WO2013023487A1 - 带散热配光装置的车船用led照明灯 - Google Patents

带散热配光装置的车船用led照明灯 Download PDF

Info

Publication number
WO2013023487A1
WO2013023487A1 PCT/CN2012/077282 CN2012077282W WO2013023487A1 WO 2013023487 A1 WO2013023487 A1 WO 2013023487A1 CN 2012077282 W CN2012077282 W CN 2012077282W WO 2013023487 A1 WO2013023487 A1 WO 2013023487A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
lens
led
heat dissipation
light distribution
Prior art date
Application number
PCT/CN2012/077282
Other languages
English (en)
French (fr)
Inventor
黎昌兴
Original Assignee
Li Changxing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2011203054664U external-priority patent/CN202229131U/zh
Priority claimed from CN2011204475764U external-priority patent/CN202382134U/zh
Priority claimed from CN2011205600831U external-priority patent/CN202647225U/zh
Application filed by Li Changxing filed Critical Li Changxing
Publication of WO2013023487A1 publication Critical patent/WO2013023487A1/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • F21S41/147Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/28Cover glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/42Forced cooling
    • F21S45/43Forced cooling using gas
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/42Forced cooling
    • F21S45/46Forced cooling using liquid
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes

Definitions

  • the present invention relates to the field of LED lighting, and more particularly to a vehicle and boat LED lighting device with a heat dissipating light distribution device. Background technique
  • Vehicle and ship headlights are a kind of light source that requires very high illumination.
  • the current vehicle headlights are mainly tungsten incandescent lamps, and the working principle is realized by incandescent state illumination of tungsten wire up to 3000 °C. illumination.
  • the current luminous efficiency of tungsten-on-white incandescent headlamps for vehicles and ships is generally 13-201m/W, and the lighting efficiency is low;
  • LEDs have been favored by various countries because of their higher luminous efficiency (generally 120-1601 m/W) and more environmental protection and energy saving.
  • luminous efficiency generally 120-1601 m/W
  • tungsten lamps due to the low operating temperature requirements of LEDs, it is impossible to withstand high temperatures and difficult light distribution as tungsten lamps, which is extremely limited in the application of strong light sources for LEDs.
  • a first object of the embodiments of the present invention is to provide an LED lighting for a vehicle and a ship with a heat dissipating light distribution device, which has better heat dissipation, stronger moisture resistance, longer service life, and a low beam at the same time. And high beam lights.
  • a second object of the embodiments of the present invention is to provide an LED lighting for a vehicle and a ship with a heat dissipating light distribution device, which has better heat dissipation, stronger moisture resistance, longer service life, and can be used for a high beam lamp. .
  • a third object of the embodiments of the present invention is to provide a vehicle-mounted LED lighting device with a heat-dissipating light distribution device, which has better heat dissipation, stronger moisture resistance, and longer service life, and can be used for a low beam light.
  • the first type of LED lighting for vehicles and ships with a heat dissipating light distribution device includes: a curved light distribution mirror, a lens supporting structure, and a lens.
  • the lens supporting structure is connected to a front open end of the curved light distribution mirror, and the lens is fixed on the lens supporting structure
  • a main heat dissipation base is further disposed in the cavity of the curved lens.
  • a first circuit base is further fixed on a front end surface of the main heat dissipation base, and an LED that can be used for a high beam is fixed on the first circuit base, and the LED that can be used for the high beam is located On the optical axis of the lens,
  • a second circuit base is further fixed on a side of the main heat dissipation base, and an LED that can be used for a low beam lamp is fixed on the second circuit base, and the optical axis of the LED that can be used for the low beam lamp is The optical axis of the lens is perpendicular;
  • An isolation plate is further disposed in the cavity of the curved lens, the spacer separating the cavity formed by the curved lens, the lens supporting structure and the lens to form a first cavity and a second cavity that are not connected to each other. Cavity,
  • the first circuit base, the second circuit base and all of the LEDs are located in the first cavity, and the lens is located on the first cavity.
  • the main heat sink base portion is located in the second cavity body
  • a plurality of first through holes are disposed on the lens supporting structure, and a plurality of second through holes are further disposed on a rear end surface of the lens.
  • All of the first through holes and the second through holes are in communication with the second cavity.
  • the outer surface of the main heat dissipation base further extends: a plurality of heat dissipation fins,
  • Each of the heat dissipating fins is located in the second cavity.
  • a baffle is further disposed in the second cavity.
  • One end of the baffle is connected to the outer end of the heat dissipating fin, and the other end is connected to the lens supporting structure, and all the first through holes and the heat dissipating fins are located on the baffle and the separating plate. between.
  • a second circuit base is further fixed on a side of the main heat dissipation base, specifically:
  • a recessed platform is further disposed on a side of the main heat dissipation base.
  • the second circuit base is constrained within the recess and is flush with the main heat sink base.
  • the first circuit base, and/or the second circuit base respectively comprise: a metal substrate, an insulating substrate, a copper foil;
  • Each of the LEDs is an LED chip
  • Each of the LED chips is fixed on a top surface of the metal substrate, and an insulating layer on a bottom surface of each of the LED chips is in surface contact with the metal substrate on a bottom surface of the LED chip;
  • An electrode lead of each of the LED chips is soldered to the metal substrate on the bottom surface of the LED chip, and another electrode pin is electrically connected to the trace copper foil through each of the conductive leads;
  • the insulating substrate is laid on a top surface of the metal substrate except for a fixed position of the LED chip, and the trace copper foil is laid in the insulating substrate;
  • the metal substrate and the copper foil can be electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • the first circuit base protrudes from a side of the main heat dissipation base
  • a second type of LED lighting for a vehicle and a ship with a heat dissipating light distribution device includes: a curved light distribution mirror, a lens supporting structure, and a lens.
  • the lens supporting structure is coupled to a front open end of the curved light distribution mirror, and the lens is fixed on the lens supporting structure.
  • a main heat dissipation base is further disposed in the cavity of the curved light distribution mirror, and a circuit base is further fixed on the front end surface of the main heat dissipation base.
  • An LED that can be used for a high beam is fixed on the circuit base, and the LED that can be used for the high beam is located on the optical axis of the lens.
  • An isolation plate is further disposed in the cavity of the curved lens, and the isolation plate forms a first cavity and a second cavity that are not connected to each other in a cavity formed by the curved lens, the lens supporting structure and the lens.
  • the circuit base, and all the LEDs are located in the first cavity, the lens is located on the first cavity, and the main heat dissipation base is at least partially located in the second cavity.
  • a plurality of first through holes are disposed on the lens supporting structure, and a plurality of second through holes are further disposed on a rear end surface of the lens.
  • All of the first through holes and the second through holes are in communication with the second cavity.
  • a plurality of heat dissipating fins extend on an outer circumference of a side surface of the main heat dissipation base.
  • Each of the heat dissipating fins is located in the second cavity.
  • a baffle is further disposed in the second cavity.
  • One end of the baffle is connected to the outer end of the heat dissipating fin, and the other end is connected to the lens supporting structure, and all the first through holes and the heat dissipating fins are located on the baffle and the separating plate. between.
  • the circuit base comprises: a metal substrate, an insulating substrate, a trace copper foil;
  • Each of the LEDs is an LED chip.
  • Each of the LED chips is fixed on a top surface of the metal substrate, and an insulating layer on a bottom surface of each of the LED chips is in surface contact with the metal substrate on a bottom surface of the LED chip.
  • An electrode lead of each of the LED chips is soldered to the metal substrate on the bottom surface of the LED chip, and another electrode pin is electrically connected to the trace copper foil through each of the conductive leads;
  • the insulating substrate is laid on a top surface of the metal substrate except for a fixed position of the LED chip,
  • the blank alignment is laid in the blank insulation of the blank;
  • the metal substrate and the copper foil can be electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • a third aspect of a vehicle-mounted LED illumination lamp with a heat dissipating light distribution device includes a curved light distribution mirror, a lens support structure, and a lens.
  • the lens supporting structure is connected to a front open end of the curved light distribution mirror, and the lens is fixed on the lens supporting structure
  • a main heat dissipation base is further disposed in the cavity of the curved lens.
  • a circuit base is further fixed on a side of the main heat dissipation base, and an LED that can be used for a low beam lamp is fixed on the circuit base, and the optical axis of the LED that can be used for the low beam lamp and the lens The optical axis is vertical;
  • An isolation plate is further disposed in the cavity of the curved lens, the spacer separating the cavity formed by the curved lens, the lens supporting structure and the lens to form a first cavity and a second cavity Cavity,
  • the circuit base and all of the LEDs are located in the first cavity window, and the lens is located on the first cavity.
  • the main heat sink base portion is located in the second cavity body
  • a plurality of first through holes are disposed on the lens supporting structure, and a plurality of second through holes are further disposed on a rear end surface of the lens.
  • All of the first through holes and the second through holes are in communication with the second cavity.
  • the outer surface of the main heat dissipation base further extends: a plurality of heat dissipation fins,
  • Each of the heat dissipating fins is located in the second cavity.
  • a baffle is further disposed in the second cavity
  • One end of the baffle is connected to the outer end of the heat dissipating fin, and the other end is connected to the lens supporting structure, and all the first through holes and the heat dissipating fins are located on the baffle and the separating plate. between.
  • a circuit base is further fixed on a side of the main heat dissipation base, specifically:
  • a recessed platform is further disposed on a side of the main heat dissipation base.
  • the circuit base is constrained within the recess and is flush with the main heat sink base.
  • the circuit base comprises: a metal substrate, an insulating substrate, a copper foil;
  • Each of the LEDs is an LED chip
  • Each of the LED chips is fixed on a top surface of the metal substrate, and an insulating layer on a bottom surface of each of the LED chips is in surface contact with the metal substrate on a bottom surface of the LED chip.
  • One electrode pin of each of the LED chips is soldered to the metal substrate on the bottom surface of the LED chip, and the other electrode
  • the pole pins are electrically connected to the trace copper foil through the respective conductive leads;
  • the insulating substrate is laid on a top surface of the metal substrate except for a fixed position of the LED chip, and the trace copper foil is laid in the insulating substrate;
  • the metal substrate and the copper foil are electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • a light blocking plate is further fixed on the front end surface of the main heat dissipation base.
  • the light blocking plate protrudes from a side of the main heat dissipation base.
  • the heat generated during the working process of the high beam and the low beam LED is transmitted to the main heat dissipation base through the circuit base on the back side, and the main The heat dissipation pedestal is exposed in the second cavity, and the first through hole and the second through hole are respectively disposed at the front and rear ends of the second cavity, so that the first through hole, the second cavity, and the second through hole are circulated.
  • the fluid can carry heat from the main heat sink base to the outside, improving heat dissipation.
  • the LED illumination lamp When the LED illumination lamp is applied on a ship, when the LED illumination lamp of the embodiment is placed under water, the same can be used as a fluid to carry the heat on the main heat dissipation base to achieve rapid heat dissipation.
  • FIG. 1 is a schematic axial cross-sectional structural view of a vehicle-mounted LED illumination lamp with a low-beam light distribution and a low beam, which is provided with a low beam and a high beam;
  • FIG. 2 is a cross-sectional structural view of a first circuit base and/or a second circuit base provided by Embodiment 1 of the present invention
  • FIG. 3 is a schematic cross-sectional structural view of an LED lighting lamp for a vehicle and a ship that can be used in a high beam light-dissipating light distribution device according to Embodiment 2 of the present invention
  • FIG. 4 is a schematic cross-sectional structural view of an LED lighting lamp for a vehicle and a ship that can be used in a low beam light-dissipating light distribution device according to Embodiment 3 of the present invention.
  • the present embodiment provides a vehicle-mounted LED lighting device with a heat-dissipating light distribution device, in which a low beam light and a high beam light are commonly disposed.
  • the LED illumination lamp mainly comprises a curved light distribution mirror 101, a lens support structure 102, and a lens 103.
  • One of the lenses 103 should be selected according to different applications, such as but not limited to a ring lens.
  • the lens supporting structure 102 is connected to the front open end of the curved light distribution mirror 101, and the lens 103 is fixed on the lens supporting structure 102. At this time, the curved light distribution mirror 101, the lens supporting structure 102 and the lens 103 together form a cavity. In the present embodiment, it is referred to as a total cavity, that is, a combination of the cavities 110, 111 in the drawing.
  • a main heat dissipation base 104 is fixed in the total cavity, and the main heat dissipation base 104 may be, but not limited to, made of copper or aluminum or other metal base, and the rear end of the main heat dissipation base 104 is fixed at The rear end of the curved lens mirror 101 is sealingly connected to the rear end of the curved lens.
  • a first circuit base 105 is further fixed on the front end surface of the main heat dissipation base 104.
  • the first circuit base 105 is provided with a circuit structure, and the circuit structure thereof can be connected to an external external power supply circuit.
  • the first circuit base 105 can be a circuit structure such as a PCB circuit board which is widely used at present, or a novel preferred structure provided by the embodiment of the present invention (for details, see later).
  • the LED 106 (which may be a single high-power LED or an LED group) is fixed on the first circuit base 105.
  • the optical axis of the LED is parallel to the optical axis of the lens 103.
  • the LED 106 is in the LED illumination. It can be used as a high beam, and the optical axis of the LED 106 is overlapped with the optical axis of the curved lens 101 and the optical axis of the lens 103 as much as possible to obtain a good high beam light distribution effect.
  • a second circuit base 107 is further fixed on a side surface of the main heat dissipation base 104.
  • the second circuit base 107 is provided with a circuit structure, and the circuit structure thereof can be connected to an external external power supply circuit.
  • the two circuit pedestal 107 can be a PCB circuit board or other currently widely used, or a new preferred structure provided by the embodiment of the present invention.
  • An LED 108 is fixed to the first circuit base 105, and the optical axis of the LED 108 is orthogonal to the optical axis of the lens 103.
  • the LED 108 can be used as a low beam light in the LED illumination lamp.
  • An isolation plate 109 is further disposed in the total cavity, the isolation plate 109 isolating the total cavity into a first: non-connected first The cavity 110 and the second cavity 111.
  • Circuit components such as LEDs are located in the first cavity 110, and a lens 103 for transmitting light externally is located on the first cavity 110 as a part of the first cavity 110.
  • All or at least part of the main heat dissipation base 104 is located on the second cavity 111, and a plurality of first through holes 112 are disposed on the lens supporting structure 102, and a plurality of first holes are disposed on the rear end surface of the lens 103.
  • the second through holes 113, all the first through holes 112 on the lens supporting structure 102, and all the second through holes 113 on the rear end surface of the lens 103 are in communication with the second cavity 111.
  • the front and rear ends of the second cavity 111 communicate with the outside through the first through hole 112 and the second through hole 113, respectively, thereby forming a passage for the fluid to flow in the second cavity 111 to make a fluid such as air or water. It may flow into the second cavity 111 from the outside and flow from the other end of the second cavity 111 to the outside.
  • first cavity 110 and the second cavity 111 of the electronic component such as the first circuit base 105, the second circuit base 107, and the LED are not connected to each other, they are not connected to each other. Air or liquid or the like does not enter the first cavity 110, and the electronic components in the second cavity 111 can be prevented from being damp.
  • the heat generated during the working process of the high beam and the low beam LED can be transmitted to the main heat dissipation base 104 through the circuit base on the back side thereof.
  • the main heat dissipation pedestal 104 is exposed to the second cavity 111, and the first through hole 112 and the second through hole 113 are respectively disposed at the front and rear ends of the second cavity 111, so that the first through hole 112 flows through the first through hole 112.
  • the fluid of the second cavity 111 and the second through hole 113 can take the heat on the main heat dissipation base 104 out of the outside, which is beneficial to greatly improve the heat dissipation effect.
  • the air naturally enters from the first through hole 112 opposite to the traveling direction, and rapidly flows through the second cavity 111, in the second
  • the cavity 111 is in sufficient contact with the surface of the main heat dissipation base 104, and finally flows out from the outlet of the other end of the second cavity 111, and the heat on the main heat dissipation base 104 is led out to the outside.
  • the air will naturally enter and exit the second cavity 111 to achieve rapid heat dissipation.
  • the openings of the first through hole 112 and the second through hole 113 disposed on the lens supporting structure 102 and the curved light distribution mirror 101 can be set according to different application requirements.
  • the different apertures may be a plurality of through holes composed of a plurality of through holes or a through hole having a larger aperture.
  • the heat on the main heat dissipation base 104 can be taken out by using water as a fluid to achieve rapid heat dissipation.
  • a plurality of heat dissipation fins 1041 may be further disposed on the outer surface of the main heat dissipation base 104, and the heat dissipation fins 1041 and the main heat dissipation base 104 are integrally formed.
  • the design is extended from the main heat dissipation base 104 to protrude into the second cavity 111 to increase the main heat dissipation base 104 and the fluid such as air or water flowing therethrough.
  • the contact area further enhances the heat dissipation effect.
  • each baffle 115 can also be disposed in the second cavity 111, and each baffle 115 is used to guide the flow of fluid through the main heat dissipation base.
  • Each of the fins 1041 of the seat 104 ensures a contact area between the fluid and the main heat dissipation base 104, thereby further improving the heat dissipation effect.
  • one end of each baffle 115 can be connected to each of the fins 1041 on the main heat sink base 104, and the other end can be coupled to the lens support structure 102.
  • a recess 1042 is disposed on a side of the main heat dissipation base 104 to limit the second circuit base 107 to the recess 1042.
  • the use of the recess limit setting described above further facilitates the manufacturing process such as the illumination. Assembly, improve production efficiency; on the other hand, the application device is also beneficial to increase the contact area between the second circuit base 107 and the main heat dissipation base 104, thereby further improving the heat dissipation effect, and on the other hand, due to the limit setting It is beneficial to improve the stability of the assembly structure, avoid the problem of damage to the electronic components due to vibration during the vehicle and the ship, and even cause the device to fall off.
  • the inventors have found through long-term experiments that the first circuit base 105 and the second circuit base 107 can be widely used PCB boards or the like, and the following technical solutions can also be adopted:
  • the circuit base (which can be applied to the first circuit base 105 and/or the second circuit base 107) of the present embodiment mainly includes: a metal substrate 201, an insulating substrate 202, and a trace copper foil 204.
  • the insulating substrate 202 can be a PCB insulating substrate used in current circuit fabrication;
  • the metal substrate 201 can be a copper plate, an aluminum plate or other metal plates.
  • the connection relationship of each component is as follows:
  • the bottom surface of the metal substrate 201 is mounted on the surface of the main heat dissipation base 104 in surface contact with the main heat dissipation base 104.
  • Each of the LED chips 203 is fixed on the top surface of the metal substrate 201, and the insulating layer 2031 and the LED chip on the bottom surface of each LED chip 203.
  • the metal substrate 201 on the bottom surface of the 203 is in surface contact, and one electrode pin of each LED chip 203 is soldered to the metal substrate 201 on the bottom surface of the LED chip 203, and the other electrode pin is respectively laid in the insulating substrate 202 through the conductive leads.
  • the wiring copper foil 204 is electrically connected, and the insulating substrate 202 is laid on a top surface of the metal substrate 201 except for a fixed position of the LED wafer 203.
  • the metal substrate 201 and the wiring copper foil 204 can be electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • the working principle is that the external power supply circuit inputs DC power to the metal substrate 201 and the copper foil 204, respectively, and the LED chip 203 electrically connected between the metal substrate 201 and the copper foil 204 is in the current. Drive to work outside the light.
  • the LED chip 203 is directly fixed on the metal substrate 201 in face-to-face contact, and the insulating layer 2031 on the bottom surface of the LED chip 203 is directly in face-to-face contact with the metal substrate 201, and an electric charge of each LED chip 203
  • the pole pins are directly soldered to the metal substrate 201, and the other electrode pins of the LED chips 203 are electrically connected to the wiring copper foil 204 laid in the insulating substrate 202 by wire leads.
  • the metal substrate 201 and the trace copper foil 204 introduce DC power to each LED chip 203.
  • the heat generated during the operation of the LED chip 203 can be quickly transferred to the metal substrate 201 having good heat dissipation performance by face-to-face contact heat conduction, and the metal substrate 201 quickly transfers the heat on the LED chip 203 to the main heat dissipation base 104 by the main heat dissipation.
  • the pedestal 104 is further distributed.
  • the solid crystal technology of soldering the LED wafer 203 on the positive and negative trace copper foil 204 of the conventional PCT substrate is further advantageous for improving the heat dissipation effect by applying the technical solution.
  • the main heat dissipation base 104 acts as a polarity with the metal substrate 201 in addition to heat dissipation.
  • the technical solution of the embodiment is further beneficial for reducing the internal resistance of the LED illumination lamp, reducing the heat, and avoiding excessive heat generation of the conductor due to long-term use. , further extend the service life and stability.
  • the first circuit base 105 fixed to the front end surface of the main heat dissipation base 104 protrudes from the side of the LED for the low beam light to the main heat dissipation base 104, which is higher than the predetermined height of the main heat dissipation base 104, so that the main heat dissipation base
  • the seat 104 is flush with or above the top surface of the LEDs for the low beam on the second circuit base 107. Therefore, in addition to fixing the LED for the high beam, the first circuit base 105 further serves to block part of the light under the LED for the low beam, thereby avoiding the use of the low beam.
  • the range of illumination emitted by the LED is too high and affects the line of sight of the driver at the opposite end.
  • the present invention refers to the low beam, the high beam and the high beam of the LED headlamp for an automobile produced by the present embodiment with reference to the national LED headlamp standard GB25991-2010. Temperature The following test tests were performed.
  • the light distribution of the low beam lamp of the embodiment is tested, and is measured under a vertical plane light distribution screen 25 meters ahead of the quasi center of the headlight, and the test points on the light distribution screen are tested to obtain a table.
  • Table 1 Illumination value on the low beam light distribution screen
  • testing the light distribution of the high beam in the LED headlight of the embodiment measuring at a vertical plane light distribution screen 25 meters ahead of the quasi center of the headlight, and testing each test point on the light distribution screen.
  • the illuminance data on the light distribution screen shown in Table 2 is obtained.
  • Table 2 Illumination value table on the high beam light distribution screen The standard requires illuminance to measure illuminance. ⁇ Test point or domain w
  • the operating power of the LED low beam in the LED headlamp used in the test of this embodiment is: 20W;
  • the operating power for the LED high beam is 22W.
  • the power allowable value reaches 45W. It can be seen that the technical solution of the embodiment can be used to obtain the relative light distribution of the high beam and the low beam. There are standards that have great results.
  • test environment room temperature, and blasting the second cavity 111 at a wind speed of 2 m per second from the first through hole 112 located below the lens 103 to simulate the air flow during the traveling of the car;
  • the LED high beam lamp was continuously operated for 2 hours, and the temperature was measured on the surface of the main heat dissipation base 0.3 mm from the outer circumference of the LED chip by using an infrared temperature detector, and the measured temperature value was 50.2 ° C.
  • the temperature of the surface of the LED chip is 58.6 ° C;
  • the LED low beam lamp was continuously operated for 2 hours, and an infrared temperature detector was used to test the temperature on the surface of the main heat dissipation base 0.3 mm from the outer circumference of the LED chip, and the measured temperature value was 49.1 ° C in the low beam.
  • the LED strong light source can be realized in the LED vehicle and marine illumination lamp, and the specific application scene characteristics are: The vehicle or the ship naturally generates airflow or water flow while walking, and the naturally generated airflow is generated. Or the water flow through the heat dissipation base to achieve efficient heat dissipation, and the heat dissipation base can also be used as a common electrode of the DC power supply, which is advantageous for reducing internal resistance and reducing heat.
  • the technical solution of the embodiment of the present invention is applied and simultaneously solved. At present, it has troubled the heat dissipation problem and light distribution problem of LED application on vehicle and ship lighting.
  • the color temperature of the LED low beam and the LED high beam LED of the automobile headlight of the embodiment is 4000K (kelvin)
  • the embodiment provides an LED illumination lamp for a vehicle and a ship that can be used for a high beam, and the LED illumination lamp is provided with a heat dissipation device and a light distribution device.
  • the difference between the embodiment and the embodiment 1 mainly includes: only the high beam is disposed in the LED illumination lamp, which is suitable for the application of the high beam independent setting.
  • the LED lighting lamp for a vehicle and a ship of the present embodiment mainly includes: a curved light distribution mirror 301, a lens supporting structure 302, and a lens 304.
  • the lens support structure 302 is connected to the front open end of the curved light distribution mirror 301, and the lens 304 is fixed on the lens support structure 302. At this time, the curved light distribution mirror 301, the lens support structure 302 and the lens 304 together form a cavity. In the present embodiment, it is referred to as a total cavity.
  • a main heat dissipation base 304 is fixed in the total cavity, and the main heat dissipation base 304 may be, but not limited to, made of copper or aluminum or other metal base, and the rear end of the main heat dissipation base 304 is fixed at The rear end of the curved lens 301.
  • a circuit base 305 is further fixed on the front end surface of the main heat dissipation base 304.
  • the circuit base 305 is provided with a circuit structure, and the circuit structure thereof can be connected to an external external power supply circuit.
  • the circuit base 305 The PCB circuit board or other currently widely used can be used, and the new preferred structure provided in Embodiment 1 can be used. The advantageous effects of the preferred design can be found in the analysis of the embodiment 1.
  • An LED 306 is fixed on the circuit base 305.
  • the optical axis of the LED 306 is parallel to the optical axis of the lens 304.
  • the LED 306 is used as a high beam in the LED illumination lamp, and the optical axis and the surface of the LED 306 are made as far as possible.
  • the optical axis of the lens 301 and the optical axis of the lens 304 are overlapped as much as possible to achieve a good high beam light distribution effect.
  • a spacer 308 is also disposed within the total cavity, the spacer 308 isolating the total cavity into a first cavity 310 and a second cavity 311 that are not in communication.
  • circuit components such as the circuit base 305, the LED for the high beam, and the like are all located in the first cavity 310, and the lens 304 for transmitting the external light is also located on the first cavity 310 as a composition. A portion of the first cavity 310.
  • All or at least part of the main heat dissipation base 304 is located on the second cavity 311, and a plurality of first through holes 312 are disposed on the lens supporting structure 302, and a plurality of first holes 312 are disposed on the rear end surface of the lens 304.
  • the second through hole 313, all the first through holes 312 on the lens supporting structure 302, and all the second through holes 313 on the rear end surface of the lens 304 are in communication with the second cavity 311, so that the front and rear of the second cavity 311
  • the ends communicate with the outside through the first through holes 312 and the second through holes 313, respectively, so that a fluid passage can be formed in the second cavity 311, so that fluid such as air or water can flow into the second cavity 311 from the outside, and The second cavity 311 flows to the outside.
  • first cavity 310 and the second cavity 311 which are mounted with the circuit base 305 and the electronic components such as LEDs, are independent of each other and do not communicate with each other, air or liquid or the like cannot enter the first cavity 310, and The moisture of the electronic components in the second cavity 311 is affected to affect its normal operation.
  • the circuit board 305, the electronic components such as the LEDs, and the like are both the front end faces of the main heat sink base 304, when the spacers 308 are disposed, only the facing areas of the lenses 304 are located as far as possible.
  • the small space is the second cavity 311, and all of the main heat dissipation base 304 except the front end surface thereof are exposed in the first cavity 310, on the lens support structure 302 on the outer circumference of the lens 304, and the curved light distribution mirror.
  • the first through hole 312 and the second through hole 313 are respectively disposed on the back surface, so that the fluid flowing through the first cavity 310 can flow through the periphery of the main heat dissipation base 304 through the first through hole 312 and the second through hole 313. , improve the heat dissipation effect.
  • the heat dissipating fins 3041 may be disposed outside the main heat dissipation base 304 to increase the contact area between the fluid and the main heat dissipation base 304, thereby improving the heat dissipation effect.
  • the main heat dissipation effect may be
  • the heat dissipating susceptor 304 extends the heat dissipating fins 3041 in a circle to fully improve the heat dissipating effect and electrical stability, reduce the internal resistance, and reduce the heat generation of the LED lighting device.
  • the baffle 315 may be disposed in the second cavity 311 to guide the flow direction of the flowing fluid to make more or all of the wings of the main heat dissipation base 304.
  • the sheet 3041 ensures the contact area of the fluid with the main heat dissipation base 304 to further improve the heat dissipation effect.
  • first cavity 310 is located at the front end of the lens 304 and the second cavity 311 is located at the rear end of the curved lens 301, the rear end of the curved lens is disposed.
  • a structure in which a plurality of first through holes 313 are formed on the end surface as shown in FIG. 3 or a rear end having a full opening may be used, and the latter design further facilitates fluid circulation and material saving, and simplifies the structure. .
  • the embodiment provides an LED lighting for a vehicle and a ship that can be used for a low beam, and the LED lighting device is provided with a heat dissipating device.
  • Embodiment 1 The difference between this embodiment and Embodiment 1 mainly includes:
  • the LED lighting lamp for a vehicle and a ship of the present embodiment mainly includes: a curved light distribution mirror 401, a lens supporting structure 402, and a lens 403.
  • One of them should be an optional lens 103, such as, but not limited to, an annular lens 103, depending on the application.
  • the lens support structure 402 is connected to the front open end of the curved light distribution mirror 401, and the lens 403 is fixed on the lens support structure 402. At this time, the curved light distribution mirror 401, the lens support structure 402 and the lens 403 together form a cavity. In the example, it is recorded as the total cavity.
  • a main heat dissipation base 404 is fixed in the total cavity, and the main heat dissipation base 404 may be made of copper or aluminum or the like.
  • the metal base is made of a rear end of the main heat dissipation base 404 fixed to the rear end of the curved light distribution mirror 401.
  • a circuit base 407 is further fixed on a side surface of the main heat dissipation base 404.
  • the circuit base 407 is provided with a circuit structure, and the circuit structure thereof can be connected to an external external power supply circuit.
  • the PCB circuit board or the like which is widely used at present may be used, and the novel preferred structure provided in Embodiment 1 may be employed. The advantageous effects of the preferred design are shown in the analysis of the embodiment 1.
  • An LED 408 is fixed to the circuit base 407.
  • the optical axis of the LED 408 is orthogonal to the optical axis of the lens 403.
  • the LED 408 is used as a low beam in the LED illumination lamp.
  • a spacer 408 is also disposed within the total cavity, the spacer 408 isolating the total cavity into a first cavity 410 and a second cavity 411 that are not in communication.
  • circuit components such as the circuit base 407, the LED for the high beam, and the like are all located in the first cavity 410, and the lens 403 for transmitting the external light is also located on the first cavity 410 as a composition. A portion of the first cavity 410.
  • a portion of the main heat dissipation base 404 is located on the second cavity 411, and a plurality of first through holes 412 and a second pass are respectively disposed at the lens support structure 402 and the rear end of the lens 403 which are not on the same side as the low beam light.
  • the hole 413, the first through hole 412, and the second through hole 413 are all in communication with the second cavity 411.
  • the front and rear ends of the second cavity 411 communicate with the outside through the first through hole 412 and the second through hole 413, respectively, so that a fluid passage can be formed in the second cavity 411, so that fluid such as air or water can flow from the outside.
  • the second cavity 411 is advanced, and flows from the second cavity 411 to the outside.
  • first cavity 410 and the second cavity 411 which are mounted with the circuit base 407 and the electronic components such as LEDs, are independent of each other and do not communicate with each other, air or liquid or the like cannot enter the first cavity 410, and The moisture of the electronic components in the second cavity 411 is affected to affect its normal operation.
  • heat dissipating fins 4041 may be disposed on the semi-circumferential side of the main heat sink base 404 opposite to the low beam to further increase the fluid and the main heat sink base.
  • the contact area of the seat 404 improves the heat dissipation effect and does not affect the illumination of the low beam.
  • the baffle 115 may be disposed in the second cavity 411 to guide the flow direction of the flowing fluid to make more or all of the wings of the main heat dissipation base 404.
  • the sheet 4041 ensures the contact area of the fluid with the main heat dissipation base 404 to further improve the heat dissipation effect.
  • a light blocking plate 405 is disposed on the front end surface of the main heat dissipation base 404 of the embodiment, and the light blocking plate 405 extends from the side of the LED for the low beam light to the main heat dissipation base 404, which is higher than the predetermined height of the main heat dissipation base 404.
  • Main cooling base 404 is used for The top surface of the LED of the low beam is flat or higher than its height.
  • the light blocking plate 405 blocks part of the light under the LED for the low beam, thereby avoiding the problem that the illumination range of the LED emission for the low beam is too high and affecting the driver's line of sight of the opposite end.
  • Applying the technical solution of the embodiment further facilitates the illumination adjustment of the LED illumination lamp during the production or detection process, so that the adjustment of the current technology is difficult to adjust quickly and conveniently by merely adjusting the height of the light barrier 405.
  • the illumination of the low beam ensures that the light of the product meets the requirements of the customer or the requirements of the standard.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种带散热配光装置的车船用LED照明灯,其包括曲面配光镜(101)、透镜支持结构(102)、透镜(103)。透镜支持结构(102)连接在曲面配光镜(101)的前端,透镜(103)固定在透镜支持结构(102)上。曲面配光镜(101)的腔体内设置有主散热基座(104)和隔离板(109),主散热基座(104)的前端和侧面分别固定有用于远光灯的LED(106)和用于近光灯的LED(108),隔离板(109)将曲面配光镜(101)、透镜支持结构(102)以及透镜(103)构成的腔体间隔形成互不相通的第一腔体(110)和第二腔体(111)。用于远光灯的LED(106)和用于近光灯的LED(108)、以及透镜(103)均位于第一腔体(110)内,主散热基座(104)部分位于第二腔体(111)内。在透镜支持结构(102)上设置有多个第一通孔(112),在曲面配光镜(101)的后端面上设置有多个第二通孔(113),所有的第一通孔(112)和第二通孔(1133)均与第二腔体(111)连通。该车船用LED照明灯利用流经第一通孔(112)和第二通孔(113)的空气或水实现快速散热。

Description

带散热配光装置的车船用 LED照明灯 技术领域
[0001] 本发明涉及 LED照明领域, 尤其涉及一种带散热配光装置的车船用 LED照明灯。 背景技术
[0002] 车船用前照灯为对照明要求非常高的一种光源, 目前的车船用前照灯主要为钨丝白 炽灯, 其工作原理为通过钨丝高达 3000°C的白炽状态发光而实现照明。
[0003] 本发明人在进行本发明的研究过程中发现, 目前的车船用钨丝白炽前照灯在应用过 程中存在以下的缺陷:
1、 目前的车船用钨丝白炽前照灯的发光效率一般为 13-201m/W, 照明效率较低;
2、 目前的车船用钨丝白炽前照灯的寿命较低, 其应用寿命一般仅 3-10个月不等。
[0004] 近年来随着 LED技术的发展, LED 由于其发光效率更高 (一般达到 120- 1601m/W) , 更加环保节能的优点而备受各国的青睐。 但是由于 LED的工作温度要求较低而 不可能如钨丝灯一样耐受高温以及难以实现的良好配光, 故在 LED的强光源应用上受到极 大的限制。
[0005] 在本发明人近几个年参加的一些大型 LED科学会议上获悉, 目前有些 LED照明专家 仍然认为对照明强度极高且体积受限的车船用前照灯中应用 LED是不可能实现的散热以及 配光两大技术难题。
发明内容
[0006] 本发明实施例第一目的在于: 提供一种带散热配光装置的车船用 LED照明灯, 其散 热性更佳, 防潮能力更强, 使用寿命更长, 并可同时具备近光灯以及远光灯。
[0007] 本发明实施例第二目的在于: 提供一种带散热配光装置的车船用 LED照明灯, 其散 热性更佳且, 防潮能力更强, 使用寿命更长, 其可用于远光灯。
[0008] 本发明实施例第三目的在于: 提供一种带散热配光装置的车船用 LED照明灯, 其散 热性更佳, 防潮能力更强, 使用寿命更长, 其可用于近光灯。
[0009] 本发明实施例提供的第一种带散热配光装置的车船用 LED照明灯, 包括: 曲面配光 镜、 透镜支持结构、 透镜,
其中, 所述透镜支持结构连接在所述曲面配光镜的前开口端, 所述透镜固定在所述透镜支持 结构上,
在所述曲面配光镜的腔体内还设置有主散热基座, 在所述主散热基座的前端面还固定有第一电路基座, 在所述第一电路基座上固定有可用于远 光灯的 LED, 所述可用于远光灯的 LED位于所述透镜的光轴上,
在所述主散热基座的侧面还固定有第二电路基座, 在所述第二电路基座上固定有可用于近光 灯的 LED, 所述可用于近光灯的 LED的光轴与所述透镜的光轴垂直;
在所述曲面配光镜的腔体内还设置有隔离板, 所述隔离板将所述曲面配光镜、 透镜支持结构 以及透镜构成的腔体间隔形成互不相通的第一腔体、 第二腔体,
所述第一电路基座、 第二电路基座以及所有 LED均位于所述第一腔体内, 所述透镜位于所 述第一腔体上,
所述主散热基座部分位于所述第二腔体内,
在所述透镜支持结构上设置有复数个第一通孔, 在所述透镜的后端面上还设置有复数个第二 通孔,
所有所述第一通孔、 第二通孔均与所述第二腔体连通。
[0010] 可选地, 在所述主散热基座外表面还延伸有: 复数个散热翅片,
各所述散热翅片均位于所述第二腔体内。
[0011] 可选地, 在所述第二腔体内还设置有导流板,
所述导流板的一端与所述散热翅片的外端部连接, 另一端与所述透镜支持结构连接, 所有所述第一通孔、 散热翅片均位于所述导流板与隔离板之间。
[0012] 可选地, 在所述主散热基座的侧面还固定有第二电路基座, 具体是:
在所述主散热基座的侧面还设置有凹台,
所述第二电路基座限位在所述凹台内, 与所述主散热基座相平。
[0013] 可选地, 所述第一电路基座、 和 /或第二电路基座分别包括: 金属基板、 绝缘基材、 走线铜箔;
各所述 LED分别为 LED晶片,
各所述 LED晶片固定在所述金属基板的顶面, 各所述 LED晶片底面的绝缘层与本所述 LED 晶片底面的所述金属基板面接触;
各所述 LED晶片的一电极引脚分别焊接于本所述 LED晶片底面的所述金属基板上, 另一电 极引脚分别通过各所述导电引线与所述走线铜箔电连接;
其中, 所述绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区域, 所 述走线铜箔铺设在所述绝缘基材内;
所述金属基板、 走线铜箔可分别与外供电电路的正极、 负极分别电连接。 [0014] 可选地, 所述第一电路基座突出于所述主散热基座的侧面,
并且, 与所述第二电路基座上可用于近光的 LED顶面相平, 或者高于所述可用于近光的 LED顶面预定的高度。
[0015] 本发明实施例提供的第二种带散热配光装置的车船用 LED照明灯, 包括: 曲面配光 镜、 透镜支持结构、 透镜,
其中所述透镜支持结构连接在所述曲面配光镜的前开口端, 所述透镜固定在所述透镜支持结 构上,
在所述曲面配光镜的腔体内还设置有主散热基座, 在所述主散热基座的前端面还固定有电路 基座,
在所述电路基座上固定有可用于远光灯的 LED, 所述可用于远光灯的 LED位于所述透镜的 光轴上,
在所述曲面配光镜的腔体内还设置有隔离板, 所述隔离板将曲面配光镜、 透镜支持结构以及 透镜构成的腔体内间隔形成互不相通的第一腔体、 第二腔体,
所述电路基座、 以及所有 LED均位于所述第一腔体内, 所述透镜位于所述第一腔体上, 所述主散热基座至少部分位于所述第二腔体内,
在所述透镜支持结构上设置有复数个第一通孔, 在所述透镜的后端面上还设置有复数个第二 通孔,
所有所述第一通孔、 第二通孔均与所述第二腔体连通。
[0016] 可选地, 在所述主散热基座的侧面外周还延伸有: 复数个散热翅片,
各所述散热翅片均位于所述第二腔体内。
[0017] 可选地, 在所述第二腔体内还设置有导流板,
所述导流板的一端与所述散热翅片的外端部连接, 另一端与所述透镜支持结构连接, 所有所述第一通孔、 散热翅片均位于所述导流板与隔离板之间。
[0018] 可选地, 所述电路基座包括: 金属基板、 绝缘基材、 走线铜箔;
各所述 LED为 LED晶片,
各所述 LED晶片固定在所述金属基板的顶面, 各所述 LED晶片底面的绝缘层与本所述 LED 晶片底面的所述金属基板面接触,
各所述 LED晶片的一电极引脚分别焊接于本所述 LED晶片底面的所述金属基板上, 另一电 极引脚分别通过各所述导电引线与所述走线铜箔电连接;
其中, 所述绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区域, 所 坯定线锏消铺设在所坯绝緣¾衬内;
所述金属基板、 走线铜箔可分别与外供电电路的正极、 负极分别电连接。
[0019] 本发明实施例提供的第三种带散热配光装置的车船用 LED照明灯, 包括曲面配光 镜、 透镜支持结构、 透镜,
其中, 所述透镜支持结构连接在所述曲面配光镜的前开口端, 所述透镜固定在所述透镜支持 结构上,
在所述曲面配光镜的腔体内还设置有主散热基座,
在所述主散热基座的侧面还固定有电路基座, 在所述电路基座上固定有可用于近光灯的 LED, 所述可用于近光灯的 LED的光轴与所述透镜的光轴垂直;
在所述曲面配光镜的腔体内还设置有隔离板, 所述隔离板将所述曲面配光镜、 透镜支持结构 以及透镜构成的腔体间隔形成胡不相通的第一腔体、 第二腔体,
所述电路基座以及所有所述 LED均位于所述第一腔体内窗, 所述透镜位于所述第一腔体 上,
所述主散热基座部分位于所述第二腔体内,
在所述透镜支持结构上设置有复数个第一通孔, 在所述透镜的后端面上还设置有复数个第二 通孔,
所有所述第一通孔、 第二通孔均与所述第二腔体连通。
[0020] 可选地, 在所述主散热基座外表面还延伸有: 复数个散热翅片,
各所述散热翅片均位于所述第二腔体内。
[0021] 可选地, 在所述第二腔体内还设置有导流板,
所述导流板的一端与所述散热翅片的外端部连接, 另一端与所述透镜支持结构连接, 所有所述第一通孔、 散热翅片均位于所述导流板与隔离板之间。
[0022] 可选地, 在所述主散热基座的侧面还固定有电路基座, 具体是:
在所述主散热基座的侧面还设置有凹台,
所述电路基座限位在所述凹台内, 与所述主散热基座相平。
[0023] 可选地, 所述电路基座包括: 金属基板、 绝缘基材、 走线铜箔;
各所述 LED分别为 LED晶片,
各所述 LED晶片固定在所述金属基板的顶面, 各所述 LED晶片底面的绝缘层与本所述 LED 晶片底面的所述金属基板面接触,
各所述 LED晶片的一电极引脚分别焊接于本所述 LED晶片底面的所述金属基板上, 另一电 极引脚分别通过各所述导电引线与所述走线铜箔电连接;
其中, 所述绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区域, 所 述走线铜箔铺设在所述绝缘基材内;
所述金属基板、 走线铜箔可分别与所述外供电电路的正极、 负极分别电连接。
[0024] 可选地, 在所述主散热基座的前端面上还固定有挡光板,
所述挡光板突出于所述主散热基座的侧面,
并且, 与所述电路基座上可用于近光的 LED顶面相平, 或者高于所述可用于近光的 LED顶 面预定的高度
由上可见, 应用本发明实施例的技术方案, 在应用过程中, 远光灯以及近光灯的 LED工作 过程中产生的热量通过其背面的电路基座传递至主散热基座上, 而主散热基座露在第二腔 体, 而由于在第二腔体的前后端分别设置有第一通孔、 第二通孔, 故流通经过第一通孔、 第 二腔体、 第二通孔的流体可以将主散热基座上的热量带出外部, 而提高散热效果。
[0025] 特别地, 对于车船用 LED照明灯而言, 在车船前进过程中, 空气、 流体进方向相反 地从第一通孔处进入, 快速经过第二腔体, 在第二腔体内与主散热基座的表面充分接触并快 速流动上的热量导出外部。 同理, 在车船退后过程中, 空气也会自然进入第二腔体, 实现快 速散热。
[0026] 在轮船上应用本 LED照明灯时, 将本实施例的 LED照明灯置于水下时候, 同理可以 利用水作为流体将主散热基座上的热量带出, 实现快速散热。
[0027] 其功率以及照明质量具体可以参见实施例 1中的试验数据。
[0028] 附图说明
此处所说明的附图用来提供对本发明的进一步理解, 构成本申请的一部分, 并不构成对本发 明的不当限定, 在附图中:
图 1为本发明实施例 1提供的一种配置有近光灯以及远光灯的带散热配光的车船用 LED照 明灯的轴向剖面结构示意图;
图 2为本发明实施例 1提供的一种可应用于第一电路基座和 /或第二电路基座的剖视结构示 意图;
图 3为本发明实施例 2提供的一种可用于远光灯带散热配光装置的车船用 LED照明灯的轴 向剖面结构示意图;
图 4为本发明实施例 3提供的一种可用于近光灯带散热配光装置的车船用 LED照明灯的轴 向剖面结构示意图。 [0029] 具体实施方式
下面将结合附图以及具体实施例来详细说明本发明, 在此本发明的示意性实施例以及说明用 来解释本发明, 但并不作为对本发明的限定。
[0030] 实施例 1 :
请参考图 1。
[0031] 本实施例提供了一种带散热配光装置的车船用 LED照明灯, 在该 LED照明灯中共同 配置有近光灯以及远光灯。
[0032] 本 LED照明灯主要包括曲面配光镜 101、 透镜支持结构 102、 透镜 103。
[0033] 其中一应该根据不同的应用场合选用不用的透镜 103, 譬如但不限于为环带透镜
103 ο
[0034] , 透镜支持结构 102连接在曲面配光镜 101的前开口端, 透镜 103固定在透镜支持 结构 102上, 此时曲面配光镜 101、 透镜支持结构 102以及透镜 103共同构成一腔体, 在本 实施例中记为总腔体, 即图中腔体 110、 111的结合。
[0035] 在该总腔体内固定有主散热基座 104, 该主散热基座 104可以但不限于由铜或者铝或 者其他的金属基座制成, 该主散热基座 104的后端固定在曲面配光镜 101的后端上, 与曲面 透镜的后端密封连接。
[0036] 在主散热基座 104的前端面上还固定有第一电路基座 105, 该第一电路基座 105上的 设置有电路结构, 其电路结构可与外接的外供电电路连接, 该第一电路基座 105可以为目前 广泛使用的 PCB电路板等电路结构, 或者本发明实施例提供的一种新型优选结构 (具体描 述见后)。
[0037] 在第一电路基座 105上固定有 LED106 (其可以为单个大功率 LED也可以为: LED 群), 该 LED的光轴与透镜 103的光轴平行, 该 LED106在本 LED照明灯中可以作为远光 灯使用, 尽量使该 LED106的光轴与曲面配光镜 101的光轴、 透镜 103的光轴重叠, 以取得 较好的远光配光效果。
[0038] 在主散热基座 104的侧面上还固定有第二电路基座 107, 该第二电路基座 107上的设 置有电路结构, 其电路结构可与外接的外供电电路连接, 该第二电路基座 107可以为目前广 泛使用的 PCB电路板或者其他, 或者本发明实施例提供的一种新型优选结构。
[0039] 在第一电路基座 105上固定有 LED 108, 该 LED 108的光轴与透镜 103的光轴正 交, 该 LED 108在本 LED照明灯中可以作为近光灯使用。
[0040] 在总腔体内还设置有隔离板 109, 该隔离板 109将总腔体隔离成成:不相连通的第一 腔体 110、 第二腔体 111。
[0041] 其中, 第一电路基座 105、 第二电路基座 107、 用于远光灯的 LED以及用于近光灯的
LED等电路部件均位于第一腔体 110内, 用于对外透射光线的透镜 103位于所述第一腔体 110上, 作为构成第一腔体 110的一部分。
[0042] 主散热基座 104的全部或者至少部分位于第二腔体 111上, 并且在透镜支持结构 102 上设置有复数个第一通孔 112, 在透镜 103的后端面上还设置有复数个第二通孔 113, 透镜 支持结构 102上的所有第一通孔 112、 透镜 103的后端面上的所有第二通孔 113均与第二腔 体 111连通。 这样, 第二腔体 111的前后端分别通过这些第一通孔 112、 第二通孔 113与外 连通, 从而在第二腔体 111内形成可供流体流动的通道, 使空气或者水等流体可由外部流进 第二腔体 111, 并且从第二腔体 111的另一端部流到外部。
[0043] 在本实施例中, 由于安装有第一电路基座 105、 第二电路基座 107以及 LED等电子 元件的第一腔体 110与第二腔体 111相互独立而互不连通, 故空气或者液体等并不能进入第 一腔体 110, 能保证第二腔体 111内的电子元件不会受潮。
[0044] 由上可见, 采用本发明实施例技术方案, 在应用过程中, 远光灯以及近光灯的 LED 工作过程中产生的热量可通过其背面的电路基座传递至主散热基座 104上, 而主散热基座 104露在第二腔体 111, 而由于在第二腔体 111的前后端分别设置有第一通孔 112、 第二通孔 113 , 故流经第一通孔 112、 第二腔体 111、 第二通孔 113的流体可以将主散热基座 104上的 热量带出外部, 有利于大大提高散热效果。
[0045] 特别地, 对于车船用 LED照明灯而言, 在车船前进过程中, 空气自然与行进方向相 反地, 从第一通孔 112处进入, 快速流经第二腔体 111, 在第二腔体 111内与主散热基座 104的表面充分接触, 最后从第二腔体 111另一端部的出口流出, 将主散热基座 104上的热 量导出外部。 同理, 在车船退后过程中, 空气也会自然进出第二腔体 111, 实现快速散热。
[0046] 需要说明的是, 在本实施例中, 设置在透镜支持结构 102以及曲面配光镜 101上的 第一通孔 112、 第二通孔 113的开孔可以根据不同的应用需求设定不同的孔径, 其可以为复 数个通孔组成的通孔群也可以为一个孔径较大的通孔。
[0047] 在轮船上应用本 LED照明灯时, 将本实施例的 LED照明灯置于水下时候, 同理可以 利用水作为流体将主散热基座 104上的热量带出, 实现快速散热。
[0048] 在本实施例中, 为了进一步提高主散热基座 104, 还可以进一步在主散热基座 104外 表面设置多个散热翅片 1041, 这些散热翅片 1041与主散热基座 104—体化设计, 由主散热 基座 104上延伸突出在第二腔体 111内, 以增加主散热基座 104与流经的空气或者水等流体 的接触面积, 进一步提高散热效果。
[0049] 进一步地, 本发明人经过长期的试验发现, 还可以在第二腔体 111内设置导流板 115, 各导流板 115用于引导流体流经方向, 使流体流经主散热基座 104的各翅片 1041, 保 证流体与主散热基座 104的接触面积, 进一步提高散热效果。 在导流板位置可以使各导流板 115的一端与主散热基座 104上的各翅片 1041连接, 另一端与透镜支持结构 102连接。
[0050] 另外, 本发明人经过长期的试验发现, 第二电路基座 107在主散热基座 104表面的 装配可以采用以下的技术方案:
在主散热基座 104的侧面设置有凹台 1042, 使第二电路基座 107限位在凹台 1042内; 应用上述的该凹台限位设置, 一方面进一步方便本照明等制造过程中的装配, 提高生产效 率; 另一方面, 应用器还有利于增大第二电路基座 107与主散热基座 104之间的接触面积, 进一步提高散热效果, 再一方面, 由于该限位设置还有利于提高装配结构的稳固性, 避免车 船过程中由于振动而损害电子器件甚至导致器件脱落的问题。
[0051] 另外, 本发明人经过长期的试验发现, 上述的第一电路基座 105、 第二电路基座 107 可以为目前广泛使用的 PCB电路板或者其他, 也可以采用以下的技术方案:
请参考图 2, 本实施例的电路基座 (可应用于第一电路基座 105和 /或第二电路基座 107 ) 主 要包括: 金属基板 201、 绝缘基材 202、 走线铜箔 204。
[0052] 其中该绝缘基材 202可以为目前电路制备中使用的 PCB绝缘基材; 该金属基板 201 可以为铜板、 铝板或者其他的金属板。 各部件的连接关系如下:
金属基板 201的底面与主散热基座 104面接触地安装在主散热基座 104表面, 各 LED晶片 203分别固定在金属基板 201的顶面, 各 LED晶片 203底面的绝缘层 2031与本 LED晶片 203底面的金属基板 201面接触, 各 LED晶片 203的一电极引脚分别焊接于本 LED晶片 203底面的金属基板 201上, 另一电极引脚分别通过各导电引线与铺设在绝缘基材 202内的 走线铜箔 204电连接, 所述绝缘基材 202铺设在所述金属基板 201的顶面、 除 LED晶片 203固定位置外的区域。 金属基板 201、 走线铜箔 204可分别与外供电电路的正极、 负极分 别电连接。
[0053] 其工作原理是, 外供电电路分别向金属基板 201、 走线铜箔 204输入直流电源, 而电 连接在金属基板 201以及走线铜箔 204之间的 LED晶片 203在该引入电流的驱动下工作对 外发光。
[0054] 在上述的技术方案中, LED晶片 203直接面对面接触地固定在金属基板 201上, LED晶片 203底面的绝缘层 2031直接与金属基板 201面对面接触, 各 LED晶片 203的一电 极引脚直接焊接在金属基板 201上, 各 LED晶片 203的另一电极引脚通过导线引线与铺设 在绝缘基材 202内的走线铜箔 204电连接。
[0055] 在应用时, 金属基板 201以及走线铜箔 204为各 LED晶片 203引入直流工作电源,
LED晶片 203工作过程中产生的热量可通过面对面接触热传导而快速传递到散热性能良好 的金属基板 201上, 金属基板 201将 LED晶片 203上的热量快速传递到主散热基座 104 上, 由主散热基座 104进一步散发。
[0056] 相对于现有技术在常规的 PCT基板的正负极走线铜箔 204上焊接 LED晶片 203的固 晶技术方案, 应用本技术方案进一步有利于提高散热效果。
[0057] 另外, 由于本实施例的金属基板 201与主散热基座 104紧密面对面接触连接, 在 LED晶片 203工作过程中, 主散热基座 104除了散热之外, 还作为与金属基板 201极性相 同的导体应用, 由于主散热基座 104的体积较大, 故应用本实施例技术方案还进一步有利于 降低 LED照明灯的内阻, 降低热量, 避免导体由于长期使用而发热过大而烧坏, 进一步延 长使用寿命以及稳定性。
[0058] 将本实施例的 LED照明灯应用于摩托车、 汽车、 轮船等时, 本实施例为了进一步优 化其配光光照效果, 还进行了以下的优化设计:
使固定在主散热基座 104前端面的第一电路基座 105往用于近光灯的 LED所在侧面伸出主 散热基座 104, 高出主散热基座 104预定的高度, 使主散热基座 104与第二电路基座 107上 用于近光灯的 LED的顶面持平或者高于这些 LED顶面一定的高度。 从而使该第一电路基座 105在应用上除了用于固定用于远光灯的 LED之外, 还进一步兼用于挡住用于近光灯的 LED下方的部分光线, 从而避免用于近光灯的 LED发射的光照范围过高而影响对端开来的 司机的视线的问题。
[0059] 应用本实施例技术方案进一步方便在生产或者检测过程中对 LED照明灯的光照调 整, 使仅通过调整第一电路基座 105的高度的便利的方式而快速简便地调整目前技术中较难 调整的近光灯的光照, 保证产品的光线符合客户的要求或者标准的要求。
[0060] 申请人作为照明行业浸泡数十年的发明人知晓, 在现有技术中摩托车、 汽车、 轮船 等车用照明灯应用 LED的难题主要在于散热以及配光、 调光困难、 成本较高的问题, 而本 发明人克服了现有技术中仅限于通过调整 LED的安装位置而实现调光的高成本以及难操作 方式, 而巧妙通过调光板实现调光易于实施且成本较低的方式而解决的现有技术的难题。
[0061] 为了进一步说明本发明的效果, 本发明参照根据国家汽车用 LED前照灯标准 《GB25991-2010》, 对采用本实施例制成的汽车用 LED前照灯的近光、 远光以及温度进行 了以下的试验测试。
[0062] 首先测试本实施例近光灯的配光性, 在距离前照灯准中心前 25米的垂直平面配光屏 幕下测量, 对该配光屏幕上的各测试点进行测试, 得到表一所示在配光屏幕上的照度数据。 各测试点、 区的位置参见 《GB25991-2010》 中的配光屏幕图。
[0063] 表一: 近光的配光屏幕上的照度值
Figure imgf000012_0001
然后, 测试本实施例 LED前照灯中远光灯的配光性, 在距离前照灯准中心前 25米的垂直平 面配光屏幕下测量, 对该配光屏幕上的各测试点进行测试, 得到表二所示在配光屏幕上的照 度数据。 各测试点、 区的位置参见 《GB25991-2010》 中的配光屏幕图。
[0064] 表二: 远光的配光屏幕上的照度值表 标准要求照度 实测照度. ^ 测试点或 域 w
(单位: l x) (单位- lx) ^
>4S且< 240 ^
HV点、 >0. 80E 88-
HV点至 1125L和 >24 38- m点至 2250L和 .' 6.-: 9. 说明: 表一、 二所示对照数据是在以下条件下测得:
测试时的功率: 用于本实施例测试用的 LED前照灯中的 LED近光灯的工作功率为: 20W; 用于 LED远光灯的工作功率为: 22W。 而其目前标准达标要求的 LED前照灯照度值达到上 述要求时, 其功率允许值达 45W, 可见, 应用本实施例技术方案, 可以在远光灯以及近光 灯的配光方面取得相对现有标准大大优良的效果。
[0065] 测试环境: 室温, 并且从位于透镜 103下方的第一通孔 112处以风速每秒 2m向第二 腔体 111中鼓风, 以模拟在汽车行进过程中的气流;
在上述测试环境中, 使 LED远光灯连续工作 2小时, 采用红外温度检测仪, 在离 LED晶片 外周 0.3mm处的主散热基座表面测试温度, 测得温度值为 50.2°C , 在远光灯 LED晶片表 面的温度为 58.6°C;
在上述测试环境中, 使 LED近光灯连续工作 2小时, 采用红外温度检测仪, 在离 LED晶片 外周 0.3mm的主散热基座表面测试温度, 测得温度值为 49.1°C , 在近光灯 LED晶片表面 测得温度值为 55.6 C
[0066] 综上, 采用本实施例技术方案, 可以在 LED车船用照明灯中实现 LED强光源, 针对 其特定的应用场景特征: 车船在行走时自然产生气流或者水流, 通过该自然产生的气流或水 流贯穿流通散热基座, 实现高效散热, 并且该散热基座还可以作为一直流供电电源的共同电 极使用, 有利于降低内阻, 降低热量, 总之, 应用本发明实施例技术方案, 同时解决了目前 困扰 LED在车船照明灯上应用的散热问题以及配光问题。
[0067] 本实施例的汽车前照灯的 LED近光灯、 LED远光灯 LED的色温为 4000K(kelvin)
[0068] 实施例 2:
请参见图 3
[0069] 本实施例提供一种可用于远光灯的车船用 LED照明灯, 其 LED照明灯配置有散热装 置以及配光装置。 [0070] 本实施例与实施例 1所不同之处主要包括: 在本 LED照明灯中仅设置有远光灯, 其 适用于远光灯独立设置的应用。
[0071] 本实施例的车船用 LED照明灯主要包括: 曲面配光镜 301、 透镜支持结构 302、 透镜 304
[0072】 其中透镜支持结构 302连接在曲面配光镜 301的前开口端, 透镜 304固定在透镜支 持结构 302上, 此时曲面配光镜 301、 透镜支持结构 302以及透镜 304共同构成一腔体, 在 本实施例中记为总腔体。
[0073】 在该总腔体内固定有主散热基座 304, 该主散热基座 304可以但不限于由铜或者铝或 者其他的金属基座制成, 该主散热基座 304的后端固定在曲面配光镜 301的后端上。
[0074】 在主散热基座 304的前端面上还固定有电路基座 305, 该电路基座 305上的设置有电 路结构, 其电路结构可与外接的外供电电路连接, 该电路基座 305既可以采用目前广泛使用 的 PCB电路板或者其他, 也可以采用实施例 1提供的新型优选结构, 采用优选设计的有益 效果见实施例 1中的分析记载。
[0075] 在该电路基座 305上固定有 LED306, 该 LED306的光轴与透镜 304的光轴平行, 该 LED306在本 LED照明灯中作为远光灯使用, 尽量使该 LED306的光轴与曲面配光镜 301的 光轴、 透镜 304的光轴尽量重叠, 以取得较好的远光配光效果。
[0076] 在总腔体内还设置有隔离板 308, 该隔离板 308将总腔体隔离成不相连通的第一腔体 310、 第二腔体 311。
[0077] 其中诸如电路基座 305、 用于远光灯的 LED等电路部件均位于第一腔体 310内, 用 于对外透射光线的透镜 304也位于所述第一腔体 310上, 作为构成第一腔体 310的一部分。
[0078] 主散热基座 304的全部或至少部分位于第二腔体 311上, 并且在透镜支持结构 302上 设置有复数个第一通孔 312, 在透镜 304的后端面上还设置有复数个第二通孔 313, 透镜支 持结构 302上的所有第一通孔 312、 透镜 304的后端面上的所有第二通孔 313均与第二腔体 311连通, 这样, 第二腔体 311的前后端分别通过这些第一通孔 312、 第二通孔 313与外连 通, 从而在第二腔体 311内可形成流体通道, 使得空气或者水等流体可由外部流进第二腔体 311, 并且从第二腔体 311流到外部。
[0079] 而由于安装有电路基座 305以及 LED等电子元件的第一腔体 310与第二腔体 311相 互独立而互不连通, 故空气或者液体等并不能进入第一腔体 310, 而使第二腔体 311内的电 子元件的受潮而影响其正常工作。
[0080] 本实施例的工作原理以及有益效果与实施例 1同理。 [0081] 在本实施例中, 由于第电路基座 305、 LED等电子元件等均主散热基座 304的前端 面, 故在进行隔离板 308设置时, 仅将位于透镜 304正对区域的尽量小空间间隔为第二腔体 311 , 而使主散热基座 304除其前端面外的全部均露在第一腔体 310内, 在透镜 304外周的 透镜支持结构 302上以及曲光配光镜的背面分别设置第一通孔 312、 第二通孔 313, 从而使 得通过第一通孔 312、 第二通孔 313使得流经第一腔体 310的流体可以流过主散热基座 304 的四周, 提高散热效果。
[0082] 另外, 与实施例同理, 还可以在主散热基座 304外设置散热翅片 3041, 以提高流体 与主散热基座 304的接触面积, 从而提高散热效果, 优选地, 可以在主散热基座 304的四周 一圈均延伸散热翅片 3041, 以充分提高散热效果和电性稳定性以及降低内阻, 降低 LED照 明设备的发热量。
[0083] 与实施例 1同理, 还可以在第二腔体 311内设置导流板 315, 从而引导流进的流体的 流动方向, 使其更多或者全部经过主散热基座 304的各翅片 3041, 保证流体与主散热基座 304的接触面积, 进一步提高散热效果。
[0084] 需要说明的是, 在本实施例中, 由于第一腔体 310均位于透镜 304的前端, 第二腔 体 311位于曲面配光镜 301的后端, 故曲面配光镜的后端可以如图 3所示地在端面上形成有 多个第一通孔 313的结构, 也可以其后端为全开口的端部, 采用后一设计进一步有利于流体 的流通以及节省材料, 简化结构。
[0085] 实施例 3 :
请参见图 4。
[0086] 本实施例提供一种可用于近光灯的车船用 LED照明灯, 其 LED照明灯配置有散热装 置。
[0087] 本实施例与实施例 1所不同之处主要包括:
在本 LED照明灯中仅设置有近光灯, 其适用于近光灯独立设置的应用。
[0088] 本实施例的车船用 LED照明灯主要包括: 曲面配光镜 401、 透镜支持结构 402、 透镜 403
[0089] 其中其中一应该根据不同的应用场合选用不用的透镜 103, 譬如但不限于为环带透镜 103。 透镜支持结构 402连接在曲面配光镜 401的前开口端, 透镜 403固定在透镜支持结构 402上, 此时曲面配光镜 401、 透镜支持结构 402以及透镜 403共同构成一腔体, 在本实施 例中记为总腔体。
[0090] 在该总腔体内固定有主散热基座 404, 该主散热基座 404可以由铜或者铝或者其他的 金属基座制成, 该主散热基座 404的后端固定在曲面配光镜 401的后端上。
[0091] 在主散热基座 404的侧面上还固定有电路基座 407, 该电路基座 407上的设置有电路 结构, 其电路结构可与外接的外供电电路连接, 该电路基座 407既可以采用目前广泛使用的 PCB电路板或者其他, 也可以采用实施例 1提供的新型优选结构, 采用优选设计的有益效果 见实施例 1中的分析记载。
[0092] 在该电路基座 407上固定有 LED408 , 该 LED408的光轴与透镜 403的光轴正交, 该 LED408在本 LED照明灯中作为近光灯使用。
[0093] 在总腔体内还设置有隔离板 408, 该隔离板 408将总腔体隔离成不相连通的第一腔体 410、 第二腔体 411。
[0094] 其中诸如电路基座 407、 用于远光灯的 LED等电路部件均位于第一腔体 410内, 用 于对外透射光线的透镜 403也位于所述第一腔体 410上, 作为构成第一腔体 410的一部分。
[0095] 主散热基座 404的部分位于第二腔体 411上, 并且与近光灯不在同一侧的透镜支持结 构 402以及透镜 403的后端分别设置复数个第一通孔 412、 第二通孔 413, 第一通孔 412、 第二通孔 413均与第二腔体 411连通。 这样, 第二腔体 411的前后端分别通过这些第一通孔 412、 第二通孔 413与外连通, 从而在第二腔体 411内可形成流体通道, 使空气或者水等流 体可由外部流进第二腔体 411, 并且从第二腔体 411流到外部。
[0096] 而由于安装有电路基座 407以及 LED等电子元件的第一腔体 410与第二腔体 411相 互独立而互不连通, 故空气或者液体等并不能进入第一腔体 410, 而使第二腔体 411内的电 子元件的受潮而影响其正常工作。
[0097] 本实施例的工作原理以及有益效果与实施例 1同理。
[0098] 在本实施例中, 参见图 4所示的结构, 可以在主散热基座 404上与近光灯相背的半 周侧面上设置散热翅片 4041, 以进一步加大流体与主散热基座 404的接触面积, 提高散热 效果, 且不影响近光灯的光照。
[0099] 与实施例 1同理, 还可以在第二腔体 411内设置导流板 115, 从而引导流进的流体的 流动方向, 使其更多或者全部经过主散热基座 404的各翅片 4041, 保证流体与主散热基座 404的接触面积, 进一步提高散热效果。
[0100] 在本实施例中, 将本实施例的 LED照明灯应用于摩托车、 汽车、 轮船等时, 本实施 例为了进一步优化其配光光照效果, 还进行了以下的优化设计:
在本实施例的主散热基座 404前端面设置一挡光板 405, 挡光板 405往用于近光灯的 LED 所在侧面伸出主散热基座 404, 高出主散热基座 404预定的高度, 使主散热基座 404与用于 近光灯的 LED的顶面持平或者高于其一定的高度。 SP : 使该挡光板 405挡住用于近光灯的 LED下方的部分光线, 从而避免用于近光灯的 LED发射的光照范围过高而影响对端开来的 司机的视线的问题。
[0101] 应用本实施例技术方案进一步方便在生产或者检测过程中对 LED照明灯的光照调 整, 使仅通过调整挡光板 405的高度的便利的方式而快速简便地调整目前技术中较难调整的 近光灯的光照, 保证产品的光线符合客户的要求或者标准的要求。
[0102] 申请人作为照明行业浸泡数十年的发明人知晓, 在现有技术中摩托车、 汽车、 轮船 等车用照明灯应用 LED的难题主要在于散热以及配光、 调光困难、 成本较高的问题, 而本 发明人克服了现有技术中仅限于通过调整 LED的安装位置而实现调光的高成本以及难操作 方式, 而巧妙通过调光板实现调光易于实施且成本较低的方式而解决的现有技术的难题。
[0103] 以上对本发明实施例所提供的技术方案进行了详细介绍, 本文中应用了具体个例对 本发明实施例的原理以及实施方式进行了阐述, 以上实施例的说明只适用于帮助理解本发明 实施例的原理; 同时, 对于本领域的一般技术人员, 依据本发明实施例, 在具体实施方式以 及应用范围上均会有改变之处, 综上所述, 本说明书内容不应理解为对本发明的限制。

Claims

1、 一种带散热配光装置的车船用 LED 照明灯, 包括: 曲面配光镜、 透 镜支持结构、 透镜,
其中, 所述透镜支持结构连接在所述曲面配光镜的前开口端, 所述透镜 固定在所述透镜支持结构上, 其特征是,
在所述曲面配光镜的腔体内还设置有主散热基座,
在所述主散热基座的前端面还固定有第一电路基座, 在所述第一电路基 座上固定有可用于远光灯的 LED,所述可用于远光灯的 LED位于所述透镜的 光轴上,
在所述主散热基座的侧面还固定有第二电路基座, 在所述第二电路基座 上固定有可用于近光灯的 LED,所述可用于近光灯的 LED的光轴与所述透镜 的光轴垂直;
在所述曲面配光镜的腔体内还设置有隔离板, 所述隔离板将所述曲面配 光镜、 透镜支持结构以及透镜构成的腔体间隔形成互不相通的第一腔体、 第 二腔体,
所述第一电路基座、第二电路基座以及所有 LED均位于所述第一腔体内, 所述透镜位于所述第一腔体上,
所述主散热基座部分位于所述第二腔体内,
在所述透镜支持结构上设置有复数个第一通孔, 在所述透镜的后端面上 还设置有复数个第二通孔,
所有所述第一通孔、 第二通孔均与所述第二腔体连通。
2、 根据权利要求 1所述的带散热配光装置的车船用 LED照明灯, 其特 征是:
在所述主散热基座的侧面还固定有第二电路基座, 具体是:
在所述主散热基座的侧面还设置有凹台, 所述第二电路基座限位在所述凹台内, 与所述主散热基座相平。
3、 根据权利要求 1或 2所述的带散热配光装置的车船用 LED照明灯, 其特征是,
所述第一电路基座、 和 /或第二电路基座分别包括: 金属基板、 绝缘基材、 走线铜箔;
各所述 LED分别为 LED晶片 ,
各所述 LED晶片固定在所述金属基板的顶面,各所述 LED晶片底面的绝 缘层与本所述 LED晶片底面的所述金属基板面接触; 各所述 LED晶片的一电极引脚分别焊接于本所述 LED晶片底面的所述金 属基板上, 另一电极引脚分别通过各所述导电引线与所述走线铜箔电连接; 其中, 所述绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定 位置外的区域, 所述走线铜箔铺设在所述绝缘基材内; 所述金属基板、 走线铜箔可分别与外供电电路的正极、 负极分别电连接。
4、 根据权利要求 1或 2所述的带散热配光装置的车船用 LED照明灯, 其特征是,
所述第一电路基座突出于所述主散热基座的侧面,
并且, 与所述第二电路基座上可用于近光的 LED顶面相平, 或者高于所 述可用于近光的 LED顶面预定的高度。
5、 根据权利要求 1或 2所述的带散热配光装置的车船用 LED照明灯, 其特征是,
在所述主散热基座外表面还延伸有: 复数个散热翅片,
各所述散热翅片均位于所述第二腔体内。
6、 根据权利要求 5所述的带散热配光装置的车船用 LED照明灯, 其特 征是,
在所述第二腔体内还设置有导流板, 所述导流板的一端与所述散热翅片的外端部连接, 另一端与所述透镜支 持结构连接,
所有所述第一通孔、 散热翅片均位于所述导流板与隔离板之间。
7、 一种带散热配光装置的车船用 LED 照明灯, 其特征是, 包括: 曲面 配光镜、 透镜支持结构、 透镜,
其中所述透镜支持结构连接在所述曲面配光镜的前开口端, 所述透镜固 定在所述透镜支持结构上, 其特征是, 在所述曲面配光镜的腔体内还设置有主散热基座, 在所述主散热基座的 前端面还固定有电路基座,
在所述电路基座上固定有可用于远光灯的 LED, 所述可用于远光灯的 LED位于所述透镜的光轴上,
在所述曲面配光镜的腔体内还设置有隔离板, 所述隔离板将曲面配光镜、 透镜支持结构以及透镜构成的腔体内间隔形成互不相通的第一腔体、 第二腔 体,
所述电路基座、 以及所有 LED均位于所述第一腔体内, 所述透镜位于所 述第一腔体上, 所述主散热基座至少部分位于所述第二腔体内, 在所述透镜支持结构上设置有复数个第一通孔, 在所述透镜的后端面上 还设置有复数个第二通孔,
所有所述第一通孔、 第二通孔均与所述第二腔体连通。
8、 根据权利要求 7所述的带散热配光装置的车船用 LED照明灯, 其特 征是, 所述电路基座包括: 金属基板、 绝缘基材、 走线铜箔; 各所述 LED为 LED晶片 ,
各所述 LED晶片固定在所述金属基板的顶面,各所述 LED晶片底面的绝 缘层与本所述 LED晶片底面的所述金属基板面接触, 各所述 LED晶片的一电极引脚分别焊接于本所述 LED晶片底面的所述金 属基板上, 另一电极引脚分别通过各所述导电引线与所述走线铜箔电连接; 其中, 所述绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定 位置外的区域, 所述走线铜箔铺设在所述绝缘基材内; 所述金属基板、 走线铜箔可分别与外供电电路的正极、 负极分别电连接。
9、 根据权利要求 7所述的带散热配光装置的车船用 LED照明灯, 其特 征是,
在所述主散热基座的侧面外周还延伸有: 复数个散热翅片,
各所述散热翅片均位于所述第二腔体内。
10、 根据权利要求 9所述的带散热配光装置的车船用 LED照明灯, 其特 征是,
在所述第二腔体内还设置有导流板, 所述导流板的一端与所述散热翅片的外端部连接, 另一端与所述透镜支 持结构连接,
所有所述第一通孔、 散热翅片均位于所述导流板与隔离板之间。
11、 一种带散热配光装置的车船用 LED照明灯, 其特征是, 包括曲面配 光镜、 透镜支持结构、 透镜,
其中, 所述透镜支持结构连接在所述曲面配光镜的前开口端, 所述透镜 固定在所述透镜支持结构上, 其特征是, 在所述曲面配光镜的腔体内还设置有主散热基座, 在所述主散热基座的侧面还固定有电路基座, 在所述电路基座上固定有 可用于近光灯的 LED,所述可用于近光灯的 LED的光轴与所述透镜的光轴垂 直;
在所述曲面配光镜的腔体内还设置有隔离板, 所述隔离板将所述曲面配 光镜、 透镜支持结构以及透镜构成的腔体间隔形成胡不相通的第一腔体、 第 二腔体,
所述电路基座以及所有所述 LED均位于所述第一腔体内窗, 所述透镜位 于所述第一腔体上,
所述主散热基座部分位于所述第二腔体内, 在所述透镜支持结构上设置有复数个第一通孔, 在所述透镜的后端面上 还设置有复数个第二通孔,
所有所述第一通孔、 第二通孔均与所述第二腔体连通。
12、根据权利要求 11所述的带散热配光装置的车船用 LED照明灯,其特 征是,
在所述主散热基座的侧面还固定有电路基座, 具体是:
在所述主散热基座的侧面还设置有凹台,
所述电路基座限位在所述凹台内, 与所述主散热基座相平。
13、根据权利要求 11或 12所述的带散热配光装置的车船用 LED照明灯, 其特征是,
所述电路基座包括: 金属基板、 绝缘基材、 走线铜箔; 各所述 LED分别为 LED晶片 ,
各所述 LED晶片固定在所述金属基板的顶面,各所述 LED晶片底面的绝 缘层与本所述 LED晶片底面的所述金属基板面接触, 各所述 LED晶片的一电极引脚分别焊接于本所述 LED晶片底面的所述金 属基板上, 另一电极引脚分别通过各所述导电引线与所述走线铜箔电连接; 其中, 所述绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定 位置外的区域, 所述走线铜箔铺设在所述绝缘基材内; 所述金属基板、 走线铜箔可分别与所述外供电电路的正极、 负极分别电 连接。
14、根据权利要求 11或 12所述的带散热配光装置的车船用 LED照明灯, 其特征是,
在所述主散热基座的前端面上还固定有挡光板,
所述挡光板突出于所述主散热基座的侧面,
并且, 与所述电路基座上可用于近光的 LED顶面相平, 或者高于所述可 用于近光的 LED顶面预定的高度。
15、根据权利要求 11所述的带散热配光装置的车船用 LED照明灯,其特 征是,
在所述主散热基座外表面还延伸有: 复数个散热翅片,
各所述散热翅片均位于所述第二腔体内。
16、 根据权利要求 15所述的带散热配光装置的车船用 LED照明灯, 其 特征是,
在所述第二腔体内还设置有导流板, 所述导流板的一端与所述散热翅片的外端部连接, 另一端与所述透镜支 持结构连接,
所有所述第一通孔、 散热翅片均位于所述导流板与隔离板之间。
PCT/CN2012/077282 2011-08-12 2012-06-21 带散热配光装置的车船用led照明灯 WO2013023487A1 (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
CN2011203054664U CN202229131U (zh) 2011-03-16 2011-08-12 Led强光源流体巡回散热装置
CN2011203054683U CN202158545U (zh) 2011-03-16 2011-08-12 流体疏导接纳装置及led强光源流体巡回散热装置
CN201120305468.3 2011-08-12
CN201120305466.4 2011-08-12
CN2011204475764U CN202382134U (zh) 2011-11-14 2011-11-14 适用于车船前照灯用led光源
CN201120447576.4 2011-11-14
CN2011205600831U CN202647225U (zh) 2011-12-28 2011-12-28 Led光源
CN201120560083.1 2011-12-28
CN2011205593363U CN202382140U (zh) 2011-03-16 2011-12-28 带散热配光装置的车船用led照明灯
CN201120559336.3 2011-12-28

Publications (1)

Publication Number Publication Date
WO2013023487A1 true WO2013023487A1 (zh) 2013-02-21

Family

ID=47714733

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2012/077283 WO2013023488A1 (zh) 2011-08-12 2012-06-21 Led光源
PCT/CN2012/077282 WO2013023487A1 (zh) 2011-08-12 2012-06-21 带散热配光装置的车船用led照明灯

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/077283 WO2013023488A1 (zh) 2011-08-12 2012-06-21 Led光源

Country Status (4)

Country Link
US (1) US8936378B2 (zh)
EP (1) EP2743566A4 (zh)
JP (1) JP5802887B2 (zh)
WO (2) WO2013023488A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6343812B2 (ja) * 2014-01-27 2018-06-20 上海三思▲電▼子工程有限公司Shanghai Sansi Electronic Engineering Co.,Ltd. コーティング式立体構造回路の製造方法、回路パネルを有しないled電球ランプおよび電子部品、led照明装置
MX2017003983A (es) * 2014-09-24 2017-12-14 Truck Lite Co Llc Faro delantero con subconjunto de lente reflector.
US10180246B2 (en) 2016-10-31 2019-01-15 Honeywell International Inc. LED searchlight and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329033B2 (en) * 2005-10-25 2008-02-12 Visteon Global Technologies, Inc. Convectively cooled headlamp assembly
CN201615422U (zh) * 2009-12-07 2010-10-27 林智勇 汽车无影灯
CN101936494A (zh) * 2010-09-28 2011-01-05 南通恺誉照明科技有限公司 Led汽车大灯
JP2011071039A (ja) * 2009-09-28 2011-04-07 Toyoda Gosei Co Ltd 照明装置
CN102095148A (zh) * 2010-12-14 2011-06-15 孟强 电动汽车led大灯
CN102494292A (zh) * 2011-03-16 2012-06-13 黎昌兴 带散热配光装置的车船用led照明灯

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337293U (zh) * 1976-09-06 1978-04-01
JPH0545811U (ja) * 1991-11-15 1993-06-18 株式会社小糸製作所 車輌用標識灯
FR2698055B1 (fr) * 1992-11-18 1995-02-03 Peugeot Bloc optique ventilé, notamment pour véhicule automobile.
JPH07209764A (ja) * 1994-01-18 1995-08-11 Nikon Corp 光源装置
US6945672B2 (en) 2002-08-30 2005-09-20 Gelcore Llc LED planar light source and low-profile headlight constructed therewith
JP4102240B2 (ja) 2003-04-08 2008-06-18 株式会社小糸製作所 車両用前照灯
CN2761964Y (zh) 2004-12-16 2006-03-01 谢庆云 一种带散热器的led照具
US7275848B2 (en) * 2005-02-16 2007-10-02 Visteon Global Technologies, Inc. Headlamp assembly having cooling channel
JP4697951B2 (ja) * 2005-08-22 2011-06-08 スタンレー電気株式会社 車両用テールランプ
US7478932B2 (en) * 2005-11-29 2009-01-20 Visteon Global Technologies, Inc. Headlamp assembly having cooling channel
US7427152B2 (en) * 2005-12-05 2008-09-23 Visteon Global Technologies, Inc. Headlamp assembly with integrated housing and heat sink
CN200940816Y (zh) 2006-03-28 2007-08-29 钟李杏枝 灯具的散热装置
JP4582803B2 (ja) * 2006-03-31 2010-11-17 スタンレー電気株式会社 車両用灯具
JP2008041558A (ja) 2006-08-09 2008-02-21 Ichikoh Ind Ltd 車両用前照灯
FR2913751A1 (fr) * 2007-03-15 2008-09-19 Valeo Vision Sa Dispositif d'eclairage et/ou de signalisation pour vehicule automobile comprenant une paroi externe pourvue d'une zone d'eclairage thermique.
CN101368714A (zh) 2007-08-16 2009-02-18 大亿交通工业制造股份有限公司 Led车灯散热装置
EP2263039A1 (en) * 2008-04-03 2010-12-22 Koninklijke Philips Electronics N.V. Improved white light-emitting device
CN201382351Y (zh) 2009-04-07 2010-01-13 吉林东光瑞宝车灯有限责任公司 反射式汽车前照灯
JP5473535B2 (ja) * 2009-10-28 2014-04-16 三菱電機株式会社 光源装置
CN102410483B (zh) 2011-11-14 2013-06-12 黎昌兴 适用于车船照明灯具led光源

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329033B2 (en) * 2005-10-25 2008-02-12 Visteon Global Technologies, Inc. Convectively cooled headlamp assembly
JP2011071039A (ja) * 2009-09-28 2011-04-07 Toyoda Gosei Co Ltd 照明装置
CN201615422U (zh) * 2009-12-07 2010-10-27 林智勇 汽车无影灯
CN101936494A (zh) * 2010-09-28 2011-01-05 南通恺誉照明科技有限公司 Led汽车大灯
CN102095148A (zh) * 2010-12-14 2011-06-15 孟强 电动汽车led大灯
CN102494292A (zh) * 2011-03-16 2012-06-13 黎昌兴 带散热配光装置的车船用led照明灯

Also Published As

Publication number Publication date
US8936378B2 (en) 2015-01-20
EP2743566A1 (en) 2014-06-18
US20140211468A1 (en) 2014-07-31
JP2014522092A (ja) 2014-08-28
EP2743566A4 (en) 2015-08-12
JP5802887B2 (ja) 2015-11-04
WO2013023488A1 (zh) 2013-02-21

Similar Documents

Publication Publication Date Title
CN202382140U (zh) 带散热配光装置的车船用led照明灯
KR20210008810A (ko) 램프
WO2016008213A1 (zh) Led汽车灯及其制造方法、汽车大灯总成
WO2013023487A1 (zh) 带散热配光装置的车船用led照明灯
US11754253B2 (en) Heat dissipating structure for automotive LED headlight
CN204648056U (zh) 一种led汽车灯
JP3215782U (ja) 車両用led灯具
CN102410483B (zh) 适用于车船照明灯具led光源
US20150292725A1 (en) Lighting device
CN208139169U (zh) 一种led车灯
CN207935976U (zh) 一种新型聚光的led车灯
CN105423217A (zh) H4 led汽车大灯
CN107314323A (zh) Led汽车前照灯
CN100507349C (zh) 大功率led路灯
CN207880727U (zh) 一种散热效果好的汽车前照灯
CN205824830U (zh) 一种汽车前照灯
CN201166348Y (zh) 高散热性led照明装置
CN220269209U (zh) 一种用于替代氙气灯的led车灯
CN217235487U (zh) 一种新型led车灯
CN204404018U (zh) 一种自行车前灯
CN205048323U (zh) 一种双面出光薄片式led汽车大灯
CN215892226U (zh) 一种led车灯光源模组
CN108397745A (zh) 一种led车灯
CN215908991U (zh) 一种设有透镜的d系列led汽车大灯
CN217273911U (zh) 一种led汽车前大灯模组导热装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12823863

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12823863

Country of ref document: EP

Kind code of ref document: A1