WO2014146382A1 - 触摸屏及其制造方法 - Google Patents

触摸屏及其制造方法 Download PDF

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Publication number
WO2014146382A1
WO2014146382A1 PCT/CN2013/078942 CN2013078942W WO2014146382A1 WO 2014146382 A1 WO2014146382 A1 WO 2014146382A1 CN 2013078942 W CN2013078942 W CN 2013078942W WO 2014146382 A1 WO2014146382 A1 WO 2014146382A1
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WIPO (PCT)
Prior art keywords
touch screen
sensing
mesh
adjacent
glass substrate
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PCT/CN2013/078942
Other languages
English (en)
French (fr)
Inventor
周菲
Original Assignee
南昌欧菲光科技有限公司
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Publication date
Application filed by 南昌欧菲光科技有限公司 filed Critical 南昌欧菲光科技有限公司
Priority to US14/000,199 priority Critical patent/US9063604B2/en
Priority to KR1020137029937A priority patent/KR101556312B1/ko
Priority to JP2015506092A priority patent/JP5957141B2/ja
Publication of WO2014146382A1 publication Critical patent/WO2014146382A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Definitions

  • the present invention relates to a touch screen, and to a method of manufacturing a touch screen.
  • a touch screen is an inductive device that can receive input signals such as touch.
  • the touch screen gives a new look to the information interaction and is an attractive new information interaction device.
  • the development of touch screen technology has aroused widespread concern in the information media industry at home and abroad, and has become a high-tech industry in Chaoyang, where the optoelectronic industry has sprung up.
  • the ITO (Indium Tin Oxide) layer is a vital component of touch screen modules.
  • the manufacturing technology of touch screens is rapidly developing rapidly, taking the projected capacitive screen as an example, the basic manufacturing process of the ITO layer as the conductive layer of the capacitive sensing has not changed much in recent years, and ITO is always inevitable. Coating, ITO patterning.
  • This traditional method of production inevitably requires an etching process, and a large amount of ITO and metal materials are wasted.
  • a method for manufacturing a touch screen comprising the steps of: providing a glass substrate; performing plasma bombardment treatment on a surface of the glass substrate to expose the surface to a Si-O-base; and performing plasma bombardment treatment on the glass substrate
  • the surface is coated with a gel and cured to form a matrix layer that is bonded to the Si-O-base of the surface of the glass substrate during curing; the substrate layer is embossed using an imprinting mold at the substrate layer Forming a trench away from a side of the glass substrate; and filling a metal into the trench to form a metal mesh as a conductive layer.
  • the surface of the glass substrate treated by plasma bombardment has a roughness of 5 to 10 nanometers.
  • a touch screen includes a glass substrate, a conductive layer and a substrate layer, and a surface of the glass substrate is formed by a plasma bombardment treatment to form a Si-O-based layer, and the substrate layer is disposed on the surface to form the Si-O a base layer, the matrix layer is formed by curing a gel, a side of the substrate layer facing away from the glass substrate is provided with a trench, the conductive layer is disposed in the trench, and the conductive layer is a metal wire a grid comprising a plurality of grid cells, the grid cells comprising a plurality of grid edges and nodes formed by adjacent two grid edges, the conductive layer comprising a sensing region and a sensing a lead area electrically connected to the area, the sensing area includes a plurality of first sensing patterns and a plurality of second sensing patterns, the first sensing patterns and the second sensing patterns are adjacent and insulated from each other, each of the first sensing patterns
  • the grid cells are electrically connected to each other, and the grid cells in
  • the surface of the glass substrate treated by plasma bombardment has a roughness of 5 to 10 nanometers.
  • the first sensing pattern includes a first main line extending in a second dimensional direction of the two-dimensional coordinate system and a plurality of first side branches extending laterally from the first main line
  • the first The second sensing pattern includes a second main line extending in a second dimension direction of the two-dimensional coordinate system and a plurality of second side branches extending laterally from the second main line, and the first and second ends of the second main lines are spaced apart from each other, the first The side branches and the second side branches are alternately arranged.
  • first side branch and the second side branch extend in a first dimensional direction of the two-dimensional coordinate system, the first main line being parallel to the second main line.
  • the conductive layer further includes a color line that forms a complementary pattern with the sensing region and the lead region, the color matching line being insulated from the sensing region and the lead region.
  • the color matching lines form a mesh, the mesh unit shape of the mesh formed by the color matching lines, and the mesh side length and the mesh in the first sensing pattern and the second sensing pattern.
  • the mesh cell shape and the mesh side length are the same.
  • the color line between the adjacent first sensing pattern and the second sensing pattern lacks a mesh edge that intersects the insulating track.
  • the color line between the adjacent first sensing pattern and the second sensing pattern is disconnected from the middle of the mesh side.
  • the color line between the adjacent first sensing pattern and the second sensing pattern is disconnected from the node of the mesh adjacent to the first sensing pattern and/or the second sensing pattern.
  • the lead region includes a plurality of lead clusters, the lead clusters are insulated from each other, and each of the lead clusters is formed by a single row of grid cells connected to each other, one end of each of the lead clusters and one The second sensing patterns are electrically connected.
  • each of the lead clusters and the second sensing pattern have two common nodes.
  • a portion of the lead bobbin includes a stem, and adjacent ones of the grid cells are connected by only one common node.
  • the partial lead cluster further includes a branch connected to the stem, and adjacent two grid cells in the branch are connected by a common mesh edge, the adjacent two nets
  • the grid cells include two common nodes, and the grid cells at one end of the branches and the grid cells at the end of the stem are connected by a common mesh edge.
  • the color lines between the stems of the adjacent two lead clusters are disconnected from the middle of the mesh side.
  • the length of the break is 2-20 microns.
  • the length of the break is 3-9 microns.
  • the stem is disconnected from a junction of a grid adjacent to an adjacent color line.
  • some of the two grid cells in the lead cluster are connected by a common mesh edge, and the two adjacent grid cells include two common nodes.
  • the grid cells of the grid are diamond shaped.
  • the sensing area includes a left sensing area and a right sensing area disposed separately from each other, and each of the left sensing area and the right sensing area includes a plurality of first sensing patterns and a plurality of second sensing patterns, the leads The area is located in the middle of the left sensing area and the right sensing area.
  • the groove is stamped and formed by a convex imprinting mold having a predetermined shape.
  • the groove has an aspect ratio greater than one.
  • the depth of the trench is not less than the thickness of the conductive layer.
  • the thickness of the substrate layer is less than the thickness of the glass substrate.
  • a protective layer is further included, the protective layer covering the substrate layer and the conductive layer.
  • the manufacturing method and the touch screen of the above touch screen are manufactured by using an imprint process.
  • the mesh shape can be formed in one step, the process is simple, and the yield is high.
  • the metal cost is greatly reduced by replacing the ITO with metal. Since the etching process is not required, the waste material of the conductive layer is not wasted, and the discharge of heavy metals in the waste liquid is reduced.
  • FIG. 1 is a schematic view of a touch screen in an embodiment
  • Figure 2 is a cross-sectional view of the touch screen shown in Figure 1;
  • FIG. 3A is a schematic structural view of a sensing area, and FIG. 3B is a partial schematic view of FIG. 3A;
  • FIG. 4A is a schematic view showing a structure of a lead region and a color matching line structure disposed between the lead portion and the sensing region
  • FIG. 4B is a schematic view showing the color matching line on the right side of the symmetry axis of FIG. 4A;
  • Figure 5 is a schematic view showing the connection of the lead cluster and the second sensing pattern in the structure of Figure 4B;
  • Figure 6A is a partial enlarged view of the area I in Figure 1, and Figure 6B is a schematic view of Figure 6A after removing the color line;
  • FIG. 7 is a schematic view of a color line insulation structure for realizing lead bush insulation in an embodiment
  • FIG. 8 is a schematic view of a color line insulation structure for realizing lead bush insulation in another embodiment
  • 9A-9D are schematic diagrams of a color line insulation structure for realizing insulation between the first sensing pattern and the second sensing pattern, respectively;
  • FIG. 10 is a schematic diagram of a method of manufacturing a touch screen in an embodiment
  • 11A to 11E are cross-sectional views of the touch screen during the manufacturing process.
  • FIG. 1 is a schematic view of a touch screen in an embodiment
  • FIG. 2 is a cross-sectional view of the touch screen including a glass substrate 10, a conductive layer 100, and a substrate layer 20.
  • the glass substrate 10 is a sodium silicate glass or aluminosilicate glass, and the glass substrate 10 includes a bonding surface 21 bonded to the substrate layer 20, and the bonding surface 21 is treated by plasma bombardment to expose the Si-O-based layer.
  • the bonding surface 21 has a roughness of 5-10 nm.
  • the substrate layer 20 is provided on the bonding surface 21, and the substrate layer 20 is formed by curing a jelly having a thickness smaller than the thickness of the glass substrate 10. Free radical and bonding surface 21 in the gel when solidified The Si-O-base is bonded so that the matrix layer 20 can be tightly bonded to the glass substrate 10.
  • the gel forming the matrix layer 20 is a solventless ultraviolet curable acrylic resin.
  • the gel forming the matrix layer 20 may also be other photo-curing adhesives, thermosetting adhesives, and self-drying adhesives.
  • the photo-curable glue is a mixture of pre-polymer, monomer, photoinitiator and auxiliary agent according to molar ratio: 30 ⁇ 50%, 40 ⁇ 60%, 1 ⁇ 6% and 0.2 ⁇ 1%.
  • the prepolymer is selected from at least one of epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate, and acrylic resin; the monomer is monofunctional (IBOA, IBOMA, HEMA, etc.), difunctional (TPGDA, HDDA, DEGDA, NPGDA, etc.), at least one of a trifunctional and polyfunctional (TMPTA, PETA, etc.); the photoinitiator is benzophenone, benzophenone or the like.
  • an auxiliary agent having a molar ratio of 0.2 to 1% may be added to the above mixture.
  • the auxiliary agent may be hydroquinone, p-methoxyphenol, p-benzoquinone, 2,6-di-tert-butylcresol or the like.
  • the substrate layer 20 is formed with a groove 23 formed by embossing a embossing die having a predetermined shape, and the metal wire is received in the groove 23.
  • the aspect ratio of the trench 23 is greater than 1, and the depth of the trench 23 is not less than the thickness of the conductive layer 100 in order to form the substrate layer 20 to protect the conductive layer 100.
  • the metal of the conductive layer 100 may be gold, silver, copper, aluminum, nickel, zinc, or an alloy of any two or more thereof.
  • the conductive layer 100 is a metal mesh composed of metal wires, and the mesh includes a plurality of mesh cells, and the mesh cells include a plurality of mesh edges and nodes formed by adjacent two mesh edges.
  • each grid unit of the metal mesh is a diamond shape, and other shapes of grid cells, such as a rectangle, a triangle, etc., may also be used in other embodiments.
  • the conductive layer 100 includes a sensing region 110 and a lead region 120 electrically connected to the sensing region.
  • the conductive layer 100 further includes a color matching line forming a complementary pattern with the sensing region 110 and the lead region 120, and the color matching line is insulated from the sensing region 110 and the lead region 120.
  • the color lines may also be omitted.
  • the shape and period of the mesh unit of the sensing region 110, the lead region 120, and the color matching line are the same, and may be different in other embodiments.
  • the color matching line may also be in a zigzag shape or a zigzag line shape.
  • the conductive layer 100 shown in FIG. 1 is an axisymmetric structure, and the conductive layer 100 is axisymmetric with respect to one of its perpendicular lines. In other embodiments, the conductive layer 100 may also adopt a structure other than axisymmetric.
  • the sensing area 110 includes at least one first sensing pattern 111 and at least one second sensing pattern 113.
  • the first sensing pattern 111 and the second sensing pattern 113 are adjacent to each other and insulated from each other, and each of the first sensing patterns
  • the grid cells in 111 are electrically connected to each other, and the grid cells in each of the second sensing patterns 113 are electrically connected to each other. Referring to FIG.
  • the sensing region 110 includes a left sensing region 112 and a right sensing region 114 which are disposed apart from each other. Since the conductive layer 100 is an axisymmetric structure in this embodiment, the left sensing region 112 and The right sensing region 114 is symmetric about an axis of symmetry, and each of the left sensing region 112 and the right sensing region 114 includes at least one first sensing pattern 111 and at least one second sensing pattern 113.
  • the first sensing pattern 111 includes a first main line 111a extending in a second dimension direction of the two-dimensional coordinate system and a plurality of first side branches 111b extending laterally from the first main line 111a.
  • the second sensing pattern 113 includes a second main line 113a extending in the second dimension direction of the two-dimensional coordinate system and a plurality of second side branches 113b extending laterally from the second main line 113a, and the ends of the respective second main lines 113a are spaced apart from each other.
  • the first side branch 111b and the second side branch 113b are located between the corresponding first main line 111a and the second main line 113a, and the first side branch 111b and the second side branch 113b are alternately arranged, so that the second sensing pattern 113 and the first sensing pattern 111 are arranged.
  • the first side branch 111b and the second side branch 113b extend in the first dimension direction of the two-dimensional coordinate system and are parallel to each other, and the first main line 111a and the second main line 113a are also parallel to each other.
  • the two-dimensional coordinate system is an XOY rectangular coordinate system
  • the first dimension direction is the X-axis direction
  • the second dimension direction is the Y-axis direction.
  • the two-dimensional coordinate system can also be other coordinate systems, such as a two-dimensional oblique coordinate system.
  • the lead region 120 is disposed in the middle of the left sensing region 112 and the right sensing region 114.
  • 4A shows the structure of the lead region 120 and the color lines disposed between the lead region 120 and the sensing region 110.
  • the color line on the right side of the symmetry axis 31 is deleted in FIG. 4B, and the color line on the left side of the symmetry axis 31 is retained.
  • the lead region 120 includes a number of lead clusters equal to the number of the second sensing patterns 113, and each of the lead clusters is connected to a second sensing pattern 113, and each of the lead clusters is insulated from each other.
  • each lead cluster is distributed laterally of the second sensing pattern 113, one end of each lead cluster is electrically connected to the second sensing pattern 113, and the other end extends to an inner edge of the substrate layer 20.
  • each lead cluster is formed by a single row of grid cells connected to each other, and the position of the lead cluster is used as a touch-sensing blind zone on the touch screen.
  • the single-row lead structure minimizes the area of the sensing dead zone and improves the touch sensitivity of the touch screen. .
  • each lead cluster and the second sensing pattern 113 have two common nodes 1132.
  • each lead cluster includes a branch portion 122, and the second sensing pattern 113 is connected through the branch portion 122.
  • Two adjacent grid cells in each branch 122 are connected by a common mesh edge 1222, and two common grid nodes include two common nodes.
  • the lead cluster further includes a stem portion 124 connected to the branch portion 122. The stem portions 124 of the respective lead tufts are parallel to each other, and the branch portion 122 is led to the edge of the conductive layer 100 through the stem portion 124, and then connected through the wire.
  • the PCB board transmits signals generated by the sensing area 110 due to capacitance changes to the PCB board.
  • the adjacent two grid cells in each stem 124 are connected by only one common node.
  • the grid unit at the end of the cadre 124 and the grid unit at the end of the branch 122 are connected by a common mesh edge, and the common grid edge is framed by a dotted circle in Fig. 6B.
  • the function of the stem portion 124 is mainly to lead the branch to the lower edge of the conductive layer 100
  • the second sensing pattern 113 located close to the lower edge of the conductive layer 100 can be directly led to the edge of the conductive layer 100 through the branch portion 122, that is, The corresponding lead cluster does not include the trunk 124.
  • the adjacent two grid cells in the lead cluster are connected by a common mesh edge, and the two adjacent grid cells include two common nodes.
  • the two diagonal lines of the diamond-shaped grid unit extend along the X coordinate axis direction and the Y coordinate axis direction of the plane rectangular coordinate system, that is, the stem portion 124 extends in the Y coordinate axis direction.
  • the lead region 120 is also an axisymmetric structure.
  • the lead cluster on the left side of the symmetry axis is connected to the left sensing region 112, and the lead cluster on the right side of the symmetry axis is connected to the right sensing region 114.
  • the conductive layer 100 further includes a color matching line.
  • insulation is required between each of the first sensing patterns 111 and the second sensing patterns 113 and between the respective lead clusters. Therefore, the present invention achieves an insulating effect by breaking the color matching lines.
  • the present invention provides various disconnecting modes.
  • the color line insulating structure for realizing lead bushing insulation is first illustrated by the following diagram:
  • the grid line side corresponding to the missing color line intersecting the first line 131 is a virtual line extending in a direction parallel to the extending direction of the stem portion 124, that is, the Y coordinate axis. direction.
  • the disconnection structure is equivalent to missing a few mesh edges on the basis of the original mesh, and the mesh period is unchanged. Therefore, the touch screen does not exhibit a large chromatic aberration when displayed.
  • the color lines between the stem portions 124 of the adjacent two lead clusters are disconnected from the middle of the mesh side. As shown in Fig. 7, a fracture 121 is formed at the break, the length of the break is 2-20 microns, and the preferred break length is 3-9 microns. In a preferred embodiment, the length of the break is 6 Micron. If the interval between the stem portions 124 of the adjacent two lead tufts is wide and there are multiple color matching lines, it is theoretically unnecessary to disconnect each mesh side of the color matching line, for example, only one column of color matching may be disconnected. The line, that is, the color line intersecting the first straight line 131 is broken.
  • each cluster stem 124 can be insulated only by disconnecting the color line adjacent to the left or the right at the junction of the grid, but the insulation effect can be ensured in the case of adhesion during the manufacturing process. It is also possible to disconnect the left and right nodes of the trunk 124.
  • the two modes (2) and (3) are combined, that is, the stem portion 124 is disconnected from the node 123 of the mesh adjacent to the adjacent color matching line, and the broken mesh knot is broken.
  • the mesh edge between the points 123 is broken from the middle to form a fracture 121.
  • FIG. 9A is a schematic view showing the insulation structure of the color line disconnection in an embodiment, and the position on the conductive layer 100 corresponds to the area II in FIG.
  • the insulating track 11 is a line (which may be a broken line or a curve) located between the adjacent first sensing pattern 111 and the second sensing pattern 113.
  • the insulating track 11 is also shown in FIG. 3B.
  • the insulating track 11 is a broken line including a portion extending in the X-axis direction and a portion extending in the Y-axis direction.
  • the color line between the first sensing pattern 111 and the second sensing pattern 113 is a single row/single column structure, so the first sensing pattern 111 and the second sensing pattern in this embodiment. All the color lines between 113 are missing.
  • the insulating structure (4) is equivalent to missing a few mesh edges on the basis of the original mesh, and the mesh period is unchanged. Therefore, the touch screen does not exhibit a large chromatic aberration when displayed.
  • the color line between the adjacent first sensing patterns 111 and the second sensing patterns 113 is disconnected from the middle of the mesh side.
  • the break 13 is formed at the break, the length of the break is 2-20 microns, and the preferred break length is 3-9 microns. In a preferred embodiment, the length of the break is 6 Micron. If there is a multi-column/multi-line color matching line between the adjacent first sensing patterns 111 and the second sensing patterns 113, it is theoretically unnecessary to disconnect each mesh side of the color matching line. For example, it is possible to disconnect only one column/line of color lines, that is, to break the color line intersecting the insulating track 11.
  • the color line between the adjacent first sensing pattern 111 and the second sensing pattern 113 is disconnected from the node of the mesh adjacent to the first sensing pattern 111 and the second sensing pattern 113. Referring to Figure 9C, it is broken at the grid node 15. It can be understood that the color matching line between the adjacent first sensing pattern 111 and the second sensing pattern 113 only needs to be disconnected from the node of the grid adjacent to the first sensing pattern 111, or from the second sensing pattern. Insulation can be achieved when the node of the adjacent grid is disconnected, but in order to ensure the insulation effect in the case of adhesion during the manufacturing process, the color matching line and the first sensing pattern 111 and the second sensing pattern can also be used. 113 adjacent nodes are disconnected.
  • the two modes (5) and (6) are combined.
  • FIG. 9D The color matching line between the adjacent first sensing pattern 111 and the second sensing pattern 113 is the same.
  • the node 15 of the mesh adjacent to the sensing pattern 111 and the second sensing pattern 113 is broken, and the mesh edge between the broken mesh nodes 15 is broken from the middle to form the fracture 13.
  • the conductive layer is made of a metal mesh structure and can be manufactured by an imprint process. Compared with the conventional ITO film as a conductive layer, the mesh shape can be formed in one step, the process is simple, and the yield is high. Moreover, the metal cost is greatly reduced by replacing the ITO with metal. Since the etching process is not required, the waste material of the conductive layer is not wasted, and the discharge of heavy metals in the waste liquid is reduced.
  • the touch screen further includes a protective layer 30 covering the substrate layer 20 and the conductive layer 100 for protecting the substrate layer 20 and the conductive layer 100 .
  • the invention also provides a method for manufacturing a touch screen, as shown in FIG. 10, comprising the following steps:
  • a glass substrate 10 as shown in FIG. 11A is provided, and the glass substrate 10 is sodium silicate glass or aluminosilicate glass.
  • the surface of the glass substrate 10 is bombarded with a plasma 63 to form a bonding surface 21. It can be treated with a plasma cleaner with a preferred roughness of 5 to 10 nm.
  • the effect of plasma bombardment treatment is mainly on the cleaning of the glass surface and the Si-O-bonding of the glass surface (Si-O- Si ⁇ Si-O-). Since the glass is a polar material and the substrate layer 20 is a non-polar material, if it is not treated, the adhesion between the glass substrate 10 and the substrate layer 20 is limited, and the glue is applied at the time of subsequent demolding. After the treatment, the Si-O- exposed on the bonding surface 21 The bond facilitates bonding with the subsequent substrate layer 20, increasing the adhesion of the substrate layer 20 to the glass substrate 10.
  • the surface of the glass substrate subjected to the plasma bombardment treatment is coated with a gel and solidified to form a matrix layer.
  • the substrate layer 20 is used as an embossing adhesive, and the material thereof may be polymethyl methacrylate (PMMA) or photo-curing adhesive.
  • the substrate layer 20 is a solvent-free UV-curable acrylic resin.
  • the gel forming the matrix layer 20 may also be other photo-curing adhesives, thermosetting adhesives, and self-drying adhesives.
  • the photo-curable glue is a mixture of pre-polymer, monomer, photoinitiator and auxiliary agent according to molar ratio: 30 ⁇ 50%, 40 ⁇ 60%, 1 ⁇ 6% and 0.2 ⁇ 1%.
  • the prepolymer is selected from at least one of epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate, and acrylic resin; the monomer is monofunctional (IBOA, IBOMA, HEMA, etc.), difunctional (TPGDA, HDDA, DEGDA, NPGDA, etc.), at least one of a trifunctional and polyfunctional (TMPTA, PETA, etc.); the photoinitiator is benzophenone, benzophenone or the like.
  • an auxiliary agent having a molar ratio of 0.2 to 1% may be added to the above mixture.
  • the auxiliary agent may be hydroquinone, p-methoxyphenol, p-benzoquinone, 2,6-di-tert-butylcresol or the like.
  • the substrate layer is imprinted using an imprint mold 61, and a groove is formed on a side of the substrate layer facing away from the glass substrate.
  • the substrate layer 20 is formed as a embossing paste which is embossed by a convex mold having a predetermined shape to form a groove 23.
  • the groove 23 has a depth of 3 ⁇ m and a width of 2.2 ⁇ m. In other embodiments, the dimensions of the grooves can be modified as needed.
  • the conductive layer 100 may adopt the conductive layer structure of the touch panel described above, and the metal of the conductive layer 100 may be gold, silver, copper, aluminum, nickel, zinc or an alloy of any two or more.
  • the nano silver ink may be filled in the trench 23 by a doctor blade technique, and then sintered at 150 ° C to sinter the silver element in the nano silver ink into conductive thin wires.
  • the silver ink has a solid content of 35%, and the solvent volatilizes during sintering.

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Abstract

本发明涉及一种触摸屏的制造方法，包括下列步骤：提供玻璃基板；对玻璃基板的一表面进行等离子体轰击处理，使表面露出Si-O-基；在玻璃基板进行了等离子轰击处理的表面涂覆胶状物并固化，形成基质层，胶状物固化过程中与玻璃基板表面的Si-O-基结合；使用压印模具压印所述基质层，在基质层背离玻璃基板的一面形成沟槽；将金属填充于沟槽内，形成金属网格作为导电层。本发明还涉及一种触摸屏。本发明的触摸屏采用压印工艺进行制造，相较于传统的ITO膜作为导电层的工艺，网格形状可一步成形，工艺简单，良率高。并且以金属代替ITO，材料成本大大降低，由于不需要用到刻蚀工艺，不会造成导电层材料的浪费，并减少了废液中重金属的排放。

Description

触摸屏及其制造方法
【技术领域】
本发明涉及触摸屏，还涉及一种触摸屏的制造方法。
【背景技术】
触摸屏是可接收触摸等输入信号的感应式装置。触摸屏赋予了信息交互崭新的面貌，是极富吸引力的全新信息交互设备。触摸屏技术的发展引起了国内外信息传媒界的普遍关注，已成为光电行业异军突起的朝阳高新技术产业。
目前，ITO（氧化铟锡）层是触摸屏模组中至关重要的组成部分。虽然触摸屏的制造技术一日千里地飞速发展着，但是以投射式电容屏为例，作为电容感应的导电层的ITO层的基础制造流程近年来并未发生太大的改变，总是不可避免的需要ITO镀膜、ITO图形化。
这种传统的制作方式不可避免的需要用到刻蚀工艺，大量的ITO及金属材料会被浪费。
【发明内容】
基于此，有必要提供一种能够节省导电层材料的触摸屏的制造方法。
一种触摸屏的制造方法，包括下列步骤：提供玻璃基板；对所述玻璃基板的一表面进行等离子体轰击处理，使所述表面露出Si-O-基；在所述玻璃基板进行了等离子轰击处理的表面涂覆胶状物并固化，形成基质层，所述胶状物固化过程中与玻璃基板表面的Si-O-基结合；使用压印模具压印所述基质层，在所述基质层背离所述玻璃基板的一面形成沟槽；及将金属填充于所述沟槽内，形成金属网格作为导电层。
在其中一个实施例中，所述玻璃基板经等离子体轰击处理的表面具有5至10纳米的粗糙度。
一种触摸屏，包括玻璃基板、导电层及基质层，所述玻璃基板的一表面经等离子体轰击处理形成有Si-O-基，所述基质层设于所述表面从而与所述Si-O-基结合，所述基质层由胶状物固化形成，所述基质层背离所述玻璃基板的一面开设有沟槽，所述导电层设于所述沟槽内，所述导电层为金属线构成的网格，所述网格包括若干网格单元，所述网格单元包括若干条网格边及相邻两网格边相接形成的结点，所述导电层包括感应区和与感应区电连接的引线区，所述感应区包括若干第一感应图案和若干第二感应图案，所述第一感应图案和第二感应图案相邻且相互绝缘，每个所述第一感应图案内的网格单元相互电连接，每个所述第二感应图案内的网格单元相互电连接。
在其中一个实施例中，所述玻璃基板经等离子体轰击处理的表面具有5至10纳米的粗糙度。
在其中一个实施例中，所述第一感应图案包括沿二维坐标系的第二维方向延伸的一第一主线及自所述第一主线向侧向延伸的若干第一侧枝，所述第二感应图案包括沿二维坐标系的第二维方向延伸的一第二主线及自所述第二主线向侧向延伸的若干第二侧枝，各个第二主线的首尾相互间隔，所述第一侧枝与第二侧枝间隔交替排列。
在其中一个实施例中，所述第一侧枝和第二侧枝沿所述二维坐标系的第一维方向延伸，所述第一主线与第二主线平行。
在其中一个实施例中，所述导电层还包括与所述感应区和引线区形成互补图形的配色线，所述配色线与所述感应区和引线区绝缘。
在其中一个实施例中，所述配色线形成网格，所述配色线形成的网格的网格单元形状及网格边长与所述第一感应图案及第二感应图案中的网格的网格单元形状及网格边长相同。
在其中一个实施例中，相邻的所述第一感应图案和第二感应图案之间的配色线缺失与绝缘轨迹相交的网格边。
在其中一个实施例中，相邻的所述第一感应图案和第二感应图案之间的配色线从网格边的中部断开。
在其中一个实施例中，相邻的所述第一感应图案和第二感应图案之间的配色线自与第一感应图案和/或第二感应图案邻接处的网格的结点断开。
在其中一个实施例中，所述引线区包括若干引线簇，所述引线簇之间相互绝缘，每一所述引线簇由单列网格单元相互连接形成，每一所述引线簇的一端与一所述第二感应图案电连接。
在其中一个实施例中，每一所述引线簇与所述第二感应图案具有两个公共结点。
在其中一个实施例中，部分引线簇包括干部，所述干部中相邻两个网格单元之间仅通过一个公共结点连接。
在其中一个实施例中，所述部分引线簇进一步包括与干部连接的枝部，所述枝部中相邻两个网格单元之间通过一公共网格边连接，所述相邻两个网格单元之间包括两个公共结点，所述枝部一末端的网格单元与所述干部一末端的网格单元通过公共网格边连接。
在其中一个实施例中，相邻的两引线簇的干部之间的配色线从网格边的中部断开。
在其中一个实施例中，所述断开的长度为2-20微米。
在其中一个实施例中，所述断开的长度为3-9微米。
在其中一个实施例中，所述干部自与相邻的配色线邻接处的网格的结点断开。
在其中一个实施例中，部分所述引线簇中的相邻两个网格单元之间通过一公共网格边连接，所述相邻两个网格单元之间包括两个公共结点。
在其中一个实施例中，所述网格的网格单元为菱形。
在其中一个实施例中，所述感应区包括相互分离设置的左感应区和右感应区，每个左感应区和右感应区均包括若干第一感应图案和若干第二感应图案，所述引线区设于左感应区和右感应区的中间。
在其中一个实施例中，所述沟槽为具有预设形状的凸起的压印模具压印形成。
在其中一个实施例中，所述沟槽的深宽比大于1。
在其中一个实施例中，所述沟槽的深度不小于所述导电层的厚度。
在其中一个实施例中，所述基质层的厚度小于所述玻璃基板的厚度。
在其中一个实施例中，还包括保护层，所述保护层覆盖所述基质层及导电层。
上述触摸屏的制造方法及触摸屏，采用压印工艺进行制造，相较于传统的ITO膜作为导电层的工艺，网格形状可以一步成形，工艺简单，良率高。并且以金属代替ITO，材料成本大大降低，由于不需要用到刻蚀工艺，不会造成导电层材料的浪费，并减少了废液中重金属的排放。
【附图说明】
图1是一实施例中触摸屏的示意图；
图2是图1所示的触摸屏的剖视图；
图3A是感应区的结构示意图，图3B是图3A的局部示意图；
图4A是引线区结构及设于引线区和感应区中间的配色线结构的示意图，图4B是图4A删除对称轴右边的配色线后的示意图；
图5是图4B中的结构中引线簇与第二感应图案连接的示意图；
图6A是图1中区域I的局部放大图，图6B是图6A去除配色线后的示意图；
图7是一实施例中实现引线簇绝缘的配色线绝缘结构的示意图；
图8是另一实施例中实现引线簇绝缘的配色线绝缘结构的示意图；
图9A~9D分别是实现第一感应图案和第二感应图案间绝缘的配色线绝缘结构的示意图；
图10是一实施例中触摸屏的制造方法的示意图；
图11A~11E是触摸屏在制造过程中的剖视图。
【具体实施方式】
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的首选实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容更加透彻全面。
需要说明的是，当元件被称为“固设于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“上”、“下”、“左”、“右”、“横”、“竖”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及／或”包括一个或多个相关的所列项目的任意的和所有的组合。
图1是一实施例中触摸屏的示意图，图2是触摸屏的剖视图，触摸屏包括玻璃基板10、导电层100及基质层20。
玻璃基板10为硅酸钙钠玻璃或硅铝酸盐玻璃，玻璃基板10包括一与基质层20结合的结合面21，该结合面21经等离子体轰击处理，使之露出Si-O-基，该结合面21的粗糙度为5-10纳米。
基质层20设于结合面21，基质层20由胶状物固化形成，其厚度小于玻璃基板10的厚度。固化时，该胶状物中的自由基与结合面21 Si-O-基结合，以使基质层20与玻璃基板10能紧密结合。
在本实施例中，形成基质层20的胶状物为无溶剂紫外固化亚克力树脂。在其他实施例中，形成基质层20的胶状物还可以为其他光固胶、热固胶及自干胶。其中光固胶为预聚物、单体、光引发剂及助剂按照摩尔配比：30~50%、40~60%、1~6%及0.2~1%组成的混合物。其中，预聚物选为环氧丙烯酸酯、聚氨酯丙烯酸酯、聚醚丙烯酸酯、聚酯丙烯酸酯、丙烯酸树脂中的至少一种；单体为单官能（IBOA、IBOMA、HEMA等）、二官能（TPGDA、HDDA、DEGDA、NPGDA等）、三官能及多官能（TMPTA、PETA等）中的至少一种；光引发剂为二苯甲酮、二苯乙酮等。进一步的，在上述混合物中还可添加摩尔配比为0.2~1%的助剂。助剂可为对苯二酚、对甲氧基苯酚、对苯醌、2，6一二叔丁基甲苯酚等。
请参图11D，基质层20上形成有沟槽23，沟槽23为具有预设形状的凸起的压印模压印形成，金属线收容于沟槽23中。沟槽23的深宽比大于1，沟槽23的深度不小于导电层100的厚度，以便于基质层20形成对导电层100的保护。
导电层100的金属可以是金、银、铜、铝、镍、锌或其中任意两者或两者以上的合金。
导电层100为金属线构成的金属网格，网格包括若干网格单元，网格单元包括若干条网格边及由相邻两网格边相接形成的结点。在本实施例中，金属网格的每个网格单元为菱形，在其它实施例中也可以采用其它形状的网格单元，例如长方形、三角形等。
导电层100包括感应区110和与感应区电连接的引线区120。
在本实施例中，为了减小色差，获得更好的显示效果，导电层100还包括与感应区110和引线区120形成互补图形的配色线，配色线与感应区110和引线区120均绝缘，在其它实施例中也可以将配色线省略。在本实施例中，感应区110、引线区120及配色线的网格单元形状和周期均相同，在其它实施例中也可以不相同，例如配色线也可以为锯齿状或折线状。
图1所示的导电层100为轴对称结构，导电层100关于其一条中垂线轴对称，在其它实施例中，导电层100也可以采用轴对称以外的结构。请一并参见图3B，感应区110包括至少一个第一感应图案111和至少一个第二感应图案113，第一感应图案111和第二感应图案113相邻且相互绝缘，每个第一感应图案111内的网格单元相互电连接，每个第二感应图案113内的网格单元相互电连接。请一并参见图3A，在本实施例中，感应区110包括相互分离设置的左感应区112和右感应区114，由于本实施例中导电层100为轴对称结构，所以左感应区112和右感应区114关于对称轴对称，每个左感应区112和右感应区114均包括至少一个第一感应图案111和至少一个第二感应图案113。
请参见图3B，第一感应图案111包括沿二维坐标系的第二维方向延伸的一第一主线111a及自第一主线111a向侧向延伸的若干第一侧枝111b。第二感应图案113包括沿二维坐标系的第二维方向延伸的一第二主线113a及自第二主线113a向侧向延伸的若干第二侧枝113b，各个第二主线113a的首尾相互间隔。第一侧枝111b与第二侧枝113b位于对应的第一主线111a与第二主线113a之间，且第一侧枝111b与第二侧枝113b间隔交替排列，使得第二感应图案113与第一感应图案111形成互感。第一侧枝111b和第二侧枝113b沿二维坐标系的第一维方向延伸且相互平行，第一主线111a和第二主线113a亦相互平行。
具体在图示的实施例中，二维坐标系为XOY直角坐标系，第一维方向为X轴方向，第二维方向为Y轴方向。在其它实施例中二维坐标系也可以为其它坐标系，例如二维斜角坐标系。
引线区120设于左感应区112和右感应区114的中间。图4A示出了引线区120，及设于引线区120和感应区110中间的配色线的结构。为了便于区分引线区120及其旁边的配色线，图4B中将对称轴31右边的配色线删除，对称轴31左边的配色线予以保留。
引线区120包括与第二感应图案113的数量相等的引线簇，每一引线簇对应连接一第二感应图案113，每一引线簇之间相互绝缘。
引线簇分布于第二感应图案113的侧向，每一引线簇的一端与第二感应图案113电连接，另一端延伸至基质层20的一内侧边缘。在本实施例中，每一引线簇由单列网格单元相互连接形成，引线簇所在位置作为触摸屏上的触摸感应盲区，这种单列的引线结构尽量减小感应盲区的面积，提高触摸屏的触摸灵敏度。请参照图5，每一引线簇与第二感应图案113具有两个公共结点1132。
图6A是图1中区域I的局部放大图，图6B是将图6A中的配色线删除后形成的示意图。请一并参照图6A、图6B，每一引线簇均包括枝部122，并通过枝部122连接第二感应图案113。每一枝部122内相邻两个网格单元之间通过一公共网格边1222连接，且相邻两个网格单元之间包括两个公共结点。在本实施例中，引线簇还包括与枝部122连接的干部124，各个引线簇的干部124之间相互平行，通过干部124将枝部122引至导电层100的边缘，再通过导线接入PCB板，从而将感应区110因电容变化产生的信号传输至PCB板。每一干部124内相邻两个网格单元之间仅通过一个公共结点连接。干部124一末端的网格单元与枝部122一末端的网格单元通过公共网格边连接，图6B中用一虚线圆框框出了该公共网格边。
因为干部124的作用主要是将枝部引至导电层100的下方边缘，因此对于位置靠近导电层100下方边缘的第二感应图案113，可以直接通过枝部122引至导电层100的边缘，即对应的引线簇不包括干部124，引线簇内相邻两个网格单元之间通过一公共网格边连接，且相邻两个网格单元之间包括两个公共结点。
呈菱形的网格单元的两条对角线分别沿平面直角坐标系的X坐标轴方向和Y坐标轴方向延伸，也就是干部124沿Y坐标轴方向延伸。参见附图，引线区120亦为轴对称结构，对称轴左边的引线簇连接左感应区112，对称轴右边的引线簇连接右感应区114。
如前述，导电层100还包括配色线。根据触摸屏的工作原理，各个第一感应图案111和第二感应图案113之间、各个引线簇之间均要实现绝缘，因此本发明通过将配色线断开以实现绝缘效果。
具体的，本发明提供多种断开方式，以下通过图示首先说明实现引线簇绝缘的配色线绝缘结构：
（1）将相邻的两引线簇的干部124之间的配色线中的一列去除。参见图6B，相当于配色线缺失与第一直线131相交的网格边，该第一直线131是一条虚拟的直线，其延伸方向平行于干部124的延伸方向，也就是Y坐标轴的方向。该断开结构相当于在原有网格的基础上缺失若干网格边，网格周期不变，因此，触摸屏在显示时不会出现较大色差。
（2）相邻的两引线簇的干部124之间的配色线从网格边的中部断开。如图7所示，断开处形成断口121，断开的长度为2-20微米，较佳的断开长度为3-9微米，在一较佳的实施例中，断开的长度为6微米。如果相邻的两引线簇的干部124之间的间隔较宽，存在多列的配色线，则理论上不需要将配色线的每一条网格边均断开，例如可以只断开一列的配色线，即断开与第一直线131相交的配色线。考虑到在制造过程中可能会出现原本设计断开的地方没有做好而粘连的情况，可以在设计时将更多的配色线断开，例如相邻的两引线簇的干部124之间的配色线每一条网格边都自中部断开，以保证绝缘效果。
（3）干部124自与相邻的配色线邻接处的网格的结点断开。参见图8，在网格结点123处断开。可以理解的，每一簇干部124只需与左边或右边相邻的配色线在网格的结点处断开即可实现绝缘，但为了在制造过程中出现粘连的情况下还能保证绝缘效果，也可以将干部124左、右的结点均断开。
图6A所示实施例中，是将（2）、（3）两种方式结合，即干部124自与相邻的配色线邻接处的网格的结点123断开，断开的网格结点123之间的网格边从中部断开形成断口121。
上述绝缘结构（2）、（3）和图6A所示实施例的绝缘结构，由于断开部分的大小相对于网格边可忽略，故可进一步减小色差。
接下来介绍实现第一感应图案111和第二感应图案113间绝缘的配色线绝缘结构：
（4）相邻的第一感应图案111和第二感应图案113之间的配色线缺失与绝缘轨迹相交的网格边。请参见图9A，图9A是一实施例中配色线断开实现绝缘结构的示意图，其在导电层100上的位置对应于图1中的区域II。绝缘轨迹11是位于相邻的第一感应图案111和第二感应图案113之间空隙的一条线（可以是折线或曲线），为了便于理解，图3B中也示出了绝缘轨迹11。在该实施例中绝缘轨迹11是折线，包括沿X轴方向延伸的部分和沿Y轴方向延伸的部分。由于在图9A所示的实施例中，第一感应图案111和第二感应图案113之间的配色线是单排/单列的结构，因此该实施例中第一感应图案111和第二感应图案113之间的配色线全部缺失。绝缘结构（4）相当于在原有网格的基础上缺失若干网格边，网格周期不变，因此，触摸屏在显示时不会出现较大色差。
（5）相邻的第一感应图案111和第二感应图案113之间的配色线从网格边的中部断开。如图9B所示，断开处形成断口13，断开的长度为2-20微米，较佳的断开长度为3-9微米，在一较佳的实施例中，断开的长度为6微米。如果相邻的第一感应图案111和第二感应图案113之间的间隔较宽，存在多列/多行的配色线，则理论上不需要将配色线的每一条网格边均断开，例如可以只断开一列/一行的配色线，即断开与绝缘轨迹11相交的配色线。考虑到在制造过程中可能会出现原本设计断开的地方没有做好而粘连的情况，可以在设计时将更多的配色线断开，例如相邻的第一感应图案111和第二感应图案113之间的配色线每一条网格边都自中部断开，以保证绝缘效果。
（6）相邻的第一感应图案111和第二感应图案113之间的配色线自与第一感应图案111和第二感应图案113邻接处的网格的结点断开。参见图9C，在网格结点15处断开。可以理解的，相邻的第一感应图案111和第二感应图案113之间的配色线只需自与第一感应图案111邻接的网格的结点处断开，或自与第二感应图案113邻接的网格的结点处断开，即可实现绝缘，但为了在制造过程中出现粘连的情况下还能保证绝缘效果，也可以将配色线与第一感应图案111和第二感应图案113邻接的结点均断开。
图1所示实施例中，是将（5）、（6）两种方式结合，具体请参图9D，相邻的第一感应图案111和第二感应图案113之间的配色线自与第一感应图案111和第二感应图案113邻接处的网格的结点15断开，断开的网格结点15之间的网格边从中部断开形成断口13。
上述绝缘结构（5）、（6）和图9D所示实施例的绝缘结构，由于断开部分的大小相对于网格边可忽略，故可进一步减小色差。
上述导电层采用金属网格结构，可以采用压印工艺进行制造，相较于传统的ITO膜作为导电层的工艺，网格形状可以一步成形，工艺简单，良率高。并且以金属代替ITO，材料成本大大降低，由于不需要用到刻蚀工艺，不会造成导电层材料的浪费，并减少了废液中重金属的排放。
请参照图2，触摸屏还包括保护层30，保护层30覆盖基质层20及导电层100，用于对基质层20及导电层100进行保护。
本发明还提供一种触摸屏的制造方法，如图10所示，包括下列步骤：
S110，提供玻璃基板。
提供如图11A所示的玻璃基板10，玻璃基板10为硅酸钙钠玻璃或硅铝酸盐玻璃。
S120，对玻璃基板的一表面进行等离子体轰击处理，使该表面露出Si-O-基。
请参见图11B，在该实施例中，是采用等离子体63轰击玻璃基板10的表面，形成结合面21。可以采用等离子清洗机进行处理，优选的粗糙度为5~10纳米。等离子体轰击处理的作用主要是对玻璃表面的清洁及使玻璃表面打出Si-O-键（Si-O- Si→ Si-O-）。因为玻璃为极性材料，而基质层20为非极性材料，如果不做处理，则玻璃基板10与基质层20之间的粘合力有限，在后续脱模的时候会起胶。而经过处理后，结合面21露出的Si-O- 键有利于与后面的基质层20键合，增加基质层20与玻璃基板10的粘合力。
S130，在玻璃基板进行了等离子轰击处理的表面涂覆胶状物并固化，形成基质层。
请参见图11C，基质层20作为压印胶，其材质可以为聚甲基丙烯酸甲酯（PMMA）或光固胶。在本实施例中，基质层20为无溶剂紫外固化亚克力树脂。在其他实施例中，形成基质层20的胶状物还可以为其他光固胶、热固胶及自干胶。其中光固胶为预聚物、单体、光引发剂及助剂按照摩尔配比：30~50%、40~60%、1~6%及0.2~1%组成的混合物。其中，预聚物选为环氧丙烯酸酯、聚氨酯丙烯酸酯、聚醚丙烯酸酯、聚酯丙烯酸酯、丙烯酸树脂中的至少一种；单体为单官能（IBOA、IBOMA、HEMA等）、二官能（TPGDA、HDDA、DEGDA、NPGDA等）、三官能及多官能（TMPTA、PETA等）中的至少一种；光引发剂为二苯甲酮、二苯乙酮等。进一步的，在上述混合物中还可添加摩尔配比为0.2~1%的助剂。助剂可为对苯二酚、对甲氧基苯酚、对苯醌、2，6一二叔丁基甲苯酚等。
S140，使用压印模具61压印基质层，在基质层背离玻璃基板的一面形成沟槽。
请参看图11D，基质层20作为压印胶被具有预设形状的凸起的模具压印后，形成沟槽23。在本实施例中，沟槽23的深度为3微米，宽度为2.2微米。在其它实施例中，沟槽的尺寸可根据实际需要进行更改。
S150，将金属填充于沟槽内，形成金属网格作为导电层。
请参见图11E，导电层100可以采用前述的触摸屏的导电层结构，导电层100的金属可以是金、银、铜、铝、镍、锌或其中任意两者或两者以上的合金。可以使用刮涂技术在沟槽23中填充纳米银墨水，再在150℃条件下烧结，使纳米银墨水中的银单质烧结成导电细线。其中，银墨水固含量35%，溶剂在烧结中挥发。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (27)

  1. 一种触摸屏，包括玻璃基板和导电层，其特征在于，还包括基质层，所述玻璃基板的一表面经等离子体轰击处理形成有Si-O-基，所述基质层设于所述表面从而与所述Si-O-基结合，所述基质层由胶状物固化形成，所述基质层背离所述玻璃基板的一面开设有沟槽，所述导电层设于所述沟槽内，所述导电层为金属线构成的网格，所述网格包括若干网格单元，所述网格单元包括若干条网格边及相邻两网格边相接形成的结点，所述导电层包括感应区和与感应区电连接的引线区，所述感应区包括若干第一感应图案和若干第二感应图案，所述第一感应图案和第二感应图案相邻且相互绝缘，每个所述第一感应图案内的网格单元相互电连接，每个所述第二感应图案内的网格单元相互电连接。
  2. 根据权利要求1所述的触摸屏，其特征在于，所述玻璃基板经等离子体轰击处理的表面具有5至10纳米的粗糙度。
  3. 根据权利要求1所述的触摸屏，其特征在于，所述第一感应图案包括沿二维坐标系的第二维方向延伸的一第一主线及自所述第一主线向侧向延伸的若干第一侧枝，所述第二感应图案包括沿二维坐标系的第二维方向延伸的一第二主线及自所述第二主线向侧向延伸的若干第二侧枝，各个第二主线的首尾相互间隔，所述第一侧枝与第二侧枝间隔交替排列。
  4. 根据权利要求1所述的触摸屏，其特征在于，所述第一侧枝和第二侧枝沿所述二维坐标系的第一维方向延伸，所述第一主线与第二主线平行。
  5. 根据权利要求1所述的触摸屏，其特征在于，所述导电层还包括与所述感应区和引线区形成互补图形的配色线，所述配色线与所述感应区和引线区绝缘。
  6. 根据权利要求5所述的触摸屏的导电层，其特征在于，所述配色线形成网格，所述配色线形成的网格的网格单元形状及网格边长与所述第一感应图案及第二感应图案中的网格的网格单元形状及网格边长相同。
  7. 根据权利要求5所述的触摸屏，其特征在于，相邻的所述第一感应图案和第二感应图案之间的配色线缺失与绝缘轨迹相交的网格边。
  8. 根据权利要求5所述的触摸屏，其特征在于，相邻的所述第一感应图案和第二感应图案之间的配色线从网格边的中部断开。
  9. 根据权利要求5所述的触摸屏，其特征在于，相邻的所述第一感应图案和第二感应图案之间的配色线自与第一感应图案和/或第二感应图案邻接处的网格的结点断开。
  10. 根据权利要求5所述的触摸屏，其特征在于，所述引线区包括若干引线簇，所述引线簇之间相互绝缘，每一所述引线簇由单列网格单元相互连接形成，每一所述引线簇的一端与一所述第二感应图案电连接。
  11. 根据权利要求10所述的触摸屏，其特征在于，每一所述引线簇与所述第二感应图案具有两个公共结点。
  12. 根据权利要求10所述的触摸屏的导电层，其特征在于，部分引线簇包括干部，所述干部中相邻两个网格单元之间仅通过一个公共结点连接。
  13. 根据权利要求12所述的触摸屏，其特征在于，所述部分引线簇进一步包括与干部连接的枝部，所述枝部中相邻两个网格单元之间通过一公共网格边连接，所述相邻两个网格单元之间包括两个公共结点，所述枝部一末端的网格单元与所述干部一末端的网格单元通过公共网格边连接。
  14. 根据权利要求12所述的触摸屏，其特征在于，相邻的两引线簇的干部之间的配色线从网格边的中部断开。
  15. 根据权利要求8所述的触摸屏，其特征在于，所述断开的长度为2-20微米。
  16. 根据权利要求15所述的触摸屏，其特征在于，所述断开的长度为3-9微米。
  17. 根据权利要求12所述的触摸屏，其特征在于，所述干部自与相邻的配色线邻接处的网格的结点断开。
  18. 根据权利要求11所述的触摸屏，其特征在于，部分所述引线簇中的相邻两个网格单元之间通过一公共网格边连接，所述相邻两个网格单元之间包括两个公共结点。
  19. 根据权利要求1所述的触摸屏，其特征在于，所述网格的网格单元为菱形。
  20. 根据权利要求1所述的触摸屏，其特征在于，所述感应区包括相互分离设置的左感应区和右感应区，每个左感应区和右感应区均包括若干第一感应图案和若干第二感应图案，所述引线区设于左感应区和右感应区的中间。
  21. 根据权利要求1所述的触摸屏，其特征在于，所述沟槽为具有预设形状的凸起的压印模具压印形成。
  22. 根据权利要求21所述的触摸屏，其特征在于，所述沟槽的深宽比大于1。
  23. 根据权利要求21所述的触摸屏，其特征在于，所述沟槽的深度不小于所述导电层的厚度。
  24. 根据权利要求1所述的触摸屏，其特征在于，所述基质层的厚度小于所述玻璃基板的厚度。
  25. 根据权利要求1所述的触摸屏，其特征在于，还包括保护层，所述保护层覆盖所述基质层及导电层。
  26. 一种触摸屏的制造方法，包括下列步骤：
    提供玻璃基板；
    对所述玻璃基板的一表面进行等离子体轰击处理，使所述表面露出Si-O-基；
    在所述玻璃基板进行了等离子轰击处理的表面涂覆胶状物并固化，形成基质层，所述胶状物固化过程中与玻璃基板表面的Si-O-基结合；
    使用压印模具压印所述基质层，在所述基质层背离所述玻璃基板的一面形成沟槽；及
    将金属填充于所述沟槽内，形成金属网格作为导电层。
  27. 根据权利要求26所述的触摸屏的制造方法，其特征在于，所述玻璃基板经等离子体轰击处理的表面具有5至10纳米的粗糙度。
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