WO2013150867A1 - 半導体デバイス - Google Patents

半導体デバイス Download PDF

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Publication number
WO2013150867A1
WO2013150867A1 PCT/JP2013/056828 JP2013056828W WO2013150867A1 WO 2013150867 A1 WO2013150867 A1 WO 2013150867A1 JP 2013056828 W JP2013056828 W JP 2013056828W WO 2013150867 A1 WO2013150867 A1 WO 2013150867A1
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WIPO (PCT)
Prior art keywords
semiconductor device
wiring
semiconductor chip
semiconductor
lead
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PCT/JP2013/056828
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English (en)
French (fr)
Inventor
浩史 野津
貴弘 杉村
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住友電気工業株式会社
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Publication of WO2013150867A1 publication Critical patent/WO2013150867A1/ja

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Definitions

  • the present invention relates to a semiconductor device.
  • Non-Patent Document 1 As examples of semiconductor devices, case-type semiconductor devices and resin-encapsulated semiconductor devices are known (see Non-Patent Document 1). In such a semiconductor device, a semiconductor chip mounted on a die pad is connected to an electrode terminal via a wire.
  • the semiconductor chip may be connected to the source electrode terminal via a plurality of thin wires instead of a single thick wire.
  • the end portions of the plurality of wires can be distributed and arranged in the source electrode pads provided on the surface of the semiconductor chip, it is possible to suppress local concentration of current on the surface of the semiconductor chip. Further, the load applied to the semiconductor chip by ultrasonic waves or pressure during wire bonding can be dispersed on the surface of the semiconductor chip.
  • An object of the present invention is to provide a semiconductor device in which wirings for connecting a semiconductor chip to electrode terminals are unlikely to contact each other.
  • a semiconductor device includes a semiconductor chip, a die pad having a chip mounting surface on which the semiconductor chip is mounted, and electrode terminals connected to the semiconductor chip via first and second wirings.
  • the electrode terminal has a first surface including a connection point with the first wiring, and a second surface including a connection point with the second wiring, and the first terminal
  • a connection point with the second wiring is located at a first height from a reference plane extending from the chip mounting surface, and a connection point with the second wiring is different from the first height from the reference plane. Located at the second height.
  • the height of the connection point with the first wiring is different from the height of the connection point with the second wiring. For this reason, compared with the case where the height of a connection point is the same, the distance between the 1st and 2nd wiring in a height direction can be enlarged. Therefore, a semiconductor device in which the first wiring and the second wiring are difficult to contact can be obtained.
  • the electrode terminal may have a step portion provided between the first surface and the second surface.
  • both the first and second surfaces can be arranged parallel to the reference plane.
  • the first and second wirings can be easily connected to the first and second surfaces, respectively.
  • the material of the semiconductor chip may include a wide band gap semiconductor.
  • silicon allows only a small current to flow through a semiconductor chip, it is not necessary to use a large number of wirings.
  • the current flowing through the semiconductor chip is larger than that in silicon, so that there is a high need to increase the number of wirings in order to suppress current concentration.
  • the wide band gap semiconductor it is difficult to increase the size of the semiconductor chip due to the manufacturing yield lower than that of silicon. For this reason, in the wide band gap semiconductor, a large number of wirings are connected to a small semiconductor chip. Therefore, in wide band gap semiconductors, it is particularly important to avoid contact between wirings.
  • the semiconductor device may further include a case for accommodating the semiconductor chip and the die pad, and the electrode terminal may be attached to the case.
  • FIG. 1 is a plan view schematically showing a semiconductor device according to a first embodiment. It is a figure which shows typically a part of semiconductor device seen from the X direction of FIG. It is a figure which shows typically a part of semiconductor device for a reference. It is a figure which shows typically a part of semiconductor device which concerns on 2nd Embodiment. It is a figure which shows typically a part of semiconductor device which concerns on 3rd Embodiment. It is a figure which shows typically a part of semiconductor device which concerns on 4th Embodiment. It is a figure which shows typically the semiconductor device which concerns on 5th Embodiment.
  • FIG. 1 is a plan view schematically showing the semiconductor device according to the first embodiment.
  • FIG. 1 shows an XYZ orthogonal coordinate system.
  • FIG. 2 is a diagram schematically showing a part of the semiconductor device viewed from the X direction of FIG.
  • a semiconductor device 10 shown in FIGS. 1 and 2 is a resin-encapsulated semiconductor device.
  • the semiconductor device 10 includes a die pad 12, a semiconductor chip (or a semiconductor element) 14, and leads 20 as electrode terminals.
  • the semiconductor device 10 may include leads 16 and 18 as other electrode terminals.
  • the leads 16, 18, and 20 are arranged along the X direction.
  • the lead 16 is located between the leads 18 and 20.
  • the leads 16, 18, 20 and the die pad 12 may constitute a lead frame.
  • the semiconductor device 10 is a power semiconductor device used for a power source or the like, for example.
  • An example of the package form of the semiconductor device 10 is a general TO series. Examples of TO series include TO-247, TO-220, TO-263 (D2-PAK), and TO-252 (D-PAK).
  • the die pad 12 has a chip mounting surface 12a on which the semiconductor chip 14 is mounted.
  • the die pad 12 can be electrically connected to the semiconductor chip 14.
  • the die pad 12 has a plate shape, for example.
  • the chip mounting surface 12a is, for example, a rectangle.
  • Examples of the material of the die pad 12 include metals such as copper (Cu) and a copper alloy.
  • a through-hole 26 that penetrates the die pad 12 in the thickness direction can be formed in the die pad 12.
  • the through hole 26 is a hole through which a screw is passed when the semiconductor device 10 is fixed to another member by, for example, a screw.
  • the semiconductor chip 14 is mounted at a predetermined position on the chip mounting surface 12a.
  • Examples of the semiconductor chip 14 include transistors such as bipolar transistors, MOS-FETs, insulated gate bipolar transistors (IGBTs), and diodes.
  • the semiconductor chip 14 can be mounted on the chip mounting surface 12a via an adhesive layer 32 made of a material containing lead-containing metal solder, lead-free metal solder, conductive resin, or the like.
  • Examples of the material of the semiconductor chip 14 include a wide band gap semiconductor, silicon and other semiconductors.
  • a wide band gap semiconductor has a band gap larger than that of silicon. Examples of wide band gap semiconductors include silicon carbide (SiC), gallium nitride (GaN), and diamond.
  • the inner end of the lead 16 is mechanically and integrally connected to the die pad 12. Since the die pad 12 has conductivity, the lead 16 and the die pad 12 are electrically connected. Examples of the material of the lead 16 include the same material as that of the die pad 12.
  • the lead 18 is connected to the semiconductor chip 14 via the wiring 30.
  • One end of the wiring 30 is connected to the electrode pad GP of the semiconductor chip 14.
  • the other end of the wiring 30 is connected to the inner end of the lead 18.
  • the lead 20 is connected to the semiconductor chip 14 via the first to fourth wirings 22a to 22d.
  • the wirings 22a to 22d have first ends E1a to E1d connected to the electrode pads SP of the semiconductor chip 14 and second ends E2a to E2d connected to the inner ends of the leads 20, respectively. May be.
  • the ends E1a to E1d of the wirings 22a to 22d are distributed on the surface of the electrode pad SP.
  • the end E1a of the wiring 22a can be disposed at a position closer to the lead 20 than the end E1b of the wiring 22b.
  • the end E1c of the wiring 22c can be disposed at a position closer to the lead 20 than the end E1d of the wiring 22d.
  • the ends E1a and E1c are arranged in this order in the X direction.
  • the ends E1b and E1d are arranged in this order in the X direction.
  • the end E2a of the wiring 22a can be disposed at a position closer to the semiconductor chip 14 than the end E2b of the wiring 22b.
  • the end E2c of the wiring 22c can be disposed at a position closer to the semiconductor chip 14 than the end E2d of the wiring 22d.
  • the end portions E2a to E2d are arranged in this order in the X direction.
  • the lead 20 has a first surface S1 including a connection point P1 with the wiring 22a and a second surface S2 including a connection point P2 with the wiring 22b.
  • the end portion E2c of the wiring 22c is connected to the surface S1.
  • An end E2d of the wiring 22d is connected to the surface S2.
  • the surface S1 can be disposed at a position closer to the semiconductor chip 14 than the surface S2.
  • the connection point P1 is located at the first height H1 from the reference plane R obtained by extending the chip mounting surface 12a.
  • the reference plane R can be a plane parallel to the XY plane.
  • the connection point P2 is located at the second height H2 from the reference plane R.
  • the height H2 is different from the height H1. In the present embodiment, the height H2 is higher than the height H1.
  • the chip mounting surface 12a and the reference surface R can be the same plane.
  • the semiconductor chip 14 and the lead 20 can be arranged along the reference plane R.
  • the surface S1 and the surface S2 may be parallel to the chip mounting surface 12a and the reference surface R.
  • the lead 20 may have a step portion 20a provided between the surface S1 and the surface S2.
  • the stepped portion 20a can be produced by bending a plate-like member by pressing or the like.
  • the lead 16 corresponds to the drain electrode terminal
  • the lead 18 corresponds to the gate electrode terminal
  • the lead 20 corresponds to the source electrode terminal
  • the electrode pad GP corresponds to the gate electrode pad.
  • the electrode pad SP corresponds to the source electrode pad.
  • Examples of the material of the leads 18 and 20 include metals such as copper and copper alloys.
  • the wirings 22a to 22d and 30 may be wires or ribbons. Examples of the material of the wirings 22a to 22d and 30 include metals such as aluminum, gold, and copper.
  • the wirings 22a to 22d and 30 are connected to the leads 18 and 20 and the semiconductor chip 14 by wire bonding using, for example, ultrasonic waves or pressure.
  • the die pad 12 and the semiconductor chip 14 can be sealed by the resin portion 24.
  • Inner ends of the leads 16, 18, and 20 are fixed to the resin portion 24.
  • the portion inside the resin portion 24 is a so-called inner lead portion.
  • the portion outside the resin portion 24 is an outer lead portion.
  • An example of the outer shape of the resin portion 24 is a substantially rectangular parallelepiped.
  • the material of the resin portion 24 include thermoplastic resins such as polyphenylene sulfide resin (PPS resin) and liquid crystal polymer.
  • the resin portion 24 can be formed by molding the die pad 12 and the semiconductor chip 14 with a thermoplastic resin.
  • a through hole 28 is formed in the resin portion 24 with the central axis of the through hole 26 of the die pad 12 as the central axis.
  • the through hole 28 is a hole through which a screw is passed in the case of screwing or the like, like the through hole 26.
  • the diameter of the through hole 28 is smaller than the diameter of the through hole 26.
  • the bottom surface 12f of the die pad 12 opposite to the chip mounting surface 12a can be opened.
  • the bottom surface 12 f may be a surface that is not covered by the resin portion 24.
  • the bottom surface 12f can function as a heat dissipation surface.
  • the height H1 of the connection point P1 with the wiring 22a is different from the height H2 of the connection point P2 with the wiring 22b.
  • the connection points P11 and P12 between the lead 500 and the wirings 522a and 522b have the same height H from the reference plane R.
  • the wirings 522a and 522b in the height direction are relatively narrow, and the possibility that the wirings 522a and 522b come into contact with each other increases. Therefore, in the semiconductor device 10, the distance between the wirings 22a and 22b in the height direction can be increased as compared with the semiconductor device shown in FIG. Therefore, the semiconductor device 10 in which the wiring 22a and the wiring 22b are difficult to contact is obtained.
  • both the surfaces S1 and S2 can be arranged in parallel with the reference plane R.
  • the wirings 22a and 22b can be easily connected to the surfaces S1 and S2, respectively.
  • FIG. 4 is a diagram schematically showing a part of the semiconductor device according to the second embodiment.
  • FIG. 4 corresponds to FIG.
  • the semiconductor device according to the second embodiment has the same configuration as the semiconductor device 10 except that the lead 120 is provided instead of the lead 20.
  • the lead 120 has surfaces S1 and S2 that are inclined with respect to the reference plane R.
  • Surface S1 is adjacent to surface S2.
  • Surfaces S1 and S2 are coplanar.
  • the inner end portion of the lead 120 extends in a direction inclined with respect to the reference plane R.
  • the lead 120 can be manufactured by press working or the like. In the semiconductor device according to the second embodiment, at least the same effects as the semiconductor device 10 can be obtained.
  • FIG. 5 is a diagram schematically showing a part of the semiconductor device according to the third embodiment.
  • FIG. 5 corresponds to FIG.
  • the semiconductor device according to the third embodiment has the same configuration as that of the semiconductor device 10 except that a lead 220 is provided instead of the lead 20.
  • the inner end portion of the lead 220 is branched into a portion having the surface S1 and a portion having the surface S2.
  • the surface S1 and the surface S2 are parallel to the chip mounting surface 12a and the reference surface R.
  • the lead 220 can be manufactured by pressing, welding, or the like.
  • at least the same effects as the semiconductor device 10 can be obtained.
  • FIG. 6 is a diagram schematically showing a part of the semiconductor device according to the fourth embodiment.
  • FIG. 6 corresponds to FIG.
  • the semiconductor device according to the fourth embodiment has the same configuration as that of the semiconductor device 10 except that it includes a lead 320 instead of the lead 20 and further includes wirings 22e to 22g.
  • the inner end portion of the lead 320 has a large number of step portions 320a to 320d.
  • the wirings 22e to 22g electrically connect the semiconductor chip 14 and the leads 320 in the same manner as the wirings 22a to 22d.
  • the lead 320 has surfaces S1 to S5.
  • Surfaces S3 to S5 include connection points P3 to P5 with wirings 22e to 22g, respectively.
  • the connection points P3 to P5 are located at heights H3 to H5 from the reference plane R, respectively.
  • the heights H3 to H5 are different from each other.
  • the heights H1 to H5 increase in this order.
  • the surfaces S1 to S5 are parallel to the chip mounting surface 12a and the reference surface R.
  • a stepped portion 320a is provided between the surface S1 and the surface S2.
  • a step portion 320b is provided between the surface S2 and the surface S3.
  • a step portion 320c is provided between the surface S3 and the surface S4.
  • a step portion 320d is provided between the surface S4 and the surface S5.
  • the lead 320 can be manufactured by press working or the like. In the semiconductor device according to the fourth embodiment, at least the same effects as the semiconductor device 10 can be obtained.
  • FIG. 7 is a diagram schematically showing a semiconductor device according to the fifth embodiment.
  • a semiconductor device 110 shown in FIG. 7 is a case-type semiconductor device.
  • the semiconductor device 110 includes a die pad 46, a semiconductor chip 14, an electrode terminal 420, and a case 52.
  • the die pad 46 has a chip mounting surface 46a on which the semiconductor chip 14 is mounted.
  • the semiconductor chip 14 is mounted on the chip mounting surface 46 a via the adhesive layer 32.
  • the electrode terminal 420 is connected to the semiconductor chip 14 via the first and second wirings 22a and 22b.
  • the electrode terminal 420 has the surfaces S1 and S2 like the lead 20 of the semiconductor device 10 shown in FIGS.
  • a stepped portion 420a is provided between the surface S1 and the surface S2.
  • the die pad 46 is a wiring layer provided on the surface of the insulating substrate 42.
  • Examples of the material of the die pad 46 include metals such as copper and copper alloys.
  • An example of the material of the insulating substrate 42 includes ceramic such as alumina.
  • a heat dissipation layer 44 may be provided on the back surface of the insulating substrate 42. Examples of the material of the heat dissipation layer 44 include metals such as copper and copper alloys.
  • the heat dissipation layer 44 is bonded to the heat sink 50 via an adhesive layer 48 made of, for example, solder.
  • An example of the material of the heat sink 50 includes a metal.
  • the semiconductor chip 14, the die pad 46, the insulating substrate 42 and the heat dissipation layer 44 are accommodated in a case 52.
  • the case 52 has a cylindrical shape, for example.
  • One opening of the case 52 can be sealed by the heat sink 50.
  • the other opening of the case 52 can be sealed by a lid 54.
  • the material of the case 52 include a resin such as an engineering plastic such as polybutylene terephthalate (PBT) or polyphenylene sulfide (PPS) resin.
  • An example of the material of the lid 54 includes a thermoplastic resin.
  • a gel 56 such as a silicone gel may be injected for stress relaxation.
  • the semiconductor device 110 may include an electrode terminal 418.
  • the electrode terminal 418 is connected to the semiconductor chip 14 via the wiring 30.
  • the electrode terminal 418 and the electrode terminal 420 are attached to the inner wall of the case 52.
  • the electrode terminal 418 and the electrode terminal 420 extend along the inner wall of the case 52 and project outside through an opening formed in the lid 54.
  • the electrode terminal 418 and the electrode terminal 420 can be manufactured by press working or the like.
  • the case 52 has a step portion along the step portion 420 a of the electrode terminal 420.
  • the step portion of the case 52 can be produced by molding or the like.
  • the semiconductor chip 14 includes a MOS-FET
  • the electrode terminal 418 corresponds to a gate electrode terminal
  • the electrode terminal 420 corresponds to a source electrode terminal.
  • the drain electrode terminal is not shown.
  • at least the same effects as those of the semiconductor device 10 can be obtained.
  • the semiconductor device 10 may not include the third to fourth wirings 22c to 22d, and may include five or more wirings.
  • the surfaces S1 and S2 of the lead 20 are arranged along the Y direction, they may be arranged along the X direction.
  • a plurality of semiconductor chips 14 may be mounted on the chip mounting surface 12 a of the die pad 12. In this case, since the number of wires in the semiconductor device increases, it is particularly important to avoid contact between the wires.

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Abstract

　半導体デバイスは、半導体チップと、半導体チップが搭載されるチップ搭載面を有するダイパッドと、第１及び第２の配線を介して半導体チップに接続される電極端子とを備える。電極端子は、第１の配線との接続点を含む第１の表面と、第２の配線との接続点を含む第２の表面とを有する。第１の配線との接続点は、チップ搭載面を延長した基準面から第１の高さに位置する。第２の配線との接続点は、基準面から第１の高さとは異なる第２の高さに位置する。

Description

半導体デバイス
　本発明は、半導体デバイスに関する。
　半導体デバイスの例として、ケース型の半導体デバイス及び樹脂封止型の半導体デバイスが知られている（非特許文献１参照）。このような半導体デバイスでは、ダイパッドに搭載された半導体チップが、ワイヤを介して電極端子に接続される。
「Ｃｕワイヤを中心としたワイヤボンディングの不良原因と信頼性向上・評価技術」株式会社技術情報協会出版、２０１１年７月２９日、ｐ．１６３、ｐ．２６３
　半導体チップは、１本の太いワイヤの代わりに複数の細いワイヤを介してソース電極端子に接続されることがある。この場合、複数のワイヤの端部が半導体チップの表面に設けられたソース電極パッドおいて分散配置され得るので、半導体チップの表面において局所的に電流が集中することを抑制できる。また、ワイヤボンディングの際に超音波又は加圧等により半導体チップが受ける荷重を半導体チップの表面において分散させることができる。
　しかし、複数のワイヤを用いる場合、ワイヤの本数を増やすとワイヤ同士が接触する可能性が高まる。ワイヤ同士が接触すると、接触箇所において電流が集中し、発熱するおそれがある。
　本発明は、半導体チップを電極端子に接続する配線同士が接触し難い半導体デバイスを提供することを目的とする。
　本発明の一側面に係る半導体デバイスは、半導体チップと、前記半導体チップが搭載されるチップ搭載面を有するダイパッドと、第１及び第２の配線を介して前記半導体チップに接続される電極端子と、を備え、前記電極端子が、前記第１の配線との接続点を含む第１の表面と、前記第２の配線との接続点を含む第２の表面と、を有し、前記第１の配線との接続点が、前記チップ搭載面を延長した基準面から第１の高さに位置し、前記第２の配線との接続点が、前記基準面から前記第１の高さとは異なる第２の高さに位置する。
　この半導体デバイスでは、第１の配線との接続点の高さが、第２の配線との接続点の高さと異なっている。このため、接続点の高さが同じ場合に比べて、高さ方向における第１及び第２の配線間距離を大きくすることができる。よって、第１の配線と第２の配線とが接触し難い半導体デバイスが得られる。
　一実施形態において、前記電極端子が、前記第１の表面と前記第２の表面との間に設けられた段差部を有してもよい。
　この場合、第１及び第２の表面の両方を基準面と平行に配置することができる。その結果、第１及び第２の配線をそれぞれ第１及び第２の表面に接続し易くなる。
　一実施形態において、前記半導体チップの材料が、ワイドバンドギャップ半導体を含んでもよい。
　シリコン（Ｓｉ）では、半導体チップに小さい電流しか流れないので、多数の配線を使用する必要性は低い。しかし、ワイドバンドギャップ半導体では、半導体チップに流れる電流がシリコンよりも大きいので、電流の集中を抑制するために配線の本数を増やす必要性が高い。また、ワイドバンドギャップ半導体では、シリコンよりも低い製造歩留まりに起因して半導体チップの大型化が難しい。このため、ワイドバンドギャップ半導体では、小型の半導体チップに多数の配線が接続される。よって、ワイドバンドギャップ半導体では、配線同士の接触を回避することが特に重要である。
　一実施形態において、半導体デバイスは、前記半導体チップ及び前記ダイパッドを収容するケースを更に備え、前記電極端子が、前記ケースに取り付けられてもよい。
　この場合、ケース型の半導体デバイスが得られる。
　本発明によれば、半導体チップを電極端子に接続する配線同士が接触し難い半導体デバイスが提供され得る。
第１実施形態に係る半導体デバイスを模式的に示す平面図である。 図１のＸ方向から見た半導体デバイスの一部を模式的に示す図である。 参照用の半導体デバイスの一部を模式的に示す図である。 第２実施形態に係る半導体デバイスの一部を模式的に示す図である。 第３実施形態に係る半導体デバイスの一部を模式的に示す図である。 第４実施形態に係る半導体デバイスの一部を模式的に示す図である。 第５実施形態に係る半導体デバイスを模式的に示す図である。
　以下、添付図面を参照しながら本発明の実施形態を詳細に説明する。なお、図面の説明において、同一又は同等の要素には同一符号を用い、重複する説明を省略する。
（第１実施形態）
　図１は、第１実施形態に係る半導体デバイスを模式的に示す平面図である。図１には、ＸＹＺ直交座標系が示されている。図２は、図１のＸ方向から見た半導体デバイスの一部を模式的に示す図である。図１及び図２に示される半導体デバイス１０は、樹脂封止型の半導体デバイスである。半導体デバイス１０は、ダイパッド１２と、半導体チップ（又は半導体素子）１４と、電極端子としてのリード２０とを備える。
　半導体デバイス１０は、別の電極端子としてのリード１６及び１８を備えてもよい。リード１６，１８，２０はＸ方向に沿って配列される。リード１６は、リード１８，２０の間に位置する。リード１６，１８、２０及びダイパッド１２は、リードフレームを構成し得る。半導体デバイス１０は、例えば電源等に使用される電力用半導体デバイスである。半導体デバイス１０のパッケージ形態の例は一般的なＴＯシリーズである。ＴＯシリーズの例はＴＯ－２４７、ＴＯ－２２０、ＴＯ－２６３（Ｄ２―ＰＡＫ）、ＴＯ－２５２（Ｄ－ＰＡＫ）を含む。
　ダイパッド１２は、半導体チップ１４が搭載されるチップ搭載面１２ａを有する。ダイパッド１２は、半導体チップ１４と電気的に接続され得る。ダイパッド１２は例えば板状を呈している。チップ搭載面１２ａは、例えば長方形である。ダイパッド１２の材料の例は、銅（Ｃｕ）及び銅合金等の金属を含む。ダイパッド１２には、板厚方向にダイパッド１２を貫通する貫通孔２６が形成され得る。貫通孔２６は、例えば螺子によって半導体デバイス１０を他の部材に固定する際に、螺子を通すための孔である。
　半導体チップ１４は、チップ搭載面１２ａの所定位置に搭載される。半導体チップ１４の例は、バイポーラトランジスタ、ＭＯＳ－ＦＥＴ、絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）等のトランジスタ、ダイオードを含む。半導体チップ１４は、鉛入り金属半田、鉛を含まない金属半田又は導電性樹脂等を含む材料から構成される接着層３２を介してチップ搭載面１２ａに実装され得る。半導体チップ１４の材料の例は、ワイドバンドギャップ半導体、シリコンその他の半導体を含む。ワイドバンドギャップ半導体は、シリコンのバンドギャップよりも大きいバンドギャップを有する。ワイドバンドギャップ半導体の例は、シリコンカーバイド（ＳｉＣ）、窒化ガリウム（ＧａＮ）、ダイヤモンドを含む。
　リード１６の内側端部は、ダイパッド１２に機械的に一体的に連結されている。ダイパッド１２は導電性を有するので、リード１６とダイパッド１２とは電気的に接続されている。リード１６の材料の例はダイパッド１２の材料と同じ材料を含む。
　リード１８は、配線３０を介して半導体チップ１４に接続される。配線３０の一端は半導体チップ１４の電極パッドＧＰに接続される。配線３０の他端はリード１８の内側端部に接続される。
　リード２０は、第１～第４の配線２２ａ～２２ｄを介して半導体チップ１４に接続される。配線２２ａ～２２ｄは、半導体チップ１４の電極パッドＳＰに接続される第１の端部Ｅ１ａ～Ｅ１ｄと、リード２０の内側端部に接続される第２の端部Ｅ２ａ～Ｅ２ｄとをそれぞれ有してもよい。
　配線２２ａ～２２ｄの端部Ｅ１ａ～Ｅ１ｄは、電極パッドＳＰの表面において分散配置される。配線２２ａの端部Ｅ１ａは、配線２２ｂの端部Ｅ１ｂよりもリード２０に近い位置に配置され得る。配線２２ｃの端部Ｅ１ｃは、配線２２ｄの端部Ｅ１ｄよりもリード２０に近い位置に配置され得る。端部Ｅ１ａ及びＥ１ｃは、Ｘ方向においてこの順に配列される。端部Ｅ１ｂ及びＥ１ｄは、Ｘ方向においてこの順に配列される。配線２２ａの端部Ｅ２ａは、配線２２ｂの端部Ｅ２ｂよりも半導体チップ１４に近い位置に配置され得る。配線２２ｃの端部Ｅ２ｃは、配線２２ｄの端部Ｅ２ｄよりも半導体チップ１４に近い位置に配置され得る。端部Ｅ２ａ～Ｅ２ｄは、Ｘ方向においてこの順に配列される。
　リード２０は、図２に示されるように、配線２２ａとの接続点Ｐ１を含む第１の表面Ｓ１と、配線２２ｂとの接続点Ｐ２を含む第２の表面Ｓ２とを有する。表面Ｓ１には、配線２２ｃの端部Ｅ２ｃが接続される。表面Ｓ２には、配線２２ｄの端部Ｅ２ｄが接続される。表面Ｓ１は表面Ｓ２よりも半導体チップ１４に近い位置に配置され得る。接続点Ｐ１は、チップ搭載面１２ａを延長した基準面Ｒから第１の高さＨ１に位置する。基準面ＲはＸＹ平面に平行な平面であり得る。接続点Ｐ２は、基準面Ｒから第２の高さＨ２に位置する。高さＨ２は高さＨ１とは異なる。本実施形態において、高さＨ２は高さＨ１よりも高い。
　チップ搭載面１２ａ及び基準面Ｒは同一平面であり得る。半導体チップ１４及びリード２０は、基準面Ｒに沿って配置され得る。表面Ｓ１及び表面Ｓ２は、チップ搭載面１２ａ及び基準面Ｒと平行であり得る。リード２０は、表面Ｓ１と表面Ｓ２との間に設けられた段差部２０ａを有してもよい。段差部２０ａは、プレス加工等により板状部材を折り曲げることによって作製され得る。
　半導体チップ１４がＭＯＳ－ＦＥＴを含む場合、リード１６はドレイン電極端子に対応し、リード１８はゲート電極端子に対応し、リード２０はソース電極端子に対応し、電極パッドＧＰはゲート電極パッドに対応し、電極パッドＳＰはソース電極パッドに対応する。リード１８，２０の材料の例は、銅及び銅合金等の金属を含む。配線２２ａ～２２ｄ，３０は、ワイヤ又はリボンであってもよい。配線２２ａ～２２ｄ，３０の材料の例は、アルミニウム、金、銅等の金属を含む。配線２２ａ～２２ｄ，３０は、例えば超音波又は加圧等を用いたワイヤボンディングによりリード１８，２０及び半導体チップ１４に接続される。
　ダイパッド１２及び半導体チップ１４は、樹脂部２４によって封止され得る。リード１６，１８，２０の内側端部は、樹脂部２４に固定される。リード１６，１８，２０のうち樹脂部２４の内側の部分は、いわゆるインナーリード部である。リード１６，１８，２０のうち樹脂部２４の外側の部分は、アウターリード部である。樹脂部２４の外形形状の一例は、略直方体である。樹脂部２４の材料の例は、ポリフェニレンサルファイド樹脂（ＰＰＳ樹脂）、液晶ポリマー等の熱可塑性樹脂を含む。樹脂部２４は、ダイパッド１２及び半導体チップ１４を熱可塑性樹脂でモールドすることによって形成され得る。樹脂部２４には、ダイパッド１２の貫通孔２６の中心軸線を中心軸線とする貫通孔２８が形成されている。貫通孔２８は、貫通孔２６と同様に螺子止めなどの際などに螺子が通される孔である。貫通孔２８の直径は、貫通孔２６の直径より小さい。
　一実施形態において、ダイパッド１２のチップ搭載面１２ａと反対側の面である底面１２ｆは開放され得る。換言すれば、底面１２ｆは樹脂部２４によって覆われていない面であり得る。この場合、底面１２ｆは放熱面として機能し得る。
　半導体デバイス１０では、配線２２ａとの接続点Ｐ１の高さＨ１が、配線２２ｂとの接続点Ｐ２の高さＨ２と異なっている。一方、図３に示される半導体デバイスでは、リード５００と配線５２２ａ，５２２ｂとの接続点Ｐ１１，Ｐ１２は、基準面Ｒから同じ高さＨである。この場合、高さ方向における配線５２２ａ，５２２ｂ間が相対的に狭くなり、配線５２２ａ，５２２ｂ同士が接触する可能性が高くなる。よって、半導体デバイス１０では、図３に示される半導体デバイスに比べて、高さ方向における配線２２ａ，２２ｂ間距離を大きくすることができる。したがって、配線２２ａと配線２２ｂとが接触し難い半導体デバイス１０が得られる。
　リード２０が表面Ｓ１と表面Ｓ２との間に設けられた段差部２０ａを有する場合、表面Ｓ１，Ｓ２の両方を基準面Ｒと平行に配置することができる。その結果、配線２２ａ，２２ｂをそれぞれ表面Ｓ１，Ｓ２に接続し易くなる。
　シリコンでは、半導体チップ１４に小さい電流しか流れないので、多数の配線２２ａ～２２ｄを使用する必要性は低い。しかし、ワイドバンドギャップ半導体では、半導体チップ１４に流れる電流がシリコンよりも大きいので、電流の集中を抑制するために配線２２ａ～２２ｄの本数を増やす必要性が高い。また、ワイドバンドギャップ半導体では、シリコンよりも低い製造歩留まりに起因して半導体チップ１４の大型化が難しい。このため、ワイドバンドギャップ半導体では、小型の半導体チップ１４に多数の配線２２ａ～２２ｄが接続される。よって、ワイドバンドギャップ半導体では、配線２２ａ～２２ｄ同士の接触を回避することが特に重要である。
（第２実施形態）
　図４は、第２実施形態に係る半導体デバイスの一部を模式的に示す図である。図４は、図２に対応する。第２実施形態に係る半導体デバイスは、リード２０に代えてリード１２０を備えること以外は半導体デバイス１０と同様の構成を備える。リード１２０は、基準面Ｒに対して傾斜した表面Ｓ１及びＳ２を有する。表面Ｓ１は表面Ｓ２に隣接する。表面Ｓ１及びＳ２は同一平面である。リード１２０の内側端部は、基準面Ｒに対して傾斜する方向に延びる。リード１２０は、プレス加工等により作製され得る。第２実施形態に係る半導体デバイスでは、少なくとも半導体デバイス１０と同様の作用効果が得られる。
（第３実施形態）
　図５は、第３実施形態に係る半導体デバイスの一部を模式的に示す図である。図５は、図２に対応する。第３実施形態に係る半導体デバイスは、リード２０に代えてリード２２０を備えること以外は半導体デバイス１０と同様の構成を備える。リード２２０の内側端部は、表面Ｓ１を有する部分と表面Ｓ２を有する部分とに分岐されている。表面Ｓ１及び表面Ｓ２は、チップ搭載面１２ａ及び基準面Ｒと平行である。リード２２０は、プレス加工、溶接等により作製され得る。第３実施形態に係る半導体デバイスでは、少なくとも半導体デバイス１０と同様の作用効果が得られる。
（第４実施形態）
　図６は、第４実施形態に係る半導体デバイスの一部を模式的に示す図である。図６は、図２に対応する。第４実施形態に係る半導体デバイスは、リード２０に代えてリード３２０を備え、配線２２ｅ～２２ｇを更に備えること以外は半導体デバイス１０と同様の構成を備える。リード３２０の内側端部は多数の段差部３２０ａ～３２０ｄを有する。配線２２ｅ～２２ｇは、配線２２ａ～２２ｄと同様に、半導体チップ１４とリード３２０とを電気的に接続する。
　リード３２０は、表面Ｓ１～Ｓ５を有する。表面Ｓ３～Ｓ５は、配線２２ｅ～２２ｇとの接続点Ｐ３～Ｐ５をそれぞれ含む。接続点Ｐ３～Ｐ５は、基準面Ｒから高さＨ３～Ｈ５にそれぞれ位置する。高さＨ３～Ｈ５は互いに異なる。高さＨ１～Ｈ５はこの順に高くなる。表面Ｓ１～Ｓ５は、チップ搭載面１２ａ及び基準面Ｒと平行である。表面Ｓ１と表面Ｓ２との間には段差部３２０ａが設けられている。表面Ｓ２と表面Ｓ３との間には段差部３２０ｂが設けられている。表面Ｓ３と表面Ｓ４との間には段差部３２０ｃが設けられている。表面Ｓ４と表面Ｓ５との間には段差部３２０ｄが設けられている。リード３２０は、プレス加工等により作製され得る。第４実施形態に係る半導体デバイスでは、少なくとも半導体デバイス１０と同様の作用効果が得られる。
（第５実施形態）
　図７は、第５実施形態に係る半導体デバイスを模式的に示す図である。図７に示される半導体デバイス１１０は、ケース型の半導体デバイスである。半導体デバイス１１０は、ダイパッド４６と、半導体チップ１４と、電極端子４２０と、ケース５２とを備える。
　ダイパッド４６は、半導体チップ１４が搭載されるチップ搭載面４６ａを有する。半導体チップ１４は、接着層３２を介してチップ搭載面４６ａに搭載される。電極端子４２０は、第１及び第２の配線２２ａ，２２ｂを介して半導体チップ１４に接続される。電極端子４２０は、図１及び図２に示される半導体デバイス１０のリード２０と同様に、表面Ｓ１及びＳ２を有する。表面Ｓ１と表面Ｓ２との間には、段差部４２０ａが設けられる。
　ダイパッド４６は、絶縁性基板４２の表面に設けられた配線層である。ダイパッド４６の材料の例は、銅及び銅合金等の金属を含む。絶縁性基板４２の材料の例は、アルミナ等のセラミックを含む。絶縁性基板４２の裏面には、放熱層４４が設けられてもよい。放熱層４４の材料の例は、銅及び銅合金等の金属を含む。放熱層４４は、例えば半田等からなる接着層４８を介してヒートシンク５０に接着される。ヒートシンク５０の材料の例は、金属を含む。
　半導体チップ１４、ダイパッド４６、絶縁性基板４２及び放熱層４４は、ケース５２に収容される。ケース５２は、例えば筒状である。ケース５２の一方の開口はヒートシンク５０によって封止され得る。ケース５２の他方の開口は蓋５４によって封止され得る。ケース５２の材料の例は、ポリブチレンテレフタレート（ＰＢＴ）又はポリフェニレンサルファイド（ＰＰＳ）樹脂といったエンジニヤリングプラスチック等の樹脂を含む。蓋５４の材料の例は熱可塑性樹脂を含む。ケース５２の内側には、応力緩和のため、例えばシリコーンゲル等のゲル５６が注入され得る。
　半導体デバイス１１０は、電極端子４１８を備え得る。電極端子４１８は、配線３０を介して半導体チップ１４に接続される。電極端子４１８及び電極端子４２０はケース５２の内壁に取り付けられる。電極端子４１８及び電極端子４２０は、ケース５２の内壁に沿って延びており、蓋５４に形成された開口を通って外部に突出する。電極端子４１８及び電極端子４２０は、プレス加工等により作製され得る。ケース５２は、電極端子４２０の段差部４２０ａに沿った段差部を有する。ケース５２の段差部は、成型等により作製され得る。半導体チップ１４がＭＯＳ－ＦＥＴを含む場合、電極端子４１８はゲート電極端子に対応し、電極端子４２０はソース電極端子に対応する。なお、ドレイン電極端子は図示されていない。第５実施形態に係る半導体デバイスでは、少なくとも半導体デバイス１０と同様の作用効果が得られる。
　以上、本発明の好適な実施形態について詳細に説明したが、本発明は上記実施形態に限定されない。
　例えば、半導体デバイス１０は、第３～第４の配線２２ｃ～２２ｄを備えなくてもよいし、５本以上の配線を備えてもよい。また、リード２０の表面Ｓ１及びＳ２はＹ方向に沿って配列されているが、Ｘ方向に沿って配列されてもよい。また、ダイパッド１２のチップ搭載面１２ａ上に複数の半導体チップ１４が搭載されてもよい。この場合、半導体デバイス中の配線数が増えるので、配線同士の接触を回避することが特に重要である。
　１０，１１０…半導体デバイス、１２，４６…ダイパッド、１２ａ，４６ａ…チップ搭載面、１４…半導体チップ、２０，１２０，２２０，３２０…リード（電極端子）、２０ａ，３２０ａ，４２０ａ…段差部、２２ａ…第１の配線、２２ｂ…第２の配線、５２…ケース、４２０…電極端子、Ｐ１…第１の配線との接続点、Ｐ２…第２の配線との接続点、Ｒ…基準面、Ｓ１…第１の表面、Ｓ２…第２の表面。

Claims (4)

  1. 　半導体チップと、
    　前記半導体チップが搭載されるチップ搭載面を有するダイパッドと、
    　第１及び第２の配線を介して前記半導体チップに接続される電極端子と、
    を備え、
    　前記電極端子が、前記第１の配線との接続点を含む第１の表面と、前記第２の配線との接続点を含む第２の表面と、を有し、
    　前記第１の配線との接続点が、前記チップ搭載面を延長した基準面から第１の高さに位置し、
    　前記第２の配線との接続点が、前記基準面から前記第１の高さとは異なる第２の高さに位置する、半導体デバイス。
  2. 　前記電極端子が、前記第１の表面と前記第２の表面との間に設けられた段差部を有する、請求項１に記載の半導体デバイス。
  3. 　前記半導体チップの材料が、ワイドバンドギャップ半導体を含む、請求項１又は２に記載の半導体デバイス。
  4. 　前記半導体チップ及び前記ダイパッドを収容するケースを更に備え、
    　前記電極端子が、前記ケースに取り付けられる、請求項１～３のいずれか一項に記載の半導体デバイス。
PCT/JP2013/056828 2012-04-06 2013-03-12 半導体デバイス WO2013150867A1 (ja)

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US20130175704A1 (en) * 2012-01-05 2013-07-11 Ixys Corporation Discrete power transistor package having solderless dbc to leadframe attach
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US10629520B2 (en) * 2017-05-29 2020-04-21 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073904A (ja) * 2004-09-06 2006-03-16 Matsushita Electric Ind Co Ltd 半導体装置、リードフレーム、及びその製造方法

Family Cites Families (7)

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JP2003258178A (ja) * 2002-02-27 2003-09-12 Sanyo Electric Co Ltd 半導体装置
KR101221807B1 (ko) * 2006-12-29 2013-01-14 페어차일드코리아반도체 주식회사 전력 소자 패키지
JP5206102B2 (ja) * 2008-05-08 2013-06-12 トヨタ自動車株式会社 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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