WO2015014051A1 - 一种pcb板上的背钻孔的制备方法以及pcb板 - Google Patents

一种pcb板上的背钻孔的制备方法以及pcb板 Download PDF

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Publication number
WO2015014051A1
WO2015014051A1 PCT/CN2013/088042 CN2013088042W WO2015014051A1 WO 2015014051 A1 WO2015014051 A1 WO 2015014051A1 CN 2013088042 W CN2013088042 W CN 2013088042W WO 2015014051 A1 WO2015014051 A1 WO 2015014051A1
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WIPO (PCT)
Prior art keywords
hole
pcb board
metal layer
resin
metal
Prior art date
Application number
PCT/CN2013/088042
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English (en)
French (fr)
Inventor
陈显任
任保伟
Original Assignee
北大方正集团有限公司
珠海方正科技高密电子有限公司
方正信息产业控股有限公司
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Publication date
Application filed by 北大方正集团有限公司, 珠海方正科技高密电子有限公司, 方正信息产业控股有限公司 filed Critical 北大方正集团有限公司
Priority to JP2016530308A priority Critical patent/JP6133507B2/ja
Priority to US14/909,176 priority patent/US9756734B2/en
Priority to EP13890368.7A priority patent/EP3030062B1/en
Publication of WO2015014051A1 publication Critical patent/WO2015014051A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Definitions

  • the present invention relates to the field of electronic product production, and in particular to a method for preparing a back hole on a PCB board and a PCB board.
  • BACKGROUND OF THE INVENTION The application of back drilling is more and more widely used in the current PCB (Printed Circuit Board) industry, especially for electronic products with high signal transmission, back drilling is an important part of PCB design. factor.
  • through holes are needed to realize the connection between the inner layer lines, and the through holes also need to be subjected to copper plating, electroplating, etc., to form a conductive layer in the through holes, thereby realizing the lines between the layers.
  • the connection but some of the through-holes of the PCB board only need to be partially turned on, and the through-holes after the copper-plated and electroplated treatment are all turned on, which causes a problem of the connection of the end portions of the through-holes, which may cause the signal to be folded back. , causing reflection, scattering, delay, etc. of signal transmission, causing "distortion" problems to the signal.
  • the through hole needs to be backdrilled.
  • FIG. 1 to FIG. 1b are schematic diagrams showing the steps of the steps of the preparation method of the back hole drilling on the PCB board in the prior art. As shown in FIG. 1 to FIG.
  • the alkaline etching process mainly includes: opening, inner layer Graphics transfer, browning, pressing the outer layer to form PCB board 01 (as shown in Figure la), drilling 011 (shown in Figure lb), copper sinking and pre-plate plating (copper 02 in the hole is 5 meters thick ⁇ 8 m control, as shown in Figure lc, the thickened layer in the hole, for the convenience of the subsequent, the copper thickened part is not shown), placed the thousand film 03, the outer layer of the basic pattern transfer (as shown in Figure Id), graphic plating (Plating the copper thickness of all holes according to customer requirements, as shown in Figure le), plating tin 04 (as shown in Figure), back drilling (as shown in Figure lg), and removing thousands of wires at the window opening position.
  • Membrane (as shown in Figure lh), alkaline etching (shown in Figure li), etc.
  • alkaline etching is very strict on the thickness of the base copper of the PCB board. Generally, the thickness of the base copper needs to be controlled within ⁇ 50 microns, otherwise it is for small lines (the line width is generally defined as a small line of 4 mils, 1 mil is lmil Approximately 25.4 microns) does not meet the etching requirements.
  • small hole back drill design alkaline etching process requires two times of copper plating, which tends to cause the surface copper to be too thick, the small hole diameter becomes smaller, it will be difficult to plate the small holes, resulting in insufficient holes
  • the tin protects the hole copper, and in the subsequent etching process except the residual copper wire of the back-drilled, the copper which should not be etched is etched, and it is easy to cause the small hole to be free of copper.
  • the present invention provides a method for preparing a back hole on a PCB board, which protects the hole copper through a resin plug hole, so that the acid etching process only removes residual metal chips after the back hole is drilled, without resin protection. Part of the hole copper is affected, and the process cartridge is prepared.
  • the present invention also provides a PCB board comprising the above-mentioned back-drilled hole, wherein no metal chips are left in the back hole, and the hole copper should be partially intact.
  • the present invention provides the following technical solutions:
  • the invention provides a preparation method of a back hole on a PCB board, comprising:
  • the metal chips remaining in the through holes are removed.
  • the method for preparing the back hole on the PCB board uses a single electroplating process to make the metal layer formed on the inner wall of the through hole reach a set thickness, so that the preparation process tube is simplified, and the double plating is avoided.
  • the process produces a large error, and the thickness of the metal layer becomes large.
  • the first resin plug hole is used for back drilling, and then the metal chips remaining in the back hole are removed by acid etching to avoid the hole diameter of the through hole. Small, after the metal in the hole is plated twice, the hole diameter of the through hole becomes smaller, and it is difficult to protect the hole copper from being etched.
  • the present invention is a method for preparing a back hole drilled on a PCB board provided by the city, which can be used for the tube preparation process, and can avoid the excessive thickness of the base copper generated in the alkaline etching process provided in the background art.
  • the phenomenon can also avoid the phenomenon that the small holes generated in the alkaline etching process provided in the background technology are free from copper scrapping.
  • the method for preparing the back hole of the PCB board provided by the invention protects the hole copper through the resin plug hole, so that the acid etching process which requires only one plating process can be used, so that the acid etching process only removes the small hole back.
  • the metal chips are left after drilling without affecting the hole copper of the resin-protected portion, and the process cartridge is prepared.
  • FIG. 1 to FIG. 1 are schematic diagrams showing the steps of the steps of the method for preparing the back hole on the PCB board in the prior art
  • FIG. 2 is a flow chart of the method for preparing the back hole on the PCB board provided by the present invention
  • FIG. 3 is a schematic view showing formation of a through hole on a PCB in an embodiment of the present invention.
  • FIG. 4 is a schematic view showing a metal layer formed on an inner wall of a through hole according to an embodiment of the present invention
  • FIG. 5 is a schematic view showing a resin filled in a through hole in an embodiment of the present invention.
  • FIG. 6 is a schematic view of a back hole after back drilling according to an embodiment of the present invention.
  • FIG. 7 is a schematic view showing the removal of metal chips remaining in the through holes in the embodiment of the present invention.
  • the PCB board mentioned in the present invention is a multi-layer board, and the preparation method of the back hole mentioned is mainly for back drilling processing of a small hole (aperture ⁇ 0.25 mm is called a small hole), which is to overcome the background.
  • the holes mentioned in the technique are an alternative to the difficulty of back-drilling. Of course, large holes can also be used in this way.
  • FIG. 2 is a flowchart of a method for preparing a back hole on a PCB board according to the present invention.
  • the method for preparing a back hole on a PCB board according to an embodiment of the present invention includes:
  • Step S101 forming a through hole on the PCB board
  • Step S102 forming a metal layer of a set thickness on an inner wall of the through hole
  • Step S103 filling a through hole having a metal layer into a resin
  • Step S104 performing back drilling processing on the through hole filled with the resin
  • Step S105 Removing the metal chips remaining in the through holes.
  • the method for preparing the back hole on the PCB board uses a single electroplating process to make the metal layer formed on the inner wall of the through hole reach a set thickness, so that the preparation process tube is simplified, and the double plating is avoided.
  • the process produces a large error, and the thickness of the metal layer becomes large.
  • the electroplated metal crucible is performed by an electroplating process; at the same time, the resin plug hole is used for back drilling, and then the etching is performed to remove the through hole that has been drilled back.
  • the method of residual metal chips is to avoid the hole diameter of the through hole becoming smaller after the metal in the hole is plated twice, and the hole diameter of the through hole is less likely to be caused, so that the hole copper which should not be erased by the candle cannot be protected. happened. Therefore, the present invention is a method for preparing a back hole drilled on a PCB board provided by the city, which can be used for the tube preparation process, and can avoid the excessive thickness of the base copper generated in the alkaline etching process provided in the background art.
  • the phenomenon can also avoid the phenomenon that the small holes generated in the alkaline etching process provided in the background technology are free from copper scrapping.
  • the method for preparing the back hole of the PCB board provided by the invention protects the copper of the hole wall through the resin plug hole, so that the acid etching process only removes residual metal chips after the back hole is drilled, and does not protect the resin portion.
  • the effect of the hole copper at the same time, the use of resin plug holes and back-drilling method, so that the original design of the alkali etching scheme was replaced by a more single acid etching process, such as reducing the copper plating part, and plating 4
  • the link saves production time, has the requirement of being easy to be environmentally friendly, and ensures the reduction of the waste board rate.
  • Step S101 is specifically: drilling a through hole 11 on the PCB 1 with a metal drill bit, as shown in Fig. 3, Fig. 3 is a schematic view showing the formation of a through hole on the PCB in the embodiment of the invention.
  • step S102 forming a metal layer of a set thickness on the inner wall of the through hole comprises: metallizing the inner wall of the through hole by a metal sinking process, and then setting a metal on the inner wall of the through hole by a plating metal process thickness of.
  • the sinking metal process and the electroplating metal process are common preparation processes.
  • FIG. 4 is a schematic view showing the formation of a metal layer on the inner wall of the through hole according to the embodiment of the present invention. After the completion of the step, the outer layer of the PCB board 1 is completed. And the inner wall of the through hole 11 is plated with a layer of metal.
  • the set thickness of the metal layer 12 on the inner wall of the through hole 11 is generally 13 104 micrometers based on the needs of the products in the industry. For example: 13 ⁇ m, 23 ⁇ m, 33 ⁇ m, 43 ⁇ m, 53 m, 63 m, 73 m, 83 m, 93 ⁇ m, 104 ⁇ m, etc., here is no longer - repeat. In general, 25 ⁇ m to 35 ⁇ m metal thickness is mainly used in the preparation of products above the mid-end.
  • step S103 filling the resin into the through hole 11 having formed the metal layer specifically comprises: filling the through hole of the metal layer with the aluminum plate to fill the resin 2 with the resin.
  • FIG. 5 is a schematic view showing a resin filled in a through hole in an embodiment of the present invention. After the step is completed, the through hole 11 is filled with a resin 2, and preferably, the resin 2 fills the entire through hole.
  • the copper of the hole wall can be protected by the resin plug hole, so that the acid etching process only removes residual metal chips after the back hole is drilled, and does not affect the hole copper of the resin protection portion.
  • Step S104 is specifically as follows: generally, the through hole of the resin filled hole is back-drilled by means of mechanical drilling. After this step is completed, the PCB board 1 is as shown in FIG. 6, FIG. 6 is a pass in the embodiment of the present invention. The schematic diagram of the hole after the back drilling process can be seen from the figure, there will be residual metal chips 121 in the through hole after the back drilling process.
  • step S105 removing the metal chips remaining in the through hole specifically includes: covering the outer layer of the outer layer of the PCB board 1 by using an acid etching process, and performing the pattern of the outer layer by pattern transfer, and the through hole that has been drilled back The residual metal chips inside are etched.
  • the 1000 film can protect the metal layer that does not need to be removed.
  • the acidic etching solution in the above acid etching process is industrial gram acid.
  • industrial sulphuric acid is a commonly used acidic etching solution, and the amount of sulfuric acid contained in industrial sulfuric acid is greater than 92.5%.
  • concentration of the industrial sulfuric acid used in the embodiment of the present invention can be adjusted according to requirements.
  • the acidic etching solution can also be other acids, which will not be repeated here.
  • the metal plated above is generally copper, and the metal scrap remaining in the through hole after back drilling may also be a wire or a metal wire.
  • the present invention also provides a PCB board comprising the above-mentioned back-drilled hole, wherein no metal chips are left in the back hole, and the hole copper should be partially intact.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

提供一种印刷电路板（PCB）上的背钻孔的制备方法以及PCB板。其中背钻孔的制备方法包括：在PCB板（1）上形成通孔；在通孔的内壁形成设定厚度的金属层（12）；向已经形成金属层（12）的通孔内填充树脂；对已经填充树脂的通孔进行背钻加工；去除通孔内残留的金属屑。该制备方法通过树脂塞孔对孔壁铜进行保护，使酸蚀过程只会去除小孔背钻后残留的金属屑，而不会对树脂保护部分的孔铜造成影响，且制备工艺简单。

Description

一种 PCB板上的背钻孔的制备方法以及 PCB板 本申请要求在 2013年 8月 2 日提交中国专利局、 申请号为 201310334885.4、 发明名 称为 "一种 PCB板上的背钻孔的制备方法以及 PCB板，， 的中国专利申请的优先权， 该专 利申请的全部内容通过引用结合在本申请中。 技术领域
本发明涉及电子产品生产领域，尤其涉及一种 PCB板上的背钻孔的制备方法以及 PCB 板。 背景技术 背钻孔的应用在目前 PCB ( Printed Circuit Board, 印刷电路板）行业里面越来越广泛， 特别是针对目前高信号传输的电子产品而言， 背钻孔是 PCB板设计中的一个重要因素。
在 PCB板制造过程中， 需要设置通孔来实现各内层线路之间的连接，且通孔还需要经 过沉铜、电镀等处理，在通孔中形成导电层，从而实现各层线路之间的连接，但是一些 PCB 板的通孔只需要部分导通， 而经过沉铜、 电镀处理后的通孔是全部导通的， 这样就会出现 通孔端部连接问题， 从而会导致信号的折回， 造成信号传输的反射、 散射、 延迟等现象， 给信号带来 "失真" 问题。 为了避免上述现象的发生， 就需要对通孔进行背钻处理。
随着电子产品的不断进步， 电子产品在设计时对于背钻工艺的要求越来越严格， 尤其 是对高速电子产品设计的小孔（孔径 < 0.25毫米称为小孔）进行背钻加工时， 要求小孔背 钻后不能有铜丝残留。
基于上述各种要求限制， 行业对于小孔背钻铜丝残留的做法是设计碱性蚀刻流程工 艺。 图 la〜图 lb为现有技术中的 PCB板上的背钻孔的制备方法流程中各步骤结构示意图， 如图 la〜图 li所示， 碱性蚀刻流程工艺主要包括： 开料、 内层图形转移、 棕化、 压合外层 板形成 PCB板 01 (如图 la所示）、 钻孔 011 (如图 lb所示）、 沉铜及预板镀（孔内铜 02 厚按 5 米~8 米控制， 如图 lc所示孔内增厚层， 为后续方便， 面铜增厚部分未示出）、 放置千膜 03 , 外层碱性图形转移（如图 Id所示）、 图形电镀（把所有孔的孔铜厚按客户要 求镀够， 如图 le所示）、 在线路开窗位置镀上锡 04 (如图 If所示）、 背钻（如图 lg所示）、 去掉千膜（如图 lh所示）、 碱性蚀刻 （如图 li所示）等。
但是， 釆用上述碱性蚀刻流程工艺尽管能够解决小孔背钻残留的铜丝问题， 但仍然存 在很多不足的缺陷， 主要包括以下几个方面：
1、 小孔背钻设计碱性蚀刻流程工艺非常复杂而且生产流程长， 生产效率低。 2、 碱性蚀刻对于 PCB板的基铜厚度要求非常严格， 一般基铜厚度需要控制在 < 50微 米以内， 否则针对细小线路（线路宽度一般< 4密耳定义为细小线路， 1密耳即 lmil约为 25.4微米）无法满足蚀刻要求。
3、 小孔背钻设计碱性蚀刻流程工艺中需要两次镀面铜， 容易导致面铜过厚， 小孔直 径变小， 将很难对小孔进行镀 4易， 导致孔内没有足够的锡保护孔铜， 在后续除背钻残留铜 丝的蚀刻过程中， 蚀刻掉本不应蚀刻的铜， 容易造成小孔无铜 4艮废。 发明内容 本发明提供一种 PCB板上的背钻孔的制备方法，通过树脂塞孔对孔铜进行保护，使酸 蚀过程只会去除小孔背钻后残留金属屑， 而不会对树脂保护部分的孔铜造成影响， 且制备 工艺筒单。
本发明还提供一种含上述背钻孔的 PCB板， 背钻孔内不留金属屑，且孔铜应留部分完 好。
为达到上述目的， 本发明提供以下技术方案：
本发明提供了一种 PCB板上的背钻孔的制备方法， 包括：
在 PCB板上形成通孔；
在所述通孔的内壁形成设定厚度的金属层；
向已经形成金属层的所述通孔内填充树脂；
对已经填充树脂的所述通孔进行背钻加工；
去除所述通孔内残留的金属屑。
本发明实施例提供的 PCB板上的背钻孔的制备方法，釆用一次电镀工艺便使通孔的内 壁上形成的金属层达到设定的厚度， 使得制备工艺筒单化， 避免两次电镀工艺产生较大的 误差， 金属层的厚度变大的现象的发生； 同时釆用先树脂塞孔再背钻， 然后酸蚀去除背钻 孔内残留的金属屑的方法， 避免由于通孔孔径过小， 两次电镀孔内金属后， 通孔的孔径变 的更小， 不易镀锡导致无法保护不应被蚀刻掉的孔铜的现象的发生。
因此， 釆用本发明是市里提供的 PCB板上的背钻孔的制备方法， 可以筒化制备工艺， 同时可以避免背景技术中提供的碱性蚀刻流程工艺中产生的基铜厚度过大的现象， 还能避 免背景技术中提供的碱性蚀刻流程工艺中产生的小孔无铜报废的现象。
所以， 本发明提供的 PCB板的背钻孔的制备方法， 通过树脂塞孔对孔铜进行保护， 因 而可以釆用只需一次电镀过程的酸蚀工艺， 使酸蚀过程只会去除小孔背钻后残留金属屑， 而不会对树脂保护部分的孔铜造成影响， 且制备工艺筒单。 附图说明 此处所说明的附图用来提供对本发明的进一步理解， 构成本发明的一部分， 本发明的 示意性实施例及其说明用于解释本发明， 并不构成对本发明的不当限定。 在附图中：
图 la〜图 l i为现有技术中的 PCB板上的背钻孔的制备方法流程中各步骤结构示意图； 图 2为本发明提供的 PCB板上的背钻孔的制备方法流程图；
图 3为本发明实施例中 PCB板上的通孔形成的示意图；
图 4为本发明实施例中使通孔得内壁形成金属层的示意图；
图 5为本发明实施例中通孔内填充树脂的示意图；
图 6为本发明实施例中对通孔进行背钻加工后的示意图；
图 7为本发明实施例中去除通孔内残留的金属屑的示意图。
图中：
01.PCB板 011.钻孔 02.铜 03.千膜 04.锡 1.PCB板 11.通孔 12.金属层 121. 残留的金属屑 2.树脂 具体实施方式 为了使本发明所要解决的技术问题、 技术方案及有益效果更加清楚、 明白， 以下结合 附图和实施例， 对本发明进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅用 以解释本发明， 并不用于限定本发明。
此处说明，本发明中提到的 PCB板为多层板， 所提到的背钻孔的制备方法主要针对小 孔（孔径 < 0.25毫米称为小孔）进行背钻加工， 是为克服背景技术中提到的小孔进行背钻 加工的困难而釆取的替代方案。 当然大孔背钻也可以釆用这种方法。
如图 2所示， 图 2为本发明提供的 PCB板上的背钻孔的制备方法流程图； 本发明实施 例提供的 PCB板上的背钻孔的制备方法， 包括：
步骤 S 101 : 在 PCB板上形成通孔；
步骤 S 102: 在通孔的内壁形成设定厚度的金属层；
步骤 S 103 : 向已经形成金属层的通孔内填充树脂；
步骤 S 104: 对已经填充树脂的通孔进行背钻加工；
步骤 S 105： 去除通孔内残留的金属屑。
本发明实施例提供的 PCB板上的背钻孔的制备方法，釆用一次电镀工艺便使通孔的内 壁上形成的金属层达到设定的厚度， 使得制备工艺筒单化， 避免两次电镀工艺产生较大的 误差， 金属层的厚度变大的现象的发生， 电镀金属釆用一种电镀工艺进行； 同时釆用先树 脂塞孔再背钻， 然后酸蚀去除已经背钻的通孔内残留的金属屑的方法， 避免由于通孔孔径 过小， 两次电镀孔内金属后， 通孔的孔径变的更小， 不易镀 4易导致无法保护不应被烛刻掉 的孔铜的现象的发生。 因此， 釆用本发明是市里提供的 PCB板上的背钻孔的制备方法， 可以筒化制备工艺， 同时可以避免背景技术中提供的碱性蚀刻流程工艺中产生的基铜厚度过大的现象， 还能避 免背景技术中提供的碱性蚀刻流程工艺中产生的小孔无铜报废的现象。
所以， 本发明提供的 PCB板的背钻孔的制备方法， 通过树脂塞孔对孔壁铜进行保护， 使酸蚀过程只会去除小孔背钻后残留金属屑， 而不会对树脂保护部分的孔铜造成影响； 同 时， 使用树脂塞孔再背钻的方式， 使得原来设计的碱蚀方案被更筒单的酸蚀工艺所替代， 比如减少了一次镀面铜的环节， 以及镀 4易环节， 节省了制作时间， 有易于环保的要求， 更 保证了废板率的降低。
步骤 S101具体的： 用金属钻头在 PCB板 1上钻出通孔 11 , 如图 3所示， 图 3为本发 明实施例中 PCB板上的通孔形成的示意图。
进一步地， 步骤 S102 中： 在通孔的内壁形成设定厚度的金属层具体包括： 通过沉金 属工艺使通孔的内壁金属化， 再通过电镀金属工艺使通孔的内壁上的金属达到设定的厚 度。 沉金属工艺和电镀金属工艺都是常用的制备工艺， 如图 4所示， 图 4为本发明实施例 中使通孔得内壁形成金属层的示意图， 本步骤完成后， PCB板 1的外层和通孔 11的内壁 上都被镀上了一层金属。
基于行业内产品的需要， 通孔 11 内壁上的金属层 12的设定的厚度一般为 13 104微 米。 例如： 13 ^ 米、 23 ^ 米、 33 ^ 米、 43 ^ 米、 53 米、 63 米、 73 米、 83 米、 93微米、 104微米等， 这里就不再——赘述。 一般情况下， 25微米〜 35微米金属厚主要应 用在中端以上产品的制备过程中。
步骤 S103中： 向已经形成金属层的通孔 11内填充树脂具体包括： 釆用铝片网版对已 经形成金属层的通孔内填充树脂 2。 如图 5所示， 图 5为本发明实施例中通孔内填充树脂 的示意图， 本步骤完成后， 通孔 11内被填充上树脂 2, 优选地， 树脂 2填满整个通孔， 这 样， 可以通过树脂塞孔对孔壁铜进行保护， 使酸蚀过程只会去除小孔背钻后残留金属屑， 而不会对树脂保护部分的孔铜造成影响。
步骤 S104具体为： 一般釆用机械钻孔的方式， 对已经填充树脂的通孔进行背钻加工， 此步骤完成后， PCB板 1如图 6所示， 图 6为本发明实施例中对通孔进行背钻加工后的示 意图， 从图上可以看出背钻工艺后的通孔内会存在残留的金属屑 121。
步骤 S105中： 去除通孔内残留的金属屑具体包括： 在 PCB板 1的外层覆盖千膜， 使 用酸性蚀刻工艺， 通过图形转移做外层的线路图形的同时， 把已经背钻的通孔内残留的金 属屑蚀刻千净。千膜可以保护不需要去掉的金属层，此步骤完成后， PCB板 1如图 7所示。
上述酸性蚀刻工艺中的酸性刻蚀液为工业石克酸。 在制备工艺中， 工业石克酸为常用的酸 性刻蚀液， 工业硫酸中含有的硫酸量大于 92.5%。 对于本发明实施方式中应用的工业硫酸 的浓度可以根据需要配比， 当然， 酸性蚀刻液也可以为其它酸， 这里就不再——赘述。 上述电镀的金属一般为铜， 而背钻后通孔内残留的金属屑也可能是金属丝或金属末 等。
本发明还提供一种含上述背钻孔的 PCB板， 背钻孔内不留金属屑，且孔铜应留部分完 好。
显然， 本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明的 精神和范围。 这样， 倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范 围之内， 则本发明也意图包含这些改动和变型在内。

Claims

权 利 要 求
1、 一种 PCB板上的背钻孔的制备方法， 其特征在于， 包括：
在 PCB板上形成通孔；
在所述通孔的内壁形成设定厚度的金属层；
向已经形成金属层的所述通孔内填充树脂；
对已经填充树脂的所述通孔进行背钻加工；
去除所述通孔内残留的金属屑。
2、 如权利要求 1所述的 PCB板上的背钻孔的制备方法， 其特征在于， 所述步骤在所 述通孔的内壁形成设定厚度的金属层具体包括： 通过沉金属和电镀工艺使所述通孔的内壁 形成设定厚度的金属层。
3、 如权利要求 1所述的 PCB板上的背钻孔的制备方法， 其特征在于， 所述步骤向已 经形成金属层的所述通孔内填充树脂具体包括： 釆用铝片网版向已经形成金属层的所述通 孔内填充树脂。
4、 如权利要求 2所述的 PCB板上的背钻孔的制备方法， 其特征在于， 所述通孔的内 壁形成的金属层的设定厚度为 13微米〜 104微米。
5、 如权利要求 4所述的 PCB板上的背钻孔的制备方法， 其特征在于， 所述通孔的内 壁形成的金属层的设定厚度为 25微米〜 35微米。
6、 如权利要求 1~5所述的 PCB板上的背钻孔的制备方法， 其特征在于， 所述步骤去 除所述通孔内残留的金属屑具体包括：在所述 PCB板的外层覆盖千膜，使用酸性蚀刻工艺， 通过图形转移做外层的线路图形的同时， 对背钻后的所述通孔内残留的金属屑进行蚀刻。
7、 如权利要求 1~5任一所述的 PCB板上的背钻孔的制备方法， 其特征在于， 所述通 孔的孔径小于等于 0.25毫米。
8、 一种 PCB板， 其特征在于， 包含由权利要求 1~7任一所述方法制得的背钻孔。
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