WO2014156775A1 - 封止シート、封止シートの製造方法及び電子部品パッケージの製造方法 - Google Patents
封止シート、封止シートの製造方法及び電子部品パッケージの製造方法 Download PDFInfo
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- WO2014156775A1 WO2014156775A1 PCT/JP2014/057168 JP2014057168W WO2014156775A1 WO 2014156775 A1 WO2014156775 A1 WO 2014156775A1 JP 2014057168 W JP2014057168 W JP 2014057168W WO 2014156775 A1 WO2014156775 A1 WO 2014156775A1
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- sealing sheet
- elastomer
- sealing
- component
- electronic component
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
- C08L65/02—Polyphenylenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the present invention relates to a sealing sheet, a method for manufacturing a sealing sheet, and a method for manufacturing an electronic component package.
- Patent Document 1 For the production of electronic component packages such as semiconductors, typically, one or more electronic components fixed to a substrate, a temporary fixing material or the like are sealed with a sealing resin, and a sealed object is provided as necessary. A procedure of dicing so as to form a package in units of electronic components is employed.
- a sealing resin As such a sealing resin, a sheet-shaped sealing resin having good handling properties is used.
- Patent Document 1 As a technique for increasing the blending amount of the filler for improving the performance of the sealing sheet, a technique for blending the filler by kneading into the sealing sheet has been proposed (Patent Document 1).
- Increasing the compounding amount of the filler in the sealing sheet can reduce warpage due to heating after thermosetting and solder reflow, etc., and can produce a highly reliable electronic component package.
- the flexibility of the sheet may decrease, and the handling property may decrease.
- MEMS Microelectronic components
- SAW Surface Acoustic Wave
- CMOS Complementary Metal Oxide Semiconductor
- acceleration sensors etc.
- MEMS microelectronic components
- These electronic components generally have a hollow structure for ensuring the propagation of surface acoustic waves, the maintenance of an optical system, the mobility of a movable member, and the like.
- sealing it is necessary to seal while maintaining the hollow structure so as to ensure the operation reliability of the movable member and the connection reliability of the element.
- the sealing sheet is also required to cope with a sealing target having such a hollow structure.
- An object of the present invention is to provide a sealing sheet that is excellent in flexibility and capable of producing a highly reliable electronic component package even if the sealing target has a hollow structure, a method for manufacturing the sealing sheet, and an electronic component package It is to provide a manufacturing method.
- the present invention is a sealing sheet in which elastomer domains are dispersed and the maximum diameter of the domains is 20 ⁇ m or less.
- fine domains having a maximum diameter of 20 ⁇ m or less (hereinafter also simply referred to as “fine domains”) are uniformly dispersed.
- Such a micro domain can give a thixotropy-like action particularly to a micro region of about several ⁇ m to several hundred ⁇ m, and can act to regulate the flow of other components due to heating during sealing.
- an electronic component having a hollow structure can be prevented from flowing into the gap and the hollow structure can be maintained, whereby a highly reliable electronic component package can be manufactured.
- the maximum diameter of the domain refers to the maximum distance among the distances between two points on the contour in the observation image of each domain. In the case where a plurality of elastomer particles are aggregated or aggregated in the observed image, a continuous contour is treated as one domain.
- the domain observation procedure and the maximum diameter measurement method are as described in the examples.
- the elastomer preferably contains a rubber component.
- the rubber component is preferably at least one selected from the group consisting of butadiene rubber, styrene rubber, acrylic rubber, and silicone rubber.
- the elastomer content is preferably 1.0% by weight or more and 3.5% by weight or less.
- the sealing sheet can ensure the embedding property of an electronic component by exhibiting moderate melt viscosity.
- the sealing sheet preferably further contains a thermosetting resin.
- the heat resistance and temporal stability of the electronic component package obtained by sealing can be improved.
- the ratio Ee / Et of the elastic modulus Ee of the elastomer at 60 ° C. to the elastic modulus Et of the thermosetting resin is preferably 5 ⁇ 10 ⁇ 5 or more and 1 ⁇ 10 ⁇ 2 or less. .
- the shear stress from the thermosetting resin effectively acts on the elastomer, and the miniaturization of the elastomer can be promoted.
- the present invention includes a kneading step of preparing a kneaded product containing an elastomer, and a molding step of forming the kneaded product into a sheet to obtain a sealing sheet,
- a method for producing a sealing sheet in which the elastomer of the sealing sheet is dispersed in a domain shape and kneaded so that the maximum diameter of the domain is 20 ⁇ m or less is also included.
- the sealing sheet can be efficiently produced.
- the ratio r / t of the kneading rotation speed r (rpm) to the kneading treatment amount t (kg / hr) in the kneading step is preferably 60 or more.
- the ratio r / t is 60 or more, sufficient shear stress is applied to the kneaded raw material containing the elastomer, and the miniaturization of the elastomer can be promoted efficiently.
- the manufacturing method of the electronic component package containing is also included.
- FIG. 1 is a cross-sectional view schematically showing a sealing sheet according to an embodiment of the present invention.
- the sealing sheet 11 is typically provided in a state of being laminated on a support 11a such as a polyethylene terephthalate (PET) film. Note that a release treatment may be applied to the support 11a in order to easily peel off the sealing sheet 11.
- PET polyethylene terephthalate
- the elastomer domains are dispersed, and the maximum diameter of the domains is 20 ⁇ m or less.
- the elastomer may be aggregated or agglomerated locally, but it is preferable that the elastomer is uniformly dispersed as a whole from the viewpoint of the flow regulating action.
- the upper limit of the maximum diameter of the domain is not particularly limited as long as it is 20 ⁇ m or less, it is preferably 15 ⁇ m or less, more preferably 10 ⁇ m or less.
- the lower limit of the maximum diameter of the domain is preferably 0.1 ⁇ m or more, and more preferably 0.3 ⁇ m or more, from the viewpoint of physical limitation of miniaturization and imparting flexibility.
- the linear expansion coefficient in 20 degreeC after thermosetting a sealing sheet at 150 degreeC for 1 hour is 15 ppm / K or less, and it is more preferable that it is 10 ppm / K or less. Thereby, the curvature in an electronic component package can be suppressed favorably.
- the measuring method of the linear expansion coefficient is as follows. The unsealed sealing sheet having a width of 4.9 mm, a length of 25 mm, and a thickness of 0.2 mm is cured at 150 ° C. for 1 hour. The cured resin sheet is set in TMA8310 (manufactured by Rigaku Corporation), and the linear expansion coefficient is measured at a tensile load of 4.9 mN and a temperature increase rate of 10 ° C./min.
- the resin composition forming the sealing sheet can suitably impart the above-described characteristics, and can be used for resin sealing of electronic components such as semiconductor chips, and is not particularly limited as long as it contains an elastomer. . From the viewpoint of improving heat resistance and stability after curing the sealing sheet, it is preferable to further include a thermosetting resin together with the elastomer.
- epoxy resin compositions containing the following components A to E are preferred.
- epoxy resin (A component) It does not specifically limit as an epoxy resin (A component) as a thermosetting resin.
- an epoxy resin (A component) As a thermosetting resin.
- Various epoxy resins such as an epoxy resin, a phenol novolac type epoxy resin, and a phenoxy resin can be used. These epoxy resins may be used alone or in combination of two or more.
- a modified bisphenol A type epoxy resin having a flexible skeleton such as an acetal group or a polyoxyalkylene group is preferable, and a modified bisphenol A type epoxy resin having an acetal group is in a liquid state and is easy to handle. Therefore, it can be particularly preferably used.
- the content of the epoxy resin (component A) is preferably set in the range of 1 to 10% by weight with respect to the entire epoxy resin composition.
- the phenol resin (component B) is not particularly limited as long as it can be used as a thermosetting resin and causes a curing reaction with the epoxy resin (component A).
- a phenol novolak resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resole resin, or the like is used.
- phenolic resins may be used alone or in combination of two or more.
- phenol resin those having a hydroxyl equivalent weight of 70 to 250 and a softening point of 50 to 110 ° C. are preferably used from the viewpoint of reactivity with the epoxy resin (component A), and above all, from the viewpoint of high curing reactivity.
- a phenol novolac resin can be preferably used. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can also be suitably used.
- the blending ratio of the epoxy resin (component A) and the phenol resin (component B) is a hydroxyl group in the phenol resin (component B) with respect to 1 equivalent of the epoxy group in the epoxy resin (component A). It is preferable to blend so that the total amount becomes 0.7 to 1.5 equivalents, more preferably 0.9 to 1.2 equivalents.
- the elastomer (C component) used together with the epoxy resin (A component) and the phenol resin (B component) is not particularly limited as long as the above-mentioned predetermined domain can be formed.
- various acrylic copolymers and A rubber component or the like can be used.
- a rubber component is included from the viewpoint that the dispersibility in the epoxy resin (component A) and the heat resistance, flexibility, and strength of the resulting sealing sheet can be improved.
- a rubber component is preferably at least one selected from the group consisting of butadiene rubber, styrene rubber, acrylic rubber, and silicone rubber. These may be used alone or in combination of two or more.
- the content of the elastomer (component C) is preferably 1.0 to 3.5% by weight, more preferably 1.0 to 3.0% by weight, based on the entire epoxy resin composition.
- the content of the elastomer (component C) is less than 1.0% by weight, it is difficult to obtain the flexibility and flexibility of the sealing sheet 11, and it is also difficult to perform resin sealing with the warping of the sealing sheet suppressed. It becomes.
- the content exceeds 3.5% by weight the melt viscosity of the sealing sheet 11 is increased, the embedding property of the electronic component is lowered, and the strength and heat resistance of the cured body of the sealing sheet 11 are reduced. There is a tendency to decrease.
- the weight ratio of elastomer (C component) to epoxy resin (A component) is preferably set in the range of 0.5 to 1.5.
- weight ratio is less than 0.5, it becomes difficult to control the fluidity of the sealing sheet 11, while when it exceeds 1.5, the adhesiveness of the sealing sheet 11 to electronic components tends to be inferior. Because it is seen.
- the ratio Ee / Et of the elastic modulus Ee of the elastomer at 60 ° C. to the elastic modulus Et of the thermosetting resin is preferably 5 ⁇ 10 ⁇ 5 or more and 1 ⁇ 10 ⁇ 2 or less, and 2 ⁇ 10 ⁇ 4. More preferably, it is 4 ⁇ 10 ⁇ 3 or less.
- Each sheet of elastomer and thermosetting resin is cut into a strip shape having a thickness of 200 ⁇ m, a length of 400 mm, and a width of 10 mm with a cutter knife to obtain a measurement sample.
- a measurement sample using this measurement sample, using a solid viscoelasticity measuring apparatus (RSAIII, manufactured by Rheometric Scientific), a tensile elastic modulus at ⁇ 50 to 300 ° C. under the conditions of a frequency of 1 Hz and a heating rate of 10 ° C./min, And measure the loss modulus.
- the value of the tensile modulus at 60 ° C. at the time of this measurement is read to obtain the target tensile modulus Ee and Et.
- the inorganic filler (component D) is not particularly limited, and various conventionally known fillers can be used.
- the internal stress is reduced by reducing the thermal linear expansion coefficient of the cured product of the epoxy resin composition, and as a result, the warp of the sealing sheet 11 after sealing of the electronic component can be suppressed.
- a fused silica powder among the silica powders examples include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, it is particularly preferable to use a spherical fused silica powder.
- those having an average particle size in the range of 54 ⁇ m or less are preferably used, those in the range of 0.1 to 30 ⁇ m are more preferable, and those in the range of 0.5 to 20 ⁇ m are particularly preferable.
- the average particle diameter can be derived by using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution measuring apparatus.
- the content of the inorganic filler (component D) is preferably 70 to 90% by volume of the whole epoxy resin composition (in the case of silica particles, the specific gravity is 2.2 g / cm 3 , so that it is 81 to 94% by weight). More preferably, it is 74 to 85% by volume (84 to 91% by weight in the case of silica particles), and still more preferably 76 to 83% by volume (85 to 90% by weight in the case of silica particles).
- the content of the inorganic filler (D component) is less than 70% by volume, the linear expansion coefficient of the cured product of the epoxy resin composition increases, and thus the warpage of the sealing sheet 11 tends to increase.
- liquidity of the sealing sheet 11 will worsen when the said content exceeds 90 volume%, the tendency for adhesiveness with an electronic component to fall is seen.
- the curing accelerator (component E) is not particularly limited as long as it allows curing of the epoxy resin and the phenol resin, but from the viewpoint of curability and storage stability, triphenylphosphine or tetraphenylphosphonium tetraphenyl. Organic phosphorus compounds such as borates and imidazole compounds are preferably used. These curing accelerators may be used alone or in combination with other curing accelerators.
- the content of the curing accelerator (component E) is preferably 0.1 to 5 parts by weight with respect to a total of 100 parts by weight of the epoxy resin (component A) and the phenol resin (component B).
- a flame retardant component may be added to the epoxy resin composition.
- various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, and complex metal hydroxide can be used.
- the average particle diameter of the metal hydroxide is preferably 1 to 10 ⁇ m, more preferably 2 to 5 ⁇ m, from the viewpoint of ensuring appropriate fluidity when the epoxy resin composition is heated. It is.
- the average particle size of the metal hydroxide is less than 1 ⁇ m, it becomes difficult to uniformly disperse in the epoxy resin composition, and the fluidity during heating of the epoxy resin composition tends to be insufficient.
- the surface area per addition amount of a metal hydroxide (E component) will become small when an average particle diameter exceeds 10 micrometers, the tendency for a flame-retardant effect to fall is seen.
- a phosphazene compound can be used in addition to the above metal hydroxide.
- phosphazene compounds for example, SPR-100, SA-100, SP-100 (above, Otsuka Chemical Co., Ltd.), FP-100, FP-110 (above, Fushimi Pharmaceutical Co., Ltd.) and the like are commercially available. is there.
- the phosphazene compound represented by the formula (1) or the formula (2) is preferable from the viewpoint of exhibiting a flame retardant effect even in a small amount, and the content of phosphorus element contained in these phosphanzene compounds is 12% by weight or more. Is preferred.
- n is an integer of 3 to 25
- R 1 and R 2 are the same or different and are selected from the group consisting of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group and an allyl group.
- a monovalent organic group having (In the formula (2), n and m are each independently an integer of 3 to 25.
- R 3 and R 5 are the same or different and are composed of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group and an allyl group.
- R 4 is a divalent organic group having a functional group selected from the group consisting of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group and an allyl group. .
- n is an integer of 3 to 25
- R 6 and R 7 are the same or different and are hydrogen, a hydroxyl group, an alkyl group, an alkoxy group, or a glycidyl group.
- the cyclic phosphazene oligomer represented by the above formula (3) is commercially available, for example, FP-100, FP-110 (above, Fushimi Pharmaceutical Co., Ltd.) and the like.
- the content of the phosphazene compound includes the epoxy resin (component A), phenol resin (component B), elastomer (component D), curing accelerator (component E) and phosphazene compound (other components) contained in the epoxy resin composition. It is preferably 10 to 30% by weight of the total organic component containing. That is, when the content of the phosphazene compound is less than 10% by weight of the whole organic component, the flame retardancy of the encapsulating sheet 11 is reduced and the unevenness followability to an adherend (for example, a substrate on which an electronic component is mounted). Tends to decrease, and voids tend to occur. When the content exceeds 30% by weight of the whole organic component, tackiness is likely to occur on the surface of the sealing sheet 11, and the workability tends to be lowered, such as difficulty in alignment with the adherend.
- the sealing sheet 11 having excellent flame retardancy while ensuring the flexibility necessary for sealing the sheet.
- sufficient flame retardancy when only the metal hydroxide is used and sufficient flexibility can be obtained when only the phosphazene compound is used.
- organic flame retardants are used from the viewpoints of deformability of the sealing sheet at the time of molding the resin seal, conformability to the unevenness of the electronic component or adherend, and adhesion to the electronic component or adherend. It is desirable to use phosphazene flame retardants.
- the epoxy resin composition can be appropriately mixed with other additives such as pigments including carbon black as necessary.
- the manufacturing method of the sealing sheet of the present embodiment includes a kneading step of preparing a kneaded material containing an elastomer, and a forming step of forming the kneaded material into a sheet shape to obtain a sealing sheet.
- the elastomer of the sealing sheet is kneaded so that the domains are dispersed in a domain shape and the maximum diameter of the domain is 20 ⁇ m or less.
- an epoxy resin composition is prepared by mixing the above-described components.
- the mixing method is not particularly limited as long as each component is uniformly dispersed and mixed.
- a kneaded material is prepared by kneading each compounding component including the elastomer directly with a kneader or the like.
- the elastomer of the encapsulating sheet is kneaded so that the elastomer is dispersed in a domain shape and the maximum diameter of the domain is 20 ⁇ m or less.
- the above components A to E and, if necessary, each component of other additives are mixed using a known method such as a mixer, and then kneaded to prepare a kneaded product.
- the method of melt kneading is not particularly limited, and examples thereof include a method of melt kneading with a known kneader such as a mixing roll, a pressure kneader, or an extruder.
- a kneader for example, a kneading screw having a portion in which the protruding amount of the screw blade from the screw shaft in a part of the axial direction is smaller than the protruding amount of the screw blade of the other portion or the shaft
- a kneader equipped with a kneading screw having no screw blades in a part of the direction can be suitably used.
- Low shear force and low agitation in the part where the protruding amount of the screw wing is small or where there is no screw wing increases the compression rate of the kneaded product, and it is possible to eliminate the trapped air and generate pores in the obtained kneaded product Can be suppressed.
- the kneading conditions are not particularly limited as long as the temperature is equal to or higher than the softening point of each component described above.
- the thermosetting property of the epoxy resin it is preferably 40 to 140 ° C., more preferably The temperature is 60 to 120 ° C., and the time is, for example, 1 to 30 minutes, preferably 5 to 15 minutes. Thereby, a kneaded material can be prepared.
- the ratio r / t of the kneading rotation speed r (rpm) to the kneading throughput t (kg / hr) is preferably 60 or more, and more preferably 70 or more.
- the ratio r / t is 60 or more, sufficient shear stress is applied to the kneaded raw material containing the elastomer, and the miniaturization of the elastomer can be promoted efficiently.
- the kneading rotation speed r (rpm) is preferably 200 to 1000 rpm
- the kneading throughput t (kg / hr) is preferably 3 to 20 kg / hr.
- the encapsulating sheet 11 can be obtained by forming the obtained kneaded material into a sheet by extrusion molding. Specifically, the encapsulating sheet 11 can be formed by extrusion molding without cooling the kneaded product after melt-kneading while maintaining a high temperature state.
- Such an extrusion method is not particularly limited, and examples thereof include a T-die extrusion method, a roll rolling method, a roll kneading method, a co-extrusion method, and a calendar molding method.
- the extrusion temperature is not particularly limited as long as it is equal to or higher than the softening point of each component described above. However, considering the thermosetting property and moldability of the epoxy resin, for example, 40 to 150 ° C., preferably 50 to 140 ° C. Preferably, it is 70 to 120 ° C.
- the sealing sheet 11 can be formed.
- the thickness of the sealing sheet 11 is not particularly limited, but is preferably 100 to 2000 ⁇ m. Within the above range, the electronic component can be satisfactorily sealed. Further, by making the resin sheet thin, the amount of heat generation can be reduced, and curing shrinkage hardly occurs. As a result, the amount of package warpage can be reduced, and a more reliable electronic component package can be obtained.
- the sealing sheet obtained in this way may be used by being laminated so as to have a desired thickness if necessary. That is, the sealing sheet may be used in a single layer structure, or may be used as a laminate formed by laminating two or more multilayer structures.
- FIGS. 2A to 2C are cross-sectional views schematically showing one process of a method for manufacturing an electronic component package according to an embodiment of the present invention.
- the electronic component mounted on the substrate is hollow-sealed with a sealing sheet to produce an electronic component package.
- the SAW filter is used as the electronic component and the printed wiring board is used as the adherend, but other elements may be used.
- a capacitor, a sensor device, a light emitting element, a vibration element or the like can be used as an electronic component, and a lead frame, a tape carrier, or the like can be used as an adherend.
- hollow sealing is carried out, you may carry out solid sealing so that a hollow part may not be included using an underfill material etc. depending on sealing object.
- a printed wiring board 12 on which a plurality of SAW chips 13 are mounted is prepared (see FIG. 2A).
- the SAW chip 13 can be formed by dicing a piezoelectric crystal on which a predetermined comb-shaped electrode is formed by a known method.
- a known device such as a flip chip bonder or a die bonder can be used.
- the SAW chip 13 and the printed wiring board 12 are electrically connected via protruding electrodes 13a such as bumps.
- a hollow portion 14 is maintained between the SAW chip 13 and the printed wiring board 12 so as not to inhibit the propagation of surface acoustic waves on the surface of the SAW chip.
- the distance between the SAW chip 13 and the printed wiring board 12 is determined by the specifications of each element, and is generally about 15 to 50 ⁇ m.
- the sealing sheet 11 is laminated on the printed wiring board 12 so as to cover the SAW chip 13, and the SAW chip 13 is resin-sealed with the sealing sheet (see FIG. 2B).
- the sealing sheet 11 functions as a sealing resin for protecting the SAW chip 13 and elements associated therewith from the external environment.
- the sealing sheet 11 by employing the sealing sheet 11, the SAW chip 13 can be embedded simply by sticking the cover of the SAW chip 13 on the printed wiring board 12, thereby improving the production efficiency of the electronic component package. be able to.
- the sealing sheet 11 can be laminated on the printed wiring board 12 by a known method such as hot press or laminator.
- hot press conditions the temperature is, for example, 40 to 100 ° C., preferably 50 to 90 ° C.
- the pressure is, for example, 0.1 to 10 MPa, preferably 0.5 to 8 MPa
- the time For example, 0.3 to 10 minutes, preferably 0.5 to 5 minutes.
- it is preferable to press under reduced pressure conditions for example, 0.1 to 5 kPa).
- the sealing sheet 15 is formed by thermosetting the sealing sheet (see FIG. 2B).
- the conditions of the thermosetting treatment of the sealing sheet are preferably 100 to 200 ° C., more preferably 120 to 180 ° C. as the heating temperature, and preferably 10 to 180 minutes, more preferably 30 to 120 minutes as the heating time. , You may pressurize as needed. In the pressurization, preferably 0.1 MPa to 10 MPa, more preferably 0.5 MPa to 5 MPa can be employed.
- dicing process Subsequently, dicing of the sealing body 15 including elements such as the sealing sheet 11, the printed wiring board 12, and the SAW chip 13 may be performed (see FIG. 2C). Thereby, the electronic component package 18 in the SAW chip 13 unit can be obtained. Dicing is usually performed after fixing the sealing body 15 with a conventionally known dicing sheet.
- Board mounting process If necessary, it is possible to perform a substrate mounting process in which rewiring and bumps are formed on the electronic component package 18 obtained above and mounted on a separate substrate (not shown).
- a known device such as a flip chip bonder or a die bonder can be used for mounting the electronic component package 18 on the substrate.
- each compounding component is kneaded with a kneader or the like to prepare a kneaded product, and the kneaded product is extruded to form a sheet.
- distributed each component in the organic solvent etc. is applied, and it forms in a sheet form.
- the coating method since the sheet can be formed in a state where the elastomer is dissolved or dispersed in a solvent or the like, the domain size of the elastomer can be miniaturized.
- the above components A to E and other additives as necessary are mixed as appropriate according to a conventional method, and uniformly dissolved or dispersed in an organic solvent to prepare a varnish.
- the sealing sheet 11 can be obtained by applying the varnish on a support such as polyester and drying it. If necessary, a release sheet such as a polyester film may be bonded to protect the surface of the sealing sheet. The release sheet peels at the time of sealing.
- the organic solvent is not particularly limited, and various conventionally known organic solvents such as methyl ethyl ketone, acetone, cyclohexanone, dioxane, diethyl ketone, toluene, and ethyl acetate can be used. These may be used alone or in combination of two or more. Usually, it is preferable to use an organic solvent so that the solid content concentration of the varnish is in the range of 30 to 95% by weight.
- the thickness of the sheet after drying the organic solvent is not particularly limited, but is usually preferably set to 5 to 100 ⁇ m, more preferably 20 to 70 ⁇ m, from the viewpoint of thickness uniformity and the amount of residual solvent. is there.
- Example 1 (Preparation of sealing sheet) By blending the following components with a mixer, using a twin-screw kneader, kneading rotation speed is 300 rpm, kneading treatment amount is 5 kg / hr, melt kneading at 110 ° C. for 10 minutes, and then extruding from a T die, A sealing sheet having a thickness of 200 ⁇ m was produced.
- Epoxy resin bisphenol F type epoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., YSLV-80XY (epochine equivalent 200 g / eq. Softening point 80 ° C.)) 3.4 parts phenol resin: phenol resin having biphenylaralkyl skeleton (Maywa) MEH-7851-SS (Hydroxyl equivalent: 203 g / eq., Softening point: 67 ° C.)) 3.6 parts Elastomer: (Mitsubrene C-132E, Mitsubishi Rayon Co., Ltd.) 2.3 parts Inorganic filler: Spherical melting Silica (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-9454FC) 87.9 parts Silane coupling agent: Epoxy group-containing silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-803) 0.5 part Carbon black (Mitsubishi
- Example 2 A sealing sheet was produced in the same manner as in Example 1 except that the kneading amount was 3.5 kg / hr.
- Example 3 A sealing sheet was produced in the same manner as in Example 1 except that the kneading rotation speed was 500 rpm.
- Example 4 A sealing sheet was produced in the same manner as in Example 1 except that the kneading rotation speed was 1000 rpm.
- Example 5 The following components were dissolved or dispersed in a 1: 1 mixed solvent of methyl ethyl ketone and toluene to prepare a varnish having a solid content of 40% by weight.
- Epoxy resin bisphenol F type epoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., YSLV-80XY (epochine equivalent 200 g / eq. Softening point 80 ° C.)) 3.4 parts phenol resin: phenol resin having biphenylaralkyl skeleton (Maywa) Made by Kasei Co., Ltd., MEH-7851-SS (hydroxyl equivalent: 203 g / eq., Softening point: 67 ° C.) 3.6 parts Elastomer: (manufactured by Kaneka Corporation, SIBSTAR 102T) 4.0 parts Inorganic filler: spherical fused silica (Manufactured by Denki Kagaku Kogyo Co., Ltd., FB-9454FC) 87.0 parts Carbon black (manufactured by Mitsubishi Chemical Corporation, # 20) 0.1 part Flame retardant: (manufactured by Fushimi Pharmaceutical Co., Ltd., FP-
- the varnish was applied so that the thickness of the coating film after drying the solvent was 50 ⁇ m, and then the drying condition was 120 ° C. for 3 minutes to dry the coating film.
- a resin sheet having a thickness of 50 ⁇ m was obtained.
- the obtained resin sheet was laminated to a thickness of 200 ⁇ m using a laminator to prepare a sealing sheet having a thickness of 200 ⁇ m.
- Example 1 A sealing sheet was produced in the same manner as in Example 1 except that the kneading rotation speed was 100 rpm.
- Example 2 A sealing sheet was produced in the same manner as in Example 1 except that the kneading rotation speed was 50 rpm.
- the produced sealing sheet was heat-cured at 150 ° C. for 1 hour and gradually cooled to room temperature, and then the obtained cured product was cut with a cutter.
- the cut surface was polished by a Buhler automatic polishing apparatus, and the cut surface after polishing was observed with SEM (2000 times).
- SEM 2000 times
- FIG. 3 the SEM observation image of the cut surface of the sealing sheet of Example 1 is shown.
- a region shown in black in the SEM observation image is an elastomer domain.
- 50 elastomer domains shown in black were selected at random, and their maximum diameters were measured and averaged to obtain the maximum domain diameter.
- SEM observation and maximum diameter measurement were performed in the same manner. The results of the maximum diameter measurement are shown in Table 1.
- Chip size 1.4 ⁇ 1.1mm ⁇ (thickness 150 ⁇ m)
- Bump material Au Height 30 ⁇ m
- Number of bumps 6 bumps
- Number of chips 100 (10 x 10)
- Each sealing sheet was affixed on the obtained SAW chip mounting substrate by a vacuum press under the heating and pressing conditions shown below.
- the sealing sheet was thermally cured in a hot air dryer at 150 ° C. for 1 hour to obtain a sealed body.
- the amount of resin entering the hollow part between the SAW chip and the glass substrate was measured from the glass substrate side by an electron microscope (manufactured by KEYENCE, trade name “Digital Microscope”, 200 times).
- the amount of the resin entering is confirmed and memorized by the electron microscope from the glass substrate side before the sealing with the sealing sheet, and is observed again with the electron microscope from the glass substrate side after the sealing.
- the observation images before and after the stop were compared, and the maximum reach distance of the resin that entered the hollow portion from the end of the SAW chip that had been confirmed before sealing was measured, and this was taken as the amount of resin penetration.
- the case where the resin penetration amount was 20 ⁇ m or less was evaluated as “ ⁇ ”, and the case where it exceeded 20 ⁇ m was evaluated as “ ⁇ ”.
- the results are shown in Table 1.
- the sealing sheets of Examples 1 to 5 had good flexibility. On the other hand, in Comparative Examples 1 and 2, cracks occurred and the flexibility was poor. Further, in Examples 1 to 5, in the SAW chip package produced by the encapsulating sheet having the micro domain of elastomer, the resin component of the encapsulating sheet is prevented from entering the hollow portion, and the high quality electronic component package As can be seen from FIG. In Comparative Examples 1 and 2, the amount of resin entering the hollow portion exceeded 20 ⁇ m. This is considered to be due to the fact that the maximum diameter of the elastomer domain exceeds 20 ⁇ m and the resin flow regulating action is not sufficient.
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Abstract
Description
前記混練物をシート状に成形して封止シートを得る成形工程
を含み、
前記混練工程において、前記封止シートのエラストマーがドメイン状に分散し、該ドメインの最大径が20μm以下となるように混練する封止シートの製造方法も含まれる。
前記封止シートを硬化させて封止体を形成する封止体形成工程
を含む電子部品パッケージの製造方法も含まれる。
[封止シート]
本実施形態に係る封止シートについて図1を参照しつつ説明する。図1は、本発明の一実施形態に係る封止シートを模式的に示す断面図である。封止シート11は、代表的に、ポリエチレンテレフタレート(PET)フィルム等の支持体11a上に積層された状態で提供される。なお、支持体11aには封止シート11の剥離を容易に行うために離型処理が施されていてもよい。
A成分:エポキシ樹脂
B成分:フェノール樹脂
C成分:エラストマー
D成分:無機充填剤
E成分:硬化促進剤
熱硬化性樹脂としてのエポキシ樹脂(A成分)としては、特に限定されるものではない。例えば、トリフェニルメタン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、変性ビスフェノールA型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、変性ビスフェノールF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、フェノキシ樹脂等の各種のエポキシ樹脂を用いることができる。これらエポキシ樹脂は単独で用いてもよいし2種以上併用してもよい。
フェノール樹脂(B成分)は、熱硬化性樹脂として用いることができるとともに、エポキシ樹脂(A成分)との間で硬化反応を生起するものであれば特に限定されるものではない。例えば、フェノールノボラック樹脂、フェノールアラルキル樹脂、ビフェニルアラルキル樹脂、ジシクロペンタジエン型フェノール樹脂、クレゾールノボラック樹脂、レゾール樹脂、等が用いられる。これらフェノール樹脂は単独で用いてもよいし、2種以上併用してもよい。
エポキシ樹脂(A成分)及びフェノール樹脂(B成分)とともに用いられるエラストマー(C成分)は、上述の所定のドメインを形成可能であれば特に限定するものではなく、例えば、各種アクリル系共重合体やゴム成分等を用いることができる。エポキシ樹脂(A成分)への分散性や、得られる封止シートの耐熱性、可撓性、強度を向上させることができるという観点から、ゴム成分を含むことが好ましい。このようなゴム成分としては、ブタジエン系ゴム、スチレン系ゴム、アクリル系ゴム、シリコーン系ゴムからなる群より選択される少なくとも1種であることが好ましい。これらは単独で用いてもよいし、2種以上併せて用いてもよい。
無機質充填剤(D成分)は、特に限定されるものではなく、従来公知の各種充填剤を用いることができ、例えば、石英ガラス、タルク、シリカ(溶融シリカや結晶性シリカ等)、アルミナ、窒化アルミニウム、窒化珪素、窒化ホウ素の粉末が挙げられる。これらは単独で用いてもよいし、2種以上併用してもよい。
硬化促進剤(E成分)は、エポキシ樹脂とフェノール樹脂の硬化を進行させるものであれば特に限定されるものではないが、硬化性と保存性の観点から、トリフェニルホスフィンやテトラフェニルホスホニウムテトラフェニルボレート等の有機リン系化合物や、イミダゾール系化合物が好適に用いられる。これら硬化促進剤は、単独で用いても良いし、他の硬化促進剤と併用しても構わない。
また、エポキシ樹脂組成物には、A成分からE成分に加えて、難燃剤成分を加えてもよい。難燃剤組成分としては、例えば水酸化アルミニウム、水酸化マグネシウム、水酸化鉄、水酸化カルシウム、水酸化スズ、複合化金属水酸化物等の各種金属水酸化物を用いることができる。
(式(1)中、nは3~25の整数であり、R1及びR2は同一又は異なって、アルコキシ基、フェノキシ基、アミノ基、水酸基及びアリル基からなる群より選択される官能基を有する1価の有機基である。)
(式(2)中、n及びmは、それぞれ独立して3~25の整数である。R3及びR5は同一又は異なって、アルコキシ基、フェノキシ基、アミノ基、水酸基及びアリル基からなる群より選択される官能基を有する1価の有機基である。R4は、アルコキシ基、フェノキシ基、アミノ基、水酸基及びアリル基からなる群より選択される官能基を有する2価の有機基である。)
(式(3)中、nは3~25の整数であり、R6及びR7は同一又は異なって、水素、水酸基、アルキル基、アルコキシ基又はグリシジル基である。)
封止シートの作製方法を以下に説明する。本実施形態の封止シートの製造方法は、エラストマーを含む混練物を調製する混練工程、及び前記混練物をシート状に成形して封止シートを得る成形工程を含み、前記混練工程において、前記封止シートのエラストマーがドメイン状に分散し、該ドメインの最大径が20μm以下となるように混練する。
まず、上述の各成分を混合することによりエポキシ樹脂組成物を調製する。混合方法は、各成分が均一に分散混合される方法であれば特に限定するものではない。その後、エラストマーを含む各配合成分を直接ニーダー等で混練することにより混練物を調製する。この際、封止シートのエラストマーがドメイン状に分散し、該ドメインの最大径が20μm以下となるように混練する。
得られる混練物をシート状に押出成形により成形することにより、封止シート11を得ることができる。具体的には、溶融混練後の混練物を冷却することなく高温状態のままで、押出成形することで、封止シート11を形成することができる。このような押出方法としては、特に制限されず、Tダイ押出法、ロール圧延法、ロール混練法、共押出法、カレンダー成形法などが挙げられる。押出温度としては、上記した各成分の軟化点以上であれば、特に制限されないが、エポキシ樹脂の熱硬化性および成形性を考慮すると、例えば40~150℃、好ましくは、50~140℃、さらに好ましくは70~120℃である。以上により、封止シート11を形成することができる。
次に、上記封止シートを用いる本実施形態に係る電子部品パッケージの製造方法について図2A~2Cを参照しつつ説明する。図2A~2Cはそれぞれ、本発明の一実施形態に係る電子部品パッケージの製造方法の一工程を模式的に示す断面図である。本実施形態では、基板上に搭載された電子部品を封止シートにより中空封止して電子部品パッケージを作製する。なお、本実施形態では、電子部品としてSAWフィルタを用い、被着体としてプリント配線基板を用いているが、これら以外の要素を用いてもよい。例えば、電子部品としてコンデンサやセンサデバイス、発光素子、振動素子等、被着体としてリードフレーム、テープキャリア等を用いることができる。また、被着体を用いずに、仮固定材上に電子部品を仮固定しておき、これらを樹脂封止することもできる。いずれの要素を用いても、電子部品の樹脂封止による高度な保護を達成することができる。また、中空封止しているが、封止対象によってはアンダーフィル材等を用いて中空部分を含まないよう中実封止してもよい。
SAWチップ搭載基板準備工程では、複数のSAWチップ13が搭載されたプリント配線基板12を準備する(図2A参照)。SAWチップ13は、所定の櫛形電極が形成された圧電結晶を公知の方法でダイシングして個片化することにより形成することができる。SAWチップ13のプリント配線基板12への搭載には、フリップチップボンダーやダイボンダーなどの公知の装置を用いることができる。SAWチップ13とプリント配線基板12とはバンプ等の突起電極13aを介して電気的に接続されている。また、SAWチップ13とプリント配線基板12との間は、SAWチップ表面での表面弾性波の伝播を阻害しないように中空部分14を維持するようになっている。SAWチップ13とプリント配線基板12との間の距離は各要素の仕様によって決定され、一般的には15~50μm程度である。
封止工程では、SAWチップ13を覆うようにプリント配線基板12へ封止シート11を積層し、SAWチップ13を上記封止シートで樹脂封止する(図2B参照)。この封止シート11は、SAWチップ13及びそれに付随する要素を外部環境から保護するための封止樹脂として機能する。
封止体形成工程では、上記封止シートを熱硬化処理して封止体15を形成する(図2B参照)。封止シートの熱硬化処理の条件は、加熱温度として好ましくは100℃から200℃、より好ましくは120℃から180℃、加熱時間として好ましくは10分から180分、より好ましくは30分から120分の間、必要に応じて加圧しても良い。加圧の際は、好ましくは0.1MPaから10MPa、より好ましくは0.5MPaから5MPaを採用することができる。
続いて、封止シート11、プリント配線基板12、及びSAWチップ13などの要素からなる封止体15のダイシングを行ってもよい(図2C参照)。これにより、SAWチップ13単位での電子部品パッケージ18を得ることができる。ダイシングは、通常、従来公知のダイシングシートにより上記封止体15を固定した上で行う。
必要に応じて、上記で得られた電子部品パッケージ18に対して再配線及びバンプを形成し、これを別途の基板(図示せず)に実装する基板実装工程を行うことができる。電子部品パッケージ18の基板への実装には、フリップチップボンダーやダイボンダーなどの公知の装置を用いることができる。
第1実施形態では、各配合成分をニーダー等で混練して混練物を調製し、この混練物を押出成形してシート状に形成している。これに対し、本実施形態では、各成分を有機溶剤等に溶解又は分散したワニスを塗工してシート状に形成する。塗工法では、エラストマーを溶剤等に溶解又は分散させた状態でシート成膜が可能であるので、エラストマーのドメインサイズを微小化することができる。
(封止シートの作製)
以下の成分をミキサーにてブレンドし、2軸混練機により、混練回転数を300rpm、混練処理量を5kg/hrとし、110℃で10分間溶融混練し、続いてTダイから押出しすることにより、厚さ200μmの封止シートを作製した。
フェノール樹脂:ビフェニルアラルキル骨格を有するフェノール樹脂(明和化成社製、MEH-7851-SS(水酸基当量203g/eq.、軟化点67℃)) 3.6部
エラストマー:(三菱レーヨン社製、メタブレンC-132E) 2.3部
無機充填剤:球状溶融シリカ(電気化学工業社製、FB-9454FC) 87.9部
シランカップリング剤:エポキシ基含有シランカップリング剤(信越化学工業(株)製、KBM-803) 0.5部
カーボンブラック(三菱化学(株)製、MA600) 0.1部
難燃剤:((株)伏見製薬所製、FP-100) 1.8部
硬化促進剤:イミダゾール系触媒(四国化成工業社製、2PHZ-PW) 0.4部
混練処理量を3.5kg/hrとしたこと以外は、実施例1と同様に封止シートを作製した。
混練回転数を500rpmとしたこと以外は、実施例1と同様に封止シートを作製した。
混練回転数を1000rpmとしたこと以外は、実施例1と同様に封止シートを作製した。
以下の成分をメチルエチルケトンとトルエンとの1:1混合溶剤に溶解ないし分散し、固形分40重量%のワニスを作製した。
フェノール樹脂:ビフェニルアラルキル骨格を有するフェノール樹脂(明和化成社製、MEH-7851-SS(水酸基当量203g/eq.、軟化点67℃)) 3.6部
エラストマー:((株)カネカ製、SIBSTAR 102T) 4.0部
無機充填剤:球状溶融シリカ(電気化学工業社製、FB-9454FC) 87.0部
カーボンブラック(三菱化学(株)製、♯20) 0.1部
難燃剤:((株)伏見製薬所製、FP-100) 1.8部
硬化促進剤:イミダゾール系触媒(四国化成工業社製、2PHZ-PW) 0.1部
混練回転数を100rpmとしたこと以外は、実施例1と同様に封止シートを作製した。
混練回転数を50rpmとしたこと以外は、実施例1と同様に封止シートを作製した。
実施例及び比較例の封止用シートを、幅60mm×長さ60mmに切り出し、封止シートの両端部(平面視で対向する辺)を把持し、ゆっくりと90°折り曲げて、可撓性を下記の基準により評価した。結果を表1に示す。
○:90°折り曲げても割れなかった。
△:90°折り曲げるとヒビが入った。
×:90°折り曲げると割れた。
作製した封止シートを150℃で1時間熱硬化して室温まで徐冷した後、得られた硬化物をカッターにて切断した。切断面をビューラー製自動研磨装置にて研磨し、研磨後の切断面をSEM(2000倍)により観察した。図3に、実施例1の封止シートの切断面のSEM観察像を示す。SEM観察像において黒色で示される領域がエラストマーのドメインである。次いで、この黒色で示されるエラストマーのドメインをランダムに50点選び、それらの最大径を測定して平均値をとることでドメインの最大径とした。他の実施例2~5及び比較例1~2についても同様にSEM観察及び最大径の測定を行った。最大径測定の結果を表1に示す。
アルミニウム櫛形電極が形成された以下の仕様のSAWチップを下記ボンディング条件にてガラス基板に実装したSAWチップ実装基板を作製した。
チップサイズ:1.4×1.1mm□(厚さ150μm)
バンプ材質:Au 高さ30μm
バンプ数:6バンプ
チップ数:100個(10個×10個)
装置:パナソニック電工(株)製
ボンディング条件:200℃、3N、1sec(超音波出力2W)
温度:60℃
加圧力:4MPa
真空度:1.6kPa
プレス時間:1分
11a 支持体
13 SAWチップ
15 封止体
18 電子部品パッケージ
Claims (9)
- エラストマーのドメインが分散しており、該ドメインの最大径が20μm以下である封止シート。
- 前記エラストマーがゴム成分を含む請求項1に記載の封止シート。
- 前記ゴム成分が、ブタジエン系ゴム、スチレン系ゴム、アクリル系ゴム、シリコーン系ゴムからなる群より選択される少なくとも1種である請求項2に記載の封止シート。
- 前記エラストマーの含有量が1.0重量%以上3.5重量%以下である請求項1~3のいずれか1項に記載の封止シート。
- 熱硬化性樹脂をさらに含む請求項1~4のいずれか1項に記載の封止シート。
- 60℃における前記エラストマーの引張弾性率Eeの前記熱硬化性樹脂の引張弾性率Etに対する比Ee/Etが5×10-5以上1×10-2以下である請求項5に記載の封止シート。
- エラストマーを含む混練物を調製する混練工程、及び
前記混練物をシート状に成形して封止シートを得る成形工程
を含み、
前記混練工程において、前記封止シートのエラストマーがドメイン状に分散し、該ドメインの最大径が20μm以下となるように混練する封止シートの製造方法。 - 前記混練工程における混練回転数r(rpm)の混練処理量t(kg/hr)に対する比r/tが60以上である請求項7に記載の封止シートの製造方法。
- 一又は複数の電子部品を覆うように請求項1~6のいずれか1項に記載の封止シートを該電子部品上に積層する積層工程、及び
前記封止シートを硬化させて封止体を形成する封止体形成工程
を含む電子部品パッケージの製造方法。
Priority Applications (4)
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CN201480018211.6A CN105103285B (zh) | 2013-03-27 | 2014-03-17 | 密封片、密封片的制造方法以及电子部件封装体的制造方法 |
KR1020157030642A KR20150136513A (ko) | 2013-03-27 | 2014-03-17 | 봉지 시트, 봉지 시트의 제조 방법 및 전자 부품 패키지의 제조 방법 |
SG11201507950PA SG11201507950PA (en) | 2013-03-27 | 2014-03-17 | Sealing sheet, method for manufacturing sealing sheet, and method for manufacturing electronic component package |
US14/779,859 US20160060450A1 (en) | 2013-03-27 | 2014-03-17 | Sealing sheet, method for manufacturing sealing sheet, and method for manufacturing electronic component package |
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JP2014022295A JP6456027B2 (ja) | 2013-03-27 | 2014-02-07 | 封止シート、封止シートの製造方法及び電子部品パッケージの製造方法 |
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JP (1) | JP6456027B2 (ja) |
KR (1) | KR20150136513A (ja) |
CN (1) | CN105103285B (ja) |
SG (1) | SG11201507950PA (ja) |
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Cited By (1)
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WO2016072236A1 (ja) * | 2014-11-07 | 2016-05-12 | 日東電工株式会社 | 樹脂組成物、半導体装置の製造方法及び半導体装置 |
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US9680445B2 (en) * | 2014-10-31 | 2017-06-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Packaged device including cavity package with elastic layer within molding compound |
JP6749887B2 (ja) * | 2015-02-26 | 2020-09-02 | 日立化成株式会社 | 封止用フィルム及びそれを用いた電子部品装置 |
JP6848930B2 (ja) * | 2017-07-19 | 2021-03-24 | 株式会社村田製作所 | 電子モジュール |
US11387400B2 (en) * | 2017-07-19 | 2022-07-12 | Murata Manufacturing Co., Ltd. | Electronic module with sealing resin |
CN108873536B (zh) * | 2018-06-01 | 2022-01-18 | Oppo广东移动通信有限公司 | 壳体及其制备方法、电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08199012A (ja) * | 1995-01-26 | 1996-08-06 | Mitsubishi Chem Corp | 熱可塑性樹脂組成物 |
JPH10154777A (ja) * | 1996-11-25 | 1998-06-09 | Hitachi Ltd | 半導体装置 |
JP2009097013A (ja) * | 2007-09-27 | 2009-05-07 | Hitachi Chem Co Ltd | 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
WO2012151178A2 (en) * | 2011-05-02 | 2012-11-08 | 3M Innovative Properties Company | Thermoplastic resin composite containing hollow glass microspheres |
JP2013007028A (ja) * | 2011-05-20 | 2013-01-10 | Nitto Denko Corp | 封止用シートおよび電子部品装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3357412B2 (ja) * | 1992-03-16 | 2002-12-16 | 三井化学株式会社 | 液晶封止用樹脂組成物及び液晶封止用セルの製造方法 |
JPH1050899A (ja) * | 1996-08-06 | 1998-02-20 | Nitto Denko Corp | 半導体装置 |
WO1998015597A1 (en) * | 1996-10-08 | 1998-04-16 | Hitachi Chemical Company, Ltd. | Phase-separation structure, resin composition comprising said structure, molding material for sealing electronic component, and electronic component device |
US20040075802A1 (en) * | 1999-12-14 | 2004-04-22 | Mitsui Chemicals, Inc. | Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element |
JP3941938B2 (ja) * | 2002-11-22 | 2007-07-11 | 新日本石油株式会社 | エポキシ樹脂組成物 |
JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
JP5133598B2 (ja) * | 2007-05-17 | 2013-01-30 | 日東電工株式会社 | 封止用熱硬化型接着シート |
-
2014
- 2014-02-07 JP JP2014022295A patent/JP6456027B2/ja active Active
- 2014-03-17 SG SG11201507950PA patent/SG11201507950PA/en unknown
- 2014-03-17 WO PCT/JP2014/057168 patent/WO2014156775A1/ja active Application Filing
- 2014-03-17 CN CN201480018211.6A patent/CN105103285B/zh active Active
- 2014-03-17 US US14/779,859 patent/US20160060450A1/en not_active Abandoned
- 2014-03-17 KR KR1020157030642A patent/KR20150136513A/ko active IP Right Grant
- 2014-03-24 TW TW103110916A patent/TWI664076B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08199012A (ja) * | 1995-01-26 | 1996-08-06 | Mitsubishi Chem Corp | 熱可塑性樹脂組成物 |
JPH10154777A (ja) * | 1996-11-25 | 1998-06-09 | Hitachi Ltd | 半導体装置 |
JP2009097013A (ja) * | 2007-09-27 | 2009-05-07 | Hitachi Chem Co Ltd | 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
WO2012151178A2 (en) * | 2011-05-02 | 2012-11-08 | 3M Innovative Properties Company | Thermoplastic resin composite containing hollow glass microspheres |
JP2013007028A (ja) * | 2011-05-20 | 2013-01-10 | Nitto Denko Corp | 封止用シートおよび電子部品装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016072236A1 (ja) * | 2014-11-07 | 2016-05-12 | 日東電工株式会社 | 樹脂組成物、半導体装置の製造方法及び半導体装置 |
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TWI664076B (zh) | 2019-07-01 |
CN105103285B (zh) | 2019-11-22 |
TW201446504A (zh) | 2014-12-16 |
KR20150136513A (ko) | 2015-12-07 |
SG11201507950PA (en) | 2015-10-29 |
CN105103285A (zh) | 2015-11-25 |
JP2014209565A (ja) | 2014-11-06 |
JP6456027B2 (ja) | 2019-01-23 |
US20160060450A1 (en) | 2016-03-03 |
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