WO2015050054A1 - 強化ガラス板及びこれを用いた携帯端末 - Google Patents
強化ガラス板及びこれを用いた携帯端末 Download PDFInfo
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- WO2015050054A1 WO2015050054A1 PCT/JP2014/075617 JP2014075617W WO2015050054A1 WO 2015050054 A1 WO2015050054 A1 WO 2015050054A1 JP 2014075617 W JP2014075617 W JP 2014075617W WO 2015050054 A1 WO2015050054 A1 WO 2015050054A1
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- tempered glass
- hole
- less
- glass
- infrared
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
Definitions
- ⁇ ⁇ ⁇ ⁇ Devices such as mobile phones, digital cameras, and mobile terminals are widely used and are becoming increasingly popular.
- a resin substrate made of acrylic or the like has been used as a protective member for protecting the display.
- the acrylic resin substrate has a low Young's modulus, it tends to bend when the display surface of the display is pressed with a pen or a human finger, and the resin substrate may come into contact with the internal display and display defects may occur. there were.
- the acrylic resin substrate has a problem in that the surface is easily scratched and the visibility is easily lowered.
- One method for solving these problems is to use a glass plate as a protective member.
- This glass plate (cover glass) has (1) high mechanical strength, (2) low density and light weight, (3) low cost and a large amount of supply, and (4) excellent foam quality. (5) It is required to have a high light transmittance in the visible range, and (6) to have a high Young's modulus so that it is difficult to bend when the surface is pushed with a pen or a finger. In particular, when the requirement (1) is not satisfied, a glass plate (so-called tempered glass plate) that has been tempered by ion exchange treatment or the like has been conventionally used because the use as a protective member is insufficient.
- the present invention has been made in view of the above circumstances, and its technical problem is to create a tempered glass that is suitable for protecting displays and the like and transmits infrared rays having a wavelength of 5 to 20 ⁇ m.
- the present inventors have found that the above technical problem can be solved by forming a through-hole penetrating through the surface of the tempered glass (compressive stress layer), and proposed as the present invention.
- the tempered glass of the present invention is characterized in that in the tempered glass having a compressive stress layer on the surface, a through-hole penetrating through the surface is formed.
- the number of “through-holes” is not limited to one, and a plurality of “through-holes” may be used for the purpose of increasing infrared transmittance.
- a through hole 3 penetrating the surface compressive stress layer is formed in the tempered glass (tempered glass plate) 2, and an infrared sensor 4 is disposed below the tempered glass 2.
- a through-hole 3 is formed in an infrared detection region (region colored in gray) 1 in which the light receiving angle of the infrared sensor 4 is within 45 °.
- the infrared transmitting member is preferably formed of any one of oxide glass, chalcogenide glass, halogen glass, silicon, germanium, ZnSe, ZnS, and polyethylene.
- the infrared transmitting member is bonded and fixed in the through hole with an adhesive.
- the infrared transmitting member is preferably fixed in the through hole by softening deformation of the infrared transmitting member and / or the tempered glass.
- the total area of the openings of the through holes on one surface is preferably 0.1 to 100 mm 2 .
- the total area of the openings of the through holes refers to the total of the areas when there are a plurality of through holes.
- the ratio of [total area of through-hole openings on one surface (mm 2 )] / [thickness (mm)] is preferably 0.5 to 800.
- the inner peripheral surface of the through hole is preferably a tapered surface.
- the inner peripheral surface of the through-hole is a tapered surface, and the surface of the tempered glass on the side where the area of the opening of the through-hole is small is arranged upward, and the through-hole
- an infrared transmitting member is disposed inside, and the infrared transmitting member is supported by a support member from below the through hole.
- the tempered glass of the present invention preferably has a compressive stress layer on the inner peripheral surface of the through hole. If it does in this way, it will become difficult for a tempered glass to start from a through-hole and to be damaged.
- the tempered glass of the present invention has a flat plate shape and a plate thickness of 2 mm or less.
- the mobile terminal of the present invention is provided with an infrared sensor so as to correspond to the position of the through hole.
- the tempered glass of the present invention has a compressive stress layer on the surface.
- a method for forming a compressive stress layer on the surface there are a physical strengthening method and a chemical strengthening method.
- the tempered glass of the present invention preferably forms a compressive stress layer on the surface by a chemical tempering method.
- a chemical tempering method a method of introducing alkali ions having a large ion radius to the surface by ion exchange at a temperature below the strain point, that is, ion exchange treatment is preferable. If it is an ion exchange process, even if the thickness of glass is thin, a compressive-stress layer can be appropriately formed on the surface, and as a result, desired mechanical strength can be ensured. Furthermore, even if the tempered glass is cut after the compression stress layer is formed on the surface, the tempered glass is not easily broken as in a physical tempering method such as an air cooling tempering method.
- the total area of the opening of the through hole is 100 mm 2 or less, 50 mm 2 or less, 30 mm 2 or less, 20 mm 2 or less, 15 mm 2 or less, 10 mm 2 or less, 5 mm 2 or less, 2 mm 2 or less or 1 mm 2 or less, particularly preferably 0.5 mm 2 or less.
- the smaller the total area of the opening of the through hole the more difficult it is to visually recognize the through hole, and it is difficult to impair the design of the mobile terminal and the like, and it is difficult for dust and moisture to enter the device from the through hole. Reliability of portable terminals and the like is improved.
- the total area of the openings of the through holes is too small, infrared rays are difficult to transmit through the tempered glass.
- the total area of the openings of the through holes on one surface may not be the same as the total area of the openings of the through holes on the other surface.
- the inner peripheral surface of the through-hole may be a tapered surface, and the direction in which the total area of the opening becomes larger may be the infrared sensor side, and the direction in which the total area of the opening becomes smaller may be the viewing side (outside). If it does in this way, while design property, such as a portable terminal, will not be impaired easily, dust, a water
- the ratio of [total area of through-hole openings on one surface (mm 2 )] / [thickness (mm)] is preferably 0.5 or more, 1 or more, 3 or more, 5 Or more, 10 or more, particularly preferably 15 or more.
- the ratio of [total area of through-hole openings on one surface (mm 2 )] / [thickness (mm)] is too small, infrared rays hardly pass through the tempered glass.
- the ratio of [total area (mm 2 ) of openings of through holes on one surface] / [thickness (mm)] is preferably 800 or less, 600 or less, 500 or less, 300 or less, or 200 or less, particularly preferably.
- oxide glass such as oxide glass, chalcogenide glass, and halogen glass, metal such as silicon and germanium, crystal such as ZnSe and ZnS, and resin such as polyethylene
- oxide-based glass is preferable from the viewpoints of appearance and mechanical strength.
- the oxide-based glass preferably has, as a glass composition, one or more of TeO 2 , Bi 2 O 3 , Al 2 O 3 , and TiO 2 as main components, and the total amount of the above components is 20 mol% or more. In particular, 30 mol% or more is preferable.
- alkali metal oxides alkaline earth metal oxides, ZnO, rare earth oxides, and the like can be added to promote vitrification.
- SiO 2 , B 2 O 3 , and P 2 O 5 are components that promote vitrification but reduce infrared transmittance. Therefore, the total amount of these components is preferably less than 5 mol%, particularly preferably less than 1 mol%.
- the surface of the infrared transmissive member is preferably disposed so as to be flush with the surface of the tempered glass that should be viewed, and also prevents the infrared transmissive member from being damaged.
- the surface of the infrared transmitting member is located at a position on the deeper side of the through-hole than the surface that should be the viewing side of the tempered glass (preferably a position on the deep side of 10 ⁇ m or more, particularly preferably a position on the deep side of 100 ⁇ m or more). It is also preferable to arrange them as follows.
- the infrared transmitting member is preferably fixed in the through hole. In this way, it is possible to prevent the infrared transmitting member from falling off the tempered glass.
- an inorganic material such as a two-component mixed system, an organic resin such as a UV curing system, a low-melting glass, or a ceramic as the adhesive. If an organic resin is used, the bonding operation is facilitated.
- Adhesives that are consistent other member and refractive index, and particularly preferably equal to the refractive index n d of tempered glass ( ⁇ 0.5).
- the adhesive is preferably transparent. When the transparent adhesive is used, the through hole is hardly visually recognized, so that the design of the mobile terminal or the like is hardly impaired.
- the infrared transmitting member may be fixed in the through hole by softening and deforming the infrared transmitting member and / or the tempered glass (preferably the infrared transmitting member). In this way, no adhesive is required. Further, the inner peripheral surface of the through hole is processed into a tapered surface, and the surface of the tempered glass on the side where the area of the opening of the through hole is small is disposed upward, and then the infrared transmitting member is inserted into the through hole from below. The infrared transmitting member can be supported by the support member from below the through hole.
- SiO 2 is a component that forms a network of glass.
- the content of SiO 2 is preferably 40 to 71%, 40 to 70%, 40 to 65%, 45 to 65% or 55 to 64%, particularly preferably 55 to 62%. If the content of SiO 2 is too large, the meltability and moldability are likely to be lowered, or the thermal expansion coefficient is too low, so that it is difficult to match the thermal expansion coefficient with the surrounding materials. On the other hand, if the content of SiO 2 is too small, it becomes difficult to vitrify. In addition, the thermal expansion coefficient increases, and the thermal shock resistance of the glass tends to decrease.
- Al 2 O 3 is a component that increases ion exchange performance, strain point, and Young's modulus.
- the content of Al 2 O 3 is preferably 3 to 30%.
- the thermal expansion coefficient becomes too low, and it becomes difficult for the peripheral material and the thermal expansion coefficient to be matched, or the high-temperature viscosity becomes high and the meltability tends to decrease.
- the content of Al 2 O 3 is too small, resulting is a possibility which can not be sufficiently exhibited ion exchange performance.
- the preferable upper limit range of Al 2 O 3 is 28% or less, 26% or less, 24% or less or 22% or less, particularly 19% or less. Further, the preferable lower limit range is 7.5% or more, 11% or more, 12% or more, 15% or more, 16% or more, or 17% or more, particularly 18% or more.
- the content of Li 2 O is preferably 0 to 10%, 0 to 3.5%, 0 to 2%, 0 to 1% or 0 to 0.5%, particularly preferably 0 to 0.1%. It is desirable that it is not substantially contained, that is, suppressed to less than 0.01%.
- Na 2 O is an ion exchange component and a component that lowers the high-temperature viscosity and improves the meltability and moldability.
- Na 2 O is also a component that improves devitrification resistance.
- the content of Na 2 O is preferably 7 to 20%, 10 to 20%, 10 to 19%, 12 to 19%, 12 to 17% or 13 to 17%, particularly preferably 14 to 17%.
- the thermal expansion coefficient becomes too high, or the thermal shock resistance decreases, the peripheral material and the coefficient of thermal expansion is hardly consistent.
- the strain point is excessively lowered, the balance of the glass composition is lacking, and the devitrification resistance is lowered.
- too small content of Na 2 O lowered the melting property, become too coefficient of thermal expansion is low, it tends to decrease the ion exchange performance.
- K 2 O has an effect of promoting ion exchange, and has a large effect of increasing the stress depth among alkali metal oxides. Moreover, it is a component which reduces high temperature viscosity and improves meltability and moldability. It is also a component that improves devitrification resistance.
- the content of K 2 O is preferably 0 to 15%. When the content of K 2 O is too large, the thermal expansion coefficient becomes high, or the thermal shock resistance is lowered, the peripheral material and the coefficient of thermal expansion is hardly consistent. Further, the strain point is excessively lowered or the balance of the glass composition is lost, and the devitrification resistance of the glass tends to be lowered. Therefore, the preferable upper limit range of K 2 O is 12% or less, 10% or less, 8% or less, 6% or less, 5% or less, 4% or less, or 3% or less, particularly 2% or less.
- the total amount of the alkali metal oxide R 2 O (R is one or more selected from Li, Na, K) is too large, the glass tends to devitrify, and the thermal expansion coefficient becomes too high. Thermal shock resistance decreases, and it becomes difficult to match the thermal expansion coefficient with the surrounding materials. Further, there is a case where when the total content of R 2 O is too large, the strain point excessively lowers, not obtain a high compression stress value. Furthermore, the viscosity in the vicinity of the liquidus temperature may decrease, making it difficult to ensure a high liquidus viscosity. Therefore, the total amount of R 2 O is preferably 22% or less or 20% or less, and particularly preferably 19% or less.
- the total amount of R 2 O is preferably 8% or more, 10% or more, or 13% or more, and particularly preferably 15% or more.
- the mass ratio K 2 O / Na 2 O is preferably 0-2.
- the mass ratio K 2 O / Na 2 O is preferably regulated to 0 to 0.5, particularly 0 to 0.3 or 0 to 0.2.
- the mass ratio K 2 O / Na 2 O is set to 0.3-2, 0.5-2. It is preferable to regulate to 1, 2 or 1.2 to 2, particularly 1.5 to 2.
- the mass ratio K 2 O / Na 2 O is too large, lacks the balance of the composition of the glass, tends glass devitrified.
- Alkaline earth metal oxide R′O (R ′ is one or more selected from Mg, Ca, Sr, and Ba) is a component that can be introduced for various purposes.
- R′O is preferably 0 to 9.9%, 0 to 8% or 0 to 6%, particularly preferably 0 to 5%.
- MgO is a component that lowers the high-temperature viscosity to increase meltability and moldability, and increases the strain point and Young's modulus.
- MgO has a large effect of improving ion exchange performance among alkaline earth metal oxides.
- the MgO content is preferably 0 to 6%.
- the content of MgO is preferably 4% or less, 3% or less, or 2% or less, and particularly preferably 1.5% or less.
- CaO is a component that increases the strain point and Young's modulus as well as lowering the high-temperature viscosity to increase meltability and moldability.
- CaO has a large effect of improving ion exchange performance among alkaline earth metal oxides.
- the CaO content is preferably 0 to 6%.
- the content of CaO is preferably 4% or less, 3% or less, 2% or less, 1% or less, or less than 1%, particularly preferably 0.5% or less.
- SrO is a component that lowers the high-temperature viscosity to increase the meltability and moldability, and also increases the strain point and Young's modulus.
- the content of SrO is preferably 3% or less, 2% or less, 1.5% or less, 1% or less, 0.5% or less or 0.2% or less, particularly preferably 0.1% or less. .
- ZnO is a component that enhances ion exchange performance, and is particularly a component that has a large effect of increasing the compressive stress value. Moreover, it is a component which has the effect of reducing high temperature viscosity, without reducing low temperature viscosity.
- the ZnO content is preferably 8% or less, 6% or less, or 4% or less, and particularly preferably 3% or less.
- the mass ratio R′O / R 2 O is preferably 0.5 or less or 0.4 or less, particularly preferably 0.3 or less. If the mass ratio R′O / R 2 O is too large, the devitrification resistance tends to be lowered.
- SnO 2 has the effect of increasing the ion exchange performance, particularly the compressive stress value.
- the SnO 2 content is preferably 0.01 to 3% or 0.01 to 1.5%, particularly preferably 0.1 to 1%.
- ZrO 2 is a component that increases ion exchange performance, Young's modulus, and strain point, and lowers high-temperature viscosity. It also has the effect of increasing the viscosity in the vicinity of the liquid phase viscosity. For this reason, when a predetermined amount of ZrO 2 is introduced, the ion exchange performance and the liquid phase viscosity can be simultaneously increased. However, when the content of ZrO 2 is too high, there are cases where the devitrification resistance is extremely lowered. Therefore, the content of ZrO 2 is preferably 0 to 10%, 0.001 to 10%, 0.1 to 9%, 0.5 to 7% or 1 to 5%, particularly preferably 2.5 to 5%. %.
- B 2 O 3 is a component that lowers the liquidus temperature, high-temperature viscosity, and density, and is a component that increases ion exchange performance, particularly the compressive stress value.
- the content of B 2 O 3 is preferably 0 to 6% or 0 to 4%, particularly preferably 0 to 3%.
- TiO 2 is a component that enhances ion exchange performance. It is also a component that lowers the high temperature viscosity. However, when the content of TiO 2 is too large, or glass is colored, lowered resistance to devitrification, the density is high. In particular, when used for a cover glass of a display, when the content of TiO 2 is increased, the transmittance is likely to change when the melting atmosphere or the raw material is changed. Therefore, in the process of bonding the tempered glass to the device using light such as an ultraviolet curable resin, the ultraviolet irradiation conditions are likely to fluctuate, making it difficult to stably produce the device.
- light such as an ultraviolet curable resin
- the content of TiO 2 is preferably 10% or less, 8% or less, 6% or less, 5% or less, 4% or less, 2% or less, 0.7% or less, 0.5% or less, or 0.1% % Or less, particularly preferably 0.01% or less.
- P 2 O 5 is a component that improves ion exchange performance, and in particular, a component that increases the stress depth.
- the content of P 2 O 5 is preferably 5% or less, 4% or less, or 3% or less, and particularly preferably 2% or less.
- the fining agent it is preferable to introduce 0.001 to 3% of one or more selected from the group of As 2 O 3 , Sb 2 O 3 , CeO 2 , F, SO 3 , and Cl.
- the content of As 2 O 3 is preferably less than 0.1%, particularly preferably less than 0.01%, and the content of Sb 2 O 3 is preferably 0.1%.
- CeO 2 is a component that decreases the transmittance. Therefore, the content of CeO 2 is preferably less than 0.1%, particularly preferably less than 0.01%.
- F is a component that lowers the low temperature viscosity and lowers the compressive stress value.
- the content of F is preferably less than 0.1%, particularly preferably less than 0.01%.
- Particularly preferred fining agents are SO 3 and Cl, and one or both of SO 3 and Cl is 0.001 to 3%, 0.001 to 1%, or 0.01 to 0.5%, especially 0. It is preferable to introduce 05 to 0.4%.
- Rare earth oxides such as Nd 2 O 3 and La 2 O 3 are components that increase the Young's modulus. However, the cost of the raw material itself is high, and if it is introduced in a large amount, the devitrification resistance tends to decrease. Therefore, the rare earth oxide content is preferably 3% or less, 2% or less, 1% or less, or 0.5% or less, and particularly preferably 0.1% or less.
- Transition metal elements such as CoO 3 and NiO are components that reduce the transmittance.
- the content of the transition metal element is preferably 0.5% or less or 0.1% or less, particularly preferably 0.05% or less.
- PbO and Bi 2 O 3 are each preferably limited to a content of less than 0.1% in consideration of the environment.
- the tempered glass of the present invention has a compressive stress layer on the surface.
- the stress value of the compressive stress layer on the surface is preferably 200 MPa or more, 300 MPa or more, 500 MPa or more, 600 MPa or more, 700 MPa or more, 800 MPa or more, 900 MPa or more, or 1000 MPa or more, particularly preferably 1100 MPa or more.
- the greater the stress value of the compressive stress layer the higher the mechanical strength of the tempered glass.
- microcracks are generated on the surface, which may lower the mechanical strength. Further, the stress value of the tensile stress layer inherent in the tempered glass may become extremely high.
- the stress value of the compressive stress layer is preferably 2500 MPa or less or 2000 MPa or less, and particularly preferably 1500 MPa or less.
- the content of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, ZnO, SnO 2 may be increased, or the content of SrO, BaO may be reduced.
- the ion exchange time may be shortened or the temperature of the ion exchange solution may be lowered.
- the stress depth of the compressive stress layer on the surface is preferably 5 ⁇ m or more, 10 ⁇ m or more, 15 ⁇ m or more, 20 ⁇ m or more, or 30 ⁇ m or more, particularly preferably 40 ⁇ m or more.
- the greater the stress depth the more difficult it is to break the tempered glass even if the tempered glass is deeply damaged.
- the stress depth of the compressive stress layer is too large, it becomes difficult to cut the tempered glass, or the stress value of the internal tensile stress layer becomes extremely high, and the tempered glass is easily damaged by mechanical impact.
- the stress value of the internal tensile stress layer is preferably 200 MPa or less, 150 MPa or less or 100 MPa or less, particularly preferably 50 MPa or less.
- the tempered glass of the present invention preferably has a flat plate shape, in which case the plate thickness is preferably 2 mm or less, 1.5 mm or less, 1.3 mm or less, 1.1 mm or less, 0.9 mm or less, 0.7 mm or less, 0 0.5 mm or less or 0.4 mm or less, particularly preferably 0.05 to 0.3 mm.
- molding a glass plate by the overflow down-draw method even if it does not grind
- the tempered glass of the present invention preferably has an unpolished surface, and the average surface roughness Ra of the unpolished surface is preferably 10 mm or less, 5 mm or less, 4 mm or less, or 3 mm or less, particularly preferably 2 mm or less.
- the average surface roughness Ra of the surface can be measured by a method based on, for example, SEMI D7-97 “Measurement method of surface roughness of FPD glass plate”.
- the theoretical strength of glass is inherently very high, but breakage often occurs even at a stress much lower than the theoretical strength. This is because a small defect called Griffith flow is generated on the surface of the glass in a post-molding process such as a polishing process.
- Liquidus viscosity preferably of 10 4.0 dPa ⁇ s or more, 10 4.3 dPa ⁇ s or more, 10 4.5 dPa ⁇ s or more, 10 5.0 dPa ⁇ s or more, 10 5.4 dPa ⁇ s 10 5.8 dPa. s or more or 10 6.0 dPa ⁇ s or more, particularly preferably 10 6.2 dPa ⁇ s or more.
- the content of Na 2 O or K 2 O may be increased, or the content of Al 2 O 3 , Li 2 O, MgO, ZnO, TiO 2 or ZrO 2 may be reduced. .
- the liquidus temperature is 1200 ° C. or less, if the liquidus viscosity of 10 4.0 dPa ⁇ s or more, it is possible to form the glass sheet by an overflow down draw method.
- the “liquid phase temperature” is obtained by passing the glass powder that passes through a standard sieve 30 mesh (a sieve opening of 500 ⁇ m) and remains in 50 mesh (a sieve opening of 300 ⁇ m) into a platinum boat and puts it in a temperature gradient furnace for 24 hours. This is a value obtained by measuring the temperature at which crystals are deposited.
- “Liquid phase viscosity” refers to the viscosity of the glass at the liquidus temperature.
- the density is preferably 2.8 g / cm 3 or less or 2.6 g / cm 3 or less, particularly preferably 2.5 g / cm 3 or less.
- density refers to a value measured by the well-known Archimedes method. In order to decrease the density, the content of SiO 2 , P 2 O 5 , B 2 O 3 is increased, or the content of alkali metal oxide, alkaline earth metal oxide, ZnO, ZrO 2 , TiO 2 is included. The amount may be reduced.
- the “density” can be measured by a known Archimedes method.
- the thermal expansion coefficient in the temperature range of 30 to 380 ° C. is preferably 70 to 110 ⁇ 10 ⁇ 7 / ° C., 75 to 110 ⁇ 10 ⁇ 7 / ° C. or 80 to 105 ⁇ 10 ⁇ 7 / ° C., particularly preferably 85 to 100 ⁇ 10 ⁇ 7 / ° C.
- thermal expansion coefficient in a temperature range of 30 to 380 ° C.” refers to a value obtained by measuring an average thermal expansion coefficient using a dilatometer.
- the strain point is preferably 500 ° C or higher, 510 ° C or higher, 520 ° C or higher, 540 ° C or higher, 550 ° C or higher, 560 ° C or higher, 580 ° C or higher, or 600 ° C or higher, particularly preferably 620 ° C or higher.
- the strain point is higher, the heat resistance is improved, and even if the tempered glass is subjected to a heat treatment, the compressive stress is hardly lost. Further, when the strain point becomes high, it becomes difficult for stress relaxation to occur in the ion exchange treatment, and it becomes easy to secure a high compressive stress value.
- the content of alkaline earth metal oxide, Al 2 O 3 , ZrO 2 , P 2 O 5 may be increased, or the content of alkali metal oxide may be reduced.
- the “strain point” is a measured value based on the method of ASTM C336.
- the temperature at 10 2.5 dPa ⁇ s is preferably 1650 ° C. or lower, 1500 ° C. or lower, 1450 ° C. or lower, 1430 ° C. or lower, or 1420 ° C. or lower, particularly preferably 1400 ° C. or lower.
- the temperature at 10 2.5 dPa ⁇ s corresponds to the melting temperature, and the lower the temperature at 10 2.5 dPa ⁇ s, the more the glass can be melted. Therefore, the lower the temperature at 10 2.5 dPa ⁇ s, the smaller the load on glass manufacturing equipment such as a melting furnace, and the higher the bubble quality of the glass. As a result, glass can be manufactured at low cost.
- temperature at 10 2.5 dPa ⁇ s In order to decrease the temperature at 10 2.5 dPa ⁇ s, the content of alkali metal oxide, alkaline earth metal oxide, ZnO, B 2 O 3 , TiO 2 is increased, or SiO 2 , Al The content of 2 O 3 may be reduced.
- temperature at 10 2.5 dPa ⁇ s refers to a value measured by a platinum ball pulling method.
- the Young's modulus is preferably 70 GPa or more or 73 GPa or more, and particularly preferably 75 GPa or more.
- the higher the Young's modulus the smaller the amount of deformation when the surface of the cover glass is pushed with a pen, finger, or the like when using it for the cover glass of the display, thereby reducing damage to the internal display.
- the “Young's modulus” can be measured by a known resonance method.
- the glass according to the present invention has a through-hole penetrating through the surface, and is used for a strengthening treatment.
- the glass composition is SiO 2 40 to 71% by mass, Al 2 O 3 3 to 3 % by mass. It preferably contains 30%, Li 2 O 0-3.5%, Na 2 O 7-20%, K 2 O 0-15%, SiO 2 40-71%, Al 2 O 3 7.5- 25%, Li 2 O 0-2%, Na 2 O 10-19%, K 2 O 0-15%, MgO 0-6%, CaO 0-6%, SrO 0-3%, BaO 0-3% ZnO 0 to 8%, SnO 2 0.01 to 3% is more preferable, SiO 2 40 to 71%, Al 2 O 3 13 to 25%, Li 2 O 0 to 1%, Na 2 O 10-19%, K 2 O 0-10%, MgO 0-6%, CaO 0-6%, SrO 0- More preferably, it contains 3%, BaO 0 to 3%, ZnO 0 to
- the glass according to the present invention is obtained by, for example, putting a glass raw material prepared so as to have a desired glass composition into a continuous melting furnace, heating and melting at 1500 to 1600 ° C., clarification, and supplying to a molding apparatus. It can be produced by forming into a shape and slowly cooling.
- the overflow down draw method is a method in which molten glass is overflowed from both sides of a heat-resistant bowl-shaped structure, and the overflowed molten glass is merged at the lower top end of the bowl-shaped structure and stretched downward. This is a method for producing a glass plate.
- the structure and material of the bowl-shaped structure are not particularly limited as long as the dimensions and surface accuracy of the glass plate can be set to a desired state and the quality usable for the glass plate can be realized.
- the method of extending and forming downward is not particularly limited. For example, a method of rotating and stretching a heat-resistant roll having a sufficiently large width in contact with the glass ribbon may be adopted, or a plurality of pairs of heat-resistant rolls may be used only near the end face of the glass ribbon. A method of stretching by contacting with the substrate may be adopted.
- a molding method other than the overflow downdraw method can be adopted.
- a molding method such as a downdraw method (slot down method, redraw method, etc.), a float method, a rollout method, or a press method can be adopted.
- a glass plate is formed by a press method, a small glass plate can be efficiently produced.
- the tempered glass of the present invention can be produced by forming molten glass and forming glass, and then forming through holes in the obtained glass and performing tempering treatment.
- the time for cutting the glass into a predetermined size may be before the tempering treatment, but if it is after the tempering treatment, the production cost can be reduced.
- the strengthening treatment is preferably an ion exchange treatment, and the ion exchange treatment can be performed, for example, by immersing the glass in KNO 3 molten salt at 400 to 550 ° C. for 1 to 8 hours.
- the conditions for the ion exchange treatment may be selected in consideration of the viscosity characteristics, application, thickness, internal tensile stress, etc. of the glass.
- the timing for forming the through-hole may be after the strengthening treatment, but if it is before the strengthening treatment, compressive stress can be formed on the inner peripheral surface of the through-hole by the strengthening treatment. Strength can be increased.
- a method of forming a through-hole penetrating the surface through the glass For example, an initial crack is formed on the surface of the glass with a laser so as to have a desired through hole shape, and then rapidly cooled, and the initial crack propagates in the thickness direction of the glass and penetrates in the thickness direction of the glass. A method can be adopted.
- the surface of the glass is irradiated with a short pulse laser (for example, a femtosecond laser) so as to obtain a desired through-hole shape, and component volatilization is promoted in the thickness direction of the irradiated portion.
- a method of forming can also be adopted. In this way, minute through holes can be formed efficiently.
- the glass is immersed in an etching solution, and the part not subjected to the masking process is dissolved by etching to form a through hole. It is also possible to adopt a method to do so. If it does in this way, the inner peripheral surface of a through-hole will become smooth and a crack will become difficult to advance from a through-hole. Furthermore, a method of forming a through-hole penetrating through the surface of the glass with a drill having a predetermined shape can be adopted.
- the through hole is formed by mechanical means, it is preferable to perform etching, fire polishing, polishing or the like on the inner peripheral surface of the through hole. If it does in this way, the crack source which exists in the internal peripheral surface of a through-hole can be reduced, and it becomes difficult for a crack to advance from a through-hole.
- an infrared transmitting member may be disposed in the through hole as necessary.
- the infrared transmitting member may be fitted as it is, but it is preferable that the infrared transmitting member is bonded and fixed in the through hole through the adhesive as described above.
- the portable terminal of the present invention is characterized by comprising the above-mentioned tempered glass.
- an infrared sensor is disposed so as to correspond to the position of the through hole formed in the tempered glass. In this way, a small amount of infrared rays emitted from the human body can pass through the through hole and be detected by the infrared sensor.
- a speaker is further arranged so as to correspond to the position of the through hole formed in the tempered glass. If it does in this way, it will become easy to detect voice information with a speaker. Furthermore, in the portable terminal of the present invention, it is preferable that both the infrared sensor and the speaker are arranged so as to correspond to the position of the through hole. In this way, the number of through holes is reduced, and the drilling process can be simplified.
- FIG. 2 is a schematic view of the surface of tempered glass (tempered glass plate) as viewed from above.
- tempered glass tempered glass plate
- two through holes 6 and 7 are formed in the tempered glass 5 so as to pass through the compressive stress layer on the surface, and the infrared sensor 8 corresponds to the position of one through hole 6.
- a speaker 9 is arranged so as to correspond to the position of the other through hole 7.
- one through hole 11 is formed in the tempered glass 10 so as to pass through the surface compressive stress layer, and the infrared sensor 12 and the speaker 13 are both connected to correspond to the position of the through hole 11. Has been placed.
- Table 1 shows sample No. 1 to 9 are shown.
- Each sample was prepared as follows. First, the glass raw material was prepared so that it might become the glass composition in a table
- the density is a value measured by the well-known Archimedes method.
- strain point Ps and the annealing point Ta are measured values based on the method of ASTM C336.
- the softening point Ts is a measured value based on the method of ASTM C338.
- the liquid phase temperature TL passes through a standard sieve 30 mesh (a sieve opening of 500 ⁇ m), puts the glass powder remaining in 50 mesh (a sieve opening of 300 ⁇ m) in a platinum boat, and holds it in a temperature gradient furnace for 24 hours. This is a value obtained by measuring the temperature at which crystals precipitate.
- the liquid phase viscosity log ⁇ TL indicates the viscosity of each glass at the liquid phase temperature.
- the Young's modulus is a value measured by a bending resonance method.
- the thermal expansion coefficient ⁇ is a value obtained by measuring an average thermal expansion coefficient in a temperature range of 30 to 380 ° C. using a dilatometer.
- each sample was immersed in 3 tanks of KNO held at 430 ° C. for 4 hours to perform ion exchange treatment. After the ion exchange treatment, the stress value CS and the stress depth DOL of the compressive stress layer on the surface were measured. The stress value CS and stress depth DOL of the compressive stress layer were calculated by observing the number of interference fringes and their intervals using a surface stress meter (FSM-6000 manufactured by Toshiba Corporation). In the calculation, the sample No. No. 1 has a refractive index of 1.52 and an optical elastic constant of 28 [(nm / cm) / MPa].
- FIG. 3 is a diagram showing dimensions of through holes formed in the tempered glass plate in [Example 2].
- sample No. The material of No. 2 was used.
- a tempered glass plate having a through-hole can be produced in the same manner with the materials of 1, 3 to 9.
- TeO 2 -based glass contains 80 mol% TeO 2 and 20 mol% ZnO as a glass composition, has a disk shape with a diameter of 4.9 mm and a thickness of 0.5 mm, and both surfaces are mirror-finished.
- the outer peripheral side surface of the infrared transmitting member is finished to be a mirror surface in appearance.
- the TeO 2 type mounting of glass after placing a disc-shaped TeO 2 type glass in the center position of the through hole, injecting a UV-curable resin into the gap between the through-hole, UV curable resin by UV light was cured to adhere and fix TeO 2 -based glass in the through hole.
- the adhesive protrudes from the through hole, it is preferably removed before UV curing or removed by mechanical polishing after UV curing.
- FIG. 4 is a conceptual cross-sectional view showing an embodiment according to [Example 4].
- the tempered glass plate 21 is formed with a through hole 22 that passes through the surface compressive stress layer and an infrared sensor 23 is disposed below the through hole 22.
- the inner peripheral surface of the through-hole 22 is a taper surface, and while the surface of the tempered glass board 21 with the small hole area of the through-hole 22 is arranged above, the reinforcement with the large hole area of the through-hole 22 is strengthened.
- the surface of the glass plate 21 is arrange
- Example 5 Except that the thickness of the TeO 2 type glass to 0.4mm, in the same manner as Example 3 was bonded and fixed to TeO 2 type glass in the through hole.
- the thickness of the TeO 2 -based glass since the thickness of the TeO 2 -based glass is thin, the surface of the TeO 2 -based glass is positioned 100 ⁇ m deeper than the surface that should be the viewing side of the tempered glass (from the surface). Both were to be bonded and fixed so that the height position was lower by 100 ⁇ m.
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Abstract
Description
2、5、10 強化ガラス
3、6、7、11、22、32 貫通孔
4、8、12、23、33 赤外線センサー
9、13 スピーカー
21、31 強化ガラス板
24、34 赤外線透過部材
25 支持部材
36 視認側になるべき表面
Claims (18)
- 表面に圧縮応力層を有する強化ガラスにおいて、
表面を通過して貫通する貫通孔が形成されていることを特徴とする強化ガラス。 - 貫通孔が赤外線センサーを動作させるために形成されていることを特徴とする請求項1に記載の強化ガラス。
- 貫通孔内に赤外線透過部材が配置されていることを特徴とする請求項1又は2に記載の強化ガラス。
- 赤外線透過部材が、酸化物系ガラス、カルコゲナイド系ガラス、ハロゲン系ガラス、シリコン、ゲルマニウム、ZnSe、ZnS、ポリエチレンの何れかにより形成されていることを特徴とする請求項3に記載の強化ガラス。
- 赤外線透過部材が、貫通孔内に、接着剤により接着固定されていることを特徴とする請求項3又は4に記載の強化ガラス。
- 赤外線透過部材が、赤外線透過部材及び/又は強化ガラスの軟化変形により、貫通孔内に固定されていることを特徴とする請求項3又は4に記載の強化ガラス。
- 赤外線透過部材が、強化ガラスの視認側になるべき表面よりも貫通孔の奥側の位置で固定されていることを特徴とする請求項4~6の何れかに記載の強化ガラス。
- 一方の表面における貫通孔の開口部の総面積が0.1~100mm2であることを特徴とする請求項1~7の何れかに記載の強化ガラス。
- [一方の表面における貫通孔の開口部の総面積(mm2)]/[厚み(mm)]の比率が0.5~800であることを特徴とする請求項1~8の何れかに記載の強化ガラス。
- 貫通孔の内周面がテーパー面であることを特徴とする請求項1~9の何れかに記載の強化ガラス。
- 貫通孔の内周面がテーパー面であり、該貫通孔の開口部の面積が小さい側の強化ガラスの表面を上方に配置すると共に、該貫通孔内に赤外線透過部材を配置し、更に該赤外線透過部材を該貫通孔の下方から支持部材により支持することを特徴とする請求項10に記載の強化ガラス。
- 貫通孔の内周面に圧縮応力層を有することを特徴とする請求項1~11の何れかに記載の強化ガラス。
- 平板形状であり、且つ板厚が2mm以下であることを特徴とする請求項1~12の何れかに記載の強化ガラス。
- 表面の圧縮応力層の応力値が200MPa以上であり、且つ表面の圧縮応力層の応力深さが5μm以上であることを特徴とする請求項1~13の何れかに記載の強化ガラス。
- ガラス組成として、質量%で、SiO2 40~71%、Al2O3 3~30%、Li2O 0~10%、Na2O 7~20%、K2O 0~15%を含有することを特徴とする請求項1~14の何れかに記載の強化ガラス。
- 請求項1~15の何れかに記載の強化ガラスを備えることを特徴とする携帯端末。
- 貫通孔の位置に対応するように、赤外線センサーが配置されていることを特徴とする請求項16に記載の携帯端末。
- 貫通孔の位置に対応するように、更にスピーカーが配置されていることを特徴とする請求項17に記載の携帯端末。
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US15/021,288 US10252935B2 (en) | 2013-10-03 | 2014-09-26 | Tempered glass plate and portable terminal using same |
CN201480031460.9A CN105263878A (zh) | 2013-10-03 | 2014-09-26 | 强化玻璃板以及使用了该强化玻璃板的便携终端 |
KR1020157032885A KR102152046B1 (ko) | 2013-10-03 | 2014-09-26 | 강화유리판 및 이것을 사용한 휴대단말 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107979660A (zh) * | 2016-10-24 | 2018-05-01 | 宇龙计算机通信科技(深圳)有限公司 | 一种具有内雕图案的手机玻璃盖板及其制备工艺和移动终端 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6372649B2 (ja) * | 2014-04-10 | 2018-08-15 | 日本電気硝子株式会社 | ディスプレイ用保護部材及びこれを用いた携帯端末 |
JP6631775B2 (ja) * | 2014-08-11 | 2020-01-15 | 日本電気硝子株式会社 | 赤外線透過ガラス |
JP6591837B2 (ja) * | 2015-09-10 | 2019-10-16 | 旭化成エレクトロニクス株式会社 | 電子機器及びその赤外線センサ |
JP6701547B2 (ja) * | 2015-11-19 | 2020-05-27 | 日本電気硝子株式会社 | ディスプレイ用保護部材及びこれを用いた携帯端末 |
DE202016008995U1 (de) * | 2015-12-11 | 2021-04-20 | Corning Incorporated | Durch Fusion bildbare glasbasierte Artikel mit einem Metalloxidkonzentrationsgradienten |
WO2018110224A1 (ja) * | 2016-12-16 | 2018-06-21 | 日本電気硝子株式会社 | 球状ガラス及びガラス転動体の製造方法 |
CN108101361B (zh) * | 2016-12-30 | 2021-07-06 | 东旭光电科技股份有限公司 | 一种硅酸盐制品及其强化方法 |
JP7129997B2 (ja) | 2017-01-18 | 2022-09-02 | コーニング インコーポレイテッド | 応力プロファイルが操作されたガラス系物品およびその製造方法 |
CN107200469A (zh) * | 2017-06-23 | 2017-09-26 | 四川旭虹光电科技有限公司 | 高透光性玻璃板 |
KR102406807B1 (ko) * | 2018-01-04 | 2022-06-13 | 삼성디스플레이 주식회사 | 윈도우 부재 |
KR20200036979A (ko) * | 2018-09-28 | 2020-04-08 | 삼성디스플레이 주식회사 | 윈도우 부재 및 이를 포함하는 전자 장치 |
KR20220024574A (ko) * | 2019-06-20 | 2022-03-03 | 코닝 인코포레이티드 | 유리 리본 제조 방법 및 장치 |
CN115784609A (zh) | 2021-09-09 | 2023-03-14 | 肖特股份有限公司 | 化学强化的玻璃板及其制造方法 |
EP4148025A1 (en) | 2021-09-09 | 2023-03-15 | Schott Ag | Chemically strengthened glass sheet and method for its production |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0843199A (ja) * | 1994-07-29 | 1996-02-16 | Sanyo Electric Co Ltd | 光軸センサ |
WO2009078406A1 (ja) * | 2007-12-18 | 2009-06-25 | Hoya Corporation | 携帯端末用カバーガラス及びその製造方法、並びに携帯端末装置 |
JP2013011568A (ja) * | 2011-06-30 | 2013-01-17 | Seiko Instruments Inc | 光センサ装置 |
JP2013108970A (ja) * | 2011-10-25 | 2013-06-06 | Panasonic Corp | 赤外線検出装置 |
JP2013195293A (ja) * | 2012-03-21 | 2013-09-30 | Asahi Kasei Electronics Co Ltd | 赤外線検出装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU689873B2 (en) | 1994-05-31 | 1998-04-09 | Sanyo Electric Co., Ltd. | Solar lighting apparatus and controller for controlling the solar lighting apparatus |
JP2006083045A (ja) | 2004-09-17 | 2006-03-30 | Hitachi Ltd | ガラス部材 |
US20090013724A1 (en) * | 2006-02-22 | 2009-01-15 | Nippon Sheet Glass Company, Limited | Glass Processing Method Using Laser and Processing Device |
JP2008160648A (ja) * | 2006-12-26 | 2008-07-10 | Hitachi Maxell Ltd | カメラモジュール、撮像装置及び撮像装置の製造方法 |
US8693877B2 (en) * | 2007-03-09 | 2014-04-08 | Apple Inc. | Integrated infrared receiver and emitter for multiple functionalities |
JP2010245920A (ja) * | 2009-04-08 | 2010-10-28 | Jfe Engineering Corp | 防爆型ip携帯電話機 |
CN102844857A (zh) * | 2010-04-20 | 2012-12-26 | 旭硝子株式会社 | 半导体器件贯通电极用的玻璃基板 |
US8393175B2 (en) * | 2010-08-26 | 2013-03-12 | Corning Incorporated | Methods for extracting strengthened glass substrates from glass sheets |
US9434644B2 (en) * | 2010-09-30 | 2016-09-06 | Avanstrate Inc. | Cover glass and method for producing cover glass |
US8539794B2 (en) * | 2011-02-01 | 2013-09-24 | Corning Incorporated | Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets |
JP5649592B2 (ja) * | 2011-02-17 | 2015-01-07 | Hoya株式会社 | 携帯電子機器用カバーガラスのガラス基板の製造方法、携帯電子機器用カバーガラスのガラス基板および携帯電子機器 |
US9725359B2 (en) * | 2011-03-16 | 2017-08-08 | Apple Inc. | Electronic device having selectively strengthened glass |
JP5730241B2 (ja) * | 2011-05-11 | 2015-06-03 | Hoya株式会社 | 電子機器用カバーガラスの製造方法および電子機器用カバーガラスのガラス基板保持具 |
US8649229B2 (en) * | 2011-06-29 | 2014-02-11 | Intel Corporation | Memory module bus termination voltage (VTT) regulation and management |
CN103562997A (zh) * | 2011-06-30 | 2014-02-05 | Hoya株式会社 | 磁盘用玻璃基板及其制造方法 |
JP5943003B2 (ja) * | 2011-12-14 | 2016-06-29 | コニカミノルタ株式会社 | カバーガラスおよびその製造方法 |
US8684613B2 (en) * | 2012-01-10 | 2014-04-01 | Apple Inc. | Integrated camera window |
KR101177322B1 (ko) * | 2012-01-27 | 2012-08-30 | 영보엔지니어링 주식회사 | 크로스오버 이중 스피커 |
TWI592382B (zh) * | 2012-05-30 | 2017-07-21 | 宸鴻科技控股有限公司 | 硬質基板、觸控面板及硬質基板的處理方法 |
KR102047017B1 (ko) * | 2012-10-03 | 2019-11-20 | 코닝 인코포레이티드 | 표면-개질 유리 기판 |
US9346706B2 (en) * | 2012-11-29 | 2016-05-24 | Corning Incorporated | Methods of fabricating glass articles by laser damage and etching |
US20140182392A1 (en) * | 2013-01-02 | 2014-07-03 | Apple Inc. | Apparatus and method for breakage testing of small articles |
US9213102B2 (en) * | 2013-09-11 | 2015-12-15 | Google Technology Holdings LLC | Electronic device with gesture detection system and methods for using the gesture detection system |
-
2014
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0843199A (ja) * | 1994-07-29 | 1996-02-16 | Sanyo Electric Co Ltd | 光軸センサ |
WO2009078406A1 (ja) * | 2007-12-18 | 2009-06-25 | Hoya Corporation | 携帯端末用カバーガラス及びその製造方法、並びに携帯端末装置 |
JP2013011568A (ja) * | 2011-06-30 | 2013-01-17 | Seiko Instruments Inc | 光センサ装置 |
JP2013108970A (ja) * | 2011-10-25 | 2013-06-06 | Panasonic Corp | 赤外線検出装置 |
JP2013195293A (ja) * | 2012-03-21 | 2013-09-30 | Asahi Kasei Electronics Co Ltd | 赤外線検出装置 |
Cited By (2)
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---|---|---|---|---|
CN107979660A (zh) * | 2016-10-24 | 2018-05-01 | 宇龙计算机通信科技(深圳)有限公司 | 一种具有内雕图案的手机玻璃盖板及其制备工艺和移动终端 |
CN107979660B (zh) * | 2016-10-24 | 2021-03-09 | 宇龙计算机通信科技(深圳)有限公司 | 一种具有内雕图案的手机玻璃盖板及其制备工艺和移动终端 |
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KR102152046B1 (ko) | 2020-09-04 |
JP6288499B2 (ja) | 2018-03-07 |
KR20160106003A (ko) | 2016-09-09 |
JP2015091739A (ja) | 2015-05-14 |
US10252935B2 (en) | 2019-04-09 |
US20160221863A1 (en) | 2016-08-04 |
CN105263878A (zh) | 2016-01-20 |
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