WO2013145764A1 - 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置 - Google Patents
超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置 Download PDFInfo
- Publication number
- WO2013145764A1 WO2013145764A1 PCT/JP2013/002147 JP2013002147W WO2013145764A1 WO 2013145764 A1 WO2013145764 A1 WO 2013145764A1 JP 2013002147 W JP2013002147 W JP 2013002147W WO 2013145764 A1 WO2013145764 A1 WO 2013145764A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ultrasonic transducer
- substrate
- transducer element
- element chip
- probe
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims description 37
- 238000002604 ultrasonography Methods 0.000 title claims description 3
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 60
- 238000009423 ventilation Methods 0.000 claims abstract description 29
- 238000005192 partition Methods 0.000 claims description 60
- 239000011148 porous material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 21
- 239000010703 silicon Substances 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- 238000001514 detection method Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052741 iridium Inorganic materials 0.000 description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4427—Device being portable or laptop-like
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/46—Ultrasonic, sonic or infrasonic diagnostic devices with special arrangements for interfacing with the operator or the patient
- A61B8/461—Displaying means of special interest
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/52—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/5207—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves involving processing of raw data to produce diagnostic data, e.g. for generating an image
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
- G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
- G01S15/8934—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a dynamic transducer configuration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B42/00—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means
- G03B42/06—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means using ultrasonic, sonic or infrasonic waves
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
Definitions
- the present invention relates to an ultrasonic transducer element chip, a probe using the same, an electronic device using such a probe, an ultrasonic diagnostic apparatus, and the like.
- the ultrasonic transducer element chip includes a substrate. A plurality of openings are formed in the substrate. An ultrasonic transducer element is provided at each opening. The ultrasonic transducer element includes a vibrating membrane. The vibrating membrane closes the opening from the surface of the substrate.
- the strength of the substrate decreases.
- the strength is insufficient with respect to the force in the thickness direction of the substrate.
- the ultrasonic transducer element chip is pressed against the subject, the ultrasonic transducer element may be damaged.
- an ultrasonic transducer element chip that is thin and has a strength that can withstand a pressing force in the thickness direction of the substrate can be provided.
- a substrate having openings arranged in an array, an ultrasonic transducer element provided in each of the openings on the first surface of the substrate, and the first surface of the substrate
- An ultrasonic transducer element chip comprising: a reinforcing member fixed to the second surface of the substrate on the opposite side to reinforce the substrate; and a ventilation path communicating with the internal space of the opening and the external space of the substrate About.
- the ultrasonic transducer element can be formed thin.
- the ultrasonic transducer element can be formed on a thin substrate. Even if the reinforcing member is fixed to the substrate, the ultrasonic transducer element chip can be formed thin.
- the reinforcing member is fixed to the second surface of the substrate, the strength of the substrate can be reinforced in the thickness direction of the substrate.
- the internal space of the opening communicates with the external space of the substrate. Ventilation is ensured between the internal space of the opening and the external space of the substrate. Therefore, the internal space of the opening is not sealed. The internal space of the opening can easily follow ambient pressure fluctuations. In this way, damage to the ultrasonic transducer element can be reliably avoided. If the internal space of the opening is hermetically sealed, the ultrasonic transducer element may be damaged due to pressure fluctuation.
- the reinforcing member may be bonded to the partition wall portion of the substrate between the openings arranged in an array at at least one bonding region.
- the partition wall portion When the partition wall portion is joined to the reinforcing member, the movement of the partition wall portion is restrained by the reinforcing member. Therefore, vibration of the partition wall portion can be prevented. As a result, crosstalk between the ultrasonic transducer elements can be prevented.
- the action of vibration of the partition wall portion on the ultrasonic vibration of the ultrasonic transducer element can be avoided.
- the ultrasonic transducer element can provide ultrasonic vibration in a clear vibration mode. When the vibration of the partition wall portion is avoided in this way, a decrease in the amplitude of the ultrasonic vibration can be suppressed.
- the reinforcing member may have a first surface overlaid on the second surface of the substrate, and the ventilation path may include a groove portion disposed on the first surface of the reinforcing member. In this way, the ventilation path can be secured relatively easily.
- the ventilation path may include a groove portion that is disposed on the second surface of the substrate and communicates the openings. In this way, the ventilation path can be secured relatively easily.
- At least a part of the substrate and the reinforcing member may be made of a porous material, and the ventilation path may include pores of the porous material. In this way, the ventilation path can be secured relatively easily.
- the ultrasonic transducer element chip can be used by being incorporated in a probe.
- the probe may include an ultrasonic transducer element chip and a housing that supports the ultrasonic transducer element chip.
- the probe can be used by being incorporated in an electronic device.
- the electronic apparatus can include a probe and a processing circuit connected to the probe and processing an output of the ultrasonic transducer element.
- the probe can be used by being incorporated in an ultrasonic diagnostic apparatus.
- the ultrasonic diagnostic apparatus may include a probe, a processing circuit that is connected to the probe and processes an output of the ultrasonic transducer element to generate an image, and a display device that displays the image.
- the ultrasonic transducer element chip can be used by being incorporated in the probe head.
- the probe head can include an ultrasonic transducer element chip and a housing that supports the ultrasonic transducer element chip.
- FIG. 1 is an external view schematically showing a specific example of an electronic apparatus according to an embodiment, that is, an ultrasonic diagnostic apparatus. It is an enlarged front view of an ultrasonic probe. It is an enlarged plan view of an ultrasonic transducer element chip.
- FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. It is a top view of the reinforcement board which shows a groove
- FIG. 6 is an enlarged partial plan view of FIG. 5.
- 1 is a block diagram schematically showing a circuit configuration of an ultrasonic diagnostic apparatus. It is a partial expanded vertical sectional view which shows schematically the flexible film and lower electrode which were formed on the silicon wafer.
- FIG. 3 is a partially enlarged vertical sectional view schematically showing a piezoelectric film and an upper electrode formed on a lower electrode.
- FIG. It is a partial expanded vertical sectional view which shows schematically the electrically conductive film which covers a silicon wafer. It is a partial expanded vertical sectional view which shows schematically the wafer for the opening and reinforcement board which were formed in the silicon wafer.
- FIG. 5 is a vertical sectional view of an ultrasonic transducer element chip according to a second embodiment corresponding to FIG. 4.
- FIG. 8 is an enlarged partial plan view of the ultrasonic transducer element chip according to the second embodiment corresponding to FIG. 6. It is a partial expanded vertical sectional view which shows roughly the groove
- FIG. 5 is a vertical cross-sectional view of an ultrasonic transducer element chip according to a third embodiment corresponding to FIG. 4.
- FIG. 1 schematically shows a specific example of an electronic apparatus according to an embodiment of the present invention, that is, a configuration of an ultrasonic diagnostic apparatus 11.
- the ultrasonic diagnostic apparatus 11 includes an apparatus terminal 12 and an ultrasonic probe (probe) 13.
- the apparatus terminal 12 and the ultrasonic probe 13 are connected to each other by a cable 14.
- the apparatus terminal 12 and the ultrasonic probe 13 exchange electric signals through the cable 14.
- a display panel (display device) 15 is incorporated in the device terminal 12.
- the screen of the display panel 15 is exposed on the surface of the device terminal 12.
- an image is generated based on the ultrasonic waves detected by the ultrasonic probe 13.
- the imaged detection result is displayed on the screen of the display panel 15.
- the ultrasonic probe 13 has a housing 16.
- An ultrasonic transducer element chip (hereinafter referred to as “element chip”) 17 is accommodated in the housing 16.
- the surface of the element chip 17 can be exposed on the surface of the housing 16.
- the element chip 17 outputs an ultrasonic wave from the surface and receives a reflected wave of the ultrasonic wave.
- the ultrasonic probe 13 can include a probe head 13b that is detachably connected to the probe main body 13a. At this time, the element chip 17 can be incorporated into the housing 16 of the probe head 13b.
- FIG. 3 schematically shows a plan view of the element chip 17 according to the first embodiment.
- the element chip 17 includes a substrate 21.
- An element array 22 is formed on the surface (first surface) of the substrate 21.
- the element array 22 includes an array of ultrasonic transducer elements (hereinafter referred to as “elements”) 23.
- the array is formed of a matrix having a plurality of rows and a plurality of columns.
- Each element 23 includes a piezoelectric element portion.
- the piezoelectric element portion includes a lower electrode 24, an upper electrode 25, and a piezoelectric film 26.
- a piezoelectric film 26 is sandwiched between the lower electrode 24 and the upper electrode 25 for each element 23.
- the lower electrode 24 has a plurality of first conductors 24a.
- the first conductors 24a extend parallel to each other in the row direction of the array.
- One first conductor 24 a is assigned to each row of the elements 23.
- One first conductor 24a is disposed in common on the piezoelectric film 26 of the elements 23 arranged in the row direction of the array. Both ends of the first conductor 24a are connected to a pair of lead wires 27, respectively.
- the lead wires 27 extend parallel to each other in the column direction of the array. Accordingly, all the first conductors 24a have the same length.
- the lower electrode 24 is commonly connected to the elements 23 of the entire matrix.
- the upper electrode 25 has a plurality of second conductors 25a.
- the second conductors 25a extend parallel to each other in the column direction of the array.
- One second conductor 25a is assigned to each element 23 in one row.
- One second conductor 25a is disposed in common on the piezoelectric film 26 of the elements 23 arranged in the column direction of the array. Energization of the element 23 is switched for each column. Line scan and sector scan are realized according to such switching of energization. Since the elements 23 in one column output ultrasonic waves simultaneously, the number of columns, that is, the number of rows in the array, can be determined according to the output level of the ultrasonic waves. For example, the number of lines may be set to about 10 to 15 lines. In the figure, five lines are drawn without illustration.
- the number of columns in the array can be determined according to the spread of the scanning range.
- the number of columns may be set to 128 columns or 256 columns, for example. In the figure, there are omitted and 8 columns are drawn.
- a staggered arrangement may be established in the array. In the staggered arrangement, the even-numbered element groups 23 need only be shifted by half the row pitch with respect to the odd-numbered element groups 23. The number of elements in one of the odd and even columns may be one less than the number of the other element.
- the roles of the lower electrode 24 and the upper electrode 25 may be interchanged. That is, while the upper electrode is commonly connected to the elements 23 of the entire matrix, the lower electrode may be commonly connected to the elements 23 for each column of the array.
- the outer edge of the substrate 21 has a first side 21a and a second side 21b that are partitioned by a pair of straight lines 29 parallel to each other and face each other.
- a first line array 32a of one line is disposed between the first side 21a and the contour of the element array 22, and the second side
- One line of the second terminal array 32 b is arranged between the edge 21 b and the outline of the element array 22.
- the first terminal array 32a can form one line parallel to the first side 21a.
- the second terminal array 32b can form one line parallel to the second side 21b.
- the first terminal array 32 a includes a pair of lower electrode terminals 33 and a plurality of upper electrode terminals 34.
- the second terminal array 32 b includes a pair of lower electrode terminals 35 and a plurality of upper electrode terminals 36.
- Lower electrode terminals 33 and 35 are connected to both ends of one lead wiring 27, respectively.
- the lead wiring 27 and the lower electrode terminals 33 and 35 may be formed symmetrically on a vertical plane that bisects the element array 22.
- Upper electrode terminals 34 and 36 are respectively connected to both ends of one second conductor 25a.
- the second conductor 25a and the upper electrode terminals 34 and 36 may be formed symmetrically on a vertical plane that bisects the element array 22.
- the outline of the substrate 21 is formed in a rectangular shape.
- the outline of the substrate 21 may be square or trapezoidal.
- a first flexible printed circuit board (hereinafter referred to as “first flexible”) 37 is connected to the substrate 21.
- the first flexible board 37 covers the first terminal array 32a.
- Conductive lines, that is, first signal lines 38 are formed at one end of the first flexible board 37 corresponding to the lower electrode terminal 33 and the upper electrode terminal 34, respectively.
- the first signal lines 38 are individually faced and joined to the lower electrode terminal 33 and the upper electrode terminal 34, respectively.
- the substrate 21 is covered with a second flexible printed circuit board (hereinafter referred to as “second flexible”) 41.
- the second flexible board 41 covers the second terminal array 32b.
- Conductive lines, that is, second signal lines 42 are formed at the first end 41a of the second flexible printed circuit 41 corresponding to the lower electrode terminal 35 and the upper electrode terminal 36, respectively.
- the second signal lines 42 are individually faced and joined to the lower electrode terminal 35 and the upper electrode terminal 36, respectively.
- each element 23 has a vibration film 43.
- an opening 45 is formed in the base 44 of the substrate 21 for each element 23.
- the openings 45 are arranged in an array with respect to the base body 44.
- a flexible film 46 is formed on one surface of the surface (first surface) of the substrate 44.
- the flexible film 46 includes a silicon oxide (SiO 2 ) layer 47 laminated on the surface of the base 44 and a zirconium oxide (ZrO 2 ) layer 48 laminated on the surface of the silicon oxide layer 47.
- the flexible film 46 is in contact with the opening 45.
- a part of the flexible film 46 functions as the vibrating film 43 corresponding to the outline of the opening 45.
- the film thickness of the silicon oxide layer 47 can be determined based on the resonance frequency.
- the lower electrode 24, the piezoelectric film 26, and the upper electrode 25 are sequentially laminated on the surface of the vibration film 43.
- a laminated film of titanium (Ti), iridium (Ir), platinum (Pt) and titanium (Ti) can be used.
- the piezoelectric film 26 can be formed of, for example, lead zirconate titanate (PZT).
- the upper electrode 25 can be formed of iridium (Ir), for example.
- Other conductive materials may be used for the lower electrode 24 and the upper electrode 25, and other piezoelectric materials may be used for the piezoelectric film 26.
- the piezoelectric film 26 completely covers the lower electrode 24 under the upper electrode 25. A short circuit between the upper electrode 25 and the lower electrode 24 can be avoided by the action of the piezoelectric film 26.
- a protective film 49 is laminated on the surface of the substrate 21.
- the protective film 49 covers the entire surface of the substrate 21 over the entire surface.
- the element array 22, the first and second terminal arrays 32 a and 32 b, and the first ends 37 a and 41 a of the first and second flexes 37 and 41 are covered with the protective film 49.
- a silicone resin film can be used as the protective film 49.
- the protective film 49 protects the structure of the element array 22, the junction between the first terminal array 32 a and the first flex 37, and the junction between the second terminal array 32 b and the second flex 41.
- a partition wall 51 is defined between adjacent openings 45.
- the openings 45 are partitioned by a partition wall 51.
- the wall thickness t of the partition wall 51 corresponds to the space between the openings 45.
- the partition wall 51 defines two wall surfaces in a plane extending parallel to each other.
- the wall thickness t corresponds to the distance between the wall surfaces. That is, the wall thickness t can be defined by the length of a perpendicular line sandwiched between the wall surfaces perpendicular to the wall surfaces.
- the wall height H of the partition wall 51 corresponds to the depth of the opening 45.
- the depth of the opening 45 corresponds to the thickness of the base body 44. Therefore, the wall height H of the partition wall 51 can be defined by the length of the wall surface defined in the thickness direction of the base body 44.
- the partition wall 51 can have a constant wall height H over its entire length. If the wall thickness t of the partition wall 51 is reduced, the arrangement density of the vibration films 43 is increased. This can contribute to miniaturization of the element chip 17. If the wall height H of the partition wall 51 is larger than the wall thickness t, the bending rigidity of the element chip 17 can be increased. Thus, the interval between the openings 45 is set smaller than the depth of the openings 45.
- a reinforcing plate (reinforcing member) 52 is fixed to the back surface (second surface) of the base body 44 opposite to the surface of the base body 44.
- the back surface of the base 44 is overlaid on the surface of the reinforcing plate 52.
- the reinforcing plate 52 covers the opening 45 on the back surface of the element chip 17.
- the reinforcing plate 52 can include a rigid base material.
- the reinforcing plate 52 can be formed from, for example, a silicon substrate.
- the thickness of the base 44 is set to about 100 ⁇ m, for example, and the thickness of the reinforcing plate 52 is set to about 100 to 150 ⁇ m, for example.
- the partition wall 51 is coupled to the reinforcing plate 52.
- the reinforcing plate 52 is joined to each partition wall 51 at at least one joining region.
- An adhesive can be used for bonding.
- the term “overlapping” includes not only the overlapping of the base body 44 and the reinforcing plate 52 but also the stacking of the reinforcing material on the back surface of the base body 44 and the connection in the opposing arrangement of the base body 44 and the reinforcing plate 52.
- a plurality of linear grooves (grooves) 53 are arranged on the surface of the reinforcing plate 52.
- the groove 53 divides the surface of the reinforcing plate 52 into a plurality of flat surfaces 54.
- the plurality of planes 54 extend within one virtual plane HP.
- the back surface of the base body 44 spreads within the virtual plane HP.
- the partition wall 51 is joined to the flat surface 54.
- the groove 53 is recessed from the virtual plane HP.
- the cross-sectional shape of the groove 53 may be a square, a triangle, a semicircular shape, or other shapes.
- the openings 45 form a row in the first direction D1.
- Concentric centroids 45c of the openings 45 are arranged at equal pitch on one straight line 56 in the first direction D1. Since the openings 45 are formed by copying one contour shape, the openings 45 having the same shape are repeatedly arranged at a constant pitch.
- An outline 45a of the opening 45 is defined as a quadrangle, for example. Specifically, it is formed in a rectangular shape. The long side of the rectangle is aligned with the first direction D1.
- the partition wall 51 can have a constant wall thickness t over its entire length. At this time, the junction area of the partition wall 51 may be an area including the center position of the long side.
- the joining area of the partition wall 51 may be an area including the entire length of the long side.
- the partition wall 51 can be surface-bonded to the reinforcing plate 52 over the entire length between the openings 45 over the entire length of the long side.
- at least one junction region of the partition wall 51 can be arranged on each side of the quadrangle.
- the junction area of the partition wall 51 can surround the quadrangle without interruption.
- the partition wall 51 can be surface-bonded to the reinforcing plate 52 on the entire surface between the openings 45 over the entire circumference of the quadrilateral.
- the grooves 53 are arranged in the first direction D1 parallel to each other at regular intervals.
- the groove 53 extends in a second direction D2 that intersects the first direction D1. Both ends of the groove 53 are opened at end surfaces 57 a and 57 b of the reinforcing plate 52.
- one groove 53 sequentially crosses the outline 45 a of the opening 45 in one column (here, one row). At least one groove 53 is connected to each opening 45.
- the second direction D2 is orthogonal to the first direction D1. Therefore, the groove 53 crosses the outline 45a of the opening 45 in the short side direction of the rectangle.
- the groove 53 forms ventilation paths 58 a and 58 b between the base body 44 and the reinforcing plate 52 between the flat surfaces 54.
- the ventilation paths 58a and 58b communicate the internal space of the opening 45 and the external space of the substrate 21 with each other. In this way, ventilation is ensured between the internal space of the opening 45 and the external space of the substrate 21.
- one groove 53 crosses the outline 45a of the openings 45 in one row (here, one row) in order, so that the openings 45 are connected to each other by a ventilation path 58a one after another.
- the Both ends of the groove 53 are opened at end surfaces 57 a and 57 b of the reinforcing plate 52.
- the ventilation path 58b is opened from the opening 45 at the row end to the outside of the outer edge of the substrate 21.
- the integrated circuit includes a multiplexer 61 and a transmission / reception circuit 62.
- the multiplexer 61 includes a port group 61a on the element chip 17 side and a port group 61b on the transmission / reception circuit 62 side.
- the first signal line 38 and the second signal line 42 are connected to the port group 61 a on the element chip 17 side via the first wiring 54.
- the port group 61a is connected to the element array 22.
- a prescribed number of signal lines 63 in the integrated circuit chip 55 are connected to the port group 61b on the transmission / reception circuit 62 side.
- the specified number corresponds to the number of columns of the elements 23 that are simultaneously output during scanning.
- the multiplexer 61 manages the interconnection between the port on the cable 14 side and the port on the element chip 17 side.
- the transmission / reception circuit 62 includes a specified number of changeover switches 64. Each changeover switch 64 is individually connected to a corresponding signal line 63.
- the transmission / reception circuit 62 includes a transmission path 65 and a reception path 66 for each changeover switch 64. A transmission path 65 and a reception path 66 are connected in parallel to the changeover switch 64.
- the changeover switch 64 selectively connects the transmission path 65 or the reception path 66 to the multiplexer 61.
- a pulsar 67 is incorporated in the transmission path 65. The pulsar 67 outputs a pulse signal at a frequency corresponding to the resonance frequency of the vibration film 52.
- An amplifier 68, a low-pass filter (LPF) 69, and an analog-digital converter (ADC) 71 are incorporated in the reception path 66.
- the detection signals of the individual elements 23 are amplified and converted into digital signals.
- the transmission / reception circuit 62 includes a drive / reception circuit 72.
- the transmission path 65 and the reception path 66 are connected to the drive / reception circuit 72.
- the driving / receiving circuit 72 controls the pulsar 67 simultaneously according to the scanning mode.
- the driving / receiving circuit 72 receives a digital signal of the detection signal in accordance with the scanning mode.
- the driving / receiving circuit 72 is connected to the multiplexer 61 by a control line 73.
- the multiplexer 61 manages the interconnection based on the control signal supplied from the driving / receiving circuit 72.
- a processing circuit 74 is incorporated in the device terminal 12.
- the processing circuit 74 can include, for example, a central processing unit (CPU) and a memory.
- the overall operation of the ultrasonic diagnostic apparatus 11 is controlled according to the processing of the processing circuit 74.
- the processing circuit 74 controls the driving / receiving circuit 72 in accordance with an instruction input from the user.
- the processing circuit 74 generates an image according to the detection signal of the element 23. An image is specified by drawing data.
- a drawing circuit 75 is incorporated in the device terminal 12.
- the drawing circuit 75 is connected to the processing circuit 74.
- the display panel 15 is connected to the drawing circuit 75.
- the drawing circuit 75 generates a drive signal according to the drawing data generated by the processing circuit 74.
- the drive signal is sent to the display panel 15. As a result, an image is displayed on the display panel 15.
- the processing circuit 74 instructs the driving / receiving circuit 72 to transmit and receive ultrasonic waves.
- the driving / receiving circuit 72 supplies a control signal to the multiplexer 61 and also supplies a driving signal to each pulsar 67.
- the pulsar 67 outputs a pulse signal in response to the supply of the drive signal.
- the multiplexer 61 connects the port of the port group 61a to the port of the port group 61b according to the instruction of the control signal.
- the pulse signal is supplied to the element 23 for each column through the lower electrode terminals 33 and 35 and the upper electrode terminals 34 and 36 according to the selection of the port.
- the vibration film 43 vibrates in response to the supply of the pulse signal. As a result, desired ultrasonic waves are emitted toward an object (for example, the inside of a human body).
- the changeover switch 64 After the transmission of the ultrasonic wave, the changeover switch 64 is switched.
- the multiplexer 61 maintains the port connection relationship.
- the changeover switch 64 establishes a connection between the reception path 66 and the signal line 63 instead of the connection between the transmission path 65 and the signal line 63.
- the ultrasonic reflected wave vibrates the vibration film 43.
- a detection signal is output from the element 23.
- the detection signal is converted into a digital signal and sent to the driving / receiving circuit 72.
- the element 23 can be formed thin.
- the element 23 can be formed on a thin substrate 21. Even if the reinforcing plate 52 is fixed to the substrate 21, the element chip 17 can be formed thin. At the same time, the reinforcing plate 52 reinforces the strength of the substrate 21.
- the wall thickness t of the partition wall 51 is smaller than the wall height H, sufficient rigidity in the thickness direction of the substrate 21 can be ensured in the partition wall 51 because of the section modulus. The force in the thickness direction of the substrate 21 can be supported by the reinforcing plate 52 along the partition wall 51.
- the element chip 17 can have sufficient strength in the thickness direction of the substrate 21.
- the reinforcing plate 52 can prevent the substrate 21 from being damaged.
- the thickness of the substrate is set to about several mm. Even if the reinforcing plate 52 is bonded, the thickness of the element chip 17 according to the present embodiment can be reliably reduced as compared with the case where the element array is configured by bulk type ultrasonic transducer elements.
- the element chip 17 omits the acoustic impedance matching layer compared to the bulk type ultrasonic transducer element. Can be done. Such omission of the matching layer can further contribute to the thinning of the element chip 17.
- the reinforcing plate 52 is joined to each partition wall 51 at at least one joining region.
- the partition wall 51 is joined to the reinforcing plate 52, the movement of the partition wall 51 is restrained by the reinforcing plate 52. Therefore, vibration of the partition wall 51 can be prevented. As a result, crosstalk between the elements 23 can be prevented.
- the action of the partition wall 51 on the ultrasonic vibration of the element 23 can be avoided.
- ultrasonic vibration in a clear vibration mode is obtained. When the vibration of the partition wall 51 is avoided in this way, the decrease in the amplitude of the ultrasonic vibration can be suppressed.
- the groove 53 is formed between the internal space of each opening 45 and the external space of the substrate 21. Ensure ventilation. Therefore, the internal space of the opening 45 is not sealed.
- the internal space of the opening 45 is connected to the atmospheric space.
- the internal space of the opening 45 can easily follow the surrounding pressure fluctuation. In this way, damage to the element 23 can be avoided reliably. If the internal space of the opening 45 is hermetically sealed, the ultrasonic transducer element may be damaged due to pressure fluctuation.
- the external space means a space that is separated from the internal space by the substrate 21, the flexible film 46, and the reinforcing plate 52 and is significantly larger than the internal space.
- the joining area of the partition wall 51 can be an area including the center position of the long side. A portion of the partition wall 51 having a large vibration amplitude is joined to the reinforcing plate 52. As a result, vibration of the partition wall 51 can be effectively prevented. And the junction area of the partition wall 51 can be an area
- the junction area of the partition wall 51 may be arranged at least one place on each side of the rectangle.
- the junction area of the partition wall 51 can surround the quadrangle without interruption. In this way, if the partition wall 51 is joined to the reinforcing plate 52 over the entire rectangular area, vibration of the partition wall 51 can be reliably prevented.
- the partition wall 51 can be surface-joined on the entire surface between the openings 45 over the entire circumference of the square. Thus, if the partition wall 51 is surface-bonded to the reinforcing plate 52 over the entire circumference of the quadrangular shape between the openings 45, vibration of the partition wall 51 can be reliably prevented.
- the lower electrode 24, the lead-out wiring 27 and the lower electrode terminal for each element chip 17 on the surface of the silicon wafer 78. 33 and 35 are formed.
- a silicon oxide film 79 and a zirconium oxide film 81 are successively formed on the surface of the silicon wafer 78.
- a conductive film is formed on the surface of the zirconium oxide film 81.
- the conductive film is composed of a laminated film of titanium, iridium, platinum and titanium.
- the lower electrode 24, the lead-out wiring 27, and the lower electrode terminals 33 and 35 are formed from the conductive film based on the photolithography technique.
- a piezoelectric film 26 and an upper electrode 25 are formed for each element 23 on the surface of the lower electrode 24.
- a piezoelectric material film and a conductive film are formed on the surface of the silicon wafer 78.
- the piezoelectric material film is composed of a PZT film.
- the conductive film is composed of an iridium film. Based on the photolithography technique, the piezoelectric film 26 and the upper electrode 25 are formed from the piezoelectric material film and the conductive film for each element 23.
- a conductive film 82 is formed on the surface of the silicon wafer 78.
- the conductive film 82 connects the upper electrodes 25 to each other in each element chip 17 in each column.
- the upper electrode 25 and the upper electrode terminals 34 and 36 are formed from the conductive film 82 based on the photolithography technique.
- an array-shaped opening 45 is formed from the back surface of the silicon wafer 78.
- an etching process is performed.
- the silicon oxide film 79 functions as an etching stop layer.
- the vibration film 43 is partitioned by the silicon oxide film 79 and the zirconium oxide film 81.
- the surface of the reinforcing plate wafer 83 is superimposed on the back surface of the silicon wafer 78.
- a rigid insulating substrate can be used for the wafer 83.
- a silicon wafer can be used as the insulating substrate.
- a linear groove 84 is formed on the surface of the reinforcing plate wafer 83.
- the grooves 84 extend in parallel with each other at equal intervals. At least one end of the groove 84 is opened at the end face of the wafer 83. For example, an adhesive can be used for joining. After bonding, the individual element chips 17 are cut out from the silicon wafer 78.
- the groove 84 provides the groove 53.
- the groove 84 when the groove 84 is formed, even if the silicon wafer 78 and the wafer 83 are superposed on each other in the air or other gas atmosphere, the superposition can be realized relatively easily.
- gas is squeezed into the individual openings 45 on the plane of the reinforcing plate wafer.
- a gas having a volume larger than the volume of the space in the opening 45 tends to stay in the opening 45. If the excess gas does not escape from the gap between the silicon wafer 78 and the reinforcing plate wafer simultaneously with the closing of the opening 45, the bonding of the silicon wafer 78 and the reinforcing plate wafer cannot be realized.
- FIG. 12 schematically shows an ultrasonic transducer element chip 17a according to the second embodiment.
- a plurality of grooves (groove parts) 86 are arranged on the back surface of the substrate 21.
- the groove 86 divides the back surface of the substrate 21 into a plurality of planes 87 at the lower end of the partition wall 51.
- the plurality of planes 87 extend within one virtual plane HP.
- the surface of the reinforcing plate 52 spreads within the virtual plane HP.
- the groove 86 is recessed from the virtual plane HP.
- the cross-sectional shape of the groove 86 may be a square, a triangle, a semicircular shape, or other shapes. As shown in FIG.
- the groove 86 between the flat surfaces 87 forms ventilation paths 88 a and 88 b between the base body 44 and the reinforcing plate 52.
- the ventilation paths 88a and 88b connect the inside and outside of the space in the opening 45 to each other. In this way, ventilation is ensured between the space in the opening 45 and the outside of the opening 45.
- the openings 45 in one column (here, one row)
- the openings 45 are connected to each other by a ventilation path 88a.
- the opening 45 at the column end and the outside of the outer edge of the substrate 21 are connected by a ventilation path 88b.
- the opening 45 at the column end is opened to the outside of the outer edge of the substrate 21.
- Other configurations can be configured similarly to the element chip 17. In the figure, the same reference numerals are assigned to the configurations and structures equivalent to the element chip 17.
- a groove 89 is formed on the back surface of the silicon wafer 78 prior to the opening 45 being formed.
- a lithography technique can be used for forming the groove 89.
- a resist film 91 is formed on the back surface of the silicon wafer 78.
- the resist film 91 is engraved with a pattern of grooves 89.
- an array-shaped opening 45 is formed from the back surface of the silicon wafer 78.
- the grooves 89 provide the grooves 86.
- FIG. 15 schematically shows an ultrasonic transducer element chip 17b according to the third embodiment.
- the element chip 17b at least a part of the substrate 21 and the reinforcing plate 52 is made of a porous material.
- a porous material is disposed at least between the openings 45 or between the opening 45 at the row end and the outer edge of the substrate 21.
- the reinforcing plate 52 is formed of a porous material. The pores of the porous material are connected to each other to form a ventilation path.
- Other configurations can be configured similarly to the element chip 17. In the figure, the same reference numerals are assigned to the configurations and structures equivalent to the element chip 17.
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Abstract
Description
図1は本発明の一実施形態に係る電子機器の一具体例すなわち超音波診断装置11の構成を概略的に示す。超音波診断装置11は装置端末12と超音波プローブ(プローブ)13とを備える。装置端末12と超音波プローブ13とはケーブル14で相互に接続される。装置端末12と超音波プローブ13とはケーブル14を通じて電気信号をやりとりする。装置端末12にはディスプレイパネル(表示装置)15が組み込まれる。ディスプレイパネル15の画面は装置端末12の表面で露出する。装置端末12では、後述されるように、超音波プローブ13で検出された超音波に基づき画像が生成される。画像化された検出結果がディスプレイパネル15の画面に表示される。
図3は第1実施形態に係る素子チップ17の平面図を概略的に示す。素子チップ17は基板21を備える。基板21の表面(第1面)には素子アレイ22が形成される。素子アレイ22は超音波トランスデューサー素子(以下「素子」という)23の配列で構成される。配列は複数行複数列のマトリクスで形成される。個々の素子23は圧電素子部を備える。圧電素子部は下部電極24、上部電極25および圧電体膜26で構成される。個々の素子23ごとに下部電極24および上部電極25の間に圧電体膜26が挟み込まれる。
図7に示されるように、集積回路はマルチプレクサー61および送受信回路62を備える。マルチプレクサー61は素子チップ17側のポート群61aと送受信回路62側のポート群61bとを備える。素子チップ17側のポート群61aには第1配線54経由で第1信号線38および第2信号線42が接続される。こうしてポート群61aは素子アレイ22に繋がる。ここでは、送受信回路62側のポート群61bには集積回路チップ55内の規定数の信号線63が接続される。規定数はスキャンにあたって同時に出力される素子23の列数に相当する。マルチプレクサー61はケーブル14側のポートと素子チップ17側のポートとの間で相互接続を管理する。
次に超音波診断装置11の動作を簡単に説明する。処理回路74は駆動/受信回路72に超音波の送信および受信を指示する。駆動/受信回路72はマルチプレクサー61に制御信号を供給するとともに個々のパルサー67に駆動信号を供給する。パルサー67は駆動信号の供給に応じてパルス信号を出力する。マルチプレクサー61は制御信号の指示に従ってポート群61bのポートにポート群61aのポートを接続する。パルス信号はポートの選択に応じて下部電極端子33、35および上部電極端子34、36を通じて列ごとに素子23に供給される。パルス信号の供給に応じて振動膜43は振動する。その結果、対象物(例えば人体の内部)に向けて所望の超音波は発せられる。
図8に示されるように、シリコンウエハー78の表面で個々の素子チップ17ごとに下部電極24、引き出し配線27および下部電極端子33、35(図8以降では図示されず)が形成される。下部電極24、引き出し配線27および下部電極端子33、35の形成に先立ってシリコンウエハー78の表面には酸化シリコン膜79および酸化ジルコニウム膜81が相次いで形成される。酸化ジルコニウム膜81の表面には導電膜が形成される。導電膜はチタン、イリジウム、白金およびチタンの積層膜で構成される。フォトリソグラフィ技術に基づき導電膜から下部電極24、引き出し配線27および下部電極端子33、35は成形される。
図12は第2実施形態に係る超音波トランスデューサー素子チップ17aを概略的に示す。この素子チップ17aでは基板21の裏面に複数の溝(溝部)86が配置される。溝86は仕切り壁51の下端で基板21の裏面を複数の平面87に分割する。複数の平面87は1つの仮想平面HP内で広がる。その仮想平面HP内で補強板52の表面は広がる。溝86は仮想平面HPから窪む。溝86の断面形状は四角形であってもよく三角形であってもよく半円形その他の形状であってもよい。図13に示されるように、平面87同士の間で溝86は基体44と補強板52との間に通気経路88a、88bを形成する。こうして溝86内の空間は開口45内の空間に接続される。通気経路88a、88bは開口45内の空間の内外を相互に接続する。こうして開口45内の空間と開口45の外側との間で通気が確保される。1列(ここでは1行)の開口45では次々に開口45同士は通気経路88aで接続される。列端の開口45と基板21の外縁の外側とは通気経路88bで接続される。こうして列端の開口45は基板21の外縁の外側に開放される。その他の構成は素子チップ17と同様に構成されることができる。図中、素子チップ17と均等な構成や構造には同一の参照符号が付される。
図15は第3実施形態に係る超音波トランスデューサー素子チップ17bを概略的に示す。この素子チップ17bでは基板21および補強板52の少なくとも一部は多孔質材で構成される。こうした多孔質材は少なくとも開口45同士の間や列端の開口45と基板21の外縁との間に配置される。ここでは、補強板52は多孔質材から形成される。多孔質材の孔は相互に連なって通気経路を形成する。その他の構成は素子チップ17と同様に構成されることができる。図中、素子チップ17と均等な構成や構造には同一の参照符号が付される。
Claims (9)
- 開口がアレイ状に配置された基板と、
前記基板の第1面において個々の前記開口に設けられる超音波トランスデューサー素子と、
前記基板の前記第1面とは反対側の前記基板の第2面に固定されて前記基板を補強する補強部材と、
前記開口の内部空間および前記基板の外部空間を相互に連通する通気経路と
を備えることを特徴とする超音波トランスデューサー素子チップ。 - 請求項1に記載の超音波トランスデューサー素子チップにおいて、前記補強部材は、アレイ状に配置された前記開口の間の前記基板の仕切り壁部に少なくとも1カ所の接合域で接合されることを特徴とする超音波トランスデューサー素子チップ。
- 請求項1または2に記載の超音波トランスデューサー素子チップにおいて、前記補強部材は、前記基板の前記第2面に重ねられる第1面を有し、前記通気経路は、前記補強部材の前記第1面に配置される溝部を含むことを特徴とする超音波トランスデューサー素子チップ。
- 請求項1または2に記載の超音波トランスデューサー素子チップにおいて、前記通気経路は、前記基板の前記第2面に配置されて前記開口同士を連通する溝部を含むことを特徴とする超音波トランスデューサー素子チップ。
- 請求項1または2に記載の超音波トランスデューサー素子チップにおいて、前記基板および前記補強部材の少なくとも一部は多孔質材で構成され、前記通気経路は当該多孔質材の孔を含むことを特徴とする超音波トランスデューサー素子チップ。
- 請求項1~5のいずれか1項に記載の超音波トランスデューサー素子チップと、前記超音波トランスデューサー素子チップを支持する筐体とを備えることを特徴とするプローブ。
- 請求項6に記載のプローブと、前記プローブに接続されて、前記超音波トランスデューサー素子の出力を処理する処理回路とを備えることを特徴とする電子機器。
- 請求項6に記載のプローブと、前記プローブに接続されて、前記超音波トランスデューサー素子の出力を処理し、画像を生成する処理回路と、前記画像を表示する表示装置とを備えることを特徴とする超音波診断装置。
- 請求項1~5のいずれか1項に記載の超音波トランスデューサー素子チップと、
前記超音波トランスデューサー素子チップを支持し、かつプローブのプローブ本体部に取付けられるようになっている筐体と、
を備えることを特徴とするプローブヘッド。
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KR1020147030048A KR101649436B1 (ko) | 2012-03-30 | 2013-03-28 | 초음파 트랜스듀서 소자 칩 및 프로브, 및 전자 기기 및 초음파 진단 장치 |
CN201380016098.3A CN104203109B (zh) | 2012-03-30 | 2013-03-28 | 超声波换能器元件芯片、探测器、电子设备和超声波诊断装置 |
EP13768858.6A EP2832297A4 (en) | 2012-03-30 | 2013-03-28 | ULTRASONIC TRANSDUCER ELEMENT CHIP AND PROBE AND ELECTRONIC DEVICE AND ULTRASONIC DIAGNOSTIC EQUIPMENT |
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JP2012078672A JP6102075B2 (ja) | 2012-03-30 | 2012-03-30 | 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置 |
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US20130258803A1 (en) * | 2012-03-30 | 2013-10-03 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
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US10478859B2 (en) | 2006-03-02 | 2019-11-19 | Fujifilm Sonosite, Inc. | High frequency ultrasonic transducer and matching layer comprising cyanoacrylate |
US20130258803A1 (en) * | 2012-03-30 | 2013-10-03 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US20130258802A1 (en) * | 2012-03-30 | 2013-10-03 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US9079220B2 (en) * | 2012-03-30 | 2015-07-14 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US9089872B2 (en) * | 2012-03-30 | 2015-07-28 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US20150265246A1 (en) * | 2012-03-30 | 2015-09-24 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US9554775B2 (en) | 2012-03-30 | 2017-01-31 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US10040098B2 (en) | 2012-03-30 | 2018-08-07 | Seiko Epson Corporation | Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
US10265047B2 (en) | 2014-03-12 | 2019-04-23 | Fujifilm Sonosite, Inc. | High frequency ultrasound transducer having an ultrasonic lens with integral central matching layer |
US11083433B2 (en) | 2014-03-12 | 2021-08-10 | Fujifilm Sonosite, Inc. | Method of manufacturing high frequency ultrasound transducer having an ultrasonic lens with integral central matching layer |
US11931203B2 (en) | 2014-03-12 | 2024-03-19 | Fujifilm Sonosite, Inc. | Manufacturing method of a high frequency ultrasound transducer having an ultrasonic lens with integral central matching layer |
Also Published As
Publication number | Publication date |
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JP6102075B2 (ja) | 2017-03-29 |
KR20140148452A (ko) | 2014-12-31 |
US20130258803A1 (en) | 2013-10-03 |
US20150265246A1 (en) | 2015-09-24 |
KR101649436B1 (ko) | 2016-08-19 |
US9554775B2 (en) | 2017-01-31 |
US10040098B2 (en) | 2018-08-07 |
CN104203109B (zh) | 2016-06-15 |
JP2013208148A (ja) | 2013-10-10 |
US20170095838A1 (en) | 2017-04-06 |
EP2832297A1 (en) | 2015-02-04 |
EP2832297A4 (en) | 2015-11-18 |
CN104203109A (zh) | 2014-12-10 |
TW201338877A (zh) | 2013-10-01 |
TWI620601B (zh) | 2018-04-11 |
US9079220B2 (en) | 2015-07-14 |
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