WO2013042689A1 - 硬質基板積層体の加工方法及び板状製品の製造方法 - Google Patents

硬質基板積層体の加工方法及び板状製品の製造方法 Download PDF

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Publication number
WO2013042689A1
WO2013042689A1 PCT/JP2012/073946 JP2012073946W WO2013042689A1 WO 2013042689 A1 WO2013042689 A1 WO 2013042689A1 JP 2012073946 W JP2012073946 W JP 2012073946W WO 2013042689 A1 WO2013042689 A1 WO 2013042689A1
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Prior art keywords
hard substrate
hard
substrate laminate
processing
meth
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PCT/JP2012/073946
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English (en)
French (fr)
Japanese (ja)
Inventor
啓之 栗村
賢司 田中
幸雄 江田
敏成 伊林
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電気化学工業株式会社
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Application filed by 電気化学工業株式会社 filed Critical 電気化学工業株式会社
Priority to CN201280045897.9A priority Critical patent/CN103813995B/zh
Priority to JP2013534725A priority patent/JP5956449B2/ja
Priority to KR1020147007937A priority patent/KR20140069034A/ko
Publication of WO2013042689A1 publication Critical patent/WO2013042689A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/26—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for simultaneously grinding or polishing opposite faces of continuously travelling sheets or bands
    • B24B7/265—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for simultaneously grinding or polishing opposite faces of continuously travelling sheets or bands of vertical surfaces

Definitions

  • Display devices of various electronic devices such as TVs, notebook computers, car navigation systems, calculators, mobile phones, electronic notebooks, and PDAs (Personal Digital Assistants) include liquid crystal displays (LCD), organic EL displays (OELD), electroluminescent displays ( Display elements such as ELD), field emission displays (FED), and plasma displays (PDP) are used. And in order to protect a display element, it is common to install the plate glass product for protection facing a display element.
  • LCD liquid crystal displays
  • OELD organic EL displays
  • ELD electroluminescent displays
  • FED field emission displays
  • PDP plasma displays
  • This flat glass product is obtained by processing a flat glass into a size and shape suitable for each display device. In order to meet the price level required in the market, it is possible to process a large amount of flat glass products with high production efficiency. Desired.
  • Patent Document 1 proposes a method for increasing the production efficiency of a sheet glass product. Specifically, “a large number of material glass sheets (1) are stacked, and each material glass sheet (1) is integrally fixed by a peelable fixing material (2) interposed between each material glass sheet (1). Forming the material glass block (A), dividing the material glass block (A) in the plane direction to form a small-area divided glass block (B), and processing at least the outer periphery of the divided glass block (B) A product glass block (C) having a product shape in plan view is formed, and after the end face processing of the product glass block (C), the product glass block (C) is individually separated. “Processing method” is proposed (claim 1).
  • JP 2010-269389 A (Patent Document 2) describes that the end surface of the divided glass block is polished by a rotary polishing disk having a flat polishing surface. And it describes that this edge surface is grind
  • the jig has positioning means for disposing the divided block at the center between two rotating grindstones.
  • the adhesive bonding the hard substrates together in the hard substrate laminate obtained in step a) is ground in step b).
  • the adhesive is present in the entire portion to be formed, and occupies 90% or more of the area of the bonding surface of each hard substrate.
  • step c) is performed on a plurality of divided blocks by stacking a plurality of divided blocks and / or arranging them side by side in the moving direction. And put together.
  • the position accuracy of the divided blocks in the direction connecting the central axes of the two rotating grindstones is within ⁇ 100 ⁇ m. To control.
  • step b) and step c) shape processing is performed between step b) and step c) and / or after step c).
  • step c) performing a step of polishing the ground end face.
  • shape processing is performed between step c) and step d) and / or after step d).
  • the present invention is a method for manufacturing a plate-like product, including a step of peeling a divided block and forming a plurality of plate-like products after performing the processing method of the hard substrate laminate according to the present invention.
  • a hard substrate laminate 10 is prepared in which two or more hard substrates 11 are bonded together with an adhesive 12 that can be peeled off.
  • the hard substrate is not particularly limited.
  • a hard substrate that does not have translucency may be used as the hard substrate.
  • the hard substrate when using a photo-curable adhesive as an adhesive or for the purpose of protecting display elements, the hard substrate must be translucent.
  • plate glass tempered plate glass, material plate glass, transparent A glass substrate with a conductive film, a glass substrate on which electrodes and circuits are formed, etc.
  • a sapphire substrate a quartz substrate, a plastic substrate, a magnesium fluoride substrate, and the like can be used.
  • the lamination of the hard substrates can be performed, for example, by bonding the hard substrates having a peelable adhesive applied to one or both bonding surfaces. By repeating this a desired number of times, a hard substrate laminate in which a desired number of hard substrates are laminated can be produced. From the viewpoint of improving the production efficiency of plate products, it is desirable to produce a hard substrate laminate in which 10 or more hard substrates, typically 10 to 30 hard substrates, are laminated.
  • the irradiation light here may be an irradiation amount necessary to temporarily fix the translucent hard substrate, and is generally 1 to 500 mJ / cm 2 , typically measured by an integrating illuminometer using a 365 nm light receiver. Specifically, it can be 3 to 300 mJ / cm 2 , more typically 5 to 200 mJ / cm 2 .
  • the irradiation time is generally 1 to 120 seconds, typically about 2 to 60 seconds, and preferably about 2.5 to 20 seconds.
  • (A) As a polyfunctional (meth) acrylate two or more (meth) acryloylated polyfunctional (meth) acrylate oligomer / polymer or two or more (meth) acryloyl groups at the oligomer / polymer terminal or side chain Polyfunctional (meth) acrylate monomers having can be used.
  • 1,2-polybutadiene-terminated urethane (meth) acrylate for example, “TE-2000”, “TEA-1000” manufactured by Nippon Soda Co., Ltd.
  • hydrogenated product thereof for example, “TEAI-1000” manufactured by Nippon Soda Co., Ltd.
  • 1,4-polybutadiene terminated urethane (meth) acrylate eg “BAC-45” manufactured by Osaka Organic Chemical Co., Ltd.
  • polyisoprene terminated (meth) acrylate for example, “UV-2000B”, “UV-3000B”, “UV-7000B” manufactured by Nippon Synthetic Chemical Co., Ltd.
  • bifunctional (meth) acrylate monomer examples include 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9- Nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol di (meth) acrylate, neopentyl glycol modified trimethylolpropane Di (meth) acrylate, stearic acid-modified pentaerythritol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis (4- (meth) acryl Propoxy phenyl
  • Examples of the trifunctional (meth) acrylate monomer include trimethylolpropane tri (meth) acrylate and tris [(meth) acryloxyethyl] isocyanurate.
  • Examples of tetrafunctional or higher functional (meth) acrylate monomers include dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, or dipenta Examples include erythritol hexa (meth) acrylate.
  • Monofunctional (meth) acrylate monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate , Isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydr
  • the cured adhesive is peeled off into a film by being immersed in warm water.
  • the content of (B) monofunctional (meth) acrylate is more preferably 40 to 80 parts by mass in 100 parts by mass of the total amount of (A) and (B).
  • the photopolymerization initiator is blended for sensitization with visible light or ultraviolet active light to promote photocuring of the resin composition, and various known photopolymerization initiators can be used. . Specifically, benzophenone or a derivative thereof; benzyl or a derivative thereof; anthraquinone or a derivative thereof; benzoin; a benzoin derivative such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, or benzyl dimethyl ketal; diethoxyacetophenone, 4 Acetophenone derivatives such as t-butyltrichloroacetophenone; 2-dimethylaminoethyl benzoate; p-dimethylaminoethyl benzoate; diphenyl disulfide; thioxanthone or derivatives thereof; camphorquinone; 7,7-dimethyl-2,3-dioxobicycl
  • a photoinitiator can be used 1 type or in combination of 2 or more types.
  • One or more of the group consisting of [2-hydroxy-ethoxy] -ethyl ester are preferred.
  • the content of the photopolymerization initiator is preferably 0.1 to 20 parts by mass, and more preferably 0.5 to 10 parts by mass with respect to 100 parts by mass in total of (A) and (B). If it is 0.1 mass part or more, the effect of hardening acceleration
  • the photocurable adhesive preferably contains a particulate material (D) that does not dissolve in the components (A), (B), and (C) of the adhesive.
  • the granular material (D) is preferably spherical from the viewpoint of improving processing accuracy, that is, controlling the film thickness of the adhesive.
  • the average particle diameter of the particulate material (D) by laser method is preferably in the range of 20 to 200 ⁇ m. If the average particle size of the granular material is less than 20 ⁇ m, the peelability is inferior, and if it exceeds 200 ⁇ m, the temporarily fixed member tends to be displaced during processing, resulting in poor dimensional accuracy.
  • the average particle diameter (D50) is more preferably 35 ⁇ m to 150 ⁇ m, more preferably 50 ⁇ m to 120 ⁇ m, from the viewpoint of peelability and dimensional accuracy.
  • the particle size distribution is measured by a laser diffraction type particle size distribution measuring device.
  • the amount of the granular material (D) used is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B), from the viewpoint of adhesiveness, processing accuracy, and peelability. 2 to 10 parts by mass is more preferable, and 0.2 to 6 parts by mass is most preferable.
  • a polymerization inhibitor (E) can be added to the photocurable adhesive to improve storage stability.
  • Polymerization inhibitors include methyl hydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol), catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2,5-ditertiary butyl hydroquinone.
  • the amount of the polymerization inhibitor (E) used is preferably 0.001 to 3 parts by mass and more preferably 0.01 to 2 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B). If it is 0.001 mass part or more, storage stability will be ensured, and if it is 3 mass parts or less, favorable adhesiveness will be obtained and it will not become uncured.
  • the photocurable adhesive may further use an organic peroxide for the purpose of improving curability.
  • an organic peroxide can be used as a polymerization initiator in place of the photopolymerization initiator (C) for laminating a hard substrate having no translucency.
  • Preferred photocurable adhesives for the present invention include the following photocurable adhesives 1-2. 1.
  • Photo-curable adhesive 1 The following components (A) to (E) are mixed to prepare the photocurable adhesive 1.
  • polystyrene acrylate weight average molecular weight 18000, polyol compound is polyester polyol, organic polyisocyanate compound is isophorone diisocyanate, hydroxy (meth) acrylate Is 2-hydroxyethyl acrylate) 15 parts by weight, dicyclopentanyl diacrylate (“KAYARAD R-684” manufactured by Nippon Kayaku Co., Ltd.), 15 parts by weight,
  • B As monofunctional (meth) acrylate, 45 parts by mass of 2- (1,2-cyclohexacarboximide) ethyl acrylate (“Aronix M-140” manufactured by Toa Gosei Co., Ltd.), phenol ethylene oxide 2 mol modified acrylate (Toa 25 parts by mass of “Aronix M-101A” manufactured by Gosei (C) 10 parts by mass of benzyldimethyl ketal (“IRGACURE651” manufactured by BASF Japan) as a photopolymerization initiator, (D) 1
  • Photocurable Adhesive 2 The following components (A) to (E) are mixed to prepare the photocurable adhesive 2.
  • A As a polyfunctional (meth) acrylate, “UV-3000B” manufactured by Nippon Gosei Co., Ltd. (polyester urethane acrylate, weight average molecular weight 18000, polyol compound is polyester polyol, organic polyisocyanate compound is isophorone diisocyanate, hydroxy (meth) acrylate Is 2-hydroxyethyl acrylate) 20 parts by mass, dicyclopentanyl diacrylate (manufactured by Nippon Kayaku Co., Ltd.
  • the adhesive that bonds the hard substrates together in the divided block obtained in the step b is present in the entire portion to be ground by the end face processing in the step b, and the adhesive surface of each hard substrate It is preferably 90% or more of the area, more preferably 95% or more.
  • chipping is likely to occur during the end face processing if there is a gap where no adhesive exists between the substrates on the end face 16 of the divided block when the step b is performed.
  • the space between the substrates is filled with an adhesive, so that the adhesive serves to reinforce the substrate, and chipping is suppressed during end face processing.
  • step b the hard substrate laminate 10 is divided in the thickness direction to form a desired number of divided hard substrate laminates 14 (hereinafter referred to as “divided blocks”).
  • the division in the thickness direction of the hard substrate laminate 10 can be performed, for example, along the cutting line 13 shown in FIG.
  • the dividing method is not particularly limited, but a disk cutter (diamond disc, cemented carbide disc), fixed abrasive type or loose abrasive type wire saw, laser beam, etching (eg, chemical etching using hydrofluoric acid, sulfuric acid, etc.) And electrolytic etching), water jet, and red tropics (nichrome wire), each of which is used alone or in combination, and is divided into rectangular parallelepiped shapes of the same size. Etching can also be used for surface treatment of the cut surfaces after division.
  • the width of the hard substrate has little variation.
  • the dimensional error is preferably 100 ⁇ m or less, and more preferably 80 ⁇ m or less.
  • the dimensional error is a difference between the largest width and the smallest width in one divided block that performs step c.
  • the divided block is measured with a micrometer at the four corners and the central portion of the divided block. It is obtained by subtracting the smallest value from the largest value measured.
  • step c the divided block 14 is relatively moved between the rotating grindstones 15 arranged in parallel at a predetermined interval to grind the two end faces 16 facing each other at the same time.
  • the two end surfaces can be flattened, which contributes to an improvement in production efficiency.
  • step c can also be performed on a plurality of divided blocks by stacking a plurality of divided blocks and / or arranging them side by side in the moving direction. As a result, it becomes possible to perform end face processing of a larger number of hard substrates at once.
  • the difference between the width of the divided block before performing the step c and the distance d on the straight line connecting the central axes of the two rotating wheels corresponds to the width of the divided block that is reduced by one grinding process. If the width of the divided glass block before performing step c is too large compared to the distance d on the straight line connecting the central axes of the two rotating whetstones, a large load is applied during the end face processing, and the divided blocks and the rotating whetstone are damaged. Increased risk. On the other hand, if the width of the divided block before the step c is too small compared to the distance d, grinding becomes inefficient.
  • the width of the divided block to be reduced by one grinding process is preferably about 10 to 300 ⁇ m, more preferably 15 to 200 ⁇ m per one end face.
  • Step c can be repeated as often as necessary. From the viewpoint of effectively removing dimensional errors and chipping generated in step b without waste, it is preferable to repeat step c until the entire width is reduced by 30 to 500 ⁇ m for one end face, and the step until 50 to 300 ⁇ m is reduced. More preferably, c is repeated. The entire width of the divided block is reduced by a value twice that value.
  • step c it is preferable to use a grindstone with a large surface roughness at the beginning and a grindstone with a small surface roughness for finishing.
  • the end face of the divided block after grinding is flattened by using a grindstone with a small surface roughness, but the grinding efficiency of a grindstone with a small surface roughness is low. Increases the number of iterations required.
  • the use frequency can be reduced by using it for finishing. Thereby, the exchange frequency of a grindstone can also be made low.
  • a grindstone having a particle size of 400 or less, preferably 150 to 350, is used for the initial treatment of the repetition, and the count is increased as necessary.
  • the number of 400 or more, preferably 500 to 800 is used.
  • a grindstone with a grain size is used for the final treatment of the iteration. There is no need to change the count of the grindstone more than necessary, and it is usually sufficient to prepare two types for roughing and finishing.
  • the count is based on JIS R 6001.
  • the divided blocks 14 are arranged so that the upper and lower surfaces thereof are orthogonal to the central axes of the two rotating grindstones 15, and the divided blocks 14 are relatively moved in a direction orthogonal to the central axes of the rotating grindstones 15.
  • the relative movement can be performed by moving either or both of the rotating grindstone and the divided block.
  • the relative movement can be automatically performed by driving means such as a motor.
  • the speed during relative movement can also be controlled by an inverter or the like.
  • the rotating grindstone is produced by, for example, bonding abrasive grains with a binder.
  • the material of the abrasive grains is not limited, and examples thereof include diamond and boron nitride. Diamond is preferred when grinding glass.
  • the material of the binder is not limited, but includes metal bonds using metal powders, resin bonds using thermosetting resins, metal resin bonds using metal powders and thermosetting resins, etc. It is done. Among these, metal bonds are generally used in this application. Metal bonds are made by blending and sintering various materials including multiple metals. As a grindstone using a metal bond, an electrodeposited grindstone in which only one layer of diamond is embedded in the base metal by nickel plating, and an electroformed grindstone in which diamond is densely bound via plating without a base metal Is mentioned. Among these, an electroformed grindstone is preferable from the viewpoint of maintaining the shape of the grindstone.
  • the material of the plating layer is not particularly limited, but generally nickel is the main component in many cases.
  • the division block 14 is fixed with the jig 17 and then performed.
  • the jig 17 preferably has a clamp plate 18 for sandwiching the divided block 14 in the vertical direction and / or the traveling direction.
  • the clamp plate 18 can be adjusted in tightening strength by a clamp bolt 19.
  • the jig 17 can also be movable on a linear rail 25 that passes through the center of the distance between the central axes of the two rotating grindstones 15 at a right angle.
  • the jig 17 preferably has positioning means for placing (centering) the divided block 14 at the center between the two rotating grindstones from the viewpoint of improving dimensional accuracy.
  • the positioning means is not particularly limited.
  • the jig 17 is separated from the upper and lower surfaces of the divided block 14 by a distance necessary for centering in a direction perpendicular to the traveling direction.
  • the butting plate 20 can be detachably attached by fixing means such as bolts 28 and 29, and this can be used as positioning means.
  • the distance can be adjusted by sandwiching the spacer 21 between the main body 26 of the jig and the abutting plate 20. Centering can be completed by setting the divided block 14 to the jig 17 so that the one end surface of the divided block 14 contacts the abutting plate 20.
  • the abutting plate 22 is detachably attached to the position opposite to the abutting plate 20 via a spacer 23, and bolts 28 and 29 provided in the front and rear directions are provided.
  • the end face of the divided block 14 can be finely adjusted to be parallel to the traveling direction.
  • the dial gauge 27 capable of measuring the tightening distance can be installed in the divided block 14 or the jig 17. After the centering is completed, the abutting plates 20 and 22 and the spacers 21 and 23 can be removed.
  • the fixing of the divided block 14 to the jig is preferably performed in order to facilitate positioning by temporarily tightening loosely before performing centering and then performing final tightening after performing centering.
  • step d After the step c, it is preferable to carry out a step d of polishing the ground end face.
  • the end face of the hard substrate becomes smoother, the occurrence of chipping is suppressed, and the strength is remarkably improved.
  • the width of the hard substrate reduced by step d is generally less than step c, typically less than 50 ⁇ m, and more typically 20-45 ⁇ m.
  • the polishing method include, but are not limited to, mechanical polishing, chemical polishing, electrolytic polishing, and combinations thereof.
  • a specific example of mechanical polishing is polishing with a rotating brush. At this time, the slurry containing an abrasive such as cerium oxide may be contacted with the polishing surface.
  • the material of the brush is not particularly limited, and examples thereof include nylon, PVC, and PP. Pig hair, wool, horse hair, brass, cerium oxide, aluminum oxide, silicon carbide, aluminum silicate and the like can be kneaded into nylon, PVC, PP and the like.
  • a specific example of chemical polishing is etching. Etching can be performed by bringing the object to be processed into contact with the etching solution by, for example, immersing it.
  • the etching solution is not particularly limited, and examples thereof include hydrofluoric acid, phosphoric acid, hydrochloric acid, and ammonium salts thereof.
  • Shape processing can be performed between step b and step c and / or after step c.
  • an arbitrary shape processing can be performed between the step c and the step d and / or after the step d. Since processing can be performed integrally in the shape of the target plate product in the state of the divided blocks, there is an advantage that the production speed of the plate product can be significantly increased.
  • Shape processing may be performed by any known means. For example, rotary grinding wheel, router, drill, outer shape processing by etching, drilling by ultrasonic vibration drill or etching, flame processing using burner, laser beam and water jet For example, a cutting process or the like.
  • the shape processing is generally aimed at other than the flattening of the end face, but is not limited thereto.
  • the processing methods can be used alone or in combination. Etching can also be used for surface treatment after shape processing.
  • segmentation block can be peeled and a some plate-shaped product can be formed.
  • the peeling method of the divided blocks may be selected according to the adhesive, but can be peeled off by heating, for example.
  • the heating method in the case of a photo-curable adhesive the translucent hard substrate laminate is immersed in warm water so that the adhesive softens into a film and is well separated into each plate-like product. Is preferred.
  • a suitable temperature of the hot water varies depending on the fixing agent employed, but is usually about 60 to 95 ° C., preferably 80 to 90 ° C. By irradiating light such as UV, it can be easily peeled off.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Surface Treatment Of Glass (AREA)
PCT/JP2012/073946 2011-09-22 2012-09-19 硬質基板積層体の加工方法及び板状製品の製造方法 WO2013042689A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280045897.9A CN103813995B (zh) 2011-09-22 2012-09-19 硬质基板层叠体的加工方法及板状制品的制造方法
JP2013534725A JP5956449B2 (ja) 2011-09-22 2012-09-19 硬質基板積層体の加工方法及び板状製品の製造方法
KR1020147007937A KR20140069034A (ko) 2011-09-22 2012-09-19 경질 기판 적층체의 가공 방법 및 판형 제품의 제조 방법

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Application Number Priority Date Filing Date Title
JP2011-207912 2011-09-22
JP2011207912 2011-09-22

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WO2013042689A1 true WO2013042689A1 (ja) 2013-03-28

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CN112130354A (zh) * 2020-09-16 2020-12-25 江西合力泰科技有限公司 一种3d眼镜产品加工工艺
KR102443795B1 (ko) * 2020-11-03 2022-09-16 주식회사 도우인시스 초박형 글라스의 가공 방법
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JP2015072453A (ja) * 2013-09-04 2015-04-16 住友化学株式会社 端面加工偏光板の製造方法
JP2015063413A (ja) * 2013-09-24 2015-04-09 Hoya株式会社 電子機器用カバーガラスのガラス基板の製造方法
JP2015104785A (ja) * 2013-11-29 2015-06-08 ショーダテクトロン株式会社 積層ガラスブロックの保持具
JP2018507158A (ja) * 2015-02-02 2018-03-15 コーニング インコーポレイテッド 合わせガラス物品のエッジを強化する方法及びそれによって形成された合わせガラス物品
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