WO2013035276A1 - Integrated touch sensor substrate, display device provided with same, and method for producing integrated touch sensor substrate - Google Patents

Integrated touch sensor substrate, display device provided with same, and method for producing integrated touch sensor substrate Download PDF

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Publication number
WO2013035276A1
WO2013035276A1 PCT/JP2012/005471 JP2012005471W WO2013035276A1 WO 2013035276 A1 WO2013035276 A1 WO 2013035276A1 JP 2012005471 W JP2012005471 W JP 2012005471W WO 2013035276 A1 WO2013035276 A1 WO 2013035276A1
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WO
WIPO (PCT)
Prior art keywords
touch sensor
sensor substrate
integrated touch
film layer
layer
Prior art date
Application number
PCT/JP2012/005471
Other languages
French (fr)
Japanese (ja)
Inventor
真依 木本
松政　健司
Original Assignee
凸版印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to KR1020147003679A priority Critical patent/KR20140059196A/en
Priority to CN201280042416.9A priority patent/CN103782257A/en
Publication of WO2013035276A1 publication Critical patent/WO2013035276A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to an integrated touch sensor substrate used for a display device with a touch panel, and more particularly to an integrated touch sensor substrate in which a logo mark is displayed on a peripheral portion.
  • touch panels have been adopted for operation units of various electronic devices such as mobile phones, personal digital assistants, car navigation systems.
  • the touch panel is configured by bonding a position input device capable of detecting a contact position such as a finger on a display screen of a display device such as a liquid crystal panel or an organic EL (Electro-Luminescence).
  • the touch panel system is roughly classified into a resistance film type, a capacitance type, an optical type, and an ultrasonic type, and each has a merit / demerit, and is used properly according to the application.
  • the capacitance type further includes a surface type and a projection type.
  • a projected capacitive touch panel includes a plurality of electrodes arranged on a grid in the X direction and the Y direction, is capable of multi-touch, and is currently spreading rapidly.
  • the projected capacitive touch panel sensor substrate generally has a five-layer structure, that is, metal wiring, two transparent electrodes for X and Y directions, an interlayer insulating layer between two transparent electrodes, It consists of a protective layer.
  • a single-sided structure in which two transparent electrode layers are formed on one side of a glass substrate by forming an interlayer insulating layer with an organic film, and the glass substrate is also used as an interlayer insulating layer, and the two transparent electrode layers are made of glass. It is roughly divided into two types of double-sided structures formed separately on both sides. (For example, see Patent Document 1)
  • a display with a touch panel such as a cellular phone to adopt a structure in which a front plate (cover glass) is provided on the outermost surface.
  • the cover glass is formed with a frame portion made of a highly light-shielding material for concealing peripheral wiring and the like.
  • Various colors and patterns can be applied to the frame portion according to the design of the device.
  • the frame portion is black because various colors and patterns are applied to the frame portion to increase the cost.
  • the ink or resist used when forming the black frame portion a material in which carbon or titanium, which is a pigment having a high light shielding property, is dispersed is generally used.
  • a material in which carbon or titanium is dispersed has a low specific resistance and a high dielectric constant.
  • a material whose resistivity is increased to 1 ⁇ 10 11 ⁇ ⁇ cm by coating carbon with resin is also used.
  • a company name, a product name, or a design called a house mark, family name, or pet name is often displayed as a logo mark on the periphery of the screen.
  • a logo mark is formed on the back surface of the cover glass by printing.
  • the logo mark is displayed in metallic color (metallic), white, or a predetermined color.
  • a frame part having a mark extraction part in a predetermined shape of the logo mark provided at a predetermined position is formed on the back surface of the front plate in black, for example, and then a predetermined part is formed by screen printing or the like from the back side of the mark extraction part.
  • This display is formed by overcoating with colors.
  • FIG. 30 shows an example of a cover glass of a display with a touch panel used for a conventional mobile phone or the like.
  • a frame portion 103 having a rectangular frame shape is formed on the cover glass 102, and the inside of the frame portion 103 is a display region 110.
  • the frame portion 103 is formed of a light-shielding material and includes a mark removal portion 113 and a window 114 for a camera or the like.
  • a display film layer 112 made of ink of a predetermined color or the like is applied to the mark removal portion 113 from the back side to form a logo mark display portion 111.
  • a step 112 a is generated with respect to the surface of the frame portion 103.
  • the step 112a has a disadvantage that the front plate becomes thick.
  • the object of the present invention employs the following configuration in order to solve the above inconvenience.
  • the present invention relates to an integrated touch sensor substrate including a front plate and a touch panel sensor. And a transparent front plate, a frame layer that is formed on the peripheral portion of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal portion that is formed by extracting a predetermined position of the frame layer in a predetermined shape
  • the metal film layer are formed of the same metal.
  • a part of the metal wiring is characterized in that a part of the metal film layer is formed by being separated by a slit.
  • the slit interval is 25 ⁇ m or less.
  • an opaque layer covering the slit is formed on the back surface of the metal film layer.
  • the metal film layer has a reflectance of 30% or more.
  • the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region And a touch sensor substrate.
  • a transparent front plate a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape
  • a metal plate formed on the back surface side of the frame layer, a metal film layer formed on the back surface side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wire.
  • the metal film layer is formed as a part of the metal wiring by providing the metal film layer with a slit and separating it.
  • the interval between the slits is 25 ⁇ m or less.
  • the method further includes a step of forming an opaque layer that covers the slit of the metal film layer after the step of forming the metal film layer.
  • a material having a reflectance of 30% or more is used as the material of the metal film layer.
  • an integrated touch sensor substrate of a front plate and a touch panel sensor a transparent front plate, a frame layer that is formed on a peripheral portion of the back surface of the front plate and defines a display area of a predetermined shape, and a frame layer Formed in a display area, a mark-out part formed by extracting a predetermined position in a predetermined shape, a metal wiring formed on the back side of the frame layer, a metal film layer formed on the back side of the mark-out part
  • the sensor layer is connected to the metal wiring, and the metal wiring and the metal film layer are made of the same metal, so the configuration is simple compared to screen printing with different ink. It can be formed with a thin thickness.
  • the logo mark display excellent in the design property with a metallic color (metallic) can be performed.
  • the metal wiring can be arranged by effectively using a limited area of the frame portion.
  • the slit spacing is 25 ⁇ m or less, the slits are not conspicuous and the design of the logo mark is not impaired.
  • an opaque layer covering the slit is formed on the back surface of the metal film layer, reflection of light in the slit can be suppressed and the slit can be made less noticeable.
  • the reflectance of the metal film layer is 30% or more, a logo mark with excellent gloss can be formed.
  • the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region Since the touch sensor substrate is provided, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink. Moreover, the logo mark display excellent in the design property with a metallic color (metallic) can be performed.
  • a transparent front plate a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape
  • a metal plate formed on the back surface side of the frame layer, a metal film layer formed on the back surface side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wire.
  • a step of forming a frame layer having a mark removal portion on the back surface of the front plate, a step of forming metal wiring, and a step of forming a metal film layer And a step of forming a sensor layer, and the step of forming the metal wiring and the step of forming the metal film layer are performed in the same step using the same metal material. Is no longer necessary The number and can reduce the manufacturing cost. In addition, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink.
  • the metal film layer is formed by providing slits and separated, thereby forming at least a part of the metal film layer as a part of the metal wiring, thereby limiting the frame portion.
  • the metal wiring can be arranged by effectively using the designated area.
  • the slits are not conspicuous and the design of the logo mark is not impaired.
  • a logo having excellent gloss can be formed by using a material having a reflectance of 30% or more as the material of the metal film layer.
  • FIG. 1 is a perspective view showing an example of a display device including an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 2 is a schematic plan view of the integrated touch sensor substrate according to the first embodiment viewed from the front side.
  • FIG. 3 is a schematic plan view of the integrated touch sensor substrate according to the first embodiment viewed from the back side.
  • FIG. 4 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 5 is a schematic cross-sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 6 is a schematic cross-sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 7 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the first embodiment.
  • FIG. 8 is a schematic plan view seen from the front surface side showing the integrated touch sensor substrate according to the second embodiment.
  • FIG. 9 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the second embodiment.
  • FIG. 10 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the second embodiment.
  • FIG. 11 is a schematic plan view of the integrated touch sensor substrate according to the third embodiment viewed from the front side.
  • FIG. 12 is a schematic plan view showing a main part structure of the integrated touch sensor substrate according to the third embodiment.
  • FIG. 13 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the third embodiment.
  • FIG. 14 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fourth embodiment.
  • FIG. 15 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the fifth embodiment.
  • FIG. 16 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fifth embodiment.
  • FIG. 17 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 18 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the invention.
  • FIG. 19 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the invention.
  • FIG. 20 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 21 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 22 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention.
  • FIG. 23 is a schematic diagram illustrating an integrated touch sensor substrate according to a third embodiment of the present invention.
  • FIG. 24 is a schematic view showing an integrated touch sensor substrate according to Embodiment 3 of the present invention.
  • FIG. 25 is a schematic diagram illustrating an integrated touch sensor substrate according to a third embodiment of the present invention.
  • FIG. 26 is a schematic view showing an integrated touch sensor substrate according to Embodiment 3 of the present invention.
  • FIG. 27 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention.
  • FIG. 28 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention.
  • FIG. 29 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention.
  • FIG. 30 is a schematic view showing a structure of a front plate of a conventional integrated touch sensor substrate.
  • FIGS. 1-10 An integrated touch sensor substrate according to a first embodiment of the present invention will be described with reference to FIGS.
  • the cover glass and the touch panel sensor are directly formed integrally. Moreover, it has the structure which provides a metal wiring in a frame part.
  • the front surface the surface with which a finger or the like is brought into contact
  • the back surface the opposite surface
  • FIG. 1 is a perspective view showing a mobile phone as an example of a display device including an integrated touch sensor substrate 1 according to the present embodiment.
  • FIG. 2 is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side.
  • FIG. 3 is a plan view of the integrated touch sensor substrate 1 as viewed from the back side.
  • 4 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 shown in FIG. 3, and shows a state before the insulating protective film 9 shown in FIG. 3 is formed.
  • 5 is a cross-sectional view in the direction of arrows PP shown in FIG. 3
  • FIG. 6 is a cross-sectional view in the direction of arrows Q-Q shown in FIG. 3
  • FIG. FIG. 7B is an enlarged cross-sectional view showing a portion A of FIG. 7A.
  • the display device 50 is a mobile phone called a smartphone, and has a case 51 constituting an outer casing.
  • the case 51 is flat and has a rectangular shape that is long in the vertical direction (Y direction).
  • An integrated touch sensor substrate 1 is provided at the center of one main surface, and an operation button 52 is provided at the bottom.
  • the integrated touch sensor substrate 1 has a rectangular shape that is long in the vertical direction (Y direction), and is provided with a frame-shaped frame portion 3 having a predetermined width at the periphery.
  • An inner area defined by the frame portion 3 is a display area 10.
  • a logo mark display part 11 for displaying a logo mark is provided at the lower part of the frame part 3, and a window 14 is provided at the upper part.
  • a camera or proximity sensor (not shown) is provided below the window 14 (inside the case 51).
  • FIG. 2 is a plan view of the integrated touch sensor substrate 1 of the display device 50 shown in FIG. The shape is shown in a simplified manner.
  • the display of each character of this logo mark display part 11 is comprised from the surface of a uniform metal color.
  • FIGS. 3 to 6 for simplification of illustration, two lines of electrode patterns are schematically shown in each of the X direction and the Y direction. An electrode is provided.
  • the integrated touch sensor substrate 1 is a position input device used in combination with a display device such as a liquid crystal panel or an organic EL panel (not shown).
  • the integrated touch sensor substrate 1 has a plurality of electrodes extending in the X direction and a plurality of electrodes extending in the Y direction, and detects a change in capacitance of the electrode in contact with or close to the finger, thereby detecting the contact position of the finger. Specify coordinates.
  • the integrated touch sensor substrate 1 includes a cover glass 2, a frame portion 3, a plurality of jumper wirings 4, an insulating film 5, a metal wiring 6, a plurality of transparent electrodes 7 and 8, and insulation. And a protective film 9.
  • the cover glass 2 is a transparent front plate that is the outermost surface of the integrated touch sensor substrate 1 and is a member that is touched by the user.
  • the cover glass 2 is used as the front plate.
  • a heat-resistant transparent resin material may be used as the front plate.
  • the transparent plate which consists of resin materials may be stuck on the glass surface, and you may form from several layers.
  • the frame part 3 is formed on the back surface of the cover glass 2 using a light-shielding material that absorbs and blocks light.
  • the frame part 3 defines a display area 10 having a predetermined shape in a central window part, and plays a role of hiding wiring provided on the peripheral part of the integrated touch sensor substrate 1.
  • the frame portion 3 is formed in a frame shape so as to partition the display region 10 at the peripheral edge of the cover glass 2.
  • the planar shape of the frame part 3 is not limited to a rectangular ring shape as in the present embodiment, and is arbitrary such as a heart shape, an egg shape, and a round shape.
  • the outer peripheral edge shape (outer shape) and the inner peripheral edge shape (the shape of the display area 10) of the frame part 3 may be similar or dissimilar.
  • the frame part 3 is made of a photo-cured product of a pigment-based resist that absorbs visible light.
  • the pigment-based resist is a resin in which a pigment is dispersed in a resin dissolved in a solvent.
  • the photo-cured product of the pigment-based resist means that the pigment-based resist is subjected to an exposure process by a photolithography method. It is the one cured by.
  • the pigment-based resist is a pseudo black resist containing a mixture of at least two kinds of pigments other than carbon black and titanium oxide.
  • a pigment used in forming a colored transparent layer of a color filter C.I. I. Pigment Red 1, C.I. I. Pigment Red 2cm, C.I. I. Pigment Red 3cm, C.I. I. Pigment Red 4cm, C.I. I. Pigment Red 5cm, C.I. I. Pigment Red 6cm, C.I. I. Pigment Red 7cm, C.I. I. Pigment Red 8cm, C.I. I. Pigment Red 9cm, C.I. I. Pigment red 1 0, C.I. I. I.
  • Pigment Red 11cm C.I. I. Pigment Red 1 2, C.I. I. Red (RED) pigments such as CI Pigment Red 1 to 4; I. Pigment Blue 1 5, C.I. I. Pigment Blue 1 5: 3, C.I. I. Pigment Blue 1 5: 4, C.I. I. Pigment Blue 1 5: 6, C.I. I.
  • a pseudo black color is obtained by mixing at least a blue (BLUE) pigment represented by CI Pigment Blue 60 and the like.
  • a yellow (YELLOW) pigment may be added.
  • Yellow pigments are known to absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shiji (1940, 1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P) 170-173).
  • the yellow pigment absorbs low-wavelength visible light and can be made closer to black.
  • the dielectric constant of the pigment-based resist photocured product is preferably 10 or less, more preferably 5.0 or less. This is to ensure the responsiveness of the capacitively coupled touch panel. Further, when the dielectric constant is 4.0 or less, formation of the electrostatic capacity of the pigment-based resist can be suppressed.
  • the metal wiring 6 and the transparent electrodes 7 and 8 are formed on the frame part 3 of this embodiment, it is necessary to ensure electrical insulation. That is, even if the specific resistance value is 1 ⁇ 10 8 ⁇ ⁇ cm, the specific resistance value of the photo-cured pigment-based resist is preferably 1 ⁇ 10 9 ⁇ ⁇ cm or more, more preferably 1 ⁇ 10 14 ⁇ ⁇ cm. More than cm is preferable. When the specific resistance value of the photo-cured product of the pigment-based resist is less than 1 ⁇ 10 9 ⁇ ⁇ cm, the metal wiring and the transparent electrode wiring formed on the frame, which is the photo-cured product of the pigment-based resist, are short-circuited (short) This is because the integrated touch sensor substrate does not operate normally.
  • the jumper wiring 4 is formed using a conductive material, and is intermittently arranged in a matrix on the cover glass 2 in the display region 10 in the X direction parallel to one side of the display region 10 and in the Y direction perpendicular thereto. Is arranged.
  • the jumper wiring 4 is for connecting the transparent electrodes 7 aligned in the X direction.
  • a plurality of insulating films 5 are provided corresponding to each of the jumper wirings 4.
  • Each of the insulating films 5 is formed so as to cross the corresponding jumper wiring 4 and extend in the X direction, and partially overlaps the central portion of the jumper wiring 4 in the Y direction.
  • the insulating film 5 functions as an interlayer insulating film between the jumper wiring 4 and the transparent electrode 8. The insulating film 5 does not overlap with both ends of the jumper wiring 4 so that the jumper wiring 4 and the transparent electrode 7 can be connected in the Y direction.
  • the metal wiring 6 is directly formed on the frame part 3 and is electrically connected to the transparent electrodes 7 and 8 located at the peripheral part of the display area 10.
  • the metal wiring 6 is made of a Mo / Al / Mo (molybdenum / aluminum / molybdenum) laminate, but may be formed of Au (gold), Ag (silver), an Ag alloy, or the like. good.
  • the constituent material of the metal wiring 6 is not limited to these, and any material that contains metal and has low resistance can be suitably used.
  • the sheet resistance value of the formed metal wiring 6 is preferably 5.0 ⁇ / ⁇ or less, more preferably 1.0 ⁇ / ⁇ or less, and further preferably 0.5 ⁇ / ⁇ or less.
  • the sheet resistance value can be measured by, for example, a four-terminal method.
  • the same constituent material as that of the metal wiring 6 is used as a display film layer described later.
  • the reflectance of the material is preferably 30% or more, more preferably 50% or more, and further preferably 70% or more.
  • Mo / Al / Mo or Mo a reflectance of 30% or more can be realized.
  • Ag—Pd—Cu silver palladium copper
  • Al a high reflectance of 70% or more can be realized.
  • the reflectance can be measured using, for example, a microspectrophotometer.
  • the transparent electrode 7 is for detecting the X coordinate.
  • the transparent electrode 7 is formed on the cover glass 2 in the display region 10 using a material having electrical conductivity and transparency.
  • the transparent electrode 7 is intermittently arranged in a matrix in the X direction and the Y direction, and is electrically connected to the jumper wiring 4 adjacent in the Y direction.
  • the transparent electrode 7 is made of, for example, ITO (Indium Tin Oxide).
  • the transparent electrode 8 is for detecting the Y coordinate.
  • the transparent electrode 8 is formed in the same process as the transparent electrode 7 using the same material as the transparent electrode 7.
  • the transparent electrode 8 extends in the Y direction between the columns of the transparent electrodes 7 aligned in the X direction, and three-dimensionally intersects with the jumper wiring 4 on the insulating film 5 as shown in FIGS.
  • the insulating protective film 9 is formed on almost the entire surface of the cover glass 2 except for the portion corresponding to the lead-out wiring of the metal wiring 6 so as to cover the jumper wiring 4, the metal wiring 6, the transparent electrodes 7 and 8, and the frame portion 3. Has been.
  • the insulating protective film 9 functions as a protective film that protects each component formed on the cover glass 2.
  • the jumper wiring 4, the insulating film 5, the transparent electrodes 7 and 8, and the insulating protective film 9 correspond to the sensor layer.
  • the photo-cured product of the pigment-based resist used in this embodiment has a lower dielectric constant and a higher specific resistance value than the photo-cured product of the black resist material for conventional color filters. Is unnecessary, and the sensor layer and the metal wiring 6 can be formed directly on the frame portion 3. In addition, since the number of steps is reduced because an insulating film that covers the frame portion 3 is not necessary, it is possible to realize cost reduction and yield improvement.
  • the material of the frame portion 3 is subjected to an exposure process by a photolithography method.
  • the frame part 3 is formed by screen printing, the unevenness of the surface of the frame part 3 becomes rough, but when the frame part 3 is formed by photolithography, the surface of the frame part 3 becomes smooth. Therefore, the metal wiring 6 can be directly and stably formed on the frame portion 3.
  • the frame part 3 positioned in the logo mark display part 11 on which the logo mark is displayed is formed with a mark removal part 13 that is cut out in the shape of the logo mark. That is, the mark-extracted portion 13 is a concave portion formed in a letter shape on the frame portion 3, and includes an inner wall obtained by hollowing the frame portion 3 in the shape of a logo mark, and the back surface of the cover glass 2 in the shape of the logo mark. And a bottom.
  • the metal wiring 6 is formed directly on the frame portion 3.
  • the display film layer 12 is formed on the inner surface of the mark removal portion 13.
  • each character of the logo mark on the logo mark display portion 11 of the frame portion 103 is displayed by a uniform surface of the same metal color as the metal wiring 6.
  • the film thickness of the metal wiring 6 and the display film layer 12 is preferably 50 nm or more and 1 ⁇ m or less, and more preferably 100 nm or more and 500 nm or less. When the thickness is 50 nm or more, sufficient conductivity and gloss can be realized, and when the thickness is 1 ⁇ m or less, sufficient conductivity and gloss and thin film thickness can be achieved at the same time.
  • a metal wiring 6 is formed continuously with the display film layer 12, and is connected to an electric circuit of a display device (not shown). In this way, the display film layer 12 may be grounded. This is to prevent the touch panel, the electric circuit of the display device and the like from being troubled by static electricity accumulated in the display film layer 12 made of a metal film, and to take measures against unnecessary radiation of the display device.
  • FIG. 8A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side
  • FIG. 8B is an enlarged cross-sectional view showing a portion B of FIG. 8A. is there.
  • FIG. 9 is a plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment).
  • FIG. 10A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the arrow S—S shown in FIG. 9, and
  • FIG. 10B is an enlarged view showing a portion C in FIG. It is sectional drawing.
  • the integrated touch sensor substrate 1 according to the present embodiment is the same as the first embodiment in that the metal film of the display film layer 12 is formed in the same process using the same metal as the metal wiring 6. There is a difference in that a part of the metal wiring 6 is used as at least a part of the display film layer 12. In other words, in the present embodiment, the metal wiring 6 is arranged in a region for displaying each character of the logo mark display unit 11.
  • each character of the logo mark on the logo mark display unit 11 is not a uniform surface, but is constituted by a display surface on which vertical slits 15 are formed.
  • the mark removal part 13 and the area in the vicinity thereof on the back side of the logo mark display part 11 are covered with the display film layer 12 and the metal wiring 6.
  • a wide display film layer 12 is formed in the center of this region, a metal wiring 6 is formed on both sides thereof, and a narrow display film layer 12 is formed on both sides thereof. It is configured not to short-circuit).
  • the metal film layer in the vicinity of the mark removal portion 13 is separated by the slit 15, and at least a part of the metal film layer can be used as the metal wiring 6.
  • the slits 15 may be formed in the display film layer 12 at equal intervals. By doing so, when the interval between the slits 15 is wide and easily visible, the slits 15 provided between the display film layer 12 and the metal wiring 6 and the equally spaced slits 15 are arranged at equal intervals. Design with stripes can be realized.
  • the slit 15 is 25 ⁇ m or less.
  • the slit 15 is 15 ⁇ m or less and the width of the line-shaped metal film between the adjacent slits 15 is 30 ⁇ m or more, the surface is almost uniform with fine stripes.
  • the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties.
  • the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
  • FIG. 11A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front surface side
  • FIG. 11B is an enlarged cross-sectional view showing a portion D of FIG. is there.
  • FIG. 12 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment).
  • It is a drawing corresponding to 13A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and
  • FIG. 13B is an enlarged view showing an E portion of FIG. 13A. It is sectional drawing.
  • the metal film of the display film layer 12 is formed in the same process using the same metal as the metal wiring 6, and each of the logo mark display unit 11 is formed.
  • the point that the metal wiring 6 is arranged in a part of the area for displaying characters is the same as that of the second embodiment.
  • each character of the logo mark of the logo mark display unit 11 is constituted by a horizontal striped display surface in which horizontal slits 15 are inserted at substantially equal intervals. Different.
  • the inner surface of the mark removal portion 13 on the back surface side of the logo mark display portion 11 and a region in the vicinity thereof are composed of a horizontally elongated display film layer 12 and metal wiring 6. Is done.
  • a slit 15 is provided between the display film layer 12 and the metal wiring 6 so as not to short-circuit each other. These slits 15 form horizontal stripes arranged at approximately equal intervals as shown in FIG.
  • the display film layer 12 and the metal wiring 6 each having a horizontally long and narrow shape are arranged alternately, but the display film layers 12 may be combined into one.
  • the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties.
  • the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
  • the integrated touch sensor substrate 1 according to this embodiment is obtained by changing a part of the configuration described in the third embodiment, and the plan view seen from the front side is as shown in FIGS. Are the same.
  • a plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side is the same as FIG.
  • FIG. 14A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and
  • FIG. 14B is an enlarged view showing a portion F in FIG. It is sectional drawing.
  • the metal wiring 6 is formed directly on the frame portion 3, but the specific resistance value of the material constituting the frame portion 3 is lower than a predetermined value, or the frame portion 3 is formed by screen printing. In cases such as when the surface unevenness is rough, it is difficult to form the metal wiring 6 directly on the frame portion 3. In the present embodiment, it will be described below that the technical idea of the present invention can be implemented even when such metal wiring 6 cannot be directly formed on the frame portion 3.
  • an insulating layer 16 that covers the entire back surface of the cover glass 2 is formed on the frame portion 3.
  • the metal wiring 6 is formed on the insulating layer 16. Can be formed on top.
  • each character of the logo mark of the logo mark display section 11 is formed on a horizontal stripe-shaped display surface as in the third embodiment.
  • this horizontal stripe-shaped display surface is not formed on the inner surface of the mark removal portion 13 as in the third embodiment, but is formed on the insulating layer 16. The display surface is visually recognized through the insulating layer 16.
  • the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties.
  • the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
  • the integrated touch sensor substrate 1 according to this embodiment is obtained by changing a part of the configuration described in the second embodiment, and the plan view seen from the front side is as shown in FIGS. Are the same.
  • FIG. 15 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side.
  • 16 (a) and 16 (b) are cross-sectional views of the integrated touch sensor substrate 1 in the directions of the arrows UU and VV shown in FIG. 15, respectively.
  • the frame layer 3 is formed of a carbon black resist. Therefore, the frame part 3 is insulated by forming the insulating layer 16 so as to cover the frame part 3.
  • the fourth embodiment is different from the fourth embodiment in that the insulating layer 16 is not formed inside the region where the frame portion 3 of the cover glass 2 is formed.
  • the insulating layer 16 is formed in the same process as the formation of the insulating film 5 using the same material as the insulating film 5. Thereby, the amount of material for the insulating layer 16 can be reduced and the number of processes can be reduced.
  • the integrated touch sensor substrate 1 after the metal wiring 6 and the display film layer 12 are formed, at least slits in the metal wiring 6 and the display film layer 12 are formed.
  • An opaque layer 17 is formed on the back side of the region where 15 is formed. Since the opaque layer 17 absorbs or scatters the light incident on the slit 15, the reflection of the light by the slit 15 becomes less conspicuous and the design of the logo mark can be improved.
  • the opaque layer 17 may be formed by appropriately selecting a suitable color from black or other colors in order to make the slit 15 less noticeable using a pigment or the like.
  • the opaque layer 17 can be formed by a conventionally known printing method such as a photolithography method, and can also be formed by an inkjet method, a dispenser method, or the like.
  • the opaque layer 17 is formed directly on the display film layer 12, the opaque layer 17 may be formed on the insulating protective film 9.
  • the opaque layer 17 only needs to cover the slit 15, and may be provided in the entire logo mark area as shown in FIG. 16, or may be provided only in the slit area and its vicinity, or may be provided only in the slit area. Good.
  • the opaque layer 17 may be formed on the metal wiring 6 and the display film layer 12 so as to cover the slit 15.
  • the frame layer 3 may be formed of a carbon black resist, and the insulating layer 16 may be formed so as to cover the frame portion 3 for insulation.
  • Example 1 In this example, a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the second embodiment will be described in detail.
  • 17 to 22 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment. 17 to 22, (a) is a cross-sectional view and (b) is a plan view. In addition, a two-dot chain line shown in (b) of FIGS. 17 to 22 represents a cutting position in the sectional view of (a).
  • frame part 3 Formation of frame part 3> First, a pigment-based resist, which will be described later, was applied on the back surface of the cover glass 2 by spin coating. Next, after removing the solvent content with a vacuum dryer, exposure was performed by a proximity exposure system (ultra-high pressure mercury lamp). Here, as the photomask for exposure, a soda glass patterned with Cr (chromium) was used. Next, development was performed with an alkaline developer, and heat treatment was performed to form a frame portion 3 having a mark removal portion 13 in the shape of a predetermined logo mark shown in FIG.
  • a proximity exposure system ultra-high pressure mercury lamp
  • etching is performed using an etching solution mainly composed of oxalic acid ((COOH) 2 ), and the positive resist is exposed on the entire surface, and then the positive resist is stripped with an alkaline stripping solution, as shown in FIG. A jumper wiring 4 made of an ITO film was formed.
  • etching solution mainly composed of oxalic acid ((COOH) 2 )
  • Formation of insulating film 5> First, an acrylic insulating material was applied on the formed product shown in FIG. 18 by spin coating. Next, pre-baking was performed to remove the solvent, and exposure was performed by a proximity exposure system (super high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used. Next, it developed with the alkaline developing solution and heat-processed. In this way, as shown in FIG. 19, the insulating film 5 on the jumper wiring 4 was formed.
  • a proximity exposure system super high pressure mercury lamp
  • Formation of metal wiring 6 and display film layer 12> First, a Mo layer, an Al layer, and a Mo layer are sequentially formed in a vacuum by a DC magnetron sputtering method on the formation shown in FIG. Formed. Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
  • a proximity exposure system ultra-high pressure mercury lamp
  • etching was performed with a phosphoric acid / nitric acid / acetic acid three-component etchant (etching solution), and the positive resist was exposed on the entire surface, and then the positive resist was stripped with an alkaline stripping solution.
  • etching solution a phosphoric acid / nitric acid / acetic acid three-component etchant
  • the positive resist was exposed on the entire surface, and then the positive resist was stripped with an alkaline stripping solution.
  • the metal wiring 6 and the display film layer 12 were formed on the frame part 3.
  • the inner surface of the mark removal portion 13 is covered with the film of the Mo / Al / Mo laminate formed by the display film layer 12 and the metal wiring 6 on both sides thereof.
  • the thicknesses of the Mo / Al / Mo laminated bodies constituting the display film layer 12 and the metal wiring 6 are set to 50 nm, 200 nm, and 50 nm, respectively, and the sheet resistance values of the display film layer 12 and the metal wiring 6 are set. 0.2 ⁇ / ⁇ and the reflectance was 40%. The width of the slit 15 was 15 ⁇ m.
  • transparent electrodes 7 and 8 Formation of transparent electrodes 7 and 8> First, an ITO film was formed on the formed material shown in FIG. 20 by heat sputtering, in which sputtering was performed by a DC magnetron sputtering method. Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure. And it etched using the etching liquid which has oxalic acid as a main component, and exposed the positive resist to the whole surface, Then, the positive resist was peeled with the alkaline peeling liquid. Thus, as shown in FIG. 21, the transparent electrodes 7 and 8 were formed with the ITO film.
  • a proximity exposure system ultra-high pressure mercury lamp
  • insulating protective film 9 Formation of insulating protective film 9> First, an acrylic overcoat material was applied on the formed product shown in FIG. 21 by spin coating. Next, pre-baking was performed to remove the solvent, and exposure was performed using a proximity exposure system (ultra-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used. Next, it developed with the alkaline developing solution and heat-processed. In this way, as shown in FIG. 22, the insulating protective film 9 was formed, and the integrated touch sensor substrate 1 was manufactured and completed.
  • a proximity exposure system ultra-high pressure mercury lamp
  • the pigment-based resist used in the above examples is a pseudo black resist in which two types of pigments are dispersed in a resin dissolved in a solvent to realize pseudo black.
  • pigment red (PR254) and pigment blue (PB15: 3) mixed at a ratio of 1: 1 were used as the two types of pigments.
  • the pigment ratio in the solid is 40 percent.
  • the frame portion 3 was formed to a thickness of 3 ⁇ m using this material.
  • the specific resistance value of the frame portion 3 formed in this way was 1 ⁇ 10 14 ⁇ ⁇ cm or more, and the dielectric constant was 4.0 or less.
  • the slit 15 was not visually recognized, and the metal wiring 6 and the display film layer 12 exhibited a sufficient metallic luster.
  • Example 2 In this example, the display film layer 12 and the metal wiring 6 in Example 1 are made of Ag—Pd—Cu alloy to a thickness of 200 nm, the width of the slit 15 is set to 25 ⁇ m, and the sheet resistance value is set to 0.1 ⁇ / ⁇ . The reflectance is 95%. Thereby, compared with Example 1, the electroconductivity and metal luster of the metal wiring 6 and the display film layer 12 were improved more. Moreover, the slit 15 was not visually recognized also in the logo mark display part 11 of the integrated touch sensor board
  • Example 3 the manufacturing method of the integrated touch sensor substrate 1 in which the frame layer 3 is formed of carbon black resist and the insulating layer 16 is formed so as to cover the frame portion 3 in the first embodiment described above will be described in detail. To do.
  • 23 to 26 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment.
  • 23 to 26 (a) is a cross-sectional view, and (b) is a plan view.
  • a two-dot chain line shown in (b) of FIGS. 23 to 26 represents a cutting position in the sectional view of (a).
  • the drawings referred to in the first embodiment are also referred to in this embodiment as appropriate.
  • a frame portion 3 having a thickness of 1.2 ⁇ m was formed on the back surface of the cover glass 2 at the same position as in FIG. 17 using a carbon black resist.
  • a jumper wiring 4 was formed in the same manner as in Example 1 as shown in FIG.
  • the insulating film 5 on the jumper wiring 4 is formed in the same manner as in the first embodiment, and at the same time, the insulating layer 16 is formed by the same material and method as the insulating film 5 is formed. The formation shown in FIG. 23 was obtained.
  • transparent electrodes 7 and 8 were formed of ITO films by the same method as in Example 1 as shown in FIG.
  • insulating protective film 9 Formation of insulating protective film 9> As shown in FIG. 26, the insulating protective film 9 was formed on the formed product shown in FIG. 25 as shown in FIG. 26, and the integrated touch sensor substrate 1 was manufactured and completed.
  • the display film layer 12 exhibited a sufficient metallic luster as in Example 1.
  • Example 4 a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the fifth embodiment will be described in detail.
  • 27 to 29 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment.
  • 27 to 29 (a) is a cross-sectional view, and (b) is a plan view.
  • a two-dot chain line shown in (b) of FIGS. 27 to 29 represents a cutting position in the sectional view of (a).
  • the formation of the frame portion 3, the formation of the jumper wiring 4, the formation of the insulating film 5 and the insulating layer 16, and the formation of the transparent electrodes 7 and 8 are as described in 1. ⁇ 3. And 5. Since it is the same as that of FIG. Since the formation of the metal wiring 6 and the display film layer 12 is the same as that of the second embodiment, the description thereof is omitted. However, the second embodiment differs from the second embodiment in that the width of the slit 15 is 30 ⁇ m.
  • FIG. 27 shows the formed product up to the formation of the transparent electrodes 7 and 8.
  • the opaque layer 17 was formed by an ink jet method so as to cover the slit 15 with the same material as that of the frame portion 3, and the formed product shown in FIG. 28 was obtained.
  • the insulating protective film 9 was formed on the formed product shown in FIG. 28 by the same method as in Example 1, and the integrated touch sensor substrate 1 shown in FIG. 29 was manufactured and completed.
  • the width of the slit 15 is larger than that of the third embodiment, but the slit 15 can be made inconspicuous because the slit 15 is covered from the opposite side of the cover glass 2 by the opaque layer 17.
  • the opaque layer 17 may be formed after the metal wiring 6 and the display film layer 12 are formed and before the transparent electrodes 7 and 8 are formed.
  • the opaque layer 17 may be formed on the insulating protective film 9 after the insulating protective film 9 is formed.
  • the integrated touch sensor substrate of the present invention is not limited to the above-described embodiments and examples, and various modifications are possible.
  • the mobile phone is used as the display device, but the present invention is not limited to this.
  • the present invention can also be applied to a display device in which a logo mark is displayed on the periphery, such as a portable information terminal, a car navigation system, a computer display, a liquid crystal television such as a tablet television and a stationary television, and an electronic blackboard. That is, the size of the integrated touch sensor substrate is not particularly limited.
  • the size of the logo mark, the metal wiring constituting the logo mark, and the size of the display film are not particularly limited as long as they are within the frame portion. Further, the number of characters of the logo mark is not limited. Further, the frame portion is not limited to black, and can be formed by appropriately selecting a material of a suitable color such as white, red, blue, or yellow according to the design of the display device, for example.
  • the projected capacitive touch panel has been described as an integrated touch sensor substrate.
  • the capacitive touch panel is not limited to the capacitive touch panel, and various types of touch panels having a frame portion may be used. Can be applied.
  • the present invention can be used as a position input device for an electronic device such as a mobile phone or a portable information terminal.

Abstract

The present invention provides an integrated touch sensor substrate, a display device provided with the same, and a method for producing an integrated touch sensor substrate. It is possible to display a logo mark in a metallic color in the frame section of a front-surface plate of a touch panel sensor, and to maintain a thin thickness thereof by using a simple configuration. An integrated touch sensor substrate used in a display device having a touch panel, wherein the metal wiring provided in the frame section and the display membrane for displaying the logo mark are formed from the same metal during the same step. In addition, metal wiring is also positioned in the region for displaying the logo mark, and the wiring is positioned by effectively using the limited space in the frame section.

Description

一体型タッチセンサー基板、これを備える表示装置、および一体型タッチセンサー基板の製造方法Integrated touch sensor substrate, display device including the same, and method for manufacturing the integrated touch sensor substrate
　本発明はタッチパネル付き表示装置に用いられる一体型タッチセンサー基板に関し、より詳細には周縁部にロゴマークが表示された一体型タッチセンサー基板に関する。 The present invention relates to an integrated touch sensor substrate used for a display device with a touch panel, and more particularly to an integrated touch sensor substrate in which a logo mark is displayed on a peripheral portion.
　近年、携帯電話や、携帯情報端末、カーナビゲーションシステムを始め、さまざまな電子機器の操作部にタッチパネルが採用されている。タッチパネルは、液晶パネルや有機ＥＬ（Ｅｌｅｃｔｒｏ-Ｌｕｍｉｎｅｓｅｎｃｅ）などの表示デバイスの表示画面上に、指などの接触位置を検出可能な位置入力装置を貼り合わせて構成される。タッチパネルの方式としては、抵抗膜式、静電容量式、光学式、超音波式に大別されるが、それぞれメリット／デメリットがあるため用途に応じて使い分けられている。静電容量式には、更に、表面型と投影型とがある。投影型静電容量式タッチパネルは、Ｘ方向及びＹ方向にグリッド上に配列された複数の電極を備え、マルチタッチが可能であり、現在急速に普及しつつある。 In recent years, touch panels have been adopted for operation units of various electronic devices such as mobile phones, personal digital assistants, car navigation systems. The touch panel is configured by bonding a position input device capable of detecting a contact position such as a finger on a display screen of a display device such as a liquid crystal panel or an organic EL (Electro-Luminescence). The touch panel system is roughly classified into a resistance film type, a capacitance type, an optical type, and an ultrasonic type, and each has a merit / demerit, and is used properly according to the application. The capacitance type further includes a surface type and a projection type. A projected capacitive touch panel includes a plurality of electrodes arranged on a grid in the X direction and the Y direction, is capable of multi-touch, and is currently spreading rapidly.
　投影型静電容量式タッチパネルセンサー基板は、一般的に５層構造、すなわち、金属配線、Ｘ方向用及びＹ方向用の２層の透明電極、２層の透明電極間の層間絶縁層、表面の保護層からなる。また、層間絶縁層を有機膜で形成することによってガラス基板の片面に２層の透明電極層を形成した片面構造と、ガラス基板を層間絶縁層としても使用し、２層の透明電極層をガラスの両面に分けて形成した両面構造の２つに大別される。（例えば、特許文献１参照） The projected capacitive touch panel sensor substrate generally has a five-layer structure, that is, metal wiring, two transparent electrodes for X and Y directions, an interlayer insulating layer between two transparent electrodes, It consists of a protective layer. In addition, a single-sided structure in which two transparent electrode layers are formed on one side of a glass substrate by forming an interlayer insulating layer with an organic film, and the glass substrate is also used as an interlayer insulating layer, and the two transparent electrode layers are made of glass. It is roughly divided into two types of double-sided structures formed separately on both sides. (For example, see Patent Document 1)
　ここで、携帯電話機などのタッチパネル付きディスプレイには、最表面には前面板（カバーガラス）を設けた構造を採用することが一般的である。このカバーガラスには周辺部の配線などを隠すための遮光性の高い材料からなる額縁部が形成される。この額縁部には、機器のデザインに応じて様々な色や模様を施すことができる。額縁部に色や模様を施す場合、スクリーン印刷で額縁部を形成することが一般的である。ただし、額縁部に色々な色や模様を施すとコストアップに繋がるため、額縁部は黒色とするのが主流である。 Here, it is common for a display with a touch panel such as a cellular phone to adopt a structure in which a front plate (cover glass) is provided on the outermost surface. The cover glass is formed with a frame portion made of a highly light-shielding material for concealing peripheral wiring and the like. Various colors and patterns can be applied to the frame portion according to the design of the device. When applying a color or a pattern to a frame part, it is common to form a frame part by screen printing. However, it is mainstream that the frame portion is black because various colors and patterns are applied to the frame portion to increase the cost.
　また、この黒色の額縁部を形成するときに使用するインキやレジストとしては、一般的には、遮光性の高い顔料であるカーボンやチタンを分散させた材料が使用される。カーボンやチタンを分散させた材料は比抵抗値が低く、誘電率も高い。また、カーボンを樹脂で被覆させることで、比抵抗値が１×１０１１Ω・ｃｍまで高抵抗化した材料も採用されている。 Further, as the ink or resist used when forming the black frame portion, a material in which carbon or titanium, which is a pigment having a high light shielding property, is dispersed is generally used. A material in which carbon or titanium is dispersed has a low specific resistance and a high dielectric constant. In addition, a material whose resistivity is increased to 1 × 10 11 Ω · cm by coating carbon with resin is also used.
　ここで、このようなタッチパネル付きディスプレイでは、画面の周辺の部分に、ハウスマークやファミリーネーム、ペットネームと呼ばれる会社名や商品名、図案などをロゴマークとして表示することが多い。このようなロゴマークは、カバーガラスの裏面に印刷によって形成される。 Here, in such a display with a touch panel, a company name, a product name, or a design called a house mark, family name, or pet name is often displayed as a logo mark on the periphery of the screen. Such a logo mark is formed on the back surface of the cover glass by printing.
　ロゴマークは、金属色（メタリック）や白色、あるいは所定の色によって表示される。ロゴマークの所定の形に抜いた形のマーク抜き部を所定の位置に備える額縁部を例えば黒色で前面板の裏面に形成し、次に、マーク抜き部の裏面側からスクリーン印刷等で所定の色で重ね塗りすることにより、この表示を形成する。（例えば、特許文献２参照） The logo mark is displayed in metallic color (metallic), white, or a predetermined color. A frame part having a mark extraction part in a predetermined shape of the logo mark provided at a predetermined position is formed on the back surface of the front plate in black, for example, and then a predetermined part is formed by screen printing or the like from the back side of the mark extraction part. This display is formed by overcoating with colors. (For example, see Patent Document 2)
　図３０に、従来の携帯電話などに使われるタッチパネル付きディスプレイのカバーガラスの一例を示す。図３０（ａ）、（ｂ）に示すように、カバーガラス１０２上には矩形枠状の額縁部１０３が形成され、額縁部１０３の内側が表示領域１１０となっている。額縁部１０３は遮光性材料により形成され、マーク抜き部１１３とカメラ用等の窓１１４を備えている。そして、マーク抜き部１１３に裏面側から所定の色のインクなどによる表示膜層１１２を塗り、ロゴマーク表示部１１１を形成していた。 FIG. 30 shows an example of a cover glass of a display with a touch panel used for a conventional mobile phone or the like. As shown in FIGS. 30A and 30B, a frame portion 103 having a rectangular frame shape is formed on the cover glass 102, and the inside of the frame portion 103 is a display region 110. The frame portion 103 is formed of a light-shielding material and includes a mark removal portion 113 and a window 114 for a camera or the like. Then, a display film layer 112 made of ink of a predetermined color or the like is applied to the mark removal portion 113 from the back side to form a logo mark display portion 111.
特開２０１０-１８２２７７号公報JP 2010-182277 A 特開２０１０-２５６６８２号公報JP 2010-256682 A
　しかしながら、図３０のようにしてロゴマーク表示部１１１を形成した場合には、額縁部１０３に表示膜部１１２を形成するためインク等を重ね塗りする必要があるので、工程数及び製造コストが増加してしまうという不都合があった。 However, when the logo mark display unit 111 is formed as shown in FIG. 30, it is necessary to apply ink or the like to form the display film unit 112 on the frame unit 103, which increases the number of processes and the manufacturing cost. There was an inconvenience of doing so.
　また、図３０（ａ）に示すように、表示膜部１１２が形成されると額縁部１０３の表面に対して段差１１２ａが生じる。この段差１１２ａにより、前面板が厚くなってしまうという不都合があった。 Further, as shown in FIG. 30A, when the display film portion 112 is formed, a step 112 a is generated with respect to the surface of the frame portion 103. The step 112a has a disadvantage that the front plate becomes thick.
　本発明の目的は、上記の不都合を解決するために、以下の構成を採用した。 The object of the present invention employs the following configuration in order to solve the above inconvenience.
　本発明は、前面板とタッチパネルセンサーとの一体型タッチセンサー基板に関する。そして、透明な前面板と、前面板の裏面の周縁部に形成され所定の形状の表示領域を区画する額縁層と、額縁層の所定の位置を所定の形状で抜いて形成されたマーク抜き部と、額縁層の裏面側に形成された金属配線と、マーク抜き部の裏面側に形成された金属膜層と、表示領域に形成され、金属配線と結線されるセンサー層とを備え、金属配線と金属膜層とが同一の金属で形成されていることを特徴とする。 The present invention relates to an integrated touch sensor substrate including a front plate and a touch panel sensor. And a transparent front plate, a frame layer that is formed on the peripheral portion of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal portion that is formed by extracting a predetermined position of the frame layer in a predetermined shape A metal wiring formed on the back side of the frame layer, a metal film layer formed on the back side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wiring. And the metal film layer are formed of the same metal.
　また、金属配線の一部は、金属膜層の一部が、スリットにより分離されることにより、形成されることを特徴とする。 Further, a part of the metal wiring is characterized in that a part of the metal film layer is formed by being separated by a slit.
　また、スリットの間隔は２５μｍ以下であることを特徴とする。 Further, the slit interval is 25 μm or less.
　また、金属膜層の裏面に、スリットを覆う不透明層が形成されることを特徴とする。 Also, an opaque layer covering the slit is formed on the back surface of the metal film layer.
　また、金属膜層の反射率が３０％以上であることを特徴とする。 Further, the metal film layer has a reflectance of 30% or more.
　また、表示装置であって、複数の画素が行列状に配列された画素領域を有し、入力信号に基づいて画素領域に画像を表示する表示パネルと、画素領域を覆うように取り付けられる一体型タッチセンサー基板とを備えることを特徴とする。 In addition, the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region And a touch sensor substrate.
　また、透明な前面板と、前面板の裏面の周縁部に形成され、所定の形状の表示領域を区画する額縁層と、額縁層の所定の位置を所定の形状で抜いて形成されたマーク抜き部と、額縁層の裏面側に形成された金属配線と、マーク抜き部の裏面側に形成された金属膜層と、表示領域に形成され、金属配線と結線されるセンサー層とを備える前面板とタッチパネルセンサーとの一体型タッチセンサー基板の製造方法であって、前面板の裏面にマーク抜き部を備える額縁層を形成する工程と、金属配線を形成する工程と、金属膜層を形成する工程と、センサー層を形成する工程とを備え、金属配線を形成する工程と金属膜層を形成する工程とを、同一の金属材料を用いて同一工程で行うことを特徴とする。 Also, a transparent front plate, a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape And a metal plate formed on the back surface side of the frame layer, a metal film layer formed on the back surface side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wire. And touch panel sensor integrated touch sensor substrate manufacturing method, a step of forming a frame layer having a mark removal portion on the back surface of the front plate, a step of forming metal wiring, and a step of forming a metal film layer And a step of forming the sensor layer, wherein the step of forming the metal wiring and the step of forming the metal film layer are performed in the same step using the same metal material.
　また、金属膜層を形成する工程において、金属膜層にスリットを設けて分離して形成することにより、当該金属膜層の少なくとも一部を金属配線の一部として形成することを特徴とする。 Further, in the step of forming the metal film layer, at least a part of the metal film layer is formed as a part of the metal wiring by providing the metal film layer with a slit and separating it.
　また、金属膜層を形成する工程において、上記スリットの間隔を２５μｍ以下とすることを特徴とする。 Further, in the step of forming the metal film layer, the interval between the slits is 25 μm or less.
　また、金属膜層を形成する工程より後に、金属膜層のスリットを覆う不透明層を形成する工程をさらに含むことを特徴とする。 In addition, the method further includes a step of forming an opaque layer that covers the slit of the metal film layer after the step of forming the metal film layer.
　また、金属膜層を形成する工程において、金属膜層の材料として、反射率が３０％以上である材料を用いることを特徴とする。 Further, in the step of forming the metal film layer, a material having a reflectance of 30% or more is used as the material of the metal film layer.
　本発明によれば、上述の特徴を有することから、以下の効果が得られる。 According to the present invention, the following effects can be obtained due to the above-mentioned features.
　すなわち、前面板とタッチパネルセンサーとの一体型タッチセンサー基板であって、透明な前面板と、前面板の裏面の周縁部に形成され所定の形状の表示領域を区画する額縁層と、額縁層の所定の位置を所定の形状で抜いて形成されたマーク抜き部と、額縁層の裏面側に形成された金属配線と、マーク抜き部の裏面側に形成された金属膜層と、表示領域に形成され、金属配線と結線されるセンサー層とを備え、金属配線と金属膜層とが同一の金属で形成されているので、別のインクでスクリーン印刷する場合と比較して、構成が簡単になり、薄い厚さで形成できる。また、金属色（メタリック）で意匠性に優れたロゴマーク表示をすることができる。 That is, an integrated touch sensor substrate of a front plate and a touch panel sensor, a transparent front plate, a frame layer that is formed on a peripheral portion of the back surface of the front plate and defines a display area of a predetermined shape, and a frame layer Formed in a display area, a mark-out part formed by extracting a predetermined position in a predetermined shape, a metal wiring formed on the back side of the frame layer, a metal film layer formed on the back side of the mark-out part The sensor layer is connected to the metal wiring, and the metal wiring and the metal film layer are made of the same metal, so the configuration is simple compared to screen printing with different ink. It can be formed with a thin thickness. Moreover, the logo mark display excellent in the design property with a metallic color (metallic) can be performed.
　また、金属配線の一部は、金属膜層の一部が、スリットにより分離されることにより、形成されるので、額縁部の限られた領域を有効に利用して金属配線を配置できる。 Further, since a part of the metal wiring is formed by separating a part of the metal film layer by the slit, the metal wiring can be arranged by effectively using a limited area of the frame portion.
　また、スリットの間隔は２５μｍ以下であるので、スリットが目立たず、ロゴマークの意匠性を損なうことがない。 Also, since the slit spacing is 25 μm or less, the slits are not conspicuous and the design of the logo mark is not impaired.
　また、金属膜層の裏面に、スリットを覆う不透明層が形成されるため、スリットにおける光の反射を抑制し、スリットをさらに目立たなくすることができる。 Also, since an opaque layer covering the slit is formed on the back surface of the metal film layer, reflection of light in the slit can be suppressed and the slit can be made less noticeable.
　また、金属膜層の反射率が３０％以上であるので、光沢性に優れたロゴマークを形成することができる。 Also, since the reflectance of the metal film layer is 30% or more, a logo mark with excellent gloss can be formed.
　また、表示装置であって、複数の画素が行列状に配列された画素領域を有し、入力信号に基づいて画素領域に画像を表示する表示パネルと、画素領域を覆うように取り付けられる一体型タッチセンサー基板とを備えるので、別のインクでスクリーン印刷する場合と比較して、構成が簡単になり、薄い厚さで形成できる。また、金属色（メタリック）で意匠性に優れたロゴマーク表示をすることができる。 In addition, the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region Since the touch sensor substrate is provided, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink. Moreover, the logo mark display excellent in the design property with a metallic color (metallic) can be performed.
　また、透明な前面板と、前面板の裏面の周縁部に形成され、所定の形状の表示領域を区画する額縁層と、額縁層の所定の位置を所定の形状で抜いて形成されたマーク抜き部と、額縁層の裏面側に形成された金属配線と、マーク抜き部の裏面側に形成された金属膜層と、表示領域に形成され、金属配線と結線されるセンサー層とを備える前面板とタッチパネルセンサーとの一体型タッチセンサー基板の製造方法であって、前面板の裏面にマーク抜き部を備える額縁層を形成する工程と、金属配線を形成する工程と、金属膜層を形成する工程と、センサー層を形成する工程とを備え、金属配線を形成する工程と金属膜層を形成する工程とを、同一の金属材料を用いて同一工程で行うので、別のインクでスクリーン印刷する工程が不要となり、工程数及び製造コストを減少することができる。また、別のインクでスクリーン印刷する場合と比較して、構成が簡単になり、薄い厚さで形成することができる。 Also, a transparent front plate, a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape And a metal plate formed on the back surface side of the frame layer, a metal film layer formed on the back surface side of the mark removal portion, and a sensor layer formed in the display area and connected to the metal wire. And touch panel sensor integrated touch sensor substrate manufacturing method, a step of forming a frame layer having a mark removal portion on the back surface of the front plate, a step of forming metal wiring, and a step of forming a metal film layer And a step of forming a sensor layer, and the step of forming the metal wiring and the step of forming the metal film layer are performed in the same step using the same metal material. Is no longer necessary The number and can reduce the manufacturing cost. In addition, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink.
　そして、金属膜層を形成する工程において、金属膜層にスリットを設けて分離して形成することにより、金属膜層の少なくとも一部を金属配線の一部として形成することにより、額縁部の限られた領域を有効に利用して金属配線を配置できる。 In the step of forming the metal film layer, the metal film layer is formed by providing slits and separated, thereby forming at least a part of the metal film layer as a part of the metal wiring, thereby limiting the frame portion. The metal wiring can be arranged by effectively using the designated area.
　また、金属膜層を形成する工程において、上記スリットの間隔を２５μｍ以下とすることにより、スリットが目立たず、ロゴマークの意匠性を損なうことがない。 Further, in the step of forming the metal film layer, by setting the interval between the slits to 25 μm or less, the slits are not conspicuous and the design of the logo mark is not impaired.
　また、金属膜層を形成する工程より後に、金属膜層のスリットを覆う不透明層を形成する工程をさらに含むことにより、スリットにおける光の反射を抑制し、スリットをさらに目立たなくすることができる。 Further, by further including a step of forming an opaque layer that covers the slit of the metal film layer after the step of forming the metal film layer, reflection of light in the slit can be suppressed and the slit can be made less noticeable.
　また、金属膜層を形成する工程において、金属膜層の材料として、反射率が３０％以上である材料を用いることにより、光沢性に優れたロゴマークを形成することができる。 Also, in the step of forming the metal film layer, a logo having excellent gloss can be formed by using a material having a reflectance of 30% or more as the material of the metal film layer.
図１は、本発明の第１の実施形態に係る一体型タッチセンサー基板を備える表示装置の一例を示す斜視図である。FIG. 1 is a perspective view showing an example of a display device including an integrated touch sensor substrate according to the first embodiment of the present invention. 図２は、第１の実施形態に係る一体型タッチセンサー基板を示す表面側から見た概略平面図である。FIG. 2 is a schematic plan view of the integrated touch sensor substrate according to the first embodiment viewed from the front side. 図３は、第１の実施形態に係る一体型タッチセンサー基板を示す裏面側から見た概略平面図である。FIG. 3 is a schematic plan view of the integrated touch sensor substrate according to the first embodiment viewed from the back side. 図４は、第１の実施形態に係る一体型タッチセンサー基板の要部構造を示す概略平面図である。FIG. 4 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the first embodiment. 図５は、第１の実施形態に係る一体型タッチセンサー基板の構造を示す概略断面図である。FIG. 5 is a schematic cross-sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment. 図６は、第１の実施形態に係る一体型タッチセンサー基板の構造を示す概略断面図である。FIG. 6 is a schematic cross-sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment. 図７は、第１の実施形態に係る一体型タッチセンサー基板の要部の構造を示す概略断面図である。FIG. 7 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the first embodiment. 図８は、第２の実施形態に係る一体型タッチセンサー基板を示す表面側から見た概略平面図である。FIG. 8 is a schematic plan view seen from the front surface side showing the integrated touch sensor substrate according to the second embodiment. 図９は、第２の実施形態に係る一体型タッチセンサー基板の要部構造を示す概略平面図である。FIG. 9 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the second embodiment. 図１０は、第２の実施形態に係る一体型タッチセンサー基板の要部の構造を示す概略断面図である。FIG. 10 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the second embodiment. 図１１は、第３の実施形態に係る一体型タッチセンサー基板を示す表面側から見た概略平面図である。FIG. 11 is a schematic plan view of the integrated touch sensor substrate according to the third embodiment viewed from the front side. 図１２は、第３の実施形態に係る一体型タッチセンサー基板の要部構造を示す概略平面図である。FIG. 12 is a schematic plan view showing a main part structure of the integrated touch sensor substrate according to the third embodiment. 図１３は、第３の実施形態に係る一体型タッチセンサー基板の要部の構造を示す概略断面図である。FIG. 13 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the third embodiment. 図１４は、第４の実施形態に係る一体型タッチセンサー基板の要部の構造を示す概略断面図である。FIG. 14 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fourth embodiment. 図１５は、第５の実施形態に係る一体型タッチセンサー基板の要部構造を示す概略平面図である。FIG. 15 is a schematic plan view showing the main structure of the integrated touch sensor substrate according to the fifth embodiment. 図１６は、第５の実施形態に係る一体型タッチセンサー基板の要部の構造を示す概略断面図である。FIG. 16 is a schematic cross-sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fifth embodiment. 図１７は、本発明の実施例１に係る一体型タッチセンサー基板を示す概略図である。FIG. 17 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention. 図１８は、本発明の実施例１に係る一体型タッチセンサー基板を示す概略図である。FIG. 18 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the invention. 図１９は、本発明の実施例１に係る一体型タッチセンサー基板を示す概略図である。FIG. 19 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the invention. 図２０は、本発明の実施例１に係る一体型タッチセンサー基板を示す概略図である。FIG. 20 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention. 図２１は、本発明の実施例１に係る一体型タッチセンサー基板を示す概略図である。FIG. 21 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention. 図２２は、本発明の実施例１に係る一体型タッチセンサー基板を示す概略図である。FIG. 22 is a schematic diagram illustrating an integrated touch sensor substrate according to the first embodiment of the present invention. 図２３は、本発明の実施例３に係る一体型タッチセンサー基板を示す概略図である。FIG. 23 is a schematic diagram illustrating an integrated touch sensor substrate according to a third embodiment of the present invention. 図２４は、本発明の実施例３に係る一体型タッチセンサー基板を示す概略図である。FIG. 24 is a schematic view showing an integrated touch sensor substrate according to Embodiment 3 of the present invention. 図２５は、本発明の実施例３に係る一体型タッチセンサー基板を示す概略図である。FIG. 25 is a schematic diagram illustrating an integrated touch sensor substrate according to a third embodiment of the present invention. 図２６は、本発明の実施例３に係る一体型タッチセンサー基板を示す概略図である。FIG. 26 is a schematic view showing an integrated touch sensor substrate according to Embodiment 3 of the present invention. 図２７は、本発明の実施例４に係る一体型タッチセンサー基板を示す概略図である。FIG. 27 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention. 図２８は、本発明の実施例４に係る一体型タッチセンサー基板を示す概略図である。FIG. 28 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention. 図２９は、本発明の実施例４に係る一体型タッチセンサー基板を示す概略図である。FIG. 29 is a schematic view showing an integrated touch sensor substrate according to Embodiment 4 of the present invention. 図３０は、従来の一体型タッチセンサー基板の前面板の構造を示す概略図である。FIG. 30 is a schematic view showing a structure of a front plate of a conventional integrated touch sensor substrate.
　以下、図面を参照して、本発明の実施形態について、詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
　（第１の実施形態）
　図１乃至図７を参照して、本発明の第１の実施形態に係る一体型タッチセンサー基板について説明する。本実施形態に係る一体型タッチセンサー基板は、カバーガラスとタッチパネルセンサーとが一体に直接形成されている。また、金属配線を額縁部に設ける構成となっている。以後、指などが接触される面を表面、その反対面を裏面と呼ぶこととする。 (First embodiment)
An integrated touch sensor substrate according to a first embodiment of the present invention will be described with reference to FIGS. In the integrated touch sensor substrate according to the present embodiment, the cover glass and the touch panel sensor are directly formed integrally. Moreover, it has the structure which provides a metal wiring in a frame part. Hereinafter, the surface with which a finger or the like is brought into contact will be referred to as the front surface, and the opposite surface as the back surface.
　図１は、本実施形態に係る一体型タッチセンサー基板１を備える表示装置の一例である携帯電話を示す斜視図である。図２は、本実施形態に係る一体型タッチセンサー基板１を表面側から見た平面図である。図３は、この一体型タッチセンサー基板１を裏面側から見た平面図である。図４は、図３に示した一体型タッチセンサー基板１の積層構造の詳細を示す平面図であって、図３の絶縁保護膜９の形成前の状態を示す。図５は、図３に示したＰ－Ｐ線矢視方向の断面図、図６は、図３に示したＱ－Ｑ線矢視方向の断面図、図７（ａ）は、図３に示したＲ－Ｒ線矢視方向の断面図であり、図７（ｂ）は、図７（ａ）のＡ部を示す拡大断面図である。 FIG. 1 is a perspective view showing a mobile phone as an example of a display device including an integrated touch sensor substrate 1 according to the present embodiment. FIG. 2 is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side. FIG. 3 is a plan view of the integrated touch sensor substrate 1 as viewed from the back side. 4 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 shown in FIG. 3, and shows a state before the insulating protective film 9 shown in FIG. 3 is formed. 5 is a cross-sectional view in the direction of arrows PP shown in FIG. 3, FIG. 6 is a cross-sectional view in the direction of arrows Q-Q shown in FIG. 3, and FIG. FIG. 7B is an enlarged cross-sectional view showing a portion A of FIG. 7A.
　まず、図１を用いて、本実施形態に係る一体型タッチセンサー基板１を備える表示装置５０について説明する。この表示装置５０はスマートフォンと呼ばれる携帯電話であり、外筐を構成するケース５１を有している。ケース５１は扁平で上下（Ｙ方向）に長い矩形形状をしており、一方の主面の中央に一体型タッチセンサー基板１、下部に操作ボタン５２が配設されている。 First, a display device 50 including the integrated touch sensor substrate 1 according to the present embodiment will be described with reference to FIG. The display device 50 is a mobile phone called a smartphone, and has a case 51 constituting an outer casing. The case 51 is flat and has a rectangular shape that is long in the vertical direction (Y direction). An integrated touch sensor substrate 1 is provided at the center of one main surface, and an operation button 52 is provided at the bottom.
　図１に示すように、一体型タッチセンサー基板１は上下（Ｙ方向）に長い矩形形状をしており、周縁部には所定の幅の枠状の額縁部３を備えている。額縁部３で区画される内側の領域が表示領域１０である。額縁部３の下部にはロゴマークを表示するロゴマーク表示部１１、上部には窓１４が設けられている。窓１４の下方（ケース５１の内側）には、図示しないカメラまたは近接センサ等が設けられる。 As shown in FIG. 1, the integrated touch sensor substrate 1 has a rectangular shape that is long in the vertical direction (Y direction), and is provided with a frame-shaped frame portion 3 having a predetermined width at the periphery. An inner area defined by the frame portion 3 is a display area 10. A logo mark display part 11 for displaying a logo mark is provided at the lower part of the frame part 3, and a window 14 is provided at the upper part. A camera or proximity sensor (not shown) is provided below the window 14 (inside the case 51).
　図２は、図１に示した表示装置５０の一体型タッチセンサー基板１を表面側から見た平面図である。形状は簡略化されて示されている。ここで、このロゴマーク表示部１１の各文字の表示は、均一な金属色の面から構成される。 FIG. 2 is a plan view of the integrated touch sensor substrate 1 of the display device 50 shown in FIG. The shape is shown in a simplified manner. Here, the display of each character of this logo mark display part 11 is comprised from the surface of a uniform metal color.
　図３～７を用いて一体型タッチセンサー基板１の構成を説明する。図３～６では、図示を簡略化するために、Ｘ方向及びＹ方向のそれぞれに２ラインの電極パターンが模式的に示されているが、実際には、Ｘ方向及びＹ方向に更に多くの電極が設けられる。 The configuration of the integrated touch sensor substrate 1 will be described with reference to FIGS. In FIGS. 3 to 6, for simplification of illustration, two lines of electrode patterns are schematically shown in each of the X direction and the Y direction. An electrode is provided.
　一体型タッチセンサー基板１は、図示しない液晶パネルや有機ＥＬパネルなどの表示デバイスと組み合わせて用いられる位置入力装置である。一体型タッチセンサー基板１は、Ｘ方向に延びる複数の電極及びＹ方向に延びる複数の電極を有し、指が接触または近接した電極の静電容量変化を検出することによって、指の接触位置の座標を特定する。 The integrated touch sensor substrate 1 is a position input device used in combination with a display device such as a liquid crystal panel or an organic EL panel (not shown). The integrated touch sensor substrate 1 has a plurality of electrodes extending in the X direction and a plurality of electrodes extending in the Y direction, and detects a change in capacitance of the electrode in contact with or close to the finger, thereby detecting the contact position of the finger. Specify coordinates.
　具体的には、一体型タッチセンサー基板１は、カバーガラス２と、額縁部３と、複数のジャンパ配線４と、絶縁膜５と、金属配線６と、複数の透明電極７及び８と、絶縁保護膜９とを備える。 Specifically, the integrated touch sensor substrate 1 includes a cover glass 2, a frame portion 3, a plurality of jumper wirings 4, an insulating film 5, a metal wiring 6, a plurality of transparent electrodes 7 and 8, and insulation. And a protective film 9.
　カバーガラス２は、一体型タッチセンサー基板１の最表面となる透明な前面板であり、使用者によってタッチされる部材である。本実施形態では、前面板としてカバーガラス２を使用した例を説明するが、ガラスに代えて、耐熱性透明樹脂材料を前面板として使用しても良い。また、ガラス表面に樹脂材料からなる透明板を貼ったりして、複数の層から形成してもよい。 The cover glass 2 is a transparent front plate that is the outermost surface of the integrated touch sensor substrate 1 and is a member that is touched by the user. In the present embodiment, an example in which the cover glass 2 is used as the front plate will be described. However, instead of glass, a heat-resistant transparent resin material may be used as the front plate. Moreover, the transparent plate which consists of resin materials may be stuck on the glass surface, and you may form from several layers.
　額縁部３は、光を吸収し遮光する遮光性材料を用いてカバーガラス２の裏面上に形成される。額縁部３は、中央の窓部分に所定形状の表示領域１０を区画し、一体型タッチセンサー基板１の周縁部に設けられる配線を隠す役割を果たす。 The frame part 3 is formed on the back surface of the cover glass 2 using a light-shielding material that absorbs and blocks light. The frame part 3 defines a display area 10 having a predetermined shape in a central window part, and plays a role of hiding wiring provided on the peripheral part of the integrated touch sensor substrate 1.
　額縁部３は、カバーガラス２の周縁部に表示領域１０を区画するよう枠状に形成されている。なお、額縁部３の平面形状は、本実施形態のような矩形環状に限定されず、ハート型、たまご型、丸型など、任意である。また、額縁部３の外周縁形状（外形）と内周縁形状（表示領域１０の形状）とは相似であっても良いし、非相似でも良い。 The frame portion 3 is formed in a frame shape so as to partition the display region 10 at the peripheral edge of the cover glass 2. In addition, the planar shape of the frame part 3 is not limited to a rectangular ring shape as in the present embodiment, and is arbitrary such as a heart shape, an egg shape, and a round shape. Further, the outer peripheral edge shape (outer shape) and the inner peripheral edge shape (the shape of the display area 10) of the frame part 3 may be similar or dissimilar.
　額縁部３は、可視光を吸収する顔料系レジストの光硬化物からなる。ここで、顔料系レジストとは、溶媒に溶解させた樹脂中に顔料を分散させたものをいい、顔料系レジストの光硬化物とは、当該顔料系レジストをフォトリソグラフィー法の露光処理を行うことによって硬化させたものをいう。 The frame part 3 is made of a photo-cured product of a pigment-based resist that absorbs visible light. Here, the pigment-based resist is a resin in which a pigment is dispersed in a resin dissolved in a solvent. The photo-cured product of the pigment-based resist means that the pigment-based resist is subjected to an exposure process by a photolithography method. It is the one cured by.
　本実施形態では、顔料系レジストは、カーボンブラック及び酸化チタン以外の少なくとも２種類以上の顔料の混合物を含む疑似ブラックレジストである。例として、カラーフィルタの着色透明層を形成する際に用いられる顔料で、Ｃ．Ｉ．ピグメントレッド１ 、Ｃ．Ｉ．ピグメントレッド２ 、Ｃ．Ｉ．ピグメントレッド３ 、Ｃ．Ｉ．ピグメントレッド４ 、Ｃ．Ｉ．ピグメントレッド５ 、Ｃ．Ｉ．ピグメントレッド６ 、Ｃ．Ｉ．ピグメントレッド７ 、Ｃ．Ｉ．ピグメントレッド８ 、Ｃ．Ｉ．ピグメントレッド９ 、Ｃ．Ｉ．ピグメントレッド１ ０ 、Ｃ．Ｉ．ピグメントレッド１１ 、Ｃ．Ｉ．ピグメントレッド１ ２ 、Ｃ．Ｉ．ピグメントレッド１ ４ などに代表される赤色（ＲＥＤ）系顔料と、Ｃ．Ｉ．ピグメントブルー１ ５ 、Ｃ．Ｉ．ピグメントブルー１ ５ ： ３ 、Ｃ．Ｉ．ピグメントブルー１ ５ ： ４ 、Ｃ．Ｉ．ピグメントブルー１ ５ ： ６ 、Ｃ．Ｉ．ピグメントブルー６０などに代表される青色（ＢＬＵＥ）系顔料とを少なくとも混合することにより、擬似的に黒色としたものが挙げられる。 In the present embodiment, the pigment-based resist is a pseudo black resist containing a mixture of at least two kinds of pigments other than carbon black and titanium oxide. As an example, a pigment used in forming a colored transparent layer of a color filter, C.I. I. Pigment Red 1, C.I. I. Pigment Red 2cm, C.I. I. Pigment Red 3cm, C.I. I. Pigment Red 4cm, C.I. I. Pigment Red 5cm, C.I. I. Pigment Red 6cm, C.I. I. Pigment Red 7cm, C.I. I. Pigment Red 8cm, C.I. I. Pigment Red 9cm, C.I. I. Pigment red 1 0, C.I. I. Pigment Red 11cm, C.I. I. Pigment Red 1 2, C.I. I. Red (RED) pigments such as CI Pigment Red 1 to 4; I. Pigment Blue 1 5, C.I. I. Pigment Blue 1 5: 3, C.I. I. Pigment Blue 1 5: 4, C.I. I. Pigment Blue 1 5: 6, C.I. I. A pseudo black color is obtained by mixing at least a blue (BLUE) pigment represented by CI Pigment Blue 60 and the like.
　また、本実施形態では、赤色系顔料と青色系顔料とに加え、さらに黄色（ＹＥＬＬＯＷ）系顔料を加えてもよい。黄色系顔料は可視光の低波長領域、すなわち波長５００ｎｍ以下の光を吸収することが知られている（例えば、塩治孜著（昭和４０年、１９６５年）「印刷インキ教室」（日本印刷新聞社）Ｐ１７０～１７３）。赤色系顔料と青色系顔料とに黄色系顔料を加えることにより、黄色系顔料が低波長可視光を吸収し、より黒色に近くすることができる。 In this embodiment, in addition to the red pigment and the blue pigment, a yellow (YELLOW) pigment may be added. Yellow pigments are known to absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shiji (1940, 1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P) 170-173). By adding a yellow pigment to a red pigment and a blue pigment, the yellow pigment absorbs low-wavelength visible light and can be made closer to black.
　ここで、顔料系レジストの光硬化物の誘電率は、好ましくは１０以下、より好ましくは５．０以下とする必要がある。静電容量結合方式のタッチパネルの応答性を確保するためである。また、誘電率を４．０以下とすると、顔料系レジストの静電容量の形成を抑えることができる。 Here, the dielectric constant of the pigment-based resist photocured product is preferably 10 or less, more preferably 5.0 or less. This is to ensure the responsiveness of the capacitively coupled touch panel. Further, when the dielectric constant is 4.0 or less, formation of the electrostatic capacity of the pigment-based resist can be suppressed.
　また、本実施形態の額縁部３上には、金属配線６および透明電極７、８が形成されるため、電気的な絶縁性を確保する必要がある。すなわち、比抵抗値が１×１０８Ω・ｃｍでも不十分であり、顔料系レジストの光硬化物の比抵抗値は、１×１０９Ω・ｃｍ以上が好ましく、さらに１×１０１４Ω・ｃｍ以上が好ましい。顔料系レジストの光硬化物の比抵抗値が、１×１０９Ω・ｃｍ未満の場合、顔料系レジストの光硬化物である額縁上に形成された金属配線および透明電極配線が短絡（ショート）することとなり、一体型タッチセンサー基板が正常に動作しなくなるためである。 Moreover, since the metal wiring 6 and the transparent electrodes 7 and 8 are formed on the frame part 3 of this embodiment, it is necessary to ensure electrical insulation. That is, even if the specific resistance value is 1 × 10 8 Ω · cm, the specific resistance value of the photo-cured pigment-based resist is preferably 1 × 10 9 Ω · cm or more, more preferably 1 × 10 14 Ω · cm. More than cm is preferable. When the specific resistance value of the photo-cured product of the pigment-based resist is less than 1 × 10 9 Ω · cm, the metal wiring and the transparent electrode wiring formed on the frame, which is the photo-cured product of the pigment-based resist, are short-circuited (short) This is because the integrated touch sensor substrate does not operate normally.
　ジャンパ配線４は、導電性を有する材料を用いて形成され、表示領域１０内のカバーガラス２上に、表示領域１０の一辺と平行なＸ方向及びこれと直交するＹ方向に間欠的かつ行列状に配列されている。ジャンパ配線４は、Ｘ方向に整列する透明電極７を接続するためのものである。 The jumper wiring 4 is formed using a conductive material, and is intermittently arranged in a matrix on the cover glass 2 in the display region 10 in the X direction parallel to one side of the display region 10 and in the Y direction perpendicular thereto. Is arranged. The jumper wiring 4 is for connecting the transparent electrodes 7 aligned in the X direction.
　複数の絶縁膜５は、ジャンパ配線４の各々に対応して設けられる。絶縁膜５の各々は、対応するジャンパ配線４と交差してＸ方向に延びるように形成され、Ｙ方向におけるジャンパ配線４の中央部と部分的に重なっている。絶縁膜５は、ジャンパ配線４と透明電極８との間の層間絶縁膜として機能する。ジャンパ配線４と透明電極７とのＹ方向の接続を可能とするため、絶縁膜５はジャンパ配線４の両端部とは重なっていない。 A plurality of insulating films 5 are provided corresponding to each of the jumper wirings 4. Each of the insulating films 5 is formed so as to cross the corresponding jumper wiring 4 and extend in the X direction, and partially overlaps the central portion of the jumper wiring 4 in the Y direction. The insulating film 5 functions as an interlayer insulating film between the jumper wiring 4 and the transparent electrode 8. The insulating film 5 does not overlap with both ends of the jumper wiring 4 so that the jumper wiring 4 and the transparent electrode 7 can be connected in the Y direction.
　金属配線６は、額縁部３上に直接形成され、表示領域１０の周縁部に位置する透明電極７及び８に電気的に接続されている。本実施形態では、金属配線６は、Ｍｏ／Ａｌ／Ｍｏ（モリブデン／アルミニウム／モリブデン）の積層体からなるが、これ以外にＡｕ（金）やＡｇ（銀）、Ａｇ合金などによって形成されても良い。 The metal wiring 6 is directly formed on the frame part 3 and is electrically connected to the transparent electrodes 7 and 8 located at the peripheral part of the display area 10. In the present embodiment, the metal wiring 6 is made of a Mo / Al / Mo (molybdenum / aluminum / molybdenum) laminate, but may be formed of Au (gold), Ag (silver), an Ag alloy, or the like. good.
　金属配線６の構成材料は、これらに限らず、金属を含み低抵抗なものであれば好適に用いることができる。形成された金属配線６のシート抵抗値は、５．０Ω／□以下が好ましく、１．０Ω／□以下がより好ましく、０．５Ω／□以下がさらに好ましい。シート抵抗値は、例えば、４端子法によって測定することができる。 The constituent material of the metal wiring 6 is not limited to these, and any material that contains metal and has low resistance can be suitably used. The sheet resistance value of the formed metal wiring 6 is preferably 5.0Ω / □ or less, more preferably 1.0Ω / □ or less, and further preferably 0.5Ω / □ or less. The sheet resistance value can be measured by, for example, a four-terminal method.
　また、金属配線６と同一の構成材料が後述する表示膜層として利用される。構成材料が十分な金属光沢を呈するためには、材料の反射率は、３０％以上が好ましく、５０％以上がより好ましく、７０％以上がさらに好ましい。Ｍｏ／Ａｌ／ＭｏやＭｏを用いることで、３０％以上の反射率を実現することができる。Ａｇ－Ｐｄ－Ｃｕ（銀パラジウム銅）合金やＡｇ、Ａｌを用いることで、７０％以上の高反射率を実現することができる。反射率は、例えば、顕微分光測定機を用いて測定することができる。 Further, the same constituent material as that of the metal wiring 6 is used as a display film layer described later. In order for the constituent material to exhibit a sufficient metallic luster, the reflectance of the material is preferably 30% or more, more preferably 50% or more, and further preferably 70% or more. By using Mo / Al / Mo or Mo, a reflectance of 30% or more can be realized. By using an Ag—Pd—Cu (silver palladium copper) alloy, Ag, or Al, a high reflectance of 70% or more can be realized. The reflectance can be measured using, for example, a microspectrophotometer.
　透明電極７は、Ｘ座標を検出するためのものである。透明電極７は、電気伝導性と透明性とを有する材料を用いて、表示領域１０内のカバーガラス２上に形成されている。透明電極７は、Ｘ方向及びＹ方向に間欠的かつ行列状に配列され、Ｙ方向に隣接するジャンパ配線４に電気的に接続されている。透明電極７は、例えば、ＩＴＯ（Ｉｎｄｉｕｍ　Ｔｉｎ　Ｏｘｉｄｅ）によって形成される。 The transparent electrode 7 is for detecting the X coordinate. The transparent electrode 7 is formed on the cover glass 2 in the display region 10 using a material having electrical conductivity and transparency. The transparent electrode 7 is intermittently arranged in a matrix in the X direction and the Y direction, and is electrically connected to the jumper wiring 4 adjacent in the Y direction. The transparent electrode 7 is made of, for example, ITO (Indium Tin Oxide).
　透明電極８は、Ｙ座標を検出するためのものである。本実施形態では、透明電極８は、透明電極７と同一材料を用いて、透明電極７と同一工程で形成される。透明電極８は、Ｘ方向に整列する透明電極７の各列間をＹ方向に延び、図５及び６に示すように、絶縁膜５上でジャンパ配線４と立体交差している。 The transparent electrode 8 is for detecting the Y coordinate. In the present embodiment, the transparent electrode 8 is formed in the same process as the transparent electrode 7 using the same material as the transparent electrode 7. The transparent electrode 8 extends in the Y direction between the columns of the transparent electrodes 7 aligned in the X direction, and three-dimensionally intersects with the jumper wiring 4 on the insulating film 5 as shown in FIGS.
　絶縁保護膜９は、ジャンパ配線４と、金属配線６と、透明電極７及び８と、額縁部３とを覆うように、金属配線６の引き出し配線に当たる部分を除きカバーガラス２のほぼ全面に形成されている。絶縁保護膜９は、カバーガラス２上に形成された各構成要素を保護する保護膜として機能する。 The insulating protective film 9 is formed on almost the entire surface of the cover glass 2 except for the portion corresponding to the lead-out wiring of the metal wiring 6 so as to cover the jumper wiring 4, the metal wiring 6, the transparent electrodes 7 and 8, and the frame portion 3. Has been. The insulating protective film 9 functions as a protective film that protects each component formed on the cover glass 2.
　なお、本実施形態に係る一体型タッチセンサー基板１においては、ジャンパ配線４と、絶縁膜５と、透明電極７及び８と、絶縁保護膜９とがセンサー層に相当する。 In the integrated touch sensor substrate 1 according to the present embodiment, the jumper wiring 4, the insulating film 5, the transparent electrodes 7 and 8, and the insulating protective film 9 correspond to the sensor layer.
　本実施形態で用いる顔料系レジストの光硬化物は、従来のカラーフィルタ用のブラックレジスト材料の光硬化物と比べて、誘電率が低く、かつ、比抵抗値が高いため、額縁部３の絶縁が不要となり、額縁部３上に直接センサー層や金属配線６を形成することができる。また、額縁部３を覆う絶縁膜が不要であることによって工程数が減少するので、コストダウン及び歩留まりの向上を実現できる。 The photo-cured product of the pigment-based resist used in this embodiment has a lower dielectric constant and a higher specific resistance value than the photo-cured product of the black resist material for conventional color filters. Is unnecessary, and the sensor layer and the metal wiring 6 can be formed directly on the frame portion 3. In addition, since the number of steps is reduced because an insulating film that covers the frame portion 3 is not necessary, it is possible to realize cost reduction and yield improvement.
　また、本実施形態では額縁部３の材料をフォトリソグラフィー法の露光処理を行った。
スクリーン印刷で額縁部３を形成した場合には額縁部３の表面の凹凸が粗くなるが、フォトリソグラフィー法によって額縁部３を形成すると、額縁部３の表面が平滑になる。そこで、金属配線６を額縁部３上に直接、安定して形成することができる。 In the present embodiment, the material of the frame portion 3 is subjected to an exposure process by a photolithography method.
When the frame part 3 is formed by screen printing, the unevenness of the surface of the frame part 3 becomes rough, but when the frame part 3 is formed by photolithography, the surface of the frame part 3 becomes smooth. Therefore, the metal wiring 6 can be directly and stably formed on the frame portion 3.
　ここで、図４および図７（ａ）（ｂ）を用いて、本実施形態に係る一体型タッチセンサー基板１におけるロゴマーク表示部１１の形成について説明する。
　図７（ｂ）に示すように、ロゴマークが表示されるロゴマーク表示部１１に位置する額縁部３には、ロゴマークの形に抜いたマーク抜き部１３が形成されている。すなわち、マーク抜き部１３は額縁部３に抜き文字状に形成された凹部であって、額縁部３をロゴマークの形にくり抜いた内壁と、ロゴマークの形をしたカバーガラス２の裏面からなる底部とを備える。 Here, formation of the logo mark display part 11 in the integrated touch sensor substrate 1 according to the present embodiment will be described with reference to FIGS. 4 and 7A and 7B.
As shown in FIG. 7B, the frame part 3 positioned in the logo mark display part 11 on which the logo mark is displayed is formed with a mark removal part 13 that is cut out in the shape of the logo mark. That is, the mark-extracted portion 13 is a concave portion formed in a letter shape on the frame portion 3, and includes an inner wall obtained by hollowing the frame portion 3 in the shape of a logo mark, and the back surface of the cover glass 2 in the shape of the logo mark. And a bottom.
　上述した通り、本実施形態では金属配線６を額縁部３上に直接形成している。この金属配線６と同一の金属を用いて、金属配線６を形成する同一の工程で、図４に示すように、マーク抜き部１３とその近傍の領域に金属膜からなる表示膜層１２を形成する。図７（ｂ）に示すように、マーク抜き部１３の内面には表示膜層１２が形成される。表側から見たときに額縁部１０３のロゴマーク表示部１１のロゴマークの各文字は、金属配線６と同一の金属色の均一な面により表示される。 As described above, in the present embodiment, the metal wiring 6 is formed directly on the frame portion 3. In the same process of forming the metal wiring 6 using the same metal as this metal wiring 6, as shown in FIG. To do. As shown in FIG. 7B, the display film layer 12 is formed on the inner surface of the mark removal portion 13. When viewed from the front side, each character of the logo mark on the logo mark display portion 11 of the frame portion 103 is displayed by a uniform surface of the same metal color as the metal wiring 6.
　金属配線６および表示膜層１２の膜厚は、５０ｎｍ以上１μｍ以下が好ましく、１００ｎｍ以上５００ｎｍ以下がより好ましい。５０ｎｍ以上とすることで、十分な導電性及び光沢を実現することができ、１μｍ以下とすることで、十分な導電性及び光沢と、膜厚の薄さとを両立することができる。 The film thickness of the metal wiring 6 and the display film layer 12 is preferably 50 nm or more and 1 μm or less, and more preferably 100 nm or more and 500 nm or less. When the thickness is 50 nm or more, sufficient conductivity and gloss can be realized, and when the thickness is 1 μm or less, sufficient conductivity and gloss and thin film thickness can be achieved at the same time.
　このように、ロゴマーク表示部１１の内面を、金属配線６を形成する金属膜と同一の膜で覆うことで、別のインクでスクリーン印刷する工程が不要となり、工程数及び製造コストを減少することができる。また、別のインクでスクリーン印刷する場合と比較して、構成が簡単になり、金属膜と同等の薄い厚さで形成することが可能となる。また、金属色（メタリック）で意匠性に優れたロゴマークを表示することができる。 Thus, by covering the inner surface of the logo mark display unit 11 with the same film as the metal film that forms the metal wiring 6, a step of screen printing with another ink becomes unnecessary, and the number of steps and manufacturing cost are reduced. be able to. In addition, as compared with the case of screen printing with another ink, the configuration is simplified, and it is possible to form with a thin thickness equivalent to the metal film. In addition, a logo with a metallic color (metallic) and excellent design can be displayed.
　なお、図４に示すように、表示膜層１２と連続して金属配線６が形成されていて、図示しない表示装置の電気回路に結線されている。このようにして、表示膜層１２をアース（接地）するようにしてもよい。金属膜からなる表示膜層１２に静電気が貯まることによるタッチパネルや表示装置の電気回路等に不具合が生ずることを防止したり、表示装置の不要輻射対策をしたりするためである。 As shown in FIG. 4, a metal wiring 6 is formed continuously with the display film layer 12, and is connected to an electric circuit of a display device (not shown). In this way, the display film layer 12 may be grounded. This is to prevent the touch panel, the electric circuit of the display device and the like from being troubled by static electricity accumulated in the display film layer 12 made of a metal film, and to take measures against unnecessary radiation of the display device.
　（第２の実施形態）
　図８乃至図１０を参照して、本発明の第２の実施形態に係る一体型タッチセンサー基板について説明する。第２の実施形態において、第１の実施形態と同じ部分は同一符号を付し、説明を省略し、異なった部分だけを説明する。 (Second Embodiment)
An integrated touch sensor substrate according to a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.
　図８（ａ）は、本実施形態に係る一体型タッチセンサー基板１を表面側から見た平面図であり、図８（ｂ）は、図８（ａ）のＢ部を示す拡大断面図である。図９は、裏面側から見たときの一体型タッチセンサー基板１の積層構造の詳細を示す平面図であって、絶縁保護膜９の形成前の状態を示す（第１の実施形態の図４に相当する図面である）。図１０（ａ）は、図９に示したＳ－Ｓ線矢視方向の一体型タッチセンサー基板１の断面図であり、図１０（ｂ）は、図１０（ａ）のＣ部を示す拡大断面図である。 FIG. 8A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side, and FIG. 8B is an enlarged cross-sectional view showing a portion B of FIG. 8A. is there. FIG. 9 is a plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment). It is a drawing corresponding to FIG. 10A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the arrow S—S shown in FIG. 9, and FIG. 10B is an enlarged view showing a portion C in FIG. It is sectional drawing.
　本実施形態に係る一体型タッチセンサー基板１は、表示膜層１２の金属膜を、金属配線６と同一の金属を用いて、同一工程で形成している点は第１の実施形態と同一であるが、金属配線６の一部が、表示膜層１２の少なくとも一部として利用される点が異なる。すなわち、本実施形態では、ロゴマーク表示部１１の各文字を表示する領域に金属配線６が配置されている。 The integrated touch sensor substrate 1 according to the present embodiment is the same as the first embodiment in that the metal film of the display film layer 12 is formed in the same process using the same metal as the metal wiring 6. There is a difference in that a part of the metal wiring 6 is used as at least a part of the display film layer 12. In other words, in the present embodiment, the metal wiring 6 is arranged in a region for displaying each character of the logo mark display unit 11.
　図８（ａ）に示すように、本実施形態を表面側から見たとき、第１の実施形態とほぼ同様の構成となっているが、図８（ｂ）のＢ部拡大図に示すように、ロゴマーク表示部１１のロゴマークの各文字は、均一の面ではなくて、縦方向のスリット１５が形成された表示面により構成される。 As shown in FIG. 8A, when the present embodiment is viewed from the front side, the configuration is substantially the same as that of the first embodiment, but as shown in the enlarged view of the B part in FIG. 8B. In addition, each character of the logo mark on the logo mark display unit 11 is not a uniform surface, but is constituted by a display surface on which vertical slits 15 are formed.
　図９および図１０に示すように、ロゴマーク表示部１１の裏面側の、マーク抜き部１３とその近傍の領域は、表示膜層１２と金属配線６とで覆われている。この領域の中央には幅広の表示膜層１２、その両脇に金属配線６、更にその両脇に幅の狭い表示膜層１２が形成され、それぞれの間にはスリット１５が設けられ互いにショート（短絡）しないように構成されている。言い換えれば、マーク抜き部１３近傍の金属膜層が、スリット１５により分離され、金属膜層の少なくとも一部が金属配線６として利用可能となる。また、スリット１５を表示膜層１２に等間隔に形成してもよい。こうすることで、スリット１５の間隔が広く、視認されやすい場合、表示膜層１２と金属配線６との間に設けられたスリット１５とこの等間隔のスリット１５とにより、等間隔に並んだ縦ストライプによる意匠を実現できる。 As shown in FIGS. 9 and 10, the mark removal part 13 and the area in the vicinity thereof on the back side of the logo mark display part 11 are covered with the display film layer 12 and the metal wiring 6. A wide display film layer 12 is formed in the center of this region, a metal wiring 6 is formed on both sides thereof, and a narrow display film layer 12 is formed on both sides thereof. It is configured not to short-circuit). In other words, the metal film layer in the vicinity of the mark removal portion 13 is separated by the slit 15, and at least a part of the metal film layer can be used as the metal wiring 6. Further, the slits 15 may be formed in the display film layer 12 at equal intervals. By doing so, when the interval between the slits 15 is wide and easily visible, the slits 15 provided between the display film layer 12 and the metal wiring 6 and the equally spaced slits 15 are arranged at equal intervals. Design with stripes can be realized.
　文字の大きさにもよるが、スリット１５を２５μｍ以下に形成することにより、人間の視覚では認識しにくくなる。例えば、スリット１５を１５μｍ以下、隣接するスリット１５の間のライン状の金属膜の幅を３０μｍ以上とすれば、細かなストライプのほぼ均質な面となる。 Depending on the size of the characters, it is difficult to recognize by human vision by forming the slit 15 to be 25 μm or less. For example, if the slit 15 is 15 μm or less and the width of the line-shaped metal film between the adjacent slits 15 is 30 μm or more, the surface is almost uniform with fine stripes.
　このようにロゴマーク表示部１１の表示面を同一の工程で同一の金属を用いて覆うので、工程数及び製造コストを減少し、簡単な構成で厚さが薄く、金属色（メタリック）で意匠性に優れたロゴマーク表示をすることが可能となる。また、ロゴマーク表示部１１の領域にもこの金属配線６を配置して、額縁部の限られたスペースを有効に使用して配線を設けることができる。 Thus, since the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties. In addition, the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
　（第３の実施形態）
　図１１乃至図１３を参照して、本発明の第３の実施形態に係る一体型タッチセンサー基板について説明する。第３の実施形態において、前述した実施形態と同じ部分は同一符号を付し、説明を省略し、異なった部分だけを説明する。 (Third embodiment)
An integrated touch sensor substrate according to a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, the same parts as those in the above-described embodiment are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.
　図１１（ａ）は、本実施形態に係る一体型タッチセンサー基板１を表面側から見た平面図であり、図１１（ｂ）は、図１１（ａ）のＤ部を示す拡大断面図である。図１２は、裏面側から見たときの一体型タッチセンサー基板１の積層構造の詳細を示す平面図であって、絶縁保護膜９の形成前の状態を示す（第１の実施形態の図４に相当する図面である）。図１３（ａ）は、図１２に示したＴ－Ｔ線矢視方向の一体型タッチセンサー基板１の断面図であり、図１３（ｂ）は、図１３（ａ）のＥ部を示す拡大断面図である。 FIG. 11A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front surface side, and FIG. 11B is an enlarged cross-sectional view showing a portion D of FIG. is there. FIG. 12 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment). It is a drawing corresponding to 13A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and FIG. 13B is an enlarged view showing an E portion of FIG. 13A. It is sectional drawing.
　本実施形態に係る一体型タッチセンサー基板１は、表示膜層１２の金属膜を、金属配線６と同一の金属を用いて、同一工程で形成している点と、ロゴマーク表示部１１の各文字を表示する領域の一部に、金属配線６が配置されている点は第２の実施形態と同一である。しかし、図１１（ｂ）に示すように、ロゴマーク表示部１１のロゴマークの各文字は、略等間隔に横方向のスリット１５が入った横ストライプ状の表示面により構成されている点が異なる。 In the integrated touch sensor substrate 1 according to the present embodiment, the metal film of the display film layer 12 is formed in the same process using the same metal as the metal wiring 6, and each of the logo mark display unit 11 is formed. The point that the metal wiring 6 is arranged in a part of the area for displaying characters is the same as that of the second embodiment. However, as shown in FIG. 11B, each character of the logo mark of the logo mark display unit 11 is constituted by a horizontal striped display surface in which horizontal slits 15 are inserted at substantially equal intervals. Different.
　図１２および図１３に示すように、ロゴマーク表示部１１の裏面側の、マーク抜き部１３内面とその近傍の領域には、横長に細長い形状をした表示膜層１２と金属配線６とから構成される。表示膜層１２と金属配線６との間には、互いにショート（短絡）しないようにスリット１５が設けられている。これらのスリット１５により、図１２に示すように略等間隔に並んだ横ストライプが構成される。 As shown in FIGS. 12 and 13, the inner surface of the mark removal portion 13 on the back surface side of the logo mark display portion 11 and a region in the vicinity thereof are composed of a horizontally elongated display film layer 12 and metal wiring 6. Is done. A slit 15 is provided between the display film layer 12 and the metal wiring 6 so as not to short-circuit each other. These slits 15 form horizontal stripes arranged at approximately equal intervals as shown in FIG.
　なお、図１２において、横長に細長い形状をした表示膜層１２と金属配線６とを一つ置きに配置したが、表示膜層１２を一つにまとめてもよい。 In FIG. 12, the display film layer 12 and the metal wiring 6 each having a horizontally long and narrow shape are arranged alternately, but the display film layers 12 may be combined into one.
　このようにロゴマーク表示部１１の表示面を同一の工程で同一の金属を用いて覆うので、工程数及び製造コストを減少し、簡単な構成で厚さが薄く、金属色（メタリック）で意匠性に優れたロゴマーク表示をすることが可能となる。また、ロゴマーク表示部１１の領域にもこの金属配線６を配置して、額縁部の限られたスペースを有効に使用して配線を設けることができる。 Thus, since the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties. In addition, the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
　（第４の実施形態）
　図１４を参照して、本発明の第４の実施形態に係る一体型タッチセンサー基板について説明する。第４の実施形態において、前述した実施形態と同じ部分は同一符号を付し、説明を省略し、異なった部分だけを説明する。 (Fourth embodiment)
With reference to FIG. 14, an integrated touch sensor substrate according to a fourth embodiment of the present invention will be described. In the fourth embodiment, the same parts as those of the above-described embodiment are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.
　本実施形態に係る一体型タッチセンサー基板１は、第３の実施形態で説明した構成の一部を変更したものであり、表面側から見た平面図は、図１１（ａ）（ｂ）と同一である。また、裏面側から見たときの一体型タッチセンサー基板１の積層構造の詳細を示す平面図は、図１２と同一である。図１４（ａ）は、図１２に示したＴ－Ｔ線矢視方向の一体型タッチセンサー基板１の断面図であり、図１４（ｂ）は、図１４（ａ）のＦ部を示す拡大断面図である。 The integrated touch sensor substrate 1 according to this embodiment is obtained by changing a part of the configuration described in the third embodiment, and the plan view seen from the front side is as shown in FIGS. Are the same. A plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side is the same as FIG. FIG. 14A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and FIG. 14B is an enlarged view showing a portion F in FIG. It is sectional drawing.
　前述した実施形態では金属配線６を額縁部３上に直接形成しているが、額縁部３を構成する材料の比抵抗値が所定値より低く、または、スクリーン印刷で額縁部３を形成して表面の凹凸が粗い場合などの場合では、額縁部３の上に金属配線６を直接形成することは難しい。本実施形態においては、このような金属配線６を額縁部３上に直接形成できない場合においても、本発明の技術的思想が実施可能であることを以下に説明するものである。 In the above-described embodiment, the metal wiring 6 is formed directly on the frame portion 3, but the specific resistance value of the material constituting the frame portion 3 is lower than a predetermined value, or the frame portion 3 is formed by screen printing. In cases such as when the surface unevenness is rough, it is difficult to form the metal wiring 6 directly on the frame portion 3. In the present embodiment, it will be described below that the technical idea of the present invention can be implemented even when such metal wiring 6 cannot be directly formed on the frame portion 3.
　図１４（ａ）に示すように、本実施形態に係る一体型タッチセンサー基板１においては、額縁部３の上にカバーガラス２の裏面全体を覆う絶縁層１６を形成する。このように構成することにより、例えば、額縁部３にカーボンブラックが多く含まれ比抵抗値が低く、金属配線６を額縁部３の上に直接形成できない場合でも、金属配線６は絶縁層１６の上に形成することができる。 As shown in FIG. 14A, in the integrated touch sensor substrate 1 according to this embodiment, an insulating layer 16 that covers the entire back surface of the cover glass 2 is formed on the frame portion 3. With this configuration, for example, even when the frame portion 3 contains a large amount of carbon black and has a low specific resistance value, and the metal wiring 6 cannot be formed directly on the frame portion 3, the metal wiring 6 is formed on the insulating layer 16. Can be formed on top.
　本実施形態を表面側から見たとき、第３の実施形態と同様、ロゴマーク表示部１１のロゴマークの各文字は、横ストライプ状の表示面で形成される。ここで、図１４（ｂ）に示すように、この横ストライプ状の表示面は、第３の実施形態のようにマーク抜き部１３の内面に形成されたものではなく、絶縁層１６上に形成されていて、絶縁層１６を介して表示面が視認される。 When the present embodiment is viewed from the front side, each character of the logo mark of the logo mark display section 11 is formed on a horizontal stripe-shaped display surface as in the third embodiment. Here, as shown in FIG. 14B, this horizontal stripe-shaped display surface is not formed on the inner surface of the mark removal portion 13 as in the third embodiment, but is formed on the insulating layer 16. The display surface is visually recognized through the insulating layer 16.
　このようにロゴマーク表示部１１の表示面を同一の工程で同一の金属を用いて覆うので、工程数及び製造コストを減少し、簡単な構成で厚さが薄く、金属色（メタリック）で意匠性に優れたロゴマーク表示をすることが可能となる。また、ロゴマーク表示部１１の領域にもこの金属配線６を配置して、額縁部の限られたスペースを有効に使用して配線を設けることができる。 Thus, since the display surface of the logo mark display unit 11 is covered with the same metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple configuration, and the design is metallic (metallic). It is possible to display a logo mark with excellent properties. In addition, the metal wiring 6 can be arranged also in the region of the logo mark display portion 11, and the wiring can be provided by effectively using the limited space of the frame portion.
　（第５の実施形態）
　図１５を参照して、本発明の第５の実施形態に係る一体型タッチセンサー基板について説明する。第５の実施形態において、前述した実施形態と同じ部分は同一符号を付し、説明を省略し、異なった部分だけを説明する。 (Fifth embodiment)
With reference to FIG. 15, an integrated touch sensor substrate according to a fifth embodiment of the present invention will be described. In the fifth embodiment, the same parts as those of the above-described embodiment are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.
　本実施形態に係る一体型タッチセンサー基板１は、第２の実施形態で説明した構成の一部を変更したものであり、表面側から見た平面図は、図８（ａ）（ｂ）と同一である。裏面側から見たときの一体型タッチセンサー基板１の積層構造の詳細を示す平面図を、図１５に示す。図１６（ａ）、（ｂ）は、それぞれ図１５に示したＵ－Ｕ線およびＶ－Ｖ線の矢視方向の一体型タッチセンサー基板１の断面図である。 The integrated touch sensor substrate 1 according to this embodiment is obtained by changing a part of the configuration described in the second embodiment, and the plan view seen from the front side is as shown in FIGS. Are the same. FIG. 15 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side. 16 (a) and 16 (b) are cross-sectional views of the integrated touch sensor substrate 1 in the directions of the arrows UU and VV shown in FIG. 15, respectively.
　本実施形態では、額縁層３がカーボンブラックレジストで形成されている。そのため、絶縁層１６が額縁部３を覆って形成されることにより、額縁部３を絶縁している。しかし、絶縁層１６がカバーガラス２の額縁部３が形成された領域より内側には形成されていない点で第４の実施形態と異なる。また、絶縁層１６は、絶縁膜５と同一の材料を用いて、絶縁膜５の形成と同一工程で形成される。これにより、絶縁層１６の材料の減量と省工程とを図ることができる。 In the present embodiment, the frame layer 3 is formed of a carbon black resist. Therefore, the frame part 3 is insulated by forming the insulating layer 16 so as to cover the frame part 3. However, the fourth embodiment is different from the fourth embodiment in that the insulating layer 16 is not formed inside the region where the frame portion 3 of the cover glass 2 is formed. The insulating layer 16 is formed in the same process as the formation of the insulating film 5 using the same material as the insulating film 5. Thereby, the amount of material for the insulating layer 16 can be reduced and the number of processes can be reduced.
　図１６（ａ）（ｂ）に示すように、本実施形態に係る一体型タッチセンサー基板１においては、金属配線６および表示膜層１２の形成後、金属配線６および表示膜層１２の少なくともスリット１５が形成された領域の裏面側に不透明層１７を形成する。不透明層１７がスリット１５に入射した光を吸収または散乱するため、スリット１５による光の反射をより目立たなくし、ロゴマークの意匠性を向上させることができる。不透明層１７は、顔料等を用いてスリット１５をより目立たなくするために好適な色を、黒色あるいはその他の色から適宜選択して形成すればよい。不透明層１７は、フォトリソグラフィー法等の従来知られた印刷方法で形成することができ、インクジェット方式、ディスペンサ方式等によっても形成することができる。 As shown in FIGS. 16A and 16B, in the integrated touch sensor substrate 1 according to the present embodiment, after the metal wiring 6 and the display film layer 12 are formed, at least slits in the metal wiring 6 and the display film layer 12 are formed. An opaque layer 17 is formed on the back side of the region where 15 is formed. Since the opaque layer 17 absorbs or scatters the light incident on the slit 15, the reflection of the light by the slit 15 becomes less conspicuous and the design of the logo mark can be improved. The opaque layer 17 may be formed by appropriately selecting a suitable color from black or other colors in order to make the slit 15 less noticeable using a pigment or the like. The opaque layer 17 can be formed by a conventionally known printing method such as a photolithography method, and can also be formed by an inkjet method, a dispenser method, or the like.
　図１６では、不透明層１７を表示膜層１２上に直接形成する例を示したが、不透明層１７は、絶縁保護膜９の上に形成してもよい。 16 shows an example in which the opaque layer 17 is formed directly on the display film layer 12, the opaque layer 17 may be formed on the insulating protective film 9.
　また、不透明層１７は、スリット１５を覆っていればよく、図１６のように、ロゴマーク領域全体に設けてもよく、スリット領域及びその近傍のみ設けてもよく、スリット領域のみに設けてもよい。 Further, the opaque layer 17 only needs to cover the slit 15, and may be provided in the entire logo mark area as shown in FIG. 16, or may be provided only in the slit area and its vicinity, or may be provided only in the slit area. Good.
　なお、第２、第４の実施形態において、スリット１５を覆うように金属配線６および表示膜層１２に不透明層１７を形成してもよい。また、第１、第２、第４の実施形態において、額縁層３をカーボンブラックレジストで形成し、額縁部３を覆うように絶縁層１６を形成して絶縁してもよい。 In the second and fourth embodiments, the opaque layer 17 may be formed on the metal wiring 6 and the display film layer 12 so as to cover the slit 15. In the first, second, and fourth embodiments, the frame layer 3 may be formed of a carbon black resist, and the insulating layer 16 may be formed so as to cover the frame portion 3 for insulation.
　本発明を更に詳しく説明するために以下に実施例を上げるが、本発明はこれらの実施例のみに限定されるものではない。 In order to describe the present invention in more detail, examples are given below, but the present invention is not limited to these examples.
　（実施例１）
　この実施例では、前述の第２の実施形態で説明したものと同様の構成の一体型タッチセンサー基板１の製造方法について、詳説する。 Example 1
In this example, a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the second embodiment will be described in detail.
　図１７～２２は、本実施例に係る一体型タッチセンサー基板１の製造工程を示す図である。図１７～２２において、（ａ）は断面図であり、（ｂ）は平面図である。また、図１７～２２の（ｂ）に示す二点鎖線は、（ａ）の断面図の切断位置を表す。 17 to 22 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment. 17 to 22, (a) is a cross-sectional view and (b) is a plan view. In addition, a two-dot chain line shown in (b) of FIGS. 17 to 22 represents a cutting position in the sectional view of (a).
　<１．額縁部３の形成>
　まず、カバーガラス２の裏面の上に、後述する顔料系レジストを、スピンコートにより塗布した。
　次に、減圧乾燥機にて溶剤分を除去したのち、プロキシミティー露光方式（超高圧水銀ランプ）にて露光した。ここで、露光用フォトマスクとしてはソーダガラスにＣｒ（クロム）でパターンを施したものを用いた。
　次に、アルカリ性現像液にて現像し、熱処理を行い、図１７に示す所定のロゴマークの形をしたマーク抜き部１３を備えた額縁部３を形成した。 <1. Formation of frame part 3>
First, a pigment-based resist, which will be described later, was applied on the back surface of the cover glass 2 by spin coating.
Next, after removing the solvent content with a vacuum dryer, exposure was performed by a proximity exposure system (ultra-high pressure mercury lamp). Here, as the photomask for exposure, a soda glass patterned with Cr (chromium) was used.
Next, development was performed with an alkaline developer, and heat treatment was performed to form a frame portion 3 having a mark removal portion 13 in the shape of a predetermined logo mark shown in FIG.
　<２．ジャンパ配線４の形成>
　まず、図１７に示す形成物の上に、ＤＣマグネトロンスパッタ方式にて、加熱しながらスパッタする加熱スパッタによってＩＴＯ膜を形成した。
　次に、一般的なノボラック系ポジレジストをスピンコートし、プレベーク後、露光したのち、アルカリ性現像液にてポジ現像を行った。ここで、露光はプロキシミティー露光方式（超高圧水銀ランプ）を使用し、露光用フォトマスクとしてはソーダガラスにＣｒでパターンを施したものを用いた。
　そして、シュウ酸（（ＣＯＯＨ）２）を主成分としたエッチング液を用いてエッチングし、ポジレジストを全面露光したのち、アルカリ性剥離液にてポジレジストを剥離して、図１８に示すように、ＩＴＯ膜によるジャンパ配線４を形成した。 <2. Formation of jumper wiring 4>
First, an ITO film was formed on the formed material shown in FIG. 17 by heat sputtering, in which sputtering was performed with a DC magnetron sputtering method.
Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching is performed using an etching solution mainly composed of oxalic acid ((COOH) 2 ), and the positive resist is exposed on the entire surface, and then the positive resist is stripped with an alkaline stripping solution, as shown in FIG. A jumper wiring 4 made of an ITO film was formed.
　<３．絶縁膜５の形成>
　まず、図１８に示す形成物の上に、アクリル系絶縁材料をスピンコートにより塗布した。
　次に、プレベークして溶剤分を除去し、プロキシミティー露光方式（超高圧水銀ランプ）にて露光した。ここで、露光用フォトマスクとしてはクオーツガラスにＣｒでパターンを施したものを用いた。
　次に、アルカリ性現像液にて現像し、熱処理を行った。
　このようにして、図１９に示すように、ジャンパ配線４上の絶縁膜５を形成した。 <3. Formation of insulating film 5>
First, an acrylic insulating material was applied on the formed product shown in FIG. 18 by spin coating.
Next, pre-baking was performed to remove the solvent, and exposure was performed by a proximity exposure system (super high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used.
Next, it developed with the alkaline developing solution and heat-processed.
In this way, as shown in FIG. 19, the insulating film 5 on the jumper wiring 4 was formed.
　<４．金属配線６および表示膜層１２の形成>
　まず、図１９に示す形成物の上に、ＤＣマグネトロンスパッタ方式にて、真空中でＭｏの層、Ａｌの層、Ｍｏの層を順次形成し、３層積層構造のＭｏ／Ａｌ／Ｍｏ積層体を形成した。
　次に、一般的なノボラック系ポジレジストをスピンコートし、プレベークして、その後、露光したのち、アルカリ性現像液にてポジ現像を行った。ここで、露光はプロキシミティー露光方式（超高圧水銀ランプ）を使用し、露光用フォトマスクとしてはソーダガラスにＣｒでパターンを施したものを用いた。
　そして、燐酸・硝酸・酢酸の３成分系のエッチャント（エッチング液）にてエッチングし、ポジレジストを全面露光したのち、アルカリ性剥離液にてポジレジストを剥離した。
　このようにして、図２０に示すように、額縁部３上に金属配線６および表示膜層１２を形成した。
　ここで、表示膜層１２とその両脇の金属配線６によるＭｏ／Ａｌ／Ｍｏ積層体の膜により、マーク抜き部１３の内面は覆われる。本実施例では、表示膜層１２および金属配線６を構成するＭｏ／Ａｌ／Ｍｏ積層体の厚さを、それぞれ、５０ｎｍ、２００ｎｍ、５０ｎｍとし、表示膜層１２および金属配線６のシート抵抗値を０．２Ω／□、反射率を４０％とした。またスリット１５の幅を１５μｍとした。 <4. Formation of metal wiring 6 and display film layer 12>
First, a Mo layer, an Al layer, and a Mo layer are sequentially formed in a vacuum by a DC magnetron sputtering method on the formation shown in FIG. Formed.
Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching was performed with a phosphoric acid / nitric acid / acetic acid three-component etchant (etching solution), and the positive resist was exposed on the entire surface, and then the positive resist was stripped with an alkaline stripping solution.
Thus, as shown in FIG. 20, the metal wiring 6 and the display film layer 12 were formed on the frame part 3.
Here, the inner surface of the mark removal portion 13 is covered with the film of the Mo / Al / Mo laminate formed by the display film layer 12 and the metal wiring 6 on both sides thereof. In this example, the thicknesses of the Mo / Al / Mo laminated bodies constituting the display film layer 12 and the metal wiring 6 are set to 50 nm, 200 nm, and 50 nm, respectively, and the sheet resistance values of the display film layer 12 and the metal wiring 6 are set. 0.2Ω / □ and the reflectance was 40%. The width of the slit 15 was 15 μm.
　<５．透明電極７および８の形成>
　まず、図２０に示す形成物の上に、ＤＣマグネトロンスパッタ方式にて、加熱しながらスパッタする加熱スパッタによってＩＴＯ膜を形成した。
　次に、一般的なノボラック系ポジレジストをスピンコートし、プレベーク後、露光したのち、アルカリ性現像液にてポジ現像を行った。ここで、露光はプロキシミティー露光方式（超高圧水銀ランプ）を使用し、露光用フォトマスクとしてはソーダガラスにＣｒでパターンを施したものを用いた。
　そして、シュウ酸を主成分とするエッチング液を用いてエッチングし、ポジレジストを全面露光したのち、アルカリ性剥離液にてポジレジストを剥離した。
　このようにして、図２１に示すように、ＩＴＯ膜により透明電極７、８を形成した。 <5. Formation of transparent electrodes 7 and 8>
First, an ITO film was formed on the formed material shown in FIG. 20 by heat sputtering, in which sputtering was performed by a DC magnetron sputtering method.
Next, a general novolac positive resist was spin-coated, pre-baked, exposed, and then positively developed with an alkaline developer. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
And it etched using the etching liquid which has oxalic acid as a main component, and exposed the positive resist to the whole surface, Then, the positive resist was peeled with the alkaline peeling liquid.
Thus, as shown in FIG. 21, the transparent electrodes 7 and 8 were formed with the ITO film.
　<６．絶縁保護膜９の形成>
　まず、図２１に示す形成物の上に、アクリル系オーバーコート材料をスピンコートにより塗布した。
　次に、プレベークして溶剤分を除去し、プロキシミティー露光方式（超高圧水銀ランプ）を使用し露光した。ここで、露光用フォトマスクとしてはクオーツガラスにＣｒでパターンを施したものを用いた。
　次に、アルカリ性現像液にて現像し、熱処理を行った。
　このようにして、図２２に示すように、絶縁保護膜９を形成して、一体型タッチセンサー基板１を製造し完成させた。 <6. Formation of insulating protective film 9>
First, an acrylic overcoat material was applied on the formed product shown in FIG. 21 by spin coating.
Next, pre-baking was performed to remove the solvent, and exposure was performed using a proximity exposure system (ultra-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used.
Next, it developed with the alkaline developing solution and heat-processed.
In this way, as shown in FIG. 22, the insulating protective film 9 was formed, and the integrated touch sensor substrate 1 was manufactured and completed.
　<７．顔料系レジストについて>
　以上の実施例で使用した顔料系レジストは、溶媒に溶解させた樹脂中に２種の顔料を分散させ、擬似的に黒色を実現した疑似ブラックレジストである。２種の顔料としては、ピグメントレッド（ＰＲ２５４）とピグメントブルー（ＰＢ１５：３）とを１：１の比率で混合したものを用いた。また、固形物中の顔料比率は４０パーセントである。この材料を用いて３μｍの厚さに額縁部３を形成した。このように形成した額縁部３の比抵抗値は１×１０１４Ω・ｃｍ以上となり、誘電率は４．０以下となった。 <7. About pigment-based resists>
The pigment-based resist used in the above examples is a pseudo black resist in which two types of pigments are dispersed in a resin dissolved in a solvent to realize pseudo black. As the two types of pigments, pigment red (PR254) and pigment blue (PB15: 3) mixed at a ratio of 1: 1 were used. The pigment ratio in the solid is 40 percent. The frame portion 3 was formed to a thickness of 3 μm using this material. The specific resistance value of the frame portion 3 formed in this way was 1 × 10 14 Ω · cm or more, and the dielectric constant was 4.0 or less.
　また、本実施例１の一体型タッチセンサー基板のロゴマーク表示部１１において、スリット１５は視認されず、金属配線６および表示膜層１２は、十分な金属光沢を呈するものであった。 In addition, in the logo mark display portion 11 of the integrated touch sensor substrate of Example 1, the slit 15 was not visually recognized, and the metal wiring 6 and the display film layer 12 exhibited a sufficient metallic luster.
　（実施例２）
　この実施例は、実施例１において、表示膜層１２および金属配線６を、Ａｇ－Ｐｄ－Ｃｕ合金で厚さ２００ｎｍとし、スリット１５の幅を２５μｍとし、シート抵抗値を、０．１Ω／□、反射率を９５％としたものである。これにより、実施例１に比べ、金属配線６および表示膜層１２の導電性および金属光沢性を、より向上した。また、本実施例２の一体型タッチセンサー基板１のロゴマーク表示部１１においても、スリット１５は視認されなかった。 (Example 2)
In this example, the display film layer 12 and the metal wiring 6 in Example 1 are made of Ag—Pd—Cu alloy to a thickness of 200 nm, the width of the slit 15 is set to 25 μm, and the sheet resistance value is set to 0.1Ω / □. The reflectance is 95%. Thereby, compared with Example 1, the electroconductivity and metal luster of the metal wiring 6 and the display film layer 12 were improved more. Moreover, the slit 15 was not visually recognized also in the logo mark display part 11 of the integrated touch sensor board | substrate 1 of the present Example 2. FIG.
　（実施例３）
　この実施例では、前述の第１の実施形態において、額縁層３をカーボンブラックレジストで形成し、額縁部３を覆うように絶縁層１６を形成した一体型タッチセンサー基板１の製造方法について、詳説する。 (Example 3)
In this example, the manufacturing method of the integrated touch sensor substrate 1 in which the frame layer 3 is formed of carbon black resist and the insulating layer 16 is formed so as to cover the frame portion 3 in the first embodiment described above will be described in detail. To do.
　図２３～２６は、本実施例に係る一体型タッチセンサー基板１の製造工程を示す図である。図２３～２６において、（ａ）は断面図であり、（ｂ）は平面図である。また、図２３～２６の（ｂ）に示す二点鎖線は、（ａ）の断面図の切断位置を表す。また、実施例１で参照した図面を、本実施例においても適宜参照する。 23 to 26 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment. 23 to 26, (a) is a cross-sectional view, and (b) is a plan view. In addition, a two-dot chain line shown in (b) of FIGS. 23 to 26 represents a cutting position in the sectional view of (a). The drawings referred to in the first embodiment are also referred to in this embodiment as appropriate.
　<１．額縁部３の形成>
　まず、カバーガラス２の裏面の上に、カーボンブラックレジストを用いて、図１７と同様の位置に厚さ１．２μｍの額縁部３を形成した。 <1. Formation of frame part 3>
First, a frame portion 3 having a thickness of 1.2 μm was formed on the back surface of the cover glass 2 at the same position as in FIG. 17 using a carbon black resist.
　<２．ジャンパ配線４の形成>
　実施例１と同様の方法で、図１８に示すのと同様にジャンパ配線４を形成した。 <2. Formation of jumper wiring 4>
A jumper wiring 4 was formed in the same manner as in Example 1 as shown in FIG.
　<３．絶縁膜５および絶縁層１６の形成>
　図１８に示す形成物の上に、実施例１と同様にジャンパ配線４上の絶縁膜５を形成すると同時に、絶縁膜５を形成するのと同一の材料、方法で、絶縁層１６を形成し、図２３に示す形成物を得た。 <3. Formation of Insulating Film 5 and Insulating Layer 16>
On the formation shown in FIG. 18, the insulating film 5 on the jumper wiring 4 is formed in the same manner as in the first embodiment, and at the same time, the insulating layer 16 is formed by the same material and method as the insulating film 5 is formed. The formation shown in FIG. 23 was obtained.
　<４．金属配線６および表示膜層１２の形成>
　図２３に示す形成物の上に、実施例１と同様の方法で、図２４に示すように、額縁部３上に金属配線６および表示膜層１２を形成した。 <4. Formation of metal wiring 6 and display film layer 12>
On the formation shown in FIG. 23, the metal wiring 6 and the display film layer 12 were formed on the frame portion 3 as shown in FIG.
　<５．透明電極７および８の形成>
　図２４に示す形成物の上に、実施例１と同様の方法で、図２５に示すように、ＩＴＯ膜により透明電極７、８を形成した。 <5. Formation of transparent electrodes 7 and 8>
On the formed product shown in FIG. 24, transparent electrodes 7 and 8 were formed of ITO films by the same method as in Example 1 as shown in FIG.
　<６．絶縁保護膜９の形成>
　図２５に示す形成物の上に、実施例１と同様に、図２６に示すように、絶縁保護膜９を形成して、一体型タッチセンサー基板１を製造し完成させた。 <6. Formation of insulating protective film 9>
As shown in FIG. 26, the insulating protective film 9 was formed on the formed product shown in FIG. 25 as shown in FIG. 26, and the integrated touch sensor substrate 1 was manufactured and completed.
　本実施例３の一体型タッチセンサー基板１のロゴマーク表示部１１においても、実施例１と同様に、表示膜層１２は、十分な金属光沢を呈するものであった。 Also in the logo mark display part 11 of the integrated touch sensor substrate 1 of Example 3, the display film layer 12 exhibited a sufficient metallic luster as in Example 1.
　（実施例４）
　この実施例では、前述の第５の実施形態で説明したものと同様の構成の一体型タッチセンサー基板１の製造方法について、詳説する。 (Example 4)
In this example, a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the fifth embodiment will be described in detail.
　図２７～２９は、本実施例に係る一体型タッチセンサー基板１の製造工程を示す図である。図２７～２９において、（ａ）は断面図であり、（ｂ）は平面図である。また、図２７～２９の（ｂ）に示す二点鎖線は、（ａ）の断面図の切断位置を表す。 27 to 29 are diagrams showing manufacturing steps of the integrated touch sensor substrate 1 according to the present embodiment. 27 to 29, (a) is a cross-sectional view, and (b) is a plan view. In addition, a two-dot chain line shown in (b) of FIGS. 27 to 29 represents a cutting position in the sectional view of (a).
　額縁部３の形成、ジャンパ配線４の形成、絶縁膜５および絶縁層１６の形成、透明電極７および８の形成は、実施例３の１．～３．および５．と同様であるので説明を省略する。金属配線６および表示膜層１２の形成は、実施例２と同様であるので説明を省略する。ただし、スリット１５の幅を３０μｍとした点で実施例２と異なる。 The formation of the frame portion 3, the formation of the jumper wiring 4, the formation of the insulating film 5 and the insulating layer 16, and the formation of the transparent electrodes 7 and 8 are as described in 1. ~ 3. And 5. Since it is the same as that of FIG. Since the formation of the metal wiring 6 and the display film layer 12 is the same as that of the second embodiment, the description thereof is omitted. However, the second embodiment differs from the second embodiment in that the width of the slit 15 is 30 μm.
　〈不透明層の形成〉
　図２７に透明電極７および８の形成まで行った形成物を示す。この形成物において、額縁部３と同様の材料でスリット１５を覆うようにインクジェット方式で不透明層１７を形成し、図２８に示す形成物を得た。 <Opaque layer formation>
FIG. 27 shows the formed product up to the formation of the transparent electrodes 7 and 8. In this formed product, the opaque layer 17 was formed by an ink jet method so as to cover the slit 15 with the same material as that of the frame portion 3, and the formed product shown in FIG. 28 was obtained.
　図２８に示す形成物の上に、実施例１と同様の方法で絶縁保護膜９を形成し、図２９に示す一体型タッチセンサー基板１を製造し完成させた。 28. The insulating protective film 9 was formed on the formed product shown in FIG. 28 by the same method as in Example 1, and the integrated touch sensor substrate 1 shown in FIG. 29 was manufactured and completed.
　本実施例では、スリット１５の幅が、実施例３より大きいが、不透明層１７によって、スリット１５がカバーガラス２の反対側から覆われているため、スリット１５を目立たなくすることができる。なお、不透明層１７の形成は、金属配線６および表示膜層１２の形成後、透明電極７および８の形成の前に行ってもよい。また、不透明層１７は、絶縁保護膜９の形成後、絶縁保護膜９上に形成してもよい。 In this embodiment, the width of the slit 15 is larger than that of the third embodiment, but the slit 15 can be made inconspicuous because the slit 15 is covered from the opposite side of the cover glass 2 by the opaque layer 17. The opaque layer 17 may be formed after the metal wiring 6 and the display film layer 12 are formed and before the transparent electrodes 7 and 8 are formed. The opaque layer 17 may be formed on the insulating protective film 9 after the insulating protective film 9 is formed.
　以上、本発明の実施形態、実施例を説明したが、本発明の一体型タッチセンサー基板は、その細部が上述した実施形態、実施例に限定されず、種々の変形が可能である。上述の実施形態では、表示装置として携帯電話を用いて説明したが、これらに限定されるわけではない。例えば、携帯情報端末、カーナビゲーションシステム、コンピュータ・ディスプレイ、またはタブレットテレビ、据え置きテレビ等の液晶テレビ、電子黒板など、周縁部にロゴマークが表示された表示装置にも応用することができる。すなわち一体型タッチセンサー基板のサイズは特に限定されない。またロゴマークおよびロゴマークを構成する金属配線、表示膜の大きさも、額縁部に収まる範囲であれば特に限定されない。またロゴマークの文字数についても限定されない。また、額縁部は、黒色に限らず、例えば表示装置のデザインに合わせ、白、赤、青、黄等の好適な色の材料を適宜選択して形成することができる。 Although the embodiments and examples of the present invention have been described above, the integrated touch sensor substrate of the present invention is not limited to the above-described embodiments and examples, and various modifications are possible. In the above-described embodiment, the mobile phone is used as the display device, but the present invention is not limited to this. For example, the present invention can also be applied to a display device in which a logo mark is displayed on the periphery, such as a portable information terminal, a car navigation system, a computer display, a liquid crystal television such as a tablet television and a stationary television, and an electronic blackboard. That is, the size of the integrated touch sensor substrate is not particularly limited. Further, the size of the logo mark, the metal wiring constituting the logo mark, and the size of the display film are not particularly limited as long as they are within the frame portion. Further, the number of characters of the logo mark is not limited. Further, the frame portion is not limited to black, and can be formed by appropriately selecting a material of a suitable color such as white, red, blue, or yellow according to the design of the display device, for example.
　また、上述した実施形態では、一体型タッチセンサー基板として投影型静電容量式タッチパネルを用いて説明したが、静電容量式に限定されるわけではなく、額縁部を有する種々の方式のタッチパネルに応用することができる。 In the above-described embodiment, the projected capacitive touch panel has been described as an integrated touch sensor substrate. However, the capacitive touch panel is not limited to the capacitive touch panel, and various types of touch panels having a frame portion may be used. Can be applied.
　本発明は、携帯電話機や、携帯情報端末などの電子機器用の位置入力装置として利用することができる。 The present invention can be used as a position input device for an electronic device such as a mobile phone or a portable information terminal.
　１　　一体型タッチセンサー基板
　２、１０２　　カバーガラス
　３、１０３　　額縁部
　４　　ジャンパ配線
　５　　絶縁膜
　６　　金属配線
　７、８　　透明電極
　９　　絶縁保護膜
　１０、１１０　　表示領域
　１１、１１１　　ロゴマーク表示部
　１２、１１２　　表示膜層
　１３、１１３　　マーク抜き部
　１４、１１４　　窓
　１５　　スリット
　１６　　絶縁層
　１７　　不透明層
　５０　　表示装置
　５１　　ケース
　５２　　操作ボタン DESCRIPTION OF SYMBOLS 1 Integrated touch sensor board | substrate 2,102 Cover glass 3,103 Frame part 4 Jumper wiring 5 Insulating film 6 Metal wiring 7, 8 Transparent electrode 9 Insulating protective film 10, 110 Display area 11, 111 Logo mark display part 12, 112 Display Film layer 13, 113 Mark removal part 14, 114 Window 15 Slit 16 Insulating layer 17 Opaque layer 50 Display device 51 Case 52 Operation button

Claims (11)

  1. 　前面板とタッチパネルセンサーとの一体型タッチセンサー基板であって、
    　透明な前面板と、
    　前記前面板の裏面の周縁部に形成され、所定の形状の表示領域を区画する額縁層と、
    　前記額縁層の所定の位置を、所定の形状で抜いて形成されたマーク抜き部と、
    　前記額縁層の裏面側に形成された金属配線と、
    　前記マーク抜き部の裏面側に形成された金属膜層と、
    　前記表示領域に形成され、前記金属配線と結線されるセンサー層とを備え、
    　前記金属配線と前記金属膜層とが同一の金属で形成されていることを特徴とする、一体型タッチセンサー基板。     An integrated touch sensor substrate with a front panel and a touch panel sensor,
    A transparent front plate,
    A frame layer that is formed at the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape;
    A mark removing portion formed by extracting a predetermined position of the frame layer in a predetermined shape;
    Metal wiring formed on the back side of the frame layer;
    A metal film layer formed on the back side of the mark removal part;
    A sensor layer formed in the display area and connected to the metal wiring;
    The integrated touch sensor substrate, wherein the metal wiring and the metal film layer are formed of the same metal.
  2. 　前記金属配線の一部は、前記金属膜層の一部が、スリットにより分離されることにより、形成されることを特徴とする、請求項１に記載の一体型タッチセンサー基板。 2. The integrated touch sensor substrate according to claim 1, wherein a part of the metal wiring is formed by separating a part of the metal film layer by a slit.
  3. 　前記スリットの間隔は２５μｍ以下であることを特徴とする、請求項２に記載の一体型タッチセンサー基板。 3. The integrated touch sensor substrate according to claim 2, wherein the interval between the slits is 25 μm or less.
  4. 　前記金属膜層の裏面に、前記スリットを覆う不透明層が形成されることを特徴とする、請求項２または３に記載の、一体型タッチセンサー基板。 4. The integrated touch sensor substrate according to claim 2, wherein an opaque layer covering the slit is formed on a back surface of the metal film layer.
  5. 　前記金属膜層の反射率が３０％以上であることを特徴とする、請求項１～４のいずれかに記載の、一体型タッチセンサー基板。 5. The integrated touch sensor substrate according to claim 1, wherein the reflectance of the metal film layer is 30% or more.
  6. 　表示装置であって、
    　複数の画素が行列状に配列された画素領域を有し、入力信号に基づいて前記画素領域に画像を表示する表示パネルと、
    　前記画素領域を覆うように取り付けられる、請求項１～５のいずれかに記載の一体型タッチセンサー基板とを備えることを特徴とする、表示装置。     A display device,
    A display panel having a pixel region in which a plurality of pixels are arranged in a matrix, and displaying an image in the pixel region based on an input signal;
    6. A display device comprising: the integrated touch sensor substrate according to claim 1 attached so as to cover the pixel region.
  7. 　透明な前面板と、
    　前記前面板の裏面の周縁部に形成され、所定の形状の表示領域を区画する額縁層と、
    　前記額縁層の所定の位置を、所定の形状で抜いて形成されたマーク抜き部と、
    　前記額縁層の裏面側に形成された金属配線と、
    　前記マーク抜き部の裏面側に形成された金属膜層と、
    　前記表示領域に形成され、前記金属配線と結線されるセンサー層とを備える前面板とタッチパネルセンサーとの一体型タッチセンサー基板の製造方法であって、
    　前記前面板の裏面に前記マーク抜き部を備える前記額縁層を形成する工程と、
    　前記金属配線を形成する工程と、
    　前記金属膜層を形成する工程と、
    　前記センサー層を形成する工程とを備え、
    　前記金属配線を形成する工程と前記金属膜層を形成する工程とを、同一の金属材料を用いて同一工程で行うことを特徴とする、一体型タッチセンサー基板の製造方法。     A transparent front plate,
    A frame layer that is formed at the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape;
    A mark removing portion formed by extracting a predetermined position of the frame layer in a predetermined shape;
    Metal wiring formed on the back side of the frame layer;
    A metal film layer formed on the back side of the mark removal part;
    A method for manufacturing an integrated touch sensor substrate of a front panel and a touch panel sensor, which is formed in the display area and includes a sensor layer connected to the metal wiring,
    Forming the frame layer comprising the mark removal part on the back surface of the front plate;
    Forming the metal wiring;
    Forming the metal film layer;
    Forming the sensor layer,
    A method for manufacturing an integrated touch sensor substrate, wherein the step of forming the metal wiring and the step of forming the metal film layer are performed in the same step using the same metal material.
  8. 　前記金属膜層を形成する工程において、前記金属膜層にスリットを設けて分離して形成することにより、当該金属膜層の少なくとも一部を前記金属配線の一部として形成することを特徴とする、請求項７に記載の一体型タッチセンサー基板の製造方法。 In the step of forming the metal film layer, at least a part of the metal film layer is formed as a part of the metal wiring by forming a slit in the metal film layer and separating it. A method for manufacturing an integrated touch sensor substrate according to claim 7.
  9. 　前記金属膜層を形成する工程において、前記スリットの間隔を２５μｍ以下とすることを特徴とする、請求項８に記載の一体型タッチセンサー基板の製造方法。 The method for manufacturing an integrated touch sensor substrate according to claim 8, wherein, in the step of forming the metal film layer, the interval between the slits is set to 25 µm or less.
  10. 　前記金属膜層を形成する工程より後に、前記金属膜層の前記スリットを覆う不透明層を形成する工程をさらに含むことを特徴とする、請求項８または９に記載の一体型タッチセンサー基板の製造方法。 The method of manufacturing an integrated touch sensor substrate according to claim 8, further comprising a step of forming an opaque layer that covers the slit of the metal film layer after the step of forming the metal film layer. Method.
  11. 　前記金属膜層を形成する工程において、前記金属膜層の材料として、反射率が３０％以上である材料を用いることを特徴とする、請求項７～１０のいずれかに記載の一体型タッチセンサー基板の製造方法。 11. The integrated touch sensor according to claim 7, wherein in the step of forming the metal film layer, a material having a reflectance of 30% or more is used as a material of the metal film layer. A method for manufacturing a substrate.
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TW201329808A (en) 2013-07-16

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