WO2014064969A1 - Alliage de titane et de cuivre de résistance élevée - Google Patents

Alliage de titane et de cuivre de résistance élevée Download PDF

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Publication number
WO2014064969A1
WO2014064969A1 PCT/JP2013/068260 JP2013068260W WO2014064969A1 WO 2014064969 A1 WO2014064969 A1 WO 2014064969A1 JP 2013068260 W JP2013068260 W JP 2013068260W WO 2014064969 A1 WO2014064969 A1 WO 2014064969A1
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Prior art keywords
strength
titanium
copper
present
rolling
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PCT/JP2013/068260
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English (en)
Japanese (ja)
Inventor
弘泰 堀江
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Jx日鉱日石金属株式会社
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Priority to KR1020157009690A priority Critical patent/KR101695115B1/ko
Priority to CN201380055740.9A priority patent/CN104755642B/zh
Publication of WO2014064969A1 publication Critical patent/WO2014064969A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053—Driving means for the movement of one or more optical element
    • G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils

Definitions

  • the present invention relates to high-strength titanium copper suitable as a spring material for electronic parts such as FPC connectors and autofocus camera modules.
  • titanium-containing copper alloy (hereinafter referred to as “titanium copper”) has a relatively high strength and is most excellent in the copper alloy in terms of stress relaxation characteristics.
  • a signal system terminal member it has been used for a long time.
  • Titanium copper is an age-hardening type copper alloy.
  • a supersaturated solid solution of Ti which is a solute atom, is formed by solution treatment, and heat treatment is performed at a low temperature for a relatively long time from that state, a modulated structure that is a periodic variation of Ti concentration in the parent phase is caused by spinodal decomposition.
  • the problem is that the strength and the bending workability are contradictory. That is, if the strength is improved, the bending workability is impaired, and conversely, if the bending workability is emphasized, a desired strength cannot be obtained.
  • Patent Document 1 a third element such as Fe, Co, Ni, Si or the like is added (Patent Document 1), and the concentration of the impurity element group that dissolves in the parent phase is regulated, and the second element (Cu—Ti— X-type particles) are precipitated in a predetermined distribution form to increase the regularity of the modulation structure (Patent Document 2), and the density of the trace additive elements and second-phase particles effective to refine the crystal grains is specified. From the viewpoints of (Patent Document 3) and refining crystal grains (Patent Document 4), a technique has been proposed which attempts to achieve both the strength and bending workability of titanium copper.
  • Patent Document 3 a technique has been proposed which attempts to achieve both the strength and bending workability of titanium copper.
  • Patent Document 6 By paying attention to the crystal orientation and controlling the crystal orientation to satisfy I ⁇ 420 ⁇ / I 0 ⁇ 420 ⁇ > 1.0 and I ⁇ 220 ⁇ / I 0 ⁇ 220 ⁇ ⁇ 3.0, the strength and bending A technique for improving workability and stress relaxation resistance has also been proposed (Patent Document 6).
  • the production method is as follows: ingot melting casting ⁇ homogenization annealing ⁇ hot rolling ⁇ (repetition of annealing and cold rolling) ⁇ final solution treatment ⁇ cold It was based on the order of rolling ⁇ aging treatment, and there was a limit to improving the characteristics.
  • Patent Document 7 it is supposed that the dislocation density of the titanium copper obtained will rise by employ
  • a certain ⁇ ⁇ 220 ⁇ is ⁇ 0 ⁇ 220 ⁇ which is the half width of the X-ray diffraction intensity peak from the ⁇ 220 ⁇ crystal plane of the pure copper standard powder and the following formula: 3.0 ⁇ ⁇ ⁇ 220 ⁇ / ⁇ 0 ⁇ 220 ⁇ ⁇ 6.0.
  • an object of the present invention is to provide high-strength titanium copper suitable as a conductive spring material used for electronic parts such as FPC connectors and camera modules.
  • the present invention contains 2.0 to 4.0% by mass of Ti, and the third element is Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and One or more selected from the group consisting of P is contained in a total amount of 0 to 0.5% by mass, the balance is made of copper and inevitable impurities, and the KAM value is 1.5 to 3 in the crystal orientation analysis in the EBSD measurement.
  • 0.0 which is titanium copper.
  • the 0.2% proof stress is 1100 MPa or more.
  • the present invention is a copper-stretched product provided with titanium copper according to the present invention.
  • the present invention is an electronic component including titanium copper according to the present invention.
  • the electronic component according to the present invention is an autofocus camera module.
  • a lens in another aspect of the present invention, a lens, a spring member that elastically urges the lens to an initial position in the optical axis direction, and an electromagnetic force that resists the urging force of the spring member are generated to light the lens.
  • An autofocus camera module comprising electromagnetic drive means that can be driven in the axial direction, wherein the spring member is titanium copper according to the present invention.
  • High-strength titanium copper suitable as a conductive spring material used for electronic parts such as camera modules can be obtained.
  • FIG. 2 is an exploded perspective view of the autofocus camera module of FIG. 1. It is sectional drawing which shows operation
  • Ti concentration in the titanium copper according to the present invention is set to 2.0 to 4.0 mass%. Titanium copper increases strength and electrical conductivity by dissolving Ti in a Cu matrix by solution treatment and dispersing fine precipitates in the alloy by aging treatment. If the Ti concentration is less than 2.0% by mass, the precipitates are insufficiently deposited and the desired strength cannot be obtained. When the Ti concentration exceeds 4.0% by mass, the workability deteriorates and the material is easily cracked during rolling. Considering the balance between strength and workability, the preferable Ti concentration is 2.5 to 3.5% by mass.
  • a third element selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P.
  • these third elements can be contained in a total amount of 0 to 0.5% by mass, and considering the balance between strength and workability, one or more of the above elements are added in a total amount of 0.1 to 0.4% by mass. It is preferable to contain.
  • the 0.2% yield strength in a direction parallel to the rolling direction can achieve 1100 MPa or more.
  • the 0.2% yield strength of titanium copper according to the present invention is 1200 MPa or more in a preferred embodiment, and 1300 MPa or more in a more preferred embodiment.
  • the upper limit of 0.2% proof stress is not particularly restricted in terms of the intended strength of the present invention, but it takes time and effort, and there is a risk of cracking during hot rolling if the titanium concentration is increased to obtain high strength. Therefore, the 0.2% yield strength of the titanium copper according to the present invention is generally 2000 MPa or less, typically 1600 MPa or less, and more typically 1500 MPa or less.
  • the 0.2% proof stress in a direction parallel to the rolling direction of titanium copper is measured in accordance with JIS Z2241 (metal material tensile test method).
  • the titanium-copper according to the present invention has a KAM (Kerner Average Mission) value of 1.5 to 3.0.
  • KAM Kernel Average Mission
  • This KAM value represents an orientation difference between adjacent measurement points in a crystal grain, and analysis software attached to EBSD (example: TSL) by crystal orientation analysis in EBSD (Electron Back Scatter Diffraction) measurement. It can be calculated by measuring the orientation difference in the crystal grains by using OIM Analysis (Solutions).
  • OIM Analysis Solutions
  • the KAM value is an index for indirectly evaluating the dislocation density.
  • the KAM value tends to decrease as the dislocation density decreases, and conversely, it increases as the dislocation density increases.
  • the present inventor has found that when the KAM value is 1.5 to 3.0, a property having high strength and good sag resistance at high temperature exposure can be obtained. If the KAM value exceeds the upper limit, the sag resistance at high temperature exposure tends to deteriorate, and if it falls below the lower limit, the strength tends to decrease, such being undesirable.
  • the KAM value is preferably 1.8 to 3.0, more preferably 2.1 to 3.0.
  • Thickness of titanium copper Generally, as the thickness of the metal material becomes thinner, the sag resistance decreases, but in one embodiment of the titanium copper according to the present invention, the thickness should be 1.0 mm or less. In a typical embodiment, the thickness can be 0.02 to 0.8 mm, and in a more typical embodiment, the thickness can be 0.05 to 0.5 mm.
  • the titanium copper according to the present invention can be processed into various copper products, for example, plates, strips, tubes, bars and wires.
  • the titanium copper according to the present invention is not limited to electronic components such as switches, connectors (particularly, fork FPC connectors that do not require severe bending workability), autofocus camera modules, jacks, terminals, and relays. It can be suitably used as a material.
  • the autofocus camera module generates a lens, a spring member that elastically biases the lens toward an initial position in the optical axis direction, and an electromagnetic force that resists the biasing force of the spring member to cause the lens to light.
  • Electromagnetic drive means that can be driven in the axial direction is provided.
  • the electromagnetic driving means includes a U-shaped cylindrical yoke, a coil accommodated inside the inner peripheral wall of the yoke, and a magnet surrounding the coil and accommodated inside the outer peripheral wall of the yoke. Can do.
  • FIG. 1 is a cross-sectional view showing an example of an autofocus camera module according to the present invention
  • FIG. 2 is an exploded perspective view of the autofocus camera module of FIG. 1
  • FIG. 3 is an autofocus camera module of FIG. It is sectional drawing which shows this operation
  • the autofocus camera module 1 includes a U-shaped cylindrical yoke 2, a magnet 4 attached to the outer wall of the yoke 2, a carrier 5 having a lens 3 at a central position, a coil 6 attached to the carrier 5, a yoke 2, a frame 8 that supports the base 7, two spring members 9 a and 9 b that support the carrier 5 at the top and bottom, and two caps 10 a and 10 b that cover these top and bottom.
  • the two spring members 9a and 9b are the same product, support the carrier 5 sandwiched from above and below in the same positional relationship, and function as a power feeding path to the coil 6. By applying a current to the coil 6, the carrier 5 moves upward.
  • the terms “upper” and “lower” are used as appropriate, but the upper and lower parts in FIG. 1 are pointed out, and the upper part represents the positional relationship from the camera toward the subject.
  • the yoke 2 is a magnetic material such as soft iron, has a U-shaped cylindrical shape with a closed top surface, and has a cylindrical inner wall 2a and an outer wall 2b.
  • a ring-shaped magnet 4 is attached (adhered) to the inner surface of the U-shaped outer wall 2b.
  • the carrier 5 is a molded product made of a synthetic resin or the like having a cylindrical structure having a bottom surface portion, supports a lens at a central position, and is mounted with a pre-formed coil 6 bonded to the outside of the bottom surface.
  • the yoke 2 is fitted and incorporated in the inner peripheral portion of the base 7 of the rectangular upper resin molded product, and the entire yoke 2 is fixed by the frame 8 of the resin molded product.
  • the spring members 9a and 9b are both fixed with the outermost peripheral part sandwiched between the frame 8 and the base 7, respectively, and the notch groove part for each inner peripheral part 120 ° is fitted to the carrier 5 and fixed by thermal caulking or the like. Is done.
  • the spring member 9b and the base 7 and the spring member 9a and the frame 8 are fixed by adhesion, heat caulking, or the like. Further, the cap 10b is attached to the bottom surface of the base 7, and the cap 10a is attached to the upper portion of the frame 8, respectively. 9b is sandwiched between the base 7 and the cap 10b, and the spring member 9a is sandwiched and fixed between the frame 8 and the cap 10a.
  • One lead wire of the coil 6 extends upward through a groove provided on the inner peripheral surface of the carrier 5 and is soldered to the spring member 9a.
  • the other lead wire extends downward through a groove provided on the bottom surface of the carrier 5 and is soldered to the spring member 9b.
  • Spring members 9a and 9b are titanium copper foil leaf springs according to the present invention. It has springiness and elastically biases the lens 3 to the initial position in the optical axis direction. At the same time, it acts as a power feeding path to the coil 6. One part of the outer peripheral part of the spring members 9a and 9b is projected outward to function as a power supply terminal.
  • the cylindrical magnet 4 is magnetized in the radial direction, forms a magnetic path with the inner wall 2a, the upper surface portion and the outer wall 2b of the U-shaped yoke 2 as a path, and a gap between the magnet 4 and the inner wall 2a.
  • the coil 6 is arranged.
  • the spring members 9a and 9b have the same shape and are attached in the same positional relationship as shown in FIGS. 1 and 2, the axial displacement when the carrier 5 moves upward can be suppressed. Since the coil 6 is manufactured by pressure molding after winding, the accuracy of the finished outer diameter is improved, and the coil 6 can be easily arranged in a predetermined narrow gap. Since the carrier 5 hits the base 7 at the lowermost position and hits the yoke 2 at the uppermost position, the carrier 5 is provided with an abutting mechanism in the vertical direction, thereby preventing the carrier 5 from falling off.
  • FIG. 3 shows a cross-sectional view when a current is applied to the coil 6 to move the carrier 5 having the lens 3 for autofocus upward.
  • a current flows through the coil 6 and an upward electromagnetic force acts on the carrier 5.
  • the restoring force of the two connected spring members 9a and 9b acts downward on the carrier 5.
  • the upward moving distance of the carrier 5 is a position where the electromagnetic force and the restoring force are balanced. Thereby, the amount of movement of the carrier 5 can be determined by the amount of current applied to the coil 6.
  • the restoring force acts equally downward on the upper surface and lower surface of the carrier 5, so that the lens 3 Axis misalignment can be kept small.
  • the magnet 4 has been described as having a cylindrical shape, the magnet 4 is not limited to this, and may be divided into three or four parts and magnetized in the radial direction, and this may be adhered and fixed to the inner surface of the outer wall 2b of the yoke 2.
  • Titanium copper according to the present invention can be manufactured by carrying out appropriate heat treatment and cold rolling, particularly in the final solution treatment and the subsequent steps. Below, a suitable manufacture example is demonstrated sequentially for every process.
  • Cu includes one or more selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P in total 0 to 0 It is desirable to add in an amount of 0.5% by mass, and then add Ti in an amount of 2.0 to 4.0% by mass to produce an ingot.
  • First solution treatment> Thereafter, it is preferable to perform the first solution treatment after appropriately repeating cold rolling and annealing.
  • the reason why the solution treatment is performed in advance is to reduce the burden in the final solution treatment. That is, in the final solution treatment, it is not a heat treatment for dissolving the second phase particles, but is already in solution, so it is only necessary to cause recrystallization while maintaining that state.
  • the first solution treatment may be performed at a heating temperature of 850 to 900 ° C. for 2 to 10 minutes. In this case, it is preferable to increase the heating rate and the cooling rate as much as possible so that the second phase particles do not precipitate. Note that the first solution treatment may not be performed.
  • the rolling reduction of the intermediate rolling is preferably 70 to 99%.
  • the rolling reduction is defined by ⁇ ((thickness before rolling ⁇ thickness after rolling) / thickness before rolling) ⁇ 100% ⁇ .
  • ⁇ Final solution treatment> In the final solution treatment, it is desirable to completely dissolve the precipitate, but if heated to a high temperature until it completely disappears, the crystal grains are likely to coarsen, so the heating temperature is close to the solid solution limit of the second phase particle composition.
  • the temperature at which the solid solubility limit of Ti becomes equal to the addition amount when the addition amount of Ti is in the range of 2.0 to 4.0% by mass is about 730 to 840 ° C., for example, the addition amount of Ti is 3 About 800 ° C. at 0.0 mass%). And if it heats rapidly to this temperature and a cooling rate is also made quick by water cooling etc., generation
  • grains will be suppressed.
  • the shorter the heating time in the final solution treatment the more the crystal grains can be prevented from coarsening.
  • the heating time can be, for example, 30 seconds to 10 minutes, and typically 1 minute to 8 minutes. Even if the second phase particles are generated at this point, if they are finely and uniformly dispersed, they are almost harmless to strength and bending workability. However, since the coarse particles tend to grow further in the final aging treatment, the second phase particles at this point must be made as small as possible even if they are formed.
  • the average crystal grain size after the final solution treatment is preferably controlled in the range of 2 to 30 ⁇ m, more preferably in the range of 2 to 15 ⁇ m, and in the range of 2 to 10 ⁇ m. Even more preferred.
  • a cross-sectional structure parallel to the rolling direction is revealed by electropolishing, and then an observation field of view of 100 ⁇ m ⁇ 100 ⁇ m is photographed with an electron microscope (SEM). Then, based on JISH0501, the average crystal grain size in the direction perpendicular to the rolling direction and the average crystal grain size in the direction parallel to the rolling direction are obtained by a cutting method, and the average value of both is taken as the average crystal grain size.
  • a preliminary aging treatment is performed.
  • cold rolling is usually performed after the final solution treatment, but in order to obtain titanium copper according to the present invention, after the final solution treatment, it is immediately preliminarily performed without performing cold rolling. It is important to perform an aging treatment.
  • the pre-aging heat treatment is a heat treatment performed at a lower temperature than the aging treatment in the next step, and by performing the pre-aging heat treatment and the aging treatment described later continuously, the sag resistance at the time of high temperature exposure is significantly increased along with the strength of titanium copper. The advantage of improvement is obtained.
  • the pre-aging treatment is preferably performed in an inert atmosphere such as Ar, N 2 , H 2 or the like in order to suppress the generation of the surface oxide film.
  • the heating temperature in the pre-aging treatment is too low or too high. According to the results of investigation by the present inventors, it is preferable to heat at a material temperature of 150 to 250 ° C. for 10 to 20 hours, more preferably at a material temperature of 160 to 230 ° C. for 10 to 18 hours, and at 170 to 200 ° C. Even more preferred is heating for 12-16 hours.
  • ⁇ Aging treatment> An aging process is performed following the preliminary aging process. After preliminary aging treatment, it may be once cooled to room temperature. Considering the production efficiency, it is desirable that after the preliminary aging treatment, the temperature is raised to the aging treatment temperature without cooling and the aging treatment is continuously performed. There is no difference in the characteristics of titanium copper obtained by any method. However, since the preliminary aging is intended to precipitate the second phase particles uniformly in the subsequent aging treatment, cold rolling should not be performed between the preliminary aging treatment and the aging treatment.
  • the aging treatment should be carried out at a slightly lower temperature than the conventional aging treatment, and 0.5 to 0.5 at a material temperature of 300 to 450 ° C. It is preferable to heat for ⁇ 20 hours, more preferably for 2 to 18 hours at a material temperature of 350 to 440 ° C, and even more preferably for 3 to 15 hours at a material temperature of 375 to 430 ° C.
  • the aging treatment is preferably performed in an inert atmosphere such as Ar, N 2 and H 2 for the same reason as the preliminary aging treatment.
  • the characteristics of titanium copper are significantly improved by performing preliminary aging heat treatment and aging treatment continuously for the following reasons.
  • fine second phase particles are uniformly precipitated. After that, by performing cold rolling, the dislocation density increases and the strength becomes higher than before.
  • the pre-aging heat treatment is not applied, the second phase particles become coarse or non-uniform, so that a sufficient dislocation density cannot be obtained even by cold rolling, and the strength becomes insufficient.
  • the final cold rolling is performed.
  • the strength of titanium copper can be increased by the final cold working.
  • the rolling reduction is 55% or more, preferably 60% or more, more preferably 90% or more.
  • the productivity decreases, so the rolling reduction is preferably 99.9% or less, more preferably 97% or less, and even more preferably 95% or less. .
  • strain relief annealing From the viewpoint of improving sag resistance at high temperature exposure, it is desirable to perform strain relief annealing after the final cold rolling. This is because dislocations are rearranged by performing strain relief annealing.
  • the conditions for strain relief annealing may be conventional conditions. However, excessive strain relief annealing is not preferable because coarse particles precipitate and the strength decreases.
  • the strain relief annealing is preferably performed at a material temperature of 200 to 600 ° C. for 10 to 600 seconds, more preferably at 250 to 550 ° C. for 10 to 400 seconds, and even more preferably at 300 to 500 ° C. for 10 to 200 seconds. .
  • steps such as grinding, polishing, and shot blast pickling for removing oxide scale on the surface can be appropriately performed between the above steps.
  • hot rolling was performed at 900 to 950 ° C. to obtain a hot rolled sheet having a thickness of 15 mm.
  • cold rolling was performed to obtain a strip thickness (1 to 8 mm), and a primary solution treatment with the strip was performed.
  • the conditions for the first solution treatment were heating at 850 ° C. for 10 minutes, and then water cooling.
  • the heating conditions at this time were such that the material temperature was such that the solid solubility limit of Ti was the same as the addition amount (Ti concentration: 3.0% by mass, about 800 ° C., Ti concentration: 2.0% by mass, about 730 ° C., Ti concentration: 4 0.0 mass% and about 840 ° C.) as a standard.
  • preliminary aging treatment and aging treatment were continuously performed in the Ar atmosphere under the conditions described in Table 1. That is, no cooling was performed after the preliminary aging treatment.
  • final cold rolling was performed under the conditions described in Table 1
  • strain relief annealing was performed under each heating condition described in Table 1 to obtain test pieces of invention examples and comparative examples.
  • preliminary aging treatment, aging treatment or strain relief annealing was omitted.
  • the average crystal grain size of the intermediate product after the final solution treatment was measured by an electron microscope (XL30 SFEG manufactured by Philips) by the measurement method described above.
  • Comparative Example 3 is conceived of the invention described in JP2012-0625757A. Since the preliminary aging treatment was not performed, the strength improvement was insufficient, and the KAM value was also outside the scope of the present invention. Therefore, both 0.2% yield strength and permanent deformation rate were inferior to those of the inventive examples. Although the comparative example 4 performed the preliminary aging treatment, since the heating temperature was too low, the strength improvement was insufficient, and the KAM value was also outside the range of the present invention. Therefore, both 0.2% yield strength and permanent deformation rate were inferior to those of the inventive examples. In Comparative Example 5, since the heating temperature in preliminary aging was too high, overaging was caused and coarse particles were precipitated, and the KAM value was also outside the range of the present invention.
  • Comparative Example 8 since the heating temperature in the aging treatment was too high, overaging occurred and coarse particles were precipitated, and the KAM value was also outside the range of the present invention. Therefore, both 0.2% yield strength and permanent deformation rate were inferior to those of the inventive examples.
  • Comparative Example 9 the rolling reduction in the final cold rolling was too low, resulting in insufficient strength, and the KAM value was also outside the scope of the present invention. Therefore, both 0.2% yield strength and permanent deformation rate were inferior to those of the inventive examples. Since Comparative Example 10 did not perform strain relief annealing, the KAM value was out of the range of the present invention. Therefore, the permanent deformation rate was inferior to that of the inventive examples.

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Abstract

La présente invention concerne un alliage de titane et de cuivre de résistance élevée qui est approprié comme élément ressort électro-conducteur destiné à être utilisé dans des composants électroniques d'un module d'appareil-photo ou similaire. L'alliage de titane et de cuivre comprend de 2,0 à 4,0 % en masse de Ti, un total de 0 à 0,5 % en masse d'un ou plusieurs éléments choisis dans le groupe constitué par le Fe, le Co, le Mg, le Si, le Ni, le Cr, le Zr, le Mo, le V, le Nb, le Mn, le B, et le P comme élément tertiaire, et un complément comprenant du cuivre et des impuretés inévitables. La valeur KAM selon l'analyse des orientations cristallines obtenue par mesure EBSD est de 1,5 à 3,0.
PCT/JP2013/068260 2012-10-25 2013-07-03 Alliage de titane et de cuivre de résistance élevée WO2014064969A1 (fr)

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KR1020157009690A KR101695115B1 (ko) 2012-10-25 2013-07-03 고강도 티탄 구리
CN201380055740.9A CN104755642B (zh) 2012-10-25 2013-07-03 高强度钛铜

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CN104278171A (zh) * 2014-09-16 2015-01-14 中南大学 一种CuTi系弹性铜合金及其制备方法
WO2015072221A1 (fr) * 2013-11-18 2015-05-21 Jx日鉱日石金属株式会社 Alliage cuivre-titane pour composant électronique
WO2015098201A1 (fr) * 2013-12-27 2015-07-02 Jx日鉱日石金属株式会社 Alliage de cuivre-titane pour composant électronique
WO2018180429A1 (fr) * 2017-03-30 2018-10-04 Ｊｘ金属株式会社 Bande de cuprotitane à haute résistance et feuille à structure stratifiée
WO2018180428A1 (fr) * 2017-03-30 2018-10-04 Ｊｘ金属株式会社 Bande de cuprotitane à haute résistance et feuille ayant une structure feuilletée
CN113802026A (zh) * 2021-09-18 2021-12-17 宁波博威合金板带有限公司 钛青铜带材及其制备方法

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