WO2013161492A1 - 波長カットフィルタ - Google Patents

波長カットフィルタ Download PDF

Info

Publication number
WO2013161492A1
WO2013161492A1 PCT/JP2013/058986 JP2013058986W WO2013161492A1 WO 2013161492 A1 WO2013161492 A1 WO 2013161492A1 JP 2013058986 W JP2013058986 W JP 2013058986W WO 2013161492 A1 WO2013161492 A1 WO 2013161492A1
Authority
WO
WIPO (PCT)
Prior art keywords
cut filter
wavelength
wavelength cut
group
dye
Prior art date
Application number
PCT/JP2013/058986
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
洋介 前田
清水　正晶
Original Assignee
株式会社Adeka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49482826&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2013161492(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 株式会社Adeka filed Critical 株式会社Adeka
Priority to JP2014512430A priority Critical patent/JP6305331B2/ja
Priority to KR1020147012499A priority patent/KR101987926B1/ko
Priority to CN201380003842.6A priority patent/CN103930806B/zh
Publication of WO2013161492A1 publication Critical patent/WO2013161492A1/ja

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/26—Reflecting filters

Definitions

  • the present invention relates to a wavelength cut filter formed by laminating a coating layer containing a dye, a glass substrate, and an infrared reflecting film.
  • the sensitivity of solid-state image sensors ranges from the ultraviolet region to the infrared region of the wavelength of light.
  • human visibility is only in the visible region of the wavelength of light. Therefore, by providing an infrared cut filter between the imaging lens and the solid-state imaging device, the sensitivity of the solid-state imaging device is corrected so as to approach human visibility (see, for example, Patent Documents 1 to 3). .
  • an infrared cut filter is a reflection type filter using a combination of layers containing substances having no absorption characteristics and laminated in multiple layers and utilizing the difference in refractive index, or a light absorber is contained in a transparent substrate, or It was a combined absorption filter.
  • Reflective filters have problems such as changes in color between the center and the periphery of the screen because the characteristics change depending on the incident angle of light. In addition, the reflected light becomes stray light in the optical path, leading to a problem that causes a reduction in resolution, image spots, unevenness, multiple images called ghosts, and the like.
  • the absorption type filter does not change the characteristics depending on the incident angle of light, it needs a considerable thickness in order to obtain the desired characteristics.
  • an object of the present invention is to provide a wavelength cut filter that has low incidence angle dependency, high heat resistance, and can be thinned.
  • the inventor has a coating layer (B) containing a dye on one surface of the glass substrate (A), and an infrared reflective film (on the other surface of the glass substrate (A)).
  • the present inventors have found that a wavelength cut filter characterized by being formed by laminating C) has low incident angle dependency, and has reached the present invention.
  • the present invention has a coating layer (B) containing a dye on one surface of a glass substrate (A) and an infrared reflective film (C) laminated on the other surface of the glass substrate (A).
  • the wavelength cut filter characterized by this is provided.
  • the present invention also provides a solid-state imaging device comprising the wavelength cut filter.
  • the present invention also provides a camera module having the wavelength cut filter.
  • the wavelength cut filter of the present invention is excellent in that the incident angle dependency is low.
  • the wavelength cut filter of the present invention is suitable for a solid-state imaging device and a camera module.
  • wavelength cut filter of the present invention will be described based on preferred embodiments.
  • the wavelength cut filter of the present invention has a coating layer (B) containing a dye on one surface of a glass substrate (A), and an infrared ray on the other surface of the glass substrate (A).
  • the layer structure is formed by laminating the reflective film (C), and the side having the coating layer (B) is the light incident side.
  • each layer will be described in order.
  • the glass substrate (A) used for the wavelength cut filter of the present invention can be used by appropriately selecting from a glass material transparent in the visible range, but soda lime glass, white plate glass, borosilicate glass, tempered glass, Quartz glass, phosphate glass, and the like can be used. Among them, soda lime glass is preferable because it is inexpensive and easily available, and white plate glass, borosilicate glass, and tempered glass are easily available and have high hardness and high workability. It is preferable because it is excellent.
  • the coating liquid is applied to form a coating layer (B) containing a dye described later, and then the dye after drying the coating liquid Adhesiveness to the glass substrate of the coating layer (B) containing bismuth increases.
  • silane coupling agent examples include epoxy-functional alkoxysilanes such as ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, and ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane.
  • Amino-functional alkoxysilanes such as N- ⁇ (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxy Examples include mercapto functional alkoxysilanes such as silane.
  • the thickness of the glass substrate (A) is not particularly limited, but is preferably 0.05 to 8 mm, and more preferably 0.05 to 1 mm from the viewpoint of weight reduction and strength.
  • the substrate is a glass plate, it can be directly coated on the substrate, dried and then cut, and the structure and process are simplified. Moreover, since a board
  • substrate is a glass plate, heat resistance (260 degreeC reflow tolerance) is higher than the case where it is a plastic.
  • the coating layer (B) containing a dye used in the wavelength cut filter of the present invention is prepared by dissolving or dispersing a dye, a resin, and other components to be blended as necessary in a suitable solvent to prepare a coating solution. It can form by apply
  • Application methods include spin coating, dip coating, spray coating, bead coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating, die coating, and hopper. Examples include the extrusion coating method.
  • the dye is not particularly limited, and known dyes can be used.
  • oxazole and oxadiazole compounds coumarin compounds, quinolinol compounds, phthalocyanine compounds, naphtholactam compounds, fluorenes and derivatives thereof, anthracene and derivatives thereof, xanthene compounds ( (Pyronine, rhodamine, fluorescein), stilbene compounds, cyanine compounds, azo compounds, azomethine compounds, indigo compounds, thioindigo compounds, oxonol compounds, squarylium compounds, indole compounds, styryl compounds, porphine compounds, azurenium compounds, croconic methine compounds , Pyrylium compounds, thiopyrylium compounds, triarylmethane compounds, diphenylmethane compounds, tetrahydrocholine compounds, And phenol compounds, anthraquinone compounds, naphthoquinone compounds, thiazin
  • acidic dyes such as xanthene compounds, phthalocyanine compounds, cyanine compounds, azo compounds, oxonol compounds, and anthraquinone compounds are preferable from the viewpoint of solubility.
  • acid dyes a cyanine compound is more preferable from the viewpoint of ease of synthesis and molecular design.
  • Examples of the cyanine compound include those represented by the following general formula (1).
  • A represents a group selected from (a) to (m) of the following group I
  • a ′ represents a group selected from (a ′) to (m ′) of the following group II
  • Q represents a methine chain having 1 to 9 carbon atoms, and represents a linking group that may contain a ring structure in the chain, and the hydrogen atom in the methine chain is a hydroxyl group, a halogen atom, a cyano group, —NRR ′, aryl Group, an arylalkyl group or an alkyl group, and the —NRR ′, aryl group, arylalkyl group and alkyl group may be further substituted with a hydroxyl group, a halogen atom, a cyano group or —NRR ′.
  • R and R ′ represent an aryl group, an arylalkyl group or an alkyl group, An q ⁇ represents a q-valent anion, q represents 1 or 2, and p represents a coefficient for keeping the charge neutral.
  • R 1 and R 1 ′ are a hydroxyl group, a halogen atom, a nitro group, a cyano group, —SO 3 H, a carboxyl group, an amino group, an amide group, a ferrocenyl group, an aryl group having 6 to 30 carbon atoms, or a carbon atom number of 7 Represents an arylalkyl group of ⁇ 30 or an alkyl group of 1 to 8 carbon atoms,
  • the aryl group having 6 to 30 carbon atoms, the arylalkyl group having 7 to 30 carbon atoms and the alkyl group having 1 to 8 carbon atoms in the above R 1 and R 1 ′ are a hydroxyl group, a halogen atom, a nitro group, a cyano group
  • R 2 to R 9 and R 2 ′ to R 9 ′ represent the same group or hydrogen atom as R 1 and R 1 ′
  • X and X ′ represent an oxygen atom, a sulfur atom, a selenium atom, —CR 51 R 52 —, a cycloalkane-1,1-diyl group having 3 to 6 carbon atoms, —NH— or —NY 2 —
  • R 51 and R 52 represent the same group or hydrogen atom as R 1 and R 1 ′
  • Y, Y ′ and Y 2 are each a hydrogen atom, or a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, —SO 3 H or a nitro group, which may be substituted with 1 carbon atom.
  • the methylene group in the alkyl group having 1 to 8 carbon atoms, the aryl group having 6 to 30 carbon atoms and the arylalkyl group having 7 to 30 carbon atoms in the above Y, Y ′ and Y 2 is —O—, Even when interrupted by —S—, —CO—, —COO—, —OCO—, —SO 2 —, —NH—, —CONH—, —NHCO—, —N ⁇ CH— or —CH ⁇ CH—.
  • r and r ′ are 0 or (a) to (e), (g) to (j), (l), (m), (a ′) to (e ′), (g ′) to (j ′) ), (L ′) and (m ′) represent the number that can be substituted. )
  • Examples of the halogen atom represented by R 51 and R 52 in R 1 to R 9 and R 1 ′ to R 9 ′ and X and X ′ in the general formula (1) include fluorine, chlorine, bromine and iodine.
  • Examples of the aryl group having 6 to 30 carbon atoms include phenyl, naphthyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 4-vinylphenyl, 3-iso-propylphenyl, 4-iso-propylphenyl, 4-butylphenyl, 4-iso-butylphenyl, 4-tert-butylphenyl, 4-hexylphenyl, 4-cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) phenyl, 4-stearylphenyl, 2, 3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-
  • Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-amyl, tert-amyl, hexyl, 2- Examples include hexyl, 3-hexyl, cyclohexyl, 1-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, 1-octyl, iso-octyl, tert-octyl and the like.
  • the aryl group having 6 to 30 carbon atoms, the arylalkyl group having 7 to 30 carbon atoms and the alkyl group having 1 to 8 carbon atoms are a hydroxyl group, a halogen atom, a nitro group, a cyano group, —SO 3 H, carboxyl Group, amino group, amido group or ferrocenyl group, which may be substituted, —O—, —S—, —CO—, —COO—, —OCO—, —SO 2 —, —NH—, —CONH— , —NHCO—, —N ⁇ CH— or —CH ⁇ CH—, and the number and position of these substitutions and interruptions are arbitrary.
  • examples of the group in which the alkyl group having 1 to 8 carbon atoms is substituted with a halogen atom include chloromethyl, dichloromethyl, trichloromethyl, fluoromethyl, difluoromethyl, trifluoromethyl, nonafluorobutyl and the like.
  • Examples of the group in which the alkyl group having 1 to 8 carbon atoms is interrupted by —O— include methyloxy, ethyloxy, iso-propyloxy, propyloxy, butyloxy, pentyloxy, iso-pentyloxy, hexyloxy, heptyl Alkoxy groups such as oxy, octyloxy, 2-ethylhexyloxy, 2-methoxyethyl, 2- (2-methoxy) ethoxyethyl, 2-ethoxyethyl, 2-butoxyethyl, 4-methoxybutyl, 3-methoxybutyl, etc.
  • alkoxyalkyl group of Examples of the group in which the alkyl group having 1 to 8 carbon atoms is substituted with a halogen atom and interrupted by —O— include, for example, chloromethyloxy, dichloromethyloxy, trichloromethyloxy, fluoromethyloxy, difluoromethyloxy , Trifluoromethyloxy, nonafluorobutyloxy and the like.
  • the cycloalkane-1,1-diyl group having 3 to 6 carbon atoms represented by X and X ′ is cyclopropane-1,1-diyl, cyclobutane-1,1- Examples thereof include diyl, 2,4-dimethylcyclobutane-1,1-diyl, 3,3-dimethylcyclobutane-1,1-diyl, cyclopentane-1,1-diyl, cyclohexane-1,1-diyl and the like.
  • a halogen atom represented by Y, Y ′ and Y 2 an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms and an aryl having 7 to 30 carbon atoms
  • alkyl group examples include groups exemplified in the description of R 1 and the like.
  • the hydrogen atom in these substituents is a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group,- Any number of SO 3 H or nitro groups may be substituted.
  • alkyl group, the aryl group and the methylene group in the arylalkyl group in Y, Y ′, and Y 2 are —O—, —S—, —CO—, —COO—, —OCO—, —SO. It may be interrupted with 2 —, —NH—, —CONH—, —NHCO—, —N ⁇ CH— or —CH ⁇ CH—.
  • ether bonds are interrupted by ether bonds, thioether bonds, etc.
  • ether bonds such as 2-methoxye 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-phenoxyethyl, 3-phenoxypropyl, 2-methylthioethyl, 2-phenylthio And ethyl.
  • Examples of the linking group constituting the methine chain having 1 to 9 carbon atoms represented by Q in the general formula (1) and including a ring structure in the chain include the following (Q-1) to (Q-11):
  • the group represented by any of the above is preferable because it is easy to produce.
  • the number of carbon atoms in the methine chain having 1 to 9 carbon atoms is the carbon atom of the methine chain or a group that further substitutes the ring structure contained in the methine chain (for example, linking groups (Q-1) to (Q-11). ), Carbon atoms at both ends in Z), or when Z 14 or R 14 to R 19 contain a carbon atom, are not included.
  • R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and Z ′ are each independently a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, —NRR ′, an aryl group, an arylalkyl
  • the —NRR ′, aryl group, arylalkyl group and alkyl group may be substituted with a hydroxyl group, a halogen atom, a cyano group or —NRR ′, and —O—, —S—, May be interrupted by —CO—, —COO—, —OCO—, —SO 2 —, —NH—, —CONH—, —NHCO—, —N ⁇ CH— or —CH ⁇ CH—, R and R ′ represent an aryl group, an arylalkyl group or an alkyl group.
  • Examples of the halogen atom, aryl group, arylalkyl or alkyl group represented by R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and Z ′ include those exemplified in the description of R 1 and the like.
  • Examples of the aryl group, arylalkyl group or alkyl group represented by R and R ′ those exemplified in the description of R 1 and the like can be mentioned.
  • Examples of the q-valent anion represented by pAn q- in the general formula (1) include methanesulfonate anion, dodecylsulfonate anion, benzenesulfonate anion, toluenesulfonate anion, trifluoromethanesulfonate anion, naphthalenesulfone. Acid anion, diphenylamine-4-sulfonate anion, 2-amino-4-methyl-5-chlorobenzenesulfonate anion, 2-amino-5-nitrobenzenesulfonate anion, JP-A-10-235999, JP-A-10-337959, Japanese Laid-Open Patent Publication No.
  • cyanine compound used in the present invention include the following compound No. 1-102. In the following examples, cyanine cations without anions are shown.
  • the production method of the cyanine compound is not particularly limited, and can be obtained by a method using a well-known general reaction.
  • a compound having a corresponding structure such as a route described in JP2010-209191A And a method of synthesis by reaction with an imine derivative.
  • the dye used in the present invention preferably has a maximum absorption wavelength ( ⁇ max) of the coating film of 650 to 1200 nm, and more preferably 650 to 900 nm.
  • ⁇ max maximum absorption wavelength of the coating film
  • the maximum absorption wavelength ( ⁇ max) of the coating film is 1200 nm or more of the present invention, the effect of the present invention is not exhibited, and when it is less than 650 nm, visible light is absorbed.
  • the content of the dye is single or a total of a plurality of types, preferably 0.01 to 50% by mass, more preferably 0.1%. ⁇ 30% by mass. When the content of the dye is less than 0.01% by mass, sufficient characteristics may not be obtained. When the content is more than 50% by mass, the dye may precipitate in the coating layer.
  • the content of the dye alone or in total of a plurality of types is preferably 0.01 to 10.0 parts by mass with respect to 100 parts by mass of the resin solid content, More preferably, it is 0.25 to 5.0 parts by mass.
  • the resin examples include natural polymer materials such as gelatin, casein, starch, cellulose derivatives, and alginic acid, or polymethyl methacrylate, polyvinyl butyral, polyvinyl pyrrolidone, polyvinyl alcohol, polyvinyl chloride, styrene-butadiene copolymer, polystyrene, Synthetic polymer materials such as polycarbonate and polyamide are used.
  • natural polymer materials such as gelatin, casein, starch, cellulose derivatives, and alginic acid, or polymethyl methacrylate
  • polyvinyl butyral polyvinyl pyrrolidone
  • polyvinyl alcohol polyvinyl chloride
  • styrene-butadiene copolymer polystyrene
  • Synthetic polymer materials such as polycarbonate and polyamide are used.
  • benzotriazole, triazine, and benzoate UV absorbers include benzotriazole, triazine, and benzoate UV absorbers; phenol, phosphorus, and sulfur antioxidants; cationic surfactants and anionic surfactants Agents, nonionic surfactants, amphoteric surfactants, etc .; halogen compounds, phosphate ester compounds, phosphate amide compounds, melamine compounds, fluororesins or metal oxides, (poly) phosphorus Flame retardants such as melamine acid, piperazine phosphate (poly); hydrocarbon-based, fatty acid-based, aliphatic alcohol-based, aliphatic ester-based, aliphatic amide-based or metal soap-based lubricants; fumed silica, fine particle silica, silica Stone, diatomaceous earth, clay, kaolin, diatomaceous earth, silica gel, calcium silicate, sericite, kaolinite, flint, feldspar
  • the solvent is not particularly limited and various known solvents can be used as appropriate. Examples thereof include alcohols such as isopropanol; ether alcohols such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, and butyl diglycol; acetone, Ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and diacetone alcohol; esters such as ethyl acetate, butyl acetate and methoxyethyl acetate; acrylic acid esters such as ethyl acrylate and butyl acrylate; Fluorinated alcohols such as 3-tetrafluoropropanol; hydrocarbons such as hexane, benzene, toluene, xylene; chlorinated hydrocarbons such as methylene dichloride, dichloroethane, and chloroform. These organic solvents can be used alone or in combination.
  • the thickness of the coating layer (B) containing the dye is preferably 1 to 200 ⁇ m because a uniform film can be obtained and it is advantageous for thinning. If the thickness is less than 1 ⁇ m, the function cannot be sufficiently exhibited, and if it exceeds 200 ⁇ m, the solvent may remain during coating.
  • the infrared reflective film (C) used in the cut filter of the present invention has a function of blocking light in a wavelength region of 700 to 1200 nm, and a low refractive index layer and a high refractive index layer are alternately laminated. It is formed of a dielectric multilayer film.
  • a material constituting the low refractive index layer a material having a refractive index of 1.2 to 1.6 can be used.
  • silica, alumina, lanthanum fluoride, magnesium fluoride, aluminum hexafluoride sodium, etc. can be mentioned.
  • a material having a refractive index of 1.7 to 2.5 can be used as the material constituting the high refractive index layer.
  • the method for laminating the low refractive index layer and the high refractive index layer is not particularly limited as long as a dielectric multilayer film in which these layers are laminated is formed.
  • a CVD method a sputtering method on a glass substrate.
  • the number of laminated layers is 10 to 80, and 25 to 50 is preferable from the viewpoint of process and strength.
  • the thickness of the low refractive index layer and the high refractive index layer is usually 1/10 to 1/2 of the wavelength ⁇ (nm) of the light beam to be blocked.
  • the thickness is less than 0.1 ⁇ or greater than 0.5 ⁇ , the product (nd) of the refractive index (n) and the physical film thickness (d) is significantly different from the optical film thickness expressed as a multiple of ⁇ / 4. There is a risk that the wavelength cannot be blocked or transmitted.
  • the infrared reflective film (C) in addition to the above dielectric multilayer film, a film containing a dye having a maximum absorption wavelength of 700 to 1100 nm, a film in which a polymer is laminated, or a film formed by applying a cholesteric liquid crystal
  • a film containing a dye having a maximum absorption wavelength of 700 to 1100 nm, a film in which a polymer is laminated, or a film formed by applying a cholesteric liquid crystal The thing using organic materials, such as these, can also be used.
  • the wavelength cut filter of the present invention preferably has a transmittance satisfying the following (i) to (iii).
  • the upper transmittance was measured with an ultraviolet-visible near-infrared spectrophotometer V-570 manufactured by JASCO Corporation.
  • V-570 ultraviolet-visible near-infrared spectrophotometer manufactured by JASCO Corporation.
  • the average transmittance when measured from the vertical direction of the wavelength cut filter is 75% or more.
  • the average transmittance when measured from the vertical direction of the wavelength cut filter is 5% or less.
  • the wavelength value (Ya) at which the transmittance is 80% when measured from the vertical direction of the wavelength cut filter, and an angle of 35 ° with respect to the vertical direction of the wavelength cut filter The absolute value of the difference in wavelength value (Yb) at which the transmittance is 80% when measured from is 30 nm or less.
  • the wavelength cut filter if the average value of the transmittance in the wavelength range of 430 to 580 nm of (i) is less than 75%, light in the visible light region is hardly transmitted, and the wavelength 800 of (ii) above.
  • a heat ray cut filter mounted on a window glass of an automobile or a building; a digital still camera, a digital video camera, a surveillance camera, an in-vehicle camera, a web camera, a mobile phone
  • a solid-state imaging device such as a CCD or CMOS
  • a solid-state imaging device such as a camera
  • an automatic exposure meter a display device
  • a plasma display such as a plasma display.
  • the solid-state imaging device of the present invention is configured in the same manner as a conventionally known solid-state imaging device except that the wavelength cut filter of the present invention is provided on the front surface of the imaging element.
  • the wavelength cut filter 1 of the present invention may be fixed to a part other than the solid-state image sensor on the light incident side of the solid-state image sensor 2, or as shown in FIG. It may be fixed directly to the front of the.
  • an optical low-pass filter In the solid-state imaging device of the present invention, an optical low-pass filter, an antireflection filter, a color filter, and the like can be arranged as necessary, and the order of stacking these is not particularly limited.
  • FIG. 2 is a cross-sectional view showing an embodiment of the configuration of a camera module that is one of the solid-state imaging devices of the present invention.
  • the camera module includes a solid-state imaging device 2 formed in a rectangular shape in plan view on a semiconductor substrate, and a coating layer (B) / glass substrate containing a dye from the light incident side on the opposite side of the light-receiving unit 3 of the solid-state imaging device 2 (A)
  • the wavelength cut filter 1 laminated in the order of the infrared reflective film (C) and the solid-state image sensor 2 are formed in a region excluding the light-receiving unit 3 on one surface, and the solid-state image sensor 2 and the wavelength cut filter 1 are bonded.
  • a camera module which is a solid-state imaging device, takes in light from the outside through the wavelength cut filter 1 and receives the light with a light-receiving element disposed in the light-receiving unit 3 of the solid-state imaging element 2.
  • a UV curable adhesive such as an acrylic resin or an epoxy resin, or a thermosetting resin can be used.
  • a known photolithography may be used as necessary.
  • the adhesive 4 is patterned using a technique and bonded by thermosetting. When joining, vacuum pressurization may be performed after bonding in a vacuum environment.
  • the mounting substrate 8 is a rigid substrate using a glass epoxy substrate, a ceramic substrate, or the like, and is provided with a control circuit for controlling the solid-state imaging device 2.
  • the solid-state imaging device 2 is disposed on the mounting substrate 8, and then the adhesive 4 is applied in advance to a position where the lens holder 7 of the mounting substrate 8 is fixed.
  • the lens cap 6 protects the lens 5.
  • the lens holder 7 holds the lens 5, and is attached to the mounting substrate 8 to cover the solid-state imaging device 2.
  • a box-shaped base portion 7 a and a cylindrical lens barrel portion 7 b that holds the lens 5 are provided. It has.
  • the lens holder 7 is disposed on the mounting substrate 8 so that the lower end surface of the lens holder 7 is in contact with the applied adhesive 4, and the light receiving unit 3 of the solid-state imaging device 2 and the lens 5 in the lens holder 7 are arranged.
  • the position of the lens holder 7 is adjusted such that the distance of the lens 5 coincides with the focal length of the lens 5.
  • the adhesive 4 can be irradiated with ultraviolet rays to cure the adhesive 4, and a camera module can be manufactured.
  • the entire mounting substrate 8 to which the lens holder 7 is fixed may be heated at about 85 ° C. and the adhesive 4 may be sufficiently cured by thermal curing.
  • the camera module manufacturing method includes a step of heating the entire mounting substrate 8 after the step of irradiating ultraviolet rays, the lens holder 7, the lens 5 and the wavelength cut filter 1 are all materials having high heat resistance. Is required. Specifically, in addition to heating for thermosetting the adhesive 4 as described above, a plurality of solders disposed on the lower surface of the mounting substrate 8 are heated and melted at about 260 ° C. to be soldered to other substrates. For this reason, it is desirable that the material is made of a material having reflow resistance.
  • Production Examples 1 to 11 show preparation examples of coating solutions for forming the coating layer (B) containing the dye used in the wavelength cut filter of the present invention, and Comparative Production Examples 2 to 4 show comparative wavelengths. Examples of preparation of a comparative coating solution for forming a coating layer (B) containing a dye used for a cut filter are shown. Examples 1 to 11 show examples of production of the wavelength cut filter of the present invention. 1 to 4 show comparative wavelength cut filter manufacturing examples. In evaluation examples 1 to 11, the wavelength cut filters of the present invention manufactured in Examples 1 to 11 were evaluated, and in comparative evaluation examples 1 to 4, comparisons were made. The comparative wavelength cut filters produced in Examples 1-4 were evaluated.
  • the wavelength cut filter of Comparative Example 1 having no dye-containing coating layer (B) has a high incident angle dependency and has an infrared reflection film (C).
  • the wavelength cut filters of Comparative Examples 2 to 4 have low incident angle dependency, the transmittance is low in the wavelength range of 430 to 580 nm or high in the wavelength range of 800 to 1000 nm, that is, in the visible light region. Since light is not transmitted and light is not cut in the infrared region, the sensitivity cannot be corrected to approach human visibility.
  • the wavelength cut filter of the present invention has high transmittance in the wavelength range of 430 to 580 nm, low transmittance in the wavelength range of 800 to 1000 nm, and low incident angle dependency.
  • the glass substrate (A) has a coating layer (B) containing a dye on one surface, and the infrared reflection film (C) is laminated on the other surface of the glass substrate (A).
  • the wavelength cut filter according to the present invention which is characterized by this, has low incident angle dependency. Therefore, the wavelength cut filter of the present invention is useful for a solid-state imaging device and a camera module.
PCT/JP2013/058986 2012-04-25 2013-03-27 波長カットフィルタ WO2013161492A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014512430A JP6305331B2 (ja) 2012-04-25 2013-03-27 波長カットフィルタ
KR1020147012499A KR101987926B1 (ko) 2012-04-25 2013-03-27 파장 컷 필터
CN201380003842.6A CN103930806B (zh) 2012-04-25 2013-03-27 波长截止滤光器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-100275 2012-04-25
JP2012100275 2012-04-25

Publications (1)

Publication Number Publication Date
WO2013161492A1 true WO2013161492A1 (ja) 2013-10-31

Family

ID=49482826

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/058986 WO2013161492A1 (ja) 2012-04-25 2013-03-27 波長カットフィルタ

Country Status (5)

Country Link
JP (1) JP6305331B2 (ko)
KR (1) KR101987926B1 (ko)
CN (1) CN103930806B (ko)
TW (1) TWI634352B (ko)
WO (1) WO2013161492A1 (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015203863A (ja) * 2014-04-16 2015-11-16 ソニー株式会社 撮像素子及び撮像装置
CN105593712A (zh) * 2013-12-26 2016-05-18 旭硝子株式会社 滤光器
JP2016162946A (ja) * 2015-03-04 2016-09-05 Jsr株式会社 固体撮像装置
WO2017022708A1 (ja) * 2015-08-06 2017-02-09 株式会社Adeka 熱反応性組成物
JP2019086771A (ja) * 2017-11-01 2019-06-06 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 光学フィルターとこれを含むカメラモジュール及び電子装置
US10598834B2 (en) 2015-12-01 2020-03-24 AGC Inc. Near-infrared light blocking optical filter having high visible light transmission and an imaging device using the optical filter
US11059977B2 (en) 2016-02-02 2021-07-13 AGC Inc. Near-infrared-absorbing dye, optical filter, and imaging device
WO2022181422A1 (ja) * 2021-02-26 2022-09-01 Ａｇｃ株式会社 光学フィルタ

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6312241B2 (ja) * 2014-03-19 2018-04-18 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 透明基板
CN111665583B (zh) * 2015-05-12 2022-03-15 Ａｇｃ株式会社 近红外线吸收色素和吸收层
JP6642313B2 (ja) * 2015-07-28 2020-02-05 Jsr株式会社 新規シアニン化合物、光学フィルターおよび光学フィルターを用いた装置
JP6619627B2 (ja) * 2015-11-20 2019-12-11 株式会社Adeka 着色組成物
WO2017094672A1 (ja) * 2015-11-30 2017-06-08 Jsr株式会社 光学フィルター、環境光センサーおよびセンサーモジュール
CN108496098B (zh) * 2016-01-21 2021-12-07 3M创新有限公司 光学掩蔽滤光器
US11269121B2 (en) 2016-01-21 2022-03-08 3M Innovative Properties Company Optical camouflage filters
WO2017213047A1 (ja) * 2016-06-08 2017-12-14 Jsr株式会社 光学フィルターおよび光学センサー装置
CN109923447B (zh) * 2016-11-14 2021-03-30 日本板硝子株式会社 光吸收性组合物及滤光器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008009142A (ja) * 2006-06-29 2008-01-17 Dainippon Printing Co Ltd 複合フィルタ
JP2012032454A (ja) * 2010-07-28 2012-02-16 Fujifilm Corp 赤外線反射膜

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049419A (en) * 1998-01-13 2000-04-11 3M Innovative Properties Co Multilayer infrared reflecting optical body
JP4412867B2 (ja) 2000-07-06 2010-02-10 富士フイルム株式会社 光学フィルター
US6929864B2 (en) * 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
JP2004133174A (ja) 2002-10-10 2004-04-30 Mitsubishi Chemicals Corp 光学フィルター
JP2004354735A (ja) 2003-05-29 2004-12-16 Daishinku Corp 光線カットフィルタ
CN1989208B (zh) * 2004-09-28 2011-12-14 株式会社艾迪科 花青化合物、滤光器和光学记录材料
JP2006106570A (ja) * 2004-10-08 2006-04-20 Adl:Kk 光吸収フィルター
JP2008051985A (ja) * 2006-08-24 2008-03-06 Nidec Copal Corp 近赤外線吸収フィルタ
JP4752792B2 (ja) * 2007-02-28 2011-08-17 ブラザー工業株式会社 画像記録装置
JP2008250022A (ja) * 2007-03-30 2008-10-16 Adeka Corp 光学フィルター
JP5489669B2 (ja) * 2008-11-28 2014-05-14 Ｊｓｒ株式会社 近赤外線カットフィルターおよび近赤外線カットフィルターを用いた装置
KR101676384B1 (ko) * 2008-12-25 2016-11-15 가부시키가이샤 아데카 시아닌 화합물을 이용한 근적외선 흡수재료 및 시아닌 화합물
JP2011213969A (ja) * 2009-04-14 2011-10-27 Nippon Shokubai Co Ltd 近赤外線吸収粘着剤組成物
US8699651B2 (en) * 2009-04-15 2014-04-15 Ge-Hitachi Nuclear Energy Americas Llc Method and system for simultaneous irradiation and elution capsule
JP5454111B2 (ja) 2009-12-07 2014-03-26 旭硝子株式会社 近赤外線カットフィルタおよび撮像装置・表示装置
JP5810604B2 (ja) * 2010-05-26 2015-11-11 Jsr株式会社 近赤外線カットフィルターおよび近赤外線カットフィルターを用いた装置
JP5936299B2 (ja) * 2010-11-08 2016-06-22 Jsr株式会社 近赤外線カットフィルター、およびそれを備える固体撮像素子ならびに固体撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008009142A (ja) * 2006-06-29 2008-01-17 Dainippon Printing Co Ltd 複合フィルタ
JP2012032454A (ja) * 2010-07-28 2012-02-16 Fujifilm Corp 赤外線反射膜

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105593712A (zh) * 2013-12-26 2016-05-18 旭硝子株式会社 滤光器
JP2015203863A (ja) * 2014-04-16 2015-11-16 ソニー株式会社 撮像素子及び撮像装置
US10317593B2 (en) 2014-04-16 2019-06-11 Sony Corporation Image device and imaging apparatus
JP2016162946A (ja) * 2015-03-04 2016-09-05 Jsr株式会社 固体撮像装置
WO2017022708A1 (ja) * 2015-08-06 2017-02-09 株式会社Adeka 熱反応性組成物
JPWO2017022708A1 (ja) * 2015-08-06 2018-05-24 株式会社Adeka 熱反応性組成物
US10598834B2 (en) 2015-12-01 2020-03-24 AGC Inc. Near-infrared light blocking optical filter having high visible light transmission and an imaging device using the optical filter
US11059977B2 (en) 2016-02-02 2021-07-13 AGC Inc. Near-infrared-absorbing dye, optical filter, and imaging device
JP2019086771A (ja) * 2017-11-01 2019-06-06 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 光学フィルターとこれを含むカメラモジュール及び電子装置
JP7158243B2 (ja) 2017-11-01 2022-10-21 三星電子株式会社 光学フィルターとこれを含むカメラモジュール及び電子装置
US11719867B2 (en) 2017-11-01 2023-08-08 Samsung Electronics Co., Ltd. Optical filter, and camera module and electronic device comprising the same
WO2022181422A1 (ja) * 2021-02-26 2022-09-01 Ａｇｃ株式会社 光学フィルタ

Also Published As

Publication number Publication date
CN103930806B (zh) 2016-11-23
TW201346350A (zh) 2013-11-16
JPWO2013161492A1 (ja) 2015-12-24
KR101987926B1 (ko) 2019-06-11
CN103930806A (zh) 2014-07-16
KR20150003712A (ko) 2015-01-09
JP6305331B2 (ja) 2018-04-04
TWI634352B (zh) 2018-09-01

Similar Documents

Publication Publication Date Title
JP6305331B2 (ja) 波長カットフィルタ
JP2014126642A (ja) 波長カットフィルタ
JP5535664B2 (ja) 色調補正剤、スクアリリウム化合物及び光学フィルター
JP6020746B2 (ja) 光学フィルタ
CN106062592B (zh) 近红外线截止滤波器和摄像装置
CN105122095B (zh) 红外线遮蔽滤波器、固体摄像元件、摄像装置和显示装置
KR101832114B1 (ko) 광학 필터 및 촬상 장치
JP2016090781A (ja) 波長カットフィルタ
KR101676384B1 (ko) 시아닌 화합물을 이용한 근적외선 흡수재료 및 시아닌 화합물
CN103608705A (zh) 滤光片、固体摄像元件、摄像装置用透镜和摄像装置
CN111936896B (zh) 滤光片和信息获取装置
CN106023822A (zh) Oled显示装置以及其制造方法
JP2019168611A (ja) 光学フィルタ
JP2008250022A (ja) 光学フィルター
WO2019189072A1 (ja) 光学フィルターおよびその用途
JP6908522B2 (ja) 熱反応性組成物
CN108419438B (zh) 着色组合物
JP2007256717A (ja) 光学フィルター
WO2019151348A1 (ja) 光学フィルタおよび撮像装置
US20230258853A1 (en) Optical filter
TWI444435B (zh) Anthocyanin compounds and filters using the compounds

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13781891

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2014512430

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20147012499

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13781891

Country of ref document: EP

Kind code of ref document: A1