WO2014033770A1 - Composition d'adhésif et bande adhésive pour soudage par laser - Google Patents

Composition d'adhésif et bande adhésive pour soudage par laser Download PDF

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Publication number
WO2014033770A1
WO2014033770A1 PCT/JP2012/005362 JP2012005362W WO2014033770A1 WO 2014033770 A1 WO2014033770 A1 WO 2014033770A1 JP 2012005362 W JP2012005362 W JP 2012005362W WO 2014033770 A1 WO2014033770 A1 WO 2014033770A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive composition
styrene
weight
Prior art date
Application number
PCT/JP2012/005362
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English (en)
Japanese (ja)
Inventor
山田　功作
博文 村上
藤田　和也
Original Assignee
早川ゴム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 早川ゴム株式会社 filed Critical 早川ゴム株式会社
Priority to PCT/JP2012/005362 priority Critical patent/WO2014033770A1/fr
Priority to KR1020147000652A priority patent/KR101601565B1/ko
Priority to PCT/JP2013/005057 priority patent/WO2014034100A1/fr
Priority to CN201380002202.3A priority patent/CN103781869B/zh
Priority to JP2014532789A priority patent/JP6267640B2/ja
Publication of WO2014033770A1 publication Critical patent/WO2014033770A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer

Definitions

  • the present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape for laser bonding that are used when a predetermined member is bonded using the heat of laser light irradiation.
  • LCD TVs mobile phones, smartphones, tablet terminals, digital cameras, portable game machines, etc. have become widespread in recent years, and are indispensable for living.
  • These devices are provided with a transparent panel such as a glass plate or an acrylic plate used for a display screen in addition to a housing for accommodating a substrate and the like.
  • Black and white printed portions, so-called frame portions, are formed on the peripheral portion of the back surface of the transparent panel so as to hide the peripheral terminals and the like from the front side of the transparent panel.
  • the transparent panel on which the frame portion is formed as described above and the casing are generally bonded in many cases, and in this case, an adhesive tape having a width smaller than that of the frame portion is used.
  • the total thickness is 500 ⁇ m or less, providing a double-sided pressure-sensitive adhesive tape having a thin total thickness and having a foam layer and excellent removability.
  • a double-sided pressure-sensitive adhesive tape formed from a pressure-sensitive adhesive composition containing an acrylic polymer composed of an acid alkyl ester as an essential monomer component, a tackifier resin, and a crosslinking agent is disclosed.
  • patent document 2 when making the design layer of a transparent panel visible from the front side, it can be joined using a laser beam without melting or decomposing the design layer, thereby improving the appearance appearance.
  • an adhesive tape for laser bonding is provided adjacent to the design layer having laser light impermeability, and the design layer is moved toward the design layer until a predetermined temperature not exceeding the melting or decomposition temperature of the design layer is reached.
  • the bonding portion between the transparent panel and the casing has a high level of bonding reliability (impact resistance, cold resistance, waterproofness). Desired.
  • the width of the frame portion of the transparent panel is becoming narrower (narrowing the frame). If the width of the frame portion of the transparent panel is reduced, the width of the adhesive tape must be reduced accordingly.
  • the width of the adhesive tape is reduced, the effective adhesive area is reduced, so in general, the adhesive strength is reduced and the adhesive reliability is also reduced, and the above-mentioned impact resistance, cold resistance and waterproofness are sufficiently satisfied. Can not be.
  • the transparent panel after bonding the transparent panel and the housing with adhesive tape, for example, if a defect is found in the transparent panel or substrate after product inspection, or if the bonding operation fails, the transparent panel is mounted on the housing. Sometimes it can be peeled off from the body and reused, but if the adhesive tape remains on the transparent panel or casing at this time, it becomes an obstacle to reuse. There is a problem that the adhesive tape must be gradually peeled off.
  • the base material of the adhesive tape is a foam layer
  • the tensile strength is weak.
  • the adhesive layer of the adhesive tape can be easily peeled off from the transparent panel, the adhesive tape has a Part may remain. Even if you pull the remaining adhesive tape to pull it, it will break immediately, so there is a problem that you have to work carefully with the hands of the operator using solvent or applying heat is there.
  • Patent Document 2 the design layer adjacent to the adhesive tape is irradiated with laser light to generate heat, and the heat is used to soften the adhesive layer. Although reliability increases to a certain extent, there is a concern that the adhesive strength and waterproofness may decrease due to the narrow frame.
  • the present invention has been made in view of the above points, and its object is to provide sufficient impact resistance, cold resistance and waterproofness even when the effective adhesion area becomes narrow, for example, as a narrow frame.
  • the adhesive reliability is improved, and the adhesive layer made of the adhesive composition is hardly broken when the bonded member is peeled off, and the adhesive layer can be easily peeled off from the member.
  • the 1st invention is arrange
  • the pressure-sensitive adhesive composition is heated by the irradiation heat of the laser light applied to the design layer of the first member,
  • the temperature of the pressure-sensitive adhesive composition is 25 ° C.
  • the 180-degree peeling adhesive strength from the stainless steel plate is 20 N / 25 mm or more
  • the destructive phenomenon of the pressure-sensitive adhesive composition is interfacial peeling.
  • the temperature of the pressure-sensitive adhesive composition is 100 ° C.
  • the 180-degree peeling adhesive strength from the stainless steel plate is 10 N / 25 mm or less, and the destructive phenomenon of the pressure-sensitive adhesive composition is interfacial peeling. To do.
  • a laser is applied to the design layer of the first member with the pressure-sensitive adhesive composition disposed between the first member and the second member.
  • laser light is absorbed by the design layer to generate heat, and this heat is transmitted to the pressure-sensitive adhesive composition, and the pressure-sensitive adhesive composition is heated and softened.
  • the adhesive surface of the first member or the second member has irregularities or steps, the pressure-sensitive adhesive composition is easily deformed so as to conform to the shape of the irregularities or steps by the softening of the pressure-sensitive adhesive composition, and adheres without gaps. Thereby, it becomes possible to obtain high waterproofness between the first member and the second member.
  • the adhesive strength is as high as 20 N / 25 mm or more when peeled off from the stainless steel plate, so that sufficient adhesive strength is ensured even if the temperature is lowered. It is possible to obtain high cold resistance and impact resistance.
  • the design layer is again irradiated with laser light.
  • the adhesive composition is softened as described above.
  • the 180-degree peeling adhesive strength from the stainless steel plate is 10 N / 25 mm or less, and exhibits the phenomenon of interfacial debonding, so the first member is the second member.
  • the pressure-sensitive adhesive composition remains in the first member, for example, when the temperature of the pressure-sensitive adhesive composition is 25 ° C., the phenomenon of interfacial peeling is exhibited.
  • the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition is peeled from the first member without breaking. Therefore, it is possible to easily peel off all of the remaining pressure-sensitive adhesive composition without using a solvent or applying heat.
  • the tensile strength of the dumbbell-shaped No. 3 having a thickness of 100 ⁇ m formed by the pressure-sensitive adhesive composition is 5 MPa or more and the elongation is 800% or more.
  • the first invention contains a styrene / butadiene / styrene copolymer and a terpene tackifier.
  • the content of the terpene tackifier is 60 parts by weight or less of the styrene / butadiene / styrene copolymer.
  • the adhesive strength becomes insufficient and the adhesion reliability is lowered. By doing so, it becomes possible to obtain sufficient adhesive strength.
  • the diblock component in the styrene / butadiene / styrene copolymer is 40 parts by weight or more and less than 60 parts by weight.
  • This configuration makes it possible to further increase the adhesive strength.
  • the sixth invention is a pressure-sensitive adhesive tape for laser bonding, wherein the pressure-sensitive adhesive composition according to the first to fifth inventions is used.
  • the first invention even when the effective bonding area becomes narrow, sufficient impact resistance, cold resistance, and waterproofing are obtained to improve the adhesion reliability, and when the first member is peeled off from the second member.
  • the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition is difficult to break and can be easily peeled off.
  • the second invention sufficient strength can be ensured even after the pressure-sensitive adhesive composition has been cooled, so that the pressure-sensitive adhesive composition can be easily peeled off from the first member or the second member.
  • the adhesion reliability can be further improved.
  • the laser has high adhesion reliability and can easily peel the first member from the second member. It can be set as the adhesive tape for joining.
  • the pressure-sensitive adhesive composition according to the embodiment of the present invention is disposed between the first member and the second member having translucency, and is heated by the irradiation heat of the laser light applied to the design layer of the first member. It is an adhesive composition that is softened.
  • the first member is, for example, a transparent panel made of a glass plate or an acrylic plate used for a display screen of a liquid crystal television, a mobile phone, a smartphone, a tablet terminal, a digital camera, a portable game machine, etc. It may be.
  • the transparent panel has a laser beam transmission property that allows the laser beam to pass therethrough.
  • the laser light transmission includes not only the case of transmitting all of the irradiated laser light but also the case of slightly absorbing the irradiated laser light.
  • a black or white printed portion is provided as a frame portion on the periphery of the transparent panel.
  • This printed portion is composed of a design layer having laser beam impermeability that does not transmit laser light.
  • the laser beam non-transmission includes not only the case of absorbing all of the irradiated laser beam but also the case of slightly transmitting the irradiated laser beam.
  • the second member is a housing that accommodates, for example, the substrate of the device.
  • the housing may have a laser beam transparency, or may have a laser beam opaqueness.
  • the 180-degree peeling adhesive strength from the stainless steel plate is 20 N / 25 mm or more, and the destructive phenomenon of the pressure-sensitive adhesive composition is interfacial peeling.
  • the temperature of the pressure-sensitive adhesive composition is 100 ° C.
  • the 180-degree peeling adhesive strength from the stainless steel plate is 10 N / 25 mm or less, and the destructive phenomenon of the pressure-sensitive adhesive composition is interfacial peeling.
  • the component is set to the content and the content is set.
  • the temperature of the pressure-sensitive adhesive composition is 25 ° C., it is preferably 30 N / 25 mm or more as the 180-degree peeling adhesive strength from the stainless steel plate. If it is more than this level, a transparent panel and a housing
  • the test method for obtaining 180 degree peeling adhesive strength is as follows. A test piece having a width of 25 mm is attached to a stainless steel SUS304BA steel sheet in accordance with JIS Z 0237, and 180 degree at a peeling speed of 300 mm / min at temperatures of 25 ° C and 100 ° C. The peel resistance value when peeling in the direction was measured (unit: N / 25 mm).
  • the pressure-sensitive adhesive composition has its constituents set such that the tensile strength of the 100 ⁇ m-thick dumbbell-shaped No. 3 formed by the pressure-sensitive adhesive composition is 5 MPa or more and the elongation is 800% or more, The amount is set.
  • This tensile strength is preferably 7 MPa or more.
  • the pressure is less than 5 MPa, the tensile strength of the pressure-sensitive adhesive layer constituted by the pressure-sensitive adhesive composition is insufficient.
  • the pressure-sensitive adhesive layer is pulled with a finger, there is a high possibility of breakage.
  • the transparent panel has a narrow frame, the bondable width is narrowed and the frame is easily broken.
  • the elongation is preferably 1000% or more. If the elongation is less than 800%, the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition is hardened, so that the impact resistance and low-temperature characteristics (cold resistance) are reduced, and the transparent panel is encased when the device falls at low temperatures. Since there is a possibility of peeling from the body, it is not preferable.
  • Tensile strength and elongation were tested by measuring strength and elongation when a dumbbell-shaped No. 3 test piece having a thickness of 100 ⁇ m was pulled at a temperature of 20 ° C. and a pulling speed of 500 mm / min in accordance with JIS K 6251.
  • the pressure-sensitive adhesive composition contains styrene / butadiene / styrene copolymer and a terpene-based tackifier as essential components.
  • the main adhesive component is a styrene / isoprene / styrene copolymer used as the main component of hot melt
  • the main adhesive component is styrene / butadiene / styrene copolymer when compared with the 180 degree peeling adhesive strength. Smaller than the one used. Therefore, the main adhesive component is preferably a styrene / butadiene / styrene copolymer.
  • a reactive hot melt adhesive it may be possible to use a UV curable acrylic hot melt as a main component, but this is not preferable for the following reason.
  • a UV curable acrylic hot melt it is necessary to directly irradiate the sheet or tape with ultraviolet rays in order to develop adhesiveness.
  • the transparent panel or the case is bonded. In this case, it is difficult to irradiate ultraviolet rays from the transparent panel side or the housing side.
  • the softening point is often high, and the temperature of 100 ° C. or more is required to melt and solidify the hot-melt. This is not suitable because it is necessary to increase the temperature until a high temperature is reached, and it may adversely affect other components (liquid crystal display device, touch panel sensor) due to heat.
  • the main component is a polyethylene-based hot melt adhesive or a polypropylene-based hot melt adhesive
  • the adhesiveness at high temperature is deteriorated, and further, it becomes brittle at low temperature, so the usable temperature range is narrow and not suitable.
  • a tackifier so-called tackifier, is added to the pressure-sensitive adhesive composition in order to impart tackiness and flexibility.
  • the peeling adhesive strength is 32 N / 25 mm (YShara Chemical Co., Ltd. YS Polystar T-115), but even with a natural type tackifier.
  • Special rosin ester that is not a terpene resin (Arakawa Chemical Industry Co., Ltd., Super Ester A-115) has the same 28N / 25mm, and aliphatic hydrocarbon resin (Tonen Petrochemical Co., Ltd.
  • Escolez 1304) has the same 3N / 25mm, fat
  • the cyclic hydrocarbon resin (Arakawa Chemical Industries, Ltd., Alcon M115) has 10N / 25mm and 180 degree peeling adhesive strength that can be obtained with any terpene resin no matter which terpene resin is used. Cann't get.
  • the content of the terpene resin is 60 parts by weight or less of the styrene / butadiene / styrene copolymer.
  • the diblock component in the styrene / butadiene / styrene copolymer is 40 parts by weight or more and less than 60 parts by weight.
  • the terpene resin has the effect of reducing the viscoelasticity in the normal temperature region and imparting tackiness. However, when more terpene resin is added than 60 parts by weight of the styrene / butadiene / styrene copolymer, Then, the glass transition point is raised. That is, when the pressure-sensitive adhesive composition becomes hard in a low temperature region, cold resistance is lowered.
  • the pressure-sensitive adhesive composition becomes hard and the wettability is deteriorated, so that the adhesive strength in the normal temperature region is lowered.
  • the pressure-sensitive adhesive composition becomes hard, it becomes weak against impact in a low temperature region.
  • the adhesive layer becomes soft and the cohesive force at room temperature is reduced, so that the adhesive strength is reduced by peeling 180 degrees.
  • the pressure-sensitive adhesive composition has an appropriate cohesive force in the room temperature region while ensuring the softness of the pressure-sensitive adhesive composition in the low temperature region. It can be a composition.
  • a light stabilizer For the purpose of enhancing the stability of the obtained pressure-sensitive adhesive composition, it is possible to add a light stabilizer, an antioxidant, and a heat stabilizer within a general range.
  • light stabilizers include benzotriazole ultraviolet absorbers and hindered amine light stabilizers.
  • antioxidant include phenol-based, phosphorus-based, and amine-based agents.
  • a dye or pigment may be added for coloring to the extent that the physical properties of the pressure-sensitive adhesive composition are not hindered.
  • fillers may be blended so as not to affect the physical properties.
  • At least one selected from the group consisting of a conductive agent, a flame retardant, an antistatic agent, a crosslinking agent, and a plasticizer can be mixed.
  • the pressure-sensitive adhesive composition may be used as it is, or the pressure-sensitive adhesive composition may be used for laser bonding pressure-sensitive adhesive tape. This laser bonding adhesive tape can be used.
  • the adhesive composition When the adhesive composition is disposed between the transparent panel and the housing and the design layer of the transparent panel is irradiated with laser light, the laser light is absorbed by the design layer and heat is generated.
  • the pressure-sensitive adhesive composition is heated and softened by being transmitted to the pressure-sensitive adhesive composition.
  • the transparent panel or the housing has irregularities or steps, the pressure-sensitive adhesive composition is easily deformed so as to conform to the shapes of the irregularities or steps by the softening of the pressure-sensitive adhesive composition. This makes it possible to obtain high waterproofness between the transparent panel and the housing.
  • the adhesive strength is as high as 20 N / 25 mm or more when peeled off from the stainless steel plate, so that sufficient adhesive strength is ensured even if the temperature is lowered. It is possible to obtain high cold resistance and impact resistance.
  • the design layer is irradiated again with the laser beam.
  • the adhesive composition is softened as described above. Specifically, heating is performed until the temperature of the pressure-sensitive adhesive composition reaches 100 ° C. or higher, but the upper limit temperature is set so as not to affect the internal substrate and the liquid crystal display device.
  • the temperature of the pressure-sensitive adhesive composition is 100 ° C.
  • the 180 ° peel-off adhesive strength from the stainless steel plate is 10 N / 25 mm or less, and the phenomenon of interfacial debonding is exhibited. It can be peeled off.
  • the pressure-sensitive adhesive composition remains on the transparent panel, for example, when the temperature of the pressure-sensitive adhesive composition is 25 ° C., the phenomenon of interfacial delamination is exhibited.
  • the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition is peeled off from the transparent panel without breaking. Therefore, it is possible to easily peel off all of the remaining pressure-sensitive adhesive composition without using a solvent or applying heat.
  • the pressure-sensitive adhesive composition according to the present embodiment even when the effective bonding area is narrowed, sufficient impact resistance, cold resistance, and waterproofing are obtained to increase the bonding reliability, and the transparent panel is encased.
  • the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition is not easily broken and can be easily peeled off.
  • Styrene / butadiene / styrene copolymer with 78% diblock component so-called SBS (D-1118, manufactured by Kraton®), 56 parts by weight and styrene / butadiene / styrene copolymer with 15% diblock component (TR2601, manufactured by JSR Corporation), 44 parts by weight As a tackifier, 50 parts by weight of terpene phenol resin (Yasuhara Chemical Co., Ltd.
  • YS Polystar T-115 10 parts by weight of oil (LBR-305, Kuraray Co., Ltd.), antioxidant (Irganox 1010, manufactured by Ciba Japan Co., Ltd.) 1 part by weight was dissolved in toluene to prepare a pressure-sensitive adhesive solution having a solid content of 40 parts by weight.
  • the diblock component of the styrene / butadiene / styrene copolymer is 50 parts by weight.
  • an adhesive layer having a thickness of 100 ⁇ m was prepared by applying and drying the release PET film so that the dry film had a thickness of 100 ⁇ m.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • a diblock component of 78% styrene / butadiene / styrene copolymer (D-1118 manufactured by Kraton®), 40 parts by weight, a diblock component 15% styrene / butadiene / styrene copolymer (TR2601 manufactured by JSR Corporation), 60 parts by weight.
  • the diblock component of the styrene / butadiene / styrene copolymer is 40 parts by weight.
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • a diblock component of 78% styrene / butadiene / styrene copolymer (D-1118 manufactured by Kraton®) 71 parts by weight, a diblock component 15% styrene / butadiene / styrene copolymer (TR2601 manufactured by JSR Corporation), 29 parts by weight.
  • the diblock component of the styrene / butadiene / styrene copolymer is 60 parts by weight.
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • the tack was slightly reduced but it was usable.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • tackifier was changed to 60 parts by weight of terpene phenol resin (Yasuhara Chemical Co., Ltd., YS Polystar T-115).
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • the tack was slightly reduced but it was usable.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • the styrene / butadiene / styrene copolymer was only 100 parts by weight of the diblock component 0% (TR2827 manufactured by JSR Corporation).
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • the styrene / butadiene / styrene copolymer was only 100 parts by weight of 78% diblock component (D-1118 manufactured by Kraton).
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • the tackifier was changed to 50 parts by weight of a special rosin ester (Arakawa Chemical Industries, Ltd., Super Ester A-115).
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • the tackifier was changed to 50 parts by weight of an aliphatic hydrocarbon resin (Tokoro Petrochemical Co., Ltd. Escollets 1304).
  • An adhesive layer having a thickness of 100 ⁇ m was prepared in the same manner as in Example 1. Tack, holding power, and low-temperature characteristics were insufficient and could not be used.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • the tackifier was changed to 50 parts by weight of alicyclic hydrocarbon resin (Arakawa Chemical Industries, Ltd., Alcon M115).
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • the styrene / butadiene / styrene copolymer was changed to 100 parts by weight of a styrene / isoprene / styrene copolymer having a diblock component of 20%, a so-called SIS cage (SIS5200 manufactured by JSR Corporation).
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • the 180 degree peeling adhesive strength at 100 ° C. was high, and the tensile strength was small and it was not usable.
  • Example 2 As in Example 1, an adhesive solution having a solid content of 40 parts by weight was prepared.
  • Example 2 As in Example 1, an adhesive layer having a thickness of 100 ⁇ m was prepared.
  • the present invention can be used, for example, when bonding a panel of various electronic devices or electrical products and a housing.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne une composition d'adhésif caractérisée en ce que : quand la température de la composition d'adhésif est de 25 °C, la force d'adhérence par pelage à 180° à partir d'une plaque en acier inoxydable est supérieure ou égale à 20 N/25 mm et un défaut de la composition d'adhésif se produit sous la forme d'un pelage interfacial ; et quand la température de la composition d'adhésif est de 100 °C, la force d'adhérence par pelage à 180° à partir d'une plaque en acier inoxydable est inférieure ou égale à 10 N/25 mm et un défaut de la composition d'adhésif se produit sous la forme d'un pelage interfacial.
PCT/JP2012/005362 2012-08-27 2012-08-27 Composition d'adhésif et bande adhésive pour soudage par laser WO2014033770A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2012/005362 WO2014033770A1 (fr) 2012-08-27 2012-08-27 Composition d'adhésif et bande adhésive pour soudage par laser
KR1020147000652A KR101601565B1 (ko) 2012-08-27 2013-08-27 점착제 조성물 및 레이저 접합용 점착 테이프
PCT/JP2013/005057 WO2014034100A1 (fr) 2012-08-27 2013-08-27 Composition d'adhésif et bande adhésive pour soudage par laser
CN201380002202.3A CN103781869B (zh) 2012-08-27 2013-08-27 黏合剂组合物和激光接合用胶带
JP2014532789A JP6267640B2 (ja) 2012-08-27 2013-08-27 粘着剤組成物及びレーザー接合用粘着テープ

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Application Number Priority Date Filing Date Title
PCT/JP2012/005362 WO2014033770A1 (fr) 2012-08-27 2012-08-27 Composition d'adhésif et bande adhésive pour soudage par laser

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WO2014033770A1 true WO2014033770A1 (fr) 2014-03-06

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JP2017008178A (ja) * 2015-06-19 2017-01-12 Dic株式会社 熱剥離性粘着テープ、情報表示装置及びその解体方法
JP2017014309A (ja) * 2015-06-26 2017-01-19 Dic株式会社 熱剥離性粘着テープ、画像読み取り装置及びその解体方法
JP2017048368A (ja) * 2015-08-31 2017-03-09 日東電工株式会社 粘着シート
WO2017038307A1 (fr) * 2015-08-31 2017-03-09 日東電工株式会社 Feuille adhésive sensible à la pression
KR20210081135A (ko) 2019-12-23 2021-07-01 이상훈 열활성 접착 테이프
KR102452666B1 (ko) 2021-07-28 2022-10-07 주식회사 지오니어 애슬레저 소재용 열활성 접착테이프
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JP2016196567A (ja) * 2015-04-03 2016-11-24 Dic株式会社 易剥離型粘着テープ、電子機器、携帯電子端末及び解体方法
JP2017008178A (ja) * 2015-06-19 2017-01-12 Dic株式会社 熱剥離性粘着テープ、情報表示装置及びその解体方法
JP2017014309A (ja) * 2015-06-26 2017-01-19 Dic株式会社 熱剥離性粘着テープ、画像読み取り装置及びその解体方法
JP2017048368A (ja) * 2015-08-31 2017-03-09 日東電工株式会社 粘着シート
WO2017038307A1 (fr) * 2015-08-31 2017-03-09 日東電工株式会社 Feuille adhésive sensible à la pression
KR20210081135A (ko) 2019-12-23 2021-07-01 이상훈 열활성 접착 테이프
KR102452666B1 (ko) 2021-07-28 2022-10-07 주식회사 지오니어 애슬레저 소재용 열활성 접착테이프
WO2024143055A1 (fr) * 2022-12-28 2024-07-04 日東電工株式会社 Feuille adhésive

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CN103781869B (zh) 2016-12-28
JP6267640B2 (ja) 2018-01-24
KR20140056213A (ko) 2014-05-09
JPWO2014034100A1 (ja) 2016-08-08

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