JP6260085B2 - Polyester resin composition for LED reflector - Google Patents

Description

  The present invention relates to a polyester resin composition suitable for use in a reflector for a surface-mounted LED having excellent moldability, fluidity, dimensional stability, low water absorption, solder heat resistance, surface reflectance, and the like. Furthermore, the present invention relates to a polyester resin composition suitable for use in a reflector for a surface-mounted LED having excellent gold / tin solder heat resistance, light resistance and low water absorption.

  In recent years, LEDs (light-emitting diodes) are used for lighting fixtures, optical elements, mobile phones, backlights for liquid crystal displays, automobile console panels, traffic lights, etc. by utilizing features such as low power consumption, long life, high brightness, and miniaturization. It is applied to display boards. In applications where design and portability are important, surface mounting technology is used to achieve lightness, thinness, and miniaturization.

  A surface-mounted LED is generally composed of a light-emitting LED chip, a lead wire, a reflector that also serves as a case, and a sealing resin. In order to join the entire component mounted on an electronic board with lead-free solder In addition, each component must be formed of a material that can withstand the soldering reflow temperature of 260 ° C. The melting point (melting peak temperature) of the material is required to be 280 ° C. or higher. In particular, regarding the reflector, in addition to these heat resistances, surface reflectivity for efficiently extracting light and durability against heat and ultraviolet rays are required. From this point of view, various heat-resistant plastic materials such as ceramics, semi-aromatic polyamides, liquid crystal polymers, and thermosetting silicones have been studied. Among them, high refractive fillers such as titanium oxide are dispersed in semi-aromatic polyamides and polyesters. The resin made has a good balance of mass productivity, heat resistance, surface reflectance, etc., and is most commonly used. Recently, with the generalization of LEDs, it is necessary to further improve the workability and reliability of the reflector, and long-term heat-resistant coloring and light resistance are required to be improved.

For example, Patent Documents 1 to 4 have been proposed as polyester resin compositions for LED reflectors.
In Patent Document 1, (a) 100 parts by weight of a polycyclohexylenedimethylene terephthalate-based polyester resin in which a repeating unit in which a terephthalic acid residue and a 1,4-cyclohexanedimethanol residue are bonded accounts for 80 mol% of the polymer, (B) 0.05-20 parts by weight of a polyetheramide and / or polyetherester, and (c) an organic phosphite in which at least one P — O bond is bound to an aromatic group having 6 to 30 carbon atoms, Alternatively, a polyester resin composition comprising 0.05 to 4 parts by weight of a phosphonite compound is disclosed, but there are problems in heat resistance and light resistance.

  In Patent Documents 2, 3 and 4, (A) a polyester comprising a repeating unit having terephthalic acid as a main acid component and cyclohexanedimethanol as a main glycol component and having an intrinsic viscosity of at least 0.5 dl / g, (B) Including titanium oxide and (C) glass flakes, (A) + (B) + (C) = 100 wt%, (B) 1-30 wt% and (C) 10-40 wt% Although a high heat resistance and high reflectance resin composition characterized in that is disclosed, there is a problem in heat resistance and moldability.

  In Patent Document 5, at least two layers of a layer composed of two or more kinds of polyester and containing 50 to 70% by weight of inorganic particles (A layer) and a polyester layer containing 0 to 25% by weight of inorganic particles (B layer). Although a laminated stretched polyester film characterized by having a total light transmittance of 3% or less is disclosed, there are problems in heat resistance, moldability, mechanical strength, and reflectance.

  In Patent Documents 6 and 7, (a) i) terephthalic acid residues 70 to 100 mol%; ii) aromatic dicarboxylic acid residues 0 to 30 mol% having 20 or less carbon atoms; and iii) fats having 16 or less carbon atoms A dicarboxylic acid component comprising 0 to 10 mol% of an aromatic dicarboxylic acid residue; and (b) i) a 2,2,4,4-tetramethyl-1,3-cyclobutanediol residue of 1 to 99 mol%; and ii) Disclosed is a glycol component containing 1-99 mol% 1,4-cyclohexanedimethanol residues, wherein the total mol% of the dicarboxylic acid component is 100 mol% and the total mol% of the glycol component is 100 mol% However, there are problems in mechanical strength and reflectivity. Moreover, in patent document 8, (A) 2-50 mass parts of phosphinate whose anion part is the calcium salt or aluminum salt of phosphinic acid with respect to 100 mass parts of polyester resin, (C) 0.5% of titanium dioxide A flame retardant polyester resin composition for a reflector of an illuminating device using a semiconductor light emitting element as a light source, characterized in that 0.01 to 3 parts by mass of (D) a polyolefin resin having a polar group is blended in an amount of 0.01 to 3 parts by mass. However, there are problems in the heat resistance, heat resistance, and light resistance of gold / tin solder. Moreover, in patent document 9, 100-mass part of wholly aromatic thermotropic liquid crystalline polyester, 97-85 mass% of titanium oxide obtained by the manufacturing method including a roasting process are used for aluminum oxide (including hydrate) 3-15 mass%. It is composed of 8 to 42 parts by mass of titanium oxide particles surface-treated by adding (both of them to 100% by mass), 25 to 50 parts by mass of glass fibers, and 0 to 8 parts by mass of other inorganic fillers. Resin composition obtained through a melt-kneading step including a step of supplying at least a part of the glass fiber from a position 30% or more downstream with respect to the total length of the cylinder of the biaxial kneader using a shaft kneader. Although the product is disclosed, there is a problem in heat resistance and light resistance.

  In Patent Document 10, a dry unsaturated polyester resin composition containing at least an unsaturated polyester resin, a polymerization initiator, an inorganic filler, a white pigment, a release agent, and a reinforcing material, wherein the unsaturated polyester resin is the above-mentioned The total amount of the inorganic filler and the white pigment is within the range of 44 to 74% by mass with respect to the total amount of the composition. Yes, the proportion of the white pigment in the total amount of the inorganic filler and the white pigment is 30% by mass or more, and the unsaturated polyester resin is a mixture of an unsaturated alkyd resin and a crosslinking agent. Although an unsaturated polyester resin composition for LED reflectors is disclosed, there are problems in moldability and light resistance. In addition, various polyamides have been used as surface mount LED reflectors, but there are problems with heat-resistant coloring, light resistance, and low water absorption.

  As described above, conventionally proposed polyesters and polyamides are used while having problems in heat resistance coloring property, light resistance, and moldability.

  Furthermore, in recent years, development for lighting applications has been actively carried out. When considering the development of lighting applications, further cost reduction, higher power, longer life, and long-term reliability are required. Therefore, as a measure for improving the reliability, gold / tin eutectic solder having a low deterioration and a high thermal conductivity is being used instead of the conventional epoxy resin / silver paste for bonding the lead frame and the LED chip. However, since processing of gold / tin eutectic solder requires a temperature of 280 ° C. or higher and lower than 290 ° C., the resin to be used is required to have a melting point of 290 ° C. or higher in order to withstand the process. In addition, even when processing gold / tin eutectic solder, the resin is required to have low water absorption in order to prevent the occurrence of blisters on the surface of the molded product due to moisture in the resin.

  As described above, the required melting point (melting peak temperature) of the polyester resin composition used for the surface mount LED reflector is as high as 280 ° C. or higher, preferably 290 ° C. or higher, and the aromatic ring concentration is high. It is preferable. However, a polyester resin composition used for a surface mount LED reflector satisfying these conditions has not been reported so far.

JP-A-7-90163 JP-A-4-142362 Special table 2009-507990 JP 2012-136710 A JP 2006-15674 A Special table 2008-544030 gazette JP 2008-54031 A JP 2010-270177 A JP 2008-231368 A Japanese Patent No. 4844699

  The present invention was devised in view of the above-mentioned problems of the prior art, and its purpose is moldability during injection molding, fluidity, dimensional stability, low water absorption, solder heat resistance, surface reflectance, An object of the present invention is to provide a polyester resin composition suitable for use in a surface mount LED reflector having excellent light resistance. Furthermore, an object of the present invention is to provide a high melting point that can be applied to a gold / tin eutectic soldering process and to ensure a long-term reliability, and a low water absorption for reducing swelling of a molded product due to moisture in the soldering process. Another object of the present invention is to provide a polyester resin composition suitable for use in a surface mount LED reflector that has achieved light resistance during outdoor use or long-term use.

  In order to achieve the above object, the present inventor can advantageously perform injection molding and reflow soldering processes while satisfying the characteristics as an LED reflector, and further, gold / tin eutectic solder heat resistance, low water absorption As a result of intensive studies on the composition of polyester having excellent properties and light resistance, the present invention has been completed.

That is, the present invention has the following configuration.
(1) Copolyester resin (A), titanium oxide (B), at least one reinforcing material (C) selected from the group consisting of fibrous reinforcing materials and acicular reinforcing materials , non- fibrous or non-acicular The filler (D) and the polyester resin (E) different from the copolymer polyester resin (A) are contained, and titanium oxide (B) 0.5-100 mass with respect to 100 mass parts of the copolymer polyester resin (A). Part, reinforcing material (C) 0-100 parts by mass , non- fibrous or non-needle filler (D) 0-50 parts by mass , and polyester resin (E) 1-30 parts by mass be those copolyester resin (a), a dicarboxylic acid component is an aromatic dicarboxylic acid, and the components glycol component consisting of trans-1,4-cyclohexanedicarboxylic methanol and other glycol , A polyester resin (E) is, LED reflector for polyester resin composition characterized der Rukoto least one selected from polybutylene terephthalate and polybutylene naphthalate.
(2) At least 80 mol% of the dicarboxylic acid component constituting the copolyester resin (A) is at least one selected from terephthalic acid, 2,6-naphthalenedicarboxylic acid, and 4,4′-biphenyldicarboxylic acid. (1) The polyester resin composition for LED reflecting plates as described in the above.
(3) copolymerized polyester 70 to 100 mol% of the glycol component constituting the (A) is a trans-1,4-cyclohexanedicarboxylic methanol (1) or (2) the polyester for LED reflector according Resin composition.
(4) 30 to 0 mol% of the glycol component constituting the copolymerized polyester resin (A) is other glycol, and the other glycol is ethylene glycol, cis-type 1,4-cyclohexanedimethanol, 1,3-propane. The polyester resin composition for LED reflectors according to any one of (1) to (3), which is one or more selected from diol, neopentyl glycol, and 1,4-butanediol.
(5) The non-fibrous or non-needle filler (D) is talc, and is contained in a proportion of 0.1 to 5 parts by mass of talc with respect to 100 parts by mass of the copolyester resin (A). (4) The polyester resin composition for LED reflectors in any one of .
(6 ) Solder reflow heat-resistant temperature is 260 degreeC or more, The polyester resin composition for LED reflectors in any one of (1)-( 5 ) characterized by the above-mentioned.
( 7 ) Solder reflow heat-resistant temperature is 280 degreeC or more, The polyester resin composition for LED reflectors in any one of (1)-( 5 ) characterized by the above-mentioned.
( 8 ) A surface-mounted LED reflector obtained by molding the polyester resin composition according to any one of (1) to ( 7 ).

  In addition to high heat resistance and low water absorption, the polyester resin composition of the present invention uses a specific copolyester resin excellent in processability such as moldability during injection molding and solder heat resistance. A reflector for a surface-mounted LED that highly satisfies the required characteristics can be industrially advantageously produced.

  Further, the LED reflective blend composition of the present invention is adaptable to a gold / tin eutectic solder process because the main component copolymer polyester resin has a high melting point of 280 ° C. or higher and excellent heat resistance, Since the aromatic ring concentration is high, it can exhibit characteristics such as excellent heat resistance, toughness, and light resistance as well as excellent adhesion to a sealing material.

  The polyester resin composition of the present invention is intended for use in a surface-mounted LED reflector. The surface mount type LED includes a chip LED type using a printed wiring board, a gull wing type using a lead frame, and a PLCC type. The polyester resin composition of the present invention injection-molds all these reflectors. Can be manufactured.

The polyester resin composition for an LED reflector of the present invention comprises at least one reinforcing material (A) selected from the group consisting of a copolyester resin (A), titanium oxide (B), a fibrous reinforcing material, and a needle-shaped reinforcing material ( C), and non-fibrous or non-needle filler (D), and 0.5 to 100 parts by mass of titanium oxide (B) with respect to 100 parts by mass of the copolyester resin (A), reinforcing material (C ) 0-100 parts by mass, and non-fibrous or non-acicular filler (D), a polyester resin composition containing 0-50 parts by mass, wherein the copolymer polyester resin (A) is a dicarboxylic acid component a LED reflector for polyester resin composition as a constituent component a glycol component consisting of trans-1,4-cyclohexanedicarboxylic methanol and other glycols.

The copolyester resin (A) is blended to realize excellent UV resistance in addition to a high melting point and low water absorption in order to impart high reliability. a) is, to a dicarboxylic acid component, characterized in that the trans-1,4-cyclohexanedicarboxylic methanol and constituting a glycol component composed of other glycol component.

Copolyester resin (A), it includes a trans-1,4-cyclohexanedicarboxylic meth no le, is preferably 70 to 100 mol% of the glycol component constituting the copolyester resin (A). More preferably, trans-type 1,4-cyclohexanedimethanol is 80 mol% or more, more preferably 85 mol% or more, and particularly preferably 90 mol% or more. If trans 1,4-cyclohexanedimethanol is not contained, moldability, solder heat resistance, and light resistance tend to be lowered.
The other glycol is preferably 30 to 0 mol% of the glycol component constituting the copolyester resin (A). More preferably, other glycol is 20 mol% or less, More preferably, it is 15 mol% or less, Most preferably, it is 10 mol% or less. Examples of other glycols include ethylene glycol, diethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butylene glycol, 1,2-butylene glycol, 1,3-butylene glycol, 2,3- Butylene glycol, 1,5-pentanediol, 1,6-hexanediol, 1,2-cyclohexanediol, 1,3-cyclohexanediol, cis-type 1,4-cyclohexanediol, 1,2-cyclohexanedimethanol, 1, 3-cyclohexanedimethanol, cis-type 1,4-cyclohexanedimethanol, 1,4-cyclohexanediethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,5-pentanediol, 2-methyl-1 , 3-propanediol, 2-ethyl 1,3-propanediol, neopentyl glycol, 2-ethyl-2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-methyl-2-n-butyl-1 , 3-propanediol, 2-n-butyl-2-ethyl-1,3-propanediol, 2,2-di-n-butyl-1,3-propanediol, 2-ethyl-2-n-hexyl- 1,3-propanediol, 2,2-di-n-hexyl-1,3-propanediol, 1,9-nonanediol, 1,10-decanediol, 1,12-dodecanediol, triethylene glycol, polyethylene Glycol, polytrimethylene glycol, polytetramethylene glycol, polypropylene glycol and other aliphatic glycols, hydroquinone, 4,4′- Hydroxybisphenol, 1,4-bis (β-hydroxyethoxy) benzene, 1,4-bis (β-hydroxyethoxyphenyl) sulfone, bis (p-hydroxyphenyl) ether, bis (p-hydroxyphenyl) sulfone, bis ( Examples include aromatic glycols such as p-hydroxyphenyl) methane, 1,2-bis (p-hydroxyphenyl) ethane, bisphenol A, and alkylene oxide adducts of bisphenol A. Among these, a kind selected from ethylene glycol, cis-type 1,4-cyclohexanedimethanol, 1,3-propanediol, neopentyl glycol, and 1,4-butanediol because of heat resistance, polymerizability, molding, cost, etc. Or the mixture of 2 or more types is preferable. More preferably, ethylene glycol and 1,4-butanediol are preferred. In addition, when ethylene glycol is used for the glycol component, diethylene glycol may be by-produced during the production of the copolymer polyester resin (A) to become a copolymer component. Moreover, you may use together polyhydric polyols, such as a trimethylol ethane, a trimethylol propane, glycerol, and a pentaerythritol.

  The dicarboxylic acid component is terephthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4′-biphenyldicarboxylic acid, isophthalic acid, diphenoxyethanedicarboxylic acid, 4,4′-diphenyl ether dicarboxylic acid, 4,4′-diphenyl. Aromatic dicarboxylic acids such as ketone dicarboxylic acids, aliphatic dicarboxylic acids such as adipic acid, sebacic acid, succinic acid, glutaric acid, dimer acid, hexahydroterephthalic acid, hexahydroisophthalic acid, 1,2-cyclohexanedicarboxylic acid, 1 , 3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, and other alicyclic dicarboxylic acids. Among these, terephthalic acid and 2,6-naphthalenedicarboxylic acid are preferred in terms of polymerizability, cost, and heat resistance. Acid, 4,4′-biphenyldicarboxylic acid is preferred. 80-100 mol% of the dicarboxylic acid component constituting the copolyester resin (A) is at least one selected from terephthalic acid, 2,6-naphthalenedicarboxylic acid, and 4,4′-biphenyldicarboxylic acid. preferable. In addition, polyoxycarboxylic acids such as p-oxybenzoic acid and oxycaproic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenylsulfonetetracarboxylic acid, and biphenyltetracarboxylic acid, and anhydrides thereof. You may use together.

  Further, metal salts such as 5-sulfoisophthalic acid, 4-sulfonaphthalene-2,7-dicarboxylic acid, 5- [4-sulfophenoxy] isophthalic acid, or 2-sulfo-1,4-butanediol, 2,5 A dicarboxylic acid or diol containing a metal salt of a sulfonate such as a metal salt such as dimethyl-3-sulfo-2,5-hexanediol is used within a range of 20 mol% or less of the total dicarboxylic acid component or the total glycol component. Also good.

  Although it does not specifically limit as a catalyst used when manufacturing copolyester resin (A), It is preferable that at least 1 type of compound chosen from the compound of Ge, Sb, Ti, Al, Mn, or Mg is used. . These compounds are added to the reaction system as powders, aqueous solutions, ethylene glycol solutions, ethylene glycol slurries and the like.

  Also, as stabilizers, phosphoric acid, phosphoric acid esters such as polyphosphoric acid and trimethyl phosphate, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, phosphonous acid compounds, phosphinic acid compounds, phosphine compounds It is preferable to use at least one phosphorus compound selected from the group consisting of:

  The acid value of the copolyester resin (A) is preferably 1 to 40 eq / ton. When the acid value exceeds 40 eq / ton, light resistance tends to decrease. On the other hand, when the acid value is less than 1 eq / ton, the polycondensation reactivity tends to decrease and the productivity tends to deteriorate.

  The intrinsic viscosity (IV) of the copolyester resin (A) is preferably 0.10 to 0.70 dl / g, more preferably 0.20 to 0.65 dl / g, and still more preferably 0.25 to 0.25. 0.60 dl / g.

  The copolyester resin (A) is present in the polyester resin composition of the present invention in a proportion of 25 to 90% by mass, preferably 40 to 75% by mass. When the proportion of the copolymerized polyester resin (A) is less than the above lower limit, the mechanical strength becomes low, and when it exceeds the above upper limit, the blending amount of titanium oxide (B) and the reinforcing material (C) is insufficient, and the desired amount It becomes difficult to obtain the effect.

Titanium oxide (B) is blended to increase the surface reflectance of the reflector. For example, rutile type and anatase type titanium dioxide (TiO ₂ ) and titanium monoxide produced by the sulfuric acid method and the chlorine method. (TiO), dititanium trioxide (Ti ₂ O ₃ ) and the like can be mentioned, and rutile type titanium dioxide (TiO ₂ ) is particularly preferably used. The average particle size of the titanium oxide (B) is generally in the range of 0.05 to 2.0 μm, preferably 0.15 to 0.5 μm, and may be used alone or with different particle sizes. Titanium may be used in combination. The titanium oxide component concentration is 90% or more, preferably 95% or more, and more preferably 97% or more. In addition, the titanium oxide (B) may be one that has been surface-treated with a metal oxide such as silica, alumina, zinc oxide, zirconia, a coupling agent, an organic acid, an organic polyhydric alcohol, or siloxane. it can.

  The ratio of titanium oxide (B) is 0.5 to 100 parts by mass, preferably 10 to 80 parts by mass with respect to 100 parts by mass of the copolyester resin (A). If the ratio of titanium oxide (B) is less than the above lower limit, the surface reflectivity is lowered, and if it exceeds the upper limit, molding processability may be lowered, such as a significant decrease in physical properties and fluidity.

  The reinforcing material (C) is blended in order to improve the moldability of the polyester resin composition and the strength of the molded product, and uses at least one selected from a fibrous reinforcing material and an acicular reinforcing material. . Examples of the fibrous reinforcing material include glass fiber, carbon fiber, boron fiber, ceramic fiber, and metal fiber. Examples of the acicular reinforcing material include potassium titanate whisker, aluminum borate whisker, zinc oxide whisker, and carbonic acid. Calcium whiskers, magnesium sulfate whiskers, wollastonite and the like can be mentioned. As the glass fiber, chopped strands or continuous filament fibers having a length of 0.1 mm to 100 mm can be used. As the cross-sectional shape of the glass fiber, a glass fiber having a circular cross section and a non-circular cross section can be used. The diameter of the circular cross-section glass fiber is 20 μm or less, preferably 15 μm or less, more preferably 10 μm or less. Further, a glass fiber having a non-circular cross section is preferred from the viewpoint of physical properties and fluidity. Non-circular cross-sectional glass fibers include those that are substantially oval, substantially oval, and substantially bowl-shaped in a cross section perpendicular to the length direction of the fiber length, and have a flatness of 1.5 to 8. It is preferable. Here, the flatness is assumed to be a rectangle with the smallest area circumscribing a cross section perpendicular to the longitudinal direction of the glass fiber, the length of the long side of the rectangle is the major axis, and the length of the short side is the minor axis. It is the ratio of major axis / minor axis. The thickness of the glass fiber is not particularly limited, but the minor axis is about 1 to 20 μm and the major axis is about 2 to 100 μm. Moreover, the glass fiber becomes a fiber bundle, and the thing of the chopped strand shape cut | disconnected by about 1-20 mm of fiber length can use it preferably. Furthermore, in order to increase the surface reflectance of the polyester resin composition, it is preferable that the difference in refractive index from the copolyester resin is large, so use a material whose refractive index is increased by changing the glass composition or surface treatment. It is preferable to do.

  The ratio of the reinforcing material (C) is 0 to 100 parts by mass, preferably 5 to 100 parts by mass, and more preferably 10 to 60 parts by mass with respect to 100 parts by mass of the copolyester resin (A). The reinforcing material (C) is not an essential component, but the proportion of 5 parts by mass or more is preferable because the mechanical strength of the molded product is improved. When the ratio of the reinforcing material (C) exceeds the above upper limit, the surface reflectance and the moldability tend to be lowered.

  Examples of the non-fibrous or non-needle filler (D) include reinforcing fillers, conductive fillers, magnetic fillers, flame retardant fillers, thermal conductive fillers, thermal yellowing suppression fillers, etc., according to purpose. Glass beads, glass flakes, glass balloons, silica, talc, kaolin, mica, alumina, hydrotalcite, montmorillonite, graphite, carbon nanotubes, fullerene, indium oxide, tin oxide, iron oxide, magnesium oxide, aluminum hydroxide, Magnesium hydroxide, calcium hydroxide, red phosphorus, calcium carbonate, magnesium acetate, lead zirconate titanate, barium titanate, aluminum nitride, boron nitride, zinc borate, barium sulfate, and non-acicular wollastonite, titanium Potassium acid, aluminum borate, sulfur Magnesium, zinc oxide, calcium carbonate, and the like. These fillers may be used not only alone but also in combination of several kinds. Among these, talc is preferable because it has an effect of accelerating crystallization and improves moldability. The addition amount of the filler may be selected as an optimum amount, but it is possible to add up to 50 parts by mass with respect to 100 parts by mass of the copolyester resin (A), but the mechanical strength of the resin composition From this viewpoint, 0.1 to 20 parts by mass is preferable, and 1 to 10 parts by mass is more preferable. When using talc, 0.1-5 mass parts is preferable with respect to 100 mass parts of copolyester resin (A), More preferably, it is 0.5-3 mass parts. In order to improve the affinity with the polyester resin, the fibrous reinforcing material and the filler are preferably used after being treated with an organic treatment or a coupling agent, or used in combination with a coupling agent at the time of melt compounding. As the ring agent, any of a silane coupling agent, a titanate coupling agent, and an aluminum coupling agent may be used, and among them, an aminosilane coupling agent and an epoxy silane coupling agent are particularly preferable.

  Various additives of the conventional polyester resin composition for LED reflectors can be used for the polyester resin composition of the present invention. Additives include stabilizers, impact modifiers, flame retardants, mold release agents, slidability improvers, colorants, fluorescent brighteners, plasticizers, crystal nucleating agents, thermoplastic resins other than polyester, and the like. .

  Stabilizers include organic antioxidants such as hindered phenol antioxidants, sulfur antioxidants, phosphorus antioxidants, heat stabilizers, light stabilizers such as hindered amines, benzophenones, and imidazoles. Examples include ultraviolet absorbers, metal deactivators, and copper compounds. Copper compounds include cuprous chloride, cuprous bromide, cuprous iodide, cupric chloride, cupric bromide, cupric iodide, cupric phosphate, cupric pyrophosphate, Copper salts of organic carboxylic acids such as copper sulfide, copper nitrate, and copper acetate can be used. Further, as a component other than the copper compound, an alkali metal halide compound is preferably contained. Examples of the alkali metal halide compound include lithium chloride, lithium bromide, lithium iodide, sodium fluoride, sodium chloride, bromide. Examples thereof include sodium, sodium iodide, potassium fluoride, potassium chloride, potassium bromide, potassium iodide and the like. These additives may be used alone or in combination of several kinds. Although the addition amount of a stabilizer should just select the optimal quantity, it is possible to add a maximum of 5 mass parts with respect to 100 mass parts of copolyester resin (A).

A polyester resin (E) different from the copolymer polyester resin (A) can be added to the polyester resin composition of the present invention as long as the solder heat resistance is not lowered, and further, a polyester resin imparting moldability. It is desirable to add.
Specifically, the melting point of the polyester resin composition blended with the polyester resin (E) has a melting point of 280 ° C. or higher, and the melting peak temperature (Tm) of the polyester resin composition blended with the polyester resin (E). The difference (Tm-Tc2) between the crystallization temperature (Tc2) during cooling and the temperature drop is smaller than (Tm-Tc2) of the polyester resin composition not containing the polyester resin (E), and the moldability tends to be good. The polyester resin (E) to be blended includes polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polymethylene terephthalate (PTT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), polymethylene naphthalate ( PTN) and other homopolyesters, polyester / polyether block copolymers, and polyesters obtained by copolymerizing acids and glycols described in the text may be added. Preferably, polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), polyester-polyether block copolymer, more preferably polybutylene terephthalate (PBT), polybutylene naphthalate ( PBN), a polyester / polyether block copolymer, most preferably polybutylene terephthalate (PBT), polybutylene naphthalate (PBN) tend to have good moldability. Moreover, although it is possible to add a maximum of 50 mass parts with respect to 100 mass parts of copolyester resin (A) as an addition part, from a heat resistant viewpoint of a resin composition, 1-30 mass parts is preferable. Is more preferable, and 5 to 25 parts by mass is more preferable. If it exceeds 50 parts by mass, the moldability tends to decrease, and if it is less than 1 part, the moldability tends to be difficult to improve.

  A thermoplastic resin different from the copolymer polyester resin (A) and the polyester resin (E) may be added to the polyester resin composition of the present invention. For example, polyamide (PA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), fluororesin, aramid resin, polyetheretherketone (PEEK), polyetherketone (PEK), polyether Imide (PEI), Thermoplastic polyimide, Polyamideimide (PAI), Polyetherketone ketone (PEKK), Polyphenylene ether (PPE), Polyethersulfone (PES), Polysulfone (PSU), Polyarylate (PAR), Polycarbonate (PC ), Polyoxymethylene (POM), polypropylene (PP), polyethylene (PE), polymethylpentene (TPX), polystyrene (PS), polymethyl methacrylate, acrylonitrile-styrene copolymer Body (AS), acrylonitrile - butadiene - styrene copolymer (ABS) and the like. These thermoplastic resins can be blended in a molten state by melt kneading. However, the thermoplastic resin may be made into a fiber or particle and dispersed in the polyamide resin composition of the present invention. An optimum amount of the thermoplastic resin may be selected, but a maximum of 50 parts by mass can be added to 100 parts by mass of the copolyester resin (A).

  As the impact modifier, ethylene-propylene rubber (EPM), ethylene-propylene-diene rubber (EPDM), ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, ethylene-methacrylic acid copolymer, ethylene- Polyolefin resins such as methacrylic acid ester copolymer, ethylene vinyl acetate copolymer, styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-isoprene -Polytetramethylene glycol, polycaprolactone, or poly (polyethylene glycol) as a hard segment made of vinyl polymer resin such as styrene copolymer (SIS), acrylate copolymer, polybutylene terephthalate or polybutylene naphthalate. Polyester block copolymer in which the ball sulfonate diol as a soft segment, a nylon elastomer, urethane elastomer, acrylic elastomer, silicone rubber, fluorinated rubber, and the like polymer particles having a core-shell structure constituted from two different polymers. The addition amount of the impact modifier may be selected as an optimum amount, but it is possible to add a maximum of 30 parts by mass with respect to 100 parts by mass of the copolyester resin (A).

  When a thermoplastic resin other than the copolymerized polyester resin (A) and an impact resistance improving material are added to the polyester resin composition of the present invention, a reactive group capable of reacting with the polyester is copolymerized. Preferably, the reactive group is a group capable of reacting with a hydroxyl group and / or a carboxyl group which is a terminal group of the polyester resin. Specific examples include an acid anhydride group, an epoxy group, an oxazoline group, an amino group, and an isocyanate group. Among these, an epoxy group and an isocyanate group are most excellent in reactivity. There is also a report that the thermoplastic resin having a reactive group that reacts with the polyester resin is finely dispersed in the polyester and finely dispersed, so that the distance between the particles is shortened and the impact resistance is greatly improved.

As a flame retardant, a combination of a halogen flame retardant and a flame retardant aid is good. As a halogen flame retardant, brominated polystyrene, brominated polyphenylene ether, brominated bisphenol type epoxy polymer, brominated styrene maleic anhydride Polymers, brominated epoxy resins, brominated phenoxy resins, decabromodiphenyl ether, decabromobiphenyl, brominated polycarbonate, perchlorocyclopentadecane, brominated cross-linked aromatic polymers, etc. are preferred. Examples include layered silicates such as antimony, antimony pentoxide, sodium antimonate, zinc stannate, zinc borate, and montmorillonite, fluorine-based polymers, and silicones. Among these, from the viewpoint of thermal stability, the halogen flame retardant is preferably a combination of dibromopolystyrene, and the flame retardant aid is a combination of antimony trioxide, sodium antimonate, or zinc stannate. Non-halogen flame retardants include melamine cyanurate, red phosphorus, phosphinic acid metal salts, and nitrogen-containing phosphoric acid compounds. In particular, a combination of a phosphinic acid metal salt and a nitrogen-containing phosphoric acid compound is preferable. As the nitrogen-containing phosphoric acid compound, a reaction product of melamine or a melamine condensate such as melam, melem, melon and polyphosphoric acid Or a mixture thereof. As other flame retardants and flame retardant aids, addition of hydrotalcite-based compounds and alkali compounds is preferable as metal corrosion prevention for molds and the like when these flame retardants are used. The addition amount of the flame retardant may be selected an optimum amount, but it is possible to add up to 50 parts by weight per 100 parts by weight copolymer poly ester resin (A).

  Examples of the release agent include long chain fatty acids or esters thereof, metal salts, amide compounds, polyethylene wax, silicone, polyethylene oxide, and the like. The long chain fatty acid preferably has 12 or more carbon atoms, and examples thereof include stearic acid, 12-hydroxystearic acid, behenic acid, and montanic acid. Partial or total carboxylic acid is esterified with monoglycol or polyglycol. Or a metal salt may be formed. Examples of the amide compound include ethylene bisterephthalamide and methylene bisstearyl amide. These release agents may be used alone or as a mixture. The addition amount of the release material may be selected as an optimum amount, but a maximum of 5 parts by mass can be added to 100 parts by mass of the copolyester resin (A).

  The polyester resin composition of the present invention preferably has a melting peak temperature (Tm) of 280 ° C. or higher in DSC measurement, more preferably 290 ° C. or higher, further preferably 300 ° C. or higher, particularly preferably 310 ° C. or higher. is there. The upper limit of Tm of the polyester resin composition of the present invention is preferably 340 ° C. or lower for the following reason. When Tm exceeds the above upper limit, the processing temperature required for injection molding the polyester resin composition of the present invention becomes extremely high, so that the polyester resin composition decomposes during processing, and the desired physical properties and appearance are obtained. There may not be. On the other hand, when Tm is less than the above lower limit, the crystallization rate is slow, and in some cases, molding may be difficult, and further, solder heat resistance may be reduced. A Tm of 310 ° C. or higher is preferable because it satisfies the reflow solder heat resistance of 280 ° C. and can be applied to a gold / tin eutectic solder process.

  Furthermore, the polyester resin composition of the present invention preferably has a difference in melting peak temperature (Tm) and cooling crystallization temperature (Tc2) of 50 ° C. or less, more preferably 45 ° C. or less, and still more preferably 40 in DSC measurement. It is below ℃. The temperature-falling crystallization temperature (Tc2) is a temperature at which crystallization starts when the temperature is lowered from a temperature 10 ° C. higher than the melting point of the copolyester resin in DSC measurement. When the difference between the melting peak temperature (Tm) and the cooling crystallization temperature (Tc2) is 50 ° C. or less, crystallization proceeds easily, and dimensional stability and physical properties can be sufficiently exhibited. On the other hand, when the difference between the melting peak temperature (Tm) and the cooling crystallization temperature (Tc2) exceeds 50 ° C., the LED reflector is molded in a short cycle of injection molding, and thus crystallization may not proceed sufficiently. Due to molding difficulties such as insufficient mold release, or because crystallization has not been completed sufficiently, deformation and crystal shrinkage occur during heating in the subsequent process, causing problems of peeling from the sealing material and lead frame, resulting in reliability Lack of sex.

  The copolymerized polyester resin (A) in the present invention has an excellent balance between low water absorption and fluidity, in addition to a high melting point and moldability, and further has excellent light resistance. For this reason, the polyester resin composition of the present invention obtained from such a copolyester resin (A) has a high melting point of 280 ° C. or higher and low water absorption in the molding of a reflector of a surface-mounted LED. Thin-walled, high-cycle molding is possible.

  The polyester resin composition of this invention can be manufactured by mix | blending each above-mentioned component by a conventionally well-known method. For example, each component is added during the polycondensation reaction of the copolyester resin (A), the copolyester resin (A) and other components are dry blended, or a twin screw type extruder is used. The method of melt-kneading each structural component can be mentioned.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. In addition, the measured value described in the Example is measured by the following method.

(1) Intrinsic viscosity of copolyester resin (IV)
It calculated | required from the solution viscosity at 30 degreeC in a 1,1,2,2-tetrachloroethane / phenol (2: 3 weight ratio) mixed solvent.
(2) Acid value After 0.1 g of copolyester resin was dissolved in 10 ml of benzyl alcohol by heating, it was determined by titration using a solution of 0.1 N NaOH in methanol / benzyl alcohol (1/9 volume ratio). .
(3) Melting peak temperature (Tm) of polyester resin composition, crystallization temperature during temperature drop (Tc2)
Measurements were made with a differential thermal analyzer (DSC), RDC-220, manufactured by Seiko Electronics Corporation. The temperature was raised at a rate of temperature increase of 20 ° C./min, held at 330 ° C. for 3 minutes, and then cooled from 330 ° C. to 130 ° C. at a rate of 10 ° C./min. The peak temperature of the melting peak observed when the temperature was raised was defined as the melting point Tm, and the temperature of the crystallization peak observed when the temperature was lowered was the crystallization temperature (Tc2).

(4) Moldability and dimensional stability Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C., the mold temperature is set to 120 ° C., the film gate has a length of 100 mm, a width of 100 mm, Injection molding was performed using a flat plate forming mold having a thickness of 1 mm. Molding was performed at an injection speed of 50 mm / sec, a holding pressure of 30 MPa, an injection time of 10 seconds, and a cooling time of 10 seconds. The quality of the moldability was evaluated as follows.
○: A molded product can be obtained without problems.
Δ: Sprue sometimes remains in the mold.
X: The releasability is insufficient, and the molded product sticks to the mold or deforms.
Furthermore, in order to evaluate the dimensional stability of the obtained molded product, the molded product was heated at 180 ° C. for 1 hour. The dimension in the direction perpendicular to the flow direction before and after heating was measured, and the amount of dimensional change was determined as follows.
Dimensional change (%) = {dimension before heating (mm) −dimension after heating (mm)} / dimension before heating (mm) × 100
Dimensional stability was evaluated as follows.
○: Dimensional change is less than 0.2% ×: Dimensional change is 0.2% or more

(5) Solder heat resistance Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C., the mold temperature is set to 140 ° C., the length is 127 mm, the width is 12.6 mm, and the thickness is 0.8 mm. The test piece for the UL combustion test was injection molded to produce a test piece. The test piece was left in an atmosphere of 85 ° C. and 85% RH (relative humidity) for 72 hours. The test piece was heated in an air reflow furnace (AIS-20-82C manufactured by ATEC) over 60 seconds from room temperature to 150 ° C, preheated, and then heated to 190 ° C at a rate of 0.5 ° C / min. Preheating was performed. Thereafter, the temperature was raised to a predetermined set temperature at a rate of 100 ° C./min, held at the predetermined temperature for 10 seconds, and then cooled. The set temperature was increased from 240 ° C. every 5 ° C., and the highest set temperature at which the surface did not swell or deformed was defined as the reflow heat resistant temperature, which was used as an index of solder heat resistance.
A: Reflow heat resistant temperature is 280 ° C or higher. ○: Reflow heat resistant temperature is 260 ° C or higher and lower than 280 ° C. X: Reflow heat resistant temperature is lower than 260 ° C.

(6) Saturated water absorption rate Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C., the mold temperature is set to 140 ° C., and a flat plate having a length of 100 mm, a width of 100 mm, and a thickness of 1 mm is injection molded. Then, a test piece for evaluation was produced. This test piece was immersed in hot water at 80 ° C. for 50 hours, and the saturated water absorption was determined from the following equation from the weight at the time of saturated water absorption and drying.
Saturated water absorption (%) = {(weight at time of saturated water absorption−weight at time of drying) / weight at time of drying} × 100

(7) Fluidity Using Toshiba Machine's injection molding machine IS-100, the cylinder temperature is set to 330 ° C., the mold temperature is set to 120 ° C., the injection pressure set value is 40%, the injection speed set value is 40%, the metering is 35 mm, Under the conditions of an injection time of 6 seconds and a cooling time of 10 seconds, injection molding was performed with a flow length measuring mold having a width of 1 mm and a thickness of 0.5 mm to prepare an evaluation test piece. As an evaluation of fluidity, the flow length (mm) of this test piece was measured.

(8) Silicone adhesion Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C., the mold temperature is set to 140 ° C., and a flat plate having a length of 100 mm, a width of 100 mm, and a thickness of 2 mm is injection molded. Then, a test piece for evaluation was produced. On one side of this test piece, a silicone sealing material (manufactured by Shin-Etsu Silicone Co., ASP-1110, sealing material hardness D60) is coated to a coating thickness of about 100 μm, and after preheating at 100 ° C. for 1 hour, A curing treatment was performed at 150 ° C. for 4 hours to form a sealing material film on one side of the test piece.
Next, the adhesiveness of the sealing material film on the test piece was evaluated by a cross-cut test based on JIS K5400 (100 mm of 1 mm width crosscut).
○: No more than 10 peeling cells ×: There is peeling when forming the cells before the peeling test

(9) Light resistance Using Toshiba Machine's injection molding machine EC-100, the cylinder temperature is set to the melting point of the resin + 20 ° C., the mold temperature is set to 140 ° C., and a flat plate having a length of 100 mm, a width of 100 mm, and a thickness of 2 mm is injection molded. A test piece for evaluation was prepared. This test piece was irradiated with 50 mW / UV in an environment of 63 ° C. and 50% RH using an accelerated weathering tester “QUV”. The light reflectance at a wavelength of 460 nm of the test piece was measured before irradiation and 60 hours after irradiation.
The light reflectance was measured by measuring the reflectance at wavelengths of 350 nm to 800 nm using an integrating sphere manufactured by Hitachi, Ltd. on a self-recording spectrophotometer “U3500” manufactured by Hitachi. For comparison of reflectance, diffuse reflectance at a wavelength of 460 nm was obtained. Barium sulfate was used as a reference.
The retention rate of the light reflectivity of the post-irradiation test piece relative to the light reflectivity of the pre-irradiation test piece was evaluated according to the following criteria.
○: Retention rate 90% or more △: Retention rate less than 90% to 85% or more ×: Retention rate less than 85%

(Synthesis Example 1)
A 20-liter stainless steel autoclave with a stirrer is charged with 1409 g of high-purity dimethyl terephthalic acid, 2 times its molar amount of trans-type 1,4-cyclohexanedimethanol, 2 g of manganese acetate, and 0.86 g of germanium dioxide. The pressure of the reaction system was gradually decreased to 13.3 Pa (0.1 Torr) while the temperature was raised to 300 ° C., and a polycondensation reaction was further performed at 310 ° C. and 13.3 Pa. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The intrinsic viscosity of the obtained copolyester was 0.60 dl / g, and the resin composition was 100 mol% for terephthalic acid and 100 mol% for 1,4 - cyclohexanedimethanol as determined by ¹ H-NMR measurement. Table 1 shows characteristic values of the obtained copolyester resin.

(Synthesis Examples 2 to 6)
Each copolyester resin was obtained in the same manner as in the polymerization of the copolyester resin of Synthesis Example 1 except that the amount and type of raw materials used were changed. Table 1 shows the characteristic values of the obtained copolymer polyester resins.

(Synthesis example of polyester resin (E))
Polybutylene terephthalate (PBT)
A 20-liter stainless steel autoclave with a stirrer was charged with 1409 g of high-purity dimethyl terephthalic acid, 4 times its molar amount of 1,4-butanediol and 2 g of titanium butoxide, and the temperature was raised to 240 ° C. over 60 minutes after transesterification. However, the pressure of the reaction system was gradually decreased to 13.3 Pa (0.1 Torr), and a polycondensation reaction was further performed at 240 ° C. and 13.3 Pa. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The intrinsic viscosity of the obtained copolyester was 0.60 dl / g, and the resin composition was 100 mol% for terephthalic acid and 100 mol% for 1,4-butanediol as determined by ¹ H-NMR measurement. Table 1 shows characteristic values of the obtained copolyester resin.

Polybutylene naphthalate (PBN)
A 20-liter stainless steel autoclave with a stirrer was charged with 1409 g of high-purity 2,6-naphthalenedicarboxylic acid dimethyl ester, 4 times the molar amount of 1,4-butanediol and 2 g of titanium butoxide, and the ester exchange was carried out for 60 minutes. The pressure of the reaction system was gradually decreased to 13.3 Pa (0.1 Torr) while the temperature was raised to 300 ° C., and a polycondensation reaction was further performed at 310 ° C. and 13.3 Pa. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The resulting intrinsic viscosity copolyester, 0.60 dl / g, the resin composition ^by 1 H-NMR measurement, 2,6-naphthalene dicarboxylic acid 100 mole%, 1,4 - butanediol 100 mol% Met. Table 1 shows characteristic values of the obtained copolyester resin.

(Comparative Synthesis Example 1)
A 20-liter stainless steel autoclave with a stirrer is charged with high-purity terephthalic acid and twice its amount of ethylene glycol, and 0.3 mol% of triethylamine is added to the acid component, and water is added at 250 ° C. under a pressure of 0.25 MPa. The esterification reaction was carried out while distilling out of the system to obtain a mixture of bis (2-hydroxyethyl) terephthalate and oligomer (hereinafter referred to as BHET mixture) having an esterification rate of about 95%. To this BHET mixture, germanium dioxide (100 ppm as Ge) was added as a polymerization catalyst, and then stirred at 250 ° C. for 10 minutes under a nitrogen atmosphere at normal pressure. Thereafter, the pressure in the reaction system was gradually decreased to 13.3 Pa (0.1 Torr) while the temperature was raised to 280 ° C. over 60 minutes, and a polycondensation reaction was further performed at 280 ° C. and 13.3 Pa. Subsequent to releasing the pressure, the resin under slight pressure was discharged into water as a strand, cooled, and then cut with a cutter to obtain a cylindrical pellet having a length of about 3 mm and a diameter of about 2 mm. The obtained PET had an IV of 0.61 dl / g, and the resin composition was 100 mol% terephthalic acid, 98.0 mol% ethylene glycol, and 2.0 mol% diethylene glycol by ¹ H-NMR measurement. . Diethylene glycol is a by-product of condensation of ethylene glycol. The characteristic values of the obtained polyester resin are shown in Table 2.

(Comparative Synthesis Example 2)
Each polyester resin was obtained in the same manner as in the polymerization of the polyester resin of Comparative Synthesis Example 1 except that the type of raw material used was changed. Table 2 shows the characteristic values of the obtained polyester resins.

Examples 1 to 13 and Comparative Examples 1 and 2 Examples 1, 4, 5, and 7 to 13 are reference examples.
The components and mass ratios shown in Tables 3 and 4 were melt kneaded at a melting point of the resin + 15 ° C. using a twin screw extruder STS-35 manufactured by Coperion Co., Ltd., Examples 1 to 13 and Comparative Examples 1 and 2 A polyester resin composition was obtained. In Tables 3 and 4, the materials used other than the copolyester resin are as follows.
Titanium oxide (B): manufactured by Ishihara Sangyo Co., Ltd., Taipei CR-60, rutile TiO2, average particle size 0.2 μm
Reinforcing material (C): Glass fiber (manufactured by Nitto Boseki Co., Ltd., CS-3J-324), acicular wallast (manufactured by NYCO, NYGLOS8)
Filler (D): Talc (Micron White 5000A, Hayashi Kasei Co., Ltd.)
Mold release agent: Magnesium stearate Stabilizer: Pentaerythrityl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] (Chiba Specialty Chemicals, Irganox 1010)

  The polyester resin compositions obtained in Examples 1 to 13 and Comparative Examples 1 and 2 were used for evaluation of various properties. The results are shown in Tables 3 and 4.

  From Table 3, when the melting peak temperature by DSC of the polyester resin composition is 280 ° C. or higher, it can be applied to the reflow soldering process, and when the melting peak temperature is 310 ° C. or higher, the reflow heat resistant temperature is 280 ° C. or higher. Therefore, it exhibits solder heat resistance that can be applied to gold / tin eutectic soldering processes, and has excellent adhesion to sealing materials and surface reflectivity, which are important characteristics for LED applications, and moldability. It was confirmed that the fluidity, dimensional stability, low water absorption, and light resistance were excellent. On the other hand, all of these characteristics could not be satisfied in the comparative example.

  The polyester resin composition of the present invention is not only excellent in heat resistance, moldability, fluidity, and low water absorption, but also has excellent adhesion to a sealing material in LED applications, and also has excellent light resistance. Since the copolyester resin is used, the reflector for surface mount type LED can be produced industrially advantageously while highly satisfying the required characteristics.

Claims (7)

At least one reinforcing material (C) selected from the group consisting of copolymerized polyester resin (A), titanium oxide (B), fibrous reinforcing material and acicular reinforcing material, non-fibrous or non-acicular filler ( D) and a polyester resin (E) different from the copolyester resin (A), and 0.5 to 100 parts by mass of titanium oxide (B) with respect to 100 parts by mass of the copolyester resin (A), reinforced It is a polyester resin composition containing 0 to 100 parts by mass of material (C), 0 to 50 parts by mass of non-fibrous or non-acicular filler (D), and 1 to 30 parts by mass of polyester resin (E). Te, copolyester resin (a), and a dicarboxylic acid component is an aromatic dicarboxylic acid, a constituent component a glycol component consisting of trans-1,4-cyclohexane dimethanol and other glycols, copolycondensation In 70 to 100 mole% of the glycol component constituting the polyester resin (A) is trans-1,4-cyclohexanedimethanol, the polyester resin (E) is one or more selected from polybutylene terephthalate and polybutylene naphthalate A polyester resin composition for an LED reflector, which is characterized in that it exists.   At least 80 mol% of the dicarboxylic acid component constituting the copolymerized polyester resin (A) is at least one selected from terephthalic acid, 2,6-naphthalenedicarboxylic acid, and 4,4′-biphenyldicarboxylic acid. The polyester resin composition for LED reflectors according to claim 1. 30 to 0 mol% of the glycol component constituting the copolyester resin (A) is other glycol, and the other glycol is ethylene glycol, cis-type 1,4-cyclohexanedimethanol, 1,3-propanediol, neo neopentyl glycol, and 1,4-butane selected from diol is one or more claims. 1 to LED reflector for polyester resin composition according to any one of 2. Non-fibrous or non-acicular filler (D) is talc, any claim 1-3, containing a proportion of talc 0.1-5 parts by weight per 100 parts by weight copolymerized polyester (A) A polyester resin composition for LED reflectors according to claim 1. Solder reflow heat-resistant temperature is 260 degreeC or more, The polyester resin composition for LED reflectors in any one of Claims 1-4 characterized by the above-mentioned. Solder reflow heat-resistant temperature is 280 degreeC or more, The polyester resin composition for LED reflectors in any one of Claims 1-4 characterized by the above-mentioned. A surface-mounted LED reflecting plate, characterized in that it is obtained by molding using a polyester resin composition according to any one of claims 1-6.