WO2013035276A1 - Substrat de capteur tactile intégré, dispositif d'affichage le comprenant et procédé de production de substrat de capteur tactile intégré - Google Patents

Substrat de capteur tactile intégré, dispositif d'affichage le comprenant et procédé de production de substrat de capteur tactile intégré Download PDF

Info

Publication number
WO2013035276A1
WO2013035276A1 PCT/JP2012/005471 JP2012005471W WO2013035276A1 WO 2013035276 A1 WO2013035276 A1 WO 2013035276A1 JP 2012005471 W JP2012005471 W JP 2012005471W WO 2013035276 A1 WO2013035276 A1 WO 2013035276A1
Authority
WO
WIPO (PCT)
Prior art keywords
touch sensor
sensor substrate
integrated touch
film layer
layer
Prior art date
Application number
PCT/JP2012/005471
Other languages
English (en)
Japanese (ja)
Inventor
真依 木本
松政　健司
Original Assignee
凸版印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to KR1020147003679A priority Critical patent/KR20140059196A/ko
Priority to CN201280042416.9A priority patent/CN103782257A/zh
Publication of WO2013035276A1 publication Critical patent/WO2013035276A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to an integrated touch sensor substrate used for a display device with a touch panel, and more particularly to an integrated touch sensor substrate in which a logo mark is displayed on a peripheral portion.
  • touch panels have been adopted for operation units of various electronic devices such as mobile phones, personal digital assistants, car navigation systems.
  • the touch panel is configured by bonding a position input device capable of detecting a contact position such as a finger on a display screen of a display device such as a liquid crystal panel or an organic EL (Electro-Luminescence).
  • the touch panel system is roughly classified into a resistance film type, a capacitance type, an optical type, and an ultrasonic type, and each has a merit / demerit, and is used properly according to the application.
  • the capacitance type further includes a surface type and a projection type.
  • a projected capacitive touch panel includes a plurality of electrodes arranged on a grid in the X direction and the Y direction, is capable of multi-touch, and is currently spreading rapidly.
  • the projected capacitive touch panel sensor substrate generally has a five-layer structure, that is, metal wiring, two transparent electrodes for X and Y directions, an interlayer insulating layer between two transparent electrodes, It consists of a protective layer.
  • a single-sided structure in which two transparent electrode layers are formed on one side of a glass substrate by forming an interlayer insulating layer with an organic film, and the glass substrate is also used as an interlayer insulating layer, and the two transparent electrode layers are made of glass. It is roughly divided into two types of double-sided structures formed separately on both sides. (For example, see Patent Document 1)
  • a display with a touch panel such as a cellular phone to adopt a structure in which a front plate (cover glass) is provided on the outermost surface.
  • the cover glass is formed with a frame portion made of a highly light-shielding material for concealing peripheral wiring and the like.
  • Various colors and patterns can be applied to the frame portion according to the design of the device.
  • the frame portion is black because various colors and patterns are applied to the frame portion to increase the cost.
  • the ink or resist used when forming the black frame portion a material in which carbon or titanium, which is a pigment having a high light shielding property, is dispersed is generally used.
  • a material in which carbon or titanium is dispersed has a low specific resistance and a high dielectric constant.
  • a material whose resistivity is increased to 1 ⁇ 10 11 ⁇ ⁇ cm by coating carbon with resin is also used.
  • a company name, a product name, or a design called a house mark, family name, or pet name is often displayed as a logo mark on the periphery of the screen.
  • a logo mark is formed on the back surface of the cover glass by printing.
  • the logo mark is displayed in metallic color (metallic), white, or a predetermined color.
  • a frame part having a mark extraction part in a predetermined shape of the logo mark provided at a predetermined position is formed on the back surface of the front plate in black, for example, and then a predetermined part is formed by screen printing or the like from the back side of the mark extraction part.
  • This display is formed by overcoating with colors.
  • FIG. 30 shows an example of a cover glass of a display with a touch panel used for a conventional mobile phone or the like.
  • a frame portion 103 having a rectangular frame shape is formed on the cover glass 102, and the inside of the frame portion 103 is a display region 110.
  • the frame portion 103 is formed of a light-shielding material and includes a mark removal portion 113 and a window 114 for a camera or the like.
  • a display film layer 112 made of ink of a predetermined color or the like is applied to the mark removal portion 113 from the back side to form a logo mark display portion 111.
  • a step 112 a is generated with respect to the surface of the frame portion 103.
  • the step 112a has a disadvantage that the front plate becomes thick.
  • the object of the present invention employs the following configuration in order to solve the above inconvenience.
  • the present invention relates to an integrated touch sensor substrate including a front plate and a touch panel sensor. And a transparent front plate, a frame layer that is formed on the peripheral portion of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal portion that is formed by extracting a predetermined position of the frame layer in a predetermined shape
  • the metal film layer are formed of the same metal.
  • a part of the metal wiring is characterized in that a part of the metal film layer is formed by being separated by a slit.
  • the slit interval is 25 ⁇ m or less.
  • an opaque layer covering the slit is formed on the back surface of the metal film layer.
  • the metal film layer has a reflectance of 30% or more.
  • the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region And a touch sensor substrate.
  • a transparent front plate a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape
  • a metal plate formed on the back surface side of the frame layer, a metal film layer formed on the back surface side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wire.
  • the metal film layer is formed as a part of the metal wiring by providing the metal film layer with a slit and separating it.
  • the interval between the slits is 25 ⁇ m or less.
  • the method further includes a step of forming an opaque layer that covers the slit of the metal film layer after the step of forming the metal film layer.
  • a material having a reflectance of 30% or more is used as the material of the metal film layer.
  • an integrated touch sensor substrate of a front plate and a touch panel sensor a transparent front plate, a frame layer that is formed on a peripheral portion of the back surface of the front plate and defines a display area of a predetermined shape, and a frame layer Formed in a display area, a mark-out part formed by extracting a predetermined position in a predetermined shape, a metal wiring formed on the back side of the frame layer, a metal film layer formed on the back side of the mark-out part
  • the sensor layer is connected to the metal wiring, and the metal wiring and the metal film layer are made of the same metal, so the configuration is simple compared to screen printing with different ink. It can be formed with a thin thickness.
  • the logo mark display excellent in the design property with a metallic color (metallic) can be performed.
  • the metal wiring can be arranged by effectively using a limited area of the frame portion.
  • the slit spacing is 25 ⁇ m or less, the slits are not conspicuous and the design of the logo mark is not impaired.
  • an opaque layer covering the slit is formed on the back surface of the metal film layer, reflection of light in the slit can be suppressed and the slit can be made less noticeable.
  • the reflectance of the metal film layer is 30% or more, a logo mark with excellent gloss can be formed.
  • the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region Since the touch sensor substrate is provided, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink. Moreover, the logo mark display excellent in the design property with a metallic color (metallic) can be performed.
  • a transparent front plate a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape
  • a metal plate formed on the back surface side of the frame layer, a metal film layer formed on the back surface side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wire.
  • a step of forming a frame layer having a mark removal portion on the back surface of the front plate, a step of forming metal wiring, and a step of forming a metal film layer And a step of forming a sensor layer, and the step of forming the metal wiring and the step of forming the metal film layer are performed in the same step using the same metal material. Is no longer necessary The number and can reduce the manufacturing cost. In addition, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink.
  • the metal film layer is formed by providing slits and separated, thereby forming at least a part of the metal film layer as a part of the metal wiring, thereby limiting the frame portion.
  • the metal wiring can be arranged by effectively using the designated area.
  • the slits are not conspicuous and the design of the logo mark is not impaired.
  • a logo having excellent gloss can be formed by using a material having a reflectance of 30% or more as the material of the metal film layer.
  • FIG. 1 is a perspective view showing an example of a display device including an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 2 is a schematic plan view of the integrated touch sensor substrate according to the first embodiment viewed from the front side.
  • FIG. 3 is a schematic plan view of the integrated touch sensor substrate according to the first embodiment viewed from the back side.
  • FIG. 4 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 5 is a schematic cross-sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 6 is a schematic cross-sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 7 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 8 is a schematic plan view seen from the front surface side showing the integrated touch sensor substrate according to the second embodiment.
  • FIG. 9 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the second embodiment.
  • FIG. 10 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the second embodiment.
  • FIG. 11 is a schematic plan view of the integrated touch sensor substrate according to the third embodiment viewed from the front side.
  • FIG. 12 is a schematic plan view showing a main part structure of the integrated touch sensor substrate according to the third embodiment.
  • FIG. 13 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the third embodiment.
  • FIG. 14 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fourth embodiment.
  • FIG. 15 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the fifth embodiment.
  • FIG. 16 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fifth embodiment.
  • FIG. 17 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 18 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the invention.
  • FIG. 19 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the invention.
  • FIG. 20 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 21 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 22 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 23 is a schematic diagram illustrating an integrated touch sensor substrate according to a third embodiment of the present invention.
  • FIG. 24 is a schematic view showing an integrated touch sensor substrate according to Embodiment 3 of the present invention.
  • FIG. 25 is a schematic diagram illustrating an integrated touch sensor substrate according to a third embodiment of the present invention.
  • FIG. 26 is a schematic view showing an integrated touch sensor substrate according to Embodiment 3 of the present invention.
  • FIG. 27 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention.
  • FIG. 28 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention.
  • FIG. 29 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention.
  • FIG. 30 is a schematic view showing a structure of a front plate of a conventional integrated touch sensor substrate.
  • FIGS. 1-10 An integrated touch sensor substrate according to a first embodiment of the present invention will be described with reference to FIGS.
  • the cover glass and the touch panel sensor are directly formed integrally. Moreover, it has the structure which provides a metal wiring in a frame part.
  • the front surface the surface with which a finger or the like is brought into contact
  • the back surface the opposite surface
  • FIG. 1 is a perspective view showing a mobile phone as an example of a display device including an integrated touch sensor substrate 1 according to the present embodiment.
  • FIG. 2 is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side.
  • FIG. 3 is a plan view of the integrated touch sensor substrate 1 as viewed from the back side.
  • 4 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 shown in FIG. 3, and shows a state before the insulating protective film 9 shown in FIG. 3 is formed.
  • 5 is a cross-sectional view in the direction of arrows PP shown in FIG. 3
  • FIG. 6 is a cross-sectional view in the direction of arrows Q-Q shown in FIG. 3
  • FIG. FIG. 7B is an enlarged cross-sectional view showing a portion A of FIG. 7A.
  • the display device 50 is a mobile phone called a smartphone, and has a case 51 constituting an outer casing.
  • the case 51 is flat and has a rectangular shape that is long in the vertical direction (Y direction).
  • An integrated touch sensor substrate 1 is provided at the center of one main surface, and an operation button 52 is provided at the bottom.
  • the integrated touch sensor substrate 1 has a rectangular shape that is long in the vertical direction (Y direction), and is provided with a frame-shaped frame portion 3 having a predetermined width at the periphery.
  • An inner area defined by the frame portion 3 is a display area 10.
  • a logo mark display part 11 for displaying a logo mark is provided at the lower part of the frame part 3, and a window 14 is provided at the upper part.
  • a camera or proximity sensor (not shown) is provided below the window 14 (inside the case 51).
  • FIG. 2 is a plan view of the integrated touch sensor substrate 1 of the display device 50 shown in FIG. The shape is shown in a simplified manner.
  • the display of each character of this logo mark display part 11 is comprised from the surface of a uniform metal color.
  • FIGS. 3 to 6 for simplification of illustration, two lines of electrode patterns are schematically shown in each of the X direction and the Y direction. An electrode is provided.
  • the integrated touch sensor substrate 1 is a position input device used in combination with a display device such as a liquid crystal panel or an organic EL panel (not shown).
  • the integrated touch sensor substrate 1 has a plurality of electrodes extending in the X direction and a plurality of electrodes extending in the Y direction, and detects a change in capacitance of the electrode in contact with or close to the finger, thereby detecting the contact position of the finger. Specify coordinates.
  • the integrated touch sensor substrate 1 includes a cover glass 2, a frame portion 3, a plurality of jumper wirings 4, an insulating film 5, a metal wiring 6, a plurality of transparent electrodes 7 and 8, and insulation. And a protective film 9.
  • the cover glass 2 is a transparent front plate that is the outermost surface of the integrated touch sensor substrate 1 and is a member that is touched by the user.
  • the cover glass 2 is used as the front plate.
  • a heat-resistant transparent resin material may be used as the front plate.
  • the transparent plate which consists of resin materials may be stuck on the glass surface, and you may form from several layers.
  • the frame part 3 is formed on the back surface of the cover glass 2 using a light-shielding material that absorbs and blocks light.
  • the frame part 3 defines a display area 10 having a predetermined shape in a central window part, and plays a role of hiding wiring provided on the peripheral part of the integrated touch sensor substrate 1.
  • the frame portion 3 is formed in a frame shape so as to partition the display region 10 at the peripheral edge of the cover glass 2.
  • the planar shape of the frame part 3 is not limited to a rectangular ring shape as in the present embodiment, and is arbitrary such as a heart shape, an egg shape, and a round shape.
  • the outer peripheral edge shape (outer shape) and the inner peripheral edge shape (the shape of the display area 10) of the frame part 3 may be similar or dissimilar.
  • the frame part 3 is made of a photo-cured product of a pigment-based resist that absorbs visible light.
  • the pigment-based resist is a resin in which a pigment is dispersed in a resin dissolved in a solvent.
  • the photo-cured product of the pigment-based resist means that the pigment-based resist is subjected to an exposure process by a photolithography method. It is the one cured by.
  • the pigment-based resist is a pseudo black resist containing a mixture of at least two kinds of pigments other than carbon black and titanium oxide.
  • a pigment used in forming a colored transparent layer of a color filter C.I. I. Pigment Red 1, C.I. I. Pigment Red 2cm, C.I. I. Pigment Red 3cm, C.I. I. Pigment Red 4cm, C.I. I. Pigment Red 5cm, C.I. I. Pigment Red 6cm, C.I. I. Pigment Red 7cm, C.I. I. Pigment Red 8cm, C.I. I. Pigment Red 9cm, C.I. I. Pigment red 1 0, C.I. I. I.
  • Pigment Red 11cm C.I. I. Pigment Red 1 2, C.I. I. Red (RED) pigments such as CI Pigment Red 1 to 4; I. Pigment Blue 1 5, C.I. I. Pigment Blue 1 5: 3, C.I. I. Pigment Blue 1 5: 4, C.I. I. Pigment Blue 1 5: 6, C.I. I.
  • a pseudo black color is obtained by mixing at least a blue (BLUE) pigment represented by CI Pigment Blue 60 and the like.
  • a yellow (YELLOW) pigment may be added.
  • Yellow pigments are known to absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shiji (1940, 1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P) 170-173).
  • the yellow pigment absorbs low-wavelength visible light and can be made closer to black.
  • the dielectric constant of the pigment-based resist photocured product is preferably 10 or less, more preferably 5.0 or less. This is to ensure the responsiveness of the capacitively coupled touch panel. Further, when the dielectric constant is 4.0 or less, formation of the electrostatic capacity of the pigment-based resist can be suppressed.
  • the metal wiring 6 and the transparent electrodes 7 and 8 are formed on the frame part 3 of this embodiment, it is necessary to ensure electrical insulation. That is, even if the specific resistance value is 1 ⁇ 10 8 ⁇ ⁇ cm, the specific resistance value of the photo-cured pigment-based resist is preferably 1 ⁇ 10 9 ⁇ ⁇ cm or more, more preferably 1 ⁇ 10 14 ⁇ ⁇ cm. More than cm is preferable. When the specific resistance value of the photo-cured product of the pigment-based resist is less than 1 ⁇ 10 9 ⁇ ⁇ cm, the metal wiring and the transparent electrode wiring formed on the frame, which is the photo-cured product of the pigment-based resist, are short-circuited (short) This is because the integrated touch sensor substrate does not operate normally.
  • the jumper wiring 4 is formed using a conductive material, and is intermittently arranged in a matrix on the cover glass 2 in the display region 10 in the X direction parallel to one side of the display region 10 and in the Y direction perpendicular thereto. Is arranged.
  • the jumper wiring 4 is for connecting the transparent electrodes 7 aligned in the X direction.
  • a plurality of insulating films 5 are provided corresponding to each of the jumper wirings 4.
  • Each of the insulating films 5 is formed so as to cross the corresponding jumper wiring 4 and extend in the X direction, and partially overlaps the central portion of the jumper wiring 4 in the Y direction.
  • the insulating film 5 functions as an interlayer insulating film between the jumper wiring 4 and the transparent electrode 8. The insulating film 5 does not overlap with both ends of the jumper wiring 4 so that the jumper wiring 4 and the transparent electrode 7 can be connected in the Y direction.
  • the metal wiring 6 is directly formed on the frame part 3 and is electrically connected to the transparent electrodes 7 and 8 located at the peripheral part of the display area 10.
  • the metal wiring 6 is made of a Mo / Al / Mo (molybdenum / aluminum / molybdenum) laminate, but may be formed of Au (gold), Ag (silver), an Ag alloy, or the like. good.
  • the constituent material of the metal wiring 6 is not limited to these, and any material that contains metal and has low resistance can be suitably used.
  • the sheet resistance value of the formed metal wiring 6 is preferably 5.0 ⁇ / ⁇ or less, more preferably 1.0 ⁇ / ⁇ or less, and further preferably 0.5 ⁇ / ⁇ or less.
  • the sheet resistance value can be measured by, for example, a four-terminal method.
  • the same constituent material as that of the metal wiring 6 is used as a display film layer described later.
  • the reflectance of the material is preferably 30% or more, more preferably 50% or more, and further preferably 70% or more.
  • Mo / Al / Mo or Mo a reflectance of 30% or more can be realized.
  • Ag—Pd—Cu silver palladium copper
  • Al a high reflectance of 70% or more can be realized.
  • the reflectance can be measured using, for example, a microspectrophotometer.
  • the transparent electrode 7 is for detecting the X coordinate.
  • the transparent electrode 7 is formed on the cover glass 2 in the display region 10 using a material having electrical conductivity and transparency.
  • the transparent electrode 7 is intermittently arranged in a matrix in the X direction and the Y direction, and is electrically connected to the jumper wiring 4 adjacent in the Y direction.
  • the transparent electrode 7 is made of, for example, ITO (Indium Tin Oxide).
  • the transparent electrode 8 is for detecting the Y coordinate.
  • the transparent electrode 8 is formed in the same process as the transparent electrode 7 using the same material as the transparent electrode 7.
  • the transparent electrode 8 extends in the Y direction between the columns of the transparent electrodes 7 aligned in the X direction, and three-dimensionally intersects with the jumper wiring 4 on the insulating film 5 as shown in FIGS.
  • the insulating protective film 9 is formed on almost the entire surface of the cover glass 2 except for the portion corresponding to the lead-out wiring of the metal wiring 6 so as to cover the jumper wiring 4, the metal wiring 6, the transparent electrodes 7 and 8, and the frame portion 3. Has been.
  • the insulating protective film 9 functions as a protective film that protects each component formed on the cover glass 2.
  • the jumper wiring 4, the insulating film 5, the transparent electrodes 7 and 8, and the insulating protective film 9 correspond to the sensor layer.
  • the photo-cured product of the pigment-based resist used in this embodiment has a lower dielectric constant and a higher specific resistance value than the photo-cured product of the black resist material for conventional color filters. Is unnecessary, and the sensor layer and the metal wiring 6 can be formed directly on the frame portion 3. In addition, since the number of steps is reduced because an insulating film that covers the frame portion 3 is not necessary, it is possible to realize cost reduction and yield improvement.
  • the material of the frame portion 3 is subjected to an exposure process by a photolithography method.
  • the frame part 3 is formed by screen printing, the unevenness of the surface of the frame part 3 becomes rough, but when the frame part 3 is formed by photolithography, the surface of the frame part 3 becomes smooth. Therefore, the metal wiring 6 can be directly and stably formed on the frame portion 3.
  • the frame part 3 positioned in the logo mark display part 11 on which the logo mark is displayed is formed with a mark removal part 13 that is cut out in the shape of the logo mark. That is, the mark-extracted portion 13 is a concave portion formed in a letter shape on the frame portion 3, and includes an inner wall obtained by hollowing the frame portion 3 in the shape of a logo mark, and the back surface of the cover glass 2 in the shape of the logo mark. And a bottom.
  • the metal wiring 6 is formed directly on the frame portion 3.
  • the display film layer 12 is formed on the inner surface of the mark removal portion 13.
  • each character of the logo mark on the logo mark display portion 11 of the frame portion 103 is displayed by a uniform surface of the same metal color as the metal wiring 6.
  • the film thickness of the metal wiring 6 and the display film layer 12 is preferably 50 nm or more and 1 ⁇ m or less, and more preferably 100 nm or more and 500 nm or less. When the thickness is 50 nm or more, sufficient conductivity and gloss can be realized, and when the thickness is 1 ⁇ m or less, sufficient conductivity and gloss and thin film thickness can be achieved at the same time.
  • a metal wiring 6 is formed continuously with the display film layer 12, and is connected to an electric circuit of a display device (not shown). In this way, the display film layer 12 may be grounded. This is to prevent the touch panel, the electric circuit of the display device and the like from being troubled by static electricity accumulated in the display film layer 12 made of a metal film, and to take measures against unnecessary radiation of the display device.
  • FIG. 8A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side
  • FIG. 8B is an enlarged cross-sectional view showing a portion B of FIG. 8A. is there.
  • FIG. 9 is a plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment).
  • FIG. 10A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the arrow S—S shown in FIG. 9, and
  • FIG. 10B is an enlarged view showing a portion C in FIG. It is sectional drawing.
  • the integrated touch sensor substrate 1 according to the present embodiment is the same as the first embodiment in that the metal film of the display film layer 12 is formed in the same process using the same metal as the metal wiring 6. There is a difference in that a part of the metal wiring 6 is used as at least a part of the display film layer 12. In other words, in the present embodiment, the metal wiring 6 is arranged in a region for displaying each character of the logo mark display unit 11.
  • each character of the logo mark on the logo mark display unit 11 is not a uniform surface, but is constituted by a display surface on which vertical slits 15 are formed.
  • the mark removal part 13 and the area in the vicinity thereof on the back side of the logo mark display part 11 are covered with the display film layer 12 and the metal wiring 6.
  • a wide display film layer 12 is formed in the center of this region, a metal wiring 6 is formed on both sides thereof, and a narrow display film layer 12 is formed on both sides thereof. It is configured not to short-circuit).
  • the metal film layer in the vicinity of the mark removal portion 13 is separated by the slit 15, and at least a part of the metal film layer can be used as the metal wiring 6.
  • the slits 15 may be formed in the display film layer 12 at equal intervals. By doing so, when the interval between the slits 15 is wide and easily visible, the slits 15 provided between the display film layer 12 and the metal wiring 6 and the equally spaced slits 15 are arranged at equal intervals. Design with stripes can be realized.
  • the slit 15 is 25 ⁇ m or less.
  • the slit 15 is 15 ⁇ m or less and the width of the line-shaped metal film between the adjacent slits 15 is 30 ⁇ m or more, the surface is almost uniform with fine stripes.
  • the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties.
  • the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
  • FIG. 11A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front surface side
  • FIG. 11B is an enlarged cross-sectional view showing a portion D of FIG. is there.
  • FIG. 12 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment).
  • It is a drawing corresponding to 13A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and
  • FIG. 13B is an enlarged view showing an E portion of FIG. 13A. It is sectional drawing.
  • the metal film of the display film layer 12 is formed in the same process using the same metal as the metal wiring 6, and each of the logo mark display unit 11 is formed.
  • the point that the metal wiring 6 is arranged in a part of the area for displaying characters is the same as that of the second embodiment.
  • each character of the logo mark of the logo mark display unit 11 is constituted by a horizontal striped display surface in which horizontal slits 15 are inserted at substantially equal intervals. Different.
  • the inner surface of the mark removal portion 13 on the back surface side of the logo mark display portion 11 and a region in the vicinity thereof are composed of a horizontally elongated display film layer 12 and metal wiring 6. Is done.
  • a slit 15 is provided between the display film layer 12 and the metal wiring 6 so as not to short-circuit each other. These slits 15 form horizontal stripes arranged at approximately equal intervals as shown in FIG.
  • the display film layer 12 and the metal wiring 6 each having a horizontally long and narrow shape are arranged alternately, but the display film layers 12 may be combined into one.
  • the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties.
  • the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
  • the integrated touch sensor substrate 1 according to this embodiment is obtained by changing a part of the configuration described in the third embodiment, and the plan view seen from the front side is as shown in FIGS. Are the same.
  • a plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side is the same as FIG.
  • FIG. 14A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and
  • FIG. 14B is an enlarged view showing a portion F in FIG. It is sectional drawing.
  • the metal wiring 6 is formed directly on the frame portion 3, but the specific resistance value of the material constituting the frame portion 3 is lower than a predetermined value, or the frame portion 3 is formed by screen printing. In cases such as when the surface unevenness is rough, it is difficult to form the metal wiring 6 directly on the frame portion 3. In the present embodiment, it will be described below that the technical idea of the present invention can be implemented even when such metal wiring 6 cannot be directly formed on the frame portion 3.
  • an insulating layer 16 that covers the entire back surface of the cover glass 2 is formed on the frame portion 3.
  • the metal wiring 6 is formed on the insulating layer 16. Can be formed on top.
  • each character of the logo mark of the logo mark display section 11 is formed on a horizontal stripe-shaped display surface as in the third embodiment.
  • this horizontal stripe-shaped display surface is not formed on the inner surface of the mark removal portion 13 as in the third embodiment, but is formed on the insulating layer 16. The display surface is visually recognized through the insulating layer 16.
  • the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties.
  • the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
  • the integrated touch sensor substrate 1 according to this embodiment is obtained by changing a part of the configuration described in the second embodiment, and the plan view seen from the front side is as shown in FIGS. Are the same.
  • FIG. 15 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side.
  • 16 (a) and 16 (b) are cross-sectional views of the integrated touch sensor substrate 1 in the directions of the arrows UU and VV shown in FIG. 15, respectively.
  • the frame layer 3 is formed of a carbon black resist. Therefore, the frame part 3 is insulated by forming the insulating layer 16 so as to cover the frame part 3.
  • the fourth embodiment is different from the fourth embodiment in that the insulating layer 16 is not formed inside the region where the frame portion 3 of the cover glass 2 is formed.
  • the insulating layer 16 is formed in the same process as the formation of the insulating film 5 using the same material as the insulating film 5. Thereby, the amount of material for the insulating layer 16 can be reduced and the number of processes can be reduced.
  • the integrated touch sensor substrate 1 after the metal wiring 6 and the display film layer 12 are formed, at least slits in the metal wiring 6 and the display film layer 12 are formed.
  • An opaque layer 17 is formed on the back side of the region where 15 is formed. Since the opaque layer 17 absorbs or scatters the light incident on the slit 15, the reflection of the light by the slit 15 becomes less conspicuous and the design of the logo mark can be improved.
  • the opaque layer 17 may be formed by appropriately selecting a suitable color from black or other colors in order to make the slit 15 less noticeable using a pigment or the like.
  • the opaque layer 17 can be formed by a conventionally known printing method such as a photolithography method, and can also be formed by an inkjet method, a dispenser method, or the like.
  • the opaque layer 17 is formed directly on the display film layer 12, the opaque layer 17 may be formed on the insulating protective film 9.
  • the opaque layer 17 only needs to cover the slit 15, and may be provided in the entire logo mark area as shown in FIG. 16, or may be provided only in the slit area and its vicinity, or may be provided only in the slit area. Good.
  • the opaque layer 17 may be formed on the metal wiring 6 and the display film layer 12 so as to cover the slit 15.
  • the frame layer 3 may be formed of a carbon black resist, and the insulating layer 16 may be formed so as to cover the frame portion 3 for insulation.
  • Example 1 In this example, a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the second embodiment will be described in detail.
  • 17 to 22 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment. 17 to 22, (a) is a cross-sectional view and (b) is a plan view. In addition, a two-dot chain line shown in (b) of FIGS. 17 to 22 represents a cutting position in the sectional view of (a).
  • frame part 3 Formation of frame part 3> First, a pigment-based resist, which will be described later, was applied on the back surface of the cover glass 2 by spin coating. Next, after removing the solvent content with a vacuum dryer, exposure was performed by a proximity exposure system (ultra-high pressure mercury lamp). Here, as the photomask for exposure, a soda glass patterned with Cr (chromium) was used. Next, development was performed with an alkaline developer, and heat treatment was performed to form a frame portion 3 having a mark removal portion 13 in the shape of a predetermined logo mark shown in FIG.
  • a proximity exposure system ultra-high pressure mercury lamp
  • etching is performed using an etching solution mainly composed of oxalic acid ((COOH) 2 ), and the positive resist is exposed on the entire surface, and then the positive resist is stripped with an alkaline stripping solution, as shown in FIG. A jumper wiring 4 made of an ITO film was formed.
  • etching solution mainly composed of oxalic acid ((COOH) 2 )
  • Formation of insulating film 5> First, an acrylic insulating material was applied on the formed product shown in FIG. 18 by spin coating. Next, pre-baking was performed to remove the solvent, and exposure was performed by a proximity exposure system (super high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used. Next, it developed with the alkaline developing solution and heat-processed. In this way, as shown in FIG. 19, the insulating film 5 on the jumper wiring 4 was formed.
  • a proximity exposure system super high pressure mercury lamp
  • Formation of metal wiring 6 and display film layer 12> First, a Mo layer, an Al layer, and a Mo layer are sequentially formed in a vacuum by a DC magnetron sputtering method on the formation shown in FIG. Formed. Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
  • a proximity exposure system ultra-high pressure mercury lamp
  • etching was performed with a phosphoric acid / nitric acid / acetic acid three-component etchant (etching solution), and the positive resist was exposed on the entire surface, and then the positive resist was stripped with an alkaline stripping solution.
  • etching solution a phosphoric acid / nitric acid / acetic acid three-component etchant
  • the positive resist was exposed on the entire surface, and then the positive resist was stripped with an alkaline stripping solution.
  • the metal wiring 6 and the display film layer 12 were formed on the frame part 3.
  • the inner surface of the mark removal portion 13 is covered with the film of the Mo / Al / Mo laminate formed by the display film layer 12 and the metal wiring 6 on both sides thereof.
  • the thicknesses of the Mo / Al / Mo laminated bodies constituting the display film layer 12 and the metal wiring 6 are set to 50 nm, 200 nm, and 50 nm, respectively, and the sheet resistance values of the display film layer 12 and the metal wiring 6 are set. 0.2 ⁇ / ⁇ and the reflectance was 40%. The width of the slit 15 was 15 ⁇ m.
  • transparent electrodes 7 and 8 Formation of transparent electrodes 7 and 8> First, an ITO film was formed on the formed material shown in FIG. 20 by heat sputtering, in which sputtering was performed by a DC magnetron sputtering method. Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure. And it etched using the etching liquid which has oxalic acid as a main component, and exposed the positive resist to the whole surface, Then, the positive resist was peeled with the alkaline peeling liquid. Thus, as shown in FIG. 21, the transparent electrodes 7 and 8 were formed with the ITO film.
  • a proximity exposure system ultra-high pressure mercury lamp
  • insulating protective film 9 Formation of insulating protective film 9> First, an acrylic overcoat material was applied on the formed product shown in FIG. 21 by spin coating. Next, pre-baking was performed to remove the solvent, and exposure was performed using a proximity exposure system (ultra-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used. Next, it developed with the alkaline developing solution and heat-processed. In this way, as shown in FIG. 22, the insulating protective film 9 was formed, and the integrated touch sensor substrate 1 was manufactured and completed.
  • a proximity exposure system ultra-high pressure mercury lamp
  • the pigment-based resist used in the above examples is a pseudo black resist in which two types of pigments are dispersed in a resin dissolved in a solvent to realize pseudo black.
  • pigment red (PR254) and pigment blue (PB15: 3) mixed at a ratio of 1: 1 were used as the two types of pigments.
  • the pigment ratio in the solid is 40 percent.
  • the frame portion 3 was formed to a thickness of 3 ⁇ m using this material.
  • the specific resistance value of the frame portion 3 formed in this way was 1 ⁇ 10 14 ⁇ ⁇ cm or more, and the dielectric constant was 4.0 or less.
  • the slit 15 was not visually recognized, and the metal wiring 6 and the display film layer 12 exhibited a sufficient metallic luster.
  • Example 2 In this example, the display film layer 12 and the metal wiring 6 in Example 1 are made of Ag—Pd—Cu alloy to a thickness of 200 nm, the width of the slit 15 is set to 25 ⁇ m, and the sheet resistance value is set to 0.1 ⁇ / ⁇ . The reflectance is 95%. Thereby, compared with Example 1, the electroconductivity and metal luster of the metal wiring 6 and the display film layer 12 were improved more. Moreover, the slit 15 was not visually recognized also in the logo mark display part 11 of the integrated touch sensor board
  • Example 3 the manufacturing method of the integrated touch sensor substrate 1 in which the frame layer 3 is formed of carbon black resist and the insulating layer 16 is formed so as to cover the frame portion 3 in the first embodiment described above will be described in detail. To do.
  • 23 to 26 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment.
  • 23 to 26 (a) is a cross-sectional view, and (b) is a plan view.
  • a two-dot chain line shown in (b) of FIGS. 23 to 26 represents a cutting position in the sectional view of (a).
  • the drawings referred to in the first embodiment are also referred to in this embodiment as appropriate.
  • a frame portion 3 having a thickness of 1.2 ⁇ m was formed on the back surface of the cover glass 2 at the same position as in FIG. 17 using a carbon black resist.
  • a jumper wiring 4 was formed in the same manner as in Example 1 as shown in FIG.
  • the insulating film 5 on the jumper wiring 4 is formed in the same manner as in the first embodiment, and at the same time, the insulating layer 16 is formed by the same material and method as the insulating film 5 is formed. The formation shown in FIG. 23 was obtained.
  • transparent electrodes 7 and 8 were formed of ITO films by the same method as in Example 1 as shown in FIG.
  • insulating protective film 9 Formation of insulating protective film 9> As shown in FIG. 26, the insulating protective film 9 was formed on the formed product shown in FIG. 25 as shown in FIG. 26, and the integrated touch sensor substrate 1 was manufactured and completed.
  • the display film layer 12 exhibited a sufficient metallic luster as in Example 1.
  • Example 4 a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the fifth embodiment will be described in detail.
  • 27 to 29 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment.
  • 27 to 29 (a) is a cross-sectional view, and (b) is a plan view.
  • a two-dot chain line shown in (b) of FIGS. 27 to 29 represents a cutting position in the sectional view of (a).
  • the formation of the frame portion 3, the formation of the jumper wiring 4, the formation of the insulating film 5 and the insulating layer 16, and the formation of the transparent electrodes 7 and 8 are as described in 1. ⁇ 3. And 5. Since it is the same as that of FIG. Since the formation of the metal wiring 6 and the display film layer 12 is the same as that of the second embodiment, the description thereof is omitted. However, the second embodiment differs from the second embodiment in that the width of the slit 15 is 30 ⁇ m.
  • FIG. 27 shows the formed product up to the formation of the transparent electrodes 7 and 8.
  • the opaque layer 17 was formed by an ink jet method so as to cover the slit 15 with the same material as that of the frame portion 3, and the formed product shown in FIG. 28 was obtained.
  • the insulating protective film 9 was formed on the formed product shown in FIG. 28 by the same method as in Example 1, and the integrated touch sensor substrate 1 shown in FIG. 29 was manufactured and completed.
  • the width of the slit 15 is larger than that of the third embodiment, but the slit 15 can be made inconspicuous because the slit 15 is covered from the opposite side of the cover glass 2 by the opaque layer 17.
  • the opaque layer 17 may be formed after the metal wiring 6 and the display film layer 12 are formed and before the transparent electrodes 7 and 8 are formed.
  • the opaque layer 17 may be formed on the insulating protective film 9 after the insulating protective film 9 is formed.
  • the integrated touch sensor substrate of the present invention is not limited to the above-described embodiments and examples, and various modifications are possible.
  • the mobile phone is used as the display device, but the present invention is not limited to this.
  • the present invention can also be applied to a display device in which a logo mark is displayed on the periphery, such as a portable information terminal, a car navigation system, a computer display, a liquid crystal television such as a tablet television and a stationary television, and an electronic blackboard. That is, the size of the integrated touch sensor substrate is not particularly limited.
  • the size of the logo mark, the metal wiring constituting the logo mark, and the size of the display film are not particularly limited as long as they are within the frame portion. Further, the number of characters of the logo mark is not limited. Further, the frame portion is not limited to black, and can be formed by appropriately selecting a material of a suitable color such as white, red, blue, or yellow according to the design of the display device, for example.
  • the projected capacitive touch panel has been described as an integrated touch sensor substrate.
  • the capacitive touch panel is not limited to the capacitive touch panel, and various types of touch panels having a frame portion may be used. Can be applied.
  • the present invention can be used as a position input device for an electronic device such as a mobile phone or a portable information terminal.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

La présente invention porte sur un substrat de capteur tactile intégré, un dispositif d'affichage le comprenant et un procédé de production d'un substrat de capteur tactile intégré. Il est possible d'afficher un logo en une couleur métallique dans la section cadre d'une plaque de surface avant d'un capteur de panneau tactile, et de maintenir une faible épaisseur de celui-ci par utilisation d'une configuration simple. Un substrat de capteur tactile intégré est utilisé dans un dispositif d'affichage comprenant un panneau tactile, le câblage métallique placé dans la section cadre et la membrane d'affichage servant à afficher le logo étant formés à partir du même métal durant la même étape. De plus, un câblage métallique est également positionné dans la région pour afficher le logo, et le câblage est positionné par utilisation efficace de l'espace limité dans la section cadre.
PCT/JP2012/005471 2011-09-06 2012-08-30 Substrat de capteur tactile intégré, dispositif d'affichage le comprenant et procédé de production de substrat de capteur tactile intégré WO2013035276A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020147003679A KR20140059196A (ko) 2011-09-06 2012-08-30 일체형 터치 센서 기판, 이를 구비하는 표시 장치 및 일체형 터치 센서 기판의 제조 방법
CN201280042416.9A CN103782257A (zh) 2011-09-06 2012-08-30 一体型触控传感器基板、具有它的显示装置、以及一体型触控传感器基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-194395 2011-09-06
JP2011194395 2011-09-06

Publications (1)

Publication Number Publication Date
WO2013035276A1 true WO2013035276A1 (fr) 2013-03-14

Family

ID=47831751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/005471 WO2013035276A1 (fr) 2011-09-06 2012-08-30 Substrat de capteur tactile intégré, dispositif d'affichage le comprenant et procédé de production de substrat de capteur tactile intégré

Country Status (5)

Country Link
JP (1) JPWO2013035276A1 (fr)
KR (1) KR20140059196A (fr)
CN (1) CN103782257A (fr)
TW (1) TW201329808A (fr)
WO (1) WO2013035276A1 (fr)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171128A (ja) * 2012-02-20 2013-09-02 Dainippon Printing Co Ltd 配線付き表示装置用前面保護板とその製造方法、及び表示装置
CN103324350A (zh) * 2013-05-09 2013-09-25 友达光电股份有限公司 触控面板
CN103336643A (zh) * 2013-06-19 2013-10-02 业成光电（深圳）有限公司 触控面板
CN103984435A (zh) * 2014-04-10 2014-08-13 业成光电（深圳）有限公司 可缩减边框区的触控面板
US20140322492A1 (en) * 2013-04-24 2014-10-30 Tpk Touch Solutions (Xiamen) Inc. Touch panel and cover structure thereof
JP2015014733A (ja) * 2013-07-05 2015-01-22 大日本印刷株式会社 表示装置用前面保護板及び表示装置
JP2015025966A (ja) * 2013-07-26 2015-02-05 大日本印刷株式会社 表示装置用前面保護板及び表示装置
JP2015049364A (ja) * 2013-09-02 2015-03-16 大日本印刷株式会社 表示装置用前面保護板及び表示装置
TWI492121B (zh) * 2013-04-02 2015-07-11 深圳歐菲光科技股份有限公司 觸摸屏
JP2015148941A (ja) * 2014-02-06 2015-08-20 大日本印刷株式会社 タッチパネルセンサおよびタッチパネルセンサを備える入出力装置
KR20150125129A (ko) * 2014-04-29 2015-11-09 엘지디스플레이 주식회사 터치 센서 일체형 표시장치
WO2016199446A1 (fr) * 2015-06-11 2016-12-15 富士フイルム株式会社 Procédé de fabrication de corps conducteur de panneau tactile, corps stratifié de film conducteur et corps conducteur de panneau tactile
JP2017134432A (ja) * 2017-04-26 2017-08-03 大日本印刷株式会社 表示装置用前面保護板及び表示装置
KR20200005707A (ko) * 2018-07-06 2020-01-16 삼성디스플레이 주식회사 입력 감지 유닛 및 이를 포함하는 표시장치
CN111488086A (zh) * 2020-04-08 2020-08-04 合肥鑫晟光电科技有限公司 一种触控显示装置及其制作方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201512916A (zh) * 2013-09-18 2015-04-01 Wintek Corp 觸控面板
TWI559186B (zh) * 2013-12-13 2016-11-21 Ｌｇ化學股份有限公司 觸控感測器及顯示裝置
CN103823603A (zh) * 2014-03-19 2014-05-28 南昌欧菲光学技术有限公司 Ogs触摸屏及其制作方法
CN106033276B (zh) * 2015-03-18 2019-04-02 宸鸿科技(厦门)有限公司 触控面板及其制造方法
CN111857410A (zh) * 2018-01-24 2020-10-30 祥达光学（厦门）有限公司 触控面板
CN111831156A (zh) * 2018-01-24 2020-10-27 祥达光学（厦门）有限公司 触控面板与触控传感器卷带

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008197346A (ja) * 2007-02-13 2008-08-28 Nagashima Kogei Kk 背光表示パネル及びその製造方法
JP2010256682A (ja) * 2009-04-27 2010-11-11 Hitachi Displays Ltd 液晶表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410779A (zh) * 2006-06-12 2009-04-15 夏普株式会社 触摸面板、显示装置和触摸面板的制造方法
TWM378603U (en) * 2009-11-12 2010-04-11 3D Pre Color Plastic Inc Board body and its transparent covering layer
KR101048974B1 (ko) * 2010-04-01 2011-07-12 삼성모바일디스플레이주식회사 터치 스크린 패널

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008197346A (ja) * 2007-02-13 2008-08-28 Nagashima Kogei Kk 背光表示パネル及びその製造方法
JP2010256682A (ja) * 2009-04-27 2010-11-11 Hitachi Displays Ltd 液晶表示装置

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171128A (ja) * 2012-02-20 2013-09-02 Dainippon Printing Co Ltd 配線付き表示装置用前面保護板とその製造方法、及び表示装置
TWI492121B (zh) * 2013-04-02 2015-07-11 深圳歐菲光科技股份有限公司 觸摸屏
US9857850B2 (en) * 2013-04-24 2018-01-02 Tpk Touch Solutions (Xiamen) Inc. Touch panel and cover structure thereof
US20140322492A1 (en) * 2013-04-24 2014-10-30 Tpk Touch Solutions (Xiamen) Inc. Touch panel and cover structure thereof
CN103324350A (zh) * 2013-05-09 2013-09-25 友达光电股份有限公司 触控面板
CN103336643A (zh) * 2013-06-19 2013-10-02 业成光电（深圳）有限公司 触控面板
JP2015014733A (ja) * 2013-07-05 2015-01-22 大日本印刷株式会社 表示装置用前面保護板及び表示装置
JP2015025966A (ja) * 2013-07-26 2015-02-05 大日本印刷株式会社 表示装置用前面保護板及び表示装置
JP2015049364A (ja) * 2013-09-02 2015-03-16 大日本印刷株式会社 表示装置用前面保護板及び表示装置
JP2015148941A (ja) * 2014-02-06 2015-08-20 大日本印刷株式会社 タッチパネルセンサおよびタッチパネルセンサを備える入出力装置
CN103984435A (zh) * 2014-04-10 2014-08-13 业成光电（深圳）有限公司 可缩减边框区的触控面板
KR101633175B1 (ko) 2014-04-29 2016-06-24 엘지디스플레이 주식회사 터치 센서 일체형 표시장치
US9823765B2 (en) 2014-04-29 2017-11-21 Lg Display Co., Ltd. Touch sensor integrated type display device
KR20150125129A (ko) * 2014-04-29 2015-11-09 엘지디스플레이 주식회사 터치 센서 일체형 표시장치
US10318035B2 (en) 2014-04-29 2019-06-11 Lg Display Co., Ltd. Touch sensor integrated type display device having dummy pixel eletrodes in a bezel region
WO2016199446A1 (fr) * 2015-06-11 2016-12-15 富士フイルム株式会社 Procédé de fabrication de corps conducteur de panneau tactile, corps stratifié de film conducteur et corps conducteur de panneau tactile
JPWO2016199446A1 (ja) * 2015-06-11 2018-02-22 富士フイルム株式会社 タッチパネル用導電体の製造方法、導電フィルム積層体およびタッチパネル用導電体
US10514787B2 (en) 2015-06-11 2019-12-24 Fujifilm Corporation Method for manufacturing conductor for touch panel, conductive film laminate, and conductor for touch panel
JP2017134432A (ja) * 2017-04-26 2017-08-03 大日本印刷株式会社 表示装置用前面保護板及び表示装置
KR20200005707A (ko) * 2018-07-06 2020-01-16 삼성디스플레이 주식회사 입력 감지 유닛 및 이를 포함하는 표시장치
KR102607494B1 (ko) * 2018-07-06 2023-12-01 삼성디스플레이 주식회사 입력 감지 유닛 및 이를 포함하는 표시장치
CN111488086A (zh) * 2020-04-08 2020-08-04 合肥鑫晟光电科技有限公司 一种触控显示装置及其制作方法
CN111488086B (zh) * 2020-04-08 2024-04-16 合肥鑫晟光电科技有限公司 一种触控显示装置及其制作方法

Also Published As

Publication number Publication date
KR20140059196A (ko) 2014-05-15
CN103782257A (zh) 2014-05-07
JPWO2013035276A1 (ja) 2015-03-23
TW201329808A (zh) 2013-07-16

Similar Documents

Publication Publication Date Title
WO2013035276A1 (fr) Substrat de capteur tactile intégré, dispositif d'affichage le comprenant et procédé de production de substrat de capteur tactile intégré
JP5418130B2 (ja) 静電容量式タッチパネルセンサおよび当該タッチパネルセンサの製造方法
CN102736780B (zh) 输入装置
US7071926B2 (en) Touch panel capable of wide-area inputting
KR101363151B1 (ko) 터치스크린용 투명 회로 기판, 그 제조 방법 및 이를 포함하는 터치스크린
TWI476656B (zh) 觸控面板及其製造方法
US20100053114A1 (en) Touch panel apparatus and method for manufacturing the same
EP2461232A1 (fr) Substrat d'électrode, procédé de fabrication de substrat d'électrode et dispositif d'affichage d'image
JP5827972B2 (ja) タッチセンサ一体型表示装置
US20130271408A1 (en) Touch screen and manufacturing method thereof
JP5780455B2 (ja) 投影型静電容量式タッチパネルセンサー及びその製造方法、投影型静電容量式タッチパネルセンサーを備えた表示装置
CN103927068A (zh) 与显示窗一体的电容式接触感应器以及其制造方法
CN104793790A (zh) 透光型输入装置
TWM458612U (zh) 觸控面板
JP2014071734A (ja) カラーフィルタ一体型タッチパネルセンサ用基板、カラーフィルタ一体型タッチパネルセンサおよびカラーフィルタ一体型タッチパネルモジュール
JP5884763B2 (ja) タッチパネル用電極基板、及びタッチパネル、ならびに画像表示装置
JP2013161203A (ja) タッチパネルセンサー基板およびそれを備える表示装置
JP2013008272A (ja) 加飾透明保護基板一体型タッチパネルおよびその製造方法
JP5892418B2 (ja) タッチパネルセンサ、タッチパネルセンサの製造方法、および、タッチパネルセンサを製造するための積層体
TWI498948B (zh) Input device and manufacturing method thereof
JP5471543B2 (ja) タッチパネルセンサ製造方法およびタッチパネルセンサ
JP6206637B2 (ja) タッチパネル基板、及び表示装置
CN108475152A (zh) 触摸屏传感器
JP2015064748A (ja) 一体型タッチセンサー基板、これを備える表示装置、および一体型タッチセンサー基板の製造方法
JP6108094B2 (ja) 電極付き表示装置用前面保護板及び表示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12830367

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20147003679

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2013532425

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12830367

Country of ref document: EP

Kind code of ref document: A1