JP2021068783A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2021068783A JP2021068783A JP2019192015A JP2019192015A JP2021068783A JP 2021068783 A JP2021068783 A JP 2021068783A JP 2019192015 A JP2019192015 A JP 2019192015A JP 2019192015 A JP2019192015 A JP 2019192015A JP 2021068783 A JP2021068783 A JP 2021068783A
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- semiconductor chip
- semiconductor device
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Abstract
Description
<回路構成について>
図1は、本実施の形態の半導体装置(半導体パッケージ)PKGを用いた電子装置の一例を示す回路図であり、ここでは、半導体装置PKGを用いてインバータ回路INVを構成した場合の回路図が示されている。なお、図1において、符号CPHを付した点線で囲まれた部分が、半導体チップCPH内に形成され、符号CPLを付した点線で囲まれた部分が、半導体チップCPL内に形成され、符号CPCを付した点線で囲まれた部分が、半導体チップCPC内に形成され、符号PKGを付した一点鎖線で囲まれた部分が、半導体装置PKG内に形成されている。
図2は、本実施の形態の半導体装置PKGの上面図であり、図3は、半導体装置PKGの下面図(裏面図)であり、図4〜図6は、半導体装置PKGの平面透視図であり、図7〜図10は、半導体装置PKGの断面図である。図4には、半導体装置PKGを下面側から見たときの、封止部MRを透視した平面透視図が示されている。また、図5は、図4において、更にワイヤBWおよび金属板MP1,MP2を透視(省略)したときの半導体装置PKGの下面側の平面透視図が示されている。また、図6は、図5において、更に半導体チップCPC,CPH,CPLを透視(省略)したときの半導体装置PKGの下面側の平面透視図が示されている。図3〜図6では、半導体装置PKGの向きは同じである。また、図4〜図6では、封止部MRの外周の位置を点線で示してある。また、図2〜図4のA1−A1線の位置での半導体装置PKGの断面が、図7にほぼ対応し、図2〜図4のA2−A2線の位置での半導体装置PKGの断面が、図8にほぼ対応し、図2〜図4のA3−A3線の位置での半導体装置PKGの断面が、図9にほぼ対応し、図2〜図4のA4−A4線の位置での半導体装置PKGの断面が、図10にほぼ対応している。なお、各平面図に示した符号Xは第1方向(以下、X方向と称する)、符号Yは第1方向Xに直交する第2方向(以下、Y方向と称する)を示している。すなわち、X方向とY方向とは、互いに直交する方向である。
次に、上記図2〜図10に示される半導体装置PKGの製造工程(組立工程)について説明する。図11〜図26は、本実施の形態の半導体装置PKGの製造工程中の平面図または断面図である。図11〜図26のうち、図11、図12、図16および図20は平面図であり、図13〜図15、図17〜図19および図21〜図24は断面図である。なお、図13、図17、図21、図23および図25は、上記図7に相当する断面位置での断面図に対応し、図14および図18は、上記図8に相当する断面位置での断面図に対応し、図15、図19、図22、図24および図26は、上記図9に相当する断面位置での断面図に対応している。
図27〜図30は、半導体装置PKGを配線基板PB1に実装した状態を示す断面図である。なお、図27は、上記図7に相当する断面位置での断面図に対応し、図28は、上記図8に相当する断面位置での断面図に対応し、図29は、上記図9に相当する断面位置での断面図に対応し、図30は、上記図10に相当する断面位置での断面図に対応している。
本実施の形態の主要な特徴は、半導体装置PKGにおいて、接合材(接着層)BD1,BD2,BD3,BD4,BD5,BD6,BD7の弾性率の使い分けである。具体的には、接合材BD1,BD2,BD3,BD4,BD6のそれぞれの弾性率は、接合材BD5,BD7のそれぞれの弾性率よりも低い。すなわち、接合材BD1,BD2,BD3,BD4,BD6は、低弾性率であり、接合材BD5,BD7は、高弾性率である。言い換えると、接合材BD1,BD2,BD3,BD4,BD6として低弾性接合材を用い、接合材BD5,BD7として高弾性接合材を用いている。
図32は、上記実施の形態1と本実施の形態2のそれぞれにおける接合材BD1,BD2,BD3,BD4,BD5,BD6,BD7についてまとめた表である。
3,4 センスMOSFET
BD1,BD1a,BD2,BD2a,BD3,BD3a,BD4,BD4a,BD5,BD5a,BD6,BD6a,BD7,BD7a,SD 接合材
BW ワイヤ
CAV キャビティ
CL コイル
CLC,CT 制御回路
CPC,CPH,CPL 半導体チップ
DPC,DPH,DPL ダイパッド
HS ヒートシンク
KG1,KG2 金型
LB1,LB2,LB3,LB4 リード連結部
LB1a,LB3a 連結部
LD,LD1,LD2,LD3,LD4,LD5a,LD5b,LD6,LD7,LD8 リード
LF リードフレーム
MP1,MP2 金属板
MR 封止部
PB1 配線基板
PDC,PDHA,PDHC,PDHG,PDHS1,PDHS2,PDLA,PDLC,PDLG,PDLS1,PDLS2 パッド
PKG 半導体装置
TE1,TE2,TE3,TE4,TE5,TM 端子
TE6 接続点
Claims (20)
- スイッチング用の第1電界効果トランジスタを含む第1半導体チップと、
前記第1半導体チップが第1接合材を介して搭載された第1チップ搭載部と、
前記第1半導体チップの第1ソース用パッドに第1金属板を介して電気的に接続された第1リードと、
前記第1リードと一体的に形成された第1金属部と、
前記第1半導体チップと、前記第1金属板と、前記第1金属部と、前記第1チップ搭載部の少なくとも一部と、前記第1リードの一部と、を封止する封止体と、
を備える半導体装置であって、
前記第1半導体チップの第1ドレイン用裏面電極と前記第1チップ搭載部とが、前記第1接合材を介して接合され、
前記第1金属板と前記第1半導体チップの前記第1ソース用パッドとが、第2接合材を介して接合され、
前記第1金属板と前記第1金属部とが、第3接合材を介して接合され、
前記第1接合材、前記第2接合材および前記第3接合材は、導電性を有し、
前記第1接合材および前記第2接合材のそれぞれの弾性率は、前記第3接合材の弾性率よりも低い、半導体装置。 - 請求項1記載の半導体装置において、
スイッチング用の第2電界効果トランジスタを含む第2半導体チップと、
前記第2半導体チップが第4接合材を介して搭載された第2チップ搭載部と、
前記第2半導体チップの第2ソース用パッドに第2金属板を介して電気的に接続された第2リードと、
前記第2リードと一体的に形成された第2金属部と、
を更に備え、
前記封止体は、前記第2半導体チップと、前記第2金属板と、前記第2金属部と、前記第2チップ搭載部の少なくとも一部と、前記第2リードの一部と、を封止し、
前記第2半導体チップの第2ドレイン用裏面電極と前記第2チップ搭載部とが、前記第4接合材を介して接合され、
前記第2金属板と前記第2半導体チップの前記第2ソース用パッドとが、第5接合材を介して接合され、
前記第2金属板と前記第2金属部とが、第6接合材を介して接合され、
前記第4接合材、前記第5接合材および前記第6接合材は、導電性を有し、
前記第1接合材、前記第2接合材、前記第4接合材および前記第5接合材のそれぞれの弾性率は、前記第3接合材および前記第6接合材のそれぞれの弾性率よりも低い、半導体装置。 - 請求項2記載の半導体装置において、
前記第1電界効果トランジスタは、ハイサイドスイッチ用であり、
前記第2電界効果トランジスタは、ロウサイドスイッチ用である、半導体装置。 - 請求項3記載の半導体装置において、
前記第1半導体チップおよび前記第2半導体チップのそれぞれを制御する回路を含む第3半導体チップと、
前記第3半導体チップが第7接合材を介して搭載された第3チップ搭載部と、
を更に備え、
前記封止体は、前記第3半導体チップと、前記第2チップ搭載部の少なくとも一部と、を封止する、半導体装置。 - 請求項4記載の半導体装置において、
前記第7接合材の弾性率は、前記第3接合材および前記第6接合材のそれぞれの弾性率よりも低い、半導体装置。 - 請求項5記載の半導体装置において、
前記第1接合材、前記第2接合材、前記第4接合材、前記第5接合材および前記第7接合材は、同じ接合材からなり、
前記第3接合材および前記第6接合材は、同じ接合材からなる、半導体装置。 - 請求項6記載の半導体装置において、
前記第1接合材、前記第2接合材、前記第3接合材、前記第4接合材、前記第5接合材、前記第6接合材および前記第7接合材は、それぞれ銀ペースト型接合材である、半導体装置。 - 請求項7記載の半導体装置において、
前記第1接合材、前記第2接合材、前記第4接合材、前記第5接合材および前記第7接合材のそれぞれの銀含有率は、前記第3接合材および前記第6接合材のそれぞれの銀含有率よりも低い、半導体装置。 - 請求項5記載の半導体装置において、
前記第1接合材、前記第2接合材、前記第4接合材、前記第5接合材および前記第7接合材のそれぞれの弾性率は、1〜3GPaであり、
前記第3接合材および前記第6接合材のそれぞれの弾性率は、10〜20GPaである、半導体装置。 - 請求項4記載の半導体装置において、
前記第1金属板と前記第2金属板と前記第1金属部と前記第2金属部とは、同じ材料からなる、半導体装置。 - 請求項4記載の半導体装置において、
前記第1金属板と前記第2金属板と前記第1金属部と前記第2金属部とは、銅または銅合金からなる、半導体装置。 - 請求項4記載の半導体装置において、
前記第1チップ搭載部、前記第2チップ搭載部および前記第3チップ搭載部のそれぞれの裏面が、前記封止体から露出している、半導体装置。 - 請求項4記載の半導体装置において、
前記第1リードと前記第2リードとを、それぞれ複数有し、
前記第1金属部は、前記複数の第1リードを連結し、
前記第2金属部は、前記複数の第2リードを連結する、半導体装置。 - 請求項4記載の半導体装置において、
前記第1半導体チップ、前記第2半導体チップおよび前記第3半導体チップは、インバータ回路を形成するために用いられる、半導体装置。 - 請求項1記載の半導体装置において、
前記第1金属板と前記第1金属部とは、同じ材料からなる、半導体装置。 - スイッチング用の第1電界効果トランジスタを含む第1半導体チップと、
前記第1半導体チップが第1接合材を介して搭載された第1チップ搭載部と、
前記第1半導体チップの第1ソース用パッドに第1金属板を介して電気的に接続された第1リードと、
前記第1リードと一体的に形成された第1金属部と、
前記第1半導体チップと、前記第1金属板と、前記第1金属部と、前記第1チップ搭載部の少なくとも一部と、前記第1リードの一部と、を封止する封止体と、
を備える半導体装置であって、
前記第1半導体チップの第1ドレイン用裏面電極と前記第1チップ搭載部とが、前記第1接合材を介して接合され、
前記第1金属板と前記第1半導体チップの前記第1ソース用パッドとが、第2接合材を介して接合され、
前記第1金属板と前記第1金属部とが、第3接合材を介して接合され、
前記第1接合材、前記第2接合材および前記第3接合材は、導電性を有し、
前記第1接合材、前記第2接合材および前記第3接合材は、それぞれ銀ペースト型接合材であり、
前記第1接合材および前記第2接合材のそれぞれの銀含有率は、前記第3接合材の銀含有率よりも低い、半導体装置。 - 請求項16記載の半導体装置において、
スイッチング用の第2電界効果トランジスタを含む第2半導体チップと、
前記第2半導体チップが第4接合材を介して搭載された第2チップ搭載部と、
前記第2半導体チップの第2ソース用パッドに第2金属板を介して電気的に接続された第2リードと、
前記第2リードと一体的に形成された第2金属部と、
を更に備え、
前記封止体は、前記第2半導体チップと、前記第2金属板と、前記第2金属部と、前記第2チップ搭載部の少なくとも一部と、前記第2リードの一部と、を封止し、
前記第2半導体チップの第2ドレイン用裏面電極と前記第2チップ搭載部とが、前記第4接合材を介して接合され、
前記第2金属板と前記第2半導体チップの前記第2ソース用パッドとが、第5接合材を介して接合され、
前記第2金属板と前記第2金属部とが、第6接合材を介して接合され、
前記第4接合材、前記第5接合材および前記第6接合材は、導電性を有し、
前記第4接合材、前記第5接合材および前記第6接合材は、それぞれ銀ペースト型接合材であり、
前記第1接合材、前記第2接合材、前記第4接合材および前記第5接合材のそれぞれの銀含有率は、前記第3接合材および前記第6接合材のそれぞれの銀含有率よりも低い、半導体装置。 - 請求項17記載の半導体装置において、
前記第1半導体チップおよび前記第2半導体チップのそれぞれを制御する回路を含む第3半導体チップと、
前記第3半導体チップが第7接合材を介して搭載された第3チップ搭載部と、
を更に備え、
前記封止体は、前記第3半導体チップと、前記第2チップ搭載部の少なくとも一部とを封止し、
前記第1電界効果トランジスタは、ハイサイドスイッチ用であり、
前記第2電界効果トランジスタは、ロウサイドスイッチ用であり、
前記第7接合材は、銀ペースト型接合材であり、
前記第7接合材の銀含有率は、前記第3接合材および前記第6接合材のそれぞれの銀含有率よりも低い、半導体装置。 - スイッチング用の第1電界効果トランジスタを含む第1半導体チップと、
前記第1半導体チップが第1接合材を介して搭載された第1チップ搭載部と、
前記第1半導体チップの第1ソース用パッドに第1金属板を介して電気的に接続された第1リードと、
前記第1リードと一体的に形成された第1金属部と、
前記第1半導体チップと、前記第1金属板と、前記第1金属部と、前記第1チップ搭載部の少なくとも一部と、前記第1リードの一部と、を封止する封止体と、
を備える半導体装置であって、
前記第1半導体チップの第1ドレイン用裏面電極と前記第1チップ搭載部とが、前記第1接合材を介して接合され、
前記第1金属板と前記第1半導体チップの前記第1ソース用パッドとが、第2接合材を介して接合され、
前記第1金属板と前記第1金属部とが、第3接合材を介して接合され、
前記第1接合材、前記第2接合材および前記第3接合材は、導電性を有し、
前記第1接合材の弾性率は、前記第2接合材および前記第3接合材のそれぞれの弾性率よりも低く、
前記第2接合材を介した前記第1金属板と前記第1半導体チップの前記第1ソース用パッドとの接合面積は、前記第1接合材を介した前記第1チップ搭載部と前記第1半導体チップの前記第1ドレイン用裏面電極との接合面積よりも、小さい、半導体装置。 - 請求項19記載の半導体装置において、
スイッチング用の第2電界効果トランジスタを含む第2半導体チップと、
前記第2半導体チップが第4接合材を介して搭載された第2チップ搭載部と、
前記第2半導体チップの第2ソース用パッドに第2金属板を介して電気的に接続された第2リードと、
前記第2リードと一体的に形成された第2金属部と、
を更に備え、
前記封止体は、前記第2半導体チップと、前記第2金属板と、前記第2金属部と、前記第2チップ搭載部の少なくとも一部と、前記第2リードの一部と、を封止し、
前記第2半導体チップの第2ドレイン用裏面電極と前記第2チップ搭載部とが、前記第4接合材を介して接合され、
前記第2金属板と前記第2半導体チップの前記第2ソース用パッドとが、第5接合材を介して接合され、
前記第2金属板と前記第2金属部とが、第6接合材を介して接合され、
前記第4接合材、前記第5接合材および前記第6接合材は、導電性を有し、
前記第1接合材および前記第4接合材のそれぞれの弾性率は、前記第2接合材、前記第3接合材、前記第5接合材および前記第6接合材のそれぞれの弾性率よりも低く、
前記第5接合材を介した前記第2金属板と前記第2半導体チップの前記第2ソース用パッドとの接合面積は、前記第4接合材を介した前記第2チップ搭載部と前記第2半導体チップの前記第2ドレイン用裏面電極との接合面積よりも、小さい、半導体装置。
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TW109135296A TW202129866A (zh) | 2019-10-21 | 2020-10-13 | 半導體裝置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2021154957A1 (en) | 2020-01-28 | 2021-08-05 | Littelfuse, Inc. | Semiconductor chip package and method of assembly |
US11373941B2 (en) * | 2020-10-12 | 2022-06-28 | Renesas Electronics Corporation | Sense MOSFET electrically connected to a source pad via a plurality of source extraction ports |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223634A (ja) * | 1999-01-28 | 2000-08-11 | Hitachi Ltd | 半導体装置 |
US6319755B1 (en) * | 1999-12-01 | 2001-11-20 | Amkor Technology, Inc. | Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe |
US6723582B2 (en) * | 2000-12-07 | 2004-04-20 | Amkor Technology, Inc. | Method of making a semiconductor package having exposed metal strap |
US20040150082A1 (en) * | 1999-01-28 | 2004-08-05 | Ryoichi Kajiwara | Semiconductor device |
US20080265386A1 (en) * | 2007-04-27 | 2008-10-30 | Kuniharu Muto | Semiconductor device |
JP2018121035A (ja) * | 2017-01-27 | 2018-08-02 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW451392B (en) * | 2000-05-18 | 2001-08-21 | Siliconix Taiwan Ltd | Leadframe connecting method of power transistor |
JP3602453B2 (ja) * | 2000-08-31 | 2004-12-15 | Necエレクトロニクス株式会社 | 半導体装置 |
JP4112816B2 (ja) * | 2001-04-18 | 2008-07-02 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
US20080036078A1 (en) * | 2006-08-14 | 2008-02-14 | Ciclon Semiconductor Device Corp. | Wirebond-less semiconductor package |
JP5119678B2 (ja) * | 2007-02-20 | 2013-01-16 | 富士通株式会社 | 実装構造、接続部材の製造方法、および半導体装置 |
US9093322B2 (en) * | 2007-07-13 | 2015-07-28 | Intel Mobile Communications GmbH | Semiconductor device |
JP5123633B2 (ja) | 2007-10-10 | 2013-01-23 | ルネサスエレクトロニクス株式会社 | 半導体装置および接続材料 |
JP5384913B2 (ja) * | 2008-11-18 | 2014-01-08 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5921055B2 (ja) * | 2010-03-08 | 2016-05-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5823798B2 (ja) | 2011-09-29 | 2015-11-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2013197365A (ja) * | 2012-03-21 | 2013-09-30 | Toshiba Corp | 半導体装置 |
US20130256894A1 (en) * | 2012-03-29 | 2013-10-03 | International Rectifier Corporation | Porous Metallic Film as Die Attach and Interconnect |
JP6161251B2 (ja) * | 2012-10-17 | 2017-07-12 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP7016015B2 (ja) * | 2017-05-09 | 2022-02-04 | パナソニックIpマネジメント株式会社 | 実装構造体 |
JP6998826B2 (ja) * | 2018-04-27 | 2022-01-18 | ルネサスエレクトロニクス株式会社 | 電子装置 |
-
2019
- 2019-10-21 JP JP2019192015A patent/JP7266508B2/ja active Active
-
2020
- 2020-10-01 US US17/060,545 patent/US11444010B2/en active Active
- 2020-10-13 TW TW109135296A patent/TW202129866A/zh unknown
- 2020-10-19 EP EP20202651.4A patent/EP3813106A1/en active Pending
- 2020-10-20 CN CN202011126718.7A patent/CN112768414A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223634A (ja) * | 1999-01-28 | 2000-08-11 | Hitachi Ltd | 半導体装置 |
US20040150082A1 (en) * | 1999-01-28 | 2004-08-05 | Ryoichi Kajiwara | Semiconductor device |
US6319755B1 (en) * | 1999-12-01 | 2001-11-20 | Amkor Technology, Inc. | Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe |
US6723582B2 (en) * | 2000-12-07 | 2004-04-20 | Amkor Technology, Inc. | Method of making a semiconductor package having exposed metal strap |
US20080265386A1 (en) * | 2007-04-27 | 2008-10-30 | Kuniharu Muto | Semiconductor device |
JP2008294384A (ja) * | 2007-04-27 | 2008-12-04 | Renesas Technology Corp | 半導体装置 |
JP2018121035A (ja) * | 2017-01-27 | 2018-08-02 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US20180218969A1 (en) * | 2017-01-27 | 2018-08-02 | Renesas Electronics Corporation | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024018790A1 (ja) * | 2022-07-19 | 2024-01-25 | ローム株式会社 | 半導体装置 |
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