WO2013065810A1 - 電子機器、電子機器用筐体および表面保護板 - Google Patents
電子機器、電子機器用筐体および表面保護板 Download PDFInfo
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- WO2013065810A1 WO2013065810A1 PCT/JP2012/078423 JP2012078423W WO2013065810A1 WO 2013065810 A1 WO2013065810 A1 WO 2013065810A1 JP 2012078423 W JP2012078423 W JP 2012078423W WO 2013065810 A1 WO2013065810 A1 WO 2013065810A1
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- layer
- cured layer
- protection plate
- cured
- surface protection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
Definitions
- the present invention relates to an electronic device such as a mobile phone or a portable information terminal, in particular, a casing or a surface protection plate thereof, and in particular, a surface protection plate having high surface hardness, excellent curling (warping) prevention properties, and excellent impact resistance. It relates to the electronic equipment used.
- a surface protection plate made of a resin plate such as an acrylic plate or a polycarbonate plate or a glass plate is installed in a casing of an electronic device such as a PC monitor, a television, or a mobile phone.
- a resin plate is used as such a surface protection plate, it is advantageous that it does not break like a glass plate and is lightweight, and when a glass plate is used, the surface is hard to be damaged and flatness is Good is the advantage.
- Patent Document 1 proposes a demand for weight reduction.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-140558 (conventional technology)
- Patent Document 2 Japanese Patent Laid-Open No. 2008-37101 (Background Technology)
- an electronic device having a casing having a surface protection plate that has good flatness and does not cause cracks in the hard coat layer on the surface opposite to the impacted surface when subjected to a strong impact.
- the present inventors have found that cracks in the hard coat layer on the surface opposite to the surface subjected to impact when subjected to strong impact can be solved by adjusting the balance of the composition and thickness of the cured layer provided on both surfaces.
- the present invention has been completed.
- the electronic device of the present invention that solves the above-described problems is an electronic device that includes a housing and an electronic component that is incorporated in the housing, and the housing has a surface protection plate. Is provided with a first cured layer on one surface of a substrate including a plastic film and a second cured layer on the other surface, and the first cured layer is inorganic with respect to 100 parts by weight of the curable resin. The first hardened layer is thicker than the second hardened layer, and the second hardened layer of the surface protection plate is disposed inward of the housing.
- the surface protection plate of the present invention is provided with a first cured layer on one surface of a substrate including a plastic film and a second cured layer on the other surface, and the first cured layer is a curable resin. 50 to 200 parts by weight of inorganic fine particles are contained per 100 parts by weight, and the thickness of the first hardened layer is thicker than that of the second hardened layer.
- the electronic device or the surface protection plate of the present invention has a bending resistance value of 16 mm or less measured by a cylindrical mandrel method according to JIS-K5600-5-1 (1999) of the second hardened layer of the surface protection plate. It is characterized by being.
- the value of the above-mentioned bending resistance test in the present invention is a value obtained by measuring a sample piece obtained by forming a second cured layer on a base material of polyethylene terephthalate of 188 ⁇ m.
- the electronic device or the surface protection plate of the present invention has a pencil hardness of 4H or more in JIS K5600-5-4 (1999) of the first cured layer, and JIS K5600-5-4 (1999) of the second cured layer.
- the pencil hardness in (1) is not less than B and not more than 2H.
- the electronic device or the surface protection plate of the present invention is characterized in that two or more plastic films are laminated via an adhesive layer.
- the electronic device or surface protection plate of the present invention is characterized in that the average particle diameter of the inorganic fine particles contained in the first hardened layer is 3 nm or more and 2/3 or less of the thickness of the first hardened layer.
- the electronic device casing of the present invention is an electronic device casing that incorporates an electronic device and includes a surface protection plate on at least one surface, and the surface protection plate is the surface protection plate of the present invention. Is.
- an electronic device including a housing having a surface protection plate that is hard to be damaged, has good flatness, is light, and has excellent impact resistance.
- An embodiment of an electronic apparatus provided with a housing having a surface protection plate of the present invention Another embodiment of an electronic device provided with a housing having a surface protection plate of the present invention It is a figure which shows the microscope picture which shows the result of an impact resistance test, (a) is the surface of the surface protection board (1st hardening layer) of Example 1, (b) is the surface protection board (1st) of the comparative example 1. The surface of the (hardened layer) is shown.
- An electronic device of the present invention includes a housing and an electronic component incorporated in the housing, the housing has a surface protection plate, and the surface protection plate is one of the surface protection plates.
- the first cured layer is provided on the surface, and the second cured layer is provided on the other surface.
- the first cured layer contains 50 to 200 parts by weight of inorganic fine particles with respect to 100 parts by weight of the curable resin.
- the thickness of the hardened layer is thicker than the second hardened layer, and the second hardened layer of the surface protection plate is arranged toward the inside of the housing.
- the curable resin is a general term for resins that are irreversibly cured by energy such as heat, light, and ionizing radiation.
- the second hardened layer is characterized in that the value of a bending resistance measured by a cylindrical mandrel method in accordance with JIS-K5600-5-1 (1999) is 16 mm or less.
- the pencil hardness of the hardened layer is 4H or higher, and the pencil hardness of the second hardened layer is B or higher and 2H or lower.
- the electronic device of the present invention includes a housing and electronic components incorporated in the housing.
- Electronic components incorporated in the housing include display devices such as liquid crystal display devices, plasma display devices, and EL display devices, as well as electronic components that constitute music recording / playback devices, mobile phones, digital cameras, and the like.
- the housing has a surface protection plate.
- the surface protection plate may be used in any part of the housing. For example, if it is a housing
- the surface protective plate used in the electronic device of the present invention is composed of a base material 15 and cured films (10, 13) provided on both surfaces thereof.
- a cured film consists of the 1st cured film 10 used as the front side, and the 2nd cured film 13 used as the inner side of a housing
- a plastic film alone or a laminate in which a plastic film is bonded through an adhesive can be used.
- the impact resistance is excellent is considered as follows.
- the cured layer receives an impact, the impact is transmitted from the cured layer to the base material and further to the cured layer on the opposite surface.
- the base material By making the base material a plastic film laminated via an adhesive layer, the impact transmitted to each layer in the base material can be mitigated, and the impact transmitted to the cured layer on the opposite side can be reduced. This is thought to be possible.
- polyester films such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and various plastic films made of polyethylene, polypropylene, triacetyl cellulose, polyvinyl chloride, polycarbonate, and the like can be used.
- a polyethylene terephthalate film that has been stretched, in particular biaxially stretched is preferred in that it has high stiffness and is difficult to break during die cutting.
- the surface of the plastic film may be subjected to an easy adhesion treatment such as a corona discharge treatment or an undercoat easy adhesion treatment.
- the plastic film which has transparency is used.
- each plastic film is preferably 50 to 400 ⁇ m, more preferably 100 to 350 ⁇ m, and even more preferably 150 to 300 ⁇ m.
- the adhesive layer consists of a resin and additives that are added as necessary.
- a resin constituting the adhesive layer a thermosetting resin or an ionizing radiation curable resin that is crosslinked and cured by heating and / or ionizing radiation irradiation or the like is preferably used. When these resins are crosslinked and cured, the adhesion to the plastic film is increased and the stiffness of the laminate can be increased.
- Thermosetting resins can be crosslinked and cured by heat below the heat-resistant temperature of the plastic film because of the requirement in the manufacturing method that the coating liquid containing the thermosetting resin is applied on the plastic film and then crosslinked by heat.
- a thermosetting resin that can be used is preferable. Specifically, those obtained by crosslinking and curing a crosslinkable resin such as melamine type, epoxy type, amino alkyd type, urethane type, acrylic type, polyester type, phenol type and the like by heat can be used. In particular, an acrylic thermosetting resin that can increase the stiffness when used as a laminate and has good adhesion to a plastic film is preferable. These can be used alone, but it is desirable to add a curing agent in order to further improve the crosslinkability and the hardness of the crosslinked cured coating film.
- a compound such as polyisocyanate, amino resin, epoxy resin, carboxylic acid or the like can be appropriately used according to a suitable resin.
- the ionizing radiation curable resin it is preferable to use a resin formed from a paint that can be crosslinked and cured by irradiation with ionizing radiation (ultraviolet rays or electron beams).
- ionizing radiation ultraviolet rays or electron beams
- an ionizing radiation curable coating one or a mixture of two or more of a photocationic polymerizable resin capable of photocationic polymerization, a photopolymerizable prepolymer or a photopolymerizable monomer capable of radical photopolymerization, and the like. Can be used.
- Various additives can be added to such an ionizing radiation curable coating. However, when ultraviolet rays are used for curing, it is preferable to add a photopolymerization initiator, an ultraviolet sensitizer, or the like.
- the adhesive layer may contain a thermoplastic resin such as an acrylic adhesive resin in addition to the curable resin described above.
- a thermoplastic resin such as an acrylic adhesive resin in addition to the curable resin described above.
- the thermoplastic resin By mixing the thermoplastic resin, pressure-sensitive adhesiveness at room temperature can be imparted to the adhesive layer, so that the plastic films can be easily attached to each other. Further, by mixing the thermoplastic resin, the Martens hardness can be adjusted to be low, and when the die-cutting process is performed, it is difficult for floating or peeling between the plastic film and the adhesive layer.
- the thermoplastic resin is preferably 60% or less of the resin constituting the adhesive layer.
- additives such as a leveling agent, an ultraviolet absorber, and an antioxidant may be added to the adhesive layer.
- the adhesive layer is cured by heating and / or irradiating the above-mentioned thermosetting resin or ionizing radiation curable paint.
- Curing here refers to the change from the state of a paint having fluidity at room temperature to the state of losing fluidity, and the degree of curing may vary. The degree of curing can be adjusted by the dose.
- the thickness of the adhesive layer after curing is preferably 1 to 50 ⁇ m.
- the lower limit of the adhesive layer is further preferably 2 ⁇ m or more, more preferably 5 ⁇ m or more, particularly preferably 10 ⁇ m or more, and the upper limit is further preferably 40 ⁇ m or less, more preferably 30 ⁇ m or less.
- the reason why the thickness is 50 ⁇ m or less is that even if the thickness is 50 ⁇ m or more, the effect of strengthening the waist due to the thickness cannot be obtained so much and the thickness of the functional laminate becomes too thick.
- the irradiation amount of the ionizing radiation with respect to a plastic film increases by making the thickness of an adhesion layer thick, it will also cause deterioration of a plastic film.
- the thickness of the substrate is not particularly limited, but is practically preferably in the range of 100 ⁇ m to 1 mm.
- the substrate is made of a single plastic film, it is preferably 100 ⁇ m or more, more preferably 188 ⁇ m or more. Is 400 ⁇ m or less.
- two or more plastic films are laminated with an adhesive layer, it is preferably 200 ⁇ m or more, more preferably 300 ⁇ m or more, and preferably 800 ⁇ m or less, more preferably 700 ⁇ m or less.
- the first cured layer 10 provided on one surface of the substrate 15 contains 50 to 200 parts by weight of inorganic fine particles with respect to 100 parts by weight of the curable resin.
- the surface hardness and impact resistance of the first hardened layer can be appropriately adjusted.
- polyester resins acrylic resins, acrylic urethane resins, polyester acrylate resins, polyurethane acrylate resins, epoxy acrylate resins, urethane resins, epoxy resins, polycarbonate resins, melamine resins
- thermosetting resins such as phenolic resins and silicone resins
- ionizing radiation curable resins that can strengthen the waist of the surface protection plate by curing are preferably used.
- the cured layer can be added with a resin such as a thermoplastic resin as long as its characteristics, particularly surface hardness and impact resistance are not impaired.
- Thermoplastic resins include vinyl chloride resin, vinyl acetate resin, vinylidene chloride resin, polyester resin, urethane resin, polyamide resin, polystyrene resin, acrylic resin, cellulose resin, acetal resin, epoxy Resin, phenol resin, melamine resin, silicone resin, etc., and one or more of these are mixed with the curable resin to the extent that the curable resin is not cured. be able to.
- the inorganic fine particles used in the first hardened layer preferably have an average particle diameter of 2/3 or less of the thickness of the first hardened layer.
- the average particle diameter is 3 nm or more, more preferably 5 nm or more, and still more preferably 10 nm or more.
- an average particle diameter is 30 micrometers or less, More preferably, it is 1 micrometer or less, More preferably, it is 500 nm or less.
- the average particle diameter may be primary particles or secondary particles that are aggregates. By setting the average particle size to 3 nm or more, dispersion stability can be obtained.
- the average particle diameter of inorganic type fine particle when using a surface protection board for a transparent use, it is preferable that the average particle diameter of inorganic type fine particle shall be 300 nm or less, 100 nm or less is more preferable, and 80 nm or less is further more preferable.
- the average particle diameter in the present invention refers to the median diameter (D50) measured with a laser diffraction particle size distribution analyzer (for example, Shimadzu Corporation: SALD-7000).
- inorganic fine particles examples include titanium oxide, zinc oxide, zirconium oxide, tin oxide, aluminum oxide, cobalt oxide, magnesium oxide, iron oxide, silicon oxide, cerium oxide, indium oxide, barium titanate, clay, and a lattice of these nanoparticles.
- a material doped with a different metal or a surface-modified material can be used.
- inorganic fine particles those prepared by a vapor phase method or a liquid phase method, and those obtained by firing and microcrystallization as required can be used.
- inorganic fine particles such as titanium oxide, zinc oxide, zirconium oxide, tin oxide, and silicon oxide that have a large number of hydroxyl groups on the surface of the particles can be surface-modified with a silane coupling agent, a dispersant, etc. It is preferable because it can be stably present therein.
- Such inorganic fine particles are preferably 50 parts by weight or more, more preferably 60 parts by weight or more, and still more preferably 65 parts by weight or more with respect to 100 parts by weight of the curable resin. By setting it to 50 parts by weight or more, a high surface hardness can be obtained. Further, it is preferably 200 parts by weight or less, more preferably 150 parts by weight or less, and still more preferably 120 parts by weight or less with respect to 100 parts by weight of the curable resin. By setting the amount to 200 parts by weight or less, it is possible to prevent the impact resistance of the cured layer from being lowered.
- the thickness of the first hardened layer is preferably 10 ⁇ m or more, and more preferably 15 ⁇ m or more. By setting the thickness to 10 ⁇ m or more, sufficient damage prevention properties can be obtained.
- the thickness of the first hardened layer is preferably 40 ⁇ m or less, more preferably 30 ⁇ m or less. By setting the thickness to 40 ⁇ m or less, it is possible to prevent a decrease in impact resistance.
- the pencil hardness in JIS K5600-5-4 (1999) of the first hardened layer is 4H or higher, more preferably 5H or higher, still more preferably 6H or higher, 10H or lower, more preferably 9H or lower, still more preferably. Is 8H or less.
- the pencil hardness can be adjusted by adjusting the type of resin, the amount of inorganic fine particles added, and the layer thickness. By setting the pencil hardness of the first hardened layer in the above range, it is possible to prevent the surface from being scratched and to protect the electronic components and circuits inside the housing from impact.
- the 2nd hardened layer 13 (FIG. 1) provided in the surface opposite to a 1st hardened layer is a layer arrange
- a cured layer having the same composition and the same thickness as the first cured layer is provided as the second cured layer, it is possible to prevent warping, but when the first cured film receives an impact, Cracks are likely to occur in the cured film.
- the surface protection plate of the present invention is characterized in that it is intended to prevent warping and improve impact resistance by making the characteristics and thickness of the second cured layer different from those of the first cured layer. is there.
- the second hardened layer preferably has a bending resistance value measured by a cylindrical mandrel method according to JIS-K5600-5-1 (1999) of 16 mm or less, and more preferably 13 mm or less.
- the value of the bending resistance test is a value obtained by measuring a sample piece using 188 ⁇ m polyethylene terephthalate as a base material. By setting the value of the bending resistance test to 16 mm or less, the impact resistance can be improved.
- the pencil hardness in JIS K5600-5-4 (1999) of the second hardened layer is preferably lower than that of the first hardened layer, specifically B to 3H.
- the bending resistance and pencil hardness described above can be adjusted to a suitable range by adjusting the thickness of the second hardened layer, the type of resin, and the content of inorganic fine particles.
- the thickness of the second hardened layer is preferably thinner than the thickness of the first hardened layer.
- the specific thickness depends on the thickness of the first hardened layer and cannot be generally specified, but is preferably 2 to 30 ⁇ m.
- the thickness of the second hardened layer is close to the thickness of the first hardened layer, when the second hardened layer is disposed on the surface opposite to the surface that receives the impact, the second hardened layer cracks due to the impact. Can not be prevented.
- the compositions of the first cured layer and the second cured layer are the same and the thicknesses are different, the flatness tends to be deteriorated (warping occurs) due to the difference in thickness. Since the surface protective plate has different characteristics and compositions of the first cured layer and the second cured layer, even if the thickness is varied, the flatness is not impaired and the impact resistance can be improved. it can.
- the curable resin used for the second cured layer can be selected from the same materials as described for the first cured layer, but for the purpose of obtaining the above characteristics, the type of resin or inorganic fine particles is selected.
- the first cured layer and the second cured layer may be different.
- a cured resin having a lower surface hardness than the cured resin of the first cured film may be used, or a resin other than the cured resin may be added.
- the second hardened layer may not contain inorganic fine particles.
- the content of the inorganic fine particles relative to the curable resin is preferably 75% or less of the content of the inorganic fine particles based on 100 parts by weight of the curable resin of the first cured layer, and more preferably. Is 50% or less, more preferably 25% or less.
- the second cured film may not contain inorganic fine particles, but in order to prevent sticking thereof, it may contain 1% or more, preferably 3% or more, more preferably 5% or more. .
- the second cured layer preferably has printability.
- the printability can be imparted, for example, by adjusting the contact angle of the second cured layer with water. By controlling the contact angle to water to 80 ° or less with a value measured by a method according to JIS-R3257 (1999), excellent printability can be obtained. As shown in FIG. A decorative print 3 such as a pattern can be provided.
- Such a surface protection plate is arranged so that the second hardened layer is located on the inner side of the housing.
- positioning a 1st hardened layer on the side which receives an impact the damage
- casing can be protected from an impact.
- the thickness of the surface protective plate is preferably 125 to 2000 ⁇ m, more preferably 200 to 1000 ⁇ m.
- the waist of the surface protection plate can be strengthened, and the electronic components and circuits inside the housing can be protected from the impact when subjected to an impact.
- the thickness can be reduced and the weight can be reduced.
- the surface protection plate of the present invention is (1) bonding a plastic film provided with a first hardened layer and a plastic film provided with a second hardened layer through an adhesive layer, (2) adhering a plastic film
- the first and second cured layers are sequentially provided after bonding through the layers, (3) a plastic film provided with one of the first and second cured layers and a plastic film not formed with the cured layer. Then, after bonding through the adhesive layer, the other one of the first and second cured layers can be provided.
- Each layer of the present invention is prepared by dissolving or dispersing the constituent components in an appropriate solvent to prepare a coating solution, or mixing the constituent components of the adhesive layer without using a solvent to adjust the coating solution.
- the coating solution is applied onto a plastic film by a known method such as a roll coating method, a bar coating method, a spray coating method, or an air knife coating method, and if necessary, a method of heating or irradiating with ionizing radiation is used.
- a method of heating or irradiating with ionizing radiation is used.
- the dose of ionizing radiation is about 500 to 1500 mJ.
- additives such as a leveling agent and an ultraviolet absorber can be added to each layer as necessary.
- the surface protection plate of the present invention can be die-cut into a desired shape depending on the application.
- the die cutting process can be performed by a conventionally known method using, for example, a die cutter using a Thomson blade die (Bik blade die).
- the surface protection plate is not broken at the time of die-cutting, and neither peeling nor floating occurs at the interface with the cured layer, the plastic film, or the adhesive layer.
- Example 1 On one side of a transparent polyester film A having a thickness of 188 ⁇ m (Cosmo Shine A4300: Toyobo Co., Ltd.), a first hardened layer coating solution having the following composition was applied by a bar coating method so as to have a thickness of 26 ⁇ m. Irradiated to produce a transparent polyester film having a first cured layer.
- a second hardened layer coating solution having the following composition is applied to one surface of a transparent polyester film B (Cosmo Shine A4300: Toyobo Co., Ltd.) having a thickness of 188 ⁇ m by a bar coating method so that the thickness becomes 6 ⁇ m.
- the transparent polyester film which has a 2nd hardened layer by ultraviolet irradiation was produced.
- an adhesive layer coating solution having the following composition was applied to the surface opposite to the second cured layer of the transparent polyester film B by a bar coating method so as to have a thickness of 10 ⁇ m and dried.
- an adhesive layer coating solution having the following composition was applied to the surface opposite to the second cured layer of the transparent polyester film B by a bar coating method so as to have a thickness of 10 ⁇ m and dried.
- thermosetting resin Takelac A975: Mitsui Chemicals, solid content 65%
- Hardener 5 parts Takenate A-3: Mitsui Chemicals, solid content 75%)
- Example 2 to Example 6 Surface protective plates of Examples 2 to 6 were prepared in the same manner as in Example 1 except that the first cured layer coating solution and the second cured layer coating solution were replaced with the coating solutions shown in Table 1.
- Comparative Examples 1 to 3 Surface protective plates of Comparative Examples 1 to 3 were prepared in the same manner as in Example 1 except that the first cured layer coating solution and the second cured layer coating solution were replaced with the coating solutions shown in Table 2.
- Example 7 A surface protective plate of Example 7 was produced in the same manner as in Example 1 except that the thickness of the transparent polyester films A and B used in Example 1 was changed to 125 ⁇ m.
- Example 8 A first cured layer was prepared on one side of a transparent polyester film having a thickness of 250 ⁇ m (Cosmo Shine A4300: Toyobo Co., Ltd.) in the same manner as in Example 1, and then performed on the side opposite to the first cured layer. A second cured layer was produced in the same manner as in Example 1, and the surface protective plate of Example 8 was produced.
- Example 9 A surface protective plate of Example 9 was produced in the same manner as in Example 1 except that the second hardened layer coating liquid was replaced with the coating liquid described below.
- ⁇ Second cured layer coating solution> ⁇ Ionizing radiation curable resin 37.5 parts (Diabeam MH-7363: Mitsubishi Rayon Co., Ltd., solid content 40%) -0.75 parts of photopolymerization initiator (Irgacure 651: Ciba Japan) ⁇ 0.5 parts of diluted solvent
- Comparative Example 4 in the same manner as in Example 1 except that the first cured layer coating solution and the second cured layer coating solution were replaced with the coating solutions shown in Table 2 and the thickness of the second cured layer was replaced with 26 ⁇ m. A surface protection plate was prepared.
- Comparative Example 5 A surface protective plate of Comparative Example 5 was produced in the same manner as in Example 1 except that the thickness of the second hardened layer was changed to 26 ⁇ m.
- Comparative Example 6 The thicknesses of the transparent polyester films A and B used in Example 1 are replaced with 125 ⁇ m, the first cured layer coating solution and the second cured layer coating solution are replaced with the coating solutions described in Table 2, and the thickness of the first layer is changed.
- a surface protection plate of Comparative Example 6 was produced in the same manner as in Example 1 except that was replaced with 6 ⁇ m.
- Comparative Example 7 The surface of Comparative Example 7 was coated with the coating liquid shown in Table 2 on both sides of a transparent polyester film (Cosmo Shine A4300: Toyobo Co., Ltd.) having a thickness of 250 ⁇ m by a bar coating method so as to have a thickness of 6 ⁇ m. A protective plate was produced.
- a transparent polyester film Cosmo Shine A4300: Toyobo Co., Ltd.
- Pencil hardness The pencil hardness in JIS K5600-5-4 (1999) of the first and second cured layers of Examples 1 to 9 and Comparative Examples 1 to 7 was measured. The results are shown in Table 3.
- Bending resistance test JIS-K5600 was prepared by using the second cured layers of Examples 1 to 9 and Comparative Examples 1 to 7 on a transparent polyester film of 188 ⁇ m and a sample piece having the same thickness as each experimental example. The value of a bending resistance test measured by a cylindrical mandrel method according to -5-1 (1999) was measured. The results are shown in Table 3.
- the first hardened layer was placed on the surface side, and the height at which cracks occurred in the second hardened layer was measured.
- “ ⁇ ” indicates that no crack is generated at a height of 50 cm or more
- “ ⁇ ” indicates that a crack is generated at a height of 40 cm or more and less than 50 cm
- “ ⁇ ” indicates that a crack is generated at a height of 30 cm or more but less than 40 cm
- “30” Those that cracked at a height less than “x” were rated as “x”. The results are shown in Table 3.
- the first cured layer contains 50 to 200 parts by weight of inorganic fine particles with respect to 100 parts by weight of the curable resin.
- the surface hardness of the layer was high, and the pencil hardness was as good as 5H to 6H.
- the electronic devices of Examples 1 to 5 and 7 use a base material in which two or more plastic films are laminated via an adhesive layer, and the second cured layer does not contain inorganic fine particles. And since the thickness of the 1st hardened layer is thicker than the 2nd hardened layer, it was excellent also in impact resistance and flatness.
- the composition of the first cured layer is the same as that of Example 3, and the content of the inorganic fine particles relative to 100 parts by weight of the curable resin of the second cured layer is the same as that of the first cured layer.
- the content of the inorganic fine particles is 75% or less with respect to 100 parts by weight of the curable resin contained. Since the second hardened layer contains inorganic fine particles, the results of the bending resistance test were higher than those of Examples 1 to 5 and 7, but both the impact resistance and the flatness were good. .
- Example 8 Since the electronic device of Example 8 uses a single plastic film as a base material, the impact resistance of the second cured layer was inferior to that of the other examples, but the same single plastic film Compared to Comparative Example 7 using No. 1, there were fewer cracks generated in the second cured layer, and the surface hardness of the first cured layer was higher than that of Comparative Example 7.
- the resin type of the second cured layer is different from that of Example 1, and the result of the bending resistance test was higher than that of Example 1, but the impact resistance The flatness was good.
- the electronic device of Comparative Example 1 has an excellent pencil hardness of 6H because the first cured layer contains more than 200 parts by weight of inorganic fine particles with respect to 100 parts by weight of the curable resin. However, in the impact resistance test, the first hardened layer was cracked.
- the electronic device of Comparative Example 2 was inferior in surface hardness because the content of the inorganic fine particles relative to 100 parts by weight of the curable resin of the first cured layer was less than 50 parts by weight.
- both the first cured layer and the second cured layer have the same formulation as the first cured layer of Example 1. Since the content of the inorganic fine particles contained in the second cured layer is more than 75% of the content of the inorganic fine particles based on 100 parts by weight of the curable resin contained in the first cured layer, the impact resistance is poor. The flatness was not good.
- the first cured layer and the second cured layer have the same formulation, and the thicknesses of both layers are the same.
- the flatness is improved by making the formulation and thickness the same, the content of the inorganic fine particles contained in the second cured layer is as high as the first cured layer and the second cured layer Since the thickness was also thick, it was inferior in impact resistance.
- the first cured layer and the second cured layer were formulated in the same manner as in Example 1, and the thickness of the second cured layer was the same as the thickness of the first cured layer. is there. Since the thickness of the second hardened layer was thick, the impact resistance was inferior and the flatness was not good.
- both the first cured layer and the second cured layer were formulated so as not to contain the same inorganic fine particles as the second cured layer of Example 1, and the thicknesses of both layers were the same. It is.
- This electronic device was excellent in impact resistance and flatness, but its surface hardness was inferior because the first hardened layer did not contain inorganic fine particles.
- the prescription and thickness of the first cured layer and the second cured layer are the same as those of Comparative Example 6, and the base material is replaced with a single plastic film. It was inferior in impact resistance.
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Abstract
Description
なお硬化型樹脂は、熱、光、電離放射線などのエネルギーによって不可逆的に硬化する樹脂の総称である。
なお本発明でいう平均粒子径は、レーザー回折式粒度分布測定装置(例えば、島津製作所社:SALD-7000など)で測定されるメディアン径(D50)を指すものである。
第二の硬化層は、JIS-K5600-5-1(1999)に準拠した円筒形マンドレル法で測定した耐屈曲試験の値が16mm以下であることが好ましく、さらに好ましくは、13mm以下である。なお、本発明では耐屈曲試験の値は、188μmのポリエチレンテレフタレートを基材としたサンプル片を測定した値である。耐屈曲試験の値を16mm以下とすることにより、耐衝撃性をよりよくすることができる。
上述した耐屈曲性及び鉛筆硬度は、第二の硬化層の厚みや樹脂の種類及び無機系微粒子の含有量を調整することにより好適な範囲に調整することができる。
[実施例1]
厚み188μmの透明ポリエステルフィルムA(コスモシャインA4300:東洋紡績社)の一方の面に、下記の組成からなる第一の硬化層塗布液を、厚みが26μmとなるようにバーコーティング法により塗布、紫外線照射して、第一の硬化層を有する透明ポリエステルフィルムを作製した。
・電離放射線硬化型樹脂 60部
(ダイヤビームMH-7363:三菱レイヨン社、固形分40%)
・シリカ微粒子溶液 80部
(MIBK-ST:日産化学工業社、平均粒子径:10~20nm、固形分30%)
・光重合開始剤 1.2部
(イルガキュア651:チバ・ジャパン社)
・希釈溶媒 22部
・電離放射線硬化型樹脂 10部
(ビームセット575:荒川化学工業社、固形分100%)
・電離放射線硬化型樹脂 5部
(NKエステルA-1000:新中村化学工業社、固形分100%)
・光重合開始剤 0.75部
(イルガキュア651:チバ・ジャパン社)
・希釈溶媒 23部
・熱硬化型樹脂 35部
(タケラック A975:三井化学社、固形分65%)
・硬化剤 5部
(タケネート A-3:三井化学社、固形分75%)
・希釈溶剤 66部
第一の硬化層塗布液、第二の硬化層塗布液を表1記載の塗布液に代えた以外は、実施例1と同様にして実施例2~6の表面保護板を作製した。
第一の硬化層塗布液、第二の硬化層塗布液を表2記載の塗布液に代えた以外は、実施例1と同様にして比較例1~3の表面保護板を作製した。
実施例1で用いた透明ポリエステルフィルムAおよびBの厚みを125μmに代えた以外は、実施例1と同様にして実施例7の表面保護板を作製した。
厚み250μmの透明ポリエステルフィルム(コスモシャインA4300:東洋紡績社)の一方の面に、実施例1と同様に第一の硬化層を作製し、次いで、第一の硬化層とは反対面に、実施例1と同様に第二の硬化層を作製し、実施例8の表面保護板を作製した。
第二の硬化層塗布液を下記記載の塗布液に代えた以外は、実施例1と同様にして実施例9の表面保護板を作製した。
<第二の硬化層塗布液>
・電離放射線硬化型樹脂 37.5部
(ダイヤビームMH-7363:三菱レイヨン社、固形分40%)
・光重合開始剤 0.75部
(イルガキュア651:チバ・ジャパン社)
・希釈溶媒 0.5部
第一の硬化層塗布液、第二の硬化層塗布液を表2記載の塗布液に代え、第二の硬化層の厚みを26μmに代えた以外は、実施例1と同様にして比較例4の表面保護板を作製した。
第二の硬化層の厚みを26μmに代えた以外は、実施例1と同様にして比較例5の表面保護板を作製した。
実施例1で用いた透明ポリエステルフィルムAおよびBの厚みを125μmに代え、第一の硬化層塗布液、第二の硬化層塗布液を表2記載の塗布液に代え、第一の層の厚みを6μmに代えた以外は、実施例1と同様にして比較例6の表面保護板を作製した。
厚み250μmの透明ポリエステルフィルム(コスモシャインA4300:東洋紡績社)の両面に、表2記載の塗布液を、厚みが6μmとなるようにバーコーティング法により塗布、紫外線照射して、比較例7の表面保護板を作製した。
実施例1~9、比較例1~7の表面保護板の第二の硬化層に、枠や文字などの加飾印刷を施し、所定の大きさに裁断した。そして、携帯電話用筐体に、表示装置やスピーカなどの必要な電子部品を組み込み、表示部分となる開口部に、実施例1~9、比較例1~7の表面保護板を第二の硬化層が筐体の内側になるように配置して、電子機器(携帯電話)を作製した。
実施例1~9、比較例1~7の第一・第二の硬化層のJIS K5600-5-4(1999)におけるにおける鉛筆硬度を測定した。結果を表3に示す。
実施例1~9、比較例1~7の第二の硬化層を、188μmの透明ポリエステルフィルムに、厚みを各実験例と同じにしたサンプル片を用いて、JIS-K5600-5-1(1999)に準拠した円筒形マンドレル法で測定した耐屈曲試験の値を測定した。結果を表3に示す。
直径60mmの円筒上に、10cm×10cmに切断した実施例1~9、比較例1~7の表面保護板を円筒の中心とサンプル片の中心が重なるようにして、第一の硬化層を表面側として設置して、130gの剛球(クロム球、直径:1.25インチ)を落下させた。第一の硬化層にクラックが発生する高さを測定した。50cm以上の高さでクラックを生じないものを「○」、50cm未満の高さでクラックを生じるものを「×」とした。
また実施例1及び比較例1の表面保護板について、上記の剛球を50cmの高さから落下させた場合、落下点を含む第一の硬化層表面の顕微鏡写真を図4に示す。
実施例1~9、比較例1~7の表面保護板を縦横10cm×10cmに裁断し、平らな面を持つ台の上に静置した。表面保護板の4つの端部について、台面から浮き上がった高さ(反り量)を測定し、反り量の四隅の合計が、0mm以上~5mm未満であったものを「○」とし、5mm以上であったものを「×」とした。測定結果を表3に示す。
10・・第一の硬化層
11・・プラスチックフィルム
12・・接着層
13・・第二の硬化層
15・・基材
2・・・筐体
3・・・加飾印刷
Claims (13)
- 筐体と、筐体内に組み込まれる電子部品とを備えた電子機器であって、
筐体が表面保護板を有するものであり、
表面保護板は、プラスチックフィルムを含む基材の一方の面に第一の硬化層、他方の面に第二の硬化層が設けられ、前記第一の硬化層は、硬化型樹脂100重量部に対して無機系微粒子を50~200重量部含み、前記第一の硬化層の厚みが前記第二の硬化層より厚く、前記表面保護板の第二の硬化層は筐体の内側向きに配置されることを特徴とする電子機器。 - 前記第二の硬化層のJIS-K5600-5-1(1999)に準拠した円筒形マンドレル法で測定した耐屈曲試験の値が16mm以下であることを特徴とする請求項1記載の電子機器。
- 前記第一の硬化層のJIS K5600-5-4(1999)における鉛筆硬度が4H以上であり、第二の硬化層のJIS K5600-5-4(1999)における鉛筆硬度がB以上2H以下であることを特徴とする請求項1又は2に記載の電子機器。
- 前記基材は、2枚以上のプラスチックフィルムが接着層を介して積層されたものであることを特徴とする請求項1から3のいずれか1項に記載の電子機器。
- 前記第一の硬化層に含まれる無機系微粒子の平均粒子径が3nm以上第一の硬化層の厚みの2/3以下であることを特徴とする請求項1から4のいずれか一項に記載の電子機器。
- 前記第二の硬化層は、無機系微粒子を含まないか、硬化型樹脂100重量部に対する無機系微粒子の含有量が、第一の硬化層に含まれる硬化型樹脂100重量部に対する無機系微粒子の含有量の75%以下であることを特徴とする請求項1から5のいずれか一項に記載の電子機器。
- プラスチックフィルムを含む基材の一方の面に第一の硬化層、他方の面に第二の硬化層が設けられ、前記第一の硬化層は、硬化型樹脂100重量部に対して無機系微粒子を50~200重量部含み、前記第一の硬化層の厚みが第二の硬化層より厚いことを特徴とする表面保護板。
- 前記第二の硬化層のJIS-K5600-5-1(1999)に準拠した円筒形マンドレル法で測定した耐屈曲試験の値が16mm以下であることを特徴とする請求項7記載の表面保護板。
- 前記第一の硬化層のJIS K5600-5-4(1999)における鉛筆硬度が4H以上であり、第二の硬化層のJIS K5600-5-4(1999)における鉛筆硬度がB以上2H以下であることを特徴とする請求項7又は8に記載の表面保護板。
- 前記基材は、2枚以上のプラスチックフィルムが接着層を介して積層されたものであることを特徴とする請求項7から9のいずれか一項に記載の表面保護板。
- 前記第一の硬化層に含まれる無機系微粒子の平均粒子径が3nm以上第一の硬化層の厚みの2/3以下であることを特徴とする請求項7から10のいずれか一項に記載の表面保護板。
- 前記第二の硬化層は、無機系微粒子を含まないか、硬化型樹脂100重量部に対する無機系微粒子の含有量が、第一の硬化層に含まれる硬化型樹脂100重量部に対する無機系微粒子の含有量の75%以下であることを特徴とする請求項7から11のいずれか一項に記載の表面保護板。
- 電子部品を内蔵し、少なくとも一つの面に表面保護板を備えた電子機器用筐体であって、前記表面保護板が請求項7ないし12のいずれか一項記載の表面保護板である電子機器用筐体。
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