KR102158764B1 - 폴리에스테르 수지 및 그것을 사용한 표면 실장형 led 반사판용 폴리에스테르 수지 조성물 - Google Patents

폴리에스테르 수지 및 그것을 사용한 표면 실장형 led 반사판용 폴리에스테르 수지 조성물 Download PDF

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KR102158764B1
KR102158764B1 KR1020157035467A KR20157035467A KR102158764B1 KR 102158764 B1 KR102158764 B1 KR 102158764B1 KR 1020157035467 A KR1020157035467 A KR 1020157035467A KR 20157035467 A KR20157035467 A KR 20157035467A KR 102158764 B1 KR102158764 B1 KR 102158764B1
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KR
South Korea
Prior art keywords
polyester resin
mass
acid
resin composition
mol
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KR1020157035467A
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English (en)
Korean (ko)
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KR20160016858A (ko
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게이이치로 도가와
Original Assignee
도요보 가부시키가이샤
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Publication of KR20160016858A publication Critical patent/KR20160016858A/ko
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Publication of KR102158764B1 publication Critical patent/KR102158764B1/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/19Hydroxy compounds containing aromatic rings
    • C08G63/193Hydroxy compounds containing aromatic rings containing two or more aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/346Clay
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Polyesters Or Polycarbonates (AREA)
KR1020157035467A 2013-06-03 2014-05-23 폴리에스테르 수지 및 그것을 사용한 표면 실장형 led 반사판용 폴리에스테르 수지 조성물 KR102158764B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2013-116764 2013-06-03
JP2013116764 2013-06-03
JPJP-P-2013-119893 2013-06-06
JP2013119893 2013-06-06
PCT/JP2014/063679 WO2014196378A1 (fr) 2013-06-03 2014-05-23 Résine de polyester et composition de résine de polyester pour plaque réfléchissante pour led de type encastrable

Publications (2)

Publication Number Publication Date
KR20160016858A KR20160016858A (ko) 2016-02-15
KR102158764B1 true KR102158764B1 (ko) 2020-09-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157035467A KR102158764B1 (ko) 2013-06-03 2014-05-23 폴리에스테르 수지 및 그것을 사용한 표면 실장형 led 반사판용 폴리에스테르 수지 조성물

Country Status (5)

Country Link
JP (1) JP5915948B2 (fr)
KR (1) KR102158764B1 (fr)
CN (1) CN105246941B (fr)
TW (1) TWI599594B (fr)
WO (1) WO2014196378A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7065381B2 (ja) * 2016-07-19 2022-05-12 パナソニックIpマネジメント株式会社 光反射体、ベース体、発光装置及びベース体の製造方法
GB2567456B (en) * 2017-10-12 2021-08-11 Si Group Switzerland Chaa Gmbh Antidegradant blend
US11220599B2 (en) * 2018-11-26 2022-01-11 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition and article comprising the same
CN113785017B (zh) * 2019-04-18 2024-03-05 科思创知识产权两合公司 具有通过硫酸钡改进的阻燃性的导热聚碳酸酯
JP6687793B1 (ja) * 2019-08-09 2020-04-28 住友化学株式会社 樹脂組成物及び成形体
CN110804284A (zh) * 2019-11-29 2020-02-18 江苏胜帆电子科技有限公司 一种高强度lcp基板封装材料及其制备方法
CN114685766B (zh) * 2020-12-31 2024-02-02 中国石油化工股份有限公司 一种改性生物降解聚酯及其制备方法
CN113292708A (zh) * 2021-05-25 2021-08-24 吉林建筑大学 一种生物基共聚酯及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011075628A (ja) 2009-09-29 2011-04-14 Sumitomo Chemical Co Ltd 光反射部品用基材
JP6048833B2 (ja) 2012-02-24 2016-12-21 東洋紡株式会社 表面実装型led用反射板に使用するポリエステル樹脂組成物

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JPS4844699B1 (fr) 1970-01-28 1973-12-26
JPS55106222A (en) * 1979-02-08 1980-08-14 Toray Ind Inc Preparation of modified polyester
JPH06116373A (ja) * 1992-10-02 1994-04-26 Polyplastics Co 共重合ポリエステル及びポリエステル樹脂組成物
JPH06239982A (ja) * 1993-02-16 1994-08-30 Polyplastics Co 共重合ポリエステル及びポリエステル樹脂組成物
JPH10316741A (ja) * 1997-05-20 1998-12-02 Teijin Ltd 表面実装対応電子部品用材料
JP4159160B2 (ja) * 1999-01-20 2008-10-01 ダイセル化学工業株式会社 酢酸の精製方法
JP3679641B2 (ja) * 1999-02-05 2005-08-03 キヤノン株式会社 電子写真感光体、プロセスカートリッジ及び電子写真装置
JP2001131397A (ja) * 1999-11-08 2001-05-15 Nippon Kayaku Co Ltd 樹脂組成物及び、これらの硬化物
JP4082836B2 (ja) * 1999-11-08 2008-04-30 日本化薬株式会社 樹脂組成物及びこれらの硬化物
US8119761B2 (en) 2005-06-17 2012-02-21 Eastman Chemical Company Polyester compositions containing cyclobutanediol having a certain combination of inherent viscosity and high glass transition temperature and articles made therefrom
JP2008231368A (ja) 2007-03-23 2008-10-02 Nippon Oil Corp 光線反射率および強度に優れた液晶ポリエステル樹脂組成物
JP2009001707A (ja) * 2007-06-22 2009-01-08 Toyo Ink Mfg Co Ltd ポリエステル樹脂及び感圧式接着剤組成物
JP5321239B2 (ja) 2009-05-19 2013-10-23 三菱エンジニアリングプラスチックス株式会社 Ledを光源とする照明装置反射板用難燃性ポリエステル樹脂組成物
JP5903732B2 (ja) * 2012-02-28 2016-04-13 住友化学株式会社 液晶ポリエステル組成物及び成形体
JP5924525B2 (ja) * 2012-03-26 2016-05-25 住友化学株式会社 液晶ポリエステル樹脂組成物及び成形体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011075628A (ja) 2009-09-29 2011-04-14 Sumitomo Chemical Co Ltd 光反射部品用基材
JP6048833B2 (ja) 2012-02-24 2016-12-21 東洋紡株式会社 表面実装型led用反射板に使用するポリエステル樹脂組成物

Also Published As

Publication number Publication date
JP5915948B2 (ja) 2016-05-11
TW201504274A (zh) 2015-02-01
TWI599594B (zh) 2017-09-21
JPWO2014196378A1 (ja) 2017-02-23
KR20160016858A (ko) 2016-02-15
WO2014196378A1 (fr) 2014-12-11
CN105246941B (zh) 2017-06-16
CN105246941A (zh) 2016-01-13

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