound CC(=C)C(O)=O.O=C1CCCO1 IFDUTQGPGFEDHJ-UHFFFAOYSA-N 0.000 description 2
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 description 2
- NWKKCUWIMOZYOO-UHFFFAOYSA-N 3-methoxybutyl 2-methylprop-2-enoate Chemical compound COC(C)CCOC(=O)C(C)=C NWKKCUWIMOZYOO-UHFFFAOYSA-N 0.000 description 2
- NPYMXLXNEYZTMQ-UHFFFAOYSA-N 3-methoxybutyl prop-2-enoate Chemical compound COC(C)CCOC(=O)C=C NPYMXLXNEYZTMQ-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N 3-methyl-2-pentanone Chemical compound CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 2
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- NUXLDNTZFXDNBA-UHFFFAOYSA-N 6-bromo-2-methyl-4h-1,4-benzoxazin-3-one Chemical compound C1=C(Br)C=C2NC(=O)C(C)OC2=C1 NUXLDNTZFXDNBA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004438 BET method Methods 0.000 description 2
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 2
- 102100026735 Coagulation factor VIII Human genes 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 101001095043 Homo sapiens Bone marrow proteoglycan Proteins 0.000 description 2
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 2
- 101001131990 Homo sapiens Peroxidasin homolog Proteins 0.000 description 2
- 101000582986 Homo sapiens Phospholipid phosphatase-related protein type 3 Proteins 0.000 description 2
- 101000999079 Homo sapiens Radiation-inducible immediate-early gene IEX-1 Proteins 0.000 description 2
- 101000879840 Homo sapiens Serglycin Proteins 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 102100030383 Phospholipid phosphatase-related protein type 3 Human genes 0.000 description 2
- 102100030368 Phospholipid phosphatase-related protein type 4 Human genes 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 2
- FVFZFANLRPXUIE-UHFFFAOYSA-N anthracen-1-yl 2-methylprop-2-enoate Chemical compound C1=CC=C2C=C3C(OC(=O)C(=C)C)=CC=CC3=CC2=C1 FVFZFANLRPXUIE-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 2
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 125000000332 coumarinyl group Chemical group O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 2
- 235000018417 cysteine Nutrition 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- MMVJBWFKSYKXIA-UHFFFAOYSA-N ethoxyethane;2-methylprop-2-enoic acid Chemical compound CCOCC.CC(=C)C(O)=O MMVJBWFKSYKXIA-UHFFFAOYSA-N 0.000 description 2
- LVMRFLWAXIZLNG-UHFFFAOYSA-N ethoxyethane;prop-2-enoic acid Chemical compound CCOCC.OC(=O)C=C LVMRFLWAXIZLNG-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229940119545 isobornyl methacrylate Drugs 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 2
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 2
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 2
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 2
- HVYCQBKSRWZZGX-UHFFFAOYSA-N naphthalen-1-yl 2-methylprop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C(=C)C)=CC=CC2=C1 HVYCQBKSRWZZGX-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 125000006551 perfluoro alkylene group Chemical group 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 2
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 2
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229950006389 thiodiglycol Drugs 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- IXSPLXSQNNZJJU-UHFFFAOYSA-N trimethyl(silyloxy)silane Chemical compound C[Si](C)(C)O[SiH3] IXSPLXSQNNZJJU-UHFFFAOYSA-N 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- QASBHTCRFDZQAM-UHFFFAOYSA-N (2-isocyanato-2-methyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(C)(COC(=O)C=C)N=C=O QASBHTCRFDZQAM-UHFFFAOYSA-N 0.000 description 1
- FDYDISGSYGFRJM-UHFFFAOYSA-N (2-methyl-2-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC1C(OC(=O)C(=C)C)(C)C2C3 FDYDISGSYGFRJM-UHFFFAOYSA-N 0.000 description 1
- YRPLSAWATHBYFB-UHFFFAOYSA-N (2-methyl-2-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1C(C)(OC(=O)C=C)C2C3 YRPLSAWATHBYFB-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DCXZWVLJCYXHDV-UHFFFAOYSA-N (4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-heptadecafluoro-2-hydroxyundecyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F DCXZWVLJCYXHDV-UHFFFAOYSA-N 0.000 description 1
- DAEIFBGPFDVHNR-UHFFFAOYSA-N (4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-heptadecafluoro-2-hydroxyundecyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F DAEIFBGPFDVHNR-UHFFFAOYSA-N 0.000 description 1
- GEEMGMOJBUUPBY-UHFFFAOYSA-N (4,4,5,5,6,6,7,7,8,8,9,9,9-tridecafluoro-2-hydroxynonyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F GEEMGMOJBUUPBY-UHFFFAOYSA-N 0.000 description 1
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 1
- NIUHGYUFFPSEOW-UHFFFAOYSA-N (4-hydroxyphenyl) prop-2-enoate Chemical compound OC1=CC=C(OC(=O)C=C)C=C1 NIUHGYUFFPSEOW-UHFFFAOYSA-N 0.000 description 1
- YBBLOADPFWKNGS-UHFFFAOYSA-N 1,1-dimethylurea Chemical compound CN(C)C(N)=O YBBLOADPFWKNGS-UHFFFAOYSA-N 0.000 description 1
- UDATXMIGEVPXTR-UHFFFAOYSA-N 1,2,4-triazolidine-3,5-dione Chemical compound O=C1NNC(=O)N1 UDATXMIGEVPXTR-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MASDFXZJIDNRTR-UHFFFAOYSA-N 1,3-bis(trimethylsilyl)urea Chemical compound C[Si](C)(C)NC(=O)N[Si](C)(C)C MASDFXZJIDNRTR-UHFFFAOYSA-N 0.000 description 1
- OXFSTTJBVAAALW-UHFFFAOYSA-N 1,3-dihydroimidazole-2-thione Chemical compound SC1=NC=CN1 OXFSTTJBVAAALW-UHFFFAOYSA-N 0.000 description 1
- 229940057054 1,3-dimethylurea Drugs 0.000 description 1
- IUPUTCOATBREJA-UHFFFAOYSA-N 1-[3,5-bis(2-methylprop-2-enoyl)-1,3,5-triazinan-1-yl]-2-methylprop-2-en-1-one Chemical compound CC(=C)C(=O)N1CN(C(=O)C(C)=C)CN(C(=O)C(C)=C)C1 IUPUTCOATBREJA-UHFFFAOYSA-N 0.000 description 1
- FYBFGAFWCBMEDG-UHFFFAOYSA-N 1-[3,5-di(prop-2-enoyl)-1,3,5-triazinan-1-yl]prop-2-en-1-one Chemical compound C=CC(=O)N1CN(C(=O)C=C)CN(C(=O)C=C)C1 FYBFGAFWCBMEDG-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- HHVCCCZZVQMAMT-UHFFFAOYSA-N 1-hydroxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(O)C(=O)C=C1C1=CC=CC=C1 HHVCCCZZVQMAMT-UHFFFAOYSA-N 0.000 description 1
- YWOYCXNNAGNDKT-UHFFFAOYSA-N 1-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OC(C)OC(=O)C=C YWOYCXNNAGNDKT-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical compound C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 description 1
- VTHCSXMNKNHJHY-UHFFFAOYSA-N 1h-imidazol-2-yl(trimethyl)silane Chemical class C[Si](C)(C)C1=NC=CN1 VTHCSXMNKNHJHY-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- CLISWDZSTWQFNX-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)C(F)(F)F CLISWDZSTWQFNX-UHFFFAOYSA-N 0.000 description 1
- JDVGNKIUXZQTFD-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)COC(=O)C=C JDVGNKIUXZQTFD-UHFFFAOYSA-N 0.000 description 1
- AENZGWONVTXLRC-UHFFFAOYSA-N 2-(2,5-dioxopyrrol-1-yl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1N1C(=O)C=CC1=O AENZGWONVTXLRC-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- RFCQDOVPMUSZMN-UHFFFAOYSA-N 2-Naphthalenethiol Chemical compound C1=CC=CC2=CC(S)=CC=C21 RFCQDOVPMUSZMN-UHFFFAOYSA-N 0.000 description 1
- NKMOLEYVYVWWJC-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis[2-(3-sulfanylbutanoyloxy)ethyl]-1,3,5-triazinan-1-yl]ethyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCN1C(=O)N(CCOC(=O)CC(C)S)C(=O)N(CCOC(=O)CC(C)S)C1=O NKMOLEYVYVWWJC-UHFFFAOYSA-N 0.000 description 1
- JQCWCBBBJXQKDE-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(O)COCCOCCO JQCWCBBBJXQKDE-UHFFFAOYSA-N 0.000 description 1
- MZGMQAMKOBOIDR-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCO MZGMQAMKOBOIDR-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 1
- NREFJJBCYMZUEK-UHFFFAOYSA-N 2-[2-[4-[2-[4-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]phenyl]propan-2-yl]phenoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound C1=CC(OCCOCCOC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCCOCCOC(=O)C(C)=C)C=C1 NREFJJBCYMZUEK-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- QLIBJPGWWSHWBF-UHFFFAOYSA-N 2-aminoethyl methacrylate Chemical compound CC(=C)C(=O)OCCN QLIBJPGWWSHWBF-UHFFFAOYSA-N 0.000 description 1
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SUODCTNNAKSRHB-UHFFFAOYSA-N 2-ethylhexyl 3-sulfanylpropanoate Chemical compound CCCCC(CC)COC(=O)CCS SUODCTNNAKSRHB-UHFFFAOYSA-N 0.000 description 1
- BONVROUPOZRCDU-UHFFFAOYSA-N 2-hydroxyprop-2-enamide Chemical compound NC(=O)C(O)=C BONVROUPOZRCDU-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- YXYJVFYWCLAXHO-UHFFFAOYSA-N 2-methoxyethyl 2-methylprop-2-enoate Chemical compound COCCOC(=O)C(C)=C YXYJVFYWCLAXHO-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- AAYSXEMBWUMDIZ-UHFFFAOYSA-N 2-methyl-n,n-dipropylprop-2-enamide Chemical compound CCCN(CCC)C(=O)C(C)=C AAYSXEMBWUMDIZ-UHFFFAOYSA-N 0.000 description 1
- TWYISXLZCIVDDW-UHFFFAOYSA-N 2-methyl-n-(2-methylpropoxymethyl)prop-2-enamide Chemical compound CC(C)COCNC(=O)C(C)=C TWYISXLZCIVDDW-UHFFFAOYSA-N 0.000 description 1
- YQIGLEFUZMIVHU-UHFFFAOYSA-N 2-methyl-n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C(C)=C YQIGLEFUZMIVHU-UHFFFAOYSA-N 0.000 description 1
- JMADMUIDBVATJT-UHFFFAOYSA-N 2-methylprop-2-enamide;propan-2-one Chemical compound CC(C)=O.CC(C)=O.CC(=C)C(N)=O JMADMUIDBVATJT-UHFFFAOYSA-N 0.000 description 1
- RKOOOVKGLHCLTP-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.OCC(O)CO RKOOOVKGLHCLTP-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- TYNRPOFACABVSI-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,6-nonafluorohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)F TYNRPOFACABVSI-UHFFFAOYSA-N 0.000 description 1
- GYUPEJSTJSFVRR-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,6-nonafluorohexyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C GYUPEJSTJSFVRR-UHFFFAOYSA-N 0.000 description 1
- CDXFIRXEAJABAZ-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CDXFIRXEAJABAZ-UHFFFAOYSA-N 0.000 description 1
- VPKQPPJQTZJZDB-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C VPKQPPJQTZJZDB-UHFFFAOYSA-N 0.000 description 1
- HBZFBSFGXQBQTB-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F HBZFBSFGXQBQTB-UHFFFAOYSA-N 0.000 description 1
- QUKRIOLKOHUUBM-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C QUKRIOLKOHUUBM-UHFFFAOYSA-N 0.000 description 1
- FQHLOOOXLDQLPF-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-henicosafluorododecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F FQHLOOOXLDQLPF-UHFFFAOYSA-N 0.000 description 1
- FIAHOPQKBBASOY-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-henicosafluorododecyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C FIAHOPQKBBASOY-UHFFFAOYSA-N 0.000 description 1
- SNCMCDMEYCLVBO-UHFFFAOYSA-N 3-aminopropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCN SNCMCDMEYCLVBO-UHFFFAOYSA-N 0.000 description 1
- OTKLRHWBZHQJOP-UHFFFAOYSA-N 3-aminopropyl prop-2-enoate Chemical compound NCCCOC(=O)C=C OTKLRHWBZHQJOP-UHFFFAOYSA-N 0.000 description 1
- UXBMPEBBRQPJDL-UHFFFAOYSA-N 3-hydroxy-2-methylprop-2-enamide Chemical compound OC=C(C)C(N)=O UXBMPEBBRQPJDL-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- WXTVPMWCUMEVSZ-UHFFFAOYSA-N 4-amino-3,5-diiodobenzoic acid Chemical compound NC1=C(I)C=C(C(O)=O)C=C1I WXTVPMWCUMEVSZ-UHFFFAOYSA-N 0.000 description 1
- IRQWEODKXLDORP-UHFFFAOYSA-N 4-ethenylbenzoic acid Chemical compound OC(=O)C1=CC=C(C=C)C=C1 IRQWEODKXLDORP-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- DITPLXUFWDEMDN-UHFFFAOYSA-N 4-methoxybutyl 3-sulfanylpropanoate Chemical compound COCCCCOC(=O)CCS DITPLXUFWDEMDN-UHFFFAOYSA-N 0.000 description 1
- ZBSKZKPSSKTLNE-UHFFFAOYSA-N 4-methylpent-3-enoxysilane Chemical compound CC(=CCCO[SiH3])C ZBSKZKPSSKTLNE-UHFFFAOYSA-N 0.000 description 1
- NKYDKCVZNMNZCM-UHFFFAOYSA-N 5-chloro-3h-1,3-benzothiazole-2-thione Chemical compound ClC1=CC=C2SC(S)=NC2=C1 NKYDKCVZNMNZCM-UHFFFAOYSA-N 0.000 description 1
- VSYIJNDEXXBJFH-UHFFFAOYSA-N 5-isocyanato-2-methylpent-1-en-3-one Chemical compound CC(=C)C(=O)CCN=C=O VSYIJNDEXXBJFH-UHFFFAOYSA-N 0.000 description 1
- FOMNBFSRHKJALH-UHFFFAOYSA-N 5-isocyanatopent-1-en-3-one Chemical compound C=CC(=O)CCN=C=O FOMNBFSRHKJALH-UHFFFAOYSA-N 0.000 description 1
- XFOFBPRPOAWWPA-UHFFFAOYSA-N 6-hydroxyhexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCO XFOFBPRPOAWWPA-UHFFFAOYSA-N 0.000 description 1
- OCIFJWVZZUDMRL-UHFFFAOYSA-N 6-hydroxyhexyl prop-2-enoate Chemical compound OCCCCCCOC(=O)C=C OCIFJWVZZUDMRL-UHFFFAOYSA-N 0.000 description 1
- KECHYAFVYLLNCH-UHFFFAOYSA-N 6-methyl-3h-1,3-benzothiazole-2-thione Chemical compound CC1=CC=C2N=C(S)SC2=C1 KECHYAFVYLLNCH-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 101001074560 Arabidopsis thaliana Aquaporin PIP1-2 Proteins 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- VPIAKHNXCOTPAY-UHFFFAOYSA-N Heptane-1-thiol Chemical compound CCCCCCCS VPIAKHNXCOTPAY-UHFFFAOYSA-N 0.000 description 1
- 101000818014 Homo sapiens Ferroptosis suppressor protein 1 Proteins 0.000 description 1
- 101001123334 Homo sapiens Proteoglycan 3 Proteins 0.000 description 1
- ITATYELQCJRCCK-UHFFFAOYSA-N Mandelic Acid, Methyl Ester Chemical compound COC(=O)C(O)C1=CC=CC=C1 ITATYELQCJRCCK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- 102100030288 Phospholipid phosphatase-related protein type 1 Human genes 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- VTQPKTHPDMWXHX-XBQJKBNESA-N [(E)-[4-[[4-[4-(N-phenylanilino)benzoyl]phenyl]methoxy]phenyl]methylideneamino] acetate Chemical compound C(C)(=O)O\N=C\C1=CC=C(C=C1)OCC1=CC=C(C=C1)C(C1=CC=C(C=C1)N(C1=CC=CC=C1)C1=CC=CC=C1)=O VTQPKTHPDMWXHX-XBQJKBNESA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- GQPVFBDWIUVLHG-UHFFFAOYSA-N [2,2-bis(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(CO)COC(=O)C(C)=C GQPVFBDWIUVLHG-UHFFFAOYSA-N 0.000 description 1
- CQHKDHVZYZUZMJ-UHFFFAOYSA-N [2,2-bis(hydroxymethyl)-3-prop-2-enoyloxypropyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CO)COC(=O)C=C CQHKDHVZYZUZMJ-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- YPCHGLDQZXOZFW-UHFFFAOYSA-N [2-[[4-methyl-3-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]carbonylamino]phenyl]carbamoyloxymethyl]-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CC1=CC=C(NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)C=C1NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C YPCHGLDQZXOZFW-UHFFFAOYSA-N 0.000 description 1
- WJALNINFXDCABS-UHFFFAOYSA-N [2-hydroxy-1-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C(O)C)OC(=O)C(C)=C WJALNINFXDCABS-UHFFFAOYSA-N 0.000 description 1
- RUKGJUIRYVYSBX-UHFFFAOYSA-N [3,3,4,4,5,5,6,6,7,7,8,8,9,10,10,10-hexadecafluoro-2-hydroxy-2-methyl-9-(trifluoromethyl)decyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F RUKGJUIRYVYSBX-UHFFFAOYSA-N 0.000 description 1
- KTPONRIHDUNNPD-UHFFFAOYSA-N [3,3,4,4,5,5,6,6,7,7,8,8,9,10,10,10-hexadecafluoro-9-(trifluoromethyl)decyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F KTPONRIHDUNNPD-UHFFFAOYSA-N 0.000 description 1
- QGIJZPXLSMRDCW-UHFFFAOYSA-N [3,3,4,4,5,5,6,6,7,7,8,8,9,10,10,10-hexadecafluoro-9-(trifluoromethyl)decyl] prop-2-enoate Chemical compound FC(F)(F)C(F)(C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C QGIJZPXLSMRDCW-UHFFFAOYSA-N 0.000 description 1
- HWPMGAQOODLZSC-UHFFFAOYSA-N [3,3,4,4,5,5,6,6,7,8,8,8-dodecafluoro-2-hydroxy-2-methyl-7-(trifluoromethyl)octyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F HWPMGAQOODLZSC-UHFFFAOYSA-N 0.000 description 1
- PICWOBWIOWOPOB-UHFFFAOYSA-N [3,3,4,4,5,5,6,6,7,8,8,8-dodecafluoro-2-hydroxy-2-methyl-7-(trifluoromethyl)octyl] prop-2-enoate Chemical compound C=CC(=O)OCC(O)(C)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F PICWOBWIOWOPOB-UHFFFAOYSA-N 0.000 description 1
- SAIYGCOTLRCBJP-UHFFFAOYSA-N [3,3,4,4,5,5,6,6,7,8,8,8-dodecafluoro-7-(trifluoromethyl)octyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F SAIYGCOTLRCBJP-UHFFFAOYSA-N 0.000 description 1
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 1
- LZKRGSPBGVICLV-UHFFFAOYSA-N [4,4,5,5,6,7,7,7-octafluoro-2-hydroxy-6-(trifluoromethyl)heptyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F LZKRGSPBGVICLV-UHFFFAOYSA-N 0.000 description 1
- UMWCHHTXFDYJDZ-UHFFFAOYSA-N [4,4,5,5,6,7,7,7-octafluoro-2-hydroxy-6-(trifluoromethyl)heptyl] prop-2-enoate Chemical compound C=CC(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F UMWCHHTXFDYJDZ-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- RSUCJIJELNXPQI-UHFFFAOYSA-N [4-[[4-(2-methylprop-2-enoyloxy)phenyl]methyl]phenyl] 2-methylprop-2-enoate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1CC1=CC=C(OC(=O)C(C)=C)C=C1 RSUCJIJELNXPQI-UHFFFAOYSA-N 0.000 description 1
- XZVDVVOMMJXZRA-UHFFFAOYSA-N [[1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]-3-oxobutylidene]amino] acetate Chemical compound CCN1C2=C(C=C(C=C2)C(=NOC(=O)C)CC(=O)C)C3=C1C=CC(=C3)C(=O)C4=CC=CC=C4C XZVDVVOMMJXZRA-UHFFFAOYSA-N 0.000 description 1
- LOCXTTRLSIDGPS-UHFFFAOYSA-N [[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(CCCCCC)=NOC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-UHFFFAOYSA-N 0.000 description 1
- UUJOMSFWBUBBBP-UHFFFAOYSA-N [[3-oxo-1-(9-propylcarbazol-3-yl)butylidene]amino] acetate Chemical compound C(C)(=O)ON=C(CC(C)=O)C=1C=CC=2N(C3=CC=CC=C3C=2C=1)CCC UUJOMSFWBUBBBP-UHFFFAOYSA-N 0.000 description 1
- NNVDGGDSRRQJMV-UHFFFAOYSA-L [dioctyl(2,2,5,5-tetramethylhexanoyloxy)stannyl] 2,2,5,5-tetramethylhexanoate Chemical compound CCCCCCCC[Sn](OC(=O)C(C)(C)CCC(C)(C)C)(OC(=O)C(C)(C)CCC(C)(C)C)CCCCCCCC NNVDGGDSRRQJMV-UHFFFAOYSA-L 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- FTWHFXMUJQRNBK-UHFFFAOYSA-N alpha-Methylen-gamma-aminobuttersaeure Natural products NCCC(=C)C(O)=O FTWHFXMUJQRNBK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- XRLSGYQIHTVOMC-UHFFFAOYSA-N aminomethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCN XRLSGYQIHTVOMC-UHFFFAOYSA-N 0.000 description 1
- QHOTVLWYQNKORC-UHFFFAOYSA-N aminomethyl prop-2-enoate Chemical compound NCOC(=O)C=C QHOTVLWYQNKORC-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ITKVLPYNJQOCPW-UHFFFAOYSA-N chloro-(chloromethyl)-dimethylsilane Chemical compound C[Si](C)(Cl)CCl ITKVLPYNJQOCPW-UHFFFAOYSA-N 0.000 description 1
- XSDCTSITJJJDPY-UHFFFAOYSA-N chloro-ethenyl-dimethylsilane Chemical compound C[Si](C)(Cl)C=C XSDCTSITJJJDPY-UHFFFAOYSA-N 0.000 description 1
- OJZNZOXALZKPEA-UHFFFAOYSA-N chloro-methyl-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](Cl)(C)C1=CC=CC=C1 OJZNZOXALZKPEA-UHFFFAOYSA-N 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- VTXVGVNLYGSIAR-UHFFFAOYSA-N decane-1-thiol Chemical compound CCCCCCCCCCS VTXVGVNLYGSIAR-UHFFFAOYSA-N 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical compound OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- FHQRQPAFALORSL-UHFFFAOYSA-N dimethylsilyl(trimethyl)silane Chemical class C[SiH](C)[Si](C)(C)C FHQRQPAFALORSL-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 239000012156 elution solvent Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- NHOGGUYTANYCGQ-UHFFFAOYSA-N ethenoxybenzene Chemical compound C=COC1=CC=CC=C1 NHOGGUYTANYCGQ-UHFFFAOYSA-N 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- LDTLDBDUBGAEDT-UHFFFAOYSA-N methyl 3-sulfanylpropanoate Chemical compound COC(=O)CCS LDTLDBDUBGAEDT-UHFFFAOYSA-N 0.000 description 1
- SNZRPPBWRSEVIU-UHFFFAOYSA-N methyl 4-chloropyridine-3-carboxylate Chemical compound COC(=O)C1=CN=CC=C1Cl SNZRPPBWRSEVIU-UHFFFAOYSA-N 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- ICWPRFNZEBFLPT-UHFFFAOYSA-N n-(2-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=CC=C1O ICWPRFNZEBFLPT-UHFFFAOYSA-N 0.000 description 1
- KIQBVKPQYARZTK-UHFFFAOYSA-N n-(2-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=CC=C1NC(=O)C=C KIQBVKPQYARZTK-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- KCTMTGOHHMRJHZ-UHFFFAOYSA-N n-(2-methylpropoxymethyl)prop-2-enamide Chemical compound CC(C)COCNC(=O)C=C KCTMTGOHHMRJHZ-UHFFFAOYSA-N 0.000 description 1
- POVITWJTUUJBNK-UHFFFAOYSA-N n-(4-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=C(NC(=O)C=C)C=C1 POVITWJTUUJBNK-UHFFFAOYSA-N 0.000 description 1
- YOZHLACIXDCHPV-UHFFFAOYSA-N n-(methoxymethyl)-2-methylprop-2-enamide Chemical compound COCNC(=O)C(C)=C YOZHLACIXDCHPV-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- VQGWOOIHSXNRPW-UHFFFAOYSA-N n-butyl-2-methylprop-2-enamide Chemical compound CCCCNC(=O)C(C)=C VQGWOOIHSXNRPW-UHFFFAOYSA-N 0.000 description 1
- YRVUCYWJQFRCOB-UHFFFAOYSA-N n-butylprop-2-enamide Chemical compound CCCCNC(=O)C=C YRVUCYWJQFRCOB-UHFFFAOYSA-N 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 125000005185 naphthylcarbonyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- ZVEZMVFBMOOHAT-UHFFFAOYSA-N nonane-1-thiol Chemical compound CCCCCCCCCS ZVEZMVFBMOOHAT-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- UCUPUEARJPTGKU-UHFFFAOYSA-N octadecyl 3-sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCS UCUPUEARJPTGKU-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- LWNSNYBMYBWJDN-UHFFFAOYSA-N octyl 3-sulfanylpropanoate Chemical compound CCCCCCCCOC(=O)CCS LWNSNYBMYBWJDN-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229940105570 ornex Drugs 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- KOOHRIRWWIYFRH-UHFFFAOYSA-N oxolan-2-one;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1CCCO1 KOOHRIRWWIYFRH-UHFFFAOYSA-N 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000010702 perfluoropolyether Substances 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical compound SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- MYGFXCLXHGITIQ-UHFFFAOYSA-N quinolin-4-ylhydrazine Chemical compound C1=CC=C2C(NN)=CC=NC2=C1 MYGFXCLXHGITIQ-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 description 1
- 229950000329 thiouracil Drugs 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- CCIDWXHLGNEQSL-UHFFFAOYSA-N undecane-1-thiol Chemical compound CCCCCCCCCCCS CCIDWXHLGNEQSL-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Definitions
- the present invention relates to a photosensitive resin composition. More specifically, the present invention relates to a resin composition suitable as a material for a self-luminous display such as a quantum dot-organic electroluminescence (QD-OLED) display and a micro LED display.
- QD-OLED quantum dot-organic electroluminescence
- Self-luminous displays such as QD-OLED displays and micro LED displays are based on next-generation display technology that implements a wavelength conversion layer for red and green by an inkjet printing method based on a blue self-luminous device.
- the technology is evaluated as a technology that has high color reproduction ability and can express richer colors.
- the adoption of a colored partition wall (colored liquid repellent bank) having a light-shielding property is being considered for the partition wall constituting the subpixel of the wavelength conversion layer of the display panel. ..
- the conventional colored photosensitive resin composition since the transmittance of the incident light in the exposure process for forming the partition wall is low, it cannot be sufficiently cured to the deep part of the film, resulting in poor pattern formation.
- the curing of the film was prioritized, it was difficult to secure the necessary light-shielding property due to insufficient addition of the colorant.
- the present invention has been made in view of the above circumstances, has good curability in the exposure process even in a colored state, can form a pattern, and has a light-shielding property of visible light after curing. It is an object of the present invention to provide a resin composition which gives a highly cured film.
- the present inventors have determined a specific absorption coefficient as a photoinitiator (in the present invention, it means a gram absorption coefficient; the same applies hereinafter).
- the resin composition in which the photoinitiator and the specific black pigment are used in combination can form a pattern, has a relatively high ultraviolet transmittance in the exposure process, and can be sufficiently cured to the deep part of the film.
- a cured film having a high light-shielding property of visible light can be formed by curing the composition, and completed the present invention.
- the present invention provides the following resin compositions.
- 1. (A) Alkali-soluble copolymer, (B) A compound having two or more polymerizable groups of at least one selected from the group consisting of an acrylate group, a methacrylate group, a vinyl group and an allyl group.
- the resin composition according to any one of 1 to 4 wherein the content of the component (C-1) is 0.3 to 5 parts by mass with respect to 100 parts by mass of the component (A).
- a cured film obtained from any of the resin compositions 1 to 7. 9. A partition wall for a self-luminous display formed by any of the resin compositions 1 to 7. 10. A wavelength conversion layer of a self-luminous display having 9 partition walls. 11. An organic electroluminescence device including 10 wavelength conversion layers. 12. A micro LED element having 10 wavelength conversion layers.
- the resin composition according to the present invention has a relatively high transmittance of ultraviolet rays in the exposure process, can be sufficiently cured to a deep part of the film, and can be cured with a high light-shielding property of visible light by curing the composition. It can form a film.
- the obtained cured film can be suitably used as a material for self-luminous displays such as QD-OLED displays and micro LED displays, and in particular, patterns are formed to form subpixels of the wavelength conversion layer of the self-luminous display panel. By using it as a partition (colored partition), it can contribute to further improvement of the image quality.
- the resin composition of the present invention (A) Alkali-soluble copolymer, (B) A compound having two or more polymerizable groups of at least one selected from the group consisting of an acrylate group, a methacrylate group, a vinyl group and an allyl group. (C) Photoinitiator: (C-1) A photoinitiator having an oxime ester group and having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more.
- the light transmittance at a wavelength of 365 nm is T 1 and the light transmittance at a wavelength of 550 nm is T.
- a black pigment having a T 1 / T 2 value of 0.3 or more It is a resin composition containing (E) a liquid-repellent component and (F) a solvent.
- the alkali-soluble copolymer (A) may be described as a copolymer obtained by copolymerizing a monomer having an alkali-soluble group and a monomer mixture containing other monomers (hereinafter, "copolymer of component (A)"). There is).
- the copolymer of the component (A) may contain a structure having an alkali-soluble group in its repeating unit, and the type of main chain skeleton and side chain of the polymer constituting the copolymer is particularly limited. Not done.
- the number average molecular weight Mn of the copolymer of the component (A) is preferably 2,000 to 50,000, more preferably 5,000 to 20, in consideration of the developability (solubility in an alkaline solution) of the unexposed portion. It is 000.
- the number average molecular weight Mn and the weight average molecular weight Mw described later are both polystyrene-equivalent values by gel permeation chromatography (GPC).
- alkali-soluble group contained in the monomer having an alkali-soluble group examples include a carboxy group, a phenolic hydroxy group, an acid anhydride group and a maleimide group.
- Examples of the monomer having a carboxy group include acrylic acid, methacrylic acid, crotonic acid, mono- (2- (acryloyloxy) ethyl) phthalate, mono- (2- (methacryloyloxy) ethyl) phthalate, and N- (carboxyphenyl).
- Examples of the monomer having a phenolic hydroxy group include hydroxystyrene, N- (hydroxyphenyl) acrylamide, N- (hydroxyphenyl) methacrylamide and N- (hydroxyphenyl) maleimide.
- Examples of the monomer having an acid anhydride group include maleic anhydride and itaconic anhydride.
- Examples of the monomer having a maleimide group include maleimide and the above-mentioned N- (carboxyphenyl) maleimide and N- (hydroxyphenyl) maleimide.
- a copolymer of a monomer mixture containing at least one selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride and maleimide is preferable.
- the above-mentioned copolymer when the above-mentioned copolymer is obtained, another monomer copolymerizable with the above-mentioned monomer having an alkali-soluble group is used in combination.
- examples of other monomers include acrylic acid ester compounds, methacrylic acid ester compounds, N-substituted maleimide compounds, acrylonitrile compounds, acrylamide compounds, methacrylic amide compounds, styrene compounds and vinyl compounds.
- acrylic acid ester compound examples include methyl acrylate, ethyl acrylate, isopropyl acrylate, benzyl acrylate, naphthyl acrylate, anthryl acrylate, anthryl methyl acrylate, phenyl acrylate, phenoxyethyl acrylate, and 2,2,2-trifluoroethyl acrylate.
- methacrylic acid ester compound examples include methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, benzyl methacrylate, naphthyl methacrylate, anthryl methacrylate, anthryl methyl methacrylate, phenyl methacrylate, phenoxyethyl methacrylate, and 2,2,2-trifluoroethyl methacrylate.
- vinyl compounds include methyl vinyl ether, benzyl vinyl ether, vinylnaphthalene, vinyl anthracene, vinyl biphenyl, vinyl carbazole, 2-hydroxyethyl vinyl ether, phenyl vinyl ether and propyl vinyl ether.
- styrene compound examples include styrene, methylstyrene, chlorostyrene and bromostyrene.
- N-substituted maleimide compound examples include N-methylmaleimide, N-phenylmaleimide and N-cyclohexylmaleimide.
- acrylonitrile compound examples include acrylonitrile.
- Examples of the acrylamide compound include hydroxyacrylamide, N-methylacrylamide, N-ethylacrylamide, N-isopropylacrylamide, N-butylacrylamide, diacetoneacrylamide, N, N-dimethylacrylamide, N, N-diethylacrylamide, N, Examples thereof include N-dipropylacrylamide, acrylic loylmorpholine, Nn-butoxymethylacrylamide, N-isobutoxymethylacrylamide and N-methoxymethylacrylamide.
- methacrylamide compounds include hydroxymethacrylamide, N-methylmethacrylamide, N-ethylmethacrylamide, N-isopropylmethacrylamide, N-butylmethacrylamide, diacetonemethacrylamide, N, N-dimethylmethacrylamide, and N. , N-diethylmethacrylamide, N, N-dipropylmethacrylamide, 4-methacrylloylmorpholine, Nn-butoxymethylmethacrylamide, N-isobutoxymethylmethacrylamide and N-methoxymethylmethacrylamide.
- an acrylic acid ester compound a methacrylic acid ester compound, an N-substituted maleimide compound, an acrylonitrile compound, an acrylamide compound, a methacrylic acid compound, a styrene compound and a vinyl compound.
- a combination of a monomer having a carboxy group and a methacrylic acid ester compound is more preferable, and a combination of methacrylic acid and methyl methacrylate is further preferable.
- the method for obtaining the copolymer of the component (A) is not particularly limited, but for example, the above-mentioned monomer having an alkali-soluble group and a monomer mixture containing other monomers are polymerized in a solvent at 50 to 110 ° C. Obtained by the method.
- the solvent can be used without particular limitation as long as it dissolves a monomer having an alkali-soluble group, other monomers, and a copolymer of the component (A). Specific examples include the solvent exemplified in the component (F) described later. Further, at the time of polymerization, it is preferable to use a known polymerization initiator such as azobisisobutyronitrile.
- the solution of the copolymer of the component (A) obtained as described above is poured into diethyl ether, water or the like under stirring to reprecipitate, the produced precipitate is filtered off, washed, and then at normal pressure.
- the above copolymer powder can be obtained by drying at room temperature or heating under reduced pressure. By such an operation, the polymerization initiator and the unreacted monomer coexisting with the copolymer can be removed, and as a result, the purified copolymer powder can be obtained. If the powder cannot be sufficiently purified by one operation, the obtained powder may be redissolved in a solvent and the above operation may be repeated.
- the polymerization solution of the above-mentioned (A) alkali-soluble copolymer may be used as it is, or a solution obtained by redissolving the isolated polymer powder in an appropriate solvent may be used.
- the solvent include the solvents exemplified in the component (F) described later.
- the mass ratio of the alkali-soluble monomer and the other monomer is preferably 5/95 to 50/50, more preferably 10/90 to 30/70.
- the component (B) is a compound having two or more polymerizable groups of at least one selected from the group consisting of an acrylate group, a methacrylate group, a vinyl group and an allyl group.
- the "compound having two or more polymerizable groups” means a compound having two or more polymerizable groups in one molecule and having those polymerizable groups at the molecular ends.
- the component (B) is preferably a compound having an Mw of 1,000 or less from the viewpoint of having good compatibility with each component and not affecting the developability.
- component (B) examples include dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, and pentaerythritol triacrylate.
- Each of the above compounds can also be obtained as a commercial product, and such commercial products include, for example, KAYARAD (registered trademark) T-1420, DPHA, DPHA-2C, D-310, and D-. 330, DPCA-20, DPCA-30, DPCA-60, DPCA-120, DN-0075, DN-2475, R-526, NPGDA, PEG400DA, MANDA, R-167 , HX-220, HX620, R-551, R-712, R-604, R-684, GPO-303, TMPTA, THE-330, TPA-320, TPA- 330, PET-30, RP-1040 (all manufactured by Nippon Kayaku Co., Ltd.); Aronix (registered trademark) M-210, M-208, M-221B, M-215, M- 220, M-225, M-270, M-240, M-6100, M-6250, M-6500, M-6200, M-309, M-310, M- 321 and
- the content of the component (B) is preferably 10 to 150 parts by mass, more preferably 20 to 120 parts by mass, and even more preferably 30 to 110 parts by mass with respect to 100 parts by mass of the component (A).
- the content of the component (B) is preferably 10 to 150 parts by mass, more preferably 20 to 120 parts by mass, and even more preferably 30 to 110 parts by mass with respect to 100 parts by mass of the component (A).
- the component (C) is a photoinitiator, and in the present invention, the following photoinitiator (C-1) having a specific extinction coefficient is used.
- the component (C-1) is a photoinitiator having an oxime ester group and having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more.
- Specific examples thereof include compounds having an oxime ester group and a light absorption site and having an extinction coefficient in methanol or acetonitrile at 365 nm of 5,000 ml / g ⁇ cm or more.
- Examples of the oxime ester group include a group represented by the following formula (1).
- R 1 represents a phenyl group, an alkyl group or a benzyl group having 1 to 10 carbon atoms
- R 2 represents a hydrogen atom, an alkyl group or a phenyl group having 1 to 10 carbon atoms
- a broken line represents a bond. Represents.
- the alkyl group having 1 to 10 carbon atoms may be linear, branched or cyclic, and may be, for example, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, a cyclopropyl group, an n-butyl group or an isobutyl group.
- Examples include groups, s-butyl groups, t-butyl groups, n-pentyl groups, neopentyl groups, cyclopentyl groups, n-hexyl groups, cyclohexyl groups, n-octyl groups, n-decyl groups and 1-adamantyl groups.
- the light absorbing site includes, for example, a group selected from a phenyl group, a phenylthiophenyl group, an N-alkylcarbazole group, a naphthyl group, a coumarin group, an alkoxyphenyl group, a phenylalkoxyphenyl group and a phenoxyalkoxyphenyl group, and a benzoyl group.
- a group having a benzoyl structure such as a naphthylcarbonyl group is substituted. Further, the structure may be substituted with a phenyl group, a phenylthio group, a diphenylamino group or the like.
- the oxym ester group represented by the formula (1) is a phenyl group, a phenylthiophenyl group, or an N-alkylcarbazole group at the light absorption site via a single bond or a carbonyl group.
- a naphthyl group, a coumarin group, an alkoxyphenyl group, a phenylalkoxyphenyl group, and a compound bonded to a group selected from a phenoxyalkoxyphenyl group are preferable. In the present invention, among these, those having a carbazole structure are preferable.
- component (C-1) examples include 1- (4-phenylthiophenyl) -1,2-octanedione-2- (O-benzoyloxime), etanone, 1- [9-ethyl-6. -(2-Methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyloxime), (E) -4-(4 (4- (diphenylamino) benzoyl) benzyloxy) benzaldehyde-O- Acetyloxime, (E) -4- (4,8-dimethoxy-1-naphthol) benzaldehyde-O-acetyloxime, 1- (9-propyl-9H-carbazole-3-yl) butane-1,3-dione- 1- (O-acetyloxime) and 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] but
- the component (C-1) is easily available as a commercial product, and such commercial products include, for example, IRGACURE (registered trademark) OXE01, IRGACURE (registered trademark) OXE02, and IRGACURE (registered trademark) OXE03 ( Examples thereof include BASF), ADEKA PUTMER N-1919, ADEKA ARCULS NCI-831, and ADEKA ARCLUDS NCI-930 (all manufactured by ADEKA Corporation). These (C-1) components may be used alone or in combination of two or more.
- the content of the component (C-1) is preferably 0.3 to 5 parts by mass, and more preferably 0.5 to 4 parts by mass with respect to 100 parts by mass of the component (A). Good curability can be obtained by setting the content of the component (C-1) within the above range.
- a photoinitiator having an extinction coefficient of 100 ml / g ⁇ cm or less in methanol or acetonitrile at (C-2) 365 nm may be used in combination with the component (C-1). Curability and developability can be further improved by using two kinds of photoinitiators having different extinction coefficients in combination as the component (C).
- the component (C-2) for example, a component having a hydroxy group is preferable.
- component (C-2) examples include 1-hydroxy-cyclohexyl-phenyl-ketone and 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane.
- the component (C-2) is easily available as a commercial product, and such commercial products include, for example, IRGACURE (registered trademark) 2959, IRGACURE (registered trademark) 754, IRGACURE (registered trademark) 184, and the like. Examples include DAROCURE MBF and DAROCURE 1173 (above, manufactured by BASF). These (C-2) components may be used alone or in combination of two or more.
- the component (C-2) When the component (C-2) is used, its content is preferably 0.5 to 10 parts by mass, and more preferably 1 to 7 parts by mass with respect to 100 parts by mass of the component (A). Good curability can be obtained by setting the content of the component (C-2) to the lower limit of the above range or more. By setting the content of the component (C-2) to the upper limit of the above range or less, good developability is ensured in the unexposed area.
- the components (D) are (A) component, (B) component, (C-1) component, (C-2) component, (D) black pigment, (E) liquid repellent component, (F) solvent and (G). )
- a dispersion liquid containing a thiol compound and dispersed in the component (F) at a ratio of 10 parts by mass of the component (D) to 100 parts by mass of the component (A) is applied onto a glass substrate and dried.
- the component (D) preferably has a T 1 / T 2 value of 1.0 or more, and more preferably 1.5 or more, in consideration of the transparency of ultraviolet rays and the shielding property of visible light.
- the upper limit of the value of T 1 / T 2 is not particularly limited, but is generally preferably 5.0 or less, and more preferably 3.0 or less.
- component (D) examples include zirconium nitride, titanium nitride and titanium oxynitride, and as a mixture thereof, a mixed powder containing zirconium nitride and titanium nitride, a mixed powder containing zirconium nitride and titanium oxynitride, and the like.
- zirconium nitride can be preferably used.
- the purity of the above-mentioned zirconium nitride, titanium nitride and titanium oxynitride is not particularly limited as long as the effect of the present invention is not impaired, but is preferably 90% by mass or more, more preferably 95% by mass or more, still more preferably 98% by mass or more. ..
- the specific surface area of the zirconium nitride measured by the BET method is preferably 20 to 90 m 2 / g, and more preferably 30 to 60 m 2 / g. Further, the titanium nitride and titanium oxynitride preferably have a specific surface area of 10 to 90 m 2 / g as measured by the BET method. When the specific surface area is in the above range, it is difficult for the composition to settle when it is stored for a long period of time, and the obtained cured film has good shielding property for visible light.
- a black pigment As such a black pigment, a commercially available product can be used, and examples thereof include NITRBLACK UB-1 (manufactured by Mitsubishi Materials Corporation).
- examples of the mixed powder containing zirconium nitride and titanium nitride and the mixed powder containing zirconium nitride and titanium oxynitride include the mixed powder for forming a black film disclosed in Japanese Patent Application Laid-Open No. 2018-83730. ..
- the content of the component (D) is preferably 1 to 50 parts by mass, more preferably 5 to 30 parts by mass with respect to 100 parts by mass of the component (A).
- the component (D) may be mixed as a powder when preparing the composition, but in consideration of obtaining a more uniform composition, a dispersion liquid dispersed in an appropriate solvent in advance should be prepared. Is preferable. Specific examples of the solvent include the solvents described in (F) Solvent described later. Further, when preparing the dispersion liquid of the component (D), a known dispersant may be used if necessary. As the dispersant, a commercially available product can be used, and examples thereof include Solsparse 34750 (manufactured by Japan Lubrizol Co., Ltd.).
- the component (E) is (e1) a polymer having a liquid-repellent group, or a predetermined surfactant described later.
- Examples of the (e1) liquid-repellent group include at least one group selected from a fluoroalkyl group, a polyfluoroether group, a silyl ether group and a polysiloxane group.
- fluoroalkyl group a fluoroalkyl group having 3 to 10 carbon atoms is preferable, and a fluoroalkyl group having 4 to 10 carbon atoms is more preferable.
- fluoroalkyl groups include 2,2,2-trifluoroethyl group, 2,2,3,3,3-pentafluoropropyl group, 2- (perfluorobutyl) ethyl group, and 3-per.
- Examples of the polyfluoroether group include an Rf group having a polyfluoroether structure represented by the following formula (i). -(X-O) n- Y ... (i) (In formula (i), X is a divalent saturated hydrocarbon group having 1 to 10 carbon atoms which may have a fluorine atom, and represents the same group or a different group for each unit enclosed by n. , Y is a monovalent hydrogen atom having 1 to 20 carbon atoms which may have a hydrogen atom (provided that a fluorine atom is not bonded to a carbon atom adjacent to an oxygen atom adjacent to Y) or a fluorine atom. It indicates a saturated hydrocarbon group, and n represents an integer of 2 to 50. However, the total number of fluorine atoms in the formula (i) is 2 or more.)
- X is an alkylene group in which one of the hydrogen atoms of the alkylene group having 1 to 10 carbon atoms is replaced with a fluorine atom or a perfluoroalkylene group having 1 to 10 carbon atoms.
- Y is an alkyl group or an alkyl group having 1 carbon atom in which one of the hydrogen atoms of the alkyl group having 1 to 20 carbon atoms is replaced with a fluorine atom. Examples thereof include those having up to 20 perfluoroalkyl groups.
- X is a perfluoroalkylene group having 1 to 10 carbon atoms, indicating the same group or a different group for each unit enclosed by n, and Y However, those having a perfluoroalkyl group having 1 to 20 carbon atoms can be mentioned.
- n is preferably an integer of 2 to 50, more preferably an integer of 2 to 30, and even more preferably an integer of 2 to 15.
- the polymer of the component (E) is a monomer having an Rf group, a hydroxy group, a carboxy group, an amide group, an amino group, an N-alkoxymethylamide group, a blocked isocyanate group or a trialkoxysilyl.
- the compatibility of the monomer becomes good.
- the total number of carbon atoms is preferably 2 to 50, more preferably 2 to 30.
- the polymer of component (E) exhibits good liquid repellency.
- the polymer of the component (E) is a monomer having an Rf group, a monomer having a hydroxy group, a carboxy group, an amide group, an amino group, an N-alkoxymethylamide group, a blocked isocyanate group or a trialkoxysilyl group, and the like. When synthesized by copolymerization with the monomer of, the compatibility of the monomer becomes good.
- X for example, -CF 2 -, - CF 2 CF 2 -, - CF 2 CF 2 CF 2 -, - CF 2 CF (CF 3) -, - CF 2 CF 2 CF 2 CF 2 - , -CF 2 CF 2 CF (CF 3 )-, and CF 2 CF (CF 3 ) CF 2- .
- Y examples include -CF 3 , -CF 2 CF 3 , -CF 2 CHF 2 ,-(CF 2 ) 2 CF 3 ,-(CF 2 ) 3 CF 3 ,-(CF 2 ) 4 CF. 3 ,-(CF 2 ) 5 CF 3 ,-(CF 2 ) 6 CF 3 ,-(CF 2 ) 7 CF 3 ,-(CF 2 ) 8 CF 3 ,-(CF 2 ) 9 CF 3 , and (CF) 2 ) 11 CF 3 ,-(CF 2 ) 15 CF 3 can be mentioned.
- Rf group represented by the formula (i) is an Rf group represented by the formula (ii).
- p is 2 or 3
- each unit enclosed by n is the same group
- q is an integer of 1 to 20
- n is an integer of 2 to 50.
- Rf group represented by the formula (ii) include the following groups from the viewpoint of ease of synthesis. -CF 2 O (CF 2 CF 2 O) n-1 CF 3 (n is 2 to 9) -CF (CF 3 ) O (CF 2 CF (CF 3 ) O) n-1 C 6 F 13 (n is 2 to 6) -CF (CF 3 ) O (CF 2 CF (CF 3 ) O) n-1 C 3 F 7 (n is 2 to 6)
- the Rf groups in the polymer of the component (E) may all be the same or different.
- the silyl ether group means a group in which the hydroxy group of the alcohol is protected by a trialkylsilyl group, and a group represented by the following formula is preferable.
- -X 4- Si (O-Si X 1 X 2 X 3 ) 3 In the formula, X 1 , X 2 and X 3 independently represent an alkyl group having 1 to 3 carbon atoms, and X 4 represents an alkylene group having 1 to 6 carbon atoms.
- Examples of the polysiloxane group include a group having a polysiloxane structure represented by the formula (iii).
- the group having a polysiloxane structure represented by the formula (iii) is referred to as a pSi group.
- a pSi group - (SiR a R b -O) m -SiR a R b R c ⁇ (iii)
- R a and R b independently represent a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group
- R c represents a hydrogen atom or an organic group having 1 to 10 carbon atoms
- m is. Represents an integer from 1 to 200.).
- R a and R b each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group, and may be the same or different for each syroxy unit. Since the polymer of the component (E) exhibits good liquid repellency, it is preferable that R a and R b are independently hydrogen atoms, methyl groups or phenyl groups, and further, all syroxys. It is preferable that the units R a and R b are methyl groups. Further, R c may contain a nitrogen atom, an oxygen atom and the like.
- At least one group selected from the group consisting of (e2) N-alkoxymethylamide group, blocked isocyanate group and trialkoxysilyl group At least one selected from the group consisting of an N-alkoxymethylamide group, a blocked isocyanate group and a trialkoxysilyl group in addition to the group (e1) from the viewpoint of ink wettability at the opening of the subpixel. It preferably contains one group.
- N-alkoxymethylamide group examples include an N-methoxymethyl (meth) acrylamide group, an N-ethoxymethyl (meth) acrylamide group, and an N-butoxymethyl (meth) acrylamide group.
- the blocked isocyanate group is one in which the blocking group is deprotected by heating to become an isocyanate group.
- an isocyanate group Specifically, alcohol, phenol, thioalcohol, imine, ketimine, amine, lactam, pyrazole, oxime, ⁇ -diketone, etc. Examples thereof include isocyanate groups substituted with.
- trialkoxysilyl group examples include those shown below. -(CH 2 ) 2- Si (OCH 3 ) 3 -(CH 2 ) 3- Si (OCH 3 ) 3 -(CH 2 ) 2- Si (OCH 2 CH 3 ) 3 -(CH 2 ) 3- Si (OCH 2 CH 3 ) 3
- the component (E) is further composed of (e3) a hydroxy group, a carboxy group, an amide group and an amino group from the viewpoint of ink wettability at the opening of the subpixel. It is preferable to contain at least one group selected from the group.
- an acrylate group that is bonded to the polymer having the group (e1) described above via a urethane bond can also be introduced.
- the acrylate group include a (meth) acryloyl group, which can be introduced by reacting an acrylate having an isocyanate group with a polymer having a group (e1).
- the acrylate having an isocyanate group include 2- (meth) acryloyloxyethyl isocyanate and 1,1-bis ((meth) acryloyloxymethyl) ethyl isocyanate).
- Examples of the polymer of the component (E) include an acrylic polymer, a polyamic acid, a polyimide, and a polyamide, which contain the group (e1), the group (e2) if necessary, and the group (e3).
- Examples thereof include polyurea, polyurethane, phenol resin, epoxy resin, polysiloxane and polyester, and in the present invention, an acrylic polymer is preferable.
- the acrylic polymer is obtained by polymerizing a monomer containing a group (e1), preferably further copolymerizing with a monomer containing a group (e2), and more preferably a monomer further containing a group (e3). In addition, it can be obtained by copolymerizing.
- (E1) Monomer containing a liquid-repellent group
- the monomer having a fluoroalkyl group include a monomer having a fluoroalkyl group having 3 to 10 carbon atoms, and examples thereof include 2,2,2-trifluoroethyl acrylate.
- Examples of the monomer having a silyl ether group include methacrylicoxypropyltris (trimethylsiloxy) silane and acrylicoxypropyltris (trimethylsiloxy) silane.
- pSi represents a pSi group.
- the monomer having a pSi group one type may be used alone, or two or more types may be used in combination.
- Examples of various modification methods for reacting a polymer having a reaction site with a compound having a pSi group include the following methods.
- a method in which a monomer having an epoxy group is copolymerized in advance, and then a compound having a mercapto group at one end and a pSi group at the other end is reacted.
- a method in which a monomer having a carboxy group is copolymerized in advance, and then a compound having an amino group at one terminal and a pSi group at the other terminal is reacted.
- the polymerization initiator having a pSi group may contain a group having a divalent polysiloxane structure in the main chain of the molecule, or a monovalent polysiloxane structure may be contained in the terminal portion or side chain of the initiator molecule. It may contain a group having.
- Examples of the polymerization initiator containing a group having a divalent polysiloxane structure in the main chain of the molecule include a compound having a group having a divalent polysiloxane structure and an azo group alternately.
- Such polymerization initiators are easily available as commercial products, and examples thereof include VPS-1001 and VPS-0501 (all manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.).
- (E2) Monomer containing a group selected from the group consisting of an N-alkoxymethylamide group, a blocked isocyanate group and a trialkoxysilyl group
- Examples of the monomer having an N-alkoxymethylamide group include N-hydroxymethyl (meth) acrylamide. , N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, and (meth) acrylamide compounds substituted with hydroxymethyl or alkoxymethyl groups such as N-butoxymethyl (meth) acrylamide.
- Examples of the monomer having a blocked isocyanate group include 2- (0- (1'-methylpropylideneamino) carboxyamino) ethyl methacrylate and 2- (3,5-dimethylpyrazolyl) carbonylamino) ethyl methacrylate. Can be mentioned.
- Examples of the monomer having a trialkoxysilyl group include 3-trimethoxysilylpropyl acrylate, 3-triethoxysilylpropyl acrylate, 3-trimethoxysilylpropyl methacrylate, and 3-triethoxysilylpropyl methacrylate.
- (E3) Monomer containing at least one group selected from the group consisting of a hydroxy group, a carboxy group, an amide group and an amino group
- the monomer having a hydroxy group include 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate, 2 -Hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, 2,3-dihydroxypropyl acrylate, 2,3-dihydroxypropyl methacrylate, glycerin monomethacrylate, diethylene glycol monoacrylate, diethylene glycol monomethacrylate , Caprolactone 2- (acryloyloxy) ethyl ester, caprolactone 2- (methacryloyloxy) ethyl ester, poly (ethylene glycol) acrylate, poly (propylene glycol) acrylate, poly (ethylene glycol) ethyl ether acrylate, poly
- Examples of the monomer having a carboxy group include acrylic acid, methacrylic acid, crotonic acid, mono- (2- (acryloyloxy) ethyl) phthalate, mono- (2- (methacryloyloxy) ethyl) phthalate, and N- (carboxyphenyl).
- Examples of the monomer having an amide group include acrylamide, methacrylamide, N-methylacrylamide, N, N-dimethylacrylamide and N, N-diethylacrylamide. Among these, metaacrylamide is preferable in the present invention.
- Examples of the monomer having an amino group include aminomethyl acrylate, aminomethyl methacrylate, 2-aminoethyl acrylate, 2-aminoethyl methacrylate, 3-aminopropyl acrylate and 3-aminopropyl methacrylate.
- polyamic acid, polyimide examples of the polyamic acid include a polyamic acid obtained by reacting a diamine having a fluoroalkyl group with an acid dianhydride.
- examples of the polyimide include a polyimide obtained by imidizing the polyamic acid.
- polyamide examples include a polyamide obtained by polymerizing a diamine having a fluoroalkyl group and a dicarboxylic acid anhydride.
- polyurea examples include polyurea obtained by polymerizing a diamine having a fluoroalkyl group and a diisocyanate.
- polyurethane examples include polyurethane obtained by polymerizing a diol having a fluoroalkyl group or a fluoroalkoxy group and a diol having an amino group with diisocyanate.
- phenol resin examples include a novolak resin obtained by polymerizing formaldehyde with a phenol having a fluoroalkyl group or a fluoroalkoxy group.
- Epoxy resin for example, one or both of bisphenol A and bisphenol F having a fluoroalkyl group or a fluoroalkoxy group, and one or both of the diglycidyl ether of the bisphenol A and the diglycidyl ether of the bisphenol F. Epoxy resin obtained by reacting with.
- polysiloxane for example, a silane monomer mixture containing a trialkoxysilane having a fluoroalkyl group or a dialkoxysilanesilane having a fluoroalkyl group and a trialkoxysilane having an amino group or a dialkoxysilane having an amino group is polymerized.
- examples thereof include the polysiloxane obtained by the above-mentioned.
- polyester examples include a polyester obtained by reacting a dicarboxylic acid or a tetracarboxylic dianhydride with a diol having a fluoroalkyl group or a fluoroalkoxy group.
- other monomer E examples include methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, benzyl methacrylate, naphthyl methacrylate, anthryl methacrylate, anthryl methyl methacrylate, phenyl methacrylate, glycidyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate, and methoxy.
- the amount of the group (e1) introduced is preferably 5 to 60 mol%, more preferably 5 to 40 mol% with respect to all the repeating units.
- Good liquid repellency can be obtained by setting the introduction amount of the group (e1) to be equal to or higher than the lower limit of the above range.
- the amount of the group selected from the group consisting of the (e2) N-alkoxymethylamide group, the blocked isocyanate group and the trialkoxysilyl group is preferably 5 to 70 with respect to all the repeating units. It is mol%, more preferably 5 to 50 mol%.
- the introduction amount is preferable with respect to all the repeating units. Is 5 to 60 mol%, more preferably 5 to 40 mol%.
- the number average molecular weight Mn of the polymer of the component (E) is preferably 2,000 to 100,000, more preferably 3,000 to 50,000, and even more preferably 4,000 to 10,000. When the Mn of the polymer of the component (E) is not more than the upper limit of the above range, a residue is unlikely to be generated.
- the number average molecular weight Mn of the polymer of the component (E) is a polystyrene-equivalent value measured by gel permeation chromatography (GPC).
- the polymer of the component (E) may be a mixture of a plurality of types of copolymers.
- the polymer of the component (E) is (e1) a monomer having a liquid-repellent group, for example, a monomer having a fluoroalkyl group having 3 to 10 carbon atoms, a monomer having a polyfluoroether group, and (e2) N-alkoxymethyl.
- the reaction temperature at the time of polymerization can be appropriately set depending on the type of polymer to be produced and the like, but when producing an acrylic polymer, it is preferably 50 to 110 ° C.
- the solvent used in the polymerization reaction is not particularly limited as long as it dissolves the monomer used and the obtained polymer. Specific examples of the solvent include the solvents described in (F) Solvent described later.
- the above component (E) is usually obtained as a solution, but if necessary, it may be isolated or purified by the same method as described in the description of the component (A). Further, the polymerization solution of the copolymer of the component (E) may be used as it is, or a solution obtained by redissolving the isolated polymer powder in an appropriate solvent may be used. Examples of the solvent include the solvents exemplified in the component (F) described later.
- surfactant of the component (E) examples include a fluorine-based surfactant, a silicone-based surfactant, and a nonionic surfactant. These surfactants are also available as commercial products, such as Polyfox PF-136A, 151, 156A, 154N, 159, 636, 6320, 656, 6520 (manufactured by Omniova).
- the content of the component (E) is preferably 0.5 to 10 parts by mass, and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the component (A).
- the content of the component (E) is within the above range, good liquid repellency can be obtained, and it is also preferable from the economical point of view.
- Component (F) Solvent> If the solvent of the component (F) dissolves the component (A), the component (B) and the component (C), and also dissolves the component (G) described later, which is added as needed, the solvent thereof.
- the type and structure are not particularly limited.
- a solvent generally used in a photoresist material can be used, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether.
- propylene glycol monomethyl ether diethylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, ethyl lactate, and butyl lactate are preferable in consideration of coatability and safety of the composition.
- These solvents can be used alone or in combination of two or more.
- the component (G) is a thiol compound. This component is blended for the purpose of improving the curing rate of the resin composition as long as the effects of the present invention are not impaired.
- the thiol compound of the component (G) is not particularly limited, but for example, 1-hexanethiol, 1-heptanethiol, 1-octanethiol, 1-nonanthiol, 1-decanethiol, 1-undecanethiol, 1-dodecane Thiol, 1-octadecanethiol, 2-mercaptobenzothiazole, 6-methyl-2-mercaptobenzothiazole, 5-chloro-2-mercaptobenzothiazole, 2-naphthalenethiol, 2,5-dimercapto-1,3,4- Thioliazol, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, ⁇ -mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate , Methoxybutyl-3-mercaptopropionate
- pentaerythritol tetrakis (3-mercaptobutanate) and pentaerythritol tetrakis (3-mercaptobutyrate) are obtained from the viewpoint of high storage stability of the resin composition and sufficient curability.
- 1,4-bis (3-mercaptobutyryloxy) butane, and 1,3,5-tris [2- (3-sulfanylbutanoyloxy) ethyl] -1,3,5-triazinan-2,4 6-Trione is preferred.
- These thiol compounds may be used alone or in combination of two or more.
- the component (G) When the component (G) is used, its content is preferably 0.01 to 10 parts by mass, more preferably 0.03 to 5 parts by mass with respect to 100 parts by mass of the component (A). When the content of the component (G) is at least the lower limit of the above range, the curability becomes better. When the content of the component (G) is not more than the upper limit of the above range, the pattern resolution becomes better.
- the component (H) is an adhesion promoter.
- the resin composition of the present invention may be added with an adhesion accelerator for the purpose of improving the adhesion to the substrate after development.
- adhesion promoters include chlorosilanes such as trimethylchlorosilane, dimethylvinylchlorosilane, methyldiphenylchlorosilane and chloromethyldimethylchlorosilane; trimethylmethoxysilane, dimethyldiethoxysilane, methyldimethoxysilane, dimethylvinylethoxysilane, and the like.
- urea compounds such as 1,1-dimethylurea
- thiourea compounds such as 1,3-dimethylurea
- alkoxysilanes that is, silane coupling agents
- these adhesion promoters can be used alone or in combination of two or more.
- adhesion promoter is, for example, manufactured by Shin-Etsu Chemical Co., Ltd., Momentive Performance Materials Materials World Inc. Commercially available compounds such as those manufactured by Toray Dow Corning Silicone Co., Ltd. and those manufactured by Toray Dow Corning Silicone Co., Ltd. can also be used, and these commercially available products are easily available.
- the content thereof is usually 0.1 to 20 parts by mass, preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the component (A).
- Good sensitivity can be obtained by setting the content of the component (H) to the upper limit of the above range or less.
- the resin composition of the present invention can be used as a sensitizer, a chain transfer agent, a cross-linking agent, a rheology adjuster, a pigment, a dye, a storage stabilizer, and a defoamer, if necessary, as long as the effects of the present invention are not impaired. It can contain an agent, or a dissolution accelerator such as a polyhydric phenol or a polyvalent carboxylic acid.
- the resin composition of the present invention has an alkali-soluble polymer of the component (A), a compound having two or more polymerizable groups of the component (B), and an oxime ester group of the component (C-1), and methanol at 365 nm.
- a photoinitiator having an absorption coefficient of 5,000 ml / g ⁇ cm or more in medium or acetonitrile, a black pigment of the component (D), and a liquid repellent component of the component (E) are dissolved or dispersed in the solvent of the component (F). If necessary, it further contains one or more of the photoinitiator of the component (C-2), the thiol compound of the component (G), the adhesion promoter of the component (H), and other additives. It is a composition that can be produced.
- Preferred embodiments of the resin composition of the present invention include, but are not limited to, those shown below.
- the solid content concentration in the resin composition of the present invention is not particularly limited as long as each component is uniformly dissolved or dispersed in the solvent, but is preferably 1 to 80% by mass, more preferably 5. It is ⁇ 70% by mass, more preferably 10-60% by mass.
- the solid content is the total amount of components other than the solvent constituting the resin composition.
- the method for preparing the resin composition of the present invention is not particularly limited, but as the method for preparing the resin composition, for example, the copolymer of the component (A) is dissolved in the solvent of the component (F), and the component (B) is dissolved in this solution.
- a method of further adding a photoinitiator of the component (C-2), a thiol compound of the component (G), an adhesion accelerator of the component (H) and other additives may be used. Can be mentioned.
- the polymerization solution of the copolymer of the component (A) obtained by the polymerization reaction of the component (F) in the solvent can be used as it is.
- the component (B), the component (C-1), the component (D) and the like are added to the polymerization solution of the component (A) and mixed in the same manner as described above, the component (F) is further adjusted for the purpose of adjusting the concentration.
- the solvent of the component may be additionally added.
- the solvent of the component (F) used in the process of forming the copolymer of the component (A) and the solvent of the component (F) used for adjusting the concentration at the time of preparing the resin composition are the same. It may or may not be different.
- the resin composition obtained above can be used as it is for pattern formation, but it is preferable to use a resin composition filtered using a filter or the like having a pore size of about 1.0 ⁇ m.
- the composition is coated with a suitable substrate (for example, silicon / silicon dioxide coated substrate, silicon nitride substrate, metal such as aluminum, molybdenum, chromium, etc., glass substrate, quartz).
- a suitable substrate for example, silicon / silicon dioxide coated substrate, silicon nitride substrate, metal such as aluminum, molybdenum, chromium, etc., glass substrate, quartz.
- a substrate such as a substrate, ITO substrate, etc.
- a film for example, a triacetyl cellulose film, a cycloolefin polymer film, a cycloolefin copolymer film, a polyethylene terephthalate film, a polyester film, an acrylic film, a resin film such as polyimide).
- a coating film can be formed by applying by a method such as a coat, a flow coat, a roll coat, a slit coat, a spin coat following the slit coat, an inkjet method, and then pre-drying with a hot plate or an oven. .. Then, by heat-treating (prebaking) this coating film, a negative-type photosensitive resin film having photosensitivity is formed.
- the pre-drying is not particularly limited as long as it can remove the solvent contained in the composition and does not adversely affect the coating film, and is not particularly limited, and is naturally dried or heated using a hot plate or an oven. Drying or the like can be adopted. Further, the pre-drying may be performed integrally with the pre-baking.
- Prebaking conditions are generally preferably 60-150 ° C, more preferably 80-120 ° C, heating for 0.5-30 minutes when using a hot plate and 0.5-90 minutes when using an oven. The method of doing is adopted.
- the film thickness of the negative photosensitive resin film formed from the above resin composition is preferably 0.1 to 50 ⁇ m, more preferably 0.5 to 40 ⁇ m, still more preferably 1 to 30 ⁇ m, and 5 to 20 ⁇ m. ..
- the negative photosensitive resin film formed from the resin composition of the present invention is negative photosensitive when exposed to ultraviolet light, ArF, KrF, F 2 laser light or the like using a mask having a predetermined pattern. Due to the action of the radicals generated from the photopolymerization initiators of the components (C-1) and (C-2) contained in the resin film, the exposed portion of the film becomes insoluble in the alkaline developer.
- ultraviolet rays it is preferable to use ultraviolet rays as the irradiation light, and it is more preferable to use ultraviolet rays having a wavelength of 365 nm, considering that the film is sufficiently cured to the deep part.
- alkaline developing solution examples include aqueous solutions of alkali metal hydroxides such as sodium carbonate, potassium carbonate, potassium hydroxide and sodium hydroxide; tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline.
- alkali metal hydroxides such as sodium carbonate, potassium carbonate, potassium hydroxide and sodium hydroxide
- tetramethylammonium hydroxide tetraethylammonium hydroxide and choline.
- examples thereof include an aqueous solution of quaternary ammonium hydroxide
- an alkaline aqueous solution such as an aqueous solution of amines such as ethanolamine, propylamine and ethylenediamine.
- a surfactant or the like can be added to these developers.
- photoresist developers include, for example, 0.5 to 3 mass% sodium carbonate aqueous solution, 0.01 to 0.5 mass% potassium hydroxide aqueous solution and 0.1 to 2.38 mass.
- An aqueous solution of% tetraethylammonium hydroxide can be mentioned, but even in the resin composition of the present invention, good development can be carried out without causing problems such as swelling by using such an alkaline developer.
- any method such as a spray method, a liquid filling method, a dipping method or a rocking dipping method can be adopted.
- the developing time at that time is usually 15 to 200 seconds.
- the negative photosensitive resin film is washed with running water.
- the washing time is not particularly limited as long as the developer can be sufficiently removed, but is usually 20 to 90 seconds.
- it may be air-dried with compressed air or compressed nitrogen, or by spinning. Moisture on the substrate is removed to obtain a patterned film.
- the obtained pattern-forming film is post-baked for thermosetting or post-exposure for photo-curing, and specifically, it is heated using a hot plate, an oven, or the like.
- a film (cured film) having a good relief pattern with improved heat resistance, flattening property, low water absorption, chemical resistance and the like can be obtained.
- the conditions for post-baking are generally preferably 150 to 300 ° C., more preferably 200 to 250 ° C., for 1 to 30 minutes when using a hot plate, and 1 to 90 minutes when using an oven.
- the method is adopted.
- a cured film having a desired good pattern shape can be obtained.
- the resin composition according to the present invention has a relatively high transmittance of ultraviolet rays in the exposure process, can be sufficiently cured to the deep part of the film, and can be sufficiently cured by curing the composition to obtain visible light. It is possible to form a cured film having a high light-shielding property.
- the obtained cured film can be suitably used as a material for self-luminous displays such as QD-OLED displays and micro LED displays, and is particularly used as a partition wall (colored partition wall) constituting a subpixel of a wavelength conversion layer of a self-luminous display panel. This can contribute to further improvement of the image quality.
- Black pigments and dispersants Black Pigment 1: NITRBLACK UB-1 manufactured by Mitsubishi Materials Corporation
- Black Pigment 2 Mitsubishi Materials Corporation
- 13MT Dispersant Solsparse 34750 manufactured by Nippon Lubrizol Co., Ltd.
- the obtained dispersion was applied onto a non-alkali glass (substrate) using a spin coater, and then prebaked on a hot plate at 100 ° C. for 120 seconds to form a black pigment 1-containing thin film having a film thickness of 10 ⁇ m.
- component 100 (A) except that the pigment dispersion liquid 2 described later was used instead of the pigment dispersion liquid 1 used in (1).
- a dispersion liquid (black pigment 2-containing resin composition) in which the component (D) was dispersed in the component (F) at a ratio of 10 parts by mass with respect to the mass part was prepared.
- a black pigment 2-containing thin film having a film thickness of 10 ⁇ m was formed on a non-alkali glass (substrate) by the same method as in (1).
- Mn and Mw of component (A) and component (E) The Mn and Mw of the components (A), the copolymer of the component (E), and the polymer of the component (E) synthesized according to the following synthesis examples were prepared by using a GPC apparatus (column KF803L and KF804L) manufactured by Shimadzu Science Co., Ltd. , Tetrahydrofuran was flown through the column (column temperature 40 ° C.) at a flow rate of 1 mL / min as an elution solvent to elute the mixture.
- Mn number average molecular weight
- Mw weight average molecular weight
- PFPE1 (1.19 g), BEI (0.48 g) are used, DOTDD (0.017 g) is used as a catalyst, and these are used as a solvent MEK (1.67 g) at room temperature (approximately 23 ° C.) 24.
- a polymer solution P3 polymer concentration: 50% by mass of the component (E) was obtained.
- the obtained Mn of P3 was 2,500 and Mw was 3,000.
- ⁇ Preparation of pigment dispersion> The black pigment, the solvent, and the dispersant were mixed so as to have the blending ratios shown in Table 2. This solution was dispersed by a mix rotor for 8 hours. As the beads, 0.5 mm ⁇ zirconia beads were used, and a mass 5 times that of the dispersion was added. After completion of the dispersion, the beads and the dispersion were separated by a filter to prepare a pigment dispersion.
- Examples 1 to 3 Comparative Examples 1 to 2> According to the composition shown in Table 3 below, the component (B), the component (C-1), the solvent of the component (F), the optional component, the component (D) and the component (E) are mixed in the solution of the component (A). Then, the resin compositions of Examples and Comparative Examples were prepared by stirring at room temperature for 3 hours.
- the resin composition was applied onto a non-alkali glass (base) using a spin coater, and then prebaked on a hot plate at 100 ° C. for 120 seconds to form a coating film (thickness 14 ⁇ m).
- the obtained coating film was irradiated 140 mJ / cm 2 light intensity of the ultraviolet rays of 5.5 mW / cm 2 at 365nm using a UV irradiation apparatus PLA-600FA manufactured by Canon Inc..
- this coating film was heated at 230 ° C. for 30 minutes to perform post-baking to obtain a cured film (film thickness 10 ⁇ m).
- the transmittance at a wavelength of 200 to 800 nm was measured using an ultraviolet visible spectrophotometer (SIMADZU UV-2550 model number manufactured by Shimadzu Corporation), and the optical density (OD value) at 550 nm was calculated. did.
- the OD value is a numerical value indicating the light-shielding ability, and the larger the value, the higher the light-shielding property. The results obtained are shown in Table 3.
- the resin composition was applied onto a non-alkali glass (base) using a spin coater, and then prebaked on a hot plate at 100 ° C. for 120 seconds to form a coating film (thickness 14 ⁇ m).
- a coating film For this coating film, an ultraviolet ray having a light intensity of 5.5 mW / cm 2 at 365 nm was applied to 140 mJ / cm using a Canon Co., Ltd. ultraviolet irradiation device PLA-600FA through a mask having a line and space pattern of 10 ⁇ m. 2 Irradiated. Then, after spray developing with 0.033 mass% potassium hydroxide aqueous solution for 180 seconds, it was washed with ultrapure water for 30 seconds.
- Examples 1 to 3 showed excellent characteristics such as excellent visible light shielding property and good resolution. On the other hand, in Comparative Example 1, the shielding property of visible light was insufficient, and in Comparative Example 2, pattern formation could not be performed.
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
1. (A)アルカリ可溶性共重合体、
(B)アクリレート基、メタクリレート基、ビニル基およびアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物、
(C)光開始剤:(C-1)オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、(D)黒色顔料:(A)成分、(B)成分、(C-1)成分、(C-2)365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤、(D)黒色顔料、(E)撥液成分、(F)溶媒および(G)チオール化合物を含有し、かつ、(A)成分100質量部に対して(D)成分10質量部の割合で(F)成分中に分散させた分散液をガラス基板上に塗布し、乾燥させて成膜した膜厚10μmの薄膜において、波長365nmの光透過率をT1、波長550nmの光透過率をT2としたとき、T1/T2の値が0.3以上である黒色顔料、
(E)撥液成分、および
(F)溶媒
を含有することを特徴とする樹脂組成物。
2. (D)成分の含有量が、(A)成分100質量部に対し、1~50質量部である1の樹脂組成物。
3. (A)成分の数平均分子量が、ポリスチレン換算で2,000~50,000である1または2の樹脂組成物。
4. (A)成分が、アクリル酸、メタクリル酸、無水マレイン酸およびマレイミドからなる群より選ばれる少なくとも1種を含むモノマー混合物の共重合体である請求項1~3のいずれか1項記載の樹脂組成物。
5. (C-1)成分の含有量が、(A)成分100質量部に対し、0.3~5質量部である1~4のいずれかの樹脂組成物。
6. (B)成分の含有量が、(A)成分100質量部に対し、10~150質量部である1~5のいずれかの樹脂組成物。
7. (C-1)成分が、カルバゾール構造を有する光開始剤である1~6のいずれかの樹脂組成物。
8. 1~7のいずれかの樹脂組成物から得られる硬化膜。
9. 1~7のいずれかの樹脂組成物により形成される自発光ディスプレイ用隔壁。
10. 9の隔壁を備える自発光ディスプレイの波長変換層。
11. 10の波長変換層を備える有機エレクトロルミネッセンス素子。
12. 10の波長変換層を備えるマイクロLED素子。
(A)アルカリ可溶性共重合体、
(B)アクリレート基、メタクリレート基、ビニル基およびアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物、
(C)光開始剤:(C-1)オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、
(D)黒色顔料:(A)成分、(B)成分、(C-1)成分、(C-2)365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤、(D)黒色顔料、(E)撥液成分、(F)溶媒および(G)チオール化合物を含有し、かつ、(A)成分100質量部に対して(D)成分10質量部の割合で(F)成分中に分散させた分散液をガラス基板上に塗布し、乾燥させて成膜した膜厚10μmの薄膜において、波長365nmの光透過率をT1、波長550nmの光透過率をT2としたとき、T1/T2の値が0.3以上である黒色顔料、
(E)撥液成分、および
(F)溶媒
を含有する樹脂組成物である。
(A)アルカリ可溶性共重合体は、アルカリ可溶性基を有するモノマーおよびその他モノマーを含むモノマー混合物の共重合により得られる共重合体(以下、「(A)成分の共重合体」と記載することもある)である。
なお、本発明において、数平均分子量Mnおよび後述の重量平均分子量Mwは、いずれも、ゲル浸透クロマトグラフィー(GPC)によるポリスチレン換算値である。
その他モノマーとしては、例えば、アクリル酸エステル化合物、メタクリル酸エステル化合物、N-置換マレイミド化合物、アクリロニトリル化合物、アクリルアミド化合物、メタクリルアミド化合物、スチレン化合物およびビニル化合物が挙げられる。
(B)成分は、アクリレート基、メタクリレート基、ビニル基およびアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物である。本発明において、「重合性基を2個以上有する化合物」とは、一分子中に重合性基を2個以上有し、かつ、それらの重合性基が分子末端にある化合物を意味する。
(B)成分は、各成分との相溶性が良好で、かつ現像性に影響を与えないという観点から、Mwが1,000以下の化合物が好ましい。
(C)成分は光開始剤であって、本発明では特定の吸光係数を有する下記(C-1)の光開始剤を用いる。
(C-1)成分は、オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤である。具体的には、オキシムエステル基と光吸収部位とを有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である化合物が挙げられる。
本発明では、(C-1)成分とともに(C-2)365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤を併用してもよい。(C)成分として2種の異なる吸光係数を有する光開始剤を併用することで、硬化性と現像性をより向上させることができる。(C-2)成分としては、例えば、ヒドロキシ基を有するものが好ましい。
(D)成分は、(A)成分、(B)成分、(C-1)成分、(C-2)成分、(D)黒色顔料、(E)撥液成分、(F)溶媒および(G)チオール化合物を含有し、かつ、(A)成分100質量部に対して(D)成分10質量部の割合で(F)成分中に分散させた分散液をガラス基板上に塗布し、乾燥させて成膜した膜厚10μmの薄膜において、波長365nmの光透過率をT1、波長550nmの光透過率をT2としたとき、T1/T2の値が0.3以上である黒色顔料である。上記分散液において、(A)成分および(D)成分の種類、ならびに(A)成分および(D)成分以外の成分の種類および含有量は、上述した(A)~(C)成分、ならびに後述する(D)~(G)成分の説明において記載したものと同様とすることができる。なお、上記分散液に使用する溶媒としては、プロピレングリコールモノメチルエーテルおよびプロピレングリコールモノメチルエーテルアセテートが好適である。これらの溶媒は、1種を単独で用いても、2種を組み合わせて用いてもよい。
(E)成分は、(e1)撥液性基を有する重合体、または後述する所定の界面活性剤である。
(e1)撥液性基としては、例えば、フルオロアルキル基、ポリフルオロエーテル基、シリルエーテル基およびポリシロキサン基から選ばれる少なくとも1種の基が挙げられる。
-(X-O)n-Y ・・・(i)
(式(i)中、Xは、フッ素原子を有してもよい炭素数1~10の2価飽和炭化水素基であって、nで括られた単位毎に同一の基または異なる基を示し、Yは、水素原子(ただし、Yに隣接する酸素原子に隣接する炭素原子にフッ素原子が結合していない場合に限る)、またはフッ素原子を有してもよい炭素数1~20の1価飽和炭化水素基を示し、nは、2~50の整数を示す。ただし、式(i)におけるフッ素原子の総数は2以上である。)
-Cp-1F2(p-1)-O-(CpF2p-O)n-1-CqF2q+1 ・・・(ii)
(式(ii)中、pは、2または3であり、nで括られた単位毎に同一の基であり、qは、1~20の整数、nは、2~50の整数を示す。)
-CF2O(CF2CF2O)n-1CF3 (nは2~9)
-CF(CF3)O(CF2CF(CF3)O)n-1C6F13 (nは2~6)
-CF(CF3)O(CF2CF(CF3)O)n-1C3F7 (nは2~6)
-X4-Si(O-SiX1X2X3)3
(式中、X1、X2およびX3は、それぞれ独立して、炭素数1~3のアルキル基を表し、X4は、炭素数1~6のアルキレン基を表す。)
-(SiRaRb-O)m-SiRaRbRc ・・・(iii)
(ただし、RaおよびRbは、それぞれ独立して、水素原子、アルキル基、シクロアルキル基またはアリール基を表し、Rcは、水素原子または炭素数1~10の有機基を表し、mは、1~200の整数を表す。)。
本発明では、上記サブピクセルの開口部におけるインク濡れ性の点から、(e1)の基に加えてさらにN-アルコキシメチルアミド基、ブロックイソシアネート基およびトリアルコキシシリル基からなる群から選ばれる少なくとも1つの基を含むことが好ましい。
-(CH2)2-Si(OCH3)3
-(CH2)3-Si(OCH3)3
-(CH2)2-Si(OCH2CH3)3
-(CH2)3-Si(OCH2CH3)3
(E)成分は、上記(e1)および(e2)の基に加えて、上記サブピクセルの開口部におけるインク濡れ性の点から、さらに(e3)ヒドロキシ基、カルボキシ基、アミド基およびアミノ基からなる群から選ばれる少なくとも1つの基を含むことが好ましい。
(E)成分は、上記(e1)の基を有する重合体にウレタン結合を介して結合するアクリレート基を導入することもできる。
アクリレート基としては、(メタ)アクリロイル基などが挙げられ、イソシアネート基を有するアクリレートを(e1)の基を有する重合体に反応させることで導入することができる。
イソシアネート基を有するアクリレートとしては、例えば、2-(メタ)アクリロイルオキシエチルイソシアネートおよび1,1-ビス((メタ)アクリロイルオキシメチル)エチルイソシアネート)が挙げられる。
アクリル重合体は、(e1)の基を含むモノマーを重合させることにより、好ましくはさらに(e2)の基を含むモノマーと共重合させることにより、より好ましくはさらに(e3)の基を含むモノマーを加えて共重合させることにより得ることができる。
フルオロアルキル基を有するモノマーとしては、炭素数3~10のフルオロアルキル基を有するモノマーを挙げることができ、例えば、2,2,2-トリフルオロエチルアクリレート、2,2,2-トリフルオロエチルメタクリレート、2,2,3,3,3-ペンタフルオロプロピルアクリレート、2,2,3,3,3-ペンタフルオロプロピルメタクリレート、2-(パーフルオロブチル)エチルアクリレート、2-(パーフルオロブチル)エチルメタクリレート、3-パーフルオロブチル-2-ヒドロキシプロピルアクリレート、3-パーフルオロブチル-2-ヒドロキシプロピルメタクリレート、2-(パーフルオロヘキシル)エチルアクリレート、2-(パーフルオロヘキシル)エチルメタクリレート、3-パーフルオロヘキシル-2-ヒドロキシプロピルアクリレート、3-パーフルオロヘキシル-2-ヒドロキシプロピルメタクリレート、2-(パーフルオロオクチル)エチルアクリレート、2-(パーフルオロオクチル)エチルメタクリレート、3-パーフルオロオクチル-2-ヒドロキシプロピルアクリレート、3-パーフルオロオクチル-2-ヒドロキシプロピルメタクリレート、2-(パーフルオロデシル)エチルアクリレート、2-(パーフルオロデシル)エチルメタクリレート、2-(パーフルオロ-3-メチルブチル)エチルアクリレート、2-(パーフルオロ-3-メチルブチル)エチルメタクリレート、3-(パーフルオロ-3-メチルブチル)-2-ヒドロキシプロピルアクリレート、3-(パーフルオロ-3-メチルブチル)-2-ヒドロキシプロピルメタクリレート、2-(パーフルオロ-5-メチルヘキシル)エチルアクリレート、2-(パーフルオロ-5-メチルヘキシル)エチルメタクリレート、2-(パーフルオロ-5-メチルヘキシル)-2-ヒドロキシプロピルアクリレート、2-(パーフルオロ-5-メチルヘキシル)-2-ヒドロキシプロピルメタクリレート、2-(パーフルオロ-7-メチルオクチル)エチルアクリレート、2-(パーフルオロ-7-メチルオクチル)エチルメタクリレート、2-(パーフルオロ-7-メチルオクチル)-2-ヒドロキシプロピルアクリレート、および2-(パーフルオロ-7-メチルオクチル)-2-ヒドロキシプロピルメタクリレートが挙げられる。
エポキシ基を有するモノマーをあらかじめ共重合させた後、一の末端にアミノ基を有し、他の末端にpSi基を有する化合物を反応させる方法。
エポキシ基を有するモノマーをあらかじめ共重合させた後、一の末端にメルカプト基を有し、他の末端にpSi基を有する化合物を反応させる方法。
アミノ基を有するモノマーをあらかじめ共重合させた後、一の末端にカルボキシ基を有し、他の末端にpSi基を有する化合物を反応させる方法。
カルボキシ基を有するモノマーをあらかじめ共重合させた後、一の末端にエポキシ基を有し、他の末端にpSi基を有する化合物を反応させる方法。
カルボキシ基を有するモノマーをあらかじめ共重合させた後、一の末端にアミノ基を有し、他の末端にpSi基を有する化合物を反応させる方法。
カルボキシ基を有するモノマーをあらかじめ共重合させた後、一の末端に塩化シリル基を有し、他の末端にpSi基を有する化合物を反応させる方法。
水酸基を有するモノマーをあらかじめ共重合させた後、一の末端に塩化シリル基を有し、他の末端にPSi基を有する化合物を反応させる方法。
N-アルコキシメチルアミド基を有するモノマーとしては、例えば、N-ヒドロキシメチル(メタ)アクリルアミド、N-メトキシメチル(メタ)アクリルアミド、N-エトキシメチル(メタ)アクリルアミド、およびN-ブトキシメチル(メタ)アクリルアミド等のヒドロキシメチル基またはアルコキシメチル基で置換された(メタ)アクリルアミド化合物が挙げられる。
ヒドロキシ基を有するモノマーとしては、例えば、2-ヒドロキシエチルアクリレート、2-ヒドロキシエチルメタクリレート、2-ヒドロキシプロピルアクリレート、2-ヒドロキシプロピルメタクリレート、4-ヒドロキシブチルアクリレート、4-ヒドロキシブチルメタクリレート、2,3-ジヒドロキシプロピルアクリレート、2,3-ジヒドロキシプロピルメタクリレート、グリセリンモノメタクリレート、ジエチレングリコールモノアクリレート、ジエチレングリコールモノメタクリレート、カプロラクトン2-(アクリロイルオキシ)エチルエステル、カプロラクトン2-(メタクリロイルオキシ)エチルエステル、ポリ(エチレングリコール)アクリレート、ポリ(プロピレングリコール)アクリレート、ポリ(エチレングリコール)エチルエーテルアクリレート、ポリ(エチレングリコール)エチルエーテルメタクリレート、5-アクリロイルオキシ-6-ヒドロキシノルボルネン-2-カルボキシリック-6-ラクトン、および5-メタクリロイルオキシ-6-ヒドロキシノルボルネン-2-カルボキシリック-6-ラクトン、p-ヒドロキシスチレン、α―メチル-p-ヒドロキシスチレン、N-ヒドロキシフェニルマレイミド、N-ヒドロキシフェニルアクリルアミド、N-ヒドロキシフェニルメタクリルアミド、p-ヒドロキシフェニルアクリレート、およびp-ヒドロキシフェニルメタクリレートが挙げられる。本発明では、これらの中でも、2-ヒドロキシエチルアクリレートおよび2-ヒドロキシエチルメタクリレートが好ましい。
ポリアミック酸としては、例えば、フルオロアルキル基を有するジアミンと、酸二無水物とを反応させて得られるポリアミック酸が挙げられる。ポリイミドとしては、例えば、前記ポリアミック酸をイミド化して得られるポリイミドが挙げられる。
ポリアミドとしては、例えば、フルオロアルキル基を有するジアミンと、ジカルボン酸無水物とを重合させて得られるポリアミドが挙げられる。
ポリウレアとしては、例えば、フルオロアルキル基を有するジアミンと、ジイソシアネートとを重合させて得られるポリウレアが挙げられる。
ポリウレタンとしては、例えば、フルオロアルキル基またはフルオロアルコキシ基を有するジオールとアミノ基を有するジオールをジイソシアネートと重合させて得られるポリウレタンが挙げられる。
フェノール樹脂としては、例えば、フルオロアルキル基またはフルオロアルコキシ基を有するフェノールと、ホルムアルデヒドとを重合させて得られるノボラック樹脂が挙げられる。
エポキシ樹脂としては、例えば、フルオロアルキル基またはフルオロアルコキシ基を有するビスフェノールAおよびビスフェノールFのいずれか一方または両方と、当該ビスフェノールAのジグリシジルエーテルおよびビスフェノールFのジグリシジルエーテルのいずれか一方または両方とを反応させて得られるエポキシ樹脂が挙げられる。
ポリシロキサンとしては、例えば、フルオロアルキル基を有するトリアルコキシシランまたはフルオロアルキル基を有するジアルコキシシランシランと、アミノ基を有するトリアルコキシシランまたはアミノ基を有するジアルコキシシランとを含むシランモノマー混合物を重合させて得られるポリシロキサンが挙げられる。
ポリエステルとしては、例えば、ジカルボン酸またはテトラカルボン酸二無水物と、フルオロアルキル基またはフルオロアルコキシ基を有するジオールとを反応させて得られるポリエステルが挙げられる。
なお、(E)成分の重合体の数平均分子量Mnは、ゲルパーミエーションクロマトグラフィー(GPC)測定によるポリスチレン換算値である。
(F)成分の溶媒は、(A)成分、(B)成分および(C)成分を溶解し、かつ必要に応じて添加される後述の(G)成分などを溶解するものであれば、その種類および構造などは特に限定されるものでない。
(G)成分は、チオール化合物である。この成分は、上記樹脂組成物の硬化速度を向上させる目的で、本発明の効果を損なわない限りにおいて、配合されるものである。
(H)成分は、密着促進剤である。本発明の樹脂組成物は、現像後の基板との密着性を向上させる目的で、密着促進剤を添加してもよい。このような密着促進剤の具体例としては、トリメチルクロロシラン、ジメチルビニルクロロシラン、メチルジフェニルクロロシランおよびクロロメチルジメチルクロロシラン等のクロロシラン類;トリメチルメトキシシラン、ジメチルジエトキシシラン、メチルジメトキシシラン、ジメチルビニルエトキシシラン、ジフェニルジメトキシシラン、フェニルトリエトキシシラン、ビニルトリクロロシラン、γ-アミノプロピルトリエトキシシラン、γ-メタクリロイルオキシプロピルトリエトキシシラン、γ-メタクリロイルオキシプロピルトリメトキシシラン、γ-グリシドキシプロピルトリエトキシシラン、γ-(N-ピペリジニル)プロピルトリエトキシシラン、3-ウレイドプロピルトリエトキシシランおよび3-ウレイドプロピルトリメトキシシラン等のアルコキシシラン類;ヘキサメチルジシラザン、N,N’‐ビス(トリメチルシリル)ウレア、ジメチルトリメチルシリルアミンおよびトリメチルシリルイミダゾール等のシラザン類;ベンゾトリアゾール、ベンズイミダゾール、インダゾール、イミダゾール、2-メルカプトベンズイミダゾール、2-メルカプトベンゾチアゾール、2-メルカプトベンゾオキサゾール、ウラゾール、チオウラシル、メルカプトイミダゾールおよびメルカプトピリミジン等の複素環状化合物;1,1-ジメチルウレア等の尿素化合物;および1,3-ジメチルウレア等のチオ尿素化合物を挙げることができる。本発明では、これらの中でも、アルコキシシラン類(すなわち、シランカップリング剤)が良好な密着性が得られる点で好ましい。また、これらの密着促進剤は、1種を単独でまたは2種類以上を組み合わせて用いることができる。
さらに、本発明の樹脂組成物は、本発明の効果を損なわない限りにおいて、必要に応じて、増感剤、連鎖移動剤、架橋剤、レオロジー調整剤、顔料、染料、保存安定剤、消泡剤、または多価フェノール、多価カルボン酸等の溶解促進剤等を含有することができる。
本発明の樹脂組成物は、(A)成分のアルカリ可溶性重合体、(B)成分の重合性基を2個以上有する化合物、(C-1)成分のオキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、(D)成分の黒色顔料、および(E)成分の撥液成分を(F)成分の溶媒に溶解または分散したものであり、必要に応じて、(C-2)成分の光開始剤、(G)成分のチオール化合物、(H)成分の密着促進剤、およびその他添加剤のうち1種以上をさらに含有することができる組成物である。
[1]:(A)成分100質量部に対して、(B)成分10~150質量部、(C-1)成分0.3~5質量部、(D)成分1~50質量部および(E)成分を(F)成分の溶媒に溶解または分散した樹脂組成物。
[2]:上記[1]の組成物において、(A)成分100質量部に対して、(E)成分を0.5~10質量部含有する樹脂組成物。
[3]:上記[1]または[2]の組成物において、さらに(G)成分を(A)成分100質量部に対して、0.01~10質量部含有する樹脂組成物。
[4]:上記[1]、[2]または[3]の組成物において、さらに(H)成分を(A)成分100質量部に対して、0.1~20質量部含有する樹脂組成物。
[5]:上記[1]~[4]いずれかの組成物において、さらに(C-2)成分を(A)成分100質量部に対して、0.5~10質量部含有する樹脂組成物。
本発明の樹脂組成物は、該組成物を適当な基板(例えば、シリコン/二酸化シリコン被覆基板、シリコンナイトライド基板、金属、例えば、アルミニウム、モリブデン、クロムなどが被覆された基板、ガラス基板、石英基板、ITO基板等)やフィルム(例えば、トリアセチルセルロースフィルム、シクロオレフィンポリマーフィルム、シクロオレフィンコポリマーフィルム、ポリエチレンテレフタレートフィルム、ポリエステルフィルム、アクリルフィルム、ポリイミド等の樹脂フィルム)等の基材上に、スピンコート、フローコート、ロールコート、スリットコート、スリットコートに続いたスピンコート、インクジェット法等の方法によって塗布し、その後、ホットプレートまたはオーブン等で予備乾燥することにより、塗膜を形成することができる。その後、この塗膜を加熱処理(プリベーク)することにより、感光性を有するネガ型感光性樹脂膜が形成される。
以下の実施例で用いる略記号の意味は、次のとおりである。
MAA:メタクリル酸
MMA:メチルメタクリレート
AIBN:アゾビスイソブチロニトリル
PRG1:エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-1-(O-アセチルオキシム)(365nm吸光係数:7,749ml/g・cm in CH3CN)
PRG2:1-ヒドロキシ-シクロヘキシル-フェニル-ケトン(365nm吸光係数:88.64ml/g・cm in MeOH)
PRG3:BASF社製、IRGACURE(登録商標)OXE03
DPHA:日本化薬(株)製、KAYARAD(登録商標)DPHA(製品名)、ジペンタエリスリトールペンタおよびヘキサアクリレートの混合物
A-DPH-12E:新中村化学工業(株)製、NKエステル(登録商標)A-DPH-12E(製品名)、エトキシ化ジペンタエリスリトールヘキサアクリレート
CTA:昭和電工(株)製、カレンズ-MT(登録商標)PE1(製品名)、ペンタエリスリトールテトラキス(3-メルカプトブチレート)
PFHMA:2-(パーフルオロヘキシル)エチルメタクリレート
KBM-503:3-メタクリロキシプロピルトリエトキシシラン(別名:3-トリエトキシシリルプロピルアクリレート)
HEMA:2-ヒドロキシエチルメタクリレート
PFPE1:両末端それぞれにポリ(オキシアルキレン)基を介さずヒドロキシ基を2つ有するパーフルオロポリエーテル[ソルベイスペシャルティポリマーズ社製 Fomblin(登録商標)T4]
BEI:1,1-ビス(アクリロイルオキシメチル)エチルイソシアネート[昭和電工(株)製 カレンズ(登録商標)BEI]
DOTDD:ジネオデカン酸ジオクチル錫[日東化成(株)製 ネオスタン(登録商標)U-830]
PGME:プロピレングリコールモノメチルエーテル
MEK:メチルエチルケトン
黒色顔料1:三菱マテリアル(株)製、NITRBLACK UB-1
黒色顔料2:三菱マテリアル(株)製、13M-T
分散剤:日本ルーブリゾール(株)製、ソルスパース34750
(1)黒色顔料1含有薄膜の形成
後述の合成例1で得たP1(8.11g)、DPHA(1.99g)、PRG1(0.03g)、PRG2(0.09g)、CTA(0.01g)、後述の顔料分散液1(0.63g)、後述の合成例2で得たP2(0.50g)、PGME(0.65g)を混合して、(A)成分100質量部に対して(D)成分が10質量部の割合で(F)成分中に分散した分散液(黒色顔料1含有樹脂組成物)を調製した。得られた分散液を無アルカリガラス(基板)上にスピンコーターを用いて塗布した後、100℃のホットプレート上で120秒間プリベークを行い、膜厚10μmの黒色顔料1含有薄膜を形成した。
(1)で使用した顔料分散液1の代わりに、後述の顔料分散液2を用いた以外は、(1)と同様の方法で、(A)成分100質量部に対して(D)成分が10質量部の割合で(F)成分中に分散した分散液(黒色顔料2含有樹脂組成物)を調製した。得られた分散液を用いて、(1)と同様の方法で、無アルカリガラス(基板)上に膜厚10μmの黒色顔料2含有薄膜を形成した。
上記で形成した薄膜について、紫外線可視分光光度計((株)島津製作所製SIMADZU UV-2550型番)を用いて365nmの波長の透過率T1および550nmの波長の光透過率T2を測定し、両者の比T1/T2を算出した。結果を表1に示す。
以下の合成例に従って合成した(A)成分、(E)成分の共重合体および(E)成分の重合体のMnおよびMwは、島津サイエンス(株)製GPC装置(カラムKF803LおよびKF804L)を用い、溶出溶媒としてテトラヒドロフランを流量1mL/分でカラム中に(カラム温度40℃)流して溶離させるという条件で測定した。なお、下記の数平均分子量(以下、Mnと称す。)および重量平均分子量(以下、Mwと称す。)は、ポリスチレン換算値にて表される。
共重合体を構成するモノマー成分として、MAA(30.0g)およびMMA(120.0g)を使用し、ラジカル重合開始剤としてAIBN(6.4g)を使用し、これらを溶媒であるPGME(290g)中、60~90℃で16時間重合反応させることにより(A)成分の共重合体溶液P1(共重合体濃度:35質量%)を得た。得られた共重合体のMnは9,700、Mwは21,500であった。
共重合体を構成するモノマー成分として、PFHMA(5.00g)、KBM-503(3.83g)およびHEMA(1.51g)を使用し、ラジカル重合開始剤としてAIBN(0.52g)を使用し、これらを溶媒であるPGME(25.32g)中、80℃で16時間重合反応させることにより(E)成分の共重合体溶液P2(共重合体濃度:30質量%)を得た。得られた共重合体のMnは4,800、Mwは6,700であった。
PFPE1(1.19g)、BEI(0.48g)を使用し、触媒としてDOTDD(0.017g)を使用し、これらを溶媒であるMEK(1.67g)中、室温(およそ23℃)で24時間反応させることにより、(E)成分の重合体溶液P3(重合体濃度:50質量%)を得た。得られたP3のMnは2,500、Mwは3,000であった。
黒色顔料、溶媒、分散剤が表2に記載の配合割合となるように混合した。この溶液をミックスローターにより8時間分散処理を行った。ビーズとしては、0.5mmφのジルコニアビーズを用い、分散液の5倍の質量を加えた。分散終了後、フィルターによりビーズと分散液を分離して、顔料分散液を調製した。
次の表3に示す組成に従い、(A)成分の溶液に、(B)成分、(C-1)成分、(F)成分の溶媒、任意成分、(D)成分および(E)成分を混合し、室温で3時間撹拌することにより、実施例および比較例の樹脂組成物を調製した。
樹脂組成物を無アルカリガラス(基板)上にスピンコーターを用いて塗布した後、100℃のホットプレート上で120秒間プリベークを行い、塗膜を形成した(膜厚14μm)。得られた塗膜に対して、キヤノン(株)製紫外線照射装置PLA-600FAを用いて365nmにおける光強度が5.5mW/cm2の紫外線を140mJ/cm2照射した。その後、0.033質量%の水酸化カリウム水溶液で180秒間スプレー現像を行った後、超純水で30秒間流水洗浄を行った。次いで、オーブンを用いて、この塗膜を230℃で30分間加熱することによりポストベークを行い硬化膜を得た(膜厚10μm)。
樹脂組成物を無アルカリガラス(基板)上にスピンコーターを用いて塗布した後、100℃のホットプレート上で120秒間プリベークを行い、塗膜を形成した(膜厚14μm)。この塗膜に対して、10μmのラインアンドスペースパターンのマスクを介して、キヤノン(株)製紫外線照射装置PLA-600FAを用いて365nmにおける光強度が5.5mW/cm2の紫外線を140mJ/cm2照射した。その後、0.033質量%の水酸化カリウム水溶液で180秒間スプレー現像を行った後、超純水で30秒間流水洗浄を行った。次いで、オーブンを用いて、この塗膜を230℃で30分間加熱することによりポストベークを行い硬化させた。硬化したラインアンドスペースパターンの断面形状を(株)日立ハイテクノロジーズ製走査型電子顕微鏡S-4800を用いて観察し、以下の基準によりパターンの解像性を評価した。得られた結果を表4に示す。
〈評価基準〉
○:パターン形成可能、かつ残膜なし
×:パターン形成不可、またはパターン形成可能であっても残膜あり
Claims (12)
- (A)アルカリ可溶性共重合体、
(B)アクリレート基、メタクリレート基、ビニル基およびアリル基からなる群より選ばれる少なくとも1種の重合性基を2個以上有する化合物、
(C)光開始剤:(C-1)オキシムエステル基を有し、365nmにおけるメタノール中またはアセトニトリル中の吸光係数が5,000ml/g・cm以上である光開始剤、(D)黒色顔料:(A)成分、(B)成分、(C-1)成分、(C-2)365nmにおけるメタノール中またはアセトニトリル中の吸光係数が100ml/g・cm以下である光開始剤、(D)黒色顔料、(E)撥液成分、(F)溶媒および(G)チオール化合物を含有し、かつ、(A)成分100質量部に対して(D)成分10質量部の割合で(F)成分中に分散させた分散液をガラス基板上に塗布し、乾燥させて成膜した膜厚10μmの薄膜において、波長365nmの光透過率をT1、波長550nmの光透過率をT2としたとき、T1/T2の値が0.3以上である黒色顔料、
(E)撥液成分、および
(F)溶媒
を含有することを特徴とする樹脂組成物。 - (D)成分の含有量が、(A)成分100質量部に対し、1~50質量部である請求項1記載の樹脂組成物。
- (A)成分の数平均分子量が、ポリスチレン換算で2,000~50,000である請求項1または2記載の樹脂組成物。
- (A)成分が、アクリル酸、メタクリル酸、無水マレイン酸およびマレイミドからなる群より選ばれる少なくとも1種を含むモノマー混合物の共重合体である請求項1~3のいずれか1項記載の樹脂組成物。
- (C-1)成分の含有量が、(A)成分100質量部に対し、0.3~5質量部である請求項1~4のいずれか1項記載の樹脂組成物。
- (B)成分の含有量が、(A)成分100質量部に対し、10~150質量部である請求項1~5のいずれか1項記載の樹脂組成物。
- (C-1)成分が、カルバゾール構造を有する光開始剤である請求項1~6のいずれか1項記載の樹脂組成物。
- 請求項1~7のいずれか1項記載の樹脂組成物から得られる硬化膜。
- 請求項1~7のいずれか1項記載の樹脂組成物により形成される自発光ディスプレイ用隔壁。
- 請求項9記載の隔壁を備える自発光ディスプレイの波長変換層。
- 請求項10記載の波長変換層を備える有機エレクトロルミネッセンス素子。
- 請求項10記載の波長変換層を備えるマイクロLED素子。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020227007046A KR20220044982A (ko) | 2019-08-07 | 2020-07-31 | 수지 조성물 |
JP2021537283A JPWO2021024928A1 (ja) | 2019-08-07 | 2020-07-31 | |
CN202080055381.7A CN114174351A (zh) | 2019-08-07 | 2020-07-31 | 树脂组合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019145006 | 2019-08-07 | ||
JP2019-145006 | 2019-08-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021024928A1 true WO2021024928A1 (ja) | 2021-02-11 |
Family
ID=74503784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2020/029377 WO2021024928A1 (ja) | 2019-08-07 | 2020-07-31 | 樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021024928A1 (ja) |
KR (1) | KR20220044982A (ja) |
CN (1) | CN114174351A (ja) |
TW (1) | TW202112833A (ja) |
WO (1) | WO2021024928A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023190218A1 (ja) * | 2022-03-30 | 2023-10-05 | 東レ株式会社 | 表示装置及び感光性組成物 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03274503A (ja) * | 1990-03-26 | 1991-12-05 | Toppan Printing Co Ltd | カラーフィルタ |
JP2010114209A (ja) * | 2008-11-05 | 2010-05-20 | Fujifilm Corp | 光ナノインプリント用硬化性組成物、硬化物およびその製造方法 |
JP2018083730A (ja) * | 2016-11-22 | 2018-05-31 | 三菱マテリアル電子化成株式会社 | 黒色膜形成用混合粉末及びその製造方法 |
JP2018155878A (ja) * | 2017-03-16 | 2018-10-04 | 三菱ケミカル株式会社 | 着色感光性樹脂組成物、硬化物、有機電界発光素子、画像表示装置及び照明 |
JP2019070720A (ja) * | 2017-10-06 | 2019-05-09 | 日鉄ケミカル&マテリアル株式会社 | 感光性樹脂組成物及び樹脂膜付き基板の製造方法 |
WO2019146685A1 (ja) * | 2018-01-26 | 2019-08-01 | 三菱ケミカル株式会社 | 着色感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015060240A1 (ja) | 2013-10-21 | 2015-04-30 | 日産化学工業株式会社 | ネガ型感光性樹脂組成物 |
KR102379844B1 (ko) * | 2017-10-06 | 2022-03-29 | 후지필름 가부시키가이샤 | 경화막의 제조 방법, 고체 촬상 소자의 제조 방법, 화상 표시 장치의 제조 방법 |
-
2020
- 2020-07-31 CN CN202080055381.7A patent/CN114174351A/zh active Pending
- 2020-07-31 KR KR1020227007046A patent/KR20220044982A/ko unknown
- 2020-07-31 WO PCT/JP2020/029377 patent/WO2021024928A1/ja active Application Filing
- 2020-07-31 JP JP2021537283A patent/JPWO2021024928A1/ja active Pending
- 2020-08-05 TW TW109126458A patent/TW202112833A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03274503A (ja) * | 1990-03-26 | 1991-12-05 | Toppan Printing Co Ltd | カラーフィルタ |
JP2010114209A (ja) * | 2008-11-05 | 2010-05-20 | Fujifilm Corp | 光ナノインプリント用硬化性組成物、硬化物およびその製造方法 |
JP2018083730A (ja) * | 2016-11-22 | 2018-05-31 | 三菱マテリアル電子化成株式会社 | 黒色膜形成用混合粉末及びその製造方法 |
JP2018155878A (ja) * | 2017-03-16 | 2018-10-04 | 三菱ケミカル株式会社 | 着色感光性樹脂組成物、硬化物、有機電界発光素子、画像表示装置及び照明 |
JP2019070720A (ja) * | 2017-10-06 | 2019-05-09 | 日鉄ケミカル&マテリアル株式会社 | 感光性樹脂組成物及び樹脂膜付き基板の製造方法 |
WO2019146685A1 (ja) * | 2018-01-26 | 2019-08-01 | 三菱ケミカル株式会社 | 着色感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023190218A1 (ja) * | 2022-03-30 | 2023-10-05 | 東レ株式会社 | 表示装置及び感光性組成物 |
Also Published As
Publication number | Publication date |
---|---|
KR20220044982A (ko) | 2022-04-12 |
TW202112833A (zh) | 2021-04-01 |
CN114174351A (zh) | 2022-03-11 |
JPWO2021024928A1 (ja) | 2021-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105765458B (zh) | 负型感光性树脂组合物 | |
CN101669070B (zh) | 感光性组合物、间隔壁、黑色矩阵、彩色滤光片的制造方法 | |
TWI572983B (zh) | 光壓印用硬化性組成物、圖案形成方法、圖案以及半導體元件的製造方法 | |
JP7099323B2 (ja) | 硬化膜の形成方法、感放射線樹脂組成物、硬化膜を備える表示素子及びセンサー | |
TW201329635A (zh) | 負型感光性樹脂組成物、隔壁、黑色矩陣及光學元件 | |
WO2007061115A1 (ja) | 隔壁、カラーフィルタ、有機elの製造方法 | |
CN102964515B (zh) | 用于层间绝缘膜和保护膜的树脂及感光树脂组合物 | |
JP6315204B2 (ja) | ネガ型感光性樹脂組成物 | |
WO2007069703A1 (ja) | 含フッ素重合体、ネガ型感光性組成物及び隔壁 | |
WO2020044918A1 (ja) | ネガ型感光性樹脂組成物 | |
KR20150105378A (ko) | 경화막 형성용 수지 조성물 | |
JP2010096846A (ja) | ネガ型レジスト | |
TW202122436A (zh) | 聚合物及樹脂組成物 | |
JP2018009059A (ja) | 硬化性樹脂組成物及びその用途 | |
JPWO2009063955A1 (ja) | スペーサー形成用感放射線性樹脂組成物、スペーサー、スペーサーの形成方法、及び液晶表示素子 | |
WO2021024928A1 (ja) | 樹脂組成物 | |
TW201422654A (zh) | 硬化膜形成組成物 | |
TW202124486A (zh) | 樹脂組成物、與感光性樹脂組成物及其硬化物 | |
JP2017058627A (ja) | 感光性樹脂組成物及びその硬化膜 | |
JP6748419B2 (ja) | 感光性樹脂組成物 | |
CN114545730A (zh) | 光敏树脂组合物和由其制备的固化膜 | |
CN114671975A (zh) | 基于氟化丙烯酸酯的共聚物和包含其的光敏树脂组合物 | |
TW202406940A (zh) | 撥液劑、活性能量線硬化性組成物、硬化物及顯示裝置 | |
JP2017141402A (ja) | 硬化性樹脂組成物及びその用途 | |
JP2017173734A (ja) | 感光性樹脂組成物及びその硬化物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20850117 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2021537283 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20227007046 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20850117 Country of ref document: EP Kind code of ref document: A1 |