WO2015008485A1 - 密閉筐体の冷却構造及びそれを用いた光学装置 - Google Patents
密閉筐体の冷却構造及びそれを用いた光学装置 Download PDFInfo
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- WO2015008485A1 WO2015008485A1 PCT/JP2014/003755 JP2014003755W WO2015008485A1 WO 2015008485 A1 WO2015008485 A1 WO 2015008485A1 JP 2014003755 W JP2014003755 W JP 2014003755W WO 2015008485 A1 WO2015008485 A1 WO 2015008485A1
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- Prior art keywords
- heat
- evaporation
- unit
- refrigerant
- cooling structure
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- 238000001816 cooling Methods 0.000 title claims abstract description 98
- 230000003287 optical effect Effects 0.000 title claims description 39
- 238000001704 evaporation Methods 0.000 claims abstract description 80
- 239000007788 liquid Substances 0.000 claims abstract description 65
- 230000008020 evaporation Effects 0.000 claims abstract description 61
- 239000003507 refrigerant Substances 0.000 claims abstract description 49
- 230000020169 heat generation Effects 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000428 dust Substances 0.000 description 13
- 239000012071 phase Substances 0.000 description 13
- 238000009833 condensation Methods 0.000 description 9
- 230000005494 condensation Effects 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000007791 liquid phase Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
Definitions
- the present invention relates to a cooling structure for a sealed casing and an optical apparatus using the same, and more particularly to a cooling structure for a sealed casing such as an optical apparatus that has a high heat generation amount and causes performance or life deterioration due to dust.
- an optical device such as an LCD (Liquid Crystal Display, liquid crystal display) that uses optical components
- performance deterioration such as a decrease in luminance, a decrease in light amount, and a change in reproduced color occurs due to dust entering the device. Since the optical device is difficult to repair, if dust enters the optical device, the life of the product is substantially ended. Therefore, securing dust resistance is an important issue for optical components.
- Patent Document 1 discloses a liquid crystal projector device in which a liquid cooling device is provided inside a main body without using a cooling fan. According to this, the liquid cooling device is disposed so as to circulate the liquid inside the projector main body and come into contact with the liquid crystal display device, and further includes an electronic cooling element.
- the liquid crystal display device When the liquid crystal display device generates heat, the liquid inside the liquid cooling device is heated from the contact portion with the liquid cooling device. The heated liquid naturally circulates in the liquid cooling device and transports heat of the liquid crystal display device.
- the electronic cooling element cools the heated liquid. The liquid cooled by the electronic cooling element circulates again in the liquid cooling device.
- bubbles in the liquid cooling device cause shadows.
- the gas has not dissolved in the liquid since the liquid was sealed, and secondly, steam is always generated in the operating environment of the liquid cooling device. It is necessary to satisfy the condition that the liquid to be used must be used. However, selection of such materials has been difficult.
- An object of the present invention is to provide a cooling structure for a sealed housing that solves the above-described problems. That is, an object of the present invention is to provide a cooling structure for a sealed housing and an optical device using the same, which solve the problem that the performance of a cooling target device is deteriorated by the arrangement of the cooling structure.
- the cooling structure of the sealed casing of the present invention receives a heat from a heat-generating component, a sealed container that stores a heat-generating component that generates heat by light irradiation from a light source, an evaporation unit that is disposed inside the sealed container, and stores a refrigerant.
- An optical device using a cooling structure for a sealed container is disposed in a housing within a casing, a light source, a heat generating component that generates heat by light irradiation from the light source, a sealed container that stores the heat generating component, and a sealed container.
- An evaporator that stores the refrigerant, a condenser that liquefies the refrigerant vaporized by receiving heat from the heat generating component, a vapor pipe that connects the evaporator and the condenser, and through which the vaporized refrigerant flows, an evaporator and a condenser And a liquid pipe through which the liquefied refrigerant flows.
- the cooling structure of the sealed casing of the present invention it is possible to realize a cooling structure that does not cause performance deterioration of the cooling target device.
- FIG. 1 is a cross-sectional view showing the configuration of the cooling structure of the sealed casing of the present embodiment.
- casing which concerns on this embodiment is the condensation part 1, the two evaporation parts 2a and 2b, the vapor
- the liquid pipe connecting portion 6 connects between the liquid pipe 4a and the liquid pipe 4b.
- the condensing part 1 is comprised by the radiator, for example.
- the two evaporation parts 2a and 2b are arranged one by one in the two sealing parts 5a and 5b provided in the casing.
- the cooling structure of the present embodiment transports heat inside these sealed portions 5a and 5b to the outside.
- the steam pipe 3 connects the steam port of the condensing unit 1 and the steam ports of the evaporating units 2a and 2b.
- the liquid pipes 4a and 4b connect the liquid pipe ports of the evaporation units 2a and 2b and the liquid pipe port of the condensing unit 1, respectively.
- the condensing unit 1 includes an upper header 11, a lower header 12, a plurality of connecting pipe portions 13, and a plurality of fin portions 14.
- the evaporation units 2 a and 2 b include an upper header 21, a lower header 22, a plurality of connecting pipe portions 23, and a plurality of fin portions 24.
- the upper headers 11 and 21 are disposed above the lower headers 12 and 22 in the vertical direction.
- the connecting pipe part 13 of the condensing part 1 connects the upper header 11 and the lower header 12. A plurality of connecting pipe portions 13 are provided.
- the connecting pipe portion 23 of the heat radiating portion 2 connects the upper header 21 and the lower header 22. A plurality of connecting pipe portions 23 are provided.
- the fin portion 14 is provided between the connecting pipe portions 13. These fin parts 14 take heat away from the high-temperature air and transmit the received heat to the refrigerant in the connecting pipe part 23.
- the refrigerant that has received heat undergoes a phase change from the liquid phase to the gas phase, and rises in the connecting pipe portion 13.
- the fin portions 24 are provided between the connecting pipe portions 23 in the same manner as the fin portions 14.
- the fin portion 24 radiates the heat of the gas-phase refrigerant flowing from the upper header 21.
- the radiated refrigerant changes its phase from the gas phase to the liquid phase, and descends the connecting pipe portion 23 toward the lower header 22.
- the fin parts 14 and 24 are comprised by the some fin, and it is comprised so that air can pass between several fins.
- the steam pipe port of the condensing unit 1 is provided at a higher position in the vertical direction than the liquid pipe port of the condensing unit 1. Moreover, the vapor
- the refrigerant amount is determined based on the maximum heat generation amount of the cooling target device. After the refrigerant is sealed in the cooling structure 10, the inside of the cooling structure 10 is maintained at the saturated vapor pressure of the refrigerant by evacuation.
- the connection position of the liquid pipe connection part 6 is provided at a position lower than the gas-liquid interface of the refrigerant liquid.
- the sealing portions 5a and 5b can be provided for each heat generating component 8 in the housing. By doing in this way, since the volume of sealing part 5a, 5b can be made small, the heat transfer in each sealing part 5a, 5b becomes easy, and the heat-emitting component 8 can be cooled efficiently.
- the heat generating component 8 is an optical component such as a lens, for example.
- the heat generating component 8 is provided in the vicinity of the evaporation portions 2a and 2b of the cooling device 10 in the sealed portions 5a and 5b. At this time, the heat generating component 8 and the evaporation units 2a and 2b do not contact each other. At this time, the evaporating units 2a and 2b can receive the heat of the heat generating component 8 via the warm air in the sealed portions 5a and 5b (radiant heat of the heat generating component 8).
- the evaporating units 2a and 2b can receive the heat of the heat generating component 8 without causing performance deterioration of the device to be cooled (heat generating component 8), such as damaging the heat generating component 8 that is the device to be cooled. Further, since the evaporating units 2a and 2b do not block the light flux 9, the heat generating component 8 can be cooled without deteriorating the performance of the cooling target device (heat generating component 8).
- the configuration of the present embodiment is effective for a device having a plurality of parts requiring dustproof.
- a part of components for example, a lens
- performance degradation due to dust is large.
- the housing has a structure that can be opened and closed for parts replacement or the like. If it is the structure of this embodiment, both conditions can be satisfy
- the heat generating component 8 in the sealed portion is heated by the light beam 9 from the light source (not shown).
- the amount of heat generated in the sealed portion 5a and the sealed portion 5b may be significantly different.
- the calorific value in the sealed part 5a is larger than the calorific value in the sealed part 5b
- the liquid phase refrigerant on the evaporation part 2a side is vaporized more than on the evaporation part 2b side, so that it is reduced more.
- the amount of the refrigerant responsible for heat transport is insufficient, the cooling performance is lowered and the temperature of the cooling target is increased.
- the amount of the refrigerant is excessive, the boiling point rises due to the increase in internal pressure due to the decrease in the volume occupied by the gas-phase refrigerant, so that the cooling performance is lowered.
- the liquid pipe connecting portion 6 is configured to connect the liquid pipes 4a and 4b, so that the liquid level in the lower header 22 of the evaporation portions 2a and 2b is equal. Adjusted. That is, when the amount of one refrigerant in the evaporation units 2a and 2b is insufficient, the refrigerant is supplied from the other of the evaporation units 2a and 2b. Moreover, when the liquid quantity of one refrigerant
- the cooling structure 10 and the heat generating component 8 are not in direct contact. Therefore, the performance of the cooling target device (heat generating component 8) is not deteriorated.
- the evaporating units 2a and 2b can be installed without interfering with the optical path. Will not bring.
- FIG. 2 shows a cross-sectional view of the cooling structure 20 of the hermetic casing of this embodiment.
- the cooling structure 20 of the sealed housing according to the present embodiment includes two condensing units 1a and 1b, two evaporating units 2a and 2b, a vapor pipe 3, and liquid pipes 4a and 4b.
- the liquid pipe connecting portion 6 connects between the liquid pipe 4a and the liquid pipe 4b.
- the steam pipe connecting part 7 connects the upper headers 11 of the two condensing parts 1a and 1b.
- the gas-phase refrigerant in the condensing part 1a and the gas-phase refrigerant in the condensing part 1b can go back and forth through the vapor pipe connection part 7.
- the amount of the gas-phase refrigerant inside the upper header 11 of the condensing unit 1a and the condensing unit 1b can be made uniform.
- the internal structure of the condensation parts 1a and 1b is the same as the internal structure of the condensation part 1 and the evaporation parts 2a and 2b.
- FIG. 2 shows a case where the two condensing units 1a and 1b are provided.
- the configuration of the present embodiment is not limited to this case, and three or more condensing units can be connected according to the required cooling performance.
- each of the plurality of evaporating units 2a and 2b is connected to each condensing unit 1a and 1b.
- both the condensing units 1a and 1b are configured by the same type of radiator, and the cooling performance can be adjusted by the number of radiators. For this reason, it is not necessary to redesign individual radiators constituting the condensing units 1a and 1b and the entire condensing units 1a and 1b (combination of condensing units) according to the amount of heat to be cooled, thereby reducing costs.
- the design guideline can be simplified.
- the condensing parts 1a and 1b are connected by a steam pipe connecting part 7. For this reason, even when the amount of the gas-phase refrigerant generated by the evaporation units 2a and 2b is uneven, the gas-phase refrigerant in the condensing unit 1a and the gas-phase refrigerant in the condensing unit 1b are It is possible to go back and forth through the connection part 7. Therefore, the amount of the gas phase refrigerant in the upper header 11 of the condensing unit 1a and the condensing unit 1b can be made uniform. As a result, the cooling performance can be maintained. Moreover, since it has the condensation parts 1a and 1b, since the condensation parts 1a and 1b should just have the performance according to the total evaporation, the enlargement of the condensation parts 1a and 1b can be suppressed.
- FIG. 3 shows a cross-sectional view of the cooling structure 30 of the hermetic casing of the present embodiment.
- the sealed container is configured to accommodate a plurality of objects to be cooled. That is, a plurality of optical components are provided in at least one sealed container. In the example of FIG. 3, a plurality of optical components 8b are provided in the sealed container 5b.
- the light flux 9b emitted from the lamp 9a as the light source is irradiated onto the heat generating components 8a and 8b as the optical components
- the light flux 9b is absorbed by the heat generating components 8a and 8b.
- the heat generating components 8a and 8b generate heat in the sealed containers 5a and 5b.
- the amount of heat generated by each of the heat generating components 8a and 8b increases or decreases depending on the operating state of the device to be cooled, but the total amount of heat generated is determined by the amount of light from the lamp 9a.
- each sealing is performed without blocking the optical path.
- Containers 5a and 5b can be arranged. Therefore, the cooling performance can be minimized. For this reason, the enlargement of the evaporation parts 2a and 2b and the condensation part 1 can be suppressed.
- the cooling performance of the cooling structure 30 can be maintained without causing performance degradation of the cooling target device due to scattering of light from the lamp 9a.
- FIG. 4 shows a cross-sectional view of the cooling structure 40 of the hermetic casing of the present embodiment.
- a plurality of heat generating components 8a, 8b, 8c, 8d, an evaporation unit 2b, and a fan 80 are accommodated in the sealed container 5b.
- the fan 80 circulates the air in the sealed container 5b.
- the fan 80 circulates the air in the sealed container 5b clockwise (clockwise).
- dust does not mix from the outside of the airtight container 5b. Therefore, the problem of dust mixing described in the background art does not occur.
- this cooling structure 40 by defining the arrangement of the evaporation unit 2b and the fan 80 corresponding to the arrangement of the heat generating components 8a, 8b, 8c, and 8d that are the objects to be cooled, the cooling structure 40 is in one direction starting from the evaporation unit 2b. Circulation cooling air (air flow) AF is generated.
- the heat generating component having a small allowable temperature rise value and a small heat generation amount is disposed on the upstream side of the circulating cooling air (air flow) AF starting from the evaporation portion 2b.
- the heat generating component having a large heat generation amount is disposed on the downstream side of the circulating cooling air (air flow) AF starting from the evaporation portion 2b.
- the circulation path of the circulating cooling air AF is formed clockwise (clockwise). Therefore, the heat generating components are arranged in the order of decreasing heat generation along the circulation path of the circulating cooling air AF starting from the evaporation unit 2b in the clockwise direction (clockwise).
- the heat generation amount of the heat generation component 8d is the smallest, the heat generation amount of the heat generation component 8a is the largest, and the heat generation amount of the heat generation components 8b and 8c is between the heat generation amounts of the heat generation components 8a and 8d.
- the heat generating component 8d is arranged clockwise on the circulation path of the circulating cooling air AF starting from the evaporator 2b, and then the heat generating components 8b, 8c are arranged. Finally, the heat generating component 8a is arranged.
- the number of sealed containers 5b is increased to a plurality, and these parts are respectively arranged on the upstream side of the circulating cooling air (air flow) AF starting from the evaporation unit 2b.
- the fan air volume can be suppressed and dust scattering can be prevented as compared with the case where the circulating cooling air (air flow) AF is formed over the entire housing of the cooling structure 40. it can. Therefore, the components can be stably cooled with low noise.
- the sealed containers 5a and 5b can be arranged according to the heat generation amount of the heat generating components 8a, 8b, 8c and 8d. Therefore, for example, a heat-generating component having a large heat generation amount can be configured such that only the component is housed in a single sealed container and separated from other components. Thereby, it can prevent that the temperature of the components arrange
- At least one of the sealed containers 5a and 5b is configured to accommodate a plurality of heat generating components, and the evaporation units 2a and 2b are arranged in the vicinity of the position where the heat generating component having the smallest amount of heat generation among the plurality of heat generating components is accommodated. It is good also as composition which has.
- Another heating element is provided between the evaporation unit 2a and the heat generating component disposed in the vicinity of the evaporation unit 2b, and the heat generation amount of the heat generating element is smaller than any of the heat generation components. It is good.
- the sealed containers 5a and 5b may include a heating element.
- the heat generating element and the plurality of heat generating components may be arranged near the evaporation units 2a and 2b as the heat generation amount thereof is smaller.
- FIG. 5 is a cross-sectional view showing the configuration of the cooling structure of the sealed casing of the present embodiment.
- a cooling structure 50 for a sealed casing according to the present embodiment includes a condensing unit 1, an evaporating unit 2, a vapor pipe 3 through which refrigerant vapor flows, and a liquid pipe 4 through which liquid phase refrigerant flows.
- the condensing part 1 is comprised by the radiator, for example.
- the evaporation unit 2 is disposed in a sealed unit 5 provided in the casing.
- the cooling structure of the present embodiment transports the heat inside the sealed part 5 to the outside.
- the steam pipe 3 connects the steam port of the condensing unit 1 and the steam port of the evaporating unit 2.
- the liquid pipe 4 connects the liquid pipe port of the evaporation unit 2 and the liquid pipe port of the condensing unit 1.
- the internal configurations of the condensing unit 1 and the evaporation unit 2 are the same as the internal configurations of the condensing unit 1 and the evaporation units 2a and 2b described above.
- the basic structure of the condensation part 1 and the evaporation part 2 is the same.
- the inside of the cooling structure 10 is maintained at the saturated vapor pressure of the refrigerant by evacuation.
- the heat generating component 8 is an optical component such as a lens, for example.
- the heat generating component 8 is provided in the vicinity of the evaporation unit 2 of the cooling device 10 in the sealed unit 5b. At this time, the heat generating component 8 and the evaporation unit 2 do not contact each other.
- the evaporation unit 2 can receive the heat of the heat generating component 8 through the warm air in the sealed portion 5 (radiant heat of the heat generating component 8).
- the evaporating units 2a and 2b can receive the heat of the heat generating component 8 without causing performance deterioration of the device to be cooled (heat generating component 8), such as damaging the heat generating component 8 that is the device to be cooled.
- the evaporation unit 2 when the optical component 8 that generates heat by absorbing light from the light source is cooled, the evaporation unit 2 can be installed without obstructing the optical path. For this reason, the performance degradation of the apparatus (heat-generating component 8) to be cooled due to light scattering or the like does not occur. That is, since the evaporating units 2a and 2b do not block the light beam 9, the heat generating component 8 can be cooled without degrading the performance of the cooling target device (heat generating component 8).
- the heat generating component 8 in the sealed portion 5 generates heat by a light beam 9 from a light source (not shown).
- the configuration of the present embodiment is effective for a device having a plurality of parts requiring dustproof.
- a part of components for example, a lens
- performance degradation due to dust is large.
- the housing has a structure that can be opened and closed for parts replacement or the like. If it is the structure of this embodiment, both conditions can be satisfy
- the present invention can be used for, for example, a cooling structure of a sealed housing and an optical device using the same.
- Cooling structure Condensing part 2a, 2b Evaporating part 3 Steam pipe 4a, 4b Liquid pipe 5a, 5b Sealed part 6 Liquid pipe connecting part 7 Steam pipe connecting part 8, 8a, 8b, 8c, 8d Heat generation Components 9, 9b Light flux 9a Light source 80 Fan AF Circulating cooling air (air flow)
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Abstract
Description
本発明の第1の実施形態について説明する。本実施形態の密閉筐体の冷却構造の構成を示す断面図を図1に示す。図1において、本実施形態に係る密閉筐体の冷却構造10は、凝縮部1、二つの蒸発部2a、2b、冷媒蒸気が流動する蒸気管3、液相冷媒が流動する液管4a、4b、および液管接続部6を備える。液管接続部6は、液管4aおよび液管4b間を接続している。凝縮部1は、例えば、ラジエータにより構成される。
本発明の第2の実施形態について説明する。本実施形態の密閉筐体の冷却構造30の断面図を図3に示す。本実施形態に係る密閉筐体の冷却構造30では、密閉容器が複数の冷却対象を収容する構成とする。すなわち、少なくともひとつの密閉容器内に、複数の光学部品が設けられている。図3の例では、密閉容器5b内に複数の光学部品8bが設けられている。
本発明の第3の実施形態について説明する。本実施形態の密閉筐体の冷却構造40の断面図を図4に示す。本実施形態の密閉筐体の冷却構造40では、複数の発熱部品8a、8b、8c、8d、蒸発部2bおよびファン80が、密閉容器5b内に収容されている。
本発明の第4の実施形態について説明する。本実施形態の密閉筐体の冷却構造の構成を示す断面図を図5に示す。図5において、本実施形態に係る密閉筐体の冷却構造50は、凝縮部1、蒸発部2、冷媒蒸気が流動する蒸気管3、液相冷媒が流動する液管4を備える。凝縮部1は、例えば、ラジエータにより構成される。
1 凝縮部
2a、2b 蒸発部
3 蒸気管
4a、4b 液管
5a、5b 密閉部
6 液管接続部
7 蒸気管接続部
8、8a、8b、8c、8d 発熱部品
9、9b 光束
9a 光源
80 ファン
AF 循環冷却風(エアフロー)
Claims (10)
- 光源からの光照射によって発熱する発熱部品を収容する密閉容器と、
前記密閉容器の内部に配置され、冷媒を貯蔵する蒸発部と、
前記発熱部品から受熱することにより気化した前記冷媒を液化する凝縮部と、
前記蒸発部と前記凝縮部を接続し、気化した前記冷媒が流動する蒸気管と、
前記蒸発部と前記凝縮部を接続し、液化した前記冷媒が流動する液管とを備えた密閉筐体の冷却構造。 - 前記蒸発部を複数個備え、
複数の前記蒸発部と前記凝縮部を接続する複数の前記液管を互いに接続する液管接続部をさらに備えた請求項1に記載の密閉筐体の冷却構造。 - 前記蒸気管は、前記凝縮部の蒸気管口と前記蒸発部の蒸気管口とを接続し、
前記液管は、前記凝縮部の液管口と前記蒸発部の液管口とを接続し、
前記凝縮部の蒸気管口は前記凝縮部の液管口よりも鉛直上方に位置し、
前記蒸発部の蒸気管口は前記蒸発部の液管口よりも鉛直上方に位置し、
前記凝縮部の液管口は前記蒸発部の蒸気管口よりも鉛直上方に位置する請求項1または2に記載の密閉筐体の冷却構造。 - 前記凝縮部は複数のラジエータを含み、
前記複数のラジエータを接続する蒸気管接続部を備えた請求項1~3のいずれか1項に記載の密閉筐体の冷却構造。 - 前記密閉容器の少なくともひとつが複数の前記発熱部品を収容し、
前記蒸発部は、前記複数の発熱部品のうち、発熱量が最も小さい発熱部品の収容位置近傍に配置された請求項1~4のいずれか1項に記載の密閉筐体の冷却構造。 - 密閉容器の冷却構造を用いた光学装置であって、
前記密閉容器の冷却構造は、
筐体内に、
光源と、
前記光源からの光照射によって発熱する発熱部品と、
前記発熱部品を収容する密閉容器と、
前記密閉容器の内部に配置され、冷媒を貯蔵する蒸発部と、
前記発熱部品から受熱することにより気化した前記冷媒を液化する凝縮部と、
前記蒸発部と前記凝縮部を接続し、気化した前記冷媒が流動する蒸気管と、
前記蒸発部と前記凝縮部を接続し、液化した前記冷媒が流動する液管とを備えた光学装置。 - 前記密閉容器の少なくともひとつが複数の前記発熱部品を収容する請求項6に記載の光学装置。
- 前記密閉容器が収容する前記複数の発熱部品が、その発熱量が小さいものほど前記蒸発部の近傍に配置された請求項7に記載の光学装置。
- 前記蒸発部と前記蒸発部の近傍に配置している前記発熱部品との間に、さらに発熱体を備え、
前記発熱体の発熱量が前記複数の発熱部品のいずれの発熱量よりも小さい請求項8に記載の光学装置。 - 前記密閉容器は、さらに発熱体を備え、
前記発熱体と前記複数の発熱部品がそれらの発熱量が小さいものほど前記蒸発部の近傍に配置された請求項7に記載の光学装置。
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JP2015527180A JPWO2015008485A1 (ja) | 2013-07-19 | 2014-07-16 | 密閉筐体の冷却構造及びそれを用いた光学装置 |
US14/904,450 US20160147034A1 (en) | 2013-07-19 | 2014-07-16 | Cooling structure of sealed casing and optical apparatus using the same |
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CN106200227A (zh) * | 2015-05-26 | 2016-12-07 | 精工爱普生株式会社 | 投影仪 |
JP2017041577A (ja) * | 2015-08-21 | 2017-02-23 | 日本電気株式会社 | 冷却装置および冷却方法 |
US11460760B2 (en) | 2020-01-29 | 2022-10-04 | Seiko Epson Corporation | Projector |
US11768427B2 (en) | 2020-01-29 | 2023-09-26 | Seiko Epson Corporation | Projector |
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US10859318B2 (en) * | 2017-02-16 | 2020-12-08 | J R Thermal, LLC | Serial thermosyphon |
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JP2020134809A (ja) * | 2019-02-22 | 2020-08-31 | セイコーエプソン株式会社 | プロジェクター |
JP2020140092A (ja) * | 2019-02-28 | 2020-09-03 | セイコーエプソン株式会社 | プロジェクター |
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