WO2014196378A1 - Résine de polyester et composition de résine de polyester pour plaque réfléchissante pour led de type encastrable - Google Patents

Résine de polyester et composition de résine de polyester pour plaque réfléchissante pour led de type encastrable Download PDF

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Publication number
WO2014196378A1
WO2014196378A1 PCT/JP2014/063679 JP2014063679W WO2014196378A1 WO 2014196378 A1 WO2014196378 A1 WO 2014196378A1 JP 2014063679 W JP2014063679 W JP 2014063679W WO 2014196378 A1 WO2014196378 A1 WO 2014196378A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyester resin
acid
resin composition
parts
mass
Prior art date
Application number
PCT/JP2014/063679
Other languages
English (en)
Japanese (ja)
Inventor
戸川 惠一朗
Original Assignee
東洋紡株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋紡株式会社 filed Critical 東洋紡株式会社
Priority to CN201480028826.7A priority Critical patent/CN105246941B/zh
Priority to JP2014541249A priority patent/JP5915948B2/ja
Priority to KR1020157035467A priority patent/KR102158764B1/ko
Publication of WO2014196378A1 publication Critical patent/WO2014196378A1/fr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/19Hydroxy compounds containing aromatic rings
    • C08G63/193Hydroxy compounds containing aromatic rings containing two or more aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/346Clay
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

Definitions

  • halogen flame retardant is preferably a combination of dibromopolystyrene and the flame retardant auxiliary is any combination of antimony trioxide, sodium antimonate, and zinc stannate.
  • Non-halogen flame retardants include melamine cyanurate, red phosphorus, phosphinic acid metal salts, and nitrogen-containing phosphoric acid compounds. In particular, a combination of a phosphinic acid metal salt and a nitrogen-containing phosphoric acid compound is preferable.
  • the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm.
  • the polyester obtained had an intrinsic viscosity of 0.60 dl / g, a resin composition of 100 mol% terephthalic acid, 65.0 mol% 4,4′-biphenyldimethanol, ethylene glycol as determined by 1 H-NMR measurement. Was 34.5 mol% and diethylene glycol was 0.5 mol%.
  • the composition and characteristic values of the obtained polyester resin are shown in Table 1.
  • the obtained polyester had an IV of 0.61 dl / g, and the resin composition was 100 mol% terephthalic acid, 98.0 mol% ethylene glycol, and 2.0 mol% diethylene glycol, as determined by 1 H-NMR. It was.
  • the composition and characteristic values of the obtained polyester resin are shown in Table 2.
  • Reinforcing material C: Glass fiber (manufactured by Nittobo Co., Ltd., CS-3J-324), acicular wallast (manufactured by NYCO, NYGLOS8) Filler (D): Talc (Micron White 5000A, Hayashi Kasei Co., Ltd.)
  • Mold release agent Magnesium stearate Stabilizer: Pentaerythrityl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] (Irganox 1010, manufactured by Ciba Specialty Chemicals)

Abstract

La présente invention concerne une résine de polyester contenant un composant acide dicarboxylique comprenant 50 % en mole ou plus d'un acide dicarboxylique aromatique et un composant glycol comprenant 15 % en mole ou plus d'un 4,4'-biphényldiméthanol, ladite résine ayant un point de fusion supérieur ou égal à 280 °C. L'invention porte également sur une composition de résine de polyester comprenant ladite résine de polyester (A), de l'oxyde de titane (B), au moins un matériau de renfort (C) choisi dans le groupe constitué d'un matériau de renfort fibreux et d'un matériau de renfort de type aciculaire, et une charge (D) non fibreuse ou non aciculaire, l'oxyde de titane (B), le matériau de renfort (C) et la charge (D) non fibreuse ou non aciculaire étant présents en des quantités respectives allant de 0,5 à 100 parties en masse, de 0 à 100 parties en masse et de 0 à 50 parties en masse, pour 100 parties en masse de la résine de polyester (A). La composition de résine de polyester est appropriée pour être utilisée pour une plaque réfléchissante pour une LED de type encastrable.
PCT/JP2014/063679 2013-06-03 2014-05-23 Résine de polyester et composition de résine de polyester pour plaque réfléchissante pour led de type encastrable WO2014196378A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201480028826.7A CN105246941B (zh) 2013-06-03 2014-05-23 聚酯树脂以及使用聚酯树脂的表面安装型led反射板用聚酯树脂组合物
JP2014541249A JP5915948B2 (ja) 2013-06-03 2014-05-23 ポリエステル樹脂、及びそれを使用した表面実装型led反射板用ポリエステル樹脂組成物
KR1020157035467A KR102158764B1 (ko) 2013-06-03 2014-05-23 폴리에스테르 수지 및 그것을 사용한 표면 실장형 led 반사판용 폴리에스테르 수지 조성물

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013116764 2013-06-03
JP2013-116764 2013-06-03
JP2013-119893 2013-06-06
JP2013119893 2013-06-06

Publications (1)

Publication Number Publication Date
WO2014196378A1 true WO2014196378A1 (fr) 2014-12-11

Family

ID=52008029

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/063679 WO2014196378A1 (fr) 2013-06-03 2014-05-23 Résine de polyester et composition de résine de polyester pour plaque réfléchissante pour led de type encastrable

Country Status (5)

Country Link
JP (1) JP5915948B2 (fr)
KR (1) KR102158764B1 (fr)
CN (1) CN105246941B (fr)
TW (1) TWI599594B (fr)
WO (1) WO2014196378A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018160654A (ja) * 2016-07-19 2018-10-11 パナソニックIpマネジメント株式会社 光反射体、ベース体、発光装置及びベース体の製造方法
CN113292708A (zh) * 2021-05-25 2021-08-24 吉林建筑大学 一种生物基共聚酯及其制备方法和应用

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2567456B (en) * 2017-10-12 2021-08-11 Si Group Switzerland Chaa Gmbh Antidegradant blend
US11220599B2 (en) * 2018-11-26 2022-01-11 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition and article comprising the same
CN113785017B (zh) * 2019-04-18 2024-03-05 科思创知识产权两合公司 具有通过硫酸钡改进的阻燃性的导热聚碳酸酯
JP6687793B1 (ja) * 2019-08-09 2020-04-28 住友化学株式会社 樹脂組成物及び成形体
CN110804284A (zh) * 2019-11-29 2020-02-18 江苏胜帆电子科技有限公司 一种高强度lcp基板封装材料及其制备方法
CN114685766B (zh) * 2020-12-31 2024-02-02 中国石油化工股份有限公司 一种改性生物降解聚酯及其制备方法

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPS55106222A (en) * 1979-02-08 1980-08-14 Toray Ind Inc Preparation of modified polyester
JPH06116373A (ja) * 1992-10-02 1994-04-26 Polyplastics Co 共重合ポリエステル及びポリエステル樹脂組成物
JPH06239982A (ja) * 1993-02-16 1994-08-30 Polyplastics Co 共重合ポリエステル及びポリエステル樹脂組成物
JP2000212118A (ja) * 1999-01-20 2000-08-02 Daicel Chem Ind Ltd 酢酸の精製方法
JP2011075628A (ja) * 2009-09-29 2011-04-14 Sumitomo Chemical Co Ltd 光反射部品用基材
JP2013177491A (ja) * 2012-02-28 2013-09-09 Sumitomo Chemical Co Ltd 液晶ポリエステル組成物及び成形体
JP2013199625A (ja) * 2012-03-26 2013-10-03 Sumitomo Chemical Co Ltd 液晶ポリエステル樹脂組成物及び成形体

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JP3679641B2 (ja) * 1999-02-05 2005-08-03 キヤノン株式会社 電子写真感光体、プロセスカートリッジ及び電子写真装置
JP4082836B2 (ja) * 1999-11-08 2008-04-30 日本化薬株式会社 樹脂組成物及びこれらの硬化物
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US7906610B2 (en) 2005-06-17 2011-03-15 Eastman Chemical Company Food service products comprising polyester compositions formed from 2,2,4,4-tetramethyl-1,3-cyclobutanediol and 1,4-cyclohexanedimethanol
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JP2009001707A (ja) * 2007-06-22 2009-01-08 Toyo Ink Mfg Co Ltd ポリエステル樹脂及び感圧式接着剤組成物
JP5321239B2 (ja) 2009-05-19 2013-10-23 三菱エンジニアリングプラスチックス株式会社 Ledを光源とする照明装置反射板用難燃性ポリエステル樹脂組成物
JP6048833B2 (ja) * 2012-02-24 2016-12-21 東洋紡株式会社 表面実装型led用反射板に使用するポリエステル樹脂組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55106222A (en) * 1979-02-08 1980-08-14 Toray Ind Inc Preparation of modified polyester
JPH06116373A (ja) * 1992-10-02 1994-04-26 Polyplastics Co 共重合ポリエステル及びポリエステル樹脂組成物
JPH06239982A (ja) * 1993-02-16 1994-08-30 Polyplastics Co 共重合ポリエステル及びポリエステル樹脂組成物
JP2000212118A (ja) * 1999-01-20 2000-08-02 Daicel Chem Ind Ltd 酢酸の精製方法
JP2011075628A (ja) * 2009-09-29 2011-04-14 Sumitomo Chemical Co Ltd 光反射部品用基材
JP2013177491A (ja) * 2012-02-28 2013-09-09 Sumitomo Chemical Co Ltd 液晶ポリエステル組成物及び成形体
JP2013199625A (ja) * 2012-03-26 2013-10-03 Sumitomo Chemical Co Ltd 液晶ポリエステル樹脂組成物及び成形体

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018160654A (ja) * 2016-07-19 2018-10-11 パナソニックIpマネジメント株式会社 光反射体、ベース体、発光装置及びベース体の製造方法
JP2018160655A (ja) * 2016-07-19 2018-10-11 パナソニックIpマネジメント株式会社 光反射体用成形材料及びその製造方法、光反射体、ベース体及びその製造方法、並びに発光装置
JP7065381B2 (ja) 2016-07-19 2022-05-12 パナソニックIpマネジメント株式会社 光反射体、ベース体、発光装置及びベース体の製造方法
JP7065382B2 (ja) 2016-07-19 2022-05-12 パナソニックIpマネジメント株式会社 光反射体用成形材料及びその製造方法、光反射体、ベース体及びその製造方法、並びに発光装置
CN113292708A (zh) * 2021-05-25 2021-08-24 吉林建筑大学 一种生物基共聚酯及其制备方法和应用

Also Published As

Publication number Publication date
CN105246941B (zh) 2017-06-16
TW201504274A (zh) 2015-02-01
JPWO2014196378A1 (ja) 2017-02-23
KR102158764B1 (ko) 2020-09-22
KR20160016858A (ko) 2016-02-15
JP5915948B2 (ja) 2016-05-11
TWI599594B (zh) 2017-09-21
CN105246941A (zh) 2016-01-13

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