WO2013114951A1 - シート貼付装置および貼付方法 - Google Patents

シート貼付装置および貼付方法 Download PDF

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Publication number
WO2013114951A1
WO2013114951A1 PCT/JP2013/050732 JP2013050732W WO2013114951A1 WO 2013114951 A1 WO2013114951 A1 WO 2013114951A1 JP 2013050732 W JP2013050732 W JP 2013050732W WO 2013114951 A1 WO2013114951 A1 WO 2013114951A1
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WO
WIPO (PCT)
Prior art keywords
sheet
adhesive sheet
feeding
plate
plate member
Prior art date
Application number
PCT/JP2013/050732
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English (en)
French (fr)
Japanese (ja)
Inventor
芳昭 杉下
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to CN201380007446.0A priority Critical patent/CN104221139B/zh
Priority to KR1020147024248A priority patent/KR102038812B1/ko
Publication of WO2013114951A1 publication Critical patent/WO2013114951A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to a plate-like member.
  • a sheet for attaching an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape to the surface of a semiconductor wafer that is a plate-like member (hereinafter sometimes simply referred to as “wafer”)
  • a sticking device is known (see, for example, Patent Document 1).
  • the sheet sticking apparatus described in Patent Document 1 includes a table that sucks and holds a wafer, a sheet sticking unit that sticks a belt-like adhesive sheet to the held wafer, and a cutter unit that cuts the adhesive sheet, By cutting the adhesive sheet with the adhesive sheet attached, the adhesive sheet having a predetermined shape can be attached to the wafer.
  • the objective of this invention is providing the sheet sticking apparatus and sticking method which can suppress the increase in the installation area accompanying the increase in the size of a plate-shaped member as much as possible.
  • Another object of the present invention is to provide a sheet sticking device and a sticking method that can reduce the risk of impurities being mixed between a plate-like member and an adhesive sheet as much as possible.
  • the sheet sticking device of the present invention has an inclined surface that is inclined with respect to a horizontal plane, and a support means for supporting a plate-like member on the inclined surface, and an adhesive sheet are temporarily attached to one surface of a strip-shaped release sheet
  • the sheet sticking device of the present invention has an inclined surface that is inclined with respect to a horizontal plane, a supporting means that supports the plate-like member on the inclined surface, a feeding means that feeds the belt-shaped adhesive sheet as a feeding object, A pressing means for pressing the adhesive sheet fed by the feeding means against the plate-like member, and the support means and the pressing means are moved relative to each other in the in-plane direction of the inclined surface so that the adhesive sheet is attached to the plate-like member. And a cutting means for cutting the adhesive sheet affixed to the plate member into a predetermined shape.
  • the support means includes first positioning means that contacts the outer edge of the plate-like member and positions the plate-like member at a predetermined position on the inclined surface.
  • the sheet sticking device of the present invention includes a receiving unit that receives the plate member when the support of the plate member by the support unit is released.
  • the feeding means is provided so that the feeding object can be fed in a state where a width direction perpendicular to the feeding direction of the feeding object is parallel to the inclined surface. It is preferable to include meandering preventing means for preventing the object from meandering in the width direction.
  • the sheet sticking apparatus of the present invention further includes second positioning means for positioning the adhesive sheet with respect to the plate-like member by relatively moving the support means and the feeding means in the width direction of the feeding object. It is preferable.
  • the plate-like member is supported by an inclined surface inclined with respect to the horizontal plane, and the original fabric in which the adhesive sheet is temporarily attached to one surface of the strip-shaped release sheet is fed out as a feeding object.
  • the peeled adhesive sheet is peeled off from the rolled-out original peel sheet, the peeled adhesive sheet is pressed against the plate-like member by pressing means, and the plate-like member and the pressing means are placed within the plane of the inclined surface.
  • the adhesive sheet is attached to the plate-like member by being relatively moved in the direction.
  • the plate-like member is supported by an inclined surface inclined with respect to the horizontal plane, the belt-like adhesive sheet is fed out as a feeding object, and the fed-out adhesive sheet is pressed by the pressing means by the plate member.
  • the adhesive sheet is attached to the plate member by moving the plate member and the pressing means relative to each other in the in-plane direction of the inclined surface, and the adhesive sheet attached to the plate member is predetermined. It is characterized by cutting into a shape.
  • the adhesive sheet can be attached in a state where the plate member is inclined with respect to the horizontal plane, an increase in the installation area accompanying an increase in the size of the plate member is suppressed as much as possible. Can do.
  • the adhesive sheet is attached in a state where the plate-like member is inclined with respect to the horizontal plane, the possibility that impurities in the atmosphere will fall on the plate-like member is reduced, and even if it falls on the plate-like member, Since it becomes easy to fall from on a plate-shaped member by gravity, it can suppress that an impurity remains on a plate-shaped member, and can reduce the risk that an impurity mixes between a plate-shaped member and an adhesive sheet as much as possible.
  • the plate-like member can be positioned by merely bringing the plate-like member into contact with the contact portion even when the plate-like member is supported on the inclined surface. For this reason, since the time required for positioning the plate-like member can be shortened, the processing capacity per unit time can be improved. Moreover, if a receiving means is provided, even if support of a plate-shaped member is cancelled
  • the front view of the sheet sticking apparatus of FIG. The perspective view which shows the sheet sticking apparatus which concerns on 2nd Embodiment of this invention.
  • the same constituent members as those described in the first embodiment and constituent members having the same functions are denoted by the same reference numerals as those in the first embodiment.
  • the description of is omitted or simplified.
  • the X axis, the Y axis, and the Z axis in this specification are in a relationship of being orthogonal to each other, the X axis and the Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane.
  • “+” is the direction of the arrow of each axis
  • “ ⁇ ” is the direction opposite to the arrow.
  • a sheet sticking apparatus 1 sticks an adhesive sheet AS to a wafer WF as a plate-like member.
  • the adhesive sheet AS has an adhesive layer AD on one surface of the base sheet BS, is cut in advance into a predetermined size, and is temporarily attached to the strip-shaped release sheet RL via the adhesive layer AD.
  • it is prepared in advance as a raw fabric RS as a feeding object.
  • the sheet sticking apparatus 1 includes a supporting unit 2 that supports the wafer WF, a feeding unit 3 that feeds the original fabric RS, a peeling unit 4 that peels the adhesive sheet AS from the peeling sheet RL of the fed raw fabric RS, and a peeling unit. 4, pressing means 5 for pressing the adhesive sheet AS peeled off to the wafer WF, sheet positioning means 6 as second positioning means for positioning the adhesive sheet AS with respect to the wafer WF, support means 2 and pressing means 5
  • a moving unit 7 for relatively moving the adhesive sheet AS to the wafer WF and a receiving unit 8 for receiving the wafer WF when the support unit 2 releases the support of the wafer WF are provided.
  • a transfer unit 9 that transfers the wafer WF is provided in the sheet sticking apparatus 1.
  • the support means 2 includes a table 22 having a support surface 21 as an inclined surface capable of sucking and holding the wafer WF by suction holding means (not shown) such as a decompression pump and a vacuum ejector, and a direct drive device provided in the table 22.
  • suction holding means such as a decompression pump and a vacuum ejector
  • a direct drive device provided in the table 22.
  • Abutting portion 25 (FIG. 2).
  • the support surface 21 is a surface parallel to a plane including the X axis and the Z axis, and is disposed in a state inclined with respect to a horizontal plane (inclination angle 90 °).
  • the feeding means 3 includes a support roller 31 that winds and supports the original fabric RS, a plurality of guide rollers 32 that guide the original fabric RS, a drive roller 33 that is driven by a driving device (not shown), and a drive roller 33.
  • a pinch roller 34 that sandwiches the release sheet RL therebetween and a collection roller 35 that is driven by a driving device (not shown) to collect the release sheet RL are supported by the base frame 30 as a whole.
  • the feeding means 3 is configured to be able to feed out the original fabric RS in a state where the width direction orthogonal to the feeding direction of the original fabric RS is parallel to the support surface 21 (a state in which it is in the Z-axis direction). Further, the base frame 30 constitutes meandering prevention means so as to prevent the original fabric RS from meandering in the width direction.
  • the peeling means 4 includes a peeling plate 41 supported in a posture extending in the Z-axis direction by the base frame 30, and the peeling sheet RL of the raw fabric RS is folded back at the edge of the peeling plate 41, thereby removing the peeling sheet RL.
  • the adhesive sheet AS is configured to peel off.
  • the pressing means 5 includes a pressing roller 51 arranged in a posture extending in the Z-axis direction.
  • the pressing roller 51 is made of an elastically deformable member such as rubber or resin.
  • the sheet positioning means 6 includes a linear motion motor 61 as a driving device in which an output shaft (not shown) is fixed to the base frame 30, and the base frame 30 is moved in the Z-axis direction by the linear motion motor 61, thereby supporting means. 2 and the feeding means 3 are configured to be relatively movable in the in-plane direction of the support surface 21 and in the width direction of the original fabric RS.
  • the moving means 7 includes a linear motor 72 as a driving device extending in the X-axis direction, and the slider 71 supports the table 22 and is configured to be movable in the X-axis direction.
  • the receiving means 8 is disposed below the range in which the table 22 moves, and in parallel with the support surface 21 in the range in which the table 22 moves, and the housing member 81 having a U-shaped cross section provided along the X-axis direction. And two tilting prevention plates 82 are provided. Buffering means 83, 84 made of an elastic member such as rubber, resin, sponge, etc. are provided on the housing portion of the housing member 81 and the surface of the tilt prevention plate 82 on the side of the table 22. In addition, a gap 82 ⁇ / b> A that allows the pressing roller 51 to press the adhesive sheet AS against the wafer WF is provided between the tilt prevention plates 82.
  • the transport means 9 includes an articulated robot 91 as a driving device and a suction tool 92 detachably provided at the tip of the articulated robot 91.
  • the suction tool 92 is attached to suction means such as a suction pump (not shown). By being connected, the wafer WF can be sucked and held.
  • the articulated robot 91 is a so-called 6-axis robot having joints that can rotate at six locations, and is configured such that the suction tool 92 can be displaced at any position and at any angle within the work range of the articulated robot 91. ing.
  • the raw fabric RS is set as shown in FIG. Further, the linear motion motor 61 is driven to move the base frame 30 in the Z-axis direction, thereby positioning the feeding position of the adhesive sheet AS with respect to the wafer WF.
  • the transfer means 9 drives the articulated robot 91 to take out the wafer WF from the wafer storage cassette CT via the suction tool 92, and the support surface of the table 22 waiting at the position indicated by the double chain line in FIG.
  • the wafer WF is brought into contact with 21.
  • the transfer means 9 makes the contact portion 25 protruding from the support surface 21 contact two points on the outer edge of the wafer WF, and positions the wafer WF at a predetermined position on the support surface 21.
  • the support means 2 drives a suction holding means (not shown) to suck and hold the wafer WF with the support surface 21 and drives the linear motion motor 23 to bring the contact portion 25 into the table 22 as shown in FIG. Evacuate.
  • the moving means 7 drives the linear motor 72 to move the table 22 in the + X axis direction.
  • detection means (not shown) detects that the wafer WF has reached a predetermined position
  • the feeding means 3 drives the driving roller 33 in synchronism with the movement of the table 22 and feeds the original fabric RS.
  • the adhesive sheet AS is peeled off from the release sheet RL by the release plate 41, and the peeled adhesive sheet AS is pressed against the wafer WF by the pressing roller 51 and pasted.
  • the raw fabric RS is prevented from meandering in the Z-axis direction by restricting movement in the ⁇ Z-axis direction by the base frame 30.
  • the moving unit 7 stops driving the linear motor 72. Thereafter, when the transfer means 9 drives the articulated robot 91 and the suction tool 92 sucks and holds the wafer WF, the support means 2 stops driving the suction holding means (not shown). Then, the transfer means 9 drives the articulated robot 91 to store the wafer WF in the wafer storage cassette CT. Thereafter, the moving means 7 drives the linear motor 72 to move the table 22 in the ⁇ X axis direction to return it to the position indicated by the chain double-dashed line in FIG. 1, and thereafter the same operation as described above is repeated.
  • the wafer WF falls and is damaged.
  • the wafer WF is supported by the housing member 81 and the tilt prevention plate 82 as shown by the two-dot chain line in FIG. Therefore, there is no inconvenience that the wafer WF is damaged.
  • the buffer means 83 of the housing member 81 and the buffer means 84 of the anti-tilt plate 82 absorb the impact when the wafer WF falls, damage to the wafer WF can be more reliably suppressed.
  • the support means 2 supports the wafer WF on the support surface 21 inclined with respect to the horizontal plane, and the moving means 7 moves the support means 2 and the pressing means 5 relative to each other in the in-plane direction of the support surface 21 to form the wafer WF.
  • Adhesive sheet AS is affixed. Therefore, an increase in the installation area of the apparatus accompanying an increase in the size of the wafer WF can be suppressed as much as possible.
  • the support surface 21 is inclined with respect to the horizontal plane, the possibility that impurities in the atmosphere fall on the wafer WF is reduced, and even if it falls on the wafer WF, it falls from the wafer WF due to gravity. Since it becomes easy, it can suppress that an impurity remains on the wafer WF, and can reduce the risk that an impurity mixes between the wafer WF and an adhesive sheet as much as possible.
  • the feeding means 3A includes a support roller 31 that winds and supports the belt-like adhesive sheet AS1, a guide roller 32 that guides the adhesive sheet AS1, a drive roller 33 that is driven by a drive device (not shown), and a drive roller 33.
  • a pinch roller 34 that sandwiches the adhesive sheet AS1 in between, a plurality of guide rollers 36 that guide the unnecessary sheet US generated by cutting the strip-shaped adhesive sheet AS1, and a drive device (not shown) to drive the unnecessary sheet US.
  • a recovery roller 35 for recovery, a drive roller 37 driven by a drive device (not shown), and a pinch roller 38 that sandwiches the adhesive sheet AS1 between the drive roller 37 are provided.
  • the support roller 31, the guide roller 32, the drive roller 33, and the pinch roller 34 are supported by the base frame 30.
  • the guide roller 36 and the collection roller 35 are supported by a collection side frame 39 that can also serve as a meandering prevention unit.
  • the moving means 7A extends in the X-axis direction, and a linear motor 74 as a driving device that drives the first slider 73 that supports the pressing roller 51, and supports the linear motor 74 movably in the Y-axis direction (not shown). And a driving device.
  • the pressing unit 5 is configured to be movable relative to the support unit 2 in the X-axis direction and the Y-axis direction.
  • the driving roller 37 and the pinch roller 38 of the feeding means 3A are supported by the second slider 75 of the linear motor 74, and are configured to be movable relative to the support means 2 in the X-axis direction and the Y-axis direction.
  • the cutting means 10 includes an articulated robot 91 that also serves as the transport means 9 and a cutter tool 94 that is detachably provided on the articulated robot 91 and has a cutter blade 93, and is an adhesive sheet that is affixed to the wafer WF.
  • the AS 1 is configured to be cut along the outer edge of the wafer WF.
  • the adhesive sheet AS1 is set as shown in FIG.
  • the pressing roller 51, the driving roller 37, and the pinch roller 38 are positioned in the vicinity of the driving roller 33, and a gap is formed between the unnecessary sheet US and the support surface 21.
  • the linear motor 74 is stopped in a state where the feeding unit 3 ⁇ / b> A stops the rotation of the drive roller 37.
  • the drive roller 37 and the pinch roller 38 are moved in the + X-axis direction.
  • the unnecessary sheet US is wound up by driving the collection roller 35.
  • the unused portion of the adhesive sheet AS1 is fed out so as to face the wafer WF in the + Y-axis direction. Also at this time, a slight gap is formed between the adhesive sheet AS1 and the support surface 21.
  • the moving means 7A drives a driving device (not shown) to move the pressing roller 51 in the ⁇ Y-axis direction, and the adhesive roller AS1 is moved to the support surface 21 by the pressing roller 51 as shown by a two-dot chain line in FIG. Press.
  • the moving means 7A drives the linear motor 74 and moves the pressing roller 51 in the + X-axis direction, thereby attaching the adhesive sheet AS1 to the wafer WF.
  • the cutting means 10 drives the articulated robot 91 and causes the suction tool 92 to change the tool to the cutter blade 93.
  • the cutting means 10 drives the articulated robot 91 to pierce the cutter blade 93 into the adhesive sheet AS1 and move the cutter blade 93 along the outer edge of the wafer WF, whereby the adhesive sheet AS1 is moved along the outer edge. Disconnect.
  • the cutting means 10 drives the articulated robot 91 to cause the suction tool 92 to perform tool exchange again from the cutter blade 93.
  • the transfer means 9 stores the wafer WF in the wafer storage cassette CT.
  • the moving means 7A drives the linear motor 74, moves the pressing roller 51, the driving roller 37, and the pinch roller 38 in the -X axis direction, and then drives the driving means (not shown) to move the linear motor 74 to the + Y axis. Move in the direction.
  • the unnecessary sheet US affixed on the support surface 21 is peeled, and a gap is formed between the unnecessary sheet US and the support surface 21.
  • the same operation as described above is repeated.
  • the table 22 includes an outer table having a cylindrical opening, and an inner table having a disk-like outer shape that is disposed in the opening of the outer table and sucks and holds the wafer WF.
  • the inner table may be supported so as to be movable in the Y-axis direction by a linear motion motor as a driving device fixed to the outer table. According to this configuration, since the support surface of the inner table can be moved relative to the support surface of the outer table in the Y-axis direction by driving the linear motion motor, the adhesive sheet AS1 is caused to wrap around the outer edge portion of the wafer WF.
  • the adhesive sheet AS1 is attached to the wafer WF with the sheet application surface of the wafer WF and the sheet application surface of the outer table being at the same level, and the pressing force per unit area by the pressing roller 51 is substantially equal. Can be. Further, a gap into which the cutter blade 93 enters can be formed between the outer table and the inner table.
  • the support surface 21 has an inclination angle of 90 °.
  • the support surface 21 may be arranged to be inclined with respect to the horizontal plane.
  • the inclination angle is 90 °. Is set to be smaller (so that the support surface 21 can be seen from above in the direction of gravity) or larger than 90 ° (so that the support surface 21 cannot be seen from above in the direction of gravity).
  • the inclination angle is preferably 45 ° to 135 ° with respect to the horizontal plane.
  • the support unit 2 may be configured to support the ring frame and the wafer WF, and the sheet sticking devices 1 and 1A may be configured as a mounting device for sticking a mounting sheet to the wafer WF and the ring frame.
  • the contact part 25 may always be in a state of protruding from the support surface 21 (impossible to protrude and retract).
  • the sheet positioning means 6 may move the support means 2 with the feeding means 3 stopped, or may move both the supporting means 2 and the feeding means 3. Further, the moving means 7 may move both the supporting means 2 and the pressing means 5.
  • the receiving means 8 may be configured as one member in which the housing member 81 and the tilt prevention plate 82 are made continuous, or the receiving means 8 may not be provided.
  • the pressing means 5 can employ a pressing member made of a blade material, rubber, resin, sponge, or the like instead of the pressing roller 51, and can also employ a configuration of pressing by air spraying.
  • the peeling means 4 may employ a roller instead of the peeling plate 41.
  • the belt-like peeling sheet fed by the feeding means 3A is used in the vicinity of the pinch roller 34, with the belt-like adhesive sheet temporarily attached to one surface of the belt-like peeling sheet.
  • a stripping means for stripping the strip-shaped adhesive sheet from the sheet may be provided, or the strip-shaped stripping sheet may be wound around the driving roller 33 to strip the strip-shaped adhesive sheet from the strip-shaped stripping sheet.
  • the plate-like member may be a glass plate, a steel plate, a resin plate, or other plate-like member other than the wafer WF, or a member other than the plate-like member.
  • the wafer WF can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like.
  • the adhesive sheets AS and AS1 to be attached to such a semiconductor wafer are not limited to a protective sheet, a dicing tape, and a die attach film, but any other arbitrary Sheets, films, tapes and the like can be used for any purpose and shape.
  • the types and materials of the adhesive sheets AS and AS1 are not particularly limited.
  • the adhesive sheets AS and AS1 have an intermediate layer provided between the base sheet BS and the adhesive layer AD, or have other layers. It may be a layer or more, or may be a single adhesive layer AD that does not have a base sheet BS.
  • the plate member may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. As described above, as the plate-like member, any form of member, article, or the like can be targeted.
  • the drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder.
  • an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot
  • an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder.
PCT/JP2013/050732 2012-01-31 2013-01-17 シート貼付装置および貼付方法 WO2013114951A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380007446.0A CN104221139B (zh) 2012-01-31 2013-01-17 片材粘贴装置及粘贴方法
KR1020147024248A KR102038812B1 (ko) 2012-01-31 2013-01-17 시트 부착 장치 및 부착 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012018181A JP6078233B2 (ja) 2012-01-31 2012-01-31 シート貼付装置
JP2012-018181 2012-01-31

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WO2013114951A1 true WO2013114951A1 (ja) 2013-08-08

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JP (1) JP6078233B2 (ko)
KR (1) KR102038812B1 (ko)
CN (1) CN104221139B (ko)
TW (1) TW201335984A (ko)
WO (1) WO2013114951A1 (ko)

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JP2015056613A (ja) * 2013-09-13 2015-03-23 リンテック株式会社 シート貼付装置および貼付方法
CN105304534A (zh) * 2015-11-10 2016-02-03 东莞市沃德精密机械有限公司 芯片贴装机

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JP2017107946A (ja) * 2015-12-08 2017-06-15 リンテック株式会社 シート剥離装置
JP6678516B2 (ja) * 2016-05-31 2020-04-08 リンテック株式会社 シート貼付装置および貼付方法

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CN105304534B (zh) * 2015-11-10 2018-05-15 东莞市沃德精密机械有限公司 芯片贴装机

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JP6078233B2 (ja) 2017-02-08
TWI560761B (ko) 2016-12-01
CN104221139B (zh) 2016-10-19
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