WO2013129680A1 - サーミスタ用金属窒化物材料及びその製造方法並びにフィルム型サーミスタセンサ - Google Patents
サーミスタ用金属窒化物材料及びその製造方法並びにフィルム型サーミスタセンサ Download PDFInfo
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- WO2013129680A1 WO2013129680A1 PCT/JP2013/055769 JP2013055769W WO2013129680A1 WO 2013129680 A1 WO2013129680 A1 WO 2013129680A1 JP 2013055769 W JP2013055769 W JP 2013055769W WO 2013129680 A1 WO2013129680 A1 WO 2013129680A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/06—Epitaxial-layer growth by reactive sputtering
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/38—Nitrides
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
Definitions
- the present invention relates to a metal nitride material for a thermistor that can be directly formed on a film or the like without firing, a method for manufacturing the material, and a film type thermistor sensor.
- a thermistor material used for a temperature sensor or the like is required to have a high B constant for high accuracy and high sensitivity.
- transition metal oxides such as Mn, Co, and Fe are generally used for such thermistor materials (see Patent Documents 1 and 2).
- these thermistor materials require firing at 600 ° C. or higher in order to obtain stable thermistor characteristics.
- This Ta—Al—N-based material is produced by performing sputtering in a nitrogen gas-containing atmosphere using a material containing the above elements as a target. Further, the obtained thin film is heat-treated at 350 to 600 ° C. as necessary.
- a very thin thermistor sensor can be obtained by using a film.
- a film made of a resin material generally has a heat resistant temperature as low as 150 ° C. or less, and polyimide known as a material having a relatively high heat resistant temperature has only a heat resistance of about 200 ° C.
- a thermistor material forming process In the case where heat treatment is applied, application is difficult.
- the conventional oxide thermistor material requires firing at 600 ° C. or higher in order to realize desired thermistor characteristics, and there is a problem that a film type thermistor sensor directly formed on a film cannot be realized.
- thermistor material that can be directly film-formed without firing, but even with the thermistor material described in Patent Document 3, the obtained thin film can be obtained as necessary in order to obtain desired thermistor characteristics. It was necessary to perform heat treatment at 350 to 600 ° C. Further, in this example of the thermistor material, a material having a B constant of about 500 to 3000 K is obtained in the example of the Ta-Al-N-based material, but there is no description regarding heat resistance, and the thermal reliability of the nitride-based material. Sex was unknown.
- the present invention has been made in view of the above-described problems, and can be directly formed on a film or the like without firing, and has high heat resistance and high reliability.
- An object is to provide a film type thermistor sensor.
- the inventors of the present invention focused on the AlN system among the nitride materials and made extensive research. As a result, it is difficult for AlN as an insulator to obtain optimum thermistor characteristics (B constant: about 1000 to 6000 K). For this reason, it was found that by replacing the Al site with a specific metal element that improves electrical conduction and having a specific crystal structure, a good B constant and heat resistance can be obtained without firing. Therefore, the present invention has been obtained from the above findings, and the following configuration has been adopted in order to solve the above problems.
- the metal nitride material for a thermistor according to the second invention is a columnar crystal formed in a film shape and extending in a direction perpendicular to the surface of the film in the first invention. . That is, since the metal nitride material for the thermistor is a columnar crystal extending in a direction perpendicular to the surface of the film, the film has high crystallinity and high heat resistance can be obtained.
- the metal nitride material for thermistors according to the third invention is formed in a film shape in the first or second invention, and the c-axis is oriented more strongly than the a-axis in the direction perpendicular to the surface of the film. It is characterized by that. That is, in this metal nitride material for the thermistor, the c-axis is oriented more strongly than the a-axis in the direction perpendicular to the film surface, so that a higher B constant can be obtained than when the a-axis orientation is strong, Excellent reliability for heat resistance.
- a film type thermistor sensor comprises an insulating film, a thin film thermistor portion formed of the metal nitride material for a thermistor of any one of the first to third inventions on the insulating film, and at least And a pair of pattern electrodes formed above or below the thin film thermistor portion. That is, in this film type thermistor sensor, since the thin film thermistor portion is formed of the metal nitride material for a thermistor according to any one of the first to third inventions on the insulating film, it is formed without firing and has a high B constant.
- an insulating film having low heat resistance such as a resin film can be used by the thin film thermistor portion having high heat resistance, and a thin and flexible thermistor sensor having good thermistor characteristics can be obtained.
- substrate materials using ceramics such as alumina are often used in the past. For example, when the thickness is reduced to 0.1 mm, the substrate material is very brittle and easily broken. Therefore, for example, a very thin film type thermistor sensor having a thickness of 0.1 mm can be obtained.
- a method for producing a metal nitride material for a thermistor according to a fifth invention is a method for producing a metal nitride material for a thermistor according to any one of the first to third inventions, using a Ti—Al alloy sputtering target. And a film forming step of forming a film by reactive sputtering in a nitrogen-containing atmosphere. That is, in this method for producing the thermistor metal nitride material, the film is formed by reactive sputtering in a nitrogen-containing atmosphere using a Ti—Al alloy sputtering target. A physical material can be deposited without firing.
- a method for producing a metal nitride material for a thermistor according to a sixth invention is characterized in that, in the fifth invention, a sputtering gas pressure in the reactive sputtering is set to less than 0.67 Pa. That is, in this method for producing the thermistor metal nitride material, since the sputtering gas pressure in reactive sputtering is set to less than 0.67 Pa, the c-axis is oriented more strongly than the a-axis in the direction perpendicular to the film surface.
- a film of the metal nitride material for a thermistor according to the third invention can be formed.
- the method for producing a metal nitride material for a thermistor according to a seventh aspect of the present invention includes, in the fifth or sixth aspect, a step of irradiating the formed film with nitrogen plasma after the film formation step.
- a film is formed by performing reactive sputtering in a nitrogen-containing atmosphere using a Ti—Al alloy sputtering target.
- the metal nitride material for thermistor can be formed without firing.
- the film type thermistor sensor according to the present invention since the thin film thermistor portion is formed of the metal nitride material for thermistor of the present invention on the insulating film, the insulating film having low heat resistance such as a resin film. Can be used to obtain a thin and flexible thermistor sensor having good thermistor characteristics.
- the substrate material is not a ceramic material that is very brittle and fragile when thin, but a resin film, a very thin film-type thermistor sensor having a thickness of 0.1 mm can be obtained.
- FIG. 1 is a Ti—Al—N-based ternary phase diagram showing a composition range of a thermistor metal nitride material in an embodiment of a thermistor metal nitride material, a manufacturing method thereof, and a film type thermistor sensor according to the present invention.
- it is a perspective view which shows a film type thermistor sensor.
- it is a perspective view which shows the manufacturing method of a film type thermistor sensor in order of a process.
- Example of the metal nitride material for thermistors which concerns on this invention, its manufacturing method, and a film type thermistor sensor it is the front view and top view which show the element
- it is a graph which shows the relationship between 25 degreeC resistivity and B constant.
- it is a graph which shows the relationship between Al / (Ti + Al) ratio and B constant.
- Example which concerns on this invention it is a graph which shows the relationship between Al / (Ti + Al) ratio and B constant which compared the Example with strong a-axis orientation, and the Example with strong c-axis orientation.
- it is a cross-sectional SEM photograph which shows an Example with strong c-axis orientation.
- it is a cross-sectional SEM photograph which shows an Example with a strong a-axis orientation.
- FIGS. 1-10 an embodiment of a metal nitride material for a thermistor, a manufacturing method thereof, and a film type thermistor sensor according to the present invention will be described with reference to FIGS.
- the scale is appropriately changed as necessary to make each part recognizable or easily recognizable.
- each composition ratio (x, y, z) of the points A, B, C, and D is A (15, 35, 50), B (2.5, 47.5, 50), C (3, 57, 40), D (18, 42, 40),
- the metal nitride material for the thermistor is a columnar crystal formed in a film shape and extending in a direction perpendicular to the surface of the film. Further, it is preferable that the c-axis is oriented more strongly than the a-axis in the direction perpendicular to the film surface. Whether the a-axis orientation (100) is strong or the c-axis orientation (002) is strong in the direction perpendicular to the film surface (film thickness direction) is determined using X-ray diffraction (XRD).
- XRD X-ray diffraction
- the film type thermistor sensor 1 includes an insulating film 2, a thin film thermistor section 3 formed on the insulating film 2 from the metal nitride material for the thermistor, and at least the thin film thermistor section 3. And a pair of pattern electrodes 4 formed thereon.
- the insulating film 2 is formed in a band shape with, for example, a polyimide resin sheet.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate, or the like may be used.
- the pair of pattern electrodes 4 is formed by patterning a laminated metal film of, for example, a Cr film and an Au film, and a pair of comb-shaped electrode portions 4a having a comb-shaped pattern disposed in opposition to each other, and tip portions of the comb-shaped electrode portions 4a have a tip portion. It has a pair of linearly extending portions 4b that are connected and have base ends extending from the ends of the insulating film 2 and extending.
- a plating portion 4c such as Au plating is formed as a lead wire lead-out portion.
- a lead wire is joined to the plating portion 4c with a solder material or the like.
- the polyimide coverlay film 5 is pressure-bonded on the insulating film 2 except for the end of the insulating film 2 including the plated portion 4c.
- polyimide or epoxy resin material may be formed on the insulating film 2 by printing.
- the manufacturing method of the metal nitride material for thermistors of the present embodiment includes a film forming step of forming a film by performing reactive sputtering in a nitrogen-containing atmosphere using a Ti—Al alloy sputtering target. Further, it is preferable to set the sputtering gas pressure in the reactive sputtering to less than 0.67 Pa. Furthermore, it is preferable to irradiate the formed film with nitrogen plasma after the film forming step.
- the present embodiment is formed on the insulating film 2 of a polyimide film having a thickness of 50 ⁇ m shown in FIG. 3A by reactive sputtering as shown in FIG.
- a thin film thermistor portion 3 made of the metal nitride material for thermistor is formed to a thickness of 200 nm.
- the sputtering conditions at that time are, for example, ultimate vacuum: 5 ⁇ 10 ⁇ 6 Pa, sputtering gas pressure: 0.4 Pa, target input power (output): 200 W, and nitrogen gas content in a mixed gas atmosphere of Ar gas + nitrogen gas Pressure: 20%.
- the thin film thermistor portion 3 is formed by forming a metal nitride material for the thermistor into a desired size using a metal mask. Note that it is desirable to irradiate the formed thin film thermistor portion 3 with nitrogen plasma. For example, the thin film thermistor section 3 is irradiated with nitrogen plasma under a vacuum degree: 6.7 Pa, an output: 200 W, and an N 2 gas atmosphere.
- a Cr film is formed to 20 nm, and an Au film is further formed to 200 nm.
- pre-baking is performed at 110 ° C. for 1 minute 30 seconds.
- unnecessary portions are removed with a developer, and post baking is performed at 150 ° C. for 5 minutes.
- Perform patterning Thereafter, unnecessary electrode portions are wet-etched with a commercially available Au etchant and Cr etchant, and as shown in FIG. 3C, pattern electrodes 4 having desired comb-shaped electrode portions 4a are formed by resist stripping. .
- the pattern electrode 4 may be formed on the insulating film 2 first, and the thin film thermistor portion 3 may be formed on the comb electrode portion 4a.
- the comb electrode portion 4 a of the pattern electrode 4 is formed under the thin film thermistor portion 3.
- a polyimide coverlay film 5 with an adhesive having a thickness of 50 ⁇ m is placed on the insulating film 2, and pressed and bonded at 150 ° C. and 2 MPa for 10 minutes.
- an end portion of the linearly extending portion 4b is formed with a 2 ⁇ m Au thin film by using, for example, an Au plating solution to form a plated portion 4c.
- the general formula: Ti x Al y N z (0.70 ⁇ y / (x + y) ⁇ 0.95, 0.4 ⁇ z ⁇ 0.5, x + y + z 1), and its crystal structure is a hexagonal crystal system and a wurtzite type single phase, so that a good B constant can be obtained without firing and a high heat resistance.
- the metal nitride material for the thermistor is a columnar crystal extending in a direction perpendicular to the surface of the film, the film has high crystallinity and high heat resistance.
- the c-axis is oriented stronger than the a-axis in the direction perpendicular to the film surface, and a higher B constant can be obtained than when the a-axis orientation is strong.
- the film is formed by performing reactive sputtering in a nitrogen-containing atmosphere using a Ti—Al alloy sputtering target. Therefore, the metal nitride for thermistors made of TiAlN.
- the material can be deposited without firing. Also, by setting the sputtering gas pressure in reactive sputtering to less than 0.67 Pa, a thermistor metal nitride material film in which the c-axis is oriented more strongly than the a-axis in the direction perpendicular to the surface of the film. Can be formed. Furthermore, since the formed film is irradiated with nitrogen plasma after the film forming step, the film has fewer nitrogen defects and further improves heat resistance.
- the thin film thermistor portion 3 is formed on the insulating film 2 from the thermistor metal nitride material.
- the formed thin film thermistor portion 3 having a high B constant and high heat resistance allows the use of an insulating film 2 having low heat resistance such as a resin film, and a thin and flexible thermistor sensor having good thermistor characteristics. It is done.
- substrate materials using ceramics such as alumina are often used in the past. For example, when the thickness is reduced to 0.1 mm, the substrate material is very brittle and easily broken. Therefore, for example, a very thin film type thermistor sensor having a thickness of 0.1 mm can be obtained.
- a film evaluation element 21 shown in FIG. 4 was produced as follows. First, by reactive sputtering, Ti—Al alloy targets having various composition ratios are used to form Si substrates S with thermal oxide films on Si wafers with various composition ratios shown in Table 1 having a thickness of 500 nm. The formed thin film thermistor portion 3 of the thermistor metal nitride material was formed.
- the sputtering conditions at that time were: ultimate vacuum: 5 ⁇ 10 ⁇ 6 Pa, sputtering gas pressure: 0.1 to 1 Pa, target input power (output): 100 to 500 W, and in a mixed gas atmosphere of Ar gas + nitrogen gas The nitrogen gas partial pressure was changed from 10 to 100%.
- a 20 nm Cr film was formed on the thin film thermistor portion 3 by sputtering, and a 200 nm Au film was further formed. Furthermore, after applying a resist solution thereon with a spin coater, pre-baking is performed at 110 ° C. for 1 minute 30 seconds, and after exposure with an exposure apparatus, unnecessary portions are removed with a developing solution, and post baking is performed at 150 ° C. for 5 minutes. Patterning. Thereafter, unnecessary electrode portions were wet-etched with a commercially available Au etchant and Cr etchant, and a patterned electrode 24 having a desired comb-shaped electrode portion 24a was formed by resist stripping.
- the X-ray source is MgK ⁇ (350 W)
- the path energy is 58.5 eV
- the measurement interval is 0.125 eV
- the photoelectron extraction angle with respect to the sample surface is 45 deg
- the analysis area is about Quantitative analysis was performed under the condition of 800 ⁇ m ⁇ .
- the quantitative accuracy the quantitative accuracy of N / (Ti + Al + N) is ⁇ 2%
- the quantitative accuracy of Al / (Ti + Al) is ⁇ 1%.
- B constant (K) In (R25 / R50) / (1 / T25-1 / T50)
- the Ti x Al y N 3 ternary triangular diagram of the composition ratio shown in FIG. 1 of z, the points A, B, C, in a region surrounded by D, ie, "0.70 ⁇ y / (x + y) ⁇ 0.95, 0.4 ⁇ z ⁇ 0.5, x + y + z 1 ”, thermistor characteristics of resistivity: 100 ⁇ cm or more, B constant: 1500 K or more Has been achieved.
- FIG. 5 shows a graph showing the relationship between the resistivity at 25 ° C. and the B constant based on the above results.
- Comparative Examples 3 to 12 shown in Table 1 are regions of Al / (Ti + Al) ⁇ 0.7, and the crystal system is a cubic NaCl type.
- the NaCl type and the wurtzite type coexist.
- the specific resistance value at 25 ° C. was less than 100 ⁇ cm
- the B constant was less than 1500 K
- the region was low resistance and low B constant.
- Comparative Examples 1 and 2 shown in Table 1 are regions where N / (Al + Ti + N) is less than 40%, and the metal is in a crystalline state with insufficient nitriding.
- Comparative Examples 1 and 2 neither the NaCl type nor the wurtzite type was in a state of very poor crystallinity. Further, in these comparative examples, it was found that both the B constant and the resistance value were very small and close to the metallic behavior.
- Thin film X-ray diffraction (identification of crystal phase)
- the crystal phase of the thin film thermistor part 3 obtained by reactive sputtering was identified by oblique incidence X-ray diffraction (Grazing Incidence X-ray Diffraction). .
- the impurity phase is not confirmed, and is a wurtzite type single phase.
- the crystal phase was neither a wurtzite type phase nor an NaCl type phase as described above, and could not be identified in this test. Further, these comparative examples were materials with very poor crystallinity because the peak width of XRD was very wide. This is considered to be a metal phase with insufficient nitriding because it is close to a metallic behavior due to electrical characteristics.
- all the examples of the present invention are films of wurtzite type phase, and since the orientation is strong, is the a-axis orientation strong in the crystal axis in the direction perpendicular to the Si substrate S (film thickness direction)? Whether the c-axis orientation is strong was investigated using XRD. At this time, the peak intensity ratio of (100) (hkl index indicating a-axis orientation) and (002) (hkl index indicating c-axis orientation) was measured in order to investigate the orientation of crystal axes.
- the example in which the film was formed at a sputtering gas pressure of less than 0.67 Pa was a film having a (002) strength much stronger than (100) and a stronger c-axis orientation than a-axis orientation.
- the example in which the film was formed at a sputtering gas pressure of 0.67 Pa or higher was a material having a (100) strength much stronger than (002) and a a-axis orientation stronger than the c-axis orientation. It is confirmed that a single wurtzite-type phase is formed even if a polyimide film is formed under the same film formation conditions. Moreover, even if it forms into a film on a polyimide film on the same film-forming conditions, it has confirmed that orientation does not change.
- FIG. 8 shows an example of the XRD profile of the embodiment having a strong a-axis orientation.
- Al / (Ti + Al) 0.83 (wurtzite type, hexagonal crystal), and the incident angle was measured as 1 degree.
- the intensity of (100) is much stronger than (002).
- FIG. 1 An example of the XRD profile of the comparative example is shown in FIG.
- Al / (Ti + Al) 0.6 (NaCl type, cubic crystal), and the incident angle was 1 degree.
- a peak that could be indexed as a wurtzite type (space group P6 3 mc (No. 186)) was not detected, and it was confirmed to be a NaCl type single phase.
- the correlation between the crystal structure and the electrical characteristics was further compared in detail for the example of the present invention which is a wurtzite type material.
- a material in which the crystal axis having a strong degree of orientation in the direction perpendicular to the substrate surface is the c-axis with respect to the Al / (Ti + Al) ratio being substantially the same ratio (Examples 7, 9, 10, 11) and a material (Examples 19, 20, 21) which is an a-axis.
- FIG. 11 shows a cross-sectional SEM photograph of the thin film thermistor portion 3 of the ore type, hexagonal crystal and strong c-axis orientation.
- the samples of these examples are obtained by cleaving and breaking the Si substrate S. Moreover, it is the photograph which observed the inclination at an angle of 45 degrees.
- the ionic radius of Ta is much larger than that of Ti or Al, and thus a wurtzite type phase cannot be produced in a high concentration Al region. Since the TaAlN system is not a wurtzite type phase, the wurtzite type phase Ti-Al-N system is considered to have better heat resistance.
- N / (Ti + Al + N) is made in the range of 0.4 to 0.5, good thermistor characteristics can be exhibited.
- the amount of nitrogen is smaller than 0.5, and it can be seen that there are nitrogen defects in the material. For this reason, it is desirable to add a process for compensating for nitrogen defects, and as one of them, the nitrogen plasma irradiation is preferable.
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Abstract
Description
定 反応性スパッタ法にて得られた薄膜サーミスタ部3について、4端子法にて25℃での比抵抗を測定した。その結果を表1に示す。(3)B定数測定 膜評価用素子21の25℃及び50℃の抵抗値を恒温槽内で測定し、25℃と50℃との抵抗値よりB定数を算出した。その結果を表1に示す。
Claims (7)
- サーミスタに用いられる金属窒化物材料であって、 一般式:TixAlyNz(0.70≦y/(x+y)≦0.95、0.4≦z≦0.5、x+y+z=1)で示される金属窒化物からなり、 その結晶構造が、六方晶系のウルツ鉱型の単相であることを特徴とするサーミスタ用金属窒化物材料。
- 請求項1に記載のサーミスタ用金属窒化物材料において、 膜状に形成され、 前記膜の表面に対して垂直方向に延在している柱状結晶であることを特徴とするサーミスタ用金属窒化物材料。
- 請求項1に記載のサーミスタ用金属窒化物材料において、 膜状に形成され、 前記膜の表面に対して垂直方向にa軸よりc軸が強く配向していることを特徴とするサーミスタ用金属窒化物材料。
- 絶縁性フィルムと、 該絶縁性フィルム上に請求項1に記載のサーミスタ用金属窒化物材料で形成された薄膜サーミスタ部と、 少なくとも前記薄膜サーミスタ部の上又は下に形成された一対のパターン電極とを備えていることを特徴とするフィルム型サーミスタセンサ。
- 請求項1に記載のサーミスタ用金属窒化物材料を製造する方法であって、 Ti−Al合金スパッタリングターゲットを用いて窒素含有雰囲気中で反応性スパッタを行って成膜する成膜工程を有していることを特徴とするサーミスタ用金属窒化物材料の製造方法。
- 請求項5に記載のサーミスタ用金属窒化物材料の製造方法において、
前記反応性スパッタにおけるスパッタガス圧を、0.67Pa未満に設定することを特徴とするサーミスタ用金属窒化物材料の製造方法。 - 請求項5に記載のサーミスタ用金属窒化物材料の製造方法において、
前記成膜工程後に、形成された膜に窒素プラズマを照射する工程を有していることを特徴とするサーミスタ用金属窒化物材料の製造方法。
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CN201380004634.8A CN104025211B (zh) | 2012-02-28 | 2013-02-26 | 热敏电阻用金属氮化物材料及其制造方法以及薄膜型热敏电阻传感器 |
US14/380,997 US9905341B2 (en) | 2012-02-28 | 2013-02-26 | Metal nitride material for thermistor, method for producing same, and film type thermistor sensor |
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