WO2014196378A1 - Polyester resin, and polyester resin composition for surface-mount-type led reflective plate which comprises same - Google Patents
Polyester resin, and polyester resin composition for surface-mount-type led reflective plate which comprises same Download PDFInfo
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- WO2014196378A1 WO2014196378A1 PCT/JP2014/063679 JP2014063679W WO2014196378A1 WO 2014196378 A1 WO2014196378 A1 WO 2014196378A1 JP 2014063679 W JP2014063679 W JP 2014063679W WO 2014196378 A1 WO2014196378 A1 WO 2014196378A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/19—Hydroxy compounds containing aromatic rings
- C08G63/193—Hydroxy compounds containing aromatic rings containing two or more aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- halogen flame retardant is preferably a combination of dibromopolystyrene and the flame retardant auxiliary is any combination of antimony trioxide, sodium antimonate, and zinc stannate.
- Non-halogen flame retardants include melamine cyanurate, red phosphorus, phosphinic acid metal salts, and nitrogen-containing phosphoric acid compounds. In particular, a combination of a phosphinic acid metal salt and a nitrogen-containing phosphoric acid compound is preferable.
- the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm.
- the polyester obtained had an intrinsic viscosity of 0.60 dl / g, a resin composition of 100 mol% terephthalic acid, 65.0 mol% 4,4′-biphenyldimethanol, ethylene glycol as determined by 1 H-NMR measurement. Was 34.5 mol% and diethylene glycol was 0.5 mol%.
- the composition and characteristic values of the obtained polyester resin are shown in Table 1.
- the obtained polyester had an IV of 0.61 dl / g, and the resin composition was 100 mol% terephthalic acid, 98.0 mol% ethylene glycol, and 2.0 mol% diethylene glycol, as determined by 1 H-NMR. It was.
- the composition and characteristic values of the obtained polyester resin are shown in Table 2.
- Reinforcing material C: Glass fiber (manufactured by Nittobo Co., Ltd., CS-3J-324), acicular wallast (manufactured by NYCO, NYGLOS8) Filler (D): Talc (Micron White 5000A, Hayashi Kasei Co., Ltd.)
- Mold release agent Magnesium stearate Stabilizer: Pentaerythrityl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] (Irganox 1010, manufactured by Ciba Specialty Chemicals)
Abstract
Description
また、これまで表面実装型LED用反射板としては、各種ポリアミドが使用されてきたが、耐熱着色性、耐光性、吸水性に問題があった。 Patent Document 5 discloses a dry unsaturated polyester resin composition containing at least an unsaturated polyester resin, a polymerization initiator, an inorganic filler, a white pigment, a release agent, and a reinforcing material, wherein the unsaturated polyester resin is The total amount of the inorganic filler and the white pigment is in the range of 44 to 74% by mass with respect to the total amount of the composition. The proportion of the white pigment in the total amount of the inorganic filler and the white pigment is 30% by mass or more, and the unsaturated polyester resin is mixed with the unsaturated alkyd resin and the crosslinking agent. Although the unsaturated polyester resin composition for LED reflectors characterized by being is disclosed, there exists a problem in a moldability and light resistance.
In addition, various polyamides have been used as surface mount LED reflectors, but there are problems with heat-resistant coloring, light resistance, and water absorption.
(1)芳香族ジカルボン酸を50モル%以上含有するジカルボン酸成分と、4,4’-ビフェニルジメタノールを15モル%以上含有するグリコール成分とからなるポリエステル樹脂であって、融点が280℃以上であることを特徴とするポリエステル樹脂。
(2)芳香族ジカルボン酸が4,4’-ビフェニルジカルボン酸、テレフタル酸、及び2,6-ナフタレンジカルボン酸からなる群から選択される少なくとも一種のジカルボン酸を含むことを特徴とする(1)に記載のポリエステル樹脂。
(3)ポリエステル樹脂を構成する4,4’-ビフェニルジメタノール以外のグリコール成分が、エチレングリコール、1,4-シクロヘキサンジメタノール、1,3-プロパンジオール、ネオペンチルグリコール、及び1,4-ブタンジオールからなる群から選択される少なくとも一種のグリコールを含むことを特徴とする(1)又は(2)に記載のポリエステル樹脂。
(4)ポリエステル樹脂の融点(Tm)と降温結晶化温度(Tc2)の差が、42℃以下であることを特徴とする(1)~(3)のいずれかに記載のポリエステル樹脂。
(5)ポリエステル樹脂の酸価が、1~40eq/tであることを特徴とする(1)~(4)のいずれかに記載のポリエステル樹脂。
(6)(1)~(5)のいずれかに記載のポリエステル樹脂(A)、酸化チタン(B)、繊維状強化材及び針状強化材からなる群より選択される少なくとも1種の強化材(C)、及び非繊維状又は非針状充填材(D)を含有し、ポリエステル樹脂(A)100質量部に対して酸化チタン(B)、強化材(C)、及び非繊維状又は非針状充填材(D)がそれぞれ0.5~100質量部、0~100質量部、及び0~50質量部の割合で存在することを特徴とする表面実装型LED用反射板に使用するためのポリエステル樹脂組成物。
(7)非繊維状又は非針状充填材(D)がタルクであり、ポリエステル樹脂(A)100質量部に対してタルク0.1~5質量部の割合で含有することを特徴とする(6)に記載のポリエステル樹脂組成物。
(8)ハンダリフロー耐熱温度が260℃以上であることを特徴とする(6)または(7)に記載のポリエステル樹脂組成物。
(9)ハンダリフロー耐熱温度が280℃以上であることを特徴とする(6)~(8)のいずれかに記載のポリエステル樹脂組成物。
(10)ポリエステル樹脂組成物の融解ピーク温度(Tm)が280℃以上であり、融解ピーク温度(Tm)と降温結晶化温度(Tc2)の差が、42℃以下であることを特徴とする(6)~(9)のいずれかに記載のポリエステル樹脂組成物。
(11)(6)~(10)のいずれかに記載のポリエステル樹脂組成物を用いて成形して得られることを特徴とする表面実装型LED用反射板。 That is, the present invention has the following configurations (1) to (11).
(1) A polyester resin comprising a dicarboxylic acid component containing 50 mol% or more of an aromatic dicarboxylic acid and a glycol component containing 15 mol% or more of 4,4′-biphenyldimethanol, having a melting point of 280 ° C. or more Polyester resin characterized by being.
(2) The aromatic dicarboxylic acid contains at least one dicarboxylic acid selected from the group consisting of 4,4′-biphenyldicarboxylic acid, terephthalic acid, and 2,6-naphthalenedicarboxylic acid (1) The polyester resin as described in.
(3) The glycol component other than 4,4′-biphenyldimethanol constituting the polyester resin is ethylene glycol, 1,4-cyclohexanedimethanol, 1,3-propanediol, neopentyl glycol, and 1,4-butane. The polyester resin according to (1) or (2), comprising at least one glycol selected from the group consisting of diols.
(4) The polyester resin according to any one of (1) to (3), wherein the difference between the melting point (Tm) of the polyester resin and the cooling crystallization temperature (Tc2) is 42 ° C. or less.
(5) The polyester resin according to any one of (1) to (4), wherein the acid value of the polyester resin is 1 to 40 eq / t.
(6) At least one reinforcing material selected from the group consisting of the polyester resin (A), titanium oxide (B), fibrous reinforcing material and acicular reinforcing material according to any one of (1) to (5) (C) and non-fibrous or non-needle-like filler (D), and 100 parts by mass of polyester resin (A), titanium oxide (B), reinforcing material (C), and non-fibrous or non-fibrous To be used for a reflector for a surface-mounted LED, wherein the needle-like filler (D) is present in a ratio of 0.5 to 100 parts by mass, 0 to 100 parts by mass, and 0 to 50 parts by mass, respectively. Polyester resin composition.
(7) The non-fibrous or non-needle filler (D) is talc and is contained in a proportion of 0.1 to 5 parts by mass of talc with respect to 100 parts by mass of the polyester resin (A) ( The polyester resin composition as described in 6).
(8) Solder reflow heat-resistant temperature is 260 degreeC or more, The polyester resin composition as described in (6) or (7) characterized by the above-mentioned.
(9) The polyester resin composition according to any one of (6) to (8), wherein the solder reflow heat-resistant temperature is 280 ° C. or higher.
(10) The polyester resin composition has a melting peak temperature (Tm) of 280 ° C. or higher, and a difference between the melting peak temperature (Tm) and the cooling crystallization temperature (Tc2) is 42 ° C. or lower ( The polyester resin composition according to any one of 6) to (9).
(11) A surface-mounted LED reflector obtained by molding the polyester resin composition according to any one of (6) to (10).
1,1,2,2-テトラクロルエタン/フェノ-ル(2:3重量比)混合溶媒中、30℃での溶液粘度から求めた。
(2)酸価
ポリエステル樹脂0.1gをベンジルアルコール10mlに加熱溶解した後、0.1NのNaOHのメタノール/ベンジルアルコール(1/9容積比)の溶液を使用して滴定して求めた。
(3)ポリエステル樹脂の融点(Tm)、および樹脂組成物の融解ピーク温度(Tm)、降温結晶化温度(Tc2)
セイコ-電子工業株式会社製の示差熱分析計(DSC)、RDC-220で測定した。昇温速度20℃/分で昇温し、330℃で3分間保持したのち、330℃から130℃までを10℃/分で降温した。なお、330℃で融解しない場合は、340℃で3分間保持したのち、340℃から130℃までを10℃/分で降温した。昇温時に観察される融解ピ-クの頂点温度を融点(Tm)、降温時に観察される結晶化ピ-クの頂点温度を降温結晶化温度(Tc2)とした。 (1) Intrinsic viscosity of polyester resin (IV)
The viscosity was determined from the solution viscosity at 30 ° C. in a 1,1,2,2-tetrachloroethane / phenol (2: 3 weight ratio) mixed solvent.
(2) Acid value The polyester resin (0.1 g) was dissolved by heating in 10 ml of benzyl alcohol, and then titrated with a 0.1N NaOH methanol / benzyl alcohol (1/9 volume ratio) solution.
(3) Melting point (Tm) of polyester resin, melting peak temperature (Tm) of resin composition, temperature drop crystallization temperature (Tc2)
Measurements were made with a differential thermal analyzer (DSC), RDC-220, manufactured by Seiko Denshi Kogyo Co., Ltd. The temperature was raised at a rate of temperature increase of 20 ° C./min, held at 330 ° C. for 3 minutes, and then cooled from 330 ° C. to 130 ° C. at a rate of 10 ° C./min. In addition, when not melting | dissolving at 330 degreeC, after hold | maintaining at 340 degreeC for 3 minutes, 340 to 130 degreeC was temperature-fallen at 10 degree-C / min. The peak temperature of the melting peak observed when the temperature was raised was defined as the melting point (Tm), and the peak temperature of the crystallization peak observed when the temperature was decreased was the lowered crystallization temperature (Tc2).
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は125℃に設定し、フィルムゲートを有する縦100mm、横100mm、厚み1mmtの平板作製用金型を使用し、射出成形を実施した。射出速度50mm/秒、保圧30MPa、射出時間10秒、冷却時間10秒で成型を行い、成形性の評価は以下のような基準で行った。
○:問題なく成型品が得られる。
△:時々スプルーが金型に残る。
×:離型性が不十分であり、成型品が金型に貼り付いたり変形する。
さらに、得られた成型品の寸法安定性の評価を行うために、上記成型品を180℃で1時間加熱した。加熱前後における、流動方向に垂直な方向の寸法を測定し、寸法変化量は以下のように求めた。
寸法変化量(%)={加熱前の寸法(mm)-加熱後の寸法(mm)}/加熱前の寸法(mm)×100
寸法安定性の評価は以下のような基準で行なった。
〇:寸法変化量が0.2%未満
×:寸法変化量が0.2%以上 (4) Moldability and dimensional stability Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature was set to the melting point of the resin + 20 ° C., the mold temperature was set to 125 ° C., and the film gate had a length of 100 mm, a width of 100 mm, Injection molding was performed using a flat plate mold having a thickness of 1 mmt. Molding was performed at an injection speed of 50 mm / second, a holding pressure of 30 MPa, an injection time of 10 seconds, and a cooling time of 10 seconds. The moldability was evaluated according to the following criteria.
○: A molded product can be obtained without problems.
Δ: Sprue sometimes remains in the mold.
X: The releasability is insufficient, and the molded product sticks to the mold or deforms.
Furthermore, in order to evaluate the dimensional stability of the obtained molded product, the molded product was heated at 180 ° C. for 1 hour. The dimension in the direction perpendicular to the flow direction before and after heating was measured, and the amount of dimensional change was determined as follows.
Dimensional change (%) = {Dimension before heating (mm) −Dimension after heating (mm)} / Dimension before heating (mm) × 100
The dimensional stability was evaluated according to the following criteria.
○: Dimensional change is less than 0.2% ×: Dimensional change is 0.2% or more
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は140℃に設定し、長さ127mm、幅12.6mm、厚み0.8mmtのUL燃焼試験用テストピースを射出成形し、試験片を作製した。試験片は85℃、85%RH(相対湿度)の雰囲気中に72時間放置した。試験片はエアリフロー炉中(エイテック製 AIS-20-82C)、室温から150℃まで60秒かけて昇温させ予備加熱を行った後、190℃まで0.5℃/分の昇温速度でプレヒートを実施した。その後、100℃/分の速度で所定の設定温度まで昇温し、所定の温度で10秒間保持した後、冷却を行った。設定温度は240℃から5℃おきに増加させ、表面の膨れや変形が発生しなかった最高の設定温度をリフロー耐熱温度とし、以下の基準でハンダ耐熱性を評価した。
◎:リフロー耐熱温度が280℃以上
○:リフロー耐熱温度が260℃以上280℃未満
×:リフロー耐熱温度が260℃未満 (5) Solder heat resistance Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C., the mold temperature is set to 140 ° C., the length is 127 mm, the width is 12.6 mm, and the thickness is 0.8 mm. The test piece for the UL combustion test was injection molded to produce a test piece. The test piece was left in an atmosphere of 85 ° C. and 85% RH (relative humidity) for 72 hours. The specimen was heated in an air reflow furnace (AIS-20-82C manufactured by ATEC) from room temperature to 150 ° C over 60 seconds, preheated, and then heated to 190 ° C at a rate of 0.5 ° C / min. Preheating was performed. Thereafter, the temperature was raised to a predetermined set temperature at a rate of 100 ° C./min, held at the predetermined temperature for 10 seconds, and then cooled. The set temperature was increased from 240 ° C. every 5 ° C., and the highest set temperature at which surface swelling and deformation did not occur was defined as the reflow heat resistant temperature, and the solder heat resistance was evaluated according to the following criteria.
A: Reflow heat resistant temperature is 280 ° C or higher. ○: Reflow heat resistant temperature is 260 ° C or higher and lower than 280 ° C. X: Reflow heat resistant temperature is lower than 260 ° C.
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は140℃に設定し、縦100mm、横100mm、厚み2mmの平板を射出成形し、評価用試験片を作製した。この試験片を用いて、日立製作所製の自記分光光度計「U3500」に同社製の積分球を設置し、350nmから800nmの波長の反射率を測定した。反射率の比較には460nmの波長における拡散反射率を求めた。リファレンスには硫酸バリウムを用いた。 (6) Diffuse reflectance Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C, the mold temperature is set to 140 ° C, and a flat plate of 100mm in length, 100mm in width and 2mm in thickness is injection molded. Then, a test piece for evaluation was produced. Using this test piece, an integrating sphere manufactured by Hitachi, Ltd. was installed in a self-recording spectrophotometer “U3500” manufactured by Hitachi, Ltd., and the reflectance at wavelengths from 350 nm to 800 nm was measured. For comparison of reflectance, diffuse reflectance at a wavelength of 460 nm was obtained. Barium sulfate was used as a reference.
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は140℃に設定し、縦100mm、横100mm、厚み1mmの平板を射出成形し、評価用試験片を作製した。この試験片を80℃熱水中に50時間浸漬させ、飽和吸水時及び乾燥時の重量から以下の式より飽和吸水率を求めた。
飽和吸水率(%)={(飽和吸水時の重量-乾燥時の重量)/乾燥時の重量}×100 (7) Saturated water absorption Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C, the mold temperature is set to 140 ° C, and a flat plate of 100mm length, 100mm width and 1mm thickness is injection molded. Then, a test piece for evaluation was produced. This test piece was immersed in hot water at 80 ° C. for 50 hours, and the saturated water absorption was determined from the following equation from the weight at the time of saturated water absorption and drying.
Saturated water absorption (%) = {(weight at saturated water absorption−weight at drying) / weight at drying} × 100
東芝機械製射出成形機IS-100を用い、シリンダー温度は330℃、金型温度は120℃に設定し、射出圧設定値40%、射出速度設定値40%、計量35mm、射出時間6秒、冷却時間10秒の条件で、幅1mm、厚み0.5mmの流動長測定用金型で射出成形し、評価用試験片を作製した。流動性の評価として、この試験片の流動長さ(mm)を測定した。 (8) Fluidity Using Toshiba Machine's injection molding machine IS-100, cylinder temperature is set to 330 ° C, mold temperature is set to 120 ° C, injection pressure set value is 40%, injection speed set value is 40%, weighing is 35mm, Under the conditions of an injection time of 6 seconds and a cooling time of 10 seconds, injection molding was performed with a flow length measuring mold having a width of 1 mm and a thickness of 0.5 mm to prepare an evaluation test piece. As an evaluation of fluidity, the flow length (mm) of this test piece was measured.
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は140℃に設定し、縦100mm、横100mm、厚み2mmの平板を射出成形し、評価用試験片を作製した。この試験片の片面に、シリコーン封止材(信越シリコーン社製、ASP-1110、封止材硬度D60)をコーティング厚み約100μmになるようにコーティングし、100℃×1時間のプレヒーティング後、150℃×4時間の硬化処理をして試験片の片面に封止材皮膜を形成させた。
次いで、試験片上の封止材皮膜に対して、JIS K5400に基づく碁盤目試験(1mm幅クロスカット100マス)を行ない、以下の基準で密着性を評価した。
○:剥離マス目数10以下
×:剥離試験前のマス目形成時に剥離あり (9) Adhesion of silicone Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C, the mold temperature is set to 140 ° C, and a flat plate of 100mm length, 100mm width and 2mm thickness is injection molded. Then, a test piece for evaluation was produced. One side of this test piece was coated with a silicone sealing material (Shin-Etsu Silicone Co., ASP-1110, sealing material hardness D60) to a coating thickness of about 100 μm, and after preheating at 100 ° C. for 1 hour, A curing treatment was performed at 150 ° C. for 4 hours to form a sealing material film on one side of the test piece.
Next, a cross-cut test (1 mm width crosscut 100 mass) based on JIS K5400 was performed on the sealing material film on the test piece, and the adhesion was evaluated according to the following criteria.
○: No more than 10 peeling cells ×: There is peeling when forming the cells before the peeling test
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は140℃に設定し、縦100mm、横100mm、厚み2mmの平板を射出成形し、評価用試験片を作製した。この試験片について、超促進耐候試験機「アイスーパーUVテスターSUV-F11」を用い、63℃50%RHの環境下、50mW/cm2の照度でUV照射を実施した。試験片の波長460nmの光反射率を、照射前と照射60時間後に測定した。照射前試験片の光反射率に対する、照射後試験片の光反射率の保持率により、耐光性を以下の基準で評価した。
◎:保持率95%以上
○:保持率95%未満~90%以上
△:保持率90%未満~85%以上
×:保持率85%未満 (10) Light resistance Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C, the mold temperature is set to 140 ° C, and a flat plate 100mm long, 100mm wide and 2mm thick is injection molded. A test piece for evaluation was prepared. This test piece was irradiated with UV light at an illuminance of 50 mW / cm 2 in an environment of 63 ° C. and 50% RH using a super accelerated weathering tester “I Super UV Tester SUV-F11”. The light reflectance at a wavelength of 460 nm of the test piece was measured before irradiation and 60 hours after irradiation. The light resistance was evaluated according to the following criteria based on the retention of the light reflectance of the test piece after irradiation with respect to the light reflectance of the test piece before irradiation.
◎: Retention rate 95% or more ○: Retention rate less than 95% to 90% or more △: Retention rate less than 90% to 85% or more ×: Retention rate less than 85%
東芝機械製射出成形機EC-100を用い、シリンダー温度は樹脂の融点+20℃、金型温度は140℃に設定し、縦100mm、横100mm、厚み2mmの平板を射出成形し、評価用試験片を作製した。この試験片を用いて、熱風乾燥機にて150℃で2時間処理して、目視にて黄変性を確認し、以下の基準で評価した。
○:変化なし
△:若干黄変する
×:黄変する (11) Heat-resistant yellowing Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C, the mold temperature is set to 140 ° C, and a flat plate of 100mm length, 100mm width and 2mm thickness is injection molded. Then, a test piece for evaluation was produced. Using this test piece, it processed at 150 degreeC with a hot air dryer for 2 hours, confirmed yellowing visually, and evaluated it on the following references | standards.
○: No change △: Slightly yellow ×: Yellowish
攪拌機付き20リッターステンレス製オートクレーブに、高純度ジメチルテレフタル酸3880g、4,4’-ビフェニルジメタノール2782g、エチレングリコール1922g、酢酸マンガン2g、二酸化ゲルマニウム0.86gを仕込み、エステル交換後、60分間かけて300℃まで昇温しつつ、反応系の圧力を徐々に下げて13.3Pa(0.1Torr)として、さらに310℃、13.3Paで重縮合反応を実施した。放圧に続き、微加圧下のレジンを水中にストランド状に吐出して冷却後、カッターで切断して長さ約3mm、直径約2mmのシリンダー形状のペレットを得た。得られたポリエステルの極限粘度は、0.60dl/g、樹脂組成は、1H-NMR測定により、テレフタル酸が100モル%、4,4’-ビフェニルジメタノールが65.0モル%、エチレングリコールが34.5モル%、ジエチレングリコールが0.5モル%であった。得られたポリエステル樹脂の組成及び特性値を表1に示す。 (Example 1)
A 20-liter stainless steel autoclave equipped with a stirrer was charged with 3880 g of high-purity dimethyl terephthalic acid, 2782 g of 4,4′-biphenyldimethanol, 1922 g of ethylene glycol, 2 g of manganese acetate, and 0.86 g of germanium dioxide. While raising the temperature to 300 ° C., the pressure of the reaction system was gradually decreased to 13.3 Pa (0.1 Torr), and a polycondensation reaction was further performed at 310 ° C. and 13.3 Pa. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The polyester obtained had an intrinsic viscosity of 0.60 dl / g, a resin composition of 100 mol% terephthalic acid, 65.0 mol% 4,4′-biphenyldimethanol, ethylene glycol as determined by 1 H-NMR measurement. Was 34.5 mol% and diethylene glycol was 0.5 mol%. The composition and characteristic values of the obtained polyester resin are shown in Table 1.
使用する原料の量や種類を変更する以外は、実施例1のポリエステル樹脂の重合と同様にして、各ポリエステル樹脂を得た。得られた各ポリエステル樹脂の組成及び特性値を表1に示す。なお、ジエチレングリコールは、エチレングリコールが縮合して副生したものである。 (Examples 2 to 4)
Each polyester resin was obtained in the same manner as in the polymerization of the polyester resin of Example 1 except that the amount and type of raw materials used were changed. Table 1 shows the composition and characteristic values of the obtained polyester resins. Diethylene glycol is a by-product of condensation of ethylene glycol.
攪拌機付き20リッターステンレス製オートクレーブに、高純度ジメチルテレフタル酸3880g、4,4’-ビフェニルジメタノール2782g、エチレングリコール1922g、酢酸マンガン2g、二酸化ゲルマニウム0.86gを仕込み、エステル交換後、高純度テレフタル酸を8g添加して、60分間かけて300℃まで昇温しつつ、反応系の圧力を徐々に下げて13.3Pa(0.1Torr)として、さらに310℃、13.3Paで重縮合反応を実施した。放圧に続き、微加圧下のレジンを水中にストランド状に吐出して冷却後、カッターで切断して長さ約3mm、直径約2mmのシリンダー形状のペレットを得た。得られたポリエステルの極限粘度は、0.60dl/g、樹脂組成は、1H-NMR測定により、テレフタル酸が100モル%、4,4’-ビフェニルジメタノールが65.0モル%、エチレングリコールが34.5モル%、ジエチレングリコールが0.5モル%であった。得られたポリエステル樹脂の組成及び特性値を表1に示す。 (Example 5)
A 20-liter stainless steel autoclave equipped with a stirrer was charged with 3880 g of high-purity dimethyl terephthalic acid, 2782 g of 4,4′-biphenyldimethanol, 1922 g of ethylene glycol, 2 g of manganese acetate, and 0.86 g of germanium dioxide. Was added, and the temperature of the reaction system was gradually decreased to 13.3 Pa (0.1 Torr) while raising the temperature to 300 ° C. over 60 minutes, and further polycondensation reaction was performed at 310 ° C. and 13.3 Pa. did. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The polyester obtained had an intrinsic viscosity of 0.60 dl / g, a resin composition of 100 mol% terephthalic acid, 65.0 mol% 4,4′-biphenyldimethanol, ethylene glycol as determined by 1 H-NMR measurement. Was 34.5 mol% and diethylene glycol was 0.5 mol%. The composition and characteristic values of the obtained polyester resin are shown in Table 1.
攪拌機付き20リッターステンレス製オートクレーブに、高純度テレフタル酸とその2倍モル量のエチレングリコールを仕込み、トリエチルアミンを酸成分に対して0.3モル%加え、0.25MPaの加圧下250℃にて水を系外に留去しながらエステル化反応を行い、エステル化率が約95%のビス(2-ヒドロキシエチル)テレフタレートおよびオリゴマーの混合物(以下BHET混合物という)を得た。このBHET混合物に重合触媒として、二酸化ゲルマニウム(Geとして100ppm)を加え、次いで、窒素雰囲気下、常圧にて250℃で10分間攪拌した。その後、60分間かけて280℃まで昇温しつつ反応系の圧力を徐々に下げて13.3Pa(0.1Torr)として、さらに280℃、13.3Paで重縮合反応を実施した。放圧に続き、微加圧下のレジンを水中にストランド状に吐出して冷却後、カッターで切断して長さ約3mm、直径約2mmのシリンダー形状のペレットを得た。得られたポリエステルのIVは0.61dl/gで、樹脂組成は、1H-NMR測定により、テレフタル酸が100モル%、エチレングリコールが98.0モル%、ジエチレングリコールが2.0モル%であった。得られたポリエステル樹脂の組成及び特性値を表2に示す。 (Comparative Example 1)
A 20-liter stainless steel autoclave with a stirrer is charged with high-purity terephthalic acid and twice its amount of ethylene glycol, and 0.3 mol% of triethylamine is added to the acid component, and water is added at 250 ° C. under a pressure of 0.25 MPa. The esterification reaction was carried out while distilling out of the system to obtain a mixture of bis (2-hydroxyethyl) terephthalate and oligomer (hereinafter referred to as BHET mixture) having an esterification rate of about 95%. To this BHET mixture, germanium dioxide (100 ppm as Ge) was added as a polymerization catalyst, and then stirred at 250 ° C. for 10 minutes under a nitrogen atmosphere at normal pressure. Thereafter, the pressure in the reaction system was gradually decreased to 13.3 Pa (0.1 Torr) while the temperature was raised to 280 ° C. over 60 minutes, and a polycondensation reaction was further performed at 280 ° C. and 13.3 Pa. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The obtained polyester had an IV of 0.61 dl / g, and the resin composition was 100 mol% terephthalic acid, 98.0 mol% ethylene glycol, and 2.0 mol% diethylene glycol, as determined by 1 H-NMR. It was. The composition and characteristic values of the obtained polyester resin are shown in Table 2.
使用する原料の種類を変更する以外は、比較例1のポリエステル樹脂の重合と同様にして、各ポリエステル樹脂を得た。得られた各ポリエステル樹脂の組成及び特性値を表2に示す。 (Comparative Examples 2 to 4)
Each polyester resin was obtained in the same manner as in the polymerization of the polyester resin of Comparative Example 1 except that the type of raw material used was changed. Table 2 shows the composition and characteristic values of the obtained polyester resins.
テレフタル酸3272.9g(19.70モル)、1,9-ノナンジアミン2849.2g(18.0モル)、2-メチル-1,8-オクタンジアミン316.58g(2.0モル)、安息香酸73.27g(0.60モル)、次亜リン酸ナトリウム一水和物6.5g(原料に対して0.1重量%)および蒸留水6リットルを内容積20リットルのオートクレーブに入れ、窒素置換した。100℃で30分間撹拌し、2時間かけて内部温度を210℃に昇温した。この時、オートクレーブは22kg/cm2まで昇圧した。そのまま1時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を22kg/cm2に保ちながら反応させた。次に、30分かけて圧力を10kg/cm2まで下げ、更に1時間反応させて、極限粘度[η]が0.25dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の大きさまで粉砕した。これを230℃、0.1mmHg下にて、10時間固相重合し、融点が310℃、極限粘度[η]が1.33dl/g、末端の封止率が90%である白色のポリアミド樹脂を得た。得られたポリアミド樹脂の組成及び特性値を表2に示す。 (Comparative Example 5: Polyamide resin)
Terephthalic acid 3272.9 g (19.70 mol), 1,9-nonanediamine 2849.2 g (18.0 mol), 2-methyl-1,8-octanediamine 316.58 g (2.0 mol), benzoic acid 73 .27 g (0.60 mol), 6.5 g of sodium hypophosphite monohydrate (0.1% by weight based on the raw material) and 6 liters of distilled water were placed in an autoclave having an internal volume of 20 liters and purged with nitrogen. . The mixture was stirred at 100 ° C. for 30 minutes, and the internal temperature was raised to 210 ° C. over 2 hours. At this time, the autoclave was pressurized to 22 kg / cm 2 . The reaction was continued for 1 hour, and then the temperature was raised to 230 ° C., and then the temperature was maintained at 230 ° C. for 2 hours. The reaction was carried out while gradually removing water vapor and maintaining the pressure at 22 kg / cm 2 . Next, the pressure was reduced to 10 kg / cm 2 over 30 minutes and the reaction was further continued for 1 hour to obtain a prepolymer having an intrinsic viscosity [η] of 0.25 dl / g. This was dried at 100 ° C. under reduced pressure for 12 hours and pulverized to a size of 2 mm or less. A white polyamide resin obtained by solid-phase polymerization at 230 ° C. and 0.1 mmHg for 10 hours, having a melting point of 310 ° C., an intrinsic viscosity [η] of 1.33 dl / g, and a terminal sealing rate of 90%. Got. The composition and characteristic values of the obtained polyamide resin are shown in Table 2.
表3、4に記載の成分と質量割合で、コペリオン(株)製二軸押出機STS-35を用いて、ポリエステル樹脂(A)またはポリアミド樹脂の融点+15℃で溶融混練し、実施例6~13、比較例6~10の樹脂組成物を得た。表3、4中、ポリエステル樹脂(A)以外の使用材料の詳細は以下の通りである。
酸化チタン(B):石原産業(株)製 タイペークCR-60、ルチル型TiO2、平均粒径0.2μm
強化材(C):ガラス繊維(日東紡績(株)製、CS-3J-324)、針状ワラスト((株)NYCO製、NYGLOS8)
充填材(D):タルク(林化成(株)製 ミクロンホワイト5000A)
離型剤:ステアリン酸マグネシウム
安定剤:ペンタエリスリチル・テトラキス[3-(3、5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート](チバ・スペシャリティーケミカルズ製、イルガノックス1010) (Examples 6 to 13, Comparative Examples 6 to 10)
The components and mass ratios shown in Tables 3 and 4 were melt-kneaded at a melting point of polyester resin (A) or polyamide resin + 15 ° C. using a twin screw extruder STS-35 manufactured by Coperion Co., Ltd. 13. Resin compositions of Comparative Examples 6 to 10 were obtained. In Tables 3 and 4, the details of the materials used other than the polyester resin (A) are as follows.
Titanium oxide (B): Ipehara Sangyo Co., Ltd. Typek CR-60, rutile TiO 2 , average particle size 0.2 μm
Reinforcing material (C): Glass fiber (manufactured by Nittobo Co., Ltd., CS-3J-324), acicular wallast (manufactured by NYCO, NYGLOS8)
Filler (D): Talc (Micron White 5000A, Hayashi Kasei Co., Ltd.)
Mold release agent: Magnesium stearate Stabilizer: Pentaerythrityl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] (Irganox 1010, manufactured by Ciba Specialty Chemicals)
Claims (11)
- 芳香族ジカルボン酸を50モル%以上含有するジカルボン酸成分と、4,4’-ビフェニルジメタノールを15モル%以上含有するグリコール成分とからなるポリエステル樹脂であって、融点が280℃以上であることを特徴とするポリエステル樹脂。 A polyester resin comprising a dicarboxylic acid component containing 50 mol% or more of aromatic dicarboxylic acid and a glycol component containing 15 mol% or more of 4,4′-biphenyldimethanol, and has a melting point of 280 ° C. or more. Polyester resin characterized by
- 芳香族ジカルボン酸が4,4’-ビフェニルジカルボン酸、テレフタル酸、及び2,6-ナフタレンジカルボン酸からなる群から選択される少なくとも一種のジカルボン酸を含むことを特徴とする請求項1に記載のポリエステル樹脂。 The aromatic dicarboxylic acid according to claim 1, comprising at least one dicarboxylic acid selected from the group consisting of 4,4'-biphenyldicarboxylic acid, terephthalic acid, and 2,6-naphthalenedicarboxylic acid. Polyester resin.
- ポリエステル樹脂を構成する4,4’-ビフェニルジメタノール以外のグリコール成分が、エチレングリコール、1,4-シクロヘキサンジメタノール、1,3-プロパンジオール、ネオペンチルグリコール、及び1,4-ブタンジオールからなる群から選択される少なくとも一種のグリコールを含むことを特徴とする請求項1又は2に記載のポリエステル樹脂。 The glycol component other than 4,4′-biphenyldimethanol constituting the polyester resin is composed of ethylene glycol, 1,4-cyclohexanedimethanol, 1,3-propanediol, neopentyl glycol, and 1,4-butanediol. The polyester resin according to claim 1, comprising at least one glycol selected from the group.
- ポリエステル樹脂の融点(Tm)と降温結晶化温度(Tc2)の差が、42℃以下であることを特徴とする請求項1~3のいずれかに記載のポリエステル樹脂。 The polyester resin according to any one of claims 1 to 3, wherein the difference between the melting point (Tm) of the polyester resin and the cooling crystallization temperature (Tc2) is 42 ° C or less.
- ポリエステル樹脂の酸価が、1~40eq/tであることを特徴とする請求項1~4のいずれかに記載のポリエステル樹脂。 The polyester resin according to any one of claims 1 to 4, wherein the polyester resin has an acid value of 1 to 40 eq / t.
- 請求項1~5のいずれかに記載のポリエステル樹脂(A)、酸化チタン(B)、繊維状強化材及び針状強化材からなる群より選択される少なくとも1種の強化材(C)、及び非繊維状又は非針状充填材(D)を含有し、ポリエステル樹脂(A)100質量部に対して酸化チタン(B)、強化材(C)、及び非繊維状又は非針状充填材(D)がそれぞれ0.5~100質量部、0~100質量部、及び0~50質量部の割合で存在することを特徴とする表面実装型LED用反射板に使用するためのポリエステル樹脂組成物。 The polyester resin (A) according to any one of claims 1 to 5, titanium oxide (B), at least one reinforcing material (C) selected from the group consisting of a fibrous reinforcing material and a needle-shaped reinforcing material, and Contains non-fibrous or non-needle filler (D), and 100 parts by mass of polyester resin (A), titanium oxide (B), reinforcing material (C), and non-fibrous or non-needle filler ( D) is present in a proportion of 0.5 to 100 parts by weight, 0 to 100 parts by weight, and 0 to 50 parts by weight, respectively, and a polyester resin composition for use in a reflector for a surface mount LED .
- 非繊維状又は非針状充填材(D)がタルクであり、ポリエステル樹脂(A)100質量部に対してタルク0.1~5質量部の割合で含有することを特徴とする請求項6に記載のポリエステル樹脂組成物。 The non-fibrous or non-needle-like filler (D) is talc, and is contained at a ratio of 0.1 to 5 parts by mass of talc with respect to 100 parts by mass of the polyester resin (A). The polyester resin composition as described.
- ハンダリフロー耐熱温度が260℃以上であることを特徴とする請求項6または7に記載のポリエステル樹脂組成物。 Solder reflow heat-resistant temperature is 260 degreeC or more, The polyester resin composition of Claim 6 or 7 characterized by the above-mentioned.
- ハンダリフロー耐熱温度が280℃以上であることを特徴とする請求項6~8のいずれかに記載のポリエステル樹脂組成物。 The polyester resin composition according to any one of claims 6 to 8, which has a solder reflow heat-resistant temperature of 280 ° C or higher.
- ポリエステル樹脂組成物の融解ピーク温度(Tm)が280℃以上であり、融解ピーク温度(Tm)と降温結晶化温度(Tc2)の差が、42℃以下であることを特徴とする請求項6~9のいずれかに記載のポリエステル樹脂組成物。 The melting peak temperature (Tm) of the polyester resin composition is 280 ° C. or higher, and the difference between the melting peak temperature (Tm) and the cooling crystallization temperature (Tc2) is 42 ° C. or lower. The polyester resin composition according to any one of 9.
- 請求項6~10のいずれかに記載のポリエステル樹脂組成物を用いて成形して得られることを特徴とする表面実装型LED用反射板。 A surface-mount type LED reflector obtained by molding the polyester resin composition according to any one of claims 6 to 10.
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CN113292708A (en) * | 2021-05-25 | 2021-08-24 | 吉林建筑大学 | Bio-based copolyester and preparation method and application thereof |
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US11220599B2 (en) * | 2018-11-26 | 2022-01-11 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition and article comprising the same |
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Also Published As
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KR20160016858A (en) | 2016-02-15 |
TW201504274A (en) | 2015-02-01 |
KR102158764B1 (en) | 2020-09-22 |
CN105246941A (en) | 2016-01-13 |
JP5915948B2 (en) | 2016-05-11 |
JPWO2014196378A1 (en) | 2017-02-23 |
CN105246941B (en) | 2017-06-16 |
TWI599594B (en) | 2017-09-21 |
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