WO2014169524A1 - 光罩掩模板的制作方法及用该方法制作的光罩掩模板 - Google Patents

光罩掩模板的制作方法及用该方法制作的光罩掩模板 Download PDF

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Publication number
WO2014169524A1
WO2014169524A1 PCT/CN2013/077941 CN2013077941W WO2014169524A1 WO 2014169524 A1 WO2014169524 A1 WO 2014169524A1 CN 2013077941 W CN2013077941 W CN 2013077941W WO 2014169524 A1 WO2014169524 A1 WO 2014169524A1
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Prior art keywords
area
effective opening
mask
ineffective
photomask
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PCT/CN2013/077941
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English (en)
French (fr)
Inventor
吴泰必
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/349,139 priority Critical patent/US9557638B2/en
Publication of WO2014169524A1 publication Critical patent/WO2014169524A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching

Definitions

  • the present invention relates to a flat panel display, and more particularly to a method for fabricating a mask mask for vapor deposition of an organic light emitting display panel.
  • the flat display device has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • the conventional flat display device mainly includes a liquid crystal display device (LCD) and an organic light emitting display device (OLED).
  • the conventional organic light emitting display device generally includes a glass substrate 900 formed on a glass substrate. On the 900, an electric layer 902 is formed on the transparent conductive layer 902, and a hole transport layer (HTL) 904. an organic light-emitting layer (EML) 906 formed on the hole transport layer 904 is formed.
  • EML organic light-emitting layer
  • the organic light emitting display device is forward biased by direct current (DC, Direct Current)
  • DC Direct Current
  • the applied voltage energy will drive the electron (Electron)
  • a hole (Hole) is injected into the organic light-emitting display device from the cathode 909 and the anode 902, respectively. Both electrons and holes meet and combine in conduction, forming a so-called Electron-Hole Capture.
  • the chemical molecules of the organic light-emitting layer 906 are excited by external energy, if the electron spins
  • the area, from, 3 ⁇ 4 forms the desired pattern on the substrate.
  • the evaporation process is performed in a vacuum chamber, and the bottom surface of the substrate is used as a vapor deposition surface.
  • the mask mask is disposed between the vapor deposition surface and the evaporation source, and when vapor deposition is performed, the evaporation source is heated to evaporate the vapor deposition material, and is adhered to the vapor deposition surface through the vapor deposition aperture of the mask mask, and further evaporated.
  • the desired pattern is formed on the plating surface.
  • FIG. 2 is a structural schematic diagram of a conventional mask mask, which is generally made of a material such as glass, quartz, magnesium fluoride or calcium fluoride having the same thermal expansion coefficient as the substrate of the processing element or underneath.
  • a plurality of working units 11 are arranged in a matrix form, and in the working unit 11, a shielding layer 12 having a thickness of about 50 500 ⁇ m is formed in a recessed manner, and is engraved on the shielding layer 12 and required
  • the predetermined pattern corresponds to the through-groove as the vapor-deposited aperture 13, and in order to prevent the deviation of the vapor deposition precision caused by the deformation of the working unit 11, a rib having a large thickness of about 50 ⁇ m in centimeters (cm) is formed on the periphery of the working unit 11. 14.
  • the mask mask is fixed to the vapor deposition surface of the processing element substrate by a support mechanism (not shown). However, since it is thin, it is difficult to fix the alignment, the installation takes a long time
  • a reticle mask fixed by magnetic attraction which is made of a magnetic material.
  • the reticle mask is provided with a plurality of effective opening areas 100 and an ineffective area 300 disposed between the effective opening areas 100.
  • the effective opening area 100 is provided with steam corresponding to a predetermined pattern. Plated pores (not shown).
  • the effective opening area 100 of the mask mask is sucked by a magnetic plate (not shown) before vapor deposition, so that the effective opening area 100 is completely flat on the substrate to avoid a shadow effect.
  • the size of the effective opening area 100 is set according to an effective area of a substrate (not shown).
  • the effective opening area 100 is provided with a plurality of vapor deposition apertures, the quality of the effective opening area 100 is different from the quality of the ineffective area 300 between the two effective opening areas 100, which causes quality when the magnetic mask is applied to the mask.
  • the adsorption order of different blocks is different, which causes the effective opening area 100 to fail to be effectively flattened at a predetermined position, thereby causing the pixel position to shift.
  • An object of the present invention is to provide a method for fabricating a mask mask, which reduces the quality difference between the effective opening area of the obtained mask mask and the adjacent ineffective area by half etching the ineffective area, thereby effectively preventing light.
  • the mask mask is adsorbed, the order of sucking is different due to a large difference in the amount of shield between the effective opening area and the ineffective area.
  • Another object of the present invention is to provide a reticle mask which reduces the quality difference between the effective opening area and the adjacent ineffective area by providing a groove in the ineffective area, thereby effectively ensuring the adsorption of the reticle mask
  • the effective opening area of the mask mask can be completely flat to a predetermined position on the substrate, thereby ensuring the precision of the coating pattern.
  • the present invention provides a method of fabricating a reticle mask, including the following Steps:
  • Step 1 Providing a reticle mask semi-finished product, the reticle blank semi-finished product is provided with a plurality of effective opening areas and an ineffective area around the effective opening area;
  • Step 2 Form a groove on the ineffective area by a half etching process.
  • the step 2 reduces the quality of the ineffective area.
  • the step 2 reduces the mass of the ineffective area such that the mass of the invalid area having the same area as the effective opening area is equal to the mass of the effective opening area.
  • the effective opening area is provided with a plurality of vapor deposition apertures.
  • the reticle mask semi-finished product is made of a magnetic material, which is integral or spliced.
  • the invention also provides a method for fabricating a reticle mask, comprising the following steps:
  • Step 1 Providing a reticle mask semi-finished product, the reticle blank semi-finished product is provided with a plurality of effective opening areas and an ineffective area around the effective opening area;
  • Step 2 forming a groove on the ineffective area by a half etching process
  • step 2 reduces the quality of the invalid area
  • step 2 reduces the quality of the ineffective area such that the mass of the ineffective area having the same area as the effective open ⁇ area is equal to the mass of the effective open area;
  • a plurality of vapor deposition apertures are disposed;
  • the reticle mask semi-finished product is made of a magnetic material, which is integrated or spliced.
  • the present invention also provides a reticle mask having a plurality of effective open areas and an ineffective area around the effective open area, the recessed areas being provided with recesses.
  • the groove is for reducing the mass of the ineffective area, and the shield amount of the ineffective area having the same area as the effective opening area is equal to the shield amount of the effective opening area.
  • a plurality of vapor deposition apertures are provided on the effective opening area.
  • the groove is formed by a half etching process.
  • the reticle mask is made of a magnetic material which is integral or spliced.
  • the method for fabricating a mask mask of the present invention and the mask mask produced by the method are formed by forming a recess in the ineffective region by performing a half-cutting on the ineffective region provided around the effective opening region , reducing the quality difference between the effective open area and the ineffective area, effectively avoiding the problem of different adsorption order due to the large difference in quality between the effective open area and the inactive area when sucking the mask mask, thereby ensuring light
  • the effective opening area of the mask mask can be completely flattened to a predetermined position on the substrate to ensure the precision of the plating pattern.
  • FIG. 1 is a schematic perspective view of a conventional organic light-emitting device
  • FIG. 2 is a partial cross-sectional view of a conventional reticle mask
  • FIG. 3 is a schematic plan view showing another conventional reticle mask
  • Figure 4 is a schematic cross-sectional view of the reticle mask shown in Figure 3;
  • FIG. 5 is a flow chart of a method of fabricating a reticle mask of the present invention.
  • FIG. 6 is a schematic plan view showing a reticle mask of the present invention.
  • FIG. 7 is a schematic cross-sectional view of a reticle mask of the present invention.
  • the present invention provides a method for fabricating a mask mask, which comprises the following steps:
  • Step 1 A reticle mask semi-finished product is provided.
  • the reticle blank is provided with a plurality of effective opening regions 22 and an ineffective region 24 located around the effective opening region 22.
  • the reticle blank semi-finished product is provided by the prior art, and is made of a magnetic material, and the reticle blank can be a one-piece integrated foil sheet mask or a splicing type. Mask mask.
  • the effective opening area 22 is provided with a plurality of vapor deposition apertures 222, which are arranged according to the pattern to be evaporated.
  • Step 2 A recess 242 is formed in the ineffective area 24 by a half etching process.
  • a recess 242 is formed in the ineffective region 24 by a half etching process to reduce the quality of the ineffective region 24.
  • the recess 242 is formed by a half etching process, and the operation is simple, and the depth of the recess 242 is easily controlled, thereby effectively reducing the opening.
  • the mass of the ineffective area 24 having the same area as the effective open area 22 is substantially equal to the mass of the effective open area 22, preferably having The mass of the ineffective area 24 of the same area of the effective opening area 22 is equal to the mass of the effective opening area 22; thereby avoiding the effective opening area 22 due to the adsorption of the reticle mask
  • the difference in quality between the ineffective areas 24 is large, resulting in a problem of uneven adsorption order, thereby ensuring that the effective opening area 22 of the mask mask can be completely flat against a predetermined position on the substrate (not shown).
  • a vapor deposition material (not shown) is evaporated by a heating evaporation source (not shown) at a predetermined position on the substrate, and adhered to the vapor deposition surface of the substrate through the vapor deposition aperture 222 of the mask mask.
  • the desired pattern is precisely formed on the vapor deposition surface of the substrate.
  • the present invention further provides a reticle mask having a plurality of effective opening regions 22 and an ineffective region 24 located around the effective opening region 22, wherein the ineffective region 24 is provided with a groove. 242.
  • the groove 242 is formed by a half etching process, and the operation is simple, and the depth of the groove 242 is easily controlled, and the quality of the open region 22 and the adjacent ineffective region 24 is effectively reduced.
  • the reticle mask is made of a magnetic material, and the reticle mask can be a full-piece integrated sheet mask or a splicing mask.
  • the effective opening area 22 is provided with a plurality of vapor deposition apertures 222, which are arranged according to the pattern to be evaporated.
  • the mass difference between the effective opening region 22 and its adjacent ineffective region 24 is reduced, and the mass of the ineffective region 24 having the same area as the effective opening region 22 is selected and the effective opening region 22 is selected.
  • the masses are substantially equal, and it is more preferred that the mass of the ineffective region 24 having the same area as the effective opening region 22 be equal to the shield of the effective opening region 22, thereby avoiding the effective opening region 22 and being ineffective when sucking the mask mask.
  • the difference in mass between the regions 24 is large, resulting in a problem of different adsorption sequences, thereby ensuring that the effective opening region 22 of the mask mask can be completely flat against a predetermined position on the substrate (not shown).
  • a vapor deposition material (not shown) is evaporated by a heating evaporation source (not shown) at a predetermined position on the substrate, and adhered to the vapor deposition surface of the substrate through the vapor deposition aperture 222 of the mask mask.
  • the desired pattern is precisely formed on the vapor deposition surface of the substrate.
  • the method for fabricating the mask mask of the present invention and the mask mask produced by the method form a recess by half etching the ineffective region disposed around the effective opening region, thereby reducing the effective opening region and invalidating
  • the difference in quality between the regions effectively avoids the problem of different sucking order due to the large difference in mass between the effective opening area and the ineffective area when the mask mask is adsorbed, and further
  • the effective opening area of the reticle mask can be completely flattened to a predetermined position on the substrate to ensure the precision of the coating pattern.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

一种光罩掩模板的制作方法及用该方法制作的光罩掩模板，所述方法包括：步骤1、提供光罩掩模板半成品，该光罩掩模板半成品设有数个有效开口区及位于有效开口区周围的无效区；步骤2、通过半蚀刻制程在无效区上形成凹槽。该制作方法及用该方法制作的光罩掩模板，通过对设于有效开口区周围的无效区域进行半蚀刻，在无效区上形成凹槽，降低有效开口区与无效区之间的质量差异，有效避免在吸附光罩掩模板时由于有效开口区与无效区之间的质量差异较大而导致吸附顺序不一的问题，进而保证光罩掩模板的有效开口区能完全平贴于基板上的预定位置，保证镀膜图案的精度。

Description

光翠掩模板的制作方法及用该方法制作的光罩掩模板
本发明涉及平面显示 ¾， 尤其涉及一种有机发光显示面板蒸镀 用的光罩掩模板的制作方法 ΐ]该方法制作的光罩掩模板。 背景；
平面显示装置具有机身薄、 省电、 无辐射等众多优点， 得到了广泛的 应用。 现有的平面显示装置主要包括液晶显示装置 （LCD, Liquid Crystal Display ) 及有机发光显示装置 ( OLED， Organic Light Emitting 图 1 , 现有的有机发光显示装置一般包括： 玻璃基板 900 , 形 成于玻璃基板 900上的: 电层 902 , 形成于透明导电层 902上空穴传 输层（HTL, Hole Transport Layer ) 904. 形成于空穴传输层 904上的有机 发光层（EML, Emitting Material Layer：) 906、 形成于有机发光层 906上的 电子传输层（ ETL, Electron Transport Layer ) 908及形成于电子传输层 908 上的阴极（Cathode ) 909, 其中， 所述透明导电层 902 为有机发光显示装 置的阳极（Anode ) ， 其一般由铟锡氧化物 （ΠΌ , Indium Tin Oxide ) 形 成， 当该有机发光显示装置受到直流电 （DC , Direct Current ) 所衍生的 顺向偏压时， 外加的电压能量将驱动电子 （Electron ) 与空穴（Hole )分别 由阴极 909与阳极 902注入有机发光显示装置， 当电子与空穴两者在传导 中相遇、 结合， 即形成所谓的电子 空穴复合 （ Electron- Hole Capture ) 。 而当有机发光层 906 的化学分子受到外来能量激发后， 如果电子自旋
( Electron Spin；)和基.态电子成对， 则为单重态 （Singlet ) , 其所鋒放的光 为焚光 ( Fluorescence ) ； 反之若激发态电子和基态电子自旋不成对且平 行 ， 则 称 为 三 重 态 （ Triplet ) ， 其 所释放 的 光 为 碑 光
( Phosphorescence ) 。 , 当当电电子子的的状状态态位位置置由由激激态态高高能能阶^回到稳态低能阶 时， 其能量 光子 ( Light Emission )或热能 ( Heat Dissipation ) 的 方式 i备才莫
Figure imgf000003_0001
区域， 从, ¾在基板上形成所需图案。
通常蒸镀制程是在真空室内进行， 以基板的底面作为蒸镀面， 罩掩模板设置于蒸镀面与蒸发源之间， 进行蒸镀时， 是将蒸发源加热使蒸 镀材料蒸发， 并经由光罩掩模板的蒸镀孔隙附着于蒸镀面上， 进而在蒸镀 面上形成所需要的图案。
请参阅图 2， 为现有的一种光罩掩模板的结构示意图， 其一般由玻 璃、 石英、 氟化镁或氟化钙等热膨胀系数与加工元件基板相同或在其下的 材料制成， 其上以矩阵形态配置有多个工作单元 11 , 在工作单元 11 中， 以向内部凹设的形态形成一厚度约在 50 500μηι的遮蔽层 12, 并于该遮蔽 层 12 上镂刻有与所要求的预定图案相对应的贯穿空槽作为蒸镀孔隙 13， 为了防止工作单元 11 变形而导致蒸镀精度偏差， 在工作单元 11 的周缘形 成具有较大厚度约在 50μιη数公分（cm ) 的肋部 14。 在使用时， 光罩掩模 板由支持机构 （未图示） 固定于加工元件基板的蒸镀面下， 但由于其较 薄， 不易对位固定， 安装耗时较长， 生产成本相对较高。
为了解决上述问题， 出现了一种由磁力吸附固定的光罩掩模板， 其由 磁吸材料制成。 如图 3与图 4所示， 该光罩掩模板上设有数个有效开口区 100及设于有效开口区 100之间的无效区 300, 所述有效开口区 100上设 有对应预定图案的蒸镀孔隙 （未图示） 。 蒸镀前通过磁板（未图示）吸付 光罩掩模板有效开口区 100， 使得该有效开口区 100 完全平贴于基板上， 以避免阴影效应 （shadow effect ) 。 所述有效开口区 100 的尺寸大小依据 基板（未图示）有效区设置。 然而， 由于有效开口区 100设有数个蒸镀孔 隙， 这就使得有效开口区 100 的质量与两有效开口区 100之间的无效区 300质量不同， 在磁力吸付光罩掩模板时会导致质量不同区块吸附先后顺 序不一， 造成有效开口区 100 未能有效平贴于预定位置， 进而导致像素 ( pixel )位置偏移。 发明内容
本发明的目的在于提供一种光罩掩模板的制作方法， 其通过对无效区 进行半蚀刻， 降低制得的光罩掩模板的有效开口区与相邻的无效区的质量 差异， 有效避免光罩掩模板在吸附时由于有效开口区与无效区之间的盾量 差异较大 导致的吸†顺序不一的问题。
本发明的另一目的在于提供一种光罩掩模板， 其通过在无效区上设有 凹槽， 减小有效开口区与相邻的无效区的质量差异， 有效保证在光罩掩模 板吸附时， 光罩掩模板的有效开口区能完全平贴于基板上的预定位置， 进 而保证镀膜图案的精度。
为实现上述目的， 本发明提供一种光罩掩模板的制作方法， 包括以下 步錄：
步骤 1、 提供光罩掩模板半成品， 该光罩掩模板半成品设有数个有效 开口区及位于有效开口区周围的无效区；
步骤 2、 通过半蚀刻制程在无效区上形成凹槽。
所述步骤 2减小无效区的质量。
所述步骤 2减小无效区的质量， 使^ "具有与有效开口区相同面积的无 效区的质量与所述有效开口区的质量相等。
步骤 1中所述.有效开口区上设有数个蒸镀孔隙。
所述光罩掩模板半成品由磁吸材料制成， 其为一体式或拼接式。
本发明还提供一种光罩掩模板的制作方法， 包括以下步骤：
步骤 1、 提供光罩掩模板半成品， 该光罩掩模板半成品设有数个有效 开口区及位于有效开口区周围的无效区；
步骤 2、 通过半蚀刻制程在无效区上形成凹槽；
其中， 所述步骤 2减小无效区的质量；
其中， 所述步骤 2减小无效区的质量， 使得具有与有效开 α区相同面 积的无效区的质量与所述有效开口区的质量相等；
其中， 步骤 i中所述有效开口区上设有数个蒸镀孔隙；
其中， 所述光罩掩模板半成品由磁吸材料制成， 其为一体式或拼接 式。
本发明还提供一种光罩掩模板， 设有数个有效开口区及位于有效开口 区周围的无效区， 所述无效区上设有凹槽。
所述凹槽用于减小无效区质量， 具有与有效开口区相同面积的无效区 的盾量与所述有效开口区的盾量相等。
所述有效开口区上设有数个蒸镀孔隙。
所述凹槽通过半蚀刻制程形成。
所述光罩掩模板由磁吸材料制成， 其为一体式或拼接式。
本发明的有益效果： 本发明的光罩掩模板的制作方法及用该方法制作 的光罩掩模板， 通过对设于有效开口区周围的无效区进行半 ；刻， 在无效 区上形成凹槽， 降低有效开口区与无效区之间的质量差异， 有效避免在吸 酎光罩掩模板时由于有效开口区与无效区之间的质量差异较大而导致吸附 顺序不一的问题， 进而保证光罩掩模板的有效开口区能完全平贴于基板上 的预定位置， 保证镀膜图案的精度。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显, 易见。
附图中，
图 1为现有的有机发光装置的立体结构示意图；
图 2为现有的一种光罩掩模^的局部剖面示意图
图 3为现有的另一种光罩掩模板的平面结构示意图；
图 4为图 3所示的光罩掩模^!的剖面示意图；
图 5为本发明光罩掩模板的制作方法的流程图；
图 6为本发明光罩掩模板的平面结构示意图；
图 7为本发明光罩掩模板的剖面示意图„ 具体实旅方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 5 至图 7, 本发明提供一种光罩掩模板的制作方法， 包括以 下步骤：
步骤 1、 提供光罩掩模板半成品， 该光罩掩模板半成品设有数个有效 开口区 22及位于有效开口区 22周围的无效区 24。
所述光罩掩模板半成品通过现有技术提供， 其由磁吸材料制成， 该光 罩掩模板半成品可为一整张的一体式光罩掩模板 ( foil sheet mask ) ， 也可 为拼接式光罩掩模板 ( divide mask ) 。
所述有效开口区 22上设有数个蒸镀孔隙 222， 该些蒸镀孔隙 222根据 欲蒸镀的图案设置。
步骤 2、 通过半蚀刻制程在无效区 24上形成凹槽 242。
通过半蝕刻制程在无效区 24上形成凹槽 242, 以减小无效区 24的质 量， 所述凹槽 242通过半蚀刻制程形成， 操作简单， 易于控制凹槽 242的 深度， 进而有效减小开口区 22与其相邻的无效区 24的质量差异。 为使所 述有效开口区 22与其相邻的无效区 24的质量差异减小， 具有与有效开口 区 22 相同面积的无效区 24 的质量与所述有效开口区 22 的质量大体相 等， 优选具有与有效开口区 22相同面积的无效区 24的质量与所述有效开 口区 22的质量相等； 从而避免在吸附光罩掩模板时由于有效开口区 22与 无效区 24之间的质量差异较大而导致吸附顺序不一的问题， 进而保证光 罩掩模板的有效开口区 22能完全平贴于基板（未图示）上的预定位置。
在该光罩掩模板使用时， 通过磁板吸附于基板上， 由于本发明的光罩 掩模板的有效开口区 22与无效区 24之间的质量差异较小， 使得有效开口 区 22 能完全平贴于基板上的预定位置上， 通过加热蒸发源 （未图示）使 蒸镀材料（未图示） 蒸发， 并经由光罩掩模板的蒸镀孔隙 222 附着于基板 的蒸镀面上， 进而在基板的蒸镀面上精确的形成所需要的图案。
请参阅图 6及图 7, 本发明还提供一种光罩掩模板， 其上设有数个有 效开口区 22及,位于有效开口区 22周围的无效区 24, 所述无效区 24上设 有 槽 242。
在本实施例中， 所述凹槽 242通过半蚀刻制程形成， 操作简单， 易于 控制凹槽 242的深度， 进 有效减小开口区 22与其相邻的无效区 24的质 圼轰 -rr。
所述光罩掩模板由磁吸材料制成， 该光罩掩模板可为一整张的一体式 光罩掩模板 ( full sheet mask ) ， 也可为拼接式光罩掩模板 ( divide mask )
所述有效开口区 22上设有数个蒸镀孔隙 222, 该些蒸镀孔隙 222根据 欲蒸镀的图案设置。
通过凹槽 242的设置， 实现所述有效开口区 22与其相邻的无效区 24 的质量差异减小， 俛选具有与有效开口区 22相同面积的无效区 24的质量 与所述有效开口区 22的质量大体相等， 更优选具有与有效开口区 22相同 面积的无效区 24的质量与所述有效开口区 22的盾量相等， 从而避免在吸 †光罩掩模板时由于有效开口区 22与无效区 24之间的质量差异较大而导 致吸附顺序不一的问题， 进而保证光罩掩模板的有效开口区 22 能完全平 贴于基板（未图示）上的预定位置。
在该光罩掩模板使用时， 通过磁板吸附于基板上， 由于本发明的光罩 掩模板的有效开口区 22与无效区 24之间的质量差异较小， 使得有效开口 区 22 能完全平贴于基板上的预定位置上， 通过加热蒸发源 （未图示）使 蒸镀材料（未图示） 蒸发， 并经由光罩掩模板的蒸镀孔隙 222 附着于基板 的蒸镀面上， 进而在基板的蒸镀面上精确的形成所需要的图案。
综上所述， 本发明的光罩掩模板的制作方法及用该方法制作的光罩掩 模板， 通过对设于有效开口区周围的无效区进行半蚀刻形成凹槽， 降低有 效开口区与无效区之间的质量差异， 有效避免在吸附光罩掩模板时由于有 效开口区与无效区之间的质量差异较大而导致吸酎顺序不一的问题， 进而 保证光罩掩模板的有效开口区能完全平贴于基板上的预定位置， 保证镀膜 图案的精度。
以上所述， 对于本领域的普通技术人员来说 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

一种光罩掩模板的制作方法， 包括以下步骤：
步骤 1、 提供光罩掩模板半成品， 该光罩掩模板半成
Figure imgf000009_0001
开口区及位于有效开口区周围的无效区；
步骤 2、 通过半蚀刻制程在无效区上形成凹槽。
2 , 如权利要求 1 所述的光罩掩模板的制作方法， 其中，
。
3、 ^il利要求 2 所述的光罩掩模板的制作方法， 其中， 所述步骤 2 减小无效区的质量， 使得具有与有效开口区相同面积的无效区的质量与所 述有效开口区的质量相等。
4、 如权利要求 1 所述的光罩掩模板的制作方法， 其中， 步骤 1 中所 述有效开口区上设有数个蒸镀孔隙。
5、 如权利要求 1 所述的光罩掩模板的制作方法， 其中， 所述光罩掩 模板半成品由磁吸材料制成， 其为一体式或拼接式。
6、 一种光罩掩模板的制作方法， 包括以下步骤：
步骤 1、 提供光罩掩模板半成品， 该光罩掩模板半成品设有数个有效 开口区及位.于有效开口区周围的无效区；
步骤 2、 通过半蚀刻制程在无效区上形成凹槽；
其中， 所述步骤 2减小无效区的质量；
其中， 所述步骤 2减小无效区的质量， 使得具有与有效开口区相同面 积的无效区的质量与所述有效开口区的质量相等；
其中， 步骤 1中所述有效开口区上设有数个蒸镀孔隙；
其中， 所述光罩掩模板半成品由磁吸材料制成， 其为一体式或拼接 式。
7、 一种光罩掩模板， 设有数个有效开口区及位于有效开口区周围的 无效区， 所述无效区上设有凹槽。
8、 如权利要求 7 所述的光罩掩模板， 其中， 所述凹槽用于减小无效 区质量， 具有与有效开口区相同面积的无效区的质量与所述有效开口区的 质量相等。
9、 如权利要求 7 所述的光罩掩模板， 其中， 所述有效开口区上设有 数个蒸镀孔隙。
10、 如权利要求 7所述的光罩掩模板， 其中， 所述凹槽通过半饯刻制 程形成。
i i、 如权利要求 7 所述的光罩掩模板， 其中， 所述光罩掩模板由磁吸 材料制成， 其为一体式或拼接式。
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