WO2015059967A1 - 放熱性回路基板及びその製造方法 - Google Patents
放熱性回路基板及びその製造方法 Download PDFInfo
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- WO2015059967A1 WO2015059967A1 PCT/JP2014/069320 JP2014069320W WO2015059967A1 WO 2015059967 A1 WO2015059967 A1 WO 2015059967A1 JP 2014069320 W JP2014069320 W JP 2014069320W WO 2015059967 A1 WO2015059967 A1 WO 2015059967A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- insulating film
- heat
- adhesive layer
- adhesive
- Prior art date
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Definitions
- the present invention relates to a heat dissipating circuit board and a manufacturing method thereof.
- Some electronic components mounted on a printed wiring board have a large amount of heat generated during operation, such as a light emitting diode (LED).
- LED light emitting diode
- a heat dissipating metal plate or the like is generally laminated in order to prevent deterioration of the function of the electronic component or circuit damage due to heating.
- a circuit board in which a metal plate and a printed wiring board are bonded with a high thermal conductivity adhesive, A circuit board (see JP-A-9-139580) on which a conductive pattern is directly formed via a heat conductive adhesive has been devised.
- the circuit board obtained by bonding the above-described metal plate and printed wiring board with a heat conductive adhesive has an insulating film between the metal plate and the electronic component (conductive pattern), so that it is difficult to obtain a sufficient heat dissipation effect. . Therefore, when it is used as a circuit board of an LED lighting device having a plurality of LEDs that are becoming popular in recent years, there is an inconvenience that usage conditions are limited.
- the circuit board in which the conductive pattern is formed on the above-described metal plate via the heat conductive adhesive for example, the heat conductive adhesive cured when the board is bent or the like is broken, and the insulation is lowered. There is an inconvenience.
- the present invention provides a heat dissipating circuit board that has high insulation reliability and that can effectively promote the heat dissipating of electronic components, and a manufacturing method thereof.
- a heat dissipating circuit board made to solve the above problems includes an insulating film disposed on the back surface and a printed wiring board having one or more land portions disposed on the surface, and A heat dissipating circuit board comprising one or more electronic components mounted on one or more land portions and an adhesive layer laminated on the back surface of the insulating film, wherein one or more electronic components for each electronic component are provided.
- the insulating film and the adhesive layer are removed in a first area that covers at least the projected area of the land portion, and the removed portion of the insulating film and the adhesive layer is filled with a heat conductive adhesive.
- a manufacturing method of a heat dissipating circuit board according to an aspect of another invention made to solve the above problems includes an insulating film disposed on the back surface and one or a plurality of land portions disposed on the surface.
- a printed wiring board having one or more electronic components mounted on the one or more land portions, an adhesive layer laminated on the back surface of the insulating film, and a support disposed on the back surface of the adhesive layer.
- a method of manufacturing a heat dissipating circuit board comprising a member, the step of mounting one or more electronic components on the one or more land portions, and the projection area of the one or more land portions for each electronic component Removing the insulating film in at least a first region covering, laminating an adhesive layer from which at least a corresponding portion of the first region is removed on the back surface of the insulating film, and the insulating film and the adhesive layer. And a step of filling the heat conductive adhesive to partially, and placing the support member on the back surface of the adhesive layer filled with thermally conductive adhesive to the removed portion.
- a heat dissipating circuit board and a manufacturing method thereof provide a circuit board that has high insulation reliability and can effectively promote heat dissipation of a mounted electronic component and is preferably used for an LED lighting device or the like. Can be provided.
- FIG. 1 is a schematic cross-sectional view showing a heat dissipation circuit board according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view showing a modification of the heat dissipation circuit board of FIG.
- FIG. 3 is a schematic cross-sectional view showing a heat dissipating circuit board in an embodiment different from FIGS. 1 and 2.
- 4A is a schematic cross-sectional view illustrating a method for manufacturing the heat dissipation circuit board of FIG. 3.
- 4B is a schematic cross-sectional view showing a step subsequent to FIG. 4A in the method for manufacturing the heat dissipation circuit substrate of FIG. 3.
- 4C is a schematic cross-sectional view showing a step subsequent to FIG.
- 4D is a schematic cross-sectional view showing a step subsequent to FIG. 4C of the method for manufacturing the heat dissipation circuit substrate of FIG. 3.
- FIG. 5 is a schematic cross-sectional view showing a heat dissipating circuit board in an embodiment different from those in FIGS. 1, 2, and 3.
- FIG. 6 is a schematic cross-sectional view showing a heat dissipating circuit board in an embodiment different from those in FIGS. 1, 2, 3 and 5.
- FIG. 7 is a schematic cross-sectional view showing a heat dissipating circuit board in an embodiment different from those in FIGS. 1, 2, 3, 5, and 6.
- FIG. 8 is a schematic cross-sectional view showing a heat dissipating circuit board in an embodiment different from those in FIGS. 1, 2, 3, 5, 6, and 7.
- a heat dissipating circuit board includes an insulating film disposed on the back surface, a printed wiring board having one or more land portions disposed on the front surface, and the one or more land lands described above. 1 or a plurality of electronic components mounted on a part, and a heat dissipation circuit board comprising an adhesive layer laminated on the back surface of the insulating film, the projected region of one or a plurality of land parts for each of the electronic parts The insulating film and the adhesive layer are removed in a first region that covers at least the insulating film and the removed portion of the insulating film and the adhesive layer is filled with a heat conductive adhesive.
- the insulating film and the adhesive layer are removed in the first region that covers at least the projection region of the land portion for each electronic component, and the removed portion is filled with the heat conductive adhesive.
- a heat conductive adhesive is directly laminated on the conductive pattern of the wiring board. Therefore, when the heat-dissipating circuit board is laminated on a support member such as a metal plate via an adhesive layer and a heat conductive adhesive, the conductive pattern and the support member such as a metal plate are thermally conductively bonded. Since the connection is made only through the agent, the heat dissipation effect of the electronic component can be significantly promoted.
- the “land area projection area” means a part or the whole of the land area projection area.
- the heat dissipation effect is promoted even if connected to a support member such as a metal plate via a heat conductive adhesive
- a region that is not performed occurs.
- the insulating film and adhesive layer are removed and the heat conductive adhesive is filled in the remaining area of the land projection area without removing the insulating film and adhesive layer.
- a heat dissipation effect can be achieved. That is, a form in which the first area does not cover a part of the projected area of the land portion is also included in the present invention.
- the “support member” can also be referred to as a “heat dissipating member”.
- the first area overlaps with the projection area of the electronic component disposed in the area, and the occupied area of the first area is not more than twice the projection area of the electronic component disposed in the area. Good.
- the first region overlaps with the projection region of the electronic component, and the area is set to be equal to or smaller than the above upper limit, so that the heat radiation effect of the electronic component can be ensured while minimizing the removal area of the insulating film. Can play.
- the adhesive layer may be further removed in the second region covering the first region.
- the printed wiring board may have a through hole for each first region, and at least the back surface side of the through hole may be filled with the heat conductive adhesive.
- the heat conductive adhesive is filled in the through-hole and the upper part thereof and is in contact with the back surface of the electronic component.
- the heat dissipation effect of the electronic component can be further promoted by bringing the heat conductive adhesive into contact with the electronic component through the through hole.
- the printed wiring board may be flexible. Thus, since a printed wiring board has flexibility, it can laminate
- the main component of the insulating film may be polyimide, liquid crystal polymer, fluororesin, polyethylene terephthalate, or polyethylene naphthalate. By using these resins as the insulating film, the insulating properties of the insulating film can be enhanced.
- the “main component” is a component having the highest content, for example, a component having a content of 50% by mass or more.
- the “fluororesin” refers to a polymer in which at least one hydrogen atom bonded to a carbon atom constituting a repeating unit of a polymer chain is substituted with a fluorine atom or an organic group having a fluorine atom.
- the thermal conductivity of the thermal conductive adhesive is preferably 1 W / mK or more.
- the electronic component may be a light emitting diode. Since the heat dissipation circuit board has a high heat dissipation effect as described above, it can be suitably used as an LED circuit board.
- the surface of the printed wiring board may have a light reflecting function. Since the heat dissipation circuit board has a high heat dissipation effect as described above, the heat dissipation performance of the light-emitting diode is maintained even if a light reflection function is given to the surface of the printed wiring board by a material that inhibits heat dissipation such as filler or paint. can do.
- the heat dissipation circuit board may include a support member disposed on the back surface of the adhesive layer. By connecting the support member and the conductive pattern only through the heat conductive adhesive, the above-described heat dissipation effect is easily and reliably achieved.
- the support member may have a curved surface or a bent surface in a laminated region of the printed wiring board.
- the printed wiring board since the printed wiring board has an insulating film in a region other than the first region, the insulating property is not easily lowered even if it is bent along the support member. Therefore, since the insulation reliability can be maintained even when a support member having a curved surface or a bent surface is used, various shapes can be employed.
- the manufacturing method of the heat dissipation circuit board which concerns on 1 aspect of this invention is a printed wiring board which has the insulating film arrange
- the insulating film and the adhesive layer are removed in a first region that covers at least the projected region of the land portion for each electronic component, and the removed portion is filled with a heat conductive adhesive,
- a heat dissipating circuit board in which the conductive pattern of the wiring board and the supporting member such as a metal plate are connected only through the heat conductive adhesive can be obtained easily and reliably. This heat dissipating circuit board can significantly promote the heat dissipating effect of the electronic component.
- the “front and back” means the direction in which the electronic component mounting side is the front and the side opposite to the electronic component mounting side is the back in the thickness direction of the heat dissipating circuit board. It does not mean the front and back of the heat dissipation circuit board in use.
- a heat-dissipating circuit board 1 shown in FIG. 1 includes a flexible printed wiring board 2 having a conductive pattern 2c including an insulating film (base film) 2a disposed on the back surface and a plurality of land portions 2b disposed on the front surface,
- the light emitting diode 3 mounted on the plurality of land portions 2b and the adhesive layer 4 laminated on the back surface of the insulating film (base film) 2a are mainly provided.
- the insulating film (base film) 2a and the adhesive layer 4 are removed in the first area A that covers at least the projected areas of the plurality of land portions 2b of the light emitting diode 3, and the insulating film (base film) 2a.
- the heat conductive adhesive 5 is filled in the removed part of the adhesive layer 4.
- the flexible printed wiring board 2 includes an insulating film (base film) 2a having insulating properties and flexibility, a conductive pattern 2c laminated on the surface of the insulating film (base film) 2a, and a surface of the conductive pattern 2c. And a coverlay 2d to be laminated.
- the conductive pattern 2c has a plurality of land portions 2b and wirings connected to the land portions 2b.
- the light emitting diodes 3 to be described later are electrically connected to the land portions 2b ( Has been implemented).
- the conductive pattern 2c may be laminated via an adhesive applied to the surface of the insulating film (base film) 2a.
- the insulating film (base film) 2a constituting the flexible printed wiring board 2 is composed of a sheet-like member having insulating properties and flexibility.
- a resin film can be employed as the sheet-like member constituting the insulating film (base film) 2a.
- As the main component of this resin film polyimide, liquid crystal polymer, fluororesin, polyethylene terephthalate, or polyethylene naphthalate is preferably used.
- the insulating film (base film) 2a may include a filler, an additive, and the like.
- the liquid crystal polymer includes a thermotropic type that exhibits liquid crystallinity in the molten state and a lyotropic type that exhibits liquid crystallinity in the solution state, but the thermotropic liquid crystal polymer is used in the heat dissipation circuit substrate according to one embodiment of the present invention. Is preferred.
- the liquid crystal polymer is an aromatic polyester obtained by synthesizing, for example, an aromatic dicarboxylic acid and a monomer such as aromatic diol or aromatic hydroxycarboxylic acid.
- a typical example is a polymer obtained by polymerizing monomers of the following formulas (1), (2) and (3) synthesized from parahydroxybenzoic acid (PHB), terephthalic acid and 4,4′-biphenol.
- PHB parahydroxybenzoic acid
- terephthalic acid and 4,4′-biphenol A polymer obtained by polymerizing monomers of the following formulas (3) and (4) synthesized from PHB, terephthalic acid and ethylene glycol; a formula (2) synthesized from PHB and 2,6-hydroxynaphthoic acid; Examples thereof include a polymer obtained by polymerizing the monomers (3) and (5).
- the liquid crystal polymer is not particularly limited as long as it exhibits liquid crystallinity, and the above-mentioned polymers are the main components (in the liquid crystal polymer, 50 mol% or more), and other polymers or monomers may be copolymerized.
- the liquid crystal polymer may be a liquid crystal polyester amide, a liquid crystal polyester ether, a liquid crystal polyester carbonate, or a liquid crystal polyester imide.
- the liquid crystal polyester amide is a liquid crystal polyester having an amide bond, and examples thereof include a polymer obtained by polymerizing monomers of the following formula (6) and the above formulas (2) and (4).
- the liquid crystal polymer is preferably produced by melt polymerization of raw material monomers corresponding to the constituent units constituting the liquid crystal polymer, and solid-phase polymerization of the obtained polymer (prepolymer). Thereby, a high molecular weight liquid crystal polymer having high heat resistance, strength, rigidity and the like can be produced with good operability. Melt polymerization may be carried out in the presence of a catalyst.
- this catalyst examples include metal compounds such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, and antimony trioxide, And nitrogen-containing heterocyclic compounds such as 4- (dimethylamino) pyridine and 1-methylimidazole, and nitrogen-containing heterocyclic compounds are preferably used.
- fluorine atom-containing group is a group in which at least one hydrogen atom in a linear or branched organic group is substituted with a fluorine atom, and examples thereof include a fluoroalkyl group, a fluoroalkoxy group, and a fluoropolyether group.
- Fluoroalkyl group means an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and includes a “perfluoroalkyl group”. Specifically, a “fluoroalkyl group” is a group in which all hydrogen atoms of an alkyl group are substituted with fluorine atoms, and all hydrogen atoms other than one hydrogen atom at the end of the alkyl group are substituted with fluorine atoms. Group and the like.
- the “fluoroalkoxy group” means an alkoxy group in which at least one hydrogen atom is substituted with a fluorine atom, and includes a “perfluoroalkoxy group”.
- a “fluoroalkoxy group” is a group in which all hydrogen atoms of an alkoxy group are substituted with fluorine atoms, and all hydrogen atoms other than one hydrogen atom at the end of the alkoxy group are substituted with fluorine atoms. Group and the like.
- the “fluoropolyether group” is a monovalent group having a plurality of alkylene oxide chains as repeating units and having an alkyl group or a hydrogen atom at the terminal, and the alkylene oxide chain and / or the terminal alkyl group or hydrogen.
- “Fluoropolyether group” includes “perfluoropolyether group” having a plurality of perfluoroalkylene oxide chains as repeating units.
- fluororesins examples include tetrafluoroethylene / hexapropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVdF), fluoro Elastomer, tetrafluoroethylene / hexafluoropropylene / vinylidene fluoride copolymer (THV), and tetrafluoroethylene-perfluorodioxole copolymer (TFE / PDD) are preferred.
- FEP tetrafluoroethylene / hexapropylene copolymer
- PFA tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer
- PTFE polytetrafluoroethylene
- PVdF polyvinylidene fluoride
- TFE / PDD
- the lower limit of the average thickness of the insulating film (base film) 2a is preferably 5 ⁇ m, and more preferably 12 ⁇ m.
- the upper limit of the average thickness of the insulating film (base film) 2a is preferably 50 ⁇ m, and more preferably 25 ⁇ m.
- the average thickness of the insulating film (base film) 2a is less than the above lower limit, the strength of the insulating film (base film 2a) may be insufficient.
- the average thickness of the insulating film (base film) 2a exceeds the upper limit, the flexibility of the flexible printed wiring board 2 may be impaired.
- the insulating film (base film) 2a has a gap (removed portion) in the first area A that covers at least the projected areas of the plurality of land portions 2b, and the gap is filled with a heat conductive adhesive 5 described later.
- the first area A is a continuous area including a plurality of land portions 2 b and overlaps with the projection area of the light emitting diode 3.
- the first area A covers the entire projection area of the plurality of land portions 2b. That is, all the projection areas of the plurality of land portions 2b are included in the first area A. However, a part of the projected area of the land portion 2b may not be included in the first area A as long as the heat dissipation promotion effect is achieved.
- the lower limit of the area ratio of the area covered by the first area A to the entire projection area of one land portion 2b is preferably 80%, more preferably 90%, and 95%. Further preferred. When the said area ratio is less than the said minimum, there exists a possibility that the thermal radiation effect of the said heat-radiating circuit board 1 may become inadequate.
- the upper limit of the area occupied by the first region A is preferably twice the projected area of the light emitting diode 3, more preferably 1.8 times, and even more preferably 1.5 times.
- the occupation area of the first region A exceeds the above upper limit, the removal region of the insulating film (base film) 2a becomes large, and the effect of reducing the insulation reliability when the heat dissipation circuit board 1 is laminated on a bent surface or the like May become insufficient.
- the conductive pattern 2c has a plurality of land portions 2b and wiring connected to them, and a desired planar shape (pattern) by etching a metal layer laminated on the surface of the insulating film (base film) 2a. Is formed.
- the land portion 2b is a portion to which the terminal of the light emitting diode 3 is connected, and the wiring portion is formed so as to connect the plurality of land portions 2b.
- the conductive pattern 2c can be formed of a conductive material.
- the conductive pattern 2c is generally formed of copper, for example.
- the lower limit of the average thickness of the conductive pattern 2c is preferably 5 ⁇ m, and more preferably 8 ⁇ m.
- the upper limit of the average thickness of the conductive pattern 2c is preferably 50 ⁇ m, and more preferably 35 ⁇ m.
- a cover lay 2d is laminated on a portion of the surface of the flexible printed wiring board 2 excluding the portion where the light emitting diode 3 is mounted (the surface side of the land portion 2b).
- the coverlay 2d has an insulating function and an adhesive function, and is adhered to the surfaces of the insulating film (base film) 2a and the conductive pattern 2c.
- the coverlay 2d has an insulating layer and an adhesive layer, the same material as the insulating film (base film) 2a can be used as the insulating layer.
- the average thickness of the insulating layer can be the same as that of the insulating film (base film) 2a.
- an adhesive which comprises the adhesive layer of the coverlay 2d an epoxy adhesive etc. are used suitably, for example.
- the average thickness of the adhesive layer is not particularly limited, but is preferably 12.5 ⁇ m or more and 60 ⁇ m or less.
- the cover lay 2d is preferably colored white.
- the coverlay 2d white it is possible to provide a light reflection function on the surface of the flexible printed wiring board 2 that reflects the light emitted from the light emitting diode 3 toward the flexible printed wiring board 2 and enhances the light utilization efficiency. it can.
- the designability of the said heat-radiating circuit board 1 can be improved by making the coverlay 2d white.
- a method of coloring the coverlay 2d white for example, a method of adding a white pigment can be used.
- the white pigment include titanium oxide, barium sulfate, aluminum oxide, calcium carbonate, zinc oxide, and silicon oxide.
- a white coat layer 12 may be laminated on the surface side of the cover lay 2d.
- a resin containing a white pigment can be used.
- the cover lay 2d or the coat layer 12 may be colored silver or the like instead of white.
- the lower limit of the light reflectance of the surface is preferably 75%, more preferably 80%.
- the light reflectance means a light reflectance measured using a light having a wavelength of 550 nm in accordance with JIS-K7375 (2008).
- the light emitting diode 3 is mounted on the land portion 2 b of the flexible printed wiring board 2.
- the light emitting diode 3 is connected to the land portion 2 b by solder 6.
- the connection method of the light emitting diode 3 to the land portion 2b is not limited to soldering, and for example, die bonding using a conductive paste, wire bonding using a metal wire, or the like can be used.
- the adhesive layer 4 is a layer mainly composed of an adhesive capable of bonding the insulating film (base film) 2a to a support member such as a metal plate.
- the adhesive is not particularly limited, and for example, a thermosetting adhesive such as an epoxy adhesive, a silicone adhesive, and an acrylic adhesive can be used.
- the adhesive layer 4 can contain additives as necessary. However, since the heat dissipation circuit board 1 includes the heat conductive adhesive 5 described later, it is not necessary to impart thermal conductivity to the adhesive layer 4.
- the lower limit of the average thickness of the adhesive layer 4 is preferably 5 ⁇ m and more preferably 10 ⁇ m.
- the upper limit of the average thickness of the adhesive layer 4 is preferably 50 ⁇ m, and more preferably 25 ⁇ m.
- the average thickness of the adhesive layer 4 is less than the above lower limit, the adhesive strength between the heat dissipating circuit board 1 and a support member such as a metal plate may be insufficient.
- the heat dissipation circuit board 1 may become unnecessarily thick, or the distance between the conductive pattern 2c and a support member such as a metal plate will increase. There is a risk that the heat dissipation will be insufficient.
- the adhesive layer 4 has a gap (removed portion) in the first area A (area that covers at least the projection area of the plurality of land portions 2b) and the second area B that covers the first area A.
- the heat conductive adhesive 5 mentioned later is filled.
- the second region B is a continuous region including a plurality of land portions 2b, overlaps with the projection region of the light emitting diode 3, and has a larger occupied area than the first region A. .
- the filling operation of the heat conductive adhesive 5 described later can be facilitated.
- region B alignment of these area
- the lower limit of the minimum distance d between the boundary of the second region B and the boundary of the first region A is preferably 1 ⁇ m, more preferably 10 ⁇ m, further preferably 20 ⁇ m, and particularly preferably 50 ⁇ m.
- the upper limit of the minimum distance d between the boundary of the second region B and the boundary of the first region A is preferably 500 ⁇ m, more preferably 300 ⁇ m, and even more preferably 100 ⁇ m.
- the thermally conductive adhesive 5 is filled in the removed portion of the insulating film (base film) 2a in the first region A and the removed portion of the adhesive layer 4 in the second region B, and includes a plurality of land portions 2b. It is in contact with the back surface of the pattern 2c.
- the heat conductive adhesive 5 contains a thermosetting resin and a heat conductive filler.
- thermosetting resin include epoxy, phenol resin, polyimide, and the like. Among these, epoxy excellent in the bonding strength of the heat conductive filler is preferable.
- epoxies bisphenol A type epoxies or bisphenol F type epoxies having excellent fluidity are more preferable from the viewpoint of the mixing property of the heat conductive filler.
- thermally conductive filler examples include metal oxides and metal nitrides.
- metal oxide aluminum oxide, silicon oxide, beryllium oxide, magnesium oxide, or the like can be used. Among these, aluminum oxide is preferable from the viewpoint of electrical insulation, thermal conductivity, price, and the like.
- metal nitride aluminum nitride, silicon nitride, boron nitride, or the like can be used. Among these, boron nitride is preferable from the viewpoint of electrical insulation, thermal conductivity, and low dielectric constant.
- the said metal oxide and metal nitride can be used in mixture of 2 or more types.
- the heat conductive adhesive 5 may contain additives, such as a hardening
- the lower limit of the thermal conductivity of the heat conductive adhesive 5 is preferably 1 W / mK, and more preferably 3 W / mK.
- the upper limit of the thermal conductivity of the heat conductive adhesive 5 is preferably 20 W / mK.
- the thermal conductivity of the heat conductive adhesive 5 is less than the lower limit, the heat dissipation effect of the heat dissipation circuit board 1 may be insufficient.
- the thermal conductivity of the heat conductive adhesive 5 exceeds the upper limit, the content of the heat conductive filler is excessive, and air bubbles are easily generated when the thermosetting resin and the heat conductive filler are mixed. The withstand voltage may decrease, and the cost may be excessive.
- the thermally conductive adhesive 5 is preferably highly insulating.
- the lower limit of the volume resistivity of the heat conductive adhesive 5 is preferably 1 ⁇ 10 8 ⁇ cm, and more preferably 1 ⁇ 10 10 ⁇ cm.
- the insulating property of the heat conductive adhesive 5 is lowered, and the conductive plate 2c is laminated on the back side of the insulating film (base film) 2a. There is a possibility that it may become conductive with a support member such as.
- the volume resistivity is a value measured according to JIS-C2139 (2008).
- the average thickness of the heat conductive adhesive 5 (the average distance from the back surface of the heat conductive adhesive 5 to the back surface of the conductive pattern 2c) is the average thickness of the insulating film (base film) 2a and the average thickness of the adhesive layer 4. It is preferable that it is larger than the total. Specifically, the lower limit of the average thickness of the heat conductive adhesive 5 is preferably 10 ⁇ m, and more preferably 20 ⁇ m. On the other hand, as an upper limit of the average thickness of the heat conductive adhesive 5, 100 micrometers is preferable and 50 micrometers is more preferable.
- the thermally conductive adhesive 5 When the average thickness of the thermally conductive adhesive 5 is less than the above lower limit, the thermally conductive adhesive 5 is in contact with a support member (metal plate or the like) disposed (laminated) on the back side of the insulating film (base film) 2a. Otherwise, the heat dissipation effect may be insufficient. On the contrary, when the average thickness of the heat conductive adhesive 5 exceeds the upper limit, the filling amount of the heat conductive adhesive 5 may increase and the cost may increase, and the heat dissipation circuit board 1 may be unnecessarily thick. There is a fear.
- the insulating film (base film) 2a and the adhesive layer 4 are removed in the first region A that covers at least the projection region of the land portion 2b on which the light emitting diode 3 is mounted, and heat is applied to the removed portion. Since the conductive adhesive 5 is filled, the heat conductive adhesive 5 is directly laminated on the conductive pattern 2 c of the flexible printed wiring board 2. Therefore, when the heat dissipation circuit board 1 is laminated on a support member such as a metal plate via the adhesive layer 4 and the heat conductive adhesive 5, the conductive pattern 2c and the support member such as a metal plate are heated. Since the connection is made only through the conductive adhesive 5, the heat dissipation effect of the light emitting diode 3 that is electrically connected to the conductive pattern 2c can be significantly promoted.
- the heat dissipating circuit board 1 is filled with the heat conductive adhesive 5 and the insulating film (base film). The alignment work of the removal area of 2a and the removal area of the adhesive layer 4 can be facilitated.
- the heat dissipating circuit board 1 since the heat dissipating circuit board 1 has the flexible printed wiring board 2, it can be easily laminated on a support member such as a metal plate having a curved surface or the like.
- the heat dissipating circuit board 1 may have a release film on the back surface of the adhesive layer 4.
- a release film a resin film whose surface is subjected to a release treatment can be used.
- the release film is peeled off when the heat-radiating circuit board 1 is bonded to a support member such as a metal plate.
- the heat-dissipating circuit board 11 shown in FIG. 3 includes a flexible printed wiring board 2 having a conductive pattern 2c including an insulating film (base film) 2a disposed on the back surface and a plurality of land portions 2b disposed on the front surface, The light emitting diode 3 mounted on the plurality of land portions 2b, the adhesive layer 4 laminated on the back surface of the insulating film (base film) 2a, and the support disposed (laminated) on the back surface of the adhesive layer 4 A member (metal plate) 7 is mainly provided.
- the insulating film (base film) 2a and the adhesive layer 4 are removed in the first area A that covers at least the projected areas of the plurality of land portions 2b of the light emitting diode 3, and the insulating film (base film) 2a.
- the heat conductive adhesive 5 is filled in the removed part of the adhesive layer 4. Since the flexible printed wiring board 2, the light emitting diode 3, the adhesive layer 4, and the heat conductive adhesive 5 are the same as those of the heat dissipating circuit board 1 of the first embodiment, the same reference numerals are given and the description is omitted. .
- the support member may be a metal plate.
- the support member (metal plate) 7 is a metal plate member.
- the lower limit of the average thickness of the support member (metal plate) 7 is preferably 0.3 mm, and more preferably 0.5 mm.
- the upper limit of the average thickness of the support member (metal plate) 7 is preferably 5 mm, and more preferably 3 mm.
- the average thickness of the support member (metal plate) 7 is less than the lower limit, the strength of the support member (metal plate) 7 may be insufficient.
- the average thickness of the support member (metal plate) 7 exceeds the above upper limit, the processing of the support member (metal plate) 7 may be difficult, and the weight and volume of the heat dissipation circuit board 11 may be increased. May grow unnecessarily.
- the heat dissipating circuit board 11 includes a step of mounting the light emitting diode 3 on the plurality of land portions 2 b of the flexible printed wiring board 2, and a projection area of the plurality of land portions 2 b of the light emitting diode 3.
- a step of removing the insulating film (base film) 2a in at least the first region A covering, and an adhesive in which a corresponding portion of the second region B covering the first region A is removed from the back surface of the insulating film (base film) 2a A step of laminating the layer 4, a step of filling the removed portion of the insulating film (base film) 2a and the adhesive layer 4 with the heat conductive adhesive 5, and a filling of the heat conductive adhesive 5 into the removed portion. And a step of disposing (stacking) the support member (metal plate) 7 on the back surface of the adhesive layer 4.
- the plurality of terminals of the light emitting diode 3 are connected to the plurality of land portions 2 b of the flexible printed wiring board 2 as shown in FIG. 4A, and the light emitting diode 3 is mounted on the flexible printed wiring board 2.
- a method for connecting the light emitting diode 3 to the land 2b for example, solder reflow, die bonding using a conductive paste, wire bonding using a metal wire, or the like can be used.
- FIG. 4A shows an example in which the light emitting diode 3 is mounted with the solder 6.
- the insulating film (base film) removing step As shown in FIG. 4B, the insulating film (base film) 2a is removed in the first region A that at least covers the projected regions of the plurality of land portions 2b of the light emitting diode 3.
- a method for removing the insulating film (base film) 2a for example, a method of immersing in an etching solution after masking other than the first region A, a method of performing plasma etching after masking other than the first region A, and the first region A
- a method of irradiating with laser can be used.
- the insulating film (base film) removing step is performed after the light emitting diode mounting step, but the insulating film (base film) removing step may be performed before the light emitting diode mounting step.
- the adhesive layer 4 from which a corresponding portion of the second region B covering the first region A is removed is laminated on the insulating film (base film) 2a.
- This step can be performed, for example, according to the following procedure. First, a release film, an adhesive in a B stage state (semi-cured state) laminated on the surface of the release film by coating, and an adhesive having another release film laminated on the surface of the adhesive Prepare a sheet. Next, the part corresponding to the second region B of the adhesive sheet is removed together with the release film by punching or the like.
- one release film of the adhesive sheet is peeled off, and the adhesive sheet is bonded so that the removed portion (corresponding to the second region B) of the adhesive sheet covers the removed region of the insulating film (base film) 2a.
- the agent exposed surface is laminated (temporarily pasted) toward the back surface of the insulating film (base film) 2a.
- the portion corresponding to the second region B may be removed.
- punching cannot be used, workability is better when the above-described method is used. .
- the heat conductive adhesive 5 is filled into the removed portions of the insulating film (base film) 2 a and the adhesive layer 4.
- a filling method of the heat conductive adhesive 5 for example, a method of printing the heat conductive adhesive 5 by screen printing, a method of discharging the heat conductive adhesive 5 with a dispenser, a release film of the heat conductive adhesive 5
- a method of attaching an adhesive sheet laminated on the substrate can be used. Note that the adhesive layer stacking step and the thermally conductive adhesive filling step may be performed in a reversed order.
- a support member (metal plate) 7 is disposed (laminated) on the back surface side of 2.
- the release film on the back surface side (the side opposite to the flexible printed wiring board 2) of the adhesive sheet is peeled off and laminated (temporarily pasted) on the support member (metal plate) 7 to obtain a laminated body.
- this laminated body is pressurized at a relatively low temperature in a vacuum container and temporarily pressure-bonded.
- the adhesive is cured by heating the laminate at a high temperature, and the heat dissipation circuit board 11 is obtained.
- this process was called a “support member (metal plate) arrangement
- the pressure at the time of provisional pressure bonding of the laminate can be, for example, 0.05 MPa or more and 1 MPa or less. Moreover, as temperature at the time of this temporary crimping, 70 degreeC or more and 120 degrees C or less are preferable, for example. Furthermore, as a minimum of the viscosity of the heat conductive adhesive 5 at the time of temporary pressure bonding, 100 Pa.s is preferable and 500 Pa.s is more preferable. On the other hand, the upper limit of the viscosity of the heat conductive adhesive 5 at the time of temporary pressure bonding is preferably 10,000 Pa ⁇ s, and more preferably 5000 Pa ⁇ s.
- the heat conductive adhesive 5 flows before the heat conductive adhesive 5 is cured, and the filling property of the heat conductive adhesive 5 is increased. May decrease.
- the viscosity of the heat conductive adhesive 5 at the time of temporary press-bonding exceeds the above upper limit, the insulating film (base film) 2a and the adhesive layer 4 are not filled with the heat conductive adhesive 5 in the removed portion. May be sufficient.
- the temperature at the time of high-temperature heating of the laminate can be, for example, 120 ° C. or higher and 200 ° C. or lower. Moreover, as high temperature heating time, it can be 30 minutes or more and 300 minutes or less, for example, and it is more preferable to set it as 30 minutes or more and 120 minutes or less.
- the heat dissipation circuit board 21 shown in FIG. 5 includes a flexible printed wiring board 2 having a conductive pattern 2c including an insulating film (base film) 2a disposed on the back surface and a plurality of land portions 2b disposed on the front surface, The light emitting diode 3 mounted on the plurality of land portions 2b, the adhesive layer 4 laminated on the back surface of the insulating film (base film) 2a, and the support member (metal) laminated on the back surface of the adhesive layer 4 Plate) 7.
- the insulating film 2 and the adhesive layer 4 are removed in the first area A that covers at least the projected areas of the plurality of land portions 2b of the light emitting diode 3, and the insulating film (base film) 2a and the adhesive layer are removed. 4 is filled with the heat conductive adhesive 5. Furthermore, the flexible printed wiring board 2 has a through hole 8 in the first region A, and at least the back surface side of the through hole 8 is filled with the heat conductive adhesive 5. Since the flexible printed wiring board 2, the light emitting diode 3, the adhesive layer 4, the heat conductive adhesive 5, and the support member (metal plate) 7 are the same as those of the heat dissipation circuit board 11 of the second embodiment, the same reference numerals are used. The description is omitted.
- the through-hole 8 is formed in the first region A and penetrates the region excluding the land portion 2b of the conductive pattern 2c of the flexible printed wiring board 2 and the cover lay 2d.
- the heat conductive adhesive 5 is filled into at least the back surface side of the through hole 8. Further, as shown in FIG. 5, it is preferable that the heat conductive adhesive 5 is filled also in the through hole 8 and the upper part thereof and is in contact with the back surface of the light emitting diode 3. As described above, by bringing the heat conductive adhesive 5 into contact with the back surface of the light emitting diode 3, the heat dissipation effect of the light emitting diode 3 can be further promoted.
- FIG. 5 only one through hole 8 is formed, but a plurality of through holes 8 may be formed in one first region A.
- the lower limit of the average area of the through-hole 8 preferably from 0.005 mm 2, 0.01 mm 2 is more preferable.
- the upper limit of the average area of the through-hole 8 is preferably 1 mm 2, 0.5 mm 2 is more preferable.
- the average area of the through-holes 8 is less than the above lower limit, the effect of preventing leakage of the heat conductive adhesive 5 and the promotion of the heat dissipation effect may be insufficient.
- the average area of the through-hole 8 exceeds the said upper limit, there exists a possibility that the intensity
- the through-hole 8 can be formed before or after removing the insulating film (base film) 2a in the first region A or simultaneously with the removal.
- a method for forming the through hole 8 a method similar to the method for removing the insulating film (base film) 2a can be used.
- the heat dissipating circuit board 21 has the through-hole 8, it is possible to prevent the heat conductive adhesive 5 from leaking outside the first region A when the heat conductive adhesive 5 is filled. Further, the heat conductive adhesive 5 is also filled in the through hole 8 and the upper portion thereof, and brought into contact with the back surface of the light emitting diode 3, thereby further promoting the heat dissipation effect of the light emitting diode 3.
- the heat dissipation circuit board 31 shown in FIG. 6 includes a flexible printed wiring board 2 having a conductive pattern 2c including an insulating film (base film) 2a disposed on the back surface and a plurality of land portions 2b disposed on the front surface, The plurality of light emitting diodes 3 mounted on the plurality of land portions 2b, the adhesive layer 4 laminated on the back surface of the insulating film (base film) 2a, and disposed (laminated) on the back surface of the adhesive layer 4.
- the support member (metal plate) 37 is mainly provided.
- the insulating film (base film) 2a and the adhesive layer 4 are removed in the plurality of first regions A that at least cover the projected regions of the plurality of land portions 2b for each of the plurality of light emitting diodes 3, and the insulating film (Base film) 2a and the removed part of the adhesive layer 4 are filled with the heat conductive adhesive 5.
- the support member (metal plate) 37 is a metal plate-like member, and has a curved surface or a bent surface in the laminated region of the flexible printed wiring board 2. Specifically, the support member (metal plate) 37 is curved or bent so that the laminated surface side of the flexible printed wiring board 2 is convex. Therefore, the flexible printed wiring board 2 is curved or bent along the surface of the support member (metal plate) 37. Since the support member (metal plate) 37 is curved or bent in this manner, the emission directions of the plurality of light emitting diodes 3 mounted on the flexible printed wiring board 2 can be made different. For example, the heat dissipation circuit board The variation of the luminous intensity due to the relative position of the LED lighting apparatus using 31 can be reduced.
- the material and average thickness of the support member (metal plate) 37 can be the same as those of the support member (metal plate) 7 of the heat dissipation circuit board 11 of the second embodiment.
- the light emitting diode 3 it is preferable to mount the light emitting diode 3 other than the curved surface and the bending surface of the support member (metal plate) 37 and the flexible printed wiring board 2 from the viewpoint of connection reliability.
- 6 shows three light emitting diodes 3, the number of light emitting diodes 3 mounted on the heat dissipation circuit board 31 is not limited to three, and may be two or four or more. .
- the flexible printed wiring board 2 is disposed (laminated) on the support member (metal plate) 37 via the insulating film (base film) 2a in the area other than the first area A, the heat dissipation circuit board 31 is curved. Even if the support member (metal plate) 37 having a surface or a bent surface is curved along the support member 37, the insulating property is hardly lowered. Therefore, since the heat dissipation circuit board 31 can maintain insulation reliability, various shapes of support members (metal plates) 37 can be employed.
- the heat dissipating circuit board it is preferable that at least two adjacent portions of the insulating film and the adhesive layer removed for each electronic component are continuous. That is, it is preferable that the insulating film for each of at least two adjacent electronic components and the thermally conductive adhesive filled in the removed portion of the adhesive layer are continuous. Moreover, when there are three or more electronic components, all of the insulating film and adhesive layer removal portions may be continuous, or the insulating film and adhesive layer removal portions of any adjacent electronic components are continuous. You may do it.
- the heat-radiating circuit board 41 shown in FIG. 7 includes a flexible printed wiring board 2 having a conductive pattern 2c including an insulating film (base film) 2a disposed on the back surface and a plurality of land portions 2b disposed on the front surface, A plurality of light emitting diodes 3 mounted adjacent to the plurality of land portions 2b, an adhesive layer 4 laminated on the back surface of the insulating film (base film) 2a, and disposed on the back surface of the adhesive layer 4 ( And a support member (metal plate) 7 to be laminated.
- a conductive pattern 2c including an insulating film (base film) 2a disposed on the back surface and a plurality of land portions 2b disposed on the front surface, A plurality of light emitting diodes 3 mounted adjacent to the plurality of land portions 2b, an adhesive layer 4 laminated on the back surface of the insulating film (base film) 2a, and disposed on the back surface of the adhesive layer 4 ( And a support member (metal plate) 7 to
- the insulating film (base film) 2a and the adhesive layer 4 are removed in the plurality of first regions A that at least cover the projected regions of the plurality of land portions 2b for each of the plurality of light emitting diodes 3, and the insulating film (Base film) 2a and the removed part of the adhesive layer 4 are filled with the heat conductive adhesive 5. Furthermore, the removed portions of the insulating film (base film) 2a and the adhesive layer 4 for each adjacent light emitting diode 3 are continuous.
- a point where a plurality of light emitting diodes 3 are mounted adjacent to the flexible printed wiring board 2, a point where a plurality of first regions A are formed, and a portion where the insulating film (base film) 2a and the adhesive layer 4 are removed are continuous, and the heat conductive adhesive 5 is flexible except that the flexible printed wiring board 2, the light emitting diode 3, the adhesive layer 4, the heat conductive adhesive 5, and the support member (metal plate) 7. Since this is the same as the heat dissipation circuit board 1 of the third embodiment, the same reference numerals are given and description thereof is omitted.
- the heat-dissipating circuit board 41 has a continuous removal portion of the insulating film (base film) 2a and the adhesive layer 4, the number of times of filling the heat conductive adhesive 5 can be reduced.
- the manufacturing process 41 is simple.
- the heat dissipation effect of the heat dissipation circuit board 41 is excellent due to the heat conductive adhesive 5.
- the heat conductive adhesive 5 is relatively large in the heat dissipating circuit board 41, since the adhesive layer 4 exists around the heat conductive adhesive 5, the thickness of the heat conductive adhesive 5 is not increased. Both have good insulation.
- the number of light emitting diodes to be mounted is one, but two or more light emitting diodes can be mounted. Moreover, you may mount one light emitting diode in the said 4th embodiment.
- the light emitting diode is mounted on the printed wiring board.
- electronic components other than the light emitting diode may be mounted on the printed wiring board.
- the number of land portions on which one electronic component is mounted is not limited to a plurality, and may be one.
- an adhesive layer was removed in the 2nd area
- the first area is a single area that includes all the projected areas of the land portions for each electronic component.
- the first area may be divided into a plurality of land area projected areas.
- the first region may include a region that does not overlap with the projection region of the electronic component.
- the material of a supporting member is not limited to a metal.
- the material of the support member can be ceramic.
- the ceramic used for the support member is preferably one having good insulation (that is, low electrical conductivity) and high thermal conductivity.
- Examples of the ceramic used for the support member include aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ), and silicon nitride (Al 3 N 4 ).
- the thickness of the heat conductive adhesive can be made extremely small, the heat dissipation of the heat dissipation circuit board can be enhanced. Further, the use of ceramics for the support member improves the voltage resistance of the heat dissipation circuit board.
- the shape of a supporting member is not limited to this.
- the support member may be a bulk having curved surfaces and corners.
- the shape of the support member may be a prismatic shape, a pyramid shape, a trapezoidal columnar shape, a shape in which these corners are chamfered, or a shape in which these corners are rounded. Good.
- the support member may include a hollow portion therein.
- the heat dissipation circuit board 51 of FIG. 8 is the same as the heat dissipation circuit board 31 of the fourth embodiment, but the heat dissipation circuit board 31 of the fourth embodiment is different from the heat dissipation circuit board 31 of the fourth embodiment in that the cross-sectional shape of the support member 47 is trapezoidal. Is different. If the support member 47 has such a shape, there is no need to bend or bend the support member 47, and therefore the manufacturing process of the heat dissipation circuit board 51 is simplified.
- an insulating film (base film) removal process when performing an insulating film (base film) removal process previously and performing a light emitting diode mounting process next, it is set as a process demonstrated below for an insulation film (base film) removal process.
- an insulation film (base film) removal process it can.
- a base material made of a conductive material such as copper is laminated on the insulating film (base film) 2a. Then, the base material is patterned and the conductive pattern 2c is formed.
- the cover lay 2d is laminated on the portion of the surface of the flexible printed wiring board 2 excluding the portion where the light emitting diode 3 is mounted (the surface side of the land portion 2b).
- the flexible printed wiring board similar to the flexible printed wiring board produced by the insulating film (base film) removing process of the third embodiment can also be produced by this process.
- the printed wiring board used in the embodiment of the present invention is not limited to a flexible printed wiring board, and a rigid printed wiring board may be used. Furthermore, the printed wiring board used in the embodiment of the present invention is not limited to the one used in the above embodiment as long as it has a land portion on the front surface and an insulating film (base film) on the back surface.
- the printed wiring board may be, for example, a double-sided printed wiring board in which a conductive pattern is formed on both sides of an insulating film, or a multilayer printed wiring board in which a plurality of insulating films having a conductive pattern are laminated. In the case of such a double-sided printed wiring board or multilayer printed wiring board, the heat radiation effect is promoted by bringing the heat conductive adhesive into contact with the conductive pattern on the back side (the side opposite to the mounting surface of the electronic component). Can do.
- a flexible printed wiring board is prepared in which a coverlay having a 30 ⁇ m adhesive layer is laminated in this order from the back side.
- This flexible printed wiring board has a white coat on the surface (the surface of the cover lay).
- the flexible printed wiring board has a land portion on which an LED (light emitting diode) can be mounted on the conductive pattern, and an opening is provided in the cover lay along the land portion.
- the insulating film (base film) is removed with an etching solution in the projection area (equal area of the flat area of the LED) of the LED mounting scheduled area of the flexible printed wiring board to expose the conductive pattern.
- lead-free solder Sn-3.0Ag-0.5Cu
- a white LED (“Nichia Chemical Co., Ltd.“ NS6W833T ”) is mounted and the solder is reflowed to mount the LED.
- an epoxy-based adhesive is applied to the surface of a polyethylene terephthalate film (release film) whose surface has been subjected to a release treatment, and the adhesive is brought into a B-stage state with an average thickness of 20 ⁇ m by drying. Furthermore, a release film is laminated on the surface of the adhesive to produce an adhesive sheet. A portion corresponding to the projection area of the LED mounting area of the adhesive sheet (an area equal to the flat area of the LED) is cut out, and at the same time, the adhesive sheet is punched according to the outer shape of the flexible printed wiring board. Thereafter, one release film of the adhesive sheet is peeled off, and the adhesive sheet is temporarily attached to the back surface of the flexible printed wiring board so that the cut-out portion coincides with the conductive pattern exposed region of the insulating film (base film).
- a 200-mesh screen having an opening 50 ⁇ m wider than the cutout portion is placed on the back surface of the adhesive sheet, and the cutout portion (insulating film ( Base film) and adhesive removal part) are mixed with epoxy adhesive, hardener, alumina particles with a particle size of 5-30 ⁇ m and alumina particles with a particle size of 0.5-1 ⁇ m, with a thermal conductivity of 3 W / mK.
- a thermally conductive adhesive is filled by screen printing.
- the release film on the back surface of the adhesive sheet is peeled off and temporarily attached to a metal plate as a support member.
- the pressure of 0.1 MPa is applied from the surface side of the flexible printed wiring board which mounted LED with the silicone rubber, and it press-bonds.
- the laminate was taken out of the vacuum vessel, placed in a preheated oven, heated at 150 ° C. for 60 minutes to cure the adhesive, 1 heat dissipation circuit board is obtained.
- the average thickness of the insulating film (base film) of the flexible printed wiring board is 13 ⁇ m
- the average thickness of the conductive pattern is 18 ⁇ m
- the average thickness of the insulating layer of the coverlay is 13 ⁇ m
- the average thickness of the adhesive layer of the coverlay Except that the projected area of the LED mounting planned area of the insulating film (base film) is removed by laser instead of the etching solution.
- a flexible printed wiring board similar to 1 is prepared. No. 1 except that a metal mask having a thickness of 100 ⁇ m is used for this flexible printed wiring board. LED is mounted in the same procedure as 1. Further, the above-mentioned No. 1. Prepare an adhesive sheet similar to 1 (having a cut-out portion).
- a thermal conductive adhesive having a thermal conductivity of 4 W / mK in which an epoxy adhesive, an amine curing agent, boron nitride particles having a particle size of 5 to 30 ⁇ m and alumina particles having a particle size of 0.1 to 1 ⁇ m are mixed is separated. It is applied to a mold film and dried to obtain a thermally conductive adhesive in a B-stage state with an average thickness of 70 ⁇ m.
- This thermally conductive adhesive sheet is half cut by punching in a shape having a width 100 ⁇ m wider than the cut-out portion of the adhesive sheet (the area equal to the flat area of the LED).
- this thermally conductive adhesive sheet is attached to the removed portion (exposed portion of the conductive pattern) of the insulating film (base film) of the flexible printed wiring board. After sticking the heat conductive adhesive sheet, one release film of the adhesive sheet is peeled off, and the adhesive sheet is attached to the back surface of the flexible printed wiring board so that the cutout portion matches the conductive pattern exposed region of the insulating film (base film). Is temporarily pasted.
- the heat conductive adhesive sheet and the release film on the back surface of the adhesive sheet are peeled off and temporarily pasted on the metal plate as a support member.
- the pressure of 0.2 Mpa is applied from the surface side of the flexible printed wiring board which mounted LED with the silicone rubber, and is temporarily crimped
- the viscosity of the heat conductive adhesive decreases, and the heat conductive adhesive is filled in the insulating film (base film) and the removed portion of the adhesive by flowing under pressure, and comes into contact with the conductive pattern.
- the laminate was taken out of the vacuum vessel, placed in a preheated oven, heated at 150 ° C. for 60 minutes to cure the adhesive, 2 heat dissipation circuit board is obtained.
- the release film on the back surface of the adhesive sheet is peeled off and temporarily attached to a metal plate as a support member.
- the pressure of 0.1 Mpa is applied from the surface side of a LED mounting flexible printed wiring board with a silicone rubber, and it press-bonds. Thereafter, the laminate was taken out of the vacuum vessel, placed in a preheated oven, heated at 150 ° C. for 60 minutes to cure the adhesive, 3 is obtained.
- the release film on the back surface of the adhesive sheet is peeled off and temporarily attached to a metal plate as a support member.
- the pressure of 0.1 Mpa is applied from the surface side of a LED mounting flexible printed wiring board with a silicone rubber, and it press-bonds.
- the laminate was taken out of the vacuum vessel, placed in a preheated oven, heated at 150 ° C. for 60 minutes to cure the adhesive, 4 is obtained.
- a print in which a conductive pattern with an average thickness of 35 ⁇ m made of copper foil is laminated on a base material with an average thickness of 1 mm made of aluminum via a heat conductive adhesive with a thermal conductivity of 3 W / mK and an average thickness of 80 ⁇ m.
- a wiring board This printed wiring board has a land portion on which an LED can be mounted on a conductive pattern.
- lead-free solder (Sn-3.0Ag-0.5Cu) is screen-printed on the land portion of the printed wiring board using a metal mask having a thickness of 150 ⁇ m, and a white LED is placed on the solder. The LED is mounted by reflowing the solder to obtain a heat dissipation circuit board of the reference example.
- the reason why the current flowing through the heat dissipation circuit board is a minute current is to prevent the LED temperature from rising due to self-heating.
- the temperature characteristic of the LED is about ⁇ 1.4 mV / ° C.
- the room temperature is set to 23 ° C., and the heat dissipating circuit board is left in a place where it is not affected by wind from the outside so as to reach room temperature, and then connected to the heat dissipating circuit board via a lead wire to a DC power source.
- the heat-dissipating circuit board was first energized with 4 mA and measured at room temperature, then 300 mA was energized for 15 seconds, then the current was changed to 4 mA within 0.1 seconds, and the voltage was measured again for 15 seconds. The operation of changing the current to 4 mA within 0.1 seconds and measuring the voltage within 0.1 seconds is repeated for a maximum of 30 minutes until the temperature of the LED that rises with the current supply stabilizes (the voltage becomes constant).
- the heat dissipating circuit boards 1 to 3 have the same heat dissipating effect as the heat dissipating circuit board using the aluminum of the reference example as a base material.
- the heat dissipating circuit board and the manufacturing method thereof according to the present invention have high insulation reliability, can effectively promote the heat dissipating of the mounted electronic component, and are suitably used for LED lighting devices and the like. Can be provided.
- Heat-dissipating circuit board Flexible printed wiring board 2a Insulating film (base film) 2b Land 2c Conductive pattern 2d Coverlay 3 Light emitting diode 4 Adhesive layer 5 Thermally conductive adhesive 6 Solder 7, 37 Support member (metal plate) 8 Through-hole 12 Coat layer 47 Support member
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Abstract
Description
(1)本発明の一態様に係る放熱性回路基板は、裏面に配設される絶縁フィルム及び表面に配設される1又は複数のランド部を有するプリント配線板と、上記1又は複数のランド部に実装される1又は複数の電子部品と、上記絶縁フィルムの裏面に積層される接着剤層とを備える放熱性回路基板であって、上記電子部品毎の1又は複数のランド部の投影領域を少なくとも覆う第1領域で上記絶縁フィルム及び接着剤層が除去されており、上記絶縁フィルム及び接着剤層の除去部分に熱伝導性接着剤が充填されている。
なお、「ランド部の投影領域」とは、ランド部の投影領域の一部又は全体を意味する。つまり、実装する電子部品の形状や特性によっては、ランド部の投影領域において放熱性が確保され難い領域(金属板等の支持部材に熱伝導性接着剤を介して接続しても放熱効果が促進されない領域)が生じる場合などがある。このような放熱性が確保され難い領域については絶縁フィルム及び接着剤層を除去しなくとも、ランド部の投影領域の残りの領域で絶縁フィルム及び接着剤層を除去し熱伝導性接着剤を充填することで放熱効果を奏することができる。すなわち、ランド部の投影領域の一部を第1領域が覆っていない形態も本発明に含まれる。
また、支持部材は電子部品等で発生した熱を放熱する役割もするため、「支持部材」を「放熱部材」と呼ぶこともできる。
以下、本発明に係る放熱性回路基板及び放熱性回路基板の製造方法の実施形態について図面を参照しつつ詳説する。なお、放熱性回路基板の実施形態における「表裏」は、放熱性回路基板の厚さ方向のうち、電子部品実装側を表、電子部品実装側と反対側を裏とする方向を意味し、当該放熱性回路基板の使用状態における表裏を意味するものではない。
図1に示す放熱性回路基板1は、裏面に配設される絶縁フィルム(ベースフィルム)2a及び表面に配設される複数のランド部2bを含む導電パターン2cを有するフレキシブルプリント配線板2と、上記複数のランド部2bに実装される発光ダイオード3と、上記絶縁フィルム(ベースフィルム)2aの裏面に積層される接着剤層4とを主に備える。また、上記発光ダイオード3の複数のランド部2bの投影領域を少なくとも覆う第1領域Aで上記絶縁フィルム(ベースフィルム)2a及び接着剤層4が除去されており、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5が充填されている。
フレキシブルプリント配線板2は、絶縁性及び可撓性を有する絶縁フィルム(ベースフィルム)2aと、この絶縁フィルム(ベースフィルム)2aの表面に積層される導電パターン2cと、この導電パターン2cの表面に積層されるカバーレイ2dとを有する。上記導電パターン2cは、複数のランド部2bと、このランド部2bに接続される配線とを有し、このランド部2bには後述の発光ダイオード3が電気的に接続されるように配設(実装)されている。なお、導電パターン2cは絶縁フィルム(ベースフィルム)2aの表面に塗工された接着剤を介して積層されていてもよい。
上記フレキシブルプリント配線板2を構成する絶縁フィルム(ベースフィルム)2aは、絶縁性及び可撓性を有するシート状部材で構成されている。この絶縁フィルム(ベースフィルム)2aを構成するシート状部材としては、具体的には樹脂フィルムを採用可能である。この樹脂フィルムの主成分としては、ポリイミド、液晶ポリマー、フッ素樹脂、ポリエチレンテレフタレート、又はポリエチレンナフタレートが好適に用いられる。なお、絶縁フィルム(ベースフィルム)2aは、充填材、添加剤等を含んでもよい。
導電パターン2cは、複数のランド部2b及びそれらに接続される配線を有しており、絶縁フィルム(ベースフィルム)2aの表面に積層された金属層をエッチングすることによって所望の平面形状(パターン)に形成されている。ランド部2bは、発光ダイオード3の端子が接続される部位であり、配線部は、これらの複数のランド部2bを接続するように形成されている。
フレキシブルプリント配線板2の表面の発光ダイオード3が実装される部分(ランド部2bの表面側)を除いた部分には、カバーレイ2dが積層される。このカバーレイ2dは絶縁機能及び接着機能を有し、絶縁フィルム(ベースフィルム)2a及び導電パターン2cの表面に接着される。カバーレイ2dが絶縁層と接着層とを有する場合、絶縁層としては、絶縁フィルム(ベースフィルム)2aと同じ材質を用いることができる。絶縁層の平均厚さは絶縁フィルム(ベースフィルム)2aと同様とすることができる。また、カバーレイ2dの接着層を構成する接着剤としては、例えばエポキシ系接着剤等が好適に用いられる。接着層の平均厚さは、特に限定されるものではないが、12.5μm以上60μm以下が好ましい。
発光ダイオード3は、フレキシブルプリント配線板2のランド部2bに実装される。この発光ダイオード3としては、多色発光タイプ又は単色発光タイプで、チップ型又は合成樹脂等でパッケージされた表面実装型の発光ダイオードを用いることができる。発光ダイオード3は、半田6によってランド部2bへ接続されている。ただし、発光ダイオード3のランド部2bへの接続方法は半田付けに限定されず、例えば導電性ペーストを用いたダイボンディング、金属線を用いたワイヤボンディング等も用いることができる。
接着剤層4は、絶縁フィルム(ベースフィルム)2aを金属板等の支持部材に接着可能な接着剤を主成分とする層である。この接着剤としては特に限定されず、例えばエポキシ系接着剤、シリコーン系接着剤、アクリル系接着剤等の熱硬化性接着剤を用いることができる。接着剤層4には、必要に応じて添加剤を含有させることができる。ただし、当該放熱性回路基板1は、後述する熱伝導性接着剤5を備えるため、接着剤層4に熱伝導性を付与する必要はない。
熱伝導性接着剤5は、上述した第1領域Aにおける絶縁フィルム(ベースフィルム)2aの除去部分及び第2領域Bにおける接着剤層4の除去部分に充填され、複数のランド部2bを含む導電パターン2cの裏面に当接している。
当該放熱性回路基板1は、発光ダイオード3が実装されるランド部2bの投影領域を少なくとも覆う第1領域Aで絶縁フィルム(ベースフィルム)2a及び接着剤層4が除去され、その除去部分に熱伝導性接着剤5が充填されているため、フレキシブルプリント配線板2の導電パターン2cに熱伝導性接着剤5が直接積層される。そのため、当該放熱性回路基板1は、金属板等の支持部材に接着剤層4及び熱伝導性接着剤5を介して積層された際に、導電パターン2cと金属板等の支持部材とが熱伝導性接着剤5のみを介して接続されるため、導電パターン2cと導通される発光ダイオード3の放熱効果を著しく促進することができる。
図3に示す放熱性回路基板11は、裏面に配設される絶縁フィルム(ベースフィルム)2a及び表面に配設される複数のランド部2bを含む導電パターン2cを有するフレキシブルプリント配線板2と、上記複数のランド部2bに実装される発光ダイオード3と、上記絶縁フィルム(ベースフィルム)2aの裏面に積層される接着剤層4と、この接着剤層4の裏面に配置(積層)される支持部材(金属板)7とを主に備える。また、上記発光ダイオード3の複数のランド部2bの投影領域を少なくとも覆う第1領域Aで上記絶縁フィルム(ベースフィルム)2a及び接着剤層4が除去されており、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5が充填されている。フレキシブルプリント配線板2、発光ダイオード3、接着剤層4及び熱伝導性接着剤5は、上記第一実施形態の放熱性回路基板1と同様であるため、同一符号を付して説明を省略する。
支持部材は金属板であるとよい。支持部材(金属板)7は、金属製の板状部材である。この支持部材(金属板)7を形成する金属としては、例えばアルミニウム、マグネシウム、銅、鉄、ニッケル、モリブデン、タングステン等を用いることができる。これらの中でも伝熱性、加工性及び軽量性に優れるアルミニウムが特に好ましい。
当該放熱性回路基板11は、例えば図4に示すように、フレキシブルプリント配線板2の複数のランド部2bに発光ダイオード3を実装する工程と、発光ダイオード3の複数のランド部2bの投影領域を少なくとも覆う第1領域Aで絶縁フィルム(ベースフィルム)2aを除去する工程と、この絶縁フィルム(ベースフィルム)2aの裏面に上記第1領域Aを覆う第2領域Bの相当部分を除去した接着剤層4を積層する工程と、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5を充填する工程と、上記除去部分に熱伝導性接着剤5を充填した接着剤層4の裏面に支持部材(金属板)7を配置(積層)する工程とを備える製造方法によって製造することができる。
発光ダイオード実装工程では、図4Aに示すようにフレキシブルプリント配線板2の複数のランド部2bに発光ダイオード3の複数の端子を接続し、発光ダイオード3をフレキシブルプリント配線板2に実装する。発光ダイオード3のランド部2bへの接続方法は、例えば半田リフロー、導電性ペーストを用いたダイボンディング、金属線を用いたワイヤボンディング等を用いることができる。なお、図4Aでは半田6で発光ダイオード3を実装した例を示している。
絶縁フィルム(ベースフィルム)除去工程では、図4Bに示すように発光ダイオード3の複数のランド部2bの投影領域を少なくとも覆う第1領域Aで絶縁フィルム(ベースフィルム)2aを除去する。絶縁フィルム(ベースフィルム)2aの除去方法としては、例えば第1領域A以外をマスクした上でエッチング液に浸漬する方法、第1領域A以外をマスクした上でプラズマエッチングする方法、第1領域Aにレーザーを照射する方法等を用いることができる。また、ここでは発光ダイオード実装工程の後に絶縁フィルム(ベースフィルム)除去工程を行っているが、発光ダイオード実装工程の前に絶縁フィルム(ベースフィルム)除去工程を行うこともできる。
接着剤層積層工程では、図4Cに示すように上記第1領域Aを覆う第2領域Bの相当部分を除去した接着剤層4を絶縁フィルム(ベースフィルム)2aに積層する。この工程は、例えば以下の手順で実施できる。まず、離型フィルム、この離型フィルムの表面に塗工により積層されたBステージ状態(半硬化状態)の接着剤、及びこの接着剤の表面に積層された別の離型フィルムを有する接着剤シートを用意する。次に、この接着剤シートの第2領域Bに相当する部分を離型フィルムごと打抜き加工等で除去する。その後、上記接着剤シートの一方の離型フィルムを剥がし、接着剤シートの除去部分(第2領域B相当部分)が絶縁フィルム(ベースフィルム)2aの除去領域を覆うように、接着剤シートの接着剤表出面を絶縁フィルム(ベースフィルム)2aの裏面に向けて積層(仮貼り)する。なお、接着剤シートを絶縁フィルム(ベースフィルム)2aに積層後、第2領域B相当部分を除去してもよいが、打抜き加工が利用できないため、上述した方法を用いた方が作業性がよい。
熱伝導性接着剤充填工程では、図4Dに示すように上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5を充填する。熱伝導性接着剤5の充填方法としては、例えばスクリーン印刷によって熱伝導性接着剤5を印刷する方法、ディスペンサで熱伝導性接着剤5を吐出する方法、熱伝導性接着剤5を離型フィルムに積層した接着シートを貼付する方法等を用いることができる。なお、接着剤層積層工程と熱伝導性接着剤充填工程とは順序を入れ替えて行ってもよい。
支持部材(金属板)配置工程では、接着剤層4を裏面に積層し、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5を充填したフレキシブルプリント配線板2の裏面側に支持部材(金属板)7を配置(積層)する。具体的には、上記接着剤シートの裏面側(フレキシブルプリント配線板2と反対側)の離型フィルムを剥がし、支持部材(金属板)7に積層(仮貼り)して積層体を得る。その後、例えば真空容器中でこの積層体を比較的低温で加圧し、仮圧着する。仮圧着後、上記積層体を高温で加熱することで各接着剤が硬化し、当該放熱性回路基板11が得られる。
なお、この工程を「支持部材(金属板)配置工程」と呼んだが、「支持部材(金属板)積層工程」と呼んでもよい。
当該放熱性回路基板11は、導電パターン2cと支持部材(金属板)7とが熱伝導性接着剤5のみを介して接続されるため、導電パターン2cと導通される発光ダイオード3の放熱効果を著しく促進することができる。
図5に示す放熱性回路基板21は、裏面に配設される絶縁フィルム(ベースフィルム)2a及び表面に配設される複数のランド部2bを含む導電パターン2cを有するフレキシブルプリント配線板2と、上記複数のランド部2bに実装される発光ダイオード3と、上記絶縁フィルム(ベースフィルム)2aの裏面に積層される接着剤層4と、この接着剤層4の裏面に積層される支持部材(金属板)7とを主に備える。また、上記発光ダイオード3の複数のランド部2bの投影領域を少なくとも覆う第1領域Aで上記絶縁フィルム2及び接着剤層4が除去されており、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5が充填されている。さらに、フレキシブルプリント配線板2が第1領域Aに貫通孔8を有し、この貫通孔8の少なくとも裏面側にも上記熱伝導性接着剤5が充填されている。フレキシブルプリント配線板2、発光ダイオード3、接着剤層4、熱伝導性接着剤5及び支持部材(金属板)7は、上記第二実施形態の放熱性回路基板11と同様であるため、同一符号を付して説明を省略する。
貫通孔8は、第1領域A内に形成され、フレキシブルプリント配線板2の導電パターン2cのランド部2bを除く領域及びカバーレイ2dを貫通している。この貫通孔8の少なくとも裏面側に上記熱伝導性接着剤5が充填される。また、図5に示すように貫通孔8及びその上部にも熱伝導性接着剤5が充填され、発光ダイオード3の裏面に当接しているとよい。このように発光ダイオード3の裏面に熱伝導性接着剤5を当接させることで、発光ダイオード3の放熱効果をさらに促進することができる。
当該放熱性回路基板21は、上記貫通孔8を有するため、熱伝導性接着剤5の充填時に熱伝導性接着剤5が第1領域A以外に漏出することを防止することができる。また、熱伝導性接着剤5を貫通孔8及びその上部にも充填し、発光ダイオード3の裏面に当接させることで、発光ダイオード3の放熱効果をさらに促進できる。
図6に示す放熱性回路基板31は、裏面に配設される絶縁フィルム(ベースフィルム)2a及び表面に配設される複数のランド部2bを含む導電パターン2cを有するフレキシブルプリント配線板2と、上記複数のランド部2bに実装される複数の発光ダイオード3と、上記絶縁フィルム(ベースフィルム)2aの裏面に積層される接着剤層4と、この接着剤層4の裏面に配置(積層)される支持部材(金属板)37とを主に備える。また、上記複数の発光ダイオード3毎の複数のランド部2bの投影領域を少なくとも覆う複数の第1領域Aで上記絶縁フィルム(ベースフィルム)2a及び接着剤層4が除去されており、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分に熱伝導性接着剤5が充填されている。フレキシブルプリント配線板2に複数の発光ダイオード3が実装され、複数の第1領域Aが形成されている点以外は、フレキシブルプリント配線板2、発光ダイオード3、接着剤層4及び熱伝導性接着剤5は、上記第一実施形態の放熱性回路基板1と同様であるため、同一符号を付して説明を省略する。
支持部材(金属板)37は、金属製の板状部材であり、フレキシブルプリント配線板2の積層領域に湾曲面又は屈曲面を有する。具体的には、支持部材(金属板)37は、フレキシブルプリント配線板2の積層面側が凸となるように湾曲又は屈曲している。そのため、フレキシブルプリント配線板2はこの支持部材(金属板)37の表面に沿って湾曲又は屈曲している。支持部材(金属板)37がこのように湾曲又は屈曲していることで、フレキシブルプリント配線板2に実装された複数の発光ダイオード3の出射方向を異ならせることができ、例えば当該放熱性回路基板31を用いたLED照明器具の相対位置による光度の変動を低減することができる。
当該放熱性回路基板31は、上記第1領域A以外の領域においてフレキシブルプリント配線板2が絶縁フィルム(ベースフィルム)2aを介して支持部材(金属板)37に配置(積層)されるため、湾曲面又は屈曲面を有する支持部材(金属板)37に沿って湾曲等させても絶縁性が低下し難い。従って、当該放熱性回路基板31は、絶縁信頼性を維持できるため、種々の形状の支持部材(金属板)37を採用することができる。
本発明の一態様に係る放熱性回路基板では、少なくとも2つの隣接する電子部品毎の絶縁フィルム及び接着剤層の除去部分が連続しているとよい。つまり、少なくとも2つの隣接する電子部品毎の絶縁フィルム及び接着剤層の除去部分に充填される熱伝導性接着剤が連続しているとよい。また、電子部品が3つ以上の場合、すべての絶縁フィルム及び接着剤層の除去部分が連続していてもよいし、任意の隣接する電子部品毎の絶縁フィルム及び接着剤層の除去部分が連続していてもよい。
放熱性回路基板41は、上記絶縁フィルム(ベースフィルム)2a及び接着剤層4の除去部分が連続しているので、熱伝導接着剤5の充填回数を減らすことができ、したがって、放熱性回路基板41の製造工程は簡易なものとなる。また、多数の発光ダイオード3が密集して配置される場合でも、熱伝導接着剤5によって放熱性回路基板41の放熱効果は優れている。さらに、放熱性回路基板41では熱伝導接着剤5が比較的多くなるが、熱伝導接着剤5の周囲には接着剤層4が存在するので、熱伝導接着剤5の厚さを大きくしなくとも、絶縁性は良好である。
今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記実施形態の構成に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。
図8の放熱性回路基板51は、第四実施形態の放熱性回路基板31と同様であるが、支持部材47の断面形状が台形状である点で第四実施形態の放熱性回路基板31とは異なる。支持部材47がこのような形状であれば、支持部材47を湾曲又は屈曲させる加工の必要がないので、放熱性回路基板51の製造工程は簡易になる。
まず、発光ダイオード3が実装されたときに、複数のランド部2bの投影領域となる領域を少なくとも覆う第1領域Aが予め除去されている絶縁フィルム(ベースフィルム)2aを準備する。次に、この絶縁フィルム(ベースフィルム)2aの上に、銅などの導電性を有する材料の基材を積層する。その後、その基材をパターニングして、導電パターン2cを形成する。さらに、フレキシブルプリント配線板2の表面の発光ダイオード3が実装される部分(ランド部2bの表面側)を除いた部分に、カバーレイ2dを積層する。
このように、第三実施形態の絶縁フィルム(ベースフィルム)除去工程によって作製されるフレキシブルプリント配線板と同様なフレキシブルプリント配線板を、この工程によっても作製することができる。
まず、ポリイミドを主成分とする平均厚さ25μmの絶縁フィルム(ベースフィルム)と、銅箔製の平均厚さ35μmの導電パターンと、ポリイミドを主成分とする平均厚さ25μmの絶縁層及び平均厚さ30μmの接着層を有するカバーレイとを裏面側からこの順に積層したフレキシブルプリント配線板を用意する。なお、このフレキシブルプリント配線板は表面(カバーレイの表面)に白色コートを有する。また、このフレキシブルプリント配線板は導電パターンにLED(発光ダイオード)が実装可能なランド部を有し、このランド部に沿ってカバーレイに開口が設けられている。
まず、フレキシブルプリント配線板の絶縁フィルム(ベースフィルム)の平均厚さを13μm、導電パターンの平均厚さを18μm、カバーレイの絶縁層の平均厚さを13μm、カバーレイの接着層の平均厚さを20μmとし、エッチング液の代わりにレーザーによって絶縁フィルム(ベースフィルム)のLED実装予定領域の投影領域を除去する以外は上記No.1と同様のフレキシブルプリント配線板を用意する。このフレキシブルプリント配線板に、厚さ100μmのメタルマスクを用いる以外はNo.1と同様の手順でLEDを実装する。さらに、上記No.1と同様の接着シート(切抜き部分を有するもの)を用意する。
まず、上記No.1と同様のLED実装フレキシブルプリント配線板及び接着シート(切抜き部分を有するもの)を用意し、このフレキシブルプリント配線板の裏面にNo.1と同様の手順で接着シートを仮貼りする。
まず、上記No.1と同様のLED実装フレキシブルプリント配線板を用意する。次に、離型フィルムの表面にエポキシ系接着剤を塗工し、乾燥により接着剤を平均厚さが20μmのBステージ状態とする。さらにこの接着剤の表面に離型フィルムを積層し、接着シートを作成する。この接着シートのLED実装領域の投影領域に相当する部分を切抜くことなく、上記フレキシブルプリント配線板の外形に合わせて打抜く。その後、接着シートの一方の離型フィルムを剥がし、上記フレキシブルプリント配線板の裏面に接着シートを仮貼りする。
まず、熱伝導率3W/mK、平均厚さ80μmの熱伝導性接着剤を介して、アルミニウム製の平均厚さ1mmのベース材に銅箔製の平均厚さ35μmの導電パターンが積層されたプリント配線板を用意する。このプリント配線板は導電パターンにLEDが実装可能なランド部を有する。
上記No.1~4及び参考例の放熱性回路基板について以下の放熱試験を行った。まず、以下の手順で放熱性回路基板の温度特性を求めた。最初に、リード線を接続した状態で放熱性回路基板を恒温槽中に配置する。次に、恒温槽が30℃、40℃、50℃及び60℃の各温度に到達毎に30分以上保持して恒温槽及び放熱性回路基板の温度を安定させ、各温度において、放熱性回路基板に微小電流(例えば4mAの電流)を通電した時の電圧を測定する。放熱性回路基板に通電する電流を微小電流としているのは、LEDの温度が自己発熱で上昇しないようにするためである。このようにして得た電圧と温度との関係を最小二乗法で直線近似することで、LEDの温度特性が約-1.4mV/℃であることが導出される。
2 フレキシブルプリント配線板
2a 絶縁フィルム(ベースフィルム)
2b ランド部
2c 導電パターン
2d カバーレイ
3 発光ダイオード
4 接着剤層
5 熱伝導性接着剤
6 半田
7、37 支持部材(金属板)
8 貫通孔
12 コート層
47 支持部材
Claims (13)
- 裏面に配設される絶縁フィルム及び表面に配設される1又は複数のランド部を有するプリント配線板と、
上記1又は複数のランド部に実装される1又は複数の電子部品と、
上記絶縁フィルムの裏面に積層される接着剤層と
を備える放熱性回路基板であって、
上記電子部品毎の1又は複数のランド部の投影領域を少なくとも覆う第1領域で上記絶縁フィルム及び接着剤層が除去されており、
上記絶縁フィルム及び接着剤層の除去部分に熱伝導性接着剤が充填されている放熱性回路基板。 - 上記第1領域がその領域に配設される電子部品の投影領域と重複し、上記第1領域の占有面積がその領域に配設される電子部品の投影面積の2倍以下である請求項1に記載の放熱性回路基板。
- 上記第1領域を覆う第2領域で上記接着剤層がさらに除去されている請求項1又は請求項2に記載の放熱性回路基板。
- 上記プリント配線板が第1領域毎に貫通孔を有し、この貫通孔の少なくとも裏面側にも上記熱伝導性接着剤が充填されている請求項2又は請求項3に記載の放熱性回路基板。
- 上記熱伝導性接着剤が、上記貫通孔及びその上部にも充填され、電子部品裏面に当接している請求項4に記載の放熱性回路基板。
- 上記プリント配線板が可撓性を有する請求項1から請求項5のいずれか1項に記載の放熱性回路基板。
- 上記絶縁フィルムの主成分が、ポリイミド、液晶ポリマー、フッ素樹脂、ポリエチレンテレフタレート、又はポリエチレンナフタレートである請求項1から請求項6のいずれか1項に記載の放熱性回路基板。
- 上記熱伝導性接着剤の熱伝導率が1W/mK以上である請求項1から請求項7のいずれか1項に記載の放熱性回路基板。
- 上記電子部品が発光ダイオードである請求項1から請求項8のいずれか1項に記載の放熱性回路基板。
- 上記プリント配線板の表面が光反射機能を有する請求項9に記載の放熱性回路基板。
- 上記接着剤層の裏面に配置される支持部材を備える請求項1から請求項10のいずれか1項に記載の放熱性回路基板。
- 上記支持部材が、上記プリント配線板の積層領域に湾曲面又は屈曲面を有する請求項11に記載の放熱性回路基板。
- 裏面に配設される絶縁フィルム及び表面に配設される1又は複数のランド部を有するプリント配線板と、上記1又は複数のランド部に実装される1又は複数の電子部品と、上記絶縁フィルムの裏面に積層される接着剤層と、この接着剤層の裏面に配置される支持部材とを備える放熱性回路基板の製造方法であって、
上記1又は複数のランド部に1又は複数の電子部品を実装する工程と、
上記電子部品毎の1又は複数のランド部の投影領域を少なくとも覆う第1領域で上記絶縁フィルムを除去する工程と、
上記絶縁フィルムの裏面に上記第1領域の相当部分を少なくとも除去した接着剤層を積層する工程と、
上記絶縁フィルム及び接着剤層の除去部分に熱伝導性接着剤を充填する工程と、
上記除去部分に熱伝導性接着剤を充填した接着剤層の裏面に支持部材を配置する工程と
を備える放熱性回路基板の製造方法。
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US11934003B2 (en) | 2021-07-28 | 2024-03-19 | Nichia Corporation | Planar light source |
JP2023023889A (ja) * | 2021-08-06 | 2023-02-16 | 日亜化学工業株式会社 | 回路基板及び発光装置並びにそれらの製造方法 |
JP7401791B2 (ja) | 2021-08-06 | 2023-12-20 | 日亜化学工業株式会社 | 回路基板及び発光装置並びにそれらの製造方法 |
US12035481B2 (en) | 2021-08-06 | 2024-07-09 | Nichia Corporation | Circuit board, light emitting device, and manufacturing method thereof |
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JPWO2015059967A1 (ja) | 2017-03-09 |
US20150369467A1 (en) | 2015-12-24 |
CN105009692A (zh) | 2015-10-28 |
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